Circuit board capable of preventing dust

Abstract

The invention relates to and discloses a dust-proof circuit board, which comprises a pcb (printed circuit board), a chip and a component are arranged on the pcb, a radiator is arranged above the chip, the radiator comprises a base, fin groups and a fan, the fin groups and the fan are arranged on the base, a gap is formed between every two adjacent fin groups, and the fan is arranged on the base. A plurality of fin groups are arranged on the base, gaps are formed between fins on each fin group, the bottom of the base is in contact with the chip, a heat pipe is arranged on the base in a penetrating manner, the heat pipe upwards penetrates through all the fin groups, the fan is positioned in the middle of the fin groups, and the heat exchanger further comprises a rotating part and a driving mechanism for driving the rotating part to rotate. The bottom of the rotating part is rotationally connected to the base, the rotating part is provided with inserting pieces, the inserting pieces are inserted into gaps between the fins, and the front face and the back face of each inserting piece make contact with the corresponding fin.

Description

Technical Field

[0001] The present invention relates to a circuit board, in particular to a circuit board capable of preventing dust. Background Art

[0002] During use, circuit boards are prone to dust accumulation, especially around the heat sink. The heat sink has many parallel fins, which increase the heat dissipation area. However, dust easily accumulates in the gaps between the fins. This dust blocks heat exchange between the fins and the air, affecting the heat dissipation effect. It is also difficult to clean, so improvements are necessary. Summary of the Invention

[0003] The object of the present invention is to provide a circuit board that prevents dust from accumulating easily on the heat sink.

[0004] To achieve the above-mentioned object, the present invention provides the following technical solution: a dust-proof circuit board, comprising a PCB board, on which chips and components are arranged, a heat sink is arranged above the chip, the heat sink comprises a base, a fin group arranged on the base, and a fan, there is a gap between two adjacent fin groups, and there is a gap between the fins on each group of the fin groups, the bottom of the base is in contact with the chip, a heat pipe is passed through the base, the heat pipe passes upward through all the fin groups, and the fan is located in the middle of the fin group The fin assembly also includes a rotating member and a driving mechanism for driving the rotating member to rotate. The bottom of the rotating member is rotatably connected to the base. The rotating member is provided with an insert, which is inserted into the gap between the fins. The front and back sides of each insert are respectively in contact with each fin. When the chip is not powered on, the driving mechanism drives the rotating member to insert the insert into the fin group. The insert and the fin are completely overlapped. When the circuit board is powered on, the driving mechanism drives the rotating member to slide the insert out of the fin group. When the circuit board with this structure is not in use, the inserts and fins completely overlap, and dust cannot enter the gaps between the inserts or fins. When in use, the inserts slide out of the gaps between the fins and the fan starts. At this time, the heat generated by the chip is transferred to the heat pipe, and the heat pipe transfers it to the fins and inserts. The airflow flows in from the gap between the inserts and the fins to complete the heat exchange, and then flows out from the top. When the airflow passes through the gap between the inserts and the fins, if some dust sticks to the gap, when the insert is inserted into the fin again, the dust in the gap will also be pushed away.

[0005] As a preferred embodiment of the present invention, there are two fin groups, and the two fin groups are arranged opposite to each other.

[0006] As a preferred embodiment of the present invention, the fin group is in a fan ring shape, and the curvature of the fin is greater than 90 degrees and less than 100 degrees.

[0007] As a preferred embodiment of the present invention, an arcuate groove is provided on the insert, and the axis of the arcuate groove is coaxial with the axis of the fin.

[0008] As a preferred embodiment of the present invention, when the inner end of the arc-shaped groove contacts the heat pipe, the insert and the fin completely overlap.

[0009] As a preferred embodiment of the present invention, the fin group is provided with a stopper on one end not inserted by the insert.

[0010] As a preferred embodiment of the present invention, the rotating member includes an annular plate, the annular plate is rotatably connected to the base, two vertically arranged baffles are fixed on the annular plate, and inserts are fixed on the baffles.

[0011] As a preferred embodiment of the present invention, the driving mechanism includes an iron block and an electromagnet. The iron block is fixed to the bottom of the annular plate. There are multiple electromagnets, and the multiple electromagnets are arranged on the base around the annular plate.

[0012] As a preferred embodiment of the present invention, the radiator is made of aluminum, and the heat pipe is made of copper.

[0013] Compared with the prior art, the present invention has the following beneficial effects: When the circuit board with this structure is not in use, the inserts and fins completely overlap, and dust cannot enter the gaps between the inserts or fins. When in use, the inserts slide out of the gaps between the fins and the fan starts. At this time, the heat generated by the chip is transferred to the heat pipe, and the heat pipe transfers it to the fins and inserts. The airflow flows in from the gap between the inserts and the fins to complete the heat exchange, and then flows out from the top. When the airflow passes through the gap between the inserts and the fins, if some dust sticks to the gap, when the insert is inserted into the fin again, the dust in the gap will also be pushed away. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional schematic diagram of an embodiment of the present invention in an inactivated state.

[0015] Figure 2 for Figure 1 sectional view of .

[0016] Figure 3 A schematic diagram of the radiator base.

[0017] Figure 4 Schematic diagram of the coordination between the driving mechanism and the rotating part.

[0018] Figure 5 It is a three-dimensional schematic diagram of the startup state of an embodiment of the present invention.

[0019] In the figure: 1. PCB board, 11. Chip, 12. Components, 2. Radiator, 21. Base, 211. Fin group, 212. Fan, 2a. Fin, 3. Heat pipe, 4. Rotating part, 41. Ring plate, 411. Baffle, 42. Insert, 421. Arc groove, 5. Driving mechanism, 51. Iron block, 52. Electromagnet. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0022] See also Figure 1-5 A dust-proof circuit board includes a PCB board 1 on which a chip 11 and components 12 are arranged.

[0023] A heat sink 2 is located above the chip 11. The heat sink 2 is made of aluminum and includes a base 21, a fin assembly 211 mounted on the base 21, and a fan 212. There is a gap between two adjacent fin assemblies 211. There is a gap between the fins 2a on each fin assembly 211. There are two fin assemblies, which are positioned opposite each other. The fin assemblies are fan-shaped, and the curvature of the fins is greater than 90 degrees and less than 100 degrees.

[0024] The bottom of the base 21 contacts the chip 11 , and a heat pipe 3 made of copper is provided on the base 21 . The heat pipe 3 passes through all the fin groups 211 upwards, and the fan 212 is located in the middle of the fin group 211 .

[0025] It also includes a rotating member 4 and a driving mechanism 5 for driving the rotating member 4 to rotate.

[0026] The rotating member 4 includes an annular plate 41, which is rotatably connected to the base 21. Two vertically arranged baffles 411 are fixed to the annular plate 41, and inserts 42 are fixed to the baffles 411. The inserts are provided with arcuate grooves 421, the axes of which are coaxial with the axes of the fins 2a. When the inner ends of the arcuate grooves 421 contact the heat pipes 3, the inserts and fins completely overlap.

[0027] The inserts 42 are inserted into the gaps between the fins 2a, with the front and back surfaces of each insert 42 contacting each fin 2a. When the chip is not powered, the drive mechanism drives the rotating member to insert the inserts into the fin assembly, completely overlapping the inserts and fins. When the circuit board is powered, the drive mechanism drives the rotating member to slide the inserts out of the fin assembly. A stopper 21a is placed on the end of the fin assembly 211 not being inserted by the insert. The stopper is primarily intended to prevent dust from entering the fin assembly through the arcuate groove 421.

[0028] The drive mechanism 5 includes an iron block 51 and electromagnets 52. There is one iron block 51 fixed to the bottom of the annular plate 41, and three electromagnets 52, multiple of which are arranged around the annular plate on the base. During operation, the three electromagnets are energized sequentially, starting with the one closest to the iron block, followed by the middle electromagnet, and then the farthest electromagnet. As each electromagnet is energized, it attracts the iron block 51 to a position directly opposite the corresponding electromagnet, thereby driving the rotating member to rotate.

[0029] When the circuit board with this structure is not in use, the inserts and fins completely overlap, and dust cannot enter the gaps between the inserts or fins. When in use, the inserts slide out of the gaps between the fins and the fan starts. At this time, the heat generated by the chip is transferred to the heat pipe, and the heat pipe transfers it to the fins and inserts. The airflow flows in from the gap between the inserts and the fins to complete the heat exchange, and then flows out from the top. When the airflow passes through the gap between the inserts and the fins, if some dust sticks to the gap, when the insert is inserted into the fin again, the dust in the gap will also be pushed away.

Claims

1. A dust-proof circuit board, comprising a PCB, a chip and components disposed on the PCB, a heat sink disposed above the chip, the heat sink comprising a base, a fin group disposed on the base, and a fan, wherein a gap exists between two adjacent fin groups, and a gap exists between the fins on each fin group, the bottom of the base contacts the chip, a heat pipe is provided on the base, the heat pipe passes upward through all the fin groups, and the fan is located in the middle of the fin group, characterized in that: It also includes a rotating member and a driving mechanism for driving the rotating member to rotate. The bottom of the rotating member is rotatably connected to the base. The rotating member is provided with an insert, which is inserted into the gap between the fins. The front and back sides of each insert are in contact with each fin respectively. When the chip is not powered on, the driving mechanism drives the rotating member to insert the insert into the fin group, and the insert and the fin are completely overlapped. When the chip is powered on, the driving mechanism drives the rotating member to slide the insert out of the fin group.

2. The dust-proof circuit board according to claim 1, characterized in that: There are two fin groups, and the two fin groups are arranged opposite to each other.

3. The dust-proof circuit board according to claim 1, characterized in that: The fin group is in a fan ring shape, and the curvature of the fin is greater than 90 degrees and less than 100 degrees.

4. The dust-proof circuit board according to claim 3, characterized in that: The insert is provided with an arc-shaped groove, and the axis of the arc-shaped groove is coaxial with the axis of the fin.

5. The dust-proof circuit board according to claim 4, characterized in that: When the inner end of the arc-shaped groove contacts the heat pipe, the insert and the fin completely overlap.

6. The dust-proof circuit board according to claim 5, characterized in that: The fin group is provided with a stopper on one end not inserted by the insert.

7. The dust-proof circuit board according to claim 1, characterized in that: The rotating member includes an annular plate, which is rotatably connected to the base. Two vertically arranged baffles are fixed on the annular plate, and inserts are fixed on the baffles.

8. The dust-proof circuit board according to claim 7, characterized in that: The driving mechanism includes an iron block and an electromagnet. The iron block is fixed to the bottom of the annular plate. There are multiple electromagnets, which are arranged on the base around the annular plate.

9. The dust-proof circuit board according to claim 8, characterized in that: The heat sink is made of aluminum, and the heat pipe is made of copper.

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