Machining device, machining robot and composite robot machining equipment

Abstract

The invention relates to the technical field of aircraft wing manufacturing, and provides a machining device, a machining robot and composite robot machining device.The machining device comprises a machining assembly and a scrap removing assembly; the machining assembly comprises a machining tool, the scrap removing assembly is installed on the machining assembly and comprises at least one scrap removing unit, and the scrap removing unit can move close to or away from the machining tool. Thus, the chip removal unit is movably arranged, so that the chip removal unit can be closer to the machining tool during working, and compared with the prior art, the chip removal unit can flexibly move to the position closer to the machining tool, and then the vacuum adsorption range is closer to the core area where machining chips are generated; and therefore, the adsorption effect of the chip removal assembly on the chips is effectively enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of aircraft wing manufacturing, and in particular to a processing device, a processing robot and a composite robot processing equipment. Background Art

[0002] An aircraft wing is the core lift-generating component of an aircraft, carrying the weight of the fuselage and balancing flight attitude. Its structural design and manufacturing process directly determine the aircraft's load capacity, range, and safety factor. A wing consists of a smooth outer skin and a crisscrossing inner frame. The skin must maintain a perfect aerodynamic curve to reduce air resistance, while the frame must possess sufficient strength to withstand airflow and fuselage loads. The synergy between the two is essential for the aircraft's stable flight. In aircraft wing manufacturing for the aviation industry, drilling is a critical step in connecting the skin and frame, ensuring the wing's structural strength and aerodynamic performance. Extremely high precision is required, requiring advanced technologies such as laser positioning and five-axis CNC machine tools to ensure precise drilling locations and smooth holes, maintaining a secure connection between the skin and frame while avoiding damage to the wing's aerodynamic shape, thereby preventing increased drag and reduced flight efficiency. However, in addition to maintaining precision during drilling, the handling of debris generated during processing is also crucial. Failure to promptly and effectively remove this debris can not only affect machining accuracy but also interfere with subsequent processes.

[0003] When dealing with debris generated during the processing process, existing processing equipment usually relies on a simple vacuum chip removal mechanism to complete the chip removal work. However, the vacuum chip removal mechanisms currently used mostly adopt a fixed installation setting, and their position cannot be adjusted accordingly according to the specific position of the processing tool, and cannot be flexibly moved to a place closer to the processing tool. This makes the range of vacuum adsorption a certain distance from the core area where the processing debris is generated, which leads to poor adsorption effect on the debris. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a processing device, a processing robot and a composite robot processing equipment.

[0005] To achieve the above object, the present invention provides the following technical solutions: In a first aspect, a processing device is provided, comprising: a processing component and a chip removal component; The processing assembly includes a processing tool. The chip removal assembly is installed on the processing assembly. The chip removal assembly includes at least one chip removal unit. The chip removal unit is movable toward or away from the processing tool.

[0006] In some embodiments, the chip removal unit includes a negative pressure generating member and at least one chip removal arm. The chip removal arm is movable toward or away from the processing tool, and the negative pressure generating member is connected to the chip removal arm.

[0007] In some embodiments, a receiving portion is provided on the chip removal arm, the processing tool can be at least partially received in the receiving portion, and the negative pressure generating member is connected to the receiving portion of the chip removal arm.

[0008] In some embodiments, there are two chip removal arms, and the two chip removal arms can move relative to each other to approach the processing tool at the same time, or move away from the processing tool at the same time. When the two chip removal arms move relative to each other to contact each other, the receiving parts of the two chip removal arms cooperate to receive the processing tool in the two receiving parts.

[0009] In some embodiments, the processing assembly further includes a guide sleeve, which is sleeved on the processing tool. The guide sleeve is provided with a guide hole. When the two chip removal arms move relative to each other to contact each other, the guide sleeve is accommodated in the receiving parts of the two chip removal arms, and the guide hole is arranged relative to the receiving part.

[0010] In some embodiments, the guide sleeve is movably mounted on the processing tool.

[0011] In some embodiments, a connecting hole is provided on the chip removal arm, one end of the connecting hole is connected to the receiving portion, and the other end of the connecting hole is connected to the negative pressure generating part through a pipe, so that the negative pressure generating part is connected to the receiving portion of the chip removal arm.

[0012] In some embodiments, the chip removal assembly further includes a slide rail, the chip removal unit is movably disposed on the slide rail along a first direction to approach or move away from the processing tool, and the slide rail is movably mounted on the processing assembly along a second direction, and the first direction is perpendicular to the second direction.

[0013] In a second aspect, a processing robot is provided, comprising a robotic arm and a processing device connected to the robotic arm, wherein the processing device is the processing device described in any of the above embodiments.

[0014] In a third aspect, a composite robot processing device is provided, which includes an AGV trolley and a processing robot connected to the AGV trolley, and the processing robot is the processing robot described in any of the above embodiments.

[0015] Compared with the prior art, the beneficial effect of the present invention is that by making the chip removal unit movably arranged, the chip removal unit can be closer to the processing tool when working, so that the chip removal unit can be flexibly moved to a position closer to the processing tool compared with the prior art, thereby making the range of vacuum adsorption closer to the core area where the processing debris is generated, thereby effectively enhancing the chip removal component's adsorption effect on the debris. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the processing device of the present invention; Figure 2 It is a partial structural schematic diagram of the processing device of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the processing device of the present invention in another direction; Figure 4 It is a structural schematic diagram of the composite robot processing equipment of the present invention.

[0017] 100, processing assembly; 110, processing tool; 120, guide sleeve; 121, guide hole; 130, spindle drive unit; 200, chip removal assembly; 210, chip removal unit; 211, chip removal arm; 212, receiving portion; 213, pipe; 220, slide rail; 230, chip removal drive unit; 300, robotic arm; 400. AGV cart. DETAILED DESCRIPTION

[0018] To make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. The described embodiments are only part of the embodiments of the present invention, not all of the embodiments.

[0019] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0020] In the following embodiments and drawings, reference is made to Figure 1 、 Figure 2 and Figure 3 The coordinate system is such that the direction of the X-axis arrow is to the right, the direction of the Y-axis arrow is to the front, and the direction of the Z-axis arrow is to the top.

[0021] like Figure 1 and Figure 2As shown, a processing device is provided, including: a processing component 100 and a chip removal component 200; the processing component 100 includes a processing tool 110, the chip removal component 200 is installed on the processing component 100, and the chip removal component 200 includes at least one chip removal unit 210, and the chip removal unit 210 can be moved close to or away from the processing tool 110.

[0022] Specifically, the machining assembly 100 is used to drill holes in the wing frame. The chip removal assembly 200 is used to absorb dust generated during the machining process of the machining tool 110 to prevent dust from flying around and affecting the machining environment. The chip removal unit 210 can absorb the dust generated during machining using a vacuum suction structure. The chip removal unit 210 can move closer to or further away from the wing frame along the Z-axis to flexibly absorb dust and debris generated by the machining tool 110 during machining.

[0023] It is worth noting that by making the chip removal unit 210 movably arranged, the chip removal unit 210 can be closer to the processing tool 110 when working, so that the chip removal unit 210 can be flexibly moved to a position closer to the processing tool 110 compared with the prior art, thereby making the range of vacuum adsorption closer to the core area where the processing debris is generated, thereby effectively enhancing the chip removal component 200's adsorption effect on the debris.

[0024] In order to facilitate the use of the chip removal unit 210, as Figure 1 and Figure 2 As shown, in some embodiments, the chip removal unit 210 includes a negative pressure generating member and at least one chip removal arm 211 . The chip removal arm 211 can be moved closer to or away from the processing tool 110 . The negative pressure generating member is connected to the chip removal arm 211 .

[0025] Specifically, the negative pressure generating element may be optionally but not limited to a vacuum pump, a negative pressure fan, etc., and is connected to the chip removal arm 211 to form a negative pressure area at a corresponding position of the chip removal arm 211 to absorb debris.

[0026] In another embodiment, the chip removal arm 211 is configured to be L-shaped, thereby improving the space utilization rate and aesthetics of the processing device.

[0027] In order to facilitate the use of the chip removal arm 211, as Figure 1 and Figure 2 As shown, in some embodiments, a receiving portion 212 is provided on the chip removal arm 211 , and the processing tool 110 can be at least partially received in the receiving portion 212 , and the negative pressure generating element is connected to the receiving portion 212 of the chip removal arm 211 .

[0028] Specifically, a receiving portion 212 is provided at the left end of the chip removal arm 211, and the receiving portion 212 is concavely arranged near one end of the processing tool 110, and a suction port is correspondingly provided in this concave area to form a negative pressure at the receiving portion 212 to adsorb debris. The suction port can be set as a large hole, or as a plurality of evenly distributed small holes, or can be set according to actual production needs, which is not limited here. In addition, the shape of the processing tool 110 is adapted to the concave shape of the receiving portion 212, that is, the cross-sectional shape of the processing tool 110 is set to be circular, and the concave cross-sectional shape of the receiving portion 212 is adapted thereto so as to be covered on the outer peripheral surface of the processing tool 110. In this way, the processing tool 110 can be at least partially accommodated in the receiving portion 212, and the distance between the processing tool 110 and the negative pressure area is closer, thereby effectively enhancing the adsorption effect.

[0029] To further enhance the descaling effect, Figure 1 and Figure 2 As shown, in some embodiments, there are two chip removal arms 211, and the two chip removal arms 211 can move relative to each other to approach the processing tool 110 at the same time, or move away from the processing tool 110 at the same time. When the two chip removal arms 211 move relative to each other to contact each other, the receiving portions 212 of the two chip removal arms 211 cooperate to receive the processing tool 110 in the two receiving portions 212.

[0030] Specifically, the two chip removal arms 211 are arranged on both sides of the processing tool 110 when working, so that the dust generated by the processing tool during processing can be vacuum adsorbed on the opposite sides. When the two receiving parts 212 are closed, the concave areas of the two receiving parts 212 surround and cover the outer peripheral side of the processing tool 110, that is, the two concave areas are closed to form a full circle. At this time, it can better adsorb dust and debris, and can effectively prevent the debris generated during processing from splashing out from the gap between the two receiving parts 212.

[0031] In another embodiment, three or four chip removal arms 211 may be provided, and the chip removal arms 211 are arranged along the circumference of the processing tool 110 to absorb the debris.

[0032] In order to facilitate the adsorption, Figure 3 As shown, in some embodiments, the processing assembly 100 also includes a guide sleeve 120, which is sleeved on the processing tool 110. The guide sleeve 120 is provided with a guide hole 121. When the two chip removal arms 211 move relative to each other to contact each other, the guide sleeve 120 is accommodated in the receiving portion 212 of the two chip removal arms 211, and the guide hole 121 is arranged relative to the receiving portion 212.

[0033] Specifically, a guide sleeve 120 is provided around the outside of the machining tool 110, and radially defined guide holes 121 are formed in the guide sleeve 120. It is understood that the guide sleeve 120 is a stop-and-clamp sleeve, mounted on the spindle sleeve to ensure tool stability and precision during machining. During machining, the concave areas of the two receiving portions 212 fit snugly around the outer periphery of the guide sleeve 120 (not shown). The guide holes 121 correspond to the suction ports of the receiving portions 212, allowing debris to flow from the guide holes 121 into the suction ports, facilitating collection of the debris.

[0034] To facilitate the processing of the processing tool 110 , in some embodiments, the guide sleeve 120 is movably mounted on the processing tool 110 .

[0035] Specifically, the guide sleeve 120 slides on the processing tool 110 in a manner of cooperation between the slider and the slide groove, so as to facilitate processing of the processing tool 110 .

[0036] In order to facilitate the negative pressure generating element to generate negative pressure, such as Figure 3 As shown, in some embodiments, a connecting hole is provided on the chip removal arm 211, one end of the connecting hole is connected to the receiving portion 212, and the other end of the connecting hole is connected to the negative pressure generating element through a pipe 213, so that the negative pressure generating element is connected to the receiving portion 212 of the chip removal arm 211.

[0037] Specifically, the rear end of the pipe 213 is connected to the negative pressure generating part, and a connecting hole is opened on the right side of the chip removal arm 211. The connecting hole is connected to the receiving part 212 and the front end of the pipe 213, so that when the negative pressure generating part is working, negative pressure can be generated at the adsorption port of the receiving part 212.

[0038] In order to facilitate the operation of the chip removal unit 210, as Figure 3 As shown, in some embodiments, the chip removal assembly 200 also includes a slide rail 220, and the chip removal unit 210 is movably disposed on the slide rail 220 along a first direction to approach or move away from the processing tool 110, and the slide rail 220 is movably installed on the processing assembly 100 along a second direction, and the first direction is perpendicular to the second direction.

[0039] Specifically, the slide rail 220 is movably arranged on the processing assembly 100 so as to be movable along the Y-axis direction on the right side of the processing assembly 100 , and the chip removal unit 210 is slidably arranged on the slide rail 220 so as to be movable along the Z-axis direction on the slide rail 220 .

[0040] Among them, human hands or driving components can drive the processing tool 110 and the chip removal component 200 to move along the Y-axis direction; and, human hands or another driving component can also drive the slide rail 220 to move along the Y-axis direction on the processing component 100; in addition, the chip removal unit 210 can also move along the Z-axis direction on the slide rail 220 to approach or move away from the processing tool 110.

[0041] In some embodiments, the driving component that drives the processing component 100 to move along the Y-axis direction is set as a spindle drive unit 130, that is, the processing component 100 also includes a spindle drive unit 130, and the spindle drive unit 130 is used to drive the processing tool 110 to approach the workpiece and perform processing according to the processing requirements.

[0042] In order to facilitate processing, Figure 3 As shown, in some embodiments, the spindle drive unit 130 includes a first driver, a first linear feed module and a spindle motor. The spindle motor is slidably arranged on the first linear feed module, and the output end of the first driver is connected to the spindle motor.

[0043] Specifically, the spindle motor is slidingly arranged on the first linear feed module. The first driver is installed on the rear side of the first linear feed module, and the driving direction of the first driver and the guide direction of the first linear feed module are set to the Y axis. The first driver is set to a servo motor, and the output end of the servo motor is connected to the spindle motor to drive the spindle motor to move along the direction of the first linear feed module to approach or move away from the workpiece in the Y axis direction. It can be understood that the servo motor has the advantages of high positioning accuracy, precise speed control, fast dynamic response and strong anti-interference ability, so that the spindle motor can be effectively controlled by the servo motor to reach the specified coordinates, thereby further controlling the punching accuracy and ensuring the punching effect. Among them, it can be understood that the specific structure of the first linear feed module and the way in which the first linear feed module cooperates with the servo motor drive component to perform linear motion are technologies that can be known to those skilled in the art and are achievable, and are not described in detail in this embodiment. For example, a linear feed module is usually composed of a guide rail, a slider, a lead screw or a synchronous belt. The guide rail provides guidance for linear motion, the slider slides on the guide rail to carry the driven components, and the lead screw or synchronous belt is responsible for converting rotational motion into linear motion.

[0044] In order to facilitate processing, Figure 3 As shown, in some embodiments, the processing tool 110 includes a spindle, a chuck and a tool. The output end of the spindle motor is connected to the spindle, the chuck is cooperatively connected to the spindle, and the tool is set in the chuck.

[0045] Specifically, the spindle motor is driven by the first driver, thereby sliding linearly on the first linear feed module. The spindle is a transmission and execution component that transmits the rotational motion of the spindle motor to the tool, driving the tool to perform cutting processing. The chuck is installed in the spindle to prevent the tool from falling off during high-speed rotation or cutting, and transmits the rotational torque of the spindle motor to the tool; in this embodiment, the chuck is configured as a pneumatic chuck. In addition, it can also be configured as a spring chuck, a hydraulic chuck, etc., which is not limited here. The tool is installed on the chuck, and the tool achieves processing through relative motion with the workpiece.

[0046] In order to increase the practicality of the device, Figure 3 As shown, in some embodiments, the driving component that drives the processing assembly 100 to move along the Y-axis direction is set to a chip removal drive unit 230, and the chip removal drive unit 230 includes a second drive and a second linear feed module. The second linear feed module is connected to the first linear feed module through a plate, and the slide rail 220 is slidably set on the second linear feed module. The second drive is set on one side of the second linear feed module, and the output end of the second drive is connected to the slide rail 220.

[0047] Specifically, the second linear feed module and the first linear feed module are both guided along the Y-axis. The second linear feed module is connected to the right side of the first linear feed module via a plate, and the slide rail 220 slides along the Y-axis on the second linear feed module. A second driver is mounted on the rear end of the second linear feed module. The second driver is configured as a stepper motor, the output end of which is connected to the slide rail 220. The stepper motor is used to drive the slide rail 220 to move, thereby driving the chip removal unit 210 toward or away from the workpiece along the Y-axis to actively absorb dust and debris generated by the processing tool 110 during processing.

[0048] In some embodiments, the movement of the two chip removal arms 211 on the slide rail 220 is driven by a cylinder. The manner in which the cylinder drives the two chip removal arms 211 to slide on the slide rail 220 is known to those skilled in the art and is feasible, and will not be described in detail in this embodiment.

[0049] In the above embodiment, the working mode of the motor drive component is a technology known to those skilled in the art and is achievable, and is not described in detail in this embodiment.

[0050] It can be understood that in the present application, the processing device is used to punch holes in the wing frame. In addition, the processing device can also perform other processing operations, which are not limited here. All of them can be processed by the processing device and removed by the chip removal component 200.

[0051] A processing robot is provided, which includes a robotic arm 300 and a processing device connected to the robotic arm 300, and the processing device is the processing device of any of the above embodiments.

[0052] Specifically, the robotic arm 300 may be, but is not limited to, a six-axis robot. A six-axis robot can operate at multiple angles and is more practical. The driving end of the robotic arm 300 is connected to the processing device via a mounting flange. Specifically, the first linear feed module is connected to the driving end of the robotic arm 300 via a mounting flange. The robotic arm 300 can drive the processing tool 110 toward the workpiece and perform processing according to the processing requirements.

[0053] like Figure 4 As shown, a composite robot processing equipment is provided, which includes an AGV trolley 400 and a processing robot connected to the AGV trolley 400, and the processing robot is the processing robot of the above embodiment.

[0054] Specifically, the positioning end of the robotic arm 300 is connected to the AGV trolley 400 and is electrically connected to the AGV trolley 400. The AGV trolley 400 can drive the processing device to reach a specified position, and the robotic arm 300 can adjust the processing device to be closer to the workpiece.

[0055] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0056] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like indicate positions or locations based on the positions shown in the accompanying drawings, or the positions or locations in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0057] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0058] In the present invention, unless otherwise expressly specified or limited, a first feature being above or below a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being above, above, and above the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being below, below, and below the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0059] Although the present invention has been described with reference to the above specific embodiments, it will be apparent to those skilled in the art that many substitutions, modifications, and variations can be made based on the above. Therefore, all such substitutions, modifications, and variations are intended to be encompassed within the spirit and scope of the appended claims.

Claims

1. A processing device, characterized in that: include: Machining components and chip removal components; The processing assembly includes a processing tool. The chip removal assembly is installed on the processing assembly. The chip removal assembly includes at least one chip removal unit. The chip removal unit is movable toward or away from the processing tool.

2. A processing device according to claim 1, characterized in that: The chip removal unit includes a negative pressure generating member and at least one chip removal arm. The chip removal arm can be moved closer to or away from the processing tool. The negative pressure generating member is connected to the chip removal arm.

3. The processing device according to claim 2, characterized in that The chip removal arm is provided with a receiving portion, the processing tool can be at least partially received in the receiving portion, and the negative pressure generating member is connected to the receiving portion of the chip removal arm.

4. The processing device according to claim 3, characterized in that There are two chip removal arms, and the two chip removal arms can move relative to each other to approach the processing tool at the same time, or move away from the processing tool at the same time. When the two chip removal arms move relative to each other to contact each other, the receiving parts of the two chip removal arms cooperate to receive the processing tool in the two receiving parts.

5. The processing device according to claim 4, characterized in that The processing assembly also includes a guide sleeve, which is sleeved on the processing tool. The guide sleeve is provided with a guide hole. When the two chip removal arms move relative to each other to contact each other, the guide sleeve is accommodated in the receiving parts of the two chip removal arms, and the guide hole is arranged opposite to the receiving part.

6. The processing device according to claim 5, characterized in that The guide sleeve is movably sleeved on the processing tool.

7. The processing device according to any one of claims 3 to 6, characterized in that: A connecting hole is provided on the chip removal arm, one end of the connecting hole is communicated with the receiving portion, and the other end of the connecting hole is connected to the negative pressure generating member through a pipe, so that the negative pressure generating member is connected to the receiving portion of the chip removal arm.

8. The processing device according to any one of claims 1 to 6, characterized in that: The chip removal assembly also includes a slide rail, the chip removal unit is movably arranged on the slide rail along a first direction to approach or move away from the processing tool, and the slide rail is movably installed on the processing assembly along a second direction, and the first direction is perpendicular to the second direction.

9. A processing robot, characterized in that: The processing robot includes a robotic arm and a processing device connected to the robotic arm, and the processing device is the processing device according to any one of claims 1 to 8.

10. A composite robot processing equipment, characterized in that, The composite robot processing equipment includes an AGV trolley and a processing robot connected to the AGV trolley, and the processing robot is the processing robot according to claim 9.

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