Full-automatic intelligent binding machine for COG

Abstract

The application discloses a COG full-automatic intelligent binding machine and relates to the technical field of liquid crystal screen manufacturing.The machine comprises an operation table, a support fixedly arranged on the top of the operation table, a linking assembly, a circular conveyor fixedly arranged in the middle of the support, a binding table fixedly arranged on each sliding block of the circular conveyor, a transmission assembly, a supporting arm fixedly connected to the side of each binding table, a sliding shaft slidingly connected to one end of each supporting arm, a hot pressing head fixedly connected to the end of each sliding shaft close to the binding table, a pre-pressing assembly, an electric cylinder two fixedly arranged on one side of the support, a pressing plate fixedly connected to the telescopic end of the electric cylinder two, a main pressing assembly and a constraint sliding plate fixedly connected to the top of the support.The pre-pressing and the main pressing are seamlessly linked by continuous pushing, the production rhythm is shortened, and the work efficiency is improved compared to the design that the pre-pressing and the main pressing need multi-station switching in the traditional equipment.

Description

Technical Field

[0001] This invention relates to the field of LCD manufacturing technology, and more specifically, to a COG fully automatic intelligent bonding machine. Background Technology

[0002] The COG bonding machine is a device that precisely positions and bonds driver IC chips onto an LCD glass substrate. The entire machine is controlled by a PLC and HMI. The automatic image alignment system calculates the alignment data of the target object. After the product is aligned and pre-pressed, it is transferred from the platform to the bonding machine for bonding and pressing.

[0003] In existing technologies, the pre-pressing mechanism of COG bonding machines is usually matched with about four sets of main pressing mechanisms. Each set of main pressing mechanisms needs to be controlled independently, which can easily lead to differences between them and is not conducive to consistent processing quality. In addition, each time the glass substrate is transferred from the pre-pressing mechanism to the main pressing mechanism, in order to avoid relative displacement between the glass substrate and the driver IC chip during the pressurization process, the placement position of the glass substrate must be repositioned. Consequently, the pressure position also needs to be controlled and adjusted each time the hot press head presses down, which affects work efficiency.

[0004] To address the aforementioned issues, a fully automated intelligent COG binding machine is proposed. Summary of the Invention

[0005] To solve the above-mentioned technical problems, a COG fully automatic intelligent binding machine is provided. This technical solution solves the problems mentioned in the background technology.

[0006] To achieve the above objectives, the present invention can be implemented using the following technical solutions:

[0007] The present invention provides a COG fully automatic intelligent binding machine, including an operating table, a support fixedly installed on the top of the operating table, and a connecting component, which includes a ring conveyor fixedly installed in the middle of the support, and a binding table fixedly installed on each slider of the ring conveyor.

[0008] It also includes a transfer assembly, which includes a support arm fixedly connected to the side of each binding platform, a sliding shaft slidably connected to one end of each support arm, a hot press head fixedly connected to the end of each sliding shaft near the binding platform, a top plate fixedly connected to the end of each sliding shaft away from the binding platform, and a spring sleeved on the outside of each sliding shaft between the top plate and the support arm;

[0009] It also includes a pre-compression assembly, which includes an electric cylinder two fixedly installed on one side of the bracket, a pressure plate fixedly connected to the telescopic end of the electric cylinder two, and a pressure sensor one fixedly installed in the middle of the bottom of the pressure plate.

[0010] It also includes this pressure assembly, which includes a constraint slide plate located above the bracket. A thin film pressure sensor is fixedly installed in the middle of the bottom of the constraint slide plate. Electric cylinders are fixedly connected to both sides of the top of the constraint slide plate, and the two electric cylinders are fixedly installed on the bracket.

[0011] Furthermore, each binding platform has multiple suction holes on the side away from the circular conveyor. Each binding platform has a pipe-type check valve fixedly installed on the opposite side of the suction hole. Each pipe-type check valve is connected to the suction hole on each binding platform. The valve core of each pipe-type check valve is made of a magnetically attracted material. One electric cylinder is fixedly installed at one end of the frame of the circular conveyor below the second electric cylinder. The telescopic end of the first electric cylinder is fixedly connected to an air extraction pipe. The bottom end of the air extraction pipe is fixedly connected to a vacuum pump, which is fixedly installed inside the operating platform.

[0012] Furthermore, an electromagnet is fixedly connected to the end of the ring conveyor frame away from the electric cylinder.

[0013] Furthermore, each hot press head has an electric heating element fixedly installed inside, and each top plate has a conductive spring fixedly installed on both sides. The two electrodes of each electric heating element are respectively connected to the corresponding conductive springs on both sides of the top plate.

[0014] Furthermore, two conductive rings are concentrically fixed to the bottom of the pressure plate, and a DC power supply is also fixedly installed inside the operating table. The two conductive rings are respectively connected to the positive and negative terminals of the DC power supply for conduction.

[0015] Furthermore, conductive strips are fixedly installed on both sides of the bottom of the constraint slide, and the two conductive strips are respectively connected to the positive and negative terminals of the DC power supply.

[0016] Furthermore, it also includes a conveyor belt 1 for transporting the glass substrate, a suction cup robotic arm 1 for transferring the glass substrate from the conveyor belt 1 to the bonding table, a conveyor belt 2 for transporting the driver IC chip, a suction cup robotic arm 2 for transferring the driver IC chip from the conveyor belt 2 to the glass substrate, and a suction cup robotic arm 3 for removing the bonded glass substrate from the bonding table. The conveyor belt 1 is fixedly installed on the top of the operating table and near one end of the electric cylinder 1. The suction cup robotic arm 1 is fixedly installed on the top of the operating table and located on one side of the conveyor belt 1. The conveyor belt 2 is fixedly installed on the top of the operating table and away from the circular conveyor. The suction cup robotic arm 2 is fixedly installed on the top of the operating table and located on one side of the conveyor belt 2. The suction cup robotic arm 3 is fixedly installed on the top of the operating table and near one end of the electromagnet.

[0017] Based on the above, the features and advantages of the COG fully automatic intelligent binding machine of the present invention are as follows:

[0018] Compared to the parallel design of multiple pressing mechanisms in existing technologies, this solution uses the geometric constraints of the pressure plate to control the pressure, ensuring that each driver IC chip receives consistent pressure conditions. Compared to the multiple independent pressure control designs in existing technologies, this solution better unifies the stress on the workpiece during the pressing process, avoids errors caused by independent control, and improves the processing accuracy between the glass substrate and the driver IC chip.

[0019] By employing a detachable hot press head design, combined with a contact conductive design and geometric constraints of the constraint slide plate, the hot press head can detach from the pre-pressing assembly after pre-pressing and be continuously pushed and subjected to constant pressure along with the glass substrate in the main pressing assembly, thereby completing COG bonding. This continuous pushing achieves seamless connection between pre-pressing and main pressing. Compared to the design of traditional equipment that requires multi-station switching between pre-pressing and main pressing, in this invention, since the glass substrate does not need to be repositioned and the position of the hot press head relative to the glass substrate and the driver IC chip remains unchanged during transfer, the production cycle is shortened, and work efficiency is improved. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 for Figure 1 Another perspective diagram of the structure;

[0022] Figure 3 This is a schematic diagram of the connecting component structure shown in the present invention;

[0023] Figure 4 for Figure 3 Another perspective diagram of the structure;

[0024] Figure 5 This is a schematic diagram showing the connection between the air intake and the tubular one-way valve as shown in this invention;

[0025] Figure 6 This is a schematic diagram of the valve core of the electromagnet attraction tube type one-way valve shown in an embodiment of the present invention.

[0026] Figure 7 This is a schematic diagram of the transmission component structure shown in the present invention;

[0027] Figure 8 This is a schematic diagram of the electric heating element structure inside the hot press head shown in this invention;

[0028] Figure 9 This is a schematic diagram of the assembly of the pre-compression component and the compression component shown in this invention.

[0029] The reference numerals in the appendix of this invention are as follows:

[0030] 11. Control panel; 12. Support frame; 13. Vacuum pump; 14. DC power supply; 15. Conveyor belt one; 16. Suction cup robotic arm one; 17. Conveyor belt two; 18. Suction cup robotic arm two; 19. Suction cup robotic arm three;

[0031] Connecting components: 21. Circular conveyor; 22. Binding platform; 23. Suction port; 24. Pipe-type check valve; 25. Electric cylinder one; 26. Suction pipe; 27. Electromagnet;

[0032] Transmission components: 31. Support arm; 32. Sliding shaft; 33. Hot press head; 34. Electric heating element; 35. Top plate; 36. Spring; 37. Conductive spring sheet;

[0033] Pre-compression components: 41. Electric cylinder II; 42. Pressure plate; 43. Pressure sensor I; 44. Conductive ring;

[0034] This pressure assembly includes: 51. Constraint slide plate; 52. Conductive strip; 53. Thin-film pressure sensor; 54. Electric cylinder three. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0036] See Figures 1-9 As shown, an embodiment of the present invention is provided, and a fully automatic intelligent COG binding machine will be described in detail below:

[0037] See Figures 1-2 As shown, a COG fully automatic intelligent bonding machine includes an operating table 11. A bracket 12 is fixedly installed on the top of the operating table 11. A pre-pressing component and a self-pressing component are respectively arranged on the upper two sides of the bracket 12. The machine also includes a connecting component located in the middle of the bracket 12. The connecting component is located below the pre-pressing component and the self-pressing component and is used to transfer the combination of the glass substrate and the driver IC chip between the two. During the transfer, the pre-pressing component first fixes the driver IC chip on the glass substrate. Then, after the transfer is under the self-pressing component, the self-pressing component completely fixes the driver IC chip on the glass substrate and realizes the conduction of the conductive contacts between the driver IC chip and the glass substrate.

[0038] It should be noted that in order to achieve full automation and intelligence of this COG bonding machine and to improve its functionality, it is necessary to use some mature equipment from existing technologies, including glass substrate feeding, cleaning of the bonding area of ​​the glass substrate, and attaching ACF to the bonding area of ​​the glass substrate.

[0039] Since the above-mentioned techniques are all well-known in this field, they will not be described in detail here, but only briefly.

[0040] The aforementioned glass substrate feeding refers to the process of transferring the glass substrate from the material stacking area to this COG bonding machine. Simply put, the robotic arm automatically grabs the glass substrate from the rack and accurately places the glass sheet onto the transfer track, which then transports the glass substrate to the cleaning area. The commonly used equipment for this function is an automatic feeder, whose main structure is a vacuum suction cup robotic arm.

[0041] After the transport track conveys the glass substrate to the cleaning area, the electrodes (terminals) on the edge of the glass substrate are first gently wiped with a soft cloth containing alcohol to remove dust and oil. Then, plasma cleaning is performed. The plasma generated by high-pressure gas discharge further removes tiny impurities, making the electrode surface more "active" and facilitating the subsequent bonding of ACF. The commonly used equipment for this function is an alcohol cleaner and a PLASMA cleaner. The former is similar to a small washing machine with a rotating brush and nozzle inside, while the latter is like a microwave oven with a transparent observation window. Its key components are a plasma generator that produces charged gas (such as argon) and a vacuum chamber that performs cleaning in a sealed environment to avoid external contamination.

[0042] After the cleaned glass substrate is transferred to the ACF bonding area, the device peels off a strip of transparent ACF conductive film from the roll, precisely applies it to the glass electrode, and then peels off the protective film, leaving only the film. This film contains tiny conductive particles that allow electricity to flow between the driver IC chip and the glass substrate. The commonly used device for this function is an ACF bonding machine, whose main structure resembles a printer, with a roll and a cutter on top. Its key components include the ACF roll that stores the roll of conductive film, the cutter that cuts the film into specified lengths, and a bonding head similar to a small iron that heats and pressurizes the film to adhere firmly and can move within space to ensure accurate bonding.

[0043] After undergoing the three pretreatment steps using existing techniques described above, the glass substrate will be transported to the connection assembly fully disclosed in this embodiment. For the transport of the glass substrate after ACF attachment to the connection assembly, and the transport of the driver IC chip, please refer to... Figures 1-2As shown, the COG fully automatic intelligent bonding machine also includes a conveyor belt 15 for transporting glass substrates, a suction cup robotic arm 16 for transferring the glass substrates from the conveyor belt 15 to the bonding assembly, a conveyor belt 17 for transporting driver IC chips, and a suction cup robotic arm 18 for transferring the driver IC chips from the conveyor belt 17 to the glass substrate. The glass substrate, after ACF attachment, is transported from the ACF attacher to the bonding assembly by the conveyor belt 15, then the suction cup robotic arm 16 transfers the glass substrate from the conveyor belt 15 to the bonding assembly, while the suction cup robotic arm 18 transfers the driver IC chips from the conveyor belt 17 to the glass substrate. The second 17 is transferred to the ACF attachment area of ​​the glass substrate located in the connecting assembly. During the transfer, in the prior art, a microscope-grade camera (CCD) is usually used to scan the marking points on the driver IC chip and the glass. After the computer calculates the spatial position of the two, the glass substrate is precisely adjusted and placed in the connecting assembly, and the driver IC chip is precisely adjusted and placed on the ACF area of ​​the glass substrate. The above-mentioned visual assistance is a well-known technical means in the art and will not be described in detail here. Furthermore, the COG fully automatic intelligent bonding machine also includes a suction cup robotic arm 3 19 for removing the bonded glass substrate from the connecting assembly.

[0044] See Figures 3-5 As shown, the connecting assembly includes a ring conveyor 21 fixedly installed in the middle of the bracket 12. Each slider of the ring conveyor 21 is fixedly installed with a binding platform 22. In this embodiment, the ring conveyor 21 is preferably vertical, with multiple sliders spaced apart on it, and can transport in a ring. The binding platform 22 is the placement area of ​​the glass substrate in the connecting assembly.

[0045] Furthermore, each binding platform 22 has multiple suction holes 23 on the side away from the annular conveyor 21. Each binding platform 22 has a tubular one-way valve 24 fixedly installed on the opposite side of the suction hole 23. Each tubular one-way valve 24 is connected to the suction hole 23 on each binding platform 22. The valve core of each tubular one-way valve 24 is made of a material that can be magnetically attracted. An electric cylinder 25 is fixedly installed at one end of the frame of the annular conveyor 21. The telescopic end of the electric cylinder 25 is fixedly connected to an air extraction pipe 26. The bottom end of the air extraction pipe 26 is fixedly connected to a vacuum pump 13. The vacuum pump 13 is fixedly installed inside the operating platform 11.

[0046] In this embodiment, when the binding platform 22 is conveyed above the electric cylinder 25, the ring conveyor 21 pauses its conveying action. At this time, the binding platform 22 remains stationary. Then, the glass substrate is placed on the binding platform 22 by the suction cup robotic arm 16. Subsequently, the electric cylinder 25 extends, thereby driving the top port of the suction pipe 26 to move upward, thus fitting onto the bottom port of the tubular one-way valve 24. Then, the vacuum pump 13 operates to remove the air inside the suction hole 23. The electric cylinder 25 resets, driving the suction pipe 26 to disengage from the bottom port of the tubular one-way valve 24. At this time, by utilizing the one-way sealing capability of the tubular one-way valve 24, the glass substrate can be firmly adsorbed onto the binding platform 22 by using negative pressure. The above-mentioned fixation of the glass substrate is prior art, and its specific technical means will not be described in detail here.

[0047] It is easy to imagine that, in order to accommodate glass substrates of different sizes, that is, to ensure that the glass substrates can completely cover the air intake 23 after placement, the binding table 22 is detachably connected to the ring conveyor 21 by bolts, and the binding table 22 can be replaced according to the different sizes of glass substrates in each batch.

[0048] Furthermore, an electromagnet 27 is fixedly connected to the end of the frame of the circular conveyor 21 away from the electric cylinder 25.

[0049] In this embodiment, the tubular check valve 24 should be in a vertical state when the binding platform 22 is horizontally conveyed. When the binding platform 22 carrying the glass substrate arrives above the electromagnet 27, and the electromagnet 27 aligns with the bottom port of the tubular check valve 24, the circular conveyor 21 pauses its conveying action again. (Refer to...) Figure 6 As shown, when the electromagnet 27 is energized, since the valve core of the tubular check valve 24 is made of a magnetically attracted material, the valve core inside the tubular check valve 24 is attracted to the bottom port of the tubular check valve 24 through the magnetic attraction, thereby releasing the one-way sealing function of the tubular check valve 24. Through the above-mentioned vacuum breaking effect, the negative pressure in the suction hole 23 no longer exists, thereby achieving the purpose of releasing the glass substrate and facilitating the unloading after bonding.

[0050] In this embodiment, conveyor belt 15 is fixedly installed on the top of the operating platform 11 and near one end of the electric cylinder 25, suction cup robotic arm 16 is fixedly installed on the top of the operating platform 11 and located on one side of conveyor belt 15, conveyor belt 27 is fixedly installed on the top of the operating platform 11 and away from the circular conveyor 21, suction cup robotic arm 28 is fixedly installed on the top of the operating platform 11 and located on one side of conveyor belt 27, and suction cup robotic arm 39 is fixedly installed on the top of the operating platform 11 and near one end of the electromagnet 27.

[0051] See Figures 7-8As shown, the COG fully automatic intelligent binding machine also includes a transfer component, which includes a support arm 31 fixedly connected to the side of each binding table 22. One end of each support arm 31 is slidably connected to a sliding shaft 32. A hot press head 33 is fixedly connected to the end of each sliding shaft 32 near the binding table 22. A top plate 35 is fixedly connected to the end of each sliding shaft 32 away from the binding table 22. A spring 36 is sleeved on the outside of each sliding shaft 32 between the top plate 35 and the support arm 31.

[0052] In this embodiment, after the driver IC chip is placed on the ACF attachment area on the glass substrate, pressure is applied to the top plate 35 at the top of the sliding shaft 32. Under the support and guidance of the support arm 31, the hot pressure head 33 at the bottom of the sliding shaft 32 will move down and adhere to the top of the driver IC chip. At the same time, the spring 36 will be compressed synchronously when it moves down. Through a certain pressure and the heating effect of the hot pressure head 33, the sticky substance of ACF melts, which will make the driver IC chip initially fixed on the glass substrate. After the pressure is removed, the spring force is released by the spring 36, which can reset the sliding shaft 32 and the hot pressure head 33. The above-mentioned initial fixing is often referred to as the pre-pressing step in the prior art.

[0053] Furthermore, each hot press head 33 has an electric heating element 34 fixedly installed inside, and each top plate 35 has a conductive spring 37 fixedly installed on both sides. The two electrodes of each electric heating element 34 are respectively connected to the corresponding conductive spring 37 on both sides of the top plate 35.

[0054] In this embodiment, the heating function of the hot press head 33 is performed by its internal electric heating element 34. The electric heating element 34 is connected to the power supply through two conductive springs 37. The heating function can be realized after current is applied, such as a resistance heating wire.

[0055] See Figure 9 As shown, the COG fully automatic intelligent binding machine also includes a pre-pressing component, which includes an electric cylinder 41 fixedly installed on one side of the bracket 12. The telescopic end of the electric cylinder 41 is fixedly connected to a pressure plate 42. A pressure sensor 43 is fixedly installed in the middle of the bottom of the pressure plate 42. Two conductive rings 44 are fixedly installed in a concentric manner at the bottom of the pressure plate 42. It also includes a DC power supply 14 fixedly installed inside the operating table 11. The two conductive rings 44 are respectively connected to the positive and negative terminals of the DC power supply 14 for conduction.

[0056] After the glass substrate is precisely placed on the bonding stage 22 and the driver IC chip is placed on the glass substrate, the circular conveyor 21 keeps the bonding stage 22 stationary. Then, the electric cylinder 41 extends, thereby driving the pressure plate 42 to press down. When the pressure sensor 43 at the bottom center of the pressure plate 42 touches the top plate 35, the pressure of the electric cylinder 41 on the top plate 35 can be detected, that is, the pressure applied by the hot press head 33 to the driver IC chip can be detected. Furthermore, in this embodiment, the installation distance difference between the conductive springs 37 on both sides of the top plate 35 is greater than the width of one conductive spring 37. For example, if the distance between one conductive spring 37 and the top plate 35 is 'a', and the distance between the other conductive spring 37 and the top plate 35 is 'a', the installation distance between the two conductive springs 37 and the top plate 35 is 'a'. If the distance is b, then the absolute value of c in the equation ab = c is greater than the width of the conductive spring 37. The purpose of the above design is that when the pressure plate 42 is pressed down, the two conductive rings 44 installed concentrically at its bottom can contact the two conductive springs 37 respectively without interfering with each other, especially the two conductive rings 44 do not interfere with each other. At this time, since the two conductive rings 44 are connected to the positive and negative terminals of the DC power supply 14 respectively, after the conductive rings 44 contact the conductive springs 37, the electric heating element 34 can be connected to the DC power supply 14 by means of the electric power transmission between the conductive rings 44 and the conductive springs 37. After the pre-pressing is completed, the electric cylinder 41 is reset, and the sliding shaft 32 and the hot pressure head 33 can also be reset by the elastic force released by the spring 36.

[0057] Of course, replacing the DC power supply with an AC power supply 14 is also a common technique in this field, and will not be elaborated here.

[0058] See Figure 9 As shown, the COG fully automatic intelligent binding machine also includes a pressure assembly, which includes a constraint slide plate 51 located above the bracket 12. A thin film pressure sensor 53 is fixedly installed in the middle of the bottom of the constraint slide plate 51. Electric cylinders 54 are fixedly connected to both sides of the top of the constraint slide plate 51. The two electric cylinders 54 are fixedly installed on the bracket 12. Conductive strips 52 are fixedly installed on both sides of the bottom of the constraint slide plate 51. The two conductive strips 52 are respectively connected to the positive and negative terminals of the DC power supply 14 for conduction.

[0059] Typically, in the pre-pressing stage of COG bonding, the driver IC chip is completely fixed to the glass substrate. After pre-pressing, the sliding shaft 32 and the hot press head 33 are reset by the elastic force released by the spring 36. Then, the circular conveyor 21 drives the bonding stage 22 to move towards the pre-pressing assembly. Specifically, the glass substrate is adsorbed onto the bonding stage 22 under negative pressure, and the driver IC chip is initially bonded to the glass substrate by ACF after pre-pressing. Thus, when the bonding stage 22 is transported, the glass substrate and the driver IC chip on it are... The support arm 31, sliding shaft 32, hot press head 33, electric heating element 34, top plate 35, and spring 36 will all be transported as a whole to the area below the constraint slide plate 51. Due to the height limitation of the constraint slide plate 51, after the top plate 35 enters below the constraint slide plate 51, it will be pressed downwards under the geometric constraint of the constraint slide plate 51. This will cause the sliding shaft 32 to move downwards, which in turn will cause the hot press head 33 to move downwards and press against the drive IC chip. At this time, the extension of the electric cylinder 34 can be adjusted. This changes the height of the constraint slide plate 51, which in turn changes the pressure of the hot press head 33 on the driver IC chip. The pressure is detected by the thin film pressure sensor 53 in the middle of the bottom of the constraint slide plate 51. Furthermore, when the top plate 35 enters under the constraint slide plate 51, the conductive springs 37 on both sides of it will contact and conduct electricity with the conductive strips 52 on both sides of the bottom of the constraint slide plate 51. At this time, the electric heating element 34 and the DC power supply 14 can be reconnected through the power transmission between the conductive springs 37 and the conductive strips 52. At this time, through the stable pressure provided by the constraint slide plate 51 and the reheating of the hot press head 33 by the electric heating element 34, the conductive particles in the ACF film are crushed, forming a permanent electrical connection between the driver IC chip pins and the glass substrate circuit, and finally completing the COG bonding operation. As for the cooling of the workpiece during this pressing stage and the visual inspection of the finished workpiece after bonding and unloading, these are all essential technical means known in the art and will not be described in detail here.

[0060] The above-mentioned automatic loading and unloading, visual alignment, and real-time pressure feedback enable this COG bonding machine to achieve fully automated and intelligent production. In the existing technology, the integration of pre-pressing and main pressing technology mostly relies on active control or multi-station design. This invention achieves pressure control through passive geometric constraints, which solves the problems of low efficiency and high cost of traditional equipment. Since the glass substrate does not need to be repositioned, and the position of the hot pressing head 33 relative to the glass substrate and the driving IC chip remains unchanged during transfer, the production cycle is shortened and the work efficiency is improved.

[0061] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0062] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fully automatic intelligent COG binding machine, comprising an operating table (11), wherein a bracket (12) is fixedly installed on the top of the operating table (11), characterized in that: It also includes a connecting assembly, which includes an annular conveyor (21) fixedly installed in the middle of the bracket (12), and a binding platform (22) fixedly installed on each slider of the annular conveyor (21); It also includes a transfer assembly, which includes a support arm (31) fixedly connected to the side of each binding platform (22), a sliding shaft (32) slidably connected to one end of each support arm (31), a hot press head (33) fixedly connected to the end of each sliding shaft (32) near the binding platform (22), a top plate (35) fixedly connected to the end of each sliding shaft (32) away from the binding platform (22), and a spring (36) sleeved on the outside of each sliding shaft (32) between the top plate (35) and the support arm (31); It also includes a pre-compression assembly, which includes an electric cylinder two (41) fixedly installed on one side of the bracket (12), a pressure plate (42) fixedly connected to the telescopic end of the electric cylinder two (41), and a pressure sensor one (43) fixedly installed in the middle of the bottom of the pressure plate (42). It also includes this pressure assembly, which includes a constraint slide plate (51) located above the bracket (12), a thin film pressure sensor (53) fixedly installed in the middle of the bottom of the constraint slide plate (51), and electric cylinders (54) fixedly connected to both sides of the top of the constraint slide plate (51), with the two electric cylinders (54) fixedly installed on the bracket (12). Each binding platform (22) has multiple suction holes (23) on the side away from the ring conveyor (21). Each binding platform (22) has a pipe-type check valve (24) fixedly installed on the opposite side of the suction hole (23). Each pipe-type check valve (24) is connected to the suction hole (23) on each binding platform (22). The valve core of each pipe-type check valve (24) is made of a material that can be magnetically attracted. One end of the frame of the ring conveyor (21) is fixedly installed below the second electric cylinder (41) with an electric cylinder (25). The telescopic end of the electric cylinder (25) is fixedly connected to a suction pipe (26). The bottom end of the suction pipe (26) is fixedly connected to a vacuum pump (13). The vacuum pump (13) is fixedly installed inside the operating table (11). Each hot press head (33) has an electric heating element (34) fixedly installed inside, and each top plate (35) has a conductive spring (37) fixedly installed on both sides. The two electrodes of each electric heating element (34) are connected to the corresponding conductive springs (37) on both sides of the top plate (35).

2. The COG fully automatic intelligent binding machine according to claim 1, characterized in that: An electromagnet (27) is fixedly connected to the end of the frame of the circular conveyor (21) away from the electric cylinder (25).

3. The COG fully automatic intelligent binding machine according to claim 2, characterized in that: Two conductive rings (44) are concentrically fixed at the bottom of the pressure plate (42), and a DC power supply (14) is fixedly installed inside the operating table (11). The two conductive rings (44) are respectively connected to the positive and negative terminals of the DC power supply (14).

4. The COG fully automatic intelligent binding machine according to claim 3, characterized in that: Conductive strips (52) are fixedly installed on both sides of the bottom of the constraint slide (51), and the two conductive strips (52) are respectively connected to the positive and negative terminals of the DC power supply (14) for conduction.

5. A COG fully automatic intelligent binding machine according to claim 4, characterized in that: It also includes a first conveyor belt (15) for transporting the glass substrate, a first suction cup robotic arm (16) for transferring the glass substrate from the first conveyor belt (15) to the bonding table (22), a second conveyor belt (17) for transporting the driver IC chip, a second suction cup robotic arm (18) for transferring the driver IC chip from the second conveyor belt (17) to the glass substrate, and a third suction cup robotic arm (19) for removing the bonded glass substrate from the bonding table (22), wherein the first conveyor belt (15) is fixedly mounted on the operating table ( 11) At the top and near one end of the electric cylinder (25), the suction cup robotic arm (16) is fixedly installed on the top of the operating table (11) and on one side of the conveyor belt (15), the conveyor belt (27) is fixedly installed on the top of the operating table (11) and on one side away from the circular conveyor (21), the suction cup robotic arm (28) is fixedly installed on the top of the operating table (11) and on one side of the conveyor belt (27), and the suction cup robotic arm (39) is fixedly installed on the top of the operating table (11) and near one end of the electromagnet (27).

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