Processing equipment and processing method of quartz bracket for chip manufacturing process

Abstract

The invention discloses machining equipment and a machining method of a quartz support for a chip manufacturing process, and belongs to the technical field of quartz support machining equipment.The machining equipment is characterized in that the machining equipment comprises a base and further comprises a supporting rod, a driving assembly, a bearing and a grinding assembly; the grinding assembly comprises a rotating disc, a loading disc, a clamping device, a lifting device, a supporting frame and a grinding device, the clamping device is arranged on the loading disc and used for clamping and fixing machined materials, the lifting device is arranged on a supporting rod, the supporting frame is installed on the lifting device, and a mounting plate is arranged at the position, corresponding to the loading disc, of the supporting frame. According to the quartz support machining device, the rotating disc is driven to rotate through the driving assembly, materials can be rapidly switched among the feeding station, the grinding station and the discharging station, the lifting device is matched to drive the grinding device to move up and down for grinding, machining of a quartz support can be efficiently and stably completed, and the machining automation degree and the machining efficiency are improved.

Description

Technical Field

[0001] The present application belongs to the technical field of quartz bracket processing equipment, and in particular relates to a quartz bracket processing equipment and a processing method thereof for a chip manufacturing process. Background Art

[0002] Semiconductor chips are the carriers of precision integrated circuits. The preparation of semiconductor chips requires very high precision, so it is difficult to prepare. Therefore, higher requirements are constantly being placed on the preparation equipment and preparation process. Semiconductor chips are generally made of round silicon wafers, referred to as "wafers". After a series of complex processing processes, including cleaning, oxidation, photolithography, etching, ion implantation, thin film deposition, chemical mechanical polishing, cutting, etc., numerous transistors, resistors, capacitors and other electronic components are integrated on them to finally form a chip with specific functions. Among them, the thin film deposition step is to deposit various thin films on the surface of the wafer through methods such as physical vapor deposition (PVD) and chemical vapor deposition (CVD). The deposition layer (thin film) prepared by the vapor deposition method for low-end chips does not need to have a strict lattice matching relationship with the substrate (silicon wafer). The deposition layer is a single crystal structure, or a polycrystalline structure, or even an amorphous film. High-end chips use the vapor phase epitaxy method, which is to use a vapor phase reaction on the substrate to allow the material to grow an epitaxial layer with a specific crystal structure and performance along the crystal direction of the substrate. This process has high requirements for the control of the crystal structure and composition, and the purpose is to obtain a single crystal film with good lattice matching with the substrate and superior performance. According to the different crystal direction growth requirements, vapor phase epitaxy is divided into three methods: growing from the center of the wafer to the edge; growing from the edge of the wafer to the center; and growing from a certain part of the wafer to the surrounding diffusion; this requires strict design of temperature distribution, airflow pattern, substrate surface state and other process conditions for different epitaxial growth methods; Currently, the simplest vapor phase epitaxy method is to grow from the center of the wafer toward the edge. This involves using a quartz nozzle aimed at the center of the wafer to inject air, which diffuses outward from the center while simultaneously heating the bottom of the wafer to achieve vapor phase epitaxy. To achieve uniform epitaxial growth, the wafer must be placed on a rotating support, such as the quartz support for semiconductor diffusion furnaces disclosed in CN115056369A. In chip manufacturing, quartz supports serve as crucial components for supporting the chips. Their precision, purity, and stability significantly impact chip manufacturing quality. However, existing quartz support processing equipment and methods suffer from insufficient precision and low production efficiency, failing to meet the growing demands of chip manufacturing. Therefore, the present invention aims to provide a quartz support processing equipment and method for chip manufacturing, aiming to improve precision and enhance production efficiency. Summary of the Invention

[0003] The purpose of this application is to address the above-mentioned technical problems and provide a processing device and a processing method for a quartz bracket used in a chip manufacturing process to solve the problems raised in the above-mentioned background technology.

[0004] The present application provides a processing device for a quartz support used in a chip manufacturing process, comprising a base and: A support rod, wherein the support rod is mounted on the base; A drive assembly, comprising a drive motor, a first rotating shaft, a rotating cylinder, a first gear, and a second gear. The drive motor is mounted on a base. The first rotating shaft is connected to an output shaft of the drive motor via a coupling. The rotating cylinder is sleeved on a support rod. The rotating cylinder and the support rod are coaxially mounted on the base. The first gear is mounted on the first rotating shaft. The second gear is mounted on the rotating cylinder. The first gear is meshed with the second gear. A bearing, wherein the outer ring of the bearing is connected to the rotating cylinder, and the inner ring of the bearing is connected to the support rod; A grinding assembly includes a rotating disk, a loading disk, a clamping device, a lifting device, a support frame, and a grinding device. The rotating disk is installed on a rotating cylinder. Four loading disks are evenly distributed on the rotating disk. Each of the four loading disks is provided with a clamping device. The clamping device is used to clamp and fix the processed material. The lifting device is provided on a support rod. The support frame is installed on the lifting device. A mounting plate is provided on the support frame at a position corresponding to the loading disk. The grinding device is installed on the support frame. The grinding device is used to grind the processed material.

[0005] The base is used as the basic support of the entire equipment to provide an installation platform for other components. The rotating cylinder is rotatably connected and installed on the base, and the support rod is vertically installed on the base, which plays a major supporting role. In the driving assembly, the driving motor is fixed on the base, and its output shaft is connected to the first rotating shaft through a coupling. When the driving motor is working, it can drive the first rotating shaft to rotate synchronously. The first gear is installed on the first rotating shaft and rotates with the first rotating shaft, and the second gear is installed on the rotating cylinder. The first gear is meshed with the second gear. The rotation of the first gear drives the second gear and the rotating cylinder to rotate together. The rotating cylinder is sleeved on the support rod and is coaxially installed with the support rod. At the same time, the outer ring of the bearing is connected to the rotating cylinder, and the inner ring is connected to the support rod. This setting not only ensures that the rotating cylinder can rotate smoothly around the support rod, but also provides stable support for the rotating cylinder. The rotating disk is installed on the rotating drum and rotates synchronously with the rotating drum. Four loading disks are evenly distributed on the rotating disk. The clamping devices on each loading disk can clamp and fix the processed materials. The lifting device is arranged on the support rod, and the support frame is installed on the lifting device. The lifting device can adopt existing structures such as screw rods, and the support frame is driven to move up and down by the rotation of the screw rod. The positions of the support frame corresponding to the loading disk are provided with mounting plates. The grinding device is installed on the support frame. When the lifting device drives the support frame to move downward, the grinding device can grind the clamped and fixed materials. The equipment drives the rotating disk to rotate through the driving assembly, so as to realize the rapid conversion of materials between the loading, grinding and unloading stations, and cooperates with the lifting device to drive the grinding device to move up and down for grinding, which can efficiently and stably complete the processing of the quartz bracket, thereby improving the degree of automation and processing efficiency.

[0006] Furthermore, the grinding device comprises: Telescopic slots, each of the four mounting plates is provided with a telescopic slot; Telescopic frames, wherein four telescopic frames are provided and are slidably mounted in respective telescopic slots. The four telescopic frames are respectively a first frame body, a second frame body, a third frame body, and a fourth frame body, and are respectively equipped with a first nozzle, a rough grinding head, a fine grinding head, and a second nozzle; A hydraulic rod, wherein the output end of the hydraulic rod is connected to the telescopic frame, and the bottom of the hydraulic rod is fixedly connected to the mounting plate.

[0007] In the grinding device, telescopic slots are provided on the four mounting plates, and the four telescopic frames are slidably installed in each telescopic slot, and the four telescopic frames are respectively the first frame, the second frame, the third frame, and the fourth frame. The four telescopic frames are respectively equipped with the first nozzle, the rough grinding head, the fine grinding head, and the second nozzle. The first nozzle and the second nozzle are both connected to the external air source, the output end of the hydraulic rod is connected to the telescopic frame, and the bottom is fixed to the mounting plate. When the hydraulic rod is working, it can drive the telescopic frame to slide in the telescopic slot, thereby adjusting the position of the first nozzle, the rough grinding head, the fine grinding head, and the second nozzle. The first nozzle can blow on the clamping disc of the pre-loaded material to remove the debris and impurities on it, so as to prevent these debris from affecting the accuracy of subsequent clamping; the rough grinding head is used to perform preliminary rough grinding on the material, and the fine grinding head performs fine grinding on the basis of rough grinding to ensure the processing accuracy of the material; the second nozzle can blow on the surface of the material after grinding to remove the debris remaining on the surface. The position of each component is adjusted by the hydraulic rod to drive the telescopic frame, which can adapt to the processing needs of materials of different sizes, improve the versatility of the equipment, and the setting of multiple grinding and cleaning processes can effectively ensure the processing quality of the quartz bracket.

[0008] Furthermore, the loading tray is provided with a feeding chute for feeding.

[0009] A feeding chute is provided on the loading tray. When the feeding process is in progress, the quartz parts that have been cleaned by the second nozzle will fall from the feeding chute after the clamping device releases the clamping, realizing automatic feeding. The setting of the feeding chute enables the processed quartz parts to be accurately and quickly separated from the processing station, solving the problem of low unloading efficiency caused by manual feeding, further improving the degree of automation and production efficiency of the equipment, and ensuring that the equipment can feed in an orderly manner during the work process.

[0010] Furthermore, the clamping device includes: A clamping plate, the clamping plate being mounted on the loading plate; A driving groove, wherein four driving grooves are arranged in an annular array on the chuck; An electric telescopic rod is provided in each of the driving slots; A clamping claw is installed at the output end of the electric telescopic rod, and the clamping claw is arc-shaped.

[0011] The clamping disc of the clamping device is installed on the loading disc, and four drive slots are opened in a circular array on the clamping disc. Each drive slot is equipped with an electric telescopic rod, and the clamping claws are installed at the output end of the electric telescopic rod, and the clamping claws are arc-shaped. When it is necessary to clamp the material, the output end of the electric telescopic rod extends to drive the clamping claws to move toward the center of the clamping disc. The material is clamped and fixed through the joint action of the four arc-shaped clamping claws. When it is necessary to remove the material, the output end of the electric telescopic rod retracts, driving the clamping claws away from the center of the circle to release the clamping of the material. This clamping method is powered by the electric telescopic rod, and the clamping force is stable and controllable, which can ensure that the material will not be displaced during the processing, thereby ensuring the processing accuracy. At the same time, the arc-shaped clamping claws can better fit the surface of the circular material and improve the clamping stability.

[0012] Furthermore, each of the clamping jaws is provided with a clamping groove, and the clamping groove is used to clamp square materials.

[0013] The clamping jaws are all provided with clamping grooves, which are specially used to clamp square materials. When a square quartz bracket needs to be processed, the square material is placed on the clamping plate so that the four corners of the square material are respectively clamped in the clamping grooves of the four clamping jaws. Then the electric telescopic rod is driven to move the clamping jaws. Through the cooperation of the clamping grooves and the square material, the square material can be firmly clamped. The setting of the clamping grooves makes the clamping device not only adaptable to the clamping of round materials, but also can reliably clamp square materials, which expands the scope of application of the equipment and improves the flexibility and practicality of the equipment.

[0014] Furthermore, rubber pads are installed on the clamping jaws.

[0015] Rubber pads are installed on the clamping jaws. When the clamping jaws clamp the quartz material, the rubber pads are in direct contact with the material surface. The rubber pads are soft and elastic, which can avoid hard contact between the clamping jaws and the material, thereby preventing scratches and damage to the material surface during the clamping process, protecting the surface quality of the material, and ensuring that the processed quartz bracket meets the surface accuracy requirements of the chip manufacturing process.

[0016] Furthermore, it also includes a blanking component, which includes: A lower hopper is placed on the base, and the position of the opening of the lower hopper corresponds to the position of the lower chute; A damper, the damper being fixedly connected to the interior of the lower hopper; A buffer pad, the buffer pad is fixedly connected and installed on the top of the damper; A spring is sleeved on the damper.

[0017] The hopper of the feeding assembly is placed on the base, and its opening position corresponds to the position of the feeding chute. The quartz pieces falling from the feeding chute can accurately fall into the feeding hopper. The damper is fixedly connected to the inside of the feeding hopper, the buffer pad is installed on the top of the damper, and the spring is set on the damper. When the quartz piece falls from the feeding chute, it will first contact the buffer pad, and the buffer pad can play a preliminary buffering role. The side of the feeding hopper is open, and the operator can take out the processed quartz piece from the side opening of the feeding hopper. At the same time, the damper and the spring will further cooperate to play a good buffering and shock-absorbing role for the fallen quartz piece. This setting can effectively prevent the quartz piece from being damaged by the impact of falling, and ensure the integrity and quality of the quartz piece after processing.

[0018] Furthermore, a processing method for a quartz support processing device for a chip manufacturing process is provided, which is applicable to the quartz support processing device for a chip manufacturing process according to claims 1-7, and the processing method comprises the following steps: Step 1: Drive the first nozzle to work, and the first nozzle sprays the clamping disc at the position corresponding to the first frame to remove debris and impurities on the clamping disc of the pre-loaded material at this station. Then, place the quartz material (round or square) to be processed on the clamping disc at the position corresponding to the first frame, and drive the output ends of the four electric telescopic rods to extend simultaneously, driving the four clamping claws to move toward the center of the clamping disc at the same time until the quartz material is clamped and fixed. When clamping and fixing the square quartz material, ensure that it is stuck in the four clamping grooves of the clamping claws; Step 2: After the quartz material is fixed on the loading tray at the position corresponding to the first frame, the driving motor drives the first rotating shaft to rotate, the rotation of the first rotating shaft drives the first gear to rotate, the first gear drives the second gear meshing with it to rotate, and the rotation of the second gear drives the rotating drum to rotate clockwise around the axis of the rotating drum until the clamping plate carrying the quartz material is aligned with the rough grinding head and stops, then the lifting device is driven to drive the support frame to move downward, and the support frame drives the rough grinding head to move downward for rough grinding; Step 3: After the rough grinding is completed, the lifting device drives the support frame to reset and move upward, and then the driving motor is driven again to drive the rotating cylinder to rotate clockwise around its axis until the chuck loaded with the rough-ground quartz material is aligned with the fine-grinding head and stops. Then the lifting device is driven to drive the support frame to move downward, and the downward movement of the support frame drives the fine-grinding head to move downward for fine grinding. Step 4: After the fine grinding head completes the fine grinding of the quartz material, the lifting device drives the support frame to reset and move upward, and then drives the drive motor again to drive the rotating cylinder to rotate around its axis until the clamping plate loaded with the finely ground quartz material is aligned with the position of the second nozzle and stops. At this time, the second nozzle sprays and cleans the debris on the surface of the ground quartz part. After cleaning, the four electric telescopic rods retract at the same time to drive the clamping claws to reset, releasing the clamping of the quartz part. The quartz part falls from the discharge chute into the discharge hopper. The quartz part flexibly contacts the buffer pad, and the damper and spring cooperate to provide buffering and shock absorption for the fallen quartz part. Step 5: After the processed quartz parts fall into the lower hopper, the driving motor drives the rotating drum to rotate again. The rotation of the rotating drum drives the rotating disk and the chuck disk to rotate clockwise to the position corresponding to the first frame, and the first nozzle is driven again to spray the chuck disk. After the spraying is completed, the unprocessed quartz parts can be loaded again.

[0019] The beneficial effects of this application are: 1. The equipment drives the rotating disk to rotate through the driving component, realizing the rapid conversion of materials between the loading, grinding and unloading stations. The lifting device drives the grinding device to move up and down for grinding, which can complete the processing of quartz brackets efficiently and stably, improving the degree of automation and processing efficiency. 2. During operation, the first nozzle can spray the clamping plate of the pre-loaded material to remove the debris and impurities on it, so as to prevent these debris from affecting the accuracy of subsequent clamping; the coarse grinding head is used to perform preliminary coarse grinding on the material, and the fine grinding head performs fine grinding on the basis of coarse grinding to ensure the processing accuracy of the material; the second nozzle can spray the surface of the ground material to remove the debris remaining on the surface; 3. After being cleaned by the second nozzle, the quartz parts will fall from the unloading chute after the clamping device releases the clamping, realizing automatic unloading; BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of this application; Figure 2 It is a schematic diagram of the overall structure of this application; Figure 3 It is a partial cross-sectional view of the overall structure of the present application; Figure 4 This application Figure 1 A magnified view of part A; Figure 5 This application Figure 2 A magnified view of part B; The reference numerals in the figure are: 100, base; 200, support rod; 300, drive assembly; 310, drive motor; 320, first rotating shaft; 330, rotating cylinder; 340, first gear; 350, second gear; 500, bearing; 600, grinding assembly; 610, rotating disk; 620, loading disk; 621, unloading chute; 630, clamping device; 631, clamping disk; 632, drive chute; 633, electric telescopic rod; 634, clamping claw; 635, clamping groove; 636, rubber Rubber pad; 640, lifting device; 650, support frame; 660, grinding device; 661, telescopic slot; 662, telescopic frame; 663, first frame; 664, second frame; 665, third frame; 666, fourth frame; 667, hydraulic rod; 670, mounting plate; 681, first nozzle; 682, rough grinding head; 683, fine grinding head; 684, second nozzle; 800, unloading assembly; 810, unloading hopper; 820, damper; 830, buffer pad; 840, spring. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0022] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0023] The following provides a detailed description of the embodiments of the present application through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0024] Example 1: like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 As shown, the embodiment of the present application provides a processing device for a quartz support for a chip manufacturing process, including a base 100 and further comprising: A support rod 200 , wherein the support rod 200 is mounted on the base 100 ; The drive assembly 300 includes a drive motor 310, a first rotating shaft 320, a rotating cylinder 330, a first gear 340, and a second gear 350. The drive motor 310 is mounted on the base 100. The first rotating shaft 320 is connected to the output shaft of the drive motor 310 via a coupling. The rotating cylinder 330 is sleeved on the support rod 200. The rotating cylinder 330 and the support rod 200 are coaxially mounted on the base 100. The first gear 340 is mounted on the first rotating shaft 320. The second gear 350 is mounted on the rotating cylinder 330. The first gear 340 is meshed with the second gear 350. A bearing 500, wherein the outer ring of the bearing 500 is connected to the rotating cylinder 330, and the inner ring of the bearing 500 is connected to the support rod 200; The grinding assembly 600 includes a rotating disk 610, a loading disk 620, a clamping device 630, a lifting device 640, a support frame 650, and a grinding device 660. The rotating disk 610 is installed on the rotating cylinder 330. Four loading disks 620 are evenly distributed on the rotating disk 610. Each of the four loading disks 620 is provided with a clamping device 630. The clamping device 630 is used to clamp and fix the processed materials. The lifting device 640 is provided on the support rod 200. The support frame 650 is installed on the lifting device 640. A mounting plate 670 is provided on the support frame 650 at a position corresponding to the loading disk 620. The grinding device 660 is installed on the support frame 650. The grinding device 660 is used to grind the processed materials.

[0025] The base 100 serves as the basic support for the entire device and provides an installation platform for other components. The rotating cylinder 330 is rotatably connected and installed on the base 100. The support rod 200 is vertically installed on the base 100 and plays a major supporting role. In the driving assembly 300, the driving motor 310 is fixed on the base 100, and its output shaft is connected to the first rotating shaft 320 through a coupling. When the driving motor 310 is working, it can drive the first rotating shaft 320 to rotate synchronously. The first gear 340 is installed on the first rotating shaft 320 and rotates with the first rotating shaft 320. The first gear 340 is meshed with the second gear 350. The rotation of the first gear 340 drives the second gear 350 and the rotating cylinder 330 to rotate together. The rotating cylinder 330 is sleeved on the support rod 200 and is coaxially installed on the base 100 with the support rod 200. At the same time, the outer ring of the bearing 500 is connected to the rotating cylinder 330, and the inner ring is connected to the support rod 200. This arrangement ensures that the rotating cylinder 330 can rotate smoothly around the support rod 200 and can stabilize the rotating cylinder 330. In the support and grinding assembly 600, the rotating disk 610 is mounted on the rotating cylinder 330 and rotates synchronously with the rotating cylinder 330. The four loading disks 620 are evenly distributed on the rotating disk 610. The clamping device 630 on each loading disk 620 can clamp and fix the processed material. The lifting device 640 is set on the support rod 200, and the support frame 650 is mounted on the lifting device 640. The lifting device 640 can adopt an existing structure such as a screw rod. The support frame 650 is driven by the rotation of the screw rod to move up and down. The support frame 650 is connected to the loading disk 620. Mounting plates 670 are provided at corresponding positions, and the grinding device 660 is installed on the support frame 650. When the lifting device 640 drives the support frame 650 to move downward, the grinding device 660 can grind the clamped materials. The equipment drives the rotating disk 610 to rotate through the driving component 300, so as to realize the rapid conversion of materials between the loading, grinding and unloading stations. The lifting device 640 drives the grinding device 660 to move up and down for grinding, which can efficiently and stably complete the processing of the quartz bracket, thereby improving the degree of automation and processing efficiency.

[0026] Example 2: like Figure 1 、 Figure 4 As shown, the embodiment of the present application provides a processing device for a quartz support used in a chip manufacturing process. In addition to the above technical features, the grinding device 660 includes: Telescopic slots 661, each of the four mounting plates 670 is provided with a telescopic slot 661; The telescopic frames 662 are provided in four numbers and are slidably mounted in the telescopic slots 661 . The four telescopic frames 662 are respectively a first frame 663 , a second frame 664 , a third frame 665 , and a fourth frame 666 , and are respectively equipped with a first nozzle 681 , a rough grinding head 682 , a fine grinding head 683 , and a second nozzle 684 ; The hydraulic rod 667 has an output end connected to the telescopic frame 662 , and a bottom of the hydraulic rod 667 is fixedly connected to the mounting plate 670 .

[0027] In the grinding device 660, four mounting plates 670 are provided with telescopic slots 661, and four telescopic frames 662 are respectively slidably installed in each telescopic slot 661, and the four telescopic frames 662 are respectively a first frame 663, a second frame 664, a third frame 665, and a fourth frame 666. The four telescopic frames 662 are respectively provided with a first nozzle 681, a rough grinding head 682, a fine grinding head 683, and a second nozzle 684. The first nozzle 681 and the second nozzle 684 are both connected to an external air source. The output end of the hydraulic rod 667 is connected to the telescopic frame 662, and the bottom is fixed to the mounting plate 670. When the hydraulic rod 667 is working, it can drive the telescopic frame 662 to slide in the telescopic slot 661, thereby adjusting the first nozzle 681, The positions of the rough grinding head 682, the fine grinding head 683 and the second nozzle 684 are such that, during operation, the first nozzle 681 can spray the clamping plate 631 of the pre-loaded material to remove the debris and impurities thereon, thereby preventing these debris from affecting the accuracy of subsequent clamping; the rough grinding head 682 is used to perform preliminary rough grinding on the material, while the fine grinding head 683 performs fine grinding on the basis of the rough grinding to ensure the processing accuracy of the material; the second nozzle 684 can spray the surface of the ground material to remove the debris remaining on the surface, and the telescopic frame 662 is driven by the hydraulic rod 667 to adjust the position of each component, which can adapt to the processing requirements of materials of different sizes, thereby improving the versatility of the equipment, and the setting of multiple grinding and cleaning processes can effectively ensure the processing quality of the quartz bracket.

[0028] Example 3: like Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 As shown, the embodiment of the present application provides a processing device for a quartz support used in a chip manufacturing process. In addition to the above-mentioned technical features, a material discharge trough 621 is provided on the loading tray 620 for discharge of materials.

[0029] A discharge chute 621 is provided on the loading tray 620. When the discharge process is carried out, the quartz parts that have been cleaned by the second nozzle 684 will fall from the discharge chute 621 after the clamping device 630 releases the clamping, realizing automatic discharge. The setting of the discharge chute 621 allows the processed quartz parts to be accurately and quickly separated from the processing station, solving the problem of low unloading efficiency caused by manual discharge, further improving the degree of automation and production efficiency of the equipment, and ensuring that the equipment can discharge materials in an orderly manner during the work process.

[0030] Example 4: like Figure 5 As shown, the embodiment of the present application provides a processing device for a quartz support used in a chip manufacturing process. In addition to the above technical features, the clamping device 630 includes: A clamping plate 631 , the clamping plate 631 being mounted on the loading plate 620 ; Driving slots 632, four of which are arranged in an annular array on the chuck plate 631; An electric telescopic rod 633 is provided in each of the driving slots 632; The clamping claw 634 is installed at the output end of the electric telescopic rod 633 and is arc-shaped.

[0031] The clamping plate 631 of the clamping device 630 is installed on the loading plate 620, and four driving grooves 632 are opened in a circular array on the clamping plate 631. Each driving groove 632 is provided with an electric telescopic rod 633, and the clamping claw 634 is installed at the output end of the electric telescopic rod 633, and the clamping claw 634 is arc-shaped. When it is necessary to clamp the material, the output end of the electric telescopic rod 633 extends, driving the clamping claw 634 to move toward the center of the circle of the clamping plate 631. The material is clamped and fixed through the joint action of the four arc-shaped clamping claws 634. When it is necessary to remove the material, the output end of the electric telescopic rod 633 retracts, driving the clamping claw 634 away from the center of the circle, and releasing the clamping of the material. This clamping method is powered by the electric telescopic rod 633, and the clamping force is stable and controllable, which can ensure that the material will not be displaced during the processing, thereby ensuring the processing accuracy. At the same time, the arc-shaped clamping claw 634 can better fit the surface of the circular material and improve the clamping stability.

[0032] Example 5: like Figure 5 As shown, the embodiment of the present application provides a processing device for a quartz support used in a chip manufacturing process. In addition to the above-mentioned technical features, the clamping jaws 634 are each provided with a clamping groove 635, and the clamping groove 635 is used to clamp square materials.

[0033] The clamping jaws 634 are each provided with clamping grooves 635, which are specifically used to clamp square materials. When a square quartz bracket needs to be processed, the square material is placed on the clamping plate 631, so that the four corners of the square material are respectively clamped in the clamping grooves 635 of the four clamping jaws 634, and then the electric telescopic rod 633 is driven to move the clamping jaws 634. Through the cooperation between the clamping grooves 635 and the square material, the square material can be firmly clamped. The setting of the clamping grooves 635 enables the clamping device 630 to not only adapt to the clamping of round materials, but also reliably clamp square materials, expanding the scope of application of the equipment and improving the flexibility and practicality of the equipment.

[0034] Example 6: like Figure 5 As shown, the embodiment of the present application provides a processing device for a quartz support used in a chip manufacturing process. In addition to the above-mentioned technical features, a rubber pad 636 is installed on each of the clamping jaws 634 .

[0035] Rubber pads 636 are installed on the clamping jaws 634. When the clamping jaws 634 clamp the quartz material, the rubber pads 636 directly contact the surface of the material. The rubber pads 636 are soft and have a certain elasticity, which can avoid hard contact between the clamping jaws 634 and the material, thereby preventing scratches and damage to the material surface during the clamping process, protecting the surface quality of the material, and ensuring that the processed quartz bracket meets the surface accuracy requirements of the chip manufacturing process.

[0036] Example 7: like Figure 2 、 Figure 3 As shown, the embodiment of the present application provides a processing device for a quartz support for a chip manufacturing process. In addition to the above technical features, it also includes a blanking component 800. The blanking component 800 includes: A lower hopper 810 is placed on the base 100 , and the position of the opening of the lower hopper 810 corresponds to the position of the lower chute 621 ; A damper 820 , wherein the damper 820 is fixedly connected to the interior of the lower hopper 810 ; A buffer pad 830 , wherein the buffer pad 830 is fixedly connected and installed on the top of the damper 820 ; The spring 840 is sleeved on the damper 820 .

[0037] The hopper 810 of the unloading assembly 800 is placed on the base 100, and its opening position corresponds to the position of the unloading chute 621. The quartz pieces falling from the unloading chute 621 can accurately fall into the unloading hopper 810. The damper 820 is fixedly connected to the inside of the unloading hopper 810, and the buffer pad 830 is installed on the top of the damper 820. The spring 840 is sleeved on the damper 820. When the quartz pieces fall from the unloading chute 621, they will first contact the buffer pad 830. The buffer pad 830 can play a preliminary buffering role. The side of the unloading hopper 810 is open, and the operator can take out the processed quartz pieces from the side opening of the unloading hopper 810. At the same time, the damper 820 and the spring 840 will further cooperate to play a good buffering and shock-absorbing role for the fallen quartz pieces. This setting can effectively prevent the quartz pieces from being damaged by the impact of falling, thereby ensuring the integrity and quality of the quartz pieces after processing.

[0038] Example 8: like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 As shown, the embodiment of the present application provides a method for processing a quartz support for a chip manufacturing process: Step 1: The first nozzle 681 is driven to operate, spraying air onto the clamping plate 631 at a position corresponding to the first frame 663 to remove debris and impurities from the pre-loaded material clamping plate 631 at that workstation. Subsequently, the quartz material (round or square) to be processed is placed on the clamping plate 631 at a position corresponding to the first frame 663. The output ends of the four electric telescopic rods 633 are driven to extend simultaneously, driving the four clamping claws 634 to move simultaneously toward the center of the clamping plate 631 until the quartz material is clamped and fixed. When clamping and fixing the square quartz material, ensure that it is stuck in the four clamping grooves 635 of the clamping claws 634. Step 2: After the quartz material is fixed on the loading tray 620 at the position corresponding to the first frame 663, the driving motor 310 drives the first rotating shaft 320 to rotate. The rotation of the first rotating shaft 320 drives the first gear 340 to rotate. The first gear 340 drives the second gear 350 meshing therewith to rotate. The rotation of the second gear 350 drives the rotating cylinder 330 to rotate clockwise around the axis of the rotating cylinder 330 until the clamping plate 631 carrying the quartz material is aligned with the rough grinding head 682 and stops. Then, the lifting device 640 is driven to drive the support frame 650 to move downward. The support frame 650 drives the rough grinding head 682 to move downward for rough grinding. Step 3: After the rough grinding is completed, the lifting device 640 drives the support frame 650 to return to its original position and move upward, and then the driving motor 310 is driven again to drive the rotating cylinder 330 to rotate clockwise around its axis until the chuck 631 loaded with the rough-ground quartz material is aligned with the fine-grinding head 683 and stops. Then the lifting device 640 is driven to drive the support frame 650 to move downward, and the downward movement of the support frame 650 drives the fine-grinding head 683 to move downward for fine grinding. Step 4: After the fine grinding head 683 completes the fine grinding of the quartz material, the lifting device 640 drives the support frame 650 to reset and move upward, and then drives the drive motor 310 to work again, driving the rotating cylinder 330 to rotate around its axis until the clamping plate 631 loaded with the finely ground quartz material is aligned with the position of the second nozzle 684 and stops. At this time, the second nozzle 684 sprays and cleans the debris on the surface of the ground quartz part. After cleaning, the four electric telescopic rods 633 retract at the same time to drive the clamping claws 634 to reset, releasing the clamping of the quartz part. The quartz part falls from the discharge chute 621 into the discharge hopper 810. The quartz part flexibly contacts the buffer pad 830. At the same time, the damper 820 and the spring 840 cooperate to provide a buffering and shock-absorbing effect for the fallen quartz part. Step 5: After the processed quartz parts fall into the lower hopper 810, the driving motor 310 drives the rotating cylinder 330 to rotate again. The rotation of the rotating cylinder 330 drives the rotating disk 610 and the chuck disk to rotate clockwise to the position corresponding to the first frame 663, and drives the first nozzle 681 again to spray the chuck disk. After the spraying is completed, the unprocessed quartz parts can be loaded again.

[0039] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be noted that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0040] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A processing device for a quartz support used in a chip manufacturing process, comprising a base (100), characterized in that , also includes: A support rod (200), wherein the support rod (200) is mounted on the base (100); A driving assembly (300), the driving assembly (300) comprising a driving motor (310), a first rotating shaft (320), a rotating cylinder (330), a first gear (340), and a second gear (350); the driving motor (310) is mounted on a base (100); the first rotating shaft (320) is connected to an output shaft of the driving motor (310) via a coupling; the rotating cylinder (330) is sleeved on a support rod (200); the rotating cylinder (330) and the support rod (200) are coaxially mounted on the base (100); the first gear (340) is mounted on the first rotating shaft (320); the second gear (350) is mounted on the rotating cylinder (330); and the first gear (340) and the second gear (350) are meshed with each other; A bearing (500), wherein the outer ring of the bearing (500) is connected to the rotating cylinder (330), and the inner ring of the bearing (500) is connected to the support rod (200); The grinding assembly (600) comprises a rotating disk (610), a charging disk (620), a clamping device (630), a lifting device (640), a support frame (650), and a grinding device (660). The rotating disk (610) is mounted on a rotating cylinder (330). Four charging disks (620) are evenly distributed on the rotating disk (610). Each of the four charging disks (620) is provided with a clamping device (630). 30), the clamping device (630) is used to clamp and fix the processing material, the lifting device (640) is arranged on the support rod (200), the support frame (650) is installed on the lifting device (640), and a mounting plate (670) is provided on the support frame (650) at a position corresponding to the loading tray (620), and the grinding device (660) is installed on the support frame (650), and the grinding device (660) is used to grind the processing material.

2. The processing equipment for a quartz support used in a chip manufacturing process according to claim 1, characterized in that: The grinding device (660) comprises: Telescopic slots (661), each of the four mounting plates (670) is provided with a telescopic slot (661); Telescopic frames (662), wherein four telescopic frames (662) are provided and are slidably mounted in respective telescopic slots (661), wherein the four telescopic frames (662) are respectively a first frame body (663), a second frame body (664), a third frame body (665), and a fourth frame body (666), and are respectively installed with a first nozzle (681), a rough grinding head (682), a fine grinding head (683), and a second nozzle (684); A hydraulic rod (667), the output end of the hydraulic rod (667) is connected to the telescopic frame (662), and the bottom of the hydraulic rod (667) is fixedly connected to the mounting plate (670).

3. The processing equipment for a quartz support for a chip manufacturing process according to claim 2, characterized in that: The loading tray (620) is provided with a feeding trough (621) for feeding.

4. The processing equipment for a quartz support used in a chip manufacturing process according to claim 3, characterized in that: The clamping device (630) comprises: A clamping plate (631), wherein the clamping plate (631) is mounted on the loading plate (620); A driving groove (632), wherein four driving grooves (632) are arranged in an annular array on the clamping plate (631); An electric telescopic rod (633), wherein each of the driving slots (632) is provided with an electric telescopic rod (633); A clamping claw (634) is installed at the output end of the electric telescopic rod (633), and the clamping claw (634) is arc-shaped.

5. The processing equipment for a quartz support used in a chip manufacturing process according to claim 4, characterized in that: The clamping claws (634) are each provided with a clamping groove (635), and the clamping groove (635) is used for clamping square materials.

6. The processing equipment for a quartz support used in a chip manufacturing process according to claim 5, characterized in that: The clamping claws (634) are each provided with a rubber pad (636).

7. The processing equipment for a quartz support used in a chip manufacturing process according to claim 6, characterized in that: The invention also includes a blanking assembly (800), wherein the blanking assembly (800) includes: A lower hopper (810), the lower hopper (810) is placed on the base (100), and the position of the opening of the lower hopper (810) corresponds to the position of the lower chute (621); a damper (820), wherein the damper (820) is fixedly connected to the interior of the lower hopper (810); A buffer pad (830), wherein the buffer pad (830) is fixedly connected and installed on the top of the damper (820); A spring (840) is sleeved on the damper (820).

8. A method for processing a quartz support for a chip manufacturing process, the method being applicable to the quartz support for a chip manufacturing process according to claims 1-7, the method comprising the following steps: Step 1: The first nozzle (681) is driven to operate, and the first nozzle (681) sprays the clamping disc (631) at a position corresponding to the first frame (663) to remove debris and impurities on the pre-loaded material clamping disc (631) at the work station. Subsequently, the quartz material (round or square) to be processed is placed on the clamping disc (631) at a position corresponding to the first frame (663), and the output ends of the four electric telescopic rods (633) are driven to extend simultaneously, driving the four clamping claws (634) to move toward the center of the clamping disc (631) at the same time until the quartz material is clamped and fixed. When clamping and fixing the square quartz material, ensure that it is stuck in the four clamping grooves (635) of the clamping claws (634); Step 2: After the quartz material is fixed on the loading tray (620) at a position corresponding to the first frame (663), the driving motor (310) drives the first rotating shaft (320) to rotate, and the rotation of the first rotating shaft (320) drives the first gear (340) to rotate, and the first gear (340) drives the second gear (350) engaged therewith to rotate, and the rotation of the second gear (350) drives the rotating cylinder (330) to rotate clockwise around the axis of the rotating cylinder (330) until the clamping plate (631) carrying the quartz material is aligned with the rough grinding head (682) and stops, and then drives the lifting device (640) to drive the support frame (650) to move downward, and the support frame (650) drives the rough grinding head (682) to move downward for rough grinding; Step 3: After the rough grinding process is completed, the lifting device (640) drives the support frame (650) to reset and move upward, and then drives the driving motor (310) again to drive the rotating cylinder (330) to rotate clockwise around its axis until the clamping plate (631) loaded with the quartz material after the rough grinding process is aligned with the fine grinding head (683) and stops, and then drives the lifting device (640) to drive the support frame (650) to move downward, and the support frame (650) moves downward to drive the fine grinding head (683) to move downward for fine grinding process; Step 4: After the fine grinding head (683) completes the fine grinding of the quartz material, the lifting device (640) drives the support frame (650) to reset and move upward, and then drives the driving motor (310) to work again, driving the rotating cylinder (330) to rotate around its axis until the clamping plate (631) loaded with the finely ground quartz material is aligned with the position of the second nozzle (684) and stops. At this time, the second nozzle (684) sprays and cleans the debris on the surface of the quartz piece that has been ground. After cleaning, the four electric telescopic rods (633) retract at the same time to drive the clamping claws (634) to reset, release the clamping of the quartz piece, and the quartz piece falls from the discharge trough (621) into the discharge hopper (810). The quartz piece is in flexible contact with the buffer pad (830), and the damper (820) and the spring (840) cooperate to provide a buffering and shock-absorbing effect for the quartz piece that falls in. Step 5: After the processed quartz pieces fall into the lower hopper (810), the driving motor (310) drives the rotating cylinder (330) to rotate again. The rotation of the rotating cylinder (330) drives the rotating disk (610) and the chuck disk to rotate clockwise to a position corresponding to the first frame (663). The first nozzle (681) is driven again to spray the chuck disk. After the spraying is completed, the unprocessed quartz pieces can be loaded again.

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