Variable pressure circulation type air-liquid homologous heat dissipation device for data center

Abstract

The application provides a variable-pressure circulation type air-liquid homologous heat dissipation device for a data center, which comprises a mounting assembly arranged in the interior of a data center cabinet, a lifting heat dissipation circulation mechanism arranged on the mounting assembly and used for lifting and changing the heat dissipation position, and an air-liquid circulation mechanism arranged above the lifting heat dissipation circulation mechanism and used for circulating and supplying cold air and cold liquid to the heat dissipation element. The application can save heat dissipation space and can move and fold to dissipate heat, so as to solve the problems of the existing conventional heat dissipation device, such as fixed design, inability to dynamically adjust according to the load difference of different areas in the data center, coexistence of energy waste and local overheating, complex structure and large space occupation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field, and particularly relates to a variable-pressure circulation type air-liquid homologous heat dissipation device for a data center. BACKGROUND

[0002] With the rapid development of cloud computing, artificial intelligence and big data technology, the single-cabinet power density of data centers continues to rise, and the traditional air cooling heat dissipation technology has been difficult to meet the heat dissipation demand in the high-density computing scenario. The liquid cooling technology gradually becomes one of the mainstream directions of data center heat dissipation due to its high efficient heat conduction performance. However, the pure liquid cooling system has problems such as high initial investment cost and complex maintenance, and the response speed is insufficient when dealing with instantaneous heat shock.

[0003] At the same time, although the air cooling technology has the advantages of low cost and flexible deployment, its heat dissipation efficiency is limited by the specific heat capacity of air, and it is difficult to meet the stringent requirements of PUE (power usage efficiency) of future data centers. Therefore, how to combine the advantages of air cooling and liquid cooling to realize efficient heat dissipation of "air-liquid cooperation" has become a research hotspot in the industry.

[0004] In the prior art, some schemes realize collaborative heat dissipation by independently setting air cooling and liquid cooling modules, but there are problems such as complex structure and large space occupation. In addition, most of the traditional heat dissipation devices are fixed design, which cannot dynamically adjust according to the load difference of different areas in the data center, resulting in coexistence of energy waste and local overheating phenomenon. SUMMARY

[0005] In view of the problems in the prior art, the present application aims to provide a variable-pressure circulation type air-liquid homologous heat dissipation device for a data center, which can save heat dissipation space and can be folded for heat dissipation, so as to solve the problems of the prior art, such as the coexistence of energy waste and local overheating phenomenon caused by the fixed design of the traditional heat dissipation device, which cannot dynamically adjust according to the load difference of different areas in the data center, and the problems of complex structure and large space occupation.

[0006] In order to achieve the above-mentioned purpose, the present application is realized by the following technical scheme: a variable-pressure circulation type air-liquid homologous heat dissipation device for a data center, comprising a mounting assembly arranged in the interior of a data center cabinet;

[0007] A lifting heat dissipation circulation mechanism is arranged on the mounting assembly and is used for lifting and changing the heat dissipation position.

[0008] An air-liquid circulation mechanism is arranged above the lifting heat dissipation circulation mechanism and is used for circulating and supplying cold air and cold liquid to the heat dissipation element.

[0009] Further, the mounting assembly comprises a base, a slide rod and a fixing lug, the slide rod is fixedly installed on both sides of the top of the base, and the fixing lug is fixedly installed on the top of the slide rod.

[0010] Further, the lifting heat dissipation circulating mechanism comprises a sliding installation plate, a lifting drive assembly, a torsion swing drive assembly, a water-cooled heat dissipation arm, a wind-liquid mixed heat dissipation arm, a gear one, a linkage sleeve one, a gear two, a linkage sleeve two and a jacking swing staggered assembly, the sliding installation plate is slidably installed on the surface of the slide rod, the lifting drive assembly is arranged at the center of the top of the base and is used for driving the sliding installation plate to adjust the height, the torsion swing drive assembly is arranged at the top center of the sliding installation plate and is used for driving the water-cooled heat dissipation arm and the wind-liquid mixed heat dissipation arm to swing on the sliding installation plate, the linkage sleeve one is fixedly installed on one side of the top of the water-cooled heat dissipation arm close to the sliding installation plate, the gear one is fixedly installed on the surface of the linkage sleeve one and is located on the top of the sliding installation plate, the linkage sleeve two is fixedly installed on one side of the top of the wind-liquid mixed heat dissipation arm close to the sliding installation plate, the gear two is longitudinally slidably installed on the top of the surface of the linkage sleeve two, the water-cooled heat dissipation arm and the wind-liquid mixed heat dissipation arm are both internally provided with a cold-lead coil, the water-cooled heat dissipation arm is rotationally matched with one side of the top of the sliding installation plate through the linkage sleeve one, the wind-liquid mixed heat dissipation arm is rotationally matched with the other side of the top of the sliding installation plate through the linkage sleeve two, and the jacking swing staggered assembly is arranged on one side of the top of the sliding installation plate close to the gear two and is used for driving the linkage sleeve two to jacking change the longitudinal position.

[0011] Further, the lifting drive assembly comprises a servo motor, a fixing frame, a screw rod and a screw sleeve, the fixing frame is fixedly installed at the center of the top of the base, the servo motor is fixedly installed at the bottom of the fixing frame, the bottom of the screw rod penetrates through the fixing frame and is fixedly installed with the output end of the servo motor, the screw sleeve is threadedly connected on the surface of the screw rod, and the top of the screw sleeve is fixedly installed with the bottom of the sliding installation plate.

[0012] Further, the torsion swing drive assembly comprises a stepping motor, a driving disc, a poking column, a driving frame and a rack, the stepping motor is fixedly installed at the center of the bottom of the sliding installation plate, the output end of the stepping motor penetrates through the sliding installation plate and extends to the top of the sliding installation plate to be fixedly connected with the driving disc, the poking column is fixedly installed on one side of the top of the driving disc close to the driving frame, the driving frame is internally provided with a sliding groove in sliding fit with the poking column, the rack is fixedly installed at both ends of the driving frame and is in mesh with the gear one and the gear two, and the driving frame is fixedly installed with a guide unit at both sides of the bottom.

[0013] Further, the jacking and swinging staggered assembly comprises an electromagnetic push rod, a jacking plate, a limiting ring, a limiting plate and a limiting slide column, the electromagnetic push rod is fixedly installed on the back of the limiting plate, the limiting plate is fixedly installed on the top of the sliding installation plate and close to the rear side of the second gear, the jacking plate is fixedly installed on the output end of the electromagnetic push rod, the jacking plate is rotatably sleeved on the surface of the limiting ring, the limiting ring is fixedly installed on the top of the surface of the second linkage sleeve, the limiting slide column is fixedly installed on the bottom of the jacking plate and close to the two sides of the limiting plate and is in sliding fit with the limiting plate, the surface of the second linkage sleeve is sleeved with a spring, the top of the spring is in contact with the bottom of the limiting ring, and the bottom of the spring is in contact with the top of the second gear.

[0014] Further, the guiding unit comprises a limiting sliding seat and a limiting sliding block, the limiting sliding seat is fixedly installed on the two sides of the top of the sliding installation plate, and the limiting sliding block is fixedly installed on the two sides of the bottom of the driving frame and is in sliding fit with the limiting sliding seat.

[0015] Further, the wind-liquid circulation mechanism comprises a heat dissipation water tank, a sealing cover, heat dissipation fans, a wind collecting cover, a cold air guide pipe, an air supply hose, a semiconductor refrigeration sheet, a variable frequency speed regulation water pump, a water return tee joint and a water supply tee joint, the heat dissipation water tank is arranged on the top of the screw rod and is fixedly installed on the two sides of the fixing lug, the bottom of the heat dissipation water tank is in rotary fit with the top of the screw rod, the heat dissipation fans are arranged in two groups and are symmetrically installed on the two sides of the top of the heat dissipation water tank, the sealing cover is threadedly connected at the center of the top of the heat dissipation water tank, the semiconductor refrigeration sheet is fixedly installed at the center of the back of the heat dissipation water tank, the wind collecting cover is fixedly connected to the front of the heat dissipation fan, one end of the cold air guide pipe is in communication with the wind collecting cover, the other end of the cold air guide pipe penetrates the heat dissipation water tank from top to bottom and extends to the bottom of the heat dissipation water tank and is in communication with the water-cooled heat dissipation arm and the wind-liquid mixed heat dissipation arm through the hose, the part of the cold air guide pipe in the heat dissipation water tank is made of cold air guide material, the variable frequency speed regulation water pump is fixedly installed at the center of the inner wall bottom of the heat dissipation water tank, the output end of the variable frequency speed regulation water pump penetrates the heat dissipation water tank and extends to the bottom of the heat dissipation water tank and is in communication with the water supply tee joint, the other two ends of the water supply tee joint are in communication with the cold air guide coil pipes in the water-cooled heat dissipation arm and the wind-liquid mixed heat dissipation arm through the hose respectively, the bottom of the heat dissipation water tank is in communication with the water return tee joint through the hose, and the other two ends of the water return tee joint are in communication with one end of the cold air guide coil pipes in the water-cooled heat dissipation arm and the wind-liquid mixed heat dissipation arm through the hose.

[0016] Further, the top of the water-cooled heat dissipation arm and the wind-liquid mixed heat dissipation arm is provided with a ventilation hole, the ventilation hole is provided with a plurality of groups and is used for air cooling heat dissipation in cooperation with the bottom hose of the cold air guide pipe, and the top of the wind-liquid mixed heat dissipation arm is fixedly installed with a plurality of cleaning brushes.

[0017] The beneficial effects of the present application: the present application drives the screw and the sleeve through the servo motor, drives the sliding mounting plate to move longitudinally, accurately matches the heat dissipation requirements of different levels of processors in the data center cabinet, avoids energy waste, and increases efficiency: the water-cooled heat dissipation arm and the air-liquid mixed heat dissipation arm are driven by the stepping motor to swing synchronously, expand the heat dissipation area and form dynamic airflow, and break the thermal boundary layer. BRIEF DESCRIPTION OF DRAWINGS

[0018] Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the following drawings:

[0019] Figure 1 is a structural schematic diagram of the present application;

[0020] Figure 2 is another perspective structural schematic diagram of the present application Figure 1

[0021] Figure 3 is a structural schematic diagram of the torsional swing driving assembly of the present application;

[0022] Figure 4 is an exploded structural schematic diagram of the present application Figure 3

[0023] Figure 5 is an enlarged structural schematic diagram of A of the present application Figure 4

[0024] Figure 6 is a structural schematic diagram of the air-liquid circulation mechanism of the present application.

[0025] In the figure: 1, base; 101, sliding rod; 102, fixed lug; 11, servo motor; 12, fixed frame; 111, screw; 112, sleeve; 2, sliding mounting plate; 21, water-cooled heat dissipation arm; 211, ventilation hole; 22, air-liquid mixed heat dissipation arm; 221, cleaning brush; 222, cooling coil; 23, gear one; 231, linkage sleeve one; 24, gear two; 241, jacking plate; 242, electromagnetic push rod; 243, limiting ring; 244, linkage sleeve two; 245, limiting plate; 246, limiting slide column; 247, spring; 25, stepping motor; 251, driving disc; 252, actuating column; 253, driving frame; 254, rack; 2531, limiting slide; 2532, limiting block; 3, heat dissipation water tank; 301, sealing cover; 302, heat dissipation fan; 3021, air collecting cover; 3022, cooling air supply pipe; 303, semiconductor refrigeration sheet; 30221, air supply hose; 304, variable frequency speed regulation water pump; 3041, water return tee joint; 3042, water supply tee joint. DETAILED DESCRIPTION

[0026] ​​​To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0027] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the present invention.

[0028] A variable-pressure circulating air-liquid co-source heat dissipation device for data centers includes mounting components and is installed inside a data center cabinet;

[0029] Please see Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the internal structure of the tower. Figure 3 for Figure 2 A magnified view of A in the middle.

[0030] The mounting assembly includes a base 1, a slide bar 101, and mounting ears 102. The slide bar 101 is fixedly mounted on both sides of the top of the base 1, and the mounting ears 102 are fixedly mounted on the top of the slide bar 101. The base 1 is mounted on the bottom of the data center rack. The base 1 supports and mounts the slide bar 101, and the mounting ears 102, in conjunction with the cooling water tank 3, provide overall vertical restraint for the slide bar 101. Its vertical mounting on the rear interior of the data center rack does not interfere with the installation of the data processors inside the rack.

[0031] A lifting and cooling circulation mechanism is mounted on the mounting assembly and used to adjust the cooling position. The mechanism includes a sliding mounting plate 2, a lifting drive assembly, a torsional swing drive assembly, a water-cooled cooling arm 21, a liquid-air mixing cooling arm 22, a gear 1 23, a linkage sleeve 1 231, a gear 24, a linkage sleeve 244, and a lifting and swinging alternating assembly. The sliding mounting plate 2 is slidably mounted on the surface of the slide rod 101. The lifting drive assembly is located at the center of the top of the base 1 and is used to drive the sliding mounting plate 2 to adjust its height. The torsional swing drive assembly is located at the center of the top of the sliding mounting plate 2 and is used to drive the water-cooled cooling arm 21 and the liquid-air mixing cooling arm 22 to swing on the sliding mounting plate 2. The top of the water-cooled cooling arm 21 is fixedly mounted on the side closest to the sliding mounting plate 2. The device is equipped with a linkage sleeve 231, and a gear 23 is fixedly installed on the surface of the linkage sleeve 231 and located at the top of the sliding mounting plate 2. A linkage sleeve 244 is fixedly installed on the top of the air-liquid mixing heat dissipation arm 22 near the sliding mounting plate 2. The gear 24 is slidably installed on the top surface of the linkage sleeve 244. Both the water-cooled heat dissipation arm 21 and the air-liquid mixing heat dissipation arm 22 are equipped with cooling coils 222. The water-cooled heat dissipation arm 21 is rotatably engaged with one side of the top of the sliding mounting plate 2 through the linkage sleeve 231, and the air-liquid mixing heat dissipation arm 22 is rotatably engaged with the other side of the top of the sliding mounting plate 2 through the linkage sleeve 244. The lifting and swinging interleaved component is located on the top of the sliding mounting plate 2 near the gear 24 and is used to drive the linkage sleeve 244 to lift and change its longitudinal position.

[0032] The heat dissipation position can be changed by sliding on the slide bar 101 through the lifting drive component and the sliding mounting plate 2. The heat dissipation intensity can be adjusted according to the heat dissipation requirements of different levels. The gear 1 23 and gear 2 24 can be used in conjunction with the torsional swing drive component to swing the water cooling heat dissipation arm 21 and the air-liquid mixing heat dissipation arm 22 to increase the heat dissipation area. When cross swinging heat dissipation is required, the height of the air-liquid mixing heat dissipation arm 22 can be adjusted by the lifting swinging cross component, so that the air-liquid mixing heat dissipation arm 22 and the water cooling heat dissipation arm 21 are staggered to avoid collision during swinging. At the same time, it can be easily folded into the bottom of the sliding mounting plate 2 for convenient height adjustment.

[0033] The lifting drive assembly includes a servo motor 11, a fixed frame 12, a screw 111, and a screw sleeve 112. The fixed frame 12 is fixedly installed at the top center of the base 1. The servo motor 11 is fixedly installed at the bottom of the fixed frame 12. The bottom of the screw 111 passes through the fixed frame 12 and is fixedly installed at the output end of the servo motor 11. The screw sleeve 112 is threadedly connected to the surface of the screw 111. The top of the screw sleeve 112 is fixedly installed at the bottom of the sliding mounting plate 2.

[0034] The mounting bracket 12 can install and fix the servo motor 11, and starting the servo motor 11 can drive the screw 111 to rotate. After the screw 111 rotates, it drives the screw sleeve 112 to adjust its height. Since the screw sleeve 112 is fixed to the sliding mounting plate 2, it is limited by the slide rod 101, which can achieve stable longitudinal adjustment.

[0035] The torsional oscillation drive assembly includes a stepper motor 25, a drive disk 251, a toggle post 252, a drive frame 253, and a rack 254. The stepper motor 25 is fixedly installed at the center of the bottom of the sliding mounting plate 2. The output end of the stepper motor 25 passes through the sliding mounting plate 2 and extends to the top of the sliding mounting plate 2, where it is fixedly connected to the drive disk 251. The toggle post 252 is fixedly installed on the top of the drive disk 251 near the drive frame 253. The drive frame 253 has a groove inside that slides with the toggle post 252. The rack 254 is fixedly installed at both ends of the drive frame 253 and meshes with gear 1 23 and gear 2 24. Guide units are fixedly installed on both sides of the bottom of the drive frame 253.

[0036] After the stepper motor 25 starts, it can drive the drive disk 251 to rotate. After the drive disk 251 rotates, it can drive the actuating column 252 to rotate as well. When the actuating column 252 rotates, it can drive the drive frame 253 to slide back and forth stably under the limit of the guide unit, thereby making the drive frame 253 stably drive the rack 254 to move back and forth. Thus, the movement of the rack 254 drives the gear 1 23 and gear 24 meshing with it to rotate synchronously. The rotation of gear 1 23 and gear 24 drives the water-cooled heat dissipation arm 21 and the air-liquid mixing heat dissipation arm 22 to rotate accordingly through the linkage sleeve 1 231 and linkage sleeve 244 fixed to them, thereby realizing the heat dissipation of the rotation, increasing the heat dissipation area and forming a dynamic airflow, breaking the local thermal boundary layer, and significantly improving the heat dissipation efficiency.

[0037] The lifting and swinging interleaved assembly includes an electromagnetic push rod 242, a lifting plate 241, a limiting ring 243, a limiting plate 245, and a limiting slide column 246. The electromagnetic push rod 242 is fixedly installed on the back of the limiting plate 245. The limiting plate 245 is fixedly installed on the rear side of the top of the sliding mounting plate 2 near the gear 24. The lifting plate 241 is fixedly installed on the output end of the electromagnetic push rod 242. The lifting plate 241 is rotatably sleeved on the surface of the limiting ring 243. The limiting ring 243 is fixedly installed on the top of the surface of the linkage sleeve 244. The limiting slide column 246 is fixedly installed on both sides of the bottom of the lifting plate 241 near the limiting plate 245 and slides with the limiting plate 245. A spring 247 is sleeved on the surface of the linkage sleeve 244. The top of the spring 247 contacts the bottom of the limiting ring 243, and the bottom of the spring 247 contacts the top of the gear 24.

[0038] By activating the electromagnetic push rod 242, the lifting plate 241 can be lifted. Through the stable sliding cooperation between the limiting slide column 246 at the bottom of the lifting plate 241 and the limiting plate 245, the lifting plate 241 can be lifted stably to avoid jamming. At the same time, the lifting plate 241 can drive the limiting ring 243, which is rotated and limited, to rise upwards without affecting the torsion of the limiting ring 243 and the second linkage sleeve 244. During the lifting process, the elastic force of the spring 247 can always keep the second gear 24 and the rack 254 meshing, ensuring that the second gear 24 can be stably driven torsion by the rack 254. The water-cooled heat dissipation arm 21 and the air-liquid mixing heat dissipation arm 22 can be folded into the bottom of the sliding mounting plate 2, which facilitates the maintenance and upgrading of the equipment in the cabinet, while reducing space occupation and adapting to the high-density deployment trend of data centers.

[0039] The guide unit includes a limiting slide block 2531 and a limiting slider 2532. The limiting slide block 2531 is fixedly installed on both sides of the top of the sliding mounting plate 2, and the limiting slider 2532 is fixedly installed on both sides of the bottom of the drive frame 253 and slides in cooperation with the limiting slide block 2531.

[0040] After the limiting slide block 2531 is fixed to the sliding mounting plate 2, it can ensure that the limiting slider 2532 will not wobble when it slides. At the same time, the limiting slider 2532 can stably limit the sliding stroke of the drive frame 253 to prevent the two sides from twisting and jamming.

[0041] A cooling and liquid circulation mechanism is located above the lifting and cooling circulation mechanism and is used to circulate and supply cold air and cool liquid to the heat dissipation components. The cooling and liquid circulation mechanism includes a heat dissipation tank 3, a sealing cover 301, a cooling fan 302, an air collector 3021, a cooling air duct 3022, a flexible air supply hose 30221, a thermoelectric cooler 303, a variable frequency speed-regulating water pump 304, a return water tee connector 3041, and a supply water tee connector 3042. The heat dissipation tank 3 is located on top of the screw 111 and is fixedly installed on both sides with the fixing ears 102. The bottom of the heat dissipation tank 3 is rotatably engaged with the top of the screw 111. Two sets of cooling fans 302 are symmetrically installed on both sides of the top of the heat dissipation tank 3. The sealing cover 301 is threaded to the center of the top of the heat dissipation tank 3. The thermoelectric cooler 303 is fixedly installed at the center of the back of the heat dissipation tank 3. The air collector 3021 is fixedly connected to the front of the cooling fan 302. One end of the cooling air duct 3022... The duct 3022 is connected to the air collector shroud 3021. The other end of the duct runs from top to bottom through the water tank 3 and extends to the bottom of the water tank 3. It is connected to the water-cooled cooling arm 21 and the air-liquid mixing cooling arm 22 via a hose. The part of the cooling air supply duct 3022 inside the water tank 3 is made of a cooling material. The variable frequency speed control water pump 304 is fixedly installed at the center of the bottom of the inner wall of the water tank 3. The output end of the variable frequency speed control water pump 304 runs through the water tank 3 and extends to the bottom of the water tank 3 and is connected to the water supply tee connector 3042. The other two ends of the water supply tee connector 3042 are connected to the cooling coil 222 inside the water-cooled cooling arm 21 and the air-liquid mixing cooling arm 22 via hoses. The bottom of the water tank 3 is connected to the return water tee connector 3041 via a hose. The other two ends of the return water tee connector 3041 are connected to one end of the cooling coil 222 inside the water-cooled cooling arm 21 and the air-liquid mixing cooling arm 22 via hoses, thus forming a liquid circulation.

[0042] The starting power of the variable frequency speed control water pump 304 is determined according to the heat dissipation requirements. When high pressure is required, the operating power of the variable frequency speed control water pump 304 is changed to increase the power and make it flow quickly to remove heat. When low pressure is required, energy is saved by reducing the operating power and the liquid flow rate. At the same time, during circulation, the output end of the variable frequency speed control water pump 304 cooperates with the water supply tee connector 3042 to simultaneously deliver cold liquid to the cooling coil 222 in the water-cooled heat dissipation arm 21 and the air-liquid mixing heat dissipation arm 22. At the same time, the interior of the water-cooled heat dissipation arm 21 and the air-liquid mixing heat dissipation arm 22 is filled with cooling coils to increase the heat dissipation effect. After the cold liquid circulates through the cooling coil 222, it returns to the interior of the heat dissipation tank 3 through the return water tee connector 3041, so that the cold liquid that has absorbed heat returns to the interior of the heat dissipation tank 3 and is delivered by the variable frequency speed control water pump 304 again. Simultaneously, it is cooled by the semiconductor cooling chip 303 to keep the cold liquid at a relatively cold temperature and ensure heat dissipation efficiency.

[0043] During the coolant delivery process, after the cooling fan 302 starts, it compresses the outside air through the air collector shroud 3021 and then delivers it through the cooling air duct 3022 to the interior of the water-cooled cooling arm 21 and the air-liquid mixing cooling arm 22. However, during the delivery process, due to the cooling air duct 3022, the outside air is cooled again, making the cooling effect better and ensuring heat dissipation performance. After entering the interior of the water-cooled cooling arm 21 and the air-liquid mixing cooling arm 22, due to the arrangement of the cooling coil 222, the cold air and the coolant in the cooling coil 222 will combine to dissipate heat from the data processor in the data center, which is then cooled through the cooling air duct 3022. The cool air cooled by the thermoelectric cooler 303 and the coolant delivered by the variable frequency speed-regulating water pump 304 are simultaneously introduced into the heat dissipation arm to achieve a composite heat dissipation effect of "air cooling wrapped with liquid cooling". The cool air blows directly on the surface of the processor and quickly removes sensible heat; the coolant absorbs latent heat through the cooling coil 222, forming a dual cooling mechanism, which is especially suitable for the instantaneous thermal shock in high-density computing scenarios. The variable frequency speed-regulating water pump 304 dynamically adjusts the flow rate according to the heat dissipation requirements. In high-pressure mode, the coolant is circulated rapidly to cope with extreme conditions, and in low-pressure mode, energy consumption is reduced. Combined with the precise temperature control of the thermoelectric cooler 303, the system energy efficiency ratio (EER) is improved by more than 25%.

[0044] A temperature sensor is added inside the cooling water tank 3 to monitor the coolant temperature in real time and transmit the data to the data center management platform via a wireless module. When the temperature exceeds the threshold, the system automatically starts the semiconductor cooling chip 303 to enhance cooling and triggers an alarm to notify the maintenance personnel.

[0045] Based on the climate conditions of the data center's location, the cooling power of the semiconductor cooling chip 303 can be adjusted via software. For example, the cooling intensity can be appropriately increased in high-temperature and high-humidity areas, while the power can be reduced in low-temperature and dry areas to save energy.

[0046] By monitoring the current and vibration signals of key components such as servo motor 11 and stepper motor 25, potential faults can be predicted in advance, enabling predictive maintenance.

[0047] Both the water-cooled heat dissipation arm 21 and the air-liquid hybrid heat dissipation arm 22 have ventilation holes 211 at their tops. Several sets of ventilation holes 211 are provided, working in conjunction with the bottom flexible hoses of the cooling air supply duct 3022 for air-cooled heat dissipation. Several sets of cleaning brushes 221 are fixedly installed on the top of the air-liquid hybrid heat dissipation arm 22. The ventilation holes 211 facilitate the removal of cool air delivered to the water-cooled heat dissipation arm 21 and the air-liquid hybrid heat dissipation arm 22 by the cooling air supply duct 3022. Simultaneously, the ventilation holes 211 can be configured as static elimination brushes to absorb static electricity from the data center cabinets during heat dissipation, ensuring equipment stability. The integrated static elimination brushes in the ventilation holes 211 actively absorb static electricity within the cabinets during heat dissipation, reducing the failure rate of electronic components due to electrostatic discharge and extending processor lifespan. The cleaning brushes 221 on the top of the air-liquid hybrid heat dissipation arm 22 can periodically clean dust from the processor surface, preventing dust accumulation that could cause localized overheating, reducing the frequency of manual maintenance, and lowering operating costs.

[0048] Working principle: 1. Adjustment of heat dissipation position

[0049] Servo motor 11 drives screw 111 to rotate, causing screw sleeve 112 and sliding mounting plate 2 to move longitudinally along slide rod 101, thereby realizing height adjustment of heat dissipation mechanism to match the heat dissipation requirements of different levels of processors.

[0050] II. Dynamic swing of the heat dissipation arm

[0051] Stepper motor 25 drives drive disk 251 to rotate, and push column 252 drives rack 254 to move back and forth through slide groove of drive frame 253, thereby driving gear 1 23 and gear 24 to rotate synchronously, so that water cooling heat dissipation arm 21 and air-liquid mixing heat dissipation arm 22 swing on sliding mounting plate 2, expand heat dissipation area and form dynamic airflow.

[0052] III. Wind-Liquid Co-circulation

[0053] Cooling liquid circulation: The variable frequency speed control water pump 304 draws cool liquid from the heat sink 3 and distributes it through the water supply tee connector 3042 to the cooling coil 222 of the water cooling heat sink 21 and the air-liquid mixing heat sink 22. After absorbing the heat of the processor, it returns to the heat sink 3 through the return tee connector 3041 and is cooled again by the semiconductor cooling chip 303.

[0054] Cool air circulation: The cooling fan 302 compresses the outside air and sends it into the cooling air supply pipe 3022 through the air collector shroud 3021. The cool air is further cooled by the semiconductor cooling chip 303 in the pipe and then delivered to the heat dissipation arm. It works together with the coolant in the cooling coil 222 to perform composite heat dissipation on the processor.

[0055] IV. Collision Protection and Adaptive Folding

[0056] The electromagnetic push rod 242 pushes the lifting plate 241 to rise, and through the limit ring 243, it drives the linkage sleeve 244 and the air-liquid mixing heat dissipation arm 22 to rise, avoiding collision with the water cooling heat dissipation arm 21; the spring 247 ensures that the gear 24 and the rack 254 are always meshed, ensuring the stability of the swing drive; the heat dissipation arm can be folded and stored in the bottom of the sliding mounting plate 2 for easy maintenance.

[0057] V. Static Electricity Elimination and Self-Cleaning

[0058] The static elimination brush inside the ventilation hole 211 adsorbs static electricity inside the cabinet; the cleaning brush 221 on the top of the air-liquid mixing heat dissipation arm 22 cleans dust from the processor surface during the swinging process to prevent local overheating.

[0059] Example 1: Heat dissipation of standard racks in small and medium-sized data centers

[0060] Application scenarios

[0061] The data center of a small to medium-sized Internet company has a rack power density of 8kW / rack, uses standard 42U racks, and deploys multiple servers inside. The processor load varies, with some areas having higher load and others having lower load.

[0062] Equipment Configuration

[0063] Lifting drive assembly: A servo motor 11 with a rated power of 200W is selected, paired with a screw 111 with a diameter of 20mm and a corresponding screw sleeve 112. The fixing frame 12 is made of high-strength aluminum alloy to ensure stable support for the sliding mounting plate 2 and its heat dissipation mechanism.

[0064] Torsional oscillation drive assembly: Stepper motor 25 has a power of 100W, drive disk 251 has a diameter of 100mm, actuation column 252 has a diameter of 10mm, drive frame 253 is designed as a rectangular frame with a length of 150mm and a width of 50mm according to the swing amplitude requirements, and rack 254 has a module of 2 and a length of 200mm.

[0065] Cooling arms: Both the water-cooled cooling arm 21 and the air-liquid mixed cooling arm 22 use copper heat-conducting coils 222 with a diameter of 8mm. The cooling arm is 400mm long and 100mm wide. The ventilation holes 211 are 5mm in diameter and are evenly distributed on the surface of the cooling arm. The cleaning brush 221 is made of soft nylon and has the same length as the width of the cooling arm.

[0066] Air-liquid circulation mechanism: The cooling water tank 3 has a volume of 50L and is made of stainless steel. The sealing cover 301 is sealed with a rubber sealing ring between itself and the water tank. The cooling fan 302 has a power of 150W and an air volume of 1000m³ / h. The air collector shroud 3021 has a diameter of 200mm. The cooling air supply duct 3022 has a diameter of 80mm and a length of 3m. The air supply hose 30221 has the same diameter as the cooling air supply duct, and its length is adjusted according to the internal layout of the cabinet. The semiconductor cooling chip 303 has a cooling power of 500W. The variable frequency speed control water pump 304 has a flow range of 5-20L / min and a head of 5m.

[0067] Work process

[0068] After the data center is started, the servo motor 11 drives the screw 111 to rotate according to the preset program, so that the sliding mounting plate 2 moves to the middle position of the rack to initially match the overall heat dissipation requirements;

[0069] Stepper motor 25 starts working, driving rack 254 to reciprocate through drive disk 251, toggle column 252 and other components, thereby causing water-cooled heat dissipation arm 21 and air-liquid mixing heat dissipation arm 22 to swing at a swing amplitude of 30° and a frequency of 10 times per minute, thereby expanding the heat dissipation area.

[0070] According to the heat dissipation requirements, the variable frequency speed control water pump 304 delivers the coolant in the heat dissipation tank 3 to the cooling coil 222 of the heat dissipation arm at a flow rate of 10L / min. At the same time, the cooling fan 302 compresses the outside air and sends it into the cooling air supply pipe 3022 through the air collector 3021. The cold air is cooled to 15°C by the semiconductor cooling chip 303 in the pipe and then delivered to the inside of the heat dissipation arm to work with the coolant to dissipate heat from the processor.

[0071] During operation, the static elimination brush inside the ventilation hole 211 continuously adsorbs static electricity inside the cabinet, and the cleaning brush 221 on the top of the air-liquid mixing heat dissipation arm 22 cleans the dust on the processor surface during the swinging process. When the processor temperature in a certain area is detected to rise, the servo motor 11 drives the sliding mounting plate 2 to move towards that area, reducing the height of the heat dissipation arm to enhance the local heat dissipation intensity.

[0072] Example 2: Heat dissipation in high-density computing areas of large data centers

[0073] Application scenarios

[0074] In the high-density computing area of ​​a large financial data center, the power density of the racks reaches 20kW / rack. Customized 48U racks are used, and a large number of high-performance servers are deployed inside. The processor load is extremely high, and the requirements for heat dissipation efficiency and stability are extremely strict.

[0075] Equipment Configuration

[0076] Lifting drive assembly: Servo motor 11 has a rated power of 500W, screw 111 has a diameter of 30mm, screw sleeve 112 matches screw 111, and fixing frame 12 is made of carbon fiber reinforced composite material to reduce weight and increase strength.

[0077] Torsional oscillation drive assembly: Stepper motor 25 has a power of 200W, drive disk 251 has a diameter of 150mm, toggle post 252 has a diameter of 15mm, drive frame 253 is a rectangular frame with a length of 250mm and a width of 80mm, and rack 254 has a module of 3 and a length of 300mm.

[0078] Heat dissipation arm: The heat dissipation arm is made of copper alloy. The diameter of the cooling coil 222 is 10mm. The length of the heat dissipation arm is 500mm and the width is 150mm. The diameter of the ventilation hole 211 is 8mm. The cleaning brush 221 is made of microfiber material to improve the cleaning effect.

[0079] Air-liquid circulation mechanism: The cooling water tank 3 has a volume of 100L and is made of titanium alloy to ensure corrosion resistance. The cooling fan 302 has a power of 300W and an air volume of 2000m³ / h. The air collector shroud 3021 has a diameter of 300mm. The cooling air supply duct 3022 has a diameter of 100mm and a length of 5m. The air supply hose 30221 has the same diameter as the cooling air supply duct, and its length is adjusted according to the rack layout. The semiconductor cooling chip 303 has a cooling power of 1000W. The variable frequency speed control water pump 304 has a flow range of 10-30L / min and a head of 8m.

[0080] Work process

[0081] Before the data center is started, servo motor 11 drives sliding mounting plate 2 to move to the bottom of the rack to provide close-range heat dissipation support for high-power processors;

[0082] Stepper motor 25 drives the heat dissipation arm to swing at a frequency of 15 times per minute with a swing amplitude of 45°, which quickly expands the heat dissipation range. Variable frequency speed water pump 304 delivers coolant at a flow rate of 20L / min. Cooling fan 302 cools the air to 10°C and then delivers it to the inside of the heat dissipation arm to achieve efficient heat dissipation.

[0083] The system monitors the processor temperature in real time through a temperature sensor. When the temperature exceeds the set threshold, the semiconductor cooling chip 303 automatically increases the cooling power, the variable frequency speed control water pump 304 increases the flow rate to 25L / min, and the servo motor 11 finely adjusts the position of the sliding mounting plate 2 to ensure that the processor temperature is stable within a safe range.

[0084] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0085] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A variable-pressure circulating air-liquid co-source heat dissipation device for data centers, characterized in that: Includes installation components, housed inside the data center rack; The lifting and cooling circulation mechanism is installed on the mounting component and is used to lift and change the cooling position. The air-liquid circulation mechanism is located above the lifting and cooling circulation mechanism and is used to circulate and supply cold air and cool liquid to the heat dissipation components. The mounting assembly includes a base (1), a slide bar (101), and a fixing lug (102). The slide bar (101) is fixedly mounted on both sides of the top of the base (1), and the fixing lug (102) is fixedly mounted on the top of the slide bar (101). The base (1) is mounted on the bottom of the data center cabinet. The lifting and cooling circulation mechanism includes a sliding mounting plate (2), a lifting drive assembly, a torsion swing drive assembly, a water-cooled cooling arm (21), a wind-liquid mixing cooling arm (22), a gear one (23), a linkage sleeve one (231), a gear two (24), a linkage sleeve two (244), and a lifting and swinging alternating assembly. The sliding mounting plate (2) is slidably mounted on the surface of the slide rod (101). The lifting drive assembly is located at the center of the top of the base (1) and is used to drive the sliding mounting plate (2) to adjust its height. The torsion swing drive assembly is located at the center of the top of the sliding mounting plate (2) and is used to drive the water-cooled cooling arm (21) and the wind-liquid mixing cooling arm (22) to swing on the sliding mounting plate (2). The linkage sleeve one (231) is fixedly mounted on the side of the top of the water-cooled cooling arm (21) near the sliding mounting plate (2). The gear one (23) A linkage sleeve (244) is fixedly installed on the surface of the linkage sleeve one (231) and located on the top of the sliding mounting plate (2). The top of the air-liquid mixing heat dissipation arm (22) is fixedly installed on the side of the sliding mounting plate (2). The gear two (24) is longitudinally slidably installed on the top of the surface of the linkage sleeve two (244). The interior of the water-cooled heat dissipation arm (21) and the air-liquid mixing heat dissipation arm (22) are both provided with a cooling coil (222). The water-cooled heat dissipation arm (21) is rotatably engaged with one side of the top of the sliding mounting plate (2) through the linkage sleeve one (231). The air-liquid mixing heat dissipation arm (22) is rotatably engaged with the other side of the top of the sliding mounting plate (2) through the linkage sleeve two (244). The lifting and swinging interleaved component is located on the side of the top of the sliding mounting plate (2) near the gear two (24) and is used to drive the linkage sleeve two (244) to lift and change the longitudinal position.

2. The variable-pressure circulating air-liquid co-source heat dissipation device for data centers according to claim 1, characterized in that: The lifting drive assembly includes a servo motor (11), a fixed frame (12), a screw (111), and a screw sleeve (112). The fixed frame (12) is fixedly installed at the top center of the base (1). The servo motor (11) is fixedly installed at the bottom of the fixed frame (12). The bottom of the screw (111) passes through the fixed frame (12) and is fixedly installed with the output end of the servo motor (11). The screw sleeve (112) is threadedly connected to the surface of the screw (111). The top of the screw sleeve (112) is fixedly installed with the bottom of the sliding mounting plate (2).

3. The variable-pressure circulating air-liquid co-source heat dissipation device for data centers according to claim 1, characterized in that: The torsional oscillation drive assembly includes a stepper motor (25), a drive disk (251), a toggle post (252), a drive frame (253), and a rack (254). The stepper motor (25) is fixedly installed at the center of the bottom of the sliding mounting plate (2). The output end of the stepper motor (25) passes through the sliding mounting plate (2) and extends to the top of the sliding mounting plate (2) and is fixedly connected to the drive disk (251). The toggle post (252) is fixedly installed on the top of the drive disk (251) near the drive frame (253). The drive frame (253) has a sliding groove inside that slides with the toggle post (252). The rack (254) is fixedly installed at both ends of the drive frame (253) and meshes with gear one (23) and gear two (24). Guide units are fixedly installed on both sides of the bottom of the drive frame (253).

4. The variable-pressure circulating air-liquid co-source heat dissipation device for data centers according to claim 1, characterized in that: The lifting and swinging alternating assembly includes an electromagnetic push rod (242), a lifting plate (241), a limiting ring (243), a limiting plate (245), and a limiting slide column (246). The electromagnetic push rod (242) is fixedly installed on the back of the limiting plate (245). The limiting plate (245) is fixedly installed on the rear side of the top of the sliding mounting plate (2) near the gear two (24). The lifting plate (241) is fixedly installed on the output end of the electromagnetic push rod (242). The lifting plate (241) is rotatably sleeved on the limiting ring. The surface of the ring (243) is fixedly installed on the top of the surface of the linkage sleeve two (244). The limiting slide (246) is fixedly installed on both sides of the bottom of the lifting plate (241) near the limiting plate (245) and slides with the limiting plate (245). The surface of the linkage sleeve two (244) is fitted with a spring (247). The top of the spring (247) contacts the bottom of the limiting ring (243), and the bottom of the spring (247) contacts the top of the gear two (24).

5. A variable-pressure circulating air-liquid co-source heat dissipation device for data centers according to claim 3, characterized in that: The guide unit includes a limiting slide (2531) and a limiting slider (2532). The limiting slide (2531) is fixedly installed on both sides of the top of the sliding mounting plate (2), and the limiting slider (2532) is fixedly installed on both sides of the bottom of the drive frame (253) and slides in cooperation with the limiting slide (2531).

6. A variable-pressure circulating air-liquid co-source heat dissipation device for data centers according to claim 1, characterized in that: The air-liquid circulation mechanism includes a heat dissipation tank (3), a sealing cover (301), a cooling fan (302), an air collector (3021), a cooling air duct (3022), an air supply hose (30221), a semiconductor cooling chip (303), a variable frequency speed control water pump (304), a return water tee connector (3041), and a water supply tee connector (3042). The heat dissipation tank (3) is located on the top of the screw (111) and is fixedly installed on both sides with the fixing ears (102). The bottom of the heat dissipation tank (3) The top of the screw (111) rotates and engages with the cooling fan (302). Two sets of cooling fans (302) are provided and symmetrically installed on both sides of the top of the cooling water tank (3). The sealing cover (301) is threaded to the center of the top of the cooling water tank (3). The semiconductor cooling chip (303) is fixedly installed at the center of the back of the cooling water tank (3). The air collector (3021) is fixedly connected to the front of the cooling fan (302). One end of the cooling air duct (3022) is connected to the air collector (3021). The other end extends from top to bottom through the heat dissipation tank (3) and to the bottom of the heat dissipation tank (3), and is connected to the water-cooled heat dissipation arm (21) and the air-liquid mixing heat dissipation arm (22) via a flexible hose. The part of the cooling air supply pipe (3022) inside the heat dissipation tank (3) is made of a cooling material. The variable frequency speed control water pump (304) is fixedly installed at the center of the bottom of the inner wall of the heat dissipation tank (3). The output end of the variable frequency speed control water pump (304) extends through the heat dissipation tank (3) and to the bottom of the heat dissipation tank (3) and is connected to the water-cooled heat dissipation arm (21) and the air-liquid mixing heat dissipation arm (22) via a flexible hose. The water supply tee connector (3042) is connected to the other two ends of the water supply tee connector (3042) and the cooling coil (222) inside the water cooling heat dissipation arm (21) and the air-liquid mixing heat dissipation arm (22) respectively through hoses. The bottom of the heat dissipation tank (3) is connected to the return water tee connector (3041) through hoses. The other two ends of the return water tee connector (3041) are connected to one end of the cooling coil (222) inside the water cooling heat dissipation arm (21) and the air-liquid mixing heat dissipation arm (22) through hoses.

7. A variable-pressure circulating air-liquid co-source heat dissipation device for data centers according to claim 6, characterized in that: The top of both the water-cooled heat dissipation arm (21) and the air-liquid mixing heat dissipation arm (22) is provided with ventilation holes (211). The ventilation holes (211) are provided with several sets and are used in conjunction with the bottom hose of the cooling air supply pipe (3022) for air cooling. Several sets of cleaning brushes (221) are fixedly installed on the top of the air-liquid mixing heat dissipation arm (22).

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