Semiconductor integrated circuit lead frame washing device

Abstract

The invention provides a semiconductor integrated circuit lead frame washing device, and relates to the technical field of lead frame production. According to the invention, the nozzle main body with the nozzle protective cover is arranged, when the water pump is started, water pressure is generated in the pressure chamber, the nozzle extension rod slides out of the pressure chamber until the nozzle protective cover is attached to the semiconductor integrated circuit lead frame body, and a water source in the pressure chamber reaches the nozzle main body through the one-way valve structure; the spray head body sprays a water source obliquely upwards, the arc-shaped suction cup and the water blocking strip are attached to the semiconductor integrated circuit lead frame body to form a water blocking area, at the moment, the water source flows according to a certain track and finally flows out of the area of the ball body, and the water source forms backflow in the spray head protection cover. And the backflow water source continuously scours the semiconductor integrated circuit lead frame body, and the scoured particle chips flow back along with the water source and scour the lead frame together with the water source, so that the water washing effect of the device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of lead frame production, in particular to a semiconductor integrated circuit lead frame water washing device. Background Art

[0002] The semiconductor integrated circuit lead frame is a frame structure usually made of metal used to support the chip, transmit electrical signals and provide mechanical support. It is a bridge connecting the chip and the external circuit. The semiconductor integrated circuit lead frame water washing device is a special equipment that uses a water circulation system, spray components, etc. to rinse and clean the contaminants on the lead frame surface to ensure its cleanliness and the quality of subsequent processes.

[0003] In Chinese patent publication number CN212494160U, the utility model discloses a highly efficient and environmentally friendly lead frame washing device. The device comprises a base, to which a guide rail and a bracket are fixedly connected. The guide rail is provided with two side baffles that can slide on the guide rails. A rotating shaft is connected between the side baffles, which is driven by a motor. The rotating shaft is fixed to at least two guide wheels, which are sleeved with O-rings and positioned between the side baffles. The bracket is fixed to a water pipe equipped with a nozzle. This washing device has the following advantages: an adjustable conveyor belt width, suitable for a wide range of product specifications; a wide cleaning area with excellent cleaning effect; a nozzle arrangement that conserves water while improving cleaning effect; a simple structure, and ease of production and use.

[0004] In the Chinese patent publication number CN222020188U, the utility model relates to the field of lead frame production technology, and more particularly to a lead frame washing device. The device comprises a turntable, the turntable being rotatably connected to a first rotating shaft, the bottom end of the turntable being fixedly connected to a first motor, the output end of the first motor being transmission-connected to the bottom end of the first rotating shaft, the turntable being driven by the first motor to rotate, causing the mounting table to drive the adsorption mechanism to rotate above the conveyor belt, the adsorption mechanism being driven downward by an electric push rod to adsorb the lead frame, the adsorption mechanism being driven downward by the electric push rod to immerse the lead frame in water for washing, the lead frame on the adsorption mechanism being driven upward by the electric push rod, water being sprayed from a nozzle by a water pump to perform a secondary rinse on the lead frame, so that the entire lead frame washing operation is performed in a water washing tank, effectively preventing the splashing of the washing water, and the secondary rinse improving the cleanliness of the lead frame.

[0005] The existing semiconductor integrated circuit lead frame water washing device is equipped with a water washing nozzle, which uses the water washing nozzle to spray the semiconductor integrated circuit lead frame to clean the semiconductor integrated circuit lead frame. However, when the nozzle directly rinses the semiconductor integrated circuit lead frame, water splashing may occur, resulting in secondary contamination of the semiconductor integrated circuit lead frame by sewage and foreign matter. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the defects of the prior art. The present invention proposes a semiconductor integrated circuit lead frame water washing device, which solves the problem of water splashing and secondary contamination of the semiconductor integrated circuit lead frame.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is: a semiconductor integrated circuit lead frame water washing device, comprising: a water washing device outer frame, a driving component is arranged inside the water washing device outer frame, the driving component comprises a lead frame clamp and a water blocking block connecting plate, the side of the lead frame clamp is clamped and connected with the semiconductor integrated circuit lead frame body, the side of the water blocking block connecting plate is fixedly connected with a synchronous sliding water blocking block, the interior of the synchronous sliding water blocking block is clamped and connected with the water washing device body, the interior of the water washing device body is provided with a telescopic nozzle assembly, the telescopic nozzle assembly includes a nozzle protective cover, the nozzle protective cover is clamped and connected to the water Inside the main body of the washing device, the top of the nozzle protective cover is fixedly connected with an arc-shaped suction cup, the outer wall of the nozzle protective cover is provided with a ball body, the bottom of the nozzle protective cover is fixedly connected with a water-blocking strip, the inside of the nozzle protective cover is fixedly connected with the nozzle body, the side of the nozzle protective cover is fixedly connected with the nozzle extension rod, the inside of the nozzle extension rod is fixedly connected with a one-way valve structure, the side of the one-way valve structure is provided with a closed water-blocking column, the closed water-blocking column and the nozzle extension rod are fixedly connected, the outer wall of the nozzle extension rod is fixedly connected with a reset spring, the side of the reset spring is fixedly connected with a pressure cabin, and a water pipe is opened inside the pressure cabin.

[0008] Preferably, the nozzle protective cover is arranged in a trumpet shape, and the nozzle body is arranged to be tilted upward.

[0009] Preferably, the nozzle extension rod is located inside the pressure chamber, and the outer diameter of the nozzle extension rod is the same as the inner diameter of the pressure chamber.

[0010] Preferably, a locking structure is formed between the closed water-blocking column and the incoming water pipe, and the diameter of the closed water-blocking column is the same as the diameter of the incoming water pipe.

[0011] Preferably, the outer wall of the nozzle extension rod is fixedly connected to the limiting block, the inner wall of the pressure chamber is provided with a limiting sliding groove, and the limiting block and the limiting sliding groove constitute a sliding structure.

[0012] Preferably, the outer wall of the lead frame clamp is fixedly connected with a clamp connecting column, one end of the clamp connecting column is fixedly connected with a clamp block, a connecting plate slot is opened inside the water blocking block connecting plate, and the clamp block and the connecting plate slot constitute a sliding structure.

[0013] Preferably, an electric telescopic rod is fixedly connected to the interior of the lead frame clamp, and one end of the electric telescopic rod is fixedly connected to a threaded slider.

[0014] Preferably, the internal thread of the threaded slider is connected to the threaded rod body, the bottom of the threaded rod body is rotatably connected to the threaded rod shaft, the bottom of the threaded rod shaft is fixedly connected to the threaded rod shell, and the threaded rod shell is fixedly connected to the outer frame of the water washing device.

[0015] Preferably, the outer wall of the threaded slider is snap-connected with a threaded rod housing, the top of the threaded rod housing is fixedly connected with a servo motor, and the threaded rod body is fixedly connected to the output end of the servo motor.

[0016] Preferably, a water pump pipe support column is fixedly connected to the bottom of the water washing device body, and the water pump pipe support column is fixedly connected to the outer frame of the water washing device.

[0017] Compared with the prior art, the beneficial effects of the present invention include: a nozzle body with a nozzle protective cover is provided, and when the water pump is started, water pressure is generated in the pressure chamber, and the nozzle extension rod slides out of the pressure chamber until the nozzle protective cover is attached to the semiconductor integrated circuit lead frame body. At this time, the water source in the pressure chamber reaches the nozzle body through the one-way valve structure, and the nozzle body sprays the water source obliquely upward, and the arc-shaped suction cup and the water blocking strip are attached to the semiconductor integrated circuit lead frame body to form a water blocking area. At this time, the water source flows according to a certain trajectory and finally flows out from the area of ​​the ball body. The water source forms a backflow inside the nozzle protective cover, and the backflow water source continuously flushes the semiconductor integrated circuit lead frame body. The washed particles and debris will flow back with the water source and flush the lead frame together with the water source, which is beneficial to improving the water washing effect of the device. The nozzle protective cover is used to prevent water from splashing, avoiding sewage and foreign matter from splashing into the surrounding environment, which is beneficial to prevent sewage and foreign matter from causing secondary pollution to the lead frame. At the same time, the water flow circulates and flows back along the trajectory in the nozzle protective cover, continuously flushing the lead frame, enhancing the carrying and flushing effect of particle debris, and improving cleanliness. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The disclosure of the present invention is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. In the accompanying drawings, the same reference numerals are used to refer to the same components. Among them: Figure 1 1 is a schematic diagram of the internal structure of a semiconductor integrated circuit lead frame washing device according to an embodiment of the present invention; Figure 2 1 is an enlarged structural diagram of a semiconductor integrated circuit lead frame water washing device proposed in one embodiment of the present invention; Figure 3 is an enlarged structural diagram of a driving component part proposed according to one embodiment of the present invention; Figure 4 2. It is a schematic diagram of the exploded structure of the clamp block part according to one embodiment of the present invention; Figure 5 This is an enlarged structural diagram of the connection portion between the synchronous sliding water blocking block and the main body of the water washing device proposed in one embodiment of the present invention; Figure 6 is an enlarged structural schematic diagram of a telescopic nozzle assembly according to one embodiment of the present invention; Figure 7 is a schematic cross-sectional structural diagram of a pressure chamber portion according to one embodiment of the present invention; Figure 8 2. It is a schematic diagram of the explosion structure of the pressure cabin part proposed in one embodiment of the present invention; Figure 9 It is a schematic diagram of the enlarged structure of the bonding portion between the nozzle protection cover and the lead frame proposed according to one embodiment of the present invention.

[0019] Numbers in the figure: 1. Water washing device outer frame; 2. Drive assembly; 201. Lead frame fixture; 202. Water blocking block connecting plate; 203. Fixture connecting column; 204. Fixture clamping block; 205. Connecting plate slide; 206. Electric telescopic rod; 207. Threaded slider; 208. Threaded rod body; 209. Threaded rod rotating shaft; 210. Threaded rod housing; 211. Servo motor; 3. Semiconductor integrated circuit lead frame body; 4. Synchronous sliding Water blocking block; 5. Water washing device body; 6. Telescopic nozzle assembly; 601. Nozzle protective cover; 602. Arc suction cup; 603. Ball bearing body; 604. Water blocking strip; 605. Nozzle body; 606. Nozzle extension rod; 607. One-way valve structure; 608. Closed water blocking column; 609. Return spring; 610. Pressure chamber; 611. Water pipeline; 612. Limit block; 613. Limit slide; 7. Water pump pipeline support column. DETAILED DESCRIPTION

[0020] It is easy to understand that according to the technical solution of the present invention, without changing the essential spirit of the present invention, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solution of the present invention and should not be regarded as the entire invention or as a limitation or restriction of the technical solution of the present invention.

[0021] According to the embodiment of the present invention, Figures 1 to 9 As shown, a semiconductor integrated circuit lead frame water washing device includes: a water washing device outer frame 1, the water washing device outer frame 1 is used to collect and transfer sewage, a driving component 2 is provided inside the water washing device outer frame 1, the driving component 2 is used to control the movement of the internal components of the device, the driving component 2 includes a lead frame clamp 201 and a water blocking block connecting plate 202, a pair of lead frame clamps 201 are provided, the lead frame clamps 201 at both ends are used to clamp the semiconductor integrated circuit lead frame body 3, the side of the lead frame clamp 201 is clamped and connected with the semiconductor integrated circuit lead frame body 3, and the side of the water blocking block connecting plate 202 is fixedly connected with a synchronous sliding Water blocking block 4, the synchronous sliding water blocking block 4 is used to limit the water washing device body 5, and the number of working nozzles is adjusted according to the size of the semiconductor integrated circuit lead frame body 3. The internal locking connection of the synchronous sliding water blocking block 4 is connected to the water washing device body 5, and the water washing device body 5 is used to wash the semiconductor integrated circuit lead frame body 3. A telescopic nozzle assembly 6 is provided inside the water washing device body 5. The bottom of the water washing device body 5 is fixedly connected to a water pump pipe support column 7, which is used to transport water. At the same time, the water pump pipe support column 7 is used to support the water washing device body 5, and the water pump pipe support column 7 is fixedly connected to the water washing device outer frame 1.

[0022] According to the embodiment of the present invention, Figures 6 to 9The figure shows a semiconductor integrated circuit lead frame water washing device, wherein the telescopic nozzle assembly 6 includes a nozzle protective cover 601, which is used to cover the nozzle body 605 to prevent water splashing. The nozzle protective cover 601 is snap-connected to the interior of the water washing device body 5. The nozzle protective cover 601 can be completely retracted into the interior of the water washing device body 5. When needed, the nozzle protective cover 601 can be extended. The top of the nozzle protective cover 601 is fixedly connected to an arc-shaped suction cup 602, which is used to suck the semiconductor integrated circuit lead frame body 3 so that the arc-shaped suction cup 602 and the semiconductor integrated circuit lead frame body 3 cannot move in the horizontal direction. However, there are water stains on the surface of the semiconductor integrated circuit lead frame body 3. When the semiconductor integrated circuit lead frame body 3 moves downward, the arc-shaped suction cup 602 can slide in the vertical direction on the surface of the semiconductor integrated circuit lead frame body 3, and at the same time, the arc-shaped suction cup 602 can block the upward water flow to prevent the water from being discharged upward, and prevent the upwardly discharged water from contaminating the cleaned lead frame part, thereby avoiding secondary pollution. The outer wall of the nozzle protective cover 601 is provided with a ball body 603, and the ball body 603 can roll on the surface of the semiconductor integrated circuit lead frame body 3. At the same time, there is a gap in the area of ​​the ball body 603, and sewage and dirt can be discharged through the gap. The bottom of the nozzle protective cover 601 is fixedly connected with a water blocking strip 604, which is used to block the falling water flow to prevent the water from flowing upward. Directly drop and discharge, the water blocking strip 604 causes the water flow to flow back, and the backflow water flow can continuously flush the semiconductor integrated circuit lead frame body 3, thereby improving the cleaning effect. The inside of the nozzle protective cover 601 is fixedly connected to the nozzle body 605, and the nozzle body 605 is tilted. The side of the nozzle protective cover 601 is fixedly connected to the nozzle extension rod 606, and the nozzle extension rod 606 can slide inside the threaded rod housing 210. The inside of the nozzle extension rod 606 is fixedly connected to the one-way valve structure 607. The one-way valve structure 607 is a mechanical structure similar to a biological heart valve. Its core feature is that it only allows fluid to flow in a single direction and prevents reverse backflow. It is usually made of a valve sheet or valve disc made of elastic material, and is achieved through the fluid pressure difference. Automatic opening and closing: When the upstream fluid pressure is greater than the downstream fluid pressure, the valve opens to allow fluid to pass through. When the downstream pressure is higher than the upstream pressure or there is no pressure, the valve automatically closes to block backflow. A closed water blocking column 608 is provided on the side of the one-way valve structure 607. The closed water blocking column 608 is fixedly connected to the nozzle extension rod 606. A return spring 609 is fixedly connected to the outer wall of the nozzle extension rod 606. The return spring 609 is used to control the reset of the nozzle extension rod 606. When the pressure inside the pressure chamber 610 disappears, the return spring 609 pulls the nozzle extension rod 606 to reset. The side of the return spring 609 is fixedly connected to the pressure chamber 610. A water pipe 611 is provided inside the pressure chamber 610. The nozzle protective cover 601 is set in a trumpet shape.The nozzle body 605 is tilted upward, and the nozzle extension rod 606 is located inside the pressure chamber 610. The outer diameter of the nozzle extension rod 606 is the same as the inner diameter of the pressure chamber 610. The closed water blocking column 608 and the water supply pipe 611 form a snap-fit ​​structure. The diameter of the closed water blocking column 608 is the same as the diameter of the water supply pipe 611. The outer wall of the nozzle extension rod 606 is fixedly connected to the limit block 612. The inner wall of the pressure chamber 610 has a limit slot 613. The limit block 612 and the limit slot 613 form a sliding structure.

[0023] According to the embodiment of the present invention, Figures 3 to 5 The present invention shows a semiconductor integrated circuit lead frame water washing device, wherein the outer wall of the lead frame clamp 201 is fixedly connected with a clamp connecting column 203, and one end of the clamp connecting column 203 is fixedly connected with a clamp block 204. The lead frame clamp 201, the clamp connecting column 203, and the clamp block 204 are integrated. The water blocking block connecting plate 202 is provided with a connecting plate slide 205 inside. The clamp block 204 and the connecting plate slide 205 form a sliding structure. The clamp block 204 and the connecting plate slide 205 cooperate with each other so that the clamp block 204 can move up and down on the inner wall of the connecting plate slide 205. The lead frame clamp 201 is fixedly connected with an electric telescopic rod 206. The electric telescopic rod 206 is used to control the horizontal movement of the lead frame clamp 201, so that the lead frame clamp 201 clamps the semiconductor integrated circuit lead frame body 3. The electric telescopic rod 206 is used to control the horizontal movement of the lead frame clamp 201, so that the lead frame clamp 201 clamps the semiconductor integrated circuit lead frame body 3. One end of 06 is fixedly connected to a threaded slider 207, and the internal thread of the threaded slider 207 is connected to a threaded rod body 208. The threaded slider 207 and the threaded rod body 208 are threadedly connected. When the threaded rod body 208 rotates, the threaded slider 207 is driven to perform lifting movements. The bottom of the threaded rod body 208 is rotatably connected to a threaded rod rotating shaft 209, and the bottom of the threaded rod rotating shaft 209 is fixedly connected to a threaded rod shell 210. The threaded rod shell 210 is fixedly connected to the outer frame 1 of the water washing device. The outer wall of the threaded slider 207 is snap-connected to the threaded rod shell 210, and the top of the threaded rod shell 210 is fixedly connected to a servo motor 211. The threaded rod body 208 is fixedly connected to the output end of the servo motor 211. The servo motor 211 is used to control the forward and reverse rotation of the threaded rod body 208, and can control the lifting and lowering of the semiconductor integrated circuit lead frame body 3 according to actual conditions.

[0024] In this embodiment, when the device is in use, the semiconductor integrated circuit lead frame body 3 is placed on the side of the lead frame clamp 201, and the electric telescopic rod 206 is started. The electric telescopic rod 206 pushes the lead frame clamp 201 to move horizontally until the lead frame clamps 201 at both ends clamp the semiconductor integrated circuit lead frame body 3. When the lead frame clamp 201 moves horizontally, the lead frame clamp 201 drives the clamp connecting column 203, the clamp block 204, the water blocking block connecting plate 202, and the synchronous sliding water blocking block 4 to move horizontally. At this time, the synchronous sliding water blocking block 4 slides on the outer wall of the water washing device body 5, and the synchronous sliding water blocking block 4 moves synchronously with the lead frame clamp 201, so that the width of the water washing area of ​​the water washing device body 5 is the same as that of the semiconductor integrated circuit. The widths of the circuit lead frame bodies 3 are the same, so that the water source for washing acts on the semiconductor integrated circuit lead frame body 3. Then, the servo motor 211 is started, and the servo motor 211 drives the threaded rod body 208 to rotate around the threaded rod shaft 209. At this time, the threaded slider 207 moves downward under the action of the thread, and the threaded slider 207 drives the electric telescopic rod 206 and the lead frame clamp 201 to move downward. The lead frame clamp 201 drives the clamped semiconductor integrated circuit lead frame body 3 to move downward. When the lead frame clamp 201 moves downward, the clamp connecting column 203 and the clamp block 204 move in the track of the connecting plate slide groove 205. The clamp block 204 and the connecting plate slide groove 205 cooperate with each other to play a limiting role. , start the water pump, at this time the water source reaches the position of the water pipe 611 through the water pump pipe support column 7, at this time the nozzle protective cover 601 is divided into two situations, one is covered by the synchronous sliding water blocking block 4, and the other is not covered by the synchronous sliding water blocking block 4. In the nozzle protective cover 601 covered by the synchronous sliding water blocking block 4, the closed water blocking column 608 is engaged with the water pipe 611, and the water source cannot enter the pressure chamber 610. In the nozzle protective cover 601 not covered by the synchronous sliding water blocking block 4, the water source pushes the closed water blocking column 608 to move, and the water source enters the pressure chamber 610. When the water source continues to replenish the cavity of the pressure chamber 610, the pressure in the pressure chamber 610 continues to increase. At this time, the water pressure pulls the nozzle extension rod 606 out of the pressure chamber 610. The nozzle extension rod 606 moves horizontally together with the nozzle protective cover 601 until the arc-shaped suction cup 602, the ball body 603 and the water blocking strip 604 on the side of the nozzle protective cover 601 are in contact with the semiconductor integrated circuit lead frame body 3. At this time, the water source inside the pressure chamber 610 breaks through the one-way valve structure 607 and reaches the position of the nozzle body 605. The nozzle body 605 sprays the water source obliquely upward. The water source first reaches the top of the inner wall of the nozzle protective cover 601. At this time, the water source is blocked by the arc-shaped suction cup 602. Then, the water source flows downward to the bottom of the inner wall of the nozzle protective cover 601. At this time, the water source is blocked by the water blocking strip 604. Then, the water source generates a backflow to the area of ​​the ball body 603. Part of the water source is discharged in the area of ​​the ball body 603.The other part returns to the circulating water flow. When the water source is in contact with the semiconductor integrated circuit lead frame body 3 by the arc-shaped suction cup 602, the semiconductor integrated circuit lead frame body 3 is sucked, so that the arc-shaped suction cup 602 and the semiconductor integrated circuit lead frame body 3 cannot move horizontally. However, there are water stains on the surface of the semiconductor integrated circuit lead frame body 3. At this time, the arc-shaped suction cup 602 can slide vertically on the surface of the semiconductor integrated circuit lead frame body 3. When the device is washed with water, the water pump is turned off, and the pressure inside the pressure chamber 610 disappears. At this time, the one-way valve structure 607 closes, and the nozzle extension rod 606 is reset under the action of the reset spring 609. The limit block 612 slides inside the limit slide groove 613, and the water source in the pressure chamber 610 returns through the water pipe 611. At this time, the nozzle protective cover 601 is reset.

[0025] A nozzle body 605 with a nozzle protective cover 601 is provided. When the water pump is started, water pressure is generated in the pressure chamber 610. At this time, the nozzle extension rod 606 slides out of the pressure chamber 610 until the nozzle protective cover 601 is attached to the semiconductor integrated circuit lead frame body 3. At this time, the water source in the pressure chamber 610 reaches the nozzle body 605 through the one-way valve structure 607. The nozzle body 605 sprays the water source obliquely upwards, and the arc-shaped suction cup 602 and the water blocking strip 604 are attached to the semiconductor integrated circuit lead frame body 3. The nozzle shield 601 is used to prevent water from splashing, so as to avoid foreign matter from splashing into the surrounding environment, which may cause the surrounding environment to be polluted. The reflux water source forms a circulating reflux inside the nozzle shield 601, which can evenly distribute the cleaning water on the surface of the lead frame. Compared with the traditional direct spraying method of the nozzle, this circulating water flow can avoid the situation of local over-cleaning or insufficient cleaning, ensuring that all parts of the lead frame can be fully and evenly cleaned, thereby improving the overall cleanliness and consistency. The circulating reflux water flow can produce continuous impact and friction on stubborn pollutants in the process of constantly flushing the lead frame. In particular, for some pollutants attached to gaps, holes or pin roots, the reflux water flow can gradually loosen and carry them away through multiple flushing and penetration, effectively improving the removal ability of stubborn pollutants.

[0026] The technical scope of the present invention is not limited to the contents of the above description. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical concept of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A semiconductor integrated circuit lead frame washing device, characterized in that: include: The outer frame of the water washing device is provided with a driving component inside the outer frame of the water washing device, and the driving component includes a lead frame clamp and a water blocking block connecting plate, the side of the lead frame clamp is connected to the semiconductor integrated circuit lead frame body by snap-fitting, the side of the water blocking block connecting plate is fixedly connected to the synchronous sliding water blocking block, the interior of the synchronous sliding water blocking block is connected to the water washing device body by snap-fitting, the water washing device body is provided with a telescopic nozzle assembly inside the water washing device body, the telescopic nozzle assembly includes a nozzle protective cover, the nozzle protective cover is snap-fitted to the interior of the water washing device body, and the top of the nozzle protective cover is fixedly connected to An arc-shaped suction cup, a ball body is provided on the outer wall of the nozzle guard cover, a water-blocking strip is fixedly connected to the bottom of the nozzle guard cover, a nozzle body is fixedly connected to the inside of the nozzle guard cover, a nozzle extension rod is fixedly connected to the side of the nozzle guard cover, a one-way valve structure is fixedly connected to the inside of the nozzle extension rod, a closed water-blocking column is provided on the side of the one-way valve structure, the closed water-blocking column is fixedly connected to the nozzle extension rod, a return spring is fixedly connected to the outer wall of the nozzle extension rod, a pressure chamber is fixedly connected to the side of the return spring, and a water pipe is provided inside the pressure chamber.

2. The semiconductor integrated circuit lead frame water washing device according to claim 1, characterized in that: The nozzle protection cover is arranged in a trumpet shape, and the nozzle body is arranged to be tilted upward.

3. The semiconductor integrated circuit lead frame water washing device according to claim 1, characterized in that: The nozzle extension rod is located inside the pressure chamber, and the outer diameter of the nozzle extension rod is the same as the inner diameter of the pressure chamber.

4. The semiconductor integrated circuit lead frame water washing device according to claim 1, characterized in that: The closed water-blocking column and the water-conducting pipe form a clamping structure, and the diameter of the closed water-blocking column is the same as the diameter of the water-conducting pipe.

5. The semiconductor integrated circuit lead frame water washing device according to claim 1, characterized in that: The outer wall of the nozzle extension rod is fixedly connected to a limiting block, the inner wall of the pressure chamber is provided with a limiting sliding groove, and the limiting block and the limiting sliding groove constitute a sliding structure.

6. The semiconductor integrated circuit lead frame water washing device according to claim 1, characterized in that: The outer wall of the lead frame clamp is fixedly connected with a clamp connecting column, one end of the clamp connecting column is fixedly connected with a clamp clamping block, a connecting plate sliding groove is opened inside the water blocking block connecting plate, and the clamp clamping block and the connecting plate sliding groove form a sliding structure.

7. The semiconductor integrated circuit lead frame water washing device according to claim 6, characterized in that: An electric telescopic rod is fixedly connected to the interior of the lead frame clamp, and one end of the electric telescopic rod is fixedly connected to a threaded slider.

8. The semiconductor integrated circuit lead frame water washing device according to claim 7, characterized in that: The internal thread of the threaded slider is connected to the threaded rod body, the bottom of the threaded rod body is rotatably connected to the threaded rod shaft, the bottom of the threaded rod shaft is fixedly connected to the threaded rod shell, and the threaded rod shell is fixedly connected to the outer frame of the water washing device.

9. The semiconductor integrated circuit lead frame water washing device according to claim 8, characterized in that: The outer wall of the threaded slider is snap-connected with a threaded rod housing, the top of the threaded rod housing is fixedly connected with a servo motor, and the threaded rod body is fixedly connected to the output end of the servo motor.

10. The semiconductor integrated circuit lead frame water washing device according to claim 1, characterized in that: A water pump pipeline support column is fixedly connected to the bottom of the water washing device body, and the water pump pipeline support column is fixedly connected to the outer frame of the water washing device.

Images