High-speed VCSEL (Vertical Cavity Surface Emitting Laser) semiconductor X chip device for multi-cavity partition packaging and packaging method

Abstract

The invention relates to the technical field of chip packaging, in particular to a high-speed VCSEL semiconductor X chip device for multi-cavity partition packaging and a packaging method, and the device comprises a workbench, a partition structure, an inverted structure, an ejection structure, a feeding structure, a pickup structure, an overturning structure, a box shell, a partition plate, a substrate and a chip body. The separation structure carries out processes such as chip feeding and substrate feeding in different areas, interference is reduced, precision is improved, and meanwhile parallel operation is supported to improve efficiency. The upside-down mounting structure realizes feeding and fixing of the substrate, the substrate is automatically released from pressing after leaving the upside-down mounting cavity, and the visual camera is combined to ensure accurate upside-down mounting; the ejection structure automatically ejects the substrate when the substrate is moved to the blanking cavity, so that the taking-out difficulty is reduced; the feeding structure stably fixes the blue film through a fixing jig, so that rapid model changing is facilitated, and the chip picking stability is improved; the pick-up structure is matched with the turnover structure, chips can be picked up in batches, turnover is completed, and follow-up flip-chip mounting is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a high-speed VCSEL semiconductor X-chip device with multi-cavity partition packaging and a packaging method. Background Art

[0002] In the field of semiconductor packaging, high-speed vertical-cavity surface-emitting laser (VCSEL) chips have key applications in cutting-edge fields such as optical communications, 3D sensing, and lidar. The packaging process places extremely high demands on accuracy, efficiency, and reliability. VCSEL chip packaging usually involves multiple steps, and chip flipping is an indispensable step.

[0003] However, in traditional chip packaging operations, chip loading, flipping, and flipping are performed sequentially in the same space, which is susceptible to mechanical vibration, temperature fluctuations, and environmental pollutants, resulting in reduced chip packaging quality.

[0004] The single-chamber process requires all operations to be completed sequentially, resulting in a long single-chip packaging cycle and being unable to meet the needs of large-scale mass production of VCSEL chips. This is especially true when changing models across multiple products, as equipment downtime for adjustments accounts for a high proportion.

[0005] After the substrate is flipped, demoulding requires manual assisted ejection, which is inefficient and prone to human damage. The demoulding of the substrate is difficult, affecting the demoulding efficiency. At the same time, when replacing the blue film and its fixing fixture, the limit of the fixing fixture needs to be released first. The fixing fixture is mostly fixed to the carrier with screws, and the replacement efficiency is low. Summary of the Invention

[0006] In view of the problems in the prior art, the present invention provides a high-speed VCSEL semiconductor X-chip device and a packaging method for multi-chamber partitioned packaging.

[0007] The technical solution adopted by the present invention to solve the technical problem is: a high-speed VCSEL semiconductor X-chip device with multi-chamber partition packaging, comprising a workbench, a partition structure provided on the workbench, a flip-chip structure provided on the workbench, an ejection structure provided on the flip-chip structure, a loading structure provided on the workbench, a substrate provided on the flip-chip structure, a pickup structure provided on the workbench, a flip structure provided on the pickup structure, a fixing fixture provided on the loading structure, a blue film, and a chip body;

[0008] The compartment structure includes an inverted loading chamber, a material unloading chamber, a material loading chamber, a turnover chamber and a working chamber. The workbench is fixedly connected to a box shell and a partition. The space above the workbench is divided into an inverted loading chamber, a material unloading chamber, a material loading chamber, a turnover chamber and a working chamber by the box shell and the partition.

[0009] The inverted structure includes a first linear motor and a first slide slidably connected to the first linear motor. Two first linear motors are fixedly connected to the workbench. The two parallel first linear motors pass through the flipping cavity, the inverted cavity and the unloading cavity. The first slide is fixedly connected to the first carrier, and a substrate is fixedly connected inside the first carrier.

[0010] Specifically, a robotic arm is installed on the workbench surface inside the working chamber, and the output end of the robotic arm is fixedly connected to the first vacuum nozzle and the first visual camera. A fixed plate is fixedly connected to the workbench surface inside the working chamber, and the top of the fixed plate is tilted. The top of the fixed plate is fixedly connected to the second visual camera, and the second visual camera points to the inside of the flip-chip cavity. Four positioning columns are fixedly connected to the first carrier, and four positioning holes are provided on the substrate, and the positioning columns are plugged into the positioning holes.

[0011] Specifically, four L-shaped fixing bars are fixedly connected to the table surface of the workbench inside the inverted cavity, and two opposite fixing bars form a group. A sliding bar with an L-shaped cross-section is slidably connected to the fixing bar, and a pressure wheel is rotatably connected to the bottom end of the sliding bar. The pressure wheel contacts the substrate, and a guide rod is fixedly connected to the fixing bar. The sliding bar is slidably connected to the guide rod, and a tension spring is fixedly connected between the sliding bar and the fixing bar. Chamfers are set at the edges on both sides of the first carrier.

[0012] Specifically, the ejection structure includes a rotating shaft and a first gear. Each of the first carriers is fixedly connected to two rotating shafts, and the rotating shaft is rotatably connected to the first gear. The first rack and the second rack are respectively engaged on both sides of the first gear. The first rack and the second rack are both slidably connected to the first carrier. A lifting bar is fixedly connected to the first rack, and two ejection rods are fixedly connected to the lifting bar. The ejection rods are slidably connected to the first carrier, and the ejection rods are in contact with the bottom end of the substrate.

[0013] Specifically, the cross-section of the second rack is an L-shaped structure, a first spring is fixedly connected between the second rack and the first carrier, a connecting bar is fixedly connected to the second rack, the connecting bar is slidably connected to the first carrier, the bottom end of the connecting bar is rotatably connected to a resistance wheel, four pads are fixedly connected to the workbench, and the pads with an isosceles trapezoidal cross-section pass through the flipping cavity, the inverted cavity and the unloading cavity.

[0014] Specifically, the loading structure includes a second linear motor and a second slide slidably connected to the second linear motor, the second slide is fixedly connected to a second carrier, a fixing jig is placed on the second carrier, a blue film is provided on the fixing jig, and a plurality of chip bodies are distributed in a rectangular array on the blue film, two clamps with L-shaped cross-sections are symmetrically slidably connected to the second carrier, the clamps press the fixing jig, two fixed blocks are fixedly connected to the bottom end of the second carrier, a fixed rod is fixedly connected to the fixed block, the fixed rod is slidably connected to the clamp, a second spring is provided on the outer sleeve of the fixed rod, and the two ends of the second spring are respectively fixedly connected to the clamp and the fixed block, two driving bars are fixedly connected to the table surface of the workbench inside the loading chamber, the ends of the driving bars are tilted, and a driving wheel is installed on the clamp, and the driving wheel conflicts with the driving bar.

[0015] Specifically, the picking structure includes a mounting frame and a slider, the workbench is fixedly connected to the mounting frame, the mounting frame passes through the loading chamber and the turning chamber, the mounting frame is slidably connected to two sliders, the slider is rotatably connected to a mounting shaft, a rotating frame with a U-shaped cross-section is provided between the two sliders, the mounting shaft is fixedly connected to a connecting block of a hexagonal prism, the connecting block is plugged into the rotating frame, the bottom end of the rotating frame is slidably connected to a lifting frame with a U-shaped cross-section, the bottom end of the lifting frame is fixedly connected to a vacuum box, the lifting frame is fixedly connected to a vacuum pump, the exhaust end of the vacuum pump is fixedly connected to the vacuum box through a connecting pipe, the bottom end of the vacuum box is fixedly connected to a plurality of second vacuum nozzles in a rectangular array, the rotating frame is fixedly connected to a hydraulic rod, and the telescopic end of the hydraulic rod is fixedly connected to the lifting frame.

[0016] Specifically, four guide columns are fixedly connected to the lifting frame, and the guide columns are slidably connected to the rotating frame.

[0017] Specifically, the flipping structure includes a screw and a motor, a screw is rotatably connected to the mounting frame, the screw is threadedly connected to one of the sliders, the mounting frame is fixedly connected to the motor, the output end of the motor is fixedly connected to the screw, a second gear is fixedly connected to one of the mounting shafts, a through slot is provided on the mounting frame, the mounting shaft is rollingly connected to the through slot, and a third rack is fixedly connected to the inner wall of the box shell at the flipping cavity.

[0018] A packaging method for a high-speed VCSEL semiconductor X-chip device with multi-chamber partition packaging comprises the following steps:

[0019] S1: The chip body is loaded through the loading structure, and then the chip body on the loading structure is picked up by the picking structure. This operation is performed in the loading chamber. The chip body picked up by the picking structure is then transferred to the flipping chamber by the flipping structure and flipped;

[0020] S2: The flip-chip structure loads the substrate, transfers the substrate into the flip-chip chamber, stops conveying the substrate, and then uses the flip-chip structure to transfer the flipped chip body and install it upside down on the substrate to complete the flip-chip operation of the chip body;

[0021] S3: When one substrate is undergoing a flip-chip operation, another flip-chip substrate and chip body can be unloaded. The flip-chip substrate and chip body are sent into the unloading cavity by the flip-chip structure. At this time, the ejection structure works to eject the flip-chip completed substrate, and then the substrate is transferred and processed again.

[0022] The beneficial effects of the present invention are:

[0023] (1) The present invention discloses a high-speed VCSEL semiconductor X-chip device and packaging method with multi-chamber partition packaging. A box shell and a partition are provided on the workbench, a partition structure is provided on the workbench, and a flip-chip structure is provided on the workbench. The partition structure realizes the partitioning of chip loading, substrate loading, chip picking and turning, and flip-chip operations, thereby reducing process interference, improving precision and stability, and simultaneously performing some processes in parallel to improve production efficiency. The substrate is loaded and fixed by the flip-chip structure, thereby improving the stability of the substrate during flip-chip. At the same time, the pressing and fixing of the substrate is automatically released after the substrate leaves the flip-chip cavity, thereby improving the loading and unloading efficiency of the substrate. The positions of the solder joints between the chip and the substrate are scanned by multiple visual cameras, and then the chip is picked up and flipped, thereby improving the accuracy of the chip flip-chip.

[0024] (2) The present invention discloses a high-speed VCSEL semiconductor X-chip device with multi-chamber partitioned packaging and a packaging method. The flip-chip structure is provided with an ejection structure. When the substrate moves to the unloading cavity, the ejection structure effectively ejects the flip-chip substrate, thereby reducing the difficulty of removing the substrate and improving the efficiency of unloading the substrate.

[0025] (3) The present invention discloses a high-speed VCSEL semiconductor X-chip device and packaging method with multi-chamber partition packaging. A loading structure is provided on a workbench, and the chip is loaded through the loading structure. The loading structure facilitates the fixing of a fixture for fixing the blue film, thereby improving the stability when picking up the chip and facilitating the rapid replacement of the blue film and the chip.

[0026] (4) The present invention discloses a high-speed VCSEL semiconductor X-chip device and packaging method for multi-chamber partitioned packaging. A pick-up structure is provided on the workbench, and a flip structure is provided on the pick-up structure card, which facilitates batch picking of chips through the pick-up structure, thereby improving chip picking efficiency. The flip structure transfers the chips picked up from the loading chamber to the flip chamber and flips them, which facilitates subsequent flip-chip picking and flipping of the chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below with reference to the accompanying drawings and examples.

[0028] Figure 1 A schematic diagram of the overall structure of a preferred embodiment of a multi-chamber partitioned packaged high-speed VCSEL semiconductor X-chip device provided by the present invention;

[0029] Figure 2 for Figure 1 An enlarged schematic diagram of the structure of section A is shown;

[0030] Figure 3 Schematic diagram of the connection structure between the workbench and the second linear motor of the present invention;

[0031] Figure 4 for Figure 3 An enlarged schematic diagram of the structure of part B is shown;

[0032] Figure 5 for Figure 3 The enlarged schematic diagram of the C-section structure is shown;

[0033] Figure 6 A schematic diagram of the connection structure between the box shell and the partition of the present invention;

[0034] Figure 7 for Figure 6 An enlarged schematic diagram of the D portion structure is shown;

[0035] Figure 8 for Figure 7 An enlarged schematic diagram of the E-section structure is shown;

[0036] Figure 9 Schematic diagram of the connection structure between the workbench and the first linear motor of the present invention;

[0037] Figure 10 for Figure 9 The enlarged schematic diagram of the F part structure is shown;

[0038] Figure 11 for Figure 10 The enlarged schematic diagram of the G-section structure is shown;

[0039] Figure 12 Schematic diagram of the connection structure between the slide and the second linear motor of the present invention;

[0040] Figure 13 for Figure 12 The enlarged schematic diagram of the H part structure is shown;

[0041] Figure 14 Schematic diagram of the connection structure between the first carrier and the substrate of the present invention;

[0042] Figure 15 for Figure 14 An enlarged schematic diagram of the structure of part I is shown.

[0043] 1. Workbench; 2. Partition structure; 201. Inverted cavity; 202. Unloading cavity; 203. Loading cavity; 204. Turning cavity; 205. Working cavity; 3. Inverted structure; 301. First linear motor; 302. First slide; 303. First carrier; 304. Positioning column; 305. Positioning hole; 306. Fixing bar; 307. Slide; 308. Pressure wheel; 309. Guide rod; 310. Tension spring; 311. Robot arm; 312. First vacuum nozzle; 313. First vision camera; 314. Fixing plate; 315. Second vision camera; 4. Ejector structure; 401. Rotating shaft; 402. First gear; 403. First rack; 404. Lifting bar; 405. Ejector rod; 406. Second rack; 407. First spring; 408. Connecting bar; 409. Contact wheel; 4 10. Pad; 5. Loading structure; 501. Second linear motor; 502. Second slide; 503. Second carrier; 504. Clamp; 505. Driving wheel; 506. Driving bar; 507. Fixed block; 508. Fixed rod; 509. Second spring; 6. Picking structure; 601. Mounting frame; 602. Slider; 603. Mounting shaft; 604. Connecting block; 605. Rotating frame; 606. Lifting frame; 607. Guide column; 608. Vacuum box; 609. Vacuum pump; 610. Connecting pipe; 611. Hydraulic rod; 612. Second vacuum nozzle; 7. Flipping structure; 701. Screw; 702. Motor; 703. Second gear; 704. Third rack; 705. Through slot; 8. Box shell; 9. Partition; 10. Substrate; 11. Fixing fixture; 12. Blue film; 13. Chip body. DETAILED DESCRIPTION

[0044] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0045] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 、 Figure 14 and Figure 15As shown, the multi-chamber partitioned packaging high-speed VCSEL semiconductor X-chip device of the present invention includes a workbench 1, a partition structure 2 provided on the workbench 1, a flip-chip structure 3 provided on the workbench 1, an ejection structure 4 provided on the flip-chip structure 3, a loading structure 5 provided on the workbench 1, a substrate 10 provided on the flip-chip structure 3, a pickup structure 6 provided on the workbench 1, a flip structure 7 provided on the pickup structure 6, a fixing fixture 11 placed on the loading structure 5, a blue film 12, and a chip body 13;

[0046] The partition structure 2 includes an inverted cavity 201, a lower cavity 202, a loading cavity 203, a flip cavity 204, and a working cavity 205. The workbench 1 is fixedly connected to a box shell 8 and a partition 9. The space above the workbench 1 is divided into the inverted cavity 201, the lower cavity 202, the loading cavity 203, the flip cavity 204, and the working cavity 205 by the box shell 8 and the partition 9.

[0047] The flip structure 3 includes a first linear motor 301 and a first slide 302 slidably connected to the first linear motor 301. Two first linear motors 301 are fixedly connected to the workbench 1. The two parallel first linear motors 301 pass through the flip chamber 204, the flip chamber 201 and the blanking chamber 202. A first carrier 303 is fixedly connected to the first slide 302. A substrate 10 is fixedly connected to the first carrier 303. A robotic arm 311 is installed on the workbench 1 inside the working chamber 205. The output end of the robot arm 311 is fixedly connected to a first vacuum nozzle 312 and a first visual camera 313. A fixed plate 314 is fixedly connected to the workbench 1 inside the working chamber 205. The top of the fixed plate 314 is tilted. The top of the fixed plate 314 is fixedly connected to a second visual camera 315. The second visual camera 315 points to the inside of the flip-chip cavity 201. The cleaned and flux-coated substrate 10 is transferred to the placement cavity on the first carrier 303, and then the first linear motor 301 is started to load the material. A linear motor 301 drives the first slide 302 to move, thereby driving the first carrier 303 to move into the flip-chip cavity 201. Since the two side edges of the first carrier 303 are chamfered, when the first carrier 303 moves into the flip-chip cavity 201, the first carrier 303 will resist the pressure wheel 308 and move upward. The slide bar 307 moves upward, the tension spring 310 stretches, and the first carrier 303 continues to move. The pressure wheel 308 presses the substrate 10 on the first carrier 303 under the tension of the tension spring 310, thereby improving the flip-chip body of the substrate 10. When the substrate 10 is in a stable shape, the first linear motor 301 is stopped, a heating component is provided inside the first carrier 303 to preheat the substrate 10 on the first carrier 303, and then the image information of the solder joints on the substrate 10 is transmitted to the control terminal through the second visual camera 315; four positioning posts 304 are fixedly connected to the first carrier 303, and four positioning holes 305 are provided on the substrate 10. The positioning posts 304 are plugged into the positioning holes 305. The arrangement of the positioning posts 304 and the positioning holes 305 improves the stability of the placement of the substrate 10;Four L-shaped fixing bars 306 are fixedly connected to the surface of the workbench 1 inside the inverted cavity 201. Two opposite fixing bars 306 form a group. A sliding bar 307 with an L-shaped cross section is slidably connected to the fixing bar 306. The bottom end of the sliding bar 307 is rotatably connected to a pressure wheel 308. The pressure wheel 308 contacts the substrate 10. A guide rod 309 is fixedly connected to the fixing bar 306. The sliding bar 307 is slidably connected to the guide rod 309. A pulling rod is fixedly connected between the sliding bar 307 and the fixing bar 306. Spring 310, chamfered edges on both sides of the first carrier 303, and simultaneously controlling the operation of a robotic arm 311. A first visual camera 313 at the end of the robotic arm 311 compares the flipped chip body 13. Then, a first vacuum nozzle 312 on the robotic arm 311 vacuum-pickups the corresponding chip body 13, places it into the flip-chip cavity 201, and presses the chip body 13 onto the corresponding position on the substrate 10. The bumps at the bottom of the chip 13 are thermally pressed into the solder grooves on the substrate 10, thereby flipping the chip body 13.

[0048] Specifically, such as Figure 1 、 Figure 5 、 Figure 11 and Figure 15As shown, the ejection structure 4 includes a rotating shaft 401 and a first gear 402. Each of the first carriers 303 is fixedly connected to two rotating shafts 401. The rotating shaft 401 is rotatably connected to the first gear 402. The first rack 403 and the second rack 406 are respectively engaged on both sides of the first gear 402. The first rack 403 and the second rack 406 are both slidably connected to the first carrier 303. The first rack 403 is fixedly connected to a lifting bar 404. The lifting bar 404 is fixedly connected to the lifting bar 404. There are two ejector rods 405, which are slidably connected to the first carrier 303 and abut against the bottom end of the substrate 10; the cross section of the second rack 406 is an L-shaped structure, and a first spring 407 is fixedly connected between the second rack 406 and the first carrier 303, and a connecting bar 408 is fixedly connected to the second rack 406, and the connecting bar 408 is slidably connected to the first carrier 303, and the bottom end of the connecting bar 408 is rotatably connected to the abutment wheel 409, and the working Four pads 410 are fixedly connected to the platform 1. The pads 410 with an isosceles trapezoidal cross section pass through the flip chamber 204, the flip chamber 201 and the blanking chamber 202. When the chip body 13 on a substrate 10 is completely flipped, the first linear motor 301 drives the first carrier 303 to move. When the first carrier 303 moves to the inside of the blanking chamber 202, the contact wheel 409 moves to the edge of the pad 410, the first spring 407 resets and drives the second rack 406 to move downward, and the second rack 406 drives the first carrier 303 to move downward. A gear 402 rotates, the first gear 402 rotates and drives the first rack 403 to rise, the rising of the first rack 403 drives the lifting bar 404 to rise, the rising of the lifting bar 404 drives the ejection rod 405 to rise, the ejection rod 405 rises and ejects the substrate 10, after the substrate 10 is completely ejected from the placement cavity of the first carrier 303, it is convenient for the subsequent unloading of the substrate 10, and at the same time, when one substrate 10 is being loaded and unloaded, another substrate 10 can be flipped over, multiple processes are carried out in parallel, and production efficiency is improved.

[0049] Specifically, such as Figure 1 、 Figure 3 、 Figure 4 、 Figure 7 、 Figure 8 、 Figure 12 and Figure 13As shown, the feeding structure 5 includes a second linear motor 501 and a second slide 502 slidably connected to the second linear motor 501, the second slide 502 is fixedly connected to the second carrier 503, a fixing fixture 11 is placed on the second carrier 503, the fixing fixture 11 is provided with a blue film 12, a plurality of chip bodies 13 are distributed in a rectangular array on the blue film 12, and two L-shaped clamps 504 are symmetrically slidably connected to the second carrier 503, and the clamps 504 press Tighten the fixture 11, the bottom end of the second carrier 503 is fixedly connected to two fixed blocks 507, and the fixed block 507 is fixedly connected to a fixed rod 508, and the fixed rod 508 is slidably connected to the clamp 504. The outer sleeve of the fixed rod 508 is provided with a second spring 509, and the two ends of the second spring 509 are respectively fixedly connected to the clamp 504 and the fixed block 507. Two driving bars 506 are fixedly connected to the table surface of the workbench 1 inside the loading chamber 203. The end portion is tilted, and a driving wheel 505 is installed on the clamp 504. The driving wheel 505 conflicts with the driving bar 506, and the second linear motor 501 is started to drive the second slide 502 to move along the guide rail, and the second carrier 503 is sent into the loading chamber 203. When the second carrier 503 moves to the specified position of the loading chamber 203, the driving wheel 505 of the clamp 504 contacts the inclined end portion of the driving bar 506. Since the end portion of the driving bar 506 is tilted, the driving wheel 505 slides along the inclined surface, driving the clamp 5 04 overcomes the elastic force of the second spring 509 and moves laterally, and the clamp 504 presses the fixed fixture 11. At this time, the chip body 13 array on the blue film 12 is completely aligned with the second vacuum nozzle 612 position of the picking structure 6. When the chip body 13 is completely picked up, the second carrier 503 slides out, and the driving wheel 505 no longer conflicts with the driving bar 506. The second spring 509 resets and drives the clamp 504 to move to both sides, and no longer clamps and presses the fixed fixture 11, which facilitates the unloading of the fixed fixture 11 and the blue film 12.

[0050] Specifically, such as Figure 3 、 Figure 4 、 Figure 5 and Figure 8As shown, the picking structure 6 includes a mounting frame 601 and a slider 602. The workbench 1 is fixedly connected to the mounting frame 601, and the mounting frame 601 passes through the loading chamber 203 and the flip chamber 204. Two sliders 602 are slidably connected to the mounting frame 601, and the slider 602 is rotatably connected to the mounting shaft 603. A rotating frame 605 with a U-shaped cross section is provided between the two sliders 602. A hexagonal prism-shaped connecting block 604 is fixedly connected to the mounting shaft 603. The connecting block 60 4 is plugged into the rotating frame 605, and the bottom end of the rotating frame 605 is slidably connected to the lifting frame 606 with a U-shaped cross section. The bottom end of the lifting frame 606 is fixedly connected to the vacuum box 608. When the positioning of the fixed fixture 11 is completed, the picking structure 6 starts to work. The mounting frame 601 spans the loading chamber 203 and the flip chamber 204. The two sliders 602 slide along the mounting frame 601 to the top of the blue film 12. The hydraulic rod 611 drives the lifting frame 606 to descend, so that the second vacuum nozzle 612 at the bottom of the vacuum box 608 contacts On the surface of the blue film 12, the vacuum pump 609 is started, and a negative pressure is formed in the vacuum box 608 through the connecting pipe 610, so that the second vacuum nozzle 612 adsorbs the chip body 13. The lifting frame 606 is fixedly connected with the vacuum pump 609, and the exhaust end of the vacuum pump 609 is fixedly connected to the vacuum box 608 through the connecting pipe 610. The bottom end of the vacuum box 608 is fixedly connected with a plurality of second vacuum nozzles 612 in a rectangular array. The rotating frame 605 is fixedly connected with a hydraulic rod 611. The hydraulic rod 611 is fixedly connected to the rotating frame 605. The telescopic end of 11 is fixedly connected to the lifting frame 606; after the picking is completed, the hydraulic rod 611 contracts, driving the lifting frame 606 to rise, so that the chip body 13 is separated from the blue film 12. At this time, the convex point of the chip body 13 is facing upward, and the picking structure 6 maintains the adsorption state. Four guide posts 607 are fixedly connected to the lifting frame 606, and the guide posts 607 are slidably connected to the rotating frame 605. The guide posts 607 and the rotating frame 605 slide together to ensure that the lifting frame 606 moves vertically to avoid chip deviation caused by tilting;

[0051] The flip structure 7 includes a screw 701 and a motor 702. The mounting frame 601 is rotatably connected to the screw 701, and the screw 701 is threadedly connected to one of the sliders 602. The mounting frame 601 is fixedly connected to the motor 702, and the output end of the motor 702 is fixedly connected to the screw 701. A second gear 703 is fixedly connected to one of the mounting shafts 603. A through slot 705 is provided on the mounting frame 601, and the mounting shaft 603 is rollingly connected to the through slot 705. The through slot 705 limits the moving trajectory of the mounting shaft 603 to prevent displacement deviation during the flipping process. A third rack 704 is fixedly connected to the inner wall of the box shell 8 at the flip chamber 204. The motor 702 drives the screw 701 to rotate, and the slider threadedly connected to the screw 701 Block 602 moves along the mounting frame 601 toward the flip chamber 204. During the movement, the second gear 703 on the mounting shaft 603 engages with the third rack 704 on the inner wall of the box shell 8 of the flip chamber 204. Since the third rack 704 is fixed, the second gear 703 is forced to rotate as the mounting shaft 603 moves, driving the mounting shaft 603 and the rotating frame 605 to rotate 180° synchronously. At this time, the chip body 13 flips with the rotating frame 605, and the bump changes from facing upward to facing downward. After the flip is completed, the picking structure 6 carries the flipped chip body 13 to the top of the flip chamber 204, and the first visual camera 313 and the second visual camera 315 of the robotic arm 311 perform visual alignment, and then the chip body 13 is accurately mounted to the pad position of the substrate 10 through the first vacuum suction nozzle 312.

[0052] A packaging method for a high-speed VCSEL semiconductor X-chip device with multi-chamber partition packaging comprises the following steps:

[0053] S1: The chip body 13 is loaded by the loading structure 5, and then the pick-up structure 6 picks up all the chip bodies 13 on the loading structure 5. This operation is performed in the loading chamber 203. The chip body 13 picked up by the pick-up structure 6 is then transferred to the flipping chamber 204 by the flipping structure 7 and flipped.

[0054] S2: The flip-chip structure 3 loads the substrate 10, transfers the substrate 10 into the flip-chip cavity 201, stops conveying the substrate 10, and then transfers the flipped chip body 13 through the flip-chip structure 3 and flip-mounts it on the substrate 10 to complete the flip-chip operation of the chip body 13;

[0055] S3: When one substrate 10 is undergoing a flip-chip operation, the other flip-chip substrate 10 and the chip body 13 can be unloaded. The flip-chip structure 3 sends the flip-chip substrate 10 and the chip body 13 into the unloading cavity 202. At this time, the ejection structure 4 works to eject the flip-chip substrate 10, and then the substrate 10 is transferred and processed again.

[0056] When the present invention is in use, the cleaned and flux-coated substrate 10 is transferred to the placement cavity on the first carrier 303, and then the first linear motor 301 is started to load the material. The first linear motor 301 drives the first slide 302 to move, and then drives the first carrier 303 to move into the flip-chip cavity 201. Since the two side edges of the first carrier 303 are chamfered, when the first carrier 303 moves into the flip-chip cavity 201, the first carrier 303 will resist the pressure wheel 308 and move upward, the slide bar 307 moves upward, the tension spring 310 stretches, and the first carrier 303 continues to move. The pressure wheel 308 presses the substrate 10 on the first carrier 303 under the tension of the tension spring 310, thereby improving the stability of the substrate 10 when the chip body is flipped. , then stop the operation of the first linear motor 301, and a heating component is provided inside the first carrier 303 to preheat the substrate 10 on the first carrier 303, and then transmit the image information of the solder joints on the substrate 10 to the control terminal through the second visual camera 315, and at the same time control the operation of the robotic arm 311, and the first visual camera 313 at the end of the robotic arm 311 compares the flipped chip body 13, and then the first vacuum nozzle 312 on the robotic arm 311 vacuum picks up the corresponding chip body 13, picks up the corresponding chip body 13 into the flip-chip cavity 201, and presses the chip body 13 to the corresponding position on the substrate 10, and the bumps at the bottom of the chip 13 are fixed to the solder grooves on the substrate 10 by hot pressing, thereby flipping the chip body 13;

[0057] When the chip body 13 on a substrate 10 is completely flipped over, the first linear motor 301 drives the first carrier 303 to move. When the first carrier 303 moves to the inside of the unloading chamber 202, the contact wheel 409 moves to the edge of the pad 410, and the first spring 407 resets and drives the second rack 406 to move downward. The second rack 406 drives the first gear 402 to rotate. The first gear 402 rotates and drives the first rack 403 to rise. The rise of the first rack 403 drives the lifting bar 404 to rise. The rise of the lifting bar 404 drives the ejection rod 405 to rise. The ejection rod 405 rises and ejects the substrate 10. After the substrate 10 is completely ejected from the placement cavity of the first carrier 303, the subsequent unloading of the substrate 10 is convenient. At the same time, when one substrate 10 is being loaded and unloaded, the other substrate 10 can be flipped over. Multiple processes are operated in parallel, which improves production efficiency.

[0058] When loading the chip body 13, first lay the blue film 12 (with the chip body 13) flat on the fixing fixture 11, and then place the fixing fixture 11 on the second carrier 503. At this time, start the second linear motor 501 to drive the second slide 502 to move along the guide rail, and send the second carrier 503 into the loading chamber 203. When the second carrier 503 moves to the specified position of the loading chamber 203, the driving wheel 505 of the clamp 504 contacts the inclined end of the driving bar 506. Since the end of the driving bar 506 is inclined, the driving wheel 505 moves along the inclined The inclined surface slides, driving the clamp 504 to move laterally to overcome the elastic force of the second spring 509. The clamp 504 presses the fixed jig 11. At this time, the chip body 13 array on the blue film 12 is completely aligned with the second vacuum nozzle 612 of the pickup structure 6. When the chip body 13 is completely picked up, the second carrier 503 slides out, and the driving wheel 505 no longer conflicts with the driving bar 506. The second spring 509 resets and drives the clamp 504 to move to both sides, thereby no longer clamping and pressing the fixed jig 11, facilitating the unloading of the fixed jig 11 and the blue film 12.

[0059] After the positioning of the fixed fixture 11 is completed, the picking structure 6 starts to work, the mounting frame 601 spans the loading chamber 203 and the flip chamber 204, and the two sliders 602 slide along the mounting frame 601 to the top of the blue film 12, and the hydraulic rod 611 drives the lifting frame 606 to descend, so that the second vacuum nozzle 612 at the bottom of the vacuum box 608 contacts the surface of the blue film 12, and the vacuum pump 609 is started, and negative pressure is formed in the vacuum box 608 through the connecting pipe 610, so that the second vacuum nozzle 612 adsorbs the chip body 13. After the picking is completed, the hydraulic rod 611 contracts, driving the lifting frame 606 to rise, so that the chip body 13 is separated from the blue film 12. At this time, the convex point of the chip body 13 is facing upward and is maintained in the adsorption state by the picking structure 6. After the picking structure 6 completes the chip picking, the flip structure 7 is started, and the motor 702 drives the screw 701 to rotate, and the slider 602 threadedly connected to the screw 701 moves along the mounting frame 601 to the flip chamber 204. During the movement, the mounting shaft 6 The second gear 703 on 03 is meshed with the third rack 704 on the inner wall of the flip chamber 204 shell 8. Since the third rack 704 is fixed, the second gear 703 is forced to rotate when moving with the mounting shaft 603, driving the mounting shaft 603 and the rotating rack 605 to rotate 180° synchronously. At this time, the chip body 13 is flipped with the rotating rack 605, and the bump changes from facing up to facing down. After the flip is completed, the picking structure 6 carries the flipped chip body 13 to the top of the flip chamber 204, and the first visual camera 313 and the second visual camera 315 of the robotic arm 311 perform visual alignment, and then the chip body 13 is accurately mounted to the pad position of the substrate 10 through the first vacuum nozzle 312. The guide column 607 of the picking structure 6 slides with the rotating rack 605 to ensure that the lifting rack 606 moves vertically to avoid chip offset caused by tilting; the through slot 705 of the flip structure 7 limits the moving trajectory of the mounting shaft 603 to prevent displacement deviation during the flipping process.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0061] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A high-speed VCSEL semiconductor X-chip device with multi-chamber partition packaging, characterized in that: The invention comprises a workbench (1), a partition structure (2) provided on the workbench (1), a flip-chip structure (3) provided on the workbench (1), an ejection structure (4) provided on the flip-chip structure (3), a loading structure (5) provided on the workbench (1), a substrate (10) provided on the flip-chip structure (3), a pick-up structure (6) provided on the workbench (1), a flip structure (7) provided on the pick-up structure (6), a fixing fixture (11) provided on the loading structure (5), a blue film (12) and a chip body (13); The partition structure (2) comprises an inverted cavity (201), a material discharging cavity (202), a material loading cavity (203), a turnover cavity (204) and a working cavity (205); a box shell (8) and a partition (9) are fixedly connected to the workbench (1); and the space above the workbench (1) is divided into an inverted cavity (201), a material discharging cavity (202), a material loading cavity (203), a turnover cavity (204) and a working cavity (205) by the box shell (8) and the partition (9); The flip-chip structure (3) comprises a first linear motor (301) and a first slide (302) slidably connected to the first linear motor (301); two first linear motors (301) are fixedly connected to the workbench (1); the two parallel first linear motors (301) pass through the flip chamber (204), the flip-chip chamber (201) and the blanking chamber (202); a first carrier (303) is fixedly connected to the first slide (302); and a substrate (10) is fixedly connected inside the first carrier (303).

2. The multi-chamber zoned packaged high-speed VCSEL semiconductor X-chip device according to claim 1, characterized in that: A robotic arm (311) is installed on the workbench (1) inside the working chamber (205); an output end of the robotic arm (311) is fixedly connected to a first vacuum suction nozzle (312) and a first visual camera (313); a fixed plate (314) is fixedly connected to the workbench (1) inside the working chamber (205); the top end of the fixed plate (314) is tilted; the top end of the fixed plate (314) is fixedly connected to a second visual camera (315); the second visual camera (315) points to the inside of the flip-chip chamber (201); four positioning columns (304) are fixedly connected to the first carrier (303); four positioning holes (305) are provided on the substrate (10); the positioning columns (304) are plugged into the positioning holes (305).

3. The multi-chamber zoned packaged high-speed VCSEL semiconductor X-chip device according to claim 1, characterized in that: Four L-shaped fixed bars (306) are fixedly connected to the table surface of the workbench (1) inside the inverted cavity (201), and two opposite fixed bars (306) form a group. A slide bar (307) with an L-shaped cross section is slidably connected to the fixed bar (306), and the bottom end of the slide bar (307) is rotatably connected to a pressure wheel (308), and the pressure wheel (308) contacts the substrate (10). A guide rod (309) is fixedly connected to the fixed bar (306), and the slide bar (307) is slidably connected to the guide rod (309). A tension spring (310) is fixedly connected between the slide bar (307) and the fixed bar (306), and chamfers are set at the edges on both sides of the first carrier (303).

4. The multi-chamber zoned packaged high-speed VCSEL semiconductor X-chip device according to claim 3, characterized in that: The ejection structure (4) includes a rotating shaft (401) and a first gear (402). Each of the first carriers (303) is fixedly connected to two rotating shafts (401). The rotating shaft (401) is rotatably connected to the first gear (402). The first rack (403) and the second rack (406) are respectively engaged on both sides of the first gear (402). The first rack (403) and the second rack (406) are both slidably connected to the first carrier (303). The first rack (403) is fixedly connected to a lifting bar (404). Two ejection rods (405) are fixedly connected to the lifting bar (404). The ejection rods (405) are slidably connected to the first carrier (303). The ejection rods (405) are in contact with the bottom end of the substrate (10).

5. The multi-chamber zoned packaged high-speed VCSEL semiconductor X-chip device according to claim 4, characterized in that: The cross section of the second rack (406) is an L-shaped structure. A first spring (407) is fixedly connected between the second rack (406) and the first carrier (303). A connecting bar (408) is fixedly connected to the second rack (406). The connecting bar (408) is slidably connected to the first carrier (303). The bottom end of the connecting bar (408) is rotatably connected to a resistance wheel (409). Four pads (410) are fixedly connected to the workbench (1). The pads (410) with an isosceles trapezoidal cross section pass through the flip chamber (204), the inverted chamber (201) and the blanking chamber (202).

6. The multi-chamber zoned packaged high-speed VCSEL semiconductor X-chip device according to claim 1, characterized in that: The feeding structure (5) includes a second linear motor (501) and a second slide (502) slidably connected to the second linear motor (501); a second carrier (503) is fixedly connected to the second slide (502); a fixing fixture (11) is placed on the second carrier (503); a blue film (12) is provided on the fixing fixture (11); a plurality of chip bodies (13) are distributed in a rectangular array on the blue film (12); two clamps (504) with L-shaped cross sections are symmetrically slidably connected to the second carrier (503); the clamps (504) press the fixing fixture (11); the bottom end of the second carrier (503) is fixedly connected There are two fixed blocks (507), and a fixed rod (508) is fixedly connected to the fixed block (507). The fixed rod (508) is slidably connected to the clamp (504). A second spring (509) is sleeved on the outside of the fixed rod (508), and the two ends of the second spring (509) are fixedly connected to the clamp (504) and the fixed block (507) respectively. Two driving bars (506) are fixedly connected to the table surface of the working table (1) inside the feeding chamber (203), and the end of the driving bar (506) is inclined. A driving wheel (505) is installed on the clamp (504), and the driving wheel (505) conflicts with the driving bar (506).

7. The multi-chamber zoned packaged high-speed VCSEL semiconductor X-chip device according to claim 6, characterized in that: The picking structure (6) includes a mounting frame (601) and a slider (602). The workbench (1) is fixedly connected with the mounting frame (601), and the mounting frame (601) passes through the loading chamber (203) and the turning chamber (204). Two sliders (602) are slidably connected to the mounting frame (601), and the sliders (602) are rotatably connected with a mounting shaft (603). A rotating frame (605) with a U-shaped cross section is provided between the two sliders (602), and a connecting block (604) with a hexagonal prism is fixedly connected to the mounting shaft (603). The connecting block (604) is plugged into the rotating frame (605). The bottom end of the rotating frame (605) is slidably connected to a lifting frame (606) with a U-shaped cross section, the bottom end of the lifting frame (606) is fixedly connected to a vacuum box (608), the lifting frame (606) is fixedly connected to a vacuum pump (609), the suction end of the vacuum pump (609) is fixedly connected to the vacuum box (608) through a connecting pipe (610), the bottom end of the vacuum box (608) is fixedly connected to a plurality of second vacuum nozzles (612) in a rectangular array, the rotating frame (605) is fixedly connected to a hydraulic rod (611), and the telescopic end of the hydraulic rod (611) is fixedly connected to the lifting frame (606).

8. The multi-chamber zoned packaged high-speed VCSEL semiconductor X-chip device according to claim 7, characterized in that: Four guide posts (607) are fixedly connected to the lifting frame (606), and the guide posts (607) are slidably connected to the rotating frame (605).

9. The multi-chamber zoned packaged high-speed VCSEL semiconductor X-chip device according to claim 7, characterized in that: The flip structure (7) comprises a screw (701) and a motor (702); the screw (701) is rotatably connected to the mounting frame (601); the screw (701) is threadedly connected to one of the sliders (602); the motor (702) is fixedly connected to the mounting frame (601); the output end of the motor (702) is fixedly connected to the screw (701); a second gear (703) is fixedly connected to one of the mounting shafts (603); a through slot (705) is provided on the mounting frame (601); the mounting shaft (603) is rollingly connected to the through slot (705); and a third rack (704) is fixedly connected to the inner wall of the box shell (8) at the flip chamber (204).

10. The packaging method of a high-speed VCSEL semiconductor X-chip device with multi-cavity partitioned packaging according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: The chip body (13) is loaded through the loading structure (5), and then all the chip bodies (13) on the loading structure (5) are picked up by the picking structure (6). This operation is performed in the loading chamber (203), and then the chip body (13) picked up by the picking structure (6) is transferred to the flipping chamber (204) and flipped through the flipping structure (7); S2: The flip-chip structure (3) loads the substrate (10), transfers the substrate (10) into the flip-chip cavity (201), stops conveying the substrate (10), and then transfers the flipped chip body (13) through the flip-chip structure (3) and installs it on the substrate (10) in an inverted manner to complete the flip-chip operation of the chip body (13); S3: When one substrate (10) is undergoing a flip-chip operation, another flip-chip substrate (10) and a chip body (13) can be unloaded. The flip-chip substrate (10) and the chip body (13) are sent into the unloading cavity (202) by the flip-chip structure (3). At this time, the ejection structure (4) works to eject the flip-chipped substrate (10), and then the substrate (10) is transferred and reprocessed.

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