Rapid resin curing device and use method thereof

Abstract

The invention provides a rapid resin curing device and a using method thereof, and belongs to the technical field of material molding, the rapid resin curing device comprises a lower die, an upper die, a first insulating part and a press machine which are sequentially arranged on a workbench from bottom to top; the lower die and the upper die are both connected with the high-frequency oscillating circuit device; and the lower mold and the upper mold are connected with a mold temperature controller through a mold temperature controller pipeline. The high-frequency electromagnetic field effect is superposed for resin curing while heating and pressurizing, the resin curing efficiency is improved, the occupied time of curing equipment and a mold is greatly shortened, and large-scale curing production of resin products is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of material forming, and in particular to a resin rapid curing device and a use method thereof. Background Art

[0002] Thermosetting resins (thermosetting resins) are a type of polymer that undergoes irreversible cross-linking reactions under heating or chemical action to form a three-dimensional network structure. They have excellent heat resistance, mechanical strength and chemical stability. The polar resins in thermosetting resins take a relatively long time to cure, especially the curing of materials such as carbon fiber prepregs, carbon fibers coated with epoxy resins, and epoxy resins containing glass fibers. Existing curing methods generally require several hours of curing at a certain temperature and pressure. Even if the material is relatively thin, it takes about an hour to complete the curing, and in many cases, a preheated mold is required. This results in a long production cycle, low production efficiency, a long equipment occupancy period, and high mold costs.

[0003] There are two existing resin curing technologies:

[0004] 1. Heating + pressure mode

[0005] This mode is to heat the resin in the mold through a certain heating method (electric heating, electromagnetic heating or mold temperature controller), and apply pressure to the mold at the same time, and cure the resin over a long period of time. Depending on the thickness of the resin, the curing time ranges from tens of minutes to several hours.

[0006] 2. Heating + pressure + magnetic field mode

[0007] First, a magnetic substance must be added to the resin and evenly dispersed through a specific method (such as stirring or ultrasound). The resin in the mold is then heated using a specific heating method (electrical heating, electromagnetic heating, or a mold temperature controller). Simultaneously, pressure is applied to the mold, and a magnetic field is applied to the mold periphery. This magnetic force exerts a force on the magnetic substance in the resin, accelerating the resin's curing. This method can shorten the curing time of some resins.

[0008] CN111805937A discloses an apparatus and method for preparing a regenerated cellulose resin laminated composite material. The apparatus comprises a vacuum chamber, a press, an upper mold, and a lower mold positioned opposite each other within the vacuum chamber. The upper mold is fixed to the bottom end of a pressure guide rod of the press, which transmits pressure to the upper mold via the pressure guide rod. A laminate of regenerated cellulose material coated with epoxy resin between layers is positioned above the lower mold. By combining mechanical lamination with vacuum infiltration molding, the laminated connection is improved, enabling efficient preparation of the regenerated cellulose resin laminated composite material.

[0009] CN116373346A discloses a segmented high-pressure injection resin transfer molding process, which includes the following steps: Step 1: Lay the reinforcing material into the mold cavity of the lower mold; Step 2: Control the upper mold and the lower mold to close by a press, forming an injection chamber between the upper mold and the lower mold; Step 3: Close the overflow glue channel of the upper mold, drive the upper mold to move to a preset position toward the lower mold by a press, perform a first pressure treatment on the injection chamber, and then inject resin into the injection chamber; Step 4: After the resin injection amount reaches a preset value, open the overflow glue channel, and drive the upper mold to perform a second pressure treatment by a press. The use of a two-stage pressure method to apply pressure to the reinforcing material and the resin can effectively improve the fusion effect of the reinforcing material and the resin, and effectively improve the performance of the reinforced composite material product produced.

[0010] CN114918306A discloses an injection-stamping forming method and device for metal-resin laminated structures. The method injects fluid resin from one side of the core interlayer of two metal plates to be stamped by applying injection pressure, while exhausting the air on the other side to achieve injection filling. After the core interlayer is filled with resin, the injection pressure is further increased. Under the action of pressure, the fluid resin pushes the metal sheet to undergo plastic deformation. At the same time, the press is started, and the upper mold is driven downward by the press slider. The forming step is completed under the combined action of liquid expansion pressure. Finally, the metal-resin laminated structure part with a geometric characteristic structure is obtained by maintaining pressure in the mold and heating and curing. Through the synergistic effect of injection pressurization and mold stamping action, the fluid resin actively participates in the plastic deformation process of the metal outer layer, and the forming and manufacturing of the specific metal-resin laminated structure part is completed in a single process. Good forming quality can be obtained, and the forming efficiency is effectively improved.

[0011] However, the curing efficiency of the above-mentioned resin curing device and method needs to be further improved to shorten the equipment and mold occupancy time. Summary of the Invention

[0012] In view of the problems existing in the prior art, the present invention provides a resin rapid curing device and a method for using the same. The device utilizes a mold temperature controller to heat the resin in the mold, applies pressure to the mold at the same time, and connects the mold to a high-frequency oscillation circuit device, thereby significantly improving the resin curing efficiency and shortening the curing time. Moreover, after curing, the resin does not need to wait in the mold to cool down, but can be directly taken out and cooled naturally, greatly reducing the time occupied by the equipment and mold.

[0013] To achieve this object, the present invention adopts the following technical solutions:

[0014] In a first aspect, the present invention provides a resin rapid curing device, comprising a lower mold, an upper mold, a first insulating member, and a press machine arranged sequentially from bottom to top on a workbench;

[0015] The lower die and the upper die are both connected to a high-frequency oscillation circuit device;

[0016] The lower mold and the upper mold are connected to the mold temperature controller via mold temperature controller pipelines.

[0017] The resin rapid curing device described in the present invention includes a high-frequency oscillation circuit device. Both the lower mold and the upper mold are connected to the high-frequency oscillation circuit device. A high-frequency electromagnetic field is used to make the polar resin molecules to be cured absorb energy, thereby increasing the molecular movement speed. During the resin curing temperature rise stage, it is conducive to rapid temperature rise and reduces the temperature difference in the thickness direction of the resin.

[0018] The rapid resin curing device described herein also includes a mold temperature controller. This design takes into account that after the resin reaches the constant temperature stage during curing, the temperature rise increases the speed of resin molecules, causing disordered molecular motion and an increase in entropy, which slows the resin curing process. Therefore, the mold temperature controller is used to control the temperature and mitigate this negative effect. Furthermore, the high-frequency electromagnetic field's effect on the polar resin molecules forces them to move in accordance with the electromagnetic field's action, reducing entropy.

[0019] The resin rapid curing device described in the present invention has a reasonable design, is easy to use, and greatly increases the curing reaction speed. Moreover, under the action of a polar electromagnetic field with a fixed direction, after the resin is cured, the resin part will not produce internal stress such as warping. There is no need to wait for cooling in the mold, and it can be directly taken out and cooled naturally. This greatly reduces the time occupied by equipment and molds, greatly improves production efficiency, and can be applied to the production of large quantities of resin products, such as the direct production of carbon fiber parts.

[0020] The high-frequency electromagnetic field generated by the high-frequency oscillation circuit device in the present invention is completely different from the high-frequency electromagnetic heating used in the prior art in accelerating the curing of resin, and the curing effects are also very different. The high-frequency oscillation circuit device in the present invention refers to a circuit that can generate high-frequency signals, which is usually used in radio communications, radar systems, etc. It generates high-frequency oscillation signals through electronic components (such as transistors, inductors, capacitors, etc.), which are mainly used for signal transmission and processing, rather than directly for heating. The present invention uses a high-frequency electromagnetic field with a fixed polarity direction generated by a high-frequency oscillation circuit device to increase the reaction power of resin molecules, reduce the reaction activation energy, and greatly increase the curing reaction speed. High-frequency electromagnetic induction heating in the prior art uses the principle of magnetic field induced current (i.e. eddy current) for heating. Conventional industrial frequency power supply is rectified and inverted through electronic technology to generate a high-frequency alternating magnetic field with constantly changing polarity. When a conductive material is in this magnetic field, eddy currents are induced to generate heat, thereby achieving heating.

[0021] The core concept of the rapid resin curing device provided by the present invention is the use of a high-frequency oscillating circuit device to generate a high-frequency electromagnetic field with a fixed polarity. This fundamentally differs from the prior art disclosed in CN115746502A, which mixes manganese-zinc-iron oxide nanomaterials with epoxy resin and then cures the material in a magnetic field using an electromagnetic induction heater. It is also completely different from existing curing methods that use radiation heating or hot air. The rapid resin curing device provided by the present invention can be used to rapidly cure carbon fiber materials containing resin.

[0022] Preferably, both the lower mold and the upper mold are metal molds.

[0023] Preferably, the first insulating member includes an insulating terminal or an insulating block.

[0024] Preferably, a second insulating member is provided between the lower mold and the upper mold because both the lower mold and the upper mold are metal molds and must be insulated when connected to a high-frequency oscillation circuit to play an isolation role.

[0025] Preferably, the second insulating member may be insulating cloth, insulating release paper or other insulating materials.

[0026] Preferably, the lower mold is connected to a mold temperature controller to better achieve temperature control during the resin curing process.

[0027] In a second aspect, the present invention further provides a method for using the resin rapid curing device, which is applicable to the resin rapid curing device as described in the first aspect, and the method comprises the following steps:

[0028] (1) After the mold temperature controller is started and heated to a first temperature, the resin to be cured is placed in the lower mold and the upper mold, and the press is pressed down to the mold closing position;

[0029] (2) the mold temperature controller is heated to a second temperature, and the high-frequency oscillation circuit device is turned on at the same time to output a high-frequency electromagnetic field to cure the resin;

[0030] (3) After the resin is cured, the mold is opened and the finished object is taken out.

[0031] The method for using the rapid resin curing device described in this invention utilizes the non-thermal effect of a fixed-polarity high-frequency electromagnetic field to cure the resin. This alters the reaction kinetics, reduces the activation energy, and significantly accelerates the resin curing reaction. This results in excellent resin curing results and significantly improves efficiency. Furthermore, the time required for curing equipment and molds is significantly reduced, facilitating large-scale production.

[0032] The method for using the resin rapid curing device described in the present invention first raises the temperature of the mold temperature controller to a lower first temperature to preheat the resin to be cured, and then raises the temperature to a higher second temperature to cure the resin. This can effectively shorten the curing time of the resin to be cured, reduce the equipment and mold occupancy time, and improve the production efficiency of finished resin parts.

[0033] The method for using the resin rapid curing device described in the present invention can not only cure the polar resin itself, but also cure and mold carbon fiber prepreg containing polar resin, resin-coated carbon fiber cloth, resin-coated glass fiber cloth and other materials containing polar resin, and resin parts with mold cores.

[0034] Preferably, the resin to be cured in step (1) comprises a polar resin.

[0035] Preferably, the polar resin comprises any one or a combination of at least two of epoxy resin, phenolic resin, melamine formaldehyde resin, polyurethane resin, unsaturated polyester resin, thermosetting polypropylene resin or silicone resin, wherein typical but non-limiting combinations include a combination of epoxy resin and phenolic resin, a combination of melamine formaldehyde resin and polyurethane resin, a combination of unsaturated polyester resin and thermosetting polypropylene resin or a combination of silicone resin and melamine formaldehyde resin.

[0036] Preferably, when the resin to be cured is an epoxy resin, the first temperature in step (1) is 90-100°C, for example, it can be 90°C, 93°C, 94°C, 95°C, 97°C, 98°C or 100°C, etc., but is not limited to the listed values, and other unlisted values ​​within this numerical range are also applicable.

[0037] Preferably, when the resin to be cured is an epoxy resin, the second temperature in step (2) is 130-170°C, for example, it can be 130°C, 135°C, 138°C, 140°C, 145°C, 150°C, 160°C or 170°C, etc., but is not limited to the listed values, and other unlisted values ​​within this numerical range are also applicable.

[0038] In the present invention, the first temperature in step (1) and the second temperature in step (2) are adjusted according to different curing requirements of the resin to be cured.

[0039] Preferably, the frequency of the high-frequency electromagnetic field is 1 MHz to 300 MHz, for example, it can be 1 MHz, 27.12 MHz, 50 MHz, 100 MHz, 200 MHz or 300 MHz, etc., but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0040] The method for using the rapid resin curing device described herein does not specify the power of the high-frequency electromagnetic field and can be adjusted based on the actual thickness of the resin to be cured. When the electromagnetic oscillation core component is air-cooled, the power output interval can be adjusted based on the power of the high-frequency electromagnetic field. When the electromagnetic oscillation core component is liquid-cooled, the high-frequency electromagnetic field output can be continuously maintained.

[0041] During the curing process, the resin rapid curing device of the present invention can adjust the up and down movement of the press according to actual conditions to discharge the gas that may be generated during the curing process. At this time, the high-frequency vibration circuit device must be disconnected.

[0042] As a preferred technical solution of the present invention, the method of use comprises the following steps:

[0043] (1) After starting the mold temperature controller and heating it to 90-100° C., the resin to be cured is placed in the lower mold and the upper mold, and the press is pressed down to the mold closing position; the resin to be cured is epoxy resin;

[0044] (2) The mold temperature controller is raised to 130-170°C, and the high-frequency oscillation circuit device is turned on at the same time to generate a high-frequency electromagnetic field with a frequency of 1MHz-300MHz to cure the resin;

[0045] (3) After the resin is cured, the mold is opened and the finished object is taken out.

[0046] Compared with the prior art, the present invention has at least the following beneficial effects:

[0047] (1) The resin rapid curing device provided by the present invention heats and pressurizes the resin while superimposing a high-frequency electromagnetic field to cure the resin, thereby accelerating the resin curing efficiency, achieving a good resin curing effect, and greatly reducing the occupancy time of the curing equipment and mold, which is conducive to large-scale production.

[0048] (2) The method for using the resin rapid curing device provided by the present invention is simple to operate, and the output power of the high-frequency electromagnetic field can be adjusted according to the thickness of the resin to be cured to achieve rapid curing of the resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a schematic structural diagram of the resin rapid curing device in Example 1 of the present invention.

[0050] Figure 2 This is a temperature-time ladder diagram of the resin curing in Example 5 of the present invention.

[0051] Figure 3 It is a temperature-time ladder diagram of the resin curing in Comparative Example 1 of the present invention.

[0052] In the figure: 1-press; 2-upper mold; 3-mold temperature controller pipeline; 4-upper mold cable; 5-lower mold; 6-lower mold cable; 7-high-frequency oscillation circuit device; 8-mold temperature controller; 9-first insulating member. DETAILED DESCRIPTION

[0053] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0054] The present invention is further described in detail below. However, the following examples are merely simplified examples of the present invention and do not represent or limit the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

[0055] It should be understood that, in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0056] It should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0057] Example 1

[0058] This embodiment provides a resin rapid curing device, the structural diagram of which is shown in FIG. Figure 1 shown.

[0059] The resin rapid curing device includes a lower mold 5, an upper mold 2, a first insulating member 9 and a press 1 arranged in sequence from bottom to top on a workbench;

[0060] The lower mold 5 and the upper mold 2 are both connected to the high-frequency oscillation circuit device 7; the lower mold 5 is connected to the high-frequency oscillation circuit device 7 via the lower mold cable 6; the upper mold 2 is connected to the high-frequency oscillation circuit device 7 via the upper mold cable 4.

[0061] The lower mold 5 and the upper mold 2 are connected to a mold temperature controller 8 via a mold temperature controller pipeline 3 .

[0062] The lower mold 5 and the upper mold 2 are both metal molds.

[0063] The first insulating member 9 is an insulating terminal;

[0064] A second insulating member is further provided between the lower mold 5 and the upper mold 2;

[0065] The second insulating member is an insulating cloth.

[0066] Example 2

[0067] This embodiment provides a method for using the resin rapid curing device as described in Example 1, the method comprising the following steps:

[0068] (1) After starting the mold temperature controller and heating it to 93°C, the resin to be cured is placed in the lower mold and the upper mold, and the press is pressed down to the mold closing position; the resin to be cured is epoxy resin;

[0069] (2) The mold temperature controller is raised to 138°C, and the high-frequency oscillation circuit device is turned on at the same time to generate a high-frequency electromagnetic field with a frequency of 27.12 MHz to cure the resin;

[0070] (3) After the resin is cured, the mold is opened and the finished object is taken out.

[0071] Example 3

[0072] This embodiment provides a method for using the resin rapid curing device as described in Example 1, the method comprising the following steps:

[0073] (1) After starting the mold temperature controller and heating it to 100° C., the resin to be cured is placed in the lower mold and the upper mold, and the press is pressed down to the mold closing position; the resin to be cured is epoxy resin;

[0074] (2) The mold temperature controller is raised to 130°C, and the high-frequency oscillation circuit device is turned on at the same time to generate a high-frequency electromagnetic field with a frequency of 13.56 MHz to cure the resin;

[0075] (3) After the resin is cured, the mold is opened and the finished object is taken out.

[0076] Example 4

[0077] This embodiment provides a method for using the resin rapid curing device as described in Example 1, the method comprising the following steps:

[0078] (1) After starting the mold temperature controller and heating it to 100° C., the resin to be cured is placed in the lower mold and the upper mold, and the press is pressed down to the mold closing position; the resin to be cured includes a polar resin; and the polar resin is an epoxy resin;

[0079] (2) The mold temperature controller is raised to 150°C, and the high-frequency oscillation circuit device is turned on at the same time to generate a high-frequency electromagnetic field with a frequency of 40.68 MHz to cure the resin;

[0080] (3) After the resin is cured, the mold is opened and the finished object is taken out.

[0081] Based on Examples 2 to 4, it can be concluded that the resin rapid curing device and the method of use provided by the present invention cure the resin by superimposing a high-frequency electromagnetic field on the resin while heating and pressurizing, thereby accelerating the resin curing efficiency, achieving a good resin curing effect, and significantly reducing the occupancy time of the curing equipment and mold, which is conducive to large-scale production.

[0082] In Example 5 and Comparative Examples 1-2, the first resin to be cured and the second resin to be cured were cured to compare the curing effects.

[0083] The first resin to be cured is a 150g unidirectional carbon fiber prepreg containing epoxy resin purchased from the material supplier Daxing Composite Materials Factory; its thickness is 0.15mm, length is 70mm, width is 35mm, and the three-layer stacking thickness is 0.45mm.

[0084] The second resin to be cured is a 3K 200g plain carbon fiber prepreg containing epoxy resin purchased from the material supplier Daxing Composite Materials Factory; its thickness is 0.2mm, length is 70mm, width is 35mm, and the stacked thickness of the three layers is 0.6mm.

[0085] Example 5

[0086] This embodiment provides a method for using the resin rapid curing device as described in Example 1, the method comprising the following steps:

[0087] (1) After starting the mold temperature controller and heating it to 100°C, the resin to be cured is placed in the lower and upper molds, and the press is pressed down to the mold closing position;

[0088] (2) The mold temperature controller is heated to 130°C at a rate of 5°C per minute and kept warm for 8 minutes; at the same time, a high-frequency oscillation circuit device is turned on to generate a high-frequency electromagnetic field with a frequency of 27.12 MHz and an output power of 2 kW to cure the resin;

[0089] (3) After the resin is cured, the mold is opened and the finished product is taken out and allowed to cool naturally.

[0090] Comparative Example 1

[0091] This comparative example provides a method for curing a resin, comprising:

[0092] First, heat the mold to 100°C for preheating, then put the resin to be cured into the mold. After the press is pressed down to close the mold, the temperature is raised to 130°C at a rate of 3°C per minute and maintained for 30 minutes. The mold is then cooled naturally and the finished object is taken out.

[0093] The resin curing temperature time ladder diagrams in Example 5 and Comparative Example 1 are as follows: Figure 2 and Figure 3 As shown, Figure 2 The displayed figure is the temperature-time ladder diagram of resin curing under the thermosetting method + high-frequency electromagnetic field curing. Figure 3 The temperature-time trapezoidal diagram of resin curing under the standard thermosetting method is shown. It can be seen that resin curing includes three stages: heating stage, heat preservation stage and cooling stage. Among them, the slope of the curve of the heating stage of Example 5 is larger, and the heat preservation stage time is greatly reduced compared with that of Comparative Example 1, which saves a lot of curing time and reduces the time occupied by equipment and molds.

[0094] Comparative Example 2

[0095] This comparative example provides a method for curing a resin, comprising:

[0096] The mold is placed under room temperature, and then the resin to be cured is placed in it. The press is pressed down to close the mold, and at the same time, the high-frequency electromagnetic field device is turned on to generate a high-frequency electromagnetic field with a frequency of 27.12MHz. The mold is opened, the finished object is taken out, and it is cooled naturally.

[0097] The resin materials before curing and the finished products after curing of Example 5 and Comparative Examples 1-2 were analyzed by infrared spectrometer to obtain the degree of curing (conversion rate of epoxy groups). The calculation equation is:

[0098]

[0099] Wherein, X represents the degree of curing, A915 and A1508 represent the areas of the epoxy peak and benzene ring peak, respectively.

[0100] The curing degree results of Example 5 and Comparative Examples 1-2, as well as the appearance and feel of the finished articles after curing, are shown in Table 1.

[0101] Table 1

[0102]

[0103] From Table 1 we can see that:

[0104] (1) In Example 5, under the conditions of heating and pressurizing, a high-frequency electromagnetic field is added at the same time, which greatly accelerates the curing speed of the resin, makes the process simple and efficient, and improves the curing degree.

[0105] (2) In comparative example 1, under heating and pressurization, the resin can be cured according to the curing curve, but the curing time is longer than that of example 1.

[0106] (3) When pressurized at room temperature and a high-frequency electromagnetic field was added at the same time, the resin was basically not cured, indicating that the thermal effect brought by the high-frequency electromagnetic field was not sufficient to provide the heat required for resin curing and could not reach the temperature required for resin curing.

[0107] In summary, the resin rapid curing device described in the present invention has a good resin curing effect and greatly improved efficiency by superimposing a high-frequency electromagnetic field while heating and pressurizing; the occupied time of the curing equipment and mold is greatly reduced, and it is suitable for large-scale production.

[0108] It should be noted that the present invention uses the above-described embodiments to illustrate the detailed structural features of the present invention. However, the present invention is not limited to these detailed structural features, and this does not mean that the present invention must rely on these detailed structural features to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent replacements for selected components, additions of auxiliary components, and selection of specific methods, etc., fall within the scope of protection and disclosure of the present invention.

[0109] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the scope of protection of the present invention.

Claims

1. A resin rapid curing device, characterized in that: The resin rapid curing device includes a lower mold, an upper mold, a first insulating member and a press machine arranged in sequence from bottom to top on a workbench; The lower die and the upper die are both connected to a high-frequency oscillation circuit device; The lower mold and the upper mold are connected to the mold temperature controller via mold temperature controller pipelines.

2. The resin rapid curing device according to claim 1, characterized in that: The lower mold and the upper mold are both metal molds.

3. The resin rapid curing device according to claim 1 or 2, characterized in that: The first insulating member includes an insulating terminal or an insulating block; Preferably, a second insulating member is further provided between the lower mold and the upper mold.

4. The resin rapid curing device according to any one of claims 1 to 3, characterized in that: The lower mold is connected to a mold temperature controller.

5. A method for using a resin rapid curing device, applicable to the resin rapid curing device according to any one of claims 1 to 4, characterized in that: The method of use comprises the following steps: (1) After the mold temperature controller is started and heated to a first temperature, the resin to be cured is placed in the lower mold and the upper mold, and the press is pressed down to the mold closing position; (2) the mold temperature controller is heated to a second temperature, and the high-frequency oscillation circuit device is turned on at the same time to output a high-frequency electromagnetic field to cure the resin; (3) After the resin is cured, the mold is opened and the finished object is taken out.

6. The method of use according to claim 5, characterized in that: The resin to be cured in step (1) includes a polar resin.

7. The method of use according to claim 6, characterized in that: The polar resin includes any one of epoxy resin, phenolic resin, melamine formaldehyde resin, polyurethane resin, unsaturated polyester resin, thermosetting polypropylene resin or silicone resin, or a combination of at least two of them.

8. The method of use according to any one of claims 5 to 7, characterized in that: When the resin to be cured is epoxy resin, the first temperature in step (1) is 90-100°C.

9. The method of use according to any one of claims 5 to 8, characterized in that: When the resin to be cured is epoxy resin, the second temperature in step (2) is 130-170° C.; Preferably, the frequency of the high-frequency electromagnetic field in step (2) is 1 to 300 MHz.

10. The method of use according to any one of claims 5 to 9, characterized in that: The method of use comprises the following steps: (1) After starting the mold temperature controller and heating it to 90-100° C., the resin to be cured is placed in the lower mold and the upper mold, and the press is pressed down to the mold closing position; the resin to be cured is epoxy resin; (2) The mold temperature controller is raised to 130-170°C, and the high-frequency oscillation circuit device is turned on at the same time to generate a high-frequency electromagnetic field with a frequency of 1-300 MHz to cure the resin; (3) After the resin is cured, the mold is opened and the finished object is taken out.

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