Semiconductor production equipment for bonding glue coating and front side edge washing

Abstract

The invention relates to the technical field of semiconductor production equipment, in particular to semiconductor production equipment for bonding glue gluing and front side edge washing, which comprises an equipment welding frame, an edge washing cavity bottom plate and a gluing cavity bottom plate are mounted in the equipment welding frame, a front side edge washing cavity is fixedly mounted on the surface of the upper end of the edge washing cavity bottom plate, and a front side edge washing cavity is fixedly mounted on the surface of the upper end of the gluing cavity bottom plate. A bonding glue coating cavity is fixedly mounted on the surface of the upper end of the gluing cavity bottom plate, and a front side edge washing arm translation mechanism is mounted at the position, close to one side of the front side edge washing cavity, of the surface of the upper end of the edge washing cavity bottom plate. The bonding glue coating cavity is provided with the glue coating waste liquid discharging mechanism, the cleaning and maintaining time is shortened, only a small amount of waste bonding glue is generated during front side edge washing, and the front side edge washing waste liquid collecting box and the like are arranged, so that the front side edge washing cavity almost does not need to be manually cleaned and maintained any more.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor production equipment, in particular to a semiconductor production equipment used for bonding glue coating and front side edge washing. Background Art

[0002] The wafer bonding process is one of the core processes in semiconductor manufacturing. It uses chemical and physical effects to tightly bond two wafers or wafers and glass together to form a stable covalent bond. The process flow is generally that the robot takes out the wafer from the cassette, enters the alignment mechanism to optically or mechanically align the wafer, and then enters the cavity to apply a layer of bonding glue on the surface of the wafer. The wafer then enters the hot plate of different temperatures for baking in turn. After the wafer is baked, it comes out of the hot plate and enters the cavity again. The front of the wafer is washed to remove the bonding glue on the edge of the wafer. Finally, the wafer enters the bonding cavity for bonding. After the wafer bonding is completed, it returns to the cassette to complete the wafer bonding process.

[0003] In the prior art, the bonding glue coating and front side washing in the wafer bonding process are designed with two upper and lower stacked cavities, each of which is equipped with the bonding glue coating and front side washing functions. When the wafer needs to be coated with glue or the front side washing is required, it can randomly enter one of the idle cavities to complete the bonding glue coating or the front side washing. Since the bonding glue has a high viscosity, a lot of waste glue is generated during the coating process, which is not easy to be discharged by its own gravity, causing the bonding glue waste to accumulate on the inner wall of the wafer process cup and the cavity waste liquid discharge mechanism. Usually, the wafer process cup and the cavity waste liquid discharge mechanism need to be cleaned and maintained every 1-2 days, otherwise the wafer process cup and the cavity waste liquid discharge mechanism will be blocked, affecting production, and the wafer process cup It is generally a quick-disassembly structure. After removal, a set of spare wafer process cups are replaced, and then the replaced wafer process cups are cleaned and maintained. Manual cleaning and maintenance space is generally reserved under the cavity waste liquid discharge mechanism of the lower cavity. It usually takes about 3 hours to remove the cavity waste liquid discharge mechanism for cleaning and maintenance. When manually cleaning and maintaining the waste liquid discharge mechanism of the upper cavity, the height of the manual operation space is limited when removing the waste liquid discharge mechanism of the upper cavity due to the air supply mechanism of the lower cavity below it. The time for removing the waste liquid discharge mechanism of the upper cavity and the cleaning and maintenance time generally take about 6 hours. During this period, the two cavities cannot perform gluing, front edge washing and other production;

[0004] In order to facilitate the removal of the waste liquid discharge mechanism of the upper cavity, it is necessary to increase the operating space height of the waste liquid discharge mechanism of the upper cavity, resulting in the overall height of the equipment increasing to approximately 2700mm. In addition, when the upper cavity is equipped with a gluing function, the height of the gluing nozzle from the glue pump at the bottom of the equipment exceeds 1600mm. Due to the high viscosity of the bonding glue, the glue pump needs to continuously and stably supply the bonding glue to the glue nozzle of the upper cavity, which places great demands on the glue supply capacity of the glue pump. In the long run, this will accelerate damage to the glue pump and reduce its service life. In addition, when both the upper and lower cavities are equipped with a gluing function and a front side washing function, both cavities need to be equipped with a bonding glue supply pipeline and a front side washing pipeline, which increases the manufacturing cost of the equipment and also complicates the pipelines within the equipment, making it difficult to maintain the equipment. Summary of the Invention

[0005] The object of the present invention is to provide a semiconductor production equipment for bonding glue coating and front side edge cleaning to solve the problems raised in the above background technology.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A semiconductor production device for bonding glue coating and front edge cleaning, comprising a device welding frame, an edge cleaning cavity bottom plate and a glue coating cavity bottom plate installed inside the device welding frame, a front edge cleaning cavity fixedly installed on the upper surface of the edge cleaning cavity bottom plate, a bonding glue coating cavity fixedly installed on the upper surface of the glue coating cavity bottom plate, and a front edge cleaning arm translation mechanism installed on the upper surface of the edge cleaning cavity bottom plate near the side of the front edge cleaning cavity;

[0008] A bonding glue arm translation mechanism is installed on one side of the bonding glue coating cavity in the upper surface space of the bottom plate of the glue coating cavity, a front washing arm lifting mechanism is provided on the front washing arm translation mechanism, the outer side wall of the front washing arm lifting mechanism is fixedly connected with the front washing arm body, and the outer side wall of the front washing arm body is fixedly connected with the front washing needle, a cavity air supply unit 1 is installed inside the equipment welding frame and directly above the front washing cavity, and a cavity air supply unit 2 is installed inside the equipment welding frame and directly above the bonding glue coating cavity.

[0009] Preferably, a wafer carrier, a plurality of wafer receiving columns and a plurality of back side washing mechanisms are fixedly installed in the front side washing chamber and inside the front side washing chamber, and the wafer carrier and the plurality of wafer receiving columns cooperate with each other.

[0010] Preferably, a front side washing waste liquid collection box is installed on the upper surface of the bottom plate of the side washing chamber near the other side of the front side washing chamber, and a cleaning maintenance port is fixedly installed on the upper surface of the front side washing waste liquid collection box near one end.

[0011] Preferably, a discharge port of the front side washing waste liquid collection box is fixedly installed on the bottom surface of the front side washing waste liquid collection box, and a second cleaning liquid injection connector is fixedly installed at one end of the outer wall of the front side washing waste liquid collection box away from the cleaning maintenance port.

[0012] Preferably, a bonding glue arm lifting mechanism is installed on the bonding glue arm translation mechanism, a wafer process cup is fixedly installed on the upper end surface of the bonding glue coating cavity, and a coating arm is fixedly installed on the outer side wall of the bonding glue arm lifting mechanism.

[0013] Preferably, a glue coating body is fixedly installed on the upper surface of the bottom plate of the glue coating cavity near one side, a plurality of glue coating nozzles are fixedly installed on the upper surface of the glue coating body, and a plurality of glue nozzle cleaning mechanisms are fixedly installed on the outer wall of the glue coating body near the upper end.

[0014] Preferably, a glue waste liquid discharge mechanism is provided on the bottom surface of the bottom plate of the glue coating cavity, and the glue waste liquid discharge mechanism includes a glue waste liquid collection box, which is fixedly installed on the bottom surface of the bottom plate of the glue coating cavity, and the bottom surface of the glue waste liquid collection box is fixedly connected to a glue waste liquid discharge port.

[0015] Preferably, a cleaning liquid injection joint 1 is fixedly connected to the outer wall of the glue coating waste liquid collection box, a waste liquid collection box sealing gasket is fixedly installed between the upper end surface of the glue coating waste liquid collection box and the bottom surface of the glue coating cavity bottom plate, and a maintenance space is provided under the bonding glue coating cavity.

[0016] Preferably, a glue pump is installed at the bottom end of the internal welding frame of the equipment, and a wafer access port shielding plate is fixedly installed on one side of the front edge washing cavity and the bonding glue coating cavity.

[0017] A glue pump is installed at the bottom end of the equipment welding frame, and a wafer pick-up and drop-off port shielding plate is fixedly installed on one side of the front edge washing cavity and the bonding glue coating cavity.

[0018] Beneficial effects of the present invention:

[0019] 1. The present invention separates the bonding glue coating function and the front edge washing function, and designs them into two independent cavities, namely a bonding glue coating cavity installed below the equipment welding frame and a front edge washing cavity installed above the equipment welding frame. When coating the wafer, it can only enter the lower bonding glue coating cavity for coating, and when washing the front edge, it can only enter the upper front edge washing cavity for washing the front edge. Unlike the traditional solution, it cannot randomly enter one of the idle cavities to complete coating or front edge washing. However, the wafer coating time and the front edge washing time are very short. The time consumed in the wafer bonding process is mainly wafer baking and wafer bonding. Therefore, the present invention will not affect the production capacity of the wafer bonding process.

[0020] 2. The present invention configures a bonding glue coating cavity under the equipment welding frame, and designs a waste liquid discharge mechanism for the bonding glue coating cavity. The time for manual cleaning and maintenance of the cavity waste liquid discharge mechanism is shortened from about 3 hours to less than 1.5 hours, and the cleaning frequency is changed from the original cleaning and maintenance every 1-2 days to cleaning and maintenance every 3-4 days. The height of the glue coating nozzle from the glue pump at the bottom of the equipment is shortened from more than 1600mm to within 900mm, which greatly reduces the load of the glue pump 13, so that the bonding glue can be continuously and stably supplied to the glue nozzle of the bonding glue coating cavity, extending the service life of the glue pump. The bonding glue coating cavity is no longer equipped with a front washing pipeline, which can reduce the equipment manufacturing cost, simplify the pipelines in the equipment, and facilitate equipment maintenance.

[0021] 2. The present invention configures a front edge washing cavity above the equipment welding frame. Only a very small amount of bonding glue waste is generated during the front edge washing. The waste liquid discharge mechanism is designed so that the front edge washing cavity almost no longer requires manual cleaning and maintenance. When manual cleaning and maintenance are occasionally performed, the time is shortened from about 6 hours to less than 1 hour, and it does not affect the normal production of the bonding glue coating cavity below. The waste liquid discharge port of the front edge washing cavity is located on the right side of the front edge washing cavity 3, so there is no need to reserve operating space under the front edge washing cavity. The overall height of the equipment can be reduced from 2700mm to 2500mm. The front edge washing cavity 3 is no longer equipped with a bonding glue supply pipeline, which can reduce the equipment manufacturing cost, simplify the pipelines in the equipment, and facilitate equipment maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a front view of the present invention;

[0025] Figure 3 It is a partial structural schematic diagram of the present invention;

[0026] Figure 4 It is a structural schematic diagram of the front side washing chamber and the side washing chamber bottom plate in the present invention;

[0027] Figure 5 In the present invention Figure 4 Enlarged view of point A in the middle;

[0028] Figure 6 It is a structural schematic diagram of the bonding glue coating cavity and the coating cavity bottom plate in the present invention;

[0029] Figure 7 It is a structural schematic diagram of the gluing cavity bottom plate and the gluing waste liquid collection box in the present invention.

[0030] The reference numerals in the figures are as follows:

[0031] 1. Equipment welding frame; 2. Cavity air supply unit 1; 3. Front edge washing chamber; 5. Front edge washing arm lifting mechanism; 6. Front edge washing arm translation mechanism; 7. Cavity air supply unit 2; 8. Bonding glue arm lifting mechanism; 9. Bonding glue arm translation mechanism; 10. Bonding glue coating chamber; 11. Glue coating waste liquid discharge port; 12. Maintenance space; 13. Glue pump; 14. Glue coating arm; 15. Glue coating nozzle; 16. Glue nozzle cleaning mechanism; 18. Wafer access port shield; 19. Wafer process cup; 20. Wafer carrier; 21. Wafer receiving column; 22. Glue coating chamber bottom plate; 23. Back side washing mechanism; 24. Cleaning liquid injection connector 1; 25. Glue coating waste liquid collection box; 26. Waste liquid collection box sealing gasket; 27. Front side washing needle; 28. Front side washing arm body; 29. ​​Front side washing waste liquid collection box; 30. Cleaning liquid injection connector 2; 31. Cleaning maintenance port; 32. Side washing waste liquid collection box discharge port; 33. Side washing chamber bottom plate; 34. Glue coating body. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] A semiconductor production equipment for bonding glue coating and front side cleaning, such as Figure 1-Figure 7As shown, it includes an equipment welding frame 1, and the equipment welding frame 1 is internally installed with a washing cavity bottom plate 33 and a coating cavity bottom plate 22. The upper end surface of the washing cavity bottom plate 33 is fixedly installed with a front washing cavity 3, and the upper end surface of the coating cavity bottom plate 22 is fixedly installed with a bonding glue coating cavity 10. The upper end surface of the washing cavity bottom plate 33 is close to the side of the front washing cavity 3 and is installed with a front washing arm translation mechanism 6. The upper end surface space of the coating cavity bottom plate 22 is fixed with a bonding glue coating cavity 10. There is a bonding glue arm translation mechanism 9, and a front washing arm lifting mechanism 5 is provided on the front washing arm translation mechanism 6. The outer wall of the front washing arm lifting mechanism 5 is fixedly connected with the front washing arm body 28, and the outer wall of the front washing arm body 28 is fixedly connected with the front washing needle 27. A cavity air supply unit 1 2 is installed inside the equipment welding frame 1 and directly above the front washing cavity 3. A cavity air supply unit 2 7 is installed inside the equipment welding frame 1 and directly above the bonding glue coating cavity 10.

[0034] The front side washing chamber 3 and the inside of the front side washing chamber 3 are fixedly installed with a wafer carrier 20, several wafer receiving columns 21 and several back side washing mechanisms 23. The wafer carrier 20 and the several wafer receiving columns 21 cooperate with each other. A glue pump 13 is installed at the bottom end of the equipment welding frame 1. A wafer pick-up and placement port baffle 18 is fixedly installed on one side of the front side washing chamber 3 and the bonding glue coating chamber 10.

[0035] When the front side washing operation is performed, air is supplied vertically downward into the front side washing chamber 3 through the cavity air supply unit 2 above the front side washing chamber 3. Before the wafer is sent into the front side washing chamber 3 by the robot, the wafer lifting mechanism rises and drives its several wafer receiving columns 21 to extend out of the wafer process cup 19. The wafer pick-up and placement port shielding plate 18 descends to expose the wafer transfer port. The robot places the wafer on the several wafer receiving columns 21 through the wafer transfer port. The robot exits the front side washing chamber 3. The wafer pick-up and placement port shielding plate 18 rises to cover the wafer transfer port to prevent foreign matter from entering the front side washing chamber 3 through the wafer transfer port and contaminating the wafer.

[0036] The wafer lifting mechanism drives several wafer receiving columns 21 to descend, so that the wafer falls on the wafer carrier 20, and the vacuum is turned on to adsorb the wafer on the wafer carrier 20. The front side washing arm lifting mechanism 5 drives the front side washing arm body 28 and the front side washing needle 27 to rise, and the front side washing arm translation mechanism 6 drives the front side washing arm body 28 and the front side washing needle 27 to translate, so that the front side washing needle 27 translates to the edge of the wafer. At this time, the cleaning liquid is sprayed from the front side washing needle 27 to reach the edge of the wafer, and the motor connected to the wafer carrier 20 rotates, driving the wafer carrier 20 and the wafer to rotate together, and removing the bonding glue at the edge of the wafer;

[0037] At the same time, the back side washing mechanism 23 sprays cleaning liquid onto the back of the wafer, and the cleaning liquid is brought to the edge of the wafer as the wafer rotates, preventing the bonding glue removed from the front edge of the wafer from being thrown onto the back of the wafer, thereby avoiding affecting the subsequent processes. After the front side washing is completed, the back side washing mechanism 23 stops spraying cleaning liquid, and the front side washing arm lifting mechanism 5 and the front side washing arm translation mechanism 6 drive the front side washing needle 27 back to its original position, and then turn off the vacuum, and the wafer lifting mechanism rises, driving its several wafer receiving columns 21 to rise, so that the wafer reaches the outside of the wafer process cup 19, and the robot takes the wafer away and leaves the front side washing chamber 3, completing the front side washing work.

[0038] A front side washing waste liquid collecting box 29 is installed on the upper surface of the side washing chamber bottom plate 33 near the other side of the front side washing chamber 3 , and a cleaning maintenance port 31 is fixedly installed on the upper surface of the front side washing waste liquid collecting box 29 near one end.

[0039] A washing waste liquid collection box discharge port 32 is fixedly installed on the bottom surface of the front washing waste liquid collection box 29, and a cleaning liquid injection connector 2 30 is fixedly installed at one end of the outer wall of the front washing waste liquid collection box 29 away from the cleaning maintenance port 31.

[0040] When the front side of the wafer is washed, the wafer process cup 19 blocks the bonding glue and cleaning liquid splashed when the wafer rotates, and discharges these waste liquids into the front side washing waste liquid collection box 29 below the chamber. The front side washing waste liquid collection box 29 is fixed to the bottom plate 33 of the washing chamber by bolts. The front side washing waste liquid collection box 29 is designed to be sloped, which is conducive to the discharge of waste liquid from the discharge port 32 of the washing waste liquid collection box;

[0041] Since only the bonding glue at the edge of the wafer needs to be removed during front-side edge washing, there is only a very small amount of bonding glue waste in the front-side edge washing waste liquid collection box 29. The cleaning liquid is automatically and regularly injected into the front-side edge washing waste liquid collection box 29 through the cleaning liquid injection connector 2 30 to automatically clean the front-side edge washing waste liquid collection box 29 and its waste liquid discharge port 32, thereby preventing the waste liquid discharge port 32 from being blocked. Therefore, the front-side edge washing waste liquid collection box 29 almost does not need to be cleaned or maintained, which greatly increases the production time of the equipment.

[0042] When manual cleaning and maintenance are occasionally performed, the cleaning and maintenance port 31 is opened to shorten the manual cleaning and maintenance time from about 6 hours to less than 1 hour, and it does not affect the normal production of the bonding glue coating cavity 10 below. The discharge port 32 of the edge washing waste liquid collection box can be extended outside the cavity, and there is no need to reserve maintenance space 12 under the front edge washing cavity 3, so that the height of the front edge washing cavity 3 is reduced, thereby reducing the overall height of the equipment from about 2700mm to about 2500mm.

[0043] A bonding glue arm lifting mechanism 8 is installed on the bonding glue arm translation mechanism 9, a wafer process cup 19 is fixedly installed on the upper end surface of the bonding glue coating chamber 10, a coating arm 14 is fixedly installed on the outer wall of the bonding glue arm lifting mechanism 8, a coating body 34 is fixedly installed near one side of the upper end surface of the coating chamber bottom plate 22, a number of coating nozzles 15 are fixedly installed on the upper end surface of the coating body 34, and a number of nozzle cleaning mechanisms 16 are fixedly installed on the outer wall of the coating body 34 near the upper end.

[0044] A glue waste liquid discharge mechanism is provided on the bottom surface of the glue coating cavity bottom plate 22, and the glue waste liquid discharge mechanism includes a glue waste liquid collecting box 25, which is fixedly installed on the bottom surface of the glue coating cavity bottom plate 22. The bottom surface of the glue waste liquid collecting box 25 is fixedly connected with a glue waste liquid discharge port 11, and the outer side wall of the glue waste liquid collecting box 25 is fixedly connected with a cleaning liquid injection joint 24. A waste liquid collection box sealing gasket 26 is fixedly installed between the upper end surface of the glue waste liquid collecting box 25 and the bottom surface of the glue coating cavity bottom plate 22, and a maintenance space 12 is provided below the bonding glue coating cavity 10.

[0045] When performing the bonding glue coating work, the cavity air supply unit 27 supplies air vertically downward into the bonding glue coating cavity 10. Before the wafer is sent into the bonding glue coating cavity 10 by the robot, the wafer lifting mechanism rises and drives several wafer receiving pillars 21 to extend out of the wafer process cup 19. The wafer pick-up and placement port shielding plate 18 descends to expose the wafer transfer port. The robot places the wafer on several wafer receiving pillars 21 through the wafer transfer port. The robot exits the bonding glue coating cavity 10, and the wafer pick-up and placement port shielding plate 18 rises to cover the wafer transfer port to prevent foreign matter from entering the bonding glue coating cavity 10 through the wafer transfer port to contaminate the wafer. The bonding glue arm lifting mechanism 8 drives the glue coating arm 14 and the glue coating nozzle 15 to rise, and the bonding glue arm translation mechanism 9 drives the glue coating arm 14 and the glue coating nozzle 15 to translate, so that the glue coating nozzle 15 translates to the center of the wafer. At this time, the glue pump 13 is activated to spray the bonding glue from the glue coating nozzle 15 to the center of the wafer. The motor connected to the wafer carrier 20 rotates, driving the wafer carrier 20 and the wafer to rotate together, and the bonding glue is evenly coated on the wafer surface from the center of the wafer to form a layer of bonding glue film;

[0046] At the same time, the back cleaning mechanism 23 sprays cleaning liquid onto the back of the wafer. The cleaning liquid is carried to the edge of the wafer as the wafer rotates, so that the bonding glue on the front of the wafer will not be thrown onto the back of the wafer when it reaches the edge of the wafer, avoiding affecting the subsequent processes.

[0047] After the bonding glue coating is completed, the back side cleaning mechanism 23 stops spraying the cleaning liquid, the bonding glue arm lifting mechanism 8 and the bonding glue arm translation mechanism 9 drive the glue nozzle 15 back to its original position, and the vacuum is turned off. The wafer lifting mechanism rises and drives several wafer receiving columns 21 to rise, so that the wafer reaches the outside of the wafer process cup 19. The robot takes the wafer away and leaves the bonding glue coating chamber 10. The wafer lifting mechanism and the opening and closing of the vacuum are existing technologies and will not be described in detail here.

[0048] When the wafer is coated with bonding glue and the back side washing mechanism 23 sprays out the cleaning liquid, the wafer process cup 19 blocks the bonding glue and cleaning liquid splashed when the wafer rotates, and discharges these waste liquids into the bonding glue coating waste liquid discharge mechanism below the bonding glue coating chamber 10. The coating waste liquid collection box 25 is fixed to the back of the coating chamber bottom plate 22 by bolts, and a hole is opened at the corresponding position of the coating chamber bottom plate 22 so that the waste liquid can be vertically discharged into the coating waste liquid collection box 25. A waste liquid collection box 25 is provided between the coating waste liquid collection box 25 and the coating chamber bottom plate 22. The box sealing gasket 26 is used to prevent the waste liquid from leaking and emitting odor. The gluing waste liquid collection box 25 is designed to be sloped, which is conducive to the discharge of waste liquid from the gluing waste liquid discharge port 11. The cleaning liquid is automatically and regularly injected into the gluing waste liquid collection box 25 through the cleaning liquid injection joint 24 to automatically clean the gluing waste liquid collection box 25 and the gluing waste liquid discharge port 11, preventing the gluing waste liquid discharge port 11 from being blocked, so that the cleaning frequency is changed from the original cleaning and maintenance every 1-2 days to cleaning and maintenance every 3-4 days, thereby increasing the production time of the equipment;

[0049] When the glue coating waste liquid discharge mechanism needs manual cleaning and maintenance, a maintenance space 12 is set below it with large space. The time for manual cleaning and maintenance of the cavity waste liquid discharge mechanism is shortened from about 3 hours to less than 1.5 hours, without affecting the normal production of the upper front edge washing cavity 3.

[0050] The present invention separates the bonding glue coating function and the front edge washing function, and designs them into two independent chambers, namely a bonding glue coating chamber 10 installed below the equipment welding frame 1 and a front edge washing chamber 3 installed above the equipment welding frame 1. When coating the wafer, it can only enter the lower bonding glue coating chamber 10 for coating, and when washing the front edge, it can only enter the upper front edge washing chamber 3 for washing the front edge. Unlike the traditional solution, it cannot randomly enter one of the idle chambers to complete the coating or front edge washing. However, the wafer coating time and the front edge washing time are very short. The time consumed in the wafer bonding process is mainly wafer baking and wafer bonding. Therefore, the present invention will not affect the production capacity of the wafer bonding process.

[0051] The present invention configures a bonding glue coating chamber 10 below the equipment welding frame 1 and designs a waste liquid discharge mechanism for the bonding glue coating chamber 10. The time required for manual cleaning and maintenance of the waste liquid discharge mechanism is shortened from about 3 hours to less than 1.5 hours, and the cleaning frequency is reduced from every 1-2 days to every 3-4 days.

[0052] The height of the glue nozzle 15 from the glue pump 13 at the bottom of the equipment is shortened from over 1600mm to less than 900mm, which greatly reduces the load on the glue pump 13, allowing the bonding glue to be continuously and stably supplied to the glue nozzle of the bonding glue coating cavity 10, and extending the service life of the glue pump 13;

[0053] The bonding glue coating chamber 10 is no longer equipped with a front edge washing pipeline, which can reduce the equipment manufacturing cost, simplify the pipelines in the equipment, and facilitate equipment maintenance.

[0054] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A semiconductor production device for bonding glue coating and front edge cleaning, comprising a device welding frame (1), characterized in that: A side-washing cavity bottom plate (33) and a glue coating cavity bottom plate (22) are installed inside the equipment welding frame (1); a front side-washing cavity (3) is fixedly installed on the upper end surface of the side-washing cavity bottom plate (33); a bonding glue coating cavity (10) is fixedly installed on the upper end surface of the glue coating cavity bottom plate (22); and a front side-washing arm translation mechanism (6) is installed on the upper end surface of the side-washing cavity bottom plate (33) near the side of the front side-washing cavity (3); A bonding glue arm translation mechanism (9) is installed on one side of the bonding glue coating cavity (10) in the upper surface space of the coating cavity bottom plate (22); a front side washing arm lifting mechanism (5) is provided on the front side washing arm translation mechanism (6); the outer side wall of the front side washing arm lifting mechanism (5) is fixedly connected to the front side washing arm body (28); the outer side wall of the front side washing arm body (28) is fixedly connected to the front side washing needle (27); a cavity air supply unit 1 (2) is installed inside the equipment welding frame (1) and directly above the front side washing cavity (3); and a cavity air supply unit 2 (7) is installed inside the equipment welding frame (1) and directly above the bonding glue coating cavity (10).

2. The semiconductor production equipment for bonding glue coating and front edge cleaning according to claim 1, characterized in that: The front side washing chamber (3) and the interior of the front side washing chamber (3) are both fixedly mounted with a wafer carrier (20), a plurality of wafer receiving columns (21) and a plurality of back side washing mechanisms (23); the wafer carrier (20) and the plurality of wafer receiving columns (21) cooperate with each other.

3. The semiconductor production equipment for bonding glue coating and front edge cleaning according to claim 2, characterized in that: A front side washing waste liquid collection box (29) is installed on the upper end surface of the side washing chamber bottom plate (33) near the other side of the front side washing chamber (3), and a cleaning maintenance port (31) is fixedly installed on the upper end surface of the front side washing waste liquid collection box (29) near one end.

4. The semiconductor production equipment for bonding glue coating and front edge cleaning according to claim 3, characterized in that: The bottom surface of the front side washing waste liquid collection box (29) is fixedly provided with a side washing waste liquid collection box discharge port (32), and the outer side wall of the front side washing waste liquid collection box (29) is fixedly provided with a cleaning liquid injection joint 2 (30) at one end away from the cleaning maintenance port (31).

5. The semiconductor production equipment for bonding glue coating and front edge cleaning according to claim 1, characterized in that: A bonding glue arm lifting mechanism (8) is installed on the bonding glue arm translation mechanism (9), a wafer process cup (19) is fixedly installed on the upper end surface of the bonding glue coating cavity (10), and a coating arm (14) is fixedly installed on the outer side wall of the bonding glue arm lifting mechanism (8).

6. The semiconductor production equipment for bonding glue coating and front edge cleaning according to claim 1, characterized in that: A glue coating body (34) is fixedly mounted on the upper surface of the bottom plate (22) of the glue coating cavity near one side, a plurality of glue coating nozzles (15) are fixedly mounted on the upper surface of the glue coating body (34), and a plurality of glue nozzle cleaning mechanisms (16) are fixedly mounted on the outer side wall of the glue coating body (34) near the upper end.

7. The semiconductor production equipment for bonding glue coating and front edge cleaning according to claim 1, characterized in that: The bottom surface of the gluing cavity bottom plate (22) is provided with a gluing waste liquid discharge mechanism, which includes a gluing waste liquid collection box (25). The gluing waste liquid collection box (25) is fixedly installed at the bottom surface of the gluing cavity bottom plate (22), and the bottom surface of the gluing waste liquid collection box (25) is fixedly connected to a gluing waste liquid discharge port (11).

8. The semiconductor production equipment for bonding glue coating and front edge cleaning according to claim 7, characterized in that: The outer wall of the glue coating waste liquid collection box (25) is fixedly connected to a cleaning liquid injection joint (24), and a waste liquid collection box sealing gasket (26) is fixedly installed between the upper end surface of the glue coating waste liquid collection box (25) and the bottom surface of the glue coating cavity bottom plate (22), and a maintenance space (12) is provided below the bonding glue coating cavity (10).

9. The semiconductor production equipment for bonding glue coating and front edge cleaning according to claim 8, characterized in that: A glue pump (13) is installed at the bottom end of the equipment welding frame (1), and a wafer access opening shielding plate (18) is fixedly installed on one side of the front edge washing cavity (3) and the bonding glue coating cavity (10).

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