Correcting device for semiconductor device processing

Abstract

A correction device for semiconductor device processing belongs to the technical field of semiconductor device processing, and aims to solve the problems that during correction in the wafer conveying process, wafers are easily scratched and damaged by pressing due to physical contact, ultra-thin and fragile wafers are seriously threatened, and height change is caused by vibration or thermal expansion and cold contraction of a conveying surface during conveying, so that the conveying efficiency is low. In order to solve the problem that the stable position of a wafer is difficult to accurately capture due to the fact that the stable position of the wafer may be affected when the wafer is subjected to pressure difference, the invention comprises a working frame and a positioning mechanism, and the positioning mechanism used for flexible transfer is arranged in the middle of the upper part of the working frame. And meanwhile, the suction force of the diaphragm which generates suction force due to pressure difference to the wafer during positioning is relatively soft, so that the wafer can be prevented from being scratched and damaged by pressing due to physical contact caused by mechanical clamping and vacuum adsorption, slight leveling correction can be carried out, and the stability of wafer conveying and processing and the accuracy of identification are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device processing, in particular to a correction device for semiconductor device processing. Background Art

[0002] Semiconductors are electronic materials with conductivity properties intermediate between conductors and insulators. They play a crucial role in electronics and circuit design. Semiconductor processing calibration equipment is a device used during semiconductor manufacturing to calibrate and adjust the performance and characteristics of semiconductor devices. Furthermore, during the processing of wafer-based semiconductor devices, calibration during transport is crucial to ensure the proper positioning and angle of the wafers. This is crucial for ensuring semiconductor product quality, production efficiency, and equipment stability.

[0003] When using the current correction device for semiconductor device processing, when correcting the wafer-type semiconductors during transportation, the existing contact methods such as mechanical clamping and vacuum adsorption with sealed contact are prone to scratching and damaging the wafers due to physical contact, which is especially threatening to ultra-thin and fragile wafers. At the same time, when the conveying platform is working, due to vibration or thermal expansion and contraction of the conveying surface, the height changes up and down, which may affect the position stability of the wafer, making it difficult to accurately capture its stable position for correction, which will have an adverse effect on subsequent wafer positioning, transfer and processing.

[0004] In view of the above problems, a correction device for semiconductor device processing is proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a correction device for semiconductor device processing. By using this device, the problem that during correction during wafer transportation in the above background, the wafer is easily scratched or damaged due to physical contact, which poses a great threat to ultra-thin and fragile wafers, and the height changes during transportation due to vibration or thermal expansion and contraction of the transportation surface may affect the position stability of the wafer, making it difficult to accurately capture its stable position during correction is solved.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: a correction device for semiconductor device processing, comprising a workbench and a positioning mechanism, wherein the positioning mechanism for flexible transfer is arranged in the upper middle portion of the workbench, the positioning mechanism comprising a receiving plate, a ventilation plate, a first air inlet, a first exhaust pipe, a second air inlet, a second exhaust pipe, a positioning branch pipe, a diameter-reducing convex ring and a diaphragm, a plurality of ventilation plates are installed in the middle portion of the surface of the receiving plate, and one end of the leftmost and rightmost ventilation plates is respectively connected to the first air inlet, the other ends of the leftmost and rightmost ventilation plates are respectively connected to the first exhaust pipe, two groups of second air inlets are arranged on one side of the first air inlet, the two groups of second air inlets are connected to the two middle groups of ventilation plates, and the output ends of the two middle groups of ventilation plates are respectively connected to the second exhaust pipe, the positioning branch pipe is connected above the surface of the ventilation plate, and the diameter-reducing convex ring is arranged inside the ventilation plate, and a diaphragm is arranged in the middle portion of the upper surface of the positioning branch pipe; An air distribution pipe is connected above the tail of the output end of the first exhaust pipe, and an air distribution pipe is connected above the air distribution pipe. A first ventilation valve is installed below the middle of the first exhaust pipe, and an air bag is provided above the front end of the first ventilation valve. A first exhaust valve is installed below one side of the air bag, and an intermediate support plate is provided at the bottom of the air bag.

[0007] Furthermore, the working frame includes a chain belt, a mounting frame and a monitoring head. A mounting frame is provided above one side of the chain belt, and a monitoring head is installed in the upper middle part of the mounting frame. Two groups of the mounting frame and the monitoring head are provided with respect to the working frame.

[0008] Furthermore, there are four groups of ventilation plates equidistantly arranged from left to right with respect to the receiving plate, and the leftmost and rightmost groups of ventilation plates are respectively connected to the corresponding two groups of first air inlets, and the two groups of ventilation plates are also respectively connected to the two groups of first exhaust pipes at the output end, and the two middle groups of ventilation plates are respectively connected to the corresponding two groups of second air inlets and second exhaust pipes, and the ventilation plates are connected to the reducing convex ring and the positioning branch pipe.

[0009] Furthermore, two inflatable bags are sequentially arranged in the middle of each group of the first exhaust pipes, and the inflatable bags are arranged at the four lower corners inside the receiving plate, and the inflatable bags are connected to the first exhaust pipe through the first ventilation valve, and the first exhaust pipe is connected to the air distribution pipe and the air distribution pipe.

[0010] Furthermore, a movable mechanism for circulating air is provided in the middle of one side of the positioning mechanism, and the movable mechanism includes a sliding track, a movable seat, an air inlet and an air supply pipe. The movable seat is installed at the front end of the surface of the sliding track, and the air inlet is installed at the upper front end of the movable seat. The air inlet is connected to the rear of the air supply pipe.

[0011] Furthermore, an air connection mechanism for convenient connection is provided on the inner side of the front end of the moving mechanism, and the air connection mechanism includes a matching seat, an electromagnetic block, a strong magnetic block, an extension end and a sealing plate. The electromagnetic block is installed on the upper side of the inner part of the matching seat, and a strong magnetic block is provided at the front end of the electromagnetic block. The extension end is fixed on the middle part of the inner side of the matching seat, and a sealing plate is provided on the front side of the extension end.

[0012] Furthermore, the movable seat is slidably connected to the sliding track, and the air inlet and the air supply pipe are connected to the movable seat, the extension end is integrated with the air inlet, the electromagnetic block is magnetically connected to the strong magnetic block, and the strong magnetic block is arranged on the inner side of the front end of the first air inlet, and the outer surface of the sealing plate is tightly fitted with the outer surface of the first air inlet.

[0013] Furthermore, a correction mechanism for auxiliary correction is provided at the bottom of the positioning mechanism, and the correction mechanism includes a supporting base plate, a piston cylinder, a piston plate, a movable rod and a movable joint. The piston cylinders are provided on both sides of the interior of the supporting base plate, and a piston plate is installed in the middle of the inner side of the piston cylinder. Moving rods are fixed on both sides of the piston plate, and a movable joint is installed at the front end of the moving rod.

[0014] Furthermore, the correction mechanism also includes a support spring, a second vent valve, a third vent valve and a second exhaust valve. The outer surface of the moving rod is provided with a support spring, the second vent valve is installed on one side of the outside of the piston cylinder, and the third vent valve is installed on the other side of the outside of the piston cylinder. Two groups of second exhaust valves are provided in the middle of the piston cylinder.

[0015] Furthermore, the second exhaust pipe is connected to the second vent valve and the piston cylinder, and the second exhaust pipe is connected to the third vent valve and the piston cylinder. The piston plate is slidably connected to the piston cylinder, and the piston plate is elastically connected to the piston cylinder through a support spring.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention uses a positioning mechanism to quickly position the semiconductor wafer to be processed and transported on the surface of the receiving plate due to the pressure difference after it is placed, so as to ensure the stability of transportation and correction. At the same time, the diaphragm that generates suction due to the pressure difference has a relatively gentle suction force on the wafer during positioning, which can avoid scratches and pressure damage to the wafer due to physical contact caused by mechanical clamping and vacuum adsorption, as well as deformation of the wafer caused by excessive local stress due to direct vacuum adsorption. In particular, it can play a good protective role while ensuring positioning for ultra-thin and fragile wafers, and can play an effect of cleaning the surface of the receiving plate to avoid scratches on the semiconductor wafer caused by small debris particles. At the same time, the receiving plate can be slightly leveled and corrected to avoid height changes due to vibration or thermal expansion and contraction of the conveying surface during transportation, which may affect the position stability of the wafer, which is conducive to ensuring the stability of subsequent wafer transportation processing and the accuracy of identification.

[0017] 2. The present invention can realize the automatic connection and separation of the ventilation plate and the air supply through the moving mechanism and the air receiving mechanism, so that the transported receiving plate can continue to be transported downward in a circular manner using the chain belt. When the last group of receiving plates is transported and separated, the moving seat and the air receiving port move back to the initial position to prepare for the connection of the next receiving plate. In this way, the cyclic operation of the device can be guaranteed during the transportation correction. While ensuring the work efficiency, it also avoids the problem that the synchronous connection of the air intake pipe is difficult to separate, which makes the pipeline movement interfere and unable to work cyclically and efficiently.

[0018] 3. The present invention uses a correction mechanism. When a slight offset occurs during the transportation of the receiving plate above the middle support plate, the movement of the moving rods in the two sets of independently working piston cylinders can be used to correct the position of the receiving plate during the transportation process, so as to avoid the slight offset being difficult to correct and affecting the stability of transportation and subsequent processing and identification. At the same time, the correction can avoid direct action on the transported wafer, and can prevent the wafer from being damaged by external force during the correction. The movement of the moving rod in the piston cylinder relies on the exhaust gas when the wafer is positioned to provide power, which helps to avoid the trouble and cost of driving and adjusting the external power equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall external three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the receiving plate of the present invention; Figure 3 For the present invention Figure 2 Schematic diagram of the right-view stereoscopic structure; Figure 4 It is a schematic diagram of the three-dimensional structure of the ventilation plate of the present invention; Figure 5 This is a schematic diagram of the internal three-dimensional structure of the positioning branch pipe of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the inflatable bag of the present invention; Figure 7 For the present invention Figure 1 A in the middle is an enlarged schematic diagram of the three-dimensional structure; Figure 8 It is a schematic diagram of the partial three-dimensional structure of the sliding track of the present invention; Figure 9 It is a schematic diagram of the internal sectional three-dimensional structure of the mating seat of the present invention; Figure 10 This is a bottom-up schematic diagram of the three-dimensional structure of the receiving plate of the present invention; Figure 11 This is a schematic diagram of the internal sectional three-dimensional structure of the support base plate of the present invention; Figure 12This is a schematic diagram of the internal three-dimensional structure of the piston cylinder of the present invention.

[0020] In the figure: 1. Work frame; 101. Chain belt; 102. Mounting frame; 103. Monitoring head; 2. Positioning mechanism; 201. Adapter plate; 202. Ventilation plate; 203. First air inlet; 204. First exhaust pipe; 205. Second air inlet; 206. Second exhaust pipe; 207. Intermediate support plate; 208. Positioning branch pipe; 209. Variable diameter convex ring; 210. Diaphragm; 211. Air distribution pipe; 212. Air distribution pipe; 213. First ventilation valve; 214. Inflatable bag; 215. First exhaust valve; 3. Moving mechanism; 301. Sliding track; 302. Moving seat; 303. Air inlet; 304. Air supply pipe; 4. Air inlet mechanism; 401. Matching seat; 402. Electromagnetic block; 403. Strong magnetic block; 404. Extension end; 405. Sealing plate; 5. Correction mechanism; 501. Support base plate; 502. Piston cylinder; 503. Piston plate; 504. Moving rod; 505. Movable joint; 506. Support spring; 507. Second ventilation valve; 508. Third ventilation valve; 509. Second exhaust valve. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] In order to solve the problem that when calibrating wafer semiconductors during transportation, the wafers are easily scratched or crushed due to physical contact, which poses a great threat to ultra-thin and fragile wafers. At the same time, the height changes caused by vibration or thermal expansion and contraction of the transportation surface during transportation may affect the stability of the wafer position, making it difficult for the calibration to accurately capture its stable position. Figures 1-6 As shown, the following preferred technical solutions are provided: A correction device for semiconductor device processing includes a workbench 1 and a positioning mechanism 2 arranged in the upper middle part of the workbench 1. The workbench 1 includes a chain belt 101 installed at the upper end of the workbench 1, a mounting frame 102 is provided above one side of the chain belt 101, and a monitoring head 103 is installed in the upper middle part of the mounting frame 102. Two groups of mounting frames 102 and monitoring heads 103 are provided with respect to the workbench 1. The chain belt 101 is an existing chain conveying equipment. There are several monitoring heads 103, which are visual inspection equipment such as cameras based on existing technical principles. In conjunction with the control equipment based on existing principles outside the workbench 1, they can compare the preset standard positions and angles to facilitate correction processing.

[0023] The positioning mechanism 2 includes a receiving plate 201 arranged at the uppermost end of the chain belt 101, and a plurality of ventilation plates 202 are installed in the middle of the surface of the receiving plate 201, and one end of the leftmost and rightmost ventilation plates 202 are respectively connected to the first air inlet 203, and the other ends of the leftmost and rightmost ventilation plates 202 are respectively connected to the first exhaust pipe 204, and two groups of second air inlets 205 are provided on one side of the first air inlet 203, and the two groups of second air inlets 205 are connected to the two middle groups of ventilation plates 202, and the output ends of the two middle groups of ventilation plates 202 are respectively connected to the second exhaust pipe 206, a positioning branch pipe 208 is connected above the surface of the ventilation plate 202, and a reducing convex ring 209 is provided inside the ventilation plate 202, and a diaphragm 210 is provided in the middle of the upper surface of the positioning branch pipe 208.

[0024] An air distribution pipe 211 is connected to the tail end of the output end of the first exhaust pipe 204, and an air distribution pipe 212 is connected to the top of the air distribution pipe 211. A first ventilation valve 213 is installed below the middle of the first exhaust pipe 204, and an air bag 214 is provided above the front end of the first ventilation valve 213. A first exhaust valve 215 is installed below one side of the air bag 214, and an intermediate support plate 207 is provided at the bottom of the air bag 214.

[0025] There are four groups of ventilation plates 202 equidistantly arranged from left to right about the receiving plate 201, and the leftmost and rightmost groups of ventilation plates 202 are respectively connected to the corresponding two groups of first air inlets 203, and the two groups of ventilation plates 202 are also respectively connected to the two groups of first exhaust pipes 204 at the output end. The two middle groups of ventilation plates 202 are respectively connected to the corresponding two groups of second air inlets 205 and second exhaust pipes 206, and the ventilation plates 202 are connected to the reducing ring 209 and the positioning branch pipe 208.

[0026] Two inflatable bags 214 are arranged in the middle of each group of first exhaust pipes 204 in sequence, and the inflatable bags 214 are arranged at the four lower corners inside the receiving plate 201, and the inflatable bags 214 are connected to the first exhaust pipe 204 through the first ventilation valve 213, and the first exhaust pipe 204 is connected to the gas distribution pipe 211 and the gas distribution pipe 212. Through the positioning mechanism 2, the wafer semiconductor can be flexibly positioned and fine-tuned during transportation.

[0027] Four groups of ventilation plates 202 are used to independently supply air and ventilation using two first air inlets 203 and a second air inlet 205, and each group of ventilation plates 202 is provided with two. When the airflow introduced from the outside enters the ventilation plate 202 through the first air inlet 203 and the second air inlet 205 and circulates, and is finally discharged from the first exhaust pipe 204 and the second exhaust pipe 206, the airflow will form a one-way circulation effect in the ventilation plate 202, with air entering on one side and exiting on the other side. When the airflow flows through the variable diameter convex ring 209 in the ventilation plate 202, it will have a certain acceleration effect on the airflow. At this time, the accelerated airflow will reduce the pressure in the ventilation plate 202 according to the Bernoulli principle, and increase the pressure on the upper end surface of the positioning branch pipe 208. At this time, a deformable diaphragm 210 made of plastic material with a slightly sunken middle part is used. When the pressure on the upper end surface of the positioning branch pipe 208 increases, the diaphragm 210 will move downward and deform. , so that when the smooth surface of the semiconductor wafer to be processed and transported is placed on the receiving plate 201, that is, it is attached to the upper surface of the positioning branch 208, the smooth surface of the semiconductor wafer will be sealed at the contact point with the positioning branch 208. At this time, the downwardly deformed diaphragm 210 will generate a certain suction force on the semiconductor wafer, and there are multiple groups of positioning branch 208 and diaphragm 210 about the ventilation plate 202. Therefore, after the semiconductor wafer to be processed and transported is placed, it can be quickly positioned on the surface of the receiving plate 201 due to the pressure difference to ensure the stability of transportation and correction. At the same time, the diaphragm 210 that generates suction due to the pressure difference has a relatively gentle suction force on the wafer during positioning, which can avoid scratches and pressure damage to the wafer due to physical contact caused by mechanical clamping and vacuum adsorption, as well as deformation of the wafer caused by excessive local stress due to direct vacuum adsorption. In particular, it can ensure positioning of ultra-thin and fragile wafers while also providing good protection.

[0028] Through the air distribution pipe 211, when the air flow is finally discharged from the side below the receiving plate 201 through the first exhaust pipe 204, the air flow can be diverted so that the air flow flows into the air distribution pipe 212, and the air distribution pipe 212 is provided with an air outlet facing the surface of the receiving plate 201, so that when the diverted gas is blown out, it can play the effect of cleaning the surface of the receiving plate 201, preventing small debris particles from scratching the wafer semiconductor. Through the existing high-response electromagnetic first vent valve 213, the air flow discharged from the first exhaust pipe 204 can be controlled to pass into the inflatable bag 214 In the process, the first exhaust valve 215, which is also electromagnetic, can be used to control the inflation and deflation of the air bag 214. When the existing monitoring head 103 device detects that the wafer transported on the receiving plate 201 has height and tilt changes, the four sets of independently set air bags 214 are used to inflate and deflate the receiving plate 201, so as to perform slight leveling correction on the receiving plate 201, thereby avoiding height changes caused by vibration or thermal expansion and contraction of the transport surface during transportation, which may affect the position stability of the wafer, thereby ensuring the stability of subsequent wafer transportation processing and the accuracy of identification.

[0029] In order to solve the technical problem that the ventilation pipe is difficult to circulate synchronously during circulation and affects the use effect and work efficiency of the device, such as Figure 1 as well as Figure 7-Figure 9 As shown, the following preferred technical solutions are provided: A moving mechanism 3 is provided in the middle of one side of the positioning mechanism 2. The moving mechanism 3 includes a sliding rail 301 installed on one side above the workbench 1. A moving seat 302 is installed at the front end of the surface of the sliding rail 301, and an air inlet 303 is installed at the front end above the moving seat 302. An air supply pipe 304 is connected to the rear of the air inlet 303. The sliding rail 301 and the moving seat 302 are existing electric slide rails, which can enable the moving seat 302 to slide on the sliding rail 301 with arcs set at both ends.

[0030] An air receiving mechanism 4 is provided on the inner side of the front end of the moving mechanism 3. The air receiving mechanism 4 includes a matching seat 401 arranged outside the front end of the air receiving port 303. An electromagnetic block 402 is installed on the inner upper side of the matching seat 401, and a strong magnetic block 403 is provided at the front end of the electromagnetic block 402. An extension end 404 is fixed to the middle part of the inner side of the matching seat 401, and a sealing sheet 405 is provided on the front side of the extension end 404.

[0031] The movable seat 302 is slidably connected to the sliding rail 301, and the air inlet 303 and the air supply pipe 304 are connected to the movable seat 302, the extension end 404 is integrated with the air inlet 303, the electromagnetic block 402 is magnetically connected to the strong magnetic block 403, and the strong magnetic block 403 is arranged on the inner side of the front end of the first air inlet 203, and the outer surface of the sealing sheet 405 is tightly fitted with the outer surface of the first air inlet 203.

[0032] The movable seat 302 and the air inlet 303 are set to correspond to the number of the first air inlet 203 and the second air inlet 205, and are located on the opposite sides of the first air inlet 203 and the second air inlet 205. When the receiving plate 201 is transported from the bottom of the device to the upper end horizontally by the chain belt 101, the receiving plate 201 moves the first air inlet 203 and the second air inlet 205 to the position corresponding to the movable seat 302 and the air inlet 303. At this time, the electromagnetic block 402 in the matching seat 401 is energized, and under the adsorption of magnetic force, the air inlet 303 and the first air inlet 203 and the second air inlet 205 are adsorbed and matched together by the strong magnetic block 403. After matching, the extension end 404 and the sealing sheet 405 can be used to seal the connection between the air inlet 303 and the first air inlet 203 and the second air inlet 205. The connection of the air supply pipe 304 to the external air can realize the air supply to the ventilation plate 202. At the same time, when the receiving plate 201 receives air and moves to the other end together with the movable seat 302 to transport the wafer into place, the electromagnetic block 402 is powered off so that the air inlet 303 and the first air inlet 203 and the second air inlet 205 can be automatically separated, so that the transported receiving plate 201 can continue to be transported downward by the chain belt 101. After the last group of receiving plates 201 are transported and separated, the movable seat 302 and the air inlet 303 move in the opposite direction to the initial position, and prepare for the connection of the next receiving plate 201. In this way, the cyclic operation of the device can be guaranteed during the transport correction. While ensuring the work efficiency, it also avoids the problem that the synchronous connection of the air inlet pipe is difficult to separate, which makes the pipeline movement interfere and unable to work cyclically and efficiently.

[0033] In order to solve the technical problems that wafer deviation during transportation is difficult to be stably corrected, and that the machine needs to be constantly stopped for adjustment, which affects work efficiency, and external power adjustment is required, such as Figure 1 、 Figure 2 as well as Figure 10-12 As shown, the following preferred technical solutions are provided: A correction mechanism 5 is provided at the bottom of the positioning mechanism 2, and the correction mechanism 5 includes a supporting base plate 501, and piston cylinders 502 are provided on both sides of the inner part of the supporting base plate 501, and a piston plate 503 is installed in the middle of the inner side of the piston cylinder 502, and moving rods 504 are fixed on both sides of the piston plate 503, and a movable joint 505 is installed at the front end of the moving rod 504.

[0034] A support spring 506 is provided on the outer surface of the moving rod 504, a second ventilation valve 507 is installed on one side of the outside of the piston cylinder 502, and a third ventilation valve 508 is installed on the other side of the outside of the piston cylinder 502, and two sets of second exhaust valves 509 are provided in the middle of the piston cylinder 502.

[0035] The second exhaust pipe 206 is connected to the second ventilation valve 507 and the piston cylinder 502, and the second exhaust pipe 206 is connected to the third ventilation valve 508 and the piston cylinder 502. The piston plate 503 is slidingly connected to the piston cylinder 502, and the piston plate 503 is elastically connected to the piston cylinder 502 through the support spring 506.

[0036] By means of the existing high-response electromagnetic second vent valve 507 and the third vent valve 508, the air flow out of the second exhaust pipe 206 can be circulated. When the second vent valve 507 is opened and the third vent valve 508 is closed, the right side of the interior of the piston cylinder 502 is ventilated, and the pressure of the intake air is greater than the elastic force of the support spring 506. At this time, the air pressure causes the piston plate 503 and the support spring 506 to move to the left, thereby causing the moving rod 504 to move to the left. Conversely, when the second vent valve 507 is closed and the third vent valve 508 is opened, the moving rod 504 will eventually move to the right. At the same time, the left and right groups of second exhaust valves 509 are used to exhaust air, and the support spring 506 is reset to return the piston plate 503 and the moving rod 504 to the middle balanced position. The support base plate 501 and the middle support plate 207 can slide, and the support base plate 501 is fixedly connected to the chain belt 101, and The moving rod 504 is rotatably connected to the middle support plate 207 by a movable joint 505, so that when the moving rod 504 moves left and right, it can push the upper middle support plate 207 and the supporting base plate 501 to move left and right, so as to cooperate with the existing detection. When the receiving plate 201 above the middle support plate 207 is slightly offset during transportation, the movement of the moving rod 504 in the two sets of independently working piston cylinders 502 can be used to correct the position of the receiving plate 201 during transportation, so as to avoid the slight offset being difficult to correct and affecting the transportation and subsequent processing and identification stability. At the same time, the correction can avoid direct action on the transported wafer, and can prevent the wafer from being damaged by external force during correction. The movement of the moving rod 504 in the piston cylinder 502 relies on the exhaust when the wafer is positioned to provide power, which helps to avoid the trouble and cost of external power equipment drive adjustment.

[0037] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include," "comprise," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed.

[0038] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A correction device for semiconductor device processing, comprising a workbench (1) and a positioning mechanism (2), characterized in that: The positioning mechanism (2) for flexible transfer is arranged in the upper middle part of the work frame (1), and the positioning mechanism (2) includes a receiving plate (201), a ventilation plate (202), a first air inlet (203), a first exhaust pipe (204), a second air inlet (205), a second exhaust pipe (206), a positioning branch pipe (208), a diameter-reducing convex ring (209) and a diaphragm (210). A plurality of ventilation plates (202) are installed in the middle of the surface of the receiving plate (201), and one end of the leftmost and rightmost ventilation plates (202) are respectively connected to the first air inlet (203). The other ends of the side vent plates (202) are respectively connected to first exhaust pipes (204); two groups of second air inlets (205) are provided on one side of the first air inlet (203); the two groups of second air inlets (205) are connected to the two middle groups of vent plates (202); and the output ends of the two middle groups of vent plates (202) are respectively connected to second exhaust pipes (206); a positioning branch pipe (208) is connected above the surface of the vent plates (202); a reducing convex ring (209) is provided inside the vent plates (202); and a diaphragm (210) is provided in the middle of the upper surface of the positioning branch pipe (208); An air distribution pipe (211) is connected above the tail end of the output end of the first exhaust pipe (204), and an air distribution pipe (212) is connected above the air distribution pipe (211). A first ventilation valve (213) is installed below the middle portion of the first exhaust pipe (204), and an air bag (214) is provided above the front end of the first ventilation valve (213). A first exhaust valve (215) is installed below one side of the air bag (214), and an intermediate support plate (207) is provided at the bottom of the air bag (214).

2. A semiconductor device processing calibration device according to claim 1, characterized in that: The working frame (1) comprises a chain belt (101), a mounting frame (102) and a monitoring head (103); the mounting frame (102) is arranged above one side of the chain belt (101), and the monitoring head (103) is installed in the middle of the upper part of the mounting frame (102); the mounting frame (102) and the monitoring head (103) are arranged in two groups with respect to the working frame (1).

3. The semiconductor device processing calibration device according to claim 1, wherein: Four groups of the ventilation plates (202) are equidistantly arranged from left to right with respect to the receiving plate (201), and the two groups of ventilation plates (202) on the leftmost and rightmost sides are respectively connected to the two corresponding groups of first air inlets (203), and the two groups of ventilation plates (202) are also respectively connected to the two groups of first exhaust pipes (204) at the output end, the two middle groups of ventilation plates (202) are respectively connected to the two corresponding groups of second air inlets (205) and the second exhaust pipe (206), and the ventilation plates (202) are connected to the variable diameter convex ring (209) and the positioning branch pipe (208).

4. The semiconductor device processing calibration device according to claim 1, wherein: Two inflatable bags (214) are sequentially arranged in the middle of each group of the first exhaust pipes (204), and the inflatable bags (214) are arranged at the four lower corners inside the receiving plate (201). The inflatable bags (214) are connected to the first exhaust pipes (204) through the first ventilation valves (213), and the first exhaust pipes (204) are connected to the gas distribution pipes (211) and the gas distribution pipes (212).

5. The semiconductor device processing calibration device according to claim 1, wherein: A moving mechanism (3) for circulated air connection is provided in the middle of one side of the positioning mechanism (2), the moving mechanism (3) comprising a sliding track (301), a moving seat (302), an air connection port (303) and an air supply pipe (304), the moving seat (302) being installed at the front end of the surface of the sliding track (301), the air connection port (303) being installed at the front end above the moving seat (302), and the air connection port (304) being connected to the rear of the air connection port (303).

6. The semiconductor device processing calibration device according to claim 5, characterized in that: An air connection mechanism (4) for convenient connection is provided on the inner side of the front end of the moving mechanism (3), and the air connection mechanism (4) comprises a mating seat (401), an electromagnetic block (402), a strong magnetic block (403), an extension end (404) and a sealing sheet (405). The electromagnetic block (402) is installed on the upper side of the interior of the mating seat (401), and the strong magnetic block (403) is provided at the front end of the electromagnetic block (402). The extension end (404) is fixed to the middle part of the inner side of the mating seat (401), and the sealing sheet (405) is provided on the front side of the extension end (404).

7. The semiconductor device processing calibration device according to claim 6, characterized in that: The movable seat (302) is slidably connected to the sliding track (301), and the air inlet (303) and the air supply pipe (304) are connected to the movable seat (302). The extension end (404) is integrated with the air inlet (303). The electromagnetic block (402) is magnetically connected to the strong magnetic block (403), and the strong magnetic block (403) is arranged on the inner side of the front end of the first air inlet (203). The outer surface of the sealing sheet (405) is tightly fitted with the outer surface of the first air inlet (203).

8. The semiconductor device processing calibration device according to claim 1, wherein: A correction mechanism (5) for assisting correction is provided at the bottom of the positioning mechanism (2). The correction mechanism (5) comprises a supporting base plate (501), a piston cylinder (502), a piston plate (503), a moving rod (504) and a movable joint (505). The piston cylinder (502) is provided on both sides of the interior of the supporting base plate (501), and the piston plate (503) is installed in the middle of the inner side of the piston cylinder (502). The moving rod (504) is fixed on both sides of the piston plate (503), and the movable joint (505) is installed at the front end of the moving rod (504).

9. The semiconductor device processing calibration device according to claim 8, wherein: The correction mechanism (5) further includes a support spring (506), a second vent valve (507), a third vent valve (508) and a second exhaust valve (509), wherein the outer surface of the movable rod (504) is provided with a support spring (506), the second vent valve (507) is installed on one side of the outside of the piston cylinder (502), and the third vent valve (508) is installed on the other side of the outside of the piston cylinder (502), and two groups of second exhaust valves (509) are provided in the middle of the piston cylinder (502).

10. The semiconductor device processing calibration device according to claim 9, wherein: The second exhaust pipe (206) is connected to the second vent valve (507) and the piston cylinder (502), and the second exhaust pipe (206) is connected to the third vent valve (508) and the piston cylinder (502). The piston plate (503) is slidably connected to the piston cylinder (502), and the piston plate (503) is elastically connected to the piston cylinder (502) via a support spring (506).

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