Light emitting device

Abstract

Disclosed is a light-emitting device provided with a substrate having graphite. The light-emitting device includes: a base having a first upper surface and mainly made of graphite; a substrate disposed on the first upper surface of the base; a first light-emitting element disposed on the substrate and emitting light in a first direction; a reflective member disposed on the first upper surface of the base body at a position away from the first light-emitting element in the first direction; a frame defining a through hole surrounding the first light-emitting element and the reflective member in plan view, the frame having a second upper surface, a lower surface bonded to the base, and one or more wiring layers provided on the second upper surface at a position away from the first light-emitting element in a direction opposite to the first direction; the first upper surface of the substrate has a first region covering the through hole in plan view, and a second region extending from the first region to directly below one or more wiring layers provided on the second upper surface.

Description

Technical Field

[0001] The present invention relates to a light emitting device. Background Art

[0002] Japanese Patent Application Laid-Open No. 2015-32706 discloses a semiconductor device in which a semiconductor chip is arranged on a substrate made of flake graphite. Graphite is an anisotropic heat-conducting element, having a property in which the thermal conductivity in one direction is higher than that in other directions.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2015-32706 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] Disclosed is a light-emitting device including a substrate having a light-emitting element arranged thereon and comprising graphite.

[0008] Solutions to the Problem

[0009] The light emitting device disclosed in the embodiment includes:

[0010] A substrate mainly made of graphite and having a first upper surface,

[0011] a substrate disposed on the first upper surface of the base,

[0012] a first light emitting element disposed on the substrate and emitting light in a first direction,

[0013] A reflective member disposed on the first upper surface of the base at a position away from the first light emitting element in the first direction, and

[0014] A frame defining a through hole surrounding the first light-emitting element and the reflective member when viewed from above, the frame comprising: a second upper surface; a lower surface bonded to the base; and a wiring layer disposed on the second upper surface at a position away from the first light-emitting element in a direction opposite to the first direction. Furthermore, the first upper surface of the base comprises: a first region covering the through hole when viewed from above, and a second region extending from the first region to directly below the one or more wiring layers disposed on the second upper surface.

[0015] According to at least one of one or more inventions disclosed in the embodiments, a light-emitting device including a base having a light-emitting element arranged thereon and having excellent heat dissipation properties can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a perspective view of the light emitting device according to the first embodiment.

[0017] Figure 2 This is a perspective view of the light emitting device according to the first embodiment and the second embodiment with optical components removed.

[0018] Figure 3 This is a perspective view showing components arranged in the internal space of the package in the light emitting device according to the first embodiment.

[0019] Figure 4A This is a plan view showing components arranged in the internal space of the package in the light emitting device according to the first embodiment.

[0020] Figure 4B yes Figure 4A End view of the IVB-IVB line.

[0021] Figure 5 yes Figure 2 Cross-sectional view of the VV line.

[0022] Figure 6 It is a perspective view of the base body of the first embodiment and the second embodiment.

[0023] Figure 7 This is a cross-sectional view of the base body according to the first embodiment.

[0024] Figure 8A This is a plan view showing a first example of a state in which an adhesive is provided on the base body of the first embodiment and the second embodiment.

[0025] Figure 8B This is a plan view showing a second example of a state in which an adhesive is provided on the base body of the first embodiment and the second embodiment.

[0026] Figure 8C It is a plan view showing a third example of a state in which an adhesive is provided on the base body of the first embodiment and the second embodiment.

[0027] Figure 9 It is a perspective view of the first graphite member of the first embodiment and the second embodiment.

[0028] Figure 10 It is a perspective view of the second graphite member of the first embodiment and the second embodiment.

[0029] Figure 11 It is a plan view of the housings of the first embodiment and the second embodiment.

[0030] Figure 12AThis is a bottom view showing a first example of the second bonding layer provided on the lower surface of the frame body in the first embodiment and the second embodiment.

[0031] Figure 12B It is a bottom view showing a second example of the second bonding layer provided on the lower surface of the frame body in the first embodiment and the second embodiment.

[0032] Figure 12C It is a bottom view showing a third example of the second bonding layer provided on the lower surface of the frame body in the first embodiment and the second embodiment.

[0033] Figure 13 This is a perspective view of a light emitting device according to a second embodiment.

[0034] Figure 14 This is a plan view showing components arranged in the internal space of the package in the light emitting device according to the second embodiment.

[0035] Figure 15 yes Figure 2 Cross-sectional view of line XV-XV.

[0036] Figure 16 It is a cross-sectional view of a base body according to the second embodiment. DETAILED DESCRIPTION

[0037] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including those with corners that have been processed, such as rounded, chamfered, chamfered, or rounded. This term also applies to shapes with processed edges, not just corners (edge ​​ends). Shapes with processed edges in the middle are also considered polygons. In other words, shapes based on polygons that have undergone partial processing are also included in the definition of "polygon" as described in this specification and claims.

[0038] This is not limited to polygons. The same applies to terms that represent specific shapes such as trapezoids, circles, and concave-convex shapes. The same applies to the processing of the various sides that form their shapes. In other words, even if processing is applied to the corners or the middle part of a certain side, the interpretation of "side" also includes the processed part. It should be noted that when distinguishing between "polygons" and "sides" that have not been partially processed and the processed shape, the word "strict" should be added, for example, it should be recorded as "strict quadrilateral".

[0039] In this specification or claims, records such as up and down (above / below), left and right, inside and outside, front and back (front / back), proximal and distal are only used to describe relative positions, orientations, directions and other relationships, and may be inconsistent with the relationships during use.

[0040] Arrows are sometimes used in the accompanying drawings to indicate directions such as the X direction, Y direction, and Z direction. The directions of the arrows are consistent across multiple drawings of the same embodiment. In the accompanying drawings, the directions of the arrows marked with X, Y, and Z are set as positive directions, and the directions opposite thereto are set as negative directions. For example, the direction marked with X at the tip of the arrow is the X direction, and is also the positive direction. It should be noted that in this specification, the direction that is the X direction and is the positive direction is referred to as the "positive direction of X," and the direction opposite thereto is referred to as the "negative direction of X." When referred to as the "X direction," any direction in the positive and negative directions is included. The same applies to the Y direction and the Z direction.

[0041] In this specification, when an object is specifically designated as "one or more" and described, both the embodiment in which the object is one and the various embodiments in which the object is multiple are collectively described. Therefore, based on the description specifically designated as "one or more," any embodiment including one or more objects, an embodiment including at least one object, and an embodiment including multiple objects are supported.

[0042] In this specification, a description of "one or each" object is a statement that integrates the description of one object in an embodiment having one object, the description of one object in an embodiment having multiple objects, and the separate descriptions of multiple objects in an embodiment having multiple objects. Therefore, based on the description of "one or each" object, any of the following situations is supported: in an embodiment having at least one object, the one object has description content; in an embodiment having multiple objects, at least one of the objects has description content; in an embodiment having multiple objects, each of the multiple objects has description content; and in an embodiment having one or more objects, all of the objects have description content.

[0043] In this specification, for example, when describing structural elements, etc., "component" or "section" may be used. A "component" refers to an object that is handled as a physically independent entity. An object that is handled as a physically independent entity may be an object that is handled as a single part in a manufacturing process. On the other hand, a "section" refers to an object that does not need to be handled as a physically independent entity. For example, "section" may be used when a portion of a component is partially extracted or when multiple components are extracted together as a single object.

[0044] The distinction between "component" and "portion" described above is not intended to limit the scope of the claims under the doctrine of equivalents. In other words, even if a structural element is described as a "component" in a claim, it cannot be inferred solely from this fact that the applicant has determined that treating that structural element as a physically independent entity is a necessary condition for the application of the invention.

[0045] In this specification or claims, when there are multiple components and it is necessary to distinguish each component, the components may be preceded by "first" or "second" to distinguish them. The components distinguished in this specification and the claims may differ. Therefore, even if the claims contain a component with the same reference number as in this specification, the components specifically designated by that component may differ between this specification and the claims.

[0046] For example, if there are structural elements in this specification that are distinguished by the labels "1," "2," and "3," and the structural elements labeled "1" and "3" in this specification are described in the claims, for ease of reading, the structural elements may be labeled "1" and "2" in the claims to distinguish them. In this case, the structural elements labeled "1" and "2" in the claims refer to the structural elements labeled "1" and "3" in this specification, respectively. It should be noted that the application of this rule is not limited to structural elements and can be reasonably and flexibly applied to other objects.

[0047] The following describes a method for implementing the present invention. A specific method for implementing the present invention will be described with reference to the accompanying drawings. It should be noted that the method for implementing the present invention is not limited to this specific method. In other words, the illustrated embodiments are not the only way to implement the present invention. It should be noted that the sizes and positional relationships of the components shown in the various drawings may be exaggerated for ease of understanding.

[0048] <First embodiment>

[0049] A light emitting device 1 according to the first embodiment will be described. Figures 1 to 12C 1 is a diagram for explaining one embodiment of the light emitting device 1 . Figure 1 It is a perspective view of the light emitting device 1 . Figure 2 It is a perspective view of the light emitting device 1 with the optical component 70 removed. Figure 3 It is a perspective view showing components arranged in the internal space of the package 10 in the light emitting device 1 . Figure 4A yes Figure 3 Top view of the state. Figure 4B yes Figure 4A The end view of the IVB-IVB line. Figure 4B In FIG. 1 , a first portion 12P1 , a second portion 12P2 , and a third portion 12P3 of the via wiring 12P are respectively indicated by hatching. Figure 5 yes Figure 2 Cross-sectional view of the VV line. Figure 6 It is a perspective view of the base 11 . Figure 7 It is a cross-sectional view of the base 11 in the light emitting device 1 . Figure 8A It is a plan view showing a first example of a state in which the adhesive 14 is provided on the base 11 . Figure 8B It is a plan view showing a second example of a state in which the adhesive 14 is provided on the base 11 . Figure 8C 1 is a top view showing a third example of a state where an adhesive 14 is provided on a base 11. Figure 8A to Figure 8C In FIG, the first region M and the second region N of the substrate 11 are shown by hatching. Figure 8B and Figure 8C In FIG. 1 , a third region P of the substrate 11 is further indicated by hatching. Figure 9 It is a perspective view of the first graphite member 11F1. Figure 10 It is a perspective view of the second graphite member 11F2. Figure 11 12 is a top view of the frame 12. Figure 11 In FIG. 1 , the narrow portion 12A1 and the wide portion 12A2 of the upper surface 12A of the frame body 12 are shown by hatching. Figure 12A This is a bottom view showing a first example of the second bonding layer 12N2 provided on the lower surface 12B of the frame body 12 . Figure 12B It is a bottom view showing a second example of the second bonding layer 12N2 provided on the lower surface 12B of the frame body 12 . Figure 12C 1 is a bottom view showing a third example of the second bonding layer 12N2 provided on the lower surface 12B of the frame body 12. Figure 12A to Figure 12C In FIG, the narrow width portion 12B1 and the wide width portion 12B2 of the lower surface 12B of the frame body 12 are shown by hatching. Figure 12B and Figure 12C The extended portion 12B21 in the wide portion 12B2 is further shown by hatching. In the package 10, Figure 12A An example of the frame 12 shown in Figure 8A Corresponding to an example of the base 11 shown in Figure 12B An example of the frame 12 shown in Figure 8B Corresponding to an example of the base 11 shown in Figure 12C An example of the frame 12 shown in Figure 8C 1 corresponds to an example of the base 11 shown in FIG.

[0050] The light emitting device 1 includes a plurality of components, including a package 10 , one or more light emitting elements 20 , one or more substrates 30 , one or more reflective members 40 , one or more protective elements 50 , a plurality of wirings 60 , and an optical component 70 .

[0051] The light emitting device 1 may also include other components. For example, the light emitting device 1 may include further light emitting elements in addition to one or more light emitting elements 20. The light emitting device 1 may not include some of the components listed here.

[0052] First, each component will be described.

[0053] (Package 10)

[0054] Package 10 includes a base 11 and a frame 12. Package 10 further includes a lid 13. An internal space is defined within package 10, where other components are located. This internal space is a closed space surrounded by base 11, frame 12, and lid 13. This internal space can be sealed in a vacuum or airtight state.

[0055] The base 11 has an upper surface 11A. The base 11 has a lower surface 11B and one or more side surfaces 11C. The base 11 is in the shape of a flat plate or a rectangular parallelepiped. The upper surface 11A is in the shape of a rectangle. The upper surface 11A is in the shape of a rectangle with long sides and short sides.

[0056] The width of the substrate 11 in the X direction is, for example, 3 mm to 15 mm, the width in the Y direction is, for example, 5 mm to 10 mm, and the thickness in the Z direction is, for example, 0.5 mm to 5 mm.

[0057] The substrate 11 is mainly made of graphite and includes a main portion 11D made mainly of graphite and one or more metal layers 11G disposed on the main portion 11D. The one or more metal layers 11G may include a first metal layer 11G1 and a second metal layer 11G2.

[0058] Here, the term "primary material" refers to the material that accounts for the largest proportion by mass or volume in the target molded object. It should be noted that when a target molded object is formed from a single material, that material is considered the primary material. This also includes situations where that material's proportion can reach 100%.

[0059] Main portion 11D has an upper surface 11D1. Furthermore, main portion 11D further has a lower surface 11D2 and one or more side surfaces 11D3. Main portion 11D is shaped like a flat plate or a rectangular parallelepiped. Upper surface 11D1 is rectangular. Upper surface 11D1 is rectangular in shape, having long and short sides.

[0060] The main portion 11D may be formed of a laminated graphite 11E in which a plurality of graphite members 11F are laminated. The laminated graphite 11E is laminated in a direction perpendicular to the upper surface 11A of the base 11 and the upper surface 11D1 of the main portion 11D.

[0061] The graphite component 11F exhibits anisotropy in thermal conductivity. In XYZ space, the thermal conductivity in a two-dimensional plane is higher than in directions perpendicular to the plane. For example, when the X and Y directions are directions of high thermal conductivity, the Z direction is a direction of low thermal conductivity. It should be noted that the terms "high" and "low" in the context of high and low thermal conductivity are used to contrast and indicate whether the thermal conductivity in one direction is higher or lower than that in other directions.

[0062] The graphite component 11F can be formed by stacking multiple graphene sheets. Graphene sheets are sheets of graphene, formed by covalently bonding six-membered rings in a planar direction. In such a stack of graphene sheets, the stacking direction has low thermal conductivity, while the direction perpendicular to the stacking direction has high thermal conductivity. Specifically, the thermal conductivity in the stacking direction is approximately 5 [W / mK] to 10 [W / mK], and the thermal conductivity in the direction perpendicular to the stacking direction is approximately 1500 [W / mK] to 1700 [W / mK]. By using graphite as the main material, a substrate 11 with excellent heat dissipation properties can be achieved.

[0063] The stacked graphite members 11F are stacked in a direction that is highly heat-conductive, thereby forming the stacked graphite 11E. Therefore, the stacking direction of the graphite members 11F is perpendicular to the stacking direction of the graphene sheets within the graphite members 11F. Hereinafter, the stacking direction of the graphite members 11F is referred to as the first stacking direction, and the stacking direction of the graphene sheets within the graphite members 11F is referred to as the second stacking direction.

[0064] The laminated graphite 11E is formed by stacking multiple graphite members 11F so that the direction of high thermal conductivity in a plane perpendicular to the first stacking direction alternates. For example, a graphite member 11F arranged so that it has high thermal conductivity in the X and Z directions is placed on top of another graphite member 11F having high thermal conductivity in the Y and Z directions. By stacking the graphite members 11F in this manner while alternating the direction of high thermal conductivity, a laminated graphite 11E having high thermal conductivity in all directions can be simulated.

[0065] Here, a graphite member 11F having a higher thermal conductivity in a first direction than in a second direction perpendicular to the first direction is referred to as a first graphite member 11F1, and a graphite member 11F having a higher thermal conductivity in the second direction than in the first direction is referred to as a second graphite member 11F2. In the illustrated laminated graphite 11E, the first direction is the Y direction and the second direction is the X direction.

[0066] On a plane perpendicular to the first stacking direction, the graphite member 11F with a high heat conduction direction as the first direction and a low heat conduction direction as the second direction can be referred to as a first graphite member 11F1, and the graphite member 11F with a high heat conduction direction as the second direction and a low heat conduction direction as the first direction can be referred to as a second graphite member 11F2. It should be noted that the plane perpendicular to the first stacking direction is a plane parallel to the upper surface 11A of the base 11.

[0067] The laminated graphite 11E is formed by laminating a first graphite member 11F1 and a second graphite member 11F2. It should be noted that the first graphite members 11F1 and the second graphite members 11F2 do not need to be alternately laminated. For example, the second graphite member 11F2 may be laminated on top of two consecutive layers of the first graphite member 11F1.

[0068] The laminated graphite 11E includes at least one first graphite member 11F1 and one second graphite member 11F2. Preferably, the topmost and bottommost graphite members 11F of the laminated graphite 11E are both first graphite members 11F1 or both second graphite members 11F2. By uniformly configuring the topmost and bottommost graphite members 11F as the first graphite member 11F1 or the second graphite member 11F2, strain imbalance between the top and bottom surfaces is avoided, and the shape stability of the laminated graphite 11E is improved.

[0069] One or each metal layer 11G is arranged on the upper surface 11D1. One or each metal layer 11G can be arranged on the lower surface 11D2, or can be arranged on one or more side surfaces 11D3. One or each metal layer 11G can be arranged on the upper surface 11D1, the lower surface 11D2, and one or more side surfaces 11D3. One or each metal layer 11G can be arranged in a manner that covers the entire surface of the main portion 11D.

[0070] First metal layer 11G1 is disposed on upper surface 11D1 of main portion 11D. First metal layer 11G1 forms upper surface 11A of base 11. Second metal layer 11G2 is disposed on upper surface 11D1 of main portion 11D. Second metal layer 11G2 is provided between upper surface 11D1 and first metal layer 11G1. Therefore, first metal layer 11G1 is provided above second metal layer 11G2.

[0071] Second metal layer 11G2 is provided on main portion 11D with a thickness of 0.1 μm to 100 μm. This prevents cracks in main portion 11D from causing cracks in upper surface 11A of substrate 11. Second metal layer 11G2 is provided to cover the entire surface of main portion 11D.

[0072] The first metal layer 11G1 is disposed on the main portion 11D with a thickness of at least 0.1 μm and no greater than 5 μm. The second metal layer 11G2 is thicker than the first metal layer 11G1. Since the upper surface 11A of the substrate 11 can serve as a bonding surface with other components, the first metal layer 11G1 can be selected from the perspective of bonding while suppressing cracks on the upper surface 11A with the second metal layer 11G2. In this case, the first metal layer 11G1 does not need to be thicker than the second metal layer 11G2.

[0073] The first metal layer 11G1 is provided so as to cover the entire surface of the second metal layer 11G2. Since the first metal layer 11G1 covers the entire surface of the second metal layer 11G2, degradation of the second metal layer 11G2 due to oxidation or the like can be suppressed.

[0074] The first metal layer 11G1 can be a metal layer containing Ni or Au. For example, the first metal layer 11G1 can be formed by Ni / Au plating. The second metal layer 11G2 can be a metal layer containing Cu. Alternatively, the second metal layer 11G2 can be formed using Cu as the main material. For example, the second metal layer 11G2 can be formed by Cu plating.

[0075] The frame 12 has an upper surface 12A and a lower surface 12B. In addition, the frame 12 has one or more inner side surfaces 12C and one or more outer side surfaces 12D. The one or more inner side surfaces 12C intersect with the upper surface 12A. When viewed from above, the upper surface 12A forms a frame. When viewed from above, the lower surface 12B forms a frame. The frame 12 has a through hole defined on the inner side of the frame that runs through the upper and lower surfaces 12B. With respect to the frames formed by the upper surface 12A and the lower surface 12B, the frame defined by the inner edge can be referred to as an inner frame, and the frame defined by the outer edge can be referred to as an outer frame.

[0076] The outer edge of the frame 12 (the shape of the outer frame) is a rectangle. This outer edge is a rectangle with a long side and a short side. The outer frame of the frame 12 is a rectangle. This outer frame is a rectangle with a long side and a short side. The inner edge of the frame 12 (the shape of the inner frame) is a rectangle. This inner frame is a rectangle with a long side and a short side.

[0077] When viewed from above, the long sides of the outer frame of the frame body 12 are parallel to the long sides of the inner frame. It should be noted that, when viewed from above, the long sides of the outer frame of the frame body 12 may also be perpendicular to the long sides of the inner frame. In the following description of the frame body 12, unless otherwise specified, "short sides" and "long sides" refer to the short sides and long sides of the inner frame of the frame body 12. The illustrated frame body 12 shows an example in which, when viewed from above, the direction parallel to the long sides of the inner frame is the X direction, and the direction parallel to the short sides of the inner frame is the Y direction.

[0078] In the frame 12, when viewed from above, the center position of the outer frame does not coincide with the center position of the inner frame. Here, when viewed from above, the direction parallel to one of the four sides of the rectangular frame of the frame 12 is referred to as the third direction, and the direction perpendicular to that side is referred to as the fourth direction. The center of the outer frame and the center of the inner frame of the frame 12 in the top view coincide with each other in the third direction, but do not coincide with each other in the fourth direction. In the illustrated frame 12, the third direction is the X direction, and the fourth direction is the Y direction.

[0079] Between two opposing sides, the upper surface 12A has an area with different widths from the inner frame to the outer frame of the frame body 12. Additionally, between the other two opposing sides, the upper surface 12A has an area with equal widths from the inner frame to the outer frame of the frame body 12. In the illustrated frame body 12, the width from the inner frame to the outer frame of the upper surface 12A differs on the two opposing sides on the long side. Additionally, the width from the inner frame to the outer frame of the upper surface 12A is equal on the two opposing sides on the short side. It should be noted that the width from the inner frame to the outer frame can also be expressed as the distance from the inner side surface 12C to the outer side surface 12D.

[0080] In the upper surface 12A, between the two opposite sides, in the areas with different widths from the inner frame to the outer frame of the frame body 12, the narrower area is set as the narrow width portion 12A1, and the wider area is set as the wide width portion 12A2. In addition, among the four sides of the frame defining the rectangle, the side of the narrow width portion 12A1 is set as the first side, and the side of the wide width portion 12A2 is set as the second side. Therefore, there are two of each of the first side in the narrow width portion 12A1 and the second side in the wide width portion 12A2. In other words, there are the first side and the second side on the inner frame where the upper surface 12A intersects with the inner side surface 12C, and the first side and the second side on the outer frame where the upper surface 12A intersects with the outer side surface 12D.

[0081] In the illustrated frame 12 , of the two opposing long sides in a plan view, the area between the inner side surface 12C and the outer side surface 12D of one side is a narrow portion 12A1 , and the area between the inner side surface 12C and the outer side surface 12D of the other side is a wide portion 12A2 .

[0082] The frame 12 further has one or more stepped portions 12E. The stepped portion 12E has an upper surface 12F and a side surface 12G that intersects with the upper surface 12F and extends downward from the upper surface 12F. Here, the surface having one stepped portion 12E only includes one upper surface 12F and one side surface 12G. Therefore, the stepped portion 12E does not have an inner side surface 12C. In addition, when viewed from above, one or more stepped portions 12E are provided on the inner side of the inner frame of the frame 12. It should be noted that when observed from the perspective of the frame 12, the side surface 12G is not an outer side surface but an inner side surface.

[0083] One or more stepped portions 12E may include a first stepped portion 12E1 and a second stepped portion 12E2. The first stepped portion 12E1 and the second stepped portion 12E2 are positioned so that their respective side surfaces 12G face each other. The first stepped portion 12E1 and the second stepped portion 12E2 are positioned along the inner side surface 12C of the short side. The direction in which the side surface 12G of the first stepped portion 12E1 and the side surface 12G of the second stepped portion 12E2 face each other is the same as the direction in which the inner side surface 12C of the short side faces each other.

[0084] Side surface 12G of step portion 12E intersects lower surface 12B of frame body 12. Short sides of the inner frame formed on lower surface 12B are included in side surface 12G, and long sides of the inner frame formed on lower surface 12B are included in inner side surface 12C.

[0085] In the frame body 12, the center position of the outer frame is inconsistent with the center position of the inner frame when viewed from above. The lower surface 12B has an area with different widths from the inner frame to the outer frame of the frame body 12 between the two opposite sides. In addition, the lower surface 12B has an area with equal widths from the inner frame to the outer frame of the frame body 12 between the two opposite sides. In the illustrated frame body 12, the widths from the inner frame to the outer frame of the lower surface 12B are different on the two opposite sides on the long side. The widths from the inner frame to the outer frame of the lower surface 12B are equal on the two opposite sides on the short side. It should be noted that the width from the inner frame to the outer frame can also be expressed as the distance from the inner side surface 12C to the outer side surface 12D.

[0086] In the lower surface 12B, between two opposing sides, in the region of different widths from the inner frame to the outer frame of the frame body 12, the narrower region is designated as the narrow width portion 12B1, and the wider region is designated as the wide width portion 12B2. Of the four sides defining the rectangular frame, the side of the narrow width portion 12B1 is designated as the first side, and the side of the wide width portion 12B2 is designated as the second side. Therefore, there are two of each of the first side in the narrow width portion 12B1 and the second side in the wide width portion 12B2. In other words, there are a first side and a second side on the inner frame where the lower surface 12B intersects with the inner side surface 12C or the side surface 12G, and a first side and a second side on the outer frame where the lower surface 12B intersects with the outer side surface 12D.

[0087] In the illustrated frame 12 , of the two opposing long sides when viewed from below, the area between the inner side surface 12C and the outer side surface 12D of one side is a narrow portion 12B1 , and the area between the inner side surface 12C and the outer side surface 12D of the other side is a wide portion 12B2 .

[0088] In a plan view, the first side of the upper surface 12A and the first side of the lower surface 12B are located on the same side as seen from the inner side of the inner frame. In a plan view, the second side of the upper surface 12A and the second side of the lower surface 12B are located on the same side as seen from the inner side of the inner frame.

[0089] The frame 12 further includes a plurality of wiring layers 12M. The plurality of wiring layers 12M include one or more first wiring layers 12M1 provided inside the inner frame of the frame 12 in a plan view. Furthermore, the plurality of wiring layers 12M include one or more second wiring layers 12M2 provided outside the inner frame of the frame 12.

[0090] One or each first wiring layer 12M1 is provided on the upper surface 12F of the stepped portion 12E. One or each second wiring layer 12M2 is provided on the upper surface 12A. One or each second wiring layer 12M2 is provided in the wide portion 12A2. One or each second wiring layer 12M2 is included in the wide portion 12A2 when viewed from above.

[0091] One or more first wiring layers 12M1 are electrically connected to one or more second wiring layers 12M2. One or each first wiring layer 12M1 is electrically connected to the second wiring layer 12M2 via a via wiring 12P. One or each second wiring layer 12M2 is electrically connected to the first wiring layer 12M1 via a via wiring 12P.

[0092] The frame 12 includes one or more via wirings 12P. One or more via wirings 12P are provided within the frame 12. One or more via wirings 12P are connected to the first wiring layer 12M1. One or more via wirings 12P are connected to the second wiring layer 12M2. The via wirings 12P are connected to the first wiring layer 12M1 and the second wiring layer 12M2, thereby achieving electrical connection between the first wiring layer 12M1 and the second wiring layer 12M2.

[0093] One or each via wiring 12P includes a first portion 12P1 connected to the first wiring layer 12M1, a second portion 12P2 connected to the second wiring layer 12M2, and a third portion extending parallel to the upper surface 12A. First portion 12P1 extends in the vertical direction. Second portion 12P2 extends in the vertical direction. Third portion 12P3 connects to first portion 12P1 and second portion. In the illustrated light-emitting device 1, third portion 12P3 of via wiring 12P extends in the Y direction.

[0094] In one or each via wiring 12P, the third portion 12P3 is located closest to the lower surface 12B of the frame 12. The distance from the lower surface 12B of the frame 12 to the third portion 12P3 of the via wiring 12P is greater than 0 and is less than 1000 μm. This distance is preferably less than 500 μm. By setting this distance less than 500 μm, heat generated in the third portion 12P3 can be more easily transferred to the lower surface 12B.

[0095] In one or each via wiring 12P, the vertical distance from the lower surface 12B of the frame 12 to the third portion 12P3 of the via wiring 12P is shorter than the vertical distance from the first wiring layer 12M1 connected to the first portion 12P1 of the via wiring 12P to the third portion 12P3. By providing the third portion 12P3 closest to the lower surface 12B of the frame 12 in this manner, heat generated in the via wiring 12P is more easily transferred to the lower surface 12B.

[0096] In one or each via wiring 12P, the vertical distance from the lower surface 12B of the frame 12 to the third portion 12P3 of the via wiring 12P is smaller than the vertical distance from the first wiring layer 12M1 connected to the first portion 12P1 of the via wiring 12P to the third portion 12P3 by more than 50 μm.

[0097] One or more first wiring layers 12M1 are arranged below one or more second wiring layers 12M2. The vertical distance from the lower surface 12B of the frame 12 to the third portion 12P3 of the via wiring 12P is shorter than the vertical distance from the second wiring layer 12M2 to the third portion 12P3.

[0098] The thermal conductivity of the via wiring 12P is 100 [W / mK] or higher and 500 [W / mK] or lower. Alternatively, the thermal conductivity of the via wiring 12P may be 150 [W / mK] or higher and 500 [W / mK] or lower. The thermal conductivity of the via wiring 12P is lower than the thermal conductivity of the graphite member 11F in the direction of high thermal conductivity and higher than the thermal conductivity of the graphite member 11F in the direction of low thermal conductivity.

[0099] The frame 12 further includes one or more bonding layers 12N. The one or more bonding layers 12N include a first bonding layer 12N1 provided in a frame-like shape near the inner frame of the upper surface 12A when viewed from above. The plurality of bonding layers 12N include a second bonding layer 12N2 provided in a frame-like shape near the inner frame of the lower surface 12B when viewed from above. For example, the frame 12 may not include the first bonding layer 12N1.

[0100] like Figure 12A As shown, the second bonding layer 12N2 may be composed only of a portion provided near the inner frame of the lower surface 12B. Figure 12B As shown, the second bonding layer 12N2 may be configured to include a first portion 12N21 provided near the inner frame of the lower surface 12B, a second portion 12N22 provided directly below one or more second wiring layers 12M2, and a third portion 12N23 provided between the first portion 12N21 and the second portion 12N22. Figure 12C As shown, the second bonding layer 12N2 has a first portion 12N21 arranged near the inner frame of the lower surface 12B, and a second portion 12N22 arranged directly below one or more second wiring layers 12M2. The first portion 12N21 and the second portion 12N22 can be constructed in a manner that is not connected and separated from each other.

[0101] On upper surface 12A, first bonding layer 12N1 is arranged so as to be separated from each of the plurality of wiring layers 12M. The distance from the outer frame or outer edge of the portion of second bonding layer 12N2 disposed near the inner frame of lower surface 12B in wide portion 12B2 of lower surface 12B to the second side of the outer frame of lower surface 12B is greater than the distance from the outer frame or outer edge of second bonding layer 12N2 in narrow portion 12B1 of lower surface 12B to the first side of the outer frame of lower surface 12B. Here, the difference between the former distance and the latter distance is referred to as a first difference.

[0102] On the lower surface 12B, the difference between the width of the second bonding layer 12N2 portion located near the inner frame of the wide portion 12B2 and the width of the second bonding layer 12N2 in the narrow portion 12B1 is defined as the second difference, and the first difference is greater than the second difference. In the illustrated frame 12, the width of the second bonding layer 12N2 located near the inner frame of the lower surface 12B in the wide portion 12B2 is equal to the width of the second bonding layer 12N2 in the narrow portion 12B1. Note that this equality includes a deviation of up to 50 μm.

[0103] When the wide portion 12B2 is divided into two areas by a straight line passing through the midpoint of the width from the second side on the inner frame of the wide portion 12B2 to the second side on the outer frame and parallel to the second side, the outer frame or outer edge of the portion of the second bonding layer 12N2 in the wide portion 12B2 that is arranged near the inner frame of the lower surface 12B is within the area of ​​the two areas that includes the second side on the inner frame of the wide portion 12B2.

[0104] like Figure 12B and Figure 12C As shown, the second portion 12N22 of the second bonding layer 12N2 can be composed of one or more regions. It should be noted that when the second portion 12N22 is composed of multiple regions, the multiple regions are separated from each other. When viewed from above, the shape of one or each second portion 12N22 is rectangular.

[0105] Since second bonding layer 12N2 includes second portion 12N22, adhesive can be provided directly beneath one or more second wiring layers 12M2. This allows the gap between upper surface 11A of base body 11 and lower surface 12B of frame body 12 in the region where second wiring layers 12M2 are provided to be filled. Since second wiring layers 12M2 may require bonding to wiring using a bonding device, pre-filling the gap can reduce the risk of damage to frame body 12 caused by the bonding process.

[0106] A gap of 200 μm or more exists between the first portion 12N21 and the second portion 12N22 of the second bonding layer 12N2 in the Y direction. Providing a gap of 200 μm or more can prevent the adhesive 14 used for bonding the second portion 12N22 from flowing into the first portion 12N21.

[0107] In a plan view, the ratio of the area where one or more second wiring layers 12M2 overlap with the second portion 12N22 relative to the area where one or more second wiring layers 12M2 are provided can be 40% or more and 100% or less. Furthermore, this ratio is preferably 50% or more. The greater this ratio, the lower the risk of damage described above.

[0108] like Figure 12B As shown, the third portion 12N23 of the second bonding layer 12N2 serves as a connection portion connecting the first portion 12N21 and the second portion 12N22. By forming the second bonding layer 12N2 in a single connection region, for example, by using an electrical method such as electroplating, the bonding process when bonding the upper surface 11A of the base 11 and the lower surface 12B of the frame 12 becomes easier.

[0109] like Figure 12B As shown, the width of the third portion 12N23 in the X direction is smaller than the distance between the ends of the first portion 12N21 in the X direction. The width of the third portion 12N23 in the X direction is also smaller than the distance between the ends of the second portion 12N22 in the X direction. By making the width of the connecting portion relatively shorter, the adhesive used to bond the second portion 12N22 to the first portion 12N21 can be reduced from extending.

[0110] like Figure 12C As shown, by separating the first portion 12N21 and the second portion 12N2 , it is possible to suppress the adhesive for bonding the second portion 12N22 from extending toward the first portion 12N21 .

[0111] On the upper surface 12A, the distance from the first side on the outer frame to the second side on the inner frame is greater than the distance from the second side on the outer frame to the second side on the inner frame. On the upper surface 12A, the distance from the first side on the inner frame to the second side on the inner frame is greater than the distance from the second side on the outer frame to the second side on the inner frame.

[0112] On the lower surface 12B, the distance from the first side of the outer frame to the second side of the inner frame is greater than the distance from the second side of the outer frame to the second side of the inner frame. On the lower surface 12B, the distance from the first side of the inner frame to the second side of the inner frame is greater than the distance from the second side of the outer frame to the second side of the inner frame.

[0113] The frame 12 can be formed using, for example, ceramic as a main material. Examples of the ceramic as a main material of the frame 12 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0114] The wiring layer 12M can be formed mainly of a metal material, for example. Examples of the metal material mainly used for the wiring layer 12M include single metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals.

[0115] The bonding layer 12N can be formed mainly of, for example, a metal material. Examples of the metal material mainly comprising the bonding layer 12N include single metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, and alloys containing these metals.

[0116] The frame 12 is bonded to the base 11. The lower surface 12B of the frame 12 is bonded to the base 11. Lower surface 12B is bonded to upper surface 11A. Because metal layer 11G forms upper surface 11A of the base 11, cracks and gas leakage in the bonded portion can be suppressed compared to directly bonding the frame 12 to graphite. The frame 12 is bonded to the first metal layer 11G1 of the base 11. The second bonding layer 12N2 of the frame 12 is bonded to the base 11. The frame 12 is bonded to the base 11 via an adhesive 14.

[0117] Since frame 12 is bonded to base 11, heat generated in via wiring 12P is conducted from lower surface 12B to base 11, thereby improving heat dissipation. Since the direction in which third portion 12P3 of via wiring 12P extends aligns with the direction of high thermal conductivity of graphite member 11F, the layer closest to upper surface 11A of base 11, heat is more easily dissipated in the direction in which third portion 12P3 extends.

[0118] The vertical distance from the upper surface 11A of the base 11 to the third portion 12P3 of the via wiring 12P is shorter than the vertical distance from the first wiring layer 12M1 connected to the first portion 12P1 of the via wiring 12P to the third portion 12P3. This allows heat generated in the via wiring 12P to be more easily transferred to the base 11.

[0119] The adhesive 14 for joining the base 11 and the frame 12 is provided in a frame-like shape on the upper surface 11A of the base 11. It should be noted that, before the base 11 and the frame 12 are joined, the adhesive 14 can be provided in a continuous frame shape or in a plurality of frame shapes. For example, by arranging spherical adhesives 14 along the frame, the adhesive 14 can be provided in a plurality of frame shapes.

[0120] Before base body 11 and frame body 12 are bonded together, adhesive 14 is provided in a frame-like shape on upper surface 11A of base body 11, so as to be contained within the frame formed by second bonding layer 12N2 of frame body 12. In other words, by projecting the shape of the area surrounded by the inner and outer frames of second bonding layer 12N2 onto upper surface 11A, the area where adhesive 14 is provided can be completely covered.

[0121] To bond frame 12 to base 11 using adhesive 14 disposed in this manner, adhesive 14 is disposed near the inner frame or inner edge of lower surface 12B, which delimits the through-hole. Disposing adhesive 14 near the inner edge of lower surface 12B reduces the size of the resulting border, compared to disposing adhesive 14 near the outer edge of lower surface 12B. This allows for a smaller amount of adhesive 14 to be used to bond frame 12 to base 11.

[0122] The adhesive 14 in a state of being cured by the bonding process has a continuous frame shape, thereby sufficiently preventing gas leakage and substrate intrusion between the base 11 and the frame 12 .

[0123] exist Figure 8A In the example shown, adhesive 14 is not provided directly beneath at least a portion of second wiring layer 12M2. By limiting the bonding area of ​​adhesive 14, the heat conduction path between base 11 and frame 12 can be reduced, thereby achieving a package with excellent heat dissipation. It should be noted that since adhesive 14 cures in a shape similar to that of second bonding layer 12N2, it is also possible to provide adhesive 14 without providing it directly beneath one or each second wiring layer 12M2.

[0124] exist Figure 8B and Figure 8CIn the example shown, the adhesive 14 is provided directly below at least a portion of the second wiring layer 12M2 , thereby reducing the risk of damage to the frame 12 caused by processes that apply a load to the second wiring layer 12M2 , such as wire bonding.

[0125] When viewed from above, the adhesive 14 does not necessarily need to completely cover one or more second wiring layers 12M2. However, it is preferred that at least 50% of the area of ​​the second wiring layers 12M2 overlap. For one or more second wiring layers 12M2, at least 50% of the area of ​​the second wiring layers 12M2 overlap is preferred. A greater overlap ratio further reduces the risk of damage.

[0126] When viewed from above, the outer edge shape of the upper surface 11A of the base 11 is larger than the inner frame of the frame 12. When viewed from above, the outer edge shape of the upper surface 11A is substantially the same as or larger than the outer edge shape of the frame 12 (the shape of the outer frame). It should be noted that "substantially the same" here includes the case where the outer edge shape of the upper surface 11A is slightly smaller than the outer edge shape of the frame 12. Due to the increased shape of the base 11, a package 10 with excellent heat dissipation can be achieved.

[0127] When viewed from above, the top surface 11A of the base 11 includes a first region M covering the through-holes of the frame 12, and a second region N extending from the first region M to directly below the second wiring layer 12M2 provided on the top surface 12A of the frame 12. By extending the top surface 11A of the base 11 from the vicinity of the through-holes to directly below the second wiring layer 12M2, the area of ​​the top surface 11A of the base 11 can be increased, thereby achieving a package 10 with excellent heat dissipation. The second region N of the top surface 11A includes an area where the adhesive 14 for bonding the base 11 to the frame 12 is not provided.

[0128] exist Figure 8A In the example shown, the adhesive 14 is not provided in the second region N. Figure 8B and Figure 8C In the example shown, the adhesive 14 is provided in the second region N. In the second region N, the adhesive 14 is not provided in the third region P between the vicinity of the inner edge of the lower surface 12B of the frame body 12 and directly below one or more second wiring layers 12M2 .

[0129] exist Figure 8B and Figure 12B In the example shown, at least a portion of the second portion 12N22 of the frame 12 overlaps the third region P of the base 11 when viewed from above, but no adhesive 14 is provided there. However, since the adhesive 14 extends during the bonding process, it can partially reach the second portion 12N22, and thus the adhesive 14 can also reach the third region P.

[0130] When viewed from above, more than 70% of the area of ​​one or each second wiring layer 12M2 overlaps with the upper surface 11A of the base 11. Alternatively, when viewed from above, more than 80% of the area of ​​one or each second wiring layer 12M2 overlaps with the upper surface 11A of the base 11. Alternatively, when viewed from above, more than 90% of the area of ​​one or each second wiring layer 12M2 overlaps with the upper surface 11A of the base 11. The larger the overlapping area between the upper surface 11A and the second wiring layer 12M2, the more the upper surface 11A of the base 11 expands, thereby achieving a package 10 with excellent heat dissipation.

[0131] Adhesive 14 is, for example, an adhesive containing AuSn. Adhesive 14 has a melting temperature of 300°C or less during the bonding process. Excessively high temperatures during the bonding process may deteriorate the adhesion between the graphite in substrate 11 and metal layer 11G. Therefore, it is preferable to use an adhesive with a low melting temperature.

[0132] The cover 13 has an upper surface 13A, a lower surface 13B, and one or more side surfaces 13C. The cover 13 is formed in the shape of a rectangular parallelepiped flat plate. However, it is not necessary to be a rectangular parallelepiped.

[0133] The cover 13 has light-transmitting properties. Here, light-transmitting properties are defined as having a transmittance of 80% or greater for light incident on the cover 13. It should be noted that the cover 13 may optionally have a non-light-transmitting region (a region that is not light-transmitting) in part.

[0134] The cover 13 is bonded to the frame 12. The lower surface 13B of the cover 13 is bonded to the upper surface 12A of the frame 12. The cover 13 is bonded to the first bonding layer 12N1 of the frame 12. The cover 13 does not overlap with the second wiring layer 12M2 in a plan view.

[0135] The cover 13 can be formed mainly of glass, for example. The cover 13 is not limited to glass, and can also be formed mainly of sapphire, for example.

[0136] (Light-emitting element 20)

[0137] The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and a plurality of side surfaces 21C. The upper surface 21A is rectangular. This rectangle has long sides and short sides. The outer shape of the light-emitting element 20 in a top view is rectangular. This rectangle has long sides and short sides. It should be noted that the shape of the upper surface 21A and the outer shape of the light-emitting element 20 in a top view are not limited to these.

[0138] Light-emitting element 20 has a light-emitting surface 22 for emitting light. For example, side surface 21C can serve as light-emitting surface 22. Side surface 21C, serving as light-emitting surface 22, intersects with a short side of top surface 21A. For example, top surface 21A can serve as light-emitting surface 22. Light-emitting element 20 has one or more light-emitting surfaces 22.

[0139] For example, the light-emitting element 20 may be a light-emitting element that emits blue light. Alternatively, the light-emitting element 20 may be a light-emitting element that emits green light. Alternatively, the light-emitting element 20 may be a light-emitting element that emits red light. It should be noted that the light-emitting element 20 may also be a light-emitting element that emits light of other colors or wavelengths.

[0140] Here, blue light refers to light with a peak emission wavelength in the range of 420nm to 494nm. Green light refers to light with a peak emission wavelength in the range of 495nm to 570nm. Red light refers to light with a peak emission wavelength in the range of 605nm to 750nm.

[0141] Examples of light-emitting elements 20 that emit blue light or green light include light-emitting elements comprising nitride semiconductors. Examples of nitride semiconductors include GaN, InGaN, and AlGaN-based semiconductors. Examples of light-emitting elements 20 that emit red light include light-emitting elements comprising InAlGaP-based, GaInP-based, and GaAs-based semiconductors, such as GaAs and AlGaAs.

[0142] For example, a semiconductor laser element can be used as the light-emitting element 20. A single-emitter semiconductor laser element consisting of a single emitter can be used as the light-emitting element 20. Alternatively, a multi-emitter semiconductor laser element consisting of multiple emitters can be used as the light-emitting element 20. It should be noted that the light-emitting element 20 is not limited to a semiconductor laser element; a light-emitting diode or the like can also be used.

[0143] Here, a semiconductor laser element as an example of the light emitting element 20 will be described.

[0144] The semiconductor laser element emits directional laser light. Divergent light is emitted from the light exit surface 22 of the semiconductor laser element. Light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light exit surface 22. The FFP refers to the shape and light intensity distribution of the emitted light at a position far from the light exit surface of the semiconductor laser element.

[0145] Here, light passing through the center of the elliptical shape of the FFP, in other words, light with peak intensity in the light intensity distribution of the FFP, is referred to as light propagating along the optical axis or light passing through the optical axis. In the light intensity distribution of the FFP, the light with 1 / e relative to the peak intensity value is referred to as 2 Light with an intensity above this is called main light.

[0146] On a plane parallel to the light-emitting surface 22, the FFP of light emitted from the semiconductor laser element is an elongated ellipse, with the length in the stacking direction being longer than the length in a direction perpendicular to the stacking direction. The stacking direction refers to the direction in which the multiple semiconductor layers, including the active layer, are stacked in a semiconductor laser element. The direction perpendicular to the stacking direction can also be referred to as the in-plane direction of the semiconductor layers. The long axis of the elliptical FFP is referred to as the fast axis of the semiconductor laser element, and the short axis is referred to as the slow axis of the semiconductor laser element.

[0147] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The beam divergence angle of a semiconductor laser element is defined as the angle at which light with a given intensity diverges. Here, the beam divergence angle is the ratio of the peak light intensity (light passing through the optical axis) to 1 / e of the peak light intensity. 2 The angle formed by the light intensity is expressed as follows. It should be noted that, in addition to the peak light intensity 1 / e 2 In addition to the light intensity, for example, the beam divergence angle can also be calculated by the light intensity at half the peak light intensity. In the description of this specification, when "beam divergence angle" is used alone, it means 1 / e of the peak light intensity. 2 The beam divergence angle at the light intensity of

[0148] The divergence angle of the light emitted from the semiconductor laser element in the fast axis direction may be greater than 20 degrees and less than 80 degrees. The divergence angle of the light in the slow axis direction may be greater than 0 degrees and less than 20 degrees. The divergence angle of the light in the fast axis direction is greater than the divergence angle in the slow axis direction.

[0149] For example, the divergence angle of the blue light emitted by the semiconductor laser element in the fast axis direction can be greater than 30 degrees and less than 60 degrees, and the divergence angle in the slow axis direction can be greater than 5 degrees and less than 20 degrees. For example, the divergence angle of the green light emitted by the semiconductor laser element in the fast axis direction can be greater than 30 degrees and less than 60 degrees, and the divergence angle in the slow axis direction can be greater than 5 degrees and less than 20 degrees. For example, the divergence angle of the red light emitted by the semiconductor laser element in the fast axis direction can be greater than 40 degrees and less than 80 degrees, and the divergence angle in the slow axis direction can be greater than 5 degrees and less than 20 degrees.

[0150] (Substrate 30)

[0151] Substrate 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. Upper surface 31A can serve as a mounting surface for other components. Upper surface 31A is rectangular in shape. The rectangle of upper surface 31A can have a short side and a long side. Furthermore, upper surface 31A may not be rectangular in shape.

[0152] The outer shape of the substrate 30 in a top view is rectangular. The rectangle of the substrate 30 may have a short side and a long side. It should be noted that the outer shape of the substrate 30 in a top view may not be rectangular. The substrate 30 may have an outer shape in which the length in one direction (hereinafter referred to as the short side direction) is shorter than the length in the direction perpendicular thereto (hereinafter referred to as the long side direction) when viewed from above. In the illustrated substrate 30, the short side direction is the same as the X direction, and the long side direction is the same as the Y direction.

[0153] The substrate 30 may include a base 32A and an upper metal portion 32B. The substrate 30 may further include a lower metal portion 32C. The upper metal portion 32B is provided on the upper surface of the substrate 32A. The lower metal portion 32C is provided on the lower surface of the substrate 32A. The substrate 30 further includes a wiring layer 33. The wiring layer 33 is provided on the upper metal portion 32B.

[0154] The substrate 32A has insulating properties. The substrate 32A is formed of, for example, silicon nitride, aluminum nitride, or silicon carbide. The main material of the substrate 32A can be a ceramic with good heat dissipation properties (high thermal conductivity).

[0155] The upper metal portion 32B is mainly made of a metal such as copper or aluminum. The upper metal portion 32B includes one or more metal layers. The upper metal portion 32B may include multiple metal layers mainly made of different metals.

[0156] The lower metal portion 32C is mainly made of a metal such as copper or aluminum. The lower metal portion 32C includes one or more metal layers. The lower metal portion 32C may include multiple metal layers mainly made of different metals.

[0157] The wiring layer 33 can be formed using metal. For example, the wiring layer 33 can be formed using AuSn solder (AuSn metal layer).

[0158] For example, the length of the substrate 30 in the short-side direction or the short-side direction is 300 μm or more and 2000 μm or less. The length of the substrate 30 in the long-side direction or the long-side direction is 500 μm or more and 10000 μm or less. The difference between the length of the long-side direction and the length of the short-side direction of the substrate 30 is 200 μm or more and 9000 μm or less.

[0159] For example, the thickness of substrate 30 (the width in the direction perpendicular to upper surface 31A) is 100 μm or greater and 500 μm or less. For example, the thickness of substrate 32A is 100 μm or greater and 400 μm or less. For example, the thickness of upper metal portion 32B is 0 μm or greater and 200 μm or less. For example, the thickness of lower metal portion 32C is 0 μm or greater and 200 μm or less. For example, the thickness of wiring layer 33 is 0.1 μm or greater and 5 μm or less.

[0160] (Reflection member 40)

[0161] The reflective member 40 includes a lower surface 41A and a light reflecting surface 41B for reflecting light. Light reflecting surface 41B is inclined relative to lower surface 41A. A straight line connecting the lower end and the upper end of light reflecting surface 41B is inclined relative to lower surface 41A. The angle at which light reflecting surface 41B is inclined relative to lower surface 41A is referred to as the inclination angle of light reflecting surface 41B.

[0162] The light reflecting surface 41B is a flat surface. Alternatively, the light reflecting surface 41B may be a curved surface. The light reflecting surface 41B has an inclination angle of 45 degrees. Alternatively, the light reflecting surface 41B may have an inclination angle other than 45 degrees.

[0163] The reflector 40 can be made primarily of glass, metal, or the like. A heat-resistant material can be used as the reflector 40. Examples of the reflector 40 include glass such as quartz or BK7 (borosilicate glass), and metals such as aluminum. Alternatively, the reflector 40 can be made primarily of silicon.

[0164] If the primary material is a reflective material such as Al, light-reflecting surface 41B can be formed from the primary material. Alternatively, the primary material can be used to form the base structure of reflective component 40, with light-reflecting surface 41B formed on the surface of the base structure. In this case, light-reflecting surface 41B can be formed using, for example, a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0165] The reflectivity of the light reflecting surface 41B for the peak wavelength of light irradiating the light reflecting surface 41B is 90% or higher. This reflectivity may be 95% or higher. Alternatively, this reflectivity may be 99% or higher. The light reflectivity is 100% or lower or less than 100%.

[0166] (Protection element 50)

[0167] The protection element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The protection element 50 is in the shape of a rectangular parallelepiped. It should be noted that the shape of the protection element 50 does not need to be a rectangular parallelepiped.

[0168] The protection element 50 is used to prevent a specific element (for example, the light emitting element 20) from being damaged by excessive current. An example of the protection element 50 is a Zener diode. A Zener diode made of Si can be used as the Zener diode.

[0169] (Wiring 60)

[0170] Wiring 60 is a linear conductive material with two ends forming joints. The joints at both ends are the parts that connect to other components. Wiring 60 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0171] (Optical component 70)

[0172] The optical component 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical component 70 applies an optical effect to light incident on the optical component 70. Examples of the optical effects applied by the optical component 70 to light include focusing, collimation, diffusion, polarization, diffraction, combining, guiding, reflection, and wavelength conversion.

[0173] The optical component 70 has an optically active surface that exerts an optical effect. The upper surface 71A, lower surface 71B, or side surface 71C may be referred to as the optically active surface. Alternatively, the optically active surface may be located at a different position from the upper surface 71A, lower surface 71B, and side surface 71C. For example, the optically active surface may be formed internally rather than on the surface of the optical component 70.

[0174] The optical component 70 may have one or more lens surfaces 71D. Lens surfaces 71D are the optically active surfaces of the optical component 70. It should be noted that an optical component 70 having lens surfaces 71D may also be referred to as a lens component. The optical component 70 applies an optical effect of focusing, diffusing, or collimating light emitted from the optical component 70 through the lens surfaces 71D. For example, the optical component 70 may be a collimating lens that converts incident light into collimated light for emission.

[0175] One or each lens surface 71D is provided on the upper surface 71A side. Alternatively, lens surface 71D may be provided on the lower surface 71B side. Upper surface 71A and lower surface 71B are flat surfaces. One or each lens surface 71D intersects with upper surface 71A. In a plan view, one or each lens surface 71D is surrounded by upper surface 71A.

[0176] When viewed from above, the outer shape of the optical component 70 is rectangular. However, the outer shape of the optical component 70 when viewed from above does not have to be rectangular. The lower surface 71B is flat. No lens surface 71D is formed on the lower surface 71B side of the optical component 70. The shape of the lower surface 71B is rectangular. Furthermore, the shape of the lower surface 71B does not have to be rectangular.

[0177] In optical component 70, the portion that overlaps with lens surface 71D when viewed from above is referred to as lens portion 72A. In optical component 70, the portion that overlaps with upper surface 71A when viewed from above is referred to as non-lens portion 72B. Lower surface 71B includes a region that constitutes the lower surface of one or each lens portion 72A and a region that constitutes the lower surface of non-lens portion 72B.

[0178] The optical component 70 may include a plurality of lens surfaces 71D formed continuously in a single direction. The direction in which the plurality of lens surfaces 71D are arranged in a plan view is referred to as a connecting direction. In the illustrated optical component 70, the connecting direction is the same as the X direction.

[0179] The plurality of lens surfaces 71D are formed so that the vertices of the lens surfaces 71D are arranged on a straight line. The virtual straight line connecting the vertices is parallel to the lower surface 71B of the optical component 70. It should be noted that the parallelism here includes a deviation within ±5 degrees.

[0180] The curvatures of a part or all of the plurality of lens surfaces 71D, or two or more lens surfaces 71D, may be the same. The curvatures of all the plurality of lens surfaces 71D may be the same.

[0181] The optical component 70 is light-transmissive. The transmittance of the optical component 70 at the peak wavelength of light incident on the optical component 70 is 80% or greater. The optical component 70 may optionally include a light-transmissive region and a light-non-transmissive region (hereinafter also referred to as a non-light-transmissive region). In the non-light-transmissive region, the transmittance at the peak wavelength of light incident on the optical component 70 is 50% or less. The optical component 70 can be formed using glass such as BK7.

[0182] Next, the light emitting device 1 will be described.

[0183] In the light emitting device 1, one or more light emitting elements 20 are arranged on the upper surface 11A of the base 11. In a plan view, the one or more light emitting elements 20 are surrounded by the through hole of the frame 12. The one or more light emitting elements 20 are located below the upper surface 12A of the frame 12.

[0184] One or each light-emitting element 20 emits light in a predetermined direction. One or each light-emitting element 20 emits light from light-emitting surface 22 so that light passing through the optical axis is parallel to upper surface 11A. Hereinafter, the predetermined direction in which light is emitted from light-emitting surface 22 is referred to as the fifth direction. In the illustrated light-emitting device 1, the fifth direction is the positive Y direction.

[0185] The light emitting device 1 may include a plurality of light emitting elements 20 . That is, the light emitting device 1 may include the first light emitting element 20 or may include one or more second light emitting elements 20 in addition to the first light emitting element 20 .

[0186] In the light emitting device 1, a plurality of light emitting elements 20 are arranged in one direction. The plurality of light emitting elements 20 are arranged in a direction perpendicular to the fifth direction in a plan view. In the light emitting device 1 shown in the figure, the plurality of light emitting elements 20 are arranged in the X direction.

[0187] In the light emitting device 1, the plurality of light emitting elements 20 are composed of three or more light emitting elements 20. In this case, the plurality of light emitting elements 20 arranged in one direction include not only the light emitting elements 20 at both ends but also the light emitting elements 20 arranged between the light emitting elements 20 at both ends.

[0188] The base 11 is configured such that the graphite member 11F in the layer closest to the upper surface 11A of the base 11, included in the laminated graphite 11E, has a high heat conduction direction perpendicular to the light emitting surface 22. By configuring the base 11 in this manner, heat generated by the light-emitting element 20 in the graphite member 11F in the layer closest to the upper surface 11A is less likely to be conducted to adjacent light-emitting elements 20, thereby achieving balanced heat dissipation among the light-emitting elements 20.

[0189] When comparing the light-emitting elements 20 located at both ends with the light-emitting elements 20 located between the two ends, the light-emitting elements 20 located at both ends have no light-emitting elements 20 on either side, while the light-emitting elements 20 located between the two ends have light-emitting elements 20 on either side. In this case, if the fifth direction is configured for high thermal conductivity, the light-emitting elements 20 located between the two ends may be more susceptible to heat accumulation and degradation than the light-emitting elements 20 located at the end. Therefore, emphasizing an overall balanced heat dissipation method contributes to extending the life of the light-emitting device 1. In the illustrated light-emitting device 1, a first graphite member 11F1 is provided in the layer closest to the upper surface 11A of the base 11, forming a laminated graphite 11E.

[0190] In a plane parallel to upper surface 11A, laminated graphite 11E has a greater number of graphite members 11F having a high heat conduction direction perpendicular to light exit surface 22 than graphite members 11F having a high heat conduction direction parallel to light exit surface 22. Laminated graphite 11E having such a structure promotes heat conduction perpendicular to light exit surface 22 over heat conduction parallel to light exit surface 22.

[0191] In the light-emitting device 1, the light-emitting element 20 is arranged such that the inner side surface 12C intersecting with the narrow portion 12A1 or the wide portion 12A2 of the frame 12 faces the light-emitting surface 22 of the light-emitting element 20. Therefore, the second region N of the base 11 extends from the first region M in a direction perpendicular to the light-emitting surface 22. By promoting heat conduction in a direction perpendicular to the light-emitting surface 22 and expanding the second region N in a direction perpendicular to the light-emitting surface 22, the heat dissipation performance of the base 11 can be improved.

[0192] In the illustrated light-emitting device 1, the inner side surface 12C intersecting the narrow portion 12A1 is disposed opposite the light-emitting surface 22 of the light-emitting element 20. Therefore, the wide portion 12A2 is disposed away from the light-emitting surface 22 in a direction opposite to the fifth direction. The second wiring layer 12M2 is disposed on the upper surface 12A in a direction opposite to the fifth direction. The second region N extends from the first region M in a direction opposite to the fifth direction.

[0193] In the light emitting device 1, one or more light emitting elements 20 are arranged on a substrate 30. The light emitting element 20 is arranged on the wiring layer 33 of the substrate 30. A plurality of light emitting elements 20 are not arranged on a single substrate 30. It should be noted that a plurality of light emitting elements 20 may be arranged on a single substrate 30.

[0194] The substrate 30 is disposed on the upper surface 11A of the base 11. The substrate 30 is bonded to the upper surface 11A of the base 11. The lower metal portion 32C of the substrate 30 is bonded to the upper surface 11A of the base 11 by an adhesive. The thickness (width in the vertical direction) of the base 11 is greater than the thickness of the substrate 30. Therefore, when forming a structure having stacked graphite 11E and a metal layer 11G, it is easier to adjust the thickness of the graphite component 11F and the thickness of the metal layer 11G of the base 11, and the degree of freedom in design is high. The substrate 30 is also provided for adjusting the height of the light emitted by the light-emitting element 20, and in this case, the degree of freedom in designing the thickness is limited.

[0195] The main material forming the lower metal portion 32C of the substrate 30 is preferably the same as the main material forming the one or more metal layers 11G of the base 11. This can suppress deformation caused by stress, reduce the risk of cracking during bonding with other components, and improve the bonding reliability of the substrate 30. For example, the main material forming the one or more metal layers 11G is the same as the main material forming the second metal layer 11G2. For example, the main material forming the lower metal portion 32C and the second metal layer 11G2 is Cu.

[0196] The width of one or each light-emitting element 20 in the fifth direction, when viewed from above, is greater than the width in a direction perpendicular to the fifth direction. In the light-emitting device 1, the plurality of light-emitting elements 20 are arranged in a direction parallel to the long sides of the frame 12. Arranging the light-emitting elements 20 in a direction parallel to the long sides of the frame 12 allows for a greater number of light-emitting elements 20 to be arranged than when arranged in a direction parallel to the short sides, thereby increasing the output of light emitted by the light-emitting device 1.

[0197] In the light emitting device 1, the width of the base 11 in the fifth direction on a plane parallel to the upper surface 11A is smaller than the width in a direction perpendicular to the fifth direction. In the illustrated light emitting device 1, the width of the upper surface 11A of the base 11 in the X direction is larger than the width in the Y direction.

[0198] On the other hand, the distance in the direction perpendicular to the fifth direction from the light-emitting element 20 arranged at the end to the outer edge of the upper surface 11A of the base 11 is shorter than the distance in the fifth direction from the side surface opposite to the light-emitting surface 22 of the light-emitting element 20 to the outer edge of the upper surface 11A of the base 11. Alternatively, the distance in the direction perpendicular to the fifth direction from the light-emitting element 20 arranged at the end to the outer edge of the upper surface 11A of the base 11 is shorter than the distance in the fifth direction from the light-emitting surface 22 of the light-emitting element 20 to the outer edge of the upper surface 11A of the base 11. In other words, as a width for dissipating heat generated by the light-emitting element 20 to the outside of the light-emitting element 20, a greater width in the fifth direction is ensured than in the direction perpendicular to the fifth direction.

[0199] In the light-emitting device 1, one or more reflective members 40 are disposed on the upper surface 11A of the base 11. One reflective member 40 is disposed for each light-emitting element 20. The number of light-emitting elements 20 in the light-emitting device 1 is equal to the number of reflective members 40. It should be noted that one reflective member 40 may be disposed for multiple light-emitting elements 20.

[0200] One or each reflective member 40 reflects light emitted from the corresponding light-emitting element 20. Light reflected by light-reflecting surface 41B travels upward. Light traveling along the optical axis is reflected by light-reflecting surface 41B in a direction parallel to upper surface 11A from light-emitting surface 22 of light-emitting element 20, and then travels in a direction perpendicular to upper surface 11A.

[0201] The reflective member 40 is disposed on the base 11 and is located away from the light-emitting element 20 in the fifth direction. One or each reflective member 40 is disposed away from the corresponding light-emitting element 20 in the fifth direction. Since an area for arranging the reflective member 40 is ensured on the upper surface 11A of the base 11 at a position away from the light-emitting element 20 in the fifth direction, by extending the second area N from the light-emitting element 20 in a direction opposite to the fifth direction, heat dissipated by the light-emitting element 20 can be dissipated not only in the fifth direction but also in a direction opposite to the fifth direction, thereby preventing heat from accumulating near the light-emitting element 20. The frame 12 also has a wide portion 12A2 that matches the expansion of the base 11. By utilizing the wide portion 12A2 in the area where the second wiring layer 12M2 is provided, an efficient packaging structure can be achieved.

[0202] Light emitting element 20 and reflective member 40 disposed on upper surface 11A of base 11 are surrounded by the through hole of frame 12 in plan view. Similarly, substrate 30 disposed together with light emitting element 20 is also surrounded by the through hole of frame 12 in plan view.

[0203] In the light-emitting device 1, the protective element 50 is disposed on the upper surface 31A of the substrate 30. Instead of being disposed on the upper surface 31A of the substrate 30, the protective element 50 may be disposed on the upper surface 12F of the step portion 12E of the frame 12. For example, the protective element 50 may be disposed on the first wiring layer 12M1. The protective element 50 protects one or more light-emitting elements 20.

[0204] In the light-emitting device 1, one or more light-emitting elements 20 are electrically connected to the wiring layer 12M of the frame 12. The one or more light-emitting elements 20 are electrically connected to the wiring layer 12M via wiring 60. The plurality of wirings 60 include wiring 60 connected to the first wiring layer 12M1. The plurality of wirings 60 include wiring 60 provided on the upper surface 12F of the first stepped portion 12E1 and connected to the first wiring layer 12M1, and wiring 60 provided on the upper surface 12F of the second stepped portion 12E2 and connected to the first wiring layer 12M1.

[0205] In the light emitting device 1 , one or more light emitting elements 20 are disposed in the internal space of the package 10 . Light reflected by the reflective member 40 is emitted to the outside of the package 10 through the lid 13 .

[0206] In the light emitting device 1, the optical component 70 is disposed on the package 10. The optical component 70 is bonded to the lid 13. The optical component 70 is fixed to the package 10. Light emitted from the package 10 passes through the optical component 70. Light emitted from one or more light emitting elements 20 passes through one or more lens surfaces 71D of the optical component 70.

[0207] <Second embodiment>

[0208] A light emitting device 2 according to a second embodiment will be described. Figure 2 、 Figure 4B 、 Figure 6 and Figure 8A to Figure 16 This is a diagram for explaining one embodiment of the light emitting device 2 . Figure 13 It is a perspective view of the light emitting device 2 . Figure 14 It is a plan view showing components of the internal space of the package 10 arranged in the light emitting device 2 . Figure 15 yes Figure 2 Cross-sectional view of line XV-XV. Figure 16 It is a cross-sectional view of the base 11 in the light emitting device 2 .

[0209] The light emitting device 2 includes a plurality of components, including a package 10 , a plurality of light emitting elements 20 , a plurality of substrates 30 , a plurality of reflective members 40 , one or more protective elements 50 , a plurality of wirings 60 , and an optical member 70 .

[0210] In the description of the light emitting device 1 and each component of the first embodiment, except for the light emitting device 2, Figure 2 、 Figure 4B 、 Figure 6 ,as well as Figure 8A to Figure 16 All contents except for the contents that are inconsistent with the drawings are applicable to the description of the light emitting device 2. In order to avoid repetition, all contents that are not inconsistent will not be repeated here.

[0211] (Light-emitting device 2)

[0212] In the light-emitting device 2, the plurality of light-emitting elements 20 are composed of a first light-emitting element 20 and a second light-emitting element 20. In other words, the number of light-emitting elements 20 mounted in the light-emitting device 2 is two. The first light-emitting element 20 and the second light-emitting element 20 are arranged side by side in a direction perpendicular to the fifth direction when viewed from above.

[0213] In a configuration where two light-emitting elements 20 are arranged, any one of the light-emitting elements 20 can be referred to as a light-emitting element 20 arranged at an end. There are no light-emitting elements 20 with another light-emitting element 20 arranged on either side of it. Therefore, even if heat generated by a light-emitting element 20 is transferred to an adjacent light-emitting element 20, the heat dissipation balance of each light-emitting element 20 is not disrupted. In this case, heat dissipation in a direction parallel to the light-emitting surface 22 is better than heat dissipation in a direction perpendicular to the light-emitting surface 22. This is because, if the light-emitting element 20 has a shape in which the length in the direction parallel to the light-emitting surface 22 is longer than the length in the direction perpendicular to the light-emitting surface 22, even if heat moves in a direction perpendicular to the light-emitting surface 22, the heat remains directly below the light-emitting element 20 until the distance it moves reaches a distance equivalent to the length of the light-emitting element 20.

[0214] In the light-emitting device 2, the base 11 is arranged so that the graphite member 11F in the layer closest to the upper surface 11A of the base 11 contained in the laminated graphite 11E has a high heat conduction direction in a plane parallel to the light-emitting surface 22. This arrangement of the base 11 facilitates heat transfer from and near the light-emitting surface 22 of the light-emitting element 20 to the outside of the light-emitting element 20, thereby achieving a light-emitting device 1 with excellent heat dissipation. In the illustrated light-emitting device 2, the laminated graphite 11E includes a second graphite member 11F2 in the layer closest to the upper surface 11A of the base 11.

[0215] Since the high heat conduction direction of the graphite part 11F in the layer closest to the upper surface 11A of the base 11 is perpendicular to the extension direction of the third part 12P3 of the via wiring 12P, it is easy to dissipate the heat dissipated in the third part 12P3 to the side relative to the extension direction of the third part 12P3.

[0216] It should be noted that while the light-emitting device 2 is shown as comprising two light-emitting elements 20, any configuration is acceptable as long as there is no need to consider the heat dissipation balance of each light-emitting element 20. For example, even if the plurality of light-emitting elements 20 includes three or more light-emitting elements 20 arranged in a single direction, it is expected that the heat dissipation balance will not be significantly affected if the spacing between the light-emitting elements 20 is sufficiently increased. For example, if the plurality of light-emitting elements 20 is comprised of a single light-emitting element 20, there is no need to consider the heat dissipation balance of each light-emitting element 20 due to the absence of other light-emitting elements 20. As such, the light-emitting device 2 is not necessarily limited to comprising two light-emitting elements 20 and may include one or more light-emitting elements 20.

[0217] The various embodiments of the present invention have been described above, but the light-emitting device of the present invention is not strictly limited to the light-emitting devices of the various embodiments. In other words, the present invention does not have to be limited to the appearance and structure of the light-emitting devices disclosed in the various embodiments to be realized. The present invention can be applied without necessarily having all the structural elements. For example, if a part of the structural elements of the light-emitting device disclosed in the embodiment is not described in the claims, those skilled in the art are allowed to make design freedom such as substitution, omission, shape deformation, material change, etc. for such part of the structural elements, and on this basis, clarify the practicality of the invention described in the claims.

[0218] Based on the contents described above in this specification, the following technical matters are disclosed.

[0219] (Item 1)

[0220] A light-emitting device comprising:

[0221] A substrate mainly made of graphite and having a first upper surface;

[0222] a substrate, disposed on the first upper surface of the base;

[0223] a first light emitting element disposed on the substrate and emitting light in a first direction;

[0224] a reflective component disposed on the first upper surface of the base at a position away from the first light emitting element along the first direction;

[0225] a frame defining a through hole surrounding the first light-emitting element and the reflective member in a plan view, the frame comprising: a second upper surface, a lower surface bonded to the base, and one or more wiring layers provided on the second upper surface at a position away from the first light-emitting element in a direction opposite to the first direction;

[0226] The first upper surface of the base includes a first region covering the through hole in a plan view, and a second region extending from the first region to directly below the one or more wiring layers provided on the second upper surface.

[0227] (Item 2)

[0228] The light-emitting device according to item 1, wherein

[0229] The base body includes a main portion mainly made of graphite and a first metal layer disposed on an upper surface of the main portion and forming the first upper surface.

[0230] (Item 3)

[0231] The light-emitting device according to item 2, wherein

[0232] The base has a second metal layer disposed on the upper surface of the main portion,

[0233] The first metal layer is arranged above the second metal layer,

[0234] The thickness of the second metal layer is greater than the thickness of the first metal layer.

[0235] (Item 4)

[0236] The light-emitting device according to item 3, wherein

[0237] The second metal layer is provided to cover the entire surface of the main portion.

[0238] (Item 5)

[0239] The light-emitting device according to item 3 or 4, wherein

[0240] The first metal layer is a metal layer containing Ni or Au,

[0241] The second metal layer is a metal layer containing Cu.

[0242] (Item 6)

[0243] The light-emitting device according to any one of items 1 to 5, wherein

[0244] The base is bonded to the frame by an adhesive provided near the inner edge of the lower surface of the frame defining the through hole.

[0245] The adhesive is not provided directly under at least a portion of the wiring layer.

[0246] (Item 7)

[0247] The light-emitting device according to any one of items 1 to 5, wherein

[0248] The base is bonded to the frame on the lower surface of the frame by an adhesive, and the adhesive is provided near the inner edge of the lower surface of the frame defining the through hole and directly below the one or more wiring layers provided on the second upper surface.

[0249] (Item 8)

[0250] The light-emitting device according to item 6 or 7, wherein

[0251] The adhesive includes AuSn.

[0252] (Item 9)

[0253] The light-emitting device according to any one of items 1 to 8, wherein

[0254] The substrate comprises a laminated graphite formed by laminating a first graphite member and a second graphite member, wherein, in a plane parallel to the first upper surface, the thermal conductivity of the first graphite member in the first direction is higher than the thermal conductivity in a second direction perpendicular to the first direction, and the thermal conductivity of the second graphite member in the second direction is higher than the thermal conductivity in the first direction.

[0255] The laminated graphite includes the first graphite member in a layer closest to the first upper surface.

[0256] (Item 10)

[0257] The light-emitting device according to item 9, wherein

[0258] further comprising one or more second light emitting elements, which are arranged on the first upper surface of the base and emit light in the first direction,

[0259] The width of the base in the first direction is smaller than the width in the second direction.

[0260] The first light emitting element and the one or more second light emitting elements are arranged along the second direction.

[0261] In any one of the first light-emitting element and the one or more second light-emitting elements, the width in the first direction is larger than the width in the second direction.

[0262] (Item 11)

[0263] The light-emitting device according to any one of items 1 to 8, wherein

[0264] The base body comprises a laminated graphite formed by laminating a first graphite member and a second graphite member, wherein, in a plane parallel to the first upper surface, the thermal conductivity of the first graphite member in the first direction is higher than the thermal conductivity in a second direction perpendicular to the first direction, and the thermal conductivity of the second graphite member in the second direction is higher than the thermal conductivity in the first direction.

[0265] The second graphite member is provided in the layer of the laminated graphite closest to the first upper surface.

[0266] (Item 12)

[0267] The light-emitting device according to item 11, wherein

[0268] further comprising a second light emitting element disposed on the first upper surface of the base body and emitting light in the first direction,

[0269] The width of the base in the first direction is smaller than the width in the second direction.

[0270] The first light emitting element and the second light emitting element are arranged along the second direction.

[0271] In either the first light-emitting element or the second light-emitting element, the width in the first direction is larger than the width in the second direction.

[0272] (Item 13)

[0273] The light-emitting device according to any one of items 1 to 12, wherein

[0274] The frame has another wiring layer electrically connected to the wiring layer provided on the second upper surface through via wiring provided inside.

[0275] The via wiring includes: a first portion connected to the other wiring layer and extending in the vertical direction; a second portion connected to the wiring layer provided on the second upper surface and extending in the vertical direction; and a third portion extending in a direction parallel to the second upper surface.

[0276] A vertical distance from the lower surface of the frame to the third portion of the via wiring is smaller than a vertical distance from the other wiring layer to the third portion.

[0277] Industrial Applicability

[0278] The light-emitting device described in this embodiment can be used in a projector, a vehicle headlamp, a head-mounted display, a lighting device, a display, and the like.

[0279] Explanation of symbols

[0280] 1.2 Light-emitting device

[0281] 10 Packaging

[0282] 11 Matrix

[0283] 11A top surface

[0284] 11B lower surface

[0285] 11C side view

[0286] 11D Main part

[0287] 11D1 top surface

[0288] 11D2 lower surface

[0289] 11D3 Side

[0290] 11E Laminated Graphite

[0291] 11F Graphite parts

[0292] 11F1 1st graphite component

[0293] 11F2 2nd graphite component

[0294] 11G Metal Layer

[0295] 11G1 Metal Layer 1

[0296] 11G2 Metal Layer 2

[0297] 12 Frame

[0298] 12A top surface

[0299] 12A1 Narrow section

[0300] 12A2 wide section

[0301] 12B lower surface

[0302] 12B1 narrow section

[0303] 12B2 wide section

[0304] 12B21 Extension Department

[0305] 12C inner side

[0306] 12D outer side

[0307] 12E Stairs

[0308] 12E1 1st Step

[0309] 12E2 Step 2

[0310] 12F upper surface

[0311] 12G Side

[0312] 12M wiring layer

[0313] 12M1 1st wiring layer

[0314] 12M2 2nd wiring layer

[0315] 12N bonding layer

[0316] 12N1 1st bonding layer

[0317] 12N2 2nd bonding layer

[0318] 12N21 Part 1

[0319] 12N22 Part 2

[0320] 12N23 Part 3

[0321] 12P via wiring

[0322] 12P1 Part 1

[0323] 12P2 Part 2

[0324] 12P3 Part 3

[0325] 13 Cover

[0326] 13A top surface

[0327] 13B lower surface

[0328] 13C side view

[0329] 14 Adhesive

[0330] 20 light-emitting elements

[0331] 21A upper surface

[0332] 21B lower surface

[0333] 21C side view

[0334] 22 Light exit surface

[0335] 30 substrate

[0336] 31A upper surface

[0337] 31B lower surface

[0338] 31C side view

[0339] 32A substrate

[0340] 32B upper metal part

[0341] 32C lower metal part

[0342] 33 wiring layers

[0343] 40 reflective components

[0344] 41A bottom surface

[0345] 41B Light reflecting surface

[0346] 50 protection elements

[0347] 51A top surface

[0348] 51B lower surface

[0349] 51C side view

[0350] 60 Wiring

[0351] 70 optical components (lens components)

[0352] 71A top surface

[0353] 71B lower surface

[0354] 71C side view

[0355] 71D lens surface (optical action surface)

[0356] 72A lens part

[0357] 72B non-lens part

Claims

1. A light-emitting device comprising: A substrate mainly made of graphite and having a first upper surface; a substrate, disposed on the first upper surface of the base; a first light emitting element disposed on the substrate and emitting light in a first direction; a reflective component disposed on the first upper surface of the base at a position away from the first light emitting element along the first direction; a frame defining a through hole surrounding the first light-emitting element and the reflective member in a plan view, the frame comprising: a second upper surface, a lower surface bonded to the base, and one or more wiring layers provided on the second upper surface at a position away from the first light-emitting element in a direction opposite to the first direction; The first upper surface of the base includes a first region covering the through hole in a plan view, and a second region extending from the first region to directly below the one or more wiring layers provided on the second upper surface.

2. The light emitting device according to claim 1, wherein The base body includes a main portion mainly made of graphite and a first metal layer disposed on an upper surface of the main portion and forming the first upper surface.

3. The light emitting device according to claim 2, wherein: The base has a second metal layer disposed on the upper surface of the main portion, The first metal layer is arranged above the second metal layer, The thickness of the second metal layer is greater than the thickness of the first metal layer.

4. The light emitting device according to claim 3, wherein The second metal layer is provided to cover the entire surface of the main portion.

5. The light emitting device according to claim 3 or 4, wherein: The first metal layer is a metal layer containing Ni or Au, The second metal layer is a metal layer containing Cu.

6. The light-emitting device according to any one of claims 1 to 5, wherein The base is bonded to the frame by an adhesive provided near the inner edge of the lower surface of the frame defining the through hole. The adhesive is not provided directly under at least a portion of the wiring layer.

7. The light-emitting device according to any one of claims 1 to 5, wherein The base is bonded to the frame on the lower surface of the frame by an adhesive, and the adhesive is provided near the inner edge of the lower surface of the frame defining the through hole and directly below the one or more wiring layers provided on the second upper surface.

8. The light emitting device according to claim 6 or 7, wherein: The adhesive includes AuSn.

9. The light-emitting device according to any one of claims 1 to 8, wherein The substrate comprises a laminated graphite formed by laminating a first graphite member and a second graphite member, wherein, in a plane parallel to the first upper surface, the thermal conductivity of the first graphite member in the first direction is higher than the thermal conductivity in a second direction perpendicular to the first direction, and the thermal conductivity of the second graphite member in the second direction is higher than the thermal conductivity in the first direction. The laminated graphite includes the first graphite member in a layer closest to the first upper surface.

10. The light emitting device according to claim 9, wherein further comprising one or more second light emitting elements, which are arranged on the first upper surface of the base and emit light in the first direction, The width of the base in the first direction is smaller than the width in the second direction. The first light emitting element and the one or more second light emitting elements are arranged along the second direction. In any one of the first light-emitting element and the one or more second light-emitting elements, the width in the first direction is larger than the width in the second direction.

11. The light-emitting device according to any one of claims 1 to 8, wherein The base body comprises a laminated graphite formed by laminating a first graphite member and a second graphite member, wherein, in a plane parallel to the first upper surface, the thermal conductivity of the first graphite member in the first direction is higher than the thermal conductivity in a second direction perpendicular to the first direction, and the thermal conductivity of the second graphite member in the second direction is higher than the thermal conductivity in the first direction. The second graphite member is provided in the layer of the laminated graphite closest to the first upper surface.

12. The light emitting device according to claim 11, wherein further comprising a second light emitting element disposed on the first upper surface of the base body and emitting light in the first direction, The width of the base in the first direction is smaller than the width in the second direction. The first light emitting element and the second light emitting element are arranged along the second direction. In either the first light-emitting element or the second light-emitting element, the width in the first direction is larger than the width in the second direction.

13. The light emitting device according to any one of claims 1 to 12, wherein: The frame has another wiring layer electrically connected to the wiring layer provided on the second upper surface through via wiring provided inside. The via wiring includes: a first portion connected to the other wiring layer and extending in the vertical direction; a second portion connected to the wiring layer provided on the second upper surface and extending in the vertical direction; and a third portion extending in a direction parallel to the second upper surface. A vertical distance from the lower surface of the frame to the third portion of the via wiring is smaller than a vertical distance from the other wiring layer to the third portion.

Images