Thermal test device

Abstract

The embodiment of the invention provides a thermal test device, and aims to realize single-sided heating of a thermal test material. According to the thermal test device, the heating module is located on one side of the supporting plate so as to heat the thermal test material located in the first opening of the supporting plate, and the first heat insulation plate is attached to the side, facing the heating module, of the supporting plate; the size of a second opening formed in the first heat insulation plate is smaller than that of a first opening formed in the supporting plate, so that the first heat insulation plate can shield a gap between the supporting plate and the thermal test material; the heat is prevented from being transferred to the other side of the hot test material from the gap between the supporting plate and the first heat insulation plate, the heating module can only heat the hot test material through the second opening, that is, only part of the hot test material exposed in the second opening can be heated, and single-face heating of the hot test material is achieved.

Description

Technical Field

[0001] The present application relates to the field of heating technology, and in particular to a thermal testing device. Background Art

[0002] In order to explore the thermal physical properties of non-metallic composite materials under ultra-high temperature conditions (mainly including thermal ablation performance and thermal conductivity), it is necessary to conduct ultra-high temperature thermal tests on non-metallic composite materials samples. At the same time, in order to truly simulate the actual use conditions of the product, the non-metallic composite materials samples need to be heated on one side, that is, only one side of the sample is heated, and the other sides are not allowed to be heated. Summary of the Invention

[0003] An embodiment of the present application provides a thermal testing device, which is intended to achieve single-sided heating of thermal test materials.

[0004] On the one hand, an embodiment of the present application provides a thermal testing device, which includes a carrying module and a heating module. The carrying module includes a support plate and a first thermal insulation plate. The support plate is provided with a first opening, and the first opening is used to place thermal test materials; the first thermal insulation plate is attached to the support plate, and a second opening is provided on the first thermal insulation plate. The center line of the second opening is collinear with the center line of the first opening, and the size of the second opening is smaller than the size of the first opening. The heating module is located on the side of the first thermal insulation plate away from the support plate.

[0005] In the thermal test device provided by the embodiment of the present application, the heating module is located on one side of the support plate to heat the thermal test material located in the first opening of the support plate, the first thermal insulation plate is attached to the side of the support plate facing the heating module, the size of the second opening set on the first thermal insulation plate is smaller than the size of the first opening set on the support plate, so that the first thermal insulation plate can block the gap between the support plate and the thermal test material. In the process of heating the thermal test material by the heating module, heat is prevented from being transferred from the gap between the support plate and the first thermal insulation plate to the other side of the thermal test material. The heating module can only heat the thermal test material through the second opening, that is, only the part of the thermal test material exposed in the second opening can be heated, thereby realizing single-sided heating of the thermal test material.

[0006] In some embodiments, the thermal testing device also includes an insulation module, which includes multiple second insulation boards. The multiple second insulation boards are located on the side of the first insulation board away from the support board and are connected to the first insulation board; the multiple second insulation boards enclose a third opening to form; the third opening is for the heating module to pass through.

[0007] Through the above arrangement, when the heating module approaches the support plate, the heating module can pass through the third opening formed by the multiple second insulation plates. Since the multiple second insulation plates are all connected to the first insulation plate, the second insulation plates can prevent the heat of the heating module from bypassing the first insulation plate, reducing heat loss and avoiding heating the other side of the thermal test material, further realizing single-sided heating of the thermal test material.

[0008] In some embodiments, a size of the heating module in a plane perpendicular to a centerline of the third opening is the same as a size of the third opening.

[0009] Through the above arrangement, when the heating module is located in the third opening, the gap between the heating module and the second thermal insulation plate can be reduced, so as to reduce the heat of the heating module from being dissipated from the gap between the heating module and the second thermal insulation plate, further reducing heat loss, and also avoiding heating the other side of the thermal test material, further realizing single-sided heating of the thermal test material.

[0010] In some embodiments, the heating module includes a mounting base and a heating element, the mounting base includes a mounting plate arranged parallel to the support plate, and a baffle arranged perpendicular to the support plate, and the baffle is connected to the edge of the mounting plate; when the heating module is located in the third opening, the outer wall of the baffle is in contact with the inner wall of the second insulation plate; a heating element is provided on the side of the mounting plate facing the first insulation plate.

[0011] In some embodiments, a mounting groove is provided on the side of the mounting plate facing the first thermal insulation plate, and the heating element is laid in the mounting groove; the mounting groove includes a first groove body, a second groove body and a third groove body; the mounting plate has a first end and a second end, and the first groove body, the second groove body and the third groove body all extend along the arrangement direction of the first end and the second end; wherein, an end of the first groove body close to the first end is connected to an end of the second groove body close to the first end, and an end of the second groove body close to the second end is connected to an end of the third groove body close to the second end.

[0012] Through the above arrangement, the area of ​​the installation groove is increased, thereby increasing the volume of the heating element laid in the installation groove and improving the heating efficiency of the heating element.

[0013] In some embodiments, a first temperature measuring hole is provided on the mounting plate, and the center line of the first temperature measuring hole is collinear with the center line of the second opening. The thermal testing device also includes a first thermometer, which is located on the side of the heating module away from the carrier module. The first temperature measuring hole is spaced apart from the mounting groove to ensure that the first thermometer can measure the temperature of one side of the thermal test material through the first temperature measuring hole.

[0014] In some embodiments, the insulation module also includes multiple third insulation plates and cover plates, the multiple third insulation plates are located on the side of the support plate away from the first insulation plate, and are connected to the first insulation plate; the multiple third insulation plates are enclosed to form a fourth opening; the cover plate is buckled on the fourth opening and is detachably connected to the multiple third insulation plates.

[0015] Through the above arrangement, the cover plate and the plurality of third heat insulation plates surround the other side of the thermal test material, thereby preventing the external temperature from affecting the temperature of the thermal test material.

[0016] In some embodiments, a second temperature measuring hole is provided on the cover plate, and the thermal testing device also includes a second temperature measuring device. The second temperature measuring device is located on the side of the supporting module away from the heating module. The center line of the second temperature measuring hole is collinear with the center line of the first opening to ensure that the second temperature measuring device can measure the temperature on the other side of the thermal test material through the second temperature measuring hole.

[0017] In some embodiments, the thermal testing device further includes a base, the carrying module is fixedly connected to the base, the heating module is slidably connected to the base, and the heating module can move closer to or farther away from the first thermal insulation board.

[0018] Through the above-mentioned setting, the carrying module and the heating module are both arranged on the base, the heating module is slidably connected to the base, the heating module can move closer to or away from the first thermal insulation board, and the temperature at which the thermal test material is heated can be controlled by adjusting the distance between the heating module and the first thermal insulation board.

[0019] In some embodiments, a slide rail and a drive motor are provided on the base, the extension direction of the slide rail is perpendicular to the support plate, the heating module is slidably connected to the slide rail, and the drive motor is connected to the heating module to drive the heating module to slide on the slide rail.

[0020] Through the above arrangement, the driving motor can more accurately control the sliding displacement of the heating module relative to the carrying module, thereby improving the accuracy of controlling the heated temperature of the thermal test material. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of a thermal test device in an embodiment of the present application;

[0022] Figure 2 for Figure 1 Cross-sectional view of the structure;

[0023] Figure 3 This is a schematic structural diagram of the load-bearing module and the heat insulation module in an embodiment of the present application;

[0024] Figure 4 Schematic diagram of the structure of the heating module in the embodiment of the present application.

[0025] Figure numerals: 100, thermal test device; 101, thermal test material; 10, carrying module; 11, support plate; 111, first opening; 12, first thermal insulation board; 121, second opening; 20, heating module; 21, mounting seat; 211, mounting plate; 210, mounting groove; 200, first temperature measuring hole; 212, baffle; 22, heating element; 30, base; 31, first bracket; 32, second bracket; 33, drive motor; 40, thermal insulation module; 41, second thermal insulation board; 411, third opening; 42, third thermal insulation board; 421, fourth opening; 43, cover plate; 431, second temperature measuring hole; 50, first temperature detector; 60, second temperature detector. DETAILED DESCRIPTION

[0026] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification are described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0027] In this article, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also include elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the statement "comprising a ..." do not exclude the presence of other identical elements in the process, method, article or equipment comprising the elements. The term "two or more" includes two or more than two cases.

[0028] In order to explore the thermal physical properties of non-metallic composite materials under ultra-high temperature conditions (mainly including thermal ablation performance and thermal conductivity), it is necessary to conduct ultra-high temperature thermal tests on non-metallic composite materials samples. At the same time, in order to truly simulate the actual use conditions of the product, the non-metallic composite materials samples need to be heated on one side, that is, only one side of the sample is heated, and the other sides are not allowed to be heated.

[0029] To solve the above problems, refer to Figure 1 and Figure 2An embodiment of the present application provides a thermal testing device 100, which includes a carrying module 10 and a heating module 20. The carrying module 10 is used to place a thermal test material 101 (the above-mentioned sample), and the heating module 20 is used to heat the thermal test material 101.

[0030] In the above embodiment, referring to Figure 2 and Figure 3 The carrier module 10 includes a support plate 11 having a first opening 111 therein for placing a thermal test material 101. The thermal test material 101 is illustratively a sheet and placed parallel to the support plate 11, such that the thermal test material 101 is clamped against the inner wall of the first opening 111. The heating module 20 is located on one side of the support plate 11 and is configured to heat the thermal test material 101.

[0031] The carrier module 10 also includes a first thermal insulation board 12, which is positioned between the support plate 11 and the heating module 20. The first thermal insulation board 12 and the support plate 11 are positioned in close contact with each other, with the heating module 20 positioned on the side of the first thermal insulation board 12 facing away from the support plate 11. A second opening 121 is defined in the first thermal insulation board 12. The centerline of the second opening 121 is collinear with the centerline of the first opening 111, and the size of the second opening 121 is smaller than that of the first opening 111.

[0032] In the thermal test device 100 provided by the embodiment of the present application, the heating module 20 is located on one side of the support plate 11 to heat the thermal test material 101 located in the first opening 111 of the support plate 11. The first thermal insulation plate 12 is attached to the side of the support plate 11 facing the heating module 20. The size of the second opening 121 set on the first thermal insulation plate 12 is smaller than the size of the first opening 111 set on the support plate 11, so that the first thermal insulation plate 12 can block the gap between the support plate 11 and the thermal test material 101. When the heating module 20 heats the thermal test material 101, heat is prevented from being transferred from the gap between the support plate 11 and the first thermal insulation plate 12 to the other side of the thermal test material 101. The heating module 20 can only heat the thermal test material 101 through the second opening 121, that is, only the part of the thermal test material 101 exposed in the second opening 121 can be heated, thereby achieving single-sided heating of the thermal test material 101.

[0033] The support plate 11 and the first thermal insulation plate 12 are formed of high-temperature resistant materials. For example, the support plate 11 may include a zirconia plate, an aluminum silicate ceramic fiberboard, or the like; the first thermal insulation plate 12 may also include a zirconia plate, an aluminum silicate ceramic fiberboard, or the like. The support plate 11 and the first thermal insulation plate 12 may be bonded together using a high-temperature adhesive capable of withstanding temperatures exceeding 2000°C.

[0034] In some embodiments, the thermal testing apparatus 100 further includes a base 30, which can be mounted on a reference surface or the ground. The carrier module 10 is fixedly coupled to the base 30, and the heating module 20 is slidably coupled to the base 30. The heating module 20 can be moved closer to or further away from the first thermal insulation board 12. It is understood that, when the heating power of the heating module 20 is fixed, a smaller distance between the heating module 20 and the first thermal insulation board 12 means a smaller distance between the heating module 20 and the thermal test material 101, and a higher temperature at which the thermal test material 101 can be heated. Conversely, a larger distance between the heating module 20 and the first thermal insulation board 12 means a larger distance between the heating module 20 and the thermal test material 101, and a higher temperature at which the thermal test material 101 can be heated. With the above arrangement, the carrier module 10 and the heating module 20 are both mounted on the base 30, and the heating module 20 is slidably coupled to the base 30. The heating module 20 can be moved closer to or further away from the first thermal insulation board 12. The heated temperature of the thermal test material 101 can be controlled by adjusting the distance between the heating module 20 and the first thermal insulation board 12.

[0035] In the above embodiment, a slide rail is provided on the base 30 , and the heating module 20 is slidably disposed on the slide rail. The extending direction of the slide rail is perpendicular to the plane where the support plate 11 is located.

[0036] In some embodiments, the thermal testing apparatus 100 further includes a first bracket 31 and a second bracket 32. The support plate 11 is mounted on the base 30 via the first bracket 31, and the heating module 20 is mounted on a slide rail via the second bracket 32. The second bracket 32 ​​is slidably connected to the slide rail. With this arrangement, the first bracket 31 and the second bracket 32 ​​can increase the distance between the support module 10 and the base 30, and can also increase the distance between the heating module 20 and the base 30, thereby preventing damage to the base 30 while the heating module 20 is heating the thermal test material 101.

[0037] In the above embodiment, the base 30 is further provided with a drive motor 33, which is connected to the heating module 20 and is used to drive the heating module 20 to slide on the slide rail. In conjunction with the above embodiment, the drive motor 33 can be connected to the second bracket 32, thereby controlling the sliding of the second bracket 32 ​​on the slide rail and thereby controlling the sliding of the heating module 20. This arrangement allows the drive motor 33 to more accurately control the sliding displacement of the heating module 20 relative to the carrier module 10, thereby improving the accuracy of controlling the heated temperature of the thermal test material 101.

[0038] In some embodiments, the thermal testing apparatus 100 further includes a thermal insulation module 40, which includes a plurality of second thermal insulation panels 41. The plurality of second thermal insulation panels 41 are located on a side of the first thermal insulation panel 12 facing away from the support panel 11 and are connected to the first thermal insulation panel 12. The plurality of second thermal insulation panels 41 enclose a third opening 411, through which the heating module 20 can pass. Exemplarily, each second thermal insulation panel 41 is disposed perpendicular to the first thermal insulation panel 12, and the plurality of second thermal insulation panels 41 are respectively connected to the edges of the first thermal insulation panel 12. With this arrangement, as the heating module 20 approaches the support panel 11, the heating module 20 can pass through the third opening 411 enclosed by the plurality of second thermal insulation panels 41. Since the plurality of second thermal insulation panels 41 are all connected to the first thermal insulation panel 12, the second thermal insulation panels 41 prevent heat from the heating module 20 from bypassing the first thermal insulation panel 12, thereby reducing heat loss and preventing heating of the other side of the thermal test material 101, further enabling single-sided heating of the thermal test material 101.

[0039] The second insulation board 41 is also formed of a high-temperature resistant material. For example, the second insulation board 41 may include a zirconia board, an aluminum silicate ceramic fiber board, or the like. Adjacent second insulation boards 41 and the second insulation board 41 to the first insulation board 12 can be bonded using a high-temperature adhesive capable of withstanding temperatures exceeding 2000°C.

[0040] In the above embodiment, the dimensions of the heating module 20 in a plane perpendicular to the centerline of the third opening 411 are the same as the dimensions of the third opening 411. With this arrangement, when the heating module 20 is located within the third opening 411, the gap between the heating module 20 and the second thermal insulation board 41 can be reduced, thereby reducing the amount of heat from the heating module 20 that escapes through the gap between the heating module 20 and the second thermal insulation board 41, further reducing heat loss. This also prevents heating of the other side of the thermal test material 101, further enabling single-sided heating of the thermal test material 101.

[0041] In the above embodiment, referring to Figure 2 and Figure 4 The heating module 20 includes a mounting base 21 and a heating element 22. The mounting base 21 includes a mounting plate 211 arranged parallel to the support plate 11, and a baffle 212 arranged perpendicular to the support plate 11. The baffle 212 is connected to the edge of the mounting plate 211. When the heating module 20 is located in the third opening 411, the outer wall of the baffle 212 abuts against the inner wall of the second thermal insulation plate 41. The heating element 22 is provided on the side of the mounting plate 211 facing the first thermal insulation plate 12. The heating element 22 may include a molybdenum silicide heating rod, a molybdenum carbide heating rod, or the like. The heating element 22 is electrically connected to a power source with a power output of up to 1600W.

[0042] The mounting base 21 is also formed of a high temperature resistant material, for example, the mounting base 21 may also include a zirconia plate, an aluminum silicate ceramic fiber plate, etc. The mounting plate 211 and the baffle 212 of the mounting base 21 may be integrally formed.

[0043] In the above embodiment, a mounting groove 210 is provided on the side of the mounting plate 211 facing the first heat insulation plate 12, and the heating element 22 is placed in the mounting groove 210; the mounting groove 210 includes a first groove body, a second groove body, and a third groove body; the mounting plate 211 has a first end and a second end, and the first groove body, the second groove body, and the third groove body all extend along the arrangement direction of the first end and the second end; wherein, the end of the first groove body near the first end is connected to the end of the second groove body near the first end, and the end of the second groove body near the second end is connected to the end of the third groove body near the second end. Through the above arrangement, the area of ​​the mounting groove 210 is increased, thereby increasing the volume of the heating element 22 placed in the mounting groove 210 and improving the heating efficiency of the heating element 22.

[0044] In some embodiments, a first temperature measuring hole 200 is provided on the mounting plate 211. The centerline of the first temperature measuring hole 200 is collinear with the centerline of the second opening 121. The thermal testing device 100 further includes a first temperature measuring device 50. The first temperature measuring device 50 is located on a side of the heating module 20 facing away from the carrier module 10. The first temperature measuring hole 200 is spaced apart from the mounting groove 210 to ensure that the first temperature measuring device 50 can measure the temperature of one side of the thermal test material 101 through the first temperature measuring hole 200. The first temperature measuring device 50 may be an infrared thermometer.

[0045] In the above embodiment, the first thermometer 50 can be electrically connected to the drive motor 33 through the controller. The controller controls the drive motor 33 to adjust the distance between the heating module 20 and the carrier module 10 according to the data measured by the first thermometer 50, thereby adjusting the heating rate of the thermal test material 101.

[0046] In some embodiments, reference Figure 1 and Figure 2 The thermal insulation module 40 further includes a plurality of third thermal insulation panels 42 and a cover panel 43. The plurality of third thermal insulation panels 42 are located on the side of the support plate 11 facing away from the first thermal insulation panel 12 and are connected to the first thermal insulation panel 12. The plurality of third thermal insulation panels 42 enclose a fourth opening 421. The cover panel 43 snaps onto the fourth opening 421 and is removably connected to the plurality of third thermal insulation panels 42. With this arrangement, the cover panel 43 and the plurality of third thermal insulation panels 42 surround the other side of the thermal test material 101, preventing the external temperature from affecting the temperature of the thermal test material 101.

[0047] The third insulation board 42 and cover board 43 are also formed of high-temperature resistant materials. For example, the third insulation board 42 may include zirconia board, aluminum silicate ceramic fiber board, etc.; the cover board 43 may also include zirconia board, aluminum silicate ceramic fiber board, etc. Adjacent third insulation boards 42, the third insulation board 42 and the first insulation board 12, and the third insulation board 42 and the high board can all be bonded using a high-temperature adhesive with a temperature resistance of over 2000°C.

[0048] In the above embodiment, the cover plate 43 is provided with a second temperature measuring hole 431, and the thermal testing device 100 further includes a second temperature measuring device 60. The second temperature measuring device 60 is located on the side of the carrier module 10 facing away from the heating module 20. The centerline of the second temperature measuring hole 431 is collinear with the centerline of the first opening 111, ensuring that the second temperature measuring device 60 can measure the temperature on the other side of the thermal test material 101 through the second temperature measuring hole 431. The second temperature measuring device 60 may also be an infrared thermometer.

[0049] It should be noted that, in the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0050] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

[0051] Although the preferred embodiments of this specification have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of this specification.

[0052] Obviously, those skilled in the art may make various changes and modifications to this specification without departing from the spirit and scope of this specification. Thus, if such changes and modifications fall within the scope of the claims of this specification and their equivalents, this specification is intended to include such changes and modifications.

Claims

1. A thermal test device, characterized in that: include: A carrying module, the carrying module comprising a support plate and a first heat insulation plate, the support plate being provided with a first opening for placing a thermal test material; The first heat insulation board is attached to the support board, and a second opening is provided on the first heat insulation board, the center line of the second opening is collinear with the center line of the first opening, and the size of the second opening is smaller than the size of the first opening; A heating module is located on a side of the first heat insulation board facing away from the support board.

2. The thermal testing device according to claim 1, characterized in that The thermal testing device also includes an insulation module, which includes a plurality of second insulation plates. The plurality of second insulation plates are located on the side of the first insulation plate away from the support plate and are connected to the first insulation plate; the plurality of second insulation plates enclose a third opening to form; the third opening is for the heating module to pass through.

3. The thermal testing device according to claim 2, characterized in that: The size of the heating module on a plane perpendicular to the center line of the third opening is the same as that of the third opening.

4. The thermal testing device according to claim 2, characterized in that: The heating module includes a mounting base and a heating element. The mounting base includes a mounting plate arranged parallel to the support plate, and a baffle arranged perpendicular to the support plate, and the baffle is connected to the edge of the mounting plate; when the heating module is located in the third opening, the outer wall of the baffle is in contact with the inner wall of the second thermal insulation plate; a heating element is provided on the side of the mounting plate facing the first thermal insulation plate.

5. The thermal testing device according to claim 4, characterized in that: A mounting groove is provided on a side of the mounting plate facing the first heat insulation plate, and the heating element is laid in the mounting groove; The mounting groove includes a first groove body, a second groove body and a third groove body; the mounting plate has a first end and a second end, and the first groove body, the second groove body and the third groove body all extend along the arrangement direction of the first end and the second end; wherein, an end of the first groove body close to the first end is connected to an end of the second groove body close to the first end, and an end of the second groove body close to the second end is connected to an end of the third groove body close to the second end.

6. The thermal testing device according to claim 5, characterized in that: A first temperature measuring hole is provided on the mounting plate, a center line of the first temperature measuring hole is collinear with a center line of the second opening, and the first temperature measuring hole is spaced apart from the mounting groove; The thermal test device further includes a first temperature detector, which is located on a side of the heating module away from the carrier module. The first temperature detector measures the temperature of one side of the thermal test material through the first temperature measuring hole.

7. The thermal testing device according to claim 2, characterized in that: The thermal insulation module also includes multiple third thermal insulation plates and a cover plate. The multiple third thermal insulation plates are located on the side of the support plate away from the first thermal insulation plate and are connected to the first thermal insulation plate; the multiple third thermal insulation plates enclose a fourth opening; the cover plate is buckled on the fourth opening and is detachably connected to the multiple third thermal insulation plates.

8. The thermal testing device according to claim 7, characterized in that: A second temperature measuring hole is provided on the cover plate, and the center line of the second temperature measuring hole is collinear with the center line of the first opening; The thermal test device further includes a second temperature detector, which is located on a side of the carrier module away from the heating module. The second temperature detector measures the temperature of the other side of the thermal test material through the second temperature measuring hole.

9. The thermal testing device according to any one of claims 1 to 8, characterized in that: The thermal testing device further comprises a base, the carrying module is fixedly connected to the base, the heating module is slidably connected to the base, and the heating module can move closer to or farther away from the first thermal insulation board.

10. The thermal testing device according to claim 9, characterized in that: The base is provided with a slide rail and a drive motor, the extension direction of the slide rail is perpendicular to the support plate, the heating module is slidably connected to the slide rail, and the drive motor is connected to the heating module for driving the heating module to slide on the slide rail.

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