Optical module

Abstract

The optical module provided by the invention comprises a first circuit board, a second circuit board, a fixed plate, a light emitting component and a light receiving component. The first circuit board is used for transmitting high-frequency signals and non-high-frequency signals. The second circuit board is used for transmitting non-high-frequency signals. And the first circuit board is electrically connected with the second circuit board, so that the non-high-frequency signal can be transmitted to the second circuit board along the first circuit board, and signal transmission by boards is realized. The dielectric constant of the first circuit board is lower than that of the second circuit board so as to support high-frequency signal transmission. One end of the surface of the fixing plate is provided with a first circuit board, and the other end is provided with a second circuit board so as to fixedly connect the first circuit board and the second circuit board and enhance the fixation between the first circuit board and the second circuit board. A first avoiding notch is formed in the surface of the second circuit board so as to avoid the light emitting component. The light modulation chip is electrically connected with the first circuit board and the second circuit board, and the light receiving chip is located on the surface of the first circuit board, so that signal transmission is guaranteed.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase. Summary of the Invention

[0003] Some embodiments provide an optical module that uses a first circuit board to transmit high-frequency signals and non-high-frequency signals, and uses a second circuit board to transmit non-high-frequency signals, thereby realizing split-board signal transmission.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] A first circuit board has a gold finger provided on one end surface thereof, and the first circuit board is configured to transmit high-frequency signals and non-high-frequency signals;

[0006] a second circuit board configured to transmit non-high-frequency signals, wherein the dielectric constant of the first circuit board is lower than that of the second circuit board; the second circuit board is electrically connected to the first circuit board so that the non-high-frequency signal output by the gold finger is transmitted along the first circuit board to the second circuit board; and a first avoidance notch is formed on a side surface of the second circuit board;

[0007] A fixed plate, having the first circuit board disposed on one end of its surface and the second circuit board disposed on the other end thereof, so as to fixedly connect the first circuit board and the second circuit board;

[0008] A light emitting component is provided on the surface of the fixing plate and is located in the first avoidance gap, and the light emitting component includes:

[0009] a laser configured to emit light that does not carry a signal and electrically connected to the second circuit board;

[0010] an optical modulation chip, located in the optical path of the laser output, configured to modulate the light not carrying a signal to generate an optical signal; the optical modulation chip is electrically connected to the first circuit board;

[0011] an optical fiber array, optically connected to the optical output port of the optical modulation chip to transmit the optical signal modulated by the optical modulation chip;

[0012] Light receiving component, including:

[0013] A light receiving chip is located on the surface of the first circuit board;

[0014] The refracting element has a reflective end surface formed at one end, and the reflective end surface is located above the light receiving chip so that the reflected light signal is incident on the light receiving chip.

[0015] The above technical solution has the following advantages or beneficial effects: The optical module includes a first circuit board, a second circuit board, a fixing plate, a light emitting component, and a light receiving component. A gold finger is formed on one end surface of the first circuit board. High-frequency and non-high-frequency signals output by the gold finger are transmitted along the surface of the first circuit board. The second circuit board is used to transmit non-high-frequency signals. The first and second circuit boards are electrically connected so that the non-high-frequency signals output by the gold finger are transmitted via the first circuit board to the second circuit board. High-frequency signals are transmitted along the first circuit board, while non-high-frequency signals are transmitted along the first circuit board or from the first circuit board to the second circuit board, thus achieving split-board signal transmission. The first and second circuit boards are made of different materials, with the dielectric constant of the first circuit board being lower than that of the second circuit board to support high-frequency signal transmission. Low-dielectric-constant materials are relatively expensive, so using circuit boards with different dielectric constants can reduce costs. Furthermore, the design of the first circuit board requires strict control over the interlayer structure, layout, and routing to provide better signal shielding and anti-interference capabilities to support high-frequency signal transmission. The design of the second circuit board is relatively simple. The first and second circuit boards are electrically connected via bonding wires, and the fixed connection is relatively weak. A first circuit board is mounted on one end of the fixed plate surface, and a second circuit board is mounted on the other end, securing the first and second circuit boards. This secures the connection and strengthens the fixation between them. A light-emitting component is mounted on the fixed plate surface, providing a stable optical platform for the light-emitting component while also allowing heat generated by the component to be conducted through the fixed plate. A first clearance notch is formed on the surface of the second circuit board to clear the light-emitting component mounted on the fixed plate surface. The light-emitting component is located within the first clearance notch and includes a laser, an optical modulation chip, and an optical fiber array. The laser is electrically connected to the second circuit board, which inputs a low-frequency current signal to the laser, driving it to output non-signal light. The optical modulation chip is configured to modulate the light emitted by the laser to generate an optical signal. The surface of the optical modulation chip is electrically connected to the first circuit board, which provides a high-frequency signal to the optical modulation chip. This high-frequency signal drives the optical modulation chip to modulate the optical signal. The light-receiving component includes a deflecting element and an optical receiving chip. The optical receiving chip is located on the surface of the first circuit board. A reflective end surface is formed at one end of the deflecting element, located above the optical receiver chip. This reflective end surface reflects the optical signal, changing its transmission direction so that the reflected optical signal's transmission direction aligns with the optical reception direction of the optical receiver chip, allowing the optical signal to enter the optical receiver chip. The optical receiver chip is located on the surface of the first circuit board, thereby improving the optical receiver chip's high-frequency signal transmission performance.

[0016] In some embodiments, one of the two adjacent surfaces of the optical modulation chip is electrically connected to the first circuit board so as to input a high-frequency signal to the optical modulation chip through the first circuit board; and the other surface is electrically connected to the second circuit board so as to input a non-high-frequency signal to the optical modulation chip through the first circuit board.

[0017] The surface of the light modulation chip is flush with the surface of the first circuit board, and the surface of the light modulation chip is flush with the surface of the second circuit board.

[0018] The above technical solution has the following advantages or beneficial effects: Of the two adjacent surfaces of the optical modulator chip, one surface is electrically connected to the first circuit board to input high-frequency signals to the optical modulator chip through the first circuit board. The other surface is electrically connected to the second circuit board to input non-high-frequency signals to the optical modulator chip through the first circuit board. The surface of the optical modulator chip is flush with the surface of the first circuit board, shortening the bonding wires between the optical modulator chip and the first circuit board and improving signal transmission performance. Similarly, the surface of the optical modulator chip is flush with the surface of the second circuit board, shortening the bonding wires between the optical modulator chip and the second circuit board and improving signal transmission performance.

[0019] In some embodiments, the light-bending member includes a first optical fiber supporting portion and a second optical fiber supporting portion;

[0020] The second optical fiber support portion is disposed on the surface of the second circuit board. A third solder pad area is formed on the end surface of the second circuit board for bonding with the surface of the first circuit board. The end of the second optical fiber support portion does not extend to the surface of the third solder pad area to avoid bonding between the second circuit board and the first circuit board.

[0021] The first optical fiber supporting portion is located above the second optical fiber supporting portion. The first optical fiber supporting portion extends from the second circuit board surface to the first circuit board surface, so as to arrange the reflective end face above the light receiving chip.

[0022] The above technical solution has the following advantages or beneficial effects: the refractive element includes a first optical fiber support portion and a second optical fiber support portion. The second optical fiber support portion is arranged on the surface of the second circuit board. A third solder pad area is formed on the surface of the second circuit board to connect with the first circuit board by wiring. The end face of the second optical fiber support portion does not extend to the third solder pad area to avoid the wiring between the second circuit board and the first circuit board, thereby providing wiring space for the second circuit board and the first circuit board. The second optical fiber support portion is located above the first optical fiber support portion, and the first optical fiber support portion is along the surface of the second circuit board, crosses the wiring between the second circuit board and the first circuit board, and extends to the surface of the first circuit board to set the reflective end face on the light receiving chip, so that the reflected light signal is incident on the light receiving chip.

[0023] In some embodiments, the optical module includes:

[0024] upper shell;

[0025] A lower housing, forming a wrapping cavity with the upper housing cover to accommodate the first circuit board and the second circuit board;

[0026] Wherein, a convex portion is formed on the surface of the lower shell, and the convex portion protrudes toward the upper shell;

[0027] The protrusion is located in the first avoidance gap and on one side of the laser;

[0028] The bottom surface of the fixing plate is thermally connected to the lower shell, and the top surface of the raised portion is thermally connected to the upper shell, so that the heat generated by the laser is sequentially conducted through the fixing plate and the lower shell to the upper shell.

[0029] The above technical solution has the following advantages or beneficial effects: the surface of the lower shell is raised upward to form a bulge, and the bulge is raised toward the upper shell. The bulge is located on one side of the laser and is located in the first avoidance gap. The first avoidance gap avoids the bulge while avoiding the light emitting component. The fixing plate is thermally connected to the lower shell, and the bulge is thermally connected to the upper shell. The heat generated by the laser is conducted downward to the fixing plate, and the fixing plate then conducts the heat downward to the lower shell. Then, the bulge on the surface of the lower shell transfers the heat upward to the upper shell. A heat dissipation duct can be formed between the upper shell and the cage of the host computer, which has better heat dissipation efficiency, thereby improving the heat dissipation efficiency of the laser.

[0030] In some embodiments, the optical modulation chip includes:

[0031] A first optical input port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the first optical input port is optically connected to the laser;

[0032] A second optical input port is located at the light input end of the optical modulation chip; when the output optical power of the laser is higher than a preset value, the second optical input port is optically connected to the laser;

[0033] a third optical input port, located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the third optical input port is optically connected to the laser;

[0034] A first optical splitter comprising a light input port, a first light output port and a second light output port, wherein the light input port is optically connected to the second light input port;

[0035] a second optical splitter comprising two light input ports and two light output ports, wherein one light input port is optically connected to the third light input port, and the other light input port is optically connected to the first light output port of the first optical splitter;

[0036] The third optical splitter includes two light input ports and two light output ports, wherein one light input port is optically connected to the first input light port, and the other light input port is optically connected to the second light output port of the first optical splitter.

[0037] The above technical solution has the following advantages or beneficial effects: the optical modulation chip includes a first input optical port, a second input optical port, and a third input optical port, and is compatible with lasers with different output optical powers. When the output optical power of the laser is higher than the preset value, it can support the output of 4 optical signals, and the laser outputs light toward the second input optical port. In some embodiments, when the output optical power of the laser is not higher than the preset value, two lasers are respectively set, one of which outputs light toward the first input optical port, and the other laser outputs light toward the third input optical port. The optical modulation chip includes a first optical splitter, a second optical splitter and a third optical splitter. The first optical splitter includes an optical input port, a first optical output port and a second optical output port. The optical input port is optically connected to the second input optical port, and the light is coupled into the first optical splitter along the second input optical port, and is divided into a first light beam and a second light beam by the first optical splitter. The second optical splitter includes two light input ports and two light output ports, one of which is optically connected to the third input light port, and the other is optically connected to the first light output port of the first optical splitter. The second optical splitter can split the light entering along the third input light port, and can also split the light entering along the first light output port of the first optical splitter. The third optical splitter includes two light input ports and two light output ports, one of which is optically connected to the first input light port, and the other is optically connected to the second light output port of the first optical splitter. The third optical splitter can split the light entering along the first input light port, and can also split the light entering along the second light output port of the first optical splitter. In this way, when the laser output optical power is higher than the preset value, the laser emits light toward the second input light port, and the laser output light is coupled to the optical modulation chip. In the optical modulation chip, the laser output light is divided into a first light beam and a second light beam by the first optical splitter. The first optical output port of the first optical splitter is optically connected to an optical input port of the second optical splitter. The first light beam is coupled along the first optical output port of the first optical splitter into the second optical splitter. The second optical splitter splits the first light beam into a first beam and a second beam, which are outputted through the two optical output ports, respectively. The second optical output port of the first optical splitter is optically connected to an optical input port of the third optical splitter. The second light beam is coupled along the second optical output port of the first optical splitter into the third optical splitter. The third optical splitter splits the second light beam into a third beam and a fourth beam, which are outputted through the two optical output ports, respectively. Thus, the light emitted by the laser is split twice into four paths. When the laser output optical power does not exceed a preset value, two lasers are set up, one of which outputs light toward the first optical input port, and the other toward the third optical input port. The light output by one laser is input into the optical modulation chip through the first optical input port, and the light output by the other laser is input into the optical modulation chip through the third optical input port. The third input optical port is optically connected to an optical input port of the second optical splitter, so that light output by a laser is coupled into the second optical splitter, which splits the light output by the laser into a first light split and a second light split.The first input port is optically connected to one of the input ports of the third optical splitter, and the light output from the other laser is coupled into the third optical splitter. The third optical splitter splits the light output from the laser into the third and fourth optical splits. Thus, the light emitted by the laser is split twice into four paths.

[0038] In some embodiments, the gold finger is formed on one end surface of the first circuit board, and a first solder pad area and a second solder pad area are formed on the other end surface; wherein the second solder pad area is electrically connected to the optical modulation chip, thereby electrically connecting the first circuit board and the optical modulation chip;

[0039] A third pad area is formed on the end surface of the second circuit board facing the first circuit board, and the third pad area is connected to the first pad area by wire bonding to electrically connect the second circuit board and the first circuit board;

[0040] A fourth pad area is formed on the surface of the second circuit board, and the fourth pad area is electrically connected to the laser, so as to electrically connect the second circuit board and the laser;

[0041] A fifth pad area is formed on the surface of the second circuit board. The fifth pad area is electrically connected to the optical modulation chip to electrically connect the second circuit board and the optical modulation chip.

[0042] The above technical solution has the following advantages or beneficial effects: A first solder pad area and a second solder pad area are formed on the end surface of the first circuit board facing the second circuit board. The first solder pad area is electrically connected to the second circuit board, thereby establishing an electrical connection between the first and second circuit boards, allowing non-high-frequency signals to be transmitted from the surface of the first circuit board to the surface of the second circuit board. The second solder pad area is electrically connected to the optical modulation chip, thereby transmitting high-frequency signals into the optical modulation chip through the first circuit board. A third solder pad area is formed on the end surface of the second circuit board facing the first circuit board, thereby establishing an electrical connection with the first solder pad area, thereby establishing an electrical connection between the second circuit board and the first circuit board. A fourth solder pad area is formed on the surface of the second circuit board, thereby establishing an electrical connection with the laser, thereby providing a current signal to the laser. A fifth solder pad area is formed on the surface of the second circuit board, thereby establishing an electrical connection with the optical modulation chip, thereby establishing an electrical connection between the second circuit board and the optical modulation chip, thereby inputting non-high-frequency signals into the optical modulation chip through the second circuit board.

[0043] In some embodiments, one end of the fixing plate extends below the first circuit board, and the other end extends below the second circuit board, or does not extend below the second circuit board.

[0044] The above technical solution has the following advantages or beneficial effects: one end of the fixing plate extends below the first circuit board to support the first circuit board. The other end extends below the second circuit board to support the second circuit board. Alternatively, if the other end does not extend below the second circuit board, the raised portion can be avoided, which facilitates heat dissipation for the laser.

[0045] In some embodiments, an optical module is provided, comprising:

[0046] A first circuit board has a gold finger provided on one end surface thereof, and the first circuit board is configured to transmit high-frequency signals and non-high-frequency signals;

[0047] a second circuit board configured to transmit non-high-frequency signals, wherein the dielectric constant of the first circuit board is lower than that of the second circuit board; the second circuit board is electrically connected to the first circuit board so that the non-high-frequency signal output by the gold finger is transmitted along the first circuit board to the second circuit board; a third avoidance gap is formed on a surface of the second circuit board, and a first arm surface and a second arm surface are formed on both sides of the third avoidance gap;

[0048] A fixed plate, having the first circuit board disposed on one end of its surface and the second circuit board disposed on the other end thereof, so as to fixedly connect the first circuit board and the second circuit board;

[0049] A light emitting component is provided on the surface of the fixing plate and is located in the third avoidance gap, and the light emitting component includes:

[0050] a laser configured to emit light that does not carry a signal and electrically connected to the second circuit board;

[0051] an optical modulation chip, located in the optical path of the laser output, and configured to modulate the light not carrying a signal to generate an optical signal; a surface of the optical modulation chip is electrically connected to the first circuit board, and a surface of the optical modulation chip is electrically connected to the first support arm surface and the second support arm surface respectively;

[0052] an optical fiber array, optically connected to the optical output port of the optical modulation chip to transmit the optical signal modulated by the optical modulation chip;

[0053] Light receiving component, including:

[0054] A light receiving chip is located on the surface of the first circuit board;

[0055] The refracting element has a reflective end surface formed at one end, and the reflective end surface is located above the light receiving chip so that the reflected light signal is incident on the light receiving chip.

[0056] The above technical solution has the following advantages or beneficial effects: The optical module includes a first circuit board, a second circuit board, a fixing plate, a light emitting component, and a light receiving component. A gold finger is formed on one end surface of the first circuit board. High-frequency signals and non-high-frequency signals output by the gold finger are transmitted along the surface of the first circuit board. The second circuit board is used to transmit non-high-frequency signals. The first and second circuit boards are electrically connected so that the non-high-frequency signals output by the gold finger are transmitted via the first circuit board to the second circuit board. High-frequency signals are transmitted along the first circuit board, while non-high-frequency signals are transmitted along the first circuit board or from the first circuit board to the second circuit board. The dielectric constant of the first circuit board is lower than that of the second circuit board to support high-frequency signal transmission. Low-dielectric-constant materials are relatively expensive, so using circuit boards with different dielectric constants can reduce costs. Furthermore, the design of the first circuit board requires strict control of the interlayer structure, layout, and routing to provide better signal shielding and anti-interference capabilities to support high-frequency signal transmission. The design of the second circuit board is relatively simple. The first and second circuit boards are electrically connected via bonding wires, and the fixed connection is relatively weak. A first circuit board is mounted on one end of the fixed plate surface, and a second circuit board is mounted on the other end, securing the first and second circuit boards. This secures the connection and strengthens the fixation between them. A light-emitting component is mounted on the fixed plate surface, providing a stable optical platform for the light-emitting component while also allowing heat generated by the component to be conducted through the fixed plate. A third clearance notch is formed on the second circuit board surface to provide clearance for the light-emitting component mounted on the fixed plate surface. First and second support arm surfaces are formed on either side of the third clearance notch. The light-emitting component, located within the third clearance notch, includes a laser, an optical modulation chip, and an optical fiber array. The laser is electrically connected to the second circuit board, allowing a low-frequency current signal to be input to the laser via the second circuit board, driving the laser to output light without carrying a signal. The optical modulation chip is configured to modulate the light emitted by the laser to generate an optical signal. The surface of the optical modulation chip is electrically connected to the first circuit board, allowing a high-frequency signal to be input to the optical modulation chip via the first circuit board. This high-frequency signal drives the optical modulation chip to modulate the optical signal. The surface of the optical modulator chip is also electrically connected to the first arm surface and the second arm surface, respectively, to increase the wiring area between the optical modulator chip and the second circuit board, meet the optical modulator chip's requirement for the number of wiring, and thus meet the optical modulator chip's signal transmission requirements. The optical receiving component includes a refracting member and an optical receiving chip. The optical receiving chip is located on the surface of the first circuit board. A reflective end face is formed at one end of the refracting member, and the reflective end face is located above the optical receiving chip. The reflective end face reflects the optical signal, changes the transmission direction of the optical signal, and makes the transmission direction of the reflected optical signal consistent with the light receiving direction of the optical receiving chip, thereby allowing the optical signal to be incident on the optical receiving chip. The optical receiving chip is located on the surface of the first circuit board, thereby improving the high-frequency signal transmission performance of the optical receiving chip.

[0057] In some embodiments, the first side surface of the optical modulation chip is electrically connected to the first circuit board so as to input a high-frequency signal into the optical modulation chip through the first circuit board;

[0058] Of the two side surfaces adjacent to the first side surface, one side surface is electrically connected to the surface of the first arm surface, and the other side surface is electrically connected to the surface of the second arm surface, so as to input a non-high-frequency signal into the optical modulation chip through the second circuit board;

[0059] The surface of the optical modulation chip is flush with the surface of the first circuit board, and the surface of the optical modulation chip is flush with the surface of the first support arm and the surface of the second support arm respectively.

[0060] The above technical solution has the following advantages or beneficial effects: The first side surface of the optical modulator chip is electrically connected to the first circuit board, so that high-frequency signals can be input into the optical modulator chip through the first circuit board. Of the two side surfaces adjacent to the first side surface, one surface is electrically connected to the surface of the first arm surface, and the other surface is electrically connected to the surface of the second arm surface, thereby increasing the bonding area between the optical modulator chip and the second circuit board, meeting the optical modulator chip's requirement for the number of bonding wires, and thus meeting the optical modulator chip's signal transmission requirements, so that non-high-frequency signals can be input into the optical modulator chip through the second circuit board. The surface of the optical modulator chip is flush with the surface of the first circuit board, shortening the bonding length between the optical modulator chip and the first circuit board surface, thereby improving the high-frequency signal transmission performance between the two. The surface of the optical modulator chip is flush with the surfaces of the first arm surface and the second arm surface, respectively, thereby shortening the bonding length between the optical modulator chip and the first arm surface and the second arm surface, respectively, thereby improving signal transmission performance.

[0061] In some embodiments, the light-bending member includes a first optical fiber supporting portion and a second optical fiber supporting portion;

[0062] The second optical fiber support portion is disposed on the surface of the second circuit board. A third solder pad area is formed on the end surface of the second circuit board for bonding with the surface of the first circuit board. The end of the second optical fiber support portion does not extend to the surface of the third solder pad area to avoid bonding between the second circuit board and the first circuit board.

[0063] The first optical fiber supporting portion is located above the second optical fiber supporting portion. The first optical fiber supporting portion extends from the second circuit board surface to the first circuit board surface, so as to arrange the reflective end face above the light receiving chip.

[0064] The above technical solution has the following advantages or beneficial effects: the refractive element includes a first optical fiber support portion and a second optical fiber support portion. The second optical fiber support portion is arranged on the surface of the second circuit board. A third solder pad area is formed on the surface of the second circuit board to connect with the first circuit board by wiring. The end face of the second optical fiber support portion does not extend to the third solder pad area to avoid the wiring between the second circuit board and the first circuit board, thereby providing wiring space for the second circuit board and the first circuit board. The second optical fiber support portion is located above the first optical fiber support portion, and the first optical fiber support portion is along the surface of the second circuit board, crosses the wiring between the second circuit board and the first circuit board, and extends to the surface of the first circuit board to set the reflective end face on the light receiving chip, so that the reflected light signal is incident on the light receiving chip.

[0065] In some embodiments, the optical module includes:

[0066] upper shell;

[0067] A lower housing, forming a wrapping cavity with the upper housing cover to accommodate the first circuit board and the second circuit board;

[0068] Wherein, a convex portion is formed on the surface of the lower shell, and the convex portion protrudes toward the upper shell;

[0069] The protrusion is located in the third avoidance gap and on one side of the laser;

[0070] The bottom surface of the fixing plate is thermally connected to the lower shell, and the top surface of the raised portion is thermally connected to the upper shell, so that the heat generated by the laser is sequentially conducted through the fixing plate and the lower shell to the upper shell.

[0071] The above technical solution has the following advantages or beneficial effects: the surface of the lower shell body is raised upward to form a bulge, and the bulge is raised toward the upper shell body. The bulge is located on one side of the laser and is located in the third avoidance gap. The third avoidance gap avoids the bulge while avoiding the light emitting component. The fixing plate is thermally connected to the lower shell body, and the bulge is thermally connected to the upper shell body. The heat generated by the laser is conducted downward to the fixing plate, and the fixing plate then conducts the heat downward to the lower shell body. Then, the bulge on the surface of the lower shell body transfers the heat upward to the upper shell body. A heat dissipation duct can be formed between the upper shell body and the cage of the upper computer, which has better heat dissipation efficiency, thereby improving the heat dissipation efficiency of the laser.

[0072] In some embodiments, a first pad area is formed on the surface of the first circuit board, and the first pad area is connected to the surface of the optical modulation chip by wire bonding, so as to input a high-frequency signal to the optical modulation chip through the first circuit board;

[0073] A second pad area is formed on the surface of the first circuit board, and a third pad area is formed on the surface of the first arm. The third pad area is connected to the second pad area by wire bonding to electrically connect the first circuit board and the second circuit board.

[0074] A fourth pad area is formed on the surface of the first circuit board, and a fifth pad area is formed on the surface of the second arm. The fifth pad area is connected to the fourth pad area by wire bonding to electrically connect the first circuit board and the second circuit board.

[0075] A sixth pad area is formed on the surface of the first arm surface, and the surface of the optical modulation chip is connected to the sixth pad area by wire bonding to input a non-high frequency signal into the optical modulation chip;

[0076] A seventh pad area is formed on the surface of the second arm surface, and the surface of the optical modulation chip is connected to the seventh pad area by wire bonding to input a non-high frequency signal into the optical modulation chip;

[0077] An eighth pad area is formed on the surface of the second arm surface, and the laser is connected to the surface of the eighth pad area by wire bonding to input a non-high frequency signal into the laser.

[0078] The above technical solution has the following advantages or beneficial effects: A first pad area is formed on the surface of the first circuit board. The first pad area is wire-bonded to the surface of the optical modulator chip to input a high-frequency signal to the optical modulator chip via the first circuit board, thereby driving the optical modulator chip to modulate the optical signal. A second pad area is formed on the surface of the first circuit board. A third pad area is formed on the surface of the first arm. The third pad area is wire-bonded to the second pad area to electrically connect the first and second circuit boards, thereby allowing non-high-frequency signals to be transmitted from the first circuit board surface to the second circuit board surface. A fourth pad area is formed on the surface of the first circuit board. A fifth pad area is formed on the surface of the second arm. The fifth pad area is wire-bonded to the fourth pad area to electrically connect the first and second circuit boards, thereby allowing non-high-frequency signals to be transmitted from the first circuit board surface to the second circuit board surface. A sixth pad area is formed on the surface of the first arm. The surface of the optical modulator chip is wire-bonded to the sixth pad area to input non-high-frequency signals into the optical modulator chip. The second arm surface has a seventh pad area, which is wire-bonded to the optical modulator chip to input non-high-frequency signals into the chip. An eighth pad area is also formed on the second arm surface, which is wire-bonded to the laser to input a low-frequency current signal into the laser, causing the laser area to emit light without carrying a signal.

[0079] In some embodiments, the surface of the first arm is electrically connected to the surface of the first circuit board, and the surface of the second arm is electrically connected to the surface of the first circuit board;

[0080] The size of the second arm surface is larger than that of the first arm surface, and the second optical fiber supporting portion of the refracting element is located on the surface of the second arm surface.

[0081] The above technical solution has the following advantages or beneficial effects: the first support arm surface is electrically connected to the first circuit board surface, so that non-high-frequency signals are transmitted along the first circuit board surface to the first support arm surface. The second support arm surface is electrically connected to the first circuit board surface, so that non-high-frequency signals are transmitted along the first circuit board surface to the second support arm surface. The second support arm surface is larger than the first support arm surface, so that the second optical fiber support portion of the deflecting element is located on the second support arm surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0082] To more clearly illustrate the technical solutions of the present disclosure, the following briefly describes the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are merely illustrations of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0083] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0084] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0085] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0086] Figure 4 is an exploded view of an optical module according to some embodiments;

[0087] Figure 5a is a diagram of the internal structure of an optical module according to some embodiments;

[0088] Figure 5b is a partially exploded view of the interior of an optical module according to some embodiments;

[0089] Figure 6a is a schematic diagram of an optical path of a light emitting component according to some embodiments;

[0090] Figure 6b is a structural diagram of a refraction element according to some embodiments;

[0091] Figure 6c is an exploded view of a refraction element according to some embodiments;

[0092] Figure 7 is a cross-sectional view of the internal structure of an optical module according to some embodiments;

[0093] Figure 8 is an exploded view of the internal structure of an optical module according to some embodiments;

[0094] Figure 9a is a partial cross-sectional structural diagram of an optical module according to some embodiments;

[0095] Figure 9b is an assembly diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0096] Figure 9c An exploded view of the assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0097] Figure 9d is a cross-sectional view of an assembly of an upper housing, a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0098] Figure 10 is an assembly diagram of a first circuit board and a second circuit board according to some embodiments;

[0099] Figure 11 is an exploded view of an assembly of a first circuit board and a second circuit board according to some embodiments;

[0100] Figure 12 A partial diagram of an assembly of a first circuit board and a second circuit board according to some embodiments;

[0101] Figure 13a is a structural diagram of a first circuit board according to some embodiments;

[0102] Figure 13b is a structural diagram of a second circuit board according to some embodiments;

[0103] Figure 14 A partial cross-section of an optical module according to some embodiments Figure 1 ;

[0104] Figure 15a A partial cross-section of an optical module according to some embodiments Figure 2 ;

[0105] Figure 15b is an enlarged partial cross-sectional view of an optical module according to some embodiments;

[0106] Figure 16 is another assembly structure diagram of the first circuit board and the second circuit board according to some embodiments;

[0107] Figure 17is another cross-sectional structural diagram of an assembly of a first circuit board and a second circuit board according to some embodiments;

[0108] Figure 18 is an enlarged cross-sectional view of another assembly of the first circuit board and the second circuit board according to some embodiments;

[0109] Figure 19 Another internal structure of an optical module according to some embodiments Figure 1 ;

[0110] Figure 20 Another structural decomposition of an optical module according to some embodiments Figure 1 ;

[0111] Figure 21 A partially enlarged view of another internal structure of an optical module according to some embodiments;

[0112] Figure 22 Another structural decomposition of an optical module according to some embodiments Figure 2 ;

[0113] Figure 23a A partial cross-section of another internal structure of an optical module according to some embodiments Figure 1 ;

[0114] Figure 23b A partial cross-section of another internal structure of an optical module according to some embodiments Figure 2 ;

[0115] Figure 24a is an assembly diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0116] Figure 24b is a cross-sectional view of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0117] Figure 25 Another internal structure of an optical module according to some embodiments Figure 1 ;

[0118] Figure 26 Another structural decomposition of an optical module according to some embodiments Figure 1 ;

[0119] Figure 27 is an exploded view of an assembly of a first circuit board and a second circuit board according to some embodiments;

[0120] Figure 28 Another internal structure of an optical module according to some embodiments Figure 2 ;

[0121] Figure 29 Another structural decomposition of an optical module according to some embodiments Figure 2 ;

[0122] Figure 30 is a cross-sectional structural diagram of another internal structure of an optical module according to some embodiments;

[0123] Figure 31 A partial enlargement of another cross-section of the interior of an optical module according to some embodiments Figure 1 ;

[0124] Figure 32 A partial enlargement of another cross-section of the interior of an optical module according to some embodiments Figure 2 ;

[0125] Figure 33 Another internal structure of an optical module according to some embodiments Figure 3 ;

[0126] Figure 34 Another structural decomposition of an optical module according to some embodiments Figure 3 ;

[0127] Figure 35a A partially enlarged view of another internal structure of an optical module according to some embodiments;

[0128] Figure 35b Schematic diagram of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0129] Figure 36 Another internal structure of an optical module according to some embodiments Figure 4 ;

[0130] Figure 37 Another structural decomposition of an optical module according to some embodiments Figure 4 ;

[0131] Figure 38a is a diagram illustrating an assembly structure of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0132] Figure 38b is a partially enlarged cross-sectional view of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0133] Figure 39a Assembling a cross section of a protective cover according to some embodiments Figure 1 ;

[0134] Figure 39b Assembling a cross section of a protective cover according to some embodiments Figure 2 ;

[0135] Figure 40 is a diagram of the internal structure of an optical modulation chip according to some embodiments;

[0136] Figure 41 is a diagram showing the internal structure of another optical modulation chip according to some embodiments;

[0137] Figure 42 is a schematic diagram of an electrical connection structure between an optical modulation chip and a first circuit board according to some embodiments;

[0138] Figure 43 Schematic diagram of wiring between an optical modulation chip and a first circuit board according to some embodiments Figure 1 ;

[0139] Figure 44 Schematic diagram of wiring between an optical modulation chip and a first circuit board according to some embodiments Figure 2 ;

[0140] Figure 45 Schematic diagram of wiring between an optical modulation chip and a first circuit board according to some embodiments Figure 3 . DETAILED DESCRIPTION

[0141] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0142] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0143] In optical communications, information is transferred between information processing devices by loading it onto light and leveraging its propagation speed. This information-carrying light is called an optical signal. Transmitting optical signals through optical information transmission equipment reduces optical power loss, enabling long-distance transmission. Furthermore, optical information transmission equipment, such as optical fiber, is less expensive than electrical information transmission equipment, such as copper wire. Therefore, optical communications technology enables high-speed, long-distance, and low-cost information transmission.

[0144] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions. Optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can identify and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert optical and electrical signals.

[0145] Optical modules can enable mutual conversion between optical and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output ends of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0146] Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the optical module's host computer. Furthermore, the optical signal input or output end of an optical module is referred to as an optical port, while the electrical signal input or output end of an optical module is referred to as an electrical port.

[0147] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, an optical module host computer 100, an optical module 200, an optical fiber 101 and a network cable 103, wherein the optical fiber 101 belongs to an optical information transmission device and the network cable 103 belongs to an electrical information transmission device.

[0148] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby achieving long-distance information transmission with low power loss.

[0149] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fibers 101 and the optical module 200 are detachably connected; in some embodiments, the optical fibers 101 and the optical module 200 are non-detachably connected.

[0150] The host computer 100 is configured to provide a data signal to the optical module 200 , or receive a data signal from the optical module 200 , or monitor or control the working state of the optical module 200 .

[0151] The host computer 100 includes a housing for accommodating the optical module 200 and an optical module interface 102 provided on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0152] The host computer 100 also includes an external electrical interface that can be connected to an electrical signal network. In some embodiments, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect to the network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0153] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0154] In some embodiments, a first optical signal from a remote information processing device 1000 propagates through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000.

[0155] In some embodiments, the optical module is a tool for converting optical signals into electrical signals. During the conversion between optical signals and electrical signals, the information does not change, but the encoding or decoding method of the information changes.

[0156] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT) or a data center server.

[0157] Figure 2 FIG1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the accommodating cavity, and a cage 106 disposed on the surface of the PCB circuit board 105 ; the optical module 200 is inserted into the cage 106 and fixed by the cage 106 .

[0158] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0159] In some embodiments, an electrical connector is disposed inside the cage 106 , and the electrical connector is configured to connect to an electrical port of the optical module 200 .

[0160] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100 , and the cage 106 fixes the optical module 200 . The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107 .

[0161] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100 , and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , thereby establishing an electrical signal connection between the optical module 200 and the host computer 100 .

[0162] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 establishes an optical signal connection with the optical fiber 101 .

[0163] Figure 3 is a structural diagram of an optical module according to some embodiments. Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, an optical module 200 includes a housing, which includes an upper housing 201 and a lower housing 202. The upper housing 201 covers the lower housing 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the housing forms a single opening that serves as both an electrical port and an optical port.

[0164] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0165] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above shell. The upper shell 201 and the lower shell 202 can encapsulate and protect the above components.

[0166] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, while the opening 205 is located at the side of the optical module 200.

[0167] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0168] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0169] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed in a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may include a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LA), a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0170] In some embodiments, the circuit board includes a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function. For example, the rigid circuit board can stably support the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0171] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0172] In some embodiments, the circuit board further includes a gold finger formed on an end surface thereof, wherein the gold finger is composed of a plurality of independent pins.

[0173] In some implementations, the gold finger 301 is disposed on a surface of one side of the circuit board 300 (eg Figure 4 In some implementations, the gold fingers 301 are provided on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to occasions where a large number of pins are required.

[0174] In some implementations, the circuit board's gold fingers extend from opening 204 and insert into an electrical connector on the host computer 100. The circuit board is inserted into cage 106, with gold fingers 301 electrically connected to the electrical connector within cage 106. Gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (I2C) signal transmission, and data signal transmission.

[0175] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0176] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0177] In some embodiments, the light module includes a light emitting component 400 .

[0178] In some embodiments, the optical module includes a light receiving component 500, such as Figure 3 and Figure 4 As shown, the light receiving component 500 is located on one side of the light emitting component 400 .

[0179] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0180] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0181] Figure 5a is a diagram of the internal structure of an optical module according to some embodiments. Figure 5b FIG. 1 is a partial exploded view of the interior of an optical module according to some embodiments. Figure 5a-5b As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400 .

[0182] In some embodiments, the light emitting component 400 is configured to enable transmission of an optical signal.

[0183] In some embodiments, the light emitting component 400 may include a laser 410. The laser 410 may emit light along the side without modulating the optical signal, so that the light emitted by the laser 410 does not carry an optical signal. Exemplarily, the laser 410 is a DFB laser.

[0184] In some embodiments, the light emitting component 400 may include a lens 420. The lens 420 is located on the light path of the laser 410. The lens 420 is a converging lens for converging the light emitted by the laser 410.

[0185] In some embodiments, the light emitting component 400 may include an isolator 430 . The isolator 430 is located on the light outgoing path of the lens 420 to prevent the light emitted by the laser 410 from returning to the laser 410 .

[0186] In some embodiments, the optical transmission component 400 may include an optical modulation chip 440. This chip is located on the optical output path of the isolator 430 and receives the light output from the isolator 430. The optical modulation chip 440 performs phase modulation on the light output from the isolator 430 to generate an optical signal. The optical modulation chip 440 integrates an MZ modulator to modulate the optical signal and enable optical signal transmission. The optical modulation chip 440 may be a silicon photonic chip, a thin-film lithium niobate chip, or a Group III-V chip.

[0187] In some embodiments, the optical emitting component 400 may include an optical fiber array 450. The optical fiber array 450 is end-face coupled to the optical modulation chip 440. The optical fiber array 450 is located on the optical outgoing path of the optical modulation chip 440 to transmit the optical signal modulated by the optical modulation chip 440 to the outside.

[0188] In some embodiments, the light emitted by the laser 410 is transmitted to the optical modulation chip 440 , where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 440 and transmitted through the optical fiber array 450 .

[0189] In some embodiments, the laser 410, lens 420, and isolator 430 are located on the light path of the optical modulation chip 440, providing the light source to be modulated to the optical modulation chip 440. The optical fiber array 450 is coupled to the light output port of the optical modulation chip 440. If the light input port and light output port of the optical modulation chip 440 are formed on the same side, the laser 410, lens 420, isolator 430, and optical fiber array 450 are located on the same side of the optical modulation chip 440.

[0190] In some embodiments, the light receiving component 500 is configured to enable reception of optical signals.

[0191] In some embodiments, the light receiving part 500 may include a light folding member 510 .

[0192] In some embodiments, the light receiving part 500 may include a light receiving chip 520 .

[0193] In some embodiments, the light receiving component 500 may include a TIA 530 .

[0194] In some embodiments, the deflecting element 510 includes an optical fiber 511, which extends toward the light receiving chip 520, with the end of the optical fiber 511 exposed above the light receiving chip 520. A reflective end surface 512 is formed at the end of the optical fiber 511, and the reflective end surface 512 is exposed above the light receiving chip 520. The reflective end surface 512 is used to reflect and redirect the optical signal transmitted by the optical fiber 511, thereby reflecting the optical signal transmitted by the optical fiber 511 to the light receiving chip 520, thereby achieving a deflection in the optical path.

[0195] In some embodiments, the TIA 530 is located on the surface of the circuit board 300 and on one side of the light receiving chip 520. The light receiving chip 520 converts the received light signal into a photocurrent signal, and the TIA 530 converts the photocurrent signal into a photovoltage signal and amplifies the photovoltage signal.

[0196] In some embodiments, the surface of the light emitting component 400 is covered with a protective cover 400a to protect the light emitting component 400 from damage. The protective cover 400a has an opening at the light output end of the light emitting component 400. The opening is projected onto the surface of the isolator 430 to expose the light output surface of the isolator 430 and avoid light blocking. The light output by the isolator 430 is then transmitted to the optical modulation chip 440.

[0197] Figure 6a is a schematic diagram of an optical path of a light emitting component according to some embodiments. Figure 6b is a structural diagram of a refractive element according to some embodiments, Figure 6c FIG. 1 is an exploded view of a refraction member according to some embodiments. Figures 6a-6c As shown, in some embodiments, the reflective end face 512 reflects the optical signal transmitted by the optical fiber 511 to change the transmission direction of the optical signal in the optical fiber 511, thereby reflecting the optical signal transmitted by the optical fiber 511 to the optical receiving chip 520 to achieve optical signal reception.

[0198] In some embodiments, the light-bending element 510 may include an optical fiber 511 . A reflective end surface 512 is formed on the light-emitting end surface of the optical fiber 511 .

[0199] In some embodiments, the deflecting member 510 may include a first fiber support portion 513 and a second fiber support portion 514. The first fiber support portion 513 and the second fiber support portion 514 are disposed in a vertically opposed relationship, with a plurality of optical fibers 511 sandwiched therebetween. The plurality of optical fibers 511 form a fiber array. A V-shaped groove 517 is formed on the bottom surface of the first fiber support portion 513 to embed the optical fibers 511.

[0200] In some embodiments, the deflecting member 510 may include a fiber fixing portion 515. The fiber fixing portion 515 is located at the rear end of the second fiber support portion 514 to securely connect the optical fiber 511. The fiber fixing portion 515 protects and cushions the optical fiber 511, thereby preventing fiber breakage. Exemplarily, the fiber fixing portion 515 is made of a soft adhesive that provides protection and cushioning for the optical fiber 511.

[0201] In some embodiments, the first fiber supporting portion 513 is longer than the second fiber supporting portion 514 , and there is space between the second fiber supporting portion 514 and the end of the first fiber supporting portion 513 , reserving coating space for the fiber fixing portion 515 .

[0202] In some embodiments, the reflective end surface 512 is an inclined surface, and the received light signal transmitted by the optical fiber 511 is totally reflected at the reflective end surface 512. For example, the inclination angle of the reflective end surface 512 is 46-50°, such as 48°.

[0203] In some embodiments, the optical fiber 511 passes through one end of the first optical fiber support portion 513 and extends outside the other end of the first optical fiber support portion 513, so that the reflective end surface 512 is located outside the other end of the first optical fiber support portion 513. One end of the optical fiber fixing portion 515 is connected to one end of the second optical fiber support portion 514, and the other end of the optical fiber fixing portion 515 is fixedly connected to the end of the optical fiber 511 to support the end of the optical fiber 511.

[0204] In some embodiments, a protective surface 516 is formed on the end surface of the first optical fiber support portion 513. The protective surface 516 surrounds the side of the reflective end surface 512 and is used to protect the reflective end surface 512. Exemplarily, the protective surface 516 is an inclined surface, and the inclination angle of the protective surface 516 is 46-50 degrees, such as 48 degrees.

[0205] In some embodiments, the reflective end face 512 and the protective surface 516 are formed by grinding and polishing. The end face of the optical fiber 511 is ground to a predetermined angle to form the reflective end face 512. The optical fiber 511 is cylindrical, and after grinding, the cross-section of the reflective end face 512 is elliptical, so that the bottom of the optical fiber 511 is exposed relative to the first optical fiber support portion 513.

[0206] In some embodiments, a certain gap is left between the optical fiber fixing portion 515 and the surface of the circuit board 300 to prevent the optical fiber fixing portion 515 from adhering to the optical glue on the surface of the circuit board 300 used to fix the second optical fiber support portion 514, thereby maintaining the binding force of the optical fiber fixing portion 515 on the optical fiber 511.

[0207] In some embodiments, the light receiving chip 520 is located on the surface of the circuit board 300. When the model of the light receiving chip 520 is fixed, its thickness is fixed, and the distance between its photosensitive surface and the surface of the circuit board 300 is fixed.

[0208] In some embodiments, the preset distance between the reflective end face 512 and the light receiving chip 520 is relatively small to ensure that the optical signal reflected by the reflective end face 512 can be transmitted to the photosensitive surface of the light receiving chip 520 and then received by the light receiving chip 520. The second optical fiber support portion 514 has a relatively small thickness to ensure that the distance between the reflective end face 512 and the light receiving chip 520 meets the preset distance. Exemplarily, the second optical fiber support portion 514 is thinner than the first optical fiber support portion 513 to ensure that the distance between the reflective end face 512 and the light receiving chip 520 meets the preset distance.

[0209] In some embodiments, there is a certain distance between the end of the second optical fiber support portion 514 and the reflective end face 512, and the length of the second optical fiber support portion 514 does not extend below the reflective end face 512, leaving space for the arrangement of the optical receiving chip 520 to ensure that the distance from the reflective end face 512 to the optical receiving chip 520 meets the preset distance.

[0210] Figure 7 is a cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 8 FIG. 1 is an exploded view of the internal structure of an optical module according to some embodiments. Figure 7 and Figure 8 As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400 .

[0211] In some embodiments, the optical module may include a first circuit board 310. The first circuit board 310 is configured to transmit high-frequency signals and non-high-frequency signals. A gold finger 301 is formed on one end of the surface of the first circuit board 310. The high-frequency and non-high-frequency signals output by the gold finger 301 are transmitted along the surface of the first circuit board 310. High-speed signal traces and non-high-speed signal traces are arranged on the surface of the first circuit board 310 to transmit high-frequency and non-high-frequency signals.

[0212] In some embodiments, the optical module may include a second circuit board 320. Non-high-speed signal traces are arranged on the surface of the second circuit board 320 to transmit non-high-frequency signals.

[0213] In some embodiments, the first circuit board 310 and the second circuit board 320 are electrically connected by gold wire bonding at their ends. The high-frequency signal output by the gold finger 301 is then transmitted along the surface of the first circuit board 310. The non-high-frequency signal output by the gold finger 301 can also be transmitted along the surface of the first circuit board 310 or to the surface of the second circuit board 320.

[0214] In some embodiments, the optical module may include a fixing plate 900. The first circuit board 310 and the second circuit board 320 are respectively fixed to the surface of the fixing plate 900. The fixing plate 900 is located below the end surface of the first circuit board 310 and the second circuit board 320 to support both the first circuit board 310 and the second circuit board 320. The fixing plate 900 also has a high thermal conductivity.

[0215] In some embodiments, the first circuit board 310 and the second circuit board 320 are connected by gold wire bonding. Gold wire bonding primarily establishes an electrical connection, but provides a weaker fixed connection. The first circuit board 310 and the second circuit board 320 are each secured to the surface of a fixing plate 900 to securely connect the first circuit board 310 and the second circuit board 320, thereby enhancing the securement between the first circuit board 310 and the second circuit board 320.

[0216] In some embodiments, a first circuit board 310 is provided at one end of the surface of the fixing plate 900 and a second circuit board 320 is provided at the other end to fixedly connect the first circuit board 310 and the second circuit board 320 and enhance the fixed connection between the first circuit board 310 and the second circuit board 320.

[0217] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900, which is beneficial to improving the heat dissipation efficiency of the light emitting component 400. The fixing plate 900 has good thermal conductivity.

[0218] In some embodiments, the first circuit board 310 is configured to transmit high-frequency signals and non-high-frequency signals, and the second circuit board 320 is configured to transmit non-high-frequency signals, thereby implementing split-board signal transmission. The first and second circuit boards are made of different materials. The material of the first circuit board 310 has a low dielectric constant to support high-frequency signal transmission. The second circuit board 320 has relatively low dielectric constant requirements for the material. High-frequency signals have a faster transmission rate, and the signal transmission rate is inversely proportional to the square root of the dielectric constant. Therefore, the lower the dielectric constant, the faster the signal transmission rate.

[0219] In some embodiments, the first circuit board 310 has a low dielectric constant. For example, the dielectric constant of the first circuit board 310 is lower than the dielectric constant of the second circuit board 320. Low dielectric constant materials are more expensive, so using separate boards to transmit signals can reduce circuit board design costs.

[0220] In some embodiments, the first circuit board 310 is configured to transmit high-frequency and non-high-frequency signals, while the second circuit board 320 is configured to transmit non-high-frequency signals. Therefore, the design of the first circuit board 310 requires strict control over the interlayer structure, layout, and routing to provide better signal shielding and anti-interference capabilities to support high-frequency signal transmission. The design of the second circuit board 320 is relatively simple, resulting in lower design costs.

[0221] In some embodiments, the optical modulation chip 440 is located on the surface of the fixing plate 900. There is a certain distance between the optical modulation chip 440 and the edge of the fixing plate 900, thereby providing space for the first circuit board 310. The end of the first circuit board 310 is located on the surface of the fixing plate 900, to one side of the optical modulation chip 440, facilitating the electrical connection of high-frequency signals between the optical modulation chip 440 and the first circuit board 310.

[0222] In some embodiments, a gold finger 301 is formed on one end surface of the first circuit board 310, and a high-frequency signal pad and an electrical connection pad are formed on the other end surface. The high-frequency signal pad is used to achieve an electrical connection between the first circuit board 310 and the optical modulation chip 440, and the electrical connection pad is used to achieve an electrical connection between the first circuit board 310 and the second circuit board 320.

[0223] In some embodiments, the first circuit board 310 or the second circuit board 320 has an avoidance gap to avoid the light emitting component 400 on the surface of the fixing plate 900 .

[0224] In some embodiments, the DSP chip 302 is located on the surface of the first circuit board 310. The DSP chip 302 is located on one side of the gold finger 301, and high-frequency signals are transmitted between the DSP chip 302 and the gold finger 301.

[0225] In some embodiments, the optical modulation chip 440 is electrically connected to the DSP chip 302, and the modulation drive signal required by the optical modulation chip 440 can be provided by the DSP chip 302. Alternatively, the modulation drive signal required by the optical modulation chip 440 is provided by an independent driver chip.

[0226] In some embodiments, one end of the TIA 530 is electrically connected to the optical receiver chip 520 to receive the photocurrent signal output by the optical receiver chip 520 , and the other end of the TIA 530 is electrically connected to the DSP chip 302 to transmit the electrical signal amplified by the TIA 530 to the DSP chip 302 .

[0227] In some embodiments, the TIA 530 is located on the surface of the first circuit board 310 and on one side of the DSP chip 302, which helps to ensure high-frequency signal transmission performance between the TIA 530 and the DSP chip 302. For example, the DSP chip 302 is located between the TIA 530 and the gold finger 301.

[0228] In some embodiments, the optical receiver chip 520 is located on the surface of the first circuit board 310 and on one side of the TIA 530, which helps to ensure high-frequency signal transmission performance between the optical receiver chip 520 and the TIA 530. For example, the TIA 530 is located between the optical receiver chip 520 and the DSP chip 302.

[0229] In some embodiments, the second fiber support portion 514 in the deflecting member 510 is located on the surface of the second circuit board 320. The second fiber support portion 514 is shorter than the first fiber support portion 513. A certain space is provided between the end of the second fiber support portion 514 and the reflective end surface 512. Therefore, there is a height difference between the bottom surface of the first fiber support portion 513 and the surface of the first circuit board 310 or the second circuit board 320, thereby providing space for bonding wires for the electrical connection between the first circuit board 310 and the second circuit board 320.

[0230] In some embodiments, the bonding area between the first circuit board 310 and the second circuit board 320 is located below the first fiber support portion 513. For example, the bonding area between the first circuit board 310 and the second circuit board 320 is located between the second fiber support portion 514 and the optical receiver chip 520.

[0231] In some embodiments, the first optical fiber support portion 513 in the folding element 510 extends from the surface of the second circuit board 320, across the bonding wire between the first circuit board 310 and the second circuit board 320, and to the surface of the first circuit board 310, so that the reflective end surface 512 is located above the light receiving chip 530.

[0232] Figure 9a FIG. 1 is a partial cross-sectional structural diagram of an optical module according to some embodiments. Figure 9a As shown, in some embodiments, the first circuit board 310 and the second circuit board 320 are respectively fixed to the surface of the fixing plate 900. The fixing plate 900 is located below the electrical connection area of ​​the first circuit board 310 and the second circuit board 320 to support the first circuit board 310 and the second circuit board 320 at the same time.

[0233] In some embodiments, the first circuit board 310 and the second circuit board 320 are respectively fixed on the surface of the fixed plate 900, and the two are connected by gold wire bonding to realize the electrical connection between the first circuit board 310 and the second circuit board 320, so that the non-high-frequency signal output by the gold finger 301 can be transmitted along the surface of the first circuit board 310, and can also be transmitted along the first circuit board 310 to the surface of the second circuit board 320.

[0234] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310 . A first area of ​​the other end of the fixing plate 900 is used to support the second circuit board 320 , and a second area is used to support the light emitting component 400 .

[0235] In some embodiments, the second circuit board 320 is formed with a first relief notch 321 to avoid the light emitting component 400 on the surface of the fixing plate 900. The first relief notch 321 is formed on the side of the second circuit board 320. The light emitting component 400 is located within the first relief notch 321. The surface of the second circuit board 320 adjacent to the first relief notch 321 is positioned above the fixing plate 900, thereby securing the second circuit board 320 to the surface of the fixing plate 900.

[0236] In some embodiments, since the first avoidance gap 321 is formed on the surface of the second circuit board 320 , the size of the fixing plate 900 below the second circuit board 320 is larger than the size of the fixing plate 900 below the first circuit board 310 .

[0237] In some embodiments, the deflecting member 510 is located on one side of the light emitting component 400 and also on one side of the first avoidance notch 321. The second fiber support portion 514 of the deflecting member 510 is located on the surface of the second circuit board 320. The first fiber support portion 513 of the deflecting member 510 extends from the surface of the second circuit board 320, across the bonding wire between the first and second circuit boards 310, and to the surface of the first circuit board 310, so that the reflective end surface 512 is located above the light receiving chip 530.

[0238] In some embodiments, the electrical connection area between the first circuit board 310 and the second circuit board 320 is located below the first fiber support portion 513. The bottom of the first fiber support portion 513 is higher than the surface of the first circuit board 310 or the second circuit board 320, thereby providing wiring space for bonding wires between the first circuit board 310 and the second circuit board 320, thereby achieving electrical connection between the first circuit board 310 and the second circuit board 320.

[0239] Figure 9b FIG1 is an assembly diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 9c This is an exploded view of the assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 9d FIG1 is a cross-sectional view of an upper housing, a lower housing, a first circuit board and a second circuit board according to some embodiments. Figures 9b-9d As shown, in some embodiments, a first avoidance gap 321 is formed on the surface of the second circuit board 320 to avoid the light emitting component 400 .

[0240] In some embodiments, the surface of the lower housing 202 is raised upward to form a raised portion 2023. The raised portion 2023 is raised toward the upper housing 201. The raised portion 2023 is located on one side of the fixing plate 900. For example, the raised portion 2023 is located on one side of the laser 410 and is located within the first avoidance gap 321.

[0241] In some embodiments, a space is left between the end of the fixing plate 900 and the side wall of the second circuit board 320 so that the first avoidance gap 321 can avoid the light emitting component 400 and the protrusion 2023 at the same time.

[0242] In some embodiments, the fixing plate 900 is thermally connected to the lower housing 202. For example, the space between the bottom surface of the fixing plate 900 and the lower housing 202 is filled with thermally conductive gel.

[0243] In some embodiments, the protrusion 2023 is thermally connected to the upper housing 201. For example, the space between the surface of the protrusion 2023 and the upper housing 201 is filled with thermally conductive gel.

[0244] In some embodiments, the heat generated by the laser 410 is transferred downward to the fixing plate 900. The fixing plate 900 then transfers the heat downward to the lower housing 202. The raised portion 2023 on the surface of the lower housing 202 then transfers the heat upward to the upper housing 201. A heat dissipation duct is formed between the upper housing 201 and the cage 106 of the host computer 100, achieving improved heat dissipation efficiency.

[0245] In some embodiments, the optical fiber array 450 is located on the surface of the fixing plate 900 . The optical fiber ribbons in the optical fiber array 450 extend along the surface of the fixing plate 900 to the surface of the second circuit board 320 .

[0246] In some embodiments, the optical fiber ribbons in the optical fiber array 450 pass horizontally along the surface of the circuit board 300 to prevent the optical fibers from being subjected to stress and breakage when in contact with the circuit board 300. In some embodiments, the fiber output port of the optical fiber array 450 can be raised by a certain amount so that the optical fibers can pass horizontally and buffered when landing on the surface of the circuit board 300, reducing interference with the circuit board 300 surface and ensuring smooth horizontal fiber output.

[0247] In some embodiments, one end of the fixing plate 900 is positioned below the first circuit board 310, while the other end does not extend beyond the first clearance gap 321. That is, the dimension of the fixing plate 900 below the second circuit board 320 is smaller than the dimension of the first clearance gap 321. Thus, there is a certain distance between the fixing plate 900 and the sidewall of the first clearance gap 321, and the optical fiber ribbons in the optical fiber array 450 are suspended within this distance. This provides bending space for the optical fiber ribbons in the optical fiber array 450 when they are lifted upward, freeing the optical fibers from stress within the bending space and thus preventing fiber breakage.

[0248] Figure 10 is an assembly diagram of a first circuit board and a second circuit board according to some embodiments, Figure 11 is an exploded view of an assembly of a first circuit board and a second circuit board according to some embodiments. Figure 12FIG1 is a partial diagram of a first circuit board and a second circuit board assembly according to some embodiments. Figure 10-12 As shown, in some embodiments, the optical module includes a first circuit board 310 and a second circuit board 320. The first circuit board 310 and the second circuit board 320 are respectively fixed to the surface of the fixing plate 900.

[0249] In some embodiments, the first circuit board 310 and the second circuit board 320 are connected end-to-end to achieve electrical connection between the two. A gold finger 301 is provided on one end surface of the first circuit board 310. A DSP chip 302 is provided on the surface of the first circuit board 310. The DSP chip 302 is located on one side of the gold finger 301.

[0250] In some embodiments, the first circuit board 310 is used to transmit high-frequency signals and non-high-frequency signals, while the second circuit board 320 is used to transmit non-high-frequency signals. High-frequency signals are transmitted along the surface of the first circuit board 310; non-high-frequency signals are transmitted along the surface of the first circuit board 310 and can also be transmitted through the first circuit board 310 to the surface of the second circuit board 320.

[0251] In some embodiments, the dielectric constant of the first circuit board 310 is lower than that of the second circuit board 320 to support high-frequency signal transmission.

[0252] In some embodiments, the fixing plate 900 is located below the interface between the first circuit board 310 and the second circuit board 320 to support both the first circuit board 310 and the second circuit board 320 from below. One end of the fixing plate 900 is located below the first circuit board 310. At the other end of the fixing plate 900, a first area is used to support the second circuit board 320, and a second area is used to support the light emitting component 400.

[0253] In some embodiments, the second circuit board 320 is formed with a first avoidance gap 321 to avoid the light emitting component 400 on the surface of the fixing plate 900. The second circuit board 320 is L-shaped.

[0254] In some embodiments, the first circuit board 310 and the second circuit board 320 are docked and connected with end-face gold wire bonding to achieve electrical connection between the two, so that non-high-frequency signals can be transmitted along the first circuit board 310 to the surface of the second circuit board 320.

[0255] In some embodiments, the bonding area between the first circuit board 310 and the second circuit board 320 is located below the first fiber support portion 513. For example, the bonding area between the first circuit board 310 and the second circuit board 320 is located between the second fiber support portion 514 and the optical receiver chip 520.

[0256] In some embodiments, the optical modulation chip 440 is located on the surface of the fixing plate 900. The optical modulation chip 440 is electrically connected to the first circuit board 310 so that a high-frequency signal is input into the optical modulation chip 440 through the first circuit board 310, thereby driving the optical modulation chip 440 to perform signal modulation.

[0257] In some embodiments, the optical modulation chip 440 is located on the surface of the fixing plate 900. The optical modulation chip 440 is electrically connected to the first circuit board 310 and the second circuit board 320, respectively, to input high-frequency and non-high-frequency signals to the optical modulation chip 440. The surface of the optical modulation chip 440 is flush with the surfaces of the first circuit board 310 and the second circuit board 320, respectively, to shorten the bonding wires between the optical modulation chip 440 and the first circuit board 310 and between the optical modulation chip 440 and the second circuit board 320, thereby improving signal transmission performance.

[0258] In some embodiments, two adjacent sides of the optical modulation chip 440 are electrically connected to the first circuit board 310 and the second circuit board 320, respectively. Of the two adjacent sides of the optical modulation chip 440, one side is located on the side of the first circuit board 310 to be electrically connected to the first circuit board 310, and the other side is located on the side of the second circuit board 320 to be electrically connected to the second circuit board 320.

[0259] In some embodiments, one side of the optical modulation chip 440 is electrically connected to the first circuit board 310 by bonding wires, so that a high-frequency signal is input to the optical modulation chip 440 through the first circuit board 310. For example, the DSP chip 302 provides a modulation drive signal to the optical modulation chip 440 to drive the optical modulation chip 440 to modulate the optical signal.

[0260] In some embodiments, the other side of the optical modulation chip 440 is electrically connected to the second circuit board 320 via bonding wires, thereby inputting a non-high-frequency signal to the optical modulation chip 440 via the second circuit board 320. For example, the gold finger 301 provides a modulated current signal to the optical modulation chip 440. The output modulated current signal is transmitted via the surface of the first circuit board 310 to the surface of the second circuit board 320, and then transmitted to the optical modulation chip 440.

[0261] In some embodiments, the laser 410 is electrically connected to the second circuit board 320 by bonding wires, so that a non-high-frequency signal can be input to the laser 410 through the second circuit board 320. For example, the gold finger 301 provides a bias current to the optical modulation chip 440. The bias current output by the gold finger 301 is transmitted from the surface of the first circuit board 310 to the surface of the second circuit board 320, and then transmitted to the laser 410.

[0262] In some embodiments, the bonding area between the first circuit board 310 and the second circuit board 320 is located at an end of the first circuit board 310 away from the gold finger 301 , and the bonding area between the first circuit board 310 and the optical modulation chip 440 is also located at an end of the first circuit board 310 away from the gold finger 301 .

[0263] Figure 13a is a structural diagram of a first circuit board according to some embodiments, Figure 13b FIG. 1 is a structural diagram of a second circuit board according to some embodiments. Figure 13a 、 13b As shown, in some embodiments, the first circuit board 310 is electrically connected to the second circuit board 320. The second circuit board 320 is formed with a first avoidance gap 321 to avoid the light emitting component 400. The second circuit board 320 is L-shaped and has a regular rectangular shape.

[0264] In some embodiments, a gold finger 301 is formed on one end surface of the first circuit board 310, and a first solder pad area 311 and a second solder pad area 312 are formed on the other end surface. The first solder pad area 311 is used to electrically connect to the second circuit board 320, and the second solder pad area 312 is used to electrically connect to the optical modulation chip 440.

[0265] In some embodiments, a third pad area 322 is formed on the end surface of the second circuit board 320. The third pad area 322 is connected to the first pad area 311 by wire bonding to achieve electrical connection between the second circuit board 320 and the first circuit board 310.

[0266] In some embodiments, the second optical fiber support portion 514 is disposed on the surface of the second circuit board 320. A certain distance exists between the end of the second optical fiber support portion 514 and the end surface of the second circuit board 320. The end of the second optical fiber support portion 514 does not extend to the surface of the third solder pad area 322, that is, the end of the second optical fiber support portion 514 does not cover the third solder pad area 322, thereby avoiding bonding between the second circuit board 320 and the first circuit board 310.

[0267] In some embodiments, a fourth pad area 323 is formed on the surface of the second circuit board 320. A wire bond is formed between the fourth pad area 323 and the laser 410 to electrically connect the second circuit board 320 and the laser 410. The bias current output by the gold finger 301 is transmitted from the surface of the first circuit board 310 to the surface of the second circuit board 320, and then to the laser 410.

[0268] In some embodiments, a fifth pad area 324 is formed on the surface of the second circuit board 320. The fifth pad area 324 and the fourth pad area 323 are located on the same side, and the fifth pad area 324 and the third pad area 322 are located on an adjacent side.

[0269] In some embodiments, the second pad area 312 is electrically connected to one side of the optical modulation chip 440 to facilitate high-frequency signal transmission between the first circuit board 310 and the optical modulation chip 440. The fifth pad area 324 is electrically connected to the other side of the optical modulation chip 440 to facilitate non-high-frequency signal transmission between the second circuit board 320 and the optical modulation chip 440.

[0270] In some embodiments, the surface where the third pad area 322 is located is located on the surface of the fixing plate 900 , so that the second circuit board 320 is disposed on the surface of the fixing plate 900 .

[0271] Figure 14 A partial cross-section of an optical module according to some embodiments Figure 1 .like Figure 14 As shown, in some embodiments, a first circuit board 310 is provided at one end of the surface of the fixing plate 900, and a second circuit board 320 is provided at the other end to fixedly connect the first circuit board 310 and the second circuit board 320, thereby enhancing the fixed connection between the first circuit board 310 and the second circuit board 320.

[0272] In some embodiments, the second fiber support portion 514 is disposed on the surface of the second circuit board 320. A third solder pad area 322 is formed on the surface of the second circuit board 320 for bonding to the first circuit board 310. The end surface of the second fiber support portion 514 does not extend to the third solder pad area 322 to avoid bonding between the second circuit board 320 and the first circuit board 310, thereby providing space for wiring between the second circuit board 320 and the first circuit board 310.

[0273] In some embodiments, the second optical fiber support portion 514 is located above the first optical fiber support portion 513, and the first optical fiber support portion 513 extends along the surface of the second circuit board 320 and across the bonding wire between the second circuit board 320 and the first circuit board 310 to the surface of the first circuit board 310, so as to set the reflective end face 512 on the optical receiving chip 530, so that the reflected optical signal is incident on the optical receiving chip 530.

[0274] In some embodiments, the bonding area between the first circuit board 310 and the second circuit board 320 is located below the first optical fiber support portion 513. For example, the bonding area between the first circuit board 310 and the second circuit board 320 is located between the second optical fiber support portion 514 and the optical receiving chip 520. Figure 6b As shown, there happens to be a wiring space below the first optical fiber supporting portion 513 , thereby providing a wiring space for wiring between the first circuit board 310 and the second circuit board 320 .

[0275] In some embodiments, the second fiber support portion 514 of the deflecting member 510 is located on the surface of the second circuit board 320. The length of the second fiber support portion 514 is shorter than the length of the first fiber support portion 513. The cutoff end surface of the second fiber support portion 514 is not flush with the end surface of the second circuit board 320. The end surface of the second fiber support portion 514 is located a certain distance from the end of the second circuit board 320, thereby avoiding the third solder pad area 322 on the surface of the second circuit board 320 and facilitating bonding between the second circuit board 320 and the first circuit board 310.

[0276] In some embodiments, a bottom surface of the first optical fiber supporting portion 513 has a height difference from a surface of the first circuit board 310 or the second circuit board 320 , thereby providing a bonding space for electrical connection between the first circuit board 310 and the second circuit board 320 .

[0277] In some embodiments, the first optical fiber support portion 513 in the folding element 510 extends from the surface of the second circuit board 320, across the bonding wire between the first circuit board 310 and the second circuit board 320, and to the surface of the first circuit board 310, so that the reflective end surface 512 is set above the light receiving chip 530.

[0278] Figure 15a A partial cross-section of an optical module according to some embodiments Figure 2 , Figure 15b FIG. 1 is an enlarged partial cross-sectional view of an optical module according to some embodiments. Figure 15a and Figure 15b As shown, in some embodiments, a fixing plate 900 is disposed on one side of the light emitting component 400, with one end being used to support the light emitting component 400 and the other end being used to support the first circuit board 310. The optical modulation chip 440 is electrically connected to the first circuit board 310 so that the first circuit board 310 transmits a high-frequency signal to the optical modulation chip 440.

[0279] In some embodiments, a certain distance exists between the fixing plate 900 and the sidewall of the first relief notch 321, and the optical fiber ribbons in the optical fiber array 450 are suspended within this distance. This provides bending space for the optical fiber ribbons in the optical fiber array 450 when they are lifted upward, freeing the optical fibers from stress within the bending space and thus preventing fiber breakage. The optical fiber ribbons follow the surface of the fixing plate 900, passing through the suspended area, and finally reaching the surface of the second circuit board 320.

[0280] In some embodiments, the surface of the optical modulation chip 440 is flush with the surface of the first circuit board 310 to shorten the wiring between the two and improve high-frequency signal transmission performance.

[0281] Figure 16 FIG. 1 is another assembly structure diagram of the first circuit board and the second circuit board according to some embodiments. Figure 16As shown, in some embodiments, the first circuit board 310 and the second circuit board 320 are electrically connected by end-surface bonding. The first circuit board 310 is used to transmit high-frequency and non-high-frequency signals, while the second circuit board 320 is used to transmit non-high-frequency signals. The dielectric constant of the first circuit board 310 is lower than that of the second circuit board 320 to meet the requirements of high-frequency signal transmission.

[0282] In some embodiments, the first circuit board 310 and the second circuit board 320 are fixed to a surface of the fixing plate 900 . The fixing plate 900 supports the first circuit board 310 and the second circuit board 320 .

[0283] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900 , and the light receiving component 500 is located on one side of the light emitting component 400 . For example, the light deflecting member 510 is located on one side of the light emitting component 400 .

[0284] In some embodiments, the second circuit board 320 is formed with a first avoiding gap 321 to avoid the light emitting component 400 . The deflecting member 510 is located on one side of the first avoiding gap 321 .

[0285] In some embodiments, the bonding wire between the first circuit board 310 and the second circuit board 320 is located below the first fiber support portion 513. The first fiber support portion 513 extends from the surface of the second circuit board 320, across the bonding wire between the first circuit board 310 and the second circuit board 320, and to the surface of the first circuit board 310, so that the reflective end surface 512 is located above the light receiving chip 530.

[0286] In some embodiments, two adjacent sides of the optical modulation chip 440 are electrically connected to the first circuit board 310 and the second circuit board 320 respectively, so as to input high-frequency signals and non-high-frequency signals to the optical modulation chip 440 .

[0287] In some embodiments, the laser 410 is electrically connected to the second circuit board 320 to input a non-high frequency signal to the laser 410 .

[0288] Figure 17 FIG. 1 is another cross-sectional structural diagram of an assembly of a first circuit board and a second circuit board according to some embodiments. Figure 18 This is another enlarged cross-sectional view of the assembly of the first circuit board and the second circuit board according to some embodiments. Figure 18 for Figure 17 In some embodiments, as Figure 17 and Figure 18 As shown, the first circuit board 310 and the second circuit board 320 are fixed on the surface of the fixing plate 900 , and the two are connected end-to-end on the surface of the fixing plate 900 .

[0289] In some embodiments, one end of the fixing plate 900 is positioned below the first circuit board 310, while the other end extends beyond the first clearance gap 321 to be positioned below the second circuit board 320. In other words, the dimension of the fixing plate 900 positioned below the second circuit board 320 is larger than the dimension of the first clearance gap 321. The optical fiber ribbons in the optical fiber array 450 are routed from the optical fiber array 450 and extend to the surface of the second circuit board 320.

[0290] In some embodiments, one end of the fixing plate 900 supports the first circuit board 310; the other end has a first region that carries the light emitting component 400 and a second region that supports the second circuit board 320. The optical modulation chip 440 is disposed near the first circuit board 310, and the optical fiber array 450 is disposed near the second circuit board 320.

[0291] In some embodiments, the surface of the optical modulation chip 440 is flush with the surface of the first circuit board 310 to shorten the wiring between the two and improve high-frequency signal transmission performance.

[0292] In some embodiments, the size of the fixing plate 900 below the second circuit board 320 is larger than the size of the fixing plate 900 below the first circuit board 310 .

[0293] In some embodiments, the light emitting component 400 is embedded in the first avoidance gap 321 , and the heat generated by the light emitting component 400 is conducted through the fixing plate 900 .

[0294] Figure 19 Another internal structure of an optical module according to some embodiments Figure 1 , Figure 20 Another structural decomposition of an optical module according to some embodiments Figure 1 .like Figure 19-20 As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400 .

[0295] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900. The heat generated by the light emitting component 400 is conducted through the fixing plate 900.

[0296] In some embodiments, two adjacent sides of the optical modulation chip 440 are electrically connected to the first circuit board 310 and the second circuit board 320, respectively. One of the two adjacent sides is electrically connected to the surface of the first circuit board 310b by bonding wires, thereby allowing high-frequency signals to be input to the optical modulation chip 440 through the first circuit board 310b. The other of the two adjacent sides is electrically connected to the surface of the second circuit board 320b by bonding wires, thereby allowing non-high-frequency signals to be input to the optical modulation chip 440 through the second circuit board 320b.

[0297] In some embodiments, different optical modulation chip 440 models have different requirements for non-high-frequency signals. To meet the optical modulation chip 440's requirements for non-high-frequency signals, the first relief notch is formed at different locations on the surface of the second circuit board 320. For example, the first relief notch is formed in the middle of the second circuit board 320. To distinguish the second circuit board 320, the second circuit board is designated as the second circuit board 320b, and the first circuit board is designated as the first circuit board 310b.

[0298] In some embodiments, a third avoidance notch 321b is formed on the surface of the second circuit board 320b to avoid the light emitting component 400. The light emitting component 400 is located in the third avoidance notch 321b and can be electrically connected to the first circuit board 310b and the second circuit board 320b respectively.

[0299] In some embodiments, the second circuit board 320b may include a first arm surface 3211b located on one side of the third avoidance gap 321b.

[0300] In some embodiments, the second circuit board 320b may include a second arm surface 3212b located on the other side of the third avoidance gap 321b.

[0301] In some embodiments, the third avoidance notch 321b is located between the first arm surface 3211b and the second arm surface 3212b. The light emitting component 400 is located between the first arm surface 3211b and the second arm surface 3212b. Exemplarily, the third avoidance notch 321b is U-shaped.

[0302] In some embodiments, the first side surface of the optical modulation chip 440 is wire-bonded to the surface of the first circuit board 310 b to input high-frequency signals to the optical modulation chip 440 through the first circuit board 310 b. The two sides adjacent to the first side surface are wire-bonded to the surface of the second circuit board 320 b to input non-high-frequency signals to the optical modulation chip 440 through the second circuit board 320 b.

[0303] In some embodiments, a surface on one side adjacent to the first side of the optical modulation chip 440 is bonded to the surface of the first support arm surface 3211b to input a non-high-frequency signal to the optical modulation chip 440 via the first support arm surface 3211b. A surface on the other side adjacent to the first side of the optical modulation chip 440 is bonded to the surface of the second support arm surface 3212b to input a non-high-frequency signal to the optical modulation chip 440 via the second support arm surface 3212b, thereby increasing the wiring space for the non-high-frequency signals of the optical modulation chip 440 and meeting the requirement for the number of bonding lines for the non-high-frequency signals of the optical modulation chip 440.

[0304] Figure 21FIG. 1 is a partially enlarged view of another internal structure of an optical module according to some embodiments. Figure 21 As shown, in some embodiments, the first circuit board 310b is electrically connected to the second circuit board 320b.

[0305] In some embodiments, a first pad area 311b is formed on the surface of the first circuit board 310b, and the surface of the optical modulation chip 440 is connected to the surface of the first pad area 311b by wire bonding, so as to input a high-frequency signal to the optical modulation chip 440 through the first circuit board 310b.

[0306] In some embodiments, a second pad area 312b is formed on the surface of the first circuit board 310b. The second pad area 312b is located to one side of the first pad area 311b. A third pad area 322b is formed on the surface of the first arm surface 3211b. The third pad area 322b is wire-bonded to the second pad area 312b to electrically connect the first circuit board 310b to the second circuit board 320b. Non-high-frequency signals can be transmitted along the first circuit board 310b to the surface of the second circuit board 320b.

[0307] In some embodiments, a fourth solder pad area 313b is formed on the surface of the first circuit board 310b. A fifth solder pad area 323b is formed on the surface of the second arm surface 3212b. The fifth solder pad area 323b is wire-bonded to the fourth solder pad area 313b to electrically connect the first circuit board 310b and the second circuit board 320b. Non-high-frequency signals can be transmitted along the first circuit board 310b to the surface of the second circuit board 320b.

[0308] In some embodiments, a sixth pad region 324 b is formed on the surface of the first arm surface 3211 b , and a surface of the optical modulation chip 440 is connected to the surface of the sixth pad region 324 b by wire bonding to input a non-high frequency signal to the optical modulation chip 440 .

[0309] In some embodiments, a seventh pad region 325 b is formed on the surface of the second arm surface 3212 b , and a surface of the optical modulation chip 440 is connected to the surface of the seventh pad region 325 b by wire bonding to input a non-high frequency signal to the optical modulation chip 440 .

[0310] In some embodiments, an eighth pad region 326b is formed on the surface of the second arm surface 3212b. The eighth pad region 326b is located on one side of the seventh pad region 325b. The surface of the laser 410 is electrically connected to the surface of the eighth pad region 326b to input a non-high frequency signal into the laser 410.

[0311] Figure 22 Another structural decomposition of an optical module according to some embodiments Figure 2 , Figure 23a A partial cross-section of another internal structure of an optical module according to some embodiments Figure 1, Figure 23b A partial cross-section of another internal structure of an optical module according to some embodiments Figure 2 .like Figure 22 、 Figure 23a and Figure 23b As shown, in some embodiments, the fixing plate 900 supports the first circuit board 310 b and the second circuit board 320 b from below at the same time.

[0312] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310 b , and the other end is located below the second circuit board 320 b .

[0313] In some embodiments, the fifth pad area 323b is bonded to the fourth pad area 313b to achieve electrical connection between the first circuit board 310b and the second circuit board 320b. The bonding wire between the fifth pad area 323b and the fourth pad area 313b is located below the first fiber support portion 513. The first fiber support portion 513 is located a certain distance from the surface of the first circuit board 310b or the second circuit board 320b, thereby providing space for bonding wire routing.

[0314] In some embodiments, two opposite sides of the optical modulation chip 440 are respectively bonded to the surface of the second circuit board 320b to increase the non-high frequency signal wiring space of the optical modulation chip 440 to meet the non-high frequency signal transmission requirements of the optical modulation chip 440.

[0315] Figure 24a FIG1 is an assembly diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 24b FIG1 is a cross-sectional view of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 24a 、 Figure 24b As shown, in some embodiments, the surface of the lower housing 202 is raised upward to form a raised portion 2023. The raised portion 2023 is raised toward the upper housing 201. The raised portion 2023 is located within the third avoidance notch 321b and on one side of the fixing plate 900. Exemplarily, the raised portion 2023 is located on one side of the laser 410.

[0316] In some embodiments, the heat generated by the laser 410 is transferred downward to the fixing plate 900. The fixing plate 900 then transfers the heat downward to the lower housing 202. The raised portion 2023 on the surface of the lower housing 202 then transfers the heat upward to the upper housing 201. A heat dissipation duct is formed between the upper housing 201 and the cage 106 of the host computer 100, achieving improved heat dissipation efficiency.

[0317] Figure 25 Another internal structure of an optical module according to some embodiments Figure 1 , Figure 26Another structural decomposition of an optical module according to some embodiments Figure 1 .like Figure 25 and 26 As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400 .

[0318] In some embodiments, the optical module may include a first circuit board 310a. A gold finger 301 is provided on one end surface of the first circuit board 310a. The first circuit board 310a is used to transmit high-frequency signals and non-high-frequency signals.

[0319] In some embodiments, the optical module may include a second circuit board 320a. The second circuit board 320a is used to transmit non-high-frequency signals. The second circuit board 320a is connected to the first circuit board 310a end-to-end. Wires are bonded at the end-to-end connection to achieve electrical connection between the two.

[0320] In some embodiments, the dielectric constant of the first circuit board 310 a is lower than the dielectric constant of the second circuit board 320 a to support the transmission of high-frequency signals.

[0321] In some embodiments, the first circuit board 310a and the second circuit board 320a are respectively fixed to the surface of the fixing plate 900. The fixing plate 900 is located below the first circuit board 310a and the second circuit board 320a to support the first circuit board 310a and the second circuit board 320a at the same time.

[0322] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900. The heat generated by the light emitting component 400 is conducted through the fixing plate 900.

[0323] In some embodiments, a gold finger 301 is provided on one end of the first circuit board 310a, and a second clearance notch 311a is formed on the other end to clear the light emitting component 400 on the surface of the fixing plate 900. For example, the first circuit board 310a is L-shaped, and the second circuit board 302a is regular in shape. The second clearance notch 311a is formed on the side of the first circuit board 310a.

[0324] In some embodiments, since the second avoidance gap 311 a is formed on the surface of the first circuit board 310 a , the size of the fixing plate 900 below the first circuit board 310 a is larger than the size of the fixing plate 900 below the second circuit board 320 a .

[0325] In some embodiments, the light receiving component 500 is located on the surface of the first circuit board 310a. For example, the light receiving component 500 is located on one side of the second avoidance gap 311a.

[0326] In some embodiments, the end of the first circuit board 310a is electrically connected to the end of the second circuit board 320a by bonding, so that the non-high frequency signal is transmitted along the first circuit board 310a to the surface of the second circuit board 320a.

[0327] In some embodiments, the bonding wire between the first and second circuit boards 310a, 320a is located below the optical fiber 513 in the deflector 510. The optical fiber 513 exits and passes over the bonding wire between the first and second circuit boards 310a, 320a, until it reaches the surface of the second circuit board 320a. The optical fiber 513 in the deflector 510 is located a certain distance from the surface of the circuit board 300, providing space for routing the bonding wire between the first and second circuit boards 310a, 320a.

[0328] In some embodiments, the surface of the laser 410 is connected to the surface of the first circuit board 310a by bonding wires to achieve electrical connection between the two. In some embodiments, the surface of the laser 410 can also be connected to the surface of the second circuit board 320a by bonding wires to achieve electrical connection between the two. For example, a shorter bonding wire length can be selected to achieve electrical connection of the laser 410.

[0329] In some embodiments, two adjacent sides of the optical modulation chip 440 are respectively connected to the surface of the first circuit board 310a by wire bonding to achieve electrical connection between the optical modulation chip 440 and the first circuit board 310a. Of the two adjacent sides, one side is electrically connected to the first circuit board 310a by wire bonding to input high-frequency signals to the optical modulation chip 440 through the first circuit board 310a; the other side is electrically connected to the first circuit board 310a by wire bonding to input non-high-frequency signals to the optical modulation chip 440 through the first circuit board 310a.

[0330] Figure 27 FIG1 is an exploded view of a first circuit board and a second circuit board according to some embodiments. Figure 27 As shown, in some embodiments, the first circuit board 310a and the second circuit board 320a are connected end-to-end.

[0331] In some embodiments, a gold finger 301 is provided on one end surface of the first circuit board 310a, and a second avoidance gap 311a is formed on the other end. The first circuit board 310a is L-shaped, and the second circuit board 302a is regular in shape.

[0332] In some embodiments, a first solder pad area 312a is formed on a first surface of an end portion of the first circuit board 310a. The first solder pad area 312a is used to electrically connect to the second circuit board 320a.

[0333] In some embodiments, a second solder pad area 315a and a third solder pad area 314a are formed on the second end surface of the first circuit board 310a. The second solder pad area 315a is used to electrically connect to the laser 410. The third solder pad area 314a is used to electrically connect to the optical modulation chip 440 to input a non-high-frequency signal to the optical modulation chip 440. The second end surface of the first circuit board 310a is located adjacent to the first end surface of the first circuit board 310a.

[0334] In some embodiments, a fourth solder pad area 313a is formed on the third surface of the end portion of the first circuit board 310a. The fourth solder pad area 313a is used to electrically connect to the optical modulation chip 440 to input high-frequency signals to the optical modulation chip 440. The third surface of the end portion of the first circuit board 310a is located adjacent to the second surface of the end portion of the first circuit board 310a. The surface of the optical modulation chip 440 is flush with the surface of the first circuit board 310a, shortening the bonding length between the two and improving high-frequency signal transmission performance between the two.

[0335] In some embodiments, a fifth pad area 321a is formed on the end surface of the second circuit board 320a. Wire bonding is performed between the fifth pad area 321a and the first pad area 312a to electrically connect the second circuit board 320a to the first circuit board 310a, allowing non-high-frequency signals to be transmitted from the surface of the first circuit board 310a to the surface of the second circuit board 320a.

[0336] Figure 28 Another internal structure of an optical module according to some embodiments Figure 2 , Figure 29 Another structural decomposition of an optical module according to some embodiments Figure 2 .like Figure 28 and 29 As shown, in some embodiments, the fixing plate 900 supports the first circuit board 310 a and the second circuit board 320 a at the same time.

[0337] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900, and the light receiving component 500 is located on the surface of the first circuit board 310a. The light receiving component 500 is located to one side of the light emitting component 400. A second avoidance notch 311a is formed on the surface of the first circuit board 310a to avoid the light emitting component 400, and the light receiving component 500 is located to one side of the second avoidance notch 311a.

[0338] In some embodiments, the bonding wires between the first circuit board 310a and the second circuit board 320a are located below the optical fiber 513 of the light deflector 510. The optical fiber 513 is at a certain distance from the surface of the circuit board 300, providing space for the bonding wires between the first circuit board 310a and the second circuit board 320a.

[0339] In some embodiments, a second avoidance gap 311 a is formed on the surface of the first circuit board 310 a , and the size of the fixing plate 900 below the first circuit board 310 a is larger than the size of the fixing plate 900 below the second circuit board 320 a .

[0340] Figure 30 FIG. 1 is another cross-sectional structural diagram of an optical module according to some embodiments. Figure 31 A partial enlargement of another cross-section of the interior of an optical module according to some embodiments Figure 1 , Figure 32 A partial enlargement of another cross-section of the interior of an optical module according to some embodiments Figure 2 .like Figure 30-32 As shown, in some embodiments, the fixing plate 900 supports both the first circuit board 310a and the second circuit board 320a. The first circuit board 310a and the second circuit board 320a are fixed to the surface of the fixing plate 900 respectively.

[0341] In some embodiments, the optical fiber of the refracting element 510 has a height difference with the surface of the first circuit board 310a or the second circuit board 320a, and the bonding wire between the first circuit board 310a and the second circuit board 320a can be located below the optical fiber, that is, in the space between the optical fiber and the first circuit board 310a or the second circuit board 320a.

[0342] In some embodiments, a second avoidance notch 311a is formed at one end of the first circuit board 310a to avoid the light emitting component 400. A surface of the first circuit board 310a on the side of the second avoidance notch 311a is located on the surface of the fixing plate 900.

[0343] In some embodiments, one end of the fixing plate 900 extends beyond one side of the second avoidance gap 311 a to be located below the first circuit board 310 a , and the other end extends beyond the other side of the second avoidance gap 311 a to be located below the second circuit board 320 a .

[0344] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310a, and the other end is located below the second circuit board 320a. The middle area of ​​the fixing plate 900 is used to support the light emitting component 400 and the first circuit board 310a.

[0345] In some embodiments, the optical fiber array 450 is positioned adjacent to the second circuit board 320a, with the fibers exiting the optical fiber array 450 extending along the surface of the second circuit board 320a. The optical modulation chip 440 is positioned adjacent to the first circuit board 310a, with the surface of the optical modulation chip 440 flush with the surface of the first circuit board 310a. This shortens the bonding length between the optical modulation chip 440 and the first circuit board 310a, thereby improving high-frequency signal transmission performance between the two.

[0346] In some embodiments, the second relief notch 311a is configured such that the surface on which the deflector 510 is disposed extends relative to the surface, forming a protruding plate 316a. Protruding plate 316a is located on one side of the second relief notch 311a. A first solder pad region 312a is located on the surface of protruding plate 316a. The surface of protruding plate 316a is bonded to the surface of the second circuit board 320a to electrically connect the second circuit board 320a to the first circuit board 310a.

[0347] In some embodiments, the deflecting element 510 is located on the surface of the protruding plate 316 a.

[0348] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310a, and the other end is located below the second circuit board 320a. The middle area of ​​the fixing plate 900 is used to support the light emitting component 400 and the extended plate 316a.

[0349] Figure 33 Another internal structure of an optical module according to some embodiments Figure 3 , Figure 34 Another structural decomposition of an optical module according to some embodiments Figure 3 , Figure 35a This is a partially enlarged view of another form of the interior of an optical module according to some embodiments. Figure 33 、 Figure 34 and Figure 35a As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400 .

[0350] In some embodiments, the optical module may include a first circuit board 310a and a second circuit board 320a. A gold finger 301 is provided on one end surface of the first circuit board 310a. The first circuit board 310a is used to transmit high-frequency signals and non-high-frequency signals. The second circuit board 320a is used to transmit non-high-frequency signals. The second circuit board 320a is connected to the first circuit board 310a end-to-end, and the two are wired at the end-to-end connection to achieve electrical connection between the two. The dielectric constant of the first circuit board 310a is lower than the dielectric constant of the second circuit board 320a to support the transmission of high-frequency signals.

[0351] In some embodiments, a second avoidance notch 311a is formed at one end of the first circuit board 310a to avoid the light emitting component 400. The second avoidance notch 311a causes the surface where the deflecting element 510 is disposed to protrude relative to form a protruding plate 316a.

[0352] In some embodiments, the optical module may include a fixing plate 900a. The fixing plate 900a is used to support the first circuit board 310a and the second circuit board 320a. The fixing plate 900a is located below the first circuit board 310a and the second circuit board 320a. The first circuit board 310a and the second circuit board 320a are respectively fixed to the surface of the fixing plate 900a.

[0353] In some embodiments, the fixing plate 900a may include a body plate 910a. The first area of ​​the body plate 910a is used to support the light emitting component, and the second area is used to support the first circuit board 310a. Exemplarily, the extension plate 316a is located on the surface of the second area of ​​the body plate 910a.

[0354] In some embodiments, the fixing plate 900a may include an extension plate 920a. The extension plate 920a extends relative to the main plate 910a toward the second circuit board 320a to support the second circuit board 320a. Exemplarily, the fixing plate 900a is L-shaped.

[0355] In some embodiments, the first circuit board 310a is located at one end of the main board 910a, and the second circuit board 320a is located at one end of the extension board 920a. The bonding wires between the first circuit board 310a and the second circuit board 320a are located on the surface of the extension board 920a.

[0356] In some embodiments, the optical fiber array 450 is located on the surface of the main plate 910a. The optical fiber ribbons of the optical fiber array 450 extend along the main plate 910a toward the second circuit board 320a. The sidewalls of the main plate 910a are a certain distance from the sidewalls of the second circuit board 320a. This sidewall of the main plate 910a does not extend below the second circuit board 320a, and the optical fiber ribbons in the optical fiber array 450 are suspended in the air within this distance. Therefore, when the optical fiber ribbons in the optical fiber array 450 are lifted upward to allow the optical fibers to fall horizontally and cushioned onto the surface of the second circuit board 320a, a bending space is provided for the optical fiber ribbons. The optical fibers are not stressed within this bending space, thereby preventing fiber breakage.

[0357] In some embodiments, the fixing plate 900a may include a notch 930a. The notch 930a is located on one side of the extension plate 920a. The optical fiber ribbons in the optical fiber array 450 pass over the notch 930a, providing a bending space for the optical fiber ribbons. The bending space frees the optical fibers from stress, thereby preventing fiber breakage.

[0358] In some embodiments, the sidewalls of the body plate 910a do not extend below the second circuit board 320a to provide downward bending space for the optical fiber ribbon. The extension plate 920a extends below the second circuit board 320a to support the second circuit board 320a.

[0359] In some embodiments, the fixing plate 900a includes an L-shaped notch 930a, thereby providing bending space for the optical fiber ribbon while also supporting the second circuit board 320a. For example, the second relief notch 311a is further away from the second circuit board 300a than the notch 930a, and the light emitting component 400 is located between the second relief notch 311a and the notch 930a.

[0360] Figure 35b FIG1 is a schematic diagram of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 35b As shown, in some embodiments, a second avoidance gap 311 a is formed at one end of the first circuit board 310 a to avoid the light emitting component 400 .

[0361] In some embodiments, the surface of the lower housing 202 is raised upward to form a raised portion 2023. The raised portion 2023 is raised toward the upper housing 201. The raised portion 2023 is located on one side of the fixing plate 900. For example, the raised portion 2023 is located on one side of the laser 410 and is located within the first avoidance gap 321.

[0362] In some embodiments, the second avoidance gap 311 a is farther away from the second circuit board 300 a than the gap portion 930 a , and a space is left from the gap portion 930 a toward the sidewall of the first circuit board 310 a to the second circuit board 320 a to avoid the protrusion 2023 .

[0363] In some embodiments, the fixing plate 900a is thermally connected to the lower housing 202. For example, the space between the bottom surface of the fixing plate 900a and the lower housing 202 is filled with thermally conductive gel.

[0364] In some embodiments, the protrusion 2023 is thermally connected to the upper housing 201. For example, the space between the surface of the protrusion 2023 and the upper housing 201 is filled with thermally conductive gel.

[0365] In some embodiments, the heat generated by the laser 410 is transferred downward to the fixing plate 900a. The fixing plate 900a then transfers the heat downward to the lower housing 202. The raised portion 2023 on the surface of the lower housing 202 then transfers the heat upward to the upper housing 201. A heat dissipation duct is formed between the upper housing 201 and the cage 106 of the host computer 100, improving heat dissipation efficiency.

[0366] Figure 36 Another internal structure of an optical module according to some embodiments Figure 4 , Figure 37 Another structural decomposition of an optical module according to some embodiments Figure 4 .like Figure 36 and Figure 37As shown, in some embodiments, different optical modulation chip 440 models have different requirements for non-high-frequency signals. To meet the optical modulation chip 440's requirements for non-high-frequency signals, a second relief notch is formed at different locations on the surface of the first circuit board 310a. For example, the second relief notch is formed in the middle of the first circuit board 310a. To distinguish the first circuit board 310a, the first circuit board is now referred to as the first circuit board 310c, and the second circuit board is correspondingly referred to as the second circuit board 320c.

[0367] In some embodiments, a fourth avoidance gap 311 c is formed on the surface of the first circuit board 310 c to avoid the light emitting component 400 .

[0368] In some embodiments, the first circuit board 310c may include a third arm surface 312c located on one side of the fourth avoidance gap 311c.

[0369] In some embodiments, the first circuit board 310c may include a fourth arm surface 313c located on the other side of the fourth avoidance gap 311c.

[0370] In some embodiments, the fourth avoidance gap 311c is located between the third arm surface 312c and the fourth arm surface 313c, and the light emitting component 400 is located between the third arm surface 312c and the fourth arm surface 313c. Exemplarily, the fourth avoidance gap 311c is configured as a U-shaped opening.

[0371] In some embodiments, a first pad area 314c is formed on the surface of the first circuit board 310c. The surface of the optical modulation chip 440 is wire-bonded to the first pad area 314c to input a high-frequency signal to the optical modulation chip 440 through the first circuit board 310c.

[0372] In some embodiments, a second pad area 3121c is formed on the surface of the third arm surface 312c. The surface of the optical modulation chip 440 is wire-bonded to the second pad area 3121c to input a non-high frequency signal to the optical modulation chip 440 through the first circuit board 310c.

[0373] In some embodiments, a third pad area 3131c is formed on the surface of the fourth arm surface 313c. The surface of the optical modulation chip 440 is wire-bonded to the third pad area 3131c to input non-high-frequency signals to the optical modulation chip 440 through the first circuit board 310c. This increases the wiring space for the non-high-frequency signals of the optical modulation chip 440 and meets the non-high-frequency signal transmission requirements of the optical modulation chip 440.

[0374] In some embodiments, the width of the fourth arm surface 313 c is greater than the width of the third arm surface 312 c , so that a refraction member 510 is disposed on the surface of the fourth arm surface 313 c .

[0375] Figure 38a FIG1 is a diagram illustrating an assembly structure of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 38b This is a partially enlarged cross-sectional view of the assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 38a and Figure 38b As shown, in some embodiments, a third support arm surface 312c and a fourth support arm surface 313c are provided on either side of the fourth avoidance notch 311c. The optical modulation chip 440 can be bonded to the third support arm surface 312c and the fourth support arm surface 313c, respectively, thereby increasing the number of bonding wires on the optical modulation chip 440 and meeting the signal transmission requirements of the optical modulation chip 440.

[0376] In some embodiments, the surface of the lower housing 202 is raised upward to form a raised portion 2023. The raised portion 2023 protrudes toward the upper housing 201. The raised portion 2023 is located on one side of the fixing plate 900. For example, the raised portion 2023 is located on one side of the laser 410 and within the fourth avoidance notch 311c. The ends of the third arm surface 312c and the fourth arm surface 313c extend toward the second circuit board 320c to electrically connect to the second circuit board 320c.

[0377] In some embodiments, a space is left between the end of the fixing plate 900 and the side wall of the second circuit board 320 c so that the fourth avoidance gap 311 c can avoid both the light emitting component 400 and the protrusion 2023 .

[0378] In some embodiments, the fixing plate 900 is thermally connected to the lower housing 202. For example, the space between the bottom surface of the fixing plate 900 and the lower housing 202 is filled with thermally conductive gel.

[0379] In some embodiments, the protrusion 2023 is thermally connected to the upper housing 201. For example, the space between the surface of the protrusion 2023 and the upper housing 201 is filled with thermally conductive gel.

[0380] In some embodiments, the heat generated by the laser 410 is transferred downward to the fixing plate 900. The fixing plate 900 then transfers the heat downward to the lower housing 202. The raised portion 2023 on the surface of the lower housing 202 then transfers the heat upward to the upper housing 201. A heat dissipation duct is formed between the upper housing 201 and the cage 106 of the host computer 100, achieving improved heat dissipation efficiency.

[0381] In some embodiments, the third arm surface 312 c and the fourth arm surface 313 c extend respectively over the fixing plate 900 toward the second circuit board 320 c and establish electrical connections with the second circuit board 320 c .

[0382] Figure 39aAssembling a cross section of a protective cover according to some embodiments Figure 1 .like Figure 39a As shown, in some embodiments, a protective cover 400a is formed on the surface of the light emitting component 400 to protect the light emitting component 400 from damage. At the light emitting end of the light emitting component 400, the protective cover 400a has an opening 401, which is formed on the surface of the isolator 430 to expose the light emitting surface of the isolator 430 and avoid light blocking. The light output by the isolator 430 is then transmitted to the optical modulation chip 440.

[0383] In some embodiments, the top surface of the protective cover 400 a overlaps the surface of the second circuit board 320 , and the bottom is fixed to the surface of the fixing plate 900 , thereby fixing the protective cover 400 a .

[0384] In some embodiments, the protective cover 400 a and the fixing plate 900 form a housing cavity, and the laser 410 , the lens 420 , and the isolator 430 are located in the housing cavity.

[0385] Figure 39b Assembling a cross section of a protective cover according to some embodiments Figure 2 .like Figure 39b As shown, in some embodiments, an opening 401 is formed at one end of the protective cover 400a to expose the light-emitting surface of the isolator 430 to avoid light blocking, so that the light output by the isolator 430 is transmitted to the optical modulation chip 440. In some embodiments, the other end of the protective cover 400a is sealed to provide sealed protection for the laser 410, lens 420, and isolator 430.

[0386] Figure 40 FIG. 1 is a diagram showing the internal structure of an optical modulation chip according to some embodiments. Figure 40 As shown, in some embodiments, the optical modulation chip 440 includes three input optical ports, which are compatible with lasers 410 with different output optical powers. In some embodiments, the optical input end and the optical output end of the optical modulation chip 440 are located on the same side.

[0387] In some embodiments, the optical input end of the optical modulation chip 440 includes a first optical input port 441 a , a second optical input port 441 b , and a third optical input port 441 c .

[0388] In some embodiments, the optical output end of the optical modulation chip 440 includes a first optical output port 442 a , a second optical output port 442 b , a third optical output port 442 c , and a fourth optical output port 442 d , which face the optical fiber array 450 .

[0389] In some embodiments, the first input light port 441 a , the second input light port 441 b , and the third input light port 441 c are respectively directed toward the laser 410 .

[0390] In some embodiments, when the optical power output of the laser 410 is higher than a preset value, the laser 410 can output four optical signals, and the laser 410 outputs light toward the second optical input port 441b. In some embodiments, when the optical power output of the laser 410 is not higher than the preset value, two lasers 410 are provided, one of which outputs light toward the first optical input port 441a, and the other outputs light toward the third optical input port 441c.

[0391] In some embodiments, the optical modulation chip 440 may include a first optical splitter 443a. The first optical splitter 443a is located on the optical path output from the second optical input port 441b. The first optical splitter 443a includes an optical input port, a first optical output port, and a second optical output port, wherein the optical input port is optically connected to the second optical input port 441b. For example, the first optical splitter 443a may be a 1×2 multimode interference coupler.

[0392] In some embodiments, the optical modulation chip 440 may include a second optical splitter 443b. The second optical splitter 443b includes two optical input ports and two optical output ports. One optical input port is optically connected to the third optical input port 441c, and the other optical input port is optically connected to the first optical output port of the first optical splitter 443a. For example, the second optical splitter 443b may be a 2×2 multimode interference coupler.

[0393] In some embodiments, the optical modulation chip 440 may include a third optical splitter 443c. The third optical splitter 443c includes two optical input ports and two optical output ports. One optical input port is optically connected to the first optical input port 441a, and the other optical input port is optically connected to the second optical output port of the first optical splitter 443a. For example, the third optical splitter 443c may be a 2×2 multimode interference coupler.

[0394] In some embodiments, when the output optical power of the laser 410 is higher than a preset value, the laser 410 emits light toward the second optical input port 441b, and the light output from the laser 410 is coupled into the optical modulation chip 440. Within the optical modulation chip 440, the light output from the laser 410 is split into a first light beam and a second light beam by a first beam splitter 443a.

[0395] In some embodiments, a first light output port of the first beam splitter 443a is optically connected to a light input port of the second beam splitter 443b. The first light beam is coupled along the first light output port of the first beam splitter 443a into the second beam splitter 443b. The second beam splitter 443b splits the first light beam into a first light beam and a second light beam, which are outputted through the two light output ports, respectively.

[0396] In some embodiments, the second light output port of the first beam splitter 443a is optically connected to an light input port of the third beam splitter 443c. The second light beam is coupled along the second light output port of the first beam splitter 443a into the third beam splitter 443c. The third beam splitter 443c splits the second light beam into a third beam split and a fourth beam split, which are output through the two light output ports, respectively. Thus, the light emitted by the laser 410 is split twice into four paths.

[0397] In some embodiments, when the optical power output by the laser 410 is not higher than a preset value, two lasers 410 are respectively provided, wherein one laser 410 outputs light toward the first optical input port 441a and the other laser 410 outputs light toward the third optical input port 441c.

[0398] In some embodiments, light output by one laser 410 is input into the optical modulation chip 440 along the first optical input port 441 a , and light output by another laser 410 is input into the optical modulation chip 440 along the third optical input port 441 c .

[0399] In some embodiments, the third optical input port 441c is optically connected to an optical input port of the second optical splitter 443b, so that light output from a laser 410 is coupled into the second optical splitter 443b. The second optical splitter 443b splits the light output from the laser 410 into a first beam and a second beam.

[0400] In some embodiments, the first optical input port 441a is optically connected to an optical input port of the third optical splitter 443c, and the light output from the other laser 410 is coupled into the third optical splitter 443c. The third optical splitter 443c splits the light output from the laser 410 into a third optical split and a fourth optical split. Thus, the light emitted by the laser 410 is split twice into four paths.

[0401] In some embodiments, light is split on the outgoing optical path of the first optical splitter 443a to monitor the input optical power. The splitting ratio may be 1%-2%.

[0402] In some embodiments, when monitoring the incident optical power, light splitting may be performed on the outgoing optical paths of the first optical splitter 443 a and the second optical splitter 443 b to avoid light saturation.

[0403] In some embodiments, the optical modulation chip 440 may include a first Mach-Zehnder Interferometer (MZ) modulator 444a. The first MZ modulator 444a is located on the output optical path of the first split light to perform signal modulation on the first split light to generate a first optical signal. The MZ modulator modulates the phase by changing the refractive index of the material, and then indirectly realizes the intensity modulation of the light by using the principle of constructive interference and destructive interference of light. Compared with electro-absorption modulators (EAM) and electro-absorption modulated lasers (EML), the MZ modulator has a higher modulation rate and modulation efficiency.

[0404] In some embodiments, the optical modulation chip 440 may include a second MZ modulator 444b. The second MZ modulator 444b is located on an output optical path of the second split light to perform signal modulation on the second split light to generate a second optical signal.

[0405] In some embodiments, the optical modulation chip 440 may include a third MZ modulator 444c. The third MZ modulator 444c is located on an output optical path of the third split light to perform signal modulation on the third split light to generate a third optical signal.

[0406] In some embodiments, the optical modulation chip 440 may include a fourth MZ modulator 444d. The fourth MZ modulator 444d is located on the output optical path of the fourth split light to perform signal modulation on the fourth split light to generate a fourth optical signal.

[0407] In some embodiments, the incident light of the first MZ modulator 444a is divided into two paths by the first demultiplexer 445a, and phase modulation is performed on one of the paths or both paths at the same time, so that a phase difference is generated between the two paths of light, thereby realizing intensity modulation of the light. The two optical signals generated after modulation are output through the first interferometer 446a, and the first optical signal is generated through interference.

[0408] In some embodiments, the incident light of the second MZ modulator 444b is divided into two paths by the second splitter 445b, and phase modulation is performed on one of the paths or both paths at the same time, so that a phase difference is generated between the two paths of light, thereby realizing intensity modulation of the light. The two optical signals generated after modulation are output through the second interferometer 446b, and a second optical signal is generated through interference.

[0409] In some embodiments, the incident light of the third MZ modulator 444c is divided into two paths through the third splitter 445c, and phase modulation is performed on one of the paths or both paths at the same time to generate a phase difference between the two paths of light, thereby achieving intensity modulation of the light. The two optical signals generated after modulation are output through the third interferometer 446c, and a third optical signal is generated through interference.

[0410] In some embodiments, the incident light of the fourth MZ modulator 444d is divided into two paths by the fourth splitter 445d, and phase modulation is performed on one of the paths or both paths at the same time, so that a phase difference is generated between the two paths of light, thereby achieving intensity modulation of the light. The two optical signals generated after modulation are output through the fourth interferometer 446d, and a fourth optical signal is generated through interference.

[0411] In some embodiments, the first optical signal is output from the optical modulation chip 440 via the first optical output port 442a. The second optical signal is output from the optical modulation chip 440 via the second optical output port 442b. The third optical signal is output from the optical modulation chip 440 via the third optical output port 442c. The fourth optical signal is output from the optical modulation chip via the fourth optical output port 442d.

[0412] In some embodiments, the output optical path of the first interferometer 446a is split to monitor the output optical power of the first optical signal. Similarly, the output optical path of the second interferometer 446b is split to monitor the output optical power of the second optical signal. The output optical path of the third interferometer 446c is split to monitor the output optical power of the third optical signal. The output optical path of the fourth interferometer 446d is split to monitor the output optical power of the fourth optical signal.

[0413] In some embodiments, the optical modulation chip 440 may include a first heater 447a. The first heater 447a is provided on the first interferometer arm or the second interferometer arm of the first MZ modulator 444a to heat the first interferometer arm or the second interferometer arm, thereby changing the phase of the first interferometer arm or the second interferometer arm, and thereby adjusting the phase difference between the first interferometer arm and the second interferometer arm. When the first interferometer arm and the second interferometer arm have a phase difference of π / 2, the operating state of the first MZ modulator 444a is at an optimal operating point.

[0414] In some embodiments, the optical modulation chip 440 may include a second heater 447b disposed on the first interferometer arm or the second interferometer arm of the second MZ modulator 444b to heat the first interferometer arm or the second interferometer arm and thereby adjust the phase difference between the first interferometer arm and the second interferometer arm.

[0415] In some embodiments, the optical modulation chip 440 may include a third heater 447c disposed on the first interferometer arm or the second interferometer arm of the third MZ modulator 444c to heat the first interferometer arm or the second interferometer arm and thereby adjust the phase difference between the first interferometer arm and the second interferometer arm.

[0416] In some embodiments, the optical modulation chip 440 may include a fourth heater 447d disposed on the first interferometer arm or the second interferometer arm of the fourth MZ modulator 444d to heat the first interferometer arm or the second interferometer arm to adjust the phase difference between the first interferometer arm and the second interferometer arm.

[0417] In some embodiments, a fault may occur in the optical fiber link of the optical modulation chip 440, and the fault needs to be diagnosed to identify the fault. For example, in the loopback mode, the optical path is looped back to perform fault diagnosis and identification.

[0418] In some embodiments, the first wave splitter 445a includes two input light paths, one of which is used for phase modulation processing, and the other is coupled to the first grating coupler 448a. The first grating coupler 448a is optically connected to an external light source.

[0419] In some embodiments, the first interferometer 446a includes two outgoing light paths, one of which is used to output the first optical signal, and the other is coupled to the second grating coupler 448b.

[0420] In some embodiments, the optical power difference between the first grating coupler 448a and the second grating coupler 448b is compared to determine the bit error rate, thereby performing fault diagnosis and identification on the first split optical transmission link. For example, when the optical power difference between the first grating coupler 448a and the second grating coupler 448b exceeds a preset range, it can be considered that the transmission link may have a fault.

[0421] In some embodiments, similarly, one input light channel of the second splitter 445b is coupled to the third grating coupler 448c, and one output light channel of the second interferometer 446b is coupled to the fourth grating coupler 448d. By comparing the optical power difference between the third grating coupler 448c and the fourth grating coupler 448d, the bit error rate is obtained, thereby performing fault diagnosis and identification on the second split optical transmission link.

[0422] In some embodiments, similarly, one input light channel of the third splitter 445c is coupled to the fifth grating coupler 448e, and one output light channel of the third interferometer 446c is coupled to the sixth grating coupler 448f. By comparing the optical power difference between the fifth grating coupler 448e and the sixth grating coupler 448f, a bit error rate is obtained, thereby performing fault diagnosis and identification on the third splitting transmission link.

[0423] In some embodiments, similarly, one input optical channel of the fourth splitter 445d is coupled to the seventh grating coupler 448g, and one output optical channel of the fourth interferometer 446d is coupled to the eighth grating coupler 448h. By comparing the optical power difference between the seventh grating coupler 448g and the eighth grating coupler 448h, a bit error rate is obtained, thereby performing fault diagnosis and identification on the fourth splitting transmission link.

[0424] In some embodiments, the first wave splitter 445a, the second wave splitter 445b, the third wave splitter 445c, and the fourth wave splitter 445d are each a 2×2 multimode interference coupler. The first interferometer 446a, the second interferometer 446b, the third interferometer 446c, and the fourth interferometer 446d are each a 2×2 multimode interference coupler.

[0425] In some embodiments, optical modulation chip 440 may include a first optical loop interface 449a and a second optical loop interface 449b. An optical waveguide is connected between first optical loop interface 449a and second optical loop interface 449b, forming a U-shaped optical loop. Light is input into optical modulation chip 440 along first optical loop interface 449a and output from optical modulation chip 440 along second optical loop interface 449b.

[0426] In some embodiments, the first optical loop interface 449a and the second optical loop interface 449b are located at optical ports of the optical modulation chip 440. The first optical loop interface 449a is coupled to an external light source. Light output from the external light source is input into the optical modulation chip 440 along the first optical loop interface 449a and output from the optical modulation chip 440 along the second optical loop interface 449b.

[0427] In some embodiments, the optical power difference between the first optical loop interface 449a and the second optical loop interface 449b is compared to determine the bit error rate, thereby performing fault diagnosis and identification on the optical interface of the optical modulation chip 440. For example, when the optical power difference between the first optical loop interface 449a and the second optical loop interface 449b exceeds a preset range, it can be considered that the optical interface may have a fault.

[0428] Figure 41 FIG. 1 is a diagram showing the internal structure of another optical modulation chip according to some embodiments. Figure 41As shown, in some embodiments, the optical modulation chip 440 includes an input optical port to support a laser 410 with a relatively high optical output power to output four optical modulation signals.

[0429] In some embodiments, the optical input and output ends of optical modulation chip 440 are located on the same side. The optical input end of optical modulation chip 440 includes an input optical port 441. Light emitted by laser 414 is coupled into optical modulation chip 440 through input optical port 441. Exemplarily, input optical port 441 faces isolator 430 to receive light output from isolator 430.

[0430] In some embodiments, the optical output end of the optical modulation chip 440 includes a first optical output port 442 a , a second optical output port 442 b , a third optical output port 442 c , and a fourth optical output port 442 d , which face the optical fiber array 450 .

[0431] In some embodiments, the optical modulation chip 440 may include a first optical splitter 443a. The first optical splitter 443a is located on the optical path of the input optical port 441 to split the light output from the input optical port 441 into a first light beam and a second light beam. Exemplarily, the first optical splitter 443a is a 1×2 multimode interference coupler.

[0432] In some embodiments, the optical modulation chip 440 may include a second optical splitter 443b. The second optical splitter 443b is located on the transmission optical path of the first light beam to split the first light beam into a first beam and a second beam. Exemplarily, the second optical splitter 443b is a 1×2 multimode interference coupler.

[0433] In some embodiments, optical modulation chip 440 may include a third beam splitter 443c. Third beam splitter 443c is located in the transmission path of the second light beam to split the second light beam into a third beam split and a fourth beam split. Thus, the light emitted by laser 410 is split twice into four paths. Exemplarily, third beam splitter 443c is a 1×2 multimode interference coupler.

[0434] In some embodiments, the subsequent processing can refer to the attached Figure 41 The relevant introduction of will not be elaborated on here.

[0435] Figure 42 FIG. 1 is a schematic diagram of an electrical connection structure between an optical modulation chip and a first circuit board according to some embodiments. Figure 42 As shown, in some embodiments, the optical modulation chip 440 is connected to the first circuit board 310 by wire bonding, so as to input a driving signal to the optical modulation chip 440 through the first circuit board 310, thereby driving the optical modulation chip 440 to perform signal modulation.

[0436] In some embodiments, the high-frequency signal pad area of ​​the optical modulated signal 440 and the first circuit board 310 use a G (GND) S (Signal) SG pad method to prevent crosstalk between different channels.

[0437] In some embodiments, a first ground pad 4401 , a first signal pad 4402 , a second signal pad 4403 , and a second ground pad 4404 are formed on the surface of the optical modulation chip 440 .

[0438] In some embodiments, a first ground pad 317 , a first high-frequency signal pad 318 a , a second high-frequency signal pad 318 b , and a second ground pad 319 are formed on the surface of the first circuit board 310 .

[0439] In some embodiments, the first ground pad 4401 is connected to the first ground pad 317 by wires, the first signal pad 4402 is connected to the first high-frequency signal pad 318a by wires, the second signal pad 4403 is connected to the second high-frequency signal pad 318b by wires, and the second ground pad 4404 is connected to the second ground pad 319 by wires, thereby realizing a GSSG signal transmission mode and preventing signal crosstalk between different channels.

[0440] In some embodiments, the first signal pad 4402 and the first high-frequency signal pad 318a are electrically connected using a differential signal transmission method, and the second signal pad 4403 and the second high-frequency signal pad 318b are also electrically connected using a differential signal transmission method to increase the optical modulation amplitude of the optical modulation chip 440, thereby increasing the modulation rate and bandwidth of the optical modulation chip 440.

[0441] In some embodiments, a first bonding wire 461 is disposed between the first ground pad 4401 and the first ground pad 317 .

[0442] In some embodiments, a sixth bonding wire 466 is disposed between the second ground pad 4404 and the second ground pad 319 .

[0443] In some embodiments, a second bonding wire 462 and a third bonding wire 463 are disposed between the first signal pad 4402 and the first high-frequency signal pad 318a. The second bonding wire 462 and the third bonding wire 463 form a pair of differential signal transmission lines to increase the optical modulation amplitude.

[0444] In some embodiments, a fourth bonding wire 464 and a fifth bonding wire 465 are disposed between the second signal pad 4403 and the second high-frequency signal pad 318b. The fourth bonding wire 464 and the fifth bonding wire 465 form a pair of differential signal transmission lines to increase the optical modulation amplitude.

[0445] In some embodiments, the second bonding wire 462 and the third bonding wire 463 overlap at the solder joints on the surface of the first high-frequency signal pad 318a, and different solder joints are used on the surface of the first signal pad 4402, thereby reducing parasitic inductance, improving high-frequency performance and preventing crosstalk.

[0446] In some embodiments, the fourth bonding wire 464 and the fifth bonding wire 465 overlap at the solder joints on the second high-frequency signal pad 318b, and different solder joints are used on the second signal pad 4403, thereby reducing parasitic inductance, improving high-frequency performance, and preventing crosstalk.

[0447] In some embodiments, the second bonding wire 462 and the third bonding wire 463 are stacked and bonded on the surface of the optical modulation chip 440 and bonded separately on the surface of the first circuit board 310 , thereby effectively reducing parasitic inductance and improving high-frequency performance.

[0448] Figure 43 Schematic diagram of wiring between an optical modulation chip and a first circuit board according to some embodiments Figure 1 , Figure 44 Schematic diagram of wiring between an optical modulation chip and a first circuit board according to some embodiments Figure 2 , Figure 45 Schematic diagram of wiring between an optical modulation chip and a first circuit board according to some embodiments Figure 3 .like Figures 43-45 As shown, in some embodiments, a second bonding wire 462 and a third bonding wire 463 are disposed between the first signal pad 4402 and the first high-frequency signal pad 318a. The second bonding wire 462 and the third bonding wire 463 form a pair of differential signal transmission lines to increase the optical modulation amplitude.

[0449] In some embodiments, the second bonding wire 462 has a high arc near the surface of the first circuit board 310 and gradually decreases in arc toward the surface of the optical modulation chip 440. In some embodiments, the third bonding wire 463 has a high arc near the surface of the optical modulation chip 440 and gradually decreases in arc toward the surface of the first circuit board 310.

[0450] In some embodiments, the second bonding wire 462 and the third bonding wire 463 are stacked and bonded on the surface of the optical modulation chip 440 and bonded separately on the surface of the first circuit board 310 , thereby effectively reducing parasitic inductance and improving high-frequency performance.

[0451] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, characterized in that: include: A first circuit board has a gold finger provided on one end surface thereof, and the first circuit board is configured to transmit high-frequency signals and non-high-frequency signals; a second circuit board configured to transmit non-high-frequency signals, wherein the dielectric constant of the first circuit board is lower than that of the second circuit board; the second circuit board is electrically connected to the first circuit board so that the non-high-frequency signal output by the gold finger is transmitted along the first circuit board to the second circuit board; and a first avoidance notch is formed on a side surface of the second circuit board; A fixed plate, having the first circuit board disposed on one end of its surface and the second circuit board disposed on the other end thereof, so as to fixedly connect the first circuit board and the second circuit board; A light emitting component is provided on the surface of the fixing plate and is located in the first avoidance gap, and the light emitting component includes: a laser configured to emit light that does not carry a signal and electrically connected to the second circuit board; an optical modulation chip, located in the optical path of the laser output, configured to modulate the light not carrying a signal to generate an optical signal; the optical modulation chip is electrically connected to the first circuit board; an optical fiber array, optically connected to the optical output port of the optical modulation chip to transmit the optical signal modulated by the optical modulation chip; Light receiving component, including: A light receiving chip is located on the surface of the first circuit board; The refracting element has a reflective end surface formed at one end, and the reflective end surface is located above the light receiving chip so that the reflected light signal is incident on the light receiving chip.

2. The optical module according to claim 1, wherein Of the two adjacent sides of the surface of the optical modulation chip, one side is electrically connected to the first circuit board so as to input a high-frequency signal to the optical modulation chip through the first circuit board; and the other side is electrically connected to the second circuit board so as to input a non-high-frequency signal to the optical modulation chip through the second circuit board; The surface of the light modulation chip is flush with the surface of the first circuit board, and the surface of the light modulation chip is flush with the surface of the second circuit board.

3. The optical module according to claim 1, wherein: The light-bending member includes a first optical fiber supporting portion and a second optical fiber supporting portion; The second optical fiber supporting portion is provided on the surface of the second circuit board, and a third soldering pad area is formed on the end surface of the second circuit board to be connected to the surface of the first circuit board by wire bonding; The end portion of the second optical fiber supporting portion does not extend to the surface of the third solder pad area to avoid bonding between the second circuit board and the first circuit board; The first optical fiber supporting portion is located above the second optical fiber supporting portion. The first optical fiber supporting portion extends from the second circuit board surface to the first circuit board surface, so as to arrange the reflective end face above the light receiving chip.

4. The optical module according to claim 1, wherein: The optical module includes: upper shell; A lower housing, forming a wrapping cavity with the upper housing cover to accommodate the first circuit board and the second circuit board; Wherein, a convex portion is formed on the surface of the lower shell, and the convex portion protrudes toward the upper shell; The protrusion is located in the first avoidance gap and on one side of the laser; The bottom surface of the fixing plate is thermally connected to the lower shell, and the top surface of the raised portion is thermally connected to the upper shell, so that the heat generated by the laser is sequentially conducted through the fixing plate and the lower shell to the upper shell.

5. The optical module according to claim 1, wherein: The optical modulation chip includes: A first optical input port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the first optical input port is optically connected to the laser; A second optical input port is located at the light input end of the optical modulation chip; when the output optical power of the laser is higher than a preset value, the second optical input port is optically connected to the laser; a third optical input port, located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the third optical input port is optically connected to the laser; A first optical splitter comprising a light input port, a first light output port and a second light output port, wherein the light input port is optically connected to the second light input port; a second optical splitter comprising two light input ports and two light output ports, wherein one light input port is optically connected to the third light input port, and the other light input port is optically connected to the first light output port of the first optical splitter; The third optical splitter includes two light input ports and two light output ports, wherein one light input port is optically connected to the first input light port, and the other light input port is optically connected to the second light output port of the first optical splitter.

6. The optical module according to claim 1, wherein: The gold finger is formed on one end surface of the first circuit board, and a first pad area and a second pad area are formed on the other end surface; wherein the second pad area is electrically connected to the optical modulation chip, so as to electrically connect the first circuit board and the optical modulation chip; A third pad area is formed on the end surface of the second circuit board facing the first circuit board, and the third pad area is connected to the first pad area by wire bonding to electrically connect the second circuit board and the first circuit board; A fourth pad area is formed on the surface of the second circuit board, and the fourth pad area is electrically connected to the laser, so as to electrically connect the second circuit board and the laser; A fifth pad area is formed on the surface of the second circuit board. The fifth pad area is electrically connected to the optical modulation chip, so as to electrically connect the second circuit board and the optical modulation chip.

7. The optical module according to claim 1, wherein: One end of the fixing plate extends to below the first circuit board; the other end extends to below the second circuit board, or does not extend to below the second circuit board.

8. An optical module, characterized in that: include: A first circuit board has a gold finger provided on one end surface thereof, and the first circuit board is configured to transmit high-frequency signals and non-high-frequency signals; a second circuit board configured to transmit non-high-frequency signals, wherein the dielectric constant of the first circuit board is lower than that of the second circuit board; the second circuit board is electrically connected to the first circuit board so that the non-high-frequency signal output by the gold finger is transmitted along the first circuit board to the second circuit board; a third avoidance gap is formed on a surface of the second circuit board, and a first arm surface and a second arm surface are formed on both sides of the third avoidance gap; A fixed plate, having the first circuit board disposed on one end of its surface and the second circuit board disposed on the other end thereof, so as to fixedly connect the first circuit board and the second circuit board; A light emitting component is provided on the surface of the fixing plate and is located in the third avoidance gap, and the light emitting component includes: a laser configured to emit light that does not carry a signal and electrically connected to the second circuit board; an optical modulation chip, located in the optical path of the laser output, and configured to modulate the light not carrying a signal to generate an optical signal; a surface of the optical modulation chip is electrically connected to the first circuit board, and a surface of the optical modulation chip is electrically connected to the first support arm surface and the second support arm surface respectively; an optical fiber array, optically connected to the optical output port of the optical modulation chip to transmit the optical signal modulated by the optical modulation chip; Light receiving component, including: A light receiving chip is located on the surface of the first circuit board; The refracting element has a reflective end surface formed at one end, and the reflective end surface is located above the light receiving chip so that the reflected light signal is incident on the light receiving chip.

9. The optical module according to claim 8, wherein: The first side surface of the optical modulation chip is electrically connected to the first circuit board so as to input a high-frequency signal into the optical modulation chip through the first circuit board; Of the two side surfaces adjacent to the first side surface, one side surface is electrically connected to the surface of the first arm surface, and the other side surface is electrically connected to the surface of the second arm surface, so as to input a non-high-frequency signal into the optical modulation chip through the second circuit board; The surface of the optical modulation chip is flush with the surface of the first circuit board, and the surface of the optical modulation chip is flush with the surface of the first support arm and the surface of the second support arm respectively.

10. The optical module according to claim 8, wherein: The light-bending member includes a first optical fiber supporting portion and a second optical fiber supporting portion; The second optical fiber supporting portion is provided on the surface of the second circuit board, and a third soldering pad area is formed on the end surface of the second circuit board to be connected to the surface of the first circuit board by wire bonding; The end portion of the second optical fiber supporting portion does not extend to the surface of the third solder pad area to avoid bonding between the second circuit board and the first circuit board; The first optical fiber supporting portion is located above the second optical fiber supporting portion. The first optical fiber supporting portion extends from the second circuit board surface to the first circuit board surface, so as to arrange the reflective end face above the light receiving chip.

11. The optical module according to claim 8, wherein: The optical module includes: upper shell; A lower housing, forming a wrapping cavity with the upper housing cover to accommodate the first circuit board and the second circuit board; Wherein, a convex portion is formed on the surface of the lower shell, and the convex portion protrudes toward the upper shell; The protrusion is located in the third avoidance gap and on one side of the laser; The bottom surface of the fixing plate is thermally connected to the lower shell, and the top surface of the raised portion is thermally connected to the upper shell, so that the heat generated by the laser is sequentially conducted through the fixing plate and the lower shell to the upper shell.

12. The optical module according to claim 8, wherein: A first pad area is formed on the surface of the first circuit board, and the first pad area is connected to the surface of the optical modulation chip by wire bonding, so as to input a high-frequency signal to the optical modulation chip through the first circuit board; A second pad area is formed on the surface of the first circuit board, and a third pad area is formed on the surface of the first arm. The third pad area is connected to the second pad area by wire bonding to electrically connect the first circuit board and the second circuit board. A fourth pad area is formed on the surface of the first circuit board, and a fifth pad area is formed on the surface of the second arm. The fifth pad area is connected to the fourth pad area by wire bonding to electrically connect the first circuit board and the second circuit board. A sixth pad area is formed on the surface of the first arm surface, and the surface of the optical modulation chip is connected to the sixth pad area by wire bonding to input a non-high frequency signal into the optical modulation chip; A seventh pad area is formed on the surface of the second arm surface, and the surface of the optical modulation chip is connected to the seventh pad area by wire bonding to input a non-high frequency signal into the optical modulation chip; An eighth pad area is formed on the surface of the second arm surface, and the laser is connected to the surface of the eighth pad area by wire bonding to input a non-high frequency signal into the laser.

13. The optical module according to claim 8, wherein: The surface of the first arm is electrically connected to the surface of the first circuit board, and the surface of the second arm is electrically connected to the surface of the first circuit board; The size of the second arm surface is larger than that of the first arm surface, and the second optical fiber supporting portion of the refracting element is located on the surface of the second arm surface.

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