Adjustable semiconductor wafer positioning device

Abstract

The invention provides an adjustable semiconductor wafer positioning device, and relates to the field of semiconductor device manufacturing. The front end surface of the mounting seat is fixedly connected with a fixed base; a lifting sliding seat is connected in the mounting seat in a sliding manner; a plurality of groups of third electric push rods are fastened and connected in the mounting seat through bolts; the tail ends of output shafts of the third electric push rods are connected with the bottom end face of the lifting sliding base. The upper part of the lifting sliding seat is fixedly connected with an auxiliary connecting seat; the top end face of the fixed base is fixedly connected with a first guide sliding rail. And a first guide sliding seat is connected into the first guide sliding rail in a sliding manner. The control rack can be driven to move in the moving process of the lifting sliding seat, then the annular air blowing frame blows air to the semiconductor positioning plate through a series of transmission, and the problem that when a photomask piece moves downwards, pollutants are likely to be clamped between the photomask piece and a wafer, and exposure is abnormal is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device manufacturing, and in particular to an adjustable semiconductor wafer positioning device. Background Art

[0002] During the semiconductor wafer processing process, in order to ensure that the wafer is accurately positioned and stably clamped during the processing and meet the nanometer-level precision requirements, a semiconductor wafer positioning device is usually used to accurately position and align the semiconductor wafer to achieve high-performance and high-yield production of chips. The existing semiconductor wafer positioning device is usually composed of a fixed seat, a semiconductor positioning plate, a semiconductor positioning claw, a lifting seat and an adhesive plate.

[0003] For example, the invention patent application number CN202211561423.1 discloses a semiconductor wafer positioning device and a semiconductor wafer processing positioning method. Specifically, the present invention relates to the field of wafer positioning technology and discloses a semiconductor wafer positioning device, comprising a bottom body, the outer wall of the bottom body is fixedly equipped with a lifting and retracting body, the inner cavity of the lifting and retracting body is provided with a first mounting groove, the inner wall of the first mounting groove is fixedly equipped with a motor, and the power output shaft of the motor is fixedly equipped with a lead screw. The center of the mask sheet is identified by a positioning sensor provided at the bottom of the fixed block, the position of the positioning assembly is positioned by a positioning sensor provided at the top of the semiconductor positioning plate, the data measured by the positioning sensor and the positioning sensor are calculated by the controller, and the controller controls the operation of the moving assembly, so that the moving assembly drives the positioning assembly to realize X and Y axis movement, thereby aligning the center of the positioning assembly with the center of the mask sheet, thereby solving the problem that when the mask sheet is manually replaced in traditional equipment, the mask sheet is difficult to be in the same position as the previous mask sheet.

[0004] However, after the photolithography, etching, thin film deposition and other processing steps of semiconductor wafers, photoresist residues or other incompletely cleaned contaminants are likely to remain on the wafer surface. At the same time, the contact and friction between the wafer surface and the positioning claws will accumulate static electricity, and then absorb charged particles such as dust and metal oxides in the air. These contaminants are easily deposited in the wafer positioning area, causing the contaminants to be sandwiched between the photomask and the wafer when the photomask moves down, causing exposure abnormalities, affecting the wafer processing effect, and being inconvenient to use. Summary of the Invention

[0005] In view of this, the present invention provides an adjustable semiconductor wafer positioning device, which is provided with an annular blowing frame, a telescopic air bag and an air guide pipe that can automatically clean contaminants in the positioning area. During the movement of the lifting slide, the control rack will be driven to move as the control rack moves, and the control gear meshed with it will be driven to rotate. During the rotation of the control gear, the rotating disk will be driven to rotate. As the rotating disk rotates, the fixed column will be driven to slide in the guide slide groove. As the fixed column slides, the swinging gear frame will be driven to swing back and forth. As the swinging gear frame swings back and forth, the sliding gear column will be driven to slide back and forth. As the sliding gear column slides back and forth, the control pressure plate will be driven to slide back and forth in the mounting seat. During the reciprocating sliding of the control pressure plate, the telescopic air bag will be reciprocally squeezed, so that the telescopic air bag will introduce gas into the annular blowing frame through the air guide pipe, so that the annular blowing frame blows air to the semiconductor positioning plate to remove contaminants remaining in the positioning area.

[0006] The present invention provides an adjustable semiconductor wafer positioning device, which specifically includes: a mounting seat; the front end face of the mounting seat is fixedly connected to a fixed base; a lifting slide is slidably connected inside the mounting seat; multiple groups of third electric push rods are fastened with bolts inside the mounting seat; the ends of the output shafts of the multiple groups of third electric push rods are all connected to the bottom end face of the lifting slide; an auxiliary connecting seat is fixedly connected to the upper part of the lifting slide; the top end face of the fixed base is fixedly connected to a first guide rail; a first guide slide is slidably connected inside the first guide rail; the top end face of the first guide slide is fixedly connected to a second guide rail; a second guide slide is slidably connected inside the second guide rail; the top end face of the second guide slide is fixedly connected to a semiconductor positioning seat; a semiconductor positioning plate is arranged in the semiconductor positioning seat; the top end face of the semiconductor positioning plate is fixedly connected to multiple groups of semiconductor positioning claws in a ring array.

[0007] Furthermore, a first electric push rod is boltedly connected to the first guide slide; the end of the output shaft of the first electric push rod is fixedly connected to the first guide rail; a second electric push rod is boltedly connected to the second guide slide; the end of the output shaft of the second electric push rod is fixedly connected to the second guide rail.

[0008] Furthermore, the top surface of the lifting slide is boltedly connected to a fourth electric push rod; a control slide is slidably connected in the auxiliary connecting seat; the end of the output shaft of the fourth electric push rod is fixedly connected to the top surface of the control slide; and the bottom surface of the control slide is fixedly connected to an adhesive rack.

[0009] Furthermore, two control racks are symmetrically fixedly connected to the outside of the lifting slide; two control gears are symmetrically rotatably connected to the mounting seat; and the two control gears are aligned with the positions of the two control racks respectively.

[0010] Furthermore, the outer sides of the two control gears are coaxially fixedly connected to a rotating disk; the mounting seat is symmetrically hinged with two swinging gear racks; the outer sides of the two swinging gear racks are each provided with a guide slot; the outer sides of the two rotating disks are each fixedly connected to a fixed column; the two fixed columns are respectively slidably connected in the two swinging gear racks.

[0011] Furthermore, the rear of the two swinging gear racks are engaged with a sliding gear column; the two sliding gear columns are symmetrically slidably connected in the mounting seat; the bottom end surfaces of the two sliding gear columns are fixedly connected with a control pressure plate; the control pressure plate is slidably connected in the mounting seat.

[0012] Furthermore, a telescopic airbag is provided at the lower part of the control pressure plate; two air guide tubes are symmetrically fixedly connected to the front of the telescopic airbag; an annular air blowing rack is fixedly connected to the top surface of the semiconductor positioning seat; and the annular air blowing rack is aligned with the position of the semiconductor positioning plate.

[0013] Furthermore, auxiliary receiving grooves are provided in the plurality of groups of semiconductor positioning claws; and warning tape color blocks are fixedly connected in the plurality of groups of auxiliary receiving grooves.

[0014] Furthermore, two auxiliary limiting grooves are symmetrically opened in the semiconductor positioning plate; a fastening screw is threadedly connected in each of the two semiconductor positioning seats; the ends of the two fastening screws are fixedly connected to an auxiliary limiting column; the two auxiliary limiting columns are respectively inserted into the two auxiliary limiting grooves. Beneficial effects

[0015] The present invention drives the control rack to move during the movement of the lifting slide, and the movement of the control rack drives the control gear meshed with it to rotate, and then the telescopic airbag is squeezed back and forth through a series of transmissions, so that the telescopic airbag introduces gas into the annular blowing frame through the air guide tube, so that the annular blowing frame blows air to the semiconductor positioning plate, removes residual pollutants in the positioning area, and prevents impurities from affecting the positioning accuracy and the yield of subsequent photolithography processes. At the same time, it can take away volatile gases in the positioning area, and prevent pollutants from accumulating between the mask sheet and the wafer, thereby ensuring the uniformity of exposure energy and the controllability of chemical reactions during the photolithography process, and effectively improving the practicality of the semiconductor wafer positioning device.

[0016] As the semiconductor positioning claws wear, the warning tape color block will slowly be exposed. When the warning tape color block is exposed, the exposed color of the warning tape color block can alert the staff that the semiconductor positioning claws are severely worn, reminding the staff to replace the semiconductor positioning claws in time to avoid wafer positioning deviation due to excessive wear, prevent batch product defects, maintain the consistency of the positioning device, ensure the quality stability of batch-produced products, and effectively improve the applicability of the semiconductor wafer positioning device.

[0017] When replacing the semiconductor positioning claws, it is only necessary to rotate the fastening screw. As the fastening screw rotates, the auxiliary limiting column will be driven to move. As the auxiliary limiting column moves, it will be disengaged from the auxiliary limiting groove, releasing the limitation on the semiconductor positioning plate. Only then can the semiconductor positioning plate be removed for replacement. This can facilitate the replacement of semiconductor positioning plates with severely worn semiconductor positioning claws, and can also facilitate the staff to select semiconductor positioning plates with different semiconductor positioning claws according to the size of the semiconductor wafer. The operation is simple and quick, which effectively improves the convenience of the semiconductor wafer positioning device and is more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments are briefly introduced below.

[0019] The drawings described below only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0020] In the attached figure: Figure 1 It is an axonometric structural diagram of the present invention.

[0021] Figure 2 It is a schematic diagram of the axonometric structure of the first guide slide of the present invention.

[0022] Figure 3 It is a schematic cross-sectional structural diagram of the lifting slide of the present invention.

[0023] Figure 4 It is a schematic cross-sectional structural diagram of the mounting seat of the present invention.

[0024] Figure 5 It is a schematic diagram of the axonometric structure of the mounting seat of the present invention in cross-section.

[0025] Figure 6 It is a schematic diagram of the axonometric structure of the telescopic airbag of the present invention.

[0026] Figure 7 This invention Figure 6 A is an enlarged structural diagram of FIG.

[0027] Figure 8 It is a schematic diagram of the axonometric structure of the semiconductor positioning seat of the present invention.

[0028] Figure 9 It is a schematic diagram of the axonometric structure of the semiconductor positioning plate of the present invention.

[0029] Figure 10 This invention Figure 9 Schematic diagram of the enlarged structure at point B.

[0030] Reference Signs List 1. Mounting base; 101. Fixed base; 102. First guide rail; 103. First guide slide; 104. First electric push rod; 105. Second guide rail; 106. Second guide slide; 107. Second electric push rod; 108. Semiconductor positioning base; 109. Lifting slide; 110. Third electric push rod; 111. Fourth electric push rod; 112. Auxiliary connecting base; 113. Control slide; 114. Pasting rack; 115. Semiconductor positioning Plate; 116, fastening screw; 117, auxiliary limiting column; 118, semiconductor positioning claw; 119, auxiliary limiting groove; 120, auxiliary receiving groove; 121, warning tape color block; 122, control gear; 123, control rack; 124, annular blowing rack; 125, rotating disk; 126, fixed column; 127, swinging gear rack; 128, guide slide; 129, sliding gear column; 130, control pressure plate; 131, telescopic airbag; 132, air guide tube. DETAILED DESCRIPTION Example 1

[0031] The present invention provides an adjustable semiconductor wafer positioning device, please refer to Figures 1 to 10 As shown, it includes: a mounting seat 1; The front end face of the mounting seat 1 is fixedly connected to a fixed base 101; a lifting slide 109 is slidably connected inside the mounting seat 1; multiple groups of third electric push rods 110 are fastened with bolts inside the mounting seat 1; the ends of the output shafts of multiple groups of third electric push rods 110 are all connected to the bottom end face of the lifting slide 109; the upper part of the lifting slide 109 is fixedly connected to an auxiliary connecting seat 112; the top end face of the fixed base 101 is fixedly connected to a first guide rail 102; a first guide slide 103 is slidably connected inside the first guide rail 102; the top end face of the first guide slide 103 is fixedly connected to a second guide rail 105; a second guide slide 106 is slidably connected inside the second guide rail 105; the top end face of the second guide slide 106 is fixedly connected to a semiconductor positioning seat 108; a semiconductor positioning plate 115 is provided in the semiconductor positioning seat 108; the top end face of the semiconductor positioning plate 115 is fixedly connected to multiple groups of semiconductor positioning claws 118 in a circular array.

[0032] Among them, a first electric push rod 104 is boltedly connected to the first guide slide 103; the end of the output shaft of the first electric push rod 104 is fixedly connected to the first guide rail 102; a second electric push rod 107 is boltedly connected to the second guide slide 106; the end of the output shaft of the second electric push rod 107 is fixedly connected to the second guide rail 105.

[0033] Among them, the top surface of the lifting slide 109 is boltedly connected to a fourth electric push rod 111; a control slide 113 is slidably connected in the auxiliary connecting seat 112; the end of the output shaft of the fourth electric push rod 111 is fixedly connected to the top surface of the control slide 113; and the bottom surface of the control slide 113 is fixedly connected to a bonding rack 114.

[0034] Among them, two control racks 123 are symmetrically fixedly connected to the outside of the lifting slide 109; two control gears 122 are symmetrically rotatably connected to the mounting base 1; and the two control gears 122 are aligned with the positions of the two control racks 123 respectively.

[0035] Among them, the outer sides of the two control gears 122 are coaxially fixedly connected to a rotating disk 125; the mounting base 1 is symmetrically hinged with two swinging gear racks 127; the outside of the two swinging gear racks 127 is provided with a guide slot 128; the outside of the two rotating disks 125 are fixedly connected to a fixed column 126; the two fixed columns 126 are respectively slidably connected in the two swinging gear racks 127.

[0036] Among them, the rear part of each of the two swinging gear racks 127 is engaged with a sliding gear column 129; the two sliding gear columns 129 are symmetrically slidably connected in the mounting base 1; the bottom end surfaces of the two sliding gear columns 129 are fixedly connected with a control pressure plate 130; the control pressure plate 130 is slidably connected in the mounting base 1.

[0037] Among them, a telescopic airbag 131 is provided at the lower part of the control pressure plate 130; two air guide tubes 132 are symmetrically fixedly connected to the front of the telescopic airbag 131; the top surface of the semiconductor positioning seat 108 is fixedly connected to an annular blowing rack 124; the annular blowing rack 124 is aligned with the position of the semiconductor positioning plate 115.

[0038] Auxiliary receiving slots 120 are defined in each of the plurality of semiconductor positioning claws 118 ; and warning tape color blocks 121 are fixedly connected in each of the plurality of auxiliary receiving slots 120 .

[0039] The specific usage and function of this embodiment: In the present invention, the semiconductor wafer is placed on the semiconductor positioning plate 115 through the semiconductor positioning claw 118, and then the mask sheet is placed on the bottom of the pasting rack 114. Then, the first electric push rod 104 and the second electric push rod 107 are activated by the controller to make the first guide slide 103 and the second guide slide 106 slide in the first guide rail 102 and the second guide rail 105 respectively, so as to realize the X-axis and Y-axis movement of the semiconductor positioning seat 108, so that the position of the semiconductor positioning plate 115 and the mask sheet are aligned, and then the third electric push rod 110 is activated to lift The lowering slide 109 moves, so that the pasting rack 114 drives the mask piece to fit the semiconductor wafer. In the process of fitting the mask piece to the semiconductor wafer, the fourth electric push rod 111 is started to drive the control slide 113 to slide in the auxiliary connecting seat 112. As the control slide 113 slides, the pasting rack 114 is driven to move, so that the mask piece can better fit the semiconductor wafer. In the process of moving the lifting slide 109, the control rack 123 is driven to move, and as the control rack 123 moves, the control gear 122 meshing with it is driven to rotate. As the control gear 122 rotates, the rotating disk 125 is driven to rotate. As the rotating disk 125 rotates, the fixed column 126 is driven to slide in the guide slot 128. As the fixed column 126 slides, the swinging gear rack 127 is driven to swing back and forth. As the swinging gear rack 127 swings back and forth, the sliding gear column 129 is driven to slide back and forth. As the sliding gear column 129 slides back and forth, the control pressure plate 130 is driven to slide back and forth in the mounting seat 1. During the reciprocating sliding of the control pressure plate 130, the telescopic airbag 131 is reciprocally squeezed, so that the telescopic airbag 131 passes through. The gas is introduced into the annular blowing rack 124 through the air duct 132, so that the annular blowing rack 124 blows air to the semiconductor positioning plate 115 to remove residual pollutants in the positioning area. During the placement of the semiconductor wafer, friction will be generated with the semiconductor positioning claws 118, resulting in wear. As the semiconductor positioning claws 118 wear, the warning tape color block 121 will slowly be exposed. When the warning tape color block 121 is exposed, the color of the exposed warning tape color block 121 can warn the staff that the wear of the semiconductor positioning claws 118 is serious, reminding the staff to replace the semiconductor positioning claws 118 in time. Example 2

[0040] Based on Example 1, please refer to Figure 1 and Figure 8As shown, it includes: a fastening screw 116, an auxiliary limiting column 117 and an auxiliary limiting groove 119. Two auxiliary limiting grooves 119 are symmetrically opened in the semiconductor positioning plate 115; a fastening screw 116 is threadedly connected in each of the two semiconductor positioning seats 108; the ends of the two fastening screws 116 are fixedly connected to an auxiliary limiting column 117; the two auxiliary limiting columns 117 are respectively inserted into the two auxiliary limiting grooves 119.

[0041] Specific usage and function of this embodiment: In the present invention, when replacing the semiconductor positioning claw 118, it is only necessary to rotate the fastening screw 116. As the fastening screw 116 rotates, the auxiliary limiting column 117 will be driven to move. As the auxiliary limiting column 117 moves, it will be disengaged from the auxiliary limiting groove 119, releasing the limitation on the semiconductor positioning plate 115. Only then can the semiconductor positioning plate 115 be removed and replaced, which can facilitate the replacement of the semiconductor positioning plate 115 whose semiconductor positioning claw 118 is severely worn, and also facilitate the staff to select the semiconductor positioning plate 115 with different semiconductor positioning claws 118 according to the size of the semiconductor wafer.

[0042] In this article, there are several points to note: 1. The drawings of this embodiment only involve the structures related to this embodiment. Other structures can refer to the general design.

[0043] 2. In the absence of conflict, the features of this embodiment and the embodiments can be combined with each other to obtain new embodiments.

[0044] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An adjustable semiconductor wafer positioning device, comprising: The mounting seat (1); the front end surface of the mounting seat (1) is fixedly connected to a fixed base (101); the mounting seat (1) is characterized in that a lifting slide (109) is slidably connected inside the mounting seat (1); multiple groups of third electric push rods (110) are fastened with bolts inside the mounting seat (1); the ends of the output shafts of the multiple groups of the third electric push rods (110) are connected to the bottom end surface of the lifting slide (109); the upper part of the lifting slide (109) is fixedly connected to an auxiliary connecting seat (112); the top surface of the fixed base (101) is fixedly connected to a first guide rail (102); the third A first guide slide (103) is slidably connected in a guide rail (102); a second guide rail (105) is fixedly connected to the top surface of the first guide slide (103); a second guide rail (106) is slidably connected in the second guide rail (105); a semiconductor positioning seat (108) is fixedly connected to the top surface of the second guide slide (106); a semiconductor positioning plate (115) is provided in the semiconductor positioning seat (108); a plurality of semiconductor positioning claws (118) are fixedly connected to the top surface of the semiconductor positioning plate (115) in a circular array.

2. The adjustable semiconductor wafer positioning device according to claim 1, wherein: A first electric push rod (104) is fastened with bolts in the first guide slide (103); the end of the output shaft of the first electric push rod (104) is fixedly connected in the first guide rail (102); a second electric push rod (107) is fastened with bolts in the second guide slide (106); the end of the output shaft of the second electric push rod (107) is fixedly connected in the second guide rail (105).

3. The adjustable semiconductor wafer positioning device according to claim 1, wherein: The top end surface of the lifting slide (109) is bolt-fastened with a fourth electric push rod (111); a control slide (113) is slidably connected in the auxiliary connecting seat (112); the end of the output shaft of the fourth electric push rod (111) is fixedly connected to the top end surface of the control slide (113); and the bottom end surface of the control slide (113) is fixedly connected to an adhesive frame (114).

4. The adjustable semiconductor wafer positioning device according to claim 1, wherein: The lifting slide (109) is symmetrically fixedly connected to two control racks (123) on the outside; the mounting seat (1) is symmetrically rotatably connected to two control gears (122); the two control gears (122) are respectively aligned with the positions of the two control racks (123).

5. The adjustable semiconductor wafer positioning device according to claim 4, characterized in that: The outer sides of the two control gears (122) are coaxially fixedly connected to a rotating disk (125); the mounting seat (1) is symmetrically hinged with two swinging gear racks (127); the outer sides of the two swinging gear racks (127) are each provided with a guide slot (128); the outer sides of the two rotating disks (125) are each fixedly connected to a fixing column (126); the two fixing columns (126) are respectively slidably connected to the two swinging gear racks (127).

6. The adjustable semiconductor wafer positioning device according to claim 5, characterized in that: The rear portions of the two swinging gear racks (127) are both engaged with a sliding tooth column (129); the two sliding tooth columns (129) are symmetrically slidably connected in the mounting seat (1); the bottom end surfaces of the two sliding tooth columns (129) are fixedly connected with a control pressure plate (130); the control pressure plate (130) is slidably connected in the mounting seat (1).

7. The adjustable semiconductor wafer positioning device according to claim 6, wherein: A telescopic airbag (131) is provided at the lower portion of the control pressure plate (130); two air guide tubes (132) are symmetrically fixedly connected to the front portion of the telescopic airbag (131); an annular air blowing frame (124) is fixedly connected to the top surface of the semiconductor positioning seat (108); and the annular air blowing frame (124) is aligned with the semiconductor positioning plate (115).

8. The adjustable semiconductor wafer positioning device according to claim 1, wherein: Auxiliary accommodating grooves (120) are provided in the plurality of groups of semiconductor positioning claws (118); and warning tape color blocks (121) are fixedly connected in the plurality of groups of auxiliary accommodating grooves (120).

9. The adjustable semiconductor wafer positioning device according to claim 1, wherein: Two auxiliary limiting grooves (119) are symmetrically provided in the semiconductor positioning plate (115); a fastening screw (116) is threadedly connected in each of the two semiconductor positioning seats (108); the ends of the two fastening screws (116) are fixedly connected to an auxiliary limiting column (117); and the two auxiliary limiting columns (117) are respectively inserted into the two auxiliary limiting grooves (119).

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