Circuit tin plating equipment for computer production

Abstract

The invention discloses circuit tinning equipment for computer production, and particularly relates to the technical field of computer production, the circuit tinning equipment comprises a tinning mechanism, the tinning mechanism comprises a tinning bath, tinning liquid is preloaded in the tinning bath, a bearing mechanism is arranged on the tinning bath, the bearing mechanism comprises a sealing cover, and the tinning bath is in sealing connection with the sealing cover. By arranging the sealing cover with a negative-pressure air exhaust function, a negative-pressure environment can be created in the closed space of the tinning bath, so that the force of bubbles in the blind holes for resisting the surface tension of tinning liquid is improved, the bubbles are discharged more easily, the tinning effect of the inner walls of the blind holes is effectively improved, and the tinning quality of the inner walls of the blind holes is improved. And the production yield of the PCB is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of computer production, and more particularly to circuit tinning equipment for computer production. Background Art

[0002] In the field of computer production, printed circuit boards (PCB boards for short) are key components that carry the important function of connecting and supporting various electronic components. Their quality and performance directly affect the stability and reliability of the computer.

[0003] Copper-clad laminate, the foundation material of PCBs, is covered with a layer of copper foil. During processing, the designed circuit pattern is transferred to the laminate through processes such as exposure and development, revealing the copper foil that needs to be retained. Etching then occurs, using a chemical etchant to remove the unprotected copper foil, thus forming a precise circuit path. Drilling then occurs to create holes for mounting electronic components. Electroplating then thickens the copper layer and copper plates the inside of the holes to enhance the circuit's conductivity and mechanical strength. Finally, the PCB surface is typically tinned to improve solderability between the PCB and the electronic components.

[0004] Tin plating on PCBs works based on electrochemical principles. During the tin plating process, the PCB acts as the cathode and is immersed in a plating solution containing tin ions, while the tin plate acts as the anode. When powered on, the electric field causes the tin plate at the anode to oxidize, releasing tin ions into the plating solution. Meanwhile, a reduction reaction occurs on the PCB surface at the cathode, where the tin ions in the plating solution gain electrons and are deposited on the copper foil of the PCB, forming a uniform tin layer. This tin layer effectively prevents oxidation of the copper foil, improves solderability, and ensures reliable and stable soldering between electronic components and the PCB.

[0005] In traditional electroplating processes, PCBs are typically manually mounted on the grippers of a gantry. The gantry then carries the vertically hoisted copper-clad board and sequentially immerses it in the pickling, copper plating, etching, and finally tinning baths. However, PCBs often feature numerous holes, including through-holes, blind vias, and buried vias, whose axes are perpendicular to the PCB surface. When the PCB is vertically immersed in the tinning bath, these holes are unable to expel gases in a timely manner due to the surface tension of the liquid. This is especially true for blind vias with large aspect ratios. Due to their small inner diameters and relatively deep depths, even with the addition of surfactants, it is difficult to completely fill the blind vias. This can lead to residual gas on the bottom wall of the blind vias, resulting in uneven tinning on the copper surface within the blind vias and even partial plating leakage, seriously impacting the quality of the finished PCB. Summary of the Invention

[0006] The present invention provides a circuit tinning device for computer production, aiming to solve the problem that, during tin plating of blind holes with a relatively large aspect ratio on existing PCBs, the tin plating liquid cannot completely fill the blind holes and fully contact the inner walls of the blind holes due to the surface tension of the liquid, resulting in uneven tin plating on the copper surface of the blind holes, or even partial plating leakage, which seriously affects the quality of the finished PCB board.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solution: a circuit tinning device for computer production, comprising: a tinning mechanism, the tinning mechanism comprising a tinning tank, the tinning tank being pre-filled with tinning liquid, and a supporting mechanism being provided on the tinning tank, the supporting mechanism comprising a sealing cover, the tinning tank being sealed to the sealing cover;

[0008] The device also includes a workpiece to be plated, which is immersed in the tin plating solution. A conductive component is provided on the sealing cover, the conductive component includes a conductive rod, the conductive rod is insulated and connected to the sealing cover, and a suspension component is provided on the conductive rod. The suspension component includes a conductive clip, the conductive clip is rotatably connected to the conductive rod, and the conductive clip and the conductive rod are electrically connected. The workpiece to be plated is fixedly arranged at the clamping end of the conductive clip;

[0009] The sealing cover is provided with an exhaust pipe, the exhaust pipe is externally connected to an exhaust device, and the input end of the exhaust pipe extends into the tinning tank.

[0010] In a preferred embodiment, a guide rail is provided in the sealing cover, a slide rod is slidably provided in the guide rail, an adjustment seat is provided on the slide rod, the adjustment seat is adapted to the workpiece to be plated, a pull rope is provided on the slide rod, and a winding assembly is provided on the sealing cover, and the end of the pull rope away from the slide rod is wound around the output end of the winding assembly.

[0011] In a preferred embodiment, a limit frame is provided on the slide rod, a spring rod is provided in the tinning tank, and the limit frame is slidably connected to the spring rod.

[0012] In a preferred embodiment, a guide wheel is provided on the inner wall of the tinning tank, and the pull rope is adapted to the guide wheel.

[0013] In a preferred embodiment, a limiting clamp is insulated on the conductive rod, a limiting assembly is provided on the sealing cover, the limiting assembly includes a driving member fixedly provided on the sealing cover, a limiting rod is provided at the output end of the driving member, and the limiting rod is adapted to the limiting clamp.

[0014] In a preferred embodiment, a bracket is provided outside the tinning tank, a conductive seat is provided on the bracket, a conductive block is electrically connected to the conductive rod, and the conductive block is adapted to the conductive seat.

[0015] In a preferred embodiment, a hanging bracket is provided on the top of the sealing cover, and a gantry crane is provided above the sealing cover, and the execution end of the gantry crane is adapted to the hanging bracket.

[0016] In a preferred embodiment, an insulating sleeve is provided on the conductive rod, and the insulating sleeve is fixedly connected to the sealing cover.

[0017] In a preferred embodiment, an ultrasonic vibration plate is provided at the bottom of the tin plating tank, and the output end of the ultrasonic vibration plate faces the workpiece to be plated.

[0018] In a preferred embodiment, the workpiece to be plated includes a PCB board, a blind hole is provided on the PCB board, and bubbles exist in the blind hole.

[0019] The beneficial effects of the present invention are:

[0020] The present invention provides a sealing cover with a negative pressure exhaust function, thereby creating a negative pressure environment in the enclosed space of the tin plating tank, thereby increasing the force of bubbles in the blind hole against the surface tension of the tin plating liquid, making it easier for bubbles to be discharged, thereby effectively improving the tin plating effect of the inner wall of the blind hole and ensuring the production yield of PCB boards;

[0021] The present invention provides a structure for adjusting the angle of the workpiece to be plated, thereby being able to conveniently adjust the angle of the PCB board without damaging the workpiece to be plated, so that the opening of the blind hole is rotated upward, thereby further reducing the obstruction of the inner wall of the blind hole itself to the bubbles, thereby significantly improving the bubble discharge efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional schematic diagram of the present invention.

[0023] Figure 2 It is a structural schematic diagram of the tin plating tank and the sealing cover part of the present invention.

[0024] Figure 3 It is a structural schematic diagram of the tin plating tank part of the present invention.

[0025] Figure 4 It is a schematic diagram of the top structure of the tin plating tank part of the present invention.

[0026] Figure 5 It is a bottom view structural diagram of the sealing cover part of the present invention.

[0027] Figure 6 It is a schematic cross-sectional structural diagram of the PCB board of the present invention in a vertical state.

[0028] Figure 7 It is a schematic cross-sectional structural diagram of the PCB board of the present invention when it is in a tilted state.

[0029] Figure 8 The figure is a schematic diagram of the angle adjustment process of the PCB board of the present invention.

[0030] Figure 9 It is a schematic structural diagram of the conductive component and the suspension component of the present invention.

[0031] Figure 10 It is a front view structural diagram of the conductive component and the suspension component of the present invention.

[0032] Figure 11 It is a structural schematic diagram of the limiting component part of the present invention.

[0033] Figure 12 It is a schematic diagram of the process of discharging bubbles in a blind hole of the present invention.

[0034] The accompanying drawings are marked as follows: 1. Tinning mechanism; 11. Tinning tank; 12. Ultrasonic vibration plate; 13. Guide rail; 14. Slide rod; 15. Adjustment seat; 16. Limit frame; 17. Spring rod; 18. Pull rope; 19. Guide wheel; 110. Rewinding assembly; 2. Carrying mechanism; 21. Sealing cover; 22. Hanging rack; 23. Conductive assembly; 231. Conductive rod; 232. Conductive block; 233. Insulating sleeve; 24. Suspension assembly; 241. Limiting clamp; 242. Conductive clamp; 25. Limiting assembly; 251. Driving part; 252. Limiting rod; 26. Exhaust pipe; 3. Gantry crane; 4. Bracket; 5. Workpiece to be plated; 51. PCB board; 52. Blind hole; 53. Bubble; 6. Conductive seat; 7. Tinning solution. DETAILED DESCRIPTION

[0035] The present application is described in further detail below in conjunction with the accompanying drawings. It is necessary to point out that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technicians in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0036] Refer to the instruction manual Figures 1 to 12 In the traditional electrotinning process, the PCB board 51 of the present invention is usually manually installed on the clamping claws of the gantry by the staff. Then the PCB board 51 is lifted by the gantry in a vertical posture and immersed in the tin plating liquid 7 in the tin plating tank 11. At this time, various holes on the PCB board 51 are immersed in the tin plating liquid 7 in a state that is kept horizontal with the liquid level of the tin plating liquid 7.

[0037] Example 1

[0038] Refer to the instruction manual Figures 1 to 12This embodiment provides a circuit tinning apparatus for computer production to address the problem in existing electrotinning processes for PCB boards 51: when the PCB board 51 is immersed in a tinning solution 7, gas in the pores of the PCB board 51 is difficult to completely discharge due to the surface tension of the tinning solution 7. The apparatus comprises a tinning mechanism 1, the tinning mechanism 1 including a tinning tank 11 pre-filled with the tinning solution 7, and a supporting mechanism 2 disposed on the tinning tank 11. The supporting mechanism 2 includes a sealing cover 21, and the tinning tank 11 and the sealing cover 21 are sealed together.

[0039] It should be noted that a soluble tin plate or tin block (not shown in the accompanying drawings) serving as an anode is also provided on the tin plating tank 11, and the anode is connected to the positive pole of the power supply, so that the PCB board 51 serving as a cathode and connected to the negative pole of the power supply is tin-plated. The above content is a mature technology well known to people in this field and will not be repeated in this embodiment.

[0040] The device further includes a workpiece 5 to be plated, which is immersed in the tin plating solution 7. A conductive component 23 is provided on the sealing cover 21. The conductive component 23 includes a conductive rod 231. The conductive rod 231 is insulated and connected to the sealing cover 21. A suspension component 24 is provided on the conductive rod 231. The suspension component 24 includes a conductive clip 242. The conductive clip 242 is rotatably connected to the conductive rod 231, and the conductive clip 242 and the conductive rod 231 are electrically connected. The workpiece 5 to be plated is fixedly provided at the clamping end of the conductive clip 242.

[0041] It should be noted that the conductive rod 231 is made of pure copper to ensure good conductivity, the conductive clip 242 is a spring clamp, and the conductive clip 242 is electrically connected to the conductive rod 231;

[0042] An exhaust pipe 26 is provided on the sealing cover 21 . The exhaust pipe 26 is externally connected to an exhaust device, and an input end of the exhaust pipe 26 extends into the tinning tank 11 .

[0043] It should be noted that the air extraction device is an air extraction pump, and a sealing gasket (not shown in the drawings) is provided at the position where the inner side of the sealing cover 21 contacts the tin plating tank 11 .

[0044] In this embodiment, the implementation scenario is specifically as follows: the sealing cover 21 with the workpiece 5 to be plated suspended thereon is dropped vertically onto the tin plating tank 11. The weight of the sealing cover 21 and the sealing gasket can provide good sealing conditions for the tin plating tank 11. At this time, the workpiece 5 to be plated has been completely immersed in the tin plating solution 7, and the equipment has been powered on as a whole. Then, the vacuum pump connected to the vacuum pipe 26 is started to extract the gas in the enclosed space enclosed by the sealing cover 21 and the tin plating tank 11, thereby creating a negative pressure environment in the sealing cover 21, and then the air pressure difference can be used to drive the bubbles 53 in the blind hole 52 to be discharged. At this time, the bubbles 53 in the blind hole 52 are easily "pulled out" due to the pressure difference, and the tin plating solution 7 is more easily pressed into the blind hole 52 under the external atmospheric pressure or additional pressure.

[0045] This is similar to drinking from a straw: after the air inside the straw is sucked out, the drink rises under the influence of atmospheric pressure. Pumping air here is equivalent to actively reducing the air pressure outside the "straw," thereby accelerating the filling of the liquid.

[0046] Furthermore, the negative pressure environment can effectively weaken the resistance of the capillary effect. The essence of the capillary effect causing gas retention is that the surface tension of the liquid causes the tin plating liquid 7 to form a "liquid film" at the opening position of the PCB board 51, hindering the discharge of internal air.

[0047] When the air is pumped out, the negative pressure will pull the air in the hole outward, counteracting the "air locking" effect of the capillary effect. When the negative pressure is large enough, the bubbles 53 can break through the constraints of surface tension and be forced out.

[0048] Example 2

[0049] Based on Example 1, refer to the attached Figures 1 to 12 This embodiment proposes a structure capable of adjusting the angle of the workpiece 5 to be plated. This solves the problem that when there are some blind holes with a relatively large aspect ratio on the workpiece 5 to be plated, the bubbles 53, during the discharge process, not only have to overcome the resistance to the gas in the holes caused by the surface tension of the tin plating solution 7, but also have to overcome the resistance to the bubbles 53 caused by the inner wall of the blind hole 52 due to its long path. That is, during the discharge process, the bubbles 53 have two tendencies to move outward along the axial direction of the blind hole 52 and to float upward.

[0050] A guide rail 13 is provided in the tin plating tank 11, and a slide rod 14 is slidably provided in the guide rail 13. An adjustment seat 15 is provided on the slide rod 14, and the adjustment seat 15 is adapted to the workpiece 5 to be plated. A pull rope 18 is provided on the slide rod 14, and a winding assembly 110 is provided on the sealing cover 21. The end of the pull rope 18 away from the slide rod 14 is wound around the output end of the winding assembly 110.

[0051] It should be noted that the specifications of the guide rail 13 can be adjusted according to actual conditions. The top of the adjustment seat 15 is set to a V-shaped opening, and the outer surface of the adjustment seat 15 is chamfered to avoid damaging the workpiece 5 to be plated. There is a rectangular groove below the opening of the adjustment seat 15, and the width of the rectangular groove is adapted to the thickness of the workpiece 5 to be plated, and the area where the workpiece 5 to be plated contacts the adjustment seat 15 is a non-functional area. Even if the workpiece 5 to be plated produces a certain amount of wear due to friction with the adjustment seat 15, it will not affect the quality of the finished product of the workpiece 5 to be plated. The pull rope 18 is insulated, for example, it is covered with insulating materials such as rubber. The winding assembly 110 is a dual-axis motor, and a winding wheel is provided at its output end. One end of the pull rope 18 is fixed on the winding wheel.

[0052] A limit frame 16 is provided on the slide bar 14 , a spring rod 17 is provided in the tinning tank 11 , and the limit frame 16 is slidably connected to the spring rod 17 .

[0053] It should be noted that in the initial state, that is, when the reeling assembly 110 applies a reeling force to the pull rope 18, the limit frame 16 will be pushed to the side away from the reeling assembly 110 by the spring on the spring rod 17. Similarly, the adjustment seat 15 will also move to the corresponding position.

[0054] A guide wheel 19 is provided on the inner wall of the tinning tank 11 , and the pull rope 18 is adapted to the guide wheel 19 .

[0055] It should be noted that the guiding function of the guide wheel 19 can prevent the pull rope 18 from interfering with the workpiece 5 to be plated.

[0056] A limit clamp 241 is insulated and provided on the conductive rod 231 , and a limit assembly 25 is provided on the sealing cover 21 . The limit assembly 25 includes a driving member 251 fixedly provided on the sealing cover 21 , and a limit rod 252 is provided at the output end of the driving member 251 , and the limit rod 252 is adapted to the limit clamp 241 .

[0057] It should be noted that the limit clamp 241 is symmetrically arranged to ensure the suspension stability of the workpiece 5 to be plated, so that the workpiece 5 to be plated can remain in a vertical state and fall into the tin plating liquid 7 without external force; the driving member 251 is a cylinder, which is controlled to engage with the limit clamp 241, so that the limit clamp 241 can be fixed, and then the stability of the conductive clamp 242 can be maintained when the staff installs the workpiece 5 to be plated on the conductive clamp 242, so as to facilitate operation.

[0058] In this embodiment, the implementation scenario is specifically as follows: during the descending process of the sealing cover 21, the workpiece 5 to be plated will fall in a vertical state. At the same time, the adjustment seat 15 will be moved to the corresponding position in advance to wait for docking with the workpiece 5 to be plated. When the workpiece 5 to be plated is docked with the adjustment seat 15, the position of the adjustment seat 15 on the guide rail 13 is controlled by the reeling assembly 110, so that the workpiece 5 to be plated can be slowly rotated around the conductive rod 231 as the axis, so that the opening direction of the blind hole 52 gradually rotates upward, thereby further reducing the obstruction of the inner wall of the blind hole 52 to the air bubble 53, and then using the buoyancy of the air bubble 53 itself to quickly discharge from the blind hole 52, so as to further reduce the probability of residual air bubbles 53 in the blind hole 52; at the same time, the workpiece 5 to be plated can also be rotated in two directions to adapt to the processing of the double-sided PCB board 51, and when processing the PCB board 51 with blind holes 52 on both sides, after rotating to the preset angle, it is maintained for a period of time and then rotated in the opposite direction to ensure that the blind holes 52 on both sides have a good tinning effect.

[0059] It should also be noted that there are methods in the prior art for adjusting the angle of the workpiece 5 to be plated by rotating the conductive clamp 242 or providing an inclined jet pipe at the bottom of the tin plating tank 11. However, in order to prevent the conductive clamp 242 from damaging the functional area on the workpiece 5 to be plated and to avoid waste of materials, the non-functional area on the workpiece 5 to be plated is usually designed to be very narrow. Therefore, the area where the conductive clamp 242 is in contact and fixed with the workpiece 5 to be plated is generally very close to the edge of the workpiece 5 to be plated, and the contact area is also very small. In actual operation, the two methods of adjusting the angle of the workpiece 5 to be plated are used as the fulcrum for the rotation of the workpiece 5 to be plated based on the position of contact with the conductive clamp 242. Therefore, it is easy to cause damage to the workpiece 5 to be plated. Moreover, since the workpiece 5 to be plated is in the tin plating liquid 7 during electrotin plating, the workpiece 5 to be plated is rotated without external force restriction, and the disordered flow of the liquid makes it even easier to cause damage to the workpiece 5 to be plated.

[0060] The adjustment seat 15 in this embodiment is docked with the workpiece 5 to be plated, and causes the workpiece 5 to be plated to slowly rotate around the conductive rod 231, so that the workpiece 5 to be plated can be uniformly stressed during rotation, thereby effectively avoiding the occurrence of the above-mentioned situation, so that the discharge effect of the bubbles 53 in the blind hole 52 can be significantly improved while ensuring the yield rate of the workpiece 5 to be plated.

[0061] Example 3

[0062] Based on Example 2, refer to the attached Figures 1 to 12 This embodiment proposes a device capable of performing large-scale electrotin plating on the workpiece 5 to be plated, so as to improve the production yield of the existing workpiece 5 to be plated.

[0063] A bracket 4 is provided outside the tinning tank 11 , a conductive seat 6 is provided on the bracket 4 , a conductive block 232 is electrically connected to the conductive rod 231 , and the conductive block 232 is adapted to the conductive seat 6 .

[0064] It should be noted that the conductive block 232 and the conductive seat 6 are both made of pure copper, and the conductive block 232 is connected to the negative pole of the power supply.

[0065] A hanging bracket 22 is provided on the top of the sealing cover 21 , and a gantry crane 3 is provided above the sealing cover 21 . The execution end of the gantry crane 3 is adapted to the hanging bracket 22 .

[0066] It should be noted that the gantry crane 3 is installed on the top of the production workshop, or is fixed by an additional bracket. This is a mature technology well known to those skilled in the art and will not be described in detail in this embodiment.

[0067] An insulating sleeve 233 is sleeved on the conductive rod 231 , and the insulating sleeve 233 is fixedly connected to the sealing cover 21 .

[0068] It should be noted that the insulating sleeve 233 is made of insulating material, such as rubber or other materials. This is a mature technology well known to people in this field and will not be described in detail in this embodiment.

[0069] An ultrasonic vibration plate 12 is provided at the bottom of the tin plating tank 11 , and an output end of the ultrasonic vibration plate 12 faces the workpiece 5 to be plated.

[0070] It should be noted that when the ultrasonic vibration plate 12 is started, the tin plating liquid 7 will vibrate continuously to destroy the bubbles 53 in the blind hole 52, so that the tin plating liquid 7 can be filled into the blind hole 52 more quickly and fully, thereby improving the tin plating effect. At the same time, the ultrasonic wave can also promote the tin ions Sn in the tin plating liquid 7. 2+ Diffusion to the surface of the workpiece 5 to be plated, especially inside the blind hole 52, can reduce the concentration gradient of the ion concentration of the concentration polarization plating solution and improve the uniformity of the coating.

[0071] The workpiece 5 to be plated includes a PCB board 51, a blind hole 52 is provided on the PCB board 51, and there are bubbles 53 in the blind hole 52.

[0072] In this embodiment, the implementation scenario is specifically as follows: by comprehensively creating a negative pressure environment in the sealing cover 21, adjusting the angle of the workpiece 5 to be plated so that the opening of the blind hole 52 rotates upward, and ultrasonic vibration, the tin plating effect of the workpiece 5 to be plated is effectively improved.

[0073] The above-described embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A circuit tinning device for computer production, comprising: A tinning mechanism (1), the tinning mechanism (1) comprising a tinning tank (11), the tinning tank (11) being pre-filled with tinning liquid (7), and a supporting mechanism (2) being provided on the tinning tank (11), the supporting mechanism (2) comprising a sealing cover (21), the tinning tank (11) being sealedly connected to the sealing cover (21); The invention is characterized in that it further comprises a workpiece (5) to be plated, wherein the workpiece (5) to be plated is immersed in the tin plating liquid (7), a conductive component (23) is provided on the sealing cover (21), the conductive component (23) comprises a conductive rod (231), the conductive rod (231) is insulated and connected to the sealing cover (21), a suspension component (24) is provided on the conductive rod (231), the suspension component (24) comprises a conductive clip (242), the conductive clip (242) is rotatably connected to the conductive rod (231), and the conductive clip (242) and the conductive rod (231) are electrically connected, and the workpiece (5) to be plated is fixedly arranged at the clamping end of the conductive clip (242); The sealing cover (21) is provided with an exhaust pipe (26), the exhaust pipe (26) is externally connected to an exhaust device, and the input end of the exhaust pipe (26) extends into the tin plating tank (11).

2. The circuit tinning equipment for computer production according to claim 1, characterized in that: A guide rail (13) is provided in the sealing cover (21), a slide rod (14) is slidably provided in the guide rail (13), an adjustment seat (15) is provided on the slide rod (14), the adjustment seat (15) is adapted to the workpiece (5) to be plated, a pull rope (18) is provided on the slide rod (14), a reeling assembly (110) is provided on the sealing cover (21), and the end of the pull rope (18) away from the slide rod (14) is wound around the output end of the reeling assembly (110).

3. The circuit tinning equipment for computer production according to claim 2, characterized in that: A limit frame (16) is provided on the slide bar (14), a spring rod (17) is provided in the tin plating tank (11), and the limit frame (16) is slidably connected to the spring rod (17).

4. The circuit tinning equipment for computer production according to claim 3, characterized in that: Said tinning tank (11) is provided with a guide wheel (19) on the inner wall thereof, and said pull rope (18) is adapted to the guide wheel (19).

5. The circuit tinning equipment for computer production according to claim 4, characterized in that: A limiting clamp (241) is insulated and provided on the conductive rod (231), a limiting assembly (25) is provided on the sealing cover (21), the limiting assembly (25) comprises a driving member (251) fixedly provided on the sealing cover (21), a limiting rod (252) is provided at the output end of the driving member (251), and the limiting rod (252) is adapted to the limiting clamp (241).

6. The circuit tinning equipment for computer production according to claim 5, characterized in that: A bracket (4) is provided outside the tin plating tank (11), a conductive seat (6) is provided on the bracket (4), a conductive block (232) is electrically connected to the conductive rod (231), and the conductive block (232) is adapted to the conductive seat (6).

7. The circuit tinning equipment for computer production according to claim 6, characterized in that: A hanging bracket (22) is provided on the top of the sealing cover (21), a gantry crane (3) is provided above the sealing cover (21), and an execution end of the gantry crane (3) is adapted to the hanging bracket (22).

8. The circuit tinning equipment for computer production according to claim 7, characterized in that: An insulating sleeve (233) is sleeved on the conductive rod (231), and the insulating sleeve (233) is fixedly connected to the sealing cover (21).

9. The circuit tinning equipment for computer production according to claim 8, characterized in that: An ultrasonic vibration plate (12) is provided at the bottom of the tin plating tank (11), and an output end of the ultrasonic vibration plate (12) faces the workpiece (5) to be plated.

10. The circuit tinning equipment for computer production according to claim 9, characterized in that: The workpiece (5) to be plated comprises a PCB board (51), a blind hole (52) is provided on the PCB board (51), and air bubbles (53) exist in the blind hole (52).

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