Non-welding modularized Internet of Things test mainboard

Abstract

The invention relates to the technical field of Internet of Things test equipment, and discloses a non-welding modular Internet of Things test mainboard, which comprises a first mainboard and a second mainboard located above the first mainboard, the first mainboard and the second mainboard are fixedly connected through four fixing mechanisms, the four fixing mechanisms are distributed in a rectangular array, and the first mainboard is connected with the second mainboard through a plurality of clamping mechanisms. The top of the first main board and the top of the second main board are each welded with a plurality of pin ports which are distributed in a bilateral symmetry mode, a pin line which is in signal communication with one pin port is clamped in the interior of the pin port, the other end of the pin line is clamped with a connecting port which is in signal communication with the pin line, and a standard board is welded to the bottom of the connecting port. The non-welding modularized internet-of-things test mainboard has the advantages of being convenient to test and the like, and solves the problems that the defects of insufficient welding, unsoldering and the like of welding points are likely to occur, the potential problems can interfere signal transmission, influence the stability and reliability of the test process, and further cause the deviation of a test result.

Description

Technical Field

[0001] The present invention relates to the technical field of Internet of Things testing equipment, in particular to a non-welding modular Internet of Things testing mainboard. Background Art

[0002] In recent years, IoT technology, leveraging its powerful connectivity and data exchange capabilities, has been widely adopted in a wide range of fields, including smart homes, industrial automation, and smart cities, leading to explosive growth in the number of IoT devices. In the R&D and production processes of IoT devices, performance testing and functional verification of various components, such as sensors, communication modules, and processors, are critical steps in ensuring device quality and reliability.

[0003] Traditional IoT test motherboards mostly use welding to fix each functional module on the motherboard. In actual application, this welding method exposes many problems. From a cost perspective, the welding process not only requires the purchase of professional welding equipment, such as reflow ovens, wave soldering equipment, etc., but also relies on skilled welding technicians to operate, which significantly increases production costs and time costs. In terms of stability, welding points are prone to defects such as cold soldering and desoldering. These potential problems will interfere with signal transmission, affect the stability and reliability of the test process, and thus cause deviations in test results. In the maintenance link, once a functional module fails, professional tools are needed to disassemble and re-solder the welding points during maintenance. The operation process is complicated and tedious, not only consuming a lot of time, but also there is a risk of damaging other components of the motherboard due to improper operation. Therefore, a non-welding modular IoT test motherboard is proposed to solve the above-mentioned problems. Summary of the Invention

[0004] (1) Technical problems solved

[0005] In response to the shortcomings of the existing technology, the present invention provides a non-welded modular Internet of Things test motherboard, which has the advantages of easy testing and solves the defects of welding points such as cold solder joints and desoldering. These potential problems will interfere with signal transmission, affect the stability and reliability of the test process, and thus lead to deviations in test results.

[0006] (2) Technical solution

[0007] The technical solution of the present invention to solve the above technical problems is as follows: a non-welded modular Internet of Things test motherboard, comprising a first motherboard and a second motherboard located above the first motherboard, the first motherboard and the second motherboard being fixedly connected by four fixing mechanisms, the four fixing mechanisms being distributed in a rectangular array, a plurality of pin ports welded to the top of the first motherboard and the second motherboard being symmetrically distributed in left and right directions, a pin line connected to the interior of one of the pin ports for signal communication therewith, a connection port connected to the other end of the pin line for signal communication therewith, a standard board welded to the bottom of the connection port, a plurality of standard chips of different specifications welded to the top of the standard board, a conductive line connecting the first motherboard and the second motherboard being connected between the two pin ports on the same side, and a plurality of pressing mechanisms fixedly connected to the bottom of the second motherboard;

[0008] A plurality of test card slots are welded on the top of the first mainboard, and the plurality of test card slots are respectively located below the plurality of pressing mechanisms. An anti-foolproof block is fixedly connected to the interior of the test card slot. Lead pins distributed in a rectangular array and adapted to the test chip are fixedly connected to the bottom wall of the inner cavity of the test card slot, and the test chip is adapted to the anti-foolproof block.

[0009] A plurality of memory card slots are welded on the top of the second mainboard and are distributed at equal distances in the horizontal direction. An application card slot is welded on the top of the second mainboard and is located behind the plurality of memory card slots. A graphics card is inserted into the application card slot.

[0010] The pressing mechanism includes an insulating plate, which is fixedly connected to the bottom of the second main board. A fixed column is fixedly connected to the bottom of the insulating plate. A sliding tube is slidably connected to the outside of the fixed column. A rubber pad is fixedly connected to the bottom of the sliding tube. The top of the rubber pad is fixedly connected to the insulating plate with the same spring located outside the sliding tube and the fixed column.

[0011] The beneficial effects of the present invention are:

[0012] Reduced costs: The non-soldering connection method eliminates the need for specialized soldering equipment and technicians during the production of the test motherboard, reducing both equipment and labor costs. Furthermore, the modular design reduces the production and R&D costs of individual functional modules. Users can flexibly select and configure modules based on actual testing requirements, avoiding unnecessary resource waste and effectively lowering overall production costs in multiple ways.

[0013] Improved stability and reliability: The plug-in interface completely eliminates potential faults caused by solder joint issues, significantly reducing the probability of failure. High-quality interface materials and a unique anti-misinsertion design further ensure the stability and reliability of the connection between the module and the motherboard, ensuring stable signal transmission and accurate data during testing. This effectively improves the overall performance and reliability of the test motherboard, providing reliable support for IoT device testing.

[0014] Convenient maintenance and upgrades: When a functional module fails, users can simply remove the faulty module from the motherboard and replace it with a new one without complex soldering operations. This simple and quick operation significantly reduces maintenance time and difficulty. Furthermore, the modular design allows users to upgrade the motherboard at any time based on technological developments and actual needs. By replacing or adding new functional modules, motherboard functionality can be easily enhanced and expanded to meet ever-changing testing requirements.

[0015] Enhanced Flexibility and Scalability: Flexible expansion interfaces and a modular design give the motherboard powerful adaptability. Users can freely combine and configure different functional modules based on specific IoT device testing projects, quickly building personalized testing solutions. The motherboard's expandability is further enhanced through expansion options such as docking stations, meeting the diverse needs of large-scale and complex testing scenarios and providing a more flexible and efficient platform for IoT device R&D and testing.

[0016] This non-welding modular IoT test motherboard has the advantage of being easy to test.

[0017] On the basis of the above technical solution, the present invention can also be improved as follows.

[0018] Furthermore, the first mainboard is used for testing thin-film chips, and the second mainboard is used for testing integrated cards.

[0019] The beneficial effect of adopting the above further solution is that chips of different thicknesses can be installed in layers, which can reduce the occupied area and improve the space utilization of the test chassis.

[0020] Furthermore, the fixing mechanism includes four pads, which are distributed in a rectangular array. The tops of the four pads are fixedly connected with screws, and the outer sides of the four screws are sleeved with insulating columns located above the first main board and the second main board. The same fixing frame located on the outside of the graphics card is sleeved between the four screws, and the outer sides of the four screws are sleeved with insulating pads located at the top of the fixing frame and the bottom of the first main board. The tops of the four screws are threadedly connected with nuts, and anti-slip grooves are provided on the outer sides of the four nuts and pads.

[0021] The beneficial effect of adopting the above further solution is that the insulating pads and the insulating columns can insulate the contact parts of the first main board, the second main board and the screw rod to avoid short circuit.

[0022] Furthermore, the pin port can be an SPI interface, an IC interface, and a general GPIO interface. The interface portion of the pin port is made of high-quality metal material and is gold-plated.

[0023] The beneficial effect of adopting this further solution is that the gold plating process can reduce contact resistance and improve corrosion resistance. At the same time, the structural design of the interface has been optimized, and a mis-insertion prevention design is adopted to prevent users from damaging the interface or module due to incorrect insertion when installing the module.

[0024] Furthermore, the standard chip includes resistors, capacitors, a central processing unit module, a communication module, a sensor interface module, a storage module, etc.

[0025] The beneficial effect of adopting the above further solution is that the standard starting components used for multiple test mainboards are soldered separately, so that when the first mainboard or the second mainboard is damaged, the standard chip can still be used, thereby saving electronic resources.

[0026] Furthermore, the plurality of pin ports are detachably connected to the pin line connection interface via a plug-in, slot-type or other mechanical connection structure. The pin port interface adopts an anti-misinsertion design, and its shape, size and pin layout are unique.

[0027] The beneficial effect of adopting the above further solution is that an anti-misinsertion design is adopted to prevent users from damaging the interface or module due to inserting the module incorrectly when installing the module.

[0028] Furthermore, metal contacts and elastic contact structures are provided inside the interfaces of the plurality of pin ports, memory card slots, application card slots and test card slots. When the pin line, memory stick, graphics card or test chip is inserted into the interface, the metal contacts are in close contact with the pins on the functional module to achieve electrical connection.

[0029] Furthermore, the first main board and the second main board are also integrated with a variety of universal communication interfaces, including USB interface, serial port, SPI interface, IC interface, Ethernet interface, WiFi interface, and Bluetooth interface. The universal communication interface is electrically connected to the corresponding module connection interface to realize data interaction between functional modules and external devices and between functional modules.

[0030] The beneficial effects of adopting this further solution are that, for example, users can use the SPI interface to connect a SPI Flash memory chip to expand the motherboard's storage capacity. They can also connect SPI-connected sensors such as accelerometers and gyroscopes to test the motion status of IoT devices. Furthermore, the motherboard supports large-scale expansion through an expansion dock. Users can connect the motherboard to an expansion dock, which integrates a rich set of interface resources, such as more USB ports and Ethernet ports, further enhancing the motherboard's testing capabilities and application range.

[0031] Furthermore, a power management module is provided on the first main board and the second main board. The power management module provides a stable power supply to each functional module through the module connection interface, and the power management module can automatically adjust the output voltage and current according to the power consumption requirements of the functional module, and has overvoltage and overcurrent protection functions.

[0032] The beneficial effect of adopting the above further solution is that the power supply overvoltage and overcurrent protection functions can effectively protect the first mainboard and the second mainboard from being broken down by instantaneous large current during the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the structure of the present invention;

[0034] Figure 2 It is a front view of the connection structure between the fixing mechanism and the first main board and the second main board of the present invention;

[0035] Figure 3 This is an enlarged view of the structure at point A of the present invention;

[0036] Figure 4 This is a top view of the connection structure between the anti-fouling block and the test card slot of the present invention.

[0037] In the figure: 1. First main board; 2. Second main board; 3. Fixing mechanism; 301. Spacer; 302. Screw; 303. Insulating column; 304. Fixing frame; 305. Insulating pad; 306. Nut; 4. Pin port; 5. Pin line; 6. Connecting port; 7. Standard board; 8. Standard chip; 9. Pressing mechanism; 901. Insulating board; 902. Fixing column; 903. Sliding tube; 904. Rubber pad; 905. Spring; 10. Conducting wire; 11. Anti-foolproof block; 12. Test chip; 13. Lead pin; 14. Memory card slot; 15. Application card slot; 16. Graphics card; 17. Test card slot. DETAILED DESCRIPTION

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] In the embodiment, Figure 1-4 A non-welded modular Internet of Things test motherboard is provided. The present invention includes a first motherboard 1 and a second motherboard 2 located above the first motherboard 1. The first motherboard 1 and the second motherboard 2 are fixedly connected by four fixing mechanisms 3. The four fixing mechanisms 3 are distributed in a rectangular array. The tops of the first motherboard 1 and the second motherboard 2 are both welded with a plurality of pin ports 4 that are symmetrically distributed on the left and right. A pin line 5 for signal communication with the pin port 4 is clamped inside, and a connection port 6 for signal communication with the pin line 5 is clamped at the other end of the pin line 5. A standard board 7 is welded at the bottom of the connection port 6, and a plurality of standard chips 8 of different specifications are welded at the top of the standard board 7. The two pin ports 4 on the same side are connected by a same conducting line 10 for conducting the first motherboard 1 and the second motherboard 2. A plurality of pressing mechanisms 9 are fixedly connected to the bottom of the second motherboard 2.

[0040] A plurality of test card slots 17 are welded to the top of the first mainboard 1. The plurality of test card slots 17 are respectively located below the plurality of pressing mechanisms 9. An anti-foolproof block 11 is fixedly connected to the interior of the test card slots 17. Lead pins 13 distributed in a rectangular array and adapted to the test chip 12 are fixedly connected to the bottom wall of the inner cavity of the test card slots 17. The test chip 12 is adapted to the anti-foolproof block 11.

[0041] A plurality of memory card slots 14 are welded to the top of the second mainboard 2 and are distributed equidistantly in the horizontal direction. An application card slot 15 is welded to the top of the second mainboard 2 and is located behind the plurality of memory card slots 14. A graphics card 16 is inserted into the application card slot 15.

[0042] The pressing mechanism 9 includes an insulating plate 901, which is fixedly connected to the bottom of the second main plate 2. A fixing column 902 is fixedly connected to the bottom of the insulating plate 901. A sliding tube 903 is slidably connected to the outer side of the fixing column 902. A rubber pad 904 is fixedly connected to the bottom of the sliding tube 903. A spring 905 is fixedly connected between the top of the rubber pad 904 and the insulating plate 901 and is located outside the sliding tube 903 and the fixing column 902.

[0043] The first mainboard 1 is used for testing the thin chip, and the second mainboard 2 is used for testing the integrated card;

[0044] Installing chips of different thicknesses in layers can reduce the occupied area and improve the space utilization of the test chassis;

[0045] The fixing mechanism 3 includes four pads 301, which are arranged in a rectangular array. The tops of the four pads 301 are fixedly connected to screws 302. The outer sides of the four screws 302 are sleeved with insulating columns 303 located above the first mainboard 1 and the second mainboard 2. A fixed frame 304 located outside the graphics card 16 is sleeved between the four screws 302. The outer sides of the four screws 302 are sleeved with insulating pads 305 located at the top of the fixed frame 304 and the bottom of the first mainboard 1. The tops of the four screws 302 are threadedly connected to nuts 306. Anti-slip grooves are provided on the outer sides of the four nuts 306 and the pads 301.

[0046] The insulating pad 305 and the insulating column 303 can insulate the contact parts of the first main board 1, the second main board 2 and the screw 302 to prevent short circuit.

[0047] Pin 4 can be used as SPI interface, I2C interface and general GPIO interface. The interface part of pin 4 is made of high-quality metal material and is gold-plated.

[0048] The gold plating process can reduce contact resistance and improve corrosion resistance. At the same time, the structural design of the interface has been optimized, and an anti-misinsertion design is adopted to prevent users from damaging the interface or module due to incorrect insertion when installing the module.

[0049] The standard chip 8 includes resistors, capacitors, CPU module, communication module, sensor interface module, storage module, etc.

[0050] By soldering the standard starting components for multiple test mainboards separately, the standard chip 8 can be retained when the first mainboard 1 or the second mainboard 2 is damaged, thereby saving electronic resources;

[0051] Multiple pin ports 4 are detachably connected to the pin line 5 connection interface through plug-in, slot-type or other mechanical connection structures. The pin port 4 interface adopts an anti-misinsertion design, and its shape, size and pin layout are unique;

[0052] The anti-misinsertion design is adopted to prevent users from damaging the interface or module due to incorrect insertion when installing the module;

[0053] The interfaces of the multiple pin ports 4, memory card slot 14, application card slot 15 and test card slot 17 are all equipped with metal contacts and elastic contact structures. When the pin line 5, memory stick, graphics card 16 or test chip 12 are inserted into the interface, the metal contacts are in close contact with the pins on the functional module to achieve electrical connection;

[0054] The first mainboard 1 and the second mainboard 2 are also integrated with a variety of universal communication interfaces, including USB interface, serial port, SPI interface, I2C interface, Ethernet interface, WiFi interface, and Bluetooth interface. The universal communication interface is electrically connected to the corresponding module connection interface to realize data interaction between the functional module and external devices and between functional modules;

[0055] Taking the SPI interface as an example, users can use it to connect to the SPIFlash memory chip to expand the motherboard's storage capacity. They can also connect SPI interface sensors such as accelerometers and gyroscopes to test the motion status of IoT devices. In addition, the motherboard also supports large-scale expansion through expansion docks. Users can connect the motherboard to expansion docks, which integrate rich interface resources such as more USB ports and Ethernet ports, further improving the motherboard's testing capabilities and application range.

[0056] The first mainboard 1 and the second mainboard 2 are provided with a power management module, which provides a stable power supply to each functional module through the module connection interface. The power management module can automatically adjust the output voltage and current according to the power consumption requirements of the functional module, and has overvoltage and overcurrent protection functions;

[0057] The power supply overvoltage and overcurrent protection functions can effectively protect the first mainboard 1 and the second mainboard 2 from being broken down by instantaneous large current during the test process.

[0058] Working principle:

[0059] 1. Layered structure and mechanical connection principle

[0060] Dual motherboard layered design

[0061] The first motherboard 1 and the second motherboard 2 are stacked together using four fixing mechanisms 3. Screws 302 in the fixing mechanisms 3 pass through insulating posts 303 and insulating pads 305, and are secured by nuts 306, ensuring a stable connection and electrical isolation between the two motherboards. This design enables layered testing of thin chips, such as test chips 12, and integrated cards, such as memory modules and graphics cards 16, optimizing space utilization.

[0062] Elastic contact of the pressing mechanism 9

[0063] The pressing mechanism 9 at the bottom of the second mainboard 2 uses the elastic force of spring 905 to press the rubber pad 904 against the test card slot 17 of the first mainboard 1. When the test chip 12 is inserted into the test card slot 17, the anti-mock block 11 ensures the chip is oriented correctly, and the lead pins 13 are tightly connected to the chip pins through the elastic contact structure, achieving electrical continuity.

[0064] 2. Signal transmission and module interaction principle

[0065] Signal link between pin 4 and standard board 7

[0066] Pin ports 4 on the first and second mainboards 1 and 2 are connected to pin cables 5 via a plug-in interface. The other end of the pin cable 5 connects to a standard board 7 via a connector 6. Standard chips 8 on the standard board 7, such as a CPU module or a communication module, establish signal pathways with the mainboards via pin ports 4. Pin ports 4 on the same side interconnect the mainboards via conductive cables 10. For example, the communication module on the standard board 7 transmits wireless signals to the WiFi interface on the second mainboard via pin port 4, and then interacts with external devices via a universal communication interface.

[0067] Functional implementation of test slot 17 and application slot 15

[0068] First motherboard 1 thin chip test: After the test chip 12 is inserted into the test card slot 17, the pin 13 is connected to the internal circuit of the motherboard, the power management module provides the working voltage through the pin, and the data acquisition circuit reads the chip output data in real time and transmits it to the processor module of the standard board 7 through the pin port 4 for analysis.

[0069] Second, motherboard 2 integrated card testing: After a memory module is inserted into memory card slot 14 and graphics card 16 is inserted into application card slot 15, the metal contacts within the interface make contact with the module pins, enabling data storage or graphics processing. For example, graphics card 16 communicates with the motherboard's SPI interface through application card slot 15, transmitting test image data to an external display.

[0070] 3. Power management and electrical protection principles

[0071] The dynamic power management module automatically adjusts the output voltage and current using PWM (Pulse Width Modulation) technology based on the power consumption requirements of different functional modules, such as the high-power CPU module and the low-power sensor module. For example, when test chip 12 enters standby mode, the power management module reduces the supply voltage to the card slot, saving energy.

[0072] Overvoltage / overcurrent protection mechanism

[0073] The power management module has a built-in current sensor and voltage comparator. When it detects an input voltage exceeding the rated value, such as 5.5V, or a transient current surge, such as a short circuit, it immediately triggers the MOS transistor to shut down, cutting off power to the faulty module and preventing damage to the motherboard and chip. Furthermore, insulating pads 305 and insulating columns 303 prevent the metal components of the fixing mechanism 3 from contacting the motherboard circuitry, reducing the risk of short circuits.

[0074] Four anti-misinsertion and stable connection principles

[0075] Interface uniqueness design

[0076] Interfaces like pin port 4 and memory card slot 14 feature anti-misinsertion features, with their shape, size, and pin layout specifically matched to the corresponding module. For example, SPI interface pin port 4 features an L-shaped notch that can only be inserted into SPI module pin 5 with the same notch, preventing pin burns caused by incorrect insertion.

[0077] The metal contacts within the elastic contact structure are gold-plated and designed with springs to ensure a tight fit between the contacts and pins when the module is inserted, with a contact resistance of less than 5mΩ. For example, in memory card slot 14, the elastic metal clip deforms when the memory module is inserted, providing continuous pressure and preventing poor contact caused by vibration.

[0078] Five expansion and upgrade principles

[0079] Universal interface expansion: The motherboard's integrated USB, Ethernet, and other universal communication interfaces are electrically connected to pin 4. This allows for connecting external sensors such as temperature and humidity sensors via the I2C interface, storage devices such as USB flash drives via the USB interface, and debugging devices such as JTAG to a programmer. Users can connect more peripherals via the expansion dock, enabling parallel testing of multiple devices.

[0080] Modular hot-swappable When the communication module needs to be upgraded, there is no need to turn off the motherboard power. Simply unplug the old module such as the Wi-Fi module and insert a new module such as the 5G module. The motherboard's plug-and-play PnP driver automatically recognizes the new module, reallocates resources and updates the test configuration to achieve "hot upgrade".

[0081] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0082] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A non-welded modular Internet of Things test motherboard, comprising a first motherboard (1) and a second motherboard (2) located above the first motherboard (1), characterized in that: The first mainboard (1) and the second mainboard (2) are fixedly connected by four fixing mechanisms (3), and the four fixing mechanisms (3) are distributed in a rectangular array. The tops of the first mainboard (1) and the second mainboard (2) are both welded with a plurality of pin ports (4) that are symmetrically distributed on the left and right. A pin line (5) for signal communication with the pin port (4) is clamped inside, and a connection port (6) for signal communication with the pin line (5) is clamped at the other end. A standard board (7) is welded at the bottom of the connection port (6), and a plurality of standard chips (8) of different specifications are welded at the top of the standard board (7). The two pin ports (4) on the same side are connected with a same conducting line (10) for conducting the first mainboard (1) and the second mainboard (2). The bottom of the second mainboard (2) is fixedly connected with a plurality of pressing mechanisms (9). A plurality of test card slots (17) are welded on the top of the first mainboard (1), and the plurality of test card slots (17) are respectively located below the plurality of pressing mechanisms (9). An anti-foolproof block (11) is fixedly connected to the interior of the test card slot (17), and lead pins (13) distributed in a rectangular array and adapted to the test chip (12) are fixedly connected to the bottom wall of the inner cavity of the test card slot (17), and the test chip (12) is adapted to the anti-foolproof block (11); A plurality of memory card slots (14) are welded to the top of the second mainboard (2) and are distributed at equal distances in the transverse direction. An application card slot (15) located behind the plurality of memory card slots (14) is welded to the top of the second mainboard (2), and a graphics card (16) is plugged into the interior of the application card slot (15); The pressing mechanism (9) comprises an insulating plate (901), the insulating plate (901) is fixedly connected to the bottom of the second main plate (2), the bottom of the insulating plate (901) is fixedly connected to a fixing column (902), the outer side of the fixing column (902) is slidably connected to a sliding tube (903), the bottom of the sliding tube (903) is fixedly connected to a rubber pad (904), and the top of the rubber pad (904) is fixedly connected to the insulating plate (901) with a same spring (905) located outside the sliding tube (903) and the fixing column (902).

2. The non-welded modular IoT test motherboard according to claim 1, characterized in that: The first mainboard (1) is used for testing thin-chip chips, and the second mainboard (2) is used for testing integrated cards.

3. The non-welded modular IoT test motherboard according to claim 1, characterized in that: The fixing mechanism (3) comprises four pads (301), the four pads (301) being distributed in a rectangular array, the tops of the four pads (301) being fixedly connected with screws (302), the outer sides of the four screws (302) being sleeved with insulating columns (303) located above the first mainboard (1) and the second mainboard (2), a fixed frame (304) being sleeved between the four screws (302) and being located outside the graphics card (16), the outer sides of the four screws (302) being sleeved with insulating pads (305) located at the top of the fixed frame (304) and the bottom of the first mainboard (1), the tops of the four screws (302) being threadedly connected with nuts (306), and the outer sides of the four nuts (306) and the pads (301) being provided with anti-slip grooves.

4. The non-welded modular IoT test motherboard according to claim 1, characterized in that: The pin port (4) can be an SPI interface, an I2C interface, and a general GPIO interface. The interface portion of the pin port (4) is made of high-quality metal material and is subjected to a gold-plating process.

5. The non-welded modular IoT test motherboard according to claim 1, characterized in that: The standard chip (8) includes a resistor, a capacitor, a central processing unit module, a communication module, a sensor interface module, a storage module, etc.

6. The non-welded modular IoT test motherboard according to claim 1, characterized in that: The plurality of pin ports (4) are detachably connected to the pin line (5) connection interface via a plug-in type, a card slot type or other mechanical connection structure. The pin port (4) interface adopts an anti-misinsertion design, and its shape, size and pin layout are all unique.

7. The non-welded modular IoT test motherboard according to claim 1, characterized in that: The interfaces of the plurality of pin ports (4), memory card slots (14), application card slots (15) and test card slots (17) are all provided with metal contacts and elastic contact structures. When a pin line (5), a memory stick, a graphics card (16) or a test chip (12) is inserted into the interface, the metal contacts are in close contact with the pins on the functional module to achieve electrical connection.

8. The non-welded modular IoT test motherboard according to claim 1, characterized in that: The first mainboard (1) and the second mainboard (2) are also integrated with a variety of universal communication interfaces, including a USB interface, a serial port, an SPI interface, an I2C interface, an Ethernet interface, a WiFi interface, and a Bluetooth interface. The universal communication interfaces are electrically connected to corresponding module connection interfaces to realize data interaction between functional modules and external devices, and between functional modules.

9. The non-welded modular IoT test motherboard according to claim 1, characterized in that: The first mainboard (1) and the second mainboard (2) are provided with a power management module, which provides a stable power supply for each functional module through a module connection interface, and the power management module can automatically adjust the output voltage and current according to the power consumption requirements of the functional module, and has overvoltage and overcurrent protection functions.

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