Detector

Abstract

A probe is provided with: a loading unit (114) having a transport unit (122) for a wafer (W); and a probe main body (112) having a plurality of measurement units (30), a tester (43) disposed in each of the plurality of measurement units (30), and a detection region (50) provided in the plurality of measurement units, the loading unit (114) and the probe main body (112) being disposed with a gap (S) therebetween, and the plurality of measurement units (30) each having a partition wall (70) between the loading unit (114) and each of the plurality of measurement units (30). An air suction port (71) for supplying cooling air to each of the testers (43) and a delivery port (72) for delivering the conveyed object from the loading part (114) into the measuring part (30) are formed in the partition wall (70), and the probe can supply cooling air to each of the measuring parts through a path not passing through the loading part.

Description

Technical Field

[0001] The present disclosure relates to a prober for inspecting electrical characteristics of a plurality of semiconductor chips formed on a wafer, and more particularly to a multi-head prober having a plurality of measuring units. Background Art

[0002] Semiconductor devices are manufactured through multiple processes. Each process includes various inspections to ensure quality and improve yield. For example, wafer level testing is performed at the stage where multiple semiconductor chips are formed on a wafer. Wafer level testing electrically confirms the normal operation of semiconductor chips (hereinafter referred to as "chips"). During wafer level testing, the electrode pads of each chip are connected to a tester, which supplies power and test signals. The tester then measures the signals output from each chip.

[0003] Wafer level checks are performed using a prober. The prober is equipped with multiple probes. The probes contact the electrode pads of each chip on the wafer. Furthermore, the probes are electrically connected to the terminals of the tester. In other words, the electrode pads and the tester are connected via the prober. In this state, power and test signals are supplied from the tester to each chip via the probes. Furthermore, the output signals from each chip are detected by the tester via the probes. This allows verification of chip operation.

[0004] One method for more efficient wafer level inspection is to use multiple probers in parallel. However, this method requires a large space to accommodate the multiple probers. Furthermore, installing and operating multiple probers incurs significant costs. Therefore, in order to improve throughput while minimizing space and cost increases, wafer level inspection using a multi-head prober has been proposed. A multi-head prober is a device comprising a loading unit and a probe body with multiple measuring units. For example, Patent Document 1 discloses a multi-head prober in which multiple measuring units are stacked in layers within the probe body, and wafer level inspection is performed using a tester installed in each measuring unit. Prior art literature Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-149447 Summary of the Invention Problems to be solved by the invention

[0006] Wafer level inspections are sometimes performed at various temperatures. When using a multi-head prober, the temperature of the measurement environment is also adjusted for inspection. For example, when cooling a tester, cooling air needs to be circulated through each measuring unit. Cooling air is often made of outside air with a relatively high dew point temperature (high moisture content). For example, when performing wafer level testing from room temperature to high temperature, it is necessary to maintain the temperature within each test section within the specified test temperature range. In this case, cooling air is typically supplied from the loading unit to each test section. After cooling the tester, the cooling air is exhausted to the outside of each test section.

[0007] On the other hand, when performing wafer level inspection at low temperatures, to prevent condensation, the inside of the probe body and the loading area can be filled with dry air. Dry air is air with a relatively low dew point (low moisture content) to prevent condensation. When the loading section is filled with dry air, it is preferable to supply cooling air to each measuring section through a path that does not pass through the loading section. In addition, it is preferable to exhaust the cooling air after cooling the tester from each measuring section.

[0008] As a method for supplying cooling air to each measuring unit through a path that does not pass through the inside of the loading unit, it is conceivable to provide a path dedicated to cooling air on the loading unit side or the probe body side. However, this method has the problem of easily increasing the size of the detector. This is because a dedicated cooling air path must be constructed airtightly relative to the loading area. One method of achieving this airtightness is to install a seal. It should be noted that airtightness is required to prevent leakage of cooling air.

[0009] The present disclosure aims to solve at least one of the problems of the prior art. A specific object is to provide a probe capable of supplying cooling air to each measuring section through a path that does not pass through the interior of the loading section. Solutions to the Problem

[0010] One embodiment of the detector disclosed herein is a detector comprising: a loading part having a wafer conveying mechanism; and a detector body having a plurality of measuring parts, testers respectively arranged in the plurality of measuring parts and detection areas arranged in the plurality of measuring parts, the loading part and the detector body being arranged with a gap therebetween, the plurality of measuring parts respectively having a partition wall between themselves and the loading part, an air intake for supplying cooling air to the tester and a delivery interface for delivering conveyed objects from the loading part to the measuring part being formed on the partition wall. Effects of the Invention

[0011] According to the present disclosure, it is possible to provide a probe in which cooling air is supplied to each measuring part through a path that does not pass through the inside of the mounting part. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a perspective view of the appearance of the probe according to the embodiment as viewed from the mounting portion side. Figure 2 is a plan view of the detector. Figure 3 It is a diagram (front view) showing the internal structure of the probe body. Figure 4 It is a diagram showing the structure of the measuring unit. Figure 5 This is a diagram schematically showing the path of cooling air throughout the entire probe. Figure 6 This is a perspective view of the appearance of the probe body as seen from the mounting portion side. Figure 7 This is a diagram of the partition wall viewed from the loading portion side. Figure 8A This is a diagram of the partition wall viewed from the inside of the measurement portion. Figure 8B This is a diagram of the partition wall viewed from the inside of the measurement portion. Figure 9 It is a diagram showing the side surface of the probe body on the maintenance area side. Figure 10A This is a three-dimensional diagram of the tester. Figure 10B This is a three-dimensional diagram of the tester. Figure 11 It is a diagram showing the path of cooling air in the measurement unit. DETAILED DESCRIPTION

[0013] The first embodiment of the detector disclosed in the present invention is a detector comprising: a loading part having a wafer conveying mechanism; and a detector body having a plurality of measuring parts, testers respectively arranged in the plurality of measuring parts and detection areas arranged in the plurality of measuring parts, the loading part and the detector body being arranged with a gap therebetween, the plurality of measuring parts respectively having a partition wall between themselves and the loading part, an air intake for supplying cooling air to the tester and a delivery interface for delivering the conveyed object from the loading part to the measuring part being formed in the partition wall.

[0014] A second embodiment of the probe of the present disclosure is based on the first embodiment, wherein the probe body includes an exhaust port for exhausting the cooling air that has passed through the tester to a side opposite to the loading portion.

[0015] A third embodiment of the sensor disclosed herein is the first or second embodiment, wherein the partition wall includes an opening and closing mechanism for opening and closing the interface.

[0016] A fourth embodiment of the sensor disclosed herein is based on the first or second embodiment and further includes a fan for sucking the cooling air on the air intake side. Hereinafter, embodiments of the detector will be described with reference to the accompanying drawings.

[0017] [detector] First, an example of a probe (multi-head probe) according to this embodiment will be described. Figure 1 This is a perspective view of the appearance of the probe 100 as viewed from the mounting portion 114 side. Figure 2 yes Figure 1 1 is a plan view of the detector 100. It should be noted that the XYZ axes in the figure are axes perpendicular to each other, the XY axes are axes parallel to the horizontal direction, and the Z axis is an axis perpendicular to the horizontal direction.

[0018] like Figure 1 and Figure 2 As shown, the probe 100 includes a loading unit 114 and a probe body 112. The loading unit 114 supplies and recovers the wafer W to be inspected (see Figure 4 The probe body 112 is arranged adjacent to the loading portion 114 and includes a plurality of measuring portions 30 .

[0019] A gap S is provided between the probe body 112 and the mounting portion 114. The probe body 112 and the mounting portion 114 are arranged with the gap S interposed therebetween. The gap S functions as an intake path for cooling air for cooling the tester, as will be described later.

[0020] A wafer W is supplied to each measuring section 30 by the loader 114. Multiple semiconductor chips to be inspected are formed on the wafer W. Each measuring section 30 performs an electrical characteristic inspection (wafer level inspection) on each chip on the supplied wafer W. The wafer W inspected by each measuring section 30 is then retrieved by the loader 114. The prober 100 also includes an operation panel 121 and a control device (not shown) for controlling various components.

[0021] The loading section 114 includes a loading port 118 and a transport unit 122 (an example of a transport mechanism). The wafer cassette 120 and the probe card cassette 123 are placed on the loading port 118. The transport unit 122 (see Figure 2 ) transports the wafer W between each measuring section 30 of the probe main body 112 and the wafer cassette 120. In addition, the transport unit 122 also transports the probe card 42 between each measuring section 30 and the probe card cassette 123 (see Figure 3 and Figure 4 ). It should be noted that the probe card 42 is placed on a cassette holder (not shown) and is transported by the transport unit 122. Hereinafter, the wafer W and the probe card 42 are collectively referred to as transported objects.

[0022] The conveying unit 122 is provided with a conveying unit driving mechanism (not shown), which is configured to be movable in the X and Z axis directions, and configured to be rotatable in the θ direction (around the Z axis). In addition, the conveying unit 122 is provided with a conveying arm 124. The conveying unit driving mechanism is capable of extending and retracting the conveying arm 124 forward and backward. An adsorption pad (not shown) is provided on the upper surface of the conveying arm 124. The conveying arm 124 holds the conveyed object by vacuum adsorbing the back side of the conveyed object with the help of the adsorption pad. The conveyed object is taken out from the loading port 118 by the conveying arm 124 of the conveying unit 122, and is conveyed to each measuring part 30 of the detector body 112 while being held on its upper surface. In addition, when the inspection is completed, the conveyed object is taken out from each measuring part 30 through the reverse path.

[0023] Figure 3 When viewed from the front side (loading unit 114 side) Figure 1 The internal structure of the detector body 112 is shown in FIG. Figure 3 As shown, the probe body 112 has a layered structure. Four measurement units 30 arranged adjacent to each other in the X-axis direction form one layer, and three layers stacked in the Z-axis direction form a layered structure (multi-layer structure). In other words, the measurement units 30 are arranged two-dimensionally along the X-axis and Z-axis directions. It should be noted that the number of measurement units 30 and the number of layers constituting each layer are not limited to those described above.

[0024] The plurality of measuring units 30 are divided by a housing. The housing is composed of a plurality of frames assembled in a lattice shape.

[0025] Next, use Figure 4 The structure of the measuring unit is described below. Each measuring unit 30 has a substantially identical structure. Figure 4 As shown, each measuring section 30 includes a test head plate 44, a tester 43, a probe card 42, and a spring frame 41. The spring frame 41 is interposed between the tester 43 and the probe card 42.

[0026] The tester 43 is supported above the test head board 44 by a tester holder (not shown). The tester 43 is electrically connected to the probes 66 of the probe card 42. The tester 43 supplies power and test signals to each chip. Furthermore, the tester 43 detects the output signals from each chip. The tester 43 verifies whether the chips are operating normally.

[0027] The test head plate 44 is supported by the housing of the probe body 112. The test head plate 44 includes a spring frame mounting portion 53 having a circular opening. The opening is formed in a shape corresponding to the planar shape of the spring frame 41. The spring frame mounting portion 53 includes positioning pins 63 . The spring frame 41 is fixed to the opening (spring frame mounting portion 53 ) of the test head plate 44 while being positioned by the positioning pins 63 . There are no particular limitations on the method for fixing the spring frame 41. For example, a method is preferably used in which a suction member (not shown) is used to vacuum-adsorb the support surface (adsorption surface) of the spring frame mounting portion 53 onto the spring frame 41. In addition to the above, mechanical fixing members such as screws may also be used.

[0028] The spring frame 41 includes a tester 43 and a plurality of spring pins (not shown) that electrically connect the terminals formed on the probe card 42. It should be noted that the terminals of the tester 43 are formed on its lower surface, while the terminals of the probe card 42 are formed on its upper surface. In other words, the terminal groups are arranged facing each other via the spring frame 41. An annular sealing member 60 is disposed on the outer periphery of the upper surface (the surface facing the tester 43) of the spring frame 41. This forms an airtight space surrounded by the tester 43, the spring frame 41, and the sealing member 60. Similarly, an annular sealing member 62 is disposed on the outer periphery of the lower surface (the surface facing the probe card 42) of the spring frame 41. This forms an airtight space surrounded by the probe card 42, the spring frame 41, and the sealing member 62. By reducing the pressure of the airtight space formed above and below the spring frame 41 using a suction member (not shown), the tester 43, the spring frame 41, and the probe card 42 are integrated (see FIG. Figure 4 ).

[0029] The probe card 42 has a plurality of probes 66 corresponding to the electrode pads of each chip on the wafer W. The probes 66 are formed to protrude downward from the bottom surface of the probe card 42. The bottom surface of the probe card 42 is the surface facing the wafer chuck 150, that is, the wafer W. The probes 66 are electrically connected to the terminals provided on the top surface of the probe card 42 (the surface facing the spring frame 41). Therefore, when the tester 43, spring frame 41, and probe card 42 are integrated, each probe 66 is electrically connected to each terminal of the tester 43 via the spring frame 41. It should be noted that the probe card 42 of this embodiment includes a plurality of probes 66 corresponding to the electrode pads of all chips on the wafer W to be inspected. In the measuring unit 30, all chips on the wafer W held on the wafer chuck 150 are simultaneously inspected.

[0030] The wafer chuck 150 holds the wafer W by suction, for example, using vacuum suction. The wafer chuck 150 is detachably supported by the alignment device 13 (described later). Furthermore, the wafer chuck 150 is movable in the X, Y, Z, and θ directions by the alignment device 13. An annular sealing member 64 is provided on the outer periphery of the upper surface (the surface on which the wafer W is placed) of the wafer chuck 150. This creates an airtight space enclosed by the probe card 42, the wafer chuck 150, and the sealing member 64. By depressurizing the space using suction means (not shown), the wafer chuck 150 is sucked toward the probe card 42. As a result, the probes 66 of the probe card 42 come into contact with the electrode pads of the chips on the wafer W. Inspection can be started in this state.

[0031] The chip chuck 150 has a heating and cooling mechanism inside. The heating and cooling mechanism adjusts the temperature of the chip during inspection. The chip level inspection can be performed between a low temperature state (for example, -40°C) and a high temperature state (for example, 150°C). The heating and cooling mechanism functions as a heating / cooling source for performing chip level inspection. As the heating and cooling mechanism, a known appropriate heater / cooler can be used. For example, a heating and cooling mechanism with a double-layer structure having a heating layer of a heating plate and a cooling layer provided with a passage for a cooling fluid, and a heating and cooling mechanism with a single-layer structure in which a cooling tube with a heater wound therein is buried in a heat conductor, etc. In addition, instead of electric heating, a hot fluid can be circulated. In addition, a Peltier element can also be used.

[0032] The probe body 112 further includes an alignment device 13 that supports the wafer chuck 150 so that it can be freely attached and detached. The alignment device 13 is provided on each level. The alignment device 13 is driven by an alignment device drive mechanism (not shown). The alignment device 13 is configured to be movable between the plurality of measurement units 30 arranged on each level (layer). That is, the alignment device 13 is shared by a plurality of (four in this example) measuring units 30 arranged in the same layer (tier).

[0033] When the alignment device 13 is moved to the measurement unit 30, it is fixed to a positioning fixture (not shown). In this state, the alignment device 13 moves the wafer chuck 150 in the X, Y, Z, and θ directions. This allows the relative position of the wafer W held on the wafer chuck 150 and the probe card 42 to be aligned. Although not shown in the drawings, the alignment device 13 includes a probe position detection camera and a wafer alignment camera, thereby detecting the relative positional relationship between the electrodes of the chips on the wafer W and the probes 66 .

[0034] The alignment device 13 secures the wafer chuck 150 by suction or other means. However, the method for securing the wafer chuck 150 is not limited to vacuum suction. For example, mechanical means may also be used. A positioning member (not shown) is provided in the alignment device 13. The positioning member maintains a constant relative position with respect to the wafer chuck 150.

[0035] Next, an overview of the inspection method using the prober 100 will be described. First, at the loader 114 , the transfer arm 124 removes a wafer W from the wafer cassette 120 . The removed wafer W is held on the upper surface of the transfer arm 124 and transported to a predetermined measurement unit 30 of the prober main body 112 .

[0036] Meanwhile, in the probe main body 112, the alignment device 13 provided at each level (layer) is moved to a predetermined measurement portion 30. Then, the wafer chuck 150 is positioned on the upper surface of the alignment device 13 and fixed by suction.

[0037] Next, the alignment device 13 moves the wafer chuck 150 to a predetermined transfer position. Then, the wafer W is transferred from the transfer unit 122 of the loader 114 . The transferred wafer W is held on the upper surface of the wafer chuck 150 .

[0038] Next, the alignment device 13 moves the wafer chuck 150 holding the wafer W to a predetermined position (alignment position). The relative positional relationship between the chip's electrode pads and the probes 66 is then detected. This detection is performed by a probe position detection camera and a wafer alignment camera (not shown). Based on the detected positional relationship, the alignment device 13 then moves the wafer chuck 150 in the X, Y, Z, and θ directions to align the wafer W with the probe card 42.

[0039] After the alignment is performed, the alignment device 13 moves the wafer chuck 150 to a predetermined measurement position. The measurement position is a position facing the probe card 42. Then, the alignment device 13 raises the wafer chuck 150 to a predetermined height. Specifically, the predetermined height refers to the height at which the sealing member 64 on the upper surface of the wafer chuck 150 contacts the lower surface of the probe card 42. It should be noted that the lower surface of the probe card 42 is the surface facing the wafer chuck 150. This creates an airtight space enclosed by the probe card 42, wafer chuck 150, and sealing member 64.

[0040] When the airtight space is depressurized by the suction member, the wafer chuck 150 is sucked toward the probe card 42 and fixed. At this time, decompression (suction) is preferably started before sealing member 64 contacts the lower surface of probe card 42. In other words, decompression (suction) is preferably started before the space surrounded by probe card 42, wafer chuck 150, and sealing member 64 becomes a sealed space. By starting to reduce the pressure before the space is sealed, the influence of the reaction force that may be generated by the compression of the space when the wafer chuck 150 is raised can be further reduced. Note that suction by the suction member may be started simultaneously with the contact of the sealing member 64 with the lower surface of the probe card 42 .

[0041] Then, the alignment device 13 releases the wafer chuck 150 from the alignment device 13. Thus, the wafer chuck 150 is detached from the alignment device 13. Meanwhile, the probe card 42 and the wafer chuck 150 are in close contact with each other, and the probes 66 of the probe card 42 contact the electrode pads of each chip on the wafer W with uniform contact pressure.

[0042] Figure 4 This shows the state where the above steps are completed. That is, in the measurement unit 30, the tester 43, the spring frame 41, the probe card 42, and the wafer chuck 150 are integrated. In this state, the wafer level test can be started.

[0043] Thereafter, an electrical operation test is performed by the tester 43. Specifically, the tester 43 supplies power and a test signal to each chip on the wafer W. In addition, the tester 43 detects a signal output from the chip.

[0044] Inspection is performed in the other measurement units 30 using the same procedure. To briefly summarize the steps, a wafer W is first loaded onto the wafer chuck 150. Next, alignment and contact operations are performed in each measurement unit 30. Subsequently, simultaneous inspection of each die on the wafer W is performed. Inspection can be performed sequentially and / or in parallel for each wafer W.

[0045] When the inspection is completed in a certain measuring section 30, the alignment device 13 of the corresponding layer moves to the measuring section 30 and recovers the wafer chuck 150. The wafer chuck 150 holds the inspected wafer W.

[0046] The specific steps of recycling the wafer chuck 150 are as follows. First, the alignment device 13 moves to the measurement unit 30 where the inspection is complete. Next, the alignment device 13 rises until its upper surface contacts the wafer chuck 150. When the decompression of the space enclosed by the probe card 42, wafer chuck 150, and seal member 64 is released, the alignment device 13 positions and secures the wafer chuck 150 on its upper surface.

[0047] The procedure for recovering the inspected wafer W on the wafer chuck 150 is as follows. The alignment device 13 moves the wafer chuck 150 to a predetermined transfer position. The wafer chuck 150 and the inspected wafer W are then released. The inspected wafer W is then transferred to the transfer unit 122. The transferred inspected wafer W is held by the transfer arm 124, transferred to the loader 114, and returned to the wafer cassette 120.

[0048] It should be noted that in Figure 3 In the illustrated configuration, the wafer chuck 150 is shared by multiple measurement units 30 arranged on the same level (layer). That is, four measurement units 30 share one wafer chuck. In this case, the alignment device 13 moves the wafer chuck 150 relative to the multiple measurement units 30 sharing the wafer chuck 150. Alternatively, one wafer chuck 150 may be assigned to each measuring unit 30. In this case, the steps of inspecting the wafer W and collecting the inspected wafer W are also the same.

[0049] The probe card 42 is set according to the type of wafer W. The probe card 42 is replaced as appropriate under the control of a control device (not shown). The procedure for disassembling the assembled probe card 42 is as follows. First, the spring frame 41 and the probe card 42 are released. Next, the probe card 42 is transferred to the transport unit 122. The transferred probe card 42 is transported to the loading unit 114 by the transport arm 124 and returned to the probe card box 123. When a new probe card 42 is mounted, the procedure is reversed to that when the probe card 42 is returned to the loading unit 114. The new probe card 42 is transported to the measurement unit 30 and mounted.

[0050] [Overview of Cooling Air Path] Next, the path of the cooling air in the tester 43 will be described. The prober 100 includes multiple measuring sections 30, and wafer level inspection is performed in parallel in each measuring section 30. The temperature within each measuring section 30 is maintained within a predetermined inspection temperature range. The cooling air serves to regulate the temperature within the measuring section 30. Specifically, the cooling air circulates within the measuring section 30 to remove heat generated by the tester 43. The circulation method is not particularly limited, but typically, a method in which the cooling air flows through the measuring section 30 along a predetermined path is preferred.

[0051] When performing wafer level inspections at low temperatures, condensation must be suppressed. Therefore, the probe body 112 and loading section 114 are filled with dry air with a low dew point (low moisture content). To maintain this condition, it is preferable to prevent the dry air from coming into contact with or mixing with cooling air. To this end, cooling air is preferably supplied to each measurement section 30 via a path that does not pass through the loading section 114, and cooling air after cooling the tester 43 is exhausted from each measurement section 30.

[0052] Therefore, in this embodiment, the path is designed so that the cooling air can be supplied to each measuring unit 30 without passing through the interior of the loading unit 114, and the cooling air can be exhausted from the measuring unit 30. Figure 5 Next, an overview of the cooling air path in the entire probe 100 of this embodiment will be described.

[0053] Figure 5 : is a diagram showing an overview of the path of cooling air when the inside of the probe 100 is viewed from the positive direction of the Z axis. Figure 5 In FIG, the thick dashed arrow A indicates the path of the cooling air. The probe body 112 and the mounting portion 114 are disposed adjacent to each other with a gap S therebetween. The width of the gap S is preferably 10 mm to 20 mm.

[0054] Each measuring section 30 of the probe body 112 has a tester 43 therein. Of the four side surfaces of the probe body 112, the side surface facing the loading section 114 (described later as side surface 112A) is provided with an air intake port 71 at a position corresponding to each tester 43. The size of the air intake port 71 is appropriately determined in consideration of the amount of heat generated by the tester 43, but is preferably as large as possible.

[0055] Furthermore, exhaust ports 73 are provided at positions corresponding to the testers 43 on the side surface (side surface 112B described later) located on the opposite side to the mounting portion 114 among the four side surfaces of the probe main body 112 .

[0056] The probe body 112 and the loading section 114 are separated by a gap S. Therefore, as shown by arrow A, cooling air can be supplied to each measurement section 30 through the gap S and the air inlet 71. This allows cooling air to be supplied to the measurement section 30 through the gap S, rather than through the interior of the loading section 114.

[0057] Furthermore, as indicated by arrow A, cooling air supplied from the air intake port 71 passes through the interior of the tester 43 and is exhausted from the air exhaust port 73. The side surface of the probe body 112 where the air intake port 71 is provided differs from the side surface where the air exhaust port 73 is provided. As a result, the temperature of the cooling air near the air intake port rises due to the exhaust cooling air, thereby suppressing a decrease in the cooling efficiency of each tester 43.

[0058] Furthermore, the fan 47 is provided on the cooling air path in the probe body 112. The fan 47 can forcibly circulate (pass) the cooling air from the air intake port 71 to the air exhaust port 73, thereby improving cooling efficiency.

[0059] [Specific Structure Related to the Path of Cooling Air] Generally speaking, the air intake port 71 first takes in cooling air from outside the probe 100. Then, the air exhaust port 73 exhausts the cooling air to the outside of the probe 100. The specific structure of the path from the air intake port 71 to the air exhaust port 73 will be described below.

[0060] First, the cooling air intake port 71 will be described. Figure 6 It is from Figure 1The probe 100 shown is an external perspective view obtained by removing the mounting portion 114 and viewing only the probe main body 112 from the mounting portion 114 side.

[0061] like Figure 6 As shown, the outer shape of the probe body 112 is roughly a rectangular parallelepiped. The shell of the probe body 112 has four side surfaces that are erected parallel to the Z-axis direction (roughly perpendicular to the ground surface). For the convenience of explanation, the four side surfaces of the probe body 112 are described as follows. First, side surface 112A is the side surface facing the loading portion 114. Next, side surface 112B is the side surface provided on the side opposite to the loading portion 114. Side surfaces 112C and 112D are two side surfaces provided between side surface 112A and side surface 112B.

[0062] It should be noted that a maintenance area is generally provided on the side opposite to the loading portion 114 when viewed from the probe body 112. From this point of view, the side surface 112B will hereinafter also be referred to as a side surface on the maintenance area side.

[0063] The side surface 112A has partition walls 70 that define each measurement unit 30. The partition walls 70 face the loading unit 114. In this example, the probe body 112 has twelve measurement units 30. Therefore, the side surface 112A has twelve partition walls 70 corresponding to the twelve measurement units 30.

[0064] The partition wall 70 isolates or substantially isolates the interior of each measurement unit 30 from the loading unit 114 and the external environment. The partition wall 70 is, for example, a metal plate with a thickness of 10 mm to 30 mm. It should be noted that this example does not limit the material and thickness of the partition wall 70.

[0065] An air intake port 71 and a delivery port 72 are formed in each partition wall 70. The air intake port 71 is an opening for supplying cooling air from the external environment into the measurement unit 30. The supplied cooling air cools the tester 43. The air inlet 71 is preferably provided at a position within the measurement unit 30 corresponding to the tester 43. The position corresponding to the tester 43 means that the air inlet 71 and the tester 43 overlap when viewed from the loading unit 114. Assuming that other components are removed, it is preferable that a portion or all of the tester 43 be visible from the air inlet 71. From another perspective, the position corresponding to the tester 43 is a position where the air inlet 71 and the tester 43 are projected and overlap in the XZ plane. In this case, the air inlet 71 and the tester 43 preferably partially or entirely overlap on the projection plane. According to the above configuration, cooling air can be efficiently supplied into the measurement unit 30 .

[0066] The transfer opening 72 is an opening for transferring the conveyed object between the loading portion 114 and the probe body 112. The transfer opening 72 is preferably shaped to correspond to the outer shape of the conveyed object. In one embodiment, a rectangular shape that matches the outer shape of a substantially plate-shaped conveyed object is preferred. The delivery port 72 is preferably provided at a position corresponding to the spring frame 41 and the wafer chuck 150 etc. (hereinafter also referred to as “the spring frame 41 etc.” in this section) in the measurement unit 30 . The position corresponding to the spring frame 41 and the wafer chuck 150 is the position where the delivery port 72 and the spring frame 41 overlap when viewed from the loading portion 114. If other components are removed, it is preferable that a portion or all of the spring frame 41 is visible from the delivery port 72. From another perspective, the position corresponding to the spring frame 41 and the wafer chuck 150, etc., refers to the position where the intersection 72 and the spring frame 41, etc. are projected and overlap in the XZ plane. In this case, it is preferable that the intersection 72 and the spring frame 41, etc. partially or completely overlap in the projection plane. This allows for smooth transfer of the transported object between the loading portion 114 and the probe main body 112 .

[0067] As a preferred embodiment, a method in which the delivery port 72 and the loading portion 114 are connected via a tunnel-shaped passage 92 can be cited. Figure 11 This embodiment is shown in . Thus, even if the probe body 112 and the mounting portion 114 are separated by the gap S, it is possible to suppress the intrusion of cooling air from the external environment into the interior of the probe body 112 .

[0068] Hereinafter, the structure of the partition wall 70 of each measurement unit 30 will be described in more detail. Figure 7 The measurement unit 30 is viewed from the side of the loading unit 114, that is, from the outside of the measurement unit 30. Figure 6 A diagram obtained by measuring the partition wall 70 of one of the measurement parts 30.

[0069] like Figure 7 As shown, the tester 43 and the fan 47 provided in the measuring section 30 can be visually observed from the air inlet 71 (see Figure 6 ). In addition, a portion of the spring frame 41 and the wafer chuck 150 etc. provided in the measuring section 30 can be visually observed from the delivery port 72. It should be noted that in order to facilitate understanding of the shapes of the air inlet 71 and the delivery port 72, Figure 7 The components in the measuring section 30 are shown by dotted lines.

[0070] Figure 8A 、 Figure 8B This is a diagram obtained by observing the partition wall 70 from the inner side of the measurement unit 30. Figure 8A 、 Figure 8B As shown, a shutter 80 for opening and closing the delivery port 72 is provided in the measurement unit 30. The shutter 80 is an example of an opening and closing mechanism. Figure 8A The state where the interface 72 is open is shown. Figure 8B The state where the interface 72 is closed is shown.

[0071] The gate 80 includes a shielding plate 81, a pair of guide rails 82, and a cylinder 83. The shielding plate 81 is preferably larger than the interface 72 so that it can reliably cover the interface 72. The shape of the shielding plate 81 is not particularly limited. In this embodiment, the shielding plate 81 is, by way of example, a trapezoidal shape.

[0072] A pair of guide rails 82 are provided on both sides of the rectangular intersection 72 in the longitudinal direction, and the shielding plate 81 is movable in the up-down direction (Z-axis direction) along the pair of guide rails 82 .

[0073] The air cylinder 83 is configured to be able to freely extend and retract in the vertical direction (Z-axis direction). One of the two ends of the air cylinder 83 in the extension and retraction direction is connected to the shielding plate 81, and the other end is connected to the bottom of the measuring section 30. When the object to be transported is supplied to the measuring section 30 through the delivery port 72, the air cylinder 83 is retracted under the control of a control device (not shown), and the shielding plate 81 moves to a position below the delivery port 72. This opens the delivery port 72.

[0074] The delivery port 72 is preferably closed except when the conveyed object is supplied through the delivery port 72. Closing of the delivery port 72 is performed under the control of a control device (not shown). The air cylinder 83 extends, and the shielding plate 81 moves to a position that completely covers the delivery port 72. It should be noted that, although the structure of the shutter 80 is illustrated, the structure is not limited as long as the delivery port 72 can be opened and closed.

[0075] By closing the transfer port 72 with the gate 80 except when the conveyed objects are transferred, it is possible to prevent air with a relatively high dew point temperature (high moisture content) from flowing from the loading portion 114 or the gap S into the detection area 50 of the measuring portion 30 (see Figure 4 ). This suppresses the occurrence of condensation. It should be noted that the probe area 50 is a space located below the test head plate 44. The probe card 42 and the wafer chuck 150 are located in this space. Specifically, the probe area 50 includes the portion where the probes 66 of the probe card 42 contact the electrode pads of each chip on the wafer W.

[0076] Next, the cooling air exhaust port 73 will be described. Figure 9 11 is a diagram showing a side surface 112B on the maintenance area side (the side opposite to the loading portion 114 ) of the probe main body 112 .

[0077] like Figure 9 As shown, the side surface 112B on the maintenance area side has a plate-shaped panel 74 divided into sections for each measuring section 30. In this example, the probe body 112 has twelve measuring sections 30. Therefore, the side surface 112B has twelve panels 74 corresponding to the twelve measuring sections 30. The panels 74 are, for example, metal plates with a thickness of 10 mm to 30 mm. It should be noted that this example does not limit the material or thickness of the panels 74.

[0078] An exhaust port 73 and a maintenance opening (not shown) are formed in each panel 74. The exhaust port 73 is preferably provided at a position corresponding to the tester 43 in the measurement unit 30 in the X-axis and Z-axis directions. It should be noted that the preferred relative positional relationship between the exhaust port 73 and the tester 43 is the same as the preferred relative positional relationship between the air intake port 71 and the tester 43, and therefore details thereof are omitted. According to the above configuration, cooling air can be efficiently exhausted from the tester 43 .

[0079] A metal mesh 75 is embedded in the exhaust port 73. The mesh 75 prevents foreign matter from entering the measuring unit 30. Furthermore, a pair of hinges 76 are provided at the lower end of the mesh 75 to allow easy removal of the mesh 75 from the exhaust port 73. It should be noted that the exhaust port 73 does not necessarily need to include the mesh 75 and hinges 76.

[0080] A maintenance opening is provided below the exhaust port 73. The maintenance opening is preferably located within the measurement unit 30 so that an operator can access the equipment located below the test head plate 44. The maintenance opening is closed by a cover 78. A pair of hinges 77 are provided at the upper end of the cover 78, allowing the cover 78 to be easily removed from the maintenance opening.

[0081] The net 75 and the cover plate 78 are detachable from the exhaust port 73 and the maintenance opening. By detaching them, the operator can easily perform maintenance on the devices provided above and below the test head plate 44 in the measurement unit 30.

[0082] Next, the tester 43 provided in each measuring unit 30 will be described. Figure 10A 、 Figure 10B It is a perspective view of the appearance of the tester 43. Figure 10A This is a perspective view of the appearance of the tester 43 as viewed from the loading portion 114 side. Figure 10B This is a perspective view of the appearance of the tester 43 as viewed from the maintenance area side opposite to the loading section 114. Figure 10A and Figure 10B In FIG. 1 , a thick dotted arrow B shows a path of cooling air.

[0083] like Figure 10A 、 Figure 10BAs shown, the tester 43 is generally in the shape of a rectangular parallelepiped. The shell of the tester 43 has 43A, 43B, 43C, and 43D, which are four side surfaces arranged upright and parallel to (approximately perpendicular to) the Z-axis direction. In addition, it has two surfaces parallel to the XY plane, namely the upper surface 43E and the lower surface 43F. The four side surfaces of the tester 43 are as follows. First, the side surface 43A is the side surface facing the loading part 114. The side surface 43B is a side surface provided on the side opposite to the loading part 114 (the maintenance area side). The side surface 43C and the side surface 43D are two side surfaces provided between the side surface 43A and the side surface 43B.

[0084] like Figure 10A As shown, side surface 43A has one or more openings 90. Cooling air is drawn into probe body 112 from gap S via air intake port 71. Cooling air is then supplied into tester 43 from opening 90. In other words, gap S, air intake port 71, and opening 90 are sequentially connected to form a cooling air path. Therefore, there is no need to provide a dedicated cooling air path for supplying cooling air from the loading section 114 side.

[0085] The fan 47 is preferably disposed near the opening 90. It should be noted that the position of the fan 47 is described in Figure 5 and Figure 11 middle. When the fan 47 is positioned as described above, cooling air can be efficiently sucked in from the air inlet 71 and circulated in the tester 43 (typically, through the tester 43 ), thereby improving the cooling efficiency of the tester 43 .

[0086] Moreover, if Figure 10B As shown, the side surface 43B has one or more openings 91. The cooling air that has passed through the tester 43 is exhausted from the tester 43 to the outside of the probe body 112 via the openings 91 and the exhaust port 73.

[0087] Furthermore, in this example, side surface 43C, side surface 43D, upper surface 43E, and lower surface 43F do not have openings. This prevents cooling air from escaping outside tester 43. Therefore, as indicated by arrow B, cooling air supplied from opening 90 passes through the roughly cylindrical (roughly square tube-shaped) housing of tester 43 and is smoothly exhausted from opening 91. This structure further improves the cooling efficiency of tester 43. Furthermore, by preventing cooling air from leaking from the tester 43, it is possible to suppress the cooling air from entering the detection area 50 located below the test head plate 44. This also helps to stably maintain the temperature in the detection area 50 within a predetermined inspection temperature range.

[0088] In particular, in chip level inspection under low temperature conditions, when the detection area 50 (and the interior of the loading part 114) is filled with dry air to suppress condensation, the cooling air can be prevented from leaking from the tester 43 to the detection area 50, which is a significant advantage.

[0089] Furthermore, since cooling air is passed through the substantially cylindrical housing of the tester 43, there is no need to provide a dedicated cooling air path within the probe body 112. In other words, there is no need to provide dedicated cooling air paths on either the loading section 114 or the probe body 112. As a result, the cost and size of the probe 100 can be reduced.

[0090] [Effects of the Invention] Below, use Figure 11 , referring to the path of cooling air within one measuring unit 30, the effects of this embodiment will be comprehensively described. Figure 11 is Figure 2 The cross-sectional view of the detector 100 is defined by the line AA' in FIG. It should be noted that, Figure 11 Only the measuring portion 30 of the top layer of the probe body 112, which is a three-layer stacked structure, is shown. Figure 11 In FIG. 1 , a thick dotted arrow C shows a path of cooling air.

[0091] like Figure 11 As shown by arrow C, cooling air is supplied from the external environment into the measurement unit 30 through the gap S between the probe body 112 and the loader 114 and the air intake port 71, not through the interior of the loader 114. This advantage is particularly effective when the loader 114 is filled with dry gas to suppress condensation during wafer level inspection at low temperatures.

[0092] Furthermore, by drawing cooling air into the measurement unit 30 through the gap S between the probe body 112 and the loading section 114, the cooling air in the gap S between the probe body 112 and the loading section 114 flows. This prevents the cooling air from stagnating between the probe body 112 and the loading section 114, thus suppressing condensation. This advantage is particularly effective during wafer level inspections at low temperatures.

[0093] As indicated by arrow C, fan 47 is positioned along the cooling air path within tester 43. By operating fan 47, cooling air can be actively drawn into tester 43 from gap S, and then directed to exhaust port 73. This improves cooling efficiency. Preferably, fan 47 is positioned on the side of loading unit 114. This facilitates the supply of cooling air from intake port 71.

[0094] like Figure 11 As shown, the probe body 112 is separated from the loading portion 114 by a gap S, but a large portion of the side surface 112A facing the loading portion 114 is covered by the partition wall 70. Therefore, even if the probe body 112 is separated from the loading portion 114 by the gap S, the ingress of cooling air from the external environment through the gap S into the detection area 50 of the probe body 112 can be suppressed.

[0095] Furthermore, the transfer port 72 provided in the partition wall 70 is connected to the loading portion 114 via a tunnel-shaped passage 92. Since the objects to be transported (wafer W and probe card 42) are transferred between the probe main body 112 and the loading portion 114 via the tunnel-shaped passage 92 and the transfer port 72, the intrusion of cooling air into the probe area 50 can be suppressed.

[0096] Furthermore, a gate 80 is provided for opening and closing the transfer port 72. By closing the transfer port 72 with the gate 80 except when transferring objects, it is possible to prevent air with a relatively high dew point temperature (high moisture content) from flowing from the loading section 114 side into the detection area 50 of the measurement section 30. Similarly, even if the loading section 114 is filled with dry air, dry air with a relatively high dew point temperature may sometimes also fill the loading section 114 side.

[0097] In addition, if Figure 11 As shown by arrow C, cooling air supplied from the air intake port 71 passes through the substantially cylindrical housing of the tester 43 and reaches the exhaust port 73 along a substantially straight path to cool the tester 43 before being exhausted.

[0098] The cooling air supplied from the opening 90 of the tester 43 passes through the substantially cylindrical housing of the tester 43 and is exhausted from the opening 91 of the tester 43, thereby suppressing leakage of the cooling air from the tester 43 into the detection area 50. As a result, the temperature in the detection area 50 can be stably maintained within a predetermined inspection temperature range.

[0099] Furthermore, since cooling air passes through the substantially cylindrical housing of the tester 43, there is no need to provide a dedicated cooling air path within the probe body 112. In other words, since dedicated cooling air paths are not required on either the loading section 114 or the probe body 112, the cost of the probe 100 and the space required for the probe body 112 can be reduced accordingly.

[0100] The air intake port 71 is provided on the side surface 112A of the probe body 112 on the side of the loading section 114 (the partition wall 70 between the measurement sections 30), and the air exhaust port 73 is provided on the side surface 112B of the probe body 112 on the side opposite the loading section 114 (the panel 74 between the measurement sections 30). Therefore, the temperature of the cooling air near the air intake port 71 can be suppressed from rising due to the cooling air exhausted from the air exhaust port 73. Consequently, a decrease in cooling efficiency can be suppressed.

[0101] [other] In the present embodiment, the shutter 80 for opening and closing the delivery port 72 is provided inside the measurement unit 30 , but the shutter 80 may also be provided outside the measurement unit 30 .

[0102] The embodiments of the detector have been described in detail above. However, it is obvious that some improvements or modifications may be made to the detector of the present disclosure without departing from the spirit and scope of the invention. Description of Reference Signs

[0103] 13: Alignment device; 30: Measurement unit; 41: Spring frame; 42: Probe card; 43: Tester; 43A, 43B, 43C, 43D: Side surfaces; 43E: Top surface; 43F: Bottom surface; 44: Test head board; 47: Fan; 50: Probe area; 53: Spring frame mounting portion; 60, 62, 64: Sealing member; 66: Probe; 70: Partition wall; 71: Air intake port; 72: Interface; 73: Exhaust port; 74: Panel; 75: Net; 76, 77: Hinges; 7 8: Cover plate; 80: Gate plate; 81: Shielding plate; 82: Guide rail; 83: Cylinder; 90, 91: Opening; 92: Passage; 100: Detector; 112: Detector body; 112A, 112B, 112C, 112D: Side surface; 114: Loading part; 118: Loading port; 120: Wafer box; 121: Operation panel; 122: Conveying unit; 123: Probe card box; 124: Conveying arm; 150: Wafer chuck; A, B, C: Arrows; S: Gap; W: Wafer.

Claims

1. A detector, wherein: have: a loading unit having a wafer conveying mechanism; and The probe body has a plurality of measuring parts, a tester respectively arranged at the plurality of measuring parts, and a detection area provided at the plurality of measuring parts. The loading portion and the probe body are arranged with a gap therebetween. Each of the plurality of measuring parts has a partition wall between itself and the loading part. An air intake port for supplying cooling air to the tester and a delivery port for delivering an object to be transported from the loading section to the measurement section are formed in the partition wall.

2. The detector according to claim 1, wherein The probe body includes an exhaust port for exhausting the cooling air having passed through the tester to a side opposite to the mounting portion.

3. The detector according to claim 1 or 2, wherein: The partition wall includes an opening and closing mechanism for opening and closing the interface.

4. The detector according to claim 1 or 2, wherein: The tester includes a fan for sucking the cooling air on the air intake side.

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