Inductor structure and manufacturing method thereof, power supply module and power converter

Abstract

The invention discloses an inductor structure. The inductor structure comprises a substrate; the magnetic core is used for packaging the peripheries of the first winding and the second winding, the magnetic core at least exposes the upper surfaces and the lower surfaces of the first winding and the second winding, and the first winding, the second winding and the magnetic core are all arranged in the substrate. The first winding and the second winding are separated by a part of the material of the substrate; wherein the two connecting ports of the second winding are arranged on the two opposite sides of the inductance structure, and the two connecting ports of the first winding are arranged on the same side as one of the two connecting ports of the second winding. The winding structure is a vertical winding structure, and the vertical winding structure is arranged in the inductor, so that the length of the coil can be reduced, the direct-current resistance of the first winding and the direct-current resistance of the second winding are reduced, and the performance and efficiency of the inductor can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of power electronics technology, and in particular to an inductor structure and a manufacturing method thereof, a power supply module, and a power converter. Background Art

[0002] The power block currently used in the power supply solution for the next-generation high-power GPU (Graphics Processing Unit) core consists of a DRMOS (Driver and MOSFET), an inductor, a capacitor, and at least two PCBs. This structure has the disadvantages of complex assembly and high cost. Furthermore, because the inductors in the existing power block are weakly coupled or discrete inductors, the dynamic response of the inductors in the power block is poor. Summary of the Invention

[0003] In view of this, an object of the embodiments of the present invention is to provide an indirect coupled inductor structure and a manufacturing method thereof, and a power module, which can effectively solve the problems of complex assembly, high cost and poor dynamic response in the prior art.

[0004] In a first aspect, an embodiment of the present invention provides an inductor structure, comprising: a substrate; a first winding and a second winding, and a magnetic core encapsulating the first winding and the second winding, wherein the magnetic core exposes at least the upper surface and the lower surface of the first winding and the second winding, the first winding, the second winding and the magnetic core are all arranged in the substrate, and the first winding and the second winding are separated by a portion of the substrate material; wherein the two connection ports of the second winding are arranged on opposite sides of the inductor structure, and the two connection ports of the first winding are arranged on the same side as one of the two connection ports of the second winding.

[0005] Furthermore, the two connection ports of the second winding are respectively arranged on the upper surface and the lower surface of the inductor structure, and the two connection ports of the first winding are arranged on the lower surface of the inductor structure.

[0006] Furthermore, the first winding is arranged to be at least partially located on both sides of the second winding, so as to increase the coupling coefficient between the first winding and the second winding and reduce the DC impedance of the first winding and the second winding.

[0007] Furthermore, the first winding surrounds the outer circumference of the second winding.

[0008] Furthermore, the first winding and the second winding have the same central axis.

[0009] Furthermore, the second winding is configured as a columnar body, the first winding is configured as a hollow columnar body, and the cavity of the first winding is used to accommodate the second winding.

[0010] Furthermore, an equidistant distance is formed between the inner side wall of the first winding and the outer surface of the second winding.

[0011] Furthermore, the inductor structure also includes: a first metal layer located on the first surface of the substrate, a second metal layer located on the side surface of the substrate, a third metal layer located on the second surface of the substrate, and a fourth metal layer located on the second surface of the substrate, the third metal layer and the fourth metal layer being separately arranged, wherein the first end of the first winding is connected to the first connection port through the first metal layer, the second metal layer, and the third metal layer, and the second end of the first winding is connected to the second connection port through the fourth metal layer, wherein the first metal layer includes a first opening exposing the top end of the second winding, the fourth metal layer includes a second opening exposing the bottom end of the second winding, and the first surface and the second surface are opposite.

[0012] Furthermore, the fifth metal layer and the sixth metal layer are located at opposite ends of the second winding, the fifth metal layer is separated from the first metal layer, and the fifth metal layer is located inside the first opening, and the sixth metal layer is separated from the fourth metal layer, and the sixth metal layer is located inside the second opening, wherein the first end of the second winding is connected to the first connection port of the second winding through the fifth metal layer, and the second end of the second winding is connected to the second connection port of the second winding through the sixth metal layer.

[0013] Furthermore, the first winding is symmetrically arranged on two opposite sides of the second winding in the horizontal direction.

[0014] Furthermore, the first winding and the second winding are configured as a quadrangular prism structure.

[0015] Furthermore, the first winding is arranged on one side of the second winding in the horizontal direction.

[0016] Furthermore, the material of the substrate includes organic insulating material or inorganic insulating material.

[0017] Furthermore, the organic insulating material includes one or more of glass fiber cloth, epoxy resin and polyimide.

[0018] Furthermore, the magnetic core includes magnetic powder core material.

[0019] In second aspect, the present application provides a method for manufacturing an inductor structure, providing a substrate, forming a first winding and a second winding in the substrate, and forming a magnetic core encapsulated around the first winding and the second winding, the magnetic core exposing at least the upper surface and the lower surface of the first winding and the second winding, forming two connection ports of the second winding on opposite sides of the inductor structure, and forming two connection ports of the first winding on the same side as one of the two connection ports of the second winding, wherein the first winding, the second winding and the magnetic core are all located in the substrate, and the first winding and the second winding are separated by a portion of the substrate material.

[0020] Furthermore, the method for forming the first winding and the second winding in the substrate, and forming a magnetic core encapsulated around the first winding and the second winding includes: providing a first structure including a third winding and a magnetic core encapsulated around the third winding, wherein the third winding and the magnetic core are both configured as columnar structures; forming a first through hole in the third winding, the remaining portion of which is configured as the first winding; filling substrate material in the first through hole and around the magnetic core to form a substrate, the substrate exposing the upper and lower surfaces of the first and second windings; forming a second through hole in the substrate material located in the first through hole, wherein the diameter of the second through hole is smaller than the diameter of the first through hole; and filling metal material in the second through hole to form the second winding.

[0021] Furthermore, the method for forming two connection ports of the first winding includes: forming a first metal layer on the first surface of the substrate, forming a second metal layer on the side surface of the substrate, and forming a third metal layer and a fourth metal layer on the second surface of the substrate, wherein the third metal layer and the fourth metal layer are arranged separately from each other, wherein the first end of the first winding is connected to the first connection port through the first metal layer, the second metal layer and the third metal layer, and the second end of the first winding is connected to the second connection port through the fourth metal layer, wherein the first metal layer includes a first opening exposing the top end of the second winding, and the fourth metal layer includes a second opening exposing the bottom end of the second winding, and the first surface and the second surface are opposite.

[0022] Furthermore, the method for forming two connection ports of the second winding includes: forming a fifth metal layer and a sixth metal layer at the opposite ends of the second winding by an additive method, the fifth metal layer is separated from the first metal layer, and the fifth metal layer is located inside the first opening, the sixth metal layer is separated from the fourth metal layer, and the sixth metal layer is located inside the second opening, wherein the first end of the second winding is connected to the first connection port of the second winding through the fifth metal layer, and the second end of the second winding is connected to the second connection port of the second winding through the sixth metal layer.

[0023] Furthermore, the method for forming the first winding and the second winding in the substrate, and forming a magnetic core encapsulated around the first winding and the second winding includes: providing a first structure including a third winding and a magnetic core encapsulated around the third winding, wherein the third winding and the magnetic core are both arranged as columnar structures; removing part of the third winding, and filling the area of ​​the removed third winding and the periphery of the magnetic core with the material of the substrate to divide the third winding into at least two independent windings arranged in a horizontal direction.

[0024] Furthermore, when the third winding is divided into three independent windings arranged in the horizontal direction, the winding in the middle is set as the second winding, and the two windings on both sides of the second winding are set as the first winding.

[0025] Furthermore, the third winding is time-divided into two independent windings arranged in a horizontal direction, one of which is set as the second winding, and the other is set as the first winding.

[0026] Furthermore, the method of forming the first winding and the second winding in the substrate, and forming a magnetic core encapsulated around the first winding and the second winding includes: forming at least two windings that are separated and arranged side by side, with insulating material provided between the two adjacent windings, and inserting the at least two windings and the insulating material located between the two adjacent windings into a magnetic core having a through hole, and filling the periphery of the magnetic core with substrate material, wherein the substrate material exposes the upper surface and the lower surface of the first winding and the second winding.

[0027] Furthermore, when the number of the windings is three, the winding located in the middle is set as the second winding, and the two windings located on both sides of the second winding are set as the first winding.

[0028] Furthermore, when the number of the windings is two, one of the windings is set as the second winding, and the other winding is set as the first winding.

[0029] In a third aspect, the present application provides a power supply module, comprising any one of the inductor structures described in the first aspect, and further comprising a chip, wherein the chip is mounted on the substrate and electrically connected to the inductor structure.

[0030] Furthermore, it also includes capacitors and / or resistors, and the capacitors and / or resistors are installed on the substrate.

[0031] Furthermore, a metal material is electroplated on the upper surface of the chip so as to extend to the top of the package encapsulating the chip, so as to increase the heat dissipation of the chip.

[0032] In a fourth aspect, the present application provides a power converter comprising any power supply module described in the third aspect.

[0033] Compared with the prior art, the winding structure of the present application is a vertical winding structure. The vertical winding structure in the inductor can reduce the length of the coil, thereby reducing the DC resistance of the first winding and the second winding, and thus effectively improving the performance and efficiency of the inductor. In addition, the first winding is configured to be at least partially located on both sides of the second winding. Since the current of the first winding can flow into the second winding at least from both sides at the same time, the energy stored in the magnetic field between the first winding and the second winding is reduced, which can effectively improve the coupling coefficient between the first winding and the second winding, thereby reducing the transient inductance of the inductor. Further, the dynamic response speed of the power module to load changes can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0035] Figure 1a 、 2a , 3a, 4a, 5a, and 6a are structural diagrams corresponding to some steps of a method for manufacturing an inductor structure according to one embodiment of the present invention;

[0036] Figure 1b yes Figure 1a Cross-section of the inductor structure;

[0037] Figure 2b yes Figure 2a Cross-section of the inductor structure;

[0038] Figure 3b yes Figure 3a Cross-section of the inductor structure;

[0039] Figure 4b yes Figure 4a Cross-section of the inductor structure;

[0040] Figure 5b yes Figure 5a Cross-section of the inductor structure;

[0041] Figure 6b yes Figure 6a Cross-section of the inductor structure;

[0042] Figure 7 is a three-dimensional schematic diagram of an inductor structure according to one embodiment of the present invention;

[0043] Figure 8a and 8b is a structural diagram corresponding to some steps of a method for manufacturing an inductor structure according to one embodiment of the present invention;

[0044] Figure 9a and 9b is a structural diagram corresponding to some steps of a method for manufacturing an inductor structure according to one embodiment of the present invention;

[0045] Figure 10 is a three-dimensional schematic diagram of an inductor structure according to one embodiment of the present invention;

[0046] Figure 11 is a three-dimensional schematic diagram of an inductor structure according to one embodiment of the present invention;

[0047] Figure 12 is a three-dimensional schematic diagram of a power module structure according to one embodiment of the present invention;

[0048] Figure 13 yes Figure 14 The schematic diagram of the power module structure without the chip;

[0049] Figure 14 It is a three-dimensional schematic diagram of a power converter structure according to one embodiment of the present invention. DETAILED DESCRIPTION

[0050] The present invention is described below based on the following embodiments, but the present invention is not limited to these embodiments. In the detailed description of the present invention below, certain specific details are described in detail. Those skilled in the art can fully understand the present invention without these details. To avoid obscuring the essence of the present invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0051] Furthermore, persons of ordinary skill in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0052] At the same time, it should be understood that in the following description, "circuit" refers to a conductive loop composed of at least one element or subcircuit connected electrically or electromagnetically. When an element or circuit is said to be "connected to" another element or an element / circuit is said to be "connected" between two nodes, it can be directly coupled or connected to the other element or there can be intermediate elements. The connection between the elements can be physical, logical, or a combination thereof. Conversely, when an element is said to be "directly coupled to" or "directly connected to" another element, it means that there are no intermediate elements between the two.

[0053] Unless the context clearly requires otherwise, the words "including", "etc." and similar expressions throughout this application should be interpreted as meaning rather than an exclusive or exhaustive meaning; that is, as meaning "including but not limited to".

[0054] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0055] In the first aspect, the present application provides an inductor structure, such as Figure 7 、 Figure 10 、 Figure 11 As shown, it includes: a substrate (the substrate is not shown to show the structure inside the substrate); a first winding 11 and a second winding 16, and a magnetic core 12 encapsulated around the first winding 11 and the second winding 16, the magnetic core 12 exposing at least the upper surface and the lower surface of the first winding 11 and the second winding 16, the first winding 11, the second winding 16 and the magnetic core 12 are all arranged in the substrate, and the first winding 11 and the second winding 16 are separated by a portion of the substrate material 13; wherein the two connection ports of the second winding 16 are arranged on opposite sides of the inductor structure, and the two connection ports of the first winding 11 are arranged on the same side as one of the two connection ports of the second winding.

[0056] In this embodiment, the two connection ports of the second winding 16 are respectively arranged on the upper surface and the lower surface of the inductor structure, and the two connection ports of the first winding 11 are arranged on the lower surface of the inductor structure. Figure 6b and 7As shown, in this example, both connection ports of the first winding 11 are located on the lower surface of the inductor structure, and the two connection ports of the second winding 16 are respectively provided on the upper and lower surfaces of the inductor structure. In other examples, both connection ports of the first winding 11 may also be located on the upper surface of the inductor structure. This embodiment can realize a vertical inductor structure, which can reduce the length of the coil, thereby reducing the DC resistance of the first winding and the second winding, and thus effectively improving the performance and efficiency of the inductor.

[0057] In other embodiments, the first winding 11 is configured to be at least partially located on both sides of the second winding 16. Since the current of the first winding 11 can flow into the second winding 16 from both sides at the same time, the energy stored in the magnetic field between the first winding 11 and the second winding 16 is reduced, which can effectively improve the coupling coefficient between the first winding 11 and the second winding 16, thereby reducing the transient inductance of the inductor. Further, the dynamic response speed of the power module to load changes can be improved.

[0058] As an example, Figure 6b and 7 As shown, the first winding 11 surrounds the outer periphery of the second winding 16. In this example, the first winding 11 is a hollow cylinder, and the second winding 16 is located in the cavity of the first winding. Since the current of the first winding 11 can flow simultaneously from the outer periphery of the second winding 16, the energy stored in the magnetic field between the first winding 11 and the second winding 16 is reduced, thereby improving the coupling coefficient between the first winding and the second winding and reducing the DC impedance of the second winding.

[0059] Further, such as Figure 6b and 7 As shown, the first winding and the second winding have the same central axis. As an example, the first winding 11 is set as a cylindrical body with a square outside and a round inside, and the second winding 16 is set as a cylinder. The first winding 11 and the second winding 16 have the same central axis. Since the current of the first winding 11 can flow into the outer peripheral side of the second winding 16 at the same time, the energy stored in the magnetic field between the first winding 11 and the second winding 16 is reduced, and a higher coupling coefficient between the two windings can be achieved, and the transient inductance of the module is reduced, so the dynamic response speed of the power module to load changes can be improved. In other examples, such as Figure 6a As shown, the first winding 11 can also be configured as an annular cylinder, the first winding 11 is arranged outside the second winding 16, the second winding can be configured as a cylinder, and the first winding can also be a cylinder with a circular inner periphery and an outer periphery configured as another shape. The shape of the first winding is not limited here.

[0060] Furthermore, an equal distance is formed between the inner side wall of the first winding and the outer surface of the second winding. Figure 8a and 8b As shown, the currents of the first windings 11a and 11c can flow into the second winding 11b from both sides at the same time, which can reduce the energy stored in the magnetic field between the first windings 11a and 11c and the second winding 11b, thereby improving the coupling coefficient between the two windings and reducing the transient inductance of the module, so as to increase the dynamic response speed of the power module to load changes and enable the second winding to achieve a very low DC impedance.

[0061] Further, such as Figure 6b and Figure 7 As shown, the inductor structure also includes: a first metal layer 18 located on the first surface of the substrate, a second metal layer 22 located on the side surface of the substrate, and a third metal layer 21 located on the second surface of the substrate, and a fourth metal layer 19 located on the second surface of the substrate, the third metal layer 21 and the fourth metal layer 19 are separately arranged, wherein the first end of the first winding 11 is connected to the first connection port through the first metal layer 18, the second metal layer 22, and the third metal layer 21, and the second end of the first winding is connected to the second connection port through the fourth metal layer 19, wherein the first metal layer 18 includes a first opening exposing the second winding 16, the fourth metal layer 19 includes a second opening exposing the second winding 16, and the first surface and the second surface are opposite.

[0062] As an example, Figure 6b and Figure 7 As shown, a first metal layer 18 is formed on the upper surface of the substrate, with a first end of the first metal layer 18 in contact with the first end of the first winding 11. The first metal layer 18 includes a first opening exposing the second winding 16. A second metal layer 22 is formed on the side surface of the substrate, with a first end of the second metal layer 22 in contact with the second end of the first metal layer 18. A third metal layer 21 is formed on the lower surface of the substrate, with a first end of the third metal layer 21 in contact with the second end of the second metal layer 22. A fourth metal layer 19 is formed on the lower surface of the substrate, with the fourth metal layer 19 including a second opening exposing the second winding 16. The third metal layer 21 and the fourth metal layer 19 are separately provided, and the fourth metal layer 19 is in contact with the second end of the first winding 11. The first end of the first winding 11 is connected to the first connection port through the first metal layer 18, the second metal layer 22, and the third metal layer 21, and the second end of the first winding 11 is connected to the second connection port through the fourth metal layer 19.

[0063] Furthermore, the inductor structure further includes: a fifth metal layer 20 and a sixth metal layer 17 located at opposite ends of the second winding, such as Figure 6b and Figure 7 As shown, the fifth metal layer 20 is separated from the first metal layer 18, and the fifth metal layer 20 is located inside the first opening, the sixth metal layer 17 is separated from the fourth metal layer 19, and the sixth metal layer 17 is located inside the second opening, wherein the first end of the second winding is connected to the first connection port of the second winding through the fifth metal layer 20, and the second end of the second winding is connected to the second connection port of the second winding through the sixth metal layer 17.

[0064] In other embodiments, the first winding 11 and the second winding 16 are configured as a quadrangular prism structure. The first winding 11 is symmetrically arranged on two opposite sides of the second winding 16 in the horizontal direction. The current of the first winding 11 can flow into the second winding 16 from both sides at the same time, which can reduce the energy stored in the magnetic field between the first winding 11 and the second winding 16, achieve a higher coupling coefficient between the two windings, and increase the dynamic response speed of the power module to load changes. At the same time, the first winding and the second winding are configured as a vertical inductance structure, which can enable the first winding 11 and the second winding 16 to achieve very low DC impedance. As an example, Figure 8a 、 8b as well as Figure 10 As shown, two first windings 11 are symmetrically arranged on the left and right sides of the second winding 16. Furthermore, the inductor structure further includes: a first metal layer located on the first surface of the substrate, a second metal layer located on the side surface of the substrate, a third metal layer located on the second surface of the substrate, and a fourth metal layer located on the second surface of the substrate, the third metal layer and the fourth metal layer being separately arranged. The first end of the first winding is connected to the first connection port via the first metal layer, the second metal layer, and the third metal layer, and the two ends of the first winding are connected to the second connection port via the fourth metal layer. The first metal layer includes a first opening exposing the second winding, and the fourth metal layer includes a second opening exposing the second winding, with the first surface and the second surface facing each other. As an example, the first winding and the second winding can be metal quadrangular prism structures, such as flat copper wire. In other examples, the first winding 11 and the second winding 16 can also be enameled flat copper wire. When the first winding 11 and the second winding 16 are enameled flat copper wire, the insulating material between the first winding 11 and the second winding 16 can be omitted.

[0065] Furthermore, the inductor structure also includes: a fifth metal layer and a sixth metal layer located at opposite ends of the second winding, the fifth metal layer is separated from the first metal layer, and the fifth metal layer is located inside the first opening, the sixth metal layer is separated from the fourth metal layer, and the sixth metal layer is located inside the second opening, wherein the first end of the second winding is connected to the first connection port of the second winding through the fifth metal layer, and the second end of the second winding is connected to the second connection port of the second winding through the sixth metal layer.

[0066] In other embodiments, the first winding 11 and the second winding 16 are configured as a quadrangular prism structure. The first winding is configured on one side of the second winding in the horizontal direction. For example, Figure 9a 、 9b as well as Figure 11 As shown, the first winding 11 is arranged horizontally to one side of the second winding 16, with a substrate material disposed between them. Similarly, the first winding 11 and the second winding 16 can be rectangular copper wire. The first winding 11 and the second winding 16 can also be enameled rectangular copper wire. When the first winding 11 and the second winding 16 are enameled rectangular copper wire, the insulating material between the first winding 11 and the second winding 16 can be omitted. Furthermore, the inductor structure also includes a first metal layer located on the first surface of the magnetic core, a second metal layer located on the substrate material surrounding the magnetic core, a third metal layer located on the second surface of the magnetic core, and a fourth metal layer located on the second surface of the magnetic core. The third and fourth metal layers are disposed separately. The first end of the first winding is connected to the first connection port via the first, second, and third metal layers, and both ends of the first winding are connected to the second connection port via the fourth metal layer. Unlike the above example, the first metal layer does not include a first opening exposing the second winding, and the fourth metal layer does not include a second opening exposing the second winding. The first surface and the second surface are opposite each other.

[0067] In other embodiments, the substrate is made of an organic insulating material or an inorganic insulating material.

[0068] In other embodiments, the organic insulating material is one or more of glass fiber cloth, epoxy resin, and polyimide.

[0069] In other embodiments, the magnetic core comprises a magnetic powder core material. Specifically, the material of the magnetic core may also be one or more of soft ferrite, sendust, rail alloy, iron powder core, amorphous alloy, or silicon steel sheet. Preferably, the magnetic core is a magnetic powder core material comprising high magnetic flux.

[0070] In a second aspect, the present application provides a method for manufacturing an inductor structure, such as Figures 1a to 6b shown, and Figure 7 、 Figure 8a and Figure 8b 、 Figure 9a and Figure 9b 、 Figure 10 、 Figure 11 As shown, a substrate is provided, in which a first winding and a second winding are formed, and a magnetic core encapsulated around the first winding and the second winding is formed, the magnetic core at least exposing the upper surface and the lower surface of the first winding and the second winding, two connection ports of the second winding are formed on opposite sides of the inductor structure, and two connection ports of the first winding are formed on the same side as one of the two connection ports of the second winding, wherein the first winding, the second winding and the magnetic core are all located in the substrate, and the first winding and the second winding are separated by a portion of the substrate.

[0071] In this embodiment, since the first winding and the second winding are a vertical inductor structure, the vertical inductor structure can reduce the length of the coil, thereby reducing the DC resistance of the first winding and the second winding, and thus effectively improving the performance and efficiency of the inductor.

[0072] In one embodiment, Figures 1a-6b As shown, the method of forming the first winding 11 and the second winding 16 in the substrate 14, and forming the magnetic core 12 encapsulated around the first winding 11 and the second winding 16 includes: Figure 1a and 1b As shown, a first structure is provided comprising a third winding 111 and a magnetic core 12 encapsulated around the outer periphery of the third winding 111, wherein the third winding 111 and the magnetic core 12 are both configured as columnar structures. In this embodiment, the third winding is configured as a quadrangular prism, and the magnetic core encapsulates the side surface of the third winding and exposes the upper surface and the lower surface of the third winding; then, as shown Figure 2a and 2b As shown, a first through hole 10 is formed in the third winding 111, and the first through hole passes through from the upper surface of the third winding to the lower surface of the third winding. In this embodiment, the through hole is set to be cylindrical, of course, it can also be set to other cylindrical bodies. The retained part of the third winding 111 is set to the first winding 11; Figure 3a and 3b As shown, substrate materials 13 and 14 are formed in the first through hole 10 and on the periphery of the magnetic core 12 respectively; Figure 4a and 4bAs shown, a second through hole 15 is formed in the substrate material 13 located in the first through hole 10. The second through hole 15 passes through from the upper surface of the substrate material 13 to the lower surface of the substrate material 13. In this embodiment, the second through hole 15 is configured as a cylinder. The diameter of the second through hole 15 is smaller than that of the first through hole 10. Figure 5a and 5b As shown, metal material is filled in the second through hole 15 to form the second winding 16 . Preferably, the first winding 10 and the second winding 16 are made of the same material.

[0073] Furthermore, the method of forming the two connection ports of the first winding includes: Figure 6a and 6b As shown, a first metal layer 18 is formed on the first surface of the substrate 14, with the first end of the first metal layer 18 contacting the first end of the first winding 11; a second metal layer 22 is formed on the side surface of the substrate 14, with the first end of the second metal layer 22 contacting the second end of the first metal layer 18; and a third metal layer 21 and a fourth metal layer 19 are formed on the second surface of the substrate 14, wherein the third metal layer 21 is connected to the second end of the second metal layer 22, and the fourth metal layer 19 is in contact with the second end of the first winding 11, and the third metal layer 21 and the fourth metal layer 19 are disposed separately from each other. The first end of the first winding 11 is connected to the first connection port through the first metal layer 18, the second metal layer 22, and the third metal layer 21, and the second end of the first winding 11 is connected to the second connection port through the fourth metal layer 19. The first and second connection ports of the first winding 11 are located on the bottom surface of the inductor structure for electrical connection to an external circuit. Continuing to refer to 6 a and 6 b , the first metal layer 18 includes a first opening exposing the second winding 16 , the fourth metal layer 19 includes a second opening exposing the second winding 16 , and the first surface and the second surface are opposite to each other.

[0074] Furthermore, the method for forming the two connection ports of the second winding includes: continuing to refer to 6a and 6b, forming a fifth metal layer 20 and a sixth metal layer 17 at opposite ends of the second winding by an additive method, wherein the fifth metal layer 20 is separated from the first metal layer 18 and is located inside the first opening, and the sixth metal layer 17 is separated from the fourth metal layer 19 and is located inside the second opening, wherein the first end of the second winding is connected to the first connection port of the second winding through the fifth metal layer, and the second end of the second winding is connected to the second connection port of the second winding through the sixth metal layer. In this embodiment, the current of the first winding 11 can flow into the second winding 16 from the outer peripheral side at the same time, which can reduce the energy stored in the magnetic field between the first winding 11 and the second winding 16, thereby improving the coupling coefficient between the two windings and reducing the transient inductance of the module.

[0075] In other embodiments, the method of forming the first winding 11 and the second winding 16 in the substrate 14, and forming the magnetic core 12 encapsulated around the first winding 11 and the second winding 16 includes: Figure 1a and 1b As shown, a first structure is provided, including a third winding 111 and a magnetic core 12 encapsulated around the periphery of the third winding. The third winding and the magnetic core are both configured as columnar structures. In this embodiment, the third winding is configured as a quadrangular prism, and the magnetic core encapsulates the side surfaces of the third winding, exposing the upper and lower surfaces of the third winding. Subsequently, a portion of the third winding 111 is removed, and the substrate material is filled in the removed third winding area and around the periphery of the magnetic core 12 to divide the third winding into at least two independent windings arranged horizontally. The substrate material filled between the at least two independent windings is used to insulate the at least two independent windings and prevent short circuits between the at least two independent windings. In other examples, other insulating materials may also be filled to prevent short circuits between the at least two independent windings. In this example, the substrate material filling is primarily formed together with the substrate material filling around the periphery of the magnetic core 12, which can reduce process steps and greatly improve efficiency.

[0076] Furthermore, in some embodiments, Figure 8a and 8b As shown, when the third winding 111 is divided into three independent windings 11a, 11b and 11c arranged in the horizontal direction, the winding in the middle is set as the second winding 11b, and the two windings 11a and 11c on both sides of the second winding 11b are set as the first winding.

[0077] Furthermore, a seventh metal layer is formed on the first surface of the substrate 14, an eighth metal layer is formed on the side surface of the substrate 14, and a ninth metal layer and a tenth metal layer are formed on the second surface of the substrate 14, wherein the ninth metal layer and the tenth metal layer are arranged separately from each other. The first end of the first winding 11a and the first winding 11c are in contact with the first end of the seventh metal layer, the second end of the seventh metal layer is in contact with the first end of the eighth metal layer, and the second end of the eighth metal layer is in contact with the first end of the ninth metal layer. In other words, the first ends of the first winding 11a and the first winding 11c are connected to the first connection port of the first winding through the seventh metal layer, the eighth metal layer, and the ninth metal layer, and the second ends of the first winding 11a and the first winding 11c are connected to the tenth metal layer. In other words, the second ends of the first winding 11a and the first winding 11c are connected to the second connection port of the first winding through the tenth metal layer. The seventh metal layer includes a first opening exposing the first end of the second winding 11b, and the tenth metal layer includes a second opening exposing the second end of the second winding 11b. The first surface and the second surface are opposite to each other.

[0078] Furthermore, the method for forming two connection ports of the second winding includes: forming an eleventh metal layer and a twelfth metal layer at opposite ends of the second winding 11b by an additive method, the eleventh metal layer is separated from the seventh metal layer, and the eleventh metal layer is located on the inner side of the first opening, the twelfth metal layer is separated from the tenth metal layer, and the twelfth metal layer is located on the inner side of the first opening, wherein the first end of the second winding 11b is connected to the eleventh metal layer, in other words, the first end of the second winding 11b connects the first end of the second winding 11b to the first connection port of the second winding 11b through the eleventh metal layer, and the second end of the second winding 11b is connected to the twelfth metal layer, in other words, the second end of the second winding 11b connects the second end of the second winding 11b to the second connection port of the second winding 11b through the twelfth metal layer.

[0079] In this embodiment, the currents of the first windings 11a and 11c can flow into the second winding 11b simultaneously from both sides, which can reduce the energy stored in the magnetic field between the first windings 11a and 11c and the second winding 11b, thereby increasing the coupling coefficient between the two windings and reducing the transient inductance of the module.

[0080] Furthermore, in other embodiments, Figure 9a and 9b As shown, the third winding 111 is time-divided into two independent windings 11e and 11f arranged in a horizontal direction, one of which is set as the second winding 11e, and the other is set as the first winding 11f.

[0081] Furthermore, a seventh metal layer is formed on the first surface of the substrate 14, an eighth metal layer is formed on the side surface of the substrate 14, and a ninth metal layer and a tenth metal layer are formed on the second surface of the substrate 14, wherein the ninth metal layer and the tenth metal layer are arranged separately from each other. The first end of the first winding 11f contacts the first end of the seventh metal layer, the second end of the seventh metal layer contacts the first end of the eighth metal layer, and the second end of the eighth metal layer contacts the first end of the ninth metal layer. In other words, the first end of the first winding 11f is connected to the first connection port of the first winding 11f through the seventh metal layer, the eighth metal layer, and the ninth metal layer, and the second end of the first winding 11f is connected to the tenth metal layer. In other words, the second end of the first winding 11f connects the second end of the second winding 11f to the second connection port of the second winding through the tenth metal layer. Different from the above embodiment, in this embodiment, the seventh metal layer does not include a first opening exposing the first end of the second winding 11e, and the tenth metal layer does not include a second opening exposing the second end of the second winding 11e. The first surface and the second surface are opposite.

[0082] Furthermore, the method for forming two connection ports of the second winding includes: forming an eleventh metal layer and a twelfth metal layer at the opposite ends of the second winding 11e by an additive method, wherein the eleventh metal layer is connected to the first end of the second winding 11e, and the first end of the second winding 11e connects the first end of the second winding 11e to the first connection port of the second winding 11e through the eleventh metal layer, and the twelfth metal layer is connected to the second end of the second winding 11e, and the second end of the second winding 11e connects the second end of the second winding 11e to the second connection port of the second winding 11e through the twelfth metal layer.

[0083] In another embodiment, a method for forming a first winding and a second winding in the substrate, and forming a magnetic core encapsulated around the first winding and the second winding, includes: first forming at least two separate windings arranged side by side, with an insulating material disposed between adjacent windings, and inserting the at least two windings and the insulating material disposed between the two adjacent windings into a magnetic core having a through hole. Then, a substrate material is filled around the periphery of the magnetic core, with the substrate material exposing the upper and lower surfaces of the first winding and the second winding. In this embodiment, the first winding and the second winding can be metal wires, such as copper wire, aluminum wire, silver wire, or gold wire, or other alloy wires, not listed here. In other embodiments, the first winding and the second winding can also be segmented metal cylinders. The cylinders here can be cylindrical or rectangular. The shape of the windings is not limited here. Similarly, the insulating material disposed between adjacent windings is also used to prevent short circuits between the two windings. In this example, the space between two adjacent windings is filled with substrate material. This is primarily because the substrate material between the two adjacent windings and the substrate material surrounding the magnetic core 12 can be formed together, reducing process steps and significantly improving efficiency. In other examples, other insulating materials can also be used to prevent short circuits between adjacent windings.

[0084] In other examples, the two adjacent windings may also be enameled wires, which are composed of two parts: a conductor and an insulating layer. The bare wire is annealed and softened, then painted multiple times, and baked. Enameled wires are affected by factors such as the quality of raw materials, process parameters, production equipment, and the environment. Therefore, the quality characteristics of various enameled wires are different, but they all have four major properties: mechanical properties, chemical properties, electrical properties, and thermal properties. In this embodiment, the enameled wire includes both a conductor and an insulating layer wrapped around the outside of the conductor. Therefore, there is no need to set up an insulating material separately between the two adjacent windings, and the enameled wire can greatly save process manufacturing steps. In this embodiment, the insulating paint of the two adjacent enameled wires can prevent a short circuit between the two. In this example, the use of enameled wires instead of ordinary metal wires can greatly save process costs.

[0085] Preferably, in one example, Figure 8a and 8bAs shown, three separate and side-by-side windings 11a, 11b, and 11c are first formed. The winding in the middle is set as the second winding 11b, and the two windings on either side of the second winding 11b are set as the first windings 11a and 11c. Insulating material is provided between two adjacent windings, and the three windings 11a, 11b, and 11c and the insulating material between the two adjacent windings are inserted into a magnetic core 12 having a through hole. A substrate 14 material is then filled around the periphery of the magnetic core 12, and the substrate 14 material exposes the upper and lower surfaces of the first windings 11a and 11c and the second winding 11b. In this example, the second winding 11b and the first windings 11a and 11c can also be set as ordinary metal wires. Insulating material is required between the first winding 11a and the second winding 11b, and between the second winding 11b and the first winding 11c. The insulating material here can be the substrate material or other insulating materials, and there is no limitation on the insulating material. In other examples, the second winding 11b and the first windings 11a and 11c may also be configured as enameled wires, and no insulating material is required between two adjacent windings.

[0086] Furthermore, a seventh metal layer is formed on the first surface of the substrate 14, an eighth metal layer is formed on the side surface of the substrate 14, and a ninth metal layer and a tenth metal layer are formed on the second surface of the substrate 14, wherein the ninth metal layer and the tenth metal layer are arranged separately from each other. The first end of the first winding 11a and the first winding 11c are in contact with the first end of the seventh metal layer, the second end of the seventh metal layer is in contact with the first end of the eighth metal layer, and the second end of the eighth metal layer is in contact with the first end of the ninth metal layer. In other words, the first end of the first winding 11a and the first winding 11c are connected to the first connection port of the first winding through the seventh metal layer, the eighth metal layer and the ninth metal layer, the second end of the first winding 11a and the first winding 11c are connected to the tenth metal layer, and the second end of the first winding 11a and the first winding 11c are connected to the second connection port of the first winding through the tenth metal layer, wherein the seventh metal layer includes a first opening exposing the first end of the second winding 11b, the tenth metal layer includes a second opening exposing the second end of the second winding 11b, and the first surface and the second surface are opposite to each other. Furthermore, the method for forming two connection ports of the second winding includes: forming an eleventh metal layer and a twelfth metal layer at opposite ends of the second winding 11b by an additive method, the eleventh metal layer is separated from the seventh metal layer, and the eleventh metal layer is located on the inner side of the first opening, the twelfth metal layer is separated from the tenth metal layer, and the twelfth metal layer is located on the inner side of the first opening, wherein the first end of the second winding 11b is connected to the eleventh metal layer, in other words, the first end of the second winding 11b is connected to the first connection port of the second winding 11b through the eleventh metal layer, and the second end of the second winding 11b is connected to the twelfth metal layer, in other words, the second end of the second winding 11b is connected to the second connection port of the second winding 11b through the twelfth metal layer.

[0087] Preferably, in another example, Figure 9a and 9b As shown, when there are two windings, one winding is set as the second winding 11e, and the other winding 11f is set as the first winding. Similarly, the first winding and the second winding here can also be metal wires, or divided metal columns, or enameled wires, which will not be repeated here.

[0088] Furthermore, a seventh metal layer is formed on the first surface of the substrate 14, an eighth metal layer is formed on the side surface of the substrate 14, and a ninth metal layer and a tenth metal layer are formed on the second surface of the substrate 14, wherein the ninth metal layer and the tenth metal layer are separated from each other. Similarly, the first end of the first winding 11f is connected to the first connection port of the first metal layer through the seventh metal layer, the eighth metal layer, and the ninth metal layer, the second end of the first winding 11f is connected to the tenth metal layer, and the second end of the first winding 11f is connected to the second connection port of the first winding through the tenth metal layer. However, unlike the above embodiment, in this embodiment, the seventh metal layer does not include a first opening exposing the first end of the second winding 11b, and the tenth metal layer does not include a second opening exposing the second end of the second winding 11b, and the first surface and the second surface are opposite to each other.

[0089] Furthermore, the method for forming two connection ports of the second winding includes: forming an eleventh metal layer and a twelfth metal layer at opposite ends of the second winding 11b by an additive method, wherein the eleventh metal layer is connected to the first end of the second winding 11b, and the first end of the second winding 11b is connected to the first connection port of the second winding 11b through the eleventh metal layer, and the twelfth metal layer is connected to the second end of the second winding 11b, and the second end of the second winding 11b is connected to the second connection port of the second winding 11b through the twelfth metal layer.

[0090] In a third aspect, the present application provides a power module structure, such as Figure 12 As shown, the power module structure includes any of the inductor structures described in the first aspect, and also includes a chip 21, which is mounted on the substrate and electrically connected to the inductor structure. Specifically, the chip is mounted above the inductor structure. In this embodiment, the chip is electrically connected to the first connection port of the second winding.

[0091] In other embodiments, the power module structure further includes a capacitor and / or a resistor, and the capacitor and / or the resistor are mounted on the substrate, specifically, above the inductor structure.

[0092] In other embodiments, the power module includes a multi-phase structure. In this embodiment, four phases are used as an example. Figure 13 and Figure 14As shown, the power supply module includes four identical inductance structures. Different from the above embodiment, the four inductance structures share a magnetic core 12, wherein the first connection port of the first winding of the first inductance structure is connected to the second connection port of the first winding of the fourth inductance structure, the first connection port of the first winding of the second inductance structure is connected to the second connection port of the first winding of the first inductance structure, the first connection port of the first winding of the third inductance structure is connected to the second connection port of the first winding of the second inductance structure, and the first connection port of the first winding of the fourth inductance structure is connected to the second connection port of the first winding of the third inductance structure. The power supply module also includes four chips 21. The first connection port of the second winding of the first inductance structure is connected to the first chip 21, the first connection port of the second winding of the second inductance structure is connected to the second chip 21, the first connection port of the second winding of the third inductance structure is connected to the third chip 21, and the first connection port of the second winding of the fourth inductance structure is connected to the fourth chip 21. The second connection port of the second winding of the first inductance structure, the second connection port of the second winding of the second inductance structure, the second connection port of the second winding of the third inductance structure, and the second connection port of the second winding of the fourth inductance structure are all connected to the ground terminal.

[0093] Specifically, such as Figure 14 As shown, the chip can be an SMT chip or other types of chips. In this embodiment, the chip 21 is mounted on top of the substrate, and its surface can contact the external system heat sink, which helps to improve the heat dissipation effect of the chip 21. In other embodiments, metal material can be electroplated on the upper surface of the chip 21 through a packaging process, so that it extends to the top of the package encapsulating the chip 21, thereby further improving the heat dissipation effect of the chip.

[0094] In other embodiments, the power module further includes components such as resistors and / or capacitors, and the resistors and / or capacitors are mounted on a substrate.

[0095] In a fourth aspect, the present application provides a power converter, wherein the power converter includes the power module structure described in the third aspect.

[0096] Compared with the prior art, the winding structure of the present application is a vertical winding structure. The vertical winding structure in the inductor can reduce the length of the coil, thereby reducing the DC resistance of the first winding and the second winding, and thus effectively improving the performance and efficiency of the inductor. In addition, the first winding is arranged to be at least partially located on both sides of the second winding. Since the current of the first winding can flow into at least both sides of the second winding at the same time, the energy stored in the magnetic field between the first winding and the second winding is reduced, which can effectively improve the coupling coefficient between the first winding and the second winding, thereby reducing the transient inductance of the inductor, and further improving the dynamic response speed of the power module to load changes. Third, the chip is mounted on the top of the substrate, and its surface can be in contact with the external system heat sink, which helps to improve the heat dissipation effect of the chip. It is also possible to electroplate metal material on the upper surface of the chip through the packaging process so that it extends to the top of the package that encapsulates the chip to further increase the heat dissipation effect of the chip.

[0097] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall fall within the scope of protection of the present invention.

Claims

1. An inductor structure, characterized in that: include: substrate; a first winding and a second winding, and A magnetic core encapsulating the periphery of the first winding and the second winding, wherein the magnetic core at least exposes the upper surface and the lower surface of the first winding and the second winding, The second winding and the magnetic core are both arranged in the substrate, and the first winding and the second winding are separated by a portion of the substrate material; The two connection ports of the second winding are arranged on opposite sides of the inductor structure, and the two connection ports of the first winding are arranged on the same side as one of the two connection ports of the second winding.

2. The inductor structure according to claim 1, characterized in that The two connection ports of the second winding are respectively arranged on the upper surface and the lower surface of the inductor structure, and the two connection ports of the first winding are arranged on the lower surface of the inductor structure.

3. The inductor structure according to claim 1, wherein: The first winding is arranged to be at least partially located on both sides of the second winding, so as to improve the coupling coefficient between the first winding and the second winding and reduce the DC impedance of the first winding and the second winding.

4. The inductor structure according to claim 3, characterized in that: The first winding is wound around the outer circumference of the second winding.

5. The inductor structure according to claim 4, characterized in that: The first winding and the second winding have the same central axis.

6. The inductor structure according to claim 4, characterized in that: The second winding is configured as a columnar body, the first winding is configured as a hollow columnar body, and the cavity of the first winding is used to accommodate the second winding.

7. The inductor structure according to claim 4, characterized in that: An equidistant distance is formed between the inner sidewall of the first winding and the outer surface of the second winding.

8. The inductor structure according to claim 1, wherein: The inductor structure further includes: a first metal layer located on the first surface of the substrate, a second metal layer located on a side surface of the substrate, a third metal layer located on the second surface of the substrate, A fourth metal layer is located on the second surface of the substrate, and the third metal layer and the fourth metal layer are separately arranged. The first end of the first winding is connected to the first connection port through the first metal layer, the second metal layer, and the third metal layer. The second end of the first winding is connected to the second connection port through the fourth metal layer, The first metal layer includes a first opening exposing the top end of the second winding, and the fourth metal layer includes a second opening exposing the bottom end of the second winding. The first surface and the second surface are opposite to each other.

9. The inductor structure according to claim 8, characterized in that: a fifth metal layer and a sixth metal layer located at opposite ends of the second winding, the fifth metal layer being separated from the first metal layer and located inside the first opening, the sixth metal layer being separated from the fourth metal layer and located inside the second opening, The first end of the second winding is connected to the first connection port of the second winding through the fifth metal layer, and the second end of the second winding is connected to the second connection port of the second winding through the sixth metal layer.

10. The inductor structure according to claim 3, characterized in that: The first winding is symmetrically arranged on two opposite sides of the second winding in the horizontal direction.

11. The inductor structure according to claim 1, wherein: The first winding and the second winding are configured as a quadrangular prism structure.

12. The inductor structure according to claim 1, wherein: The first winding is arranged on one side of the second winding in a horizontal direction.

13. The inductor structure according to claim 1, wherein: The material of the substrate includes an organic insulating material or an inorganic insulating material.

14. The inductor structure according to claim 13, wherein: The organic insulating material includes one or more of glass fiber cloth, epoxy resin and polyimide.

15. The inductor structure according to claim 1, wherein: The magnetic core includes magnetic powder core material.

16. A method for manufacturing an inductor structure, characterized in that: Providing a substrate, forming a first winding and a second winding in the substrate, and forming a magnetic core enclosed around the first winding and the second winding, The magnetic core at least exposes the upper surface and the lower surface of the first winding and the second winding, forming two connection ports of the second winding on opposite sides of the inductor structure, and forming two connection ports of the first winding on the same side as one of the two connection ports of the second winding, The first winding, the second winding and the magnetic core are all located in the substrate, and the first winding and the second winding are separated by a portion of the substrate material.

17. The manufacturing method according to claim 16, characterized in that: The method of forming a first winding and a second winding in the substrate, and forming a magnetic core encapsulated around the first winding and the second winding includes: Providing a first structure including a third winding and a magnetic core encapsulated around the third winding, wherein the third winding and the magnetic core are both configured as columnar structures; forming a first through hole in the third winding, with the remaining portion thereof being provided as the first winding; Filling the first through hole and the periphery of the magnetic core with a substrate material to form a substrate, wherein the substrate exposes the upper surface and the lower surface of the first winding and the second winding; forming a second through hole in the substrate material located in the first through hole, wherein the diameter of the second through hole is smaller than the diameter of the first through hole; The second through hole is filled with metal material to form the second winding.

18. The manufacturing method according to claim 17, characterized in that: The method of forming the two connection ports of the first winding includes: A first metal layer is formed on the first surface of the substrate, a second metal layer is formed on the side surface of the substrate, and a third metal layer and a fourth metal layer are formed on the second surface of the substrate, wherein the third metal layer and the fourth metal layer are separated from each other. The first end of the first winding is connected to the first connection port through the first metal layer, the second metal layer and the third metal layer. The second end of the first winding is connected to the second connection port through the fourth metal layer, The first metal layer includes a first opening exposing the top end of the second winding, and the fourth metal layer includes a second opening exposing the bottom end of the second winding. The first surface and the second surface are opposite to each other.

19. The manufacturing method according to claim 18, characterized in that: The method of forming the two connection ports of the second winding includes: A fifth metal layer and a sixth metal layer are respectively formed at opposite ends of the second winding by an additive method, wherein the fifth metal layer is separated from the first metal layer and located inside the first opening, and the sixth metal layer is separated from the fourth metal layer and located inside the second opening. The first end of the second winding is connected to the first connection port of the second winding through the fifth metal layer, and the second end of the second winding is connected to the second connection port of the second winding through the sixth metal layer.

20. The manufacturing method according to claim 15, characterized in that The method of forming a first winding and a second winding in the substrate, and forming a magnetic core encapsulated around the first winding and the second winding includes: Providing a first structure including a third winding and a magnetic core encapsulated around the third winding, wherein the third winding and the magnetic core are both configured as columnar structures; A portion of the third winding is removed, and the area of ​​the removed third winding and the periphery of the magnetic core are filled with the material of the substrate, so as to divide the third winding into at least two independent windings arranged in a horizontal direction.

21. The manufacturing method according to claim 20, characterized in that: When the third winding is divided into three independent windings arranged in the horizontal direction, The winding located in the middle is set as the second winding, and the two windings located on both sides of the second winding are set as the first winding.

22. The manufacturing method according to claim 20, characterized in that The third winding is time-divided into two independent windings arranged in the horizontal direction, One of the windings is set as the second winding, and the other winding is set as the first winding.

23. The manufacturing method according to claim 15, characterized in that The method of forming a first winding and a second winding in the substrate, and forming a magnetic core encapsulated around the first winding and the second winding includes: At least two windings are formed that are separated and arranged side by side, with an insulating material provided between the two adjacent windings. and inserting the at least two windings and the insulating material between two adjacent windings into a magnetic core having a through hole. A substrate material is filled around the periphery of the magnetic core, and the substrate material exposes the upper surface and the lower surface of the first winding and the second winding.

24. The manufacturing method according to claim 23, characterized in that When the number of the windings is three, The winding located in the middle is set as the second winding, and the two windings located on both sides of the second winding are set as the first winding.

25. The manufacturing method according to claim 23, characterized in that When the number of the windings is two, One of the windings is set as the second winding, and the other winding is set as the first winding.

26. A power supply module, characterized in that: comprising at least one inductor structure according to any one of claims 1 to 14, It also includes a chip, which is mounted on the substrate and electrically connected to the inductor structure.

27. The power module according to claim 26, wherein: It also includes capacitors and / or resistors, which are mounted on the substrate.

28. The power module according to claim 26, wherein: A metal material is electroplated on the upper surface of the chip so as to extend to the top of the package enclosing the chip, so as to increase the heat dissipation of the chip.

29. A power converter, characterized in that: Includes any power supply module described in claims 26-28.

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