A push-down IC chip detection device

Abstract

The application relates to the technical field of chip detection equipment, and provides a down-pressing type IC chip detection device, which comprises a workbench, a support and a chip fixing structure for fixing IC chips are fixedly arranged on the upper surface of the workbench; a connecting plate is arranged on the support; a down-pressing mechanism is fixedly installed on the connecting plate; a probe head downwardly arranged is connected to the down-pressing mechanism; the down-pressing mechanism drives the probe head to move up and down along the vertical direction; and an adjusting mechanism for adjusting the angle of the probe head is arranged between the down-pressing mechanism and the probe head. The down-pressing type IC chip detection device can automatically adjust the placement angle of the probe head to compensate the chip through the adjusting mechanism for adjusting the angle of the probe head before detecting the chip, the detection accuracy is improved, and the probe and the chip are prevented from being damaged.

Description

Technical Field

[0001] This invention relates to the field of chip testing equipment technology, and in particular to a pressure-type IC chip testing device. Background Technology

[0002] IC chips are the core components of modern electronic technology. In essence, they integrate multiple electronic components onto a semiconductor material and form a miniature circuit system through miniaturization technology to realize functions such as signal processing, data storage, and logic operations. Before the chip is used, it needs special testing equipment to achieve precise contact between the chip and the test probe through mechanical pressing to complete the electrical performance test.

[0003] To address this, patent CN106950490A discloses a pressure-type IC chip testing mechanism, comprising two pressure mechanisms and two testing plates; each testing plate is equipped with gold fingers; each pressure mechanism includes a pressure cylinder and a limiting cylinder; the output shaft of the limiting cylinder is fixedly connected to a limiting block; a baffle is fixedly attached to the upper part of the output shaft of the pressure cylinder, and a pressing part is fixedly connected to the lower end; a clamping part is movably arranged between the pressing part and the baffle; a supporting spring is provided between the clamping part and the pressing part; a front extension and a rear extension extend downwards on the front and rear sides of the clamping part, respectively; the pressing part is located between the front extension and the rear extension; a receiving groove is fixedly connected to the bottom end of the front extension and the rear extension, and the receiving groove engages with the feed track groove; a downward-facing baffle is provided on the lower surface of the pressing part, and a through hole corresponding to the baffle is opened on the upper surface of the receiving groove. The beneficial effect of this patent is that IC chip testing is achieved through the cooperation of the limiting cylinder and the pressure cylinder, thereby improving testing efficiency;

[0004] The aforementioned pressure-type IC chip testing mechanism uses a limit cylinder and a pressure cylinder to test IC chips, improving testing efficiency. However, errors may occur during chip manufacturing and packaging processes, such as uneven packaging and wafer cutting deviations. These can lead to unevenness in certain parts of the chip, causing it to tilt during placement. This can cause the probe to deviate during testing, resulting in interruption of the test signal or increased noise. If the tilt angle is too large, the probe may concentrate pressure on the chip edge, causing local short circuits or pin breakage. Summary of the Invention

[0005] The purpose of this invention is to provide a pressure-type IC chip testing device to solve the defect of existing pressure-type IC chip testing devices that are inconvenient to automatically level.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a pressure-type IC chip testing device, including a worktable, on the upper surface of the worktable a bracket and a chip fixing structure for fixing IC chips are fixedly arranged; a connecting plate is arranged on the bracket, a pressure mechanism is fixedly installed on the connecting plate, a downwardly positioned probe head is connected to the pressure mechanism, the pressure mechanism drives the probe head to move up and down in the vertical direction, and an adjustment mechanism for adjusting the angle of the probe head is arranged between the pressure mechanism and the probe head.

[0007] Furthermore, the pressing mechanism includes a pressing cylinder fixed to the top of the connecting plate. The output shaft of the pressing cylinder is arranged downward and a mounting base is fixedly connected to the lower end of the output shaft. A first sliding groove is provided vertically on the side surface of the connecting plate facing the mounting base. A slider is fixedly installed on the side of the mounting base facing the connecting plate and the slider is located in the first sliding groove. A connecting block is fixedly installed on the mounting base, and the adjusting mechanism is located at the lower end of the connecting block.

[0008] Furthermore, the adjustment mechanism includes a horizontally arranged fixed plate fixed to the lower end of the connecting block, a movable plate arranged below the fixed plate, a probe head fixed to the lower surface of the movable plate, and a connecting rod. The lower end of the connecting rod is fixed to the upper surface of the movable plate, and the upper end of the connecting rod is connected to the lower surface of the fixed plate through a ball joint structure. The lower surface of the fixed plate is provided with an angle adjustment mechanism for adjusting the tilt angle of the movable plate.

[0009] Furthermore, the angle adjustment mechanism includes four identical telescopic devices, which are evenly distributed around the ball joint structure to form a cross-shaped structure.

[0010] Furthermore, each telescopic device includes a sealed cylindrical cavity, the upper end of which is fixedly connected to the lower surface of a fixed plate. A first piston is disposed within the cylindrical cavity, dividing the inner cavity of the cylindrical cavity into a sealed upper air chamber and a sealed lower air chamber. A first piston rod is fixedly connected to the lower surface of the first piston, and the lower end of the first piston rod extends downward through the cylindrical cavity to the outside of the cylindrical cavity. A first annular plate is fixedly sleeved on the upper end of the outer wall of the cylindrical cavity, and a second annular plate is fixedly sleeved on the lower end of the first piston rod. A spring is sleeved on the outer side of the cylindrical cavity, with the spring located between the first and second annular plates. The upper end of the spring is fixed to the first annular plate. The lower surface of the movable plate is fixed with the lower end of the spring fixed to the upper surface of the second annular plate. The lower end of the first piston rod is fixed with a connecting ball, which abuts against the upper surface of the movable plate. The fixed plate is fixed with a first electromagnetic inflation valve and a second electromagnetic inflation valve. The inflation port of the first electromagnetic inflation valve is connected to a first air pipe, the end of which is connected to the upper air chamber. The inflation port of the second electromagnetic inflation valve is connected to a second air pipe, the end of which is connected to the lower air chamber. The lower surface of the movable plate is equipped with a MEMS tilt sensor and a controller. The MEMS tilt sensor, the first electromagnetic inflation valve, and the second electromagnetic inflation valve are all connected to the controller.

[0011] Furthermore, the ball joint structure includes a ball head fixed to the upper end of the connecting rod and a ball shell disposed on the lower surface of the fixed plate that matches the ball head. The ball head is located inside the ball shell, and the surface of the ball head inside the ball shell is provided with multiple arc-shaped grooves that extend from top to bottom along the surface of the ball head. The inner wall of the ball shell is provided with multiple arc-shaped grooves, and the multiple arc-shaped grooves correspond one-to-one with the multiple arc-shaped grooves. A ball is disposed in the arc-shaped groove, and the upper part of the ball is located in the arc-shaped groove. The ball head and the ball shell are slidably connected by the ball.

[0012] Furthermore, the chip fixing structure includes a first chip fixing device and a second chip fixing device with identical structures; an electric slide rail is fixedly installed on the bracket, and the connecting plate is fixedly installed on the electric slide rail. The electric slide rail drives the connecting plate to move back and forth horizontally. When the connecting plate is located at the rightmost position, the probe head is directly facing the IC chip fixed by the first chip fixing device, and when the connecting plate is located at the leftmost position, the probe head is directly facing the IC chip fixed by the second chip fixing device.

[0013] Furthermore, the first chip fixing device includes a housing and a chip placement base fixedly mounted on the upper surface of the workbench. The housing is provided with a second piston, the lower surface of which together with the inner wall of the housing forms a sealed first cavity. It also includes a second piston rod, the lower end of which is fixed to the upper surface of the second piston, and the upper end of which extends upward to the outside of the housing. A transmission rod is fixedly connected to the upper end of the second piston rod. A bracket is provided on the upper surface of the housing, and a gear is provided on the bracket. The gear is fixedly connected to the bracket by a bearing. The gear is located on one side of the transmission rod. A first rack is provided on the side of the transmission rod facing the gear. The first rack is connected to the gear in a transmission manner. A second rack is fixedly provided on one side of the fixing plate. When the connecting plate is located on the far right and the pressing mechanism drives the probe head to move downward in the vertical direction, the second rack meshes with the gear.

[0014] The chip placement base has a chip placement area on its upper surface. The chip placement base has an internal cavity located directly below the chip placement area. An annular partition divides the cavity into a sealed inner air cavity and a sealed annular outer air cavity. The inner air cavity is located within the annular outer air cavity. Multiple first air inlets communicating with the outside are located on the top wall of the inner air cavity. Multiple second air inlets communicating with the outside are located on the top wall of the annular outer air cavity. Both the first and second air inlets are located within the chip placement area. The system also includes a third and a fourth air pipe. One end of the third air pipe is connected to the first cavity, and the other end is connected to the inner air cavity. One end of the fourth air pipe is connected to the first cavity, and the other end is connected to the annular outer air cavity. A valve is installed on the fourth air pipe.

[0015] Furthermore, the probe head is fixed to the lower surface of the movable plate by a magnetic structure.

[0016] Furthermore, the magnetic attraction structure includes a magnetic base fixedly mounted on the lower surface of the movable plate, and an electromagnetic block installed inside the base of the probe head, the electromagnetic block being magnetically connected to the magnetic base.

[0017] The beneficial effects of this invention are: before chip testing, the pressure-type IC chip testing device can automatically adjust the probe tip to compensate for the chip placement angle through an adjustment mechanism for adjusting the probe tip angle, thereby improving testing accuracy and avoiding damage to the probe and chip. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the pressure-type IC chip detection device described in this invention;

[0019] Figure 2This is a schematic diagram of the overall structure of the pressure-type IC chip detection device described in this invention from another perspective;

[0020] Figure 3 This is a schematic diagram of the pressing mechanism described in this invention;

[0021] Figure 4 This is a schematic diagram of the adjustment mechanism structure described in this invention;

[0022] Figure 5 This is a schematic diagram of the split-state structure of the adjustment mechanism described in this invention;

[0023] Figure 6 This is a structural schematic diagram of the adjustment mechanism described in the present invention in a split state from another perspective.

[0024] Figure 7 This is a cross-sectional view of the angle adjustment mechanism described in this invention;

[0025] Figure 8 This is a schematic diagram of the chip fixing structure described in this invention;

[0026] Figure 9 This is a schematic diagram of the half-section structure of the box body described in this invention;

[0027] Figure 10 This is a schematic diagram of the half-section structure of the chip placement base described in this invention.

[0028] The reference numerals in the diagram are as follows: 1. Workbench; 2. Support; 3. Chip fixing structure; 301. Housing; 302. Chip placement base; 303. Second piston; 304. First cavity; 305. Second piston rod; 306. Transmission rod; 307. Bracket; 308. Gear; 309. First rack; 310. Second rack; 311. Chip placement area; 312. Annular partition; 313. Inner air cavity; 314. Annular outer air cavity; 315. First air inlet; 316. Second air inlet; 317. Third air pipe; 318. Fourth air pipe; 319. Valve; 4. Connecting plate; 5. Pressing mechanism; 5. Pressing cylinder; 501. Mounting base; 502. First slide groove; 503. Slider; 504. Connecting block; 505. Probe head; 6. Adjustment mechanism; 7. Fixing plate. 71. Movable plate; 72. Connecting rod; 73. Angle adjustment mechanism; 74. Columnar cavity; 7401. First piston; 7402. Upper air chamber; 7403. Lower air chamber; 7404. First piston rod; 7405. First annular plate; 7406. Second annular plate; 7407. Spring; 7408. Connecting ball; 7409. First electromagnetic inflation valve; 7410. Second electromagnetic inflation valve; 7411. First air pipe; 7412. Second air pipe; 7413. MEMS tilt sensor; 7414. Controller; 7415. Ball joint structure; 75. Ball head; 7501. Ball shell; 7502. Arc-shaped slide groove; 7503. Ball; 7504. Arc-shaped groove; 7505. Electric slide rail; 8. Magnetic structure; 9. Magnetic base; 901. Electromagnetic block; 902. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figure 1-10As shown, the present invention discloses a pressure-type IC chip testing device, comprising a worktable 1, a support 2 and a chip fixing structure 3 for fixing IC chips fixedly disposed on the upper surface of the worktable 1; a connecting plate 4 is disposed on the support 2, and a pressure-down mechanism 5 is fixedly mounted on the connecting plate 4; a downwardly positioned probe head 6 is connected to the pressure-down mechanism 5; the pressure-down mechanism 5 drives the probe head 6 to move up and down vertically; an adjustment mechanism 7 for adjusting the angle of the probe head 6 is disposed between the pressure-down mechanism 5 and the probe head 6. In use, the IC to be tested is first fixed in place by the chip fixing structure 3. Before testing the chip, the adjustment mechanism 7 automatically adjusts the probe head 6 to compensate for the chip's placement angle, thus preventing the probe head 6 from shifting during testing due to chip tilt, thereby improving testing accuracy and protecting both the probe head 6 and the chip.

[0031] In the above-described embodiments, the pressing mechanism 5 can be any existing pressing mechanism 5. Preferably, the pressing mechanism 5 includes a pressing cylinder 501 fixed to the top of the connecting plate 4. The output shaft of the pressing cylinder 501 is arranged downwards, and a mounting base 502 is fixedly connected to the lower end of the output shaft. A first sliding groove 503 is provided vertically on the side surface of the connecting plate 4 facing the mounting base 502. A slider 504 is fixedly installed on the side of the mounting base 502 facing the connecting plate 4, and the slider 504 is located in the first sliding groove 503. A connecting block 505 is fixedly provided on the mounting base 502, and the adjusting mechanism 7 is provided at the lower end of the connecting block 505. This pressing mechanism 5 has a simple structure. By adjusting the pressure of the pressing cylinder 501, the probe head 6 can move up and down vertically. At the same time, the first sliding groove 503 and the slider 504 enable the mounting base 502 to move smoothly back and forth vertically, thereby making the up and down movement of the probe head 6 more stable and less prone to deviation.

[0032] The adjustment mechanism 7 is used to adjust the angle of the probe head 6. The adjustment mechanism 7 can be any existing adjustment mechanism 7, as long as it can achieve the adjustment of the angle of the probe head 6. The present invention provides a preferred adjustment mechanism 7 scheme. Specifically, the adjustment mechanism 7 includes a horizontally arranged fixed plate 71, which is fixed to the lower end of the connecting block 505. A movable plate 72 is arranged below the fixed plate 71. The probe head 6 is fixed to the lower surface of the movable plate 72. It also includes a connecting rod 73, the lower end of which is fixed to the upper surface of the movable plate 72. The upper end of which is connected to the lower surface of the fixed plate 71 through a ball joint structure 75. An angle adjustment mechanism 74 for adjusting the tilt angle of the movable plate 72 is provided on the lower surface of the fixed plate 71. The fixed plate 71 and the movable plate 72 of the adjustment mechanism 7 are connected by a ball joint structure 75, and the tilt angle of the movable plate 72 is adjusted by the angle adjustment mechanism 74, thereby driving the probe head 6 to automatically level and always make perpendicular contact with the chip surface, ensuring that the chip is subjected to uniform force, the signal transmission is stable, poor contact is eliminated, the test accuracy is improved, and the contact force is evenly distributed, so that the probe wear is uniform, the maintenance cycle is extended, and the chip scrap rate is reduced, thus reducing maintenance costs.

[0033] Furthermore, the angle adjustment mechanism 74 includes four identical telescopic devices, which are evenly distributed around the ball joint structure 75 to form a cross shape. By adjusting the four telescopic devices, the movable plate 72 can be adjusted at any angle, ensuring that the probe head 6 always makes perpendicular contact with the chip surface.

[0034] The telescopic device can adopt various existing telescopic structures, such as electric push rods. This invention provides a preferred telescopic device structure where all four telescopic devices have identical structures. Each telescopic device includes a sealed cylindrical cavity 7401. The upper end of the cylindrical cavity 7401 is fixedly connected to the lower surface of the fixing plate 71. A first piston 7402 is disposed inside the cylindrical cavity 7401, dividing the inner cavity of the cylindrical cavity 7401 into a sealed upper air chamber 7403 and a sealed lower air chamber 7404. 404, a first piston rod 7405 is fixedly connected to the lower surface of the first piston 7402. The lower end of the first piston rod 7405 extends downward through the cylindrical cavity 7401 to the outside of the cylindrical cavity 7401. A first annular plate 7406 is fixedly sleeved on the upper end of the outer wall of the cylindrical cavity 7401. A second annular plate 7407 is fixedly sleeved on the lower end of the first piston rod 7405. A spring 7408 is sleeved on the outer side of the cylindrical cavity 7401, and the spring 7408 is located between the first annular plate 7406 and the second annular plate 7407. Between the annular plates 7407, the upper end of the spring 7408 is fixed to the lower surface of the first annular plate 7406, and the lower end of the spring 7408 is fixed to the upper surface of the second annular plate 7407. A connecting ball 7409 is fixed to the lower end of the first piston rod 7405, and the connecting ball 7409 abuts against the upper surface of the movable plate 72. A first electromagnetic inflation valve 7410 and a second electromagnetic inflation valve 7411 are fixedly installed on the fixed plate 71. The inflation port of the first electromagnetic inflation valve 7410 is connected to the first... A first air tube 7412 is connected to an upper air chamber 7403 at its end. A second air tube 7413 is connected to the air inlet of a second electromagnetic inflation valve 7411. The end of the second air tube 7413 is connected to a lower air chamber 7404. A MEMS tilt sensor 7414 and a controller 7415 are installed on the lower surface of the movable plate 72. The MEMS tilt sensor 7414, the first electromagnetic inflation valve 7410, and the second electromagnetic inflation valve 7411 are all connected to the controller 7415.During the downward pressing of the movable plate 72, the MEMS tilt sensor 7414 mounted on the lower surface of the movable plate 72 calculates the tilt angle of the placed chip by measuring the change in the component of gravitational acceleration on the sensitive axis. Then, it controls the first electromagnetic inflation valve 7410 and the second electromagnetic inflation valve 7411 through corresponding data feedback. When the first electromagnetic inflation valve 7410 is activated, external gas enters the upper air chamber 7403 through the first air pipe 7412, pushing the first piston 7402 downward from above, which in turn drives the first piston rod 7405 and its lower end fixed. When the connecting ball 7409 moves downward, the spring 7408 is stretched, and its corresponding position shifts downward. When the second electromagnetic inflation valve 7411 is activated, external gas enters the lower air chamber 7404 through the second air pipe 7413, pushing the first piston 7402 upward from below. This causes the first piston rod 7405 and the connecting ball 7409 fixed at its lower end to move upward, compressing the spring 7408 and shifting its corresponding position upward. This adjusts the tilt angle of the movable plate 72, automatically compensating for the tilt angle of the chip placement and ensuring the detection effect.

[0035] Furthermore, the ball joint structure 75 includes a ball head 7501 fixed to the upper end of the connecting rod 73 and a ball shell 7502 disposed on the lower surface of the fixing plate 71 and matching the ball head 7501. The ball head 7501 is located inside the ball shell 7502. The surface of the ball head 7501 located inside the ball shell 7502 is provided with a plurality of arc-shaped grooves 7503. The arc-shaped grooves 7503 extend from top to bottom along the surface of the ball head 7501. The inner wall of the ball shell 7502 is provided with a plurality of arc-shaped grooves 7505. The plurality of arc-shaped grooves 7503 correspond one-to-one with the plurality of arc-shaped grooves 7505. A ball bearing 7504 is disposed in the arc-shaped groove 7503. The upper part of the ball bearing 7504 is located in the arc-shaped groove 7505. The ball head 7501 and the ball shell 7502 are slidably connected by the ball bearing 7504. The ball joint structure 75 reduces friction, improves response speed and durability when leveling the movable plate 72 at an angle.

[0036] In addition, the chip fixing structure 3 includes a first chip fixing device and a second chip fixing device with identical structures; an electric slide rail 8 is fixedly installed on the bracket 2, and the connecting plate 4 is fixedly installed on the electric slide rail 8. The electric slide rail 8 drives the connecting plate 4 to move back and forth horizontally. When the connecting plate 4 is at the rightmost position, the probe head 6 is directly facing the IC chip fixed by the first chip fixing device; when the connecting plate 4 is at the leftmost position, the probe head 6 is directly facing the IC chip fixed by the second chip fixing device. The chip fixing structure 3 enables the pressure-type IC chip testing device to have dual stations, which work alternately. While one group is testing, the other group is unloading, loading, and positioning. By overlapping the time, the single testing cycle is shortened, the testing efficiency is improved, the equipment idle time is reduced, and the resource utilization rate is increased.

[0037] Furthermore, the first chip fixing device includes a housing 301 and a chip placement base 302 fixedly mounted on the upper surface of the workbench 1. The housing 301 is provided with a second piston 303, the lower surface of the second piston 303 and the inner wall of the housing 301 together forming a sealed first cavity 304. It also includes a second piston rod 305, the lower end of the second piston rod 305 is fixed to the upper surface of the second piston 303, the upper end of the second piston rod 305 extends upward to the outside of the housing 301, and a transmission rod is fixedly connected to the upper end of the second piston rod 305. 306. A bracket 307 is provided on the upper surface of the housing 301. A gear 308 is provided on the bracket 307. The gear 308 is fixedly connected to the bracket 307 by a bearing. The gear 308 is located on one side of the transmission rod 306. A first rack 309 is provided on the side of the transmission rod 306 facing the gear 308. The first rack 309 is connected to the gear 308 in a transmission manner. A second rack 310 is fixedly provided on one side of the fixing plate 71. When the connecting plate 4 is located on the far right and the pressing mechanism 5 drives the probe head 6 to move downward in the vertical direction, the second rack 310... Strip 310 meshes with gear 308; the chip placement base 302 has a chip placement area 311 on its upper surface, and a cavity is provided inside the chip placement area 311, with the cavity located directly below the chip placement area 311. An annular partition 312 is provided inside the cavity, dividing it into a sealed inner air cavity 313 and a sealed annular outer air cavity 314. The inner air cavity 313 is located within the annular outer air cavity 314. Multiple first air inlets 315 communicating with the outside are provided on the top wall of the inner air cavity 313. The top cavity wall of cavity 314 is provided with multiple second air inlets 316 that communicate with the outside. The first air inlet 315 and the second air inlet 316 are both located in the chip placement area 311. It also includes a third air pipe 317 and a fourth air pipe 318. One end of the third air pipe 317 is connected to the first cavity 304, and the other end of the third air pipe 317 is connected to the inner air cavity 313. One end of the fourth air pipe 318 is connected to the first cavity 304, and the other end of the fourth air pipe 318 is connected to the annular outer air cavity 314. A valve 319 is provided on the fourth air pipe 318.The working process of the first chip fixing device is as follows: During the downward pressing of the probe head 6, the second rack 310 meshes with the gear 308. As the second rack 310 moves downward, it drives the gear 308 to rotate, which in turn drives the first rack 309 to move upward. The upward movement of the first rack 309 drives the transmission rod 306 to move upward, which in turn drives the second piston rod 305 to move upward. The upward movement of the second piston rod 305 drives the second piston 303 to move upward, which reduces the pressure in the first cavity 304, thereby reducing the pressure in the inner air cavity 313 or the outer air cavity. Outside air is then drawn in through the first air inlet 315 or the second air inlet 316. In the inner air chamber 313 or outer air chamber, if a chip is placed in the chip placement area 311 during the air intake process, the bottom of the chip is adsorbed and fixed, preventing the chip from shifting during detection, causing poor contact or fluctuations in test data, and eliminating detection errors. By controlling the opening and closing of the valve 319 set on the fourth air pipe 318, the suction force generated by the outer air chamber can be controlled, thereby intelligently switching the adsorption area. This avoids the chip being too large, relying solely on the inner perimeter adsorption, resulting in uneven negative pressure distribution and chip edge lifting, or the chip being too small, where both inner and outer perimeter adsorption are activated simultaneously. If the negative pressure area is too large, the chip may be excessively stretched or even damaged. This achieves optimized adsorption effect and adapts to chips of different sizes.

[0038] To facilitate the replacement of the probe head 6, the probe head 6 is fixed to the lower surface of the movable plate 72 by a magnetic structure 9. The magnetic structure 9 includes a magnetic base 901 fixedly disposed on the lower surface of the movable plate 72, and an electromagnetic block 902 is installed inside the base of the probe head 6. The electromagnetic block 902 is magnetically connected to the magnetic base 901. The magnetic structure 9 allows for quick replacement and maintenance of the probe head 6.

[0039] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A pressure-type IC chip testing device, comprising a worktable (1), wherein a bracket (2) and a chip fixing structure (3) for fixing an IC chip are fixedly disposed on the upper surface of the worktable (1); a connecting plate (4) is disposed on the bracket (2), and a pressure mechanism (5) is fixedly installed on the connecting plate (4), wherein a downwardly positioned probe head (6) is connected to the pressure mechanism (5), and the pressure mechanism (5) drives the probe head (6) to move up and down in the vertical direction, characterized in that: An adjustment mechanism (7) for adjusting the angle of the probe head (6) is provided between the pressing mechanism (5) and the probe head (6); the pressing mechanism (5) includes a pressing cylinder (501) fixed to the top of the connecting plate (4), the output shaft of the pressing cylinder (501) is set downward and a mounting base (502) is fixedly connected to the lower end of the output shaft, a first slide groove (503) is provided vertically on the side surface of the connecting plate (4) facing the mounting base (502), a slider (504) is fixedly installed on the side of the mounting base (502) facing the connecting plate (4) and the slider (504) is located in the first slide groove (503), a connecting block (505) is fixedly provided on the mounting base (502), and the adjustment mechanism (7) is provided at the lower end of the connecting block (505); The adjustment mechanism (7) includes a horizontally arranged fixed plate (71), which is fixed to the lower end of the connecting block (505). A movable plate (72) is arranged below the fixed plate (71). The probe head (6) is fixed to the lower surface of the movable plate (72). The mechanism also includes a connecting rod (73), the lower end of which is fixed to the upper surface of the movable plate (72). The upper end of which is connected to the lower surface of the fixed plate (71) through a ball joint structure (75). An angle adjustment mechanism (74) for adjusting the tilt angle of the movable plate (72) is provided on the lower surface of the fixed plate (71). The angle adjustment mechanism (74) includes four telescopic devices with the same structure. The four telescopic devices are evenly distributed around the ball joint structure (75) to form a cross-shaped structure.Each telescopic device includes a sealed cylindrical cavity (7401), the upper end of which is fixedly connected to the lower surface of a fixed plate (71). A first piston (7402) is disposed inside the cylindrical cavity (7401). The first piston (7402) divides the inner cavity of the cylindrical cavity (7401) into a sealed upper air chamber (7403) and a sealed lower air chamber (7404). A first piston rod (7405) is fixedly connected to the lower surface of the first piston (7402). The piston rod extends downward through the cylindrical cavity (7401) to the outside of the cylindrical cavity (7401). A first annular plate (7406) is fixedly sleeved on the upper end of the outer wall of the cylindrical cavity (7401). A second annular plate (7407) is fixedly sleeved on the lower end of the first piston rod (7405). A spring (7408) is sleeved on the outer side of the cylindrical cavity (7401) and the spring (7408) is located between the first annular plate (7406) and the second annular plate (7407). The upper end of the spring (7408) is fixed to the first annular plate (7407). The lower surface of the spring (7408) is fixed to the upper surface of the second annular plate (7407). The lower end of the first piston rod (7405) is fixed with a connecting ball (7409). The connecting ball (7409) abuts against the upper surface of the movable plate (72). The fixed plate (71) is fixed with a first electromagnetic inflation valve (7410) and a second electromagnetic inflation valve (7411). The inflation port of the first electromagnetic inflation valve (7410) is connected to a first air pipe (7412). The end of the second electromagnetic inflation valve (7411) is connected to the upper air chamber (7403). A second air pipe (7413) is connected to the inflation port of the second electromagnetic inflation valve (7411). The end of the second air pipe (7413) is connected to the lower air chamber (7404). A MEMS tilt sensor (7414) and a controller (7415) are installed on the lower surface of the movable plate (72). The MEMS tilt sensor (7414), the first electromagnetic inflation valve (7410), and the second electromagnetic inflation valve (7411) are all connected to the controller (7415).

2. The pressure-type IC chip testing device according to claim 1, characterized in that: The ball joint structure (75) includes a ball head (7501) fixed to the upper end of the connecting rod (73) and a ball shell (7502) provided on the lower surface of the fixed plate (71) and matching the ball head (7501). The ball head (7501) is located inside the ball shell (7502). The surface of the ball head (7501) inside the ball shell (7502) is provided with a plurality of arc-shaped grooves (7503). The arc-shaped grooves (7503) run from top to bottom along the ball head (7501). 1) Surface extension: The inner wall of the spherical shell (7502) is provided with a plurality of arc-shaped grooves (7505), and a plurality of arc-shaped sliding grooves (7503) correspond one-to-one with the plurality of arc-shaped grooves (7505). A ball (7504) is provided in the arc-shaped sliding groove (7503), and the upper part of the ball (7504) is located in the arc-shaped groove (7505). The ball head (7501) and the spherical shell (7502) are slidably connected by the ball (7504).

3. The pressure-type IC chip testing device according to claim 1, characterized in that: The chip fixing structure (3) includes a first chip fixing device and a second chip fixing device with the same structure; an electric slide rail (8) is fixedly installed on the bracket (2), and the connecting plate (4) is fixedly installed on the electric slide rail (8). The electric slide rail (8) drives the connecting plate (4) to move back and forth in the horizontal direction. When the connecting plate (4) is located on the rightmost side, the probe head (6) is facing the IC chip fixed by the first chip fixing device. When the connecting plate (4) is located on the leftmost side, the probe head (6) is facing the IC chip fixed by the second chip fixing device.

4. The pressure-type IC chip testing device according to claim 3, characterized in that: The first chip fixing device includes a housing (301) and a chip placement base (302) fixedly mounted on the upper surface of the workbench (1). The housing (301) is provided with a second piston (303). The lower surface of the second piston (303) and the inner wall of the housing (301) together form a sealed first cavity (304). The device also includes a second piston rod (305). The lower end of the second piston rod (305) is fixed to the upper surface of the second piston (303), and the upper end of the second piston rod (305) extends upward to the outside of the housing (301). A transmission rod (306) is fixedly connected to the upper end of the second piston rod (305). The upper surface of the housing (301) is... A bracket (307) is provided on the surface, and a gear (308) is provided on the bracket (307). The gear (308) is fixedly connected to the bracket (307) by a bearing. The gear (308) is located on one side of the transmission rod (306). A first rack (309) is provided on the side surface of the transmission rod (306) facing the gear (308). The first rack (309) is connected to the gear (308) in a transmission manner. A second rack (310) is fixedly provided on one side of the fixing plate (71). When the connecting plate (4) is located on the far right and the pressing mechanism (5) drives the probe head (6) to move downward in the vertical direction, the second rack (310) meshes with the gear (308). The chip placement base (302) has a chip placement area (311) on its upper surface. The chip placement base (302) has an internal cavity located directly below the chip placement area (311). An annular partition (312) is installed inside the cavity, dividing it into a sealed inner air cavity (313) and a sealed annular outer air cavity (314). The inner air cavity (313) is located within the annular outer air cavity (314). The top cavity wall of the inner air cavity (313) has multiple first air inlets (315) communicating with the outside. The top cavity wall of the annular outer air cavity (314)... The device is provided with multiple second air inlets (316) that communicate with the outside. The first air inlet (315) and the second air inlet (316) are both located in the chip placement area (311). It also includes a third air pipe (317) and a fourth air pipe (318). One end of the third air pipe (317) is connected to the first cavity (304), and the other end of the third air pipe (317) is connected to the inner air cavity (313). One end of the fourth air pipe (318) is connected to the first cavity (304), and the other end of the fourth air pipe (318) is connected to the annular outer air cavity (314). A valve (319) is provided on the fourth air pipe (318).

5. The pressure-type IC chip testing device according to claim 1, characterized in that: The probe head (6) is fixed to the lower surface of the movable plate (72) by a magnetic structure (9).

6. The pressure-type IC chip testing device according to claim 5, characterized in that: The magnetic structure (9) includes a magnetic base (901) fixedly installed on the lower surface of the movable plate (72), and an electromagnetic block (902) installed in the base of the probe head (6). The electromagnetic block (902) is magnetically connected to the magnetic base (901).

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