High-elasticity grinding and polishing rubber polishing pad and manufacturing process thereof

Abstract

The invention relates to the technical field of polishing pad manufacturing, and particularly discloses a high-elasticity grinding and polishing rubber polishing pad and a manufacturing process thereof.The manufacturing process comprises the steps that solid rubber and a compounding agent containing pore-forming materials are mixed to obtain a binding agent, the pore-forming materials cover physical and chemical pore-forming materials, and the physical pore-forming materials are divided into liquid and solid pore-forming materials; adding polishing materials such as rare earth cerium oxide and silicon carbide and corundum grinding materials into a binding agent to obtain a forming material; and finally carrying out hot press molding on the molded material in a vacuum hot press. The high-elasticity grinding and polishing rubber polishing pad prepared on the basis of the technology has high elasticity, and the polishing pressure can be uniformly dispersed through the internal special porous structure of the high-elasticity grinding and polishing rubber polishing pad; by means of the synergistic effect of the polishing material and the abrasive, efficient grinding and polishing capacity is achieved; the vacuum hot-press forming process ensures that the internal structure of the polishing pad is uniform and compact, the performance is effectively improved, the service life is effectively prolonged, and the high-performance requirement for the polishing pad in the precision machining field is met.

Description

Technical Field

[0001] The invention relates to the technical field of polishing pad manufacturing, in particular to a high-elasticity grinding and polishing rubber polishing pad and a manufacturing process thereof. Background Art

[0002] Polishing pads are essential consumables in modern precision machining applications, such as semiconductor chip manufacturing and optical glass processing. The performance of polishing pads directly impacts the polishing quality and processing efficiency of the workpiece surface. Traditional rubber polishing pads suffer from issues such as insufficient elasticity and suboptimal polishing results, making them difficult to meet the demands of high-precision, high-efficiency polishing. For example, in semiconductor chip manufacturing, extremely high requirements are placed on the elasticity, wear resistance, and polishing uniformity of polishing pads. Ordinary polishing pads are prone to uneven wear after prolonged use, resulting in poor chip surface flatness and impacting chip performance and yield.

[0003] Patent publication number CN119431727A discloses a method for preparing a high-density and high-hardness foamed polyurethane polishing pad. However, this method has certain application limitations. Since the method adopts a polyurethane liquid material casting process, the liquid polyurethane itself has a certain viscosity. When the polishing material and other compounding agents are added to the polyurethane material, the viscosity of the molding material increases sharply, causing certain construction difficulties. Therefore, the increase in the percentage of abrasive and polishing materials in the products produced by this method is subject to certain restrictions. Therefore, the grinding force and polishing effect of the polishing products produced according to this patent are greatly limited, and therefore cannot fully meet user needs.

[0004] Therefore, a high-elasticity grinding and polishing rubber polishing pad and its manufacturing process have become problems that need to be solved urgently. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a high-elasticity grinding and polishing rubber polishing pad and its manufacturing process, so as to prepare a rubber polishing pad with high elasticity, good wear resistance and polishing effect to meet the high performance requirements of the polishing pad in the field of precision machining.

[0006] To solve the above technical problems, the present invention provides a technical solution: a process for manufacturing a high-elasticity grinding and polishing rubber polishing pad, comprising the following steps:

[0007] Step 1: uniformly mixing solid rubber and various compounding agents to obtain a binder, wherein the compounding agent contains a pore-forming material;

[0008] Step 2: adding polishing material and abrasive into the binder to obtain a molding material;

[0009] Step 3: hot pressing the molding material on a hot press to obtain a polishing pad.

[0010] Furthermore, the solid rubber is one or more of natural rubber, styrene-butadiene rubber, nitrile rubber, chloroprene rubber, polyurethane rubber, and butadiene rubber.

[0011] Furthermore, the pore-forming material includes physical pore-forming material and chemical pore-forming material.

[0012] Furthermore, the physical pore-forming material includes liquid pore-forming material and solid pore-forming material, the liquid pore-forming material includes isopentane, isopentane-2-methylbutane, cyclopentane, and isobutane; the solid pore-forming material includes organic materials and inorganic materials that are easily soluble in water: including one or more of magnesium sulfate, sodium chloride, sodium sulfate, potassium chloride, white sugar, glucose, expandable microspheres, urea, and oxalic acid.

[0013] Furthermore, the chemical pore-forming material includes one or more of azodicarbonamide, 4,4-diphenylsulfonyl oxide, p-toluenesulfonyl hydrazide, and azobisisobutyronitrile.

[0014] Furthermore, the polishing material is one or more of rare earth cerium oxide, lanthanum oxide, and praseodymium oxide; and the abrasive is silicon carbide and corundum abrasive.

[0015] Furthermore, the hot press is a vacuum hot press.

[0016] The present invention also provides a high-elasticity grinding and polishing rubber polishing pad, which is manufactured using the above manufacturing process.

[0017] The advantages of the present invention compared with the prior art are:

[0018] 1. Due to the use of solid rubber raw materials, the process can be more easily controlled and the product quality is more stable and easy to control.

[0019] 2. Solid rubber is not limited by the viscosity of the material, and can greatly increase the percentage of abrasive and polishing materials in the product, thereby greatly improving the grinding and polishing function of the rubber polishing pad.

[0020] 3. As special pore-forming materials are added to the product, the size and porosity of the pores in the product are well controlled, which can well control the performance of the product. DETAILED DESCRIPTION

[0021] Various exemplary embodiments of the present invention will be described in detail below. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0022] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0023] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0024] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0025] The following is a further detailed description of a high-elasticity grinding and polishing rubber polishing pad and its manufacturing process of the present invention.

[0026] A manufacturing process for a high-elasticity grinding and polishing rubber polishing pad specifically comprises the following steps:

[0027] Step 1: Evenly mix solid rubber and various compounding agents to obtain a binder, wherein the compounding agent contains a pore-forming material; wherein the solid rubber is one or more of natural rubber, styrene-butadiene rubber, nitrile rubber, chloroprene rubber, polyurethane rubber, and butadiene rubber. The pore-forming material includes physical pore-forming materials and chemical pore-forming materials. Physical pore-forming materials include liquid pore-forming materials and solid pore-forming materials. Liquid pore-forming materials include isopentane, isopentane-2-methylbutane, cyclopentane, and isobutane. Solid pore-forming materials include water-soluble organic and inorganic materials, including one or more of magnesium sulfate, sodium chloride, sodium sulfate, potassium chloride, white sugar, glucose, expandable microspheres, urea, and oxalic acid. Chemical pore-forming materials include one or more of azodicarbonamide, 4,4-diphenylsulfonyl oxide, p-toluenesulfonyl hydrazide, and azobisisobutyronitrile.

[0028] Step 2: Adding polishing material and abrasive into the binder to obtain a molding material; the polishing material is one or more of rare earth cerium oxide, lanthanum oxide, and praseodymium oxide; and the abrasive is silicon carbide and corundum abrasive.

[0029] Step 3: hot-pressing the molding material on a hot press to obtain a polishing pad, wherein the hot press is a vacuum hot press.

[0030] Based on the above manufacturing process, the present invention also provides a high-elasticity grinding and polishing rubber polishing pad, which is manufactured using the above manufacturing process.

[0031] The specific implementation process of the high-elasticity grinding and polishing rubber polishing pad and its manufacturing process of the present invention is as follows:

[0032] Example 1

[0033] Choose nitrile rubber as the base material of the polishing pad and form it according to the following steps:

[0034] Step 1: 100 parts of nitrile rubber, 2 parts of sulfur, 5 parts of zinc oxide, 3 parts of magnesium oxide, 30 parts of fumed silica, 1.5 parts of stearic acid, 3 parts of accelerator M, 10 parts of rubber softener, 3 parts of foaming agent AC, 2 parts of p-toluenesulfonyl, and 1.5 parts of magnesium sulfate.

[0035] The above materials are mixed evenly in a closed rubber mixer as a binder.

[0036] Step 2: In the binder mixed in step 1, 1 part of binder, 3 parts of white corundum powder with a particle size of W10 and 5 parts of lanthanum oxide rare earth polishing powder are mixed evenly to form a molding material.

[0037] Step 3: Weigh the molding material mixed in step 2 accurately and put it into the mold. Set the temperature of the hot press to 185℃ and press it in the hot press for half an hour.

[0038] Step 4: Grind the semi-finished product pressed in step 3 to the specified size on a grinder.

[0039] Example 2

[0040] Natural rubber and styrene-butadiene rubber are used as the base material of the polishing pad and are formed according to the following steps:

[0041] Step 1: 50 parts of natural rubber, 50 parts of styrene-butadiene rubber, 5 parts of sulfur, 3 parts of zinc oxide, 4 parts of magnesium oxide, 0.5 parts of accelerator DM, 15 parts of fumed silica, 1.5 parts of stearic acid, 10 parts of rubber softener, 3 parts of foaming agent AC, and 5 parts of white sugar.

[0042] The above materials are mixed evenly in a closed rubber mixer as a binder.

[0043] Step 2: In the binder mixed in step 1, 1 part of binder, 3 parts of white corundum powder with a particle size of W10 and 5 parts of lanthanum oxide rare earth polishing powder are mixed evenly to form a molding material.

[0044] Step 3: Weigh the molding material mixed in step 2 accurately and put it into the mold. Set the temperature of the hot press to 185℃ and press it in the hot press for half an hour.

[0045] Step 4: Grind the semi-finished product pressed in step 3 to the specified size on a grinder.

[0046] Example 3

[0047] Using chloroprene rubber as the base material, follow these steps to form a rubber polishing pad:

[0048] Step 1: 100 parts of chloroprene rubber, 5 parts of sulfur, 4 parts of zinc oxide, 5 parts of magnesium oxide, 30 parts of calcium silicate, 1.5 parts of stearic acid, 10 parts of rubber softener, expandable microspheres, and 7 parts of potassium chloride.

[0049] The above materials are mixed evenly in a closed rubber mixer as a binder.

[0050] Step 2: In the binder mixed in step 1, 1 part of binder, 3 parts of green silicon carbide micropowder with a particle size of W7 and 10 parts of cerium oxide rare earth polishing powder are evenly mixed to form a molding material.

[0051] Step 3: Weigh the molding material mixed in step 2 accurately and put it into the mold. Set the temperature of the hot press to 185℃ and press it in the hot press for half an hour.

[0052] Step 4: Grind the semi-finished product pressed in step 3 to the specified size on a grinder.

[0053] The present invention and its implementation methods are described above. This description is not restrictive. If ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creatively designing them without departing from the purpose of the invention, they should all fall within the scope of protection of the present invention.

Claims

1. A process for producing a high-elasticity grinding and polishing rubber polishing pad, characterized in that: The following steps are involved: Step 1: uniformly mixing solid rubber and various compounding agents to obtain a binder, wherein the compounding agent contains a pore-forming material; Step 2: adding polishing material and abrasive into the binder to obtain a molding material; Step 3: hot pressing the molding material on a hot press to obtain a polishing pad.

2. The process for producing a high-elasticity abrasive and polishing rubber polishing pad according to claim 1, characterized in that: The solid rubber is one or more of natural rubber, styrene-butadiene rubber, nitrile rubber, chloroprene rubber, polyurethane rubber and butadiene rubber.

3. The process for producing a high-elasticity abrasive and polishing rubber polishing pad according to claim 2, characterized in that: The pore-forming materials include physical pore-forming materials and chemical pore-forming materials.

4. The process for producing a high-elasticity abrasive and polishing rubber polishing pad according to claim 3, characterized in that: The physical pore-forming material includes liquid pore-forming material and solid pore-forming material. The liquid pore-forming material includes isopentane, isopentane-2-methylbutane, cyclopentane, and isobutane. The solid pore-forming material includes organic and inorganic materials that are easily soluble in water: including one or more of magnesium sulfate, sodium chloride, sodium sulfate, potassium chloride, white sugar, glucose, expandable microspheres, urea, and oxalic acid.

5. The process for producing a high-elasticity abrasive and polishing rubber polishing pad according to claim 4, characterized in that: The chemical pore-forming material includes one or more of azodicarbonamide, 4,4-bis(benzenesulfonyl)oxide, p-toluenesulfonylhydrazide, and azobisisobutyronitrile.

6. The process for producing a high-elasticity abrasive and polishing rubber polishing pad according to claim 5, characterized in that: The polishing material is one or more of rare earth cerium oxide, lanthanum oxide, and praseodymium oxide; and the abrasive is silicon carbide and corundum abrasive.

7. The process for producing a high-elasticity abrasive and polishing rubber polishing pad according to claim 6, characterized in that: The hot press is a vacuum hot press.

8. A high elasticity grinding and polishing rubber polishing pad, characterized by: The polishing pad is manufactured by the manufacturing process of the high-elasticity grinding and polishing rubber pad according to any one of claims 1 to 7.