Ceramic base

Abstract

The present invention relates to a ceramic susceptor, and the ceramic susceptor according to the present invention may comprise: an insulating plate on which one or more electrodes are arranged; one end part of the hollow shaft is connected to the insulating plate; and one or more electrode stems connected to the electrodes, the hollow shaft may include one or more side wall holes penetrating through the inside of the side wall of the hollow shaft, the one or more electrode stems may include one or more first electrode stems, and the one or more second electrode stems may include one or more second electrode stems penetrating through the inside of the side wall of the hollow shaft. The one or more first electrode stems are connected to a first electrode of the one or more electrodes, penetrate through the side wall hole, and extend.

Description

Technical Field

[0001] The present invention relates to a ceramic base, in particular to a ceramic base in which an electrode rod is arranged in a side wall of a hollow shaft. Background Art

[0002] Generally speaking, a semiconductor device or a display device is manufactured by stacking a plurality of thin film layers including a dielectric layer and a metal layer on a glass substrate, a flexible substrate or a semiconductor wafer substrate and then patterning them. These thin film layers are sequentially deposited on the substrate by a chemical vapor deposition (CVD) process or a physical vapor deposition (PVD) process. The CVD process includes a low pressure chemical vapor deposition (LPCVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, an organic metal chemical vapor deposition (MOCVD) process, and the like.

[0003] Such CVD and PVD apparatuses are equipped with a ceramic susceptor, which is used to support glass substrates, flexible substrates, semiconductor wafer substrates, and the like, and to perform heat treatment. The ceramic susceptor is installed in the CVD and PVD apparatuses and can be used to heat the substrate during heat treatment processes. Furthermore, the ceramic susceptor can also be used to generate plasma during etching processes, such as those used to form thin film layers on semiconductor wafer substrates, by providing a high-frequency (RF) electrode.

[0004] Figure 1 It is a schematic cross-sectional view of a conventional ceramic susceptor 1 .

[0005] like Figure 1 As shown, the previous ceramic base 1 includes an insulating plate 10 combined with a shaft 20, the insulating plate 10 includes an electrode 12 or a heating element 14 arranged between ceramic materials, and the shaft 20 is formed in a hollow shape to provide a through hole, so that rods 21, 22, and 23 respectively connected to the electrode 12 or the heating element 14 and supplying electricity pass through the through hole.

[0006] However, in Figure 1 In the structure of the conventional ceramic base 1 shown, rods 21, 22, and 23 for supplying electricity are arranged in the through hole of the hollow shaft 20. The rods 21, 22, and 23 are prone to move or shake in the through hole with a larger radius, so there is a problem that the rods 21, 22, and 23 may be physically bent or short-circuited with each other.

[0007] Furthermore, to prevent arcing due to electrical contact, rods 21, 22, and 23 must be insulated from one another within the same space within the through-hole of shaft 20. To this end, rods 21, 22, and 23 are wrapped and insulated with an additional insulating material, such as Al2O3. However, there is a problem: the insulating material is wrapped in a tubular form, narrowing the spacing between them. Without this wrapping, arcing could occur.

[0008] In addition, from a design perspective, since the metal rods 21, 22, and 23 are concentrated in the center of the through hole of the shaft 20, when it is necessary to change the number or position of the rods according to the situation, the change in the number or position of the rods is limited due to the constraints of the internal space of the through hole of the shaft 20. Summary of the Invention

[0009] Problems to be solved by the invention

[0010] Therefore, the present invention is proposed to solve the above problems. The purpose of the present invention is to provide a ceramic base, which eliminates the space for the electrode to shake or bend by configuring electrode rods in the side wall holes (for example, Φ3 to Φ6) of the hollow shaft, thereby easily preventing the risk of physical short circuit.

[0011] In addition, a ceramic base is provided. Although electrode rods can be arranged in the hollow part of the hollow shaft, more electrode rods can be arranged even if the electrode rods are not arranged in the hollow part, and the electrode configuration can be freely designed according to changes in the number or position of the electrode rods.

[0012] In addition, a ceramic base is provided. Since the insulating property of the hollow shaft is utilized by arranging electrode rods in the side wall holes (for example, Φ3 to Φ6) of the hollow shaft, no additional insulating covering for insulating each electrode rod is required. Moreover, by separating the high-frequency electrode rod and the heating electrode rod and arranging them in the side wall holes of the hollow shaft or respectively in the side wall holes and the hollow portion, the interval between the electrode rods will not be narrowed, thereby preventing the occurrence of arcing.

[0013] Means used to solve problems

[0014] First, the features of the present invention are briefly described. A ceramic base according to one aspect of the present invention for achieving the above-mentioned purpose may include: an insulating plate, provided with one or more electrodes; a hollow shaft, one end of which is connected to the insulating plate; and one or more electrode rods, connected to the electrodes. The hollow shaft may include one or more side wall holes, and the one or more side wall holes pass through the interior of the side wall of the hollow shaft. The one or more electrode rods may include one or more first electrode rods, and the one or more first electrode rods are connected to a first electrode among the one or more electrodes, and pass through the side wall holes and extend.

[0015] The one or more electrode rods may further include one or more second electrode rods, wherein the one or more second electrode rods are connected to the second electrode of the one or more electrodes and extend through the hollow portion of the hollow shaft.

[0016] The first electrode may include a heating electrode, and the second electrode may include a high-frequency electrode. In this case, the plurality of first electrode rods may be connected to respective terminals of the heating electrode.

[0017] The first electrode may include a high-frequency electrode, and the second electrode may include a heating electrode. In this case, a plurality of second electrode rods may be connected to respective terminals of the heating electrode.

[0018] The electrode rod may include a gas flow path and one or more gas holes communicating with the gas flow path.

[0019] A conductor connection box (socket) coupled to the electrode rod and used to supply power may be further included, and the conductor connection box may include a gas supply flow path formed in such a manner as to communicate with the gas flow path.

[0020] The ceramic base may further include: a mounting portion coupled to a lower portion of the hollow shaft; and a sealing member coupled between the hollow shaft and the mounting portion.

[0021] The hollow shaft may include a groove portion, which is formed on a surface of the hollow shaft combined with the mounting portion and extends in a manner that meets the side wall hole more than once. The mounting portion may include a gas supply flow path connected to the groove portion, and the one or more first electrode rods may extend in a manner that passes through the groove portion.

[0022] The one or more electrode rods may further include one or more second electrode rods, which are connected to the second electrodes among the one or more electrodes and extend through the hollow portion of the hollow shaft. The one or more second electrode rods may extend in a manner of penetrating the mounting portion.

[0023] The sealing member may be a ring structure, and the cross-sectional shape of the sealing member may include a rectangle, a circle, an ellipse or a trapezoid. The sealing member is preferably made of silicone.

[0024] Effects of the Invention

[0025] According to the ceramic base of the present invention, by disposing electrode rods in the sidewall holes (eg, Φ3 to Φ6) of the hollow shaft, space for the electrodes to shake or bend is eliminated, thereby easily preventing the risk of physical short circuit.

[0026] In addition, the two schemes of configuring electrode rods in the hollow part of the hollow shaft and configuring electrode rods in the side wall holes (for example, Φ3 to Φ6) of the hollow shaft can be combined, and the electrode configuration can be freely designed according to changes in the number or position of the electrode rods, and more electrode rods can be configured.

[0027] In addition, since the insulating properties of the hollow shaft are utilized by arranging electrode rods in the side wall holes (for example, Φ3 to Φ6) of the hollow shaft, there is no need for additional insulating covering to insulate each electrode rod. Moreover, by separating the high-frequency electrode rod and the heating electrode rod and arranging them in the side wall holes of the hollow shaft or respectively in the side wall holes and the hollow portion, the interval between the rods will not be narrowed, thereby preventing the occurrence of arcing. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are included as a part of the detailed description, provide embodiments of the present invention to help understanding of the present invention, and together with the detailed description, explain the technical concept of the present invention.

[0029] Figure 1 This is a schematic cross-sectional view of a conventional ceramic base.

[0030] Figure 2 FIG. 1 is a schematic cross-sectional view of a ceramic susceptor according to an embodiment of the present invention.

[0031] Figures 3A to 3D It is along Figure 2 The cross-sectional view of the AB portion is an embodiment in which multiple electrode rods are arranged in the side wall holes of the hollow shaft.

[0032] Figure 4A is a cross-sectional view for explaining a ceramic base according to another embodiment of the present invention.

[0033] Figure 4B yes Figure 4A Magnified view of the supply conductor terminal box in .

[0034] Figure 4C yes Figure 4A An enlarged view of the electrode rod with gas flow paths and air holes.

[0035] Figure 5A is a cross-sectional view for explaining a ceramic base according to still another embodiment of the present invention.

[0036] Figure 5B Viewed from below toward the hollow shaft side Figure 5A Figure 2 shows the surface CD of the hollow shaft and the mounting portion.

[0037] Description of Reference Numerals

[0038] 110: Insulation board

[0039] 112, 114: Electrodes

[0040] 120: Hollow shaft

[0041] 121, 122, 123: Electrode rods

[0042] 129: Hollow

[0043] 125: Side wall hole DETAILED DESCRIPTION

[0044] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. At this time, the same components in each drawing are represented by the same figure marks as much as possible. In addition, the description of known functions and / or structures will be omitted. The content disclosed below will mainly describe the parts required to understand the operation of various embodiments, and will omit the description of elements that may make the main points of the description unclear. In addition, some of the components in the drawings may be enlarged, omitted or shown schematically. The size of each component cannot fully reflect the actual size, and therefore, the content described here is not limited by the relative size or spacing of the components shown in each drawing.

[0045] When describing the embodiments of the present invention, if it is judged that the specific description of the known technology related to the present invention unnecessarily obscures the main purpose of the present invention, its detailed description will be omitted. In addition, the terms described below are terms defined in consideration of the functions of the present invention, and may vary according to the intention of the user, operator or precedent. Therefore, their definition should be based on the content of the entire specification. The terms used in this specification are only used to illustrate the embodiments of the present invention and are not used to limit them. Unless otherwise specified, singular expressions shall include plural expressions. Expressions such as "including" or "having" in this specification are used to refer to any feature, number, step, action, component or combination thereof, and should not be understood as excluding the existence or additional possibility of one or more other features, numbers, steps, actions, components or combinations thereof.

[0046] In addition, although the terms "first" and "second" may be used to describe various components, the components are not limited to the terms, and the terms are only used to distinguish one component from another.

[0047] First, as described below, the ceramic susceptor 100, 200, or 300 of the present invention is disposed within the chamber of a CVD or PVD apparatus and can be used for heating using an electrode (heating element) 114 and / or supporting a substrate 11 using a (high-frequency) electrode 112, or for applications such as plasma-enhanced chemical vapor deposition processes or plasma-based dry etching processes. The ceramic susceptor 100, 200, or 300 of the present invention further includes a chuck electrode (not shown) spaced a predetermined distance from the electrode 112 and configured to be capable of adsorbing and de-adsorbing the substrate 11. Depending on the circumstances, the electrode 112 may be a high-frequency electrode configured to receive power for generating plasma, as described above, or may function as an electrostatic chuck electrode (or chuck electrode) configured to receive power for adsorbing and de-adsorbing the substrate 11. The substrate 11 may be a processing target substrate of various purposes, such as a semiconductor wafer, a glass substrate, or a flexible substrate.

[0048] Therefore, the insulating plate 110 is configured to stably support the substrate to be processed while performing various semiconductor processes such as heating using the electrode 114 and / or plasma-enhanced chemical vapor deposition using the electrode 112 or dry etching using plasma.

[0049] Figure 2 FIG. 1 is a schematic cross-sectional view of a ceramic susceptor 100 according to an embodiment of the present invention.

[0050] Reference Figure 2 According to an embodiment of the present invention, a ceramic base 100 includes an insulating plate 110 made of ceramic material and a hollow shaft 120 having a hollow portion 129, and may further include a mounting portion 140 as needed. The insulating plate 110, the hollow shaft 120, and the mounting portion 140 may be connected in sequence, and a sealing member 144 having a ring structure is provided between the hollow shaft 120 and the mounting portion 140. The sealing member 144 may be configured to seal the surface where the lower portion of the hollow shaft 120 and the mounting portion 140 are joined.

[0051] In the ceramic susceptor 100 according to one embodiment of the present invention, electrode rods 121 are disposed within sidewall holes (e.g., φ3 to φ6) 125 of the hollow shaft 120, eliminating space for electrode rods 121 to wobble or bend, thereby easily preventing the risk of physical short circuits. Alternatively, electrode rods 122 may be disposed, extending through the hollow portion 129 of the hollow shaft 120. Electrode rods 121 may be connected to electrodes 112 or 114. Alternatively, electrode rods 122 may be connected to electrodes 112 or 114, as needed.

[0052] To this end, the insulating plate 110 is constructed so that one or more electrodes (heating elements) 114 are arranged (embedded) between ceramic materials, and depending on the circumstances, one or more other electrodes 112 may be arranged (embedded) at a predetermined distance from the heating element 114. The insulating plate 110 is constructed so that while being able to stably support the substrate 11 to be processed, heating by the electrode 114 and (or) supporting the substrate by the electrode 112 can be performed, or various semiconductor processes such as plasma enhanced chemical vapor deposition process or plasma dry etching process can be performed. The insulating plate 110 can be made of a plate-like structure having a predetermined shape. As an example, the insulating plate 110 can be made of a circular plate-like structure, but is not necessarily limited thereto. The ceramic material may be Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC (Autoclaved lightweight concrete, autoclaved lightweight silicate plate), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, B x C y At least one of BN, SiO2, SiC, YAG, mullite, and AlF3, preferably aluminum nitride (AlN). Furthermore, the insulating plate 110 can be formed by molding and sintering the ceramic material powder. To this end, each ceramic powder can optionally contain 0.1 to 10% (preferably about 1 to 5%) yttrium oxide powder.

[0053] The electrode (heating element) 114 can be formed into a plate-like coil form or a flat plate form composed of a heating wire (or resistance wire). In addition, the electrode 114 can also be formed in a multi-layer structure for precise temperature control. Such an electrode 114 is connected to a power supply for supplying power to an additional electrode 114 through electrode rods 121 and 122 for supplying power. In the semiconductor process, in order to perform heating or deposition processes and etching processes of the substrate, the function of heating the processing object substrate 11 on the insulating plate 110 to a predetermined temperature can be performed. The electrode rods 121 and 122 extend in a manner that passes through the hollow portion 129 or the side wall hole (side wall through hole) 125 of the hollow shaft 120 and extends to the outside through the mounting portion 140.

[0054] The electrode 112 (including the chuck electrode) can be made of tungsten (W), molybdenum (Mo), silver (Ag), gold (Au), niobium (Nb), titanium (Ti), aluminum nitride (AlN), or alloys thereof, preferably molybdenum (Mo). The electrode 112 can be connected to a power supply terminal (e.g., ground) via another connecting rod (not shown). The electrode rods 121 and 122 extend through the hollow portion 129 or the sidewall hole (sidewall through-hole) 125 of the hollow shaft 120 and extend through the mounting portion 140 to the outside. For example, the electrode 112 can be used as a chuck electrode for an electrostatic chuck function for supporting the substrate 11 placed on the insulating plate 110, or as a plasma generation electrode for performing a plasma generation function in processes such as plasma-enhanced chemical vapor deposition or dry etching in reactive ion etching (RIE) equipment.

[0055] In addition, the electrode rods 121 and 122 can also be joined to the electrode pad 51 by brazing. The electrode pad 51 can also be joined to the electrodes 112 and 114 of the insulating plate 110 by brazing. For example, to achieve the brazing, conductive filler can be injected, heated at high temperature, and then cooled to achieve the respective joints.

[0056] The hollow shaft 120 is in the form of a pipe having a hollow portion 129, and one end thereof is bonded to the lower surface of the insulating plate 110. The hollow shaft 120 can be made of the same ceramic material as the insulating plate 110. The ceramic material can be Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC (Autoclaved lightweight concrete), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, B x C y , BN, SiO2, SiC, YAG, mullite, AlF3, preferably aluminum nitride (AlN). Furthermore, the hollow shaft 120 can be formed by molding and sintering the ceramic material powder. To this end, each ceramic powder can optionally contain 0.1 to 10% (preferably about 1 to 5%) yttrium oxide powder. The hollow shaft 120 can be bonded to the insulating plate 110 using a bonding material such as ceramic glue. Depending on the situation, the hollow shaft 120 can also be mechanically bonded to the insulating plate 110 using bolts, nuts, etc.

[0057] Figures 3A to 3D It is along Figure 2The cross-sectional view of the AB portion is an embodiment in which a plurality of electrode rods 121 are arranged in the side wall holes 125 of the hollow shaft 120 .

[0058] Reference Figures 3A to 3D The hollow shaft 120 may include one or more side wall holes 125 extending through the interior of the side wall thereof, and each of the side wall holes 125 of the hollow shaft 120 may be provided with its own electrode rod 121. That is, one or more electrode rods 121 are connected to one or more electrodes 112, 114, and are respectively provided so as to extend through the side wall holes 125. Additionally, one or more electrode rods 122 are connected to one or more electrodes 112, 114, and are respectively provided so as to extend through the hollow portion 129 on the other side of the hollow shaft 120. Either of the electrode rods 121 and 122 may be omitted. That is, the electrode rod 121 may be provided only in the side wall hole 125.

[0059] Therefore, each electrode rod 121, 122 extends through the hollow portion 129 of the hollow shaft 120 or each sidewall hole 125. Furthermore, when the mounting portion 140 is provided, each electrode rod 121, 122 may extend through the mounting portion 140 and extend to the outside.

[0060] For example, preferably, the first electrode 112 of the one or more electrodes 112 and 114 can be the high-frequency electrode described above, and the second electrode 114 of the one or more electrodes 112 and 114 can be the same heating electrode as the heating element. Conversely, the first electrode 112 of the one or more electrodes 112 and 114 can be the same heating electrode as the heating element, and the second electrode 114 of the one or more electrodes 112 and 114 can be the high-frequency electrode described above.

[0061] For example, Figure 3A The two electrode rods 121 used to configure a single-zone heating element (heating electrode) can be shown. Specifically, a pair (two) of heating elements (heating electrodes) 121 can preferably be connected to the two end terminals (not shown) of the second electrode 114, which serves as the heating electrode. This is a case where the heating element (pattern) of the second electrode 114, which serves as the heating electrode, is connected without electrical disconnection between the two end terminals (not shown), forming a single zone and generating heat. In this case, one or more first electrodes 112, which serve as high-frequency electrodes, can be connected to one or more electrode rods 122, respectively.

[0062] In addition, as described above, the functions of the first electrode 112 and the second electrode 114 can be reversed. As described above, the electrode rods 121 and 122 can be reversed as needed. In addition, the inner surface of the side wall of the hollow shaft 120 can be as follows: Figure 3A and Figure 3C There is generally no uneven flat (plain) shape, or it can be as follows Figure 3B and Figure 3D There are generally uneven concave and convex shapes. Figure 3B and Figure 3D In the case of a hollow shaft 120, the portion protruding inward in the diameter direction may be provided with side wall holes 125 for arranging the electrode rods 121 and 122. The concave and convex configuration of the inner surface of the side wall of the hollow shaft 120 described above can be configured to easily distinguish the positions where the electrode rods 121 and 122 are arranged, and by facilitating the securing of the internal space of the hollow portion 129 of the hollow shaft 120, the arrangement of structures such as the electrode rods 122 arranged therein can be more freely performed.

[0063] in addition, Figure 3B Four electrode rods 121 can be shown for configuring a two-zone heating element (heating electrode). Specifically, two of the four electrode rods 121 are connected to a pair of first terminals (not shown) of the second electrode 114, which serves as the heating electrode. The heating element electrode (pattern) extending between the pair of first terminals (not shown) without electrical disconnection can form a first zone. The remaining two of the four electrode rods 121 are connected to a pair of second terminals (not shown) of the second electrode 114, which serves as the heating electrode. The heating element electrode (pattern) extending between the pair of second terminals (not shown) without electrical disconnection can form a second zone. In this case, one or more first electrodes 112, which serve as high-frequency electrodes, can each be connected to one or more electrode rods 122.

[0064] In addition, through Figure 3A or Figure 3B General methods, such as Figure 3C and Figure 3D As shown, each of the eight electrode rods 121 is connected to a pair of terminals of each of the four heating element electrodes (patterns) included in the second electrode 114 as a heating electrode, thereby forming four heating zones. Furthermore, one or more first electrodes 112 as high-frequency electrodes can be connected to one or more electrode rods 122, respectively.

[0065] Figure 4A FIG. 2 is a cross-sectional view for illustrating a ceramic base 200 according to another embodiment of the present invention.

[0066] Figure 4B yes Figure 4AAn enlarged view of the supply conductor junction box 150 in FIG.

[0067] Figure 4C yes Figure 4A FIG. 1 is an enlarged view of the electrode rod 123 having the gas flow path 123 - 1 and the gas hole 123 - 2 .

[0068] Reference Figures 4A to 4C , the ceramic base 200 is Figure 2 The ceramic base 200 includes a power supply conductor junction box 150 and an electrode rod 123 disposed in a side wall hole 125 coupled to the power supply conductor junction box 150. Figure 2 The ceramic base 100 may further include a power supply conductor junction box 150 and an electrode rod 123. Depending on the situation, the power supply conductor junction box 150 and the electrode rod 123 may be included to replace Figure 2 The electrode rod 121 is placed in the side wall hole 125 of the ceramic base 100.

[0069] First, in Figure 4A In the embodiment, each electrode rod 121 , 122 for supplying power to the electrodes 112 , 114 is accommodated by the hollow portion 129 or the side wall hole 125 of the hollow shaft 120 , and they may extend to the outside through the mounting portion 140 .

[0070] In addition, if Figure 4A As shown, a mounting portion 140 is connected to the longitudinal end of the hollow shaft 120. The mounting portion 140 can be mechanically combined with the hollow shaft 120 at the longitudinal end of the hollow shaft 120. The connection between the hollow shaft 120 and the mounting portion 140 can also be achieved by mechanical combination using bolts, nuts, etc. At this time, sealing can be performed by providing a sealing member 144 between the lower part of the hollow shaft 120 and the mounting portion 140. The sealing member 144 can be a member of a ring structure for sealing the surface where the lower part of the hollow shaft 120 is combined with the mounting portion 140, and its cross-sectional shape can be various forms such as rectangular, trapezoidal, circular or elliptical. The sealing member 144 is preferably made of silicone. For example, a predetermined groove for configuring the sealing member 144 can be set in the upper part of the mounting portion 140 at a position further outward in the diameter direction than the side wall hole 125, and after the sealing member 144 is placed at a position higher than the predetermined groove, it is compressed due to the mechanical connection as described above, thereby sealing the surface where the lower part of the hollow shaft 120 is connected to the mounting portion 140.

[0071] The mounting portion 140 can be made of the ceramic material described above. Depending on the situation, the mounting portion 140 can also be made of a metal material such as aluminum (Al). In this case, the necessary portion penetrated by the electrode rods 121 and 122 is preferably insulated. The ceramic material can be Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC (Autoclaved lightweight concrete, autoclaved lightweight silicate plate), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, B x C y At least one of BN, SiO2, SiC, YAG, mullite, and AlF3, preferably aluminum nitride (AlN). Furthermore, the ceramic material powder can be molded and sintered to form the hollow shaft 120. To this end, each ceramic powder can optionally contain 0.1 to 10% (preferably about 1 to 5%) yttrium oxide powder.

[0072] exist Figure 4B In the embodiment, the power supply conductor junction box 150 can be made of a conductor such as gold, silver, copper or nickel, and can include a main body 151 and a gas connection part 152, a power connection part 153, and a rod connection part 154 combined with or integrated with the main body 151.

[0073] like Figure 4C As shown, the interior of the electrode rod 123 is a hollow space, and the electrode rod 123 can be in a form with a gas flow path 123-1 formed along its length direction, or can be in a form with one or more air holes 123-2 connected to the gas flow path 123-1 formed on its side.

[0074] The electrode rod 123 is coupled to the rod connection portion 154 of the power conductor junction box 150. The gas flow path 123-1 can be formed with a predetermined length from the end of the electrode rod 123 on the rod connection portion 154 side to the insulating plate 110 side, or from the end of the electrode rod 123 on the rod connection portion 154 side to the insulating plate 110 side. The plurality of gas holes 123-2 can be formed in a straight line at predetermined intervals along the side of the electrode rod 123, or can be formed in a non-straight line or at different intervals depending on the situation.

[0075] The power supply conductor junction box 150 is used to supply heating power, power for high-frequency electrodes, or power for suction cup electrodes provided from a power cord connected to the power supply connection part 153 to the electrode rod 123 connected to the rod connection part 154, and can also provide inactive gas (for example, He, N2, etc.) to the electrode rod 123 through a gas supply flow path 155 formed between the gas connection part 152 and the rod connection part 154.

[0076] A gas pipe for supplying an inert gas (e.g., He, N2, etc.) may be coupled to the gas connection portion 152. The gas supplied to the electrode rods 123 through a gas supply passage 155 connected to the gas pipe flows along a gas passage 123-1 connected to the gas supply passage 155 and is supplied to the sidewall holes 125 through gas holes 123-2. When a desired semiconductor process is performed while the target substrate 11 is supported on the insulating plate 110, supplying the inert gas to the sidewall holes 125 as described above has the effect of preventing oxidation of the electrode rods 123 even in a high-temperature environment.

[0077] Figure 5A FIG. 1 is a cross-sectional view for illustrating a ceramic base 300 according to yet another embodiment of the present invention.

[0078] Reference Figure 5A , ceramic base 300 is Figure 2 Ceramic base 100 and Figure 4A The ceramic base 300 includes a hollow shaft 120 having a groove 127. Figure 2 Ceramic base 100 or Figure 4A Compared with the ceramic base 200 , the ceramic base 300 may be configured such that a groove portion 127 is additionally provided on the lowermost end surface of the hollow shaft 120 .

[0079] Depending on the situation, it can also be configured to include a hollow shaft 120 with a groove 127 and electrode rods 121, 123, instead of Figure 2 The electrode rod 121 in the side wall hole 125 of the ceramic base 100, or alternatively Figure 4A The power supply conductor junction box 150 and the electrode rod 123 in the base 200 are provided.

[0080] like Figure 5A As shown, each electrode rod 121 , 122 for supplying power to the electrodes 112 , 114 is accommodated through the hollow portion 129 or the sidewall hole 125 of the hollow shaft 120 , and they may extend to the outside through the mounting portion 140 .

[0081] Meanwhile, although a rigid rod-shaped electrode rod 121 may be provided in the side wall hole 125, an electrode rod 123 having a gas flow path 123-1 and an air hole 123-2 may be provided in the side wall hole 125. A mixture of the rigid rod-shaped electrode rod 121 and the electrode rod 123 having a gas flow path 123-1 and an air hole 123-2 may be provided, or only one of the two types may be provided.

[0082] Mounting portion 140 includes a gas supply passage 145 disposed within main body 141. Gas supply passage 145 may be a through-hole formed in a rigid portion of main body 141, or an additional member, such as a tube or hollow cylinder, installed within the internal space. Mounting portion 140 may also include a gas connection portion 142 coupled to or integrated with main body 141. Gas supply passage 145 communicates with groove 127 of hollow shaft 120.

[0083] Figure 5B When viewed from below toward the hollow shaft 120 side Figure 5A FIG. 1 shows the surface CD of the hollow shaft 120 and the mounting portion 140 when they are combined.

[0084] Reference Figure 5B A groove 127 is formed on the lower end surface of the hollow shaft 120, recessed from the flat surface. Groove 127 communicates with the gas supply passage 145 and may be a continuous, circumferential annular groove. Groove 127 extends to intersect the sidewall hole 125 at least once, and one or more electrode rods 121 and 123 in the sidewall hole 125 extend through the groove 127 and into the mounting portion 140.

[0085] Therefore, a gas pipe for providing inactive gas (for example, He, N2, etc.) can be combined in the gas connection portion 142, and the gas provided to the groove portion 127 through the gas supply flow path 145 connected to the gas pipe can flow along the electrode rods 121, 123 passing through the groove portion 127 and be supplied to the side wall hole 125.

[0086] For example, when the electrode rod 121 (refer to Figure 2 ) passes through the groove portion 127, the gas can flow along the gap between the side wall hole 125 and the electrode rod 121 and be supplied to the side wall hole 125. In addition, when the electrode rod 123 having the gas flow path 123-1 and the plurality of gas holes 123-2 (refer to Figure 4C ) When passing through the groove portion 127, the gas can not only flow along the gap between the side wall hole 125 and the electrode rod 121 and be supplied to the side wall hole 125, but also flow along the gas flow path 123-1 in the electrode rod 123 and be supplied to the side wall hole 125 through multiple gas holes 123-2.

[0087] When a desired semiconductor process is performed while the target substrate 11 is supported on the insulating plate 110 , supplying the inert gas to the sidewall holes 125 as described above can prevent the electrode rods 121 and 123 from being oxidized even in a high temperature environment.

[0088] Based on the aforementioned anti-oxidation effect, the ceramic bases 100, 200, and 300 of the present invention eliminate the space where the electrode rods 121 could shake or bend by disposing the electrode rods 121 in the sidewall holes (e.g., Φ3 to Φ6) 125 of the hollow shaft 120, thereby easily preventing the risk of physical short circuits between them. Furthermore, the two schemes of disposing the electrode rods 122 within the hollow portion 129 of the hollow shaft 120 and disposing the electrode rods 121 and 123 in the sidewall holes (e.g., Φ3 to Φ6) 125 of the hollow shaft 120 can be combined. Furthermore, the configuration of the electrodes 112 and 114 can be freely designed based on changes in the number or position of the electrode rods 121, 122, and 123, and a larger number of electrode rods 121, 122, and 123 can be configured. In addition, since the insulating properties of the hollow shaft 120 are utilized by arranging the electrode rods 121 and 123 in the side wall holes (for example, Φ3 to Φ6) 125 of the hollow shaft 120, there is no need for additional insulating covering to insulate each electrode rod 121 and 123, and by separating the high-frequency electrode rod and the heating electrode rod and arranging them in the side wall holes 125 of the hollow shaft 120 or respectively in the side wall holes 125 and the hollow portion 129, the interval between the electrode rods will not be narrowed, thereby preventing arcing.

[0089] Furthermore, the ceramic susceptors 100, 200, and 300 of the present invention can prevent high-frequency (RF) noise when the electrode rods 122 in the hollow portion 129 serve as high-frequency electrodes, and the electrode rods 121 and 123 in the sidewall holes 125 serve as heating electrodes. For example, when a plasma process is performed while the target substrate 11 is supported on the ceramic susceptor 100, 200, or 300, the electrode rods 122 in the hollow portion 129 can be grounded, and the required power can be supplied via a high-frequency head (not shown) located above the target substrate 11. In this case, unlike conventional methods, grounding is achieved only through the electrode rods 122 in the hollow portion 129. This allows the electrode rods 121 and 123 in the sidewall holes 125, which are insulated by the ceramic material of the hollow shaft 120, to be further away from the electrode rods 122 in the hollow portion 129. This prevents high-frequency current from flowing to the electrode rods 121 and 123 in the sidewall holes 125, which are insulated by the ceramic material of the hollow shaft 120. This can block high-frequency (RF) noise during the plasma process and improve the uniformity of dry etching, etc.

[0090] As described above, in the present invention, specific matters such as specific components and limited embodiments and drawings have been described, but these are provided only to facilitate understanding of the present invention as a whole, and the present invention is not limited to the embodiments. A person skilled in the art to which the present invention belongs can make various modifications and changes without departing from the essential features of the present invention. Therefore, the spirit of the present invention should not be limited to the described embodiments and should be determined. In addition to the appended claims, all technical ideas that are equivalent to or equivalent to the claims should be interpreted as being included within the scope of the present invention.

Claims

1. A ceramic base, characterized in that: include: An insulating plate, provided with one or more electrodes, a hollow shaft, one end of which is connected to the insulating plate, and one or more electrode rods connected to the electrodes; The hollow shaft comprises one or more side wall holes, and the one or more side wall holes pass through the interior of the side wall of the hollow shaft; The one or more electrode rods include one or more first electrode rods, which are connected to first electrodes among the one or more electrodes and extend through the sidewall hole.

2. The ceramic base according to claim 1, characterized in that The one or more electrode rods further include one or more second electrode rods, which are connected to the second electrodes among the one or more electrodes and extend through the hollow portion of the hollow shaft.

3. The ceramic base according to claim 2, characterized in that The first electrode includes a heating electrode, The second electrode includes a high-frequency electrode.

4. The ceramic base according to claim 3, characterized in that The plurality of first electrode rods are respectively connected to the terminals of the respective heating electrodes.

5. The ceramic base according to claim 2, characterized in that The first electrode comprises a high-frequency electrode, The second electrode includes a heating electrode.

6. The ceramic base according to claim 5, characterized in that The plurality of second electrode rods are respectively connected to the terminals of the respective heating electrodes.

7. The ceramic base according to claim 1, characterized in that The electrode rod includes a gas flow path and one or more gas holes communicating with the gas flow path.

8. The ceramic base according to claim 7, characterized in that: Also included is a conductor junction box, which is combined with the electrode rod and is used to provide electricity; The conductor junction box includes a gas supply flow path that communicates with the gas flow path.

9. The ceramic base according to claim 1, characterized in that The utility model further comprises a mounting portion coupled with the lower portion of the hollow shaft.

10. The ceramic base according to claim 9, characterized in that The hollow shaft includes a groove portion formed on a surface of the hollow shaft coupled to the mounting portion and extending so as to meet the side wall hole more than once; The mounting portion includes a gas supply flow path communicating with the groove portion; The one or more first electrode rods extend so as to pass through the groove.

11. The ceramic base according to claim 9, characterized in that The one or more electrode rods further include one or more second electrode rods, the one or more second electrode rods being connected to the second electrodes among the one or more electrodes and extending through the hollow portion of the hollow shaft; The one or more second electrode rods pass through the mounting portion and extend.

Images