Vehicle-mounted charger

Abstract

The invention provides a vehicle-mounted charger. The vehicle-mounted charger comprises a mainboard; the first power module comprises a first power board provided with a first power circuit; the second power module comprises a second power board provided with a second power circuit; wherein the first power module and the second power module are electrically connected with the mainboard and are arranged on the same side of the mainboard. The invention provides a modular design mode and concept, the OBC is subjected to modular design with unified functions and structures by taking functions as units, the customized requirements of customers can be met through standardized design, and the corresponding design flexibility is achieved. Moreover, standardization of production and assembly can be achieved, after-sales maintainability can be improved, finally, the development efficiency of products can be greatly improved, and the percent of pass of the products can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of power conversion, and in particular to a vehicle-mounted charger. Background Art

[0002] Currently, on-board charger (OBC) product development often needs to meet customer customization requirements. Almost every product requires redesigning both the electronic and structural design. This consumes a significant amount of design and verification resources, thus limiting development efficiency.

[0003] Therefore, how to improve development efficiency while meeting customers' customized needs has become one of the urgent issues that the industry needs to solve. Summary of the Invention

[0004] An object of the present invention is to provide a vehicle-mounted charger that can effectively solve at least one drawback of the prior art.

[0005] To achieve the above-mentioned objectives, the present invention provides an on-board charger, comprising: a mainboard; a first power module, comprising a first power board provided with a first power circuit; and a second power module, comprising a second power board provided with a second power circuit; wherein the first power module and the second power module are electrically connected to the mainboard and are arranged on the same side of the mainboard.

[0006] In some embodiments of the present invention, the first power module further includes a first module housing, a first portion of power components of the first power circuit are potted in a first cavity of the first module housing by potting glue, and a second portion of power components of the first power circuit are arranged on at least one side wall of the first module housing; and / or, the second power module further includes a second module housing, a first portion of power components of the second power circuit are potted in a second cavity of the second module housing by potting glue, and a second portion of power components of the second power circuit are arranged on at least one side wall of the second module housing.

[0007] In some embodiments of the present invention, the outer wall surface of at least one side wall of the first module shell protrudes outward to form a first boss, and the second part of the power components of the first power circuit are arranged corresponding to the first boss; and / or, the outer wall surface of at least one side wall of the second module shell protrudes outward to form a second boss, and the second part of the power components of the second power circuit are arranged corresponding to the second boss.

[0008] In some embodiments of the present invention, at least one side wall of the first module housing is provided with a first cooling channel, and the first cooling channel is provided corresponding to the second part of the power components of the first power circuit; and / or, at least one side wall of the second module housing is provided with a second cooling channel, and the second cooling channel is provided corresponding to the second part of the power components of the second power circuit.

[0009] In some embodiments of the present invention, the first cooling channel is formed inside the at least one side wall of the first module shell, the at least one side wall includes a first cover, the first cover covers the first cooling channel, and the outer surface of the first cover protrudes outward to form a third boss, and the second part of the power elements of the first power circuit are arranged corresponding to the third boss; and / or, the second cooling channel is formed inside the at least one side wall of the second module shell, the at least one side wall includes a second cover, the second cover covers the second cooling channel, and the outer surface of the second cover protrudes outward to form a fourth boss, and the second part of the power elements of the second power circuit are arranged corresponding to the fourth boss.

[0010] In some embodiments of the present invention, the second part of the power components of the first power circuit are connected to the outer wall surface of at least one side wall of the first module housing through a first thermal interface material for heat dissipation; and / or, the second part of the power components of the second power circuit are connected to the outer wall surface of at least one side wall of the second module housing through a second thermal interface material for heat dissipation.

[0011] In some embodiments of the present invention, the first thermal interface material and / or the second thermal interface material is a cap, or a gap filler combined with a ceramic sheet, or a gap filler combined with an aluminum substrate, or a gap filler combined with an insulating thermal conductive material.

[0012] In some embodiments of the present invention, the insulating heat-conducting material is an adhesive heat-conducting pad, or an insulating heat-conducting layer formed by spraying, or an insulating heat-conducting layer formed by thermal curing.

[0013] In some embodiments of the present invention, the second portion of power components of the first power circuit is disposed on a first power sub-board; and / or the second portion of power components of the second power circuit is disposed on a second power sub-board.

[0014] In some embodiments of the present invention, the first power sub-board is connected to the outer wall surface of at least one side wall of the first module shell through a filler and an insulating thermally conductive material for heat dissipation; and / or the second power sub-board is connected to the outer wall surface of at least one side wall of the second module shell through the filler and the insulating thermally conductive material for heat dissipation; wherein the insulating thermally conductive material is an adhesive thermally conductive gasket, or an insulating thermally conductive layer formed by spraying, or an insulating thermally conductive layer formed by thermal curing.

[0015] In some embodiments of the present invention, the on-board charger further includes: a heat dissipation device, arranged below the first power module and the second power module, wherein the bottom of the first module shell of the first power module is connected to the heat dissipation device for heat dissipation; and / or the bottom of the second module shell of the second power module is connected to the heat dissipation device for heat dissipation.

[0016] In some embodiments of the present invention, the heat dissipation device is a cold plate, and a third cooling channel arranged in a planar manner is provided inside the cold plate.

[0017] In some embodiments of the present invention, the third cooling channel is provided with guide ribs and / or spoiler columns, and / or the cold plate includes an upper cover plate and a lower cover plate, wherein the upper cover plate and the lower cover plate are connected by welding.

[0018] In some embodiments of the present invention, the first cooling channel further includes a first inlet and a first outlet, and the first inlet and the first outlet are formed at the bottom of the first module shell and are respectively connected to the corresponding interfaces of the third cooling channel of the cold plate; and / or, the second cooling channel further includes a second inlet and a second outlet, and the second inlet and the second outlet are formed at the bottom of the second module shell and are respectively connected to the corresponding interfaces of the third cooling channel of the cold plate.

[0019] In some embodiments of the present invention, the first module housing of the first power module is connected to the cold plate via a caulking agent for heat dissipation; and / or the second module housing of the second power module is connected to the cold plate via a caulking agent for heat dissipation.

[0020] In some embodiments of the present invention, the first cooling channel further includes a first inlet and a first outlet, and the first inlet and the first outlet are formed at the bottom of the first module shell, the bottom of the first module shell constitutes the upper cover plate of the cold plate, and the first inlet and the first outlet are communicated with the third cooling channel of the cold plate; and / or, the second cooling channel further includes a second inlet and a second outlet, and the second inlet and the second outlet are formed at the bottom of the second module shell, the bottom of the second module shell constitutes the upper cover plate of the cold plate, and the second inlet and the second outlet are communicated with the third cooling channel of the cold plate.

[0021] In some embodiments of the present invention, the on-board charger further includes: a capacitor module, which is arranged on the same side of the mainboard as the first power module and the second power module; wherein the capacitor module includes a capacitor plate provided with a capacitor and an insulating shell, the capacitor is placed in the accommodating space of the insulating shell, and the capacitor module is electrically connected to the mainboard through the capacitor plate; or, the capacitor module includes a capacitor directly arranged on the mainboard.

[0022] In some embodiments of the present invention, the on-board charger further includes: a housing having an accommodating space; wherein the first power module, the capacitor module, the second power module and the mainboard are placed in the accommodating space.

[0023] In some embodiments of the present invention, the on-board charger further includes: a heat dissipation device, which is disposed at the bottom of the housing and is integrally formed with the housing.

[0024] In some embodiments of the present invention, the first power board, the capacitor board, and the second power board are connected to the main board via quick-plug terminals; wherein both the power flow and the signal flow are transmitted through the first power board, the capacitor board, the second power board, and the PCB circuit on the main board.

[0025] In some embodiments of the present invention, the first power module and the second power module further include a busbar; wherein the power flow is transmitted through the busbar in the first power module and the second power module and the mainboard; wherein the signal flow is transmitted through the first power board and the second power board, and the PCB circuit on the mainboard.

[0026] In some embodiments of the present invention, the on-board charger further includes: a third power module, electrically connected to the mainboard and disposed on the same side of the mainboard as the first power module, and including a third power board provided with a third power circuit; and / or an EMI module, electrically connected to the mainboard and disposed on the same side of the mainboard as the first power module, and including a HV AC EMI module and / or a HV DC EMI module; wherein the first power module is a PFC module, and the first power circuit is a PFC circuit; the second power module is an LLC module, and the second power circuit is an LLC circuit; the third power module is an APM module, and the third power circuit is an APM circuit.

[0027] This invention proposes a modular design approach and concept. By integrating the functionality and structure of OBCs into a modular design based on their functions, this approach allows for standardized design to meet customer customization needs, providing appropriate design flexibility. Furthermore, this approach standardizes production and assembly, improving after-sales maintainability. Ultimately, this approach significantly increases product development efficiency and product qualification rates.

[0028] Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other features and advantages of the present invention will become more apparent by describing in detail example embodiments thereof with reference to the accompanying drawings.

[0030] Figure 1A This is a schematic diagram of the exploded structure of a preferred on-board charger of the present invention;

[0031] Figure 1B for Figure 1A The schematic diagram of the assembled structure of the on-board charger shown;

[0032] Figure 1C for Figure 1A The front view of the on-board charger is shown with the cover removed;

[0033] Figure 1D for Figure 1A A rear view of the on-board charger is shown, showing the structure of a heat dissipation device (e.g., a cold plate) disposed on the rear side;

[0034] Figure 1E FIG1 is a schematic diagram of the exploded structure of another preferred on-board charger of the present invention, wherein the cover is omitted for simplicity of view;

[0035] Figure 1F for Figure 1EA rear view of the mainboard of the vehicle charger is shown, showing the structure of the capacitor module provided on the mainboard;

[0036] Figure 1G Shown Figure 1F The structure of the capacitor module shown after the capacitor is assembled in the insulating housing;

[0037] Figure 2A for Figure 1A Schematic diagram of the exploded structure of a preferred embodiment of a first power module (e.g., a PFC module) in an on-board charger shown;

[0038] Figure 2B for Figure 2A The schematic diagram of the assembled structure of the first power module shown;

[0039] Figure 3A for Figure 1A The exploded structural diagram of a preferred embodiment of a capacitor module in an on-board charger is shown;

[0040] Figure 3B for Figure 3A The schematic diagram of the assembled structure of the capacitor module shown;

[0041] Figure 4A for Figure 1A Schematic diagram of the exploded structure of a preferred embodiment of the second power module (e.g., LLC module) in the on-board charger shown;

[0042] Figure 4B for Figure 4A The schematic diagram of the assembled structure of the second power module shown;

[0043] Figure 5A for Figure 1A Schematic diagram of the exploded structure of a preferred embodiment of the third power module (e.g., APM module) in the on-board charger shown;

[0044] Figure 5B for Figure 5A The schematic diagram of the assembled structure of the third power module shown;

[0045] Figure 6A Taking the first power module (e.g., PFC module) as an example, the decomposed structure of another preferred embodiment of the power module of the present invention is shown;

[0046] Figure 6B for Figure 6A An end cross-sectional view of the assembled structure of the first power module shown;

[0047] Figure 7 for Figure 6AA side cross-sectional view of the assembled structure of the first power module after being assembled on a heat sink (e.g., a cold plate);

[0048] Figure 8A Taking a second power module (e.g., LLC module) as an example, the exploded structure of another preferred embodiment of the power module of the present invention is shown, wherein a second cooling channel is provided on the side wall;

[0049] Figure 8B for Figure 8A An end cross-sectional view of the assembled structure of the second power module shown;

[0050] Figure 8C for Figure 8A A schematic diagram of the bottom structure of the second power module is shown, wherein a second inlet and a second outlet of the second cooling channel are exposed on the bottom;

[0051] Figure 8D This is a schematic diagram of the assembly structure of the heat dissipation device (such as a cold plate) of the present invention after being assembled on the housing, which schematically shows the Figure 8C The second inlet and the second outlet of the second cooling channel of the second power module are connected to the corresponding interfaces;

[0052] Figure 8E for Figure 8A A side cross-sectional view of the assembled structure of the second power module after being assembled on a heat sink (e.g., a cold plate);

[0053] Figure 9A The first heat dissipation method of the present invention is illustrated by taking the first power module (such as a PFC module) as an example;

[0054] Figure 9B The second heat dissipation method of the present invention is illustrated by taking the first power module (such as a PFC module) as an example;

[0055] Figure 9C The third heat dissipation method of the present invention is illustrated by taking the first power module (such as a PFC module) as an example;

[0056] Figure 9D The fourth heat dissipation method of the present invention is illustrated by taking the first power module (such as a PFC module) as an example;

[0057] Figure 10A The fifth heat dissipation method of the present invention is illustrated by taking the second power module (such as LLC module) as an example;

[0058] Figure 10B The sixth heat dissipation method of the present invention is illustrated by taking the second power module (such as LLC module) as an example;

[0059] Figure 10CThe seventh heat dissipation method of the present invention is illustrated by taking the second power module (eg, LLC module) as an example;

[0060] Figure 10D The eighth heat dissipation method of the present invention is illustrated by taking the second power module (eg, LLC module) as an example;

[0061] Figure 11A The ninth heat dissipation method of the present invention is illustrated by taking the second power module (eg, LLC module) as an example;

[0062] Figure 11B The tenth heat dissipation method of the present invention is illustrated by taking the second power module (eg, LLC module) as an example;

[0063] Figure 11C The eleventh heat dissipation method of the present invention is illustrated by taking the second power module (eg, LLC module) as an example;

[0064] Figure 11D The twelfth heat dissipation method of the present invention is illustrated by taking the second power module (eg, LLC module) as an example;

[0065] Figure 12 The first interconnection method of the present invention is illustrated by taking the second power module (e.g., LLC module) as an example;

[0066] Figure 13 The second interconnection method of the present invention is illustrated by taking the first power module (such as a PFC module) as an example;

[0067] Figure 14 The structure diagram of an application circuit formed by connecting a first power module (eg, a PFC module), a capacitor module, a second power module (eg, an LLC module), and a third power module (eg, an APM module) of the present invention is schematically shown. DETAILED DESCRIPTION

[0068] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent like or similar structures, and thus their detailed description will be omitted.

[0069] When introducing elements / components / etc. described and / or illustrated herein, the terms "a," "an," "the," "said," and "at least one" are used to indicate that there are one or more of the elements / components / etc. The terms "comprising," "including," and "having" are used in an open-ended, inclusive manner and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc. In addition, the terms "first," "second," etc. in the claims are used merely as labels and do not constitute numerical limitations on their objects.

[0070] It should be understood that the phraseology or terminology herein is for the purpose of description rather than limitation, so that those skilled in the relevant art can interpret the phraseology or terminology of this specification based on the teachings herein.

[0071] Different embodiments or examples are provided below for implementing different features of the subject matter provided by the present invention. Of course, these are merely examples and are not intended to be limiting. For example, the following description of "a first feature is formed on or above a second feature" may include, in an embodiment, the first feature being in direct contact with the second feature, and may also include forming an additional feature between the first feature and the second feature so that the first feature and the second feature are not in direct contact. In addition, the present invention may reuse element symbols and / or letters in various embodiments or examples. This repetition is for the purpose of simplicity and clarity and does not in itself limit the relationship between the various embodiments and / or configurations discussed.

[0072] Additionally, spatially relative terms, such as "on," "above," "above," "upper," "below," "below," "below," "lower," and the like, are used herein to simplify the description to describe the relationship of one element or feature to another element or feature as illustrated in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative terms used herein interpreted accordingly.

[0073] like Figures 1A to 1D FIG. 1 shows the structure of a preferred on-board charger 100 of the present invention. The on-board charger 100 may include a main board 10, a first power module 20, and a second power module 40. The first power module 20 may include a first power board provided with a first power circuit. The second power module 40 may include a second power board provided with a second power circuit. Furthermore, the first power module 20 and the second power module 40 may be electrically connected to the main board 10 and be provided on the same side of the main board 10 (e.g., Figure 1A on the lower side of the center).

[0074] In some embodiments, as Figure 1A As shown, the on-board charger 100 may further include a capacitor module 30, wherein the capacitor module 30, the first power module 20, and the second power module 40 are disposed on the same side of the mainboard 10 (eg Figure 1A Preferably, in the Figure 1A In the embodiment shown, the capacitor module 30 may include, for example, a capacitor plate 31 provided with a capacitor 311 (a more specific structure may be combined with reference to FIG. Figure 3A and Figure 3B ), and the capacitor module 30 and the mainboard 10 can be electrically connected through the capacitor plate 31. Alternatively, preferably, in the case Figure 1F In the embodiment shown, the capacitor module 30 may include, for example, a capacitor 311 directly disposed on the motherboard 10. Figure 1G In the embodiment shown, the capacitor module 30 may further include an insulating housing 32, and the capacitor 311 directly disposed on the motherboard 10 may be placed in the accommodation space 322 of the insulating housing 32 (the more specific structure of the insulating housing 32 may be combined with reference to FIG. Figure 3A )Inside.

[0075] In some embodiments, as Figure 1A As shown, the onboard charger 100 may further include a case housing 70 having an accommodating space 701 , wherein the first power module 20 , the capacitor module 30 , the second power module 40 and the mainboard 10 are placed in the accommodating space 701 .

[0076] In some embodiments, as Figure 1A As shown, the onboard charger 100 may further include a third power module 50. The third power module 50 may include a third power board equipped with a third power circuit. Furthermore, the third power module 50 may be electrically connected to the mainboard 10 and disposed on the underside of the mainboard 10 (i.e., on the same side of the mainboard 10 as the first power module 20, capacitor module 30, and second power module 40).

[0077] In some embodiments, preferably, the first power module 20 may be, for example, a PFC module, and the first power circuit may be a PFC (Power Factor Correction) circuit. The second power module 30 may be, for example, an LLC module, and the second power circuit may be an LLC (Inductor-Inductor-Capacitor) circuit. The third power module 50 may be, for example, an APM module, and the third power circuit may be an APM (Automotive Power Module) circuit.

[0078] More preferably, if Figure 1A and Figure 1C As shown, the first power module 20, the capacitor module 30, and the second power module 40 can be placed in the space near the rear end of the accommodation space 701, and the third power module 50 can be placed in the space near the front end of the accommodation space 701. However, it is understood that the positions of these modules can be changed according to actual applications.

[0079] In some embodiments, as Figure 1A As shown, the onboard charger 100 may further include an EMI module equipped with an EMI (ElectroMagnetic Interference) circuit, including, but not limited to, a high-voltage AC EMI module 12 and a high-voltage DC EMI module 14. These modules may be electrically connected to the mainboard 10 and disposed on the underside of the mainboard 10 (i.e., on the same side of the mainboard 10 as the first power module 20, capacitor module 30, second power module 40, and third power module 50). Preferably, the high-voltage AC EMI module 12 and the high-voltage DC EMI module 14 may be disposed near the front end of the housing space 701 and on either side of the third power module 50.

[0080] In some embodiments, as Figure 1A As shown, the on-board charger 100 may further include other assembly components such as an external connector (not shown).

[0081] In some embodiments, as Figure 1A As shown, the on-board charger 100 may further include a cover 80 that can be assembled with the housing 70 to enclose assembled components such as the mainboard 10, the first power module 20, the capacitor module 30, the second power module 40, the third power module 50, the HV AC EMI module 12, the HV DC EMI module 14, and external connectors within the accommodating space 701.

[0082] like Figure 1E to Figure 1G FIG. 1 shows another preferred structure of the on-board charger 100 - 1 of the present invention. Figure 1E The cover 80 is omitted for simplicity of illustration. Figure 1A shown). Figures 1A to 1D The difference between the on-board charger 100 shown is that Figure 1E to Figure 1G In the vehicle charger 100-1 shown, the capacitor module 30 is directly mounted on the mainboard 10. Figure 1F As shown, the capacitor module 30 may include a plurality of capacitors 311, and these capacitors 311 are directly disposed on the motherboard 10. More preferably, as Figure 1G As shown, the capacitor module 30 may further include an insulating shell 32, and the capacitors 311 may be placed in the accommodating space 322 of the insulating shell 32 (the more specific structure of the insulating shell 32 may be combined with reference to FIG. Figure 3A )Inside.

[0083] exist Figure 1E to Figure 1G In the embodiment shown, the housing 70 of the on-board charger 100-1 has a receiving space 701. Figure 1E As shown, after the first power module 20 and the second power module 40 are placed in the accommodating space 701, a capacitor module accommodating space 7013 is formed between the two. When the mainboard 10 is assembled on the housing 70, the capacitor module 30 (such as Figure 1F and Figure 1G As shown) can be placed exactly in this capacitor module accommodating space 7013.

[0084] In the present invention, the first power module 20, capacitor module 30, second power module 40, and third power module 50 are modularly designed based on their functions, forming functional modules. These functional modules are secured to the housing 70 via fasteners such as screws, and are connected to the mainboard 10 for power and signal connections. Furthermore, other functional modules, such as the HV AC EMI module 12 and the HV DC EMI module 14, may also be modularly designed, with power and signal connections made through the mainboard 10. This is not intended to limit the present invention.

[0085] In some embodiments, as Figure 1D As shown, combined with reference Figure 1A The onboard charger 100 may also include a heat dissipation device, such as a cold plate 60, but the present invention is not limited thereto. The heat dissipation device (such as the cold plate 60) may be disposed below functional modules such as the first power module 20, the capacitor module 30, the second power module 40, and the third functional module 50 to dissipate heat from these functional modules.

[0086] In some embodiments, the heat dissipation device (eg, the cold plate 60 ) may be disposed at the bottom of the housing 70 and may be integrally formed with the housing 70 .

[0087] Preferably, a planar cooling channel 61 (i.e., a third cooling channel) may be provided within the cold plate 60. The inlet 65 and outlet 66 of the cooling channel 61 may be exposed to the exterior of the housing 70, for example. Coolant (e.g., water, but the present invention is not limited thereto) may enter through the inlet 65, flow within the cooling channel 61, and exit through the outlet 66.

[0088] Preferably, the cooling channel 61 may be arranged in a serpentine manner (ie, forming a plurality of curved portions) and cover the entire bottom surface of the housing 70 as much as possible, thereby improving heat dissipation efficiency.

[0089] Preferably, the cooling channel 61 may further be provided with guide ribs (not shown) for guiding the flow of the coolant and / or pin fins 62 for disturbing the flow of the coolant. Figure 1D In the embodiment, a first group of spoiler columns 621 and a second group of spoiler columns 622 may be formed in the cooling channel 61 and arranged alternately with each other to further improve the heat dissipation efficiency.

[0090] Preferably, the cold plate 60 may include an upper cover plate 67 and a lower cover plate 68 (see Figure 9A As shown in FIG, wherein the upper cover plate 67 and the lower cover plate 68 can be connected by welding. For example, the welding can be performed by methods including but not limited to friction stir welding (FSW).

[0091] In some embodiments, as Figure 2A and Figure 2B As shown, the first power module (e.g., PFC module) 20 may further include a first module housing 22 having a first cavity 222. Preferably, the first power components of the first power circuit (e.g., magnetic components such as the inductor 211 in the PFC circuit) may be disposed on the first power board 21 and potted in the first cavity 222 of the first module housing 22 by potting glue. Preferably, the second power components of the first power circuit (e.g., heating components such as MOS components in the PFC circuit, see Figure 6A 2121) can be provided on at least one side wall of the first module housing 22. For example, Figure 2A In the embodiment shown, a portion of the MOS components may be disposed on a first power sub-board 212, while another portion of the MOS components may be disposed on another first power sub-board 213, and the two first power sub-boards 212 and 213 may be fixed to two opposite side walls of the first module housing 22 by fixing members such as screws. Of course, it is understood that in other embodiments, the second portion of the power components of the first power circuit (such as the MOS components in the PFC circuit) may also be directly connected to the outer wall surface of at least one side wall of the first module housing 22 by, for example, a first thermal interface material (see Figures 9A to 9D shown).

[0092] Preferably, if Figure 2A As shown, the first power board 21 may also be provided with a through hole 210. After the first power module 20 (eg, a PFC module) is assembled, as shown in FIG. Figure 2B As shown, the connection terminal 211a of the inductor 211 in the PFC circuit can pass through the corresponding through-hole 210 and be exposed outside the first power module (eg, PFC module) 20, thereby facilitating electrical connection with the mainboard 10. Preferably, as Figure 2AAs shown, the first power board 21 may also be provided with quick-plug terminals 21 c for realizing quick plug-in between the first power module 20 and the main board 10 .

[0093] In some embodiments, as Figure 3A and Figure 3B As shown, the capacitor module 30 includes a plurality of capacitors 311, which are disposed on a capacitor plate 31. Furthermore, the capacitor module 30 may also include an insulating housing 32. The capacitors 311 are placed within a receiving space 322 of the insulating housing 32. Preferably, the capacitor plate 31 may also be provided with quick-connect terminals 31a and 31b for quick connection between the capacitor module 30 and the motherboard 10.

[0094] In some embodiments, as Figure 4A and Figure 4B As shown, the second power module 40 (e.g., LLC module) may further include a second module housing 42 having a second cavity 422. Preferably, the first portion of the power components of the second power circuit (e.g., magnetic components such as the inductor 411 in the LLC circuit) may be disposed on the second power board 41 and potted in the second cavity 422 of the second module housing 42 by potting glue. Preferably, the second portion of the power components of the second power circuit (e.g., heating components such as the MOS component 411 in the LLC circuit, which may be referred to in the following example) may be disposed on the second power board 41 and potted in the second cavity 422 of the second module housing 42. Figure 8A 4121) can be provided on at least one side wall of the second module housing 42. For example, Figure 4A In the embodiment shown, a portion of the MOS components may be disposed on a second power sub-board 412, while another portion of the MOS components may be disposed on another second power sub-board 413, and the two second power sub-boards 412 and 413 may be fixed to two opposite side walls of the second module housing 42 by fixing members such as screws. Of course, it is understood that in other embodiments, the second portion of the power components of the second power circuit (such as the MOS component 411 in the LLC circuit and other heating components) may also be directly connected to the outer wall surface of at least one side wall of the second module housing 42 by, for example, a second thermal interface material (see Figures 11A to 11D shown).

[0095] Preferably, if Figure 4A and Figure 4B As shown, the second power board 41 may also be provided with quick-plug terminals 41 a , 41 b , 41 c exposed outside the second power module (eg, PFC module) 20 , for realizing quick plug-in between the second power module 40 and the main board 10 .

[0096] In some embodiments, as Figure 5A and Figure 5BAs shown, the third power module 50 (e.g., an APM module) may further include a third module housing 52 having a third cavity 522. Preferably, the first portion of the power components of the third power circuit (e.g., the magnetic component 511 in the APM circuit) may be disposed on the third power board 51 and potted in the third cavity 522 of the third module housing 52 by potting glue. Preferably, the second portion of the power components of the third power circuit (e.g., heating components such as MOS components in the APM circuit) may be disposed on at least one side wall of the third module housing 52. For example, in Figure 5A In the embodiment shown, a portion of the MOS components may be disposed on a third power sub-board 512, while another portion of the MOS components may be disposed on another third power sub-board 513, and the two third power sub-boards 512, 513 may be fixed to two opposite side walls of the third module housing 52 by means of fixing members such as screws. Of course, it is understood that in other embodiments, the second portion of the power components of the third power circuit (such as the MOS components and other heating components in the APM circuit) may also be directly connected to the outer wall surface of at least one side wall of the third module housing 52 by means of, for example, a third thermal interface material (which may be combined with reference to FIG. Figures 9A to 9D or Figures 11A to 11D shown).

[0097] Preferably, if Figure 5A and Figure 5B As shown, the third power board 51 may also be provided with quick-plug terminals 51a, 51b, 51c exposed outside the third power module (eg, PFC module) 50 to achieve quick plug-in between the third power module 50 and the main board 10.

[0098] Figure 6A Taking the first power module 20 - 1 (eg, a PFC module) as an example, the decomposed structure of another preferred embodiment of the power module of the present invention is illustrated. Figure 6B for Figure 6A FIG. 1 is a cross-sectional end view of the assembled structure of the first power module 20 - 1 . Figure 7 for Figure 6A The side cross-sectional view of the assembly structure after the first power module 20-1 is assembled on the heat dissipation device (such as the cold plate 60) is shown. It is understandable that the second power module 40, the third power module 50, and / or other power modules in the on-board charger 100 of the present invention can also be formed as shown in FIG. Figures 6A-6B 、 Figure 7 The assembly structure shown.

[0099] In some embodiments, reference Figure 6A and Figure 6B, the outer wall surface 223 of at least one side wall of the first module housing 22 of the first power module 20-1 can protrude outward to form a first boss 2231, and the second part of the power components of the first power circuit (such as the MOS component 2121 in the PFC circuit and other heating components) are arranged corresponding to the first boss 2231. Preferably, the second part of the power components of the first power circuit (such as the MOS component 2121 in the PFC circuit and other heating components) are, for example, arranged on the first power sub-boards 212 and 213, and the first power sub-boards 212 and 213 are connected to the outer wall surface 223 of at least one side wall of the first module housing 22 by a caulking agent and an insulating thermal conductive material for heat dissipation. Among them, the insulating thermal conductive material can be, for example, a thermally conductive gasket that can be pasted, or an insulating thermal conductive layer formed by spraying, or an insulating thermal conductive layer formed by thermal curing. More specifically, in actual operation, for example, a thermal conductive area 223A corresponding to the first boss 2231 can be first formed on the outer wall surface 223 (see Figure 7 ) A layer of insulating thermally conductive material is formed by spraying, thermally curing, or pasting. A gap filler (e.g., gap thermal adhesive, but the present invention is not limited thereto) is then applied to the outer wall surface 223 except for the heat-conducting area 223A. Finally, the first power sub-boards 212 and 213 are secured to the sidewalls of the first module housing 22. At this point, the power components (e.g., heating components such as the MOS component 2121 in the PFC circuit) on the first power sub-boards 212 and 213 can be positioned corresponding to the first bosses 2231. Furthermore, the heat generated by the power components (e.g., heating components such as the MOS component 2121 in the PFC circuit) on the first power sub-boards 212 and 213 during operation can be diffused to the sidewalls of the first module housing 22 through the insulating thermally conductive material and gap filler, and dissipated, thereby improving heat dissipation efficiency.

[0100] In some embodiments, reference Figure 7 After the first power module 20 - 1 is assembled on the heat dissipation device (eg, cold plate 60 ), the bottom 224 of the first module housing 21 of the first power module 20 - 1 is connected to the heat dissipation device (eg, cold plate 60 ) via a sealant, for example.

[0101] It is understandable that the second power module 40, the third power module 50, and / or other power modules in the on-board charger 100 of the present invention may also have the following configurations: Figures 6A-6BThe boss structure of the first power module 20-1 is shown. Specifically, for example, the outer wall surface of at least one side wall of the second module housing 42 of the second power module 40 may protrude outward to form a second boss, and the second portion of the power components of the second power circuit (e.g., a MOS component or other heat-generating component in an LLC circuit) may be disposed corresponding to the second boss. The outer wall surface of at least one side wall of the third module housing 42 of the third power module 50 may protrude outward to form a third boss, and the second portion of the power components of the third power circuit (e.g., a MOS component or other heat-generating component in an APM circuit) may be disposed corresponding to the third boss.

[0102] Likewise, it is understood that after the second power module 40, the third power module 50, and / or other power modules are assembled on the heat dissipation device (e.g., the cold plate 60), the bottoms of the module housings of these power modules may also be connected to the heat dissipation device (e.g., the cold plate 60) for heat dissipation, for example, by means of a caulking agent (see Figure 7 ).

[0103] Figure 8A Taking the second power module 40 - 1 (eg, LLC module) as an example, the decomposed structure of another preferred embodiment of the power module of the present invention is shown. Figure 8B for Figure 8A FIG. 4 is a cross-sectional end view of the assembled structure of the second power module 40 - 1 . Figure 8C for Figure 8A The bottom structure diagram of the second power module 40-1 is shown. Figure 8D It is a schematic diagram of the assembly structure of the heat dissipation device (eg, the cold plate 60 ) of the present invention after being assembled on the housing 70 . Figure 8E for Figure 8A The side cross-sectional view of the assembly structure after the second power module 40-1 is assembled on the heat dissipation device (such as the cold plate 60) is shown. It is understandable that the first power module 20, the third power module 50, and / or other power modules in the on-board charger 100 of the present invention can also be formed as shown in FIG. Figures 8A to 8E The assembly structure shown.

[0104] In some embodiments, in conjunction with reference Figure 8A and Figure 8B At least one side wall of the second module housing 42 of the second power module 40-1 is provided with a second cooling channel 425. Each second cooling channel 425 may have a second inlet 4251 and a second outlet 4252. In addition, the second cooling channel 425 is provided corresponding to the second part of the power components of the second power circuit (for example, MOS components and other heat generating components in the LLC circuit). For example, Figure 8A and Figure 8BIn the illustrated embodiment, second cooling channels 425 are provided on two opposite side walls (e.g., the left side wall and the right side wall) of the second module housing 42, and the horizontal portions of the second cooling channels 425 on the two opposite side walls correspond to the second part of the power elements of the second power circuit (e.g., heating elements such as MOS elements 4121, 4131 in the LLC circuit) provided on the second power sub-boards 412 and 413.

[0105] In some embodiments, continue to refer to Figure 8A and Figure 8B Preferably, the second cooling channel 425 is formed inside at least one side wall of the second module housing 42, and the at least one side wall may further include second covers 452 and 453, wherein the second covers 452 and 453 cover the second cooling channel 425. For example, the outer wall surface 423 of the right side wall may be recessed inward to form a recessed space 4235 for assembling the second cover 453, and a portion of the recessed space 4235 is further recessed inward to form the second cooling channel 425. More preferably, the outer surfaces of the second covers 452 and 453 may further protrude outward to form fourth bosses 4521 and 4531. The second portion of the power components of the second power circuit (e.g., heat-generating components such as the MOS components 4121 and 4131 in the LLC circuit) are arranged corresponding to the fourth bosses 4521 and 4531. The arrangement method may refer to the arrangement method between the second part of the power elements of the first power circuit (eg, the heating elements such as the MOS element 2121 in the PFC circuit) and the first boss 2231 as described above, and will not be repeated here.

[0106] like Figure 8C As shown, after the second power module 40 - 1 is assembled, the bottom 424 of the second module housing 42 exposes the second inlet 4251 and the second outlet 4252 of the second cooling channel 425 .

[0107] After the heat dissipation device (e.g., cold plate 60) of the present invention is assembled on the housing 70, a plurality of interfaces may be provided on the top of the heat dissipation device (e.g., cold plate 60) for corresponding communication with the inlet and outlet of the corresponding cooling channel of the corresponding power module. The coolant flowing in the cooling channel of the heat dissipation device (e.g., cold plate 60) may flow into the corresponding cooling channel of the corresponding power module through the corresponding interfaces. For example, Figure 8D As shown, which schematically shows Figure 8C The second inlet 4251 and the second outlet 4252 of the second cooling channel of the second power module 40-1 are connected to the corresponding interface 604. Figure 8EAs shown, after the second power module 40-1 is assembled on the cold plate 60, the coolant flowing through the cooling channel 61 of the cold plate 60 can flow in the direction indicated by the gray arrow in the figure. That is, the coolant is introduced from one end of the cooling channel 61 of the cold plate 60, upwardly enters the side wall of the second module housing 42 of the second power module 40-1, then downwardly enters the cooling channel 61 of the cold plate 60, and flows out from the other end of the cooling channel 61. In this way, the flowing coolant can remove heat generated by the second portion of the power components of the corresponding second power circuit (for example, the heat-generating components such as MOS components 4121 and 4131 in the LLC circuit), thereby achieving heat dissipation for the second portion of the power components.

[0108] It is understandable that the first power module 20, the third power module 50, and / or other power modules in the on-board charger 100 of the present invention may also have the following configurations: Figures 8A to 8E The cooling channel structure and boss structure of the second power module 40-1 are shown. That is, for example, a first cooling channel may be provided on at least one side wall of the first module housing 21 of the first power module 20, wherein the first cooling channel may be provided corresponding to the second portion of the power components of the first power circuit (e.g., a heat-generating component such as a MOS component in a PFC circuit). Preferably, the first cooling channel may be formed inside at least one side wall of the first module housing, and the at least one side wall may further include a first cover, wherein the first cover covers the first cooling channel. Preferably, the outer surface of the first cover may further protrude outward to form a third boss, and the second portion of the power components of the first power circuit (e.g., a heat-generating component such as a MOS component in a PFC circuit) may be provided corresponding to the third boss. After these power modules are assembled on the housing 70, the inlets and outlets of the corresponding cooling channels of the corresponding power modules can be connected to the cooling channels 61 of the cooling 60 through the corresponding interfaces provided on the top of the heat dissipation device (such as the cold plate 60), so that the heat generated by the heating elements on the corresponding power modules can be removed through the flow of coolant in the cooling channels 61 of the cold plate 60.

[0109] It is understood that in other embodiments, the inlets and outlets of the corresponding cooling channels of the first power module 20, the second power module 40, the third power module 50, and / or other power modules in the on-board charger 100 of the present invention are formed at the bottom of the corresponding module housing and are connected to corresponding interfaces provided on the top of the heat sink (e.g., the cold plate 60). Preferably, these corresponding connection points can also be provided with sealants or other sealing structures to ensure the sealing performance of these connection points.

[0110] It is understood that in other embodiments, the cooling channels on the first power module 20, the second power module 40, the third power module 50, and / or other power modules in the on-board charger 100 of the present invention may be independent. That is, the cooling channels on these power modules may not be connected to a heat sink (e.g., a cold plate 60), but may have independent cooling sources. Alternatively, in other embodiments, the on-board charger 100 of the present invention may not have a heat sink such as a cold plate 60, but may only dissipate heat through the cooling channels provided on these power modules. These are not limitations of the present invention.

[0111] The following combination Figures 9A to 9D 、 Figures 10A to 10D 、 Figures 11A to 11D , further details the various heat dissipation methods and heat dissipation structures of the power module of the present invention.

[0112] In some embodiments, the power module of the present invention is not provided with a cooling channel. The module housing of each power module is connected to a heat dissipation device such as a cold plate 60 through a gap filler. Figures 9A to 9D As shown, the first power modules 20-2A, 20-2B, 20-2C, and 20-2D are connected to the bottom 224 of the first module housing 22 and the cold plate 60 through the filler 601 for heat dissipation; Figures 10A to 10D As shown, the second power modules 40 - 1A, 40 - 1B, 40 - 1C, and 40 - 1D are connected to the bottom 424 of the second module housing 42 and the cold plate 60 through a sealant 601 for heat dissipation.

[0113] In some embodiments, the power module of the present invention is provided with a cooling channel for heat dissipation, and the module housing of each power module is also connected to a heat dissipation device such as a cold plate 60 through a gap filler for heat dissipation. Figures 10A to 10D As shown, a second cooling channel connected to the cold plate 60 is provided on the second module housing 42 of the second power modules 40-1A, 40-1B, 40-1C, and 40-1D. In addition to heat dissipation through the coolant 63 flowing in the second cooling channel, heat dissipation can also be achieved through the sealant 601 between the bottom 424 of the second module housing 42 and the cold plate 60.

[0114] In some embodiments, the present invention can also use the bottom of the module housing of the power module to form a part of the upper cover of the cold plate 60. The bottom of the module housing of these power modules and the upper cover of the cold plate 60 can be sealed by, for example, a Cured-In-Place Gasket (CIPG). Figures 11A to 11D As shown, the bottom 424 of the second module housing 42 of the second power modules 40-2A, 40-2B, 40-2C, and 40-2D can directly serve as part of the upper cover of the cold plate 60. Preferably, these power modules themselves can also be provided with cooling channels for heat dissipation. The inlets and outlets of the corresponding cooling channels on these power modules are formed at the bottom of the corresponding module housing and communicate with the cooling channels 61 of the cold plate 60.

[0115] In some embodiments, the second part of the power elements of the power circuit of the power module of the present invention (for example, the first power module 20, the second power module 40, the third power module 50, etc.) (for example, the heat-generating elements such as the MOS elements in the PFC circuit, the LLC circuit, and the APM circuit) are connected to the outer wall surface of at least one side wall of the module housing through a thermal interface material for heat dissipation.

[0116] Preferably, these thermal interface materials can be thermal caps. For example, Figure 9A 、 Figure 10A 、 Figure 11A The MOS elements 216, 416 on the power modules (for example, the first power module 20-2A, the second power module 40-1A, the second power module 40-2A) are connected to the outer wall surfaces of the side walls of the module shells (for example, the first module shell 22, the second module shell 42) of the corresponding power modules through cap sleeves 26, 46 for heat dissipation.

[0117] Alternatively, preferably, these thermal interface materials can be fillers combined with ceramic sheets. For example, Figure 9B 、 Figure 10B 、 Figure 11B The MOS elements 216, 416 on the power modules (for example, the first power module 20-2B, the second power module 40-1B, the second power module 40-2B) and the outer wall surfaces of the side walls of the module shells (for example, the first module shell 22, the second module shell 42) of the corresponding power modules are connected and heat dissipated by fillers 271, 471 (for example, located between the ceramic sheets 27, 47 and the side walls) and fillers 272, 472 (for example, located between the ceramic sheets 27, 47 and the MOS elements 216, 416) in combination with ceramic sheets 27, 47.

[0118] Alternatively, preferably, these thermal interface materials can be fillers combined with aluminum substrates (or other metal core printed circuit boards (MCPCBs), but the present invention is not limited thereto). For example, Figure 9C 、 Figure 10C 、 Figure 11C The MOS elements 216, 416 on the power modules (for example, the first power module 20-2C, the second power module 40-1C, the second power module 40-2C) and the outer wall surfaces of the side walls of the module shells of the corresponding power modules (for example, the first module shell 22, the second module shell 42) are connected and heat dissipated by fillers 281, 481 (for example, located between the aluminum substrates 28, 48 and the side walls) and fillers 282, 482 (for example, located between the aluminum substrates 28, 48 and the MOS elements 216, 416)) in combination with the aluminum substrates 28, 48.

[0119] Alternatively, preferably, these thermal interface materials can be gap fillers combined with insulating thermal conductive materials. For example, Figure 9D 、 Figure 10D 、 Figure 11D The MOS elements 216, 416 on the power modules (for example, the first power module 20-2D, the second power module 40-1D, the second power module 40-2D) and the outer wall surfaces of the side walls of the module shells (for example, the first module shell 22, the second module shell 42) of the corresponding power modules are connected and heat dissipated by fillers 291, 491 (for example, located between the insulating thermal conductive materials 29, 49 and the side walls) and fillers 292, 492 (for example, located between the insulating thermal conductive materials 29, 49 and the MOS elements 216, 416) in combination with insulating thermal conductive materials 29, 49.

[0120] Preferably, in the present invention, the insulating thermally conductive material is, for example, an adhesive thermally conductive pad, or an insulating thermally conductive layer formed by spraying, or an insulating thermally conductive layer formed by thermal curing, but the present invention is not limited thereto.

[0121] like Figure 12 As shown, the first interconnection mode of the present invention is illustrated by taking the second power module 40-1 (such as LLC module) as an example. Figure 12 In the embodiment, the second power board 41 of the second power module 40-1 can be connected to the main board 10 (see Figure 1A) are connected by plug-in terminals 41a, 41b, and 41c. Among them, the power flow and signal flow of the second power module 40-1 are both transmitted through the second power board 41 and the PCB circuit on the main board 10. More specifically, the power connection between the second power module 40-1 and the main board 10 can be connected by plugging in the quick-plug terminals 41a, 41b (for example, 41a as the input terminal and 41b as the output terminal) with the soldered copper sheet (not shown in the figure) on the main board 10; the signal connection between the second power module 40-1 and the main board 10 can be connected by plugging in the quick-plug terminals 41c with the signal strip terminals (not shown in the figure) on the main board 10. Similarly, the first power board 21 of the first power module 20 (refer to Figure 2B ), the capacitor plate 31 of the capacitor module 30 (refer to Figure 3B ), and the third power board 51 of the third power module 50 (refer to Figure 5B ) can also be connected to the main board 10 through corresponding quick-plug terminals, which will not be repeated here.

[0122] like Figure 13 As shown, the second interconnection method of the present invention is illustrated by taking the first power module 20-2 (eg, PFC module) as an example. Figure 13 In the embodiment, the first power module 20-2 further includes a busbar 21d. The power flow of the first power module 20-2 is through the busbar 21d and the mainboard 10 (see Figure 1A ) for transmission; the signal flow of the first power module 20-2 is transmitted through the first power board 21 and the PCB circuit on the main board 10. More specifically, the power connection input end between the first power module 20-2 and the main board 10 can be connected to the quick-plug terminal (not shown in the figure) on the main board 10 through the input terminal 21d1 of the busbar 21d, and the power connection output end can be connected to the welding copper sheet on the main board 10 through the quick-plug terminal 21a, wherein the output terminal 21d2 of the busbar 21d is connected to the quick-plug terminal 21a; the signal connection between the first power module 20-2 and the main board 10 can be connected to the signal terminal (not shown in the figure) on the main board 10 through the quick-plug terminal 21c. Similarly, the capacitor plate 31 (refer to Figure 3B ), the second power board 41 of the second power module 40 (refer to Figure 4B ), and the third power board 51 of the third power module 50 (refer to Figure 5B ) can also be connected to the main board 10 through corresponding quick-plug terminals, which will not be repeated here.

[0123] like Figure 14, which schematically illustrates the structure of an application circuit formed by connecting a first power module 20 (e.g., a PFC module), a capacitor module 30, a second power module 40 (e.g., an LLC module), and a third power module 50 (e.g., an APM module) of the present invention. The first power circuit (e.g., a PFC circuit) of the first power module 20 can be, for example, an AC / DC three-phase half-bridge circuit, the second power circuit (e.g., an LLC circuit) of the second power module 40 can be, for example, a DC / DC Boost SRC circuit, and the third power circuit (e.g., an APM circuit) of the third power module 50 can be, for example, an HV / LV single-phase half-bridge circuit. However, it should be understood that the corresponding power circuits of the power modules of the present invention are not limited to these.

[0124] This invention proposes a modular design approach and concept, integrating functionality and structure into the OBC. This modular design allows for a standardized design that meets customer customization needs, providing corresponding design flexibility. Furthermore, this approach standardizes production and assembly, improving after-sales maintainability. Ultimately, this significantly increases product development efficiency and product qualification rates.

[0125] In the present invention, the position of each power module can be changed according to actual application, the installation position of the cooling channel of the cold plate (such as the water pipe position) can also be adjusted accordingly, and the position of the cooling channel of each power module itself can also be changed. These are not intended to limit the present invention.

[0126] The OBC of the present invention has the following advantages:

[0127] (1) Power scalability: By combining or disassembling power modules, the rated power of the OBC can be expanded from 7.0KW to 11.0KW, 22.0KW or higher, making it easier to adapt to different models of different customers.

[0128] (2) Repair convenience: If a single power module fails, there is no need to replace the entire OBC; only the failed power module needs to be replaced. Faulty power modules are easier to rework, which can improve productivity in terms of manufacturability.

[0129] (3) Online potting: Standardized modules simplify manufacturing, inventory management, and design reusability, making it easier to establish a standard product line for modules. Each standardized power module can be potted online because its smaller size and less material make it easier to bake in an oven.

[0130] (4) Short electronic design and development cycle: The power module can be well isolated from the EMI filter (e.g., EMI module), and the power sub-module (e.g., power sub-board) can be connected to its own ground and sub-housing. The EMI filter of the present invention can be flexibly designed, saving development time.

[0131] While exemplary embodiments of the present invention have been particularly shown and described above, it should be understood that the present invention is not limited to the disclosed embodiments, but rather is intended to cover various modifications and equivalent arrangements encompassed within the spirit and scope of the appended claims.

Claims

1. A vehicle-mounted charger, characterized in that: include: Motherboard; A first power module includes a first power board provided with a first power circuit; as well as A second power module includes a second power board provided with a second power circuit; The first power module and the second power module are electrically connected to the mainboard and are arranged on the same side of the mainboard.

2. The on-board charger according to claim 1, characterized in that: The first power module further includes a first module housing, wherein a first portion of power components of the first power circuit are potted in a first cavity of the first module housing by potting glue, and a second portion of power components of the first power circuit are arranged on at least one side wall of the first module housing; and / or, The second power module also includes a second module shell, the first part of the power components of the second power circuit are encapsulated in the second cavity of the second module shell by potting glue, and the second part of the power components of the second power circuit are arranged on at least one side wall of the second module shell.

3. The on-board charger according to claim 2, characterized in that: The outer wall surface of the at least one side wall of the first module housing protrudes outward to form a first boss, and the second part of the power components of the first power circuit are arranged corresponding to the first boss; and / or, The outer wall surface of the at least one side wall of the second module housing protrudes outward to form a second boss, and the second part of the power components of the second power circuit are arranged corresponding to the second boss.

4. The on-board charger according to claim 2, characterized in that: The at least one side wall of the first module housing is provided with a first cooling channel, and the first cooling channel is provided corresponding to the second part of the power components of the first power circuit; and / or, The at least one side wall of the second module housing is provided with a second cooling channel, and the second cooling channel is provided corresponding to the second part of the power components of the second power circuit.

5. The on-board charger according to claim 4, characterized in that: The first cooling channel is formed inside the at least one side wall of the first module housing, the at least one side wall includes a first cover, the first cover covers the first cooling channel, and the outer surface of the first cover protrudes outward to form a third boss, and the second part of the power components of the first power circuit are arranged corresponding to the third boss; and / or, The second cooling channel is formed inside the at least one side wall of the second module shell, and the at least one side wall includes a second cover. The second cover covers the second cooling channel, and the outer surface of the second cover protrudes outward to form a fourth boss. The second part of the power elements of the second power circuit is arranged corresponding to the fourth boss.

6. The on-vehicle charger according to any one of claims 2 to 4, characterized in that: The second part of the power components of the first power circuit is connected to the outer wall surface of the at least one side wall of the first module housing through a first thermal interface material for heat dissipation; and / or, The second part of the power components of the second power circuit is connected to the outer wall surface of the at least one side wall of the second module housing through a second thermal interface material for heat dissipation.

7. The on-board charger according to claim 6, characterized in that: The first thermal interface material and / or the second thermal interface material is a cap, or a caulking agent combined with a ceramic sheet, or a caulking agent combined with an aluminum substrate, or a caulking agent combined with an insulating thermal conductive material.

8. The on-board charger according to claim 7, characterized in that: The insulating heat-conducting material is a heat-conducting pad that can be pasted, or an insulating heat-conducting layer formed by spraying, or an insulating heat-conducting layer formed by thermal curing.

9. The on-vehicle charger according to any one of claims 2 to 4, characterized in that: The second part of the power components of the first power circuit is arranged on a first power sub-board; and / or, The second part of the power components of the second power circuit is disposed on a second power sub-board.

10. The on-vehicle charger according to claim 9, characterized in that: The first power sub-board is connected to the outer wall surface of at least one side wall of the first module housing through a caulking agent and an insulating heat-conductive material for heat dissipation; and / or, The second power sub-board is connected to the outer wall surface of the at least one side wall of the second module housing through the filler and the insulating thermal conductive material to dissipate heat; The insulating heat-conducting material is a heat-conducting pad that can be pasted, or an insulating heat-conducting layer formed by spraying, or an insulating heat-conducting layer formed by thermal curing.

11. The on-vehicle charger according to any one of claims 2 to 4, characterized in that: Also includes: A heat dissipation device is arranged below the first power module and the second power module, wherein the bottom of the first module shell of the first power module is connected to the heat dissipation device for heat dissipation; and / or the bottom of the second module shell of the second power module is connected to the heat dissipation device for heat dissipation.

12. The on-vehicle charger according to claim 11, characterized in that: The heat dissipation device is a cold plate, and a third cooling channel arranged in a plane is provided inside the cold plate.

13. The on-vehicle charger according to claim 12, characterized in that: The third cooling channel is provided with flow-guiding ribs and / or spoiler columns, and / or the cold plate includes an upper cover plate and a lower cover plate, wherein the upper cover plate and the lower cover plate are connected by welding.

14. The on-vehicle charger according to claim 12, characterized in that: The first cooling channel further includes a first inlet and a first outlet, and the first inlet and the first outlet are formed at the bottom of the first module housing and are respectively connected to corresponding interfaces of the third cooling channel of the cold plate; and / or, The second cooling channel further includes a second inlet and a second outlet, and the second inlet and the second outlet are formed at the bottom of the second module housing and are respectively connected to corresponding interfaces of the third cooling channel of the cold plate.

15. The vehicle-mounted charger according to claim 14, characterized in that: The first module housing of the first power module is connected to the cold plate via a caulking agent for heat dissipation; and / or, The second module housing of the second power module is connected to the cold plate through a sealant to dissipate heat.

16. The vehicle-mounted charger according to claim 12, characterized in that: The first cooling channel further includes a first inlet and a first outlet, and the first inlet and the first outlet are formed at the bottom of the first module housing, the bottom of the first module housing constitutes an upper cover plate of the cold plate, and the first inlet and the first outlet are in communication with the third cooling channel of the cold plate; and / or, The second cooling channel also includes a second inlet and a second outlet, and the second inlet and the second outlet are formed at the bottom of the second module shell. The bottom of the second module shell constitutes the upper cover plate of the cold plate. The second inlet and the second outlet are connected to the third cooling channel of the cold plate.

17. The on-board charger according to claim 1 or 2, characterized in that: Also includes: a capacitor module, the capacitor module being arranged on the same side of the mainboard as the first power module and the second power module; The capacitor module includes a capacitor plate provided with a capacitor and an insulating shell, the capacitor is placed in the accommodating space of the insulating shell, and the capacitor module is electrically connected to the mainboard through the capacitor plate; or, the capacitor module includes a capacitor directly provided on the mainboard.

18. The vehicle-mounted charger according to claim 17, characterized in that: Also includes: a housing having a storage space; The first power module, the capacitor module, the second power module and the mainboard are placed in the accommodating space.

19. The on-vehicle charger according to claim 18, characterized in that: Also includes: The heat dissipation device is arranged at the bottom of the casing and is integrally formed with the casing.

20. The on-vehicle charger according to claim 17, characterized in that: The first power board, the capacitor board, and the second power board are plug-connected to the main board via quick-connect terminals; Wherein, both the power flow and the signal flow are transmitted through the first power board, the capacitor board, the second power board, and the PCB circuit on the main board.

21. The on-vehicle charger according to claim 1, characterized in that: The first power module and the second power module further include a busbar; The power flow is transmitted through the busbars in the first power module and the second power module and the mainboard; The signal flow is transmitted through the first power board, the second power board, and the PCB circuit on the main board.

22. The on-vehicle charger according to claim 1, characterized in that: Also includes: a third power module electrically connected to the mainboard and disposed on the same side of the mainboard as the first power module, and comprising a third power board provided with a third power circuit; and / or an EMI module, electrically connected to the mainboard and disposed on the same side of the mainboard as the first power module, and comprising an HVAC EMI module and / or an HV DC EMI module; Wherein, the first power module is a PFC module, and the first power circuit is a PFC circuit; The second power module is an LLC module, and the second power circuit is an LLC circuit; The third power module is an APM module, and the third power circuit is an APM circuit.

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