Flat-head probe, probe card and manufacturing device and method

Abstract

The invention discloses a flat-head needle probe, a probe card and a manufacturing device and method, the flat-head needle probe comprises a needle tip, a needle arm and a needle tail which are connected in sequence, the needle tip is shaped and chamfered, the needle arm is coated with a film, the needle tail is chamfered and plated with metal, and the needle tip can be twisted relative to the needle tail. The cross section of the flat-head probe is circular, the flat-head probe is made of high-strength structural materials such as metal iridium and beryllium copper, and the flat-head probe has the performance of high elasticity, high current resistance, low contact resistance and the like under the small size; according to the invention, the needle tip is molded and chamfered to ensure that the needle tip is not in short circuit with an adjacent Bump under a certain error, the problem of Bump short circuit of a flat-head needle under a Fine Pitch Bump is solved, the needle tail is chamfered and plated with metal, when an alignment error occurs, the needle tail is prevented from being in short circuit with the MLO Pad, and when the needle arms are in contact with each other, the needle tail is prevented from being in short circuit with the MLO Pad, so that the needle tip is prevented from being in short circuit with the MLO Pad, and the needle tip is prevented from being in short circuit with the MLO Pad. Probe contact short circuit can be avoided, and chip test failure is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of probe preparation, and in particular relates to a flat-head needle probe, a probe card, and a manufacturing device and method. Background Art

[0002] Bump structures are commonly used in flip-chip technology in chip packaging, where bumps serve as metal bumps connecting the chip to the substrate. Pitch refers to the distance between the centers of two adjacent bumps, and minimum pitch refers to the smallest spacing achievable at a specific technology node.

[0003] Different process nodes (such as 7nm, 5nm, and 3nm) may have different minimum pitch requirements. In earlier technologies, such as 28nm or 14nm nodes, the bump pitch may be over 100 microns. However, as packaging technology advances, such as at 7nm, 5nm, and even more advanced nodes, the bump pitch may shrink to 40 microns or even lower.

[0004] In addition, different packaging technologies, such as traditional flip-chip, fan-out packaging (Fan-Out), 2.5D / 3D packaging (such as CoWoS), etc., may have different minimum pitch requirements. Considering the development of materials and technologies, for example, the application of copper pillar bumps and microbumps has made smaller pitches possible. Microbumps are commonly found in 2.5D / 3D packaging and are used to connect chips and interposers. Their pitch can be as low as below 20 microns. For example, in HBM (high bandwidth memory) stacks, the pitch can reach 40 microns to 20 microns.

[0005] For the Bump package structure, the corresponding probe tip in the probe card has a flat head structure. Due to the small Bump spacing, the probe needs to pass a large current and have a large elastic force, so the probe needs to have excellent conductivity (low contact resistance), mechanical strength (not easy to bend), and high wear resistance (long service life). However, general processes such as photolithography combined with chemical etching or precision stamping often face the problems of complex procedures and high costs when dealing with micron-level precision. Especially when processing high-hardness or special materials such as tungsten, tungsten steel, and palladium alloys, it is easy to produce defects such as rough contact surfaces, residual burrs, stress-induced material deformation, and poor control of the tip shape. These defects directly affect the accuracy and reliability of probe testing, posing a severe test for the yield and cost control of the semiconductor industry.

[0006] Conventional probes have a rectangular cross-section, and the corresponding restraint guide cover plate has a rectangular square hole. When the pitch is very small, the thickness of the square hole wall decreases, resulting in poor hole wall structural strength after drilling, and the possibility of broken wall and probe contact short circuit during use. When faced with the need for a small pitch, in order to ensure the strength of the hole wall structure, the rectangular cross-sectional area of ​​the probe is reduced by setting a minimum hole wall size. However, the processing difficulty of probes with smaller rectangular cross-sectional dimensions increases sharply, and the requirements for equipment, personnel, and processes are very high, and the cost also increases sharply.

[0007] Based on this, the present invention discloses a flat-head needle probe, a probe card, and a manufacturing device and method. Summary of the Invention

[0008] In order to solve the problems in the prior art, the present invention aims to provide a flat-tip needle probe, a probe card, and a manufacturing device and method.

[0009] In order to achieve the above-mentioned purpose and the above-mentioned technical effect, the technical solution adopted by the present invention is:

[0010] A flat-head needle probe comprises a needle tip, a needle arm and a needle tail connected in sequence, wherein the needle tip has a shaped chamfer, the needle arm is provided with a coating layer, the needle tail has a chamfer and is provided with a metal layer, and along the axial direction of the flat-head needle probe, the needle tip can be twisted relative to the needle tail.

[0011] Furthermore, the radial cross-section of the flat-head needle probe is circular, with a diameter of 10 to 40 μm and a length of 3.5 to 6.5 mm.

[0012] The present invention also discloses a probe card, comprising a flat-head needle probe as described above, and further comprising a lower punched plate and an upper punched plate, wherein a lower cover plate interlayer is glued to the lower punched plate, and an upper cover plate interlayer is glued to the upper punched plate, and the lower punched plate deviates from the upper punched plate in the positive X direction and the negative Y direction, the lower punched plate is provided with a plurality of lower guide holes, and the upper punched plate is provided with a plurality of upper guide holes, and the plurality of flat-head needle probes are respectively slidably extended and arranged in a pair of upper guide holes and lower guide holes deviated from each other in the X direction, along the axial direction of the flat-head needle probe, the needle tip is twisted relative to the needle tail, the needle tail contacts the upper guide hole in the negative X direction, and the needle tip contacts the lower guide hole in the positive X direction.

[0013] The present invention also discloses a device for manufacturing a flat-head needle probe, comprising:

[0014] Automatic pin insertion device, used to complete the flat-head needle probe insertion operation;

[0015] Leveling assembly, used to make the tips and tails of all flat-end needle probes flush;

[0016] Probe tip shaping and chamfering device, used to complete the shaping and chamfering operation of the flat-head needle probe tip;

[0017] Rotating laser head, used to complete the chamfering of the flat-end needle probe needle end;

[0018] Coating assembly, used for coating the needle arm of the flat-head needle probe;

[0019] Electrolytic assembly for metallization of flat-tip probe tips.

[0020] Furthermore, the automatic pin insertion device includes a special tooling for probe pin insertion, a positioning camera system and a clamping system. The positioning camera system and the clamping system are respectively connected to the controller. The positioning camera system is used to determine the positions of the upper pin hole and the lower pin hole on the special tooling for probe pin insertion and transmit them to the controller. The controller is used to control the clamping system to accurately insert the flat-head pin probe into the upper pin hole and the lower pin hole.

[0021] Furthermore, a positioning camera system is provided above the special tooling for probe pins, a light source is provided below the special tooling for probe pins, the special tooling for probe pins comprises a first clamping block and a second clamping block which are arranged face to face and fixed by fasteners, a plurality of Mark marks are engraved on the second clamping block, a plurality of sockets which are opposite to each other are respectively provided on the first clamping block and the second clamping block, each socket on the top of the first clamping block is matched with a socket on the top of the second clamping block, the positions are corresponding to each other and the two are aligned to form an upper pin hole, each socket at the bottom of the first clamping block is matched with a socket at the bottom of the second clamping block, the positions are corresponding to each other and the two are aligned to form a lower pin hole, there are a plurality of upper pin holes and a plurality of lower pin holes, and each upper pin hole is opposite to a lower pin hole up and down.

[0022] Furthermore, the probe tip shaping and chamfering device includes a platform, an X-motion axis, a Y-motion axis and a Z-motion axis, the platform is arranged on the Z-motion axis, and a friction element for rubbing the tip of the flat-head needle probe is provided on the platform, the Z-motion axis is arranged on the Y-motion axis, and the Y-motion axis is arranged on the X-motion axis, the X-motion axis can drive the platform to move in the X direction, the Y-motion axis can drive the platform to move in the Y direction, and the Z-motion axis can drive the platform to move in the Z direction.

[0023] The present invention also discloses a method for manufacturing a flat-head needle probe, which is implemented using the above-mentioned manufacturing device for a flat-head needle probe, and includes the following steps:

[0024] 1) Complete the flat-head needle probe insertion operation;

[0025] 2) Laser leveling to make the tips and tails of all flat-head needle probes flush;

[0026] 3) Complete the shaping and chamfering operation of the flat-head needle probe tip;

[0027] 4) Complete the chamfering of the flat-head needle probe tail:

[0028] 5) Coating the flat-tip probe arm;

[0029] 6) Plating a metal layer on the tail of the flat-head needle probe;

[0030] Step 3) to step 6) are in no particular order.

[0031] Furthermore, in step 5), the needle arm of the flat-head needle probe is coated by ultrasonic spray atomization. The film material is photoresist, the dielectric constant is 2.5-3.5, the thickness uniformity is >95%, the dispensing area tolerance is ±0.1mm, the atomization frequency is 50-300kHz, the power is 20-50W, the atomizing nitrogen pressure is 0.01-0.2MPa, the gas flow rate is 0.5-2L / min, and the spraying speed is 0.01-0.3m / s.

[0032] Furthermore, in step 6), the metal layer is plated on the tail of the flat-head needle probe by electrolysis, the plating solution temperature is 50±1°C, the plating time is 1 to 4 minutes, and the current density is 0.5 to 2A / dm 2 The pH value of the solution is 6.5±0.2. After electroplating, it is washed with water and dried to obtain the required flat-head needle probe product.

[0033] Furthermore, the electroplating solution is a potassium gold cyanide solution with a concentration of 4 to 10 g / L.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] 1) The present invention discloses a flat-tip needle probe with a shaped chamfer at the tip to ensure that the tip will not short-circuit with an adjacent bump within a certain tolerance, thus solving the problem of a flat-tip needle short-circuiting with a fine pitch bump.

[0036] 2) The present invention discloses a flat-tip needle probe with a chamfered tip. This prevents the tip from short-circuiting to the adjacent MLO pad (multi-layer organic substrate pad) under the Fine Pitch Bump when alignment errors occur. Furthermore, the tip is provided with a metal layer to extend its service life.

[0037] 3) The present invention discloses a flat-tip probe with an insulating coating on its arms. This prevents short circuits when adjacent probe arms touch, avoids chip test failures, and solves the problem of short circuits in flat-tip probe arms under FinePitch Bump.

[0038] 4) The present invention discloses a flat-head needle probe with a circular cross-section and an arc-shaped hole wall thickness, which can achieve a smaller hole wall size, solving the defects of existing rectangular probes. When using the same material, the circular cross-section probe has higher lateral and axial strength than the rectangular probe when subjected to the same downward pressure.

[0039] 5) The present invention discloses a flat-tip needle probe, which uses high-strength structural materials such as metal iridium, beryllium, copper, etc., and can have high elasticity, high current resistance, low contact resistance and other properties in a small size, solving the problem of poor probe strength under fine pitch bump;

[0040] 6) The present invention discloses a device and method for manufacturing a flat-head needle probe. The flat-head needle probe is accurately and efficiently inserted into the pin hole through an automatic pin insertion device, thereby completing the flat-head needle probe insertion operation, solving the problem of difficult pin insertion of conventional probes.

[0041] 7) The present invention discloses a device and method for manufacturing a flat-tip needle probe, wherein the needle tip shaping and chamfering operation is completed by a probe tip shaping and chamfering device, ensuring that the needle tip will not short-circuit with an adjacent bump within a certain error;

[0042] 8) The present invention discloses a device and method for manufacturing a flat-end needle probe, which completes the chamfering operation of the needle tail by rotating the laser head to cut around the needle tail, thus solving the problem of difficult chamfering of the needle tail;

[0043] 9) When the flat-tip needle probe is inserted into the probe head, the lower perforated plate deviates relative to the upper perforated plate in the positive X and negative Y directions, causing the needle tip to twist relative to the needle tail. At this time, the needle tail is close to the hole wall in the negative X and positive Y directions, and the needle tip is close to the hole wall in the positive X and negative Y directions. The needle tip and needle tail are well consistent, and the contact error with the chip bump ball and MLOPad is small, solving the problem of flat-tip needle tip / needle tail consistency under fine pitch bump;

[0044] 10) The manufacturing device of the present invention is reasonably designed, and the manufacturing method is simple and efficient. It has the advantages of high processing efficiency, low processing cost, and high processing precision. It can realize low-cost and high-precision manufacturing of probes and has broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a schematic structural diagram of the flat-head needle probe of the present invention;

[0046] Figure 2 This is a schematic structural diagram of the present invention when the needle tail contacts the pad on the MLO with an alignment error;

[0047] Figure 3 This is a schematic structural diagram of the present invention when the needle tail contacts the pad on the MLO without any alignment error;

[0048] Figure 4 This is a schematic structural diagram of the present invention when the needle tail contacts the pad on the MLO with an alignment error;

[0049] Figure 5 This is a schematic diagram of the structure of the flat-head needle probe of the present invention installed in the probe card;

[0050] Figure 6 This is a schematic diagram of the needle tail position when the push position deviates from the present invention;

[0051] Figure 7 Schematic diagram of the needle tip position under the push-off deviation of the present invention;

[0052] Figure 8 It is a structural schematic diagram of the automatic needle insertion device of the present invention;

[0053] Figure 9 This is a schematic structural diagram of the special tooling for probe pins of the present invention;

[0054] Figure 10 This is a schematic structural diagram of a gasket being sandwiched between the first clamping block and the second clamping block of the present invention;

[0055] Figure 11 It is a structural schematic diagram of the pin hole of the present invention;

[0056] Figure 12 This is a schematic structural diagram of the semi-finished probe obtained after step 2) of the present invention;

[0057] Figure 13 This is a schematic diagram of the structure of the probe tip shaping and chamfering device of the present invention, wherein Figure 13 a is a three-dimensional schematic diagram, Figure 13 b is the front view, Figure 13 c is a side view;

[0058] Figure 14 Schematic diagram of the sandpaper and the needle tip when they are not in contact and in contact, wherein Figure 14 (A) is a schematic diagram when the sandpaper and the needle tip are not in contact. Figure 14 (B) Schematic diagram of the contact between sandpaper and needle tip;

[0059] Figure 15 This is a schematic structural diagram of the semi-finished probe obtained after step 3) of the present invention, wherein Figure 15 a is the front view, Figure 15 b is a stereogram;

[0060] Figure 16-17 are schematic diagrams of step 4) of the present invention, wherein: Figure 17 (a) is a schematic diagram before processing. Figure 17(b) is a schematic diagram after processing;

[0061] Figure 18-19 They are schematic diagrams of step 5) of the present invention. DETAILED DESCRIPTION

[0062] The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0063] The following is a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceivable aspects and is neither intended to identify key or critical elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that will be provided later.

[0064] like Figure 1-19 As shown, the present invention discloses a flat-head needle probe 100, comprising a needle tip 101, a needle arm 103 and a needle tail 102 connected in sequence, wherein the needle tip 101 has a shaped chamfer to ensure that the needle tip 101 will not short-circuit with an adjacent bump under a certain error, thereby solving the problem of the flat-head needle short-circuiting the bump under the fine pitch bump. The needle tail 102 has a chamfer and is provided with a metal layer (thickness 0.5 to 1 μm), and a coating layer with an insulating effect is provided on the needle arm 103. When adjacent probe needle arms come into contact, the probe contact short circuit can be avoided, thereby avoiding chip test failure.

[0065] In some embodiments, the cross-section of the flat-tip needle probe 100 along the radial direction is circular, with a diameter of 10 to 40 μm and a length of 3.5 to 6.5 mm.

[0066] In some embodiments, the flat-head needle probe 100 adopts a circular cross-section probe shape with an arc-shaped hole wall thickness, which can achieve a smaller hole wall size, solving the defects of existing rectangular probes. When using the same materials, compared with rectangular probes, the circular cross-section probe has higher lateral and axial strength when subjected to the same downward pressure. At the same time, the flat-head needle probe 100 is made of high-strength structural materials such as metal iridium, beryllium, and copper, and can provide high elasticity, high current resistance, and low contact resistance in a small size. When the probe is pressed down and contacts the bump, the flat-head needle probe 100 has sufficient elasticity at an overpressure of 100μm, which can solve the problem of poor probe structural strength under fine pitch.

[0067] The needle tail 102 needs to contact the pad 108 on the MLO during use. The pad on the MLO is a circle with a certain diameter. If the needle tail 102 is not chamfered, there will be a large error between the needle tail 102 and the pad on the MLO, which will cause the needle tail to contact the pad of the adjacent MLO, causing short circuit test abnormalities, such as Figure 2 The present invention designs a chamfer for the needle tail 102 so that the needle tail 102 contacts the pad on the MLO without any alignment error. Figure 3 As shown, the schematic diagram when there is alignment error is as follows Figure 4 As shown, it can be seen that when a positioning error occurs, the needle tail 102 can be chamfered to prevent the needle tail 102 from short-circuiting the adjacent MLO Pad, thereby solving the problem of the needle tail short-circuiting the MLO Pad under the Fine Pitch Bump.

[0068] In some embodiments, the coating layer is a photoresist film with a thickness of 0.5 to 1.5 μm and a length of 1.5 to 2.5 mm.

[0069] The present invention also discloses a probe card, comprising a flat-head needle probe as described above, and further comprising a lower punch plate 104 and an upper punch plate 105, wherein a lower cover plate interlayer 106 is glued to the lower punch plate 104, and an upper cover plate interlayer 107 is glued to the upper punch plate 105. After the flat-head needle probe 100 is installed on the probe card, the lower punch plate 104 is shifted (deviated) in the positive X direction and the negative Y direction relative to the upper punch plate 105. The lower punch plate 104 is provided with a plurality of lower guide holes, and the upper punch plate 105 is provided with a plurality of upper guide holes. The plurality of flat-head needle probes are respectively slidably extended and arranged in a pair of upper guide holes and lower guide holes deviated from each other in the X direction. Along the axial direction of the flat-head needle probe and along the axial direction of the flat-head needle probe 100, the needle tip 101 is twisted relative to the needle tail 102 to a certain extent, such as Figure 5 At this time, the needle tail 102 is close to the X negative direction and Y positive direction of the hole wall, eliminating the hole wall gap, the needle position is higher, and the contact consistency with the pad on the MLO (multi-layer organic substrate) is better, as shown in FIG. Figure 6 As shown; the needle tip 101 is close to the hole wall in the positive X direction and the negative Y direction, eliminating the hole wall gap, the needle position is higher, and the contact consistency with the Bump is better, as shown Figure 7 shown.

[0070] The present invention also discloses a device for manufacturing a flat-head needle probe, comprising:

[0071] Automatic pin insertion device, used to complete the flat-head needle probe insertion operation;

[0072] Leveling assembly, used to make the tips and tails of all flat-end needle probes flush;

[0073] Probe tip shaping and chamfering device, used to complete the shaping and chamfering operation of the flat-head needle probe tip;

[0074] Rotating laser head, used to complete the chamfering of the flat-end needle probe needle end;

[0075] Coating assembly, used for coating the needle arm of the flat-head needle probe;

[0076] Electrolytic assembly for metallization of flat-tip probe tips.

[0077] The present invention also discloses a method for manufacturing a flat-head needle probe, which is implemented using the above-mentioned manufacturing device for a flat-head needle probe, and includes the following steps:

[0078] 1) After the flat-head needle probe is inserted, due to tooling accuracy issues, the tip 101 and tail 102 of the flat-head needle probe 100 may be uneven, and laser leveling is required in step 2).

[0079] 2) Laser leveling: in the horizontal direction, make the needle tips 101 and needle tails 102 of all flat-head needle probes flush;

[0080] 3) Complete the shaping and chamfering operation of the flat-head needle probe tip;

[0081] 4) Complete the chamfering of the flat-head needle probe tail:

[0082] 5) Coating the flat-tip probe arm;

[0083] 6) Plating a metal layer on the tail of the flat-head needle probe;

[0084] Step 3) to step 6) are in no particular order.

[0085] In some embodiments, in step 1), in order to reduce costs and reduce the disadvantages caused by manual pin insertion fatigue, Figure 8-11 The automatic pin insertion device shown automatically, accurately and efficiently inserts the flat-head pin probe 100 into the pin insertion hole 1 (including the upper pin insertion hole 7 and the lower pin insertion hole 8), thereby completing the flat-head pin probe insertion operation. After the pin insertion is completed, fasteners need to be used to lock and fix the flat-head pin probe 100 to provide precise positioning for subsequent processes.

[0086] In some more specific embodiments, Figure 8 As shown, the automatic pin insertion device includes a special tooling for probe pin insertion, a positioning camera system and a clamping system. The positioning camera system and the clamping system are respectively connected to a controller (such as a single-chip microcomputer, a PLC, etc.). The positioning camera system is used to determine the positions of the upper pin hole 7 and the lower pin hole 8 on the special tooling for probe pin insertion and transmit them to the controller. The controller is used to control the clamping system to accurately insert the flat-head pin probe 100 into the upper pin hole 7 and the lower pin hole 8.

[0087] In some more specific embodiments, Figure 9 As shown, the special tooling for probe pins includes a first clamping block 3 and a second clamping block 4 which are arranged face to face and are fixed therebetween by a fastener 2 such as a fastening screw. The first clamping block 3 is made of PEEK material to prevent the probe from being pinched, and the second clamping block 4 is made of copper material to facilitate subsequent electroplating and conductivity. A number of Mark marks 5 are engraved on the second clamping block 4 to provide a grabbing reference point for AOI recognition. The Mark mark 5 is a cross or other shape. A number of sockets that are opposite to each other are respectively provided on the first clamping block 3 and the second clamping block 4. When the sockets at the top of the first clamping block 3 and the second clamping block 4 are aligned one by one to form an upper pin hole 7, and when the sockets at the bottom of the first clamping block 3 and the second clamping block 4 are aligned one by one to form a lower pin hole 8, the first clamping block 3 and the second clamping block 4 are aligned one by one to form a lower pin hole 8. Each socket on the top of the block 3 is matched with a socket on the top of the second clamping block 4, the positions correspond one to one and the two are aligned to form an upper pin hole 7, each socket at the bottom of the first clamping block 3 is matched with a socket at the bottom of the second clamping block 4, the positions correspond one to one and the two are aligned to form a lower pin hole 8, there are several upper pin holes 7 and lower pin holes 8, each upper pin hole 7 is opposite to a lower pin hole 8 up and down, when several gaskets 6 are clamped between the first clamping block 3 and the second clamping block 4, a gap will be generated between the first clamping block 3 and the second clamping block 4, which will facilitate the insertion of the probe into the upper pin hole 7 and the lower pin hole 8. After the pin insertion is completed, remove the gasket 6 and then firmly fix the flat-head pin probe 100 with fasteners.

[0088] In some more specific embodiments, the special tooling for the probe pin is fixed on the base 9 and fixed by side fasteners 10 (screws, etc.). A transparent glass 11 is provided on the base 9 and below the flat-head needle probe 100. The bottom end of the flat-head needle probe 100 can fall on the transparent glass 11 to play a limiting role. When the light source 12 below the special tooling for the probe pin is turned on, the high light transmittance of the transparent glass 11 is utilized to facilitate the alignment camera 13 to capture the circular coordinate positions of the upper and lower pinholes.

[0089] In some more specific embodiments, the alignment camera system includes an alignment camera 13, an X-axis motion axis 14, a Y-axis motion axis 15, and a Z-axis motion axis 16, wherein the alignment camera 13 is arranged on the Y-axis motion axis 15, the Y-axis motion axis 15 is arranged on the X-axis motion axis 14, and the X-axis motion axis 14 is arranged on the Z-axis motion axis 16. The X-axis motion axis 14, the Y-axis motion axis 15, and the Z-axis motion axis 16 are respectively connected to a controller and controlled by the controller, so that the alignment camera 13 can be controlled to move precisely in the X, Y, and Z directions. The alignment camera 13 moves to the top of the probe pin special tooling, identifies the Mark marks 5 on the left and right sides of the second clamping block 4, and moves to the top of the pin hole 1 based on the Mark mark 5. The camera takes a photo to obtain the precise coordinate position of the pin hole and transmits the coordinate position information to the controller. The controller then controls the gripping system to accurately insert the flat-head pin probe 100 into the corresponding pin hole 1.

[0090] In some more specific embodiments, the gripper system includes a gripper 17 connected to a controller, an X-axis motion axis 18, a Y-axis motion axis 19, a Z-axis motion axis 20, an X-axis rotation axis 21, a Y-axis rotation axis 22, and a Z-axis rotation axis 23. The controller controls the gripper 17 to move in the X, Y, and Z directions and rotate around the X axis, the Y axis, and the Z axis. The controller controls the gripper 17 to grip and release the flat-head needle probe 100.

[0091] In some embodiments, in step 2), laser leveling is performed by a leveling assembly (including a laser head), and the tip 101 and the tail 102 of the flat-head needle probe 100 are cut by laser, so that the length of all the flat-head needle probes 100 meets the size requirements, and the tips 101 and the tails 102 of all the flat-head needle probes are flush in the horizontal direction when they are set vertically. During the laser leveling process, the center of the laser head is perpendicular to the axis of the probe, and finally the flat-head needle probe 100 is obtained. Figure 12 The semi-finished product shown has flush needle tips and flush needle tails.

[0092] In some embodiments, in step 3), the shaping and chamfering operation of the flat-head needle probe tip is completed by a probe tip shaping and chamfering device, and the probe tip shaping and chamfering device includes a platform 24, an X-motion axis 25, a Y-motion axis 26, and a Z-motion axis 27. The X-motion axis 25, the Y-motion axis 26, and the Z-motion axis 27 are respectively connected to the controller, and the platform 24 is arranged on the Z-motion axis 27. A friction element such as sandpaper 28 for rubbing the needle tip 101 is provided on the platform 24. The grit of the sandpaper is close to half of the diameter of the probe. The Z-motion axis 27 is arranged on the Y-motion axis 26, and the Y-motion axis 26 is arranged on the X-motion axis 25. The X-motion axis 25 can drive the platform 24 to move in the X direction, the Y-motion axis 26 can drive the platform 24 to move in the Y direction, and the Z-motion axis 27 can drive the platform 24 to move in the Z direction. Figure 13The specific process is as follows:

[0093] Keep the flat-head needle probe 100 stationary, and control the Z motion axis 27 through the controller to drive the platform 24 to rise. After the friction element such as sandpaper 28 contacts the needle tip 101, take the contact point as the starting point, control the Z motion axis 27 through the controller to drive the platform 24 to rise a certain height (such as 50 μm), and then control the Z motion axis 27 through the controller to drive the platform 24 to descend to the starting point, and then rise a certain height (such as 50 μm), and repeat this cycle several times (such as 1000 times). At the same time, the X motion axis 25 and the Y motion axis 26 are cyclically moved through the control of the controller, thereby driving the platform 24 to move synchronously, ensuring that each area of ​​the sandpaper 28 is used several times (such as 1000 times), and the entire sandpaper is used as much as possible, and the entire area is used as much as possible to achieve mutual friction between the needle tip 101 and the friction component. In some embodiments, the sandpaper 28 is in a waffle structure. When the flat-head needle probe 100 contacts the sandpaper 28, the mesh of the sandpaper 28 and the flat-head needle probe 100 rub against each other, thereby completing the shaping chamfer of the needle tip. Figure 14 The sandpaper 28 and the needle tip 101 are shown in the schematic diagram when they are not in contact and in contact, and finally the result is Figure 15 After the needle tip is shaped and chamfered, the needle arm 103 and the needle tail 102 need to be processed.

[0094] In some embodiments, in step 4), the rotating laser head 29 is used to rotate 5 to 15 degrees around the central axis to cut the needle tail 102 to complete the chamfering of the needle tail of the flat-head needle probe, such as Figure 16-17 shown.

[0095] In some embodiments, as Figure 18 As shown, in step 5), the needle arm 103 is coated with a film by ultrasonic spray atomization through a coating assembly (including an ultrasonic spray atomization device and a hot plate). The film material is photoresist, the thickness uniformity is greater than 95%, and the dispensing area tolerance is ±0.1mm. The corresponding spray photoresist process parameters are as follows:

[0096] High temperature resistant photoresist: phenolic resin based positive photoresist, temperature resistant 150-180℃;

[0097] Dielectric constant 2.5~3.5, with good insulation properties;

[0098] Ultrasonic spray atomization of photoresist with a viscosity of 5-15cps ensures uniform atomization and avoids droplet agglomeration;

[0099] The ultrasonic nozzle 30 is 50 mm away from the needle arm 103 to reduce airflow interference and improve positioning accuracy;

[0100] Atomization frequency 50~300kHz, power 20~50W, atomization nitrogen pressure 0.01~0.2Mpa, gas flow 0.5~2L / min, spraying speed 0.01~0.3m / s;

[0101] After spraying, bake on a hot plate at 90-120℃ / 30-100s to remove moisture from the photoresist. Figure 19 The semi-finished probe with a photoresist film 31 is shown.

[0102] In some embodiments, in step 6), the needle tail 102 is plated with a metal layer by electrolysis through an electrolytic assembly (including electrolytic equipment such as an electrolytic cell and a power supply), and the second clamping block 4 is connected to the cathode of the power supply. Since copper is conductive, all probes are conductive at the same potential. The electroplating solution in the electrolytic cell is a potassium gold cyanide solution with a concentration of 4 to 10 g / L, the electroplating solution temperature is 50 ± 1 ° C, the electroplating time is 1 to 4 min, and the current density is 0.5 to 2 A / dm 2 The pH value of the solution is 6.5±0.2. The gold cations are reduced during electroplating and adsorbed on the needle tail 102. After electroplating, it is washed with pure water and then placed in a hot air circulation drying at 80-100°C to obtain the desired probe product.

[0103] Parts or structures not specifically described in the present invention may adopt existing technologies or existing products and will not be described in detail here.

[0104] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A flat-head needle probe, characterized in that: It comprises a needle tip, a needle arm and a needle tail connected in sequence, wherein the needle tip has a shaped chamfer, the needle arm is provided with a coating layer, the needle tail has a chamfer and is provided with a metal layer, and along the axial direction of the flat-head needle probe, the needle tip can be twisted relative to the needle tail.

2. A flat-head needle probe according to claim 1, characterized in that: The flat-head needle probe has a circular radial cross-section, a diameter of 10 to 40 μm, and a length of 3.5 to 6.5 mm.

3. A probe card, characterized in that: A flat-head needle probe according to claim 1 or 2, further comprising a lower punched plate and an upper punched plate, wherein a lower cover plate interlayer is glued to the lower punched plate, and an upper cover plate interlayer is glued to the upper punched plate, and the lower punched plate deviates from the upper punched plate in the positive X direction and the negative Y direction, the lower punched plate is provided with a plurality of lower guide holes, and the upper punched plate is provided with a plurality of upper guide holes, and the plurality of flat-head needle probes are respectively slidably extended in a pair of upper guide holes and lower guide holes deviated from each other in the X direction, and along the axial direction of the flat-head needle probe, the needle tip is twisted relative to the needle tail, the needle tail contacts the upper guide hole in the negative X direction, and the needle tip contacts the lower guide hole in the positive X direction.

4. A device for manufacturing a flat-head needle probe according to claim 1 or 2, characterized in that: include: Automatic pin insertion device, used to complete the flat-head needle probe insertion operation; Leveling assembly, used to make the tips and tails of all flat-end needle probes flush; Probe tip shaping and chamfering device, used to complete the shaping and chamfering operation of the flat-head needle probe tip; Rotating laser head, used to complete the chamfering of the flat-end needle probe needle end; Coating assembly, used for coating the needle arm of the flat-head needle probe; Electrolytic assembly for metallization of flat-tip probe tips.

5. The manufacturing device of a flat-head needle probe according to claim 4, characterized in that: The automatic pin insertion device includes a special tooling for probe pin insertion, a positioning camera system and a clamping system. The positioning camera system and the clamping system are respectively connected to the controller. The positioning camera system is used to determine the positions of the upper pin hole and the lower pin hole on the special tooling for probe pin insertion and transmit them to the controller. The controller is used to control the clamping system to accurately insert the flat-head pin probe into the upper pin hole and the lower pin hole.

6. The manufacturing device of a flat-head needle probe according to claim 5, characterized in that: A positioning camera system is arranged above the special tooling for probe pins, and a light source is arranged below the special tooling for probe pins. The special tooling for probe pins includes a first clamping block and a second clamping block arranged face to face and fixed by fasteners. A plurality of Mark marks are engraved on the second clamping block. A plurality of sockets opposite to each other are respectively provided on the first clamping block and the second clamping block. Each socket on the top of the first clamping block is matched with a socket on the top of the second clamping block, the positions correspond one to one and the two are aligned to form an upper pin hole. Each socket at the bottom of the first clamping block is matched with a socket at the bottom of the second clamping block, the positions correspond one to one and the two are aligned to form a lower pin hole. There are several upper pin holes and lower pin holes, and each upper pin hole is opposite to a lower pin hole up and down.

7. The manufacturing device of a flat-head needle probe according to claim 4, characterized in that: The probe tip shaping and chamfering device includes a platform, an X-motion axis, a Y-motion axis and a Z-motion axis. The platform is arranged on the Z-motion axis. A friction element for rubbing the tip of the flat-head needle probe is provided on the platform. The Z-motion axis is arranged on the Y-motion axis. The Y-motion axis is arranged on the X-motion axis. The X-motion axis can drive the platform to move in the X direction. The Y-motion axis can drive the platform to move in the Y direction. The Z-motion axis can drive the platform to move in the Z direction.

8. A method for manufacturing a flat-end needle probe, implemented using the apparatus for manufacturing a flat-end needle probe according to claim 4, characterized in that: The following steps are involved: 1) Complete the flat-head needle probe insertion operation; 2) Laser leveling to make the tips and tails of all flat-head needle probes flush; 3) Complete the shaping and chamfering operation of the flat-head needle probe tip; 4) Complete the chamfering of the flat-head needle probe tail: 5) Coating the flat-tip probe arm; 6) Plating a metal layer on the tail of the flat-head needle probe; Step 3) to step 6) are in no particular order.

9. The method for manufacturing a flat-head needle probe according to claim 8, characterized in that: In step 5), the needle arm of the flat-head needle probe is coated by ultrasonic spray atomization. The film material is photoresist, the dielectric constant is 2.5-3.5, the thickness uniformity is >95%, the dispensing area tolerance is ±0.1mm, the atomization frequency is 50-300kHz, the power is 20-50W, the atomizing nitrogen pressure is 0.01-0.2MPa, the gas flow rate is 0.5-2L / min, and the spraying speed is 0.01-0.3m / s.

10. The method for manufacturing a flat-head needle probe according to claim 8, characterized in that: In step 6), the metal layer is plated on the tail of the flat-head needle probe by electrolysis, the concentration of the electroplating solution is 4-10g / L, the temperature of the electroplating solution is 50±1°C, the electroplating time is 1-4min, and the current density is 0.5-2A / dm 2 The pH value of the solution is 6.5±0.

2. After electroplating, it is washed with water and dried to obtain the required flat-head needle probe product.

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