A desktop CO2 laser processing machine and its cooling system

Abstract

The present invention discloses a desktop CO2 laser processing machine and its cooling system, belonging to the technical field of laser processing equipment. The cooling system of the present invention includes a circulating cooling unit and an air compression refrigeration module. The circulating cooling unit is used to cool the laser oscillator using a circulating cooling medium, and the air compression refrigeration module is used to perform heat exchange cooling on the cooling medium in the circulating cooling unit. The present invention separates the condenser from the air compression refrigeration module and installs it on the side wall of the device body where the air inlet channel is located, and is located downstream of the air inlet of the outer plate of the side wall. This allows the refrigeration module to be integrated with the laser processing machine without increasing the device's external dimensions, and effectively ensures its cooling efficiency. At the same time, the present invention also eliminates the need to install additional cooling fans and air filters for the condenser.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser processing equipment, and more specifically, relates to a desktop CO2 laser processing machine and a cooling system thereof. Background Art

[0002] A laser processing machine is a device that cuts by irradiating a laser beam from a laser torch onto the material being cut and injecting assist gas. During laser cutting, the laser beam emitted from a laser oscillator is focused by a lens, forming a high-energy-density laser spot on the material being cut. Within the material where the laser spot is formed, the base material evaporates or melts, which is then removed from the material by the injected assist gas. The laser torch is then moved to form a continuous groove in the material, completing the cutting process.

[0003] Among them, the laser oscillator is a device that converts electrical energy into light energy. It is the main equipment for generating lasers and the core component of laser processing equipment. However, its efficiency in converting to light energy is not high. Most of the electrical energy is converted into heat energy. This requires the use of a cooling medium to remove excess heat to ensure that the oscillator can continue to work normally.

[0004] Small desktop laser processing machines (approximately 500-850mm in length, 400-600mm in width, and 200-300mm in height) are popular among individual users due to their compact size and minimal footprint, allowing them to be used directly at home. However, due to the small size of desktop laser processing machines, it is crucial to install a cooling system that maintains efficient cooling of the oscillator's cooling medium without increasing the overall size of the machine.

[0005] Furthermore, desktop laser processing machines typically use universal household power outlets for power supply, and household outlets in different countries can provide different amounts of power. Therefore, balancing the power consumption and cooling capacity of the laser processing machine to adapt to the power supply requirements of household outlets in various countries is another technical issue that needs to be addressed. Summary of the Invention

[0006] To address the existing challenges of integrating a cooling system into a desktop CO2 laser processing machine due to limited installation space and the inability to effectively guarantee cooling efficiency, the present invention provides a desktop CO2 laser processing machine and its cooling system. By utilizing an air compression cooling module to circulate cooling for the laser oscillator's cooling medium and optimizing its installation and distribution, the present invention achieves integration of the cooling module with the laser processing machine without increasing the machine's overall dimensions, effectively guaranteeing cooling efficiency.

[0007] At the same time, the air compression refrigeration module of the present application has low power consumption, can effectively balance power consumption and refrigeration capacity, and meet the demand for power supply from household sockets in different countries.

[0008] In order to achieve the above object, the technical solution provided by the present invention is:

[0009] A first aspect of the present invention provides a cooling system for a desktop CO2 laser processing machine, comprising:

[0010] a circulating cooling unit, the circulating cooling unit comprising a cooling medium circulation loop and a cooling water tank, the cooling medium circulation loop connecting the laser oscillator and the cooling water tank so that the cooling medium circulates, thereby cooling the laser oscillator; and

[0011] An air compression refrigeration module, which includes an air compressor, a condenser, a throttling device, and a heat exchanger connected in series by pipes to form a closed refrigerant circulation loop, and is used to perform heat exchange cooling on the cooling medium in the circulating cooling unit;

[0012] Among them, the laser oscillator, air compressor, throttling device and heat exchanger are all installed inside the device body of the laser processing machine. One side wall of the device body is provided with an outer plate and an inner base plate. A gap space for installing and accommodating the condenser is formed between the outer plate and the inner base plate. The device body is provided with an air intake channel, which allows external clean air to pass through the condenser arranged in the narrow gap between the outer plate and the inner base plate, and then enter the laser processing area, so that the airflow can effectively take away the heat generated by the condenser.

[0013] Small desktop laser processing machines have small overall dimensions and limited internal installation space. Therefore, how to achieve an integrated design of the cooling system and the laser processing machine without increasing its overall size and meet its requirements for the cooling efficiency of the laser oscillator has always been a technical problem that technical personnel in this field urgently need to solve, and it is also one of the difficulties that restrict its promotion and application.

[0014] The applicant of this application has been committed to the research and development of a small, home-use desktop laser processing machine. Initially, the applicant considered using an existing air compression refrigeration system to cool the circulating coolant used to cool the laser oscillator, but was forced to abandon this approach due to the limited installation space within the desktop laser processing machine. Later, during the research process, the applicant discovered that by using Peltier cooling elements to cool the circulating coolant and optimizing the layout of all components within the laser processing machine, it was possible to integrate a cooling system with sufficient cooling power into the desktop laser processing machine (within the laser processing machine). For details, please refer to Chinese patent application number 2018800057699.

[0015] However, the semiconductor refrigeration system described in the aforementioned patent application has been found to have the following problems during long-term market verification:

[0016] (1) Since the Peltier cooling element itself generates a large amount of heat during the cooling process, its cooling capacity is limited, and an additional heat dissipation unit needs to be installed for heat dissipation. When the laser processing machine is used to engrave wood or acrylic boards and other materials that are prone to generate oil smoke and dust, the air filter and radiator in front of the heat dissipation unit will soon be covered with oil smoke or dust, causing the exhaust to be blocked. The laser processing machine cannot exhaust, resulting in the heat dissipation unit being unable to dissipate heat, causing the temperature of the heat dissipation surface of the Peltier cooling plate to be too high and unable to transfer heat, which ultimately causes the laser processing machine to be unable to cool and exhaust, causing a malfunction.

[0017] (2) The cooling capacity of the Peltier cooling system will weaken as the temperature difference between the heating surface and the heat absorbing surface increases. In other words, when the water temperature gradually decreases during operation, the temperature difference (ΔT) between the heating surface and the heat absorbing surface continues to increase. At this time, the power consumption of the Peltier cooling system remains unchanged, but the cooling efficiency will become increasingly smaller as the temperature difference increases. In this case, the solution of using Peltier cooling sheets for cooling in summer will result in the water temperature not being able to drop to the ideal temperature.

[0018] (3) The desktop laser processing machine is designed to be powered by a universal household power socket. The power supply of a single socket is limited. At the same time, the power supply of household sockets in different countries is also different. The power supply of the socket must meet the power required for the operation of the laser processing machine itself and the power required for the operation of the cooling system. The maximum thermal conversion power of the Peltier cooling plate is about 50%, which results in the power supply of some power sockets not being able to take into account the power consumption and cooling capacity requirements of the entire laser processing machine at the same time, affecting its applicability.

[0019] For example, the maximum power supply of a single outlet in Japan is 100V 15A, or 1500VA. In this case, the maximum apparent power of the equipment must be below 1500VA; otherwise, it cannot use a standard household outlet. Assuming the required cooling capacity is 400W, then using a Peltier cooling system requires an apparent power of at least 800VA. Therefore, the power consumption of the laser cutting machine itself (700W) plus the cooling system (800W) equals 1500W. The power consumption of the entire laser processing machine exceeds the power supply of a standard outlet.

[0020] Therefore, the development of a cooling system with higher cooling efficiency, capable of installation in limited and narrow spaces, and capable of balancing the dual requirements of laser processing machine power consumption and cooling capacity with the power supply of household power outlets, in order to address the aforementioned technical issues of Peltier cooling systems, is the research focus of this application and also a technical difficulty that needs to be overcome. Based on the above situation, the inventors of this application reconsidered the use of compressor cooling instead of semiconductor cooling. The reason is that semiconductor cooling elements (Peltier elements) rely on the heat pump effect generated by current passing through the junction of two different conductive materials to transfer heat from one side to the other. However, this process is inherently limited by the material's thermoelectric figure of merit (for example, the limited ZT value of Bi2Te3 material) and the inherent thermal resistance of the structure, resulting in some electrical energy being lost to overcoming internal resistance, rather than being fully utilized for cooling. In practical applications, the heat dissipation surface of the cooling element is typically tightly integrated into the component assembly. If the heat sink is separated or placed too far apart, the heat transfer efficiency will be greatly reduced, further affecting the coefficient of performance (COP) of the semiconductor cooling system. In contrast, compressor refrigeration uses the phase change process of the refrigerant and the principle of using a heat pump to transport ambient heat energy, and its actual COP is higher (can reach 4-5 or even higher under ideal conditions), so that more cooling capacity can be output per unit of electrical energy, and the thermal resistance of each component of the system can also be more reasonably matched and balanced through the overall structural design, thereby ensuring that high cooling efficiency is maintained under large temperature differences.

[0021] In summary, compressor cooling can overcome the energy losses associated with thermal resistance and insufficient heat dissipation in semiconductor refrigeration, significantly improving the overall efficiency of the cooling system and meeting the dual requirements of high-performance desktop laser processing machines for cooling capacity and power consumption control. However, the main technical challenge remains to achieve an integrated design of the compressor cooling system and the laser processing machine without significantly increasing the overall size of the desktop laser processing machine.

[0022] The inventors of this applicant have creatively optimized the overall layout of the air compression refrigeration module through a large number of experimental studies, thereby effectively breaking the installation space restrictions of the desktop laser processing machine and effectively improving the refrigeration efficiency of the refrigeration system while meeting the installation space requirements.

[0023] Specifically, this application breaks the inherent thinking and separates the large component condenser in the air compression refrigeration module and installs it in the narrow gap space between the outer plate and the inner base plate of one side wall of the device body, while the compressor and other related components are installed together with the laser oscillator inside the device body, thereby realizing the integration of the air compression refrigeration module and the laser processing machine equipment, solving the technical problem that the overall size of the desktop laser processing machine is small and it is inconvenient to install the refrigeration system. The refrigeration efficiency of the air compression refrigeration module is significantly higher than that of the Peltier refrigeration system, so that the laser processing machine can meet the requirements of power consumption and refrigeration capacity at the same time.

[0024] In addition, existing commonly used air compression refrigeration modules usually require the use of a cooling fan to dissipate heat from the condenser fins separately. This will increase the requirements for installation space on the one hand, and on the other hand, it will also increase the noise during the operation of the processing equipment. At the same time, it will also disrupt the airflow entering the processing work area inside the processing machine, worsening the processing environment, causing smoke and oil to spread to every corner inside the laser processing machine, causing various faults. Therefore, the present application installs the condenser separately in the gap space between the outer plate and the inner base plate of one side wall of the laser processing machine. The air intake channel allows external clean air to pass through the condenser to remove the heat from the condenser fins, and then enter the laser processing area inside the device body, so that the condenser can be cooled and dissipated with the help of the processing machine's own air intake airflow without the need for an additional cooling fan. Therefore, this not only helps to further reduce the requirements for installation space, but also avoids disrupting the airflow entering the processing work area, thereby improving the processing environment, reducing noise pollution, and alleviating the accumulation of oil caused by airflow disturbances.

[0025] In other words, this innovative solution not only overcomes the problem of insufficient efficiency of the Peltier refrigeration system caused by the expansion of temperature differences and environmental pollution, but also provides significant improvements in power consumption, noise and maintenance convenience for desktop laser processing machines, fully demonstrating the technological breakthrough of the present invention in terms of novelty and practicality.

[0026] The cooling medium in the circulating cooling unit is a liquid heat-conducting material. The air compression refrigeration module consists of an air compressor, a condenser, a throttling device, and a heat exchanger, forming a closed refrigerant circulation system. First, the air compressor compresses the low-temperature, low-pressure gaseous refrigerant from the heat exchanger into a high-temperature, high-pressure gaseous state, which is then fed into the condenser. The condenser uses air as the heat dissipation medium, where the refrigerant releases heat, cools, and condenses into a high-pressure, medium-temperature liquid. The liquid refrigerant then passes through a throttling device (such as a capillary tube or a thermal expansion valve) to rapidly reduce its pressure, becoming a low-pressure, low-temperature liquid or a gas-liquid mixture. This mixture then enters the heat exchanger, where it absorbs heat and evaporates. In the heat exchanger (preferably a plate heat exchanger), the refrigerant exchanges heat with the cooling medium. After absorbing heat from the cooling medium, it evaporates into a low-pressure, low-temperature gaseous state, removing heat from the cooling medium and cooling the cooling medium. The evaporated low-pressure gaseous refrigerant is then drawn back into the air compressor, beginning the next cooling cycle. The present invention utilizes the phase change process of refrigerant under high and low pressure to sequentially complete heat release, temperature reduction and heat absorption in the condenser, throttling device and heat exchanger, thereby achieving continuous and stable refrigeration and ensuring the low temperature state of the laser oscillator cooling medium.

[0027] Furthermore, the air compressor is preferably a miniature air compressor driven by direct current power supply, and by selecting a power adapter, the alternating current is converted into direct current for driving, thereby ensuring that the laser processing machine can be used worldwide.

[0028] According to any technical solution described in the first aspect of the present invention, an outer plate air inlet is provided on the outer plate, and an inner base plate air inlet is provided on the inner base plate. The outer plate air inlet, the gap between the outer plate and the inner base plate, and the inner base plate air inlet together form the air inlet channel.

[0029] According to any technical solution described in the first aspect of the present invention, the outer plate air inlet and the inner base plate air inlet are both composed of a plurality of through holes, mesh or grid-like structures;

[0030] According to any technical solution described in the first aspect of the present invention, the inner substrate air inlet is located on the upper side of the inner substrate.

[0031] According to any of the technical solutions described in the first aspect of the present invention, an exhaust duct is provided on one of the side walls of the device body, and an independent exhaust fan is provided on the outside of the exhaust duct; the side wall where the exhaust duct is located is arranged opposite to or adjacent to the side wall where the air inlet duct is located. Under the action of the exhaust fan, on the one hand, dust and oil smoke generated during the processing can be discharged, and on the other hand, clean air from the outside can enter the interior of the processing machine through the air inlet duct and then be discharged through the exhaust duct, thereby taking away the heat generated by the condenser. The air inlet duct is further preferably provided on the side wall opposite to the side wall where the exhaust duct is located, so as to facilitate the uniform discharge of smoke and dust to the outside of the processing machine.

[0032] According to any of the technical solutions described in the first aspect of the present invention, the cooling medium circulation loop includes a cold water supply pipe and a hot water return pipe, one end of the cold water supply pipe is connected to the water inlet of the laser oscillator, and the other end thereof is connected to the cooling water tank through a water pump; one end of the hot water return pipe is connected to the water outlet of the laser oscillator, and the other end thereof is connected to the cooling water tank via a heat exchanger; the cooling medium after heating in the circulating cooling unit is heat exchanged with the refrigerant in the air compression refrigeration module through the heat exchanger, thereby realizing the cooling and cooling of the laser oscillator using the cooling medium.

[0033] According to any technical solution described in the first aspect of the present invention, a drying filter is provided between the condenser and the throttling device.

[0034] According to any of the technical solutions described in the first aspect of the present invention, the control component of the cooling system includes a power supply, a control mainboard and a temperature sensor, wherein the temperature sensor is installed in the cooling water tank for monitoring the temperature of the cooling medium of the circulating cooling unit, and the control mainboard is used to control the speed and start and stop of the air compressor according to the feedback of the temperature sensor.

[0035] The second aspect of the present invention also provides a desktop CO2 laser processing machine, including a device body, which is a box-type structure as a whole, and is equipped with a laser oscillator and a cooling system for cooling the laser oscillator. The cooling system adopts any cooling system described in the first aspect of the present invention.

[0036] According to any technical solution described in the second aspect of the present invention, the laser oscillator, air compressor, throttling device and heat exchanger are all installed inside the device body and close to the rear side wall, wherein the laser oscillator is close to the upper part of the rear side wall and is installed in the laser oscillator box along the length direction of the rear side wall, and the air compressor, throttling device and heat exchanger are all installed in the cooling system box and located below the laser oscillator box.

[0037] Since the condenser of the heating element is moved to the outside of the cooling system box in this application, the cooling system box can be made into a sealed box, which does not require an opening design and does not require an additional fan, thereby avoiding the risk of malfunction caused by dust and oil from the processing work area entering the cooling system.

[0038] More preferably, the exhaust duct of the laser processing machine is provided on the rear side wall and is located between the laser oscillator housing and the cooling system housing, and the condenser is vertically installed on the front side wall, left side wall or right side wall of the device body, or horizontally installed on the bottom plate and on one side close to the front side wall.

[0039] According to any of the technical solutions described in the second aspect of the present invention, the front side wall, rear side wall, left side wall and right side wall of the device body are all double-layer structures composed of outer panels and inner base panels, wherein four inner base panels are installed on the bottom plate of the device body and surround to form a mounting base, and the condenser is fixedly installed on the outer side of the front inner base panel along the length direction; the four outer panels and the upper wall of the device body together form the upper cover of the casing and are covered on the outside of the mounting base.

[0040] Furthermore, a cover opening is provided on the upper wall, which extends forward from the rear side of the upper wall to the upper portion of the front outer plate, and is covered with a cover. By opening and closing the cover, the user can conveniently place the object to be processed into the processing work area.

[0041] According to any of the technical solutions described in the second aspect of the present invention, the condenser is connected to the air compressor and the heat exchanger respectively through two copper tubes. The copper tubes pass through the gap between the left outer plate and the left inner base plate of the device body and extend to the side close to the rear side wall. The copper tubes between the condenser and the air compressor and the heat exchanger are provided with connecting joints. The provision of the connecting joints facilitates the connection or removal of the copper tubes between the condenser and the air compressor and the heat exchanger, thereby facilitating the removal and replacement of the condenser and avoiding the use of a welding torch with an open flame for removal. On the other hand, after the condenser is removed, the entire cooling system box can be directly removed from the interior of the device body, which can improve the convenience of maintenance of the entire equipment.

[0042] In summary, the technical solution provided by the present invention can achieve the following beneficial effects compared with the prior art:

[0043] (1) The present invention uses an air compression refrigeration module to cool the cooling medium in the circulating cooling unit, and optimizes the distribution design of the air compression refrigeration module. The condenser is separated from the refrigeration module and installed on one side wall close to the device body. The side wall is designed to be a double-layer structure consisting of an outer plate and an inner base plate. Since the condenser is relatively thin, the gap between the outer plate and the inner base plate only needs to meet the installation requirements of the condenser, which greatly saves installation space. The large-area condenser can be installed inside the laser processing machine without basically increasing the external dimensions of the device body, and at the same time does not affect the overall appearance of the equipment. Therefore, it can effectively overcome the installation space limitation of the desktop CO2 laser processing machine and realize the integrated design of the air compression refrigeration module and the laser processing machine. At the same time, the high efficiency of the air compression refrigeration system is utilized to greatly improve the refrigeration capacity of the refrigeration system, breaking through the limitation of the Peltier refrigeration system that the efficiency decreases due to the increase in temperature difference. It has the advantage of providing a higher power refrigeration capacity under the same external dimensions, and can take into account the power consumption and refrigeration capacity of the whole machine.

[0044] (2) The present invention installs the condenser on the side wall where the air inlet channel is located, close to the device body, and is located downstream of the air flow of the outer panel air inlet on the side wall. Therefore, the condenser can be cooled and dissipated by the clean air flow entering from the outer panel air inlet. Therefore, there is no need to install an additional cooling fan to dissipate heat for the condenser, which further reduces the requirements for installation space and can avoid the noise generated by installing a fan for heat dissipation and the spread of oil caused by disturbing the air flow entering the processing machine. At the same time, since the air flow passing through the condenser is clean indoor air that the human body can breathe, this configuration ensures that the condenser is always in the clean air flow. Therefore, there is no need to install additional air filter cotton upstream of the condenser to filter the air entering the condenser. Through this configuration, the present invention directly avoids the need to install a cooling fan and an air filter, and realizes that the processing machine is both beautiful and compact, does not generate working noise, and does not require regular cleaning and replacement of the air filter. It also makes full use of the original air flow of the laser processing machine to ensure that the condenser is always in a clean state and obtains a continuous and efficient heat dissipation effect.

[0045] (3) Since most components such as the laser oscillator are concentrated on the rear side of the laser processing machine, and the front side of the processing machine is close to the user (user) and basically no parts are placed, the present invention further preferably places the parts associated with the air compressor (air compressor, throttling device, heat exchanger, etc.) on the rear side of the processing machine and below the laser oscillator, and places the condenser on the front side wall of the processing machine, so as to effectively utilize the unused space on the front side of the laser processing machine and below the laser oscillator on the rear side, optimize the spatial layout inside the processing machine, and thus realize the miniaturization of the laser processing machine; at the same time, the condenser is located upstream of the smoke and oily waste gas generated by the processing material, which is conducive to further ensuring the cleanliness of the airflow in the condenser.

[0046] (4) The present invention utilizes the exhaust port and internal layout of the existing desktop laser processing machine to directly integrate the entire refrigeration system into the existing laser processing machine, simplifying the cooling medium circulation loop, the refrigerant closed circulation loop and the heat dissipation structure of the machine body. Without the need for an external chiller, it can provide efficient refrigeration in a limited space, meeting the actual cooling needs of cooling the carbon dioxide laser oscillator, and has significant practical value and industrial prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A schematic diagram of the overall structure and airflow direction of a laser processing machine according to an embodiment of the present invention;

[0048] Figure 2 A schematic diagram of the laser processing machine structure and airflow direction from another perspective;

[0049] Figure 3 This is a schematic diagram of the installation structure of the internal cooling system of the laser processing machine according to an embodiment of the present invention;

[0050] Figure 4 A schematic diagram of a partial cross-sectional structure of a laser processing machine according to an embodiment of the present invention;

[0051] Figure 5 A schematic diagram of a partially disassembled structure of a laser processing machine according to an embodiment of the present invention;

[0052] Figure 6 A schematic diagram of another partially disassembled structure of the laser processing machine according to an embodiment of the present invention;

[0053] Figure 7 This is a schematic diagram of the installation of a condenser according to one embodiment of the present invention;

[0054] Figure 8 This is a schematic diagram of the installation of a condenser according to another embodiment of the present invention;

[0055] Figure 9 This is a schematic diagram of the installation of a condenser according to another embodiment of the present invention;

[0056] Figure 10 This is a schematic diagram of the installation of a condenser according to another embodiment of the present invention.

[0057] Description of labels:

[0058] 1. Device body;

[0059] 101, front side wall; 1011, front outer panel; 1012, front inner base panel;

[0060] 102, rear side wall; 1021, rear outer panel; 1022, rear inner base panel;

[0061] 103, left side wall; 1031, left inner baseboard;

[0062] 104, right side wall; 1041, right inner baseboard;

[0063] 105. Upper wall;

[0064] 106, outer panel air inlet; 107, outer panel exhaust port;

[0065] 108. Inner substrate air inlet; 109. Inner substrate air outlet;

[0066] 110, bottom plate;

[0067] 2. Laser oscillator; 301. Cold water supply pipe; 302. Hot water return pipe; 4. Water pump; 5. Cooling water tank; 6. Heat exchanger; 7. Air compressor; 8. Dry filter; 9. Throttling device; 10. Condenser; 11. Laser oscillator housing; 12. Cooling system housing; 13. Control mainboard; 14. Processing control components. DETAILED DESCRIPTION

[0068] In order to further understand the content of the present invention, the present invention is now described in detail with reference to the accompanying drawings and embodiments.

[0069] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for understanding and reading by those familiar with this technology. They are not used to limit the conditions for implementation of the present invention and therefore have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the efficacy and purpose of the present invention. At the same time, terms such as "upper", "lower", "left", "right", "front", and "back" quoted in this specification are only for the convenience of description and are not used to limit the scope of implementation. Changes or adjustments in their relative relationships should also be considered as the scope of implementation of the present invention without substantially changing the technical content.

[0070] The terms "installed," "disposed," "equipped with," and "connected" as used herein should be interpreted broadly. For example, they may refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0071] In addition, the terms “include”, “comprising” and the like used herein indicate the existence of the stated features, steps, operations and / or components, but do not preclude the existence or addition of one or more other features, steps, operations or components.

[0072] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present disclosure. In the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0073] An embodiment of the present invention provides a desktop CO2 laser processing machine, including a device body 1. The device body 1 is a box-shaped structure as a whole, and a laser oscillator 2 and a cooling system for cooling the laser oscillator 2 are arranged inside the device body.

[0074] like Figure 1As shown, the device body 1 is a box-like structure surrounded by six side walls (front wall 101, rear wall 102, left wall 103, right wall 104, top wall 105, and bottom plate 110). Its interior is used to house components such as the laser oscillator and cooling system, as well as provide processing space. The top wall 105 has a cover opening for accessing and placing workpieces, replacing internal machine components, and performing maintenance and cleaning. This cover opening is covered by a cover (omitted in the figure). Specifically, one side of the cover is hingedly connected to one side of the cover opening, allowing it to rotate relative to the top wall 105 to open and close the cover.

[0075] The cooling system of an embodiment of the present invention includes a circulating cooling unit and an air compression refrigeration module, wherein the circulating cooling unit is used to cool the laser oscillator using a circulating cooling medium, and the air compression refrigeration module is used to cool the heated cooling medium in the circulating cooling unit.

[0076] Specifically, such as Figure 3 As shown, the circulating cooling unit includes a cooling medium circulation loop (pipeline) and a cooling water tank 5 . The cooling medium circulation loop connects the laser oscillator 2 with the cooling water tank 5 so that the cooling medium circulates, thereby cooling the laser oscillator 2 .

[0077] In some embodiments, the cooling medium circulation loop includes a cold water supply pipe 301 and a hot water return pipe 302. One end of the cold water supply pipe 301 is connected to one end of the laser oscillator 2 (cold water inlet), and the other end is connected to the cooling water tank 5 through a water pump 4; one end of the hot water return pipe 302 is connected to the other end of the laser oscillator 2 (hot water outlet), and the other end is connected to the cooling water tank 5 via a heat exchanger 6; the cooling medium after heating in the circulating cooling unit is heat exchanged with the low-pressure and low-temperature refrigerant in the air compression refrigeration module through the heat exchanger 6, and then transported to the cooling water tank 5 for storage.

[0078] Specifically, the laser oscillator 2 is cylindrical and consists of three concentric glass tubes centered around the axis of the laser oscillator 2. The spaces within the three glass tubes are filled with gases such as carbon dioxide (CO2), nitrogen (N2), and helium (He), respectively. The space within the middle glass tube is filled with a coolant such as a refrigerant, which flows from one end of the laser oscillator 2 to the other to cool the laser oscillator 2. One end of the cold water supply pipe 301 and the hot water return pipe 302 are respectively connected to the space within the middle glass tube of the laser oscillator.

[0079] The air compression refrigeration module of the embodiment of the present invention includes an air compressor 7, a condenser 10, a throttling device 9, and a heat exchanger 6, which are connected in series via pipes to form a closed refrigerant circulation loop. The module is used to perform heat exchange and cooling on the cooling medium in the circulating cooling unit. Specifically, the air compressor 7 compresses the refrigerant into a high-temperature, high-pressure gas. The gas then enters the condenser 10, where it is condensed into a high-pressure, medium-temperature liquid. The condensed liquid refrigerant then enters the throttling device 9 (using a capillary tube or expansion valve to control the refrigerant flow and achieve throttling and cooling). The liquid refrigerant is throttled and depressurized in the throttling device 9, becoming a low-pressure, low-temperature liquid or a gas-liquid mixture ready to absorb heat and evaporate. The refrigerant, after passing through the throttling device 9, enters the heat exchanger 6, where it exchanges heat with the heated cooling medium in the circulating cooling unit. The refrigerant evaporates from the low-pressure, low-temperature gas-liquid mixture into a low-pressure, low-temperature gas. The heat in the cooling medium is absorbed by the refrigerant, causing the heated cooling medium to cool again and be stored in the cooling water tank 5 for resupply to the laser oscillator 2 for cooling.

[0080] In order to facilitate the discharge of smoke generated during processing inside the processing machine, one of the two side walls of the device body is respectively provided with an air intake channel and an exhaust channel, and an independent exhaust fan is correspondingly provided outside the exhaust channel. It is further preferred that the air intake channel and the exhaust channel are respectively provided on the two opposite side walls of the device body, which is conducive to the uniform discharge of smoke to the outside of the processing machine.

[0081] In order to meet the narrow installation space requirements of desktop laser processing machines, the integrated design of the air compression refrigeration module and the laser processing machine is realized without increasing the original size of the equipment, and at the same time taking into account the overall power consumption and refrigeration efficiency of the processing machine, the embodiment of the present invention creatively separates the condenser 10 from the air compression refrigeration module and installs it on the side wall where the air inlet channel is located near the device body 1, while the air compressor 7, throttling device 9 and heat exchanger 6 and other components in the refrigeration module are installed together with the laser oscillator 2 inside the device body 1. Specifically, combined with Figure 2 、 Figure 4 As shown, one of the side walls of the device body 1 is provided with an outer plate and an inner base plate, and a gap space for installing and accommodating the condenser 10 is formed between the outer plate and the inner base plate. The above-mentioned air intake channel allows external clean air to pass through the condenser 10 in the gap between the outer plate and the inner base plate, and then enter the laser processing area inside the device body 1.

[0082] In this way, not only can the originally small and limited space of the laser processing machine be directly utilized to install the refrigeration system, with basically no need to increase the overall size of the device body and meet the requirements of the refrigeration effect, but the original airflow of the laser processing machine can also be used to dissipate heat for the condenser 10 without the need to install an additional cooling fan on the condenser 10, which is conducive to further reducing the demand for installation space and preventing the installation of the cooling fan from disturbing the airflow inside the device.

[0083] Specifically, in the embodiment of the present invention, the outer panel is provided with an outer panel air inlet 106, and the inner substrate is provided with an inner substrate air inlet 108. The outer panel air inlet 106, the narrow gap between the outer panel and the inner substrate, and the inner substrate air inlet 108 collectively form the air inlet channel. The clean airflow entering through the outer panel air inlet 106 can completely pass through the condenser 10 and absorb the heat generated by the condenser 10. That is, the clean airflow entering the device body 1 can flow through all the heat dissipation fins of the condenser 10 as much as possible, so that the air and the fins of the condenser 10 are in full contact to remove the heat generated by the condenser 10. In addition, the condenser is installed in the gap between the outer panel and the inner substrate. The gap is preferably connected to the internal space of the device body only through the inner substrate air inlet 108. This further helps to further structurally separate the condenser from the processing space inside the processing machine, keeping the condenser away from exhaust gas and oil pollution. Therefore, it is not necessary to install an additional dust filter device on the condenser to prevent dust from adhering to the condenser and thus reducing the cooling efficiency.

[0084] It should be noted that the present invention does not limit the specific shapes of the outer plate air inlet 106 and the inner substrate air inlet 108. For example, they can be composed of a number of through holes, mesh or grid-like structures, which are conducive to ensuring uniform airflow while preventing the invasion of large particles of impurities. At the same time, the present application does not make special requirements on the specific opening positions of the outer plate air inlet 106 and the inner substrate air inlet 108. As long as the normal operation of the laser processing machine is not affected (preventing the laser from leaking to the outside of the processing machine), the external clean air flow can cool the condenser through the gap between the outer plate and the inner substrate, and then enter the processing area inside the processing machine. For example, the outer plate air inlet 106 can be set at the bottom of the outer plate (such as Figure 7 ), or set on the front of the outer plate, or set on the front and bottom of the outer plate (as shown in Figure 8 Specifically, in this embodiment, the outer panel air inlet 106 is composed of a plurality of air inlet holes spaced apart and located at (or near) the bottom of the outer panel. The inner base panel air inlet 108 is an elliptical hole located at the upper portion of the inner base panel and extending along its length. Preferably, the height of the inner base panel air inlet 108 is adapted to the top portion of the condenser so that the airflow can fully dissipate heat from the entire condenser.

[0085] In order to further reduce heat loss and prevent condensation, in some embodiments, the refrigeration module is also provided with a structure for insulating the closed refrigerant circulation loop and the heat exchanger; similarly, the water pipes of the circulating cooling unit are also covered with thermal insulation materials, and a water flow sensor is provided to ensure that the circulating water flow meets the usage requirements (for example, ≥2 LPM).

[0086] As a further preferred embodiment, the air compression refrigeration module further includes a drying filter 8, which is connected between the condenser 10 and the throttling device 9 through a pipeline to filter out mechanical oil, moisture and impurities mixed in the refrigerant.

[0087] In an embodiment of the present invention, the control components of the refrigeration system include a power supply, a control board 13, and a temperature sensor. The temperature sensor is installed in the cooling water tank 5. The control board 13 controls the speed and start / stop of the air compressor 7 based on feedback from the temperature sensor, thereby maintaining the coolant temperature of the laser oscillator within a preset range. Furthermore, it is further preferred that the air compressor utilizes variable frequency control to optimize its cooling efficiency. Even more preferably, the air compressor 7 is a miniature air compressor powered by a DC power supply. A power adapter can be used to convert AC power to DC power for operation, making the laser processing machine of the present invention compatible with household power supply standards worldwide.

[0088] Since the original laser oscillator 2 and other components of the laser processing machine are mainly concentrated on the back side of the laser processing machine, and the front side of the processing machine is close to the user, there are basically no parts placed. Figure 4 As shown, as a preferred embodiment, the air compressor, throttling device, heat exchanger and other components of the refrigeration module are also placed on the rear side of the device body 1 and below the laser oscillator, and the condenser 10 is placed vertically on the front side wall 101 of the device body 1, that is, the front side wall 101 is set as a double-layer structure consisting of a front side outer plate 1011 and a front side inner base plate 1012, and the condenser 10 is installed in the narrow gap space between the front side outer plate 1011 and the front side inner base plate 1012 along the length direction of the front side wall 101, so that the unused space on the front side of the laser processing machine and below the rear laser oscillator can be effectively utilized. On the one hand, the overall structural layout is made more compact, and on the other hand, dust and oil in the processing work area can be prevented from entering the cooling system, thereby causing malfunctions.

[0089] like Figure 9As shown, in other embodiments, the condenser 10 can also be placed horizontally on the base plate 110, near one side of the front sidewall 101. A baffle (inner base plate) is provided within (above) the base plate. A gap is formed between the base plate and the baffle for mounting the condenser 10. Furthermore, an air intake passage is formed between the base plate and the baffle for clean air to enter the gap and then enter the processing area. Specifically, air intake holes can be formed on both the base plate and the baffle, and a guide plate can be further provided on the baffle to facilitate smooth and sufficient flow of clean air through the processing area and ultimately discharge through the exhaust passage.

[0090] like Figure 10 As shown, in other embodiments, the condenser 10 may also be placed vertically on the left side wall 103 , that is, the condenser 10 is installed between the left inner base plate 1031 and the left outer plate.

[0091] like Figure 5 As shown, in this embodiment of the present invention, the laser oscillator 2 is mounted within a laser oscillator housing 11, supported at both ends by supports. The laser oscillator housing 11 is positioned adjacent to the upper portion of the rear sidewall 102. More preferably, the cooling system's air compressor 7, throttling device 9, heat exchanger 6, filter drier 8, cooling water tank 5, water pump 4, water flow sensor (for monitoring the amount of cold water entering the laser oscillator), and cooling system control components are all mounted within a cooling system housing 12, positioned adjacent to the rear sidewall 102 and below the laser oscillator housing 11. Among them, the power supply of the cooling system control component in the cooling system box 12 is installed vertically near the rear side of the cooling system box 12, which is used to power the control main board 13, and there is a certain distance between the laser oscillator box 11 and the cooling system box 12. The distance forms a channel for airflow to pass through, and an exhaust channel for discharging the internal smoke of the processing machine out of the laser processing machine device body 1 is provided on the rear side wall 102 and located between the laser oscillator box 11 and the cooling system box 12.

[0092] In some embodiments, the front side wall 101, rear side wall 102, left side wall 103, and right side wall 104 of the device body 1 are all double-layer structures consisting of an outer panel and an inner substrate, wherein the front inner substrate 1012, the rear inner substrate 1022, the left inner substrate 1031, and the right inner substrate 1041 are all installed on the bottom plate 110 of the device body 1 and surround to form a mounting base, the condenser 10 is fixedly installed on the outside of the front inner substrate 1012, and the inside of the mounting base constitutes an installation space for parts such as a laser oscillator, an air compressor, and a heat exchanger, as well as a workpiece processing space; the front outer panel 1011, the rear outer panel 1021, the left outer panel and the right outer panel (the left outer panel and the right outer panel are omitted in the figure) and the upper wall 105 of the device body 1 together constitute the upper cover of the casing and are covered on the outside of the mounting base (fixedly connected to the bottom plate 110 by bolts). That is, the mounting base is used as the overall skeleton, and the upper cover of the casing is arranged on the outside of the mounting base from top to bottom and is fixedly connected to the bottom plate, thereby forming a nested structure, and the condenser and the components inside the laser processing machine are integrated, so that the upper cover of the casing can be directly disassembled and separated from the bottom plate of the device body in a modular manner (the structural diagram after the upper cover of the casing is removed is shown in the figure). Figure 5 As shown, the system status inside the laser processing machine can be removed without affecting the upper cover of the casing, making it easier to inspect the entire device after removing the casing, and to clean, repair, or replace the condenser 10 and other components. Alternatively, the condenser can be installed on the inner side of the front inner substrate 1012, and an additional baffle can be provided to form a mounting cavity for the condenser. However, this will occupy part of the processing work area, and the disassembly, assembly, and maintenance of the refrigeration system will be relatively troublesome.

[0093] like Figure 4 As shown, in this embodiment, the bottoms of the front outer plate 1011 and the rear outer plate 1021 are bent inward to form an L-shaped structure, so that the front outer plate 1011 and the rear outer plate 1021 are connected to the corresponding front inner base plate 1012, the rear inner base plate 1022 and the bottom plate 110 respectively. Figure 2 As shown, in this embodiment, the outer panel air inlet 106 is located at the bottom of the front outer panel 1011. In this way, the air entering the processing machine through the outer panel air inlet 106 flows upward through the gap between the condenser 10 and the front inner base plate 1012, then flows out through the inner base plate air inlet 108 and enters the processing work area of ​​the processing machine cavity. Finally, under the action of an external exhaust fan (such as a blower), it is discharged from the device body 1 through the exhaust channel of the rear side wall 102, fully taking away the heat of the condenser 10. Specifically, combined with Figure 4 、 Figure 6As shown, in this embodiment, an inner substrate exhaust port 109 is processed on the rear inner substrate 1022 between the laser oscillator housing and the cooling system housing, and an outer panel exhaust port 107 is correspondingly processed on the rear outer panel 1021. The processing work area and the outer panel exhaust port 107 are directly connected through the inner substrate exhaust port 109, without the need to additionally set up a radiator to cover the exhaust port on the rear base as when a Peltier cooling system is used.

[0094] Furthermore, the top of the rear inner baseboard 1022 bends inward to form an L-shaped support step. The laser oscillator housing 11 is supported and mounted on this L-shaped support step. The cooling system housing 12 is located below the L-shaped support step and is mounted on the bottom plate 110 and the rear inner baseboard 1022. The laser processing machine's processing control assembly 14 (used to control the overall operation of the processing machine) is independently installed in the gap between the right outer plate and the right inner baseboard 1041, thus making it independent of the processing area within the processing machine.

[0095] As a preferred embodiment, the condenser 10 is composed of large-area metal heat dissipation fins. Its refrigerant input and output are located at the same end of the condenser and are connected to the air compressor 7 and heat exchanger 6 respectively through copper tubes. The copper tubes pass through the gap between the left outer plate and the left inner base plate 1031 of the device body 1 and extend to the side near the rear wall 102. Specifically, the length of the copper tubes can be more than 1 meter to accommodate different body layouts without compromising cooling efficiency. Further preferably, the copper tubes between the condenser 10 and the air compressor 7 and heat exchanger 6 are equipped with quick-connect connectors to facilitate the disassembly and replacement of the condenser 10, avoiding the use of an open flame welding torch for disassembly. At the same time, after the condenser 10 is removed, the entire cooling system box 12 can be directly removed from the interior of the device body for module replacement, thereby improving the convenience of overall equipment maintenance. In an embodiment of the present invention, the machine cover opening on the upper wall 105 extends forward from the rear side of the upper wall 105 to the upper part of the front outer panel 1011, and a cover is covered on the machine cover opening, so that the machine cover can be easily opened and closed, making it convenient for users to place processing objects into the processing work area, and to clean and repair the condenser.

[0096] As a further preferred embodiment, and in order to facilitate those skilled in the art to accurately understand the relative relationship between the various structures of the present invention, the following quantitative design is adopted in this embodiment:

[0097] (1) The width of the gap between the outer plate and the inner base plate of the side wall where the air inlet channel is located is preferably controlled within the range of about 20 to 40 mm, and its length extends at least 500 mm along the length direction of the side wall where the air inlet channel is located, so as to ensure that the mounting surface of the condenser can fully accommodate and fix the heat dissipation fins;

[0098] (2) The condenser body is made of thin metal material, the thickness of which is preferably controlled between 20 and 30 mm, and the total heat dissipation area is not less than 500 square centimeters;

[0099] (3) The air compressor, throttling device and heat exchanger are preferably arranged in the cooling system box on the rear side. The internal dimensions of the box are approximately W500×D80×H110 mm, ensuring a reasonable distribution with the laser oscillator installation area and meeting the requirements of efficient heat exchange in a small space;

[0100] (4) The outer diameter of the copper tube connection component is preferably about 6 to 8 mm and the length is 0.5 to 1 meter, so as to achieve flexible connection and disassembly maintenance between components without affecting the refrigerant flow rate.

[0101] To verify the stability and efficiency of the cooling system of the present invention in practical applications, this embodiment was tested under the following actual operating conditions:

[0102] (1) In an indoor working environment, when the operating temperature range is set between 20℃ and 40℃, the frequency conversion control technology is used to keep the cooling medium temperature at an ideal working state of 25℃±3℃;

[0103] (2) When the cooling demand reaches 400W, the overall apparent power of the system is controlled within 1400VA under the condition of using a standard 100V / 15A household power supply (approximately 1500VA power limit), meeting the power supply requirements of household sockets in various countries;

[0104] (3) During the 8-hour continuous operation test, the condenser relied on the clean airflow in the air inlet channel to dissipate heat, and the average cooling efficiency of the system exceeded 80%. The water flow was maintained at 2 LPM or above through the built-in sensor, ensuring that the circulating cooling unit could transfer the heat generated by the laser oscillator to the cooling water tank in a timely manner;

[0105] (4) The test results show that in a simulated processing environment (with dust and oil smoke interference conditions), the condenser can still work stably without clogging, thereby maintaining the efficient and stable operation of the overall refrigeration system.

[0106] In summary, the refrigeration module of the present invention has a highly efficient refrigeration capacity, which enables the entire laser processing machine to quickly cool the cooling medium under limited power supply to cool the laser oscillator. Moreover, through the layout optimization of the refrigeration system, the limitations of the existing desktop laser processing machine on installation space are broken, so that the refrigeration system of the present invention can be integrated with the laser processing machine (the refrigeration system is built-in).

[0107] The above is a schematic description of the present invention and its embodiments, which is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. Therefore, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs a structure and embodiment similar to this technical solution without inventiveness, they shall fall within the scope of protection of the present invention.

Claims

1. A cooling system for a desktop CO2 laser processing machine, characterized in that: include: a circulating cooling unit, the circulating cooling unit comprising a cooling medium circulation loop and a cooling water tank (5), the cooling medium circulation loop connecting the laser oscillator (2) and the cooling water tank (5) so that the cooling medium circulates, thereby cooling the laser oscillator (2); and An air compression refrigeration module, comprising an air compressor (7), a condenser (10), a throttling device (9), and a heat exchanger (6) connected in series through a pipeline to form a closed refrigerant circulation loop, and used for performing heat exchange cooling treatment on the cooling medium in the circulating cooling unit; The laser oscillator (2), air compressor (7), throttling device (9) and heat exchanger (6) are all installed inside the device body (1) of the laser processing machine. One side wall of the device body (1) is provided with an outer plate and an inner base plate. A gap space for installing and accommodating the condenser (10) is formed between the outer plate and the inner base plate. The device body (1) is provided with an air inlet channel. The air inlet channel allows external clean air to pass through the condenser (10) arranged in the narrow gap between the outer plate and the inner base plate, and then enter the laser processing area, so that the air flow is used to take away the heat generated by the condenser (10).

2. The cooling system according to claim 1, characterized in that The outer plate is provided with an outer plate air inlet (106), the inner base plate is provided with an inner base plate air inlet (108), and the outer plate air inlet (106), the gap between the outer plate and the inner base plate, and the inner base plate air inlet (108) together form the air inlet channel.

3. The cooling system according to claim 2, characterized in that The outer plate air inlet (106) and the inner base plate air inlet (108) are both composed of a plurality of through holes, mesh-shaped or grid-shaped structures.

4. The cooling system according to any one of claims 1 to 3, characterized in that: An exhaust channel is provided on one side wall of the device body (1), and an independent exhaust fan is provided on the outside of the exhaust channel; the side wall where the exhaust channel is located is arranged opposite to or adjacent to the side wall where the air inlet channel is located.

5. The cooling system according to any one of claims 1 to 3, characterized in that: The cooling medium circulation loop includes a cold water supply pipe (301) and a hot water return pipe (302), one end of the cold water supply pipe (301) is connected to the water inlet of the laser oscillator (2), and the other end thereof is connected to the cooling water tank (5) via a water pump (4); one end of the hot water return pipe (302) is connected to the water outlet of the laser oscillator (2), and the other end thereof is connected to the cooling water tank (5) via a heat exchanger (6); the cooling medium after being heated in the circulating cooling unit exchanges heat with the refrigerant in the air compression refrigeration module through the heat exchanger (6), thereby realizing cooling and cooling of the laser oscillator (2).

6. The cooling system according to any one of claims 1 to 3, characterized in that: The control component of the cooling system includes a power supply, a control mainboard (13) and a temperature sensor, wherein the temperature sensor is installed on the cooling water tank (5) for monitoring the temperature of the cooling medium of the circulating cooling unit, and the control mainboard is used to control the speed and start and stop of the air compressor (7) according to feedback from the temperature sensor; the power supply is used to supply power to the control mainboard.

7. A desktop CO2 laser processing machine, comprising a device body (1), the device body (1) being a box-shaped structure as a whole, and having a laser oscillator (2) and a cooling system for cooling the laser oscillator (2) disposed therein, characterized in that: The cooling system adopts the cooling system according to any one of claims 1 to 6.

8. The desktop CO2 laser processing machine according to claim 7, characterized in that: The laser oscillator (2), air compressor (7), throttling device (9) and heat exchanger (6) are all installed inside the device body (1) and close to the side of the rear side wall (102), wherein the laser oscillator (2) is close to the upper part of the rear side wall (102) and is installed in the laser oscillator box (11) along the length direction of the rear side wall (102), and the air compressor (7), throttling device (9) and heat exchanger (6) are all installed in the cooling system box (12) and are located below the laser oscillator box (11); The exhaust passage of the laser processing machine is arranged on the rear side wall (102) and is located between the laser oscillator housing (11) and the cooling system housing (12); the condenser (10) is vertically mounted on the front side wall (101), the left side wall (103) or the right side wall (104) of the device body (1), or horizontally mounted on the bottom plate (110) and on a side close to the front side wall (101).

9. The desktop CO2 laser processing machine according to claim 8, characterized in that: The front side wall, rear side wall, left side wall and right side wall of the device body (1) are all double-layer structures composed of outer plates and inner base plates, wherein four inner base plates are mounted on the bottom plate (110) of the device body (1) and surround to form a mounting base, and the condenser (10) is fixedly mounted on the outer side of the front inner base plate (1012) along the length direction; the four outer plates and the upper wall (105) of the device body (1) together form a casing upper cover and are arranged on the outside of the mounting base; The upper wall (105) is provided with an organic cover opening, which extends forward from the rear side of the upper wall (105) to the upper part of the front outer plate (1011), and the organic cover is covered on the organic cover opening.

10. The desktop CO2 laser processing machine according to claim 9, characterized in that: The condenser (10) is connected to the air compressor (7) and the heat exchanger (6) respectively through two copper tubes, and the copper tubes pass through the gap between the left outer plate and the left inner base plate (1031) of the device body (1) and extend to the side close to the rear side wall (102), and the copper tubes between the condenser (10) and the air compressor (7) and the heat exchanger (6) are provided with connecting joints; A drying filter (8) is provided between the condenser (10) and the throttling device (9).

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