Integrated circuit PCB processing equipment and working method thereof

Abstract

The invention relates to the field of integrated circuit production and manufacturing, in particular to integrated circuit PCB machining equipment and a working method thereof.The integrated circuit PCB machining equipment comprises a copper-clad tank, the copper-clad tank is filled with an electrolyte solution used for connecting through hole copper cladding of all layers of circuits in a multi-layer PCB, and the electrolyte solution is filled with an electrolyte solution used for connecting through hole copper cladding of all layers of circuits in the multi-layer PCB. A circuit board loading device is fixedly erected at the upper end of the copper-clad groove, a copper-clad moving plate is slidably connected to the bottom face of the copper-clad groove, a plurality of copper-clad mounting rods are mounted on the copper-clad moving plate, copper-clad mounting parts are fixedly mounted at the ends, facing the middle position of the copper-clad groove, of the copper-clad mounting rods, and copper-clad sheets are filled on the copper-clad mounting parts. The problems that in the prior art, in the hole filling process, procedures are complex, and cost is high can be solved.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit manufacturing, and in particular to processing equipment for an integrated circuit PCB board and a working method thereof. Background Art

[0002] PCBs serve as the base for electronic components, providing them with stable physical support. This support ensures the stable position of electronic components within the device, preventing them from falling or being damaged by vibration or external environmental factors. Furthermore, the design of PCBs allows for compact component arrangement, contributing to the miniaturization and lightweighting of electronic devices. The PCB fabrication process includes the following steps:

[0003] 1. Preliminary Preparation

[0004] 2. Inner layer inspection and lamination

[0005] 3. Drilling and electroplating

[0006] 5. Surface treatment and character printing

[0007] 6. Forming and cutting

[0008] After the drilling process is completed, the PCB board will be immersed in a special solution. The purpose of the immersion is to activate the material of the hole wall so that the hole wall can more easily absorb copper ions. Then the activated board is immersed in a chemical reagent containing copper ions. In this way, the copper ions in the reagent can be deposited on the surface of the hole wall to form a conductive layer. However, the hole still exists at this time. However, if the PCB board is directly processed to the next step, it will cause other electronic components to be directly soldered to the hole during use. The solder will easily sink into the hole, resulting in cold solder joints and desoldering. Therefore, the traditional method is to use the equipment in the Resin is added to the above-mentioned cavity and baked, and finally copper is coated on the surface filled with resin to avoid the problem of cold solder joints or desoldering when soldering electronic components. However, the above technical process is very complicated and requires a large amount of equipment. Therefore, it is suitable for large-scale, highly integrated work environments. However, when facing some PCB boards with simpler functions and larger hole diameters, it no longer has a cost advantage due to its complicated process. There is also an alternative to directly coating the cavity with copper, but this method will result in a significant increase in copper consumption and a significant increase in processing time, resulting in increased costs. Summary of the Invention

[0009] The present invention provides a processing device for an integrated circuit PCB board, which can solve the problems of complex procedures and high costs in the hole filling process in the prior art.

[0010] include:

[0011] A copper coating tank containing an electrolyte solution for copper coating of through-holes in a multi-layer PCB for connecting circuit layers;

[0012] A circuit board loading device is mounted at the upper end of the middle of the copper cladding groove;

[0013] A copper-clad hole sealing device, comprising a copper-clad movable plate, the copper-clad movable plate being slidably connected to the bottom surface of the copper-clad groove in a front-to-rear direction, a plurality of copper-clad mounting rods being mounted on the copper-clad movable plate, and a copper-clad mounting portion being fixedly mounted on one end of the copper-clad mounting rod facing the middle position of the copper-clad groove;

[0014] A filling copper clad sheet is mounted on the copper clad mounting portion.

[0015] Preferably, the copper-clad mounting portion includes a copper-clad fixing rod, an ion flow sleeve and a directional moving coil. The copper-clad fixing rod is fixedly mounted on the copper-clad mounting rod. The copper-clad fixing rod is provided with an ion flow sleeve. The ion flow sleeve is hollow. Both sections of the ion flow sleeve are uniformly processed with through holes communicating with the interior thereof in a circumferential direction. The outer side of the ion flow sleeve is provided with a directional moving coil. The end of the copper-clad fixing rod is processed with a protruding block for placing a filling copper-clad sheet, and the protruding block is made of a conductive material embedded with a magnet.

[0016] Preferably, the ion flow sleeve is slidably connected to the copper-clad fixing rod, and a top pressure spring is provided on the copper-clad fixing rod. The two ends of the top pressure spring are respectively fixedly installed on the end of the ion flow sleeve where the filling copper-clad sheet is not placed and the end of the copper-clad fixing rod. The ion flow sleeve is fixedly installed with an ion guide cover for guiding ions at the end where the filling copper-clad sheet is installed.

[0017] Preferably, the copper-clad hole sealing device includes two copper-clad movable plates, which are symmetrically connected to the copper-clad groove for sliding along the front-to-back direction. The copper-clad movable plates include an orientation frame and a multi-directional movable plate. The orientation frame is connected to the bottom surface of the copper-clad groove for sliding along the front-to-back direction, and the multi-directional movable plate is connected to the orientation frame for sliding along the left-right direction. A copper-clad sheet storage mechanism is fixedly installed on the multi-directional movable plate, and an alignment mechanism for aligning the copper-clad mounting portion with the copper-clad sheet storage mechanism is provided on the upper and lower left and right sides of the two copper-clad movable plates.

[0018] Preferably, the copper-clad sheet storage mechanism includes a copper-clad sheet storage tube, a pressing cover and a discharge mechanism, the copper-clad sheet storage tube is fixedly mounted on the multi-directional movable plate, the copper-clad sheet storage tube corresponds one-to-one to the copper-clad mounting rod and is installed to the side of the copper-clad mounting rod, the inner circumference of the copper-clad sheet storage tube is evenly installed with constraint springs, the copper-clad sheet storage tube is spirally installed with a pressing cover at one end on the back side of the multi-directional movable plate, the pressing cover is fixedly installed with a pressing spring on the inner side of the copper-clad sheet storage tube, and the copper-clad sheet storage tube is installed with a discharge mechanism corresponding to the copper-clad mounting part at the opposite end of the multi-directional movable plate.

[0019] Preferably, the discharge mechanism includes a radial moving block, which is slidingly connected to the end of the copper-clad sheet storage tube opposite to the multi-directional moving plate, and a pulling ring is slidingly connected to the copper-clad sheet storage tube along its radial direction, and an inclined slide groove is provided on the radial moving block, and the pulling ring is slidingly connected to the inclined slide groove on the radial moving block, and the ion guide cover is processed into a shape matching the pulling ring, and a reset spring is provided on the copper-clad sheet storage tube, and the two ends of the reset spring are respectively fixedly mounted on the pulling ring and the copper-clad sheet storage tube.

[0020] Preferably, the alignment mechanism includes an alignment rod, a guide rod and a positioning spring. The alignment rod passes through the upper and lower side surfaces of the directional frame and is fixedly connected to the multi-directional movable plate. The guide rod is fixedly installed on the directional frame and corresponds to the alignment rod. The middle position of the guide rod is bent toward the middle direction of the directional frame. A positioning spring is fixedly connected between the multi-directional movable plate and the directional frame.

[0021] Preferably, the surface of the raised block is processed with multiple layers of raised portions, and the filling copper clad sheet is embedded in the surface of the raised block.

[0022] Preferably, the circuit board loading device includes a PCB board loading roller, which is rotatably mounted on the upper end of the copper clad groove, and the PCB board mounting groove is evenly processed circumferentially on the PCB board loading roller. The inner layer of the PCB board mounting groove is made of damping material such as rubber. The upper end of the copper clad groove is located on the left and right sides of the PCB board loading roller, and a pushing hydraulic cylinder is fixedly mounted downward. A clamping block is fixedly mounted on the downward telescopic end of the pushing hydraulic cylinder, and a clamping plate is symmetrically slidably connected to the clamping block.

[0023] The present invention provides a working method of an integrated circuit PCB processing device, comprising the following steps:

[0024] S1: First, the PCB is placed into the copper clad slot by the circuit board loading device. After the drilling process, the surface of the hole wall of the PCB has been activated. At this time, the copper ions in the electrolyte solution will adhere to the surface of the hole wall. At the same time, the copper clad moving plate will move towards the PCB until the filled copper clad sheet is close to the port on the PCB.

[0025] S2: Applying electricity to the surface of the filled copper clad sheet through the copper clad mounting portion, so that the surface of the filled copper clad sheet is filled with negative charges;

[0026] S3: The copper-clad filling sheet will attract copper ions to accumulate on its surface until the accumulated copper is connected to the copper on the hole wall. At this time, a hollow cylindrical structure will be formed on the hole wall and at both ends of the through hole on the PCB board.

[0027] Beneficial effects:

[0028] 1. The present invention causes the copper-clad movable plate to move toward the PCB until the filled copper-clad sheet is close to the port on the PCB. Then, the copper-clad mounting portion applies electricity to the surface of the filled copper-clad sheet, causing the surface of the filled copper-clad sheet to be filled with negative charge. At this time, the filled copper-clad sheet attracts copper ions to accumulate on its surface until the accumulated copper connects with the copper on the hole wall. At this time, a hollow cylindrical structure is formed on the hole wall and at both ends of the through-hole on the PCB. This eliminates the need for resin filling and further copper cladding operations, and avoids the need to fill the voids on the PCB using a copper cladding process. This avoids the increase in cost caused by the complexity of the process, as well as the increase in copper usage and processing time.

[0029] 2. The present invention generates a directional magnetic field in the directional moving coil by passing direct current into the directional moving coil, thereby promoting the directional movement of copper ions in the ion circulation sleeve. The advantage of this is that the probability of contact between the hole walls and the filling copper cladding on the PCB board and the copper ions is greatly increased, thereby increasing the speed of copper ion accumulation on the hole walls and the filling copper cladding on the PCB board, thereby improving work efficiency.

[0030] 3. The present invention stores a large amount of filled copper clad sheets at one time through the copper clad sheet storage mechanism, which is conducive to quickly processing multiple PCB boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 For the present invention Figure 1 A schematic diagram of the partially enlarged structure at center A;

[0033] Figure 3Schematic diagram of the structure of the copper hole sealing device in the present invention;

[0034] Figure 4 Schematic diagram of the structure of the copper-clad mounting portion of the present invention;

[0035] Figure 5 is a cross-sectional view of the copper-clad mounting portion of the present invention;

[0036] Figure 6 Schematic diagram of the coordination between the filled copper clad sheet and the raised block in the present invention;

[0037] Figure 7 Schematic diagram of the structure of the copper-clad sheet storage mechanism of the present invention;

[0038] Figure 8 For the present invention Figure 7 Schematic diagram of the locally enlarged structure at point B in the middle.

[0039] Description of reference numerals:

[0040] 1. Copper cladding groove; 2. PCB loading device; 21. PCB board loading roller; 211. PCB board mounting groove; 22. Pushing hydraulic cylinder; 23. Clamping block; 24. Clamping plate; 3. Copper cladding hole sealing device; 31. Copper cladding moving plate; 311. Orienting frame; 312. Multi-directional moving plate; 32. Copper cladding mounting rod; 33. Copper cladding mounting part; 331. Copper cladding fixing rod; 3311. Protruding block; 3312. Pressing spring; 332. Ion flow Through sleeve; 333, directional moving coil; 334, ion guide shield; 34, copper-clad sheet storage mechanism; 341, copper-clad sheet storage tube; 342, clamping cover; 3421, clamping spring; 343, discharge mechanism; 3431, radial moving block; 3432, pulling ring; 3433, reset spring; 344, restraining spring; 35, alignment mechanism; 351, alignment rod; 352, guide rod; 353, positioning spring; 4, filling copper-clad sheet. DETAILED DESCRIPTION

[0041] The specific embodiments of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0042] like Figures 1 to 8 As shown, the present invention provides an integrated circuit PCB processing device, comprising:

[0043] A copper coating tank 1 containing an electrolyte solution for copper coating of through-holes in a multi-layer PCB for connecting circuit layers;

[0044] A circuit board loading device 2 is mounted at the upper end of the middle of the copper cladding tank 1;

[0045] A copper-clad hole sealing device 3 includes a copper-clad movable plate 31, which is slidably connected to the bottom surface of the copper-clad groove 1 in the front-to-back direction. A plurality of copper-clad mounting rods 32 are mounted on the copper-clad movable plate 31, and a copper-clad mounting portion 33 is fixedly mounted on one end of the copper-clad mounting rod 32 toward the middle of the copper-clad groove 1;

[0046] A filling copper clad sheet 4 is installed on the copper clad installation portion 33 .

[0047] It should be noted that when copper cladding is performed on a PCB, the PCB is first placed in the copper cladding groove 1 by the circuit board loading device 2. At this time, the surface of the hole wall of the PCB has been activated after the drilling process. At this time, the copper ions in the electrolyte solution will adhere to the surface of the hole wall. At the same time, the copper cladding moving plate 31 will move toward the PCB until the filled copper cladding sheet 4 is close to the port on the PCB. Then, the surface of the filled copper cladding sheet 4 is energized through the copper cladding mounting portion 33, so that the surface of the filled copper cladding sheet 4 is filled with negative charge. At this time, the filled copper cladding sheet 4 will attract copper ions to accumulate on its surface until the accumulated copper is connected to the copper on the hole wall. At this time, a hollow cylindrical structure will be formed on the hole wall and at both ends of the through-hole on the PCB. In this way, there is no need to perform resin filling and further copper cladding operations, and it also avoids using the copper cladding process to fill the voids on the PCB. This not only avoids the increase in cost caused by the complexity of the process, but also avoids the increase in copper usage and the increase in processing time.

[0048] like Figure 1 、 Figures 3 to 6 As shown, the copper-clad mounting portion 33 includes a copper-clad fixing rod 331, an ion flow sleeve 332 and a directional moving coil 333. The copper-clad fixing rod 331 is fixedly mounted on the copper-clad mounting rod 32. The copper-clad fixing rod 331 is provided with an ion flow sleeve 332. The ion flow sleeve 332 is hollow. Both sections of the ion flow sleeve 332 are uniformly processed with through holes communicating with the interior thereof in the circumferential direction. The outer side of the ion flow sleeve 332 is provided with a directional moving coil 333. The end of the copper-clad fixing rod 331 is processed with a protruding block 3311 for placing the filling copper-clad sheet 4, and the protruding block 3311 is made of a conductive material embedded with a magnet.

[0049] It should be noted that, during the copper-cladding process on the hole walls of the PCB, direct current can be passed into the directional moving coil 333 to generate a directional magnetic field in the directional moving coil 333, thereby promoting the directional movement of copper ions in the ion flow sleeve 332. The advantage of this is that the probability of contact between the hole walls and the filling copper-clad sheet 4 on the PCB board and the copper ions is greatly increased, thereby increasing the speed at which copper ions accumulate in the hole walls and the filling copper-clad sheet 4 on the PCB board, thereby improving work efficiency. The raised block 3311 is made of a conductive material embedded with a magnet, which can ensure that the filling copper-clad sheet 4 is adsorbed to prevent it from falling.

[0050] like Figure 4 and Figure 5 As shown, the ion flow sleeve 332 is slidably connected to the copper-clad fixed rod 331, and a top pressure spring 3312 is sleeved on the copper-clad fixed rod 331. The two ends of the top pressure spring 3312 are respectively fixedly installed on the end of the ion flow sleeve 332 where the filling copper-clad sheet 4 is not placed and the end of the copper-clad fixed rod 331. The ion flow sleeve 332 is fixedly installed with an ion guide cover 334 for guiding ions at the end where the filling copper-clad sheet 4 is installed.

[0051] It should be noted that when the copper cladding process is being carried out, when the copper cladding fixing rod 331 drives the protruding block 3311 to approach the hole wall surface of the PCB board, the ion guide cover 334 will first contact the PCB board and form a constrained channel on the surface of the PCB board. At this time, the top pressure spring 3312 will be compressed until the filling copper cladding sheet 4 moves to a position that fits the two ends of the hole wall. This can reduce the impact of the non-directional flow of the liquid in the electrolyte on its movement direction, thereby improving work efficiency.

[0052] like Figure 1 、 Figure 3 、 Figure 7 and Figure 8 As shown, the copper-clad hole sealing device 3 includes two copper-clad movable plates 31, and the copper-clad movable plates 31 are symmetrically slidably connected to the copper-clad groove 1 along the front-to-back direction. The copper-clad movable plates 31 include an orientation frame 311 and a multi-directional movable plate 312. The orientation frame 311 is slidably connected to the bottom surface of the copper-clad groove 1 along the front-to-back direction, and the multi-directional movable plate 312 is slidably connected to the orientation frame 311 in the left-right direction. A copper-clad sheet storage mechanism 34 is fixedly installed on the multi-directional movable plate 312, and an alignment mechanism 35 for aligning the copper-clad mounting portion 33 with the copper-clad sheet storage mechanism 34 is provided between the two copper-clad movable plates 31 on their upper and lower left and right sides.

[0053] It should be noted that, by setting two copper-clad movable plates 31, the copper-clad mounting portion 33 is driven in two directions of the PCB board to approach the two ends of the hole on the PCB board, and then the two ends of the hole are sealed at the same time. After the copper cladding work of the PCB board is completed, the PCB board is taken out, and the copper-clad movable plate 31 is pushed to move relative to it by a pushing device such as a cylinder or a hydraulic cylinder. Its mechanism 35 can control the lateral movement of the multi-directional movable plate 312 to align the copper-clad mounting portion 33 with the opposite copper-clad sheet storage mechanism 34, and take out the filled copper-clad sheet 4 from the opposite copper-clad sheet storage mechanism 34. The above-mentioned technical solution one effectively improves the work efficiency by sealing the holes on both sides at the same time, and the filled copper-clad sheet 4 can be quickly installed on the upper end of the protrusion.

[0054] like Figure 3 、 Figure 7 and Figure 8 As shown, the copper-clad sheet storage mechanism 34 includes a copper-clad sheet storage tube 341, a pressing cover 342 and a discharge mechanism 343. The copper-clad sheet storage tube 341 is fixedly mounted on the multi-directional movable plate 312. The copper-clad sheet storage tube 341 corresponds one-to-one to the copper-clad mounting rod 32 and is installed to the side of the copper-clad mounting rod 32. The inner circumference of the copper-clad sheet storage tube 341 is evenly installed with a restraining spring 344. The copper-clad sheet storage tube 341 is spirally installed with a pressing cover 342 at one end on the back side of the multi-directional movable plate 312. The pressing cover 342 is fixedly installed with a pressing spring 3421 on the inner side of the copper-clad sheet storage tube 341. The copper-clad sheet storage tube 341 is installed with a discharge mechanism 343 corresponding to the copper-clad mounting part 33 at the opposite end of the multi-directional movable plate 312.

[0055] It should be noted that during the installation process of the filling copper clad sheet 4, the clamping cover 342 is unscrewed, and the filling copper clad sheet 4 is pressed into the copper clad sheet storage tube 341 in turn. The restraining spring 344 can apply a slight damping effect to the filling copper clad sheet 4 to ensure that the filling copper clad sheet 4 is placed layer by layer in the copper clad sheet storage tube 341. Then the clamping cover 342 is screwed on. At this time, the clamping spring 3421 will apply pressure to the filling copper clad sheet 4, and the filling copper clad sheet 4 is restrained by the discharge mechanism 343. Through the above-mentioned device, a large number of filling copper clad sheets 4 can be stored at one time for multiple processing.

[0056] like Figure 7 and Figure 8As shown, the discharge mechanism 343 includes a radial moving block 3431, which is slidably connected to the end of the copper-clad sheet storage tube 341 opposite to the multi-directional moving plate 312, and a pulling ring 3432 is slidably connected to the copper-clad sheet storage tube 341 along its radial direction. An inclined sliding groove is provided on the radial moving block 3431, and the pulling ring 3432 is slidably connected to the inclined sliding groove on the radial moving block 3431. The ion guide cover 334 is processed into a shape that matches the pulling ring 3432, and a reset spring 3433 is provided on the copper-clad sheet storage tube 341. The two ends of the reset spring 3433 are respectively fixedly mounted on the pulling ring 3432 and the copper-clad sheet storage tube 341.

[0057] The cam 330 is in contact with the outer ring 3432 and the outer ring 3433 is in contact with the inner ring 3434.

[0058] like Figure 3 As shown, the alignment mechanism 35 includes an alignment rod 351, a guide rod 352 and a positioning spring 353. The alignment rod 351 passes through the upper and lower side surfaces of the orientation frame 311 and is fixedly connected to the multi-directional movable plate 312. The guide rod 352 is fixedly installed on the orientation frame 311 and corresponds to the alignment rod 351. The middle position of the guide rod 352 is bent toward the middle direction of the orientation frame 311. A positioning spring 353 is fixedly connected between the multi-directional movable plate 312 and the orientation frame 311.

[0059] It should be noted that in the process of making the multi-directional movable plate 312 move laterally, when the alignment rod 351 enters the guide rod 352, it will slide along the guide rod 352. When it slides to the bending part of the orientation frame 311, the alignment rod 351 will drive the multi-directional movable plate 312 to move laterally and align the copper-clad mounting part 33 with the copper-clad sheet storage tube 341.

[0060] like Figure 6As shown, the surface of the protruding block 3311 is processed with multiple layers of protrusions, and the filling copper clad sheet 4 is embedded in the surface of the protruding block 3311.

[0061] This can effectively prevent the filled copper clad sheet 4 from randomly moving laterally, thereby affecting the processing accuracy.

[0062] like Figure 1 and Figure 2 As shown, the circuit board loading device 2 includes a PCB board loading roller 21, which is rotatably mounted on the upper end of the copper clad groove 1. The PCB board loading roller 21 is evenly processed with a PCB board mounting groove 211 in the circumferential direction. The inner layer of the PCB board mounting groove 211 is made of a damping material such as rubber. The upper end of the copper clad groove 1 is located on the left and right sides of the PCB board loading roller 21, and a pushing hydraulic cylinder 22 is fixedly mounted downward. The downward telescopic end of the pushing hydraulic cylinder 22 is fixedly mounted with a clamping block 23, and a clamping plate 24 is symmetrically slidably connected to the clamping block 23.

[0063] It should be noted that when the PCB board moves to the bottom, the PCB board is clamped by the pressure plate. The pressure plate can be driven by a pneumatic push rod or a hydraulic rod. Then, the PCB board is pushed into the copper cladding groove 1 by pushing the hydraulic cylinder 22. After the copper cladding operation of the PCB board is completed, the PCB board is pulled out of the copper cladding groove 1 by pushing the hydraulic cylinder 22. Then, the clamping plate 24 is released and the PCB board loading roller 21 is rotated to process the next PCB board. The above method can effectively improve the processing connection and thus improve the work efficiency.

[0064] In addition, the present invention also provides a working method of an integrated circuit PCB processing device, comprising the following steps:

[0065] S1: First, the PCB is placed into the copper clad slot 1 by the circuit board loading device 2. After the drilling process, the surface of the hole wall of the PCB has been activated. At this time, the copper ions in the electrolyte solution will adhere to the surface of the hole wall. At the same time, the copper clad movable plate 31 will move toward the PCB until the filled copper clad sheet 4 is close to the port on the PCB.

[0066] S2: applying electricity to the surface of the filled copper clad sheet 4 through the copper clad mounting portion 33, so that the surface of the filled copper clad sheet 4 is filled with negative charges;

[0067] S3: The copper clad sheet 4 will attract copper ions to accumulate on its surface until the accumulated copper is connected to the copper on the hole wall. At this time, a hollow cylindrical structure will be formed on the hole wall and at both ends of the through hole on the PCB board.

[0068] The above disclosures are only a few specific embodiments of the present invention. However, the embodiments of the present invention are not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the scope of protection of the present invention.

Claims

1. A processing equipment for integrated circuit PCB board, characterized in that: include: A copper cladding tank (1), wherein the copper cladding tank (1) contains an electrolyte solution for copper cladding of through holes for connecting circuits of various layers in a multi-layer PCB board; A circuit board loading device (2), the circuit board loading device (2) being mounted at the upper end of the middle of the copper cladding tank (1); A copper-clad hole sealing device (3), comprising a copper-clad movable plate (31), the copper-clad movable plate (31) being slidably connected to the bottom surface of the copper-clad groove (1) in a front-to-rear direction, a plurality of copper-clad mounting rods (32) being mounted on the copper-clad movable plate (31), and a copper-clad mounting portion (33) being fixedly mounted on one end of the copper-clad mounting rod (32) facing the middle position of the copper-clad groove (1); A filling copper clad sheet (4) is mounted on the copper clad mounting portion (33).

2. The processing equipment for an integrated circuit PCB board according to claim 1, characterized in that: The copper-clad mounting portion (33) comprises a copper-clad fixing rod (331), an ion circulation sleeve (332) and a directional moving coil (333). The copper-clad fixing rod (331) is fixedly mounted on the copper-clad mounting rod (32). The copper-clad fixing rod (331) is provided with an ion circulation sleeve (332). The ion circulation sleeve (332) is hollow. Both ends of the ion circulation sleeve (332) are uniformly processed with through holes communicating with the interior thereof in a circumferential direction. The outer side of the ion circulation sleeve (332) is provided with a directional moving coil (333). The end of the copper-clad fixing rod (331) is processed with a protruding block (3311) for placing a filling copper-clad sheet (4), and the protruding block (3311) is made of a conductive material embedded with a magnet.

3. The processing equipment for an integrated circuit PCB board according to claim 2, characterized in that: The ion circulation sleeve (332) is slidably connected to the copper-clad fixed rod (331); a top pressure spring (3312) is sleeved on the copper-clad fixed rod (331); two ends of the top pressure spring (3312) are respectively fixedly mounted on one end of the ion circulation sleeve (332) where no filling copper-clad sheet (4) is placed and the end of the copper-clad fixed rod (331); an ion guide cover (334) for guiding ions is fixedly mounted on the end of the ion circulation sleeve (332) where the filling copper-clad sheet (4) is installed.

4. The processing equipment for an integrated circuit PCB board according to claim 3, characterized in that: The copper-clad hole sealing device (3) comprises two copper-clad movable plates (31), the copper-clad movable plates (31) are symmetrically slidably connected to the copper-clad groove (1) along the front-back direction, the copper-clad movable plates (31) comprise an orientation frame (311) and a multi-directional movable plate (312), the orientation frame (311) is slidably connected to the bottom surface of the copper-clad groove (1) along the front-back direction, the multi-directional movable plate (312) is slidably connected to the orientation frame (311) in the left-right direction, a copper-clad sheet storage mechanism (34) is fixedly mounted on the multi-directional movable plate (312), and an alignment mechanism (35) for aligning the copper-clad mounting portion (33) with the copper-clad sheet storage mechanism (34) is provided on the upper and lower left and right sides of the two copper-clad movable plates (31).

5. The processing equipment for an integrated circuit PCB board according to claim 4, characterized in that: The copper-clad sheet storage mechanism (34) comprises a copper-clad sheet storage tube (341), a pressing cover (342) and a discharge mechanism (343). The copper-clad sheet storage tube (341) is fixedly mounted on the multi-directional movable plate (312). The copper-clad sheet storage tube (341) corresponds one-to-one to the copper-clad mounting rod (32) and is mounted on the side of the copper-clad mounting rod (32). Constraint springs (344) are evenly mounted on the inner circumference of the copper-clad sheet storage tube (341). The copper-clad sheet storage tube (341) is spirally mounted with a pressing cover (342) at one end on the back side of the multi-directional movable plate (312). The pressing cover (342) is fixedly mounted with a pressing spring (3421) on the inner side of the copper-clad sheet storage tube (341). The copper-clad sheet storage tube (341) is mounted with a discharge mechanism (343) corresponding to the copper-clad mounting portion (33) at the opposite end of the multi-directional movable plate (312).

6. The processing equipment for an integrated circuit PCB board according to claim 5, characterized in that: The discharge mechanism (343) includes a radial moving block (3431), which is slidably connected to the end of the copper-clad sheet storage tube (341) opposite to the multi-directional moving plate (312), and a pulling ring (3432) is slidably connected to the copper-clad sheet storage tube (341) along its radial direction. An inclined sliding groove is provided on the radial moving block (3431), and the pulling ring (3432) is slidably connected to the inclined sliding groove on the radial moving block (3431). The ion guide cover (334) is processed into a shape that matches the pulling ring (3432). A reset spring (3433) is sleeved on the copper-clad sheet storage tube (341), and the two ends of the reset spring (3433) are respectively fixedly mounted on the pulling ring (3432) and the copper-clad sheet storage tube (341).

7. The processing equipment for an integrated circuit PCB board according to claim 6, characterized in that: The alignment mechanism (35) comprises an alignment rod (351), a guide rod (352) and a positioning spring (353); the alignment rod (351) passes through the upper and lower side surfaces of the orientation frame (311) and is fixedly connected to the multi-directional movable plate (312); the guide rod (352) is fixedly mounted on the orientation frame (311) and corresponds to the alignment rod (351); the middle position of the guide rod (352) is bent toward the middle direction of the orientation frame (311); and a positioning spring (353) is fixedly connected between the multi-directional movable plate (312) and the orientation frame (311).

8. The processing equipment for an integrated circuit PCB board according to claim 2, characterized in that: The surface of the raised block (3311) is processed with multiple layers of protrusions, and the filling copper-clad sheet (4) is embedded in the surface of the raised block (3311).

9. The processing equipment for integrated circuit PCB according to claim 1, characterized in that: The circuit board loading device (2) comprises a PCB board loading roller (21), the PCB board loading roller (21) is rotatably mounted on the upper end of the copper cladding groove (1), a PCB board mounting groove (211) is uniformly processed circumferentially on the PCB board loading roller (21), the inner layer of the PCB board mounting groove (211) is made of a damping material such as rubber, the upper end of the copper cladding groove (1) is located at the left and right sides of the PCB board loading roller (21), and a pushing hydraulic cylinder (22) is fixedly mounted downward, the downward telescopic end of the pushing hydraulic cylinder (22) is fixedly mounted with a clamping block (23), and a clamping plate (24) is symmetrically slidably connected to the clamping block (23).

10. A working method of an integrated circuit PCB processing device, characterized in that: The working method is applicable to the processing equipment of an integrated circuit PCB board in claim 1, comprising the following steps: S1: First, the PCB is placed in the copper clad groove (1) by the circuit board loading device (2). At this time, the surface of the hole wall of the PCB has been activated after the drilling process. At this time, the copper ions in the electrolyte solution will adhere to the surface of the hole wall. At the same time, the copper clad movable plate (31) will move toward the PCB until the filled copper clad sheet (4) is close to the port on the PCB; S2: applying electricity to the surface of the filled copper-clad sheet (4) through the copper-clad mounting portion (33), so that the surface of the filled copper-clad sheet (4) is filled with negative charges; S3: The copper-clad sheet (4) will attract copper ions to accumulate on its surface until the accumulated copper is connected to the copper on the hole wall. At this time, a hollow cylindrical structure will be formed on the hole wall and at both ends of the through hole on the PCB board.

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