Uniformly-distributed single-blade saw tool bit for cutting quartzite and preparation method of uniformly-distributed single-blade saw tool bit

Abstract

The invention discloses a uniformly-distributed single-blade saw tool bit for cutting quartzite and a preparation method of the uniformly-distributed single-blade saw tool bit, and belongs to the technical field of stone machining tools. The evenly-distributed single-blade saw tool bit used for cutting the quartz stone comprises a tool bit body, the tool bit body comprises diamond layers and non-diamond layers, the non-diamond layers are arranged between every two adjacent diamond layers, and each diamond layer comprises a matrix and diamond particles evenly distributed in the matrix. The diamond particles are uniformly distributed in the matrix by adopting a uniform distribution process, so that the utilization rate of the diamond is greatly improved, and meanwhile, the initial sharpness of the tool bit is ensured. In addition, the diamond layers are arranged at the two side ends of the tool bit, the non-diamond layers and the diamond layers are arranged between the two side ends at intervals, and due to the fact that the consumption degrees of the diamond layers and the non-diamond layers are different, the tool bit can generate a concave structure, the chip removal effect of the tool bit is enhanced, and the sharpness of the tool bit is improved.

Description

Technical Field

[0001] The invention relates to the technical field of stone processing tools, in particular to a uniformly distributed single-piece saw blade head for cutting quartz stone and a preparation method thereof. Background Art

[0002] Conventional single-blade saw blades refer to the cutting portion of a common, single-blade saw used in sawing operations. Conventional single-blade saw blades present some significant problems in practical applications. First, this type of saw blade has a low diamond utilization efficiency, which means that a higher concentration of diamonds must be used during the manufacturing process to achieve the desired effect. This will undoubtedly lead to increased production costs and place a greater financial burden on the company. Second, during cutting operations, the sharpness of conventional single-blade saw blades is not satisfactory. This is especially true when cutting hard and difficult materials such as quartz stone. The lack of sharpness is particularly prominent, seriously affecting the efficiency and quality of the cutting. Summary of the Invention

[0003] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained through the structures particularly pointed out in the description and other drawings.

[0004] The purpose of the present invention is to overcome the above-mentioned shortcomings and provide a uniformly distributed single-piece saw blade head for cutting quartz stone and a preparation method thereof.

[0005] In order to achieve the above-mentioned purpose, the technical solution of the present invention is: a uniformly distributed single-piece saw blade for cutting quartz stone, comprising a blade body, the blade body comprising a diamond layer and a non-diamond layer, the non-diamond layer being arranged between two adjacent diamond layers, the diamond layer comprising a matrix and diamond particles uniformly distributed within the matrix. The present invention distributes the diamond particles uniformly within the matrix using a uniform distribution process, which greatly improves the utilization rate of the diamond and, at the same time, ensures the initial sharpness of the blade. In addition, the present invention arranges the diamond layer at both side ends of the blade, and arranges a non-diamond layer and a diamond layer between the two side ends. Due to the different consumption levels of the diamond layer and the non-diamond layer, the blade can have a concave structure, thereby enhancing the chip removal function of the blade and improving the sharpness of the blade.

[0006] In some embodiments, the matrix includes iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide. Based on the total mass of the matrix, the mass content of the iron powder is 35%-60%, the mass content of the copper powder is 25%-35%, the mass content of the nickel powder is 5%-10%, the mass content of the tin powder is 5%-10%, and the mass content of the titanium-coated silicon carbide is 5%-10%. Among them, iron powder, as the main powder of the cutter head body, has a high holding force on diamond particles, which can prevent diamond particles from falling off prematurely during work; the diffused copper-tin alloy has a dendritic morphology, which can prevent the movement of diamond particles during the uniform distribution process, making the positioning of diamond particles more accurate and having better formability, and copper has good compatibility with other elements, and has a good holding effect on diamond particles; nickel powder and zinc powder can be combined with copper elements, and the self-sharpening property of the cutter head can be adjusted to ensure that the cutter head remains sharp at all times during work; titanium-plated silicon carbide can increase the wear resistance of the body due to its extremely high hardness. In combination with the structure of the cutter head, the wear resistance of the body can be different by adjusting the content of titanium-plated silicon carbide in the diamond layer and the non-diamond layer, ensuring that grooves can be formed between the diamond layer and the non-diamond layer for chip removal, and preventing the concentration difference of diamond particles from being too large, resulting in too deep grooves, and avoiding too fast consumption of diamond particles.

[0007] In some embodiments, the spacing between the diamond particles is 0.6 mm to 2.5 mm. The present invention adjusts the spacing between the diamond particles through a uniform distribution process to avoid a large change in the concentration of diamond particles due to different drop heights, which may deteriorate the cutting stability of the tool head.

[0008] In some embodiments, the cutter head body is provided with an upper gradient layer, a middle gradient layer, and a lower gradient layer that shrink inwards in sequence in the vertical direction. By providing the cutter head with a gradient structure, the present invention greatly reduces frictional resistance during cutting and greatly improves sharpness.

[0009] In some embodiments, the spacing between the diamond particles gradually increases from the upper gradient layer to the lower gradient layer. The present invention provides a tool head with a larger number of diamond particles toward the upper portion due to its larger volume, while the number of diamond particles should be appropriately reduced toward the lower portion due to its reduced volume. The number of diamond particles can be controlled by designing different diamond spacings through a uniform distribution process.

[0010] In some embodiments, the gradient drop between the middle gradient layer and the upper gradient layer is 0.3mm-0.5mm, and the gradient drop between the lower gradient layer and the middle gradient layer is 0.3mm-0.5mm. The present invention reduces the frictional resistance of the blade during cutting by precisely adjusting the gradient drop, thereby improving sharpness.

[0011] In some embodiments, the top of the cutter head body is provided with an M-shaped tip, and diamond particles are evenly distributed in the M-shaped tip. The present invention greatly improves the initial sharpness of the cutter head by providing the M-shaped tip at the top of the cutter head.

[0012] In some embodiments, the height of the M-shaped tip is 0.5 mm to 2.0 mm. The present invention precisely sets the height of the M-shaped tip to precisely improve the initial sharpness of the blade.

[0013] In some embodiments, the thickness of the diamond layer is 0.8 mm to 3.0 mm, and the thickness of the non-diamond layer is 0.7 mm to 1.5 mm. The present invention precisely adjusts the thickness of the diamond layer and the non-diamond layer to achieve different degrees of wear and tear between the diamond layer and the non-diamond layer, thereby creating a concave structure in the blade, greatly enhancing the excretion function of the blade and improving the sharpness of the blade.

[0014] In some embodiments, the diamond particles have a size of 30-50 mesh.

[0015] The present invention also provides a method for preparing a uniformly distributed single-piece saw blade for cutting quartz stone, comprising the following steps: Preparation of the matrix: iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide are mixed and cold pressed to form the matrix; Preparation of the diamond layer: evenly distribute diamond particles into the matrix, and place it in a mold for pressing to form a diamond layer; The cutter head body is prepared by cold-pressing the pressed diamond layer and the non-diamond layer in multiple layers, and then placing them in a multi-layer graphite mold for sintering to form the cutter head body.

[0016] In some embodiments, the graphite mold has an M-shaped tip structure.

[0017] In some embodiments, the mixing time is 90 min to 150 min.

[0018] In some embodiments, the pressing pressure is 300 kg / cm 2 -800kg / cm 2 .

[0019] In some embodiments, the sintering temperature is 780°C-850°C.

[0020] In summary, the beneficial effects of the present invention are: The present invention utilizes a uniform distribution process to evenly distribute diamond particles within the matrix, significantly increasing diamond utilization while ensuring the initial sharpness of the blade. Furthermore, the present invention positions the diamond layer at both ends of the blade, with a non-diamond layer and a diamond layer spaced between the two ends. Due to the varying degrees of consumption of the diamond and non-diamond layers, the blade develops a concave structure, enhancing chip removal and sharpness.

[0021] The cutter head matrix of the present invention uses iron powder as the main powder, copper powder, nickel powder, tin powder, and titanium-plated silicon carbide as auxiliary powders, which greatly increases the matrix's grip on diamond particles, can prevent diamond particles from falling off prematurely during the cutting process, and can prevent diamond particles from moving in the matrix, so that the diamond particles can be positioned more accurately; in addition, the titanium-plated silicon carbide greatly enhances the wear resistance of the matrix, can ensure that grooves can be formed between the diamond layer and the non-diamond layer for chip removal, and can prevent the diamond particles from being consumed too quickly due to excessive diamond particle concentration resulting in too deep grooves.

[0022] The present invention configures the cutter head to have a gradient structure with an M-shaped tip, which greatly improves the initial sharpness of the cutter head and greatly reduces the friction resistance of the cutter head during cutting. Moreover, due to the different degrees of consumption of the diamond layer and the non-diamond layer, the cutter head can have a concave structure, thereby enhancing the chip removal function of the cutter head and improving the sharpness of the cutter head.

[0023] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

[0024] Undoubtedly, these and other objects of the present invention will become more apparent after the following detailed description of the preferred embodiment is described with reference to the various figures and drawings.

[0025] In order to make the above and other objects, features and advantages of the present invention more obvious and easy to understand, one or more preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention but do not constitute a limitation of the present invention.

[0027] In the drawings, like components are given like reference numerals, and the drawings are schematic and not necessarily drawn to scale.

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only one or several embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on such drawings without paying any creative work.

[0029] Figure 1 The main view of the cutter head of the present invention Figure 1 ; Figure 2 The side view of the cutter head of the present invention Figure 1 ; Figure 3 The main view of the cutter head of the present invention Figure 2 ; Figure 4 The side view of the cutter head of the present invention Figure 2 ; Figure 5 This is a flow chart for preparing the cutter head of the present invention.

[0030] Explanation of the main reference numerals: 1. diamond layer; 11. diamond particles; 2. non-diamond layer; 3. upper gradient layer; 4. middle gradient layer; 5. lower gradient layer; 6. M-shaped tip. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but are not intended to limit the present invention.

[0032] In addition, in the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] In the present invention, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be interpreted broadly. For example, they may refer to fixed connections, removable connections, or integration; they may refer to direct connections or indirect connections through an intermediate medium; they may refer to internal communication between two components or interactions between two components. However, the term "direct connection" indicates that the two connected entities are not connected through a transitional structure, but are connected solely through a connecting structure to form a single entity. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0034] In the present invention, unless otherwise clearly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0035] Reference Figures 1-4 According to some embodiments of the present invention, the present invention provides a uniformly distributed single-piece saw blade for cutting quartz stone. The blade includes a blade body, the blade body includes a diamond layer 1 and a non-diamond layer 2, the non-diamond layer 2 is arranged between two adjacent diamond layers 1, the diamond layer 1 includes a matrix and diamond particles 11 uniformly distributed within the matrix, and the non-diamond layer 2 includes a matrix. The present invention uses a uniform distribution process to evenly distribute the diamond particles 11 within the matrix, which greatly improves the utilization rate of diamonds and, at the same time, ensures the initial sharpness of the blade. In addition, the present invention arranges the diamond layer 1 at both side ends of the blade, and arranges the non-diamond layer 2 and the diamond layer 1 between the two side ends. Due to the different consumption levels of the diamond layer 1 and the non-diamond layer 2, the blade can have a concave structure, thereby enhancing the chip removal function of the blade and improving the sharpness of the blade.

[0036] According to some embodiments of the present invention, optionally, the matrix includes iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide. Based on the total mass of the matrix, the mass content of the iron powder is 35%-60%, the mass content of the copper powder is 25%-35%, the mass content of the nickel powder is 5%-10%, the mass content of the tin powder is 5%-10%, and the mass content of the titanium-coated silicon carbide is 5%-10%. Among them, iron powder, as the main powder of the cutter head body, has a high holding force on the diamond particles 11, which can prevent the diamond particles 11 from falling off prematurely during work; the diffused copper-tin alloy has a dendritic morphology, which can prevent the diamond particles 11 from moving during the uniform distribution process, so that the diamond particles 11 are positioned more accurately and have better formability, and copper has good compatibility with other elements, and has a good holding effect on the diamond particles 11; nickel powder and zinc powder can be combined with copper elements, and the self-sharpening property of the cutter head can be adjusted to ensure that the cutter head remains sharp at all times during work; titanium-plated silicon carbide can increase the wear resistance of the body due to its extremely high hardness. In combination with the structure of the cutter head, the wear resistance of the body can be different by adjusting the content of titanium-plated silicon carbide in the diamond layer 1 and the non-diamond layer 2, ensuring that grooves can be formed between the diamond layer 1 and the non-diamond layer 2 for chip removal, and preventing the concentration difference of diamond particles 11 from being too large, resulting in too deep grooves, and avoiding too fast consumption of diamond particles 11.

[0037] According to some embodiments of the present invention, the spacing between the diamond particles 11 is optionally 0.6 mm to 2.5 mm. The spacing between the diamond particles 11 refers to the spacing between rows of diamond particles 11 or between columns of diamond particles 11. The present invention adjusts the spacing between the diamond particles 11 through a uniform distribution process to avoid significant changes in the concentration of the diamond particles 11 due to different drop heights, which can degrade the cutting stability of the tool head.

[0038] According to some embodiments of the present invention, the cutter head body is optionally provided with an upper gradient layer 3, an intermediate gradient layer 4, and a lower gradient layer 5 in the vertical direction, which successively contract inward. By providing the cutter head with a gradient structure, the present invention greatly reduces frictional resistance during cutting and significantly improves sharpness.

[0039] According to some embodiments of the present invention, the spacing between the diamond particles 11 may optionally increase gradually from the upper gradient layer 3 to the lower gradient layer 5. In the present invention, the upper portion of the cutter head has a larger volume, so the number of diamond particles 11 increases. The number of diamond particles 11 should be appropriately reduced as the volume decreases downward. The number of diamond particles 11 can be controlled by designing different diamond spacings through a uniform distribution process.

[0040] According to some embodiments of the present invention, optionally, the gradient drop between the intermediate gradient layer 4 and the upper gradient layer 3 is 0.3mm-0.5mm, and the gradient drop T between the lower gradient layer 5 and the intermediate gradient layer 4 is 0.3mm-0.5mm. By precisely adjusting the gradient drop, the present invention reduces the frictional resistance of the blade during cutting, thereby improving sharpness.

[0041] According to some embodiments of the present invention, the top of the cutter head body is optionally provided with an M-shaped tip 6, and diamond particles 11 are evenly distributed in the M-shaped tip 6. The present invention greatly improves the initial sharpness of the cutter head by providing the M-shaped tip 6 at the top of the cutter head.

[0042] According to some embodiments of the present invention, optionally, the height H of the M-shaped tip 6 is 0.5 mm to 2.0 mm. The present invention precisely sets the height of the M-shaped tip 6 to precisely improve the initial sharpness of the blade.

[0043] According to some embodiments of the present invention, optionally, the thickness of the diamond layer 1 is 0.8 mm to 3.0 mm, and the thickness of the non-diamond layer 2 is 0.7 mm to 1.5 mm. The present invention precisely sets the thickness of the diamond layer 1 and the non-diamond layer 2 to achieve different degrees of consumption between the diamond layer 1 and the non-diamond layer 2, thereby creating a concave structure in the cutter head, greatly enhancing the excretion function of the cutter head and improving the sharpness of the cutter head.

[0044] According to some embodiments of the present invention, optionally, the size of the diamond particles 11 is 30-50 mesh.

[0045] Reference Figure 5 , Figure 5 This is a flow chart for preparing the cutter head of the present invention.

[0046] According to some embodiments of the present invention, the present invention further provides a method for preparing a uniformly distributed single-piece saw blade for cutting quartz stone, comprising the following steps: Preparation of the matrix: iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide are mixed and cold pressed to form the matrix; Preparation of the diamond layer 1: evenly distribute diamond particles 11 into the matrix, and place it in a mold for pressing to form the diamond layer 1; The cutter head body is prepared by cold-pressing the pressed diamond layer 1 and the non-diamond layer 2 in multiple layers, and then placing them in a multi-layer graphite mold for sintering to form the cutter head body.

[0047] According to some embodiments of the present invention, optionally, the graphite mold has an M-shaped tip 6 structure.

[0048] According to some embodiments of the present invention, optionally, the mixing time is 90 min-150 min.

[0049] According to some embodiments of the present invention, optionally, the pressing pressure is 300 kg / cm 2 -800kg / cm 2 .

[0050] According to some embodiments of the present invention, optionally, the sintering temperature is 780°C-850°C.

[0051] Example 1 This embodiment provides a uniformly distributed single-blade saw blade for cutting quartz stone. The blade includes a blade body, which includes a diamond layer 1 and a non-diamond layer 2. The non-diamond layer 2 is provided between two adjacent diamond layers 1. The diamond layer 1 includes a matrix and diamond particles 11 uniformly distributed within the matrix. The matrix includes iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide. Based on the total mass of the matrix, the mass content of the iron powder is 60%, the mass content of the copper powder is 25%, the mass content of the nickel powder is 5%, the mass content of the tin powder is 5%, and the mass content of the titanium-coated silicon carbide is 5%.

[0052] The cutter head body is vertically provided with an upper gradient layer 3, an intermediate gradient layer 4, and a lower gradient layer 5 that shrink inwards in sequence. The gradient drop T between the intermediate gradient layer 4 and the upper gradient layer 3 is 0.3 mm, and the gradient drop T between the lower gradient layer 5 and the intermediate gradient layer 4 is 0.3 mm.

[0053] The spacing between the diamond particles 11 gradually increases from the upper gradient layer 3 to the lower gradient layer 5. The spacing between the diamond particles 11 in the upper gradient layer 3 is 1.2 mm; the spacing between the diamond particles 11 in the middle gradient layer 4 is 1.6 mm; and the spacing between the diamond particles 11 in the lower gradient layer 5 is 2.0 mm.

[0054] The top of the tool head body is provided with an M-shaped tip 6, and diamond particles 11 are evenly distributed in the M-shaped tip 6. The height H of the M-shaped tip 6 is 0.5 mm.

[0055] The method for preparing the cutter head of this embodiment includes the following steps: Preparation of the matrix: iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide are placed in a three-dimensional mixer and mixed (mixing time is 90 minutes), and then cold pressed to form a matrix; The diamond layer 1 is prepared by using a screen adsorption uniform distribution process. Holes corresponding to the diamond aperture are punched on the screen, and then the diamond particles 11 are adsorbed into the screen holes by negative pressure. The screen with the adsorbed diamond particles 11 is then released by the machine onto the matrix and placed in a mold with an M-shaped tip 6 structure for pressing (the pressing pressure is 800kg / cm 2 ), forming a diamond layer 1; The cutter head body is prepared by cold-pressing the pressed diamond layer 1 and the non-diamond layer 2 in multiple layers, placing them in a multi-layer graphite mold assembled with an M-shaped tip 6 structure for sintering (sintering temperature is 780°C) and keeping them warm for 2 minutes to form the cutter head body.

[0056] Among them, at the M-shaped tip 6, the arrangement of diamond particles 11 should be 1-5, which can ensure the sharpness of the cutter head, and can also increase the consumption distance between the diamond layer 1 and the non-diamond layer 2, accelerate the formation of the concave structure in the cutter head, and improve the chip removal ability of the cutter head.

[0057] Example 2 This embodiment provides a uniformly distributed single-blade saw blade for cutting quartz stone. The blade includes a blade body, which includes a diamond layer 1 and a non-diamond layer 2. The non-diamond layer 2 is provided between two adjacent diamond layers 1. The diamond layer 1 includes a matrix and diamond particles 11 uniformly distributed within the matrix. The matrix includes iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide. Based on the total mass of the matrix, the mass content of the iron powder is 47.5%, the mass content of the copper powder is 30%, the mass content of the nickel powder is 7.5%, the mass content of the tin powder is 7.5%, and the mass content of the titanium-coated silicon carbide is 7.5%.

[0058] The cutter head body is vertically provided with an upper gradient layer 3, an intermediate gradient layer 4, and a lower gradient layer 5 that shrink inwards in sequence. The gradient drop T between the intermediate gradient layer 4 and the upper gradient layer 3 is 0.4 mm, and the gradient drop T between the lower gradient layer 5 and the intermediate gradient layer 4 is also 0.4 mm.

[0059] The spacing between the diamond particles 11 gradually increases from the upper gradient layer 3 to the lower gradient layer 5. The spacing between the diamond particles 11 in the upper gradient layer 3 is 0.9 mm; the spacing between the diamond particles 11 in the middle gradient layer 4 is 1.3 mm; and the spacing between the diamond particles 11 in the lower gradient layer 5 is 1.7 mm.

[0060] The top of the tool head body is provided with an M-shaped tip 6, and diamond particles 11 are evenly distributed in the M-shaped tip 6. The height H of the M-shaped tip 6 is 1.75 mm.

[0061] The method for preparing the cutter head of this embodiment includes the following steps: Preparation of the matrix: iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide are mixed in a three-dimensional mixer (mixing time is 120 minutes), and cold pressed to form a matrix; The diamond layer 1 is prepared by using a screen adsorption uniform distribution process. Holes corresponding to the diamond aperture are punched on the screen, and then the diamond particles 11 are adsorbed into the screen holes by negative pressure. The screen with the adsorbed diamond particles 11 is then released by the machine onto the matrix and placed in a mold with an M-shaped tip 6 structure for pressing (the pressing pressure is 550kg / cm 2 ), forming a diamond layer 1; The cutter head body is prepared by cold-pressing the pressed diamond layer 1 and the non-diamond layer 2 in multiple layers, placing them in a multi-layer graphite mold assembled with an M-shaped tip 6 structure for sintering (sintering temperature is 800°C) and keeping them warm for 1.5 minutes to form the cutter head body.

[0062] Among them, at the M-shaped tip 6, the arrangement of diamond particles 11 should be 1-5, which can ensure the sharpness of the cutter head, and can also increase the consumption distance between the diamond layer 1 and the non-diamond layer 2, accelerate the formation of the concave structure in the cutter head, and improve the chip removal ability of the cutter head.

[0063] Example 3 This embodiment provides a uniformly distributed single-blade saw blade for cutting quartz stone. The blade includes a blade body, which includes a diamond layer 1 and a non-diamond layer 2. The non-diamond layer 2 is provided between two adjacent diamond layers 1. The diamond layer 1 includes a matrix and diamond particles 11 uniformly distributed within the matrix. The matrix includes iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide. Based on the total mass of the matrix, the mass content of the iron powder is 35%, the mass content of the copper powder is 35%, the mass content of the nickel powder is 10%, the mass content of the tin powder is 10%, and the mass content of the titanium-coated silicon carbide is 10%.

[0064] The cutter head body is vertically provided with an upper gradient layer 3, an intermediate gradient layer 4, and a lower gradient layer 5 that shrink inwards in sequence. The gradient drop T between the intermediate gradient layer 4 and the upper gradient layer 3 is 0.5 mm, and the gradient drop T between the lower gradient layer 5 and the intermediate gradient layer 4 is 0.5 mm.

[0065] The spacing between the diamond particles 11 gradually increases from the upper gradient layer 3 to the lower gradient layer 5. The spacing between the diamond particles 11 in the upper gradient layer 3 is 0.6 mm; the spacing between the diamond particles 11 in the middle gradient layer 4 is 1.0 mm; and the spacing between the diamond particles 11 in the lower gradient layer 5 is 1.4 mm.

[0066] The top of the tool head body is provided with an M-shaped tip 6, and diamond particles 11 are evenly distributed in the M-shaped tip 6. The height H of the M-shaped tip 6 is 2.0 mm.

[0067] The method for preparing the cutter head of this embodiment includes the following steps: Preparation of the matrix: iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide are placed in a three-dimensional mixer and mixed (mixing time is 150 minutes), and then cold pressed to form a matrix; The diamond layer 1 is prepared by using a screen adsorption uniform distribution process. Holes corresponding to the diamond aperture are punched on the screen, and then the diamond particles 11 are adsorbed into the screen holes by negative pressure. The screen with the adsorbed diamond particles 11 is then released by the machine onto the matrix and placed in a mold with an M-shaped tip 6 structure for pressing (the pressing pressure is 300kg / cm 2 ), forming a diamond layer 1; The cutter head body is prepared by cold-pressing the pressed diamond layer 1 and the non-diamond layer 2 in multiple layers, placing them in a multi-layer graphite mold assembled with an M-shaped tip 6 structure for sintering (the sintering temperature is 850°C) and keeping them warm for 1 minute to form the cutter head body.

[0068] Among them, at the M-shaped tip 6, the arrangement of diamond particles 11 should be 1-5, which can ensure the sharpness of the cutter head, and can also increase the consumption distance between the diamond layer 1 and the non-diamond layer 2, accelerate the formation of the concave structure in the cutter head, and improve the chip removal ability of the cutter head.

[0069] It should be noted that many specific details are set forth in the above description to facilitate a full understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

Claims

1. A uniformly distributed single-piece saw blade for cutting quartz stone, characterized in that: The tool head comprises a main body, the main body comprising a diamond layer and a non-diamond layer, the non-diamond layer being disposed between two adjacent diamond layers, the diamond layer comprising a matrix and diamond particles uniformly distributed within the matrix; Wherein, the matrix includes iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide. Based on the total mass of the matrix, the mass content of the iron powder is 35%-60%, the mass content of the copper powder is 25%-35%, the mass content of the nickel powder is 5%-10%, the mass content of the tin powder is 5%-10%, and the mass content of the titanium-coated silicon carbide is 5%-10%.

2. The uniformly distributed single-piece saw blade for cutting quartz stone according to claim 1, characterized in that: The distance between the diamond particles is 0.6 mm to 2.5 mm.

3. The uniformly distributed single-piece saw blade for cutting quartz stone according to claim 1, characterized in that: The cutter head body is provided with an upper gradient layer, a middle gradient layer and a lower gradient layer which shrink inwards in sequence in the vertical direction.

4. The uniformly distributed single-piece saw blade for cutting quartz stone according to claim 3, characterized in that: The spacing between the diamond particles gradually increases from the upper gradient layer to the lower gradient layer.

5. The uniformly distributed single-piece saw blade for cutting quartz stone according to claim 3, characterized in that: The gradient drop between the middle gradient layer and the upper gradient layer is 0.3 mm to 0.5 mm, and the gradient drop between the lower gradient layer and the middle gradient layer is 0.3 mm to 0.5 mm.

6. The uniformly distributed single-piece saw blade for cutting quartz stone according to claim 1, characterized in that: The top of the cutter head body is provided with an M-shaped tip, and diamond particles are evenly distributed in the M-shaped tip.

7. The uniformly distributed single-piece saw blade for cutting quartz stone according to claim 6, characterized in that: The height of the M-shaped tip is 0.5mm-2.0mm.

8. The uniformly distributed single-piece saw blade for cutting quartz stone according to claim 1, characterized in that: The thickness of the diamond layer is 0.8 mm to 3.0 mm, and the thickness of the non-diamond layer is 0.7 mm to 1.5 mm.

9. A method for preparing a uniformly distributed single-piece saw blade for cutting quartz stone according to any one of claims 1 to 8, characterized in that: The following steps are involved: Preparation of the matrix: iron powder, copper powder, nickel powder, tin powder, and titanium-coated silicon carbide are mixed and cold pressed to form the matrix; Preparation of diamond layer: Diamond particles are evenly distributed in the matrix and placed in a mold with an M-shaped tip structure at a pressure of 300 kg / cm 2 -800kg / cm 2 Pressing is performed to form a diamond layer; The cutter head body is prepared by cold-pressing the pressed diamond layer and the non-diamond layer in multiple layers, and then placing them in a multi-layer graphite mold for sintering to form the cutter head body.

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