Enhanced control using AI in device with IR camera heat detection system

Abstract

A method for joining an electronic component to an electronic substrate in an apparatus, the method comprising: (1) transporting the electronic substrate through a chamber housing, the chamber housing comprising a channel extending through a plurality of processing zones; (2) detecting a temperature of an electronic substrate passing near a heat detection system, the heat detection system including at least one temperature sensor coupled to the chamber housing; (3) receiving temperature data from the heat detection system by a controller coupled to the plurality of processing zones, the transfer mechanism, and the heat detection system; (4) determining, by the controller, an adjustment to at least one of (a) a heat setting of a heating element within the chamber housing, (b) a speed of the transfer mechanism, and (c) an operating speed of a blower within the chamber housing with reference to the detected temperatures of the electronic substrates; and (5) performing the determined adjustment.

Description

Background of the Invention 1. Technical Field The present application relates generally to surface mounting electronic components onto printed circuit boards using an assembly process such as a reflow process, a wave soldering process, and / or a selective soldering process, and more particularly to an apparatus designed to control heat applied to the printed circuit board during the assembly process. 2. Background Technology In the fabrication of printed circuit boards, electronic components are typically surface-mounted to the bare circuit board using a process known as "reflow soldering." In a typical reflow soldering process, a pattern of solder paste is deposited on the circuit board, and then the leads of one or more electronic components are inserted into the deposited solder paste. The circuit board is then conveyed through an oven where the solder paste reflows (i.e., is heated to a melting or reflow temperature) in a heated zone and then cools in a cooling zone to electrically and mechanically connect the leads of the electronic components to the circuit board. As used herein, the term "circuit board" or "printed circuit board" includes any type of substrate assembly having electronic components, including, for example, a wafer substrate.

[0002] As mentioned above, current reflow ovens have a heating chamber and a cooling chamber. In order to achieve a consistent reflow process profile, the heat applied to the electronic components and circuit boards is precisely controlled to ensure proper mechanical and electrical connections between the electronic components and the circuit boards.

[0003] Furthermore, in the fabrication of printed circuit boards (PCBs), electronic components can be mounted to the boards using a process known as wave soldering. In a typical wave soldering machine, a conveyor mechanism moves the boards along an inclined path, passing through an upper fluxing station, a preheating station, and finally to the wave soldering station. At the wave soldering station, a wave of solder (using a pump) is forced upward through a wave soldering nozzle and into contact with the sections of the PCB to be soldered. Like reflow ovens, wave soldering machines (and selective soldering machines) require precise control of heat in each zone to ensure proper mechanical and electrical connection between the electronic components and the PCB.

[0004] For reflow ovens and wave (and selective) soldering machines, controlling heat in each zone of the equipment is crucial for achieving optimal performance. For example, unwanted temperature variations can cause circuit board warping and unreliable connections between electronic components and the board. Summary of the Invention

[0005] One aspect of the present disclosure relates to a reflow oven configured to attach electronic components to electronic substrates. In one embodiment, the reflow oven includes: a chamber housing including a passage extending through a plurality of processing zones; a conveyor mechanism configured to transport the electronic substrate through the plurality of processing zones in the passage; and a heat detection system including at least one temperature sensor coupled to the chamber housing. The at least one temperature sensor is configured to detect a temperature of the electronic substrate passing near the at least one temperature sensor. The reflow oven further includes a controller coupled to the plurality of processing zones, the conveyor mechanism, and the heat detection system. The controller is configured to receive temperature data from the heat detection system.

[0006] Embodiments of the reflow oven may further include at least one temperature sensor comprising at least one sensor assembly. The at least one sensor assembly may include a support structure, a support bracket coupled to the support structure, and an IR camera secured to the support bracket. The support structure may include a shield mounted on a mounting plate. The shield may be configured to surround an opening in the roof of the tunnel to enable the IR camera to sense the temperature of the tunnel. The support bracket may include a port for connection to an inert gas source. The support bracket may include a glass cover to protect the IR camera. The support bracket may be configured to mount the IR camera on the roof of the tunnel at a desired height and orientation to achieve a full field of view. The at least one sensor assembly may include multiple IR cameras to measure two or more separate locations within selected locations within the tunnel. The thermal detection system may be configured with a controller to use the sensor assembly to provide closed-loop control of the processing zone temperatures of the multiple processing zones. The at least one sensor assembly may be configured to obtain temperature data at specific electronic substrate height locations and within certain processing zones of the reflow oven. The temperature data may be used to provide traceability of the electronic substrates, wherein data regarding the specific electronic substrates is provided on a display associated with the controller. The temperature data can be used to find hot spots / heights within the reflow oven. The temperature data can be used to optimize the performance of the reflow oven, and / or provide downstream input for processing equipment, and / or determine the start and end times of a scan performed by the at least one sensor assembly on the electronic substrate, and / or generate electronic substrate curves above and below the electronic substrate. The closed-loop control can include controlling the speed of the conveyor mechanism in the multiple processing zones. Each of the electronic substrates can include a barcode scanned by a barcode scanner. The controller can be configured to implement a scanning mode for measuring the temperature of components of the electronic substrates as the electronic substrates travel through the reflow oven on the conveyor mechanism.

[0007] Another aspect of the present disclosure relates to a method for bonding electronic components to electronic substrates in a reflow oven. In one embodiment, the method includes: conveying the electronic substrate through a chamber housing including a passageway extending through a plurality of processing zones; detecting a temperature of the electronic substrate passing near a thermal detection system including at least one temperature sensor coupled to the chamber housing; and receiving temperature data from the thermal detection system via a controller coupled to the plurality of processing zones, the conveyor mechanism, and the thermal detection system.

[0008] Embodiments of the method may further include scanning a barcode associated with each substrate with a barcode scanner, and / or controlling the reflow oven to implement a scanning mode to measure the temperature of components of the electronic substrate as the electronic substrate travels through the reflow oven on a conveyor mechanism. The heat detection system may be configured with a controller to use the sensor assembly to provide closed-loop control of the processing zone temperatures of the multiple processing zones. The at least one sensor assembly may be configured to obtain temperature data at specific electronic substrate height positions and within certain processing zones of the reflow oven. The temperature data may be used to provide traceability of the electronic substrates, wherein data regarding specific electronic substrates is provided on a display associated with the controller. The temperature data may be used to locate hot spots / heights within the reflow oven. The temperature data may be used to optimize the performance of the reflow oven, and / or provide downstream input to processing equipment, and / or determine the start and end times of scans performed by the at least one sensor assembly on the electronic substrate, and / or generate electronic substrate profiles above and below the electronic substrate. The closed-loop control may include controlling the speed of the conveyor mechanism within the multiple processing zones. The method may further include scanning a barcode associated with each substrate with a barcode scanner. The method may further include controlling the reflow oven to implement a scanning mode to measure the temperature of components of the electronic substrate as the electronic substrate travels through the reflow oven on the conveyor mechanism.

[0009] Yet another aspect of the present disclosure relates to a wave soldering machine or selective soldering machine configured to attach electronic components to electronic substrates. In one embodiment, a reflow oven includes: a chamber housing including a passage extending through a plurality of processing zones; a conveyor mechanism configured to transport electronic substrates in the passage through the plurality of processing zones; and a heat detection system including at least one temperature sensor coupled to the chamber housing. The at least one temperature sensor is configured to detect the temperature of electronic substrates passing near the at least one temperature sensor. The wave soldering machine or selective soldering machine further includes a controller coupled to the plurality of processing zones, the conveyor mechanism, and the heat detection system. The controller is configured to receive temperature data from the heat detection system. The at least one temperature sensor may include at least one sensor assembly. The at least one sensor assembly may include a support structure, a support bracket coupled to the support structure, and an IR camera secured to the support bracket. The support structure may include a mounting plate positioned on a top of the passage and a shield mounted to the mounting plate. The shield may be configured to surround an opening in the mounting plate to enable the IR camera to sense the temperature of the passage. The support bracket may include a port for connecting to an inert gas source. The support bracket may include a glass cover to protect the IR camera. The support bracket may be configured to mount the IR camera at a desired height and orientation on the top of the tunnel to achieve a full field of view. The at least one sensor assembly may include multiple IR cameras to measure two or more separate locations within selected locations within the tunnel. The heat detection system may be configured with a controller to use the at least one sensor assembly to provide closed-loop control of the processing zone temperatures of the multiple processing zones. The at least one sensor assembly may be configured to obtain temperature data at specific electronic substrate height positions and within certain processing zones of the reflow oven. The temperature data can be used to provide traceability of electronic substrates, wherein data regarding specific electronic substrates is provided on a display associated with the controller. The temperature data can be used to locate hot spots / heights within a wave soldering machine or selective soldering machine. The temperature data can be used to optimize the performance of the wave soldering machine or selective soldering machine, and / or provide downstream input to processing equipment, and / or determine the start and end times of scans performed by the at least one sensor assembly on the electronic substrate, and / or generate electronic substrate profiles above and below the electronic substrate. The closed-loop control can include controlling a speed of the conveyor mechanism within the plurality of processing zones. The electronic substrates can each include a barcode that is scanned by a barcode scanner. The controller can be configured to implement a scanning mode to measure the temperature of components of the electronic substrates as the electronic substrates travel on the conveyor mechanism through a wave soldering machine or a selective soldering machine.

[0010] Another aspect of the present disclosure relates to a method for bonding electronic components to electronic substrates in a wave soldering machine or a selective soldering machine. In one embodiment, the method includes: conveying the electronic substrate through a chamber housing including a passageway extending through a plurality of processing zones; detecting the temperature of the electronic substrate passing near a thermal detection system including at least one temperature sensor coupled to the chamber housing; and receiving temperature data from the thermal detection system via a controller coupled to the plurality of processing zones, the conveyor mechanism, and the thermal detection system.

[0011] Embodiments of the method may further include scanning a barcode associated with each substrate with a barcode scanner, and / or controlling the machine to implement a scanning mode that measures the temperature of components of the electronic substrate as the electronic substrate travels through the machine on a conveyor mechanism. The heat detection system may be configured with a controller to use the sensor assembly to provide closed-loop control of the zone temperatures of the multiple processing zones. The at least one sensor assembly may be configured to obtain temperature data at specific electronic substrate height positions and within certain processing zones of the machine. The temperature data may be used to provide traceability of the electronic substrate, wherein data regarding a specific electronic substrate is provided on a display associated with the controller. The temperature data may be used to locate hot spots / heights within the machine. The temperature data may be used to optimize the performance of the machine, and / or provide downstream input to processing equipment, and / or determine the start and end times of scans performed by the at least one sensor assembly on the electronic substrate, and / or generate electronic substrate profiles above and below the electronic substrate. The closed-loop control may include controlling the speed of the conveyor mechanism within the multiple processing zones.

[0012] Another aspect of the present disclosure relates to an apparatus configured to attach electronic components to electronic substrates. In one embodiment, the apparatus includes a chamber housing including a passage extending through a plurality of processing zones; a conveyor mechanism configured to transport the electronic substrate through the plurality of processing zones in the passage; and a thermal detection system including at least one temperature sensor coupled to the chamber housing. The at least one temperature sensor is configured to detect a temperature of the electronic substrate passing near the at least one temperature sensor. The apparatus further includes a controller coupled to the plurality of processing zones, the conveyor mechanism, and the thermal detection system. The controller is configured to receive temperature data from the thermal detection system.

[0013] Another aspect of the present disclosure relates to a method for attaching electronic components to electronic substrates in an apparatus. In one embodiment, the method includes: conveying the electronic substrate through a chamber housing including a passageway extending through a plurality of processing zones; detecting the temperature of the electronic substrate passing near a thermal detection system including at least one temperature sensor coupled to the chamber housing; and receiving temperature data from the thermal detection system via a controller coupled to the plurality of processing zones, the conveyor mechanism, and the thermal detection system.

[0014] Another aspect of the present disclosure relates to a method for attaching electronic components to electronic substrates in an apparatus. In one embodiment, the method includes: (1) conveying the electronic substrate through a chamber housing including a passage extending through a plurality of processing zones; (2) detecting the temperature of the electronic substrate passing near a heat detection system, the heat detection system including at least one temperature sensor coupled to the chamber housing; (3) receiving temperature data from the heat detection system via a controller coupled to the plurality of processing zones, the conveyor mechanism, and the heat detection system; (4) determining, by the controller, an adjustment to at least one of: (a) a heat setting of a heating element within the chamber housing, (b) a speed of the conveyor mechanism, and (c) an operating speed of a blower within the chamber housing with reference to the detected temperatures of the electronic substrates; and (5) executing the determined adjustment. Yet another aspect of the present disclosure relates to a corresponding apparatus. Yet another aspect of the present disclosure relates to a corresponding computer program product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is shown in various figures is represented by a like reference numeral. For clarity, not every component in every figure may be labeled. In the drawings: Figure 1 is a perspective view of a reflow oven according to an embodiment of the present disclosure; Figure 2 yes Figure 1 Schematic diagram of a reflow oven shown; Figure 3 is a perspective view of a portion of a reflow oven illustrating a heat detection system according to an embodiment of the present disclosure; Figure 4 yes Figure 3 A perspective view of the IR camera assembly of the thermal detection system is shown; Figure 5 is a perspective view of an IR camera assembly mounted on a top wall of a tunnel of a reflow oven; Figure 6is a perspective view of an IR camera mounted on a stage of another embodiment of a thermal detection system; Figure 7 is a schematic diagram of a wave soldering machine according to an embodiment of the present disclosure; Figure 8 is a side view of a wave soldering machine with the outer cover removed to expose the internal components of the wave soldering machine; Figure 9 is a perspective view of an IR camera assembly of a heat detection system associated with a wave soldering machine; Figure 10 yes Figure 9 A perspective view of the IR camera assembly is shown; Figure 11 are block diagrams depicting systems, devices, computer program products, and associated data structures according to various embodiments of the present disclosure; and Figure 12 is a flowchart depicting a method according to various embodiments of the present disclosure. DETAILED DESCRIPTION

[0016] Solder paste is commonly used when assembling printed circuit boards (PCBs), where it is used to connect electronic components to the circuit board. Solder paste consists of a solder material used to form solder joints and a flux material used to prepare the metal surface for solder attachment. Solder paste can be deposited onto metal surfaces (e.g., electronic pads) on the circuit board using any number of application methods. In one example, a stencil printer can use a doctor blade to force solder paste through a metal stencil placed on the exposed circuit board surface. In another example, a dispenser can dispense solder paste material onto specific areas of the circuit board. The leads of the electronic components are aligned with the solder deposits and pressed into them to form the assembly. During the reflow soldering process, the solder is then heated to a temperature sufficient to melt the solder and then cooled to permanently electrically and mechanically connect the electronic components to the circuit board. The solder typically comprises an alloy with a melting temperature lower than that of the metal surfaces to be joined. The temperature must also be low enough not to damage the electronic components. In some embodiments, the solder can be a tin-lead alloy. However, lead-free solders can also be used.

[0017] Temperature control is crucial for soldering processes. In one embodiment of the present disclosure, a heat detection system with several infrared (IR) cameras is used to accurately measure the temperature of circuit boards at strategic locations within a reflow oven. Information obtained from the heat detection system's IR cameras can be used to provide closed-loop control of the reflow oven to ensure proper connection between electronic components and circuit boards. Other types of temperature measurement devices can be used in place of IR cameras. For example, a laser temperature sensor can be used as part of the heat detection system. Furthermore, the techniques described herein can be used with other types of circuit board processing equipment, such as wave soldering machines and selective soldering machines, to achieve better temperature control.

[0018] For illustrative purposes only and not to limit its generality, the present disclosure will now be described in detail with reference to the accompanying drawings. The present disclosure is not limited to the construction and arrangement details of the components set forth in the following description or shown in the accompanying drawings. The principles set forth in the present disclosure can be used for other embodiments and can be practiced or executed in various ways. Likewise, the words and terms used herein are for descriptive purposes and should not be considered as limiting. The use of "comprises," "comprising," "having," "containing," "involving," and variations thereof herein is intended to encompass the items listed thereafter and their equivalents as well as other items.

[0019] reflow oven During the reflow process, printed circuit boards are heated according to a predefined temperature profile for approximately 3-5 minutes. The complete assembly (including circuit board material, components, and solder paste) should reach the minimum reflow temperature but should not overheat. Overheating can damage components and cause soldering defects. To achieve this heating profile, reflow ovens include multiple heating and cooling zones. These zones direct hot or cold air toward the circuit boards. The air temperature set points in these zones, combined with the conveyor speed, define the final heating profile of the circuit board assembly.

[0020] To ensure the reflow oven is operating correctly, printed circuit boards are fitted with thermocouples to record the temperature of the board over time. Thermocouples are placed at the coldest and hottest locations of the board assembly, as well as on critical components, to ensure that they do not overheat. The oven contains controls and thermal probes to maintain the temperatures of these zones within acceptable limits, once set points and conveyor speeds are determined to be within acceptable specifications. During production, boards fitted with thermocouples can be passed through the reflow oven to ensure that all predefined conditions remain within acceptable specifications. A drawback of existing process controls is that the board assembly is not temperature-controlled during the reflow process. Inspection of the board's components and solder joints occurs after soldering; however, there is no inspection while the board is heating.

[0021] Existing process controls are designed to maintain temperatures and conditions within specifications for each zone using thermal probes that measure gas temperature but not the actual temperature on the circuit board assembly. Thermal profile control hardware is now available, along with software tools to help define, measure, monitor, and improve thermal processes for electronics manufacturing services. These systems are making reflow ovens smarter and reducing defects due to better process control. Intelligent software will modify oven settings as needed to ensure consistent board temperature and solder joint quality.

[0022] Although reflow ovens have intelligent systems and process controls, there is no way to verify the actual temperature of the circuit board assembly during soldering. The implementation of a thermal detection system that can obtain a thermal image of the circuit board assembly during reflow adds value to process control in preventing component damage and reducing soldering defects.

[0023] Embodiments of the present disclosure relate to a thermal detection system having several IR camera assemblies strategically positioned within a reflow oven to achieve closed-loop temperature control of the oven. In one embodiment, the lens of the IR camera assembly is kept clean to enable accurate temperature images to be produced. The IR camera assembly includes a special chamber located in front of the lens into which nitrogen is purged to create an overpressure, thereby preventing gases contaminated by flux from condensing on the lens. Another method disclosed herein for maintaining a clean lens from the effects of flux residues is to provide a transparent foil in front of the lens on a reel system. Once the foil becomes dirty, the reel rotates to provide a new, clean piece of transparent foil. Additionally, the reflow oven may include a catalyst to clean the gases in these zones.

[0024] Embodiments of thermal inspection systems include the use of thermal imaging as part of a closed-loop system for controlling the reflow process. Data from the thermal imaging is integrated into the reflow oven's intelligent control system. The camera can be a 3D thermal camera or a conventional 2D camera. The generated data (temperatures of different zones, components, solder paste, and circuit board materials) can be used for traceability and corrective actions. The reflow process can have multiple cameras. A thermal image scan is a snapshot of the reflow process. However, when multiple cameras are installed, a collection of snapshots can be used to calculate important process parameters such as peak temperature and time above liquidus. This data can be correlated with defect levels, and preventive actions can be sent to the printer, dispenser, or pick-and-place machine to make necessary modifications.

[0025] Image scanning can also signal deviations, and the reflow oven can react accordingly. If the temperature is too low or too high, various actions can be taken, such as changing the conveyor speed or adjusting the fan speed of one or more heating zones to increase or decrease heat transfer. Other methods of making temperature corrections include temporarily stopping the board from warming or pushing the board through a zone to achieve a shorter heating time if it's overheated. These minor corrections require free space between boards. If the board is too cold, IR lamps can be installed in the zone behind the scanner to heat specific boards more quickly to a certain specification. The oven conveyor's tracking system should track the board's position within the reflow oven so that scanning can be performed at the correct moment. Typically, the conveyor has an encoder or other device that controls the speed of the board and defines its position. In one embodiment, additional sensors can be installed near the scanner to locate the board. The boards can also be configured with barcodes, RFID tags, or some other type of identification for traceability.

[0026] Embodiments of the thermal inspection system are configured to obtain image scans to demonstrate component alignment during the reflow process and analyze component movement defects. For example, if multiple scanners are present in a reflow oven, the position to which a component moves within the oven can be defined, which can help prevent such defects. Further actions can include replacing fans or reducing fan speeds in specific zones of the oven.

[0027] Embodiments of the thermal detection system are further configured to obtain a temperature profile of the circuit board at strategic points within the reflow oven. This provides more accurate control than thermocouple profiles that only track the temperature of the return probe. The probe's location may not be the most critical point on the circuit board assembly; the thermocouple attachment is secondarily critical. Thermocouples may become loose after a certain number of runs; however, if the lens is kept clean, the IR camera remains accurate over time and is not limited by the number of samples.

[0028] Figure 1 An embodiment of an exemplary reflow soldering apparatus for soldering circuit board assemblies is shown. Such apparatus is sometimes referred to as a reflow oven or reflow soldering oven in the field of printed circuit board fabrication and assembly. Figure 1The reflow oven chamber 12 (indicated generally at 10) includes a reflow oven chamber 12 in the form of an insulated tunnel that defines a passageway for preheating, reflowing, and then cooling solder on a circuit board passing therethrough. The reflow oven chamber 12 extends across a plurality of heating zones, including, in one example, three preheating zones 14, 16, and 18, followed by three soaking zones 20, 22, and 24, each of which includes a top heater 26 and a bottom heater 28. For example, the soaking zones 20, 22, and 24 are followed by four peak zones 30, 32, 34, and 36, each of which also includes heaters 26 and 28. Finally, the peak zones 30, 32, 34, and 36 are followed by three cooling zones 38, 40, and 42. Other reflow oven configurations may be provided.

[0029] The circuit board assembly 44 including the deposited solder paste and electronic components is transported on a constant speed conveyor (at Figure 1 indicated by dashed line 46) on the way (e.g., Figure 1 Each zone of the insulated reflow oven chamber 12 (shown from left to right in the center) is configured to achieve controlled and gradual preheating, reflow, and post-reflow cooling of the circuit board assembly. It should be understood that the fixed-speed conveyor mechanism 46 can be divided between these zones and implemented as a variable-speed conveyor mechanism. In the preliminary preheat zones 14, 16, and 18, the circuit board assembly is heated from ambient temperature to the flux activation temperature, which can range from approximately 130°C to approximately 150°C for lead-based solders and higher for lead-free solders.

[0030] In soaking zones 20, 22, and 24, temperature variations across the circuit board assembly stabilize, allowing time for the activated flux to clean component leads, electronic pads, and solder powder prior to reflow. Additionally, VOCs in the flux evaporate. The temperature in soaking zones 20, 22, and 24 is typically about 140°C to about 160°C for lead-based solders and higher for lead-free solders. In some embodiments, the circuit board assembly may spend about 30 to about 45 seconds passing through soaking zones 20, 22, and 24.

[0031] In the spike regions 30, 32, 34, 36, the temperature is rapidly raised to a temperature above the melting point of the solder to reflow the solder. The melting point of eutectic or near-eutectic tin-lead solder is approximately 183°C, with the reflow spike typically set to about 25°C to about 50°C above the melting point to exceed the paste range of the molten solder. For lead-based solders, the typical maximum temperature in the spike region is in the range of about 200°C to about 220°C. Temperatures above about 225°C may cause baking of the flux, damage to components, and / or sacrifice solder joint integrity. Temperatures below about 200°C may prevent the solder joints from fully reflowing. In one embodiment, the circuit board assembly is typically maintained at a temperature above the reflow temperature within the spike regions 30, 32, 34, 36 for about one minute.

[0032] Next, in the cooling zones 38 , 40 , 42 , the temperature is dropped below the reflow temperature and the circuit board assembly is cooled sufficiently to solidify the solder joints, thereby maintaining solder joint integrity before the circuit board assembly exits the reflow oven chamber 12 .

[0033] A flux extraction / filtration system (not shown) may be provided to remove contaminants from the gases generated by the reflow oven 10. In one embodiment, an input gas conduit may be connected to or between selected zones to provide fluid communication from the reflow oven chamber 12 to the flux extraction / filtration system. An output gas conduit may be connected to or between selected zones to provide fluid communication from the flux extraction / filtration system back to the reflow oven chamber 12. In operation, a vapor flow is drawn from the reflow oven chamber 12, passed through the input gas conduit, passed through the system, then passed through the output gas conduit, and returned to the reflow oven chamber. Similar configurations of the input gas conduit, the system, and the output gas conduit may be similarly positioned to draw vapor flow from other zones of the reflow oven 10 or between other zones.

[0034] The reflow oven 10 further includes a controller 50 for automating the operation of several stations of the reflow oven in a well-known manner, including, but not limited to, the top heater 26 and the bottom heater 28 associated with the preheat zones 14, 16, 18, the soak zones 20, 22, 24, the spike zones 30, 32, 34, 36, and the cool-down zones 38, 40, 42. As shown, the controller 50 may include a display 52 having a user interface through which an operator of the reflow oven 10 may control the operation of the machine.

[0035] In one embodiment, the controller 50 can be configured to use a personal computer with a suitable operating system (such as the Microsoft Windows® operating system provided by Microsoft Corporation) with application-specific software to control the operation of the reflow oven 10. The controller 50 can be networked with a main controller used to control the production line that manufactures circuit boards. As will be described in more detail below, the controller 50 can use the information obtained by the thermal detection system to optimize the performance of the reflow oven 10. This optimization can include eliminating warping and better and more reliable securing of electronic components to the circuit board assembly.

[0036] refer to Figure 3The reflow oven 10 includes a heat detection system, generally indicated at 60, configured to detect heat within the zones of the oven. In the illustrated embodiment, the heat detection system 60 includes several (e.g., three) sensor assemblies, such as IR camera assemblies, each generally indicated at 62. In this example, a first IR camera assembly 62a is located between zones 3 and 4 (preheat and soak zones) of the reflow oven 10, a second IR camera assembly 62b is located between zones 6 and 7 (soak and spike zones), and a third IR camera assembly 62c is located between zones 9 and 10 (spike and cool-down zones). It should be understood that the IR camera assemblies 62 can be deployed anywhere within the reflow oven 10 to optimize the oven's performance.

[0037] Each IR camera assembly 62 is strategically positioned to measure the temperature of the circuit board assembly 44 as it passes between these zones, thereby ensuring that the circuit board assembly is properly conditioned before being processed. The information obtained from each IR camera assembly 62 is communicated to the controller 50, which is configured to provide closed-loop processing for subsequent circuit board assemblies passing through the reflow oven 10.

[0038] Additional references Figure 4 and Figure 5 For reflow oven applications, each IR camera assembly 62 includes a shroud 64 mounted on a top wall 66 of the chamber 12 of the reflow oven 10. The shroud 64 is configured to extend through an opening formed in the top wall 66 of the chamber 12 so that the temperature of the passageway is sensed by the IR camera assembly 62. The support structure further includes a support bracket 68 mounted on the top of the shroud 64. The support bracket 68 includes a port 70 for connecting to a nitrogen (N2) source to provide an inert atmosphere within the shroud 64. The support bracket 68 further includes an input port 72 for connecting a sensor to the support bracket.

[0039] The IR camera assembly 62 further includes a temperature sensor embodying an IR camera 74, which is supported in an operating position by the support bracket 68. A cable 76 is secured to the input port 72 to connect the IR camera 74 to the controller 50. As described above, any type of temperature sensor can be used to measure the temperature of circuit board assemblies traveling within the tunnel (chamber 12) of the reflow oven 10. The IR camera 74 is configured to have a field of view through the shield 64 toward the tunnel (chamber 12) of the reflow oven 10. This arrangement allows the IR camera 74 of the IR camera assembly 62 to detect the temperature of circuit board assemblies traveling within the tunnel (chamber 12) of the reflow oven 10 and communicate this information to the controller 50. The data obtained from the thermal detection system 60 can be used for a variety of purposes, as will be described in more detail below.

[0040] refer to Figure 6An alternative embodiment of a sensor assembly is generally indicated at 80. As shown, the sensor assembly 80 includes a stage 82 and a temperature sensor embodying an IR camera 84, which is connected to the stage and the controller 50. This arrangement allows the stage 82 to be configured to move the IR camera 84 along the width of the tunnel (chamber 12) under the control of the controller 50 to obtain temperature data across the width of the printed circuit board assembly as it passes through the reflow oven 10. The sensor assembly 80 may further include a shield (not shown) to maintain the IR camera 84 in an inert (clean) atmosphere.

[0041] wave soldering machine The wave soldering process involves several steps. There's a top-fluxing step, in which the PCB assembly is cleaned by spraying flux onto the soldering side (bottom) of the PCB assembly. After the flux is applied, the PCB assembly is transported to a preheating unit. This preheating unit can be implemented using different concepts, such as convection or radiant heaters. Its purpose is to heat the PCB assembly to a predefined temperature, typically measured on the soldering destination side (top side). The flux is activated by the preheater, and the PCB assembly heats up, preventing the solder from solidifying before reaching the top side. The PCB assembly then enters the solder wave. The soldering process involves a heated solder bath maintained at the required soldering temperature. A solder wave is established within this bath, and the PCB assembly passes through the wave, with the bottom side of the PCB assembly contacting the wave.

[0042] The temperature of a circuit board assembly during preheating is typically measured using a pyrometer. This is usually done after the assembly passes through the last preheating unit and just before entering the solder wave station. However, the pyrometer's location is limited, resulting in data coverage for only a small area of ​​the entire circuit board.

[0043] An embodiment of a thermal inspection system having an IR camera is capable of scanning an entire printed circuit board assembly to obtain temperature data from the printed circuit board assembly.

[0044] For wave soldering machines after the final preheating unit, an embodiment of a heat detection system includes an IR camera. Data provided by the IR camera can be used for closed-loop process control. When the IR camera is mounted above the PCB assembly in the preheating unit, it can provide information to modify the unit's preheater so that subsequent boards reach a specified temperature before entering the wave soldering station. This ensures that the PCB assembly reaches the optimal temperature when soldered, minimizing the risk of defects. This data is recorded and combined with board identification methods (such as barcodes or RFID) to provide traceability related to defects that may occur during assembly or field failures.

[0045] refer to Figure 7 , an exemplary wave soldering machine, generally indicated at 100, is used to apply wave solder to printed circuit board assemblies. As described above, the wave soldering machine 100 is one of several machines in a printed circuit board fabrication / assembly line. As shown, the wave soldering machine 100 includes a housing or frame 102 adapted to house the components of the machine. This arrangement allows a conveyor mechanism 104 to deliver printed circuit board assemblies 44 to be processed by the wave soldering machine 100.

[0046] Upon entering the wave soldering machine 100, each circuit board assembly 44 travels along a conveyor mechanism 104 along an inclined path (e.g., six degrees relative to horizontal) through a channel 106 to condition the printed circuit board assembly for wave soldering. The channel includes an upper fluxing station, generally indicated at 108, and a preheating station, generally indicated at 110. Once the conditioning (i.e., heating) is complete, the circuit board assembly 44 travels along the conveyor mechanism 104 to a wave soldering station, generally indicated at 112, for solder to be applied to the printed circuit board assembly. A controller 114 is configured to automate the operation of several stations of the wave soldering machine 100 (including, but not limited to, the upper fluxing station 108, the preheating station 110, and the wave soldering station 112) in a well-known manner.

[0047] Like the controller 50 associated with the reflow oven 10, the controller 114 for the wave soldering machine 100 can be configured to use a personal computer with a suitable operating system (such as the Microsoft Windows® operating system provided by Microsoft Corporation) with application-specific software to control the operation of the wave soldering machine. The controller 114 can be networked with a main controller used to control the production line used to manufacture circuit boards. Similar to the reflow oven 10, the controller 114 can use information obtained from the thermal detection system to optimize the performance of the wave soldering machine 100. This optimization can include eliminating warping and better and more reliable securing of electronic components to the circuit board assembly.

[0048] refer to Figure 8The upper fluxing station 108 is configured to apply flux to the printed circuit board as it travels through the wave soldering machine 100 on the conveyor mechanism 104. The preheating station 110 includes several preheaters (e.g., preheaters 110a, 110b, and 110c) designed to incrementally increase the temperature of the printed circuit board assembly as it travels through the channel 106 along the conveyor mechanism 104, thereby preparing the printed circuit board assembly for the wave soldering process. The wave soldering station 112 includes a wave soldering nozzle assembly in fluid communication with a solder reservoir. A pump is positioned within the reservoir to transfer molten solder from the reservoir to the wave soldering nozzle assembly. Once soldering is complete, the printed circuit board assembly exits the wave soldering machine 100 via the conveyor mechanism 104 and arrives at another station (e.g., a pick-and-place machine) located on the production line.

[0049] In some embodiments, the wave soldering machine 100 may further include a flux management system, generally designated 116, to remove volatile contaminants from the channel 106 of the wave soldering machine. Figure 2 As shown, the flux management system 116 is positioned below the preheating station 110. In one embodiment, the flux management system 116 is supported by the housing 102 within the wave soldering machine 100 and is in fluid communication with the channel 106. Figure 2 The flux management system 116 is configured to receive contaminated gas from the channel 106, process the gas, and return clean gas to the channel. The flux management system 116 is particularly configured to remove volatile contaminants from the gas, especially under an inert atmosphere.

[0050] refer to Figure 9 and Figure 10 The wave soldering machine 100 includes a heat detection system configured to detect heat within zones of the machine, such as between the preheating station 110 and the wave soldering station 112. The heat detection system includes a sensor assembly that implements an IR camera assembly (generally indicated at 120) that is strategically positioned to measure the temperature of the circuit board assembly 44 as it passes between zones to ensure that the circuit board assembly is properly conditioned prior to processing. Information obtained from the IR camera assembly 120 is communicated to the controller 114, which is configured to provide closed-loop processing for subsequent circuit board assemblies passing through the wave soldering machine 100.

[0051] For wave soldering machine applications, the IR camera assembly 120 includes a support structure having a mounting plate 122 positioned on top of the channel 106 of the wave soldering machine 100 and a shield 124 mounted on the mounting plate. The shield 124 is configured to surround an opening in the mounting plate 122 so that the temperature of the channel 106 is sensed by the IR camera assembly. The support structure further includes a support bracket 126 mounted on the shield on top of the shield 124. The support bracket 126 includes a port 128 for connecting to a nitrogen (N2) source to provide an inert atmosphere within the shield. The support bracket 126 further includes an input port 130 for connecting a sensor to the support bracket.

[0052] The IR camera assembly 120 further includes an IR camera 132 supported in an operating position by the support bracket 126. A cable 134 is secured to the input port 130 to connect the IR camera 132 to the controller 114. As described above, any type of temperature sensor may be used to measure the temperature of the circuit board assemblies within the lane 106 of the wave soldering machine 100. The IR camera 132 is configured to have a field of view through the shield 124 toward the lane 106 of the wave soldering machine 100. This arrangement allows the IR camera 132 of the IR camera assembly 120 to detect the temperature of the circuit board assemblies within the lane 106 of the wave soldering machine 100 and communicate this information to the controller 114.

[0053] Selective soldering machine In the selective soldering process, there are several process steps. First, there is an upper fluxing station, in which the printed circuit board assembly is cleaned by spraying flux on the soldering side (bottom) of the printed circuit board assembly. After the flux is applied, the printed circuit board assembly is conveyed to a preheating unit. The preheating unit can be configured to include different heating concepts, such as convection or radiant heaters. The purpose of this process step is to heat the printed circuit board assembly to a predefined temperature, which is typically measured on the soldering destination side (top) of the printed circuit board assembly. The flux is activated and the printed circuit board assembly becomes hot, so that the solder does not solidify before the selective soldering process is carried out. Prior to the implementation of the thermal detection system of the present disclosure, the temperature of the printed circuit board assembly during preheating could be measured with a pyrometer, which produced very limited thermal information about the printed circuit board assembly.

[0054] After preheating, the PCB assembly is transported to the soldering area, where one of two soldering processes can be performed. In one soldering process, solder is applied through a small solder nozzle that is configured to perform a point-to-point soldering process. In the other soldering process, solder is applied through a multi-wave plate, where the solder joint is made with a single dip.

[0055] An embodiment of a heat detection system can incorporate an IR camera (2D or 3D) into the selective soldering process. The data provided by this camera can be used for closed-loop process control. When the camera is mounted above the PCB assembly during the preheating process, the temperature data obtained from the camera can provide information to modify the unit's power supply in such a way that a specific temperature is achieved when the selective soldering machine is ready to deliver the board to the soldering station. As a result, the PCB assembly can reach an optimal temperature when soldered, minimizing the risk of defects. This data can be recorded and combined with a means of board identification (such as barcodes or RFID) to provide traceability related to defects that may occur during assembly or field failures.

[0056] IR scanners can also be implemented in soldering stations. For multi-wave immersion processes, 2D or 3D cameras can be configured to measure solder joint temperatures. This configuration can identify whether the solder is solidified (below its melting point) before the printed circuit board assembly is moved to avoid stress in the solder joints. Furthermore, this data can be used for process optimization and traceability purposes.

[0057] For point-to-point soldering processes, implementing an IR scanner above the soldering station can be beneficial to record the condition of the printed circuit board assembly and verify whether the temperature is within the temperature tolerance range. This information can be used to reduce defects and have better process control.

[0058] Other aspects of heat detection systems In some embodiments, the support bracket includes IR camera glass to protect the IR camera. Figure 9 , a lens 140 is provided to protect the IR camera 132. Although shown with respect to the IR camera assembly 120 of the wave soldering machine 100, it should be understood that the lens 140 or camera glass can also be provided for the IR camera assembly 62 associated with the reflow oven 10. Other types of materials can also be provided to form the protective cover. The IR camera glass is positioned so that pressurized air moves over the IR camera glass to form an "air curtain" to prevent the IR camera from being obstructed. In one embodiment, a movable film can be provided to protect the IR camera.

[0059] The lens 140 may be applied to the IR camera 74 associated with the reflow oven 10 .

[0060] In some embodiments, the shield may be configured to connect to another source of inert fluid.

[0061] In some embodiments, the shield may be configured as a temperature controlled fluid source to protect the IR camera.

[0062] In some embodiments, the support bracket can be configured to mount the IR camera at a desired height and orientation to achieve a full field of view. In the illustrated configuration, the IR camera is mounted on top of the reflow oven's tunnel. However, the IR camera can be mounted to the side of the reflow oven's tunnel. In the side-mounted case, a mirror can be used to view the top and bottom of circuit boards passing through the tunnel.

[0063] In some embodiments, the IR camera can be mounted on a support structure that acts as a stage to move the camera over the circuit board.The IR camera can be positioned inside or outside the tunnel of the reflow oven.

[0064] In some embodiments, the IR camera assembly may include multiple IR cameras to measure two or more separate locations within selected locations within a tunnel of a reflow oven.

[0065] In some embodiments, a one-dimensional line scan camera may be used to detect the circuit board temperature.

[0066] In some embodiments, a two-dimensional camera may be used to detect the circuit board temperature.

[0067] In some embodiments, an existing reflow oven can be retrofitted with a retrofit kit that includes the components of the thermal detection system, including multiple IR camera assemblies, such as a mounting plate, a shroud, a support bracket, a nitrogen connector, an IR camera cable, and an IR camera. A software upgrade can be provided for the reflow oven's controller.

[0068] In some embodiments, the thermal detection system is configured with a controller to provide closed-loop control of zone temperature using an IR camera assembly or other temperature detection device. This closed-loop control enables an operator to monitor circuit board temperature and determine the location of hot spots on the circuit board (top and bottom of the board).

[0069] In some embodiments, the controller is configured with executable software that enables closed-loop control of various zones of the reflow oven.

[0070] In some embodiments, information obtained from the thermal detection system is collected and analyzed for future action.

[0071] In some embodiments, the IR camera assembly of the thermal detection system is configured to obtain temperature data at specific board height locations and within certain areas of the reflow oven.

[0072] In some embodiments, the IR camera component of the thermal detection system is configured to provide data to a controller for process control of downstream parameters associated with the production line and / or to troubleshoot equipment issues.

[0073] In some embodiments, the printed circuit boards have bar codes that are scanned by a bar code scanner or other type of identification system to track the data of each circuit board.

[0074] In some embodiments, the IR camera assembly of the thermal detection system is configured to obtain temperature data that is used by the controller to provide closed-loop localized heating to circuit board zones when needed. Real-time zone-to-zone temperature adjustments can be made for the purpose of achieving circuit board temperature uniformity or a desired temperature profile.

[0075] In some embodiments, closed-loop processing of circuit boards can include controlling a conveyor mechanism to control conveyor speed in one or more zones to optimize heat transfer. Fan blower speed can also be controlled. In one embodiment, the conveyor mechanism can include multiple sections corresponding to the multiple zones, with each conveyor section controlled by a controller to control the speed of the conveyor section and, therefore, the temperature applied to the circuit board. This configuration enables localized heating of the circuit board.

[0076] In some embodiments, the data obtained from the thermal detection system can be used for a variety of purposes. For example, the data can be communicated to customers. The data can be used to provide traceability of circuit boards, where data about a specific circuit board is associated with the customer. The data can be used to find hot spots / heights within a reflow oven. The data can be used to optimize the performance of the reflow oven. The data can be used to provide downstream input to processing equipment. The data can be used to determine the start and end times for the IR camera assembly to perform a scan on the circuit board. The data can be used to generate circuit board curves above and below the circuit board to determine certain board areas or heights. The customer can use the data for additional analysis and store the data on the customer's server / network or in the cloud.

[0077] In some embodiments, the controller can be configured to implement a scanning mode that measures the temperature of all circuit board components as the circuit board travels through the reflow oven on a conveyor mechanism.

[0078] In some embodiments, the thermal detection system is configured to perform thermal imaging during moiré analysis (strain / stress analysis) to correlate temperature hot spots with warpage response.

[0079] In some embodiments, the thermal detection system is configured to find hot spots and cold spots during reflow soldering, wave soldering, SRT rework, and selective soldering.

[0080] In some embodiments, the thermal detection system can be used to provide analysis to improve circuit board design and functionality.

[0081] In some embodiments, a thermal detection system can be used to reduce voids in the reflow process.

[0082] In some embodiments, the thermal detection system enables enhanced temperature control to reduce defects.

[0083] In some embodiments, a thermal inspection system has integrated closed-loop control of the zone temperature of a reflow oven by employing multiple infrared (IR) camera assemblies at strategic locations to reduce warpage, identify hot spots, determine component overheating, obtain profile inspection, and reduce voids.

[0084] In some embodiments, the thermal detection system is configured to include automated sensing equipment whose settings self-adjust based on environmental conditions and the product being manufactured, thereby improving visibility, productivity, traceability, and response time while reducing costs.

[0085] In some embodiments, the heat detection system enables visibility and prescriptive real-time analysis through proactive actionable intelligence in the supply chain.

[0086] In some embodiments, the thermal detection system increases flexibility by managing complexity within a closed-loop system.

[0087] In some embodiments, connectivity is enhanced through an open architecture for developing standard or custom interfaces and data outputs. The architecture is configured to support several MEMS.

[0088] In some embodiments, automation is enhanced to reduce operator error and headcount by providing automatic replacement and replenishment of consumables.

[0089] In some embodiments, the heat detection system is configured to self-optimize by reducing operator intervention in machine parameters and providing closed-loop control, resulting in higher production yields.

[0090] In some embodiments, maintenance is enhanced by employing predictive maintenance programs based on the actual needs of the reflow oven or wave soldering machine, and the enhanced maintenance replaces or reduces the time required for maintenance planning.

[0091] In some embodiments, a controller associated with a reflow soldering oven or wave soldering machine includes a controller adapted to control the operation of the oven or soldering machine based on operating parameters obtained by the controller. The controller may be configured to communicate with a controller associated with a production line. In one embodiment, the controller may be configured to communicate with another controller (e.g., a controller associated with the production line) via a controller area network (CAN) bus or other type of network. In other embodiments, a master controller may be provided to control the operation of controllers for various pieces of equipment associated with the production line. The controller may include a display operably coupled to the controller. The display may be adapted to display operating parameters of the reflow soldering oven or wave soldering machine, such as, but not limited to, temperature data for zones of the oven or soldering machine, or data associated with solder height in the soldering machine. Suitable sensors may be provided to obtain such information. Additionally or alternatively to the aforementioned embodiments, the operating parameters may be displayed on a display within the reflow soldering oven, a display within the wave soldering machine, and / or a display associated with the production line.

[0092] In other embodiments, a system for material identification of items (such as circuit boards) traveling through a reflow oven or wave soldering machine may include a device for manipulating the items and a scanner for scanning and identifying the items. For example, the reflow oven or wave soldering machine may be configured to include a pinch wheel to rotate the circuit board to align a code or predetermined identification mark on the circuit board with a scanner located on the oven or soldering machine. The system is configured to link the material identification associated with the circuit board with the recipe, production time, etc. for the reflow oven or wave soldering machine. In one embodiment, a barcode may be implemented for item identification. For example, the barcode may include a 1D scanner for UPC codes, a 2D scanner for QRC codes, a printed logo applied to the item, or a laser-etched mark etched onto the item. In another embodiment, an RFID system may be implemented for item identification. For example, the RFID system may include an RFID tag applied to the item and an RFID reader associated with the reflow oven or wave soldering machine. In an RFID system, a line of sight between the reader and the item is not required. Additionally, scanning is not required to identify all items within a movable cart. In another embodiment, an imaging or vision system for identifying items may be implemented.

[0093] In some embodiments, a database is provided to track items processed through a reflow oven or wave soldering machine. In one embodiment, the database may include an open application (App) architecture and be configured to push data to the reflow oven or wave soldering machine. The oven or soldering machine may be configured to communicate with the oven or soldering machine to push / pull data to the oven or soldering machine and / or the production line, or may be configured to communicate directly with the production line. The database may include job information or material information. The database may also communicate with a manufacturing execution system (MES) associated with the production line, the reflow oven and / or the wave soldering machine. The MES system may be configured to know which materials are required for a particular production run. The movable cart may be configured to communicate with the MES system to coordinate the delivery of items to the reflow oven or wave soldering machine.

[0094] The database can also be configured to retrieve information about items based on identification (e.g., barcode number). In one embodiment, a central management system can be provided, wherein a reflow oven or wave soldering machine is programmed to accept materials from a mobile cart. The reflow oven or wave soldering machine is programmed to update the database via the network to process the circuit boards passing through the oven or machine, and the database is in turn connected to the MES system.

[0095] The database may further be configured to store additional information, such as temperature data, number of boards processed, and / or material consumption associated with a reflow oven or wave soldering machine. The database may be configured to store information locally or remotely, and may be configured to store data associated with one or more production runs.

[0096] The database can be configured to share predictive data when a new production run is conceived or programmed. For example, with respect to storing information related to temperature process efficiency, the database can be configured to perform one or more of the following: store information regarding the number and type of boards processed by temperature zone data when paste consumables require replenishment; trigger alarms and / or reports; signal inventory control systems associated with reflow ovens, wave soldering machines, and / or production lines; analyze consumable usage based on operating parameters and actual usage and upstream / downstream equipment activity; predict replacement or maintenance; and correlate multiple sites to predict future production run parameters.

[0097] The database can be configured to store data associated with batch traceability. Additionally, RFID or mechanical keying of circuit boards is provided to ensure proper alignment / orientation / direction / front-to-back / top-to-bottom relationship when these items are inserted into a reflow oven or wave soldering machine for processing. Low-cost readers can perform this function.

[0098] Controller feedback Figure 11 An example system 200 according to various embodiments is depicted. System 200 includes a passage 202 within a chamber housing 203 having a conveyor mechanism 204 and a plurality of temperature sensors 210 (depicted as temperature sensors 210a, 210b, 210c); a heater 212 (depicted as heaters 212a, 212b); and a blower 214 (depicted as blowers 214a, 214b). System 200 also includes a controller 250. It should be understood that the term "blower" can include any type of device configured to move air, including a fan.

[0099] In some embodiments, the system 200 can be a single device contained within a single housing. In other embodiments, the controller 250 can be housed in a different location than the chamber housing 203 .

[0100] In some embodiments, the chamber housing 203 may be part of the reflow oven 10. In other embodiments, the chamber housing 203 may be part of the wave soldering machine housing 102. In still other embodiments, the chamber housing 203 may be part of a selective soldering machine housing.

[0101] The electronic substrate or circuit board assembly 44 passes along a conveyor mechanism 204 (e.g., conveyor mechanism 46, 104) driven by a motor (or other drive mechanism) 205 through the channel 202, through temperature detection zones 216 (depicted as temperature detection zones 216a, 216b, 216c) and processing zones 218 (depicted as processing zones 218a, 218b).

[0102] Circuit board assembly 44 includes a plurality of electronic components 206 mounted on an underlying circuit board. Electronic components 206 may include, for example, an integrated circuit chip 207, solder 208, and other components such as traces (not depicted), as well as the underlying substrate itself. It should be understood that although only one circuit board assembly 44 is depicted as passing through channel 202, multiple circuit board assemblies 44 may pass through channel 202 at once. In some embodiments, several circuit board assemblies 44 may pass side by side and one after the other.

[0103] In some embodiments, the processing zones 218 may include, for example, one or more preheat zones 14, 16, 18, soaking zones 20, 22, 24, spike zones 30, 32, 34, 36, and cooling zones 38, 40, 42, as described above with reference to the reflow oven 10. Each processing zone 218 may include one or more of the heaters 212 (e.g., the top heater 26 or the bottom heater 28) and the blowers 214, as well as any other processing components, depending on the purpose of the processing zone 218.

[0104] Each temperature detection zone 216 includes one or more temperature sensors 210 (eg, IR camera assembly 62). The temperature sensors 210N may be configured to detect the temperature of various components of the circuit board assembly 44 passing through its corresponding temperature detection zone 216N.

[0105] Although the temperature detection zones 216 and the treatment zones 218 are depicted separately, in some embodiments, the temperature detection zones 216 may be combined with the treatment zones 218. Although only three temperature detection zones 216 and two treatment zones 218 are depicted, any number of temperature detection zones 216 and treatment zones 218 may be present, preferably with at least two of each. Although the temperature detection zones 216 and treatment zones 218 are depicted as alternating, multiple different treatment zones 218 may be interposed between successive temperature detection zones 216.

[0106] The controller 250 (e.g., controller 50, 114) is configured to control the heater 212 and / or blower 214 (and any other processing components) of the processing zone 218 and receive feedback from the temperature sensor 210 of the temperature detection zone 216. In some embodiments, the controller 250 can also control the drive speed of the conveyor mechanism 204.

[0107] Controller 250 can be any type of computing device, such as a personal computer, laptop, workstation, server, enterprise server, tablet, smartphone, integrated system, etc. Controller 250 includes processing circuitry 236, communication interface circuitry 234, and memory 240. In some embodiments, controller 250 may also include user interface (UI) circuitry 238 for connecting to a UI input device (not depicted) and a display device (not depicted). Controller 250 may also include various additional features well known in the art, such as an interconnect bus, etc.

[0108] Processing circuitry 236 may include any kind of processor or group of processors configured to perform operations, such as a microprocessor, a multi-core microprocessor, a digital signal processor, a system on a chip (SoC), a collection of electronic circuits, a similar kind of controller, or any combination of the above.

[0109] The communication interface circuitry 234 may include one or more networking devices (e.g., an Ethernet card, a cellular modem, a Fibre Channel (FC) adapter, an InfiniBand adapter, a wireless networking adapter, etc.) and / or local bus ports (e.g., USB, Firewire, a serial bus, a parallel bus, etc.) for connecting to the heater 212, the blower 214, the temperature sensor 210, and / or other controllable devices of the chamber housing 203, such as, for example, the conveyor motor 205.

[0110] The UI circuitry 238 may include any circuitry necessary to communicate with and interface with one or more user input devices and display screens. The UI circuitry 238 may include, for example, a keyboard controller, a mouse controller, a touch controller, serial bus ports and controllers, a universal serial bus (USB) port and controller, a wireless controller and antenna (e.g., Bluetooth), a graphics adapter and port, and the like.

[0111] Memory 240 may include any type of digital system memory, such as random access memory (RAM). Memory 240 stores an operating system (OS) (not depicted, such as Linux, UNIX, Windows, MacOS, or a similar operating system) and various drivers and other applications and software modules configured to execute on processing circuitry 236.

[0112] The memory 240 stores a set of modules 282 , 284 , 290 , 296 that are configured to execute on the processing circuitry 236 .

[0113] The feedback module 282 is configured to receive temperature readings, such as a temperature map 280 (depicted as zone temperature maps 280a, 280b, 280c), from the temperature sensor 210 as one or more circuit board assemblies 44 pass through the channel 202 along the conveyor mechanism 204. In an embodiment, the zones a The temperature map 280a is a two-dimensional (or three-dimensional) graph of the temperature within the temperature detection zone 216a as recorded by the IR camera assembly 62 of the temperature sensor 210a. b The temperature map 280b is a two-dimensional (or three-dimensional) map of the temperature within the temperature detection zone 216b as recorded by the IR camera assembly 62 of the temperature sensor 210b, and the zones c Temperature map 280c is a two-dimensional (or three-dimensional) map of the temperature within temperature detection zone 216c as recorded by IR camera assembly 62 of temperature sensor 210c.

[0114] In some embodiments, feedback module 282 may also be configured to convert each zone temperature map 280X into one or more component-level temperature maps 281 (depicted as component-level temperature maps 281-1, 281-2, ...) that include the temperature of each electronic component 206 on a particular circuit board assembly 44 that passes through zone X. In some embodiments, component-level temperature map 281 may record both the lowest and highest temperatures measured for each component 206. Component-level temperature map 281 may be created with reference to board configuration 260 input by a user via UI circuitry 238. Board configuration 260 may include the dimensions of a design for a particular circuit board assembly 44 and the location, size, and shape of each component 206 of the design for the particular circuit board assembly 44.

[0115] The comparison module 284 is configured to compare the component-level temperature map 281 with one or more expected component-level temperature maps 285 (depicted as expected maps 285a, 285b, ...). The expected component-level temperature map 285X defines the expected temperature range for each component 206 of the design of the particular circuit board assembly 44 at a particular temperature detection zone 216X.

[0116] The optimization module 290 is configured to generate a set of adjustments 294 to be made to a set of current settings 270 based on the differences detected by the comparison module 284. The current settings 270 may include, for example, a conveyor speed 272, as well as a temperature setting 274 and a blower speed 276 for each treatment zone 218 (depicted as temperature setting 274a and blower speed 276a for treatment zone 218a). The adjustments 294 are transmitted by the control module 296 to various devices, such as the heater 212, the blower 214, and the conveyor motor 205, for adjustment. The adjustments 294 are also used to update the current settings 270.

[0117] In some embodiments, optimization module 290 includes a trained machine learning model (MLM) 292. Trained MLM 292 can be any type of machine learning model, such as a neural network (e.g., ResNet50, EfficientNetB7, EfficientNet, MobileNetV3, etc.), a Bayesian network, a support vector machine, a decision tree, a random forest, a regression model, and the like. Trained MLM 292 can include as many input nodes (not depicted) as the current settings 270, plus two-dimensional or three-dimensional input nodes such as temperature maps 280 or 281 or a variance map (not depicted) calculated by comparison module 284. Trained MLM 292 can also include as many output nodes (not depicted) as the current settings 270 that can be adjusted. In embodiments where trained MLM 292 is a neural network or Bayesian network, it can also include one or more hidden layers with multiple hidden nodes (not depicted). In an exemplary embodiment, there can be between 10 billion and 1 billion hidden nodes.

[0118] In some embodiments, the trained MLM 292 may be initially trained using supervised learning by passing one or more circuit board assemblies 44 through the channel 202. Prior to these passes, the board configurations 260 of those circuit board assemblies 44 may also be input into the training nodes of the trained MLM 292. In some embodiments, thermal properties 262 for each type of component 206 may also be entered. For example, the thermal properties 262 for a particular type of component 206N may include the thermal conductivity, density, specific heat, and thermal diffusivity of that particular type of component 206N. In some embodiments, a maximum safe temperature 264 (e.g., the temperature at which the board will warp; the temperature at which the chip will burn out, etc.) and a minimum operating temperature 266 may also be entered for each type of component 206N. The "operating temperature" of a particular component 206N is defined as the highest temperature reached by that component 206N during its passage through the channel 202. An example minimum operating temperature 266 is the melting point of solder (or the temperature at which solder is guaranteed to melt sufficiently for reliable bonding).

[0119] Memory 240 may also store various other data structures used by the OS, modules 282, 284, 290, 296, trained MLM 292, and various other applications and drivers. In some embodiments, memory 240 may also include a persistent storage portion. The persistent storage portion of memory 240 may be comprised of one or more persistent storage devices (e.g., magnetic disks, flash drives, solid-state storage drives, or other types of storage drives). The persistent storage portion of memory 240 is configured to store programs and data even when the controller 250 is powered off. The OS, modules 282, 284, 290, 296, trained MLM 292, and various other applications and drivers are typically stored in this persistent storage portion of memory 240 so that they can be loaded into the system portion of memory 240 upon system restart or as needed. The OS, modules 282, 284, 290, 296, trained MLM 292, and various other applications and drivers each constitute a computer program product when stored in a non-transitory form in the volatile or persistent portion of memory 240. Thus, processing circuitry 236 running one or more application programs forms special-purpose circuitry constructed and arranged to perform the various processes described herein.

[0120] Figure 12An example method 300 is shown, performed by system 200, for attaching electronic components to electronic substrates in equipment such as a reflow oven 10, a wave soldering machine 100, or a selective soldering machine. It should be understood that whenever a piece of software (e.g., an OS, modules 282, 284, 290, 296, a trained MLM 292, etc.) is described as performing a method, process, step, or function, this means that the computing device (e.g., controller 250) on which the software is running performs the method, process, step, or function when executing the software on its processing circuitry 236. It should be understood that in some embodiments, one or more steps or sub-steps of method 300 may be omitted. Similarly, in some embodiments, one or more steps or sub-steps may be combined or performed in a different order. Dashed lines indicate that a step or sub-step is optional or represents an alternative embodiment or use case.

[0121] In some embodiments, in step 305, the trained MLM 292 can be initially trained using supervised learning. In step 305, a plurality of circuit board assemblies 44 having different board configurations 260, thermal properties 262, maximum safe temperatures 264, and minimum operating temperatures 266 are conveyed through the passage 202 of the chamber housing 203 to train the trained MLM 292. The trained MLM 292 is configured to adjust the current settings 270 for each different type of circuit board assembly 44 until each component 206 of each different type of circuit board assembly 44 reliably reaches its minimum operating temperature 266 (in some embodiments, for at least a minimum amount of time) during its passage through the passage 202 (if the minimum operating temperature 266 is applicable to that component 206), without exceeding the maximum safe temperature 264 of that component 206 during that passage. The thermal properties 262 can be used to help determine how to adjust the current settings 270 from one passage to another. At the conclusion of step 305, an initial set of current settings 270 for at least one specific circuit board assembly 44 design is output. In some embodiments, the trained MLM 292 can be generalizable to any specific circuit board assembly 44 design, given the board configuration 260, thermal properties 262, and the maximum safe temperature 264 and minimum operating temperature 266 of each component 206 as input. In other embodiments, a separate trained MLM 292 can be generated for each different circuit board assembly 44 design during the training phase. In some embodiments, step 305 can be performed as an explicit training process using test artifacts. In some embodiments, step 305 can include previous passes of non-test circuit board assemblies 44, allowing machine learning to refine the operation as more passes are performed.

[0122] In step 310, a plurality of circuit board assemblies 44 are conveyed through the chamber housing 203, which includes a passageway 202 extending through a plurality of processing zones 218. In sub-step 315, the system 200 detects the temperature of the electronic substrates 44 passing near a thermal detection system comprising at least one temperature sensor 210 coupled to the chamber housing 203. In some embodiments, in sub-step 316, the system 200 detects the temperature of the plurality of components 206 of the electronic substrates 44 at each of a plurality of locations along the passageway 202 (e.g., at successive temperature detection zones 216) (e.g., using the IR camera assembly 62 in each temperature detection zone 216). It should be understood that step 310 is a general operation step and, therefore, can be performed in parallel or simultaneously with the remaining steps.

[0123] The remainder of method 300 can be used in different embodiments. In one embodiment associated with steps 320 and 370 (hereinafter referred to as the "one-by-one embodiment" or "RBR embodiment"), first circuit board assembly 44-1 is passed through lane 202 using initial current settings 270, and after adjustments 294 are determined and applied, second circuit board assembly 44-2 of the same design is passed through lane 202 using updated current settings 270. In another embodiment associated with steps 330, 380, and 390 (hereinafter referred to as the "real-time embodiment"), current settings 270 are adjusted in real time as a particular circuit board assembly 44 passes through lane 202, allowing subsequent processing zones 218 to adjust their operations as needed.

[0124] In step 320 of the RBR embodiment, the first circuit board assembly 44-1 is conveyed through the chamber housing 203. It should be understood that although only one first circuit board assembly 44-1 is mentioned, there may be multiple first circuit board assemblies 44-1 passing through the channel 202 at the same time. It should be understood that step 315 operates on the first circuit board assembly (or multiple first circuit board assemblies) 44-1 as they are conveyed through the chamber housing 203.

[0125] In step 330 of the real-time embodiment, as the particular circuit board assembly 44 is conveyed through the chamber housing 203, a first temperature sensor of the at least two temperature sensors (e.g., temperature sensor 210a) detects the temperature of the plurality of components 206 of the particular circuit board assembly 44 at a first location along the channel 202 (e.g., within the temperature detection zone 216a) (e.g., by imaging the circuit board assembly 44 with the first IR camera assembly 62).

[0126] In step 340 , the feedback module 282 operating on the controller 250 coupled to the plurality of processing zones 218 , the conveyor motor 205 , and the thermal detection system (i.e., the temperature sensors 210 ) receives temperature data (e.g., one or more zone temperature maps 280 ) from the thermal detection system.

[0127] In the RBR embodiment, in step 340 , the zone temperature maps 280 are sequentially received from all of the temperature detection zones 216 as the first circuit board assembly 44 - 1 passes through each corresponding temperature detection zone 216 .

[0128] In a real-time embodiment, in step 340 , a zone temperature map 280 is received from a particular circuit board assembly 44 - 1 as it passes through a temperature detection zone 216 .

[0129] In step 350 , the controller 250 references the detected temperature of the electronic substrate(s) 44 (e.g., one zone temperature map 280 in a real-time embodiment, all zone temperature maps 280 in an RBR embodiment) to determine an adjustment 292 to at least one of: (a) a heat setting of the heating element 212 within the chamber housing 203 , (b) a speed of the conveyor mechanism 204 , and (c) an operating speed of the blower 214 within the chamber housing 203 .

[0130] Step 350 may include sub-steps 352 and 354. In sub-step 352, the comparison module 284 compares each detected temperature of each component 206 at each (in the case of an RBR embodiment) or first (in the case of a real-time embodiment) location (e.g., a temperature detection zone 216) along the channel 202 (e.g., with reference to one or more component-level temperature maps 281 generated from one or more zone temperature maps 280). Then, in sub-step 354, the optimization module 290 performs an optimization operation configured to adjust the current hardware settings 270 in one or more processing zones 218 to reduce the set of variances calculated by the comparison module 284. In the case of an RBR embodiment, the adjustment 292 may affect one or more of the processing zones 218. In the case of a real-time embodiment, the adjustment 292 affects one or more processing zones 218 located after the first location (e.g., processing zone 218a after temperature detection zone 216a or processing zone 218b after temperature detection zone 216b).

[0131] In some embodiments, sub-step 354 includes further sub-steps 355 in which optimization module 290 operates trained MLM 292 on processing circuitry 236 to perform optimization.

[0132] In some embodiments, if the temperature of a particular component 206 is higher than expected, the optimization module 290 may determine the adjustment to be at least one of: (1) reducing the heat setting of the heating element 212, (2) adjusting the speed of the conveyor mechanism 204, and (3) increasing the operating speed of the blower 214. In the case of an RBR embodiment, if the temperature of a particular component 206N of the first electronic substrate 44-1 has exceeded the maximum safe temperature 264N of the component 206N in the temperature detection zone 216X, the optimization module 290 may determine the adjustment to be at least one of: (1) reducing the heat setting of the heating element 212 in the processing zone 218 located before the temperature detection zone 216X, (2) increasing the speed of the conveyor mechanism 204, and (3) increasing the operating speed of the blower 214 in the processing zone 218 located before the temperature detection zone 216X. In the case of a real-time embodiment, if the temperature of a particular component 206N of a particular electronic substrate 44 has exceeded an expected temperature for the component 206N in the temperature detection zone 216X (e.g., from the expected temperature map 285X) but has not yet exceeded the maximum safe temperature 264N for the component 206N, the optimization module 290 may determine an adjustment to be at least one of: (1) reducing the heat setting of the heating element 212 in the processing zone 218 located after the temperature detection zone 216X, (2) increasing or decreasing the speed of the conveyor mechanism 204, and (3) increasing the operating speed of the blower 214 in the processing zone 218 located after the temperature detection zone 216X.

[0133] In some embodiments, if the temperature of a particular component is lower than expected, the optimization module 290 may determine an adjustment to be at least one of: (1) increasing the heat setting of the heating element 212, (2) adjusting the speed of the conveyor mechanism 204, and (3) reducing the operating speed of the blower 214. In the case of an RBR embodiment, if the temperature of a particular component 206N of the first electronic substrate 44-1 has not yet reached a minimum temperature at which the solder composition for the component 206N is reliably melted before the end of the channel 202, the optimization module 290 may determine an adjustment to be at least one of: (1) increasing the heat setting of the heating element 212 located in one or more processing zones 218, (2) reducing the speed of the conveyor mechanism 204, and (3) reducing the operating speed of the blower 214 located in one or more processing zones 218. In the case of a real-time embodiment, if the temperature of a particular component 206N of a particular electronic substrate 44 is lower than expected for the component 206N in the temperature detection zone 216X (e.g., with reference to the expected temperature map 285X), the optimization module 290 can determine an adjustment to be at least one of: (1) increasing the heat setting of the heating element 212 in the processing zone 218 located after the temperature detection zone 216X, (2) increasing or decreasing the speed of the conveyor mechanism 204, and (3) decreasing the operating speed of the blower 214 in the processing zone 218 located after the temperature detection zone 216X.

[0134] Following step 350 , in step 360 the controller 250 implements the determined adjustment(s) 294 by updating the current settings 270 and sending the adjustment(s) 294 to the appropriate devices 212 , 214 , 205 via the control module 296 and the communication interface circuitry 234 .

[0135] In the case of the RBR embodiment, in step 370, the second circuit board assembly 44-2 is conveyed through the chamber housing 203, now using the updated current settings 270 after applying the adjustment(s) 292. It should be understood that although only the second circuit board assembly 44-2 is mentioned, there may be several second circuit board assemblies 44-2 passing through the channel 202 at the same time. It should be understood that step 315 operates on the second circuit board assembly (or assemblies) 44-2 as they are conveyed through the chamber housing 203.

[0136] In the case of a real-time embodiment, in step 380, the particular circuit board assembly 44 continues to be transported through at least one processing zone 218 of the chamber housing 203 after the first temperature sensor (e.g., processing zone 218a after temperature sensor 210a, processing zone 218b after temperature sensor 210b, and so on). Then, in step 390, the system 200 detects the temperature of the plurality of components 206 of the particular circuit board assembly 44 at a second location along the passage 202 after the processing zone 218 that the particular circuit board assembly 44 passed through in step 380 (e.g., within temperature detection zone 216b or 216c) (e.g., by imaging the circuit board assembly 44 with the second IR camera assembly 62). Operations may then return to step 340 as the particular circuit board assembly 44 continues to pass through the passage 202. Having thus described several aspects of at least one embodiment of the present disclosure, it will be appreciated that various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to fall within the spirit and scope of the present disclosure. Therefore, the preceding description and accompanying figures are provided by way of example only. It should be understood that while the various embodiments have been described as methods, software embodying these methods is also encompassed. Thus, one embodiment includes a tangible computer-readable medium (e.g., a hard disk, floppy disk, optical disk, computer memory, flash memory, etc.) programmed with instructions that, when executed by a computer or a group of computers, cause one or more of the methods described in the various embodiments to be performed. Another embodiment includes a computer programmed to perform one or more of the methods described in the various embodiments.

[0137] Furthermore, it is to be understood that all embodiments that have been described can be combined with one another in all possible combinations, unless such combinations have been explicitly excluded.

[0138] Finally, nothing in this specification should be construed as an admission of any kind. Even if a technology, method, apparatus, or other concept is specifically labeled as "background" or "conventional," applicants are not admitting that such technology, method, apparatus, or other concept is, in fact, prior art under 35 USC § 102 or 103, as such determination is a legal determination that depends on many factors, not all of which are known to applicants at this time.

[0139] Claims.

Claims

1. A method for bonding an electronic component to an electronic substrate in a device, the method comprising: conveying an electronic substrate through a chamber housing including a passage extending through a plurality of processing zones; detecting a temperature of the electronic substrate passing in proximity to a thermal detection system comprising at least one temperature sensor coupled to the chamber housing; receiving temperature data from the thermal detection system via a controller coupled to the plurality of processing zones, the conveyor mechanism, and the thermal detection system; determining, by the controller with reference to the detected temperature of the electronic substrate, an adjustment to at least one of: (a) a heat setting of a heating element within the chamber housing, (b) a speed of the conveyor mechanism, and (c) an operating speed of a blower within the chamber housing; as well as Execute the determined adjustments.

2. The method of claim 1, wherein: determining that the adjusting is performed after transporting the first electronic substrate through the chamber housing; and Performing the determined adjustment is performed prior to transporting the second electronic substrate through the chamber housing.

3. The method according to claim 2, wherein: Determining the adjustment includes: in response to determining that the temperature of the component of the first electronic substrate has exceeded the maximum safe temperature of the component, determining the adjustment to be at least one of: (1) reducing the heat setting of the heating element, (2) increasing the speed of the conveyor mechanism, and (3) increasing the operating speed of the blower.

4. The method according to claim 2, wherein: Determining the adjustment includes: in response to determining that the temperature of the solder component of the first electronic substrate has not reached a minimum temperature at which the solder component reliably melts, determining the adjustment to be at least one of: (1) increasing a heat setting of the heating element, (2) decreasing a speed of the conveyor mechanism, and (3) decreasing an operating speed of the blower.

5. The method of claim 2, wherein: The heat detection system includes a plurality of temperature sensors arranged sequentially along the channel; detecting temperatures includes detecting a plurality of temperatures of a plurality of components of the first electronic substrate at each of a plurality of locations along the channel; Determining that the adjustment includes: comparing each detected temperature of each component at each location to an expected temperature of the component at the location to obtain a set of variances; as well as An optimization operation is performed, the optimization operation configured to adjust hardware settings in the plurality of processing regions to reduce the set of variances.

6. The method according to claim 5, wherein: Performing the optimization operation includes operating a trained machine learning model.

7. The method according to claim 6, wherein: Operating the trained machine learning model includes inputting the following into the trained neural network: actual initial hardware setup in the plurality of processing zones as the first electronic substrate passes through the chamber housing; the configuration of components of the first electronic substrate; thermal properties of the component of the first electronic substrate; a maximum safe temperature of at least one component of the first electronic substrate; as well as a minimum operating temperature of at least one component of the first electronic substrate.

8. The method of claim 7, wherein: The method further includes training the machine learning model using supervised learning before conveying the first electronic substrate through the chamber housing, wherein training the machine learning model using supervised learning includes conveying multiple electronic substrates having different configurations, thermal properties, maximum safe temperatures, and minimum operating temperatures through the chamber housing.

9. The method of claim 5, wherein: The plurality of temperature sensors include a plurality of infrared (IR) cameras; and Detecting the temperature of the plurality of components of the first electronic substrate at each of the plurality of locations along the channel includes imaging the plurality of components of the first electronic substrate at each of the plurality of locations along the channel using an IR camera from the plurality of IR cameras.

10. The method of claim 1, wherein: The heat detection system includes at least two temperature sensors arranged sequentially along the channel, with at least one processing zone being between the at least two temperature sensors; and For a particular electronic substrate being conveyed through the chamber housing: determining that the adjustment of the particular electronic substrate is performed after detecting, by a first temperature sensor of the at least two temperature sensors, a temperature of a plurality of components of the particular electronic substrate at a first location along the channel; and Performing the determined adjustments is performed prior to transporting the particular electronic substrate through the at least one processing zone.

11. The method of claim 10, wherein: The at least two temperature sensors include a first infrared (IR) camera and a second IR camera; and Detecting the temperature of the plurality of components of the particular electronic substrate at the first location along the channel includes: imaging the plurality of components of the first electronic substrate at the first location along the channel using the first IR camera; The method further includes detecting a temperature of the plurality of components of the particular electronic substrate at a second location along the passageway after transporting the particular electronic substrate through the at least one processing zone by imaging the plurality of components of the particular electronic substrate with the second IR camera.

12. An apparatus configured to attach an electronic component to an electronic substrate, the apparatus comprising: a chamber housing including a passage extending through the plurality of processing zones; a conveyor mechanism configured to transport the electronic substrate in the channel through the plurality of processing zones; a heat detection system comprising at least one temperature sensor coupled to the chamber housing, the at least one temperature sensor configured to detect a temperature of the electronic substrate passing near the at least one temperature sensor; as well as a controller coupled to the plurality of processing zones, the conveyor mechanism, and the thermal detection system, the controller being configured to: receiving temperature data from the thermal detection system; determining, with reference to the detected temperature of the electronic substrate, an adjustment to at least one of: (a) a heat setting of a heating element within the chamber housing, (b) a speed of the conveyor mechanism, and (c) an operating speed of a blower within the chamber housing; as well as Execute the determined adjustments.

13. The apparatus of claim 12, wherein: The controller is configured to determine the adjustment after conveying a first electronic substrate through the chamber housing; and The controller is configured to perform the determined adjustment before transporting a second electronic substrate through the chamber housing.

14. The apparatus of claim 13, wherein: Determining the adjustment includes: in response to determining that the temperature of the component of the first electronic substrate has exceeded the maximum safe temperature of the component, determining the adjustment to be at least one of: (1) reducing the heat setting of the heating element, (2) increasing the speed of the conveyor mechanism, and (3) increasing the operating speed of the blower.

15. The apparatus of claim 13, wherein: Determining the adjustment includes: in response to determining that the temperature of the solder component of the first electronic substrate has not reached a minimum temperature at which the solder component reliably melts, determining the adjustment to be at least one of: (1) increasing a heat setting of the heating element, (2) decreasing a speed of the conveyor mechanism, and (3) decreasing an operating speed of the blower.

16. The apparatus of claim 13, wherein: The heat detection system includes a plurality of temperature sensors arranged sequentially along the channel; detecting the temperature includes detecting a temperature of a plurality of components of the first electronic substrate at each of a plurality of locations along the channel; Determining that the adjustment includes: comparing each detected temperature of each component at each location to an expected temperature of the component at the location to obtain a set of variances; as well as An optimization operation is performed, the optimization operation configured to adjust hardware settings in the plurality of processing regions to reduce the set of variances.

17. The apparatus of claim 16, wherein: Performing the optimization operation includes operating a trained machine learning model.

18. The apparatus of claim 16, wherein: The plurality of temperature sensors include a plurality of infrared (IR) cameras; and Detecting the temperature of the plurality of components of the first electronic substrate at each of the plurality of locations along the channel includes imaging the plurality of components of the first electronic substrate at each of the plurality of locations along the channel using an IR camera from the plurality of IR cameras.

19. The apparatus of claim 12, wherein: The heat detection system includes at least two temperature sensors arranged sequentially along the channel, with at least one processing zone being between the at least two temperature sensors; and For a particular electronic substrate being conveyed through the chamber housing: the controller being configured to determine an adjustment to the particular electronic substrate after detecting a temperature of a plurality of components of the particular electronic substrate at a first location along the channel via a first temperature sensor of the at least two temperature sensors; and The controller is configured to perform the determined adjustment prior to transporting the particular electronic substrate through the at least one processing zone.

20. The apparatus of claim 19, wherein: The at least two temperature sensors include a first infrared (IR) camera and a second IR camera; and Detecting the temperature of the plurality of components of the first electronic substrate at the first location along the channel includes: imaging the plurality of components of the first electronic substrate at the first location along the channel with the first IR camera; The second IR camera is configured to detect a temperature of the plurality of components of the particular electronic substrate at a second location along the lane by imaging the plurality of components of the particular electronic substrate after transporting the particular electronic substrate through the at least one processing zone.

21. A computer program product comprising a non-transitory computer-readable medium storing instructions that, when executed by processing circuitry coupled to a controller device of an apparatus configured to attach an electronic component to an electronic substrate, cause the controller device to: operating the apparatus to transport an electronic substrate through a chamber housing including a passage extending through a plurality of processing zones; operating the apparatus to detect a temperature of an electronic substrate passing in proximity to a thermal detection system comprising at least one temperature sensor coupled to the chamber housing; receiving temperature data from the thermal detection system; determining, with reference to the detected temperature of the electronic substrate, an adjustment to at least one of: (a) a heat setting of a heating element within the chamber housing, (b) a speed of a conveyor mechanism within the chamber housing, and (c) an operating speed of a blower within the chamber housing; and The device is operated to implement the determined adjustment.

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