Substrate processing system and trolley

Abstract

A substrate processing system includes: a vacuum transfer module having a first side surface, a second side surface opposite to the first side surface, and a bottom surface having an opening, the distance from the opening to the first side surface being greater than the distance from the opening to the second side surface; a plurality of first substrate processing modules on the first side surface side; a plurality of second substrate processing modules on the second side surface side; a lower space defined below the vacuum transfer module; a transfer robot which is detachably attached to the vacuum transfer module so as to close the opening, and which can be removed from the opening into the lower space; a first rail mounted to the plurality of first substrate processing modules so as to extend in the longitudinal direction in the lower space; and a second track mounted on the plurality of second substrate processing modules.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing system and a trolley. Background Art

[0002] Patent Document 1 discloses a system comprising: a wafer transport module housing a robot configured to engage, lift, and transport wafers; multiple processing modules connected to the wafer transport module; and a service tunnel defined beneath the wafer transport module. The service tunnel provides access to the underside of the wafer transport module for repairing the robot.

[0003] Patent Document 2 discloses a substrate processing system comprising multiple processing chambers and multiple power supply units. The power supply units are located below the processing chambers and independently supply power to each processing chamber. In the substrate processing system disclosed in Patent Document 2, during maintenance, a crane is used to raise the unit to be maintained and transport it along a track that protrudes outward from the end of the processing chamber.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-092459

[0007] Patent Document 2: Japanese Patent Application Laid-Open No. 2021-034495 Summary of the Invention

[0008] Problems to be solved by the invention

[0009] The technology disclosed herein provides a substrate processing system capable of accessing a unit from below a vacuum transfer module, and a carriage capable of mounting a transfer robot provided in the vacuum transfer module and appropriately moving the transfer robot to below the vacuum transfer module.

[0010] Solutions for solving problems

[0011] A technical solution of the present disclosure is a substrate processing system, wherein the substrate processing system comprises: a vacuum transport module extending along the length direction of the substrate processing system, the vacuum transport module having a first side surface, a second side surface opposite to the first side surface, and a bottom surface, the bottom surface having an opening, and a distance from the opening to the first side surface is greater than a distance from the opening to the second side surface; a plurality of substrate processing modules, comprising a plurality of first substrate processing modules connected to the first side surface of the vacuum transport module and a plurality of second substrate processing modules connected to the second side surface of the vacuum transport module; a lower portion A space is defined below the vacuum transport module between the plurality of first substrate processing modules and the plurality of second substrate processing modules; a transport robot is installed on the vacuum transport module in a manner that blocks the opening and is freely loadable and removable, and is configured to transport substrates within the vacuum transport module, and the transport robot can take them out from the opening to the lower space; a first track is installed on the plurality of first substrate processing modules in the lower space in a manner that extends along the length direction; and a second track is installed on the plurality of second substrate processing modules in the lower space in a manner that extends along the length direction.

[0012] Effects of the Invention

[0013] According to the present disclosure, a substrate processing system capable of accessing a unit from below a vacuum transfer module and a carriage capable of mounting a transfer robot provided in the vacuum transfer module and appropriately moving the transfer robot to below the vacuum transfer module can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a plan view showing a configuration example of a substrate processing system according to this embodiment.

[0015] Figure 2 It is a perspective view showing a configuration example of a substrate processing system according to this embodiment.

[0016] Figure 3 It is a cross-sectional view showing a configuration example of a substrate processing system according to this embodiment.

[0017] Figure 4 It is a cross-sectional view showing a configuration example of a substrate processing system according to this embodiment.

[0018] Figure 5 It is a perspective view showing a structural example of a substrate transport robot.

[0019] Figure 6 It is an explanatory diagram showing a configuration example of a substrate processing module and a post-processing module.

[0020] Figure 7It is a perspective view showing a structural example of a carriage on which a substrate transport robot is placed and transported.

[0021] Figure 8 This is an explanatory diagram showing the main steps of loading the substrate transfer robot into the vacuum transfer module.

[0022] Figure 9 This is an explanatory diagram showing the main steps of loading the substrate transfer robot into the vacuum transfer module.

[0023] Figure 10 This is an explanatory diagram showing the main steps of loading the substrate transfer robot into the vacuum transfer module.

[0024] Figure 11 This is an explanatory diagram showing the main steps of loading the substrate transfer robot into the vacuum transfer module.

[0025] Figure 12 This is an explanatory diagram showing the main steps of loading the substrate transfer robot into the vacuum transfer module.

[0026] Figure 13 This is an explanatory diagram showing the main steps of loading the substrate transfer robot into the vacuum transfer module.

[0027] Figure 14 This is an explanatory diagram showing a jig attached to a frame supporting a vacuum transfer module.

[0028] Figure 15 This is an explanatory diagram showing a state in which a carriage enters the lower space after a jig is installed. DETAILED DESCRIPTION

[0029] In the semiconductor device manufacturing process, the interior of a substrate processing module housing a semiconductor substrate (hereinafter referred to as a "substrate") is brought to a reduced pressure (vacuum) state, and the substrate is subjected to various plasma processes, such as etching and post-processing. These plasma processes are performed using a processing system comprising a vacuum transfer module that transfers the substrate under reduced pressure, and multiple substrate processing modules arranged adjacent to the vacuum transfer module.

[0030] While Patent Document 1 discloses providing access to the bottom of the wafer transfer module via a service tunnel when repairing a robot deployed in a wafer transfer module, it does not describe or suggest moving the robot itself in and out of the wafer transfer module. Furthermore, Patent Document 2 does not describe or suggest moving a substrate transfer robot in and out of a vacuum transfer module.

[0031] The technology disclosed herein was developed in response to the aforementioned circumstances and provides a substrate processing system capable of accessing a unit from below a vacuum transfer module, and a trolley capable of carrying a transfer robot located within the vacuum transfer module and appropriately moving it to the bottom of the vacuum transfer module. The substrate processing system of this embodiment is described below with reference to the accompanying drawings. In this specification and the accompanying drawings, elements with substantially identical functional structures are denoted by the same reference numerals to avoid duplication of description.

[0032] <Substrate processing system>

[0033] First, the configuration of the substrate processing system according to this embodiment will be described. Figure 1 and Figure 2 The top view and the perspective view respectively show the schematic structure of the substrate processing system 1 of this embodiment. Figure 3 and Figure 4 They are respectively Figure 2 The perspective view of the substrate processing system 1 is shown in cross-section A and cross-section B. In addition, a wafer is an example of a substrate.

[0034] like Figure 1 As shown, the substrate processing system 1 includes an atmospheric section 10 and a decompression section 11 integrally connected via a load lock module 20. The atmospheric section 10 includes an atmospheric module for processing and / or transporting substrates W in an atmospheric atmosphere. The decompression section 11 includes a decompression module (vacuum module) for processing and / or transporting substrates W in a reduced pressure (vacuum) atmosphere.

[0035] The load lock module 20 includes a plurality of, for example, two, load lock chambers 21a and 21b along an atmospheric transfer module 30 and a vacuum transfer module 50. In one embodiment, the load lock module 20 includes two load lock chambers 21a and 21b arranged along a first horizontal direction.

[0036] The load lock chambers 21a and 21b (hereinafter sometimes collectively referred to as "load lock chambers 21") are provided so that the interior space of an atmospheric transfer module 30 (described later) of the atmospheric section 10 communicates with the interior space of a vacuum transfer module 50 (described later) of the decompression section 11 via a substrate transfer port. Furthermore, the substrate transfer ports 22 and 23 are configured to be freely openable and closable by gate valves 24 and 25, respectively.

[0037] The load lock chamber 21 is configured to temporarily hold substrates W. Furthermore, the load lock chamber 21 is configured to be able to switch between an atmospheric atmosphere and a reduced-pressure atmosphere (vacuum state). Specifically, the load lock module 20 is configured to appropriately transfer substrates W between the atmospheric section 10 (atmospheric atmosphere) and the reduced-pressure section 11 (at reduced-pressure atmosphere).

[0038] The atmospheric section 10 includes an atmospheric transfer module 30 , which houses a substrate transfer robot 40 (described later), and a load port 32 , which receives a front-opening pod 31 capable of storing multiple substrates W. Furthermore, an orientation module (not shown) for adjusting the horizontal orientation of the substrates W, a storage module (not shown) for storing multiple substrates W, and the like may be provided adjacent to the atmospheric transfer module 30 .

[0039] Atmospheric conveying module 30 comprises a rectangular housing whose interior is maintained at atmospheric atmosphere. Multiple, for example, five, load ports 32 are arranged on one side of atmospheric conveying module 30, forming a long side on the negative Y-axis side. Load lock chambers 21a and 21b of load lock module 20 are arranged on the other side of atmospheric conveying module 30, forming a long side on the positive Y-axis side.

[0040] A substrate transfer robot 40 is provided within the atmospheric transfer module 30 for transferring substrates W. In one example, the substrate transfer robot 40 is configured to move along a transfer path 41 extending in the X-axis direction and is capable of transferring substrates W between the front-opening FOUP 31 at the load port 32 and the load-lock chambers 21 a and 21 b of the load-lock module 20. The structure of the substrate transfer robot 40 is not limited to this.

[0041] The decompression section 11 includes a vacuum transfer module 50, which transports substrates W; a load lock module 20; a substrate processing module 60, which performs desired processing on the substrates W transferred from the vacuum transfer module 50; and a post-processing module 70, which performs post-processing on the substrates W after undergoing the desired processing in the substrate processing module 60. The interiors of the vacuum transfer module 50, substrate processing module 60, and post-processing module 70 are each configured to maintain a reduced pressure (vacuum) atmosphere. In this embodiment, a plurality of, for example, six, substrate processing modules 60 and a plurality of, for example, two, post-processing modules 70 are connected to one vacuum transfer module 50. The number and arrangement of the substrate processing modules 60 and post-processing modules 70 are not limited to this embodiment and can be arbitrarily set.

[0042] The vacuum transport module 50 has a housing 51 that is rectangular in shape when viewed from above. Figure 3 and Figure 4 As shown, the housing 51 is supported by the frame F, thereby becoming suspended from the floor of the room where the substrate processing system 1 is arranged. Therefore, as described later, a lower space S is formed below the vacuum transfer module 50 (see Figure 3 The housing 51 is provided with a substrate transfer port 52 to which various modules described below are connected. The substrate transfer space of the vacuum transfer module 50 communicates with the interiors of the various modules described below via the substrate transfer port 52 .

[0043] The vacuum transfer module 50 has a first side surface 50a, a second side surface 50b opposite the first side surface 50a, and a bottom surface 50c. One or more, in this embodiment, three, first-side modules (first substrate processing modules) 61 are connected to the first side surface 50a, on the negative side of the housing 51 in the X-axis direction. One or more, in this embodiment, three, second-side modules (second substrate processing modules) 62 are connected to the second side surface 50b, on the positive side of the housing 51 in the X-axis direction. In other words, the substrate processing system 1 includes multiple substrate processing modules, including multiple first substrate processing modules 61 and multiple second substrate processing modules 62. The atmospheric transfer module 30 is connected to the front surface of the housing 51 on the negative side of the Y-axis via the load lock module 20. Furthermore, one or more, in this embodiment, two, post-processing modules (other substrate processing modules) 70 are connected to the rear surface of the housing 51 on the positive side of the Y-axis direction. As described later, the substrate processing module 60 includes a first side module 61 and a second side module 62. Thus, the vacuum transfer module 50 is connected to one or more substrate processing modules 60. Furthermore, in the vacuum transfer module 50, for example, a substrate W transferred to the load lock chamber 21a of the load lock module 20 is sequentially transferred to a substrate processing module 60 and a post-processing module 70 for processing. Thereafter, the substrate W is transferred to the atmosphere section 10 via the load lock chamber 21b of the load lock module 20.

[0044] Furthermore, an opening 53 is formed in the bottom surface 50c constituting the housing 51. The opening 53 is formed at a position offset in the X-axis and Y-axis directions from the center of the housing 51. Therefore, a distance D1 from the first side surface 50a of the housing 51 to the opening 53 is greater than a distance D2 from the second side surface 50b of the housing 51 to the opening 53.

[0045] The substrate processing system 1 includes a substrate transfer robot 80 disposed within the vacuum transfer module 50. The substrate transfer robot 80 is configured to transfer substrates W between the load lock module 20, one or more substrate processing modules 60, and one or more post-processing modules 70. In one embodiment, the substrate transfer robot 80 is detachably mounted on the vacuum transfer module 50 to block the opening 53 and is configured to transfer substrates W within the vacuum transfer module 50. The substrate transfer robot 80 can be removed from the opening 53 to the lower space S.

[0046] Figure 5 1 is a perspective view showing the schematic structure of the substrate conveying robot 80. Figure 5As shown, the substrate conveying robot 80 has: a first arm 100, one end of which is connected to the base 81 so as to be freely rotatable relative to the base 81; a second arm 110, one end of which is connected to the other end of the first arm 100 so as to be freely rotatable relative to the other end of the first arm 100; a third arm 120a, which is connected to the other end of the second arm 110 so as to be freely rotatable relative to the other end of the second arm 110; and a fourth arm 120b, which is connected to the other end of the second arm 110 so as to be freely rotatable relative to the other end of the second arm 110.

[0047] Furthermore, an upper fork 121a and a lower fork 121b are connected to the other ends of the third arm 120a and the fourth arm 120b, respectively, for holding substrates W. The upper fork 121a and the lower fork 121b are arranged to overlap in the longitudinal direction, with the upper fork 121a positioned on the upper side. Thus, the substrate transfer robot 80 can simultaneously transfer two substrates W, overlapping in the longitudinal direction. Furthermore, as described later, the upper fork 121a and the lower fork 121b are configured to independently rotate about their vertical axes.

[0048] As described later, the base 81 supports the main body of the substrate transfer robot on the upper surface via the first joint 130. In this embodiment, the main body of the substrate transfer robot includes the first arm 100, the second arm 110, the third arm 120a, the fourth arm 120b, the upper fork 121a, and the lower fork 121b. The base 81 fits into the opening 53 formed in the housing 51 and is connected to the vacuum transfer module 50, thereby transporting the substrate transfer robot 80, supported on the upper surface, into the vacuum transfer module 50. Details of the method for connecting the base 81 to the housing 51 (and the method for loading and unloading the substrate transfer robot 80 into and out of the vacuum transfer module 50) will be described later.

[0049] The first arm 100 is connected to the base 81 via a first joint 130. A rotation mechanism (not shown), such as a motor, is provided at the first joint 130. Furthermore, the substrate transport robot 80 is configured so that the first arm 100 can freely rotate relative to the base 81 by operating the rotation mechanism using a drive mechanism (not shown).

[0050] The second arm 110 is connected to the first arm 100 via a second joint 140. A rotation mechanism (not shown), such as a motor, is provided at the second joint 140. Furthermore, the substrate transport robot 80 is configured so that the second arm 110 can rotate freely relative to the first arm 100 by operating the rotation mechanism using a drive mechanism (not shown).

[0051] The third arm 120a and the fourth arm 120b are connected to the second arm 110 via a third joint 150. A rotation mechanism (not shown), such as a motor corresponding to each of the third arm 120a and the fourth arm 120b, is provided at the third joint 150. Furthermore, the substrate transport robot 80 is configured such that the third arm 120a and the fourth arm 120b are independently rotatable relative to the second arm 110 by operating each of the rotation mechanisms using a drive mechanism (not shown).

[0052] In one example, electrical wiring for supplying power to the rotating mechanisms and driving mechanisms disposed inside the first to third joints 130 to 150 passes through the interior of each arm at atmospheric pressure and is connected to a power source (not shown).

[0053] The substrate transfer robot 80 can transfer substrates W between the load lock module 20 , the substrate processing module 60 , and the post-processing module 70 by utilizing the relative extension and extension rotation of each arm accompanied by the operation of the rotation mechanism disposed in each joint.

[0054] The substrate processing module 60 performs plasma processing such as etching on the substrate W. The substrate processing module 60 is connected to the vacuum transfer module 50 via a substrate transfer port 52 formed on the side wall of the vacuum transfer module 50. The substrate transfer port 52 is configured to be openable and closable using a gate valve 63. In addition, the substrate processing module 60 has a housing (see FIG. 1 ) that is vertically elongated in cross section and stands upright from the floor of the room where the substrate processing system 1 is installed. Figure 2 In one example, the top surface of the substrate processing module 60 is located at a higher level than the top surface of the vacuum transfer module. Thus, an upper space defined by the top surface of the housing 51, the plurality of first side modules 61, and the plurality of second side modules 62 is formed above the vacuum transfer module 50.

[0055] A plasma processing chamber is located in the longitudinal middle section of the housing. This plasma processing chamber is connected to a gate valve 63 and is used to process substrates W. The plasma processing chamber comprises a plasma processing space. A plasma source, a gas supply source, and other components (hereinafter sometimes referred to as "gas boxes, etc.") for generating plasma within the substrate processing module 60 are located in the upper portion of the housing. Electrical wiring and other components (hereinafter sometimes referred to as "electrical components") connected to a power source for generating plasma within the substrate processing module 60 are located in the lower portion of the housing.

[0056] In the technology disclosed herein, the plurality of gas boxes and the like include first gas boxes and the like corresponding to the plurality of first side modules 61, and second gas boxes and the like corresponding to the plurality of second side modules 62. Furthermore, in the technology disclosed herein, the plurality of electrical installation units include first electrical installation units corresponding to the plurality of first side modules 61, and second electrical installation units corresponding to the plurality of second side modules 62.

[0057] In the illustrated example, the substrate processing module 60 includes a housing having a longitudinal cross-sectional shape, and the plasma processing chamber, gas box, etc., and electrical installation units are disposed within a single housing constituting the substrate processing module 60. However, these plasma processing chambers, gas boxes, etc., and electrical installation units may be disposed within separate housings. Thus, it is possible for each substrate processing module 60 to include a plasma processing chamber, with the corresponding gas box, etc. disposed above the substrate processing module 60, and the corresponding electrical installation units disposed below the substrate processing module 60. In this case, the gas box, etc. corresponding to each substrate processing module 60 may also be disposed within the aforementioned upper space formed above the vacuum transfer module 50.

[0058] In addition, the structure of the substrate processing module 60 is not particularly limited.

[0059] In one example, Figure 6 As shown, the substrate processing module 60 includes a plasma processing chamber 200, a substrate support portion 210, and a plasma generating portion 220. The plasma processing chamber 200 has a plasma processing space. Furthermore, the plasma processing chamber 200 has at least one gas supply port for supplying at least one processing gas to the plasma processing space and at least one gas exhaust port for exhausting gas from the plasma processing space. The gas supply port is connected to the gas supply portion, and the gas exhaust port is connected to the exhaust system. The substrate support portion 210 is disposed within the plasma processing space and has a substrate supporting surface for supporting a substrate.

[0060] The plasma generating section 220 is configured to generate plasma using at least one processing gas supplied into the plasma processing space. The plasma formed in the plasma processing space may be capacitively coupled plasma (CCP), inductively coupled plasma (ICP), ECR plasma (Electron-Cyclotron-resonance plasma), helicon wave plasma (HWP), or surface wave plasma (SWP). Furthermore, various types of plasma generating sections, including AC (alternating current) plasma generating sections and DC (direct current) plasma generating sections, may also be used. In one embodiment, the AC signal (AC power) used by the AC plasma generating section has a frequency in the range of 100 kHz to 10 GHz. Therefore, the AC signal includes an RF (radio frequency) signal and a microwave signal. In one embodiment, the RF signal has a frequency in the range of 100 kHz to 150 MHz.

[0061] A post-processing module 70, another substrate processing module, performs post-processing on substrates W after the plasma processing in the substrate processing module 60. In one embodiment, an ashing process using plasma is performed in the post-processing module 70. The substrate processing module 60 is connected to the vacuum transfer module 50 via a substrate transfer port 52 formed in a side wall of the vacuum transfer module 50. The substrate transfer port 52 is configured to be freely openable and closable using a gate valve 71.

[0062] The structure of the post-processing module 70 is not particularly limited. However, generally speaking, the post-processing steps of the substrate W do not require high currents or large capacities compared to plasma processing such as etching in the aforementioned substrate processing module 60. Therefore, the post-processing module 70 can be configured as a smaller plasma processing device than the substrate processing module 60.

[0063] In one example, Figure 6 As shown, the post-processing module 70 includes a plasma processing chamber 300, a substrate support portion 310, and a plasma generating portion 320. In one example, the plasma processing chamber 300 has a smaller plasma processing space than the substrate processing module 60 (see also FIG. Figure 4In addition, the plasma processing chamber 300 has at least one gas supply port for supplying at least one processing gas to the plasma processing space and at least one gas exhaust port for exhausting gas from the plasma processing space. The gas supply port is connected to a gas supply unit, and the gas exhaust port is connected to an exhaust system. The substrate support unit 310 is disposed within the plasma processing space and has a substrate support surface for supporting a substrate.

[0064] In one example, the plasma generation unit 320 includes a plasma generation space that is separate from the plasma processing space (plasma processing chamber 300). Thus, the post-processing module 70 is configured as a remote plasma processing device with separate plasma processing and plasma generation spaces. The plasma processing and plasma generation spaces may be separated by a partition plate within a single housing, or the housing forming the plasma processing and plasma generation spaces may be physically separated.

[0065] Furthermore, in one example, a box 72 housing electrical wiring and the like is disposed below the housing (plasma processing space and / or plasma generation space) of the post-processing module 70. In one example, the box 72 is disposed below the vacuum transfer module 50 and inside the legs of the frame F supporting the vacuum transfer module 50.

[0066] In addition, as Figure 6 As shown, in one example, plasma processing of the substrate W is performed in the substrate processing module 60 and the post-processing module 70 under the control of the control unit 2 described later.

[0067] Return to the description of the substrate processing system 1 .

[0068] like Figure 3 As shown, a lower space S is formed below the vacuum transfer module 50 in the decompression section 11. This lower space S is defined by the bottom surface 50c of the housing 51, a plurality of first side modules 61, and a plurality of second side modules 62. In one embodiment, the lower space S extends from the negative end of the vacuum transfer module 50 in the Y-axis direction to the positive end of the vacuum transfer module 50 in the Y-axis direction. Furthermore, the lower space S provides access to the opening 53 formed in the bottom surface 50c of the housing 51 of the vacuum transfer module 50, that is, to the substrate transfer robot 80 disposed within the vacuum transfer module 50. Therefore, the lower space S functions as a workspace for maintenance of the vacuum transfer module 50 and the substrate transfer robot 80, as well as for loading and unloading the substrate transfer robot 80.

[0069] In addition, if Figure 3As shown, the electrical wiring and the like, which are arranged at the lower portion of the first side module 61 and the lower portion of the second side module 62, may be arranged in the lower portion S1 of the lower space S. In other words, a non-effective space that cannot be used when the substrate transfer robot 80 is loaded and unloaded may be formed in the lower portion S1 of the lower space S (see FIG. Figure 3 Therefore, the effective width (first width W1) of the lower portion S1 of the lower space S that can be used when the substrate transfer robot 80 is loaded and unloaded is smaller than the effective width (second width W2) of the upper portion Su of the lower space S.

[0070] In addition, if Figure 4 As shown and described above, the post-processing module 70, more specifically, the boxes 72 corresponding to the post-processing module 70, are located below the vacuum transfer module 50 and inside the legs of the frame F. Therefore, the post-processing module 70, more specifically, the boxes 72 corresponding to the post-processing module 70, define a lower space entrance Se that communicates with the lower space S. The effective width (third width W3) of the lower space entrance Se of the lower space S, which can be used for loading and unloading the substrate transfer robot 80, is smaller than the effective width (second width W2) of the upper portion Su of the lower space S described above. Furthermore, the lower space entrance Se of the lower space S has the same effective height H1 as the lower space S.

[0071] like Figure 1As shown, the above substrate processing system 1 is provided with a control unit 2. The control unit 2 processes instructions that can be executed by a computer so that the substrate processing system 1 performs the various processes described in this disclosure. The control unit 2 can be configured to control the various elements of the substrate processing system 1 so that it performs the various processes described herein. In one embodiment, it is also possible that the substrate processing system 1 includes part or all of the control unit 2. The control unit 2 can include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is implemented, for example, by a computer 2a. The processing unit 2a1 can be configured to read a program from the storage unit 2a2, execute the read program, and thus perform various control actions. The program can be stored in the storage unit 2a2 in advance, or it can be obtained via a medium when necessary. The obtained program is stored in the storage unit 2a2, and is read out and executed from the storage unit 2a2 by the processing unit 2a1. The medium can be various storage media that can be read by the computer 2a, or it can be a communication line connected to the communication interface 2a3. The processing unit 2a1 can be a CPU (Central Processing Unit). The storage unit 2a2 can include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 can communicate with the substrate processing system 1 via a communication line such as a LAN (Local Area Network). Furthermore, the storage medium can be either a temporary storage medium or a non-temporary storage medium.

[0072] Next, a method of transporting the substrate transfer robot 80 to the vacuum transfer module 50 in the substrate processing system 1 configured as described above will be described in detail with reference to the drawings.

[0073] When the substrate conveying robot 80 is conveyed to the vacuum conveying module 50, first, Figure 7 As shown in FIG. 4 , the substrate transport robot 80 to be transported is placed on the carriage 400. Figure 7As shown, the trolley 400 includes a support plate 410 that supports the substrate transfer robot 80 to be transferred on its upper surface; a vertical drive unit 420 that moves the substrate transfer robot 80 on the support plate 410 in the vertical (longitudinal) direction; a horizontal drive unit 430 that moves the substrate transfer robot 80 on the support plate 410 in the horizontal (lateral) direction; and an alignment mechanism 440. The trolley 400 may also include a handle 450 for an operator to manipulate the trolley 400, casters 460 for horizontal movement of the trolley 400, and a mechanism 470 to prevent the trolley 400 from tipping over. Furthermore, the trolley 400 has a fourth width W4 in the width direction perpendicular to the direction of travel that is smaller than the effective width (third width W3) of the lower space inlet Se. Therefore, the trolley 400 can enter the lower space S of the vacuum transfer module 50 through the lower space inlet Se. The specific functions of each component of the trolley 400 will be described later.

[0074] After the substrate transport robot 80 is placed on the carriage 400, Figure 8 As shown, the trolley 400 is moved toward the lower space S of the vacuum transfer module 50, more specifically, toward the lower portion of the opening 53. The trolley 400 can be moved, for example, by an operator holding the handle 450, or by remote control. At this time, because the trolley 400 has a fourth width W4 that is smaller than the third width W3 of the lower space entrance Se, the trolley 400 can properly enter the lower space S of the vacuum transfer module 50 (entry step).

[0075] After the substrate transport robot 80 is moved downwards to the opening 53, Figure 9 As shown, the substrate transport robot 80 on the support plate 410 is moved in the vertical direction (longitudinal direction) using the vertical drive unit 420. The structure and operation of the vertical drive unit 420 are not particularly limited. In the example shown in the figure, the vertical drive unit 420 includes a lifting handle 421, a vertical axis rail 422, and a vertical movement stopper 423 (see FIG. Figure 7 Then, the vertical movement stopper 423 is released to allow the support plate 410 to be raised and lowered. Thereafter, the lifting handle 421 is operated to integrally raise the support plate 410 and the substrate transport robot 80 along the vertical axis rail 422 (first raising step).

[0076] In addition, the amount of the substrate conveying robot 80 to be raised in the first raising step is not particularly limited. However, in one example, it is preferable that the substrate conveying robot 80 (support plate 410) be raised to a position where the substrate conveying robot 80 (support plate 410) can avoid the substrate conveying robot 80 in the first raising step. Figure 3The height of the non-effective space shown by the shaded portion. Therefore, the first rising step can be said to be a step for preventing interference between the electrical installation circuits of the first side module 61, the electrical installation circuits of the second side module 62, etc., which are arranged in the lower part S1 of the lower space S, and the substrate conveying robot 80 (support plate 410). In one example, in the first rising step, the support plate 410 is raised from the first plate height H1 to the second plate height H2 at the first horizontal position L1 by the vertical drive unit 420. Therefore, in the case where the electrical installation circuits of the first side module 61, the electrical installation circuits of the second side module 62, etc. are not arranged in the lower space S (not formed Figure 3 In the case of non-effective space), the first rising step can also be omitted.

[0077] When the support plate 410 rises to the second plate height H2, then, as shown in FIG. Figure 10 As shown, the support plate 410 is moved horizontally from the first horizontal position L1 to the second horizontal position L2 directly below the opening 53 at the second plate height H2 using the horizontal drive unit 430. The structure and operation of the horizontal drive unit 430 are not particularly limited. In the example shown in the figure, the horizontal drive unit 430 includes a horizontal axis rail 431 and a horizontal movement handle (not shown). Thus, for example, by operating the horizontal movement handle, the substrate conveying robot 80, which has been raised to the second plate height, is moved integrally with the support plate 410 along the horizontal axis rail 431 (horizontal movement step). Alternatively, the horizontal movement of the substrate conveying robot 80 (support plate 410) may be performed manually instead of operating the horizontal movement handle.

[0078] As described above, the opening 53 of the vacuum transfer module 50, into which the substrate transfer robot 80 engages, is formed at a position offset from the center of the housing 51 in the X-axis direction (width direction). More specifically, it is formed at a position where the distance D1 from the first side surface 50a of the housing 51 is greater than the distance D2 from the second side surface 50b. Furthermore, as described above, the electrical installation unit of the substrate processing module 60 may be disposed in the lower space S of the vacuum transfer module 50.

[0079] As described above, the presently disclosed technique is configured so that the support plate 410 of the carriage 400 that transports the substrate transfer robot 80 is freely movable horizontally by the horizontal drive unit 430. Consequently, even if the carriage 400 cannot be moved directly below the opening 53, the support plate 410 can be offset horizontally to allow the substrate transfer robot 80 to be moved directly below the opening 53. Furthermore, even if the electrical installation unit of the substrate processing module 60 is located in the lower space S of the vacuum transfer module 50, by moving the substrate transfer robot 80 horizontally after the substrate transfer robot 80 (support plate 410) has been raised to the second plate height H2 in the first raising step described above, interference between the electrical installation unit of the substrate processing module 60 and the substrate transfer robot 80 (support plate 410) can be suppressed.

[0080] When the support plate 410 moves to the second horizontal position L2, then, as shown in FIG. Figure 11 As shown, the support plate 410 is raised from the second plate height H2 to the third plate height H3 at the second horizontal position L2 by the vertical driving unit 420 (second raising step). The driving method of the vertical driving unit 420 is the same as that of the first raising step described above.

[0081] In the second raising step, in one example, the support plate 410 is raised from the second plate height H2 to a position where the support plate 410 can be raised by using the guide pins 54 (see FIG. Figure 11 ) is positioned at a third plate height H3. In the illustrated example, only one guide pin 54 is disposed at the bottom of the housing 51. However, the number of guide pins 54 disposed on the housing 51 can be arbitrarily determined, and is preferably two or more.

[0082] After the support plate 410 is raised to the third plate height H3, Figure 12 As shown, the alignment mechanism 440 is used to perform detailed horizontal alignment of the substrate transfer robot 80 supported by the support plate 410. The structure of the alignment mechanism 440 is not particularly limited, but in one example, the alignment mechanism 440 includes a plunger pin 441. By releasing the plunger pin 441, the alignment mechanism 440 can perform detailed horizontal alignment of the substrate transfer robot 80 on the support plate 410, thereby moving the substrate transfer robot 80 to a position where it can be installed in the opening 53.

[0083] In addition, if Figure 13As shown in the figure as an example, the detailed alignment of the substrate conveying robot 80 relative to the opening 53 can be achieved as follows: while aligning the guide pin 54 provided at the bottom of the shell 51 with the through hole 81a for alignment formed on the base 81 supporting the substrate conveying robot 80, the vertical driving unit 420 is used to move the substrate conveying robot 80 (support plate 410) to rise so that the guide pin 54 passes through the through hole 81a.

[0084] After the guide pins 54 are inserted through the through-holes 81a, the substrate transfer robot 80 (base 81) is then secured to the housing 51 of the vacuum transfer module 50, completing the loading operation of the substrate transfer robot 80 into the vacuum transfer module 50. Thus, the transfer robot 80, supported by the support plate 410, is mounted in the opening 53 of the vacuum transfer module 50 when the support plate 410 is at the second horizontal position L2 and the third plate height H3.

[0085] In addition, when the substrate transfer robot 80 is unloaded from the vacuum transfer module 50, the Figures 8 to 13 The above-mentioned loading operation is the reverse operation.

[0086] Therefore, the support plate 410 is lowered from the third plate height H3 to the second plate height H2 at the second horizontal position L2 by the vertical drive unit 420. As a result, the substrate transfer robot 80, supported by the support plate 410, is removed from the opening 53 of the vacuum transfer module 50 to the lower space S. Subsequently, the support plate 410 is moved from the second horizontal position L2 to the first horizontal position L1 at the second plate height H2 by the horizontal drive unit 430. Finally, the support plate 410 is lowered from the second plate height H2 to the first plate height H1 at the first horizontal position L1 by the vertical drive unit 420.

[0087] After the support plate 410 descends to the first plate height H1, the trolley 400 is unloaded from the lower space S of the vacuum transfer module 50 through the lower space inlet Se. Thus, the transfer robot 80 supported by the support plate 410 is unloaded from the lower space S of the vacuum transfer module 50 when the support plate 410 is at the first horizontal position L1 and the first plate height H1.

[0088] As described above, in the substrate processing system 1 according to the disclosed technology, by forming the lower space S below the vacuum transfer module 50 and forming the opening 53 for the substrate transfer robot 80 to engage in the bottom surface 50c of the housing 51, the vacuum transfer module 50 can be accessed from below when performing maintenance on the vacuum transfer module 50 and the substrate transfer robot 80, or when carrying the substrate transfer robot 80 in and out. This makes maintenance of the heavier substrate transfer robot 80 easier than before.

[0089] Furthermore, in the technology disclosed herein, when the substrate transfer robot 80 is moved in and out of the vacuum transfer module 50, a carriage 400 is used that enables the substrate transfer robot 80 to be raised and lowered and moved horizontally on the support plate 410. This facilitates the movement of the substrate transfer robot 80 in and out of the vacuum transfer module 50, and even when the electrical installation unit of the substrate processing module 60 is disposed in the lower space S of the vacuum transfer module 50, the substrate transfer robot 80 can be moved in and out appropriately.

[0090] Furthermore, when the carriage 400 using the disclosed technology is moved in and out of the substrate transfer robot 80, a mechanism 470 mounted on the carriage 400 is used to improve the stability of the support plate 410 during the upward and horizontal movement. In one example, the mechanism 470 includes a first slider disposed on the side surface of the carriage 400 on the first side module 61 side, and a second slider disposed on the side surface of the carriage 400 on the second side module 62 side.

[0091] Specifically, before the carriage 400 carrying the substrate transport robot 80 enters the lower space S (entry step), Figure 14 As shown, a jig 55 is attached to the leg of the frame F of the housing 51 supporting the vacuum transfer module 50. The jig 55 includes a first jig 55a, which is fixed to the leg of the frame F on the first side module 61 side, and a second jig 55b, which is fixed to the leg of the frame F on the second side module 62 side, in the lower space S. Furthermore, the first jig 55a and the second jig 55b each include a rail 56 and a bracket 57. The rail 56 extends in the Y-axis direction (the longitudinal direction of the vacuum transfer module 50) in the lower space S and is fixed to the leg of the frame F. The bracket 57 is a member arranged at multiple locations on the rail 56 at intervals in the longitudinal direction. It engages with the slider 471 of the mechanism 470 described later to enhance the stability of the carriage 400.

[0092] In addition, if Figure 14 As shown, the distance (fifth width W5) between the first jig 55a and the second jig 55b in the X-axis direction (the width direction of the vacuum transfer module 50) is set to be equal to or slightly smaller than the fourth width W4 of the carriage 400. Thus, the carriage 400 can pass between the first jig 55a and the second jig 55b and move in the Y-axis direction within the lower space S.

[0093] In the disclosed technology, bracket 57 is sometimes included in rail 56 and referred to as the "rail" of jig 55. In other words, slider 471 of mechanism 470 engages with the rail of jig 55. Thus, mechanism 470 includes at least one first slider, which engages with the first rail on the first side module 61 side and is capable of sliding along the first rail; and at least one second slider, which engages with the second rail on the second side module 62 side and is capable of sliding along the second rail.

[0094] After the fixture 55 is installed on the frame F, the trolley 400 is then moved into the lower space S (entry step). Figure 15 As shown, the mechanism 470 of the cart 400 engages with a recess formed in a bracket 57 of a rail 56 fixed to the frame F. As described above, multiple brackets 57 are provided along the longitudinal direction of the rail 56, thereby meshing the mechanism 470 of the cart 400 with the jig 55 of the vacuum transfer module 50. Consequently, the cart 400 is supported by the frame F from both sides in the width direction, improving stability even when some stress is applied to the cart 400.

[0095] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and the spirit thereof.

[0096] Description of Reference Numerals

[0097] 1. Substrate processing system; 50. Vacuum conveying module; 53. Opening; 56. Track; 57. Bracket; 60. Substrate processing module; 61. First side module; 62. Second side module; 80. Substrate conveying robot; S. Lower space; W. Substrate.

Claims

1. A substrate processing system, wherein: The substrate processing system has: a vacuum transfer module extending along a length direction of the substrate processing system, the vacuum transfer module having a first side surface, a second side surface opposite to the first side surface, and a bottom surface, the bottom surface having an opening, wherein a distance from the opening to the first side surface is greater than a distance from the opening to the second side surface; a plurality of substrate processing modules, comprising a plurality of first substrate processing modules connected to the first side surface of the vacuum transport module and a plurality of second substrate processing modules connected to the second side surface of the vacuum transport module; a lower space defined below the vacuum transfer module and between the plurality of first substrate processing modules and the plurality of second substrate processing modules; a conveying robot detachably mounted on the vacuum conveying module in a manner blocking the opening, configured to convey the substrate within the vacuum conveying module, the conveying robot being capable of taking the substrate out of the opening into the lower space; a first rail installed on the plurality of first substrate processing modules in the lower space so as to extend along the longitudinal direction; as well as A second rail is mounted on the plurality of second substrate processing modules in the lower space so as to extend along the longitudinal direction.

2. The substrate processing system according to claim 1, wherein: The lower space has a lower portion and an upper portion, The lower portion has a first width in a width direction perpendicular to the longitudinal direction of the vacuum transfer module. The upper portion has a second width in the width direction that is larger than the first width.

3. The substrate processing system according to claim 2, wherein: The substrate processing system has: a load lock module connected to a front surface of the vacuum transfer module; and One or more other substrate processing modules are connected to the rear surface of the vacuum transfer module and define a lower space inlet communicating with the lower space.

4. The substrate processing system according to claim 3, wherein: The lower space entrance has a third width in the width direction that is smaller than the second width.

5. The substrate processing system according to claim 4, wherein: The lower space inlet has the same height as that of the lower space.

6. The substrate processing system according to claim 1, wherein: The substrate processing system includes a plurality of electrical installation units including a plurality of first electrical installation units corresponding to the plurality of first substrate processing modules, and a plurality of second electrical installation units corresponding to the plurality of second substrate processing modules, respectively.

7. The substrate processing system according to claim 6, wherein: The substrate processing system includes a plurality of gas boxes including a plurality of first gas boxes corresponding to the plurality of first substrate processing modules, and a plurality of second gas boxes corresponding to the plurality of second substrate processing modules, respectively.

8. The substrate processing system according to claim 7, wherein: The first electrical installation unit is arranged below the corresponding first substrate processing module. The second electrical installation unit is disposed below the corresponding second substrate processing module.

9. The substrate processing system according to claim 8, wherein: The first gas box is arranged above the corresponding first substrate processing module. The second gas box is disposed above the corresponding second substrate processing module.

10. The substrate processing system according to claim 1, wherein: The substrate processing system includes an upper space defined above the vacuum transfer module and between the plurality of first substrate processing modules and the plurality of second substrate processing modules.

11. The substrate processing system according to claim 10, wherein: A height of an upper surface of the vacuum conveying module is lower than a height of an upper surface of the substrate processing module.

12. A trolley for transporting the transfer robot relative to the substrate processing system according to any one of claims 1 to 11, wherein: The trolley has: at least one first sliding member capable of engaging with the first rail and sliding along the first rail; at least one second sliding member capable of engaging with the second track and sliding along the second track; a support plate configured to support the transport robot; a vertical driving unit configured to raise the support plate from a first plate height to a second plate height at the first horizontal position; and a horizontal driving unit configured to move the support plate from the first horizontal position to a second horizontal position at the second plate height; The vertical driving unit is configured to raise the support plate from the second plate height to the third plate height at the second horizontal position. The transport robot supported by the support plate is installed in the opening of the vacuum transport module when the support plate is at the second horizontal position and the third plate height.

13. The trolley according to claim 12, wherein: The vertical driving unit is configured to lower the support plate from the third plate height to the second plate height at the second horizontal position, thereby taking the transport robot supported by the support plate out of the vacuum transport module into the lower space. The horizontal driving unit is configured to move the support plate from the second horizontal position to the first horizontal position at the second plate height. The vertical driving unit is configured to lower the support plate from the second plate height to the first plate height at the first horizontal position.

14. The trolley according to claim 12, wherein: The carriage has a fourth width in the width direction of the vacuum transfer module that is smaller than the entrance of the lower space.

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