Wafer detection device

Abstract

The invention belongs to the technical field of wafer detection, and discloses a wafer detection device. The wafer detection device comprises a rotating mechanism and a detection mechanism. The rotating mechanism is used for clamping and rotating a wafer. The detection mechanism comprises a machine base, a lever, a spraying assembly and a detection piece, the lever is rotationally connected to the machine base, and the spraying end of the spraying assembly is aligned with a detection point on the edge of the wafer and used for spraying fluid to the detection point of the wafer; fluid sprayed out of the spraying end of the spraying assembly can penetrate through the notch to be sprayed to the first end of the lever and enable the lever to swing, and the detection piece is used for detecting the swing state of the lever. According to the invention, the swing state of the lever is detected by spraying the fluid to the edge of the wafer so as to judge whether the edge of the wafer has a gap, the gap of the edge of the transparent or semitransparent wafer can be accurately and reliably detected, the applicability is high, the alignment rate of the wafer can be improved, the wafer is prevented from being damaged, the structure is relatively simple, and the cost is relatively low.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a wafer detection device. Background Art

[0002] In the semiconductor manufacturing process, defects on the edge of the wafer have an increasingly greater impact on the process and product yield. Therefore, it is necessary to set up a wafer detection device to detect defects on the edge of the wafer to avoid affecting the alignment rate of the wafer and avoiding chipping and damage during the subsequent clamping and processing of the wafer.

[0003] Existing wafer inspection devices use optical components to directly detect wafer edge notches. However, for transparent or translucent wafers, such as glass wafers, light can refract, affecting the accuracy of measurement results. Furthermore, existing optical components for detecting wafer edge notches are complex and expensive. Summary of the Invention

[0004] The purpose of the present invention is to provide a chip detection device that can accurately and reliably detect notches on the edge of a transparent or translucent chip, has strong applicability, can improve the alignment rate of the chip and avoid chip damage, has a relatively simple structure and low cost.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A wafer detection device, comprising:

[0007] A rotating mechanism for clamping and rotating the wafer;

[0008] The detection mechanism includes a base, a lever, a spray assembly and a detection part. The lever is rotatably connected to the base. The spray end of the spray assembly is aligned with the detection point on the edge of the wafer and is used to spray fluid to the detection point of the wafer. When there is a notch on the edge of the wafer, the fluid sprayed from the spray end of the spray assembly can pass through the notch and spray to the first end of the lever to cause the lever to swing. The detection part is used to detect the swinging state of the lever.

[0009] In some possible implementations, the spray assembly includes a spray head, which is located on a side of the lever close to the wafer, and can spray fluid onto a top surface of the first end of the lever.

[0010] In some possible implementations, the detection member is located on a side of the lever away from the wafer.

[0011] In some possible implementations, at the first end and the second end of the lever, the detection member is used to detect a distance between one end of the lever and the detection member.

[0012] In some possible implementations, the machine base includes a first base body, and the wafer detection device further includes a conveying mechanism, wherein the conveying mechanism is disposed on the first base body and is used to transport the wafer along a length direction of the first base body.

[0013] In some possible embodiments, the first base body is provided with a through hole, the lever is arranged in the through hole, the lever is provided with a rotating shaft on opposite sides, the hole wall of the through hole is provided with two connecting holes, the two connecting holes are provided in a one-to-one correspondence with the two rotating shafts, and the rotating shaft is rotatably connected to the connecting holes.

[0014] In some possible embodiments, the conveying mechanism includes a driving member and two first belts, the two first belts are respectively located on opposite sides of the first base body and are extended along the length direction of the first base body, and the driving member is used to drive the two first belts to move to drive the chip to move.

[0015] In some possible implementations, the spray assembly includes a spray head and a third base, and the spray head is adjustably disposed on the third base.

[0016] In some possible implementations, when the ejection end of the injection assembly is aligned with a detection point on the edge of the wafer, the first end of the lever is positioned close to the wafer, and the second end of the lever is positioned away from the wafer.

[0017] In some possible implementations, the first end of the lever is provided with an avoidance groove for avoiding the wafer.

[0018] Beneficial effects of the present invention:

[0019] The wafer inspection device provided by the present invention includes a rotating mechanism and a detection mechanism. The rotating mechanism is used to clamp and rotate the wafer. The detection mechanism includes a base, a lever, a spray assembly, and a detection element. During inspection, the rotating mechanism rotates the wafer, and the spray end of the spray assembly aligns with a detection point on the wafer edge, spraying fluid to the detection point. The fluid flow rate remains stable. When the wafer edge is intact, the fluid is blocked by the wafer, and the lever does not move. When the wafer edge has a notch, that is, a flat edge, a regular or irregular opening, the fluid sprayed from the spray end of the spray assembly can pass through the notch and spray to the first end of the lever, causing the lever to swing. At this time, the lever produces a large deflection and reaches the set range of the detection element. The detection element generates a trigger signal and feeds the signal back to other equipment or the rotating mechanism. Therefore, the present invention combines the spray assembly, the lever, and the detection element. By spraying fluid onto the wafer edge, the swing state of the lever is detected, and the presence of a notch on the wafer edge is determined. This device can accurately and reliably detect notches on the edges of transparent or translucent wafers. It has strong applicability, can improve wafer alignment efficiency, and prevent wafer damage. It has a relatively simple structure and is low in cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the wafer detection device provided by the present invention;

[0021] Figure 2 This is a partial structural diagram of the wafer detection device provided by the present invention (when detecting that the edge of the wafer is intact);

[0022] Figure 3 It is a partial structural diagram of the wafer detection device provided by the present invention (when a notch is detected on the edge of the wafer).

[0023] In the picture:

[0024] 1. Machine base; 11. First base; 111. Through hole; 12. Second base; 2. Lever; 21. Avoidance groove; 3. Spray assembly; 31. Spray head; 32. Third base; 33. Conveying pipe; 4. Conveying mechanism; 41. First belt; 42. First shaft; 43. Second shaft; 44. Second belt;

[0025] 100. Chip. DETAILED DESCRIPTION

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0027] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0029] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meanings.

[0030] like Figures 1 to 3 As shown, the present invention provides a chip detection device, including a rotating mechanism and a detection mechanism. The rotating mechanism is used to clamp and rotate the chip 100; the detection mechanism includes a base 1, a lever 2, a spray assembly 3 and a detection member. The lever 2 is rotatably connected to the base 1. The spray end of the spray assembly 3 is aligned with the detection point on the edge of the chip 100 and is used to spray fluid to the detection point of the chip 100. When there is a notch on the edge of the chip 100, the fluid sprayed from the spray end of the spray assembly 3 can pass through the notch and spray to the first end of the lever 2 to cause the lever 2 to swing. The detection member is used to detect the swinging state of the lever 2. Optionally, the fluid sprayed from the spray end of the spray assembly 3 is water, and the flow rate of the water is adjustable. The flow rate of water is increased during detection. When not detecting, the spray assembly 3 can be closed or maintained at a small water flow.

[0031] During the test, the rotating mechanism rotates the wafer 100, and the ejection end of the spray assembly 3 is aligned with the test point on the edge of the wafer 100, and the fluid is sprayed to the test point, and the flow rate of the fluid remains unchanged, as shown in FIG. Figure 2As shown, when the edge of the chip 100 is intact, the fluid is blocked by the chip 100 and the lever 2 does not move. It is understandable that the fluid may partially fall onto the lever 2, causing the lever 2 to deflect, but since the flow rate of the fluid remains unchanged, the lever 2 can remain motionless in the deflected position, and has not reached the set range of the detection component, and the detection component will not send a trigger signal. When there is a notch on the edge of the chip 100, that is, when there is a flat edge, regular or irregular opening, the fluid ejected from the ejection end of the injection assembly 3 can pass through the notch and spray to the first end of the lever 2 and cause the lever 2 to swing. At this time, the lever 2 produces a large deflection and reaches the set range of the detection component. The detection component sends a trigger signal and feeds the signal back to other devices or a rotating mechanism. Specifically, the detection component feeds the signal back to other devices to record the notch situation of the chip 100, or feeds the signal back to the rotating mechanism, and the rotating mechanism stops running to mark the position of the notch. Therefore, the present invention combines the injection assembly 3, the lever 2, and the detection element. By injecting fluid toward the edge of the wafer 100 to detect the swinging state of the lever 2, it is determined whether there is a notch on the edge of the wafer 100. This can accurately and reliably detect notches on the edges of transparent or translucent wafers 100, and can also accurately and reliably detect opaque wafers 100. It has strong applicability, can improve the alignment rate of the wafer 100, and can avoid damage to the wafer 100. It has a relatively simple structure and low cost. In addition, the wafer detection device does not directly contact the wafer 100, and will not cause damage to the wafer 100 or secondary contamination.

[0032] Optionally, in this embodiment, the injection assembly 3 includes a nozzle 31, which is located on the side of the lever 2 close to the chip 100, and the nozzle 31 can spray the fluid to the top surface of the first end of the lever 2. Specifically, the fluid sprayed by the nozzle 31 falls vertically to the top surface of the first end of the lever 2. With this arrangement, the sprayed fluid falls from top to bottom on the lever 2, and the flow rate requirement for the sprayed fluid is low, and the fluid can fall by gravity. In other embodiments, the nozzle 31 can spray the fluid to the bottom surface of the first end of the lever 2, that is, the sprayed fluid is sprayed from bottom to top on the lever 2, so that when there is a notch on the edge of the chip 100, the fluid sprayed by the nozzle 31 can pass through the notch and spray to the first end of the lever 2 and cause the lever 2 to swing.

[0033] Optionally, the detection member is located on the side of the lever 2 away from the chip 100. This arrangement optimizes the spatial layout and avoids interference between the detection member and the injection assembly 3. Furthermore, at the first end and the second end of the lever 2, the detection member is used to detect the distance between one end of the lever 2 and the detection member. During the swinging process of the lever 2, since the distances between the first end and the second end of the lever 2 relative to the detection member will change, the distance of one end can be detected. In this embodiment, the detection member is used to detect the distance between the first end of the lever 2 and the detection member. Specifically, the detection member is a magnetic proximity switch. In addition, the machine base 1 includes a second base body 12, and the magnetic proximity switch is waterproofly packaged in the second base body 12. In other embodiments, the detection member is located on the side of the lever 2 close to the chip 100, and is used to detect the distance between the second end of the lever 2 and the detection member. In other embodiments, the detection member is an angle sensor for measuring the swing angle of the lever 2.

[0034] Optionally, in this embodiment, the base 1 includes a first base body 11, and the wafer detection device further includes a conveying mechanism 4, which is provided on the first base body 11 and is used to convey the wafer 100 along the length direction of the first base body 11. By providing the conveying mechanism 4, it is convenient to convey the wafer 100 to the detection mechanism and the rotation mechanism. After the detection of the previous wafer 100 is completed, the next wafer 100 can be detected, thereby improving the detection efficiency. In addition, the position of the wafer 100 can be adjusted by the conveying mechanism 4, and multiple detections can be performed to avoid the problem that the nozzle 31 is aligned with the point closest to the center of the notch line of the wafer 100, resulting in the failure to detect the notch and the inaccurate detection. Of course, the position of the wafer 100 can also be adjusted by the rotation mechanism to avoid the problem of inaccurate detection.

[0035] Optionally, in this embodiment, the first base 11 is provided with a through hole 111, the lever 2 is disposed within the through hole 111, and a rotating shaft is provided on opposite sides of the lever 2. The wall of the through hole 111 is provided with two connecting holes, and the two connecting holes are provided in a one-to-one correspondence with the two rotating shafts, and the rotating shafts are rotatably connected to the connecting holes. Placing the lever 2 within the through hole 111 saves space occupied by the lever 2 and makes the structure more compact. In this embodiment, the lever 2 is provided with rotating shafts on opposite sides to enable the lever 2 to rotate, ensuring smooth rotation. In other embodiments, a rotating shaft is provided on one side of the lever 2, and a connecting hole is provided on the wall of the through hole 111, and the rotating shaft is rotatably connected to the connecting hole.

[0036] Optionally, the conveyor mechanism 4 includes a drive member and two first belts 41. The two first belts 41 are located on opposite sides of the first base 11 and extend along the length of the first base 11. The drive member is used to drive the two first belts 41 to move, thereby moving the wafer 100. This arrangement ensures stable conveyance of the wafer 100 without affecting edge detection of the wafer 100. In this embodiment, the conveyor mechanism 4 also includes a first shaft 42, a second shaft 43, a third shaft, and two second belts 44. The first shaft 42, the second shaft 43, and the third shaft are all disposed through and rotatably connected to the first base 11. Pulleys are provided at each end of the first shaft 42, the second shaft 43, and the third shaft. The ends of the second belt 44 are respectively connected to the pulley of the first shaft 42 and one of the pulleys of the second shaft 43. The ends of the first belt 41 are respectively connected to the other pulley of the second shaft 43 and the pulley of the third shaft. The drive member is used to drive the first shaft 42 to rotate. This arrangement provides a simple structure and achieves synchronous movement of the two first belts 41.

[0037] Optionally, the spray assembly 3 includes a spray head 31 and a third base body 32, and the position of the spray head 31 is adjustably arranged on the third base body 32. With this arrangement, when the flow rate of the fluid remains unchanged, it is convenient to adjust the position of the fluid sprayed on the lever 2, and then adjust the swing amplitude of the lever 2 to meet the requirement that the detection part can send a trigger signal when the deflection position of the lever 2 reaches the set range of the detection part. Specifically, the third base body 32 is provided with a waist-shaped hole along the length direction, and the spray head 31 is provided with a circular hole. The bolt passes through the circular hole and the waist-shaped hole and is threadedly connected to the nut. With this arrangement, the structure is simple and easy to adjust. In addition, the spray assembly 3 also includes a delivery pipe 33, which is used to deliver fluid to the spray head 31.

[0038] Optionally, in this embodiment, when the ejection end of the injection assembly 3 is aligned with the detection point on the edge of the wafer 100, the first end of the lever 2 is positioned close to the wafer 100, and the second end of the lever 2 is positioned away from the wafer 100. This arrangement increases the swing range of the lever 2 and prevents the second end of the lever 2 from contacting the bottom surface of the wafer 100 during the swing of the lever 2, thereby restricting the swing of the lever 2 and affecting the detection results.

[0039] Optionally, a first end of the lever 2 is provided with an avoidance groove 21 for avoiding the wafer 100 to prevent the lever 2 from interfering with the wafer 100 during the swinging process.

[0040] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A wafer inspection device, characterized in that: include: A rotating mechanism for clamping and rotating the wafer (100); A detection mechanism comprises a base (1), a lever (2), a spray assembly (3) and a detection member, wherein the lever (2) is rotatably connected to the base (1), the spray end of the spray assembly (3) is aligned with a detection point on the edge of the chip (100), and is used to spray fluid to the detection point of the chip (100); when there is a notch on the edge of the chip (100), the fluid sprayed from the spray end of the spray assembly (3) can pass through the notch and spray to the first end of the lever (2) and cause the lever (2) to swing; the detection member is used to detect the swinging state of the lever (2).

2. The wafer inspection device according to claim 1, wherein: The injection assembly (3) includes a nozzle (31), which is located on a side of the lever (2) close to the chip (100), and the nozzle (31) can spray fluid onto the top surface of the first end of the lever (2).

3. The wafer inspection device according to claim 2, wherein: The detection member is located on a side of the lever (2) away from the chip (100).

4. The wafer inspection device according to claim 3, wherein: At the first end and the second end of the lever (2), the detection member is used to detect the distance between one end of the lever (2) and the detection member.

5. The wafer inspection device according to claim 1, wherein: The machine base (1) includes a first base body (11), and the chip detection device also includes a conveying mechanism (4). The conveying mechanism (4) is arranged on the first base body (11) and is used to convey the chip (100) along the length direction of the first base body (11).

6. The wafer inspection device according to claim 5, wherein: The first base (11) is provided with a through hole (111), the lever (2) is arranged in the through hole (111), and the lever (2) is provided with a rotating shaft on both opposite sides. The hole wall of the through hole (111) is provided with two connecting holes, and the two connecting holes are arranged in a one-to-one correspondence with the two rotating shafts, and the rotating shaft is rotatably connected to the connecting holes.

7. The wafer inspection device according to claim 5, wherein: The conveying mechanism (4) includes a driving member and two first belts (41), wherein the two first belts (41) are respectively located on opposite sides of the first base (11) and are both extended along the length direction of the first base (11), and the driving member is used to drive the two first belts (41) to move, thereby driving the chip (100) to move.

8. The wafer inspection device according to claim 1, wherein: The spray assembly (3) comprises a spray head (31) and a third seat (32), and the spray head (31) is adjustably arranged on the third seat (32).

9. The wafer inspection device according to any one of claims 1 to 8, characterized in that: When the ejection end of the injection assembly (3) is aligned with a detection point on the edge of the chip (100), the first end of the lever (2) is arranged close to the chip (100), and the second end of the lever (2) is arranged away from the chip (100).

10. The wafer inspection device according to any one of claims 1 to 8, characterized in that: The first end of the lever (2) is provided with an avoidance groove (21) for avoiding the wafer (100).

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