Method for manufacturing a probe card, electronic device and probe card

Abstract

The application discloses a manufacturing method of a probe card, an electronic device and the probe card, and relates to the technical field of probe cards. The method comprises the following steps: obtaining a basic model of a reinforcing part of the probe card and element position information and element height information of a printed circuit board; setting a hollow area at a position corresponding to each element on the basic model based on the element position information; setting a protrusion in each hollow area based on the element height information, and a through hole of the hollow area penetrating through the protrusion; manufacturing the reinforcing part based on the basic model of the reinforcing part; and sequentially assembling an upper cover of the probe card, the reinforcing part, the printed circuit board and a mechanical bearing layer to obtain the probe card. The application sets a hollow area at a position corresponding to each element on the basic model based on element position information, the hollow area comprises a through hole capable of accommodating elements on the printed circuit board, the area of the printed circuit board on which elements can be arranged is increased, the number of elements capable of being accommodated on the printed circuit board is increased, and the test efficiency of the probe card is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of new generation information technology, and in particular to a manufacturing method of a probe card, an electronic device and the probe card. BACKGROUND

[0002] At present, the chip industry is booming. In the production process of chips, when the chips have not been packaged, the wafers need to be detected to prevent unqualified wafers from being further processed. The detection of the wafers needs to use a probe card, which includes a plurality of probes. The probes transmit test signals by directly contacting the solder pads or bumps on the wafers.

[0003] At present, with the increasing demand for test efficiency, the number of chips that need to be tested simultaneously by one probe card increases, and therefore the number of components on the printed circuit board of the probe card also increases.

[0004] However, the physical space of the printed circuit board itself is limited, and a contact area with a reinforcing member for strengthening the mechanical strength of the probe card needs to be reserved, which limits the number of components that can be accommodated on the printed circuit board. SUMMARY

[0005] In view of the problems in the prior art, the present application provides a manufacturing method of a probe card, an electronic device and the probe card. A hollow area is set at a position corresponding to each component on a basic model of a reinforcing member of the probe card based on component position information. The hollow area includes a through hole that can accommodate a component on a printed circuit board. This can increase the area on the printed circuit board where components can be arranged, thereby increasing the number of components that can be accommodated on the printed circuit board and improving the test efficiency of the probe card.

[0006] To solve the above problems, the present application provides the following technical solutions:

[0007] In a first aspect, the present application provides a manufacturing method of a probe card, which includes: obtaining a basic model of a reinforcing member of the probe card and component position information and component height information of a printed circuit board of the probe card;

[0008] Based on the component position information, a hollow area is set at a position corresponding to each component on the basic model of the reinforcing member of the probe card. The hollow area includes a through hole that can accommodate a component on the printed circuit board.

[0009] Based on the component height information, a protrusion with a height not less than that of the corresponding component is set in each hollow area. The through hole of the hollow area penetrates the protrusion.

[0010] The reinforcing member is manufactured based on the basic model of the reinforcing member with the hollow area set.

[0011] Assembling the upper cover, the stiffener, the printed circuit board and the mechanical bearing layer of the probe card in sequence to obtain the probe card.

[0012] In some embodiments, the protrusion is a boss, and the boss is parallel to the surface of the printed circuit board away from the upper surface of the printed circuit board.

[0013] In some embodiments, the boss is a cylinder, a column or an irregular solid, and the boss has a cross-sectional shape of a circle, a polygon or an irregular geometric figure.

[0014] In some embodiments, the through hole of the hollow region penetrates the protrusion along the axial direction of the protrusion.

[0015] In some embodiments, the cross-sectional profile of the through hole of the hollow region matches the projection profile of the element accommodated in the hollow region on the stiffener.

[0016] In some embodiments, the positions of all the hollow regions are symmetrical about the center of symmetry of the stiffener.

[0017] In some embodiments, the method for setting the hollow region corresponding to each element on the basic model of the stiffener of the probe card based on the element position information comprises:

[0018] determining the area of the fastener on the basic model of the stiffener based on the element position information;

[0019] setting the boss in each area of the fastener;

[0020] based on the element position information, setting the hollow region in the area of the stiffener corresponding to each element except the area of the fastener.

[0021] In some embodiments, the method for manufacturing the stiffener based on the basic model of the stiffener with the hollow region set comprises:

[0022] manufacturing the body of the stiffener and the through hole of the hollow region on the body based on the basic model of the stiffener with the hollow region set;

[0023] manufacturing the protrusion on each hollow region by using an elastic material to obtain the stiffener.

[0024] In a second aspect, the embodiments of the present application provide an electronic device, which comprises:

[0025] at least one processor; and

[0026] a memory in communication connection with the at least one processor; wherein

[0027] The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method for manufacturing the probe card according to the first aspect.

[0028] In a third aspect, the embodiments of the present application provide a probe card, which is manufactured by the method for manufacturing the probe card according to the first aspect.

[0029] The probe card comprises a cover, a reinforcing member, a printed circuit board and a mechanical bearing layer, the reinforcing member comprises a hollow area, the hollow area comprises a through hole and a protrusion, the through hole of the hollow area penetrates the protrusion.

[0030] The present application provides a method for manufacturing a probe card, an electronic device and a probe card. The present application sets a hollow area corresponding to each element on a basic model of a reinforcing member of a probe card based on element position information, the hollow area comprises a through hole that can accommodate an element on a printed circuit board, which can increase the area of the printed circuit board where elements can be arranged, thereby increasing the number of elements that can be accommodated on the printed circuit board, and facilitating to improve the testing efficiency of the probe card. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 FIG. 1 is a flow diagram of the method for manufacturing the probe card according to the embodiments of the present application.

[0032] Figure 2 FIG. 3 is a perspective view of the basic model of the reinforcing member according to the embodiments of the present application.

[0033] Figure 3 FIG. 4 is a front view of the basic model of the reinforcing member according to the embodiments of the present application.

[0034] Figure 4 FIG. 5 is a structural diagram of an electronic device according to the embodiments of the present application.

[0035] Figure 5 FIG. 6 is a structural block diagram of a computer readable storage medium according to the embodiments of the present application. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0037] In addition, the terms "first", "second", etc. are used only for descriptive purposes and are not to be construed as indicating or implying relative importance or an indicated number of technical features. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0038] The present application provides a probe card manufacturing method, an electronic device and a probe card. By setting a hollow area at a position corresponding to each component on a basic model of a reinforcing member of a probe card based on component position information, the hollow area including a through hole capable of accommodating a component on a printed circuit board, the area on the printed circuit board where the component can be disposed is increased, thereby increasing the number of components that can be accommodated on the printed circuit board, and the test efficiency of the probe card is improved.

[0039] The probe card manufacturing method provided by the present application will be described in detail below with reference to the accompanying drawings.

[0040] Please refer to Figure 1 , Figure 1 is a flowchart of the probe card manufacturing method provided by the present application. As Figure 1 shown, the probe card manufacturing method includes steps S100 to S500.

[0041] Step S100: Obtain a basic model of a reinforcing member of a probe card and component position information and component height information of a printed circuit board of the probe card.

[0042] In some embodiments, a plurality of electronic components are disposed on the printed circuit board of the probe card. The component position information includes information of the position of each electronic component on the printed circuit board, and the component height information includes information of the height of each electronic component on the printed circuit board. The height of the electronic component refers to the height of the electronic component protruding from the surface of the printed circuit board towards the reinforcing member.

[0043] Step S200: Set a hollow area at a position corresponding to each component on the basic model of the reinforcing member of the probe card based on the component position information.

[0044] The hollow area includes a through hole capable of accommodating a component on the printed circuit board. Since the component mounted on the printed circuit board will have part of the structure protruding from the surface of the printed circuit board, in this way, the part of the structure of the component protruding from the surface of the printed circuit board can be accommodated in the through hole, so as not to push open the reinforcing member, facilitating subsequent assembly of the reinforcing member and the printed circuit board.

[0045] In some embodiments, since the stiffener of the probe card is assembled in a stacked manner with the printed circuit board of the probe card, the contact area of the stiffener with the printed circuit board can be determined in advance on the basic model of the stiffener. Based on the element position information and the contact area of the printed circuit board on the basic model, the position coordinates of each element on the printed circuit board corresponding to the position coordinates on the contact area of the basic model can be determined, and then the position coordinates of each element on the upper surface of the basic model away from the printed circuit board corresponding to the position coordinates of each element on the contact area of the basic model can be determined.

[0046] Optionally, on the upper surface of the basic model away from the printed circuit board, the position coordinates of each element are determined as the center coordinates of the hollowed-out area, and a preset area range including the center coordinates of the hollowed-out area is determined as the hollowed-out area.

[0047] Optionally, the preset area range can be a circular area range, a rectangular area range, or an area range of other shapes.

[0048] Illustratively, a circular area range with the center coordinates of the hollowed-out area as the center and a preset radius as the radius can be determined.

[0049] Optionally, the through hole can be a circular through hole, a rectangular through hole, or an irregularly shaped through hole, etc.

[0050] Please refer to Figure 2 and Figure 3 , Figure 2 is a schematic diagram of the basic model of the stiffener provided by the embodiments of the present application, Figure 3 is a schematic diagram of the basic model of the stiffener provided by the embodiments of the present application. As Figure 2 and Figure 3 shown, in some embodiments, the basic model D of the stiffener is provided with a plurality of hollowed-out areas A, including a first hollowed-out area A1, a second hollowed-out area A2, a third hollowed-out area A3, a fourth hollowed-out area A4, a fifth hollowed-out area A5, and a sixth hollowed-out area A6. Illustratively, the first hollowed-out area A1 includes a through hole X.

[0051] In some embodiments, the cross-sectional profile of the through hole of the hollowed-out area matches the projection profile of the element accommodated by the hollowed-out area on the stiffener. The projection profile of the element on the stiffener refers to the projection profile of the element in the assembly direction of the stiffener and the printed circuit board. In this way, the through hole can play a limiting role on the element, and the area occupied by the through hole can be reduced as much as possible.

[0052] Optionally, the distance between the sidewall of the through-hole in the cutout area and the component that the cutout area can accommodate is a first preset distance. In this way, even with certain manufacturing errors, the through-hole can still accommodate the corresponding component, thereby facilitating the assembly of the probe card.

[0053] For example, the first preset distance is 0.001 mm, 0.005 mm, or 0.01 mm, etc.

[0054] Optionally, the center coordinates of the hollowed-out area can be used as the center coordinates of the through hole, and then the through hole can be set according to the center coordinates of the through hole.

[0055] In some embodiments, the reinforcement and the printed circuit board need to be fastened together using fasteners. The area on the reinforcement where the fasteners are installed cannot be hollowed out, otherwise the fixing strength will be affected. In this case, step S200 includes steps S210 to S230.

[0056] Step S210: Determine the area of ​​fasteners on the basic model of the reinforcement based on the component location information.

[0057] Fasteners are used to securely assemble the reinforcement to the printed circuit board. Optionally, fasteners may include screws and rivets.

[0058] In some implementations, the component location information also includes the location information of fasteners that need to be mounted on the printed circuit board. Based on the component location information and the contact area between the basic model and the printed circuit board, the position coordinates of each fastener on the printed circuit board on the contact area of ​​the basic model can be determined. Furthermore, based on the position coordinates of each fastener on the contact area of ​​the basic model, the position coordinates of each fastener on the upper surface of the basic model away from the printed circuit board can be determined.

[0059] Optionally, on the upper surface of the basic model away from the printed circuit board, a preset area including the position coordinates corresponding to each fastener is defined as the area of ​​the fastener.

[0060] Step S220: Set a boss in the area of ​​each fastener.

[0061] In this design, the upper surface of the boss, furthest from the printed circuit board, is parallel to the surface of the printed circuit board. This arrangement results in a large contact area between the boss and the probe card's top cover, leading to lower pressure under the same load. This protects the top cover and facilitates its installation on the reinforcing member.

[0062] like Figure 2 and Figure 3 As shown, for example, a boss Z is provided in region B2 of the fastener.

[0063] Step S230: based on the component position information, set a hollow region in the position corresponding to each component in the area of the reinforcement except the area of the fastener.

[0064] As shown in Figure 2 and Figure 3 , for example, the basic model D is provided with a fastener area B, such as fastener area B1 and fastener area B2 on the basic model D. The fastener area B1 and the fastener area B2 do not include through holes. In this way, the area where the fastener is installed will not be hollowed out, and the fixing strength of the reinforcement and the printed circuit board can be improved.

[0065] Step S300: based on the component height information, set a protrusion with a height not less than the height of the corresponding component in each hollow region.

[0066] Wherein the through hole of the hollow region penetrates the protrusion. As shown in Figure 2 and Figure 3 , for example, the through hole X of the first hollow region A1 penetrates the protrusion Y. In this way, when the component is contained in the through hole, the protrusion can protect the component.

[0067] Preferably, the height of the protrusion is equal to the height of the corresponding component.

[0068] In some embodiments, the protrusion is a boss, and the boss is parallel to the surface of the printed circuit board away from the upper surface of the printed circuit board.

[0069] In some embodiments, the boss is a cylinder, a platform or an irregular solid shape. The cross-sectional shape of the boss is circular, polygonal or irregular geometric shape.

[0070] As shown in Figure 2 and Figure 3 , for example, the protrusion Y is a boss. Optionally, the cross-sectional shape of the protrusion Y is circular or irregular geometric shape.

[0071] Optionally, the specific shape of the boss can be designed according to the actual needs and the shape of the component.

[0072] In some embodiments, the through hole of the hollow region penetrates the protrusion along the axial direction of the protrusion.

[0073] Optionally, the axial direction of the protrusion can be the geometric symmetry axis of the protrusion, or a pre-specified axial direction.

[0074] In some embodiments, the positions of all hollow regions are symmetrical about the center of symmetry of the reinforcement.

[0075] Wherein the center of symmetry of the reinforcement includes the symmetry axis and the center of symmetry, etc.

[0076] It is understood that the symmetry defined in this application is not absolute symmetry, but rather refers to making the positions of all hollow areas as close to absolute symmetry with respect to the center of symmetry of the reinforcing member as possible, where conditions permit. For example, in areas where fasteners are present, it may not be possible to make the positions of all hollow areas absolutely symmetrical with respect to the center of symmetry of the reinforcing member, but it is possible to make the positions of all hollow areas close to absolute symmetry with respect to the center of symmetry of the reinforcing member.

[0077] By symmetrically positioning all the hollowed-out areas about the center of the reinforcing member, the overall deformation of the reinforcing member can be made uniform under high temperature conditions, thereby reducing the deformation of the probe card.

[0078] Optionally, when the basic model has a center point of symmetry, for each hollow area, there is a corresponding hollow area that is centrally symmetric to the hollow area about the center point of symmetry.

[0079] like Figure 3 As shown, exemplarily, when the basic model D is circular, the basic model D has a center O, which is the center of symmetry. The first hollowed-out area A1 and the second hollowed-out area A2 are symmetrical about the center O. The third hollowed-out area A3 and the fifth hollowed-out area A5 are symmetrical about the center O. The fourth hollowed-out area A4 and the sixth hollowed-out area A6 are symmetrical about the center O.

[0080] Optionally, when the basic model has an axis of symmetry, the positions of all cutout regions can be symmetrical about the axis of symmetry. For each cutout region, there is a corresponding cutout region that is symmetrical about the axis of symmetry.

[0081] In some embodiments, the upper surface of the protrusions away from the printed circuit board can be a sawtooth surface or a wavy surface, and the cover mounted on the reinforcement can include a groove that matches the surface of each protrusion. For example, when the upper surface of the protrusion is a sawtooth surface, the cover can include a sawtooth groove that matches the sawtooth surface. In this way, the protrusions can also limit the position of the cover.

[0082] Step S400: Manufacture the reinforcing part based on the basic model of the reinforcing part with the hollowed-out area set.

[0083] In some implementations, the reinforcing member is manufactured as a single piece based on a basic model of the reinforcing member.

[0084] In some embodiments, the protrusion may be made of an elastic material. In this case, step S400 includes steps S410 to S420.

[0085] Step S410: Based on the basic model of the reinforcing member with the hollowed-out area, manufacture the main body of the reinforcing member and the through holes of the hollowed-out area on the main body.

[0086] Optionally, the through hole of the hollow region is manufactured at the same time when the main body of the reinforcing member is manufactured.

[0087] Step S420: manufacturing the protrusion on each hollow region by using the elastic material, to obtain the reinforcing member.

[0088] Optionally, the elastic material includes rubber, silica gel, polyurethane, etc.

[0089] In some embodiments, an elastic film can be arranged on the protrusion. In this way, the damage of the circuit board caused by the protrusion can be prevented.

[0090] In some embodiments, the step S400 can include steps S430-S450.

[0091] Step S430: assembling the model of the probe card based on the basic model of the reinforcing member with the hollow region and the model of the upper cover of the probe card, the printed circuit board and the mechanical bearing layer, and performing physics simulation based on the model of the probe card to obtain a simulation result.

[0092] The physics simulation includes thermal simulation and mechanical simulation.

[0093] Optionally, the deformation of the probe card under the preset high-temperature environment can be calculated based on the model of the probe card, and the mechanical strength of the probe card under the preset mechanical simulation condition can be calculated.

[0094] Optionally, the preset mechanical simulation condition can include a preset collision condition and a preset stretching condition, etc.

[0095] Step S440: modifying the basic model of the reinforcing member according to the simulation result to obtain an optimized basic model when it is judged that the simulation result does not satisfy the preset condition.

[0096] For example, when the mechanical strength of the probe card under the preset mechanical simulation condition is less than the preset strength, the number of the hollow regions can be reduced.

[0097] For example, when the deformation of the probe card under the preset high-temperature environment is greater than the preset deformation, the hollow regions can be reduced so that the positions of all the hollow regions are closer to the absolute symmetry about the center of symmetry of the reinforcing member.

[0098] Step S450: manufacturing the reinforcing member based on the optimized basic model.

[0099] The method for manufacturing the reinforcing member based on the optimized basic model is described above.

[0100] In some embodiments, when it is judged that the simulation result satisfies the preset condition, the reinforcing member can be manufactured based on the current basic model.

[0101] Step S500: Assembling the upper cover, the reinforcing member, the printed circuit board and the mechanical bearing layer of the probe card in sequence to obtain the probe card.

[0102] In some embodiments, the present application further provides a probe card, which is manufactured by the manufacturing method of the probe card.

[0103] In some embodiments, the probe card comprises an upper cover, a reinforcing member, a printed circuit board and a mechanical bearing layer. The reinforcing member comprises a hollow region, the hollow region comprises a through hole and a protrusion which can accommodate the element on the printed circuit board, and the through hole of the hollow region penetrates the protrusion.

[0104] Optionally, the reinforcing member and the printed circuit board are fixedly assembled by using the fastener.

[0105] Optionally, the mechanical bearing layer comprises an intermediate layer and a bottom layer. The intermediate layer comprises an intermediate layer protective cover and an intermediate layer main body. The intermediate layer protective cover is used to improve the fixing strength between the intermediate layer main body and the printed circuit board.

[0106] Optionally, the probe card is a Micro-Electro-Mechanical Systems (MEMS) probe card.

[0107] In summary, the manufacturing method of the probe card provided by the embodiments of the present application has the following advantages:

[0108] 1. By setting the hollow region at the position corresponding to each element on the basic model of the reinforcing member of the probe card based on the element position information, the hollow region comprises a through hole which can accommodate the element on the printed circuit board, which can increase the area of the printed circuit board where the element can be arranged, thereby increasing the number of elements that can be accommodated on the printed circuit board, and is conducive to improving the test efficiency of the probe card.

[0109] 2. By setting the hollow region at the position corresponding to each element in the area of the reinforcing member except the area where the fastener is installed, the area where the fastener is installed will not be hollowed, which can improve the fixing strength of the reinforcing member and the printed circuit board.

[0110] 3. By the way that the positions of all the hollow regions are symmetrical about the center of symmetry of the reinforcing member, the overall deformation of the reinforcing member under high temperature environment can be uniform, thereby reducing the deformation of the probe card.

[0111] Please refer to Figure 4 , Figure 4 is a structural schematic diagram of an electronic device provided by the embodiments of the present application. As shown in Figure 4 , the electronic device 400 comprises one or more processors 410 and a memory 420, Figure 4 , taking one processor 410 as an example.

[0112] In some embodiments, the processor 410 and the memory 420 can be connected by a bus or other means, Figure 4 For example, the bus connection is taken as an example.

[0113] In some embodiments, the processor 410 is configured to obtain a basic model of a stiffener of a probe card and element position information and element height information of a printed circuit board of the probe card; set a hollow area corresponding to a position of each element on the basic model of the stiffener of the probe card based on the element position information, the hollow area including a through hole capable of accommodating an element on the printed circuit board; set a protrusion with a height not less than a height of the corresponding element in each hollow area based on the element height information, the through hole of the hollow area penetrating the protrusion; manufacture the stiffener based on the basic model of the stiffener; and sequentially assemble an upper cover of the probe card, the stiffener, the printed circuit board and a mechanical bearing layer to obtain the probe card.

[0114] The processor 410 can control the probe card manufacturing device to manufacture the stiffener based on the basic model of the stiffener, and sequentially assemble the upper cover of the probe card, the stiffener, the printed circuit board and the mechanical bearing layer to obtain the probe card.

[0115] In some embodiments, the memory 420 can be used to store non-volatile software programs, non-volatile computer executable programs and modules, such as program instructions / modules of the probe card manufacturing method in the embodiments of the present application. The processor 410 executes the various functional applications and data processing of the electronic device 400 by running the non-volatile software programs, instructions and modules stored in the memory 420, that is, implements the probe card manufacturing method of the above method embodiments.

[0116] In some embodiments, the memory 420 can include a program storage area and a data storage area, wherein the program storage area can store an operating system and application programs required by at least one function; the data storage area can store data created according to the use of the electronic device 400, etc. In addition, the memory 420 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 420 can optionally include a memory remotely arranged with respect to the processor 410, and these remote memories can be connected to the controller through a network. Examples of the above network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network and a combination thereof.

[0117] In some embodiments, one or more modules are stored in the memory 420, and when executed by the one or more processors 410, perform the probe card manufacturing method in any of the above method embodiments, for example, perform the probe card manufacturing method described above.Figure 1 The method steps S100-S500 in the method.

[0118] Please refer to Figure 5 , Figure 5 is a structural block diagram of a computer readable storage medium provided by an embodiment of the present application. The computer readable storage medium 500 stores program code 510, which can be called and executed by a processor to perform the manufacturing method of the probe card described in the above method embodiments.

[0119] The computer readable storage medium 500 can be an electronic storage such as a flash memory, an electrically erasable programmable read only memory (EEPROM), a hard disk or a read-only memory (ROM). Alternatively, the computer readable storage medium includes a non-volatile computer readable medium. The computer readable storage medium 500 has a storage space for program code for performing any method step in the above manufacturing method of the probe card. These program codes can be read from or written into one or more computer program products. The program code can be compressed in an appropriate form, for example.

[0120] The present application also provides a computer program product comprising a computer program which, when executed by a processor, implements the above manufacturing method of the probe card.

[0121] In summary, the present application provides a manufacturing method of a probe card, an electronic device and a probe card. The manufacturing method of the probe card comprises: obtaining a basic model of a reinforcing member of the probe card and element position information and element height information of a printed circuit board of the probe card; setting a hollow region at a position corresponding to each element on the basic model of the reinforcing member of the probe card based on the element position information, the hollow region comprising a through hole capable of accommodating an element on the printed circuit board; setting a protrusion with a height not less than that of the corresponding element in each hollow region based on the element height information, the through hole of the hollow region penetrating the protrusion; manufacturing the reinforcing member based on the basic model of the reinforcing member; and assembling the upper cover, the reinforcing member, the printed circuit board and the mechanical bearing layer of the probe card in sequence to obtain the probe card. By setting a hollow region at a position corresponding to each element on the basic model of the reinforcing member of the probe card based on the element position information, the present application can increase the area of the printed circuit board where elements can be arranged, thereby increasing the number of elements that can be accommodated on the printed circuit board, which is conducive to improving the testing efficiency of the probe card.

[0122] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art will understand that they can still modify the technical solutions described in the foregoing examples, or make equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for manufacturing a probe card, characterized in that, include: Obtain the basic model of the probe card's reinforcement, as well as the component location and height information of the probe card's printed circuit board; Based on the component location information, a cutout area is set at the position corresponding to each component on the basic model of the probe card reinforcement. The cutout area includes through holes that can accommodate components on the printed circuit board. The positions of all the cutout areas are symmetrical about the center of symmetry of the reinforcement. The step of setting a cutout area at the position corresponding to each component on the basic model of the probe card's reinforcement based on the component position information includes: The region of the fastener on the basic model of the reinforcing member is determined based on the component location information; A boss is provided in the area of ​​each of the fasteners; Based on the component location information, the hollow area is set at the position corresponding to each component in the area of ​​the reinforcing member other than the area of ​​the fastener; Based on the component height information, a protrusion with a height not less than the height of the corresponding component is provided in each of the hollow areas, and the through hole of the hollow area penetrates the protrusion; The reinforcing member is manufactured based on a basic model of the reinforcing member with the hollowed-out area. The probe card is obtained by sequentially assembling its top cover, reinforcing member, printed circuit board, and mechanical bearing layer.

2. The method for manufacturing a probe card according to claim 1, characterized in that, The protrusion is a boss, and the boss is parallel to the surface of the printed circuit board away from the upper surface of the printed circuit board.

3. The method for manufacturing a probe card according to claim 2, characterized in that, The boss is a column, a platform, or an irregular three-dimensional shape, and the cross-sectional shape of the boss is a circle, a polygon, or an irregular geometric figure.

4. The method for manufacturing a probe card according to claim 1, characterized in that, The through hole in the hollowed-out area extends through the protrusion along its axial direction.

5. The method for manufacturing a probe card according to claim 1, characterized in that, The cross-sectional profile of the through hole in the hollowed-out area matches the projected profile of the component that the hollowed-out area can accommodate on the reinforcement.

6. The method for manufacturing a probe card according to claim 1, characterized in that, The manufacturing of the reinforcing member based on the basic model of the reinforcing member with the hollowed-out area includes: The body of the reinforcing member and the through holes of the hollowed-out area on the body are manufactured based on the basic model of the reinforcing member with the hollowed-out area set. The protrusions are manufactured in each of the hollowed-out areas using an elastic material to obtain the reinforcing member.

7. An electronic device, characterized in that, The electronic device includes: At least one processor; and, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of manufacturing the probe card as described in any one of claims 1 to 6.

8. A probe card, characterized in that, The probe card is a probe card manufactured using the probe card manufacturing method as described in any one of claims 1 to 6; The probe card includes a top cover, a reinforcing member, a printed circuit board, and a mechanical support layer. The reinforcing member includes a hollow area, which includes through holes and protrusions that can accommodate components on the printed circuit board. The through holes in the hollow area penetrate the protrusions.

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