Parallel probe card device and guide plate mechanism thereof

Abstract

The invention discloses a parallel probe card device and a guide plate mechanism thereof. The guide plate mechanism comprises two guide plate modules which are arranged in a spaced mode. Each guide plate module comprises two guide plates, a spacing piece clamped between the two guide plates and at least two connecting lines formed on one of the guide plates. In each guide plate module, each guide plate is provided with a plurality of through holes, at least two through hole groups are defined, and at least two first connecting lines are respectively configured along at least two first through hole groups of the corresponding guide plate. The layout of the at least two first connecting lines of one guide plate module is equal to the layout of the at least two second connecting lines of the other guide plate module. Therefore, the guide plate mechanism can enable the current path of the conductive probe to be more properly planned, so that the efficiency is effectively improved, and the damage probability of components is reduced.

Description

Technical Field

[0001] The present invention relates to a probe card device, in particular to a parallel probe card device and a guide plate mechanism thereof. Background Art

[0002] Existing probe card devices include multiple probes and two guide plate modules, one at each end of each probe. Current path planning in existing probe card devices primarily focuses on the structure of the probes, resulting in a lack of a technical solution that utilizes two guide plate modules in conjunction with multiple probes to coordinate current path planning. The inventors, believing these deficiencies could be addressed, conducted intensive research and applied scientific principles to develop a rationally designed and effective solution for these deficiencies. Summary of the Invention

[0003] An object of the embodiments of the present invention is to provide a parallel probe card device and a guide plate mechanism thereof, which can effectively improve the defects that may occur in the existing probe card device.

[0004] The embodiment of the present invention discloses a parallel probe card device, which includes: a first guide plate module, including: two first guide plates, each having a plurality of first through-holes, which define at least two first through-hole groups; a first spacer, clamped between the two first guide plates along a thickness direction; and at least two first connection lines, formed on one of the first guide plates, and the at least two first connection lines are respectively arranged along the at least two first through-hole groups; a second guide plate module, arranged at intervals from the first guide plate module along the thickness direction, and the second guide plate module includes: two second guide plates, each having a plurality of second through-holes, which define at least two second through-hole groups; wherein the distribution positions of the at least two first through-hole groups are respectively equal to the distribution positions of the at least two second through-hole groups; a second spacer, arranged along the thickness direction Clamped between two second guide plates; and at least two second connection circuits are formed on one of the second guide plates, and at least two second connection circuits are respectively arranged along at least two second through-hole groups; wherein the layout of at least two first connection circuits is respectively equivalent to the layout of at least two second connection circuits; and a plurality of conductive probes are installed on the first guide plate module and the second guide plate module; wherein the plurality of conductive probes respectively pass through the plurality of first through-holes of each first guide plate, and the plurality of conductive probes also respectively pass through the plurality of second through-holes of each second guide plate; wherein the conductive probes passing through any first through-hole group also pass through the corresponding second through-hole group and can be electrically coupled to each other through the corresponding first connection circuit and the corresponding second connection circuit to jointly form a three-dimensional grid-like parallel structure.

[0005] Preferably, at least two first connecting lines are not connected to one another, and at least two second connecting lines are not connected to one another.

[0006] Preferably, the first guide plate formed with at least two first connection lines is closer to the second guide plate module than the other first guide plate; the second guide plate formed with at least two second connection lines is farther away from the first guide plate module than the other second guide plate.

[0007] Preferably, the parallel probe card device further includes: a spacer plate clamped between the first guide plate module and the second guide plate module; and at least one electronic component connected to at least one first connection circuit; wherein, on the first guide plate having at least two first connection circuits formed thereon, at least one electronic component and a plurality of first perforations are distributed in a matrix shape.

[0008] Preferably, the number of the at least two first through-hole groups and the number of the at least two second through-hole groups are four each, and the number of the at least two first connecting lines and the at least two second connecting lines are also four each; wherein the multiple conductive probes are respectively defined as multiple ground probes and multiple power probes, and the multiple ground probes are arranged through two of the first through-hole groups and the corresponding two second through-hole groups, and the multiple power probes are arranged through the other two first through-hole groups and the corresponding two second through-hole groups.

[0009] Preferably, the multiple grounding probes are respectively connected to the two first connection lines and also respectively connected to the two second connection lines; the first guide plate module is further provided with a first jumper line, and the two first connection lines connected to the multiple grounding probes are electrically coupled to each other through the first jumper line; the second guide plate module is further provided with a second jumper line, and the two second connection lines connected to the multiple grounding probes are electrically coupled to each other through the second jumper line.

[0010] Preferably, the parallel probe card device further includes: a circuit board, adjacent to the second guide plate module; wherein each conductive probe has a fixed section and a test section located at opposite ends respectively; in each conductive probe, the fixed section passes through the second guide plate module and is fixed to the circuit board, the test section passes through the first guide plate module, and the test section is used to detachably abut against one of a plurality of metal pads of an object to be tested; and at least one auxiliary probe, which is installed on the first guide plate module and the second guide plate module; wherein at least one auxiliary probe has a connecting section and a mounting section, the connecting section passes through the second guide plate module and is fixed to the circuit board, and the mounting section is fixed within the first guide plate module, and the mounting section is used to face but not contact the object to be tested.

[0011] Preferably, at least one barb is formed at a distal end of the at least one auxiliary probe so as to be fixed in a first through-hole of the first guide plate which does not form the at least two first connection lines.

[0012] An embodiment of the present invention also discloses a guide plate mechanism of a parallel probe card device, comprising: a first guide plate module, including: two first guide plates, each having a plurality of first perforations, which define at least two first perforation groups; a first spacer, clamped between the two first guide plates along a thickness direction; and at least two first connection lines, formed on one of the first guide plates, and the at least two first connection lines are respectively arranged along the at least two first perforation groups; and a second guide plate module, arranged at intervals from the first guide plate module along the thickness direction, and the second guide plate module includes: two second guide plates, each having a plurality of second perforations, which define at least two second perforation groups; wherein the distribution positions of the at least two first perforation groups are respectively equivalent to the distribution positions of the at least two second perforation groups; a second spacer, clamped between the two second guide plates along the thickness direction; and

[0013] At least two second connection lines are formed on one of the second guide plates, and at least two second connection lines are respectively arranged along at least two second through-hole groups; wherein the layout of the at least two first connection lines is respectively identical to the layout of the at least two second connection lines.

[0014] Preferably, one first perforation group and the corresponding first connection line surround the outside of another first perforation group and the corresponding first connection line; one second perforation group and the corresponding second connection line surround the outside of another second perforation group and the corresponding second connection line.

[0015] In summary, the parallel probe card device and its guide plate mechanism disclosed in the embodiment of the present invention respectively form at least two first connecting circuits and at least two second connecting circuits with the same layout on the first guide plate and the second guide plate, so that the current paths of the multiple conductive probes can be more properly planned, thereby effectively improving the performance of the parallel probe card device and reducing the probability of component damage of the parallel probe card device.

[0016] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 1 is a perspective schematic diagram of a probe head of a parallel probe card device according to a first embodiment of the present invention.

[0018] Figure 2 for Figure 1 Schematic cross-sectional view along section line II-II.

[0019] Figure 3 for Figure 1A three-dimensional schematic diagram of the guide plate mechanism.

[0020] Figure 4 for Figure 1 A three-dimensional schematic diagram of the changing method of the guide plate mechanism.

[0021] Figure 5 FIG. 1 is a perspective schematic diagram of a probe head of a parallel probe card device according to a second embodiment of the present invention.

[0022] Figure 6 for Figure 5 A three-dimensional schematic diagram of the guide plate mechanism.

[0023] Figure 7 FIG. 1 is a perspective schematic diagram of a probe head of a parallel probe card device according to a third embodiment of the present invention.

[0024] Figure 8 for Figure 7 A three-dimensional schematic diagram of the guide plate mechanism.

[0025] Figure 9 FIG. 1 is a perspective schematic diagram of a probe head of a parallel probe card device according to a fourth embodiment of the present invention.

[0026] Figure 10 for Figure 9 Schematic cross-sectional view along section line XX. DETAILED DESCRIPTION

[0027] The following is an explanation of the implementation of the "parallel probe card device and its guide plate mechanism" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. Please note in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0028] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0029] [Example 1]

[0030] See also Figures 1 to 4As shown, it is the first embodiment of the present invention. Figures 1 to 3 As shown, this embodiment discloses a parallel probe card device 1000, which includes a probe head 100 and a circuit board 200 (or a pitch conversion board) fixed to one side of the probe head 100, and the other side of the probe head 100 can be used to detachably support a device under test (DUT) for testing.

[0031] It should be noted that, to facilitate understanding of this embodiment, the accompanying drawings only illustrate a partial cross-sectional view of the parallel probe card apparatus 1000, thereby clearly illustrating the structure and connection relationships of the various components of the parallel probe card apparatus 1000. However, the present invention is not limited to the accompanying drawings. The following describes the structure and connection relationships of the various components of the parallel probe card apparatus 1000.

[0032] The probe head 100 includes a first guide plate module 1, a second guide plate module 2 spaced apart from the first guide plate module 1 along a thickness direction H, a spacer 3 sandwiched between the first and second guide plate modules 1 and 2, and a plurality of conductive probes 4 mounted on the first and second guide plate modules 1 and 2. The circuit board 200 is adjacent to the second guide plate module 2; that is, the second guide plate module 2 is located between the circuit board 200 and the first guide plate module 1.

[0033] It should be noted that the spacer 3 can be a frame-shaped structure, and the spacer 3 is clamped at the corresponding peripheral parts of the first guide plate module 1 and the second guide plate module 2, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the spacer 3 of the parallel probe card device 1000 can also be omitted or replaced by other components. In addition, the first guide plate module 1 and the second guide plate module 2 are described in combination with the above-mentioned multiple components, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the first guide plate module 1 and the second guide plate module 2 can also be combined into a guide plate mechanism and used separately (such as: sold) or used in combination with other components. In addition, the guide plate mechanism can also be equipped with the spacer 3 according to actual needs.

[0034] In this embodiment, the first guide plate module 1 includes two first guide plates 11, a first spacer 12 sandwiched between the two first guide plates 11 along the thickness direction H, and at least two first connecting lines 13 formed on one of the first guide plates 11. The first spacer 12 is sandwiched between the outer portions of the two first guide plates 11, and the first guide plate 11 having the at least two first connecting lines 13 is closer to the second guide plate module 2 than the other first guide plate 11, and the at least two first connecting lines 13 are not connected to each other.

[0035] Furthermore, in this embodiment, the two first guide plates 11 employ substantially the same structure. Therefore, for ease of description, the following description focuses solely on the upper first guide plate 11 and the at least two first connecting traces 13 formed thereon. However, the present invention is not limited thereto. For example, in other embodiments not shown, the structures of the two first guide plates 11 may differ slightly; alternatively, each first guide plate 11 may also have at least two first connecting traces 13 formed thereon.

[0036] More specifically, the first guide plate 11 is flat and has two first plate surfaces 111 located on opposite sides thereof, and a plurality of first through-holes 112 extending through the two first plate surfaces 111. In this embodiment, the plurality of first through-holes 112 preferably have the same size and are arranged in a matrix. The plurality of first through-holes 112 define four first through-hole groups G1-1, G1-2, G1-3, and G1-4, but the present invention is not limited thereto.

[0037] Furthermore, in this embodiment, the number of the at least two first connecting lines 13 is four, and the four first connecting lines 13 are respectively arranged along the four first through-hole groups G1-1, G1-2, G1-3, and G1-4. In other words, each first connecting line 13 is arranged on the surface of the first guide plate 11 along the corresponding first through-hole group G1-1, G1-2, G1-3, and G1-4, and is arranged on the hole wall of the corresponding plurality of first through-holes 112, so that each first connecting line 13 can abut against and electrically connect to the plurality of conductive probes 4 passing through the corresponding first through-hole group G1-1, G1-2, G1-3, and G1-4.

[0038] Furthermore, the second guide plate module 2 includes two second guide plates 21, a second spacer 22 sandwiched between the two second guide plates 21 along the thickness direction H, and at least two second connecting lines 23 formed on one of the second guide plates 21. The second spacer 22 is sandwiched between the outer portions of the two second guide plates 21, and the second guide plate 21 having the at least two second connecting lines 23 is further away from the first guide plate module 1 than the other second guide plate 21, and the at least two second connecting lines 23 are not connected to each other.

[0039] Furthermore, in this embodiment, the two second guide plates 21 employ substantially identical structures. Therefore, for ease of description, the following description focuses solely on the upper second guide plate 21 and the at least two second connecting traces 23 formed thereon. However, the present invention is not limited thereto. For example, in other embodiments not shown, the structures of the two second guide plates 21 may differ slightly; alternatively, each second guide plate 21 may also have at least two second connecting traces 23 formed thereon.

[0040] More specifically, the second guide plate 21 is flat and has two second plate surfaces 211 located on opposite sides thereof, and a plurality of second through-holes 212 extending through the two second plate surfaces 211. In this embodiment, the plurality of second through-holes 212 preferably have the same size and are arranged in a matrix. The plurality of second through-holes 212 define four second through-hole groups G2-1, G2-2, G2-3, and G2-4, but the present invention is not limited thereto.

[0041] Furthermore, in this embodiment, the number of the at least two second connecting lines 23 is four, and the four second connecting lines 23 are respectively arranged along the four second through-hole groups G2-1, G2-2, G2-3, and G2-4. In other words, each second connecting line 23 is arranged on the surface of the second guide plate 21 along a corresponding second through-hole group G2-1, G2-2, G2-3, and G2-4, and is arranged on the wall of a corresponding plurality of second through-holes 212, so that each second connecting line 23 can abut against and electrically connect to the plurality of conductive probes 4 passing through the corresponding second through-hole group G2-1, G2-2, G2-3, and G2-4.

[0042] It should be noted that the layout of the plurality of first connecting lines 13 is limited to being respectively equivalent to the layout of the plurality of second connecting lines 23. That is, the distribution positions of the plurality of first through-hole groups G1-1, G1-2, G1-3, and G1-4 respectively correspond to the distribution positions of the plurality of second through-hole groups G2-1, G2-2, G2-3, and G2-4 (e.g., the plurality of second through-holes 212 of each second guide plate 21 respectively correspond to the plurality of first through-holes 112 of each first guide plate 11 along the thickness direction H), and the plurality of first connecting lines 13 respectively correspond to the plurality of second connecting lines 23 along the thickness direction H.

[0043] The plurality of conductive probes 4 respectively pass through the plurality of first through-holes 112 of each first guide plate 11, and the plurality of conductive probes 4 also respectively pass through the plurality of second through-holes 212 of each second guide plate 21. Accordingly, in actual application, each conductive probe 4 can be positioned by offsetting the first guide plate module 1 and the second guide plate module 2 (not shown in the figure).

[0044] Specifically, each conductive probe 4 has a fixed section 41 and a testing section 42 located at opposite ends, and an extending section 43 connecting the fixed section 41 and the testing section 42. In each conductive probe 4, the fixed section 41 extends through the second guide plate module 2 and is fixed to the circuit board 200, while the testing section 42 extends through the first guide plate module 1 and is configured to detachably contact one of the plurality of metal pads M1 of the object under test M.

[0045] Furthermore, in actual application (not shown in the figure), the test section 42 of each of the conductive probes 4 can be positioned by the mutual misalignment of the two first guide plates 11, and the fixed section 41 of each of the conductive probes 4 can be positioned by the mutual misalignment of the two second guide plates 21, and the extension section 43 of each of the conductive probes 4 can be elastically deformed due to the mutual misalignment of the first guide plate module 1 and the second guide plate module 2, but is not limited to this.

[0046] As described above, the conductive probe 4 passing through any of the first through-hole groups G1-1, G1-2, G1-3, and G1-4 also passes through the corresponding second through-hole groups G2-1, G2-2, G2-3, and G2-4, and can be electrically coupled to each other through the corresponding first connection lines 13 and the corresponding second connection lines 23 to jointly form a three-dimensional grid-like parallel structure.

[0047] In this embodiment, the structures of the plurality of conductive probes 4 are substantially the same and are respectively defined as a plurality of ground probes 4a and a plurality of power probes 4b. The plurality of ground probes 4a are disposed through two of the first through-hole groups G1-3 and G1-4 and the corresponding two of the second through-hole groups G2-3 and G2-4, so that the plurality of ground probes 4a are respectively connected to two of the first connection lines 13 and also to two of the second connection lines 23. The plurality of power probes 4b are disposed through the other two of the first through-hole groups G1-1 and G1-2 and the corresponding two of the second through-hole groups G2-1 and G2-2, so that the plurality of ground probes 4a are respectively connected to the other two of the first connection lines 13 and also to the other two of the second connection lines 23.

[0048] Accordingly, the multiple ground probes 4a (or the multiple power probes 4b) passing through any one of the first through-hole groups G1-1, G1-2, G1-3, G1-4 and the corresponding second through-hole groups G2-1, G2-2, G2-3, G2-4 can be electrically coupled to each other through the corresponding first connection line 13 and the corresponding second connection line 23, thereby realizing the parallel structure and effectively achieving current uniformity.

[0049] Furthermore, the two first through-hole groups G1-1, G1-2, G1-3, G1-4 (or the two second through-hole groups G2-1, G2-2, G2-3, G2-4) corresponding to the plurality of ground probes 4a are respectively located on opposite outer sides of the two first through-hole groups G1-1, G1-2, G1-3, G1-4 (or the two second through-hole groups G2-1, G2-2, G2-3, G2-4) corresponding to the plurality of power probes 4b, thereby achieving a shielding effect.

[0050] In addition, if Figure 4 As shown, the first guide plate module 1 may further include a first jumper line 14, and the two first connection lines 13 connected to the plurality of ground probes 4a are electrically coupled to each other via the first jumper line 14. Furthermore, the second guide plate module 2 may further include a second jumper line 24, and the two second connection lines 23 connected to the plurality of ground probes 4a are electrically coupled to each other via the second jumper line 24. Thus, the plurality of ground probes 4a, the two first connection lines 13, the first jumper line 14, the two second connection lines 23, and the second jumper line 24 can collectively form a more complete ground shielding structure.

[0051] [Example 2]

[0052] See also Figure 5 and Figure 6 As shown, this is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated here. The differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

[0053] In this embodiment, the first through-holes 112 of the first guide plate 11 are defined as two first through-hole groups G1-1 and G1-2, and the second through-holes 212 of the second guide plate 21 are defined as two second through-hole groups G2-1 and G2-2. Furthermore, the number of first connecting lines 13 and the number of second connecting lines 23 are each two. The two first connecting lines 13 are not connected to each other, and the two second connecting lines 23 are not connected to each other. In this embodiment, the guide plate mechanism does not have any jumper circuits.

[0054] Specifically, the plurality of ground probes 4a are disposed through one of the first through-hole groups G1-2 and the corresponding second through-hole group G2-2, such that the plurality of ground probes 4a are connected to one of the first connection lines 13 and one of the second connection lines 23. The plurality of power probes 4b are disposed through another of the first through-hole groups G1-1 and the corresponding second through-hole group G2-1, such that the plurality of ground probes 4a are connected to another of the first connection lines 13 and another of the second connection lines 23.

[0055] [Example 3]

[0056] See also Figure 7 and Figure 8 As shown, this is the third embodiment of the present invention. Since this embodiment is similar to the first and second embodiments, the similarities of the above embodiments will not be repeated here. The differences between this embodiment and the first and second embodiments are roughly described as follows:

[0057] In this embodiment, the parallel probe card device 1000 further includes at least one electronic component 6 (e.g., a passive component). For ease of understanding, the number of at least one electronic component 6 is described as two, but the present invention is not limited thereto. Furthermore, the two electronic components 6 are mounted on the first guide plate 11 on which the first connecting lines 13 are formed, and the two electronic components 6 are respectively connected to the two first connecting lines 13. In this embodiment, the two electronic components 6 are arranged in a matrix together with the plurality of first through-holes 112 corresponding to the first guide plate 11. The number of the plurality of conductive probes 4 is equal to the number of the plurality of metal pads of the object to be tested (not shown in the figure), and the portion of the object to be tested that the two electronic components 6 face along the thickness direction H is not equipped with any metal pads.

[0058] It should be additionally noted that, based on actual needs, at least one of the multiple first perforations 112 may not be the multiple first perforation groups G1-1 and G1-2, and at least one of the multiple second perforations 212 may not be the multiple second perforation groups G2-1 and G2-2, but the present invention is not limited to this.

[0059] [Example 4]

[0060] See also Figure 9 and Figure 10 As shown, this is the fourth embodiment of the present invention. Since this embodiment is similar to the third embodiment, the similarities of the above embodiments will not be repeated here. The differences between this embodiment and the third embodiment are roughly described as follows:

[0061] In this embodiment, the parallel probe card apparatus 1000 further includes at least one auxiliary probe 5 mounted on the first guide plate module 1 and the second guide plate module 2, and at least one electronic component 6 (e.g., a passive component) electrically coupled to the at least one auxiliary probe 5. For ease of understanding, the number of the at least one auxiliary probe 5 is one in this embodiment, and the number of the at least one electronic component 6 is two, but the present invention is not limited thereto.

[0062] The auxiliary probe 5 has a connecting section 51 and a mounting section 52. The connecting section 51 extends through the second guide plate module 2 and is fixed to the circuit board 200, while the mounting section 52 is fixed within the first guide plate module 1 and is configured to face, but not contact, the object under test M. In this embodiment, the needle diameter of the auxiliary probe 5 is substantially equivalent to the needle diameter of any of the conductive probes 4. The auxiliary probe 5 (the mounting section 52) has at least one barb 53 formed at its distal end for fixing within one of the first through-holes 112 of the first guide plate 11 where the first connecting line 13 is not formed.

[0063] Furthermore, two electronic components 6 are mounted on the first guide plate 11 formed with the first connecting lines 13, and one of the electronic components 6 is electrically coupled to the auxiliary probe 5 by being connected to one of the first connecting lines 13. In this embodiment, the two electronic components 6 are arranged in a matrix along with the corresponding plurality of first through-holes 112 of the first guide plate 11. The number of the plurality of conductive probes 4 is equal to the number of the plurality of metal pads M1 of the object under test M. However, the portion of the object under test M that the auxiliary probes 5 and each electronic component 6 face along the thickness direction H is not equipped with any of the metal pads M1.

[0064] [Technical Effects of the Embodiments of the Invention]

[0065] In summary, the parallel probe card device and its guide plate mechanism disclosed in the embodiment of the present invention respectively form at least two first connecting circuits and at least two second connecting circuits with the same layout on the first guide plate and the second guide plate, so that the current paths of the multiple conductive probes can be more properly planned, thereby effectively improving the performance of the parallel probe card device and reducing the probability of component damage of the parallel probe card device.

[0066] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.

Claims

1. A parallel probe card device, characterized in that: The parallel probe card device comprises: A first guide plate module, comprising: Two first guide plates, each having a plurality of first through-holes, which define at least two first through-hole clusters; a first spacer, clamped between the two first guide plates along a thickness direction; and At least two first connection lines are formed on one of the first guide plates, and the at least two first connection lines are respectively arranged along at least two of the first perforation groups; a second guide plate module, arranged spaced apart from the first guide plate module along the thickness direction, and comprising: Two second guide plates, each having a plurality of second perforations, which define at least two second perforation groups; wherein the distribution positions of at least two of the first perforation groups are respectively equal to the distribution positions of at least two of the second perforation groups; a second spacer, clamped between the two second guide plates along the thickness direction; and At least two second connecting lines are formed on one of the second guide plates, and at least two of the second connecting lines are respectively arranged along at least two of the second perforation groups; wherein the layout of the at least two first connecting lines is respectively identical to the layout of the at least two second connecting lines; and A plurality of conductive probes are mounted on the first guide plate module and the second guide plate module; wherein the plurality of conductive probes respectively pass through the plurality of first through-holes of each first guide plate, and the plurality of conductive probes also respectively pass through the plurality of second through-holes of each second guide plate; The conductive probe passing through any of the first through-hole groups also passes through the corresponding second through-hole group and can be electrically coupled to each other through the corresponding first connection line and the corresponding second connection line to jointly form a three-dimensional grid-like parallel structure.

2. The parallel probe card device according to claim 1, wherein: At least two of the first connecting lines are not connected to each other, and at least two of the second connecting lines are not connected to each other.

3. The parallel probe card device according to claim 1, wherein: The first guide plate formed with at least two first connection lines is closer to the second guide plate module than another first guide plate; the second guide plate formed with at least two second connection lines is farther away from the first guide plate module than another second guide plate.

4. The parallel probe card device according to claim 3, wherein: The parallel probe card device further comprises: a spacer plate, clamped between the first guide plate module and the second guide plate module; and At least one electronic component is connected to at least one of the first connecting circuits; wherein, on the first guide plate formed with at least two of the first connecting circuits, the at least one electronic component and a plurality of the first through holes are distributed in a matrix.

5. The parallel probe card device according to claim 1, wherein: The number of at least two of the first through-hole groups and the number of at least two of the second through-hole groups are four each, and the number of at least two of the first connecting lines and the number of at least two of the second connecting lines are also four each; wherein the plurality of the conductive probes are respectively defined as a plurality of ground probes and a plurality of power probes, and the plurality of the ground probes are arranged through two of the first through-hole groups and the corresponding two of the second through-hole groups, and the plurality of the power probes are arranged through the other two of the first through-hole groups and the corresponding two of the second through-hole groups.

6. The parallel probe card device according to claim 5, wherein: The plurality of ground probes are respectively connected to two of the first connection lines and are also respectively connected to two of the second connection lines; the first guide plate module is further provided with a first jumper line, and the two first connection lines connected to the plurality of ground probes are electrically coupled to each other through the first jumper line; the second guide plate module is further provided with a second jumper line, and the two second connection lines connected to the plurality of ground probes are electrically coupled to each other through the second jumper line.

7. The parallel probe card device according to claim 1, wherein: The parallel probe card device further comprises: a circuit board adjacent to the second guide plate module; wherein each of the conductive probes has a fixed section and a testing section located at opposite ends; in each of the conductive probes, the fixed section passes through the second guide plate module and is fixed to the circuit board, and the testing section passes through the first guide plate module and is configured to detachably abut one of a plurality of metal pads of a test object; and At least one auxiliary probe is mounted on the first guide plate module and the second guide plate module; wherein, at least one auxiliary probe has a connecting section and a mounting section, the connecting section passes through the second guide plate module and is fixed to the circuit board, and the mounting section is fixed within the first guide plate module, and the mounting section is used to face but not contact the object to be tested.

8. The parallel probe card device according to claim 7, wherein: At least one barb is formed at a distal end of at least one of the auxiliary probes so as to be fixed in one of the first through holes of the first guide plate where at least two first connection lines are not formed.

9. A guide plate mechanism of a parallel probe card device, characterized in that: The guide plate mechanism of the parallel probe card device includes: A first guide plate module, comprising: Two first guide plates, each having a plurality of first through-holes, which define at least two first through-hole clusters; a first spacer, clamped between the two first guide plates along a thickness direction; and At least two first connection lines are formed on one of the first guide plates, and the at least two first connection lines are respectively arranged along at least two of the first through-hole groups; and a second guide plate module, arranged spaced apart from the first guide plate module along the thickness direction, and comprising: Two second guide plates, each having a plurality of second perforations, which define at least two second perforation groups; wherein the distribution positions of at least two of the first perforation groups are respectively equal to the distribution positions of at least two of the second perforation groups; a second spacer, clamped between the two second guide plates along the thickness direction; and At least two second connection lines are formed on one of the second guide plates, and at least two of the second connection lines are respectively arranged along at least two of the second perforation groups; wherein the layout of at least two of the first connection lines is respectively identical to the layout of at least two of the second connection lines.

10. The guide plate mechanism of the parallel probe card device according to claim 9, wherein: One of the first perforation groups and the corresponding first connection line is surrounded by the outside of another of the first perforation groups and the corresponding first connection line; one of the second perforation groups and the corresponding second connection line is surrounded by the outside of another of the second perforation groups and the corresponding second connection line.

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