Preparation device of wafer-level two-dimensional material film

Abstract

The invention relates to two-dimensional material preparation, in particular to a wafer-level two-dimensional material film preparation device which comprises a substrate loading and transporting device, a film stripping mechanism, a staged pressurizing and attaching mechanism and a preparation table. A wafer substrate storage cavity is arranged on the preparation table, and a growth reaction chamber is arranged on the preparation table; the substrate loading and transporting equipment is used for picking up the wafer substrate from the wafer substrate storage cavity and placing the wafer substrate in the growth reaction chamber; the growth reaction chamber is used for preparing a two-dimensional material film, so that the two-dimensional material film is deposited on a wafer substrate; a film transfer is arranged on the preparation table; the problems of tearing risk caused by mechanical stress concentration during two-dimensional material film transfer, interface defects caused by non-uniform adhesive tape bonding pressure, wafer substrate damage caused by traditional clamping, low manual operation efficiency and the like are solved, the film breakage rate is remarkably reduced, the interface bonding uniformity and the transfer yield are improved, and the product quality is improved. And high-efficiency nondestructive preparation of the wafer-level two-dimensional material is realized.

Description

Technical Field

[0001] The present invention relates to the preparation of two-dimensional materials, and in particular to a device for preparing wafer-level two-dimensional material films. Background Art

[0002] Two-dimensional material films refer to thin film materials formed by the arrangement of atoms or molecules on a two-dimensional plane, with a thickness of only a single atomic layer or a few atomic layers. Common two-dimensional materials include graphene, transition metal dichalcogenides, hexagonal boron nitride, black phosphorus, etc. Common preparation methods include mechanical exfoliation: obtaining a single layer or a few layers of two-dimensional materials by tape exfoliation, which is suitable for laboratory research; chemical vapor deposition (CVD): growing large-area, high-quality two-dimensional material films on a substrate, which is suitable for industrial production; liquid phase exfoliation: dispersing the bulk material in a solvent and exfoliating it into thin layers by ultrasound or shear force; epitaxial growth: preparing two-dimensional materials on a specific substrate by controlling the growth conditions.

[0003] However, its wafer-level large-scale preparation still faces technical bottlenecks, especially in the process of peeling the film from the growth substrate and transferring it to the target substrate. The film can easily be damaged, wrinkled or contaminated due to problems such as uneven mechanical stress and improper adhesion control, which seriously restricts device performance and yield.

[0004] Currently, the mainstream technology mostly uses tape-assisted stripping, but it has the following key defects:

[0005] High risk of film tearing: Traditional one-time peeling methods are prone to stress concentration due to sudden changes in local adhesion, especially at film edges or defects, causing uncontrolled tearing;

[0006] Insufficient pressure control during tape lamination: Existing lamination devices mostly use constant pressure or simple pressurization mode. The pressure changes too quickly or is unevenly distributed, which can easily damage the film or generate bubbles, affecting the interface bonding quality.

[0007] Low substrate transfer accuracy: Since the surface of the wafer is extremely fragile and easily damaged, the traditional clamping method can easily cause the wafer to deform, bend, and break. This can also lead to uneven growth of the second-order material film, affecting the film quality. When loading the wafer, it relies on mechanical clamping or a single adsorption point, which can easily cause the substrate to deform or shift, resulting in subsequent film alignment errors.

[0008] Limited degree of automation: The modules of the equipment have poor coordination, and the peeling and attaching processes rely on manual intervention, making it difficult to achieve efficient and repeatable operations. Summary of the Invention

[0009] This invention provides a wafer-scale two-dimensional material film preparation device. The technical problems addressed during the transfer of two-dimensional material films include: the risk of tearing caused by mechanical stress concentration, interface defects caused by uneven tape bonding pressure, wafer substrate damage caused by traditional clamping, and low manual operation efficiency. Through a phased peeling mechanism, staged progressive pressure bonding, a non-contact adsorption system based on the Bernoulli principle, and a fully automated process design, the device significantly reduces film breakage, improves interface bonding uniformity and transfer yield, and achieves efficient and non-destructive preparation of wafer-scale two-dimensional materials.

[0010] In order to achieve the above-mentioned purpose of the invention, the technical solution adopted by the present invention is: a device for preparing a wafer-level two-dimensional material film, including a substrate loading and transporting device, a film peeling mechanism, a stage-type pressurization attachment mechanism and a preparation table; the preparation table is provided with a wafer substrate storage cavity, and the preparation table is provided with a growth reaction chamber; the substrate loading and transporting device is used to pick up the wafer substrate from the wafer substrate storage cavity and place it in the growth reaction chamber; the growth reaction chamber is used to prepare a two-dimensional material film, so that the two-dimensional material film is deposited on the wafer substrate; the preparation table is provided with a film transfer table, which is used to peel off the generated two-dimensional material film from the wafer substrate and transfer it to the operating platform on the target substrate; the film peeling mechanism is used to peel off the two-dimensional material film from the wafer substrate by means of a peeling tape, and the peeling tape and the two-dimensional material film are pressed together by the stage-type pressurization attachment mechanism to improve the adsorption force of the tape on the film, thereby improving the peeling effect;

[0011] The film peeling mechanism includes a first mechanical arm and a peeler, wherein the peeler is arranged on the first mechanical arm, and the first mechanical arm has multi-dimensional movable and adjustable freedom, which can drive the peeler to move and adjust the position, thereby facilitating the peeling operation;

[0012] The staged pressurized attachment mechanism includes a second robotic arm and a pressurized attacher. The pressurized attacher is mounted on the second robotic arm. The second robotic arm has multi-dimensional movable and adjustable freedom, which can drive the pressurized attacher to move and adjust its position, thereby facilitating the attachment operation.

[0013] Furthermore, in view of the characteristics of the two-dimensional material film, in order to ensure that the film does not tear during the peeling and transfer process, in this solution, a pre-peeling method is adopted, first the periphery of the film is peeled off to release the initial adhesion of the film, and then the whole film is peeled off, thereby reducing the probability of tearing that may occur during peeling. The stripper includes an outer nozzle, a center nozzle and a nozzle shell, the outer nozzle is annular and is arranged at the bottom of the nozzle shell, the center nozzle is located on the inner side of the outer nozzle, and the outer nozzle and the center nozzle are provided with uniformly distributed adsorption holes, and the nozzle shell is provided with a first vacuum pump and a second vacuum pump, the first vacuum pump is connected to the outer nozzle through an air duct, and the second vacuum pump is connected to the center nozzle through an air duct;

[0014] In this solution, the film is peeled off through two steps of pre-peeling and full peeling. Therefore, when the outer nozzle adsorbs the outer periphery of the tape, there is a certain gap between the central nozzle and the center of the tape. In order to enable the two to be adsorbed, the central nozzle is set to be slidable, and an adsorption regulator is provided in the nozzle shell, and the adsorption regulator is connected to the central nozzle.

[0015] Furthermore, the adsorption regulator includes an adjusting shaft, a fixed sleeve and an adjusting telescopic tube, the adjusting telescopic tube is telescopically slidable in the fixed sleeve, the adjusting telescopic tube and the fixed sleeve are kept in linear sliding by a slide bar and a slide groove, the adjusting telescopic tube is connected to the center suction head, a connecting middle plate is provided in the fixed sleeve, a first adjusting section and a second adjusting section are provided on the adjusting shaft, the first adjusting section is threadedly connected to the connecting middle plate, the second adjusting section is threadedly connected to the adjusting telescopic tube, a connecting gear is provided on the adjusting shaft, a driving gear column is provided in the fixed sleeve, the driving gear column is meshed with the connecting gear, and a control driving gear is provided in the fixed sleeve. The reduction motor assembly of the column, the length of the driving gear column is greater than the length of the first adjustment section and the second adjustment section, and the adjusting shaft is driven to rotate by the driving gear column, and then the adjusting shaft moves relative to the fixed sleeve, and the telescopic tube is adjusted to move relative to the adjusting shaft. The pitch of the first adjustment section and the second adjustment section are different, and the pitch of the first adjustment section is greater than the pitch of the second adjustment section. Therefore, in the pre-peeling stage of the film, the peripheral part must be peeled in advance, and in order to avoid peeling rupture, the peeling amplitude cannot be too large, and the center suction head needs to touch the unpeeled film. Therefore, the adsorption regulator can be fine-tuned to control the telescopic movement of the center suction head in a micro distance.

[0016] Furthermore, in order to improve the efficiency of peeling the film, after the outer periphery of the film is peeled off, an auxiliary air flow is blown into the angle between the opened film and the wafer base, so that when the center suction head peels off the remaining film, it can not only avoid damaging the film, but also assist the center suction head to peel off the remaining part completely; the suction head shell is provided with an expansion mechanism, the expansion mechanism includes an expansion arm, an expansion turntable and a fixed disc, the suction head shell is provided with a plurality of embedded slots, the expansion arm is a right-angle arm, and is slidably arranged in the embedded slot, the bottom of the expansion arm is provided with an extension cylinder, the bottom of the extension cylinder is provided with a nozzle, the nozzle is provided with an injection hole, the nozzle body is provided with a jet pump, and gas is ejected through the injection hole, when the expansion arm is controlled to expand and move in all directions, the expansion arm slides out of the embedded slot, and controls the nozzle to move to the position where the film is pre-peeled and opened by the extension cylinder, and sprays air to the opened angle, so as to assist the center suction head to peel off the film more efficiently;

[0017] The fixed disc is fixedly set, and the expansion turntable is rotatably set in the fixed disc. The fixed disc is provided with multiple linear slides, and the expansion turntable is provided with multiple arc slides. Multiple telescopic connecting rods are provided in the fixed disc for sliding and telescopic movement, and the telescopic connecting rod can extend out of the fixed disc. Limit sliding heads are provided on the upper and lower parts of the telescopic connecting rod, and the two limit sliding heads are respectively slidably set in the arc slide and the linear slide. When the expansion turntable rotates, the telescopic connecting rod is pushed out of the fixed disc through the pushing action of the arc slide and the limiting action of the linear slide. The telescopic connecting rod is connected to the expansion arm, and the expansion arm is expanded by the setting of the expansion mechanism.

[0018] Furthermore, in order to further improve the peeling effect, when the gas jet is sprayed on the pre-peeled film, the gas jet is controlled to rotate around the film, thereby more evenly improving the jetting and peeling effect; a rotating disk is rotatably provided on the suction head housing, and the expansion mechanism is located inside the rotating disk. By controlling the rotation of the rotating disk, the entire expansion mechanism and the gas jet can be driven to rotate;

[0019] A placement plate is provided in the suction head housing, a connecting column is provided on the placement plate, an opening is provided in the center of the rotating disk, the rotating disk is rotatably arranged on the connecting column, a first set of gear rings is provided on the rotating disk, the first set of gear rings is sleeved on the outside of the connecting column, a rotary spray gear meshingly connected to the first set of gear rings is provided on the placement plate, a rotary spray motor is provided on the placement plate, and the rotary spray motor is connected to the rotary spray gear;

[0020] The expansion turntable and the fixed disc are both provided with openings in their centers, and the connecting post passes through the expansion turntable, the fixed disc, and the rotating disc, and is connected to the first robotic arm;

[0021] The expansion turntable is provided with a second set of gear rings, which are sleeved on the outside of the connecting column. The fixed disc is provided with an expansion gear that is meshed and connected with the second set of gear rings. The fixed disc is fixed with an expansion motor, which is connected to the expansion gear.

[0022] Furthermore, when the spray gas is spraying the film, by controlling the up and down movement of the spray gas, a force for moving the film up and down can be applied to the film that has been peeled off, further improving the effect of peeling the film; the spray gas includes a fixed block and a floating block, the floating block is provided with a jet hole, the floating block is provided with an air column connected to the jet hole, and the air column slides into the fixed block, and the fixed block is provided with a jet pump, and the jet pump is connected to the air column via a telescopic tube, and then ejects gas through the jet hole;

[0023] A spring is provided in the fixed block and is sleeved on the air column. A floating wheel is provided for rotation in the fixed block. The floating wheel rotates eccentrically. A floating frame is sleeved on the outside of the floating wheel. The upper and lower sides of the floating frame are in contact with the floating wheel. When the floating wheel rotates, it does not contact the two sides of the floating frame. A floating rod is provided on the floating frame. The floating rod slides through the fixed block and is connected to the floating block.

[0024] Furthermore, a first electric lifter and a micro lifter are provided between the first robotic arm and the stripper, which respectively control the large-scale lifting and micro-distance lifting of the stripper, thereby facilitating the control of micro-distance adjustment during stripping and the rapid transfer after the overall stripping; the micro lifter and the adsorption regulator have the same structure and function, both of which are used to achieve micro-distance telescopic control.

[0025] On the other hand, in the process of attaching the tape and the film, in order to increase the adsorption force of the tape on the film, it is necessary to apply pressing force to the tape. In order to avoid damage to the film due to excessive pressure and rapid changes, a stage-type pressurized attachment mechanism is set up, which has a solid step-by-step pressurization effect. The pressurized attacher includes a pressing wheel, an air adjustment pump and a wheel frame. The pressing wheel is rotatably arranged on the wheel frame. The pressing wheel is an inflatable wheel. The air adjustment pump is connected to the pressing wheel and adjusts and controls the air pressure of the pressing wheel. When the air pressure is low, the pressing wheel is softer, and the pressure when pressing the film is small. When the air pressure is high, the pressing wheel is harder, and the pressure pressing the film becomes larger. By gradually controlling the air pressure, a gradually pressurized compacting effect is achieved.

[0026] In order to achieve the connection between the inflation regulating pump and the pressing wheel, a hollow rotating shaft is provided on the pressing wheel, an air channel is provided in the wheel frame, and the rotating shaft and the air channel of the wheel frame are connected through a rotating sealing joint, and the inflation regulating pump and the air channel in the wheel frame are connected.

[0027] Furthermore, in order to achieve omnidirectional pressing of the pressing wheel, a covering drive mechanism is provided between the second robotic arm and the pressurized applicator, comprising a cover body, an x-direction screw, a y-direction screw, a movable long plate and a movable block, wherein the x-direction screw is rotatably arranged on the cover body, the movable long plate is slidably arranged on the cover body, the movable long plate is threadedly connected to the x-direction screw, the y-direction screw is rotatably arranged on the movable long plate, the movable block is slidably arranged on the movable long plate, the movable block is threadedly connected to the y-direction screw, the x-direction screw is driven by a reduction motor group in the cover body, the y-direction screw is driven by a reduction motor group in the movable long plate, the x-direction screw and the y-direction screw are perpendicular to each other, the pressurized applicator is provided on the movable block, and the pressurized applicator is driven by the covering drive mechanism to move to cover the entire tape, thereby achieving pressing of the entire tape;

[0028] In addition, the second mechanical arm is provided with a second electric lifter to control the lifting and lowering movement of the booster applicator.

[0029] Furthermore, the substrate loading and transportation equipment includes a lifting cylinder, an operating top plate, a first control component, a second control component, an absorber and a centering device. The operating top plate is fixedly arranged on the driving end of the lifting cylinder piston rod. The first control component and the second control component are both arranged on the operating top plate. The centering device is arranged on the first control component, and the absorber is arranged on the second control component. The first control component controls the position movement of the centering device. The centering device is used to detect and identify the center of the wafer substrate, and then it can be picked up from the center of the wafer during transportation, thereby ensuring the levelness and stability of the wafer to avoid damage and deformation. The absorber is used to absorb the wafer substrate to avoid deformation and damage of the wafer by clamping.

[0030] Furthermore, the first control component includes control arm 1, control arm 2 and control arm 3, the control arm 1 is rotatably mounted on the operating top plate, the control arm 2 is rotatably mounted on control arm 1, the control arm 3 is rotatably mounted on control arm 2, and the centering device is fixedly mounted on control arm 3; the second control component includes control arm 4, control arm 5 and control arm 6, the control arm 4 is rotatably mounted on the operating top plate, the control arm 5 is rotatably mounted on control arm 4, the control arm 6 is rotatably mounted on control arm 5, and the adsorber is fixedly mounted on control arm 6; the horizontal position of the centering device is higher than that of the adsorber.

[0031] Furthermore, the centering device includes a centering arm, a centering disk, a sliding block and an inductive sensor. The centering disk is arranged on the centering arm, and a plurality of slide grooves radiating from the center to the surrounding areas are provided on the centering disk. The sliding block is arranged in the slide groove, and the inductive sensor is arranged on the sliding block. By controlling the inductive sensor to detect the change of the edge of the substrate, the edge and position of the substrate are determined, and the center position of the substrate is obtained by center calculation. In an embodiment, the center position of the substrate is calculated by computing software such as OpenCV (open source computer vision library), MATLAB, Python (NumPy+SciPy), etc.

[0032] Furthermore, the adsorber includes an adsorption arm, an adsorption ring fork and an adsorption system. The adsorption ring fork is a ring-shaped fork and is arranged on the adsorption arm. The adsorption system is arranged inside the adsorption ring fork. The adsorption system includes a third vacuum pump, a microchannel and an adsorption head. The adsorption head is arranged on the top of the adsorption ring fork. The microchannel is arranged inside the adsorption ring fork and the adsorption arm, and is connected to the third vacuum pump. Suction is generated through the adsorption system to adsorb and move the substrate.

[0033] When transferring the substrate, the center position of the substrate is found by the centering device, and then the substrate is adsorbed from the center of the substrate by the adsorber, thereby keeping the substrate stable during the transfer process, thereby preventing the substrate from bending and deformation.

[0034] In another embodiment, different from the above, the adsorption system is replaced by a reverse system structure, and the reverse system structure includes a blowing pump, a blowing channel and a reverse suction head. The reverse suction head is arranged at the top of the adsorption ring fork, and the blowing channel is arranged inside the adsorption ring fork, and is connected to the blowing pump, and the gas is transported to the reverse suction head. An annular high-pressure groove is provided on the reverse suction head, and a low-pressure adsorption column is formed at the center thereof. Air outlet holes are radially provided on the inner side of the annular high-pressure groove and the circumference of the low-pressure adsorption column. The air outlet holes are evenly arranged in multiple groups, and the air outlet holes are connected to the blowing channel.

[0035] According to Bernoulli's principle, by blowing high-pressure gas out from the air outlet, a pressure area is generated between the inner side of the annular high-pressure groove, the low-pressure adsorption column and the substrate. The pressure difference between the low-pressure area and the surrounding environment generates an adsorption force, which reverses the substrate to the low-pressure adsorption column and creates a tiny gap between the reverse suction head and the substrate, forming a non-contact adsorption effect, further avoiding damage and deformation to the substrate.

[0036] Furthermore, in order to improve the uniformity of adsorption, a metal mesh is provided on the periphery of the anti-absorption head, thereby increasing the contact area of ​​the anti-absorption head and improving the uniformity and stability of adsorption.

[0037] Furthermore, in order to avoid obstruction between the first control assembly and the second control assembly during operation, a hollow groove is provided on the control arm three, so that the control arm six and the adsorber can pass through freely.

[0038] Furthermore, multiple groups of adjusting screws are provided inside the centering device, and the adjusting screws and the sliding blocks correspond one to one, and the adjusting screws and the sliding blocks are threadedly connected. A micro motor is connected to the adjusting screw, which controls the rotation of the adjusting screw to drive the sliding block to move, and then drives the inductive sensor to adjust and move its position.

[0039] Furthermore, the growth reaction chamber is provided with a heating system, a gas delivery system, a growth platform and a control system. The heating system is an integrated multi-zone heater to achieve uniform heating; the gas delivery system delivers precursor gas to the growth reaction chamber, and the gas delivery system is provided with a precision flow controller; the growth platform is rotatable, and a motor for driving the growth platform to rotate is provided in the growth reaction chamber. The rotatable platform setting ensures uniform growth of the thin film; the control system includes a PID controller to adjust the temperature and gas flow.

[0040] Furthermore, a movable track is provided on one side of the bottom of the preparation table, and the substrate loading and transporting equipment is movably arranged on the movable track, so that the substrate loading and transporting equipment can move the substrate from the wafer substrate storage cavity to the growth reaction chamber.

[0041] Furthermore, a placement groove is provided in the wafer substrate storage chamber for placing the wafer substrate, and the height of the placement groove is greater than the distance between the centering device and the adsorber.

[0042] Preferably, the growth reaction chamber is made of high temperature resistant and corrosion resistant materials.

[0043] The present invention also discloses a method for preparing a wafer-level two-dimensional material film, comprising the following steps:

[0044] S1. Take out the base wafer and place it in the growth reaction chamber. During the process, ensure that the base wafer is clean, smooth, and flat to avoid bending or damage.

[0045] S2. After the reaction, the thin film is deposited on the base wafer. The base wafer is transferred to the thin film transfer table. During the process, the wafer is supported from the bottom of the base wafer to avoid touching the thin film.

[0046] S3. Pick up the peeling tape and stick it on the film. During the process, make sure the tape is flat and avoid wrinkles.

[0047] S4. Press the tape with a pressing wheel to attach the tape to the film. During this process, the film is rolled multiple times, and the pressure is gradually increased with each roll. The initial pressure of the pressing wheel is 0.1N, which is gradually increased by 0.3-0.5N. The final pressure is controlled at 1-1.5N.

[0048] When rolling, the film is rolled in a Z-shaped manner from one side to the other to ensure that the film is fully covered each time. That is, the film is rolled forward from the left side, then moved to the right for a certain distance, rolled backward, and then moved to the right for a certain distance and rolled forward until the film is fully covered.

[0049] Each time the pressing wheel is rolled in one direction, a 30%-50% repeat coverage rate is maintained. If the effective coverage width of the pressing wheel is 2 cm, when the pressing wheel enters from the left, rolls forward, moves 1 cm to the right, and then moves backward, the repeat coverage rate of this rolling process is 50%;

[0050] S5. When peeling the tape, first pre-peel the outer periphery of the tape, and then peel the tape as a whole;

[0051] The pre-peeling range is 1 / 10-3 / 10 of the tape radius; the pre-peeling points are evenly distributed and ≥8; the distance between adjacent points is ≤1 / 5 of the film side length; the peeling angle is 85-95°;

[0052] S6. After peeling, keep the tape flat and transfer it to the target substrate.

[0053] The beneficial effects of the present invention are: through mechanical structure innovation and intelligent control, this solution achieves high-yield, high-precision and high-efficiency preparation of two-dimensional material films, overcomes bottleneck problems such as film tearing, interface defects, and substrate damage in traditional technologies, and provides a reliable solution for wafer-level integration in the fields of flexible electronics, optoelectronic devices, etc.

[0054] Highly efficient reduction of film breakage rate: Through a phased peeling mechanism, a combination of pre-peeling (releasing adhesion on the periphery) and full peeling is adopted. Through a retractable and adjustable central suction head and airflow-assisted peeling technology, stress concentration is significantly reduced, thus minimizing the risk of film tearing.

[0055] Micro-distance precision control: The adsorption regulator achieves micron-level movement of the center suction head through a dual-pitch adjustment shaft to adapt to the needs of different peeling stages and avoid damage caused by sudden changes in local stress.

[0056] Improve the uniformity of interface bonding, step-by-step pressurization, and the inflatable pressing wheel through gradient air pressure control, combined with the Z-shaped rolling path, to ensure that the bonding pressure between the tape and the film is evenly distributed, so as to reduce the interface bubble rate.

[0057] All-round coverage and pressing: The covering drive mechanism drives the pressing wheel to realize XY-axis linkage movement, ensuring effective pressing of wafer-level films and avoiding interface defects caused by traditional single-point or local pressure.

[0058] Non-contact substrate protection: Bernoulli principle adsorption, reverse system structure through the annular high-pressure groove and the central low-pressure adsorption column, forming a suspended gap between the substrate and the adsorption head, achieving non-contact adsorption, completely eliminating the substrate deformation and damage caused by traditional clamping.

[0059] Center positioning technology: The centering device detects the edge of the substrate through a multi-inductance sensor and calculates the center position in combination with the OpenCV algorithm to improve the adsorption accuracy and ensure that the substrate is stable and without deviation during the transfer process. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0061] Figure 2 It is a structural schematic diagram of the film peeling mechanism and the staged pressurized attachment mechanism of the present invention;

[0062] Figure 3 It is a structural schematic diagram of the stripper of the present invention;

[0063] Figure 4 Schematic diagram of the bottom structure of the stripper of the present invention

[0064] Figure 5 Schematic diagram of the internal structure of the stripper of the present invention;

[0065] Figure 6 is a cross-sectional view of an adsorption regulator of the present invention;

[0066] Figure 7 It is a structural perspective diagram of the adsorption regulator of the present invention;

[0067] Figure 8 is a connection diagram of the expansion mechanism;

[0068] Figure 9 It is a structural diagram of a fixed disc;

[0069] Figure 10 Schematic diagram of the internal structure of the expansion mechanism;

[0070] Figure 11 Schematic diagram of the internal structure of the gas jet;

[0071] Figure 12 is a structural perspective view of the pressurized patch of the present invention;

[0072] Figure 13 This is a front view of the structure of the pressurized patch of the present invention;

[0073] Figure 14 A structural perspective diagram of the cover drive mechanism of the present invention;

[0074] Figure 15 It is a structural schematic diagram of the substrate loading and transporting equipment of the present invention;

[0075] Figure 16 A schematic structural diagram of the first control component and the second control component of the present invention;

[0076] Figure 17 It is a structural diagram of the centering device;

[0077] Figure 18 Schematic diagram of the internal structure of the centering device;

[0078] Figure 19 Schematic diagram of the structure of the adsorber in Example 1;

[0079] Figure 20 Schematic diagram of the internal structure of the adsorber in Example 1;

[0080] Figure 21 Schematic diagram of the structure of the adsorber in Example 2;

[0081] Figure 22 Schematic diagram of the structure of the anti-suction head in Example 2;

[0082] Figure 23 Schematic diagram of the internal structure of the anti-suction head in Example 2;

[0083] Figure 24 Schematic diagram of the structure of the anti-suction head in Example 3.

[0084] Reference list of accompanying figures: 1. Substrate loading and transporting equipment; 2. Film stripping mechanism; 3. Staged pressurization attachment mechanism; 4. Preparation table; 5. Wafer substrate storage chamber; 6. Growth reaction chamber; 7. Film transfer table; 8. First robot arm; 9. Stripper; 10. Second robot arm; 11. Pressurization attachment; 12. Outer suction head; 13. Center suction head; 14. Suction head housing; 15. First vacuum pump; 16. Second vacuum pump; 17. Adsorption regulator; 18. Adjustment shaft; 19. Fixed sleeve; 20. Adjustment telescopic tube; 21. Connecting middle plate; 22. First adjustment section; 23. First Second adjustment section; 24. Connecting gear; 25. Driving gear column; 26. First electric lifter; 27. Micro lifter; 28. Pressing wheel; 29. ​​Inflating adjustment pump; 30. Wheel frame; 31. Rotating shaft; 32. Cover; 33. X-axis screw; 34. Y-axis screw; 35. Moving long board; 36. Moving block; 37. Second electric lifter; 38. Lifting cylinder; 39. Rotary sealing joint; 40. Operating top plate; 41. First control component; 42. Second control component; 43. Adsorbent; 44. Centering device; 45. Control arm one; 46. Control arm two; 47. Control arm three ;48. Control arm four;49. Control arm five;50. Control arm six;51. Centering arm;52. Centering disk;53. Sliding block;54. Inductive sensor;55. Slide;56. Adsorption arm;57. Adsorption ring fork;58. Blowing pump;59. Third vacuum pump;60. Micro channel;61. Adsorption head;62. Blowing channel;63. Back suction head;64. Annular high-pressure groove;65. Low-pressure adsorption column;66. Air outlet;67. Metal mesh;68. Hollow groove;69. Adjusting screw;70. Micro motor;71. Expansion mechanism;72. Telescopic connecting rod;73. Expansion arm ;74. Expansion turntable;75. Fixed disc;76. Embedded groove;77. Extension cylinder;78. Jet gas;79. Jet hole;80. Jet pump;81. Linear slide;83. Arc slide;84. Limit sliding head;85. Placement plate;86. Connecting column;87. First set of gear rings;88. Jet-jet gear;89. Jet-jet motor;90. Second set of gear rings;91. Expansion gear;92. Expansion motor;93. Fixed block;94. Floating block;95. Air column;96. Connecting telescopic tube;97. Floating wheel;98. Floating frame;99. Floating rod;100. Rotating disk. DETAILED DESCRIPTION

[0085] The specific embodiments of the present invention are further described below with reference to the accompanying drawings, wherein the same parts are represented by the same reference numerals.

[0086] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the accompanying drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0087] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0088] The present application provides a device for preparing a wafer-level two-dimensional material film, comprising a substrate loading and transporting device 1, a film peeling mechanism 2, a staged pressurization attaching mechanism 3 and a preparation table 4; the preparation table 4 is provided with a wafer substrate storage cavity 5, and the preparation table 4 is provided with a growth reaction chamber 6; the substrate loading and transporting device 1 is used to pick up a wafer substrate from the wafer substrate storage cavity 5 and place it in the growth reaction chamber 6; the growth reaction chamber 6 is used to prepare a two-dimensional material film, so that the two-dimensional material film is deposited on the wafer substrate; the preparation table 4 is provided with a film transfer table 7, which is used to peel off the generated two-dimensional material film from the wafer substrate and transfer it to an operating platform on the target substrate, and the film transfer table 7 is provided with a vacuum adsorption mechanism for fixing the wafer substrate; the film peeling mechanism 2 is used to peel off the two-dimensional material film from the wafer substrate by means of a peeling tape, and the peeling tape and the two-dimensional material film are pressed together by the staged pressurization attaching mechanism 3 to increase the adsorption force of the tape on the film, thereby improving the peeling effect;

[0089] The film peeling mechanism 2 includes a first mechanical arm 8 and a peeler 9. The peeler 9 is provided on the first mechanical arm 8. The first mechanical arm 8 has a multi-dimensional movable and adjustable degree of freedom, which can drive the peeler 9 to move and adjust its position, thereby facilitating the peeling operation.

[0090] The staged pressurized attachment mechanism 3 includes a second robotic arm 10 and a pressurized attacher 11. The pressurized attacher 11 is provided on the second robotic arm 10. The second robotic arm 10 has multi-dimensional movable and adjustable freedom, which can drive the pressurized attacher 11 to move and adjust its position, thereby facilitating the attachment operation.

[0091] Among them, in view of the characteristics of the two-dimensional material film, in order to ensure that the film does not tear during the peeling and transfer process, in this solution, a pre-peeling method is adopted. First, the periphery of the film is peeled off to release the initial adhesion of the film, and then the entire film is peeled off, thereby reducing the probability of tearing that may occur during peeling. The stripper 9 includes an outer sleeve suction head 12, a center suction head 13 and a suction head shell 14. The outer sleeve suction head 12 is annular and is arranged at the bottom of the suction head shell 14. The center suction head 13 is located on the inner side of the outer sleeve suction head 12. The outer sleeve suction head 12 and the center suction head 13 are both provided with uniformly distributed adsorption holes. A first vacuum pump 15 and a second vacuum pump 16 are provided in the suction head shell 14. The first vacuum pump 15 is connected to the outer sleeve suction head 12 through an air duct, and the second vacuum pump 16 is connected to the center suction head 13 through an air duct.

[0092] In this solution, the film is peeled off through two steps of pre-peeling and full peeling. Therefore, when the outer nozzle 12 first adsorbs the outer periphery of the tape, there is a certain gap between the center nozzle 13 and the center of the tape. In order to enable the two to be adsorbed, the center nozzle 13 is set to be slidable, and an adsorption regulator 17 is provided in the nozzle housing 14, and the adsorption regulator 17 is connected to the center nozzle 13.

[0093] The adsorption regulator 17 includes an adjusting shaft 18, a fixed sleeve 19 and an adjusting telescopic tube 20. The adjusting telescopic tube 20 is telescopically slidable on the fixed sleeve 19. The adjusting telescopic tube 20 and the fixed sleeve 19 are kept in linear sliding by slide bars and slide grooves. The adjusting telescopic tube 20 is connected to the center suction head 13. A connecting middle plate 21 is provided in the fixed sleeve 19. A first adjusting section 22 and a second adjusting section 23 are provided on the adjusting shaft 18. The first adjusting section 22 is threadedly connected to the connecting middle plate 21, and the second adjusting section 23 is threadedly connected to the adjusting telescopic tube 20. A connecting gear 24 is provided on the adjusting shaft 18. A driving gear column 25 is provided in the fixed sleeve 19. The driving gear column 25 is meshed with the connecting gear 24. There is a reduction motor assembly for controlling the driving gear column 25. The length of the driving gear column 25 is greater than the length of the first adjusting section 22 and the second adjusting section 23. The adjusting shaft 18 is driven to rotate by the driving gear column 25, and then the adjusting shaft 18 moves relative to the fixed sleeve 19. At the same time, the telescopic tube 20 is adjusted to move relative to the adjusting shaft 18. The first adjusting section 22 and the second adjusting section 23 have different pitches, and the pitch of the first adjusting section 22 is greater than the pitch of the second adjusting section 23. Therefore, in the pre-peeling stage of the film, the peripheral part must be peeled in advance, and in order to avoid peeling rupture, the peeling amplitude cannot be too large, and the center suction head 13 needs to touch the unpeeled film. Therefore, the adsorption regulator 17 can be fine-tuned to control the micro-distance telescopic movement of the center suction head 13.

[0094] In order to improve the efficiency of peeling the film, after the periphery of the film is peeled off, the air flow is blown into the angle between the opened film and the wafer base, so that when the center suction head peels off the remaining film, it can not only not damage the film, but also assist the center suction head to peel off all the remaining parts; the suction head shell 14 is provided with an expansion mechanism 71, the expansion mechanism 71 includes an expansion arm 73, an expansion turntable 74 and a fixed disc 75, and the suction head shell 14 is provided with a plurality of embedded grooves 76, the expansion arm 73 is a right-angle arm, and is slidably arranged on the embedded groove 76. In the groove 76, an extension cylinder 77 is provided at the bottom of the expansion arm 73, and a jet body 78 is provided at the bottom of the extension cylinder 77. The jet body 78 is provided with a jet hole 79. A jet pump 80 is provided in the jet body 78, and gas is ejected through the jet hole 79. When the expansion arm 73 is controlled to expand and move in all directions, the expansion arm 73 slides out of the embedded groove 76, and the extension cylinder 77 controls the jet body 78 to move to the position where the film is pre-peeled and opened, and sprays air at the opened angle, assisting the central suction head to more efficiently peel off the film completely;

[0095] The fixed disc 75 is fixedly arranged, and the expansion turntable 74 is rotatably arranged in the fixed disc 75. The fixed disc 75 is provided with a plurality of linear slide grooves 81, and the expansion turntable 74 is provided with a plurality of arc-shaped slide grooves 83. A plurality of telescopic connecting rods are provided in the fixed disc 75 for sliding and telescopic movement, and the telescopic connecting rod can extend out of the fixed disc 75. Limit sliding heads 84 are provided on the upper and lower parts of the telescopic connecting rod 72, and the two limit sliding heads 84 are respectively slidably arranged in the arc-shaped slide groove 83 and the linear slide groove 81. When the expansion turntable 74 rotates, the telescopic connecting rod is pushed out of the fixed disc 75 by the pushing action of the arc-shaped slide groove 83 and the limiting action of the linear slide groove 81. The telescopic connecting rod is connected to the expansion arm 73, and the expansion arm 73 is expanded by the setting of the expansion mechanism 71.

[0096] To further improve the peeling effect, when the jet 78 is spraying air onto the pre-peeled film, the jet 78 is controlled to rotate around the film, thereby achieving a more uniform jetting and peeling effect. A rotating disk 100 is rotatably provided on the suction head housing 14, and the expansion mechanism 71 is located within the rotating disk 100. By controlling the rotation of the rotating disk 100, the entire expansion mechanism 71 and the jet 78 can be driven to rotate.

[0097] A placement plate 85 is provided in the suction head housing 14, and a connecting column 86 is provided on the placement plate 85. An opening is provided in the center of the rotating disk 100, and the rotating disk 100 is rotatably arranged on the connecting column 86. A first set of gear rings 87 is provided on the rotating disk 100, and the first set of gear rings 87 is sleeved on the outside of the connecting column 86. A rotary spray gear 88 is provided on the placement plate 85 and meshed with the first set of gear rings 87. A rotary spray motor 89 is provided on the placement plate 85, and the rotary spray motor 89 is connected to the rotary spray gear 88;

[0098] The expansion turntable 74 and the fixed disk 75 are both provided with openings in their centers. The connecting post 86 passes through the expansion turntable 74, the fixed disk 75, and the rotating disk 100 and is connected to the first robotic arm 8.

[0099] The expansion turntable 74 is provided with a second set of gear rings 90, which are sleeved on the outside of the connecting column 86. The fixed disc 75 is provided with an expansion gear 91 that is meshed and connected to the second set of gear rings 90. The fixed disc 75 is fixed with an expansion motor 92, and the expansion motor 92 is connected to the expansion gear 91.

[0100] When the spraying gas 78 is spraying the film, by controlling the up and down movement of the spraying gas 78, a force can be applied to the opened film to move up and down, further improving the effect of peeling the film; the spraying gas 78 includes a fixed block 93 and a floating block 94, the floating block 94 is provided with an air jet hole 79, the floating block 94 is provided with an air column 95 connected to the air jet hole 79, and the air column 95 slides into the fixed block 93, and the fixed block 93 is provided with an air pump 80, which is connected to the air column 95 by a connecting telescopic tube 96, and then ejects gas through the air jet hole 79;

[0101] The fixed block 93 is provided with a spring and is sleeved on the air column 95. A floating wheel 97 is rotatably provided in the fixed block 93. The floating wheel 97 rotates eccentrically. A floating frame 98 is sleeved on the outside of the floating wheel 97. The upper and lower side frames of the floating frame 98 are in contact with the floating wheel 97. When the floating wheel 97 rotates, it does not contact the two sides of the floating frame 98. A floating rod 99 is provided on the floating frame 98. The floating rod 99 slides through the fixed block 93 and is connected to the floating block 94. A floating motor connected to the floating wheel 97 is provided in the fixed block 93.

[0102] By controlling the floating wheel 97 to rotate, the floating frame 98 is driven to move up and down, and the floating block 94 is driven to move up and down, thereby generating an up and down floating effect.

[0103] A first electric lifter 26 and a micro lifter 27 are provided between the first robotic arm 8 and the stripper 9, which respectively control the large-scale lifting and micro-distance lifting of the stripper 9, thereby facilitating the control of micro-distance adjustment during stripping and the rapid transfer after the overall stripping; the micro lifter 27 and the adsorption regulator 17 have the same structure and function, both of which are used to achieve micro-distance telescopic control.

[0104] On the other hand, during the process of attaching the tape and the film, in order to increase the adsorption force of the tape on the film, it is necessary to apply pressing force to the tape. In order to avoid damage to the film due to excessive pressure or rapid changes, a stage-type pressurized attachment mechanism 3 is set, with a solid step-by-step pressurization effect. The pressurized attacher 11 includes a pressing wheel 28, an air adjustment pump 29 and a wheel frame 30. The pressing wheel 28 is rotatably arranged on the wheel frame 30. The pressing wheel 28 is an inflatable wheel. The air adjustment pump 29 is connected to the pressing wheel 28 and adjusts and controls the air pressure of the pressing wheel 28. When the air pressure is low, the pressing wheel 28 is softer, and the pressure when pressing the film is small. When the air pressure is high, the pressing wheel 28 is harder, and the pressure pressing the film becomes larger. By gradually controlling the air pressure, a gradually pressurized compacting effect is achieved.

[0105] In order to realize the connection between the inflation regulating pump 29 and the pressing wheel 28, a hollow rotating shaft 31 is provided on the pressing wheel 28, an air passage is provided in the wheel frame 30, and the rotating shaft 31 and the air passage of the wheel frame 30 are connected through a rotary sealing joint 39, and the inflation regulating pump 29 and the air passage in the wheel frame 30 are connected.

[0106] In order to achieve the full range of pressing of the pressing wheel 28, a covering driving mechanism is provided between the second robot arm 10 and the booster applicator 11, including a cover body 32, an x-direction screw 33, a y-direction screw 34, a moving long plate 35 and a moving block 36, wherein the x-direction screw 33 is rotatably provided on the cover body 32, the moving long plate 35 is slidably provided on the cover body 32, the moving long plate 35 and the x-direction screw 33 are threadedly connected, the y-direction screw 34 is rotatably provided on the moving long plate 35, and the moving block 36 is slidably provided on the moving long plate On the movable long plate 35, the movable block 36 and the y-direction screw 34 are threadedly connected. The x-direction screw 33 is driven by a reduction motor set (not shown in the figure) in the cover body 32, and the y-direction screw 34 is driven by a reduction motor set (not shown in the figure) in the movable long plate 35. The x-direction screw 33 and the y-direction screw 34 are perpendicular to each other. The pressurized applicator 11 is provided on the movable block 36. The pressurized applicator 11 is driven by the covering drive mechanism to move and cover the entire tape, thereby achieving pressing of the entire tape.

[0107] In addition, the second robot arm 10 is provided with a second electric lifter 37 to control the lifting and lowering movement of the booster applicator 11 .

[0108] The substrate loading and transporting equipment 1 includes a lifting cylinder 38, an operating top plate 40, a first control component 41, a second control component 42, an adsorber 43 and a centering device 44. The operating top plate 40 is fixedly arranged on the driving end of the piston rod of the lifting cylinder 38. The first control component 41 and the second control component 42 are both arranged on the operating top plate 40. The centering device 44 is arranged on the first control component 41. The adsorber 43 is arranged on the second control component 42. The first control component 41 controls the position movement of the centering device 44. The centering device 44 is used to detect and identify the center of the wafer substrate, so that it can be picked up from the center of the wafer during transportation, thereby ensuring the levelness and stability of the wafer to avoid damage and deformation. The adsorber 43 is used to adsorb the wafer substrate to avoid deformation and damage of the wafer by clamping.

[0109] The first control component 41 includes a control arm 1 45, a control arm 2 46 and a control arm 3 47, wherein the control arm 1 45 is rotatably mounted on the operating top plate 40, the control arm 2 46 is rotatably mounted on the control arm 1 45, the control arm 3 47 is rotatably mounted on the control arm 2 46, and the centering device 44 is fixedly mounted on the control arm 3 47; the second control component 42 includes a control arm 48, a control arm 5 49 and a control arm 6 50, wherein the control arm 48 is rotatably mounted on the operating top plate 40, the control arm 5 49 is rotatably mounted on the control arm 48, the control arm 6 50 is rotatably mounted on the control arm 5 49, and the adsorber 43 is fixedly mounted on the control arm 6 50; the horizontal position of the centering device 44 is higher than that of the adsorber 43.

[0110] The centering device 44 includes a centering arm 51, a centering disk 52, a sliding block 53 and an inductive sensor 54. The centering disk 52 is arranged on the centering arm 51. The centering disk 52 is provided with a plurality of slide grooves 55 radiating from the center to the surrounding areas. The sliding block 53 is arranged in the slide groove 55. The inductive sensor 54 is arranged on the sliding block 53. By controlling the inductive sensor 54, the change of the edge of the substrate is detected, and then the edge and position of the substrate are determined. The center position of the substrate is obtained by center calculation. In an embodiment, the center position of the substrate is calculated by computing software such as OpenCV (open source computer vision library), MATLAB, Python (NumPy+SciPy), etc.

[0111] The adsorber 43 includes an adsorption arm 56, an adsorption ring fork 57 and an adsorption system. The adsorption ring fork 57 is a ring-shaped fork and is arranged on the adsorption arm 56. The adsorption system is arranged in the adsorption ring fork 57. The adsorption system includes a third vacuum pump 59, a microchannel 60 and an adsorption head 61. The adsorption head 61 is arranged on the top of the adsorption ring fork 57. The microchannel 60 is arranged inside the adsorption ring fork 57 and the adsorption arm 56, and is connected to the third vacuum pump 59. Suction is generated by the adsorption system to adsorb and move the substrate.

[0112] When the substrate is transferred, the center position of the substrate is found by the centering device 44, and then the substrate is adsorbed from the center of the substrate by the adsorber 43, thereby keeping the substrate stable during the transfer process, thereby preventing the substrate from bending and deformation.

[0113] In another embodiment, different from the above, the adsorption system is replaced by a reverse system structure, which includes a blowing pump 58, a blowing channel 62 and a reverse suction head 63. The reverse suction head 63 is arranged at the top of the adsorption ring fork 57, and the blowing channel 62 is arranged inside the adsorption ring fork 57, and is connected to the blowing pump 58, and the gas is transported to the reverse suction head 63. The reverse suction head 63 is provided with an annular high-pressure groove 64, and a low-pressure adsorption column 65 is formed at the center thereof. Air outlet holes 66 are radially provided on the inner side of the annular high-pressure groove 64 and on the circumference of the low-pressure adsorption column 65. The air outlet holes 66 are evenly arranged in multiple groups, and the air outlet holes 66 are connected to the blowing channel 62.

[0114] According to Bernoulli's principle, high-pressure gas is blown out from the air outlet 66, and a pressure area is generated between the inner side of the annular high-pressure groove 64, the low-pressure adsorption column 65 and the substrate. The pressure difference between the low-pressure area and the surrounding environment generates an adsorption force, which reverses the substrate to the low-pressure adsorption column 65 and creates a tiny gap between the reverse suction head 63 and the substrate, forming a non-contact adsorption effect, further avoiding damage and deformation to the substrate.

[0115] In order to improve the uniformity of adsorption, a metal mesh 67 is provided on the outer periphery of the anti-absorption head 63, thereby increasing the contact area of ​​the anti-absorption head 63 and improving the uniformity and stability of adsorption.

[0116] In order to avoid obstruction between the first control assembly 41 and the second control assembly 42 during operation, a hollow groove 68 is provided on the control arm 47 for the control arm 6 50 and the adsorber 43 to pass through freely.

[0117] A plurality of adjusting screws 69 are provided inside the centering device 44. The adjusting screws 69 correspond to the sliding blocks 53 one by one, and the adjusting screws 69 and the sliding blocks 53 are threadedly connected. A micro motor 70 is connected to the adjusting screw 69. By controlling the rotation of the adjusting screw 69, the sliding block 53 is driven to move, and the inductive sensor 54 is driven to adjust and move its position.

[0118] The growth reaction chamber 6 is equipped with a heating system, a gas delivery system, a growth platform and a control system. The heating system is an integrated multi-zone heater to achieve uniform heating; the gas delivery system delivers precursor gas to the growth reaction chamber 6, and the gas delivery system is provided with a precision flow controller; the growth platform is rotatable, and a motor for driving the growth platform to rotate is provided in the growth reaction chamber 6. The rotatable platform setting ensures uniform growth of the thin film; the control system includes a PID controller to adjust the temperature and gas flow.

[0119] A movable track is provided on one side of the bottom of the preparation table 4 , and the substrate loading and transporting device 1 is movably arranged on the movable track, so that the substrate loading and transporting device 1 can move the substrate from the wafer substrate storage chamber 5 to the growth reaction chamber 6 .

[0120] A placement groove is provided in the wafer substrate storage chamber 5 for placing wafer substrates. The height of the placement groove is greater than the distance between the centering device 44 and the adsorber 43 .

[0121] Preferably, the growth reaction chamber 6 is made of high temperature resistant and corrosion resistant materials.

[0122] In embodiment 1, the adsorber 43 includes an adsorption arm 56, an adsorption ring fork 57 and an adsorption system. The adsorption ring fork 57 is a ring-shaped fork and is provided on the adsorption arm 56. The adsorption system is provided in the adsorption ring fork 57. The adsorption system includes a third vacuum pump 59, a microchannel 60 and an adsorption head 61. The adsorption head 61 is provided at the top of the adsorption ring fork 57. The microchannel 60 is provided inside the adsorption ring fork 57 and the adsorption arm 56 and is connected to the third vacuum pump 59. Suction is generated by the adsorption system to adsorb and move the substrate.

[0123] When the substrate is transferred, the center position of the substrate is found by the centering device 44, and then the substrate is adsorbed from the center of the substrate by the adsorber 43, thereby keeping the substrate stable during the transfer process, thereby preventing the substrate from bending and deformation.

[0124] Embodiment 2 is different from the above-mentioned embodiment 1 in that the adsorption system is replaced by a reverse system structure, and the reverse system structure includes a blowing pump 58, a blowing channel 62 and a reverse suction head 63. The reverse suction head 63 is arranged at the top of the adsorption ring fork 57, and the blowing channel 62 is arranged inside the adsorption ring fork 57, and is connected to the blowing pump 58, and the gas is transported to the reverse suction head 63. The reverse suction head 63 is provided with an annular high-pressure groove 64, and a low-pressure adsorption column 65 is formed at the center thereof. Air outlet holes 66 are radially provided on the inner side of the annular high-pressure groove 64 and on the circumference of the low-pressure adsorption column 65. The air outlet holes 66 are evenly arranged in multiple groups, and the air outlet holes 66 are connected to the blowing channel 62.

[0125] According to Bernoulli's principle, high-pressure gas is blown out from the air outlet 66, and a pressure area is generated between the inner side of the annular high-pressure groove 64, the low-pressure adsorption column 65 and the substrate. The pressure difference between the low-pressure area and the surrounding environment generates an adsorption force, which reverses the substrate to the low-pressure adsorption column 65 and creates a tiny gap between the reverse suction head 63 and the substrate, forming a non-contact adsorption effect, further avoiding damage and deformation to the substrate.

[0126] In the third embodiment, in order to improve the uniformity of adsorption, based on the second embodiment, a metal mesh 67 is provided on the outer periphery of the anti-absorption head 63 to evenly disperse the airflow, thereby increasing the contact area of ​​the anti-absorption head 63 and improving the uniformity and stability of adsorption.

[0127] In order to avoid obstruction between the first control assembly 41 and the second control assembly 42 during operation, a hollow groove 68 is provided on the control arm 47 for the control arm 6 50 and the adsorber 43 to pass through freely.

[0128] A plurality of adjusting screws 69 are provided inside the centering device 44. The adjusting screws 69 correspond to the sliding blocks 53 one by one, and the adjusting screws 69 and the sliding blocks 53 are threadedly connected. A micro motor 70 is connected to the adjusting screw 69. By controlling the rotation of the adjusting screw 69, the sliding block 53 is driven to move, and the inductive sensor 54 is driven to adjust and move its position.

[0129] The growth reaction chamber 6 is equipped with a heating system, a gas delivery system, a growth platform and a control system. The heating system is an integrated multi-zone heater to achieve uniform heating; the gas delivery system delivers precursor gas to the growth reaction chamber 6, and the gas delivery system is provided with a precision flow controller; the growth platform is rotatable, and a motor for driving the growth platform to rotate is provided in the growth reaction chamber 6. The rotatable platform setting ensures uniform growth of the thin film; the control system includes a PID controller to adjust the temperature and gas flow.

[0130] A movable track is provided on one side of the bottom of the preparation table 4 , and the substrate loading and transporting device 1 is movably arranged on the movable track, so that the substrate loading and transporting device 1 can move the substrate from the wafer substrate storage chamber 5 to the growth reaction chamber 6 .

[0131] The growth reaction chamber 6 is made of high temperature resistant and corrosion resistant materials.

[0132] The present invention also discloses a method for preparing a wafer-level two-dimensional material film, comprising the following steps:

[0133] Taking 8-inch wafer substrate as an example,

[0134] S1. Take out the base wafer and place it into the growth reaction chamber 6. During the process, ensure that the base wafer is clean, smooth, and flat to avoid bending or damage.

[0135] S2. After the reaction, the thin film is deposited on the base wafer. The base wafer is transferred to the thin film transfer stage 7. During the process, the wafer is supported from the bottom of the base wafer to avoid touching the thin film.

[0136] S3. Pick up the peeling tape and stick it on the film. During the process, make sure the tape is flat and avoid wrinkles.

[0137] S4. The tape is pressed by the pressing wheel 28 to adhere the tape to the film. During this process, the film is rolled multiple times, and the pressure is gradually increased with each roll. The initial pressure of the pressing wheel 28 is 0.1N, which is gradually increased by 0.3-0.5N. The final pressure is controlled at 1-1.5N.

[0138] When rolling, the film is rolled in a Z-shaped manner from one side to the other to ensure that the film is fully covered each time. That is, the film is rolled forward from the left side, then moved to the right for a certain distance, rolled backward, and then moved to the right for a certain distance and rolled forward until the film is fully covered.

[0139] Each unidirectional rolling maintains a 30%-50% repeat coverage rate. If the effective coverage width of the pressing wheel 28 is 2 cm, when the pressing wheel 28 enters from the left, rolls forward, moves 1 cm to the right, and then moves backward, the forward and backward rolling has a 50% repeat coverage rate.

[0140] S5. When peeling the tape, first pre-peel the outer periphery of the tape, and then peel the tape as a whole;

[0141] The pre-peeling range is 1 / 10-3 / 10 of the tape radius; the pre-peeling points are evenly distributed and ≥8; the distance between adjacent points is ≤ 1 / 5 of the film side length; the peeling angle is 85-95°; the pre-peeling lifting height is 1-1.5mm;

[0142] S6. After peeling, keep the tape flat and transfer it to the target substrate.

[0143] During the use of the device, the first control component 41 is used to drive the centering device 44 to move above the wafer. During the process, the operating top plate 40 can be rotated, and the control arm 1 45 rotates on the operating top plate 40, the control arm 2 46 rotates on the control arm 1 45, and the control arm 3 47 rotates on the control arm 2 46; the control sliding block 53 is used to drive the inductive sensor 54 to move, and the inductive sensor 54 detects the changes in the edge of the substrate. The edge and contour of the substrate are detected and identified by multiple inductive sensors 54, and then the center of the substrate is calculated by the calculation software. The adsorber 43 is driven by the second control component 42 to move to the center position of the substrate, and the substrate is moved by the adsorption force, or according to the Bernoulli principle, a reverse adsorption force is generated to generate a tiny gap between the anti-adsorption head 63 and the substrate to achieve non-contact adsorption, thereby avoiding deformation and damage to the substrate. Then the substrate loading and transportation equipment 1 carries the substrate to the growth reaction chamber 6 for growth.

[0144] After the film is deposited on the wafer substrate, it is transferred to the preparation table 4 by the substrate loading and transporting device 1, and the wafer substrate is fixed by the vacuum adsorption mechanism. First, the film stripping mechanism 2 picks up the tape and covers the tape on the film. Then, the film is pressed by the staged pressurization attachment mechanism 3. The covering drive mechanism drives the pressing wheel 28 to move in all directions. When rolling, it rolls from one side of the film to the other side in a Z-shaped rolling motion to ensure that the film is fully covered each time. The air pressure of the pressing wheel 28 is gradually controlled by air pressure, and then the hardness of the pressing wheel 28 is controlled, and then the pressure of the pressing wheel 28 is controlled, thereby achieving a gradually increased pressing effect.

[0145] During peeling, the periphery of the film is pre-peeled first, and the rest of the film is adsorbed by the control center suction head 13, and then the entire film is peeled. The adjustment device 17 is set by the micro-lifter 27 to adsorb the film. During pre-peeling and movement of the center suction head 13, fine-tuning can be performed. The adjustment shaft 18 is driven to rotate by the driving gear column 25, and then the adjustment shaft 18 moves relative to the fixed sleeve 19. At the same time, the telescopic tube 20 is adjusted to move relative to the adjustment shaft 18. The differential fine-tuning effect is achieved through the pitch difference between the first adjustment section 22 and the second adjustment section 23.

[0146] When the center suction head 13 is peeling, the expansion arm 73 is extended to the periphery through the expansion mechanism, and the spray gas 78 is pushed downward to the place where the film is lifted up by the extension cylinder 77, and then the center suction head 13 is assisted by the jet of air to improve the peeling effect. At the same time, by controlling the rotation of the rotating disk 100, the spray gas is driven to rotate, and the rotary spraying effect is achieved, which further improves the peeling effect. Then, by controlling the floating block to move up and down, the up and down floating effect is achieved during the rotary spraying, giving the film a force to move up and down, further improving the peeling effect.

[0147] After peeling off the film, it is transferred to the target wafer.

[0148] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A device for preparing a wafer-level two-dimensional material thin film, characterized in that: A device for preparing a wafer-level two-dimensional material film comprises a substrate loading and transporting device (1), a film stripping mechanism (2), a staged pressurization attaching mechanism (3) and a preparation table (4); the preparation table (4) is provided with a wafer substrate storage cavity (5), and the preparation table (4) is provided with a growth reaction chamber (6); the growth reaction chamber (6) is used for preparing a two-dimensional material film; the preparation table (4) is provided with a film transfer table (7); the film stripping mechanism (2) is used for stripping the two-dimensional material film from the wafer substrate by stripping the adhesive tape; the staged pressurization attaching mechanism (3) is used for improving the adsorption degree between the adhesive tape and the film; the film stripping mechanism (2) comprises a first robot arm (8) and a stripper (9), and the stripper (9) is provided on the first robot arm (8); the staged pressurization attaching mechanism (3) comprises a second robot arm (10) and a pressurization attacher (11), and the pressurization attacher (11) is provided on the second robot arm (10).

2. The device for preparing a wafer-level two-dimensional material thin film according to claim 1, characterized in that: The stripper (9) includes an outer sleeve suction head (12), a central suction head (13) and a suction head shell (14). The outer sleeve suction head (12) is annular and is arranged at the bottom of the suction head shell (14). The central suction head (13) is located on the inner side of the outer sleeve suction head (12). The outer sleeve suction head (12) and the central suction head (13) are both provided with uniformly distributed suction holes. A first vacuum pump (15) and a second vacuum pump (16) are provided in the suction head shell (14). The first vacuum pump (15) is connected to the outer sleeve suction head (12) through an air duct, and the second vacuum pump (16) is connected to the central suction head (13) through an air duct. The central suction head (13) is slidably arranged. An adsorption regulator (17) is provided in the suction head shell (14), and the adsorption regulator (17) is connected to the central suction head (13).

3. The device for preparing a wafer-level two-dimensional material thin film according to claim 2, characterized in that: The adsorption regulator (17) comprises an adjusting shaft (18), a fixed sleeve (19) and an adjusting telescopic tube (20), wherein the adjusting telescopic tube (20) is arranged in the fixed sleeve (19) for telescopic sliding, and the adjusting telescopic tube (20) and the fixed sleeve (19) are kept in linear sliding by a slide bar and a slide groove (55), the adjusting telescopic tube (20) is connected to the central suction head (13), a connecting middle plate (21) is provided in the fixed sleeve (19), a first adjusting section (22) and a second adjusting section (23) are provided on the adjusting shaft (18), the first adjusting section (22) and the connecting middle plate (21) are threadedly connected, the second adjusting section (23) and the adjusting telescopic tube (20) are threadedly connected, a connecting gear (24) is provided on the adjusting shaft (18), and the fixed sleeve (19) is provided with a connecting middle plate (21). A driving tooth column (25) is provided in the fixed sleeve (19), and the driving tooth column (25) is meshed with the connecting gear (24). A reduction motor assembly for controlling the driving tooth column (25) is provided in the fixed sleeve (19), and the length of the driving tooth column (25) is greater than the length of the first adjustment section (22) and the second adjustment section (23). The first adjustment section (22) and the second adjustment section (23) have different pitches, and the pitch of the first adjustment section (22) is greater than the pitch of the second adjustment section (23); a first electric lifter (26) and a micro lifter (27) are provided between the first mechanical arm (8) and the stripper (9), respectively controlling the stripper (9) to perform large-scale lifting and micro-distance lifting; the micro lifter (27) and the adsorption regulator (17) have the same structure and function.

4. The device for preparing a wafer-level two-dimensional material thin film according to claim 1, characterized in that: The nozzle housing (14) is provided with an expansion mechanism (71), and the expansion mechanism (71) includes an expansion arm (73), an expansion turntable (74) and a fixed disc (75). The nozzle housing (14) is provided with a plurality of embedded grooves (76). The expansion arm (73) is a right-angle arm and is slidably arranged in the embedded groove (76). An extension cylinder (77) is provided at the bottom of the expansion arm (73). A jet body (78) is provided at the bottom of the extension cylinder (77). A jet hole (79) is provided on the jet body (78). A jet pump (80) is provided in the jet body (78), and gas is ejected through the jet hole (79). When the expansion arm (73) is controlled to expand and move in all directions, the expansion The arm (73) slides out of the embedded groove (76); the fixed disc (75) is fixedly arranged, and the expansion turntable (74) is rotatably arranged in the fixed disc (75); the fixed disc (75) is provided with a plurality of linear slide grooves (81), and the expansion turntable (74) is provided with a plurality of arcuate slide grooves (83); a plurality of telescopic connecting rods (72) are provided in the fixed disc (75) for sliding and telescopic operation, and the telescopic connecting rods (72) can extend out of the fixed disc (75); the telescopic connecting rods (72) are provided with limit sliding heads (84) on the upper and lower parts, and the two limit sliding heads (84) are respectively slidably arranged in the arcuate slide groove (83) and the linear slide groove (81); the telescopic connecting rods (72) and connected to the expansion arm (73); a rotating disk (100) is rotatably provided on the suction head housing (14), and the expansion mechanism (71) is located in the rotating disk (100); a placement plate (85) is provided in the suction head housing (14), a connecting column (86) is provided on the placement plate (85), an opening is provided in the center of the rotating disk (100), the rotating disk (100) is rotatably provided on the connecting column (86), a first set of toothed rings (87) is provided on the rotating disk (100), the first set of toothed rings (87) is sleeved on the outside of the connecting column (86), a rotary spray gear (88) meshing with the first set of toothed rings (87) is provided on the placement plate (85), and the placement plate (85) is provided with a rotary spray gear (88) A rotary jet motor (89) is provided, and the rotary jet motor (89) is connected to a rotary jet gear (88); the centers of the expansion turntable (74) and the fixed disc (75) are both provided with openings, and the connecting column (86) passes through the expansion turntable (74), the fixed disc (75), and the rotating disc (100) and is connected to the first mechanical arm (8); the expansion turntable (74) is provided with a second set of gear rings (90) and is sleeved on the outside of the connecting column (86); the fixed disc (75) is provided with an expansion gear (91) meshed with the second set of gear rings (90); the fixed disc (75) is fixedly provided with an expansion motor (92), and the expansion motor (92) is connected to the expansion gear (91).

5. The device for preparing a wafer-level two-dimensional material thin film according to claim 4, characterized in that: The spray body (78) includes a fixed block (93) and a floating block (94). The floating block (94) is provided with a spray hole (79). The floating block (94) is provided with a gas column (95) connected to the spray hole (79). The gas column (95) slides into the fixed block (93). A jet pump (80) is provided in the fixed block (93). The jet pump (80) is connected to the gas column (95) through a connecting telescopic tube (96) and then sprays gas through the spray hole (79). The fixed block (93) is provided with a gas column (95). The spring is sleeved on the air column (95), a floating wheel (97) is rotated inside the fixed block (93), the floating wheel (97) rotates eccentrically, a floating frame (98) is sleeved outside the floating wheel (97), the upper and lower frame bodies of the floating frame (98) are fitted with the floating wheel (97), and the floating wheel (97) does not contact the two sides of the floating frame (98) when the floating wheel (97) rotates, and a floating rod (99) is provided on the floating frame (98), and the floating rod (99) slides through the fixed block (93) and is connected to the floating block (94).

6. The device for preparing a wafer-level two-dimensional material thin film according to claim 1, characterized in that: The pressurized attachment (11) comprises a pressing wheel (28), an air-charging regulating pump (29) and a wheel frame (30); the pressing wheel (28) is rotatably mounted on the wheel frame (30); the pressing wheel (28) is an inflatable wheel; the air-charging regulating pump (29) is connected to the pressing wheel (28); a hollow rotating shaft (31) is provided on the pressing wheel (28); an air passage is provided in the wheel frame (30); the rotating shaft (31) and the air passage of the wheel frame (30) are connected via a rotating sealing joint (39); the air passage in the air-charging regulating pump (29) and the wheel frame (30) are in communication.

7. The device for preparing a wafer-level two-dimensional material thin film according to claim 6, characterized in that: A covering driving mechanism is provided between the second robot arm (10) and the booster applicator (11), comprising a cover body (32), an x-direction screw (33), a y-direction screw (34), a movable long plate (35) and a movable block (36), wherein the x-direction screw (33) is rotatably provided on the cover body (32), the movable long plate (35) is slidably provided on the cover body (32), the movable long plate (35) and the x-direction screw (33) are threadedly connected, the y-direction screw (34) is rotatably provided on the movable long plate (35), the movable block (36) is slidably provided on the movable long plate (35), and the movable block (36) and the y-direction screw (34) are rotatably provided on the movable long plate (35). The x-direction screw (33) is threadedly connected to the cover body (32), the y-direction screw (34) is driven by the deceleration motor group in the cover body (32), and the y-direction screw (34) is driven by the deceleration motor group in the movable long plate (35). The x-direction screw (33) and the y-direction screw (34) are perpendicular to each other. The booster applicator (11) is arranged on the movable block (36), and the booster applicator (11) is driven by the covering driving mechanism to move and cover the entire tape, thereby achieving the pressing of the entire tape; the second mechanical arm (10) is provided with a second electric lifter (37) to control the lifting and lowering movement of the booster applicator (11).

8. The device for preparing a wafer-level two-dimensional material thin film according to claim 1, characterized in that: The base loading and transporting equipment (1) comprises a lifting cylinder (38), an operating top plate (40), a first control component (41), a second control component (42), an absorber (43) and a centering device (44), wherein the operating top plate (40) is fixedly arranged on the driving end of the piston rod of the lifting cylinder (38), the first control component (41) and the second control component (42) are both arranged on the operating top plate (40), the centering device (44) is arranged on the first control component (41), the absorber (43) is arranged on the second control component (42), the first control component (41) controls the position movement of the centering device (44), and the centering device (44) is used to detect the position of the centering device (44). and identifies the center of the wafer substrate, the absorber (43) is used to absorb the wafer substrate; the first control component (41) includes a control arm 1 (45), a control arm 2 (46) and a control arm 3 (47), the control arm 1 (45) is rotatably mounted on the operating top plate (40), the control arm 2 (46) is rotatably mounted on the control arm 1 (45), the control arm 3 (47) is rotatably mounted on the control arm 2 (46), and the centering device (44) is fixedly mounted on the control arm 3 (47); the second control component (42) includes a control arm 4 (48), a control arm 5 (49) and a control arm 6 (50), the control arm 4 (48) is rotatably mounted on the operating top plate (40) On the control arm five (49) is rotatably arranged on the control arm four (48), the control arm six (50) is rotatably arranged on the control arm five (49), and the adsorber (43) is fixedly arranged on the control arm six (50); the horizontal position of the centering device (44) is higher than that of the adsorber (43). The centering device (44) includes a centering arm (51), a centering disk (52), a sliding block (53) and an inductive sensor (54). The centering disk (52) is arranged on the centering arm (51), and the centering disk (52) is provided with a plurality of slide grooves (55) arranged to diverge from the center to the surrounding areas. The sliding block (53) is arranged in the slide groove (55), and the inductive sensor (54) is arranged on the sliding block ( 53); the adsorber (43) includes an adsorption arm (56), an adsorption ring fork (57) and an adsorption system, the adsorption ring fork (57) is a ring fork and is arranged on the adsorption arm (56), the adsorption system is arranged in the adsorption ring fork (57), the adsorption system includes a third vacuum pump (59), a micro channel (60) and an adsorption head (61), the adsorption head (61) is arranged on the top of the adsorption ring fork (57), the micro channel (60) is arranged inside the adsorption ring fork (57) and the adsorption arm (56), and is connected to the third vacuum pump (59); the control arm three (47) is provided with a hollow groove (68) for allowing the control arm six (50) and the adsorber (43) to pass freely;The centering device (44) is provided with a plurality of adjusting screws (69) inside. The adjusting screws (69) correspond to the sliding blocks (53) one by one, and the adjusting screws (69) and the sliding blocks (53) are threadedly connected. The adjusting screws (69) are connected to a micro motor (70). By controlling the rotation of the adjusting screws (69), the sliding blocks (53) are driven to move, thereby driving the inductive sensor (54) to adjust and move its position.

9. The device for preparing a wafer-level two-dimensional material thin film according to claim 8, characterized in that: The adsorption system is replaced with a reverse system structure, which includes a blowing pump (58), a blowing channel (62) and a reverse suction head (63). The reverse suction head (63) is arranged on the top of the adsorption ring fork (57). The blowing channel (62) is arranged inside the adsorption ring fork (57) and is connected to the blowing pump (58) to transport the gas to the reverse suction head (63). The reverse suction head (63) is provided with an annular high-pressure groove (64) and a low-pressure adsorption column (65) is formed at the center thereof. Air outlet holes (66) are radially provided on the inner side of the annular high-pressure groove (64) and on the circumference of the low-pressure adsorption column (65). The air outlet holes (66) are evenly arranged in multiple groups and are connected to the blowing channel (62). A metal mesh (67) is provided on the outer periphery of the reverse suction head (63).

10. A method for preparing a wafer-level two-dimensional material thin film, comprising the following steps: S1. Take out the base wafer and place it into the growth reaction chamber (6). During the process, ensure that the base wafer is clean, smooth, and flat to avoid bending or damage. S2. After the reaction, the thin film is deposited on the base wafer, and the base wafer is transferred to the thin film transfer table (7). During the process, the wafer is supported from the bottom of the base wafer to avoid touching the thin film; S3. Pick up the peeling tape and stick it on the film. During the process, make sure the tape is flat and avoid wrinkles. S4, pressing the tape with the pressing wheel (28) to make the tape and the film adhere to each other. During the process, the film is rolled multiple times, and the pressure is gradually increased each time. The initial pressure of the pressing wheel (28) is 0.1N, which is gradually increased by 0.3-0.5N. The final pressure is controlled at 1-1.5N. When rolling, the film is rolled in a Z-shaped manner from one side to the other to ensure that the film is fully covered each time. That is, the film is rolled forward from the left side, then moved to the right for a certain distance, rolled backward, and then moved to the right for a certain distance and rolled forward until the film is fully covered. Each time the unidirectional rolling is performed, a repeated coverage rate of 30% to 50% is maintained. If the effective coverage width of the pressing wheel (28) is 2 cm, when the pressing wheel (28) enters from the left side, rolls forward, moves 1 cm to the right, and then moves backward, the repeated coverage rate of the rolling is 50%; S5. When peeling the tape, first pre-peel the outer periphery of the tape, and then peel the tape as a whole; The pre-peeling range is 1 / 10-3 / 10 of the tape radius; the pre-peeling points are evenly distributed and ≥8; the distance between adjacent points is ≤1 / 5 of the film side length; the peeling angle is 85-95°; S6. After peeling, keep the tape flat and transfer it to the target substrate.

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