Wafer chip test clamp with multi-point supporting and co-planarity and use method thereof

Abstract

The invention relates to the technical field of wafer chip testing, in particular to a multi-point supporting coplanar wafer chip testing clamp and a using method thereof, the multi-point supporting coplanar wafer chip testing clamp comprises a supporting table and an air supply disc arranged on the supporting table, and a plurality of air supply holes distributed circumferentially at equal intervals are formed in the end of the air supply disc; the spacing regulation and control mechanism is arranged on the supporting table, a plurality of movable plates which are circumferentially distributed at equal intervals are arranged on the spacing regulation and control mechanism, clamping assemblies are arranged on the movable plates, and lower clamping plates and upper clamping plates are connected to the clamping assemblies; the follow-up rotating mechanism is arranged on the air supply disc, a supporting regulation and control mechanism connected with the follow-up rotating mechanism is arranged on the movable plate, and through cooperation of the follow-up rotating mechanism and the supporting regulation and control mechanism, when air flow is blown by the air supply disc to provide air buoyancy force for the wafer chip, the clamping force of the lower clamping plate on the wafer chip can be adaptively reduced; therefore, the wafer chip is prevented from being damaged due to too large clamping force.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer chip testing, and in particular to a multi-point supported co-leveling wafer chip testing fixture and a method for using the same. Background Art

[0002] Wafer chip is a technology that uses the entire wafer as a single chip, which is different from the traditional chip manufacturing method of cutting the wafer into multiple small chips.

[0003] Wafer chips integrate multiple computing units directly onto a single wafer, without cutting, to form a single, ultra-large chip. This design avoids the interconnection delays and power consumption issues of traditional chips, significantly improving computing density and performance.

[0004] Wafer chips need to be tested before use. Clamping is a key link that directly affects measurement accuracy, wafer integrity and test efficiency. Therefore, during testing, the wafer chips can be fixed by mechanical clamping to ensure the stability of the test.

[0005] However, since mechanical clamping directly and rigidly acts on the surface of the wafer chip, it may cause scratches on the surface of the wafer chip, thereby damaging the surface insulation layer, resulting in leakage or short circuit during use.

[0006] To this end, damage to the wafer chip can be reduced by combining mechanical clamping with air floating support. Mechanical clamping can limit the position of the wafer chip, and air floating support can reduce the hard clamping force required for mechanical clamping. The two work together to maintain clamping stability and provide a certain degree of protection for the wafer chip.

[0007] However, the buoyancy force will change with the fluctuation of the gas delivery volume. If the buoyancy force decreases due to gas fluctuations, the mechanical clamping force may not be able to stabilize the wafer chip alone, which may lead to deviations in the test results. If the buoyancy force increases due to gas fluctuations, the buoyancy support force may be too large, resulting in an increase in the contact force between the wafer chip and the mechanical clamp, which may damage the wafer chip clamping position. Summary of the Invention

[0008] The object of the present invention is to provide a multi-point supported co-leveling wafer chip testing fixture and a method of using the same to solve the problems raised in the above background technology.

[0009] To achieve the above object, the present invention provides the following technical solutions: A multi-point support co-leveling wafer chip test fixture, comprising: A support platform, and an air supply plate arranged on the support platform, wherein the end of the air supply plate is formed with a plurality of air supply holes distributed equidistantly around the circumference; Also includes: A spacing adjustment mechanism is provided on the support platform, wherein the spacing adjustment mechanism is provided with a plurality of movable plates equidistantly distributed around a circumference, wherein a clamping assembly is provided on the movable plate, wherein a lower clamping plate and an upper clamping plate are connected to the clamping assembly, and the spacing adjustment mechanism is capable of adjusting the spacing between the movable plates; A follow-up rotating mechanism is arranged on the air supply disk, and a support and regulation mechanism connected to the follow-up rotating mechanism is arranged on the movable plate. The follow-up rotating mechanism can adjust the supporting force of the lower clamping plate through the support and regulation mechanism when the pressure in the air supply disk changes.

[0010] As a further solution of the present invention: the spacing adjustment mechanism includes a motor arranged at the bottom of the support platform, a screw connected to the output shaft of the motor is rotatably installed on the support platform, and a threaded sleeve is threadedly connected to the screw.

[0011] As a further solution of the present invention: the spacing control mechanism also includes a plurality of first sliding grooves formed on the support platform and distributed equidistantly around the circumference, a first sliding block is slidably installed in the first sliding groove, and a connecting rod hinged to the threaded sleeve is hinged on the first sliding block.

[0012] As a further solution of the present invention: the clamping assembly includes a first fixed plate and a second fixed plate arranged on the movable plate, the second fixed plate is fixedly connected to the upper clamping plate, a support rod is slidably installed on the first fixed plate, the support rod is fixedly connected to the lower clamping plate, and a fixing ring is provided on the support rod to abut against the first fixed plate.

[0013] As a further solution of the present invention: the support and regulation mechanism also includes a second sliding groove formed on the movable plate, a second sliding block is slidably installed on the second sliding groove, a follower plate and a support plate are provided on the side wall of the second sliding block, a limiting column is provided on the follower plate, and a second spring is sleeved on the support rod, and the two ends of the second spring are respectively abutted against the support plate and the lower clamping plate.

[0014] As a further solution of the present invention: the support and regulation mechanism includes a rotating sleeve rotatably mounted on the movable plate, a limit plate is provided at the end of the rotating sleeve, and an inclined groove is formed on the limit plate to slide with the limit column.

[0015] As a further solution of the present invention: the follow-up rotation mechanism includes a limiting ring arranged in the air supply disk, a sealing plate is slidably installed in the air supply disk and contacts with the limiting ring, a movable rod is provided on the side wall of the sealing plate and passes through the air supply disk, a first spring is sleeved on the movable rod, and two ends of the first spring are respectively in contact with the sealing plate and the inner wall of the air supply disk; It also includes a driven component and a guide component which are arranged on the air supply disk and connected to the rotating sleeve and are used to drive the support and regulation mechanism to move.

[0016] As a further solution of the present invention: the guide assembly includes a rotating rod rotatably mounted on the air supply disk and slidably connected to the rotating sleeve, and a spiral groove is formed on the circumferential outer wall of the rotating rod.

[0017] As a further solution of the present invention: the driven assembly includes a push plate arranged at the end of the movable rod, a sliding sleeve is provided on the push plate, and a limit block is provided on the inner wall of the sliding sleeve and is slidably engaged with the spiral groove.

[0018] A method for using a multi-point support co-leveling wafer chip testing fixture comprises the following steps: Step 1: According to the size of the wafer chip to be tested, the spacing control mechanism is controlled to move so as to adjust the spacing between the multiple lower clamping plates and the upper clamping plates through the movable plate and the clamping assembly; Step 2: After the adjustment is completed, place the wafer chip between the upper clamping plate and the lower clamping plate; Step 3: Introduce gas into the gas delivery plate, and under the action of gas blowing, provide a certain air buoyancy to the wafer chip; Step 4: When the air pressure in the air supply plate changes, it will also drive the follow-up rotating mechanism to move, and according to the size of the air buoyancy force, the support and control mechanism will adaptively reduce the clamping force of the lower clamping plate on the wafer chip.

[0019] Compared with the prior art, the beneficial effect of the present invention is that the present application can clamp and fix the wafer chip through the dual cooperation of mechanical clamping and air buoyancy to ensure the stability of the wafer chip test. Specifically, through the spacing control mechanism, the spacing between the lower clamping plates can be adjusted to match the wafer chip to be clamped. When the wafer chip is placed between the lower clamping plate and the upper clamping plate, gas is introduced into the air supply plate to blow the gas to the bottom of the wafer chip through the air supply hole, thereby providing the wafer chip with a certain air buoyancy. At the same time, during the air supply process of the air supply plate, the air pressure therein will change, thereby adaptively adjusting the clamping force of the lower clamping plate on the wafer chip through the follow-up rotation mechanism and the support control mechanism, so as to reduce the damage to the surface of the wafer chip due to mechanical clamping while ensuring stable clamping.

[0020] By controlling the rotation of the screw rod, the spacing between the lower clamps can be adjusted to increase the adaptability range of the fixture and increase the practicality of the fixture. At the same time, the screw rod also has a self-locking effect, which can ensure the stability of the wafer chip during the test process, thereby ensuring the accuracy of the test results.

[0021] The rate at which gas is introduced into the gas delivery plate is adjusted according to the size of the wafer chip. Therefore, after the size of the wafer chip is determined, the rate of gas introduced is also kept constant, thereby providing a constant air buoyancy force to the wafer chip, and the mechanical clamping force will be adaptively adjusted according to the air buoyancy force provided, so that when the wafer chip is subjected to the air buoyancy force, the clamping force provided by the lower clamping plate to the wafer chip is automatically reduced, thereby avoiding the problem of damage to the wafer chip clamping position due to the clamping force being in an excessively large state for a long time. In this way, through the dual coordination of air buoyancy force and mechanical clamping force, it can not only ensure the stability of the wafer chip during testing, but also provide the wafer chip with a certain protection effect, avoiding the problem of damage to the wafer chip surface due to mechanical hard clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic structural diagram of an embodiment of a multi-point support and co-leveling wafer chip testing fixture.

[0023] Figure 2 This is a structural schematic diagram of another angle of an embodiment of a multi-point supported co-leveling wafer chip testing fixture.

[0024] Figure 3 This is a structural diagram of the spacing control mechanism and support platform in an embodiment of a multi-point supported co-leveling wafer chip testing fixture.

[0025] Figure 4 This is a schematic diagram of the cross-sectional structure of an air delivery plate in an air delivery state in one embodiment of a multi-point supported and co-leveled wafer chip testing fixture.

[0026] Figure 5 for Figure 4 A magnified schematic diagram of the structure at point A.

[0027] Figure 6 This is a schematic diagram of the connection relationship between the partial follow-up rotation mechanism and the support and control mechanism in the air supply state of the air supply plate in one embodiment of a multi-point supported and leveled wafer chip testing fixture.

[0028] Figure 7 This is a structural schematic diagram of a partial follow-up rotation mechanism and a support and control mechanism in an embodiment of a multi-point supported and co-leveled wafer chip testing fixture when the air supply plate is not supplying air.

[0029] Figure 8 This is a schematic diagram of the exploded structure of part of the follow-up rotation mechanism and part of the support and regulation mechanism in an embodiment of a multi-point supported co-leveling wafer chip testing fixture.

[0030] Figure 9 This is a schematic diagram of the exploded structure of part of the clamping components and part of the support and regulation mechanism in an embodiment of a multi-point support and co-leveling wafer chip testing fixture.

[0031] Figure 10 This is a structural diagram of part of the follow-up rotation mechanism, support and regulation mechanism, and part of the clamping assembly in an embodiment of a multi-point supported and co-leveled wafer chip testing fixture.

[0032] In the figure: 1. support platform; 101. first slide groove; 2. air supply plate; 201. air supply hole; 202. limiting ring; 3. first sliding block; 4. movable plate; 401. second slide groove; 5. motor; 6. screw rod; 7. threaded sleeve; 8. connecting rod; 9. sealing plate; 10. movable rod; 11. first spring; 12. push plate; 13. rotating rod; 1301. spiral groove; 14. sliding sleeve; 1401. limiting block; 15. rotating sleeve; 16. limiting plate; 1601. inclined groove; 17. first fixed plate; 18. support rod; 1801. fixed ring; 19. lower clamping plate; 1901. baffle; 20. second fixed plate; 21. upper clamping plate; 22. second sliding block; 23. follower plate; 2301. limiting column; 24. support plate; 25. second spring. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0035] See also Figures 1 to 10 In an embodiment of the present invention, a multi-point support co-leveling wafer chip testing fixture includes: A support platform 1, and an air supply plate 2 provided on the support platform 1, wherein the end of the air supply plate 2 is formed with a plurality of air supply holes 201 distributed equidistantly around the circumference; Also includes: A spacing adjustment mechanism is provided on the support platform 1, wherein the spacing adjustment mechanism is provided with a plurality of movable plates 4 distributed equidistantly around the circumference, and a clamping assembly is provided on the movable plates 4, and a lower clamping plate 19 and an upper clamping plate 21 are connected to the clamping assembly. The spacing adjustment mechanism can adjust the spacing between the movable plates 4; The follow-up rotating mechanism is arranged on the air supply disk 2, and the movable plate 4 is provided with a support and control mechanism connected to the follow-up rotating mechanism. The follow-up rotating mechanism can adjust the support force of the lower clamping plate 19 through the support and control mechanism when the pressure in the air supply disk 2 changes.

[0036] Specifically, the lower clamping plate 19 is provided with a baffle 1901 for limiting the horizontal movement of the wafer chip. Before testing the wafer chip, the wafer chip needs to be clamped and fixed. In order to avoid damage to the wafer chip due to excessive clamping force, double fixation can be performed by combining mechanical clamping and air flotation. To this end, before clamping, the spacing adjustment mechanism can be driven to move so that the spacing of the lower clamping plate 19 matches the size of the wafer chip. At this time, the wafer chip can be placed between the upper clamping plate 21 and the lower clamping plate 19. Under the action of the upper clamping plate 21 and the lower clamping plate 19, the wafer chip is clamped. At the same time, air can be introduced into the air supply plate 2. The gas will be blown to the bottom of the wafer chip through the air supply hole 201 to provide the wafer chip with air buoyancy. When the air supply plate 2 supplies air, the pressure inside it will also change. Under the action of pressure, the follower rotation mechanism is controlled to move, thereby driving the support and regulation mechanism to move. The support and regulation mechanism adaptively reduces the support force of the lower clamping plate 19 on the wafer chip through the clamping component to prevent the clamping force on the wafer chip from being too large, resulting in damage to the clamping position. At the same time, through the dual effects of mechanical clamping and air buoyancy, the mechanical clamping force can be automatically adjusted when the air supply rate of the air supply plate 2 fluctuates to ensure the accuracy of the wafer chip test.

[0037] See also Figure 1-Figure 3 The spacing adjustment mechanism includes a motor 5 arranged at the bottom of the support platform 1, a screw rod 6 connected to the output shaft of the motor 5 is rotatably installed on the support platform 1, and a threaded sleeve 7 is threadedly connected to the screw rod 6. The spacing adjustment mechanism also includes a plurality of first sliding grooves 101 formed on the support platform 1 and distributed equidistantly around the circumference, a first sliding block 3 is slidably installed in the first sliding groove 101, and a connecting rod 8 hinged to the threaded sleeve 7 is hinged on the first sliding block 3.

[0038] See also Figure 1 、 Figure 2 、 Figure 6 、 Figure 7 、 Figure 9 、 Figure 10 The clamping assembly includes a first fixed plate 17 and a second fixed plate 20 arranged on the movable plate 4, the second fixed plate 20 is fixedly connected to the upper clamping plate 21, a support rod 18 is slidably installed on the first fixed plate 17, the support rod 18 is fixedly connected to the lower clamping plate 19, and a fixing ring 1801 is provided on the support rod 18 to abut against the first fixed plate 17.

[0039] It should be noted that the upper clamping plate 21 is used to limit the position of the wafer chip in the vertical direction, and the lower clamping plate 19 is used to support the wafer chip. The lower clamping plate 19 cooperates with the baffle 1901 to limit the position of the wafer chip in the horizontal direction. When the wafer chip needs to be tested, the spacing of the lower clamping plates 19 can be adjusted according to the size of the wafer chip. In the initial state, the threaded sleeve 7 is located at the end of the stroke toward the air supply disk 2. Under the action of the connecting rod 8, the spacing between the four first sliding blocks 3 is minimized, so that the spacing between the lower clamping plates 19 is minimized through the movable plate 4. At this time, the motor 5 works and drives the screw rod 6 to rotate, thereby driving the threaded sleeve 7 to move. The threaded sleeve 7 will push the first sliding block 3 to slide radially along the first sliding groove 101 through the connecting rod 8, and the four first sliding blocks 3 will move in the direction away from each other. The first sliding groove 101 and the first sliding block 3 have a guiding function, which can ensure that the threaded sleeve 7 slides axially along the screw rod 6 and will not rotate with the screw rod 6. The first sliding block 3 will also drive the movable plate 4 to move to control the movement of the lower clamping plate 19 and the upper clamping plate 21 through the first fixed plate 17 and the second fixed plate 20. When the spacing between the baffles 1901 matches the size of the wafer chip, the wafer chip can be placed between the lower clamping plate 19 and the upper clamping plate 21, thereby mechanically clamping the wafer chip.

[0040] Preferably, by controlling the rotation of the screw rod 6, the spacing between the lower clamps 19 can be adjusted to increase the adaptability range of the clamp and increase the practicality of the clamp. At the same time, the screw rod 6 also has a self-locking effect, which can ensure the stability of the wafer chip during the test process, thereby ensuring the accuracy of the test results.

[0041] See also Figure 1 、 Figure 2 、 Figure 4-Figure 8 、 Figure 10 The support and regulation mechanism also includes a second slide groove 401 formed on the movable plate 4, and a second sliding block 22 is slidably installed on the second slide groove 401. The side wall of the second sliding block 22 is provided with a follower plate 23 and a support plate 24, and a limiting column 2301 is provided on the follower plate 23. A second spring 25 is sleeved on the support rod 18, and the two ends of the second spring 25 are respectively in contact with the support plate 24 and the lower clamping plate 19. The support and regulation mechanism includes a rotating sleeve 15 rotatably installed on the movable plate 4, and a limiting plate 16 is provided at the end of the rotating sleeve 15. The limiting plate 16 is formed with an inclined groove 1601 that is slidably engaged with the limiting column 2301.

[0042] See also Figure 1 、 Figure 2 、 Figures 6-10The follow-up rotating mechanism includes a limit ring 202 arranged in the air supply disk 2, and a sealing plate 9 is slidably installed in the air supply disk 2 to cooperate with the limit ring 202, and the side wall of the sealing plate 9 is provided with a movable rod 10 that passes through the air supply disk 2, and the movable rod 10 is sleeved with a first spring 11, and the two ends of the first spring 11 respectively abut against the sealing plate 9 and the inner wall of the air supply disk 2; it also includes a driven component and a guide component arranged on the air supply disk 2 and connected to the rotating sleeve 15 for driving the movement of the supporting and regulating mechanism, the guide component includes a rotating rod 13 rotatably mounted on the air supply disk 2 and slidably connected to the rotating sleeve 15, and a spiral groove 1301 is formed on the outer wall of the rotating rod 13, and the driven component includes a push plate 12 arranged at the end of the movable rod 10, and a sliding sleeve 14 is provided on the push plate 12, and a limit block 1401 is provided on the inner wall of the sliding sleeve 14 to slide and engage with the spiral groove 1301.

[0043] Furthermore, a keyway is formed on the inner wall of the rotating sleeve 15, and a key that cooperates with the keyway is provided on the outer wall of the rotating rod 13. Under the action of the key and the keyway, the rotating rod 13 and the rotating sleeve 15 rotate synchronously. The air supply plate 2 is cylindrical, and four extension columns are extended from its circumferential side wall and are equidistantly distributed around the circumference. The extension columns are hollow and communicate with the internal cavity of the air supply plate 2. The sealing plate 9 is used to separate the extension columns from the air supply plate 2. See also Figure 7Before testing the wafer chip, gas has not yet been introduced into the air delivery disk 2, and the elongation of the first spring 11 in the natural state is greater than the length of the movable rod 10. To this end, the first spring 11 is in a pre-compressed state and provides a thrust for the sealing plate 9 to move toward the limit ring 202, so that the sealing plate 9 and the limit ring 202 abut against each other. Under the action of the sealing plate 9, the cavity size in the extension column is maximized, and the movable rod 10 will also control the push plate 12 to be located at the end of the stroke toward the air delivery disk 2, so as to control the limit block 1401 to be located at the end of the stroke on the side of the spiral groove 1301 toward the air delivery disk 2 through the sliding sleeve 14. At this time, the rotating rod 13 and the rotating sleeve 15 are in a locked state, and the limit column 2301 is located on the side of the inclined groove 1601. At the end of the stroke, the second sliding block 22 is located at the end of the stroke in the direction in which the second sliding groove 401 is away from the first sliding block 3, so that the distance between the support plate 24 and the first fixed plate 17 is maximized, and the elongation of the second spring 25 in the natural state is greater than the length of the support rod 18. To this end, under the action of the support plate 24, the compression amount of the second spring 25 is at the maximum state, so as to provide the maximum thrust to the support rod 18, so that the distance between the support rod 18 and the second fixed plate 20 is minimized, so that the fixing ring 1801 abuts against the first fixed plate 17. In this state, the distance between the lower clamping plate 19 and the upper clamping plate 21 is minimized, and the thickness of the wafer chip is greater than the distance, and the elastic potential energy of the second spring 25 is less than the elastic potential energy of the first spring 11; See also Figure 5 、 Figure 6 When the wafer chip needs to be clamped and tested, the wafer chip can be placed between the lower clamping plate 19 and the upper clamping plate 21. At the same time, gas is introduced into the air supply plate 2, and the gas will be discharged through the air supply hole 201 and blown to the bottom of the wafer chip to provide the wafer chip with a certain air buoyancy. Since the rate of gas introduction is greater than the discharge rate of the air supply hole 201 at this time, the pressure in the air supply plate 2 will gradually increase, thereby pushing the four sealing plates 9 to move away from each other and compressing the first spring 11. The sealing plate 9 will also drive the movable rod 10 to move, so as to drive the sliding sleeve through the push plate 12 The cylinder 14 moves. Under the action of the sliding sleeve 14, the limiting block 1401 is controlled to slide along the track of the spiral groove 1301, thereby driving the rotating rod 13 to rotate. Under the cooperation of the key and the keyway, the rotating sleeve 15 is caused to rotate synchronously, thereby driving the limiting plate 16 to move, and the second sliding block 22 is controlled to move through the inclined groove 1601 and the limiting column 2301. The second sliding block 22 will move along the length direction of the second sliding groove 401 and move toward the direction of the first sliding block 3, so that the support plate 24 moves toward the direction close to the first fixed plate 17, so that the second spring 25 is elastically released; When the pressure in the air supply plate 2 increases, the discharge rate of gas from the air supply hole 201 will also increase to increase the buoyancy provided to the wafer chip. When the gas introduction rate and the discharge rate reach a balance, the pressure in the air supply plate 2 no longer changes, and the buoyancy provided to the wafer chip also no longer changes. At this time, the position of the sealing plate 9 no longer changes, so that the supporting force provided to the lower clamping plate 19 by the second spring 25 remains constant, thereby achieving the effect of balancing the buoyancy and mechanical clamping force.

[0044] Preferably, the rate at which gas is introduced into the gas delivery plate 2 is adjusted according to the size of the wafer chip. In this regard, after the size of the wafer chip is determined, the rate of gas introduced is also kept constant, thereby providing a constant air buoyancy to the wafer chip, and the mechanical clamping force will be adaptively adjusted according to the provision of the air buoyancy, so that when the wafer chip is subjected to the air buoyancy, the clamping force provided to the wafer chip by the lower clamping plate 19 is automatically reduced, thereby avoiding the problem of damage to the wafer chip clamping position due to the clamping force being in an excessively large state for a long time. In this way, through the dual coordination of air buoyancy and mechanical clamping force, the stability of the wafer chip during testing can be guaranteed, and a certain protection effect can be provided to the wafer chip, thereby avoiding the problem of damage to the wafer chip surface due to mechanical hard clamping.

[0045] Among them, when gas is introduced into the gas supply plate 2, certain fluctuations may occur. If the fluctuation causes an increase in the amount of gas introduced, the buoyancy force provided to the wafer chip increases accordingly, and the pressure in the gas supply plate 2 also rises, the sealing plate 9 will continue to move to make the support plate 24 continue to move toward the direction close to the first fixed plate 17, thereby further reducing the clamping force of the lower clamping plate 19 on the wafer chip. If the fluctuation causes a decrease in the amount of gas introduced, the buoyancy force provided to the wafer chip decreases accordingly, and the pressure in the gas supply plate 2 also decreases, the sealing plate 9 will move toward the initial position to compress the second spring 25 through the support plate 24, thereby increasing the clamping force of the lower clamping plate 19 on the wafer chip. In this way, even if the pressure in the gas supply plate 2 fluctuates, causing the provided buoyancy force to change, the mechanical clamping force can still be adaptively adjusted, thereby avoiding the problem of a reduction in clamping force caused by buoyancy fluctuations, resulting in a decrease in stability during wafer chip testing, or excessive clamping force, resulting in damage to the wafer chip surface.

[0046] A method for using a multi-point support co-leveling wafer chip testing fixture comprises the following steps: Step 1: According to the size of the wafer chip to be tested, the spacing control mechanism is controlled to move so as to adjust the spacing between the multiple lower clamping plates 19 and the upper clamping plates 21 through the movable plate 4 and the clamping assembly; Step 2: After the adjustment is completed, the wafer chip is placed between the upper clamping plate 21 and the lower clamping plate 19; Step 3: Introduce gas into the gas delivery plate 2, and under the action of the gas blowing, provide a certain air buoyancy to the wafer chip; Step 4: When the air pressure in the air delivery plate 2 changes, it will also drive the follower rotating mechanism to move, and according to the size of the air buoyancy, the clamping force of the lower clamping plate 19 on the wafer chip is adaptively reduced through the support and regulation mechanism.

[0047] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0048] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A multi-point support co-leveling wafer chip test fixture, comprising: A support platform, and an air supply plate arranged on the support platform, wherein the end of the air supply plate is formed with a plurality of air supply holes distributed equidistantly around the circumference; It is characterized by further comprising: A spacing adjustment mechanism is provided on the support platform, wherein the spacing adjustment mechanism is provided with a plurality of movable plates equidistantly distributed around a circumference, wherein a clamping assembly is provided on the movable plate, wherein a lower clamping plate and an upper clamping plate are connected to the clamping assembly, and the spacing adjustment mechanism is capable of adjusting the spacing between the movable plates; A follow-up rotating mechanism is arranged on the air supply disk, and a support and regulation mechanism connected to the follow-up rotating mechanism is arranged on the movable plate. The follow-up rotating mechanism can adjust the supporting force of the lower clamping plate through the support and regulation mechanism when the pressure in the air supply disk changes.

2. The multi-point support co-leveling wafer chip testing fixture according to claim 1, characterized in that: The spacing adjustment mechanism includes a motor arranged at the bottom of the support platform, a screw connected to the output shaft of the motor is rotatably mounted on the support platform, and a threaded sleeve is threadedly connected to the screw.

3. The multi-point support co-leveling wafer chip testing fixture according to claim 2, characterized in that: The spacing control mechanism also includes a plurality of first sliding grooves formed on the support platform and distributed equidistantly around the circumference, wherein a first sliding block is slidably installed in the first sliding groove, and a connecting rod hinged to the threaded sleeve is hinged on the first sliding block.

4. The multi-point support co-leveling wafer chip testing fixture according to claim 1, characterized in that: The clamping assembly includes a first fixed plate and a second fixed plate arranged on the movable plate, the second fixed plate is fixedly connected to the upper clamping plate, a support rod is slidably installed on the first fixed plate, the support rod is fixedly connected to the lower clamping plate, and a fixing ring is provided on the support rod to abut against the first fixed plate.

5. The multi-point support co-leveling wafer chip testing fixture according to claim 4, characterized in that: The support and regulation mechanism also includes a second sliding groove formed on the movable plate, a second sliding block is slidably installed on the second sliding groove, a follower plate and a support plate are provided on the side wall of the second sliding block, a limiting column is provided on the follower plate, and a second spring is sleeved on the support rod, and the two ends of the second spring are respectively abutted against the support plate and the lower clamping plate.

6. The multi-point support co-leveling wafer chip testing fixture according to claim 5, characterized in that: The support and regulation mechanism includes a rotating sleeve rotatably mounted on the movable plate, a limiting plate is provided at the end of the rotating sleeve, and an inclined groove is formed on the limiting plate and is slidably engaged with the limiting column.

7. The multi-point support co-leveling wafer chip testing fixture according to claim 6, characterized in that: The follow-up rotation mechanism includes a limiting ring arranged in the air supply disk, a sealing plate is slidably installed in the air supply disk and contacts with the limiting ring, a side wall of the sealing plate is provided with a movable rod passing through the air supply disk, and a first spring is sleeved on the movable rod, and two ends of the first spring are respectively in contact with the sealing plate and the inner wall of the air supply disk; It also includes a driven component and a guide component which are arranged on the air supply disk and connected to the rotating sleeve and are used to drive the support and regulation mechanism to move.

8. The multi-point support co-leveling wafer chip testing fixture according to claim 7, characterized in that: The guide assembly includes a rotating rod rotatably mounted on the air supply disk and slidably connected to the rotating sleeve, and a spiral groove is formed on the circumferential outer wall of the rotating rod.

9. The multi-point support co-leveling wafer chip testing fixture according to claim 8, characterized in that: The driven assembly includes a push plate arranged at the end of the movable rod, a sliding sleeve is arranged on the push plate, and a limiting block is arranged on the inner wall of the sliding sleeve and is slidably engaged with the spiral groove.

10. A method for using a multi-point support co-leveling wafer chip test fixture, using the multi-point support co-leveling wafer chip test fixture according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: According to the size of the wafer chip to be tested, the spacing control mechanism is controlled to move so as to adjust the spacing between the multiple lower clamping plates and the upper clamping plates through the movable plate and the clamping assembly; Step 2: After the adjustment is completed, place the wafer chip between the upper clamping plate and the lower clamping plate; Step 3: Introduce gas into the gas delivery plate, and under the action of gas blowing, provide a certain air buoyancy to the wafer chip; Step 4: When the air pressure in the air supply plate changes, it will also drive the follow-up rotating mechanism to move, and according to the size of the air buoyancy force, the support and control mechanism will adaptively reduce the clamping force of the lower clamping plate on the wafer chip.

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