Measurement method and system, electronic equipment, storage medium and program product

Abstract

The invention provides a measurement method and system, electronic equipment, a storage medium and a program product. The method comprises the following steps: acquiring position information of a plurality of points on the side surface of a to-be-measured first material; and determining the diameter of the first material according to the position information of the plurality of points. According to the method, the position information of the multiple points is collected from the side face of the material, collection of the position information of the multiple points on the side face of the material is not affected by high reflection or light rays of the material, so that the measurement system can collect the accurate position information of the multiple points on the side face of the material, and the measurement accuracy is further improved according to the accurate position information of the side face of the material. The diameter of the material is determined, and the measurement accuracy is improved.

Description

Technical Field

[0001] The present application relates to the field of three-dimensional scanning measurement technology, and in particular to a measurement method, system, electronic device, storage medium and program product. Background Art

[0002] During the production and manufacturing process of materials, processing technology control is often performed based on the diameter of the material. Therefore, the measurement system needs to accurately measure the diameter of the material.

[0003] In related art, a measurement system captures an image of the upper or lower surface of a material, extracts the edge contour of the upper or lower surface from the captured image, and then determines the diameter of the edge contour of the upper or lower surface as the diameter of the material. Due to the material's high luminescence properties or the influence of light, the image of the material captured by the measurement system may have blurred edges, resulting in inaccurate material diameter measurements based on the image. Therefore, the measurement methods in related art have low accuracy. Summary of the Invention

[0004] The present application provides a measurement method, system, electronic device, storage medium and program product to solve the problem of low accuracy of measurement methods in related technologies.

[0005] In a first aspect, the present application provides a measurement method, comprising:

[0006] Acquiring position information of a plurality of points on a side surface of a first material to be measured;

[0007] The diameter of the first material is determined according to the position information of the multiple points.

[0008] The obtaining of position information of a plurality of points on the side surface of the first material to be measured includes:

[0009] Controlling the first material to rotate along a rotation axis, and using a scanning device to collect first distances between the plurality of points and the scanning device;

[0010] According to the sampling frequency of the scanning device and the first distance, the position information of the multiple points relative to the center point of the lower bottom surface of the first material is determined; the position information of the multiple points relative to the center point of the lower bottom surface of the first material is determined.

[0011] Optionally, before obtaining the position information of a plurality of points on the side surface of the first material to be measured, the method further includes:

[0012] collecting, by the scanning device, a second distance between at least one point on the side of each second material in a plurality of second materials and the scanning device;

[0013] The determining, based on the sampling frequency of the scanning device and the first distance, position information of the plurality of points relative to the center point of the lower bottom surface of the first material includes:

[0014] Position information of the plurality of points relative to a center point of a lower bottom surface of the first material is determined according to the second distance, the sampling frequency, and the first distance.

[0015] Optionally, determining the position information of the multiple points relative to the center point of the lower bottom surface of the first material based on the second distance, the sampling frequency, and the first distance includes:

[0016] Determine the shortest distance between the rotation axis and the emission light path of the scanning device according to the diameter of the second material, the second distance, and a preset third distance from the scanning device to the center point;

[0017] Position information of the multiple points relative to a center point of a lower bottom surface of the first material is determined according to the third distance, the shortest distance, the first distance, and the sampling frequency.

[0018] Optionally, before determining the position information of the multiple points relative to the center point of the lower bottom surface of the first material based on the second distance, the sampling frequency, and the first distance, the method further includes:

[0019] determining, based on the second distance and the sampling frequency, a deviation of the second distance corresponding to the point scanned by the scanning device;

[0020] The first distance is calibrated according to the deviation.

[0021] Optionally, the scanning device is a line scanning device, and determining, based on the second distance and the sampling frequency, a deviation of the second distance corresponding to a point scanned by the scanning device includes:

[0022] Obtaining, according to the second distance and the sampling frequency, a difference between the second distances corresponding to two boundary points in each scan by the scanning device;

[0023] The deviation of the second distance corresponding to the points scanned by the scanning device is determined according to the average of the difference values ​​corresponding to multiple scans by the scanning device and the number of points scanned by the scanning device each time.

[0024] Optionally, determining the diameter of the first material according to the position information of the multiple points includes:

[0025] Fitting a cross-sectional profile of the first material according to the position information of the plurality of points;

[0026] The diameter of the first material is determined based on the cross-sectional profile.

[0027] Optionally, the first material has a plurality of cross-sectional profiles, and determining the diameter of the first material according to the cross-sectional profiles includes:

[0028] The diameter of any cross-sectional profile among the plurality of cross-sectional profiles is determined as the diameter of the first material.

[0029] Optionally, the first material has a plurality of cross-sectional profiles, and determining the diameter of the first material according to the cross-sectional profiles includes:

[0030] Among the plurality of diameters of the cross-sectional profiles, a maximum diameter among diameters that are smaller than or equal to a diameter threshold is determined, and the maximum diameter is determined as the diameter of the first material.

[0031] In a second aspect, the present application provides a measurement system, comprising: a measurement device;

[0032] The measuring device is used to execute the method described in the first aspect and various possible designs of the first aspect.

[0033] Optionally, it further comprises: a moving device and a scanning device;

[0034] The moving device is used to carry the first material and drive the first material to rotate;

[0035] The scanning device is used to collect first distances between a plurality of points on the side of the first material and the scanning device;

[0036] The measuring device is further used to control the moving device to drive the first material to rotate, and control the scanning device to collect the first distance between the multiple points and the scanning device, and, based on the sampling frequency of the scanning device and the first distance, determine the position information of the multiple points relative to the center point of the lower bottom surface of the first material;

[0037] The moving device is used to carry the first material and drive the first material to rotate;

[0038] The scanning device is used to collect first distances between the plurality of points and the scanning device;

[0039] The measuring device is further used to control the moving device to drive the first material to rotate, and control the scanning device to collect the first distance between the multiple points and the scanning device, and, based on the sampling frequency of the scanning device and the first distance, determine the position information of the multiple points relative to the center point of the lower bottom surface of the first material;

[0040] Optionally, the moving device includes: a rotary motor and a first fixed platform;

[0041] The first fixed platform is used to carry the first material;

[0042] The rotary motor is used to drive the first fixed platform to rotate so as to drive the first material to rotate.

[0043] Optionally, it further comprises: a second fixing platform;

[0044] The second fixing platform is used to carry the scanning device.

[0045] In a third aspect, the present application provides an electronic device, comprising: a processor, and a memory communicatively connected to the processor;

[0046] The memory stores computer-executable instructions;

[0047] The processor executes the computer-executable instructions stored in the memory to implement the method described in the first aspect and various possible designs of the first aspect.

[0048] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, in which computer-executable instructions are stored. When a processor executes the computer-executable instructions, the method described in the first aspect and various possible designs of the first aspect is implemented.

[0049] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program. When the computer program is executed by a processor, it implements the method described in the first aspect and various possible designs of the first aspect.

[0050] The measurement method, system, electronic device, storage medium, and program product provided in this application obtain position information of multiple points on the side of a first material to be measured and determine the diameter of the first material based on the position information of the multiple points. The method of this application collects position information of multiple points from the side of the material. Because the position information of multiple points on the side of the material is not affected by the material's high reflectivity or light, the measurement system can collect accurate position information of multiple points on the side of the material. Based on this accurate position information of the side of the material, the diameter of the material can be determined, thereby improving the accuracy of the measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0052] Figure 1 A schematic diagram of the structure of a measurement system provided in an embodiment of the present application Figure 1 ;

[0053] Figure 2 A schematic diagram of the structure of a measurement system provided in an embodiment of the present application Figure 2 ;

[0054] Figure 3 A flow chart of a measurement method provided in an embodiment of the present application;

[0055] Figure 4 A schematic diagram of a process for determining location information provided in an embodiment of the present application;

[0056] Figure 5 A schematic top view of measuring a second material provided in an embodiment of the present application;

[0057] Figure 6 A schematic top view of a method for determining position information provided in an embodiment of the present application;

[0058] Figure 7 A schematic diagram of a scanning device scanning a material provided in an embodiment of the present application;

[0059] Figure 8 A schematic diagram of a fitted cross-sectional profile provided in an embodiment of the present application;

[0060] Figure 9 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0061] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0062] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0063] In existing measurement methods, since the upper and lower surfaces of the material have high luminescence characteristics, the image of the material captured by the measurement system has blurred edges, resulting in inaccurate diameter of the material measured based on the image. Therefore, the measurement method in the related art has low accuracy.

[0064] In view of this, the present application proposes a measurement method, in which the measurement system collects the position information of multiple points from the side of the material. Since the position information of multiple points on the side of the material is not affected by the high reflectivity of the material or light, the measurement system can collect the accurate position information of multiple points on the side of the material, and further determine the diameter of the material based on the accurate position information on the side of the material, thereby improving the accuracy of the measurement.

[0065] Based on the implementation of the measurement method provided in the embodiments of the present application, the present application proposes a measurement system, and the structure of the measurement system is described below.

[0066] The measurement system proposed in this application includes a measuring device that can obtain position information of multiple points on the side of a first material to be measured and determine the diameter of the first material based on the position information of the multiple points.

[0067] Optionally, the measurement system may further include a moving device and a scanning device. Figure 1 A schematic diagram of the structure of a measurement system provided in an embodiment of the present application Figure 1 .like Figure 1 As shown, the measuring system includes a measuring device 101 , a moving device 102 and a scanning device 103 .

[0068] The moving device 102 is used to carry the first material and drive the first material to rotate.

[0069] The scanning device 103 is used to collect first distances between a plurality of points on the side of the first material and the scanning device. The scanning device 103 can be any device that can collect distances between points on the side of the material, for example, a line scanning laser radar.

[0070] The measuring device 101 is also used to control the moving device 102 to drive the first material to rotate, and control the scanning device 103 to collect the first distance between the multiple points and the scanning device, and, based on the sampling frequency and the first distance of the scanning device, determine the position information of the multiple points relative to the center point of the lower bottom surface of the first material, and determine the position information of the multiple points relative to the center point of the lower bottom surface of the first material.

[0071] Figure 2 A schematic diagram of the structure of a measurement system provided in an embodiment of the present application Figure 2 .like Figure 2 As shown, the measuring system includes a measuring device 101 , a moving device 102 and a scanning device 103 .

[0072] Optionally, the moving device 102 includes a rotary motor 201 and a first fixed platform 202. The first fixed platform 202 is used to carry the first material, and the rotary motor 201 is used to drive the first fixed platform 202 to rotate so as to drive the first material to rotate.

[0073] Optionally, the measurement system further includes a second fixed platform 203 , and the second fixed platform 203 is used to carry the scanning device 103 .

[0074] The data acquisition method provided by the embodiment of the present application is described in detail below using the above-mentioned data acquisition system as an example. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0075] It should be understood that the data collection method of the embodiment of the present application can be used in any scenario of measuring the diameter of a material.

[0076] Figure 3 This is a flow chart of a measurement method provided in an embodiment of the present application. Figure 3 As shown, the measurement method may include the following steps:

[0077] S301. Obtain position information of multiple points on a side surface of a first material to be measured.

[0078] The first material is a material whose diameter is to be measured, and the first material may be, for example, a semiconductor ingot.

[0079] Optionally, the position information of the multiple points on the side of the first material is the position information of the multiple points on the side of the first material relative to the same position.

[0080] Exemplarily, the measuring device can obtain the position information of multiple points on the side of the first material to be measured through a line scanning device. The line scanning device is any device that obtains distance by line scanning, for example, a line scanning laser radar. In this way, the first material is placed on the moving device, and the measuring device can control the moving device to drive the first material to rotate along the rotation axis, and control the line scanning device to scan the side of the first material. The line scanning device emits scanning light at a sampling frequency to collect the distance between the multiple points on the side of the first material and the line scanning device. The measuring device determines the position information of multiple points on the side of the first material relative to the same position based on the sampling frequency of the line scanning device and the distance between the multiple points on the side of the first material collected by the line scanning device and the line scanning device. For example, the position information of multiple points on the side of the first material relative to the center point of the lower bottom surface of the first material.

[0081] Exemplarily, the measuring device can obtain the position information of multiple points on the side of the first material to be measured through a point sensor. A point sensor is any sensor that obtains the distance of a scanning point by scanning light. In this manner, the first material is placed on a moving device, and the measuring device can control the moving device to drive the first material to rotate along the rotation axis, and control the point sensor to scan the side of the first material. Each time the point sensor scans, it can obtain the distance between a scanning point measured on the first material and the point sensor. After rotating the first material at least one circle, it can obtain the distance between multiple points at the same height on the side of the first material and the point sensor. The measuring device determines the position information of multiple points on the side of the first material relative to the same position based on the sampling frequency of the point sensor and the distance between the multiple points at the same height on the side of the first material collected by the point sensor and the point sensor. For example, the position information of multiple points on the side of the first material relative to the center point of the upper and lower surfaces of the first material.

[0082] S302: Determine the diameter of the first material according to the position information of the multiple points.

[0083] For example, the measuring device can fit a graph formed by multiple points based on their positional information on the side of the first material, and determine the diameter of the first material using the fitted graph. For example, based on the sampling frequency of the point sensor in the above-described embodiment, the distance between two adjacent points at the same height on the side of the first material can be determined. Based on this distance and the distance between the multiple points at the same height on the side of the first material and the point sensor, a cross-sectional curve of the first material at that height can be further fitted, and the diameter of the fitted cross-sectional curve can be determined as the diameter of the first material.

[0084] Exemplarily, the measuring device can obtain the distance between multiple points at multiple heights on the side of the first material and the point sensor. In this case, the measuring device can fit the cross-sectional curves of the first material at multiple heights and determine the diameter of any cross-sectional curve in the cross-sectional curves at multiple heights as the diameter of the first material.

[0085] The measurement method of the present application obtains position information of multiple points on the side of a first material to be measured and determines the diameter of the first material based on the position information of the multiple points. The method of the present application collects position information of multiple points from the side of the material. Because the position information of multiple points on the side of the material is not affected by the material's high reflectivity or light, the measurement system can collect accurate position information of multiple points on the side of the material. Based on this accurate position information of the side of the material, the diameter of the material can be determined, thereby improving the accuracy of the measurement.

[0086] The following describes an embodiment of how to obtain position information of multiple points on the side surface of the first material to be measured in the measurement method provided in this application.

[0087] Exemplarily, the measuring device can control the first material to rotate along the rotation axis, collect the first distance between the multiple points and the scanning device through the scanning device, determine the position information of the multiple points relative to the center point of the lower bottom surface of the first material according to the sampling frequency of the scanning device and the first distance, and determine the position information of the multiple points relative to the center point of the lower bottom surface of the first material.

[0088] The first distance is the distance between each of the multiple points on the side of the first material and the scanning device. Taking the scanning device as a line scanning device as an example, the sampling frequency of the scanning device is used to obtain that during the process of the first material rotating one circle along the rotating axis, the number of scans by the line scanning device is M times, and the number of points scanned each time is N, that is, the distance of the side of the first material that can be collected by the scanning device is N. A first distance between each of the points and the scanning device.

[0089] Based on the sampling frequency and the first distance of the scanning device, the position information of multiple points relative to the center point of the lower bottom surface of the first material is determined. For example, since the distance between the scanning device and the rotation axis of the first material is a preset distance, the testing device can convert the first distance between the multiple points on the side of the first material and the scanning device into the horizontal distance between the multiple points on the side of the first material and the rotation axis where the center point of the lower bottom surface of the first material is located. The distance between two adjacent points can be obtained based on the sampling frequency of the scanning device, and the position information of the multiple points on the side of the first material relative to the center point of the lower bottom surface of the first material can be determined based on the conversion of the geometric image.

[0090] In this mode, the measuring device can control the first material to rotate along the rotation axis, and collect the position information of multiple points from the side of the material through the scanning device. Since the position information of multiple points on the side of the material is not affected by the high reflectivity of the material or light, the measuring system can collect the accurate position information of multiple points on the side of the material. Furthermore, the diameter of the material can be determined based on the accurate data of the side of the material, thereby improving the accuracy of the measurement.

[0091] Optionally, before acquiring the position information of the multiple points on the side surface of the first material to be measured, the measurement system may further use a scanning device to collect a second distance between at least one point on the side surface of each of the multiple second materials and the scanning device. In this manner, after acquiring the position information of the multiple points to be measured, the measurement system may determine the position information of the multiple points relative to the center point of the lower surface of the first material based on the second distance, the sampling frequency, and the first distance.

[0092] Figure 4 A schematic diagram of a process for determining location information provided in an embodiment of the present application. For example, Figure 4 As shown, after the measurement system obtains the position information of multiple points on the side surface of the first material to be measured, determining the position information of the multiple points relative to the center point of the lower bottom surface of the first material based on the second distance, the sampling frequency, and the first distance may include the following steps:

[0093] S401. Determine the shortest distance between the rotation axis and the emission light path of the scanning device according to the diameter of the second material, the second distance, and a preset third distance from the scanning device to the center point.

[0094] The following combination Figure 5 The following describes how to determine the shortest distance between the rotation axis and the emission light path of the scanning device. Figure 5 This is a schematic top view of a method for measuring a second material provided in an embodiment of the present application. Figure 5 The position of the preset scanning device is shown with the rotation center as the center of the circle. Figure 5 On the x-axis shown in , due to the deviation in the placement of the scanning device, the distance between the scanning device and the x-axis is .

[0095] Taking two second materials as an example, the scanning device collects the second distances between a plurality of points on the side of each of the two second materials and the scanning device. For example, the scanning device collects the second distances between a point on the lower layer of each of the two second materials and the scanning device. and , the distance between the scanning device and the rotation center is .

[0096] like Figure 5 As shown, taking a second material as an example, the second distance collected by the scanning device through the emission light path to a point on the second material is , the diameter of the second material is , the third distance from the preset scanning device to the center point is Based on geometric calculations, the shortest distance between the rotation axis and the emission light path of the scanning device can be obtained. It can be expressed as shown in formula (1):

[0097] Formula (1)

[0098] Taking another second material as an example, the second distance collected by the scanning device through the emission light path to a point on the second material is , the diameter of the second material is Based on geometric calculations, the shortest distance between the rotation axis and the emission light path of the scanning device can be obtained. It can be expressed as shown in formula (1):

[0099] Formula (2)

[0100] According to formula (1) and formula (2), we can get As shown in formula (3):

[0101] Formula (3)

[0102] based on Can get , as shown in formula (4):

[0103] Formula (4)

[0104] It should be understood that the above embodiment obtains the second distance between one point of each second device and the scanning device. Alternatively, the measuring device can obtain the second distance between multiple points of each second device and the scanning device, and determine the shortest distance between the rotation axis and the emission light path of the scanning device based on the diameter of the second material, the second distance, and the preset third distance from the scanning device to the center point. For example, the measuring device can obtain the second distance between multiple points on the lower layer of each second material and the scanning device. Taking the first second material as an example, the average of the second distances between the multiple points and the scanning device is used as the value in the above formula. Similarly, the average of the second distances between the lower layer of the second material and the scanning device is used as the second distance in the above formula. .

[0105] In the above embodiment, when there are two second materials, the shortest distance between the rotation axis and the emission light path of the scanning device can be determined based on the second distances between multiple points on the side of each of the two second materials and the scanning device.

[0106] Alternatively, when collecting the second distances between the scanning device and multiple points on the side surfaces of more second materials, the measuring device may determine the shortest distance between the rotation axis and the emission light path of the scanning device based on the second distances between the multiple points on the side surfaces of any two second materials and the scanning device. For example, the measuring device may further divide the plurality of second materials into multiple groups, each group comprising two second materials, and determine the shortest distance between the rotation axis and the emission light path of the scanning device as the average of the shortest distances between the rotation axis and the emission light path of the scanning device determined based on the second distances between the multiple points on the side surfaces of the two second materials in each group and the scanning device.

[0107] S402. Determine position information of multiple points on the side surface of the first material relative to the center point of the lower bottom surface of the first material based on the third distance, the shortest distance, the first distance, and the sampling frequency.

[0108] For example, the scanning device scans M times, and the number of points each time is N, that is, the scanning device collects the first material side A first distance between each point in the points and the scanning device, wherein the multiple points are regarded as M columns, The matrix of the point in row i, column i, row j has the first distance from the point in the scanning device as .

[0109] The following combination Figure 6 A method for calibrating the coordinates of multiple points based on the shortest distance between the rotation axis and the emission light path of the scanning device when there is a deviation in the placement of the scanning device is described. Figure 6 This is a schematic top view of a method for determining position information provided in an embodiment of the present application. Figure 6 As shown, the process of rotating the first material one circle and obtaining a plurality of points by scanning with a scanning device can be converted into a process of rotating the scanning device around the rotation axis of the first material and obtaining a plurality of points by scanning during the rotation process. Figure 6 The dotted line passing through the coordinate origin is the emission light path of the scanning device when scanning a column of points on the side of the first material when the scanning device is placed according to the preset position of the scanning device and the rotation center of the first material. The other dotted line is the emission light path of the scanning device when scanning the same column of points at the actual position when the scanning device is placed with deviation. The distance between the two emission light paths is the shortest distance between the rotation axis and the emission light path of the scanning device obtained above. .

[0110] When the scanning device scans the points in the i-th column, the coordinates (Q, T) of the scanning device are as shown in formula (5):

[0111] Formula (5)

[0112] Based on the coordinates of the scanning device, the emission light path of the scanning device is obtained as shown in formula (6):

[0113] Formula (6)

[0114] For the point in column i and row j, the point is on the emission light path and the distance from the scanning device is The position information of the point relative to the center point of the lower bottom surface of the first material is shown in formula (7):

[0115] Formula (7)

[0116] in, is the distance between adjacent points in each scan by the scanning device, which can be obtained according to the sampling parameters of the scanning device.

[0117] In this manner, the shortest distance between the rotating axis and the emission light path of the scanning device is determined based on the diameter of the second material, the second distance, and the preset third distance from the scanning device to the center point. The position information of multiple points on the side of the first material relative to the center point of the lower bottom surface of the first material is determined based on the third distance, the shortest distance, the first distance and the sampling frequency. In the event that there is a deviation in the placement of the scanning device, the accurate position information of multiple points on the side of the first material relative to the center point of the lower bottom surface of the first material can be determined based on the shortest distance, thereby improving the accuracy of obtaining the position information of multiple points on the side of the first material to be measured, and further improving the accuracy of the diameter of the first material determined based on the position information of multiple points on the side of the first material.

[0118] Optionally, before determining the position information of multiple points on the side of the first material relative to the center point of the lower bottom surface of the first material based on the second distance, the sampling frequency and the first distance, the measuring device can also determine the deviation of the second distance corresponding to the point scanned by the scanning device based on the second distance and the sampling frequency, and calibrate the first distance based on the deviation.

[0119] Figure 7 This is a schematic diagram of a scanning device scanning a material provided in an embodiment of the present application. Figure 7 As shown, when the scanning device is placed in a tilted state, there is a deviation between the first distance between the points of each layer in the emission light path of the scanning device and the scanning device.

[0120] Exemplarily, the scanning device can obtain the difference in the second distances corresponding to two boundary points in each scan of the scanning device based on the second distance and the sampling frequency, and determine the deviation of the second distance corresponding to the point scanned by the scanning device based on the average of the differences corresponding to multiple scans of the scanning device and the number of points scanned by the scanning device each time.

[0121] Taking two second materials as an example, when the scanning device is scanning one second material, the second distance between the bottommost point of the two boundary points scanned by the scanning device each time and the scanning device is obtained, as well as the second distance between the topmost point and the scanning device. The second distance between the bottommost point and the scanning device obtained in multiple scans is determined as , and the second distance between the topmost point obtained in multiple scans and the scanning device is determined as .

[0122] When the scanning device scans another second material, the second distance between the bottommost point of the two boundary points scanned by the scanning device each time and the scanning device is obtained, as well as the second distance between the topmost point and the scanning device. The second distance between the bottommost point and the scanning device obtained in multiple scans is determined as , and the second distance between the topmost point obtained in multiple scans and the scanning device is , exemplarily, the mean of the difference values ​​corresponding to multiple scans by the scanning device is shown in formula (8):

[0123] Formula (8)

[0124] According to the second distance and the sampling frequency, the deviation of the second distance corresponding to the point scanned by the scanning device is determined, and the first distance is calibrated according to the deviation, as shown in formula (9):

[0125] j Formula (9)

[0126] In this way, when the scanning device is placed at an angle, the first distance between the multiple points collected by the scanning device and the scanning device can be calibrated to make the first distance between the multiple points collected and the scanning device more accurate, thereby improving the accuracy of obtaining the position information of the multiple points on the side of the first material to be measured, and thereby improving the accuracy of the measurement.

[0127] The measurement method of the present application obtains position information of multiple points on the side of the first material to be measured, providing data support for determining the diameter of the first material based on the position information of the multiple points. The method of the present application collects position information of multiple points from the side of the material. Because the position information of multiple points on the side of the material is not affected by the high reflectivity of the material or light, the measurement system can collect accurate position information of multiple points on the side of the material, providing accurate data for determining the diameter of the material.

[0128] The above embodiments illustrate various ways of obtaining the position information of multiple points on the side of the first material to be measured. The following describes an embodiment of how to determine the diameter of the first material based on the position information of multiple points on the side of the first material in the measurement method provided in this application.

[0129] Optionally, the measuring device may fit a cross-sectional profile of the first material based on position information of a plurality of points on the side surface of the first material, and determine the diameter of the first material based on the cross-sectional profile.

[0130] Exemplarily, when the first material is columnar, the cross-sectional profile of the first material is fitted based on any fitting method according to the position information of multiple points on the side of the first material, for example, the equation of the circle is obtained by fitting through the least squares minimization fitting method.

[0131] In this manner, fitting the cross-sectional profile of the first material based on the fitting method can improve the processing efficiency of determining the diameter of the first material, thereby improving the measurement efficiency.

[0132] Figure 8 A schematic diagram of a fitting cross-sectional profile provided in an embodiment of the present application. Figure 8 As shown, the measuring device can fit multiple cross-sectional profiles of the first material based on the position information of multiple points on the side of the first material.

[0133] For example, the measuring device may determine the diameter of any one of the plurality of cross-sectional profiles as the diameter of the first material.

[0134] For example, the measuring device may determine the maximum diameter among the diameters of the multiple cross-sectional profiles that are less than or equal to a diameter threshold, and determine the maximum diameter as the diameter of the first material. For example, the testing device may obtain the diameters of the multiple cross-sectional profiles and use a value that is 1.1 times the average of the diameters of the multiple cross-sectional profiles as the diameter threshold. From the diameters of the multiple cross-sectional profiles, determine the maximum diameter among the diameters that are less than or equal to the diameter threshold, and determine the maximum diameter as the diameter of the first material.

[0135] In this manner, the measuring device can avoid being affected by measurement errors or outliers among the diameters of multiple cross-sectional profiles and determine a more accurate diameter as the diameter of the first material.

[0136] The measurement method of the present application is that the measuring device fits the cross-sectional profile of the first material according to the position information of multiple points on the side of the first material, and determines the diameter of the first material according to the cross-sectional profile, thereby realizing the determination of the diameter of the first material according to the position information of multiple points on the side of the first material. The method of the present application collects the position information of multiple points from the side of the material. Since the collected position information of multiple points on the side of the material is not affected by the high reflectivity of the material or light, the measurement system can collect the accurate position information of multiple points on the side of the material, and further determine the diameter of the material based on the accurate position information on the side of the material, thereby improving the accuracy of the measurement.

[0137] It should be understood that the above-described device embodiments are merely illustrative, and the device of the present application may also be implemented in other ways. For example, the division of units / modules in the above-described embodiments is merely a logical functional division, and actual implementations may employ other division methods. For example, multiple units, modules, or components may be combined or integrated into another system, or some features may be omitted or not implemented.

[0138] Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 9 As shown, the electronic device may include: at least one processor 901 and a memory 902.

[0139] The memory 902 is used to store programs. Specifically, the programs may include program codes, and the program codes include computer operation instructions.

[0140] The memory 902 may include a high-speed RAM memory, and may also include a non-volatile memory.

[0141] The processor 901 is configured to execute computer-executable instructions stored in the memory 902 to implement the method of the aforementioned method embodiment. The processor 901 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0142] Optionally, the electronic device may further include a communication interface 903. In specific implementation, if the communication interface 903, memory 902 and processor 901 are implemented independently, the communication interface 903, memory 902 and processor 901 may be interconnected via a bus and communicate with each other.

[0143] Optionally, in a specific implementation, if the communication interface 903, the memory 902 and the processor 901 are integrated on a chip, the communication interface 903, the memory 902 and the processor 901 can complete communication through an internal interface.

[0144] The present application also provides a computer-readable storage medium, which may include: a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), and other media that can store program codes. Specifically, the computer-readable storage medium stores program instructions, which are used to implement the actions of the above-mentioned method implementation method.

[0145] The present application also provides a computer program product, which includes a computer program, and when the computer program is executed by a processor, the actions of the above method implementation are implemented.

[0146] In addition, unless otherwise specified, the functional units / modules in the various embodiments of the present application may be integrated into a single unit / module, each unit / module may exist physically separately, or two or more units / modules may be integrated together. The aforementioned integrated units / modules may be implemented in the form of hardware or software program modules.

[0147] If an integrated unit / module is implemented in hardware, the hardware may be digital circuits, analog circuits, or other similar devices. The physical implementation of the hardware structure includes, but is not limited to, transistors. Unless otherwise specified, a processor may be any suitable hardware processor, such as a CPU, GPU, FPGA, DSP, or ASIC. Unless otherwise specified, a storage unit may be any suitable storage medium, such as resistive random access memory (RRAM), dynamic random access memory (DRAM), static random access memory (SRAM), enhanced dynamic random access memory (EDRAM), high-bandwidth memory (HBM), or hybrid memory cube (HMC).

[0148] If the integrated unit / module is implemented in the form of a software program module and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a memory and includes a number of instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned memory includes various media that can store program code, such as USB flash drives, read-only memories (ROMs), random access memories (RAMs), and mobile hard drives.

[0149] In the above embodiments, the description of each embodiment has its own emphasis. For parts not described in detail in a particular embodiment, please refer to the relevant description of other embodiments. The technical features of the above embodiments can be combined in any way. To keep the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0150] Those skilled in the art will appreciate that all or part of the steps in the above-described method embodiments can be implemented by hardware associated with program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM and RAM.

Claims

1. A measurement method, characterized in that: include: Acquiring position information of a plurality of points on a side surface of a first material to be measured; The diameter of the first material is determined according to the position information of the multiple points.

2. The method according to claim 1, characterized in that The obtaining of position information of a plurality of points on the side surface of the first material to be measured includes: Controlling the first material to rotate along a rotation axis, and using a scanning device to collect first distances between the plurality of points and the scanning device; According to the sampling frequency of the scanning device and the first distance, the position information of the multiple points relative to the center point of the lower bottom surface of the first material is determined; the position information of the multiple points relative to the center point of the lower bottom surface of the first material is determined.

3. The method according to claim 2, characterized in that Before obtaining the position information of a plurality of points on the side surface of the first material to be measured, the method further includes: collecting, by the scanning device, a second distance between at least one point on the side of each second material in a plurality of second materials and the scanning device; The determining, based on the sampling frequency of the scanning device and the first distance, position information of the plurality of points relative to the center point of the lower bottom surface of the first material includes: Position information of the plurality of points relative to a center point of a lower bottom surface of the first material is determined according to the second distance, the sampling frequency, and the first distance.

4. The method according to claim 3, characterized in that The determining, based on the second distance, the sampling frequency, and the first distance, position information of the plurality of points relative to the center point of the lower bottom surface of the first material includes: Determine the shortest distance between the rotation axis and the emission light path of the scanning device according to the diameter of the second material, the second distance, and a preset third distance from the scanning device to the center point; Position information of the multiple points relative to a center point of a lower bottom surface of the first material is determined according to the third distance, the shortest distance, the first distance, and the sampling frequency.

5. The method according to claim 3 or 4, characterized in that Before determining the position information of the plurality of points relative to the center point of the lower bottom surface of the first material based on the second distance, the sampling frequency, and the first distance, the method further includes: determining, based on the second distance and the sampling frequency, a deviation of the second distance corresponding to the point scanned by the scanning device; The first distance is calibrated according to the deviation.

6. The method according to claim 5, characterized in that The scanning device is a line scanning device, and determining, based on the second distance and the sampling frequency, a deviation of the second distance corresponding to a point scanned by the scanning device includes: Obtaining, according to the second distance and the sampling frequency, a difference between the second distances corresponding to two boundary points in each scan by the scanning device; The deviation of the second distance corresponding to the points scanned by the scanning device is determined according to the average of the difference values ​​corresponding to multiple scans by the scanning device and the number of points scanned by the scanning device each time.

7. The method according to claim 1, characterized in that The determining the diameter of the first material according to the position information of the plurality of points includes: Fitting a cross-sectional profile of the first material according to the position information of the plurality of points; The diameter of the first material is determined based on the cross-sectional profile.

8. The method according to claim 7, characterized in that The first material has a plurality of cross-sectional profiles, and determining the diameter of the first material according to the cross-sectional profiles includes: The diameter of any cross-sectional profile among the plurality of cross-sectional profiles is determined as the diameter of the first material.

9. The method according to claim 7, characterized in that The first material has a plurality of cross-sectional profiles, and determining the diameter of the first material according to the cross-sectional profiles includes: Among the plurality of diameters of the cross-sectional profiles, a maximum diameter among diameters that are smaller than or equal to a diameter threshold is determined, and the maximum diameter is determined as the diameter of the first material.

10. A measurement system, characterized in that: include: Measuring devices; The measuring device is used to perform the method according to any one of claims 1 to 7.

11. The system according to claim 10, wherein: Also includes: Mobile devices and scanning devices; The moving device is used to carry the first material and drive the first material to rotate; The scanning device is used to collect first distances between a plurality of points on the side of the first material and the scanning device; The measuring device is further used to control the moving device to drive the first material to rotate, and control the scanning device to collect the first distance between the multiple points and the scanning device, and, based on the sampling frequency of the scanning device and the first distance, determine the position information of the multiple points relative to the center point of the lower bottom surface of the first material; 12. The system according to claim 11, wherein: The moving device includes: a rotary motor and a first fixed platform; The first fixed platform is used to carry the first material; The rotary motor is used to drive the first fixed platform to rotate so as to drive the first material to rotate.

13. The system according to claim 12, wherein: Also includes: Second fixed platform; The second fixing platform is used to carry the scanning device.

14. An electronic device, characterized in that: include: a processor, and a memory communicatively connected to the processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method according to any one of claims 1 to 9.

15. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-executable instructions, which are used to implement the method according to any one of claims 1 to 9 when executed by a processor.

16. A computer program product, characterized in that The invention comprises a computer program, which implements the method according to any one of claims 1 to 9 when the computer program is executed by a processor.

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