Cleaning device and cleaning method for cutting wafer
By designing a cleaning device for cutting wafers, the drive mechanism makes the wafer bulge in the cutting channel, achieving full flow of cleaning liquid in the cutting channel, solving the problem of difficult debris in the cutting channel of wafers, and improving cleaning efficiency and chip quality.
Patent Information
- Application Number
- CN202510920991.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-04
- Publication Date
- 2025-08-26
AI Technical Summary
In the prior art, debris from the wafer cutting channel is difficult to be completely removed, resulting in residual contamination of the wafer surface and affecting chip performance and reliability, and repeated flushing increases production costs and time.
A cleaning device for cutting wafers is designed, and the longitudinal and transverse top rods are driven to move through the driving mechanism, so that the wafers are bulging in the cutting channel, and the cleaning liquid is used to flow fully in the bulging cutting channel, eroding and washing away debris.
It effectively avoids debris residues and cleaning dead corners of incomplete cleaning, improves cleaning efficiency, reduces production costs, and improves chip quality and performance.
Smart Images
Figure CN120545221A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of wafer production, and in particular to a cleaning device and a cleaning method for cut wafers. Background Art
[0002] In the semiconductor chip manufacturing process, wafer cutting and cleaning are key links to ensure chip quality and performance. At present, the industry generally uses circular patch rings to fix wafers, and uses precision alignment equipment to make the center of the wafer coincide with the center of the patch ring, and then cuts it. This process can effectively ensure cutting accuracy and improve chip yield.
[0003] However, existing technologies have significant flaws in the debris cleaning process of wafer cutting lanes. Since wafers are typically kept flat for cleaning after cutting, the flow path of the cleaning fluid across the wafer surface is relatively simple, making it difficult to generate effective impact force. This results in debris such as silicon chips and abrasive particles generated during the cutting process easily remaining within the narrow cutting lanes and being unable to be completely removed. Residual debris not only contaminates the wafer surface but can also cause short circuits, poor contact, and other problems in subsequent packaging, seriously impacting the chip's electrical performance and reliability. Furthermore, while repeated rinsing can improve cleanliness, it increases cleaning time and production costs, reducing production efficiency. Summary of the Invention
[0004] The object of the present invention is to provide a cleaning device and a cleaning method for cut wafers in view of the above-mentioned deficiencies in the prior art.
[0005] The object of the present invention is achieved through the following technical solution: A cleaning device for cutting wafers, comprising a box body; a cleaning seat and a placement seat are provided in the box body; a placement cavity is provided in the placement seat; a circular opening is provided on the top of the placement seat and communicates with the placement cavity; a cleaning nozzle is provided on the top of the circular opening of the cleaning seat;
[0006] The placement cavity is provided with a transverse push rod movable along the diameter direction of the circular opening and a longitudinal push rod movable along the diameter direction of the circular opening; the movable direction of the transverse push rod is perpendicular to the movable direction of the longitudinal push rod; a transverse strip rod is provided on the top of the transverse push rod; the length direction of the transverse strip rod is perpendicular to the movable direction of the transverse push rod; a longitudinal strip rod is provided on the top of the longitudinal push rod; the length direction of the longitudinal strip rod is perpendicular to the movable direction of the longitudinal push rod;
[0007] A driving mechanism for moving the transverse push rod and the longitudinal push rod is provided in the placement cavity.
[0008] The present invention is further configured such that an annular vacuum suction cup is provided at the circular opening.
[0009] The present invention is further configured such that a base is fixedly provided in the placement cavity; a guide seat is fixedly provided on the base; the guide seat is provided with a transverse arcuate chute and a longitudinal arcuate chute perpendicularly intersecting in a cross; the intersection of the transverse arcuate chute and the longitudinal arcuate chute is located on the axis of the circular opening;
[0010] The transverse arc chute is provided with a transverse slider for sliding; the longitudinal arc chute is provided with a longitudinal slider for sliding; the bottom of the transverse top rod is fixedly connected to the transverse slider; the bottom of the longitudinal top rod is fixedly connected to the longitudinal slider.
[0011] The present invention is further configured as follows: the driving mechanism includes a driving motor fixedly arranged in the placement cavity, a transmission shaft connected to the output end of the driving motor, an outer ring gear arranged on the base, and an inner gear movably arranged in the outer ring gear; the transmission shaft drives the inner gear to move; the inner ring of the outer ring gear is meshed with the outer wall of the internal gear; the center of the outer ring gear is located on the axis of the circular opening; and the transmission shaft is arranged at the center of the outer ring gear.
[0012] The present invention is further configured such that the transmission shaft is provided with a transmission arm; one end of the transmission arm is connected to the transmission shaft; and the other end of the transmission arm is rotationally connected to the center of the internal gear.
[0013] The present invention is further configured such that the cleaning device for cutting wafers also includes a linkage rod; the middle part of the linkage rod is fixedly connected to the center of the internal gear; one end of the linkage rod is movable up and down and telescopically provided with a transverse telescopic rod; the other end of the linkage rod is movable up and down and telescopically provided with a longitudinal telescopic rod; the top of the transverse telescopic rod is hinged to the transverse slider; the top of the longitudinal telescopic rod is hinged to the longitudinal slider.
[0014] The present invention is further configured such that the length of the transverse arcuate chute is the same as the length of the longitudinal arcuate chute.
[0015] A cleaning method based on a cleaning device for cutting wafers comprises the following steps:
[0016] S1. Place the patch ring in the circular opening of the placement seat;
[0017] S2, start the cleaning nozzle to spray cleaning fluid;
[0018] S3. Start the driving mechanism, which drives the longitudinal push rod and the longitudinal strip rod to move longitudinally, and drives the transverse push rod and the transverse strip rod to move transversely, so that the wafer on the patch ring bulges on the cutting path, and the cleaning liquid takes away the debris on the wafer cutting path.
[0019] The beneficial effects of the present invention are as follows: the present invention drives the longitudinal push rod and the longitudinal strip rod to move longitudinally through the driving mechanism, and drives the transverse push rod and the transverse strip rod to move transversely through the driving mechanism, so that the wafer on the patch ring bulges in the cutting path, and the cleaning liquid flows fully in the bulging cutting path, flushing out the debris and then washing it away, avoiding problems such as incomplete cleaning, residual debris, and many dead corners in cleaning. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a structural schematic diagram of the present invention;
[0021] Figure 2 This is a schematic diagram of the structure of the present invention after the box is hidden;
[0022] Figure 3 This is a schematic diagram of the structure of the present invention after the hidden box cooperates with the wafer;
[0023] Figure 4 This is a cross-sectional view of the present invention after the hidden box is matched with the wafer;
[0024] Figure 5 This is a schematic diagram of the structure of the driving mechanism, the transverse push rod, the longitudinal push rod and the guide seat of the present invention;
[0025] Figure 6 It is a cross-sectional view of the cooperation among the driving mechanism, the transverse push rod, the longitudinal push rod and the guide seat of the present invention;
[0026] Among them: 1. Box body; 11. Patch ring; 12. Wafer; 2. Cleaning seat; 21. Cleaning nozzle; 3. Placement seat; 31. Placement cavity; 32. Circular opening; 33. Annular vacuum suction cup; 4. Horizontal push rod; 41. Horizontal strip rod; 42. Horizontal slider; 5. Longitudinal push rod; 51. Longitudinal strip rod; 52. Longitudinal slider; 6. Base; 61. Outer gear ring; 62. Inner gear; 7. Guide seat; 71. Horizontal arc chute; 72. Longitudinal arc chute; 81. Drive motor; 82. Transmission shaft; 83. Transmission arm; 9. Linkage rod; 91. Horizontal telescopic rod; 92. Longitudinal telescopic rod. DETAILED DESCRIPTION
[0027] The present invention is further described with reference to the following examples.
[0028] Depend on Figures 1 to 6 As can be seen, the cleaning device for cutting wafers described in this embodiment includes a box body 1; a cleaning seat 2 and a placement seat 3 are provided in the box body 1; a placement cavity 31 is provided in the placement seat 3; a circular opening 32 is provided on the top of the placement seat 3 and communicates with the placement cavity 31; the cleaning seat 2 is provided with a cleaning nozzle 21 at the top of the circular opening 32;
[0029] The placement cavity 31 is provided with a transverse push rod 4 that moves along the diameter direction of the circular opening 32 and a longitudinal push rod 5 that moves along the diameter direction of the circular opening 32; the movable direction of the transverse push rod 4 is perpendicular to the movable direction of the longitudinal push rod 5; a transverse strip rod 41 is provided on the top of the transverse push rod 4; the length direction of the transverse strip rod 41 is perpendicular to the movable direction of the transverse push rod 4; a longitudinal strip rod 51 is provided on the top of the longitudinal push rod 5; the length direction of the longitudinal strip rod 51 is perpendicular to the movable direction of the longitudinal push rod 5;
[0030] A driving mechanism for moving the transverse push rod 4 and the longitudinal push rod 5 is provided in the placement cavity 31 .
[0031] Specifically, the cleaning device for cutting the wafer 12 described in this embodiment places the patch ring 11 at the circular opening 32 of the placement seat 3, so that the center of the wafer 12 is aligned with the center of the circular opening 32, and then starts the cleaning nozzle 21 to spray the cleaning liquid, and then starts the driving mechanism. The driving mechanism drives the longitudinal push rod 5 and the longitudinal strip rod 51 to move longitudinally, and the driving mechanism drives the transverse push rod 4 and the transverse strip rod 41 to move transversely, so that the wafer 12 on the patch ring 11 bulges in the cutting path, and the cleaning liquid flows fully in the bulging cutting path, flushing out the debris and then washing it away, avoiding problems such as incomplete cleaning, residual debris, and many cleaning dead corners.
[0032] In the cleaning device for diced wafers described in this embodiment, an annular vacuum chuck 33 is provided at the circular opening 32. The annular vacuum chuck 33 is arranged concentrically with the circular opening 32. With this arrangement, the patch ring 11 can be placed on the annular vacuum chuck 33, thereby fixing the patch ring 11.
[0033] The present embodiment describes a cleaning device for cutting wafers, wherein a base 6 is fixedly provided in the placement cavity 31; a guide seat 7 is fixedly provided on the base 6; the guide seat 7 is provided with a transverse arc-shaped slide groove 71 and a longitudinal arc-shaped slide groove 72 that intersect vertically in a cross; the intersection of the transverse arc-shaped slide groove 71 and the longitudinal arc-shaped slide groove 72 is located on the axis of the circular opening 32; the transverse arc-shaped slide groove 71 is provided with a transverse slider 42 for sliding; the longitudinal arc-shaped slide groove 72 is provided with a longitudinal slider 52 for sliding; the bottom of the transverse push rod 4 is fixedly connected to the transverse slider 42; the bottom of the longitudinal push rod 5 is fixedly connected to the longitudinal slider 52.
[0034] Specifically, through the above-mentioned setting, the movement trajectory of the horizontal push rod 4 is arc-shaped, and the movement trajectory of the longitudinal push rod 5 is arc-shaped, which can effectively bulge the wafer 12 on the patch ring 11 in the cutting path, and the cleaning liquid flows fully in the bulging cutting path, flushing out the debris and then washing it away, avoiding problems such as incomplete cleaning, residual debris, and many dead corners in cleaning.
[0035] The present embodiment describes a device for cleaning cut wafers, wherein the drive mechanism includes a drive motor 81 fixedly disposed in a placement chamber 31, a transmission shaft 82 connected to the output end of the drive motor 81, an outer gear ring 61 disposed on a base 6, and an inner gear 62 movably disposed in the outer gear ring 61; the transmission shaft 82 drives the inner gear 62 to move; the inner ring of the outer gear ring 61 meshes with the outer wall of the inner gear 62; the center of the outer gear ring 61 is located on the axis of the circular opening 32; the transmission shaft 82 is disposed at the center of the outer gear ring 61. The present embodiment describes a device for cleaning cut wafers, wherein the transmission shaft 82 is provided with a transmission arm 83; one end of the transmission arm 83 is connected to the transmission shaft 82; and the other end of the transmission arm 83 is rotationally connected to the center of the inner gear 62.
[0036] Specifically, in this embodiment, through the above arrangement, the outer ring gear 61 and the inner gear 62 form a planetary transmission assembly, so that the inner gear 62 rotates and revolves.
[0037] The present embodiment describes a cleaning device for a cut wafer, and the cleaning device for the cut wafer 12 further includes a linkage rod 9; the middle portion of the linkage rod 9 is fixedly connected to the center of the circle of the internal gear 62; one end of the linkage rod 9 is movable by lifting and telescoping, and is provided with a transverse telescopic rod 91; the other end of the linkage rod 9 is movable by lifting and telescoping, and is provided with a longitudinal telescopic rod 92; the top of the transverse telescopic rod 91 is hinged to the transverse slider 42; the top of the longitudinal telescopic rod 92 is hinged to the longitudinal slider 52.
[0038] Specifically, through the above-mentioned arrangement, this embodiment enables the middle part of the linkage rod 9 to rotate and revolve along with the internal gear 62. Under the action of the transverse arc groove 71 and the longitudinal arc groove 72, the linkage rod 9 with the transverse slider 42 and the longitudinal slider 52 slide alternately in the transverse arc groove 71 and the longitudinal arc groove 72 respectively, driving the transverse push rod 4 and the longitudinal push rod 5 to slide alternately along the arc-shaped transverse arc groove 71 and the longitudinal arc groove 72 on the back side of the patch ring 11; during the sliding process of the transverse push rod 4 and the longitudinal push rod 5, the wafer 12 on the patch ring 11 bulges in the cutting path, and the cleaning liquid flows fully in the bulging cutting path, flushing out the debris and then flushing it away, avoiding problems such as incomplete cleaning, residual debris, and many dead corners in cleaning.
[0039] In the cleaning device for cut wafers described in this embodiment, the length of the transverse arcuate chute 71 is the same as the length of the longitudinal arcuate chute 72. The above arrangement makes the overall structure stable and reliable.
[0040] The cleaning method of the cleaning device based on cutting wafers described in this embodiment includes the following steps: S1, placing the patch ring 11 on the circular opening 32 of the placement seat 3; S2, starting the cleaning nozzle 21 to spray cleaning liquid; S3, starting the driving mechanism, the driving mechanism drives the longitudinal push rod 5 and the longitudinal strip rod 51 to move longitudinally, and the driving mechanism drives the transverse push rod 4 and the transverse strip rod 41 to move transversely, so that the wafer 12 on the patch ring 11 bulges on the cutting path, and the cleaning liquid takes away the debris of the cutting path of the wafer 12.
[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.
Claims
1. A cleaning device for cut wafers, characterized in that: The invention comprises a box body (1); a cleaning seat (2) and a placement seat (3) are provided in the box body (1); a placement cavity (31) is provided in the placement seat (3); a circular opening (32) communicating with the placement cavity (31) is provided at the top of the placement seat (3); a cleaning nozzle (21) is provided at the top of the circular opening (32); A transverse push rod (4) movable along the diameter direction of the circular opening (32) and a longitudinal push rod (5) movable along the diameter direction of the circular opening (32) are provided in the placement cavity (31); the movable direction of the transverse push rod (4) is perpendicular to the movable direction of the longitudinal push rod (5); a transverse strip rod (41) is provided on the top of the transverse push rod (4); the length direction of the transverse strip rod (41) is perpendicular to the movable direction of the transverse push rod (4); a longitudinal strip rod (51) is provided on the top of the longitudinal push rod (5); the length direction of the longitudinal strip rod (51) is perpendicular to the movable direction of the longitudinal push rod (5); A driving mechanism for moving the transverse push rod (4) and the longitudinal push rod (5) is provided in the placement cavity (31).
2. The cleaning device for diced wafers according to claim 1, wherein: An annular vacuum suction cup (33) is provided at the circular opening (32).
3. The cleaning device for diced wafers according to claim 1, wherein: A base (6) is fixedly provided in the placement cavity (31); a guide seat (7) is fixedly provided on the base (6); the guide seat (7) is provided with a transverse arc-shaped slide groove (71) and a longitudinal arc-shaped slide groove (72) that intersect each other perpendicularly in a cross shape; the intersection point of the transverse arc-shaped slide groove (71) and the longitudinal arc-shaped slide groove (72) is located on the axis of the circular opening (32); The transverse arc chute (71) is slidably provided with a transverse slider (42); the longitudinal arc chute (72) is slidably provided with a longitudinal slider (52); the bottom of the transverse push rod (4) is fixedly connected to the transverse slider (42); and the bottom of the longitudinal push rod (5) is fixedly connected to the longitudinal slider (52).
4. The cleaning device for diced wafers according to claim 3, wherein: The driving mechanism comprises a driving motor (81) fixedly arranged in the placement cavity (31), a transmission shaft (82) connected to the output end of the driving motor (81), an outer gear ring (61) arranged on the base (6), and an inner gear (62) movably arranged in the outer gear ring (61); the transmission shaft (82) drives the inner gear (62) to move; the inner ring of the outer gear ring (61) meshes with the outer wall of the inner gear (62); the center of the outer gear ring (61) is located on the axis of the circular opening (32); and the transmission shaft (82) is arranged at the center of the outer gear ring (61).
5. The cleaning device for diced wafers according to claim 4, characterized in that: The transmission shaft (82) is provided with a transmission arm (83); one end of the transmission arm (83) is connected to the transmission shaft (82); and the other end of the transmission arm (83) is rotationally connected to the center of the inner gear (62).
6. The device for cleaning a diced wafer according to claim 5, wherein: The cleaning device for cutting wafers also includes a linkage rod (9); the middle part of the linkage rod (9) is fixedly connected to the center of the inner gear (62); one end of the linkage rod (9) is provided with a transverse telescopic rod (91) for lifting and telescoping; the other end of the linkage rod (9) is provided with a longitudinal telescopic rod (92) for lifting and telescoping; the top of the transverse telescopic rod (91) is hinged to the transverse slider (42); the top of the longitudinal telescopic rod (92) is hinged to the longitudinal slider (52).
7. The cleaning device for diced wafers according to claim 6, characterized in that: The length of the transverse arcuate chute (71) is the same as the length of the longitudinal arcuate chute (72).
8. A cleaning method for a diced wafer according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1, placing the patch ring (11) in the circular opening (32) of the placement seat (3); S2, start the cleaning nozzle (21) to spray the cleaning liquid; S3. Start the driving mechanism, the driving mechanism drives the longitudinal push rod (5) and the longitudinal strip rod (51) to move longitudinally, and the driving mechanism drives the transverse push rod (4) and the transverse strip rod (41) to move transversely, so that the wafer (12) on the patch ring (11) bulges on the cutting path, and the cleaning liquid takes away the debris on the cutting path of the wafer (12).