Heat dissipation device, test system and test method for single event effect test

Abstract

The invention provides a heat dissipation device for a single event effect test, and the device comprises a bearing plate which is used for bearing a to-be-tested device, the back surface of the to-be-tested device is attached to the bearing plate, the test surface of the to-be-tested device is opposite to a high-energy particle beam, and the back surface and the test surface are two opposite surfaces of the to-be-tested device; the water cooling head is attached to the other side, opposite to the tested device, of the bearing plate and used for cooling the tested device; the fixing plate is used for fixing the bearing plate and the water cooling head, and the water cooling head is arranged between the fixing plate and the bearing plate; and the elastic pressing device is connected with the bearing plate, the fixing plate and the water cooling head, applies pressure towards the direction of the water cooling head to the bearing plate, and applies elastic force towards the direction of the bearing plate to the water cooling head. The invention further provides a test system and a test method.

Description

Technical Field

[0001] The present disclosure relates to the field of device testing technology, and in particular to a heat dissipation device, a testing system, and a testing method for a single event effect test. Background Art

[0002] The space radiation environment contains various high-energy particles, such as protons, electrons, alpha particles, and heavy ions. In the field of space exploration, metal-oxide semiconductor (MOS) devices are subject to the harshest radiation environments. A single high-energy particle (SEP) striking a MOS device can produce single-event effects (SEEs). The lattice is disrupted by the incident SEP, resulting in radiation displacement effects, and the energy of the SEP is absorbed by the material, causing ionization effects. SEEs primarily include single-event transients (SETs), single-event upsets (SEUs), single-event functional interrupts (SEFIs), single-event latch-ups (SELs), single-event burnouts (SEBs), and single-event gate ruptures (SEGRs). SEEs pose challenges to the long-term reliable operation of MOS devices, necessitating analysis and verification of SEEs.

[0003] Soft Error Rate (SER) onboard tests and ground-based high-energy particle simulation tests are methods for analyzing and verifying SEE. Ground-based high-energy particle simulation tests can efficiently obtain the SER of devices. However, the heat dissipation devices currently used in ground-based high-energy particle simulation tests use surface-mount heat sinks or air cooling. These heat dissipation devices have limited heat dissipation capacity and affect test accuracy and efficiency, making them difficult to meet the test scenarios of high-power and high-reliability semiconductor devices. Summary of the Invention

[0004] The present disclosure provides a heat dissipation device, a test system and a test method for a single event effect test.

[0005] In a first aspect, an embodiment of the present disclosure provides a heat dissipation device for single event effects testing, comprising:

[0006] A carrier plate for carrying a device under test, wherein the back surface of the device under test is in contact with the carrier plate, the test surface of the device under test faces the high-energy particle beam, and the back surface and the test surface are two opposing surfaces of the device under test;

[0007] a water cooling head, attached to the other side of the carrier plate opposite to the device under test, for cooling the device under test;

[0008] A fixing plate, used to fix the supporting plate and the water-cooling head, wherein the water-cooling head is arranged between the fixing plate and the supporting plate;

[0009] The elastic pressure device is connected to the supporting plate, the fixing plate and the water cooling head, and applies pressure to the supporting plate in the direction of the water cooling head and applies elastic force to the water cooling head in the direction of the supporting plate.

[0010] In a second aspect, an embodiment of the present disclosure provides a single event effects testing system, comprising:

[0011] A particle source, used for generating a particle beam for irradiating a test surface of the device under test;

[0012] A heat dissipation device is used to dissipate heat from the device under test, and the heat dissipation device includes the heat dissipation device provided in the embodiment of the present disclosure.

[0013] In a third aspect, an embodiment of the present disclosure provides a single event effect testing system, wherein the single event effect testing system adopts the single event effect testing system provided by the embodiment of the present disclosure;

[0014] Turn on the particle source to make it generate particle beams;

[0015] Adjusting the position of the device under test so that the particle beam covers the device under test;

[0016] Acquiring the temperature of the device under test, and controlling the flow rate of the cooling medium in the heat dissipation device based on the temperature of the device under test;

[0017] Record test data during the test.

[0018] The heat dissipation device for single-particle effects testing in the disclosed embodiment can attach the back of the device under test to a carrier plate, with the test surface of the device under test facing the high-energy particle beam. The test surface of the device under test is not affected by the heat dissipation device, so that the test surface of the device under test can be fully exposed to the irradiation of the high-energy particle beam, without affecting the number and energy of the high-energy particle beam reaching the interior of the device under test, thereby improving the test efficiency and accuracy of the single-particle effects test; moreover, a water-cooled head is used to cool the device under test. The water-cooled head has high heat dissipation efficiency and can meet the heat dissipation requirements of high-power consumption and high-reliability devices under test. Through the cooperation of the spring-pressing device and the fixing plate, pressure is applied to the carrier plate in the direction of the water-cooled head, and elastic force is applied to the water-cooled head in the direction of the carrier plate, so that the water-cooled head and the carrier plate are tightly fitted, and the heat dissipation capacity of the water-cooled head is exerted. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the accompanying drawings of the embodiments of the present disclosure:

[0020] Figure 1 A schematic structural diagram of a single event effects testing system provided in an embodiment of the present disclosure;

[0021] Figure 2 A schematic diagram of a portion of the structure of a test system for single event effects testing provided by an embodiment of the present disclosure;

[0022] Figure 3 A schematic structural diagram of a heat dissipation device for single event effects testing provided by an embodiment of the present disclosure;

[0023] Figure 4 A schematic structural diagram of a single event effects testing system provided in an embodiment of the present disclosure;

[0024] Figure 5 A flow chart of a single event effects test method provided in an embodiment of the present disclosure;

[0025] Figure 6 A flow chart of a proton single event effects test provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the technical solutions of the present disclosure, the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0027] The present disclosure will be described more fully hereinafter with reference to the accompanying drawings, but the illustrated embodiments may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that the present disclosure will be thorough and complete and will fully understand the scope of the present disclosure to those skilled in the art.

[0028] The accompanying drawings of the embodiments of the present disclosure are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the detailed embodiments, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing the detailed embodiments with reference to the accompanying drawings.

[0029] The present disclosure may be described with reference to plan views and / or cross-sectional views by way of ideal schematic views of the present disclosure. Therefore, the exemplary illustrations may be modified according to manufacturing techniques and / or tolerances.

[0030] In the absence of conflict, the various embodiments of the present disclosure and the various features therein may be combined with each other.

[0031] The terms used in this disclosure are only used to describe specific embodiments and are not intended to limit the disclosure. As used in this disclosure, the term "and / or" includes any and all combinations of one or more related enumerated items. As used in this disclosure, the singular forms "a" and "the" are also intended to include plural forms, unless the context clearly indicates otherwise. As used in this disclosure, the terms "comprising" and "made of" specify the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof.

[0032] Unless otherwise defined, all terms (including technical and scientific terms) used in this disclosure have the same meanings as those commonly understood by those skilled in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined in this disclosure.

[0033] The present disclosure is not limited to the embodiments shown in the drawings, but includes modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings have schematic properties, and the shapes of the regions shown in the drawings illustrate the specific shapes of the regions of the elements, but are not intended to be limiting.

[0034] In this disclosure, unless otherwise specified, the following technical terms should be understood as follows:

[0035] A single event upset is a phenomenon in which a single high-energy particle in the universe is shot into the sensitive area of ​​a semiconductor device (such as a microprocessor, semiconductor memory or power transistor), causing the logic state of the semiconductor device to flip (from 0 to 1, or from 1 to 0).

[0036] Ground-based high-energy particle simulation tests are a common method for SEE research, offering the advantages of short test cycles, low costs, and greater flexibility. Ground-based simulation sources include particle accelerators, which can provide high-energy particles such as heavy ion beams and proton beams. Before testing, the metal cover of the semiconductor device must be removed, the substrate thinned, and a surface-mount heat sink attached to the test surface of the semiconductor device (the surface facing the particle beam). However, the surface-mount heat sink reduces the number and energy of high-energy particles reaching the interior of the semiconductor device, resulting in reduced test accuracy. To reduce the impact of the surface-mount heat sink on test accuracy, a surface-mount heat sink can be placed on the first portion of the semiconductor device's test surface, leaving the second portion exposed. After the test, the surface-mount heat sink is moved to the second portion, leaving the first portion exposed for testing. However, this testing method has low test efficiency and increases test costs. Although air cooling can improve the efficiency of high-energy particle simulation tests to a certain extent, the heat dissipation efficiency of surface-mount heat sinks and air cooling is low and cannot meet the heat dissipation requirements of high-energy particle simulation tests. Poor heat dissipation can cause the over-temperature protection of semiconductor devices to activate, thereby affecting the SEE test results and even burning the semiconductor devices, making it impossible to obtain test data.

[0037] Figure 1 The present disclosure provides a schematic structural diagram of a single event effect test system. Figure 1 As shown, a grating 11 is disposed in the first target chamber 10 and is used to control the size of the high-energy particle beam. The device under test 5 is disposed in the second target chamber 20. The first target chamber 10 and the second target chamber 20 are connected via a connection port 30. The high-energy particle beam passes through the grating 11 and the connection port 30 in sequence and is directed toward the device under test 5. A sample rack and a heat sink are also disposed in the second target chamber 20. The device under test 5 and the heat sink are disposed on the sample rack. The heat sink is used to adjust the temperature of the device under test 5. A host computer 40 is disposed in the operating room and is connected to a host computer (not shown) on the sample rack by signal. The host computer 40 is used to monitor the temperature of the device under test 5 and control the heat sink to control the temperature of the device under test 5.

[0038] In a first aspect, embodiments of the present disclosure provide a heat dissipation device for single event effects testing. The heat dissipation device can be applied to a single event effects testing system, which can be applied to testing satellite devices.

[0039] Figure 2 A partial structural diagram of a test system for single event effects testing is provided in accordance with an embodiment of the present disclosure. Figure 3 The present disclosure provides a schematic structural diagram of a heat dissipation device for single event effect testing. Figures 1 to 3 As shown, the test system includes a heat dissipation device, which includes:

[0040] The carrier plate 1 is used to carry the device under test 5 , and the back surface of the device under test 5 is in contact with the carrier plate 4 , and the test surface of the device under test 5 faces the high-energy particle beam (not shown in the figure).

[0041] The device under test 5 includes two opposing surfaces, one of which is a test surface and the other is a back surface. In a single event effect test, the test surface faces the high-energy particle beam, and the back surface is attached to the carrier plate 1.

[0042] The device under test 5 can be a chip or other semiconductor device. This embodiment takes a chip as an example. The device under test 5 includes a substrate 51 and an internal circuit 52 . The internal circuit 52 is provided on the substrate 51 .

[0043] In some embodiments, the high-energy particle beam may be a proton beam or a heavy ion beam. Under the irradiation of the high-energy particle beam, a single event upset may occur in the device under test 5 .

[0044] The water cooling head 2 is attached to the other side of the carrier plate opposite to the device under test 5 and is used to cool the device under test.

[0045] The water cooling head 2 cools the device under test 5 by water cooling. Compared with air cooling, the water cooling head 2 is suitable for testing high-power, high-performance semiconductor devices and can meet the single event effect test with higher heat flux density. For example, it can meet the heat dissipation requirements of medium-energy and high-energy proton single event effect tests and the linear energy transfer (LET) value is greater than 15MeV / (mg / cm 2 ) for the heat dissipation requirements of single event effects tests.

[0046] In the disclosed embodiment, the water cooling head 2 and the device under test 5 are located on two opposite surfaces of the carrier plate 1, that is, the device under test 5 is located on the side of the carrier plate 1 close to the particle beam source, and the water cooling head 2 is located on the side of the carrier plate 1 away from the particle beam source.

[0047] The fixing plate 3 is used to fix the supporting plate 1 and the water-cooling head 2 . The water-cooling head 2 is arranged between the fixing plate 3 and the supporting plate 1 .

[0048] The fixing plate 3 is used to fix the water cooling head 2 and the supporting plate 1, that is, the supporting plate 1 and the water cooling head 2 are both fixed by the fixing plate 3, and the supporting plate 1 and the water cooling head 2 are both fixed on one side of the fixing plate 3, and the water cooling head 2 is located between the supporting plate 1 and the fixing plate 3.

[0049] The spring-pressing device 4 is connected to the carrier plate 1, the water-cooling head 2 and the fixed plate 3, and applies pressure to the carrier plate 1 toward the water-cooling head 2, and applies an elastic force to the water-cooling head 2 toward the carrier plate 1. That is, the directions of the forces applied by the spring-pressing device 4 on the carrier plate 1 and the water-cooling head 2 are opposite, so that the water-cooling head 2 and the carrier plate 1 fit tightly together, which helps to transfer heat between the carrier plate 1 and the water-cooling head 2, thereby helping to dissipate heat from the device under test 5.

[0050] In some embodiments, the water-cooling head 2 includes a heat sink 21, a back plate 22, multiple connectors 23, and pipes 24. The heat sink 21 is bonded to the carrier plate 1 to absorb heat generated by the device under test 5. A medium channel is provided within the heat sink 21 for circulating the cooling medium. The heat sink 21 is made of materials such as copper and aluminum, which have good thermal conductivity. The surface of the heat sink 21 that bonds to the carrier plate 1 is smooth, which facilitates heat conduction between the heat sink 21 and the carrier plate 1.

[0051] The back plate 22 is connected to the fixing plate 3 , that is, the back plate 22 is arranged on the side away from the carrier plate 1 , the radiator 21 is arranged on the side close to the carrier plate 1 , and the water cooling head 2 is connected to the fixing plate through the back plate 22 .

[0052] Multiple connectors 23 are used to fix the back plate 22 and the heat sink 21. One end of each connector 23 is connected to the back plate 22, and the other end is connected to the heat sink 21. The connectors 23 include but are not limited to bolts. The length of the connector 23 is greater than the thickness of the back plate 22 and the heat sink 21.

[0053] In some embodiments, four connectors 23 are used to securely connect the back plate 22 to the heat sink 21 at the corners of the back plate 22. Alternatively, more connectors 23 may be used to secure the back plate 22 and the heat sink 21. When more connectors 23 are used, the connectors 23 may be spaced apart along the edges of the back plate 22 and the heat sink 21.

[0054] The pipeline 24 is in communication with the medium channel and is used for inputting the external cooling medium into the radiator and outputting the cooling medium that has absorbed heat out of the radiator.

[0055] In some embodiments, the medium channel is connected to the pipe 24 via a connector 22. A connector 22 is provided at both the input and output ports of the radiator 21, and the pipe 24 communicates with the medium channel via the connector 22. In some embodiments, the connector 22 is provided on the side of the radiator 21 near the fixing plate to facilitate connection between the pipe 24 and the medium channel.

[0056] In some embodiments, the medium channel includes a U-shaped channel, which helps the cooling medium to generate turbulence in the medium channel, thereby increasing heat exchange between the cooling medium and the radiator 21, thereby improving heat dissipation efficiency.

[0057] In some embodiments, the heat dissipation device also includes a water cooling pump 26 and a fan (not shown in the figure). The output port of the water cooling pump 26 is connected to the input port of the radiator 21 through a pipeline, and the input port of the water cooling pump 26 is connected to the output port of the radiator 21 through a pipeline. The water cooling pump provides power for the cooling medium to flow in the medium channel, accelerates the flow of the cooling medium, and thus improves the heat dissipation efficiency of the heat dissipation device.

[0058] A fan is used to dissipate heat from the cooling medium. After the cooling medium removes the heat from the device under test, the fan dissipates the heat from the cooling medium. To expedite the dissipation of heat from the cooling medium, a heat pipe and heat fins disposed on the pipe wall are also included. The heat-carrying cooling medium flows within the heat pipe and exchanges heat with the heat pipe. The heat is transferred to the heat fins, and the fan blows air toward the heat fins, removing the heat from the heat fins through air cooling. In some embodiments, the fan speed and the flow rate of the cooling medium can be adjusted using an FPGA.

[0059] like Figure 3 As shown, the springing device 4 includes a first elastic component 41 and a second elastic component 42, wherein the first elastic component 41 applies an extrusion force to the carrier plate 1 toward the water cooling head 2, and the second elastic component 42 applies a springing force to the water cooling head toward the carrier plate.

[0060] One end of the first elastic component 41 is connected to the supporting plate 1 , and the other end is fixedly connected to the fixing plate 3 . The first elastic component 41 can drive the supporting plate 1 to move toward the fixing plate 3 .

[0061] In some embodiments, the first spring-pressing assembly 41 includes multiple groups of first elastic structures, which connect the supporting plate 1 and the fixed plate 3 at different positions. For example, multiple groups of first elastic structures are arranged at intervals along the periphery of the supporting plate 1 and the fixed plate 3, so that the force between the supporting plate 1 and the fixed plate 3 is uniform.

[0062] The first elastic structure includes a first guide member 411 and a first elastic member 412. One end of the first guide member 411 is connected to the carrier plate 1, and the other end is fixedly connected to the fixed plate 3. The first guide member 411 can be connected to the carrier plate 1 via a nut. Specifically, threads are provided at the end of the first guide member 411, and a through hole is provided in the carrier plate 1. The first guide member 411 passes through the through hole and is connected to the nut. The first guide member 411 can be screwed to the fixed plate 3. Specifically, threads are provided at the end of the first guide member 411, and a threaded hole is provided in the fixed plate 3. The first guide member 411 can be screwed into the threaded hole, thereby fixing the first guide member 411 to the fixed plate 3. The first elastic member 412 is positioned outside the first guide member and can be guided by the first guide member 411 to reciprocate in the direction of its extension. One end of the first elastic member 412 is fixedly connected to the carrier plate 1, and the other end is fixedly connected to the fixed plate 3. The contraction force of the first elastic member 412 applies a compressive force to the carrier plate 1 toward the water cooling head.

[0063] One end of the second elastic component 42 is fixedly connected to the fixing plate 3 , and the other end is fixedly connected to the water-cooling head 2 . The second elastic component 42 can drive the water-cooling head 2 to move toward the supporting plate 1 .

[0064] In some embodiments, the second spring-pressing assembly 42 includes multiple groups of second elastic structures, which connect the water-cooling head 2 and the fixed plate 3 at different positions. For example, the multiple groups of second elastic structures are arranged at intervals along the periphery of the water-cooling head 2 and the fixed plate 3, so that the force between the water-cooling head 2 and the fixed plate 3 is uniform.

[0065] The second elastic structure includes a second guide member 421 and a second elastic member 422. One end of the second guide member 421 is fixedly connected to the water-cooling head 2, and the other end is fixedly connected to the fixed plate 3. The second guide member 421 can be connected to the water-cooling head 2 via a nut, that is, a thread is provided at the end of the second guide member 421, a through hole is provided on the back plate 22 of the water-cooling head 2, and the second guide member 421 passes through the through hole and is connected to the nut. The second guide member 421 can be screwed to the fixed plate 3, that is, a thread is provided at the end of the second guide member 421, a threaded hole is provided on the fixed plate 3, and the second guide member 421 can be screwed into the threaded hole, thereby fixing the second guide member 421 to the fixed plate 3. The second elastic member 422 is placed on the outside of the second guide member 421. The second elastic member 422 is guided by the second guide member 421 and moves back and forth in the extension direction of the second guide member 421. One end of the second elastic member 422 is fixedly connected to the water-cooling head 2 , and the other end is fixedly connected to the fixing plate 3 . The elastic force of the second elastic member 422 applies an elastic force to the water-cooling head 2 in a direction toward the supporting plate.

[0066] In the embodiment of the present disclosure, the contraction elastic force of the first elastic component 41 and the outward elastic force of the second elastic component 42 cause the water cooling head 2 and the carrier plate 1 to be squeezed against each other, which is beneficial to heat conduction between the carrier plate 1 and the water cooling head 2.

[0067] In some embodiments, the heat dissipation device further includes a thermal pad 6 , which is disposed between the water-cooling head 2 and the carrier plate 1 , with two opposite surfaces of the thermal pad 6 respectively in contact with the water-cooling head 2 and the carrier plate 1 .

[0068] The thermal pad 6 can be a thermally conductive silicone gasket or a thermally conductive silicone grease gasket. The thermal pad 6 can be a flexible thermally conductive silicone gasket or a thermally conductive silicone grease gasket, that is, the thermal pad 6 can be squeezed and deformed, which helps to fill the gap between the water cooling head 2 and the carrier plate 1, thereby facilitating heat conduction between the water cooling head 2 and the carrier plate 1.

[0069] In some embodiments, the test surface of the device under test 5 is arranged vertically or horizontally. The heat dissipation device provided in this embodiment can be arranged vertically, that is, the test surface of the device under test 5 is arranged perpendicular or nearly perpendicular to the ground. This can reduce the requirements for setting up the particle source and make the particle source setting more flexible. The test surface of the device under test 5 can also be arranged horizontally, that is, the test surface of the device under test 5 is parallel or nearly parallel to the ground. This allows installation in existing equipment without requiring major modifications to the existing equipment.

[0070] In some embodiments, carrier board 1 includes a circuit board that provides electrical signals to the device under test (DUT). Specifically, carrier board 1 is used to both support DUT 5 and provide electrical signals for single-event effects testing. When providing electrical signals, carrier board 1 utilizes a circuit board equipped with the electronic components and wiring required for the test. DUT 5 is electrically connected to pads on the circuit board. The circuit board can be electrically connected to the heat sink via a UART serial port.

[0071] The heat dissipation device for single-particle effect testing in the embodiment of the present disclosure can attach the back of the device under test to the carrier plate, so that the test surface of the device under test is opposite to the high-energy particle beam. The test surface of the device under test is not affected by the heat dissipation device, so that the test surface of the device under test can be fully exposed to the irradiation of the high-energy particle beam, without affecting the number and energy of the high-energy particle beam reaching the interior of the device under test, thereby improving the test efficiency and accuracy of the single-particle effect test; moreover, a water-cooled head is used to cool the device under test. The water-cooled head has high heat dissipation efficiency and can meet the heat dissipation requirements of high-power consumption and high-reliability devices under test. Through the cooperation of the spring-pressing device and the fixing plate, pressure is applied to the carrier plate in the direction of the water-cooled head, and elastic force is applied to the water-cooled head in the direction of the carrier plate, so that the water-cooled head and the carrier plate are tightly fitted, and the heat dissipation capacity of the water-cooled head is exerted.

[0072] In a second aspect, an embodiment of the present disclosure provides a single event effects testing system.

[0073] Figure 4 The present invention provides a schematic diagram of the structure of a single event effect test system. Figure 1 and Figure 4 As shown, the single event effects test system includes:

[0074] The particle source (not shown in the figure) is used to generate a high-energy particle beam to irradiate the test surface of the device under test.

[0075] The heat dissipation device 7 is used to dissipate heat from the device under test. The heat dissipation device 7 includes the heat dissipation device provided in the embodiment of the present disclosure. To save space, the specific structure of the heat dissipation device is not described again.

[0076] In some embodiments, the particle source includes a proton source, a heavy ion source, or other high-energy particle source.

[0077] In some embodiments, the single event effects test system further includes: a grating 11 , which is disposed between the particle source and the device under test 5 and is used to control the beam spot size of the particle beam.

[0078] In some embodiments, the single event effects testing system further comprises:

[0079] The suspension platform 12 is used to fix the heat sink 7 and the device under test 5 . The heat sink 7 is fixed on the suspension platform 12 , and the device under test 5 is fixed on the heat sink 7 , thereby indirectly fixing the device under test 5 on the suspension platform 12 .

[0080] In some embodiments, the suspension platform 12 includes a suspension body, and the heat sink 7 is fixed to the suspension body via fixing columns. The fixing columns may include multiple fixing columns, which are spaced apart around the periphery of the heat sink 7 to fix the heat sink 7 on the suspension platform 12.

[0081] The first movable platform 13 and the suspension platform 12 are disposed on the first movable platform 13. The first movable platform 13 is used to move the suspension platform in a first direction. For example, the suspension body is slidably connected to the movable axis of the first movable platform 13. The suspension body slides on the movable axis of the first movable platform 13, thereby adjusting the position of the device under test 5 in the first direction.

[0082] The first movable platform 13 is slidably connected to the second movable platform 14 , and the second movable platform 14 moves the suspension platform 12 in the second direction so that the device under test 5 is covered by the beam spot of the particle beam; wherein the first direction and the second direction intersect.

[0083] First movable platform 13 is movable in the second direction relative to second movable platform 14, thereby driving suspension platform 12 to move in the second direction. Device under test 5 is secured to suspension platform 12, allowing device under test 5 to move in the second direction. As first movable platform 13 moves in the second direction via second movable platform 14, the position of device under test 5 in the second direction can be adjusted.

[0084] In the embodiment of the present disclosure, the device under test 5 can be covered by the beam spot of the particle beam with the help of the first movable platform 13 and the second movable platform 14. Moreover, the device under test 5 is back-mounted and will not block the size of the test surface of the device under test 5. Therefore, the test can be completed in one go without moving the test surface of the device under test 5 or the position of the beam spot, thereby improving the test efficiency of the single-particle effect test and reducing the test cost.

[0085] In some embodiments, the single event effects testing system further comprises:

[0086] The host computer is used to control at least one of the following: the flow rate of the cooling medium in the heat sink, the movement of the first and second mobile platforms, and the energy of the particle beam. The host computer 40 is connected to the circuit board via a signal line (such as a network cable). The host computer 40 operates in the operating room, eliminating the need for operators to enter the radiation room multiple times for confirmation. This improves test efficiency while avoiding the impact of increased metal activation dose in the radiation room on personnel health. Remote reading and writing, current monitoring, and temperature adjustment can be achieved through the host computer 40.

[0087] The monitoring module is used to monitor the temperature of the device under test and the current flowing through the device under test during the test process. For example, the monitoring module can monitor the junction temperature of the device under test and the current flowing through the device under test.

[0088] The storage module is used to store test data, wherein the test data includes but is not limited to junction temperature data, single event upset data and circuit data (such as current value).

[0089] In some embodiments, the single event effects test system further includes an energy reduction plate disposed in the optical path between the grating and the device under test, for changing the energy of high-energy particles reaching the test surface of the device under test.

[0090] The single-event effects testing system provided by the embodiments of the present disclosure utilizes a heat dissipation device provided in the embodiments of the present disclosure. The back of the device under test is attached to a carrier plate, with the test surface of the device under test facing the high-energy particle beam. This surface is unaffected by the heat dissipation device, allowing the test surface of the device under test to be fully exposed to the high-energy particle beam without affecting the quantity and energy of the high-energy particle beam reaching the device under test. This improves the testing efficiency and accuracy of the single-event effects testing system. Furthermore, a water-cooled head is used to cool the device under test. The water-cooled head has high heat dissipation efficiency and can meet the heat dissipation requirements of high-power, high-reliability devices under test (e.g., devices with a power consumption of 40W or more). The spring-loaded device and the fixed plate cooperate to apply pressure toward the water-cooled head and a spring force toward the carrier plate, ensuring a tight fit between the water-cooled head and the carrier plate, thereby maximizing the water-cooled head's heat dissipation capacity. This improves the heat dissipation capability of the single-event effects testing system.

[0091] In addition, the single event effect test system provided by the embodiment of the present disclosure does not restrict the packaging form and package size of the device under test. The size of the water cooling head only needs to be larger than the package size of the device under test, and can be adapted to most devices under test.

[0092] The single-particle effect test system provided by the embodiments of the present disclosure can meet the penetration capability of particles ranging from tens to hundreds of microns. Because it is back-mounted, it can avoid the nuclear energy loss and ionization energy loss caused by particles entering the surface-mounted material, which would cause a decrease in particle fluence rate and affect the test accuracy. The heat dissipation device can keep the temperature of the device under test within a reasonable range, and the number of charges collected by the sensitive node meets the set value of the radiation test plan. For the entire machine, it can improve the accuracy of risk assessment of space devices (such as satellites).

[0093] In a third aspect, an embodiment of the present disclosure provides a single event effect test method.

[0094] Figure 5 A flow chart of a single event effect test method is provided for an embodiment of the present disclosure. Figure 5 As shown, the single event effects test method includes:

[0095] In step S501, a single event effect test system is provided. The single event effect test system adopts the single event effect test system provided in the embodiment of the present disclosure, which will not be described in detail here to save space.

[0096] Step S502: Turn on a particle source to generate a particle beam. The particle source may be a proton source, a heavy ion source, or the like.

[0097] In step S502 , the irradiation beam is turned on to enable the particle source to radiate high-energy particles, and the fluence rate of the high-energy particles is adjusted.

[0098] Step S503: adjusting the position of the device under test so that the particle beam covers the device under test.

[0099] In step S503 , the position of the device under test is adjusted by the first movable platform and the second movable platform so that the particle beam covers the device under test.

[0100] Step S504 : acquiring the temperature of the device under test, and controlling the flow rate of the cooling medium in the heat dissipation device based on the temperature of the device under test.

[0101] The temperature of the device under test is monitored and the flow rate of the cooling medium in the heat sink is controlled based on the temperature of the device under test. When the junction temperature of the device under test is high, the flow rate of the cooling medium is increased.

[0102] Step S505: record the test data during the test process.

[0103] In step S505 , the radiation test is started to record single event upset data and circuit data.

[0104] In some embodiments, the device under test is a chip, and the temperature of the device under test is the junction temperature of the chip.

[0105] Figure 6 A flow chart of a proton single event effect test provided in an embodiment of the present disclosure. Figure 6 As shown, the proton single event effects test includes:

[0106] Step S601 : providing a single event effect test system, starting the single event effect test system, and confirming that the state of the device under test is normal and the capacity of the memory is normal.

[0107] After starting the single-event effects test system, the device under test (DUT) is checked for normal status, such as whether it is functioning properly. The memory capacity is also checked for normality, such as whether it meets test requirements. If both the DUT and memory are normal, step S602 is executed. If not, the fault is corrected and step S602 is executed again.

[0108] Step S602: Run the test case to verify that the memory write and output read values ​​are normal.

[0109] The test case is a pre-set single event effect test case. By running the test case, it is verified whether the memory write and output read values ​​are normal. If normal, step S603 is executed. Otherwise, step S603 is executed after troubleshooting.

[0110] Step S603 , turning on the particle source to generate a particle beam, adjusting the position of the device under test so that the particle beam covers the device under test, and then adjusting the fluence rate according to the SEE flipping condition until the fluence rate is stable.

[0111] The position of the device under test is adjusted by the first movable platform and the second movable platform so that the particle beam covers the device under test.

[0112] Step S604 , monitoring the junction temperature of the device under test by using a sensor within the device under test, and reading the junction temperature data.

[0113] The sensor is a built-in sensor of the device under test. Compared with an external sensor, the temperature measurement of the built-in sensor is more accurate.

[0114] Step S605 , starting the water cooling system, using the host computer to adjust the flow rate of the cooling medium, monitoring the junction temperature of the device under test, and controlling the junction temperature to meet the test requirements.

[0115] Step S606 , determining whether the junction temperature of the device under test exceeds a preset threshold value, if so, executing step S607 ; if not, executing step S604 .

[0116] Step S607 : irradiating the device under test with a high-energy particle beam, and recording single event upset data and circuit data.

[0117] It should be noted that the heat dissipation device, test system, and test method for single event effects testing provided by the embodiments of the present disclosure can be used not only for single event effects testing, but also for displacement damage testing.

[0118] The present disclosure has disclosed example embodiments, and although specific terms are employed, they are used and should be interpreted only in a general illustrative sense and not for purposes of limitation. In some instances, it will be apparent to those skilled in the art that, unless otherwise expressly indicated, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the scope of the present disclosure as set forth in the appended claims.

Claims

1. A heat dissipation device for single event effects testing, comprising: A carrier plate for carrying a device under test, wherein the back surface of the device under test is in contact with the carrier plate, the test surface of the device under test faces the high-energy particle beam, and the back surface and the test surface are two opposing surfaces of the device under test; a water cooling head, attached to the other side of the carrier plate opposite to the device under test, for cooling the device under test; A fixing plate, used to fix the supporting plate and the water-cooling head, wherein the water-cooling head is arranged between the fixing plate and the supporting plate; The elastic pressure device is connected to the supporting plate, the fixing plate and the water cooling head, and applies pressure to the supporting plate in the direction of the water cooling head and applies elastic force to the water cooling head in the direction of the supporting plate.

2. The heat dissipation device for single event effect testing according to claim 1, wherein: The water cooling head comprises: a heat sink, attached to the carrier plate, for absorbing heat generated by the device under test, and having a medium channel provided therein; a back plate connected to the fixing plate; A plurality of connectors, used for fixing the back plate and the radiator, wherein one end of each connector is connected to the back plate and the other end is connected to the radiator; The pipeline is connected to the medium channel and is used to input the external cooling medium into the radiator and output the cooling medium that absorbs heat from the radiator.

3. The heat dissipation device for single event effect testing according to claim 2, wherein: The medium channel includes a U-shaped channel.

4. The heat dissipation device for single event effect testing according to claim 2, wherein: Also includes: a water cooling pump, wherein the output port of the water cooling pump is connected to the input port of the radiator through the pipeline, and the input port of the water cooling pump is connected to the output port of the radiator through the pipeline, and the water cooling pump provides power for the flow of the cooling medium; A fan is used to discharge heat from the cooling medium.

5. The heat dissipation device for single event effect testing according to claim 1, wherein: The spring pressing device comprises: a first elastic component, one end of the first elastic component being connected to the carrier plate, and the other end being fixedly connected to the fixed plate, and the first elastic component applying an extrusion force toward the water-cooling head to the carrier plate; A second elastic component, one end of the second elastic component is fixedly connected to the fixing plate, and the other end is fixedly connected to the water cooling head, and the second elastic component applies an elastic force toward the supporting plate to the water cooling head.

6. The heat dissipation device for single event effect testing according to claim 5, wherein: The first elastic pressing assembly includes multiple groups of first elastic structures, and the multiple groups of first elastic structures connect the bearing plate and the fixing plate at different positions; The first elastic structure includes: a first guide member, one end of the first guide member being connected to the bearing plate, and the other end of the first guide member being fixedly connected to the fixing plate; A first elastic member is sleeved on the outside of the first guide member, one end of the first elastic member is fixedly connected to the supporting plate, and the other end is fixedly connected to the fixing plate, and the contraction force of the first elastic member applies an extrusion force to the supporting plate toward the water cooling head.

7. The heat dissipation device for single event effect testing according to claim 5, wherein: The second elastic pressure assembly includes multiple groups of second elastic structures, and the multiple groups of second elastic structures are connected to the water cooling head and the fixing plate at different positions; The second elastic structure includes: a second guide member, one end of the second guide member being fixedly connected to the water-cooling head, and the other end of the second guide member being fixedly connected to the fixing plate; A second elastic member is sleeved on the outside of the second guide member, one end of the second elastic member is fixedly connected to the water cooling head, and the other end is fixedly connected to the fixed plate, and the elastic force of the second elastic member applies an elastic force to the water cooling head toward the supporting plate.

8. The heat dissipation device for single event effect testing according to claim 1, wherein: The test surface of the device under test is arranged vertically or horizontally.

9. The heat dissipation device for single event effect testing according to claim 1, wherein: Also includes: The thermal pad is arranged between the water cooling head and the supporting plate, and two opposite surfaces of the thermal pad are respectively in contact with the water cooling head and the supporting plate.

10. The heat dissipation device for single event effect testing according to claim 1, wherein: The carrier board includes a circuit board, and the circuit board provides electrical signals to the device under test.

11. A single event effects test system comprising: A particle source, used for generating a particle beam for irradiating a test surface of the device under test; A heat dissipation device, used to dissipate heat from the device under test, wherein the heat dissipation device comprises the heat dissipation device according to any one of claims 1 to 9.

12. The single event effects testing system according to claim 11, wherein: Also includes: A grating is provided between the particle source and the device under test, and is used to control the beam spot size of the particle beam.

13. The single event effects testing system according to claim 11, wherein: Also includes: A suspension platform, used for fixing the heat dissipation device and the device under test; a first mobile platform, the suspension platform being arranged on the first mobile platform, and the first mobile platform being used to move the suspension platform in a first direction; The first movable platform is slidably connected to the second movable platform, and the second movable platform moves the suspension platform in a second direction so that the device under test is covered by the beam spot of the particle beam; wherein the first direction and the second direction intersect.

14. The single event effects testing system according to claim 13, wherein: Also includes: a host computer, configured to control at least one of the flow rate of the cooling medium in the heat dissipation device, the movement of the first mobile platform and the second mobile platform, and the energy of the particle beam; A monitoring module, configured to monitor the temperature of the device under test and the current flowing through the device under test during the test; Storage module, used to store test data.

15. The single event effects testing system according to claim 11, wherein: The particle source includes a proton source or a heavy ion source.

16. A single event effects test method comprising: A single event effects test system is provided, wherein the single event effects test system adopts the single event effects test system according to any one of claims 11 to 15; Turn on the particle source to make it generate particle beams; adjusting the position of the device under test so that the particle beam covers the device under test; Acquiring the temperature of the device under test, and controlling the flow rate of the cooling medium in the heat dissipation device based on the temperature of the device under test; Record test data during the test.

17. The single event effects test method according to claim 16, wherein: The device under test is a chip, and the temperature of the device under test is the junction temperature of the chip.

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