Temperature and pressure integrated sensor based on MSG technology and assembly process thereof

Abstract

The invention relates to an MSG technology-based temperature and pressure integrated sensor and an assembly process thereof, and relates to the technical field of temperature and pressure sensors, the sensor comprises a base, an NTC, a PCBA, an FPC and a connector, and further comprises a core device composed of an adapter, an NTC protection shell and a pressure sensing device, and the NTC protection shell and the pressure sensing device are fixed with the adapter through welding; the core device and the PCBA are installed in the base, the NTC and the pressure sensing device are electrically connected to the PCBA, and the PCBA is electrically connected to the connector through the FPC. A first through hole for the NTC protection shell to penetrate through and a second through hole for pressure communication are formed in the adapter in a penetrating mode, and the interior of the pressure sensing device is communicated with the second through hole. According to the temperature and pressure sensor, the adapter, the pressure sensing device and the NTC protective shell are arranged, modular assembly, modular design and production can be carried out on core devices of the temperature and pressure sensor, the production efficiency is improved, the measuring range requirements of different pressures are met, the micro-fused silicon strain gauge technology is adopted, and the product output precision is high.

Description

Technical Field

[0001] The present application relates to the technical field of temperature and pressure sensors, and in particular to a temperature and pressure integrated sensor based on MSG technology and its assembly process. Background Art

[0002] A temperature and pressure sensor is a sensor that can simultaneously detect temperature and pressure. Although it's a single sensor, it has separate temperature and pressure detection modules. Using micro-fused silicon strain gauge (MSG) technology, MSG pressure sensors are widely used in various applications, including vehicle braking systems, vehicle stability control systems, fuel pressure monitoring systems, and transmission systems. An MSG pressure sensor typically consists of a silicon strain gauge element, which is glass-bonded to a metal diaphragm in the pressure port body and forms the sensing element. The silicon strain gauges form a Wheatstone bridge circuit. Due to the characteristic that the silicon strain gauges' resistance decreases under pressure and increases under tension, when the Wheatstone bridge is powered on, the voltage signals at the nodes change with the deformation of the metal diaphragm. This signal is then calibrated to a linear output proportional to the pressure acting on the metal diaphragm.

[0003] The existing invention patent application with publication number CN116124225A discloses a temperature and pressure sensor and an assembly method thereof, wherein the temperature and pressure sensor includes a base, a top surface of the base is provided with a receiving groove inwardly, a bottom of the receiving groove is provided with a first through hole and a mounting groove inwardly, and a bottom of the mounting groove is provided with a second through hole inwardly; a pressure detection seat is installed in the mounting groove, and a varistor is installed on the top surface of the pressure detection seat through glass; a plug is installed at the bottom of the first through hole, a temperature detection cavity is provided in the plug, and a temperature detection device is provided in the temperature detection cavity; in actual use, temperature detection is achieved by opening a first through hole and a second through hole on the base, installing a plug in the first through hole and installing a temperature detection device in the plug, and installing a pressure detection seat in the second through hole and installing a varistor on the top surface of the pressure detection seat, thereby realizing the integration of temperature and pressure detection, so that temperature and pressure detection can be achieved through one device.

[0004] Regarding the above-mentioned related technologies, the inventors believe that different sensor models have different pressure detection ranges, and the fundamental reason is that the pressure sensing devices that serve as the core of pressure detection are different. If finished parts packaged for temperature and pressure detection are used, the cost is too high and needs to be improved. Summary of the Invention

[0005] The present application provides a temperature-pressure integrated sensor based on MSG technology and its assembly process, which adopts a modular assembly method for fixation. Different pressure sensing devices can be replaced for different types of sensors for assembly, thereby reducing costs.

[0006] This application provides a temperature and pressure integrated sensor based on MSG technology, which adopts the following technical solutions:

[0007] A temperature and pressure integrated sensor based on MSG technology includes a base, an NTC, a PCBA, an FPC, and a connector. It also includes a core component consisting of an adapter, an NTC protective shell, and a pressure sensing device. The NTC protective shell and the pressure sensing device are fixed to the adapter by welding. The core component and the PCBA are installed in the base, the NTC and the pressure sensing device are electrically connected to the PCBA, and the PCBA is electrically connected to the connector via the FPC. The adapter is penetrated by a first through-hole for the NTC protective shell to pass through and a second through-hole for pressure communication. The interior of the pressure sensing device is connected to the second through-hole.

[0008] By adopting the above technical solution, by setting up the adapter, pressure sensing device, and NTC protective shell, the core components can be modularly assembled and then assembled into the entire sensor.

[0009] Optionally, an inward-bent fold is provided on the top of the base, and the fold presses and fixes the outer edge of the connector. One end of the FPC is fixed to the PCBA by soldering, and the other end of the FPC is fixed to the pin of the connector by soldering.

[0010] By adopting this technical solution, the signals generated by the NTC and pressure sensing device pass through the PCBA and FPC in sequence, and are then transmitted outward through the pins on the connector. The folded edge is pressed together to improve the stability of the connection between the base and the connector.

[0011] Optionally, the pressure sensing device is integrally formed with a stress isolation ring near the outer wall of the adapter.

[0012] By adopting the above technical solution, the stress isolation ring can reduce the influence of welding stress and improve the welding firmness.

[0013] In a second aspect, the present application provides an assembly process for a temperature-pressure integrated sensor based on MSG technology, which adopts the following technical solutions:

[0014] An assembly process for a temperature-pressure integrated sensor based on MSG technology, used for assembling the above-mentioned temperature-pressure integrated sensor based on MSG technology, comprises the following steps:

[0015] Step S1: Assembly of core components:

[0016] The welding and fixing of the NTC protective shell and the adapter, and the pressure sensing device and the adapter are completed by the welding robot;

[0017] Assembly of the sensor as a whole:

[0018] Step S2: Install the core component in the base, and fix the adapter to the base;

[0019] Step S3: Assemble the NTC into the NTC protective shell;

[0020] Step S4: Assemble the PCBA and the base and bond them with glue;

[0021] Step S5: Soldering the upper end of the NTC to the PCBA;

[0022] Step S6: bonding the pressure sensing device to the PCBA lead and applying protective glue;

[0023] Step S7: Adhere a protective cover to the lead area of ​​the PCBA and the pressure sensing device;

[0024] Step S8: One end of the FPC is fixed to the PCBA by soldering, and the other end of the FPC is fixed to the pin of the connector by soldering;

[0025] Step S9: placing the connector on the base, and pre-pressing the connector and the base;

[0026] Step S10: Riveting the top of the base to form a folded edge to fix the base to the connector;

[0027] Step S11: Apply conformal glue to the contact point between the base and the connector.

[0028] By adopting the above technical solution, the assembly of the temperature and pressure integrated sensor is completed.

[0029] Optionally, the adapter is fixed to the metal base by riveting or welding.

[0030] By adopting the above technical solution, the fixing method cancels the O-ring seal and eliminates the leakage risk caused by the aging of the O-ring.

[0031] Optionally, in step S1, assembling the core components includes the following steps:

[0032] Step S101: Place an NTC protective shell in through hole 1 of the adapter, and place the adapter on the electric turntable. The NTC protective shell is located in the center hole of the electric turntable. The upper cylinder drives the pressure plate to press down on the top surface of the NTC protective shell to tighten the NTC protective shell. The lower end of the upper cylinder is rotatably connected to the pressure plate.

[0033] Step S102: The lower cylinder drives the positioning rod to penetrate the middle hole of the electric turntable. The top surface of the positioning rod is provided with a positioning groove. The positioning rod presses and positions the NTC protective shell through the top surface. The upper end of the lower cylinder is rotatably connected to the positioning rod.

[0034] Step S103: After positioning is completed, the positioning rod moves downward away from the adapter, the pressure plate moves upward away from the adapter, the welding robot approaches the contact position of the NTC protective shell and the adapter, the electric turntable rotates one circle, and the welding robot completes welding at the contact position of the NTC protective shell and the adapter;

[0035] Step S104: The auxiliary manipulator clamps the pressure sensing device onto the adapter, and the auxiliary manipulator pushes the adapter to move so that the second through hole is aligned with the center hole of the electric turntable;

[0036] Step S105: The upper cylinder drives the pressure plate to press down on the top surface of the pressure sensing device, and the lower cylinder drives the positioning rod to penetrate the middle hole of the electric turntable. The positioning rod is inserted into the second through hole. The outer diameter of the positioning rod corresponds to the inner diameter of the second through hole, and the outer edge of the top of the positioning rod is chamfered.

[0037] Step S106: The welding robot approaches the contact position of the pressure sensing device and the adapter, and the electric turntable rotates one circle. At the same time, the welding robot completes welding at the contact position of the pressure sensing device and the adapter;

[0038] Step S107: Control the upper cylinder and the lower cylinder to shorten and release the core component, and take out the core component.

[0039] By adopting the above technical solution, the assembly and production of modular core components are completed with a high degree of automation, and the fixation of the NTC protective shell and the adapter, and the pressure sensing component and the adapter can be completed in one go.

[0040] Optionally, a sliding groove is provided on the central hole wall of the electric turntable for the NTC protective shell to slide, and the sliding groove is opened along the radial direction of the electric turntable and passes upward to the top surface of the electric turntable.

[0041] By adopting the above technical solution, when the auxiliary manipulator pushes the base to move, the NTC protective shell enters the slide groove and slides in the slide groove. On the one hand, the slide groove prevents the electric turntable from blocking the movement of the NTC protective shell, and on the other hand, it provides a guide for the sliding of the NTC protective shell.

[0042] Optionally, the auxiliary manipulator includes a horizontally arranged linear module 1, a vertically arranged linear module 2 is fixed on a movable seat of the linear module 1, and a pneumatic clamp is fixed on a movable seat of the linear module 2.

[0043] By adopting the above technical solution, linear module 1 and linear module 2 are used to realize the position movement of the pneumatic gripper on the vertical plane. The pneumatic gripper is placed by first moving vertically downward and then moving horizontally. The pressure sensing device is placed.

[0044] Optionally, a push plate is fixed to the movable seat of the linear module 2.

[0045] By adopting the above technical solution, the push plate is used to contact the outer wall of the adapter and push the adapter to move horizontally. After the pneumatic clamp moves horizontally into position, the center of the pressure sensing device faces through hole two, and the push plate pushes the adapter to a position where through hole two faces the center hole of the electric turntable, thereby reducing invalid steps of mechanical movement and improving efficiency.

[0046] Optionally, the welding method of the welding robot is laser welding.

[0047] By adopting the above technical solution, laser welding has the advantages of strong adaptability, fast speed, small deformation, and does not produce harmful substances. No welding wire is required during the welding process, making it more suitable for precision welding.

[0048] In summary, this application includes at least one of the following beneficial technical effects:

[0049] 1. By setting up adapters, pressure sensing devices, and NTC protective shells, the core components of temperature and pressure sensors can be modularly assembled, modularly designed, and produced to improve production efficiency;

[0050] 2. For different temperature and pressure sensors, different pressure sensing devices can be selected through modular assembly to meet the requirements of different pressure ranges. The micro-fused silicon strain gauge (MSG) technology is used, and the product output is high in accuracy.

[0051] 3. The O-ring seal is removed between the adapter and the base to eliminate the leakage risk caused by the aging of the O-ring. The stress isolation ring design is adopted to reduce the impact of welding stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 is a cross-sectional view of a temperature-pressure integrated sensor based on MSG technology according to Example 1;

[0053] Figure 2 It is an exploded view of the assembly of the first embodiment;

[0054] Figure 3 is a cross-sectional view of the core component of Example 1;

[0055] Figure 4 Schematic diagram of the electric turntable, upper cylinder, and lower cylinder of the third embodiment;

[0056] Figure 5 is a structural diagram of the auxiliary manipulator of Example 3;

[0057] Figure 6 is a schematic diagram of step S104 of embodiment 3;

[0058] Figure 7 It is a schematic diagram of step S105 and step S106 of embodiment three.

[0059] Explanation of the reference numerals: 1. Base; 11. NTC; 12. PCBA; 13. FPC; 14. Connector; 21. Adapter; 22. NTC protective shell; 23. Pressure sensing device; 2. Core device; 231. Stress isolation ring; 211. Through hole one; 212. Through hole two; 10. Folding edge; 141. Bump; 15. Protective cover; 3. Electric turntable; 4. Upper cylinder; 41. Pressure plate; 31. Slide; 5. Lower cylinder; 51. Positioning rod; 52. Positioning slot; 6. Welding robot; 7. Auxiliary robot; 71. Linear module one; 72. Linear module two; 73. Pneumatic gripper; 74. Push plate. DETAILED DESCRIPTION

[0060] The present application is further described in detail below with reference to the accompanying drawings.

[0061] Example 1:

[0062] Reference Figures 1 to 3 This embodiment discloses a temperature-pressure integrated sensor based on MSG technology, comprising a base 1, an NTC 11, a PCBA 12, an FPC 13, and a connector 14. It also includes a core component 2 consisting of an adapter 21, an NTC protective shell 22, and a pressure sensing device 23. The NTC 11 is a thermistor, the PCBA 12 is a printed circuit board assembly, and the FPC 13 is a flexible printed circuit board.

[0063] The NTC protective shell 22 and pressure sensor 23 are secured to the adapter 21 by welding. Pressure sensor 23 utilizes micro-fused silicon strain gauge (MSG) technology, resulting in high precision. A stress isolation ring 231 is integrally formed on the outer wall of pressure sensor 23, near the adapter 21. This ring reduces welding stress and improves weld security.

[0064] The core component 2 and PCBA 12 are installed in the base 1. Specifically, the adapter 21 is fixed to the aluminum or iron base 1 by riveting, or the adapter 21 is fixed to the stainless steel base 1 by welding. Laser welding is specifically used for welding. This fixing method eliminates the O-ring seal and eliminates the leakage risk caused by the aging of the O-ring.

[0065] The NTC 11 and pressure sensor 23 are electrically connected to the PCBA 12, which is then electrically connected to the connector 14 via the FPC 13. The adapter 21 is provided with a first through-hole 211 for the NTC protective shell 22 to pass through, and a second through-hole 212 for pressure communication. The interior of the pressure sensor 23 is connected to the second through-hole 212. The signals generated by the NTC 11 and pressure sensor 23 pass through the PCBA 12 and FPC 13, and are then transmitted through the pins on the connector 14.

[0066] An inward-bent folded edge 10 is provided on the top of the base 1, which presses and fixes the outer edge of the connector 14. One end of the FPC 13 is fixed to the PCBA 12 by soldering, and the other end of the FPC 13 is fixed to the pin of the connector 14 by soldering.

[0067] The outer wall of the connector 14 is provided with a protrusion 141, which is pressed tightly against the inner wall of the flange 10. After the top of the base 1 is pressed together to form the flange 10, the protrusion 141 can be partially inserted into the inner wall of the flange 10, and the protrusion 141 prevents relative rotation between the connector 14 and the base 1.

[0068] The second through hole 212 is connected to the outside through the gap between the adapter 21 and the base 1 and the gap between the NTC protective shell 22 and the base 1, so that the pressure sensing device 23 can play a detection role.

[0069] The implementation principle of the integrated temperature and pressure sensor based on MSG technology in the embodiment of the present application is as follows: by providing the adapter 21, the pressure sensing device 23, and the NTC protective shell 22, the core component 2 of the temperature and pressure sensor can be modularly assembled. For different temperature and pressure sensors, the internal components of the pressure sensing device 23 are different. Through modular assembly, different pressure sensing devices 23 can be selected to meet the requirements of different pressure ranges. The NTC protective shell 22 and the adapter 21 are used as universal components to reduce costs, and the various components are fixed by welding, which has high welding strength.

[0070] In addition, by providing the NTC protective shell 22 and assembling the NTC protective shell 22 from top to bottom, all welding positions are concentrated on the top surface of the adapter 21, which facilitates welding operations.

[0071] Example 2:

[0072] An assembly process for a temperature-pressure integrated sensor based on MSG technology, used for assembling the temperature-pressure integrated sensor based on MSG technology of Example 1, comprises the following steps:

[0073] Step S1: Assembly of core device 2:

[0074] The welding robot 6 completes the welding and fixing of the NTC protective shell 22 and the adapter 21 , and the pressure sensing device 23 and the adapter 21 .

[0075] Reference Figures 1 to 3 , the overall assembly of the sensor:

[0076] Step S2: Install the core component 2 in the base 1 , and fix the adapter 21 to the base 1 .

[0077] The adapter 21 is fixed to the metal base 1 by riveting or welding. Specifically, the adapter 21 is fixed to the aluminum or iron base 1 by riveting, or the adapter 21 is fixed to the stainless steel base 1 by welding. The fixing method is selected based on the hardness of the base 1 material. This fixing method eliminates the O-ring seal, eliminating the potential leakage caused by O-ring aging.

[0078] Step S3 : The NTC 11 is assembled into the NTC protective shell 22 .

[0079] Step S4: PCBA 12 is assembled with the base 1 and bonded with glue.

[0080] Step S5: The upper end of the NTC 11 is soldered to the PCBA 12 using tin soldering.

[0081] Step S6: The pressure sensing device 23 is wire-bonded to the PCBA 12 and protective glue is applied.

[0082] Step S7: Glue the protective cover 15 on the lead area of ​​the PCBA 12 and the pressure sensing device 23. The leads of the pressure sensing device 23 are protected by gluing and the protective cover 15 to improve stability in various harsh environments.

[0083] Step S8: One end of FPC 13 is secured to PCBA 12 via soldering, and the other end of FPC 13 is secured to the pins of connector 14 via soldering. FPC 13 is bent into a U-shape, with one end of FPC 13 located on the upper layer and the other end of FPC 13 located on the lower layer. Due to its flexible and deformable nature, FPC 13 can still conduct the circuit even when the distance between PCBA 12 and connector 14 changes.

[0084] Step S9: Place the connector 14 on the base 1 , pre-press the connector 14 and the base 1 , and position and install the connector 14 on the base 1 through pre-pressing, so that the bottom of the connector 14 enters the ring at the top of the base 1 .

[0085] Step S10: The top of the base 1 is riveted to form a flange 10, securing the base 1 to the connector 14. This riveting is performed using a riveting machine, the bottom surface of which is a flared conical structure, thereby deforming and closing the top of the base 1 to form the flange 10. Simultaneously, a protrusion 141 is partially inserted into the inner wall of the flange 10, preventing relative rotation between the connector 14 and the base 1, thereby improving the stability of the assembly.

[0086] Step S11: Apply conformal coating to the contact position between the base 1 and the connector 14 to seal the contact position.

[0087] Through the above steps, the assembly of the temperature and pressure integrated sensor is completed.

[0088] Example 3:

[0089] An assembly process for a temperature-pressure integrated sensor based on MSG technology, used for assembling the core component 2 of the second embodiment, comprises the following steps:

[0090] Step S101: Refer to Figure 4 , place the NTC protective shell 22 in the through hole 211 of the adapter 21, place the adapter 21 on the electric turntable 3, the NTC protective shell 22 is located at the middle hole of the electric turntable 3, the upper cylinder 4 drives the pressing plate 41 to press down on the top surface of the NTC protective shell 22 to tighten the NTC protective shell 22, and the lower end of the upper cylinder 4 is rotatably connected to the pressing plate 41.

[0091] The electric turntable 3 is of the type with a central hole, which runs through the electric turntable 3. The driving source of the electric turntable 3 is a servo motor, and the angle of rotation can be precisely controlled. The wall of the central hole of the electric turntable 3 is provided with a slide groove 31 for the NTC protective shell 22 to slide. The slide groove 31 is opened along the radial direction of the electric turntable 3 and extends upward to the top surface of the electric turntable 3. The upper end of the upper cylinder 4 is fixed to the frame, and the axis of the pressure plate 41 coincides with the rotation axis of the electric turntable 3. The bottom surface of the pressure plate 41 is provided with an avoidance groove to prevent the pressure plate 41 from crushing the structure on the top of the pressure sensing device 23.

[0092] Step S102: The lower cylinder 5 drives the positioning rod 51 to penetrate the middle hole of the electric turntable 3. The top surface of the positioning rod 51 is provided with a positioning groove 52. The positioning rod 51 presses and positions the NTC protective shell 22 through the top surface. The upper end of the lower cylinder 5 is rotatably connected to the positioning rod 51.

[0093] The lower end of the lower cylinder 5 is fixed to the frame, and the axis of the positioning rod 51 coincides with the rotation axis of the electric turntable 3. Specifically, the lower end of the NTC protective shell 22 enters the positioning slot 52. The positioning slot 52 is a flared slot that corrects the deviation and positions the lower end of the NTC protective shell 22. It should be noted that the upward force of the lower cylinder 5 is less than the downward force of the upper cylinder 4, preventing the NTC protective shell 22 from moving upward.

[0094] Step S103: After positioning is completed, the positioning rod 51 moves down away from the adapter 21, the pressure plate 41 moves up away from the adapter 21, the welding robot 6 approaches the contact position of the NTC protective shell 22 and the adapter 21, the electric turntable 3 rotates one circle, and at the same time, the welding robot 6 completes welding of the contact position of the NTC protective shell 22 and the adapter 21.

[0095] The welding robot 6 uses laser welding, which has the advantages of high speed, small deformation, no harmful substances, and no welding wire during the welding process. The top circle of the NTC protective shell 22 is welded by rotating the product, which requires less mobility of the welding robot 6.

[0096] Step S104: Refer to Figure 5 and Figure 6 The auxiliary manipulator 7 clamps the pressure sensing device 23 onto the adapter 21, and the auxiliary manipulator 7 pushes the adapter 21 to move so that the second through hole 212 is opposite to the middle hole of the electric turntable 3. During this process, the NTC protective shell 22 enters the slide groove 31 and slides in the slide groove 31.

[0097] Auxiliary manipulator 7 includes a horizontally mounted linear module 1 71. The track housing of linear module 1 71 is fixed to the frame. A vertically mounted linear module 2 72 is fixed to the movable base of linear module 1 71. A pneumatic gripper 73 is fixed to the movable base of linear module 2 72. Linear modules 1 71 and 2 72 are used to vertically move pneumatic gripper 73. Pneumatic gripper 73 is positioned by first moving vertically downward and then horizontally. Once in position, pneumatic gripper 73 releases pressure sensing device 23, then controls linear modules 1 71 and 2 72 to reverse their movements, moving pneumatic gripper 73 away from electric turntable 3.

[0098] A push plate 74 is fixed to the movable base of the second linear module 72. This push plate 74 contacts the outer wall of the adapter 21 and pushes the adapter 21 horizontally. The side of the push plate 74 that contacts the adapter 21 is a circular arc surface. The push plate 74 is positioned so that, after the pneumatic gripper 73 has been horizontally moved into position, the center of the pressure sensing device 23 is aligned with the second through-hole 212. Furthermore, the push plate 74 pushes the adapter 21 until the second through-hole 212 faces the center hole of the electric turntable 3.

[0099] Step S105: Refer to Figure 7 The upper cylinder 4 drives the pressure plate 41 to press down on the top surface of the pressure sensing device 23, and the lower cylinder 5 drives the positioning rod 51 to penetrate the middle hole of the electric turntable 3. The positioning rod 51 is inserted into the second through hole 212. The outer diameter of the positioning rod 51 corresponds to the inner diameter of the second through hole 212, and the outer edge of the top end of the positioning rod 51 is chamfered.

[0100] The guiding effect of the chamfer facilitates the smooth insertion of the positioning rod 51 into the second through hole 212, and plays a positioning and correction role during the insertion process, thereby ensuring that the pressure sensing device 23 coincides with the axis of the positioning rod 51 and the rotation axis of the electric turntable 3.

[0101] Step S106 : the welding robot 6 approaches the contact position of the pressure sensing device 23 and the adapter 21 , the electric turntable 3 rotates one circle, and the welding robot 6 completes welding on the contact position of the pressure sensing device 23 and the adapter 21 .

[0102] Step S107: Control the upper cylinder 4 and the lower cylinder 5 to shorten and loosen the core component 2, and take out the core component 2.

[0103] Through this assembly process, the assembly production of the modular core component 2 is completed with a high degree of automation. The fixation of the NTC protective shell 22 and the adapter 21, and the pressure sensing component 23 and the adapter 21 can be completed at one time. There are few invalid steps in mechanical movement, and the production is efficient. The welding fixation method is adopted, and the degree of firmness is high.

[0104] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A temperature and pressure integrated sensor based on MSG technology, characterized by: The invention comprises a base (1), an NTC (11), a PCBA (12), an FPC (13), and a connector (14), and also comprises a core component (2) consisting of an adapter (21), an NTC protective shell (22), and a pressure sensing device (23), wherein the NTC protective shell (22) and the pressure sensing device (23) are fixed to the adapter (21) by welding; the core component (2) and the PCBA (12) are installed in the base (1), the NTC (11) and the pressure sensing device (23) are electrically connected to the PCBA (12), and the PCBA (12) is electrically connected to the connector (14) through the FPC (13); the adapter (21) is provided with a through hole 1 (211) for the NTC protective shell (22) to pass through and a through hole 2 (212) for pressure communication, and the interior of the pressure sensing device (23) is communicated with the through hole 2 (212).

2. The temperature-pressure integrated sensor based on MSG technology according to claim 1, characterized in that: The top of the base (1) is provided with an inwardly bent folding edge (10), and the folding edge (10) presses and fixes the outer edge of the connector (14); one end of the FPC (13) is fixed to the PCBA (12) by soldering, and the other end of the FPC (13) is fixed to the pin of the connector (14) by soldering.

3. The temperature-pressure integrated sensor based on MSG technology according to claim 1, characterized in that: The pressure sensing device (23) is integrally formed with a stress isolation ring (231) on the outer wall close to the adapter (21).

4. An assembly process for a temperature-pressure integrated sensor based on MSG technology, characterized by: The method for assembling a temperature-pressure integrated sensor based on MSG technology according to any one of claims 1 to 3 comprises the following steps: Step S1: Assembly of core components (2): The NTC protective shell (22) and the adapter (21), and the pressure sensing device (23) and the adapter (21) are welded and fixed by a welding manipulator (6); Assembly of the sensor as a whole: Step S2: Install the core component (2) in the base (1), and fix the adapter (21) to the base (1); Step S3: The NTC (11) is assembled into the NTC protective shell (22); Step S4: Assemble the PCBA (12) and the base (1) and bond them with glue; Step S5: welding the upper end of the NTC (11) to the PCBA (12); Step S6: Wire bonding the pressure sensing device (23) to the PCBA (12) and applying protective glue; Step S7: gluing the protective cover (15) to the lead area of ​​the PCBA (12) and the pressure sensing device (23); Step S8: One end of the FPC (13) is fixed to the PCBA (12) by soldering, and the other end of the FPC (13) is fixed to the pin of the connector (14) by soldering; Step S9: placing the connector (14) on the base (1), and pre-pressing the connector (14) and the base (1); Step S10: riveting the top of the base (1) to form a folded edge (10) to fix the base (1) and the connector (14); Step S11: Apply three-proof glue to the contact position between the base (1) and the connector (14).

5. The assembly process of the temperature-pressure integrated sensor based on MSG technology according to claim 4, characterized in that: The adapter (21) is fixed to the metal base (1) by riveting or welding.

6. The assembly process of the temperature-pressure integrated sensor based on MSG technology according to claim 4, characterized in that: In step S1, the assembly of the core device (2) includes the following steps: Step S101: placing the NTC protective shell (22) in the through hole 1 (211) of the adapter (21), placing the adapter (21) on the electric turntable (3), the NTC protective shell (22) being located at the center hole of the electric turntable (3), the upper cylinder (4) driving the pressing plate (41) to press down on the top surface of the NTC protective shell (22), and tightening the NTC protective shell (22), and the lower end of the upper cylinder (4) is rotatably connected to the pressing plate (41); Step S102: The lower cylinder (5) drives the positioning rod (51) to penetrate the middle hole of the electric turntable (3). The top surface of the positioning rod (51) is provided with a positioning groove (52). The positioning rod (51) is pressed and positioned against the NTC protective shell (22) through the top surface. The upper end of the lower cylinder (5) is rotatably connected to the positioning rod (51). Step S103: After positioning is completed, the positioning rod (51) moves downward away from the adapter (21), the pressing plate (41) moves upward away from the adapter (21), the welding manipulator (6) approaches the contact position of the NTC protective shell (22) and the adapter (21), the electric turntable (3) rotates one circle, and the welding manipulator (6) completes welding at the contact position of the NTC protective shell (22) and the adapter (21); Step S104: the auxiliary manipulator (7) clamps the pressure sensing device (23) onto the adapter (21), and the auxiliary manipulator (7) pushes the adapter (21) to move so that the second through hole (212) faces the middle hole of the electric turntable (3); Step S105: the upper cylinder (4) drives the pressure plate (41) to press down on the top surface of the pressure sensing device (23), and the lower cylinder (5) drives the positioning rod (51) to penetrate the middle hole of the electric turntable (3), and the positioning rod (51) is inserted into the second through hole (212). The outer diameter of the positioning rod (51) corresponds to the inner diameter of the second through hole (212), and the outer edge of the top end of the positioning rod (51) is provided with a chamfer; Step S106: The welding manipulator (6) approaches the contact position of the pressure sensing device (23) and the adapter (21), and the electric turntable (3) rotates one circle. At the same time, the welding manipulator (6) completes welding at the contact position of the pressure sensing device (23) and the adapter (21); Step S107: Control the upper cylinder (4) and the lower cylinder (5) to shorten and loosen the core component (2) and take out the core component (2).

7. The assembly process of the temperature-pressure integrated sensor based on MSG technology according to claim 6, characterized in that: The central hole wall of the electric turntable (3) is provided with a slide groove (31) for the NTC protective shell (22) to slide. The slide groove (31) is opened along the radial direction of the electric turntable (3) and passes through upward to the top surface of the electric turntable (3).

8. The assembly process of the temperature-pressure integrated sensor based on MSG technology according to claim 6, characterized in that: The auxiliary manipulator (7) comprises a horizontally arranged linear module 1 (71), a vertically arranged linear module 2 (72) being fixed on a movable seat of the linear module 1 (71), and a pneumatic clamping claw (73) being fixed on a movable seat of the linear module 2 (72).

9. The assembly process of the temperature-pressure integrated sensor based on MSG technology according to claim 8, characterized in that: The movable seat of the linear module 2 (72) is fixed with a push plate (74).

10. The assembly process of the temperature-pressure integrated sensor based on MSG technology according to claim 6, characterized in that: The welding method of the welding manipulator (6) is laser welding.

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