Chip testing handler

Abstract

The application provides a chip test sorting machine, which is provided with a test sorting chamber and a flow transfer device arranged in the test sorting chamber. The flow transfer device is provided with a transfer station arranged on the front side in the Y direction, and a test mechanism is arranged at the back of the transfer station. The chip test sorting machine is provided with an overhead transfer mechanism and a shuttle transfer mechanism with at least two layers of loading plates. In the transfer station, the loading plate on the higher layer is closer to the feeding mechanism than the loading plate on the lower layer. The overhead transfer mechanism is provided with a moving assembly which can move in the X-Y-Z direction and is used for adsorbing and placing the chip and the loading plate. At least one overhead transfer mechanism and one shuttle transfer mechanism are used to realize the whole flow process of the chip and the loading plate, so that the mechanical structure of the chip test sorting machine is greatly simplified, the manufacturing cost is reduced, the transfer stroke is short, the transfer time is saved, and the test efficiency of the chip is improved. In the running stage, the feeding channel and the discharging channel of the feeding mechanism and the discharging mechanism are closed, so that the constant temperature effect is enhanced and the energy consumption is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip testing, in particular to a chip testing handler. BACKGROUND

[0002] The three-temperature testing handler is a device for testing semiconductor chips or related components under different temperature environments, which simulates low temperature, normal temperature and high temperature environments to evaluate the performance and service life of the chips under various working conditions, so as to ensure that the chips can maintain stable performance under various temperature changes in actual application after being packaged and sold.

[0003] Due to the limitations of conventional layout and conventional structure, the current three-temperature testing handler has the following problems: in order to facilitate the loading and unloading of the tray, the loading and unloading channel of the existing material bin is generally open relative to the cover of the handler, which leads to high energy consumption and easy entry of external air into the testing and sorting room, resulting in high humidity inside the testing and sorting room and frost formation under low temperature conditions; the horizontal layout area inside the handler is large, generally uses different loading and unloading assemblies to load and unload the chips respectively, and separately uses a set of tray moving arms to transfer the tray, which leads to high cost of the flow transfer device for chip and tray transfer, and many steps of connection of multiple loading and unloading assemblies and long transfer path; meanwhile, the large horizontal layout area leads to large equipment size, high transportation, installation and operation cost.

[0004] It should be noted that the above introduction to the background art is only for the convenience of clearly and completely describing the technical solutions of the present application and facilitating the understanding of those skilled in the art. The above technical solutions cannot be considered as known to those skilled in the art just because they are described in the background art part of the present application. SUMMARY

[0005] The present application aims to disclose a chip testing handler with compact structure, high transfer efficiency and low cost and operation cost.

[0006] To achieve the above-mentioned purpose, the present application provides a chip testing handler, which is configured with a testing and sorting room and a flow transfer device arranged in the testing and sorting room, the flow transfer device comprising a feeding mechanism, a receiving mechanism, a pre-warming mechanism and a transfer station arranged in the front functional area of the Y-direction of the carrier, a testing mechanism arranged in the rear functional area of the Y-direction of the carrier and located directly behind the transfer station, and a shuttle moving mechanism and an overhead transfer mechanism arranged in the carrier.

[0007] The shuttle transfer mechanism is configured to carry at least two layers of chip-carrying trays, and the trays are configured to reciprocate between the transfer station and the testing mechanism, and at the transfer station, the higher layer of the trays is closer to the feeding mechanism and the collecting mechanism than the lower layer of the trays.

[0008] The overhead transfer mechanism is configured with a moving assembly which is arranged overhead of the functional area in front of the Y direction of the platform and moves along the X-Y direction, and the moving assembly is configured with a chip pick-and-place assembly which can be lifted along the Z direction and a tray pick-and-place assembly for picking and placing the trays.

[0009] The testing and sorting chamber is a closed structure, and during the operation stage, the feeding and discharging channels of the feeding mechanism and the collecting mechanism are closed relative to the testing and sorting chamber.

[0010] As a further improvement of the present application, the shuttle transfer mechanism is configured with a temperature control assembly connected with at least one layer of the trays, and the height of the tray configured with the temperature control assembly in the Z direction is lower than that of the tray not configured with the temperature control assembly.

[0011] As a further improvement of the present application, the pre-warming mechanism, the shuttle transfer mechanism and the testing mechanism are all provided with temperature control assemblies, so that the chips pre-warmed by the pre-warming mechanism can be kept under temperature control during the process of being transferred from the shuttle transfer mechanism to the testing mechanism for testing.

[0012] As a further improvement of the present application, the temperature control assembly includes a refrigeration unit and a heating unit, and the heating unit is closer to the element to be controlled in the corresponding mechanism relative to the refrigeration unit.

[0013] As a further improvement of the present application, the temperature control assembly includes a refrigeration unit, and the chip testing and sorting machine is configured with a refrigeration system connected with the refrigeration unit, and the chip testing and sorting machine is further configured with an air drying device for drying the external air and then introducing the dried air into the interior of the testing and sorting chamber.

[0014] As a further improvement of the present application, the flow transfer device is configured with a height measuring sensor assembly arranged in the Y direction in front of the testing mechanism, and the height of the end face of the lowest end of the height measuring sensor assembly is higher than the height of the upper end face of the uppermost layer of the trays.

[0015] As a further improvement of the present application, the testing mechanism is configured with a testing seat and a floating testing module arranged above the testing seat, the floating testing module is configured with a suction member for sucking chips, and the trays are configured to carry chips and can penetrate between the testing seat and the floating testing module, and at the testing station, the chips are switched and transferred between the at least two layers of the trays and the testing seat by the suction member.

[0016] As a further improvement of the present application, the transferring device comprises a tray temporary station arranged at the front side functional area of the Y direction of the carrier, and the temporary station is arranged between the pre-warming mechanism and the tray temporary station in the X direction;

[0017] The feeding mechanism and the collecting mechanism are both provided with a tray storage bin, a lifting mechanism arranged below the storage bin for driving the tray to lift and fall, and a positioning assembly for positioning when the top tray is lifted to a preset position;

[0018] The positioning assembly comprises a support arranged at both sides of the X direction of the top of the storage bin, an end positioning member arranged at the front end of the Y direction of the storage bin, and / or a side positioning member arranged at one side of the X direction of the storage bin.

[0019] As a further improvement of the present application, the moving assembly is configured with at least two groups of chip taking and placing assemblies and an X direction sliding rail which can lift along the Z direction, wherein at least one group of the chip taking and placing assemblies is slidingly connected to the X direction sliding rail, and the sliding stroke of the chip taking and placing assemblies on the X direction sliding rail is controlled to adjust the spacing between adjacent chip taking and placing assemblies.

[0020] As a further improvement of the present application, the overhead transferring mechanism is configured with an X-Y axis guide frame, which comprises a Y axis guide assembly arranged at the carrier and an X axis guide assembly connected to the Y axis guide assembly in an overhead manner, and the moving assembly is arranged at the X axis guide assembly.

[0021] The X axis guide assembly is configured with a vacuum generator, the chip taking and placing assembly and the tray taking and placing assembly are both configured with an adsorption module and a Z axis driving assembly for driving the adsorption module to move up and down along the Z axis, and the adsorption module is provided with a vacuum source for adsorption by the vacuum generator.

[0022] The tray taking and placing assembly is configured with a tray adsorption module, and the central area of the tray is provided with an adsorption part for positioning adsorption of the tray adsorption module.

[0023] Compared with the prior art, the present application has the following beneficial effects:

[0024] The chip testing and sorting machine provided by the application has the advantages that the feeding mechanism, the material collecting mechanism, the pre-warming mechanism and the transfer station are arranged on the Y front side functional area of the loading table, the overhead transfer mechanism is arranged above the Y front side functional area to transfer the chips and the material tray, the testing mechanism is arranged on the rear side functional area and at the back of the transfer station, and at least two layers of the material tray which can be connected with the overhead transfer mechanism are arranged to shuttle between the transfer station and the testing mechanism to realize the transmission of the chips before and after the testing, so that the structure is compact and the transfer efficiency is high. Only one overhead transfer mechanism and one shuttle transfer mechanism are needed to realize the whole process of the chips and the material tray in the chip testing, the mechanical structure of the testing and sorting machine is greatly simplified, the manufacturing cost is reduced, the moving stroke of the overhead transfer mechanism and the shuttle transfer mechanism is short, the transfer time is saved, and the testing efficiency of the chips is improved.

[0025] In another aspect, the chip testing and sorting machine sets the feeding and discharging channels of the feeding mechanism and the material collecting mechanism as the opening and closing structure relative to the testing and sorting chamber, the feeding and discharging channels of the feeding mechanism and the material collecting mechanism are closed during the operation of the equipment, the loss of the preset temperature gas in the testing and sorting chamber is realized as much as possible, the efficiency of the constant temperature is enhanced, and the energy consumption is reduced as much as possible. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The overall schematic view of the chip testing and sorting machine provided by the embodiment of the application is shown in the figure;

[0027] Figure 2 The exploded view of the structure of the chip testing and sorting machine is shown in the figure;

[0028] Figure 3 The layout schematic view of the flow transfer device in the chip testing and sorting machine provided by the application is shown in the figure;

[0029] Figure 4 The structure schematic view of the flow transfer device in the chip testing and sorting machine provided by the application is shown in the figure;

[0030] Figure 5 The structure schematic view of the flow transfer device provided by the application is shown in the figure; Figure 4 The structure schematic view of the flow transfer device provided by the application is shown in the figure;

[0031] Figure 6 The structure schematic view of the feeding mechanism and the material collecting mechanism provided by the application is shown in the figure;

[0032] Figure 7 The top view structure schematic view of the material tray is shown in the figure;

[0033] Figure 8 The structure schematic view of the pre-warming mechanism is shown in the figure;

[0034] Figure 9 The structure schematic view of the pre-warming mechanism is shown in the figure; Figure 5 The enlarged schematic view of the shuttle transfer mechanism is shown in the figure;

[0035] Figure 10 A shuttle transfer mechanism provided by the present application is configured with two carrier plates as an embodiment, and the side view of the carrier plate configuration mode in the transfer station and the test station is shown;

[0036] Figure 11 A structure diagram of an overhead transfer mechanism provided by the present application is shown;

[0037] Figure 12 A structure diagram of a second moving assembly in the overhead transfer mechanism provided by the present application is shown. DETAILED DESCRIPTION

[0038] The present application will be described in detail below in conjunction with the embodiments shown in the drawings, but it should be noted that these embodiments are not a limitation on the present application, and equivalent transformations or substitutions of function, method, or structure made by those of ordinary skill in the art based on these embodiments are within the scope of the present application.

[0039] In the three-dimensional coordinate system involved in the drawings, the direction of the X-axis corresponds to the horizontal transverse direction of the present embodiment, the direction of the Y-axis corresponds to the horizontal longitudinal direction of the present embodiment, and the direction of the Z-axis corresponds to the vertical direction, i.e., the height direction, of the present embodiment.

[0040] In conjunction with Figure 1 and Figure 2 As shown in the drawings, the present application provides a chip testing and sorting machine 900, which is constructed with a testing and sorting chamber 901 and an auxiliary equipment chamber 902, wherein the testing and sorting chamber 901 is closed on the bottom surface, the peripheral surface, and the top surface by the structure of the machine cover 91 and the internal panel thereof, so as to maintain the constant temperature of the testing and sorting chamber 901 at a lower energy consumption. The feeding mechanism 10 and the material collecting mechanism 50 are arranged in the testing and sorting chamber 901, and the feeding and discharging channels of the feeding mechanism 10 and the material collecting mechanism 50 are arranged to be open and closed relative to the testing and sorting chamber 901. For example, a drawer panel 150 is arranged on the Y-direction front side of the machine cover 91, and the drawer panel 150 is in a closed state relative to the Y-direction front panel of the machine cover 91 during the operation of the equipment, so as to reduce the loss of the preset temperature gas in the testing and sorting chamber 901 during the operation stage of the equipment and enhance the constant temperature efficiency.

[0041] In conjunction with Figures 2 to 4 As shown in the drawings, the flow transfer device 100 is arranged in the testing and sorting chamber 901, and the chips are preheated, tested, screened, and classified through the flow transfer of the chips on the flow transfer device 100.

[0042] The flow transfer device 100 is configured with a first functional area, a second functional area and a third functional area arranged in sequence along the Y direction. The first functional area is provided with a feeding station for feeding chips and at least two collecting stations for collecting chips in sequence along the X direction. The second functional area is provided with a pre-warming station for pre-warming chips, a transfer station for transferring chips before and after testing, and a temporary storage station for temporarily storing a tray in sequence along the X direction. The third functional area is provided with a testing station for testing chips.

[0043] The feeding station is provided with a feeding mechanism 10, the pre-warming station is provided with a pre-warming mechanism 20, the testing station is provided with a testing mechanism 30, the temporary storage station is provided with a tray temporary storage mechanism 40, and the collecting station is provided with a collecting mechanism 50.

[0044] In the embodiment, due to the influence of the mechanical mechanism, the feeding mechanism 10, the collecting mechanism 50, the pre-warming mechanism 20 and the tray temporary storage mechanism 40 have a relatively low height in the Z direction, while the testing mechanism 30 has a relatively high height in the Z direction and cannot take and place chips from above the testing mechanism 30. In order to reasonably and compactly arrange each functional area and enable chips (not shown) and the tray 80 to be transferred between multiple stations through as few transfer mechanisms as possible, the flow transfer device 100 provided by the application is provided with a transfer station between the pre-warming station and the temporary storage station of the second functional area, and the testing station is arranged at the back of the transfer station along the Y direction. Thus, the chip can be reciprocally transferred between the transfer station and the testing station through only one shuttle transfer mechanism 60, and the shuttle transfer mechanism 60 is configured to also have a relatively low height in the Z direction. Further, the chip and the tray 80 can be efficiently transferred between the feeding mechanism 10, the pre-warming mechanism 20, the shuttle transfer mechanism 60, the tray temporary storage mechanism 40 and the collecting mechanism 50 through only one gantry structure overhead transfer mechanism 70.

[0045] In an embodiment, the functional mechanisms on the feeding station, the collecting station, the pre-warming station, the transfer station, the testing station, the temporary storage station, the overhead transfer mechanism 70 and the shuttle transfer mechanism 60 can be arranged on the same carrier.

[0046] In another embodiment, for example, due to the fact that lifting mechanisms 12 are arranged below the feeding mechanism 10 and the collecting mechanism 50, the relative height of the feeding mechanism 10 and the collecting mechanism 50 is relatively high. In order to reduce the displacement of the overhead transfer mechanism 70 in the Z direction during transfer, two carriers with a height difference between the front and back sides can be arranged to reduce the relative height difference between the feeding mechanism 10 and the collecting mechanism 50 and the pre-warming mechanism, the shuttle transfer mechanism 60 and the tray temporary storage mechanism 40. Specifically, referring to FIG. 2, the feeding mechanism 10 and the collecting mechanism 50 are arranged on the first carrier 110, and the pre-warming mechanism 20, the shuttle transfer mechanism 60 and the tray temporary storage mechanism 40 are arranged on the second carrier 120. The first carrier 110 and the second carrier 120 are arranged in sequence along the Y direction, and the first carrier 110 is arranged in front of the second carrier 120 along the X direction. Figure 4As shown, the front side region is provided with the first carrier 110, and the rear side region is provided with the second carrier 120, the height of the first carrier 110 in the Z direction is lower than the height of the second carrier 120 in the Z direction, the first carrier 110 is used to realize the arrangement of the workstations and the functional mechanisms of the first functional area, and the second carrier 120 is used to realize the arrangement of the workstations and the functional mechanisms of the second functional area.

[0047] In combination with Figure 2 , Figure 4 and Figure 6 , the feeding mechanism 10 and the collecting mechanism 50 are both provided with a magazine for placing the tray 80, the magazine of the feeding mechanism 10 is defined as the feeding magazine 101, and the magazine of the collecting mechanism 50 is defined as the collecting magazine 501.

[0048] Before the operation of the flow transfer device 100, the corresponding drawer panel 150 of the feeding mechanism 10 and the collecting mechanism 50 is opened, and the tray 80 carrying the to-be-tested chip is placed in the feeding magazine 101 in advance, and a plurality of trays 80 are preferably stacked and placed during feeding, so as to reduce the number of feeding and unloading. Only one empty tray 80 needs to be placed in each collecting magazine 501 in advance, and during the operation process, when the tray 80 in the collecting magazine 501 is full of chips, the empty tray 80 is supplemented by the flow transfer device 100, and the supplemented empty tray 80 is stacked on the upper layer of the full tray 80.

[0049] In an embodiment, the flow transfer device 100 is further provided with a plurality of lifting mechanisms 12 for driving the tray 80 in the magazine of the feeding mechanism 10 and the collecting mechanism 50 to lift. The plurality of lifting mechanisms 12 are arranged below the feeding magazine 101 and the collecting magazine 501. The lifting mechanism 12 arranged below the feeding mechanism 10 can push the whole stack of trays 80 upwards from the bottommost tray 80, so as to push the topmost tray 80 to a preset height; the lifting mechanism 12 arranged below the feeding mechanism 10 can support the whole stack of trays 80 from the bottommost tray 80, and lower the topmost tray 80 to a preset height. For example, the lifting mechanism 12 is provided with a lifting plate 121 that can lift in the Z direction, the lifting plate 121 can penetrate through the bottom of the feeding magazine 101 or the collecting magazine 501, the bottommost tray 80 is placed on the upper end face of the lifting plate 121, so as to realize the lifting of the whole stack of trays 80 by the lifting plate.

[0050] Both the feeding mechanism 10 and the receiving mechanism 50 are equipped with a positioning assembly 13 for supporting and positioning the topmost material tray 80 when it is raised to a preset position. This assembly is suitable for various sizes of material trays 80 and provides high positioning stability. In one embodiment, the positioning assembly 13 includes a plurality of support members 131 arranged on both sides of the top of the silo in the X direction and an end positioning member 132 arranged at the front end of the silo in the Y direction. The support members 131 are used to support the topmost material tray 80, and the end positioning member 132 can move relative to the silo in the Y direction to move away from or closer to the end of the material tray 80. Furthermore, the positioning assembly 13 can also be equipped with a side positioning member 133 located on one side of the silo in the X direction. The side positioning member 133 can move relative to the silo in the X direction to move away from or closer to the side of the material tray 80.

[0051] The circulation device 100 is equipped with at least two receiving stations, that is, at least two receiving mechanisms 50. For example, in one embodiment, the circulation device 100 is equipped with three receiving mechanisms 50, wherein the first receiving mechanism 51 is used to receive chips that meet the inspection standards, the second receiving mechanism 52 is used to receive chips that do not meet the inspection standards, and the third receiving mechanism 53 is used as a backup. For example, the third receiving mechanism 53 can cooperate with the first receiving mechanism 51 to receive chips that meet the inspection standards.

[0052] Ginseng Figure 7 As shown, the material tray 80 is used to carry chips in batches, and a plurality of first receiving grooves 811 for accommodating chips are configured on the material tray 80, and the first receiving grooves 811 are arranged in an array along the X and Y directions. For material trays 80 of the same specifications, the sizes of the first receiving grooves 811 are preferably the same, so as to carry chips that match the size of the first receiving grooves 811 in batches. The spacing between adjacent first receiving grooves 811 is also preferably the same to facilitate the batch loading and unloading and transfer of chips. The first receiving groove 811 has an annular first positioning structure 812 for positioning the chip. Furthermore, the central area of ​​the material tray 80 is also provided with an adsorption portion 821, for example, formed by an annular second positioning structure 822, which is used for positioning the material tray 80 when the overhead transfer mechanism 70 adsorbs it.

[0053] Combine Figure 4 、 Figure 5 and Figure 8As shown, the pre-warming mechanism 20 is configured with a pre-warming plate 21, a first fixing seat 22 for placing the pre-warming plate 21, and a first temperature control assembly for temperature control of the pre-warming plate 21. The first temperature control assembly includes a first refrigeration unit 24 for refrigeration of the pre-warming plate 21 and a first heating unit 23 for heating of the pre-warming plate 21. When the chip is tested at low temperature, the pre-warming plate 21 is refrigerated by the first refrigeration unit 24 to provide a low temperature environment (generally below 0°C) for the chip placed on the pre-warming plate 21; when the chip is tested at high temperature, the pre-warming plate 21 is heated by the first heating unit 23 to provide a high temperature environment (generally higher than the normal temperature 25°C) for the chip placed on the pre-warming plate 21.

[0054] In an embodiment, the first refrigeration unit 24, the first heating unit 23, and the pre-warming plate 21 are stacked from bottom to top along the Z direction, wherein the first refrigeration unit 24 is fixedly arranged on the first fixing seat 22. The first refrigeration unit 24 is internally configured with a refrigeration flow channel for circulation of refrigerant, and the input and output ports of the refrigeration flow channel are connected with the refrigeration system 90 to provide refrigerant at a preset temperature. The first heating unit 23 includes a heating plate and a plurality of groups of resistance wires uniformly arranged on the heating plate. The first heating unit 23 is arranged above the first refrigeration unit 24, i.e., the first heating unit 23 is arranged closer to the pre-warming plate 21, so that the temperature of the pre-warming plate 21 can be better controlled. For example, the preset pre-warming temperature is -40°C, and the temperature of the previous test is -45°C, so the temperature of the pre-warming plate 21 can be directly heated to -40°C by the heating plate, which has a faster temperature control rate than adjusting the temperature of the refrigerant of the first refrigeration unit 24.

[0055] The pre-warming plate 21 is provided with a plurality of second accommodating grooves 211 for accommodating chips, and the second accommodating grooves 211 are arranged in an array along the X direction and the Y direction. For the same size of the pre-warming plate 21, the sizes of the second accommodating grooves 211 are preferably the same to batch pre-warm chips of the same size. The spacing between adjacent second accommodating grooves 211 is also preferably the same to facilitate positioning calculation when the chips are transferred.

[0056] In order to make the flow transfer device 100 applicable to the testing of chips of various sizes, in an embodiment, the pre-warming plate 21 is detachable relative to the first fixing seat 22, so that different sizes of pre-warming plates 21 can be used for pre-warming according to different sizes of chips.

[0057] In combination with Figure 3 , Figure 5 , Figure 9 and Figure 10As shown, the shuttle transfer mechanism 60 comprises a first moving assembly 602 arranged on the Y-direction guide rail assembly 601, and the first moving assembly 602 is configured to reciprocate between the transfer station and the test station. The first moving assembly 602 is configured to arrange at least two layers of the tray 61, and the at least two layers of the tray 61 do not have overlapping areas in the Z-direction, so as to avoid interference between the trays 61 during reciprocation. At least one of the trays 61 is used to place the chips to be tested, and the chips to be tested herein refer to the chips that are transferred to the first moving assembly 602 from the pre-warming tray 21 and further need to be transferred to the test mechanism 30 for testing. At least one of the trays 61 is used to place the tested chips, and the tested chips herein refer to the chips that are transferred to the first moving assembly 602 from the test mechanism 30 and further need to be transferred to the material receiving mechanism 50 for material receiving.

[0058] The upper surface of the tray 61 is concave to arrange the third accommodation grooves 610 for accommodating the chips, and the third accommodation grooves 610 can be arranged in multiple rows along the X-direction or multiple rows along the Y-direction. In order to facilitate measurement of the flatness of the chips placed in the tray 61, preferably, a plurality of height measuring sensors 302 are fixed to the Y-direction front side of the support 301 of the test mechanism 30, and the height measuring sensors 302 can move along the Y-direction. In the debugging stage, the tray 61 is moved to the Y-direction front side of the support 301, the position of the height measuring sensor 302 is adjusted transversely, the relative height of the tray 61 and the relative height before and after the chips are placed in the third accommodation grooves 610 are measured, and the test data is transmitted to the control system.

[0059] In an embodiment, the first moving assembly 602 is configured to arrange a base (not shown) for fixing and sliding the tray 61, and the base is slidingly connected to the Y-direction guide rail assembly 601. For the same specification of the tray 61, the size and spacing of the third accommodation grooves 610 are preferably the same. In order to make the flow device 100 applicable to the test of chips of various specifications, the tray 61 is preferably detachable relative to the base, so as to adopt different specifications of the tray 61 to carry different specifications of the chips.

[0060] To prevent rapid temperature loss during the transfer of preheated chips from the carrier 61 to the test station for testing, in one embodiment, the first moving assembly 602 is further configured with a second temperature control assembly (not shown) for controlling the temperature of the carrier 61. The second temperature control assembly includes a second cooling unit (not shown) and a second heating unit (not shown). When performing low-temperature testing on the chips, the second cooling unit provides the same low temperature as the preheating plate 21 to the chips on the carrier 61, allowing the chips to maintain a constant low temperature during transfer from the carrier 61 to the test station, thereby shortening the temperature adjustment time required by the test mechanism 30 during testing. When performing high-temperature testing on the chips, the second heating unit provides the same high temperature as the preheating plate 21 to the chips on the carrier 61, allowing the chips to maintain a constant high temperature during transfer from the carrier 61 to the test station, thereby shortening the temperature adjustment time required by the test mechanism 30 during testing.

[0061] During the transfer station, the projections of at least two layers of carriers 61 on the XY plane do not overlap. The carrier 61 located on the Y-forward side is higher than the carrier located on the Y-rearward side, preventing interference with the overhead transfer mechanism 70 during transfer. Furthermore, the lower layer of carriers 61 is configured to receive chips under test that have been preheated on the preheating plate 21, while the upper layer of carriers 61 is configured to receive tested chips. When removing tested chips, the overhead transfer mechanism 70 has a relatively short docking distance with the upper layer of carriers 61. A second temperature control assembly (not shown) need only be positioned below the lower layer of carriers 61 that support the chips under test. Its structural arrangement mirrors the arrangement of the first temperature control assembly below the preheating plate 21.

[0062] Specifically, for example, combining Figure 9 and Figure 10 The diagram illustrates a two-layer carrier 61 configuration. At the transfer station, the shorter carrier 61 is positioned on the Y-axis rearward, defined as the lower carrier 611. The taller carrier 61 is positioned on the Y-axis forward, defined as the upper carrier 612. The lower carrier 611 is mounted on a first base 6110, while the upper carrier 612 is mounted on a second base 6120. The Y-guide rail assembly 601 is configured with a first Y-guide rail 6011 and a second Y-guide rail 6012. The first base 6110 is slidably connected to the first Y-guide rail 6011, the second Y-guide rail 6012 is fixed to the first base 6110, and the second base 6120 is slidably connected to the second Y-guide rail 6011. Two independent drive mechanisms drive the displacement of the first base 6110 and the second base 6120, respectively, thereby controlling the reciprocating movement of the lower carrier 611 and the upper carrier 612 between the transfer station and the testing station according to a predetermined travel range.

[0063] In other alternative embodiments, the first moving assembly 602 can also be configured with three or more carrier plates 61, and the switching mode of movement between the plurality of carrier plates 61 can be configured according to actual needs.

[0064] In combination Figures 4 to 5 As shown, the testing mechanism 30 includes a testing seat 31 and a floating testing module 32 located above the testing seat 31. The testing seat 31 is connected to a testing device (not shown) for realizing the testing and verification of the chips. During the testing of the chips, the floating testing module 32 is pressed against the testing seat 31 to press the chips between the lower end surface of the floating testing module 32 and the testing seat 31, so as to provide a certain pressure to the chips to be tested, thereby ensuring the stability of the testing and the reliability of the data. The floating testing module 32 is fixed to the bracket 301. Due to the reasons that the floating testing module 32 needs to be arranged in the air above the testing seat 31 along the Z direction, the floating testing module 32 needs to move up and down by arranging the Z direction guide rail, and the like, the testing mechanism 30 has a relatively high relative height along the Z direction.

[0065] The floating testing module 32 is configured with a suction accessory (not shown) for adsorbing the chips. After a batch of chips are tested, the first moving assembly 602 is moved to between the testing seat 31 and the floating testing module 32. The tested chips on the testing seat 31 are first adsorbed into the third accommodation groove 610 of the carrier plate 61 by the suction accessory, and then the chips to be tested in another third accommodation groove 610 of the carrier plate 61 are adsorbed onto the testing seat 31 by the suction accessory. At the same time, a stable pressing force is provided to the chips on the testing seat 31 during the testing of the chips on the testing seat 31.

[0066] In the above embodiment of the double-layer tray setting, the upper tray 612 and the lower tray 611 can be cooperated for chip test transfer in the following manner: when a batch of chips is tested, the chips on the tray 80 in the feeding mechanism 10 are transferred to the pre-warming tray 21 by the chip pick-and-place assembly 71, and then the pre-warmed chips are first transferred to the lower tray 611 by the chip pick-and-place assembly 71, and the lower tray 611 carrying the chips and the upper tray 612 are both pre-moved to the rear side along the Y direction to a position close to the test seat 31; when the test of the batch of chips is completed, the tested chips on the test seat 31 are first adsorbed by the suction accessory of the floating test module 32, and then the upper tray 612 and the lower tray 611 are moved in a stacked manner to between the test seat 31 and the floating test module 32, the tested chips on the test seat 31 are placed in the third accommodating groove 610 of the upper tray 612 by the suction accessory of the floating test module 32, the upper tray 612 is moved to the rear side along the Y direction to the initial position of the transfer station, the floating test module 32 adsorbs the chips in the third accommodating groove 610 of the lower tray 611 to the test seat 31, the lower tray 611 is moved to the front side along the Y direction to reset to the initial position of the transfer station, and the tested chips on the upper tray 612 are transferred to the tray 80 of the corresponding material receiving bin 501 according to the test results by the chip pick-and-place assembly 71, so as to complete one moving cycle of the shuttle transfer mechanism 60 for transferring the tested chips and the chips to be tested between the transfer station and the test station.

[0067] When the lower tray 611 and the upper tray 612 are reset to the transfer station, the tested chips on the upper tray 612 are transferred to the tray 80 of the corresponding material receiving bin 501 according to the test results by the chip pick-and-place assembly 71, and then the next batch of chips to be tested pre-warmed from the pre-warming tray 21 are transferred to the lower tray 611.

[0068] In an embodiment, the floating test module 32 is further provided with a third temperature control assembly (not shown) for temperature control of the suction accessory, which includes a third refrigeration unit and a third heating unit. During testing, the floating test module 32 is pressed against the upper end surface of the chip, and when the chip is tested at low temperature, the suction accessory is controlled at low temperature by the third refrigeration unit to provide the chip with a low temperature matching the preset low temperature test condition; when the chip is tested at high temperature, the floating test module 32 is controlled at high temperature by the third heating unit to provide the chip with a high temperature matching the preset high temperature test condition. The third temperature control assembly is arranged above the suction accessory, and its structure is arranged in the same manner as the first temperature control assembly arranged below the pre-warming tray 21, including the arrangement manner that the third heating unit is closer to the suction accessory than the third refrigeration unit.

[0069] In combination with Figure 4 , Figure 5 ,Figure 11 、 Figure 12 As shown in FIG. 7, the overhead transfer mechanism 70 comprises an X-Y axis guide frame and a second moving assembly 701 arranged on the X-Y axis guide frame. In an embodiment, the X-Y axis guide frame adopts a gantry structure, and is provided with an X-axis guide assembly 702 and a Y-axis guide assembly 703 arranged at at least one end of the X-axis guide assembly 702. The second moving assembly 701 moves above the feeding mechanism 10, the preheating mechanism 20, the shuttle transfer mechanism 60, the tray temporary storage mechanism 40 and the material receiving mechanism 50, and is positioned directly above the suction part of the chip to be tested or the tray 80 to be taken.

[0070] It should be noted that the taking and placing of the tray 80 mentioned in the embodiment refers to the taking and placing of the empty tray 80. When the chips on the uppermost tray 80 of the feeding bin 101 are all detected and transferred to the material receiving mechanism 50, the empty tray 80 is transferred to the tray temporary storage mechanism 40 by the tray taking and placing assembly 72. When the uppermost tray 80 of any material receiving bin 501 of the material receiving mechanism 50 is full of tested chips, the empty tray 80 on the tray temporary storage mechanism 40 is transferred to the uppermost layer of the bin 501 by the tray taking and placing assembly 72. The taking and placing of the tray 80 will be described in detail below. Figure 4 and Figure 5 As shown in FIG. 8, in an embodiment, the tray temporary storage mechanism 40 comprises a third fixed seat (not shown) for placing the empty tray 80, and the third fixed seat is provided with a limiting structure (not shown) for limiting the empty tray 80.

[0071] The second moving assembly 701 is provided with a first base plate 73 slidingly connected to the X-axis guide assembly 702 and a vacuum generator 74 arranged on the first base plate 73. The chip taking and placing assembly 71 and the tray taking and placing assembly 72 are both provided with a suction module and a Z-direction driving assembly for driving the suction module to move up and down along the Z axis, and the vacuum generator 74 provides a vacuum source for the suction module.

[0072] As shown in FIG. 9 and FIG. 10, the chip taking and placing assembly 71 is provided with a first suction module 711 and a first Z-direction driving assembly for driving the first suction module 711 to move along the Z direction. Figure 7 and Figure 12 The first suction module 711 comprises a suction rod 7111, an adapter 7112 arranged at the upper end of the suction rod 7111 and a suction nozzle 7113 arranged at the lower end of the suction rod 7111. The suction rod 7111 is connected to the vacuum generator 74 through the vacuum pipe by the adapter 7112.

[0073] The first suction module 711 comprises a suction rod 7111, an adapter 7112 arranged at the upper end of the suction rod 7111 and a suction nozzle 7113 arranged at the lower end of the suction rod 7111. The suction rod 7111 is connected to the vacuum generator 74 through the vacuum pipe by the adapter 7112.

[0074] In an embodiment, the first Z-direction driving assembly is configured with a first connecting base 712 fixed to the first base plate 73, a first power source 713 fixed to the first connecting base 712, and a first Z-axis transmission assembly. The first Z-axis transmission assembly is in transmission connection between the first power source 713 and the first suction module 711. The first Z-axis transmission assembly drives the first sliding assembly 715 by the first belt assembly 714. The first belt assembly 714 includes a first main belt pulley 7141, a first belt 7142, and a first slave belt pulley 7143. The first sliding assembly 715 includes a first adapter block 7151 and a first slide rod 7152 for connecting the first adapter block 7151 and the suction rod 7111. The first slide rod 7152 is slidingly connected to the first connecting base 712 along the Z-axis.

[0075] The first power source 713 drives the first adapter block 7151 to move up and down along the Z-axis by the first main belt pulley 7141, the first belt 7142, and the first slave belt pulley 7143. The first suction module 711 is synchronously driven to move up and down along the Z-axis by the first sliding assembly 715.

[0076] In an embodiment, the second moving assembly 701 is configured with at least two chip pick-and-place assemblies 71 to simultaneously suction at least two chips. Since the distances between adjacent first accommodation grooves 811 on the tray 80, the distances between adjacent second accommodation grooves 211 on the pre-warming tray 21, and the distances between adjacent third accommodation grooves 610 on the tray 61 are not equal in most cases, if it is required to simultaneously transfer at least two chips between the tray 80, the pre-warming tray 21, the upper tray 612, and the lower tray 611 by at least two chip pick-and-place assemblies 71, the relative distance between the at least two chip pick-and-place assemblies 71 along the X-direction needs to be variable during the transfer.

[0077] Therefore, the second moving assembly 701 is further configured with an X-direction sliding assembly 75. The X-direction guide rail 751 of the X-direction sliding assembly 75 is fixed to the first base plate 73. If N chip pick-and-place assemblies 71 are arranged, N-1 chip pick-and-place assemblies 71 are slidingly connected to the X-direction guide rail 751 of the X-direction sliding assembly 75. The sliding stroke of the chip pick-and-place assemblies 71 on the X-direction guide rail 751 is controlled to adjust the distance between adjacent chip pick-and-place assemblies 71. For example, Figure 12 As shown, two chip pick-and-place assemblies 71 are arranged as an example. The chip pick-and-place assembly 71 on the left side of the X-direction is directly fixed to the first base plate 73. The chip pick-and-place assembly 71 on the right side of the X-direction is connected to the first base plate 73 by the X-direction sliding assembly 75. By driving the chip pick-and-place assembly 71 on the right side of the X-direction to slide along the X-direction, the distance between the two chip pick-and-place assemblies 71 along the X-direction can be adjusted, so that the distance between the two suction nozzles 7113 for suctioning chips along the X-direction can be adjusted.

[0078] The second moving assembly 701 is configured to be docked with the first moving assembly 602 on the transfer station to place the chips to be tested by the chip pick-and-place assembly 71 and transfer the tested chips. The tray pick-and-place assembly 72 is configured to transfer the empty trays 80 on the upper layer of the feeding mechanism 10 to the tray temporary storage mechanism 40 for temporary storage and provide the empty trays 80 for the collecting mechanism 50. The tray pick-and-place assembly 72 is configured with a second suction module 721 and a second Z-direction driving assembly for driving the second suction module 721 to move along the Z-direction.

[0079] The second Z-direction driving assembly is configured with a second power source (not shown) and a second sliding assembly 722 driven by the second power source (not shown), and the second sliding assembly 722 is connected with the second suction module 721 in linkage. The second sliding assembly 722 is arranged along the Z-direction and can move reciprocally along the Z-direction to drive the second suction module 721 to move reciprocally along the Z-direction synchronously. The second suction module 721 is connected to the vacuum generator 74 through a vacuum pipe, and the pick-and-place of the tray 80 is realized through the second suction module 721.

[0080] Specifically, when the second suction module 721 suctions the tray 80, it first needs to be positioned at the suction part 821 in the central region of the tray 80, and then the suction of the tray 80 is realized through the vacuum negative pressure.

[0081] In an embodiment, the second sliding assembly 722 is configured with a second connecting seat (not shown) fixed to the first base plate 73 to drive the second sliding assembly 722 and the second suction module 721 to move in the X-Y direction by the first base plate 73.

[0082] In order to realize the precise control of the displacement of the second moving assembly 701 in the X-direction and the Y-direction, the first distance measuring assembly (not shown) is arranged on the X-axis guide assembly 702, which includes a first displacement sensor arranged at one end of the X-axis guide assembly 702 and a second displacement sensor arranged on the first base plate 73. The relative displacement between the second displacement sensor and the first displacement sensor is calculated to control the movement distance of the second moving assembly 701 in the X-direction. The second distance measuring assembly (not shown) is arranged on the Y-axis guide assembly 703, which includes a third displacement sensor arranged at the limiting end of the Y-axis guide assembly 703 and a fourth displacement sensor arranged at the connecting end of the X-axis guide assembly 702 and the Y-axis guide assembly 703. The relative displacement between the fourth displacement sensor and the third displacement sensor is calculated to control the movement distance of the second moving assembly 701 in the Y-direction.

[0083] The auxiliary equipment room 902 is arranged with a refrigeration system 90, which is composed of a compressor, a condenser, a throttling device, an evaporator, etc. The refrigeration mode of the compressor can be selected according to actual needs. The chip testing and sorting machine 900 can be internally or externally connected with an air drying device (not shown) for drying air outside and then introducing the dried air into the testing and sorting room 901 above, so that the air entering the testing and sorting room 901 is dry air with low dew point, thereby avoiding frost or dew due to local temperature difference in the testing and sorting room 901, which affects the testing of the chip. The testing and sorting room 901 is provided with an air duct (not shown) for uniformly filling the dry air into the testing and sorting room 901, for example, the air duct is arranged at the inner top end of the side panel on both sides of the testing and sorting room 901 in the X direction, the air duct extends in the Y direction, and air outlets are uniformly arranged on the air duct in the extending direction.

[0084] The testing and sorting room 901 is also provided with an electrostatic eliminator (not shown), for example, the electrostatic eliminator is arranged at the top of the Y direction front side area and on the inner side of the support 301 of the testing mechanism, so as to effectively prevent the generation of static electricity in the testing and sorting room 901.

[0085] In combination Figures 1 to 3 As shown, since the height of the mechanisms arranged in the first functional area and the second functional area in the testing and sorting room 901 is lower than the height of the testing mechanism 30 in the third functional area, the testing and sorting room 901 has one accommodation space, and the chip testing and sorting machine 900 provided by the application separates the upper part of the first functional area and the second functional area in the testing and sorting room 901 by a panel or other structural member to form a control room 903, which is used to accommodate a control system, for example, the control system is preferably provided with two controllers, one of which is used for motion control of each mechanism, and the other is used for temperature control. The first temperature control assembly, the second temperature control assembly and the third temperature control assembly are uniformly and coordinately controlled by the controller for temperature control, so as to synchronously control the set testing temperature of the preheating disc 21, the carrier disc 61 and the suction part of the testing mechanism 30. The two controllers are compactly arranged to fully utilize the space, for example, one of the controllers is arranged in the X-Z direction, and the other controller is arranged in the X-Y direction. A cooling fan can be arranged on the top of the corresponding cover 91 of the control room 903 to cool the control room 903.

[0086] The chip testing and sorting machine 900 provided by the application is provided with a group of display panels 921 and instruction input devices 922 on the Y direction front and rear sides of the cover 91, which are used for parameter setting, debugging operation and other operation control of the chip testing and sorting machine 900, and are convenient to operate.

[0087] The above detailed description merely illustrates feasible implementation manners of the present application, and is not intended to limit the protection scope of the present application. Equivalent implementation manners or changes made without departing from the spirit of the present application shall be included in the protection scope of the present application.

[0088] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0089] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be properly combined to form other embodiments which can be understood by those skilled in the art.

Claims

1. A chip test handler characterized by, The test sorting chamber and the flow transfer device arranged in the test sorting chamber are configured, the flow transfer device includes a feeding mechanism, a receiving mechanism, a pre-warming mechanism and a transfer station arranged in the front functional area of the Y direction of the carrier, a test mechanism arranged in the rear functional area of the Y direction of the carrier and located directly behind the transfer station, a shuttle transfer mechanism and an overhead transfer mechanism arranged in the carrier, The shuttle transfer mechanism is configured to carry at least two layers of chip carriers, and the at least two layers of carriers do not have overlapping areas in the Z direction. The carriers are configured to reciprocate between the transfer station and the test mechanism. In the transfer station, the higher layer of the carriers is closer to the feeding mechanism and the receiving mechanism than the lower layer of the carriers. The pre-warming mechanism, the shuttle transfer mechanism and the test mechanism are all provided with temperature control components to control the temperature of the chips pre-warmed by the pre-warming mechanism during the process of transferring the chips to the test mechanism by the shuttle transfer mechanism for testing. The overhead transfer mechanism is provided with a moving component which is arranged above the front functional area of the Y direction of the carrier and moves along the X-Y direction. The moving component is provided with a chip pick-and-place component and a tray pick-and-place component which can be lifted along the Z direction. The test sorting chamber is a closed structure. During the operation stage, the feeding and receiving channels of the feeding mechanism and the receiving mechanism are closed relative to the test sorting chamber.

2. The chip test handler according to claim 1, characterized in that The shuttle transfer mechanism is provided with a temperature control component connected to at least one layer of the carriers. The height of the carrier provided with the temperature control component in the Z direction is lower than that of the carrier not provided with the temperature control component.

3. The chip test handler according to claim 1 or 2, characterized in that The temperature control component includes a refrigeration unit and a heating unit. The heating unit is closer to the temperature-controlled element in the corresponding mechanism than the refrigeration unit.

4. The chip tester handler according to claim 1 or 2, characterized in that, The temperature control component includes a refrigeration unit. The chip test handler is provided with a refrigeration system connected to the refrigeration unit. The chip test handler is also provided with an air drying device for drying external air and then introducing the dried air into the interior of the test sorting chamber.

5. The chip test handler of claim 1, wherein, The flow transfer device is provided with a height measuring sensor component arranged on the front side of the Y direction of the test mechanism. The height of the end face of the bottom end of the height measuring sensor component is higher than the height of the upper end face of the uppermost layer of the carriers.

6. The chip test handler of claim 1, wherein, The test mechanism is provided with a test seat and a floating test module arranged above the test seat. The floating test module is provided with a suction member for sucking chips. The carriers are configured to carry chips and can penetrate between the test seat and the floating test module. In the test station, the chips are switched and transferred between the at least two layers of carriers and the test seat by the suction member.

7. The chip test handler of claim 1, wherein, The flow transfer device includes a tray temporary storage station arranged in the front functional area of the Y direction of the carrier. The transfer station is arranged between the pre-warming mechanism and the tray temporary storage station in the X direction. The feeding mechanism and the receiving mechanism are both provided with a tray warehouse for accommodating trays, a lifting mechanism arranged below the tray warehouse for driving the trays to lift, and a positioning component for positioning when the topmost tray is lifted to a preset position. The positioning assembly comprises support members arranged on both sides of the top of the magazine in the X direction, an end positioning member arranged at the front end of the magazine in the Y direction, and / or a side positioning member arranged on one side of the magazine in the X direction.

8. The chip test handler of claim 1, wherein, The moving assembly is configured with at least two groups of chip pick-and-place assemblies capable of lifting along the Z direction and an X-direction sliding rail, wherein at least one group of the chip pick-and-place assemblies is slidingly connected to the X-direction sliding rail, and the sliding stroke of the chip pick-and-place assemblies on the X-direction sliding rail is controlled to adjust the spacing between adjacent chip pick-and-place assemblies.

9. The chip test handler of claim 1, wherein, The overhead transfer mechanism is configured with an X-Y axis guide frame, which comprises a Y-axis guide assembly arranged on the stage and an X-axis guide assembly connected to the Y-axis guide assembly in an overhead manner, and the moving assembly is arranged on the X-axis guide assembly. The X-axis guide assembly is configured with a vacuum generator, and the chip pick-and-place assembly and the tray pick-and-place assembly are both configured with an adsorption module and a Z-axis driving assembly for driving the adsorption module to move up and down along the Z axis, and the adsorption module is provided with a vacuum source for adsorption by the vacuum generator. The tray pick-and-place assembly is configured with a tray adsorption module, and the central region of the tray is provided with an adsorption part for positioning and adsorption of the tray adsorption module.

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