Relay intelligent verification system and method

Abstract

The invention relates to the technical field of high-voltage electrical equipment detection, and discloses a relay intelligent verification system and method, and the system comprises a built-in pressure temperature module, an external remote transmission density relay module, an MCU control module, a data storage module, a result analysis module, and a human-computer interaction interface. By integrating the built-in pressure and temperature module, the external remote transmission density relay module, the MCU control module, the data storage module, the result analysis module and the human-computer interaction interface, comprehensive verification of the relay performance is realized, the built-in pressure and temperature module can correct measurement errors in real time, the measurement accuracy is improved, and the measurement cost is reduced. The external remote transmission density relay module supports an electric power dedicated protocol analysis chip and a DL / T 860.92 communication protocol to realize seamless connection with the detected equipment, the equipment information is automatically acquired, and the verification process is simplified.

Description

Technical Field

[0001] The present invention relates to the technical field of high-voltage electrical equipment detection, and in particular to a relay intelligent calibration system and method. Background Art

[0002] A relay is an electrical control device that automatically causes a controlled variable to undergo a predetermined step change or toggles the on / off state of a controlled circuit when an input (stimulus) reaches a specified value. Relays are typically composed of an electromagnet, springs, and electrical contacts. They are used in electrical devices such as protective devices, automatic control systems, and communications equipment. They are typically used to transmit signals and simultaneously control multiple circuits. They can also be used to directly control small-capacity motors or other electrical actuators.

[0003] The current SF6 density relay calibration has problems such as complex parameter configuration, significant temperature influence and lack of data management. Traditional calibration requires manual input of rated values ​​and contact parameters, which is error-prone and time-consuming. A 1°C change in ambient temperature results in a pressure measurement deviation of 0.3% to 0.5%, and the existing compensation technology is not accurate enough. Paper records make it difficult to trace historical data and cannot perform equipment status trend analysis.

[0004] To this end, we propose a relay intelligent calibration system and method. Summary of the Invention

[0005] The present invention mainly aims to solve the technical problems existing in the above-mentioned prior art and provides a relay intelligent calibration system and method.

[0006] In order to achieve the above-mentioned objectives, the present invention adopts the following technical solutions: a relay intelligent calibration system, comprising a built-in pressure and temperature module, an external remote density relay module, an MCU control module, a data storage module, a result analysis module and a human-computer interaction interface; the built-in pressure and temperature module comprises a MEMS pressure sensor and a platinum resistance thermometer, and is equipped with a self-calibration circuit and a temperature compensation algorithm; the external remote density relay module is configured with a power-specific protocol parsing chip and supports the DL / T860.92 communication protocol; the external remote density relay module automatically obtains the model code, node parameters and contact threshold information of the inspected device through the RS-485 interface; the MCU control module is equipped with a dual-core ARM Cortex-M7 processor for real-time execution of the temperature compensation algorithm; the data storage module adopts a FRAM non-volatile memory with a storage capacity of ≥500 sets of test data; the result analysis module includes an error analysis model based on fuzzy PID; and the human-computer interaction interface includes a display unit and a parameter setting unit.

[0007] Preferably, the temperature compensation algorithm is specifically as follows: P_{true} = P_m + α(T_m - T_{ref}) + β{dT}{dt} Where P_{true} represents the true pressure value, P_m represents the measured pressure value, α is the static compensation coefficient, β is the dynamic compensation coefficient, T_m represents the current temperature value, T_{ref} represents the reference temperature value, and dT / dt represents the temperature change rate. This algorithm corrects the measured pressure value by monitoring temperature changes in real time, thereby improving the accuracy of pressure measurement.

[0008] Preferably, the display unit is a capacitive touch screen, and the parameter setting unit is a mechanical button.

[0009] Preferably, the operating temperature of the built-in pressure and temperature module is -40°C to +85°C, the pressure detection range is 0-1.2MPa, and the temperature compensation accuracy is ±0.05%FS / °C.

[0010] A method for intelligent verification of a relay, comprising the above-mentioned intelligent verification system for a relay, specifically comprising the following steps: Step 1: Protocol parsing: Read the device description file of the density relay through the digital remote transmission interface, and parse the node parameters including the rated pressure value P0, alarm contact value P1, locking contact value P2 and temperature compensation coefficient K; Step 2: Environmental parameter synchronization: The built-in pressure and temperature module collects the ambient temperature T in real time, performs dynamic compensation using the formula P_corr=P_raw×(1+KΔT), and controls the micro air pump to increase the pressure in steps at a rate of 0.005 MPa / s. Step 3: Collaborative detection of contact status: Synchronously collect the on / off status of the mechanical contacts and the displacement information of the digital signal, and start the high-speed sampling mode when the pressure reaches P1-0.02MPa; Step 4: Intelligent diagnosis: Calculate the contact action deviation δ = |P_actual - P_setting| / P_rated × 100%. If δ > 2%, generate a calibration recommendation curve and automatically correlate historical data to compare device performance degradation trends.

[0011] Preferably, the protocol parsing process in the first step also includes the identification of the device model code to ensure the compatibility between the verification system and the device being tested. After the protocol parsing is completed, the system will automatically configure the corresponding verification parameters and processes based on the information in the device description file, thereby improving the efficiency and accuracy of the verification.

[0012] Preferably, the operating temperature range of the micro air pump in the second step is -20°C to +70°C, and it has overvoltage protection and overheating protection functions, ensuring stable operation under various environmental conditions. By precisely controlling the boost rate of the micro air pump, accurate simulation of the pressure value of the device under test can be achieved, providing a reliable basis for subsequent contact state detection. At the same time, the dynamic compensation algorithm in the environmental parameter synchronization process can correct the pressure value deviation caused by ambient temperature changes in real time, further improving the accuracy of the calibration.

[0013] Preferably, the specific implementation method of the high-speed sampling mode in the third step is that when the pressure reaches the preset threshold value P1-0.02MPa, the MCU control module will immediately start high-speed AD sampling, and the sampling frequency can reach 1000 times / second to achieve accurate capture of the contact action moment. At the same time, the system will also record the on-off status of the mechanical contact and the displacement information of the digital signal to provide data support for subsequent intelligent diagnosis.

[0014] Preferably, the three-level diagnostic model used in the fourth step is: Level 1 diagnosis: contact action value deviation analysis, real-time comparison of contact action value and set threshold; Secondary diagnosis: contact hysteresis error calculation, the calculation formula is: Hysteresis = |P_action-P_reset|; Level 3 diagnosis: Evaluate sealing performance based on the pressure-temperature coupling characteristics of the time series.

[0015] The present invention provides a relay intelligent calibration system and method, which has the following beneficial effects: 1. This intelligent relay calibration system and method integrates a built-in pressure and temperature module, an external remote density relay module, an MCU control module, a data storage module, a result analysis module, and a human-computer interaction interface to achieve comprehensive calibration of relay performance. The built-in pressure and temperature module not only contains a high-precision MEMS pressure sensor and a platinum resistance thermometer, but is also equipped with an advanced self-calibration circuit and temperature compensation algorithm, which can correct measurement errors in real time and improve measurement accuracy. The external remote density relay module supports a power-specific protocol parsing chip and the DL / T 860.92 communication protocol, achieving seamless connection with the device under test, automatically obtaining device information, and simplifying the calibration process.

[0016] 2. This relay intelligent verification system and method is equipped with an MCU control module. The MCU control module is equipped with a dual-core ARM Cortex-M7 processor. This high-performance processor not only ensures the smoothness and stability of the system operation, but also enables the system to execute complex temperature compensation algorithms and data analysis tasks in real time, further improving the efficiency and accuracy of the verification. At the same time, the MCU control module is also responsible for coordinating the work between various modules to ensure the smooth progress of the entire verification process.

[0017] 3. This relay intelligent calibration system and method, by setting up a data storage module, which uses FRAM non-volatile memory, ensures the safe storage and long-term preservation of test data. It can maintain data integrity even in the event of a power outage, facilitating subsequent data analysis and tracing. At the same time, its storage capacity is ≥500 sets of test data, meeting the storage needs of a large amount of test data, and providing rich data support for equipment performance analysis and trend prediction.

[0018] 4. This intelligent relay calibration system and method has a result analysis module that can deeply mine and analyze the collected data based on the fuzzy PID error analysis model, automatically determine the performance status of the relay, and give corresponding calibration suggestions, greatly improving the intelligence level of calibration and the accuracy of diagnosis.

[0019] 5. This intelligent relay verification system and method enables users to intuitively operate and view information by setting up a human-computer interaction interface. The human-computer interaction interface is concise and clear in design, providing rich functional options and clear parameter display. Users can easily set parameters and control operations through the capacitive touch screen. At the same time, the setting of mechanical buttons also provides users with another operation option, making the operation more flexible and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a system module diagram of the present invention; Figure 2 Flow chart of the method of the present invention. DETAILED DESCRIPTION

[0021] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely illustrative, and those skilled in the art can, without inventive effort, derive other implementation drawings based on the provided drawings.

[0022] The structures, proportions, sizes, etc. illustrated in this specification are intended only to complement the contents disclosed herein and to facilitate understanding and reading by persons familiar with the art. They are not intended to limit the conditions under which the present invention may be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportions, or adjustments in sizes, without affecting the efficacy and objectives of the present invention, shall still fall within the scope of the technical contents disclosed herein.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0024] In the description of the embodiments of the present invention, it should be noted that the terms "center," "upper," "lower," "inner," "outer," and "side" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and the like are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] In the description of the embodiments of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention according to specific circumstances.

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] Example 1: A relay intelligent calibration system, such as Figure 1As shown, it includes a built-in pressure and temperature module, an external remote density relay module, an MCU control module, a data storage module, a result analysis module and a human-computer interaction interface. The built-in pressure and temperature module includes a MEMS pressure sensor and a platinum resistance thermometer, and is equipped with a self-calibration circuit and a temperature compensation algorithm. The external remote density relay module is equipped with a power-specific protocol parsing chip and supports the DL / T 860.92 communication protocol. The external remote density relay module automatically obtains the model code, node parameters and contact threshold information of the tested equipment through the RS-485 interface. The MCU control module is equipped with a dual-core ARM Cortex-M7 processor for real-time execution of the temperature compensation algorithm. The data storage module uses FRAM non-volatile memory with a storage capacity of ≥500 sets of test data. The result analysis module includes an error analysis model based on fuzzy PID. The human-computer interaction interface includes a display unit and a parameter setting unit. By integrating the built-in pressure and temperature module, the external remote density relay module, the MCU control module, the data storage module, the result analysis module and the human-machine interface, a comprehensive verification of the relay performance is achieved. The built-in pressure and temperature module not only contains a high-precision MEMS pressure sensor and a platinum resistance thermometer, but is also equipped with an advanced self-calibration circuit and temperature compensation algorithm, which can correct measurement errors in real time and improve measurement accuracy. The external remote density relay module supports the power-specific protocol parsing chip and the DL / T 860.92 communication protocol, achieving seamless connection with the device under test, automatically obtaining device information and simplifying the verification process.

[0028] Example 2: Based on Example 1, Figure 1 As shown in Figure 2, the temperature compensation algorithm is specifically as follows: P_{true} = P_m + α(T_m - T_{ref}) + β{dT}{dt} Where P_{true} represents the true pressure value, P_m represents the measured pressure value, α is the static compensation coefficient, β is the dynamic compensation coefficient, T_m represents the current temperature value, T_{ref} represents the reference temperature value, and dT / dt represents the temperature change rate. This algorithm improves pressure measurement accuracy by monitoring temperature changes in real time and correcting the measured pressure value. The display unit is a capacitive touch screen, and the parameter setting unit is a mechanical keypad. The built-in pressure and temperature module operates from -40°C to +85°C, with a pressure detection range of 0-1.2 MPa and a temperature compensation accuracy of ±0.05%FS / °C. The MCU control module, equipped with a dual-core ARM Cortex-M7 processor, not only ensures smooth and stable system operation but also enables the system to execute complex temperature compensation algorithms and data analysis tasks in real time, further improving calibration efficiency and accuracy. The MCU also coordinates the work of various modules to ensure a smooth calibration process.

[0029] Example 3: Based on Example 1 and Example 2, Figure 2 As shown, a method for intelligent calibration of a relay includes the above-mentioned intelligent calibration system for a relay, which specifically includes the following steps: Step 1: Protocol parsing: Reading the device description file of the density relay through the digital remote transmission interface, parsing the node parameters including the rated pressure value P0, the alarm contact value P1, the locking contact value P2 and the temperature compensation coefficient K; Step 2: Environmental parameter synchronization: The built-in pressure and temperature module collects the ambient temperature T in real time, and performs dynamic compensation through the formula P_corr=P_raw×(1+KΔT), controlling the micro air pump to increase the pressure in steps at a rate of 0.005MPa / s; Step 3: Contact state coordinated detection: Synchronously collect the on-off state of the mechanical contact and the displacement information of the digital signal, and start the high-speed sampling mode when the pressure reaches P1-0.02MPa; Step 4: Intelligent diagnosis: Calculating the contact action deviation δ=|P_actual-P_setting| / P_rated×100%. If δ>2%, a calibration recommendation curve is generated, and historical data is automatically associated with the performance degradation trend of the equipment. By setting up a data storage module, which uses FRAM non-volatile memory, the safe storage and long-term preservation of test data are ensured. Even in the event of a power outage, the integrity of the data can be maintained, which facilitates subsequent data analysis and traceability. At the same time, its storage capacity is ≥500 sets of test data, which meets the storage needs of a large amount of test data and provides rich data support for equipment performance analysis and trend prediction.

[0030] Example 4: Based on Example 1, Example 2 and Example 3, Figure 2As shown, the protocol parsing process in the first step also includes identification of the device model code to ensure compatibility between the calibration system and the device under test. After protocol parsing is complete, the system automatically configures the corresponding calibration parameters and procedures based on the information in the device description file, thereby improving calibration efficiency and accuracy. In the second step, the micro air pump operates within a temperature range of -20°C to +70°C and features overvoltage and overheat protection, ensuring stable operation under various environmental conditions. By precisely controlling the micro air pump's pressurization rate, accurate simulation of the pressure value of the device under test can be achieved, providing a reliable foundation for subsequent contact state detection. Furthermore, the dynamic compensation algorithm during the environmental parameter synchronization process can real-time correct pressure deviations caused by ambient temperature changes, further improving calibration accuracy. A result analysis module, based on a fuzzy PID error analysis model, deeply mines and analyzes the collected data, automatically determines the performance status of the relay, and provides corresponding calibration recommendations, significantly improving the intelligence level of calibration and diagnostic accuracy.

[0031] Example 5: Based on Example 1, Example 2, Example 3 and Example 4, Figure 2 As shown, the specific implementation of the high-speed sampling mode in the third step is that when the pressure reaches the preset threshold P1-0.02MPa, the MCU control module immediately initiates high-speed AD sampling at a frequency of up to 1000 times / second to accurately capture the moment of contact action. The system also records the on / off status of the mechanical contacts and the displacement information of the digital signal, providing data support for subsequent intelligent diagnosis. The fourth step uses a three-level diagnostic model: Level 1 diagnosis: contact action value deviation analysis, real-time comparison of the contact action value with the set threshold; Level 2 diagnosis: contact hysteresis error calculation, calculated using the formula: Hysteresis = |P_action - P_reset|; Level 3 diagnosis: sealing performance assessment based on the time series pressure-temperature coupling characteristics. The user interface is designed to enable intuitive operation and information viewing. The interface is simple and clear, providing a rich set of functional options and clear parameter display. Users can easily set parameters and operate the control via the capacitive touch screen. The mechanical button also provides an alternative operation option, making operation more flexible and convenient.

[0032] Working principle of the present invention: The system and method use a built-in pressure and temperature module to collect environmental parameters in real time, and use a temperature compensation algorithm to accurately correct the measured pressure value, ensuring measurement accuracy under different temperature conditions. The external remote density relay module uses advanced communication protocols and interface technologies to achieve seamless connection with the device under test, automatically obtain key information about the device, and provide data support for subsequent verification processes. The MCU control module, as the core of the system, is equipped with a high-performance dual-core processor that can process large amounts of data in real time and quickly execute temperature compensation algorithms, ensuring the real-time and accuracy of verification. The data storage module uses non-volatile memory to ensure the long-term preservation and reliability of test data. The result analysis module uses a fuzzy PID-based error analysis model to conduct in-depth analysis and evaluation of test results, providing a strong basis for performance optimization and maintenance of the equipment. The human-computer interaction interface is simple and intuitive, making it convenient for users to operate and set parameters, thereby improving verification efficiency and user experience.

[0033] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A relay intelligent calibration system, characterized in that: It includes a built-in pressure and temperature module, an external remote density relay module, an MCU control module, a data storage module, a result analysis module and a human-computer interaction interface. The built-in pressure and temperature module includes a MEMS pressure sensor and a platinum resistance thermometer, and is equipped with a self-calibration circuit and a temperature compensation algorithm. The external remote density relay module is equipped with a power-specific protocol parsing chip. The external remote density relay module automatically obtains the model code, node parameters and contact threshold information of the tested equipment through the RS-485 interface. The MCU control module is equipped with a dual-core ARM Cortex-M7 processor. The data storage module uses FRAM non-volatile memory with a storage capacity of ≥500 sets of test data. The result analysis module includes an error analysis model based on fuzzy PID. The human-computer interaction interface includes a display unit and a parameter setting unit.

2. The relay intelligent calibration system according to claim 1, characterized in that: The temperature compensation algorithm is specifically as follows: P_{true} = P_m + α(T_m - T_{ref}) + β{dT}{dt} Where P_{true} represents the true pressure value, P_m represents the measured pressure value, α is the static compensation coefficient, β is the dynamic compensation coefficient, T_m represents the current temperature value, T_{ref} represents the reference temperature value, and dT / dt represents the temperature change rate. This algorithm corrects the measured pressure value by monitoring temperature changes in real time, thereby improving the accuracy of pressure measurement.

3. The relay intelligent calibration system according to claim 1, characterized in that: The display unit is specifically a capacitive touch screen, and the parameter setting unit is specifically a mechanical button.

4. The relay intelligent calibration system according to claim 1, characterized in that: The operating temperature of the built-in pressure and temperature module is -40°C to +85°C, the pressure detection range is 0-1.2MPa, and the temperature compensation accuracy is ±0.05%FS / °C.

5. A method for intelligent verification of a relay, characterized in that: The relay intelligent verification system according to any one of claims 1 to 4 specifically comprises the following steps: Step 1: Protocol parsing: Read the device description file of the density relay through the digital remote transmission interface, and parse the node parameters including the rated pressure value P0, alarm contact value P1, locking contact value P2 and temperature compensation coefficient K; Step 2: Environmental parameter synchronization: The built-in pressure and temperature module collects the ambient temperature T in real time, performs dynamic compensation using the formula P_corr=P_raw×(1+KΔT), and controls the micro air pump to increase the pressure in steps at a rate of 0.005 MPa / s. Step 3: Collaborative detection of contact status: Synchronously collect the on / off status of the mechanical contacts and the displacement information of the digital signal, and start the high-speed sampling mode when the pressure reaches P1-0.02MPa; Step 4: Intelligent Diagnosis: Use the three-level diagnostic model to calculate the contact action deviation δ = |P_actual - P_setting| / P_rated × 100%. If δ > 2%, a calibration recommendation curve is generated and historical data is automatically correlated to compare the performance degradation trend of the device.

6. The method for intelligent relay verification according to claim 5, characterized in that: The protocol parsing in the first step also includes the identification of the device model code. After the protocol parsing is completed, the system will automatically configure the corresponding verification parameters and processes based on the information in the device description file.

7. The method for intelligent relay verification according to claim 5, characterized in that: The operating temperature range of the micro air pump in the second step is -20°C to +70°C, and it has overvoltage protection and overheating protection functions.

8. The method for intelligent relay verification according to claim 5, characterized in that: The specific implementation method of the high-speed sampling mode in the third step is: when the pressure reaches the preset threshold P1-0.02MPa, the MCU control module will immediately start high-speed AD sampling with a sampling frequency of up to 1000 times / second to accurately capture the instant of contact action. At the same time, the system will also record the on-off status of the mechanical contact and the displacement information of the digital signal to provide data support for subsequent intelligent diagnosis.

9. The method for intelligent relay verification according to claim 5, characterized in that: The three-level diagnostic model used in the fourth step is specifically: Level 1 diagnosis: contact action value deviation analysis, real-time comparison of contact action value and set threshold; Secondary diagnosis: contact hysteresis error calculation, the calculation formula is: Hysteresis = |P_action-P_reset|; Level 3 diagnosis: Evaluate sealing performance based on the pressure-temperature coupling characteristics of the time series.

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