Semiconductor photoetching equipment

Abstract

The invention provides semiconductor photoetching equipment, which relates to the field of semiconductor manufacturing and comprises a photoresist coating machine body, a coating rotating table, a coating driving motor, a clamping limiting piece, a clamping driving sliding block, a photoresist head, a coating cleaning mechanism and a coating clamping mechanism, the coating rotating table is rotationally connected to the middle position above the gluing bearing table; the coating driving motor is fixedly connected to the interior of the photoresist coating machine body; the clamping limiting piece is fixedly connected to the inner side of the coating rotating table; the clamping driving sliding blocks are connected to the inner sides of the sliding grooves of the clamping limiting pieces in a sliding mode. The photoresist head is arranged on the inner side of the photoresist coating machine body; the coating cleaning mechanism is arranged on the inner side of the coating rotating table; and the coating clamping mechanism is arranged on the inner side of the coating rotating table, so that the wafer is prevented from deviating, the photoresist coating uniformity of the wafer is ensured, and the problem that the processing quality of the wafer is influenced due to non-uniform circumferential thickness when the photoresist is spread is solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor photolithography device. Background Art

[0002] Semiconductor photolithography equipment is the core equipment in integrated circuit manufacturing. Its process mainly includes steps such as coating, exposure, development and etching. In the photolithography process, coating is one of the key links. Its purpose is to evenly coat the surface of the silicon wafer with photoresist (photosensitive material) to form a grapheable thin film. The existing coating process usually adopts spin coating (Spin Coating): the silicon wafer is vacuum-adsorbed on the turntable, and the photoresist is dripped to the center of the silicon wafer through a nozzle. It is then rotated at high speed (1000-6000rpm) to spread the glue liquid evenly under the action of centrifugal force, and the solvent evaporates to form a nanometer-thick glue film.

[0003] The existing publication number is: CN103977947B. The present invention provides a method for coating a high-viscosity photoresist. After pre-wetting the surface of a semiconductor substrate, the photoresist is coated in sequence using three different rotation speeds and different rotation times. First, the first rotation speed is less than the second rotation speed, and the first rotation time is greater than the second rotation time; second, the third rotation speed is less than the first rotation speed, and the third rotation time is greater than the first rotation time. Thus, after the photoresist is transported to the surface of the semiconductor substrate, the first rotation speed is increased, and the semiconductor substrate is rotated in a very short time. Its function is to uniformly coat the photoresist and avoid the generation of "wind vortex" defects. During the process of using the second rotation speed, the high-viscosity photoresist at the center of the semiconductor substrate is transferred to the edge of the semiconductor substrate. After the second rotation time, the rotation speed is reduced to the third rotation speed, so that the thickness of the formed photoresist layer at each position of the semiconductor substrate is the same, thereby improving the accuracy and quality of the photolithography process.

[0004] However, due to the flatness deviation of the wafer substrate and the uneven distribution of the photoresist fluid, the dynamic balance between the wafer and the carrier turntable is easily destroyed during rotation, resulting in radial displacement of the wafer under the action of centrifugal force, causing it to deviate from the coaxiality with the turntable. This offset of the rotation axis will cause angular velocity fluctuations, further aggravating the uneven circumferential thickness of the photoresist during spreading, and ultimately causing the uniformity error of the photoresist layer to exceed the process tolerance, affecting the pattern accuracy of subsequent exposure and development and the wafer processing yield, and affecting the processing quality of the wafer. Summary of the Invention

[0005] In view of this, the present invention provides a semiconductor photolithography device, which can realize the cleaning of the inner wall of the coating turntable, ensure the neatness of the inner wall of the coating turntable, facilitate the next use of the coating turntable, avoid contamination of the wafer, avoid the photoresist flowing through the edge of the wafer to the back of the wafer, ensure the quality of the wafer coating, realize the squeezing of the wafer, ensure that the wafer is always in a coaxial position with the coating turntable, avoid the deviation of the wafer, ensure the uniformity of the photoresist coating on the wafer, and improve the yield rate of wafer processing.

[0006] The present invention provides a semiconductor photolithography device, which specifically includes a photoresist coating machine body, a coating carrier, a coating rotary table, a control box, a coating drive motor, a clamping limiter, a clamping drive slider, a photoresist head, a coating cleaning mechanism and a coating clamping mechanism; the coating carrier is fixedly connected to the inner side of the photoresist coating machine body; the coating rotary table is rotatably connected to the middle position above the coating carrier, and multiple groups of open hole structures are provided below the coating rotary table; the control box is fixedly connected to the top of the photoresist coating machine body; The coating drive motor is fixedly connected to the inside of the photoresist coating machine body, and the coating drive motor is transmission-connected to the coating rotary table; the clamping limiter is fixedly connected to the inner side of the coating rotary table, and the clamping limiter is provided with a slide groove structure; the clamping drive sliders are provided in four groups, and the four groups of clamping drive sliders are respectively slidably connected to the inner side of the slide groove of the clamping limiter; the photoresist head is provided on the inner side of the photoresist coating machine body; the coating cleaning mechanism is provided on the inner side of the coating rotary table; and the coating clamping mechanism is provided on the inner side of the coating rotary table.

[0007] Furthermore, the coating and cleaning mechanism includes: an adsorption rotary joint, an adsorption support and an adsorption fan; the adsorption rotary joint is rotatably connected to the outer periphery of the rotating shaft of the coating rotary table; the adsorption support is fixedly connected to the upper interior of the coating rotary table, and the adsorption support is provided with multiple groups of circular hole structures, and the adsorption support is connected to the interior of the adsorption rotary joint; the adsorption fan is a negative pressure fan structure, and the adsorption fan is fixedly connected to the lower interior of the photoresist coating body, and the air inlet of the adsorption fan is connected to the adsorption rotary joint.

[0008] Furthermore, the coating cleaning mechanism also includes: a cleaning movable part, a cleaning fixed part, a cleaning transmission rod and a cleaning driving part; the cleaning movable part is slidably connected to the lower part of the rotating shaft of the coating rotary table; the cleaning fixed part is fixedly connected to the upper part of the rotating shaft of the coating rotary table; the cleaning transmission rods are provided in two groups, and the two groups of cleaning transmission rods are composed of two groups of connecting rods hinged to each other, the upper ends of the two groups of cleaning transmission rods are hinged to the cleaning fixed part, and the lower ends of the two groups of cleaning transmission rods are hinged to the cleaning movable part; the cleaning driving parts are provided in two groups, and the two groups of cleaning driving parts are fixedly connected to the outside of the cleaning transmission rods by soft ropes.

[0009] Furthermore, the coating cleaning mechanism also includes: a cleaning reset spring; the cleaning reset spring is fixedly connected above the cleaning movable part, and the upper end of the cleaning reset spring is fixedly connected to the cleaning fixed part.

[0010] Furthermore, the coating cleaning mechanism also includes: a cleaning connecting piece, a cleaning scraper and a cleaning connecting rod; the cleaning connecting piece is rotatably connected to the bottom of the cleaning movable piece; the cleaning scraper is a circular ring structure, and the cleaning scraper is slidably connected to the inner side of the coating rotary table; the cleaning connecting rods are provided in two groups, and the two groups of cleaning connecting rods are respectively fixedly connected to the outer periphery of the cleaning connecting piece, and the upper ends of the two groups of cleaning connecting rods are fixedly connected to the cleaning scraper.

[0011] Furthermore, the coating clamping mechanism includes: an anti-overflow part and an anti-overflow hole; the anti-overflow part is rotatably connected to the outer periphery of the rotating shaft of the coating rotary table, the anti-overflow part is connected to the external fan through a hose, and the upper end of the anti-overflow part is a slope structure; the anti-overflow holes are provided in multiple groups, and the multiple groups of anti-overflow holes are respectively opened on the upper outside of the anti-overflow part.

[0012] Furthermore, the coating clamping mechanism also includes: a clamping connection, a clamping drive, a coating extrusion member and a coating extrusion spring; the clamping connection member is fixedly connected to the top of the glue coating support platform, the clamping connection member is a concave structure, and the inner side of the clamping connection member is fixedly connected to the anti-overflow member; the clamping drive member is rotatably connected to the inner side of the clamping limit member, and a threaded groove structure is provided above the clamping drive member, and four groups of clamping drive sliders are all threadedly connected to the clamping drive member; the coating extrusion members are provided in four groups, and the four groups of coating extrusion members are respectively slidably connected to the upper end of the clamping drive slider; the coating extrusion springs are provided in four groups, and the four groups of coating extrusion springs are respectively fixedly connected to the upper end of the clamping drive slider, and the outer sides of the four groups of coating extrusion springs are respectively fixedly connected to the coating extrusion members.

[0013] Furthermore, the coating clamping mechanism also includes: a clamping drive rod, a clamping drive protrusion and a clamping return spring; the clamping drive rod is fixedly connected to the outside of the clamping drive member; the clamping drive protrusion is fixedly connected to the bottom of the clamping connection member; the clamping return spring is fixedly connected to the front end of the clamping drive rod, and the front end of the clamping return spring is fixedly connected to the clamping limit member. Beneficial effects

[0014] The present invention is provided with a coating and cleaning mechanism. The coating rotary table rotates to drive the cleaning movable part to rotate. The rotation of the cleaning movable part drives the cleaning transmission rod to rotate. The rotation of the cleaning transmission rod drives the cleaning driving part to rotate. The rotation of the cleaning driving part drives the cleaning movable part to move upward under the action of centrifugal force. The upward movement of the cleaning movable part drives the cleaning connecting part to move upward. The upward movement of the cleaning connecting part drives the cleaning connecting rod to move upward. The upward movement of the cleaning connecting rod drives the cleaning scraper to move upward. The cleaning scraper moves upward to the upper inner side of the coating rotary table. When the glue coating stops, the cleaning scraper moves downward under the action of the cleaning reset spring. The downward movement of the cleaning scraper realizes the cleaning of the inner wall of the coating rotary table, ensures the cleanliness of the inner wall of the coating rotary table, facilitates the next use of the coating rotary table, and avoids contamination of the wafer.

[0015] The present invention sets a coating clamping mechanism, opens the fan external to the overflow prevention part, and the overflow prevention part blows air toward the edge of the wafer through the overflow prevention hole, thereby preventing the photoresist from flowing through the edge of the wafer to the back of the wafer, thereby ensuring the quality of the wafer coating.

[0016] The present invention arranges a coating clamping mechanism. The rotation of the coating rotary table drives the rotation of the clamping limit piece. The rotation of the clamping limit piece drives the rotation of the clamping driving piece. The rotation of the clamping driving piece drives the rotation of the clamping driving rod. The rotation of the clamping driving rod contacts the clamping driving protrusion. At this time, the clamping driving rod is squeezed and drives the clamping driving piece and the clamping limit piece to rotate relative to each other. At this time, the four groups of clamping driving sliders move inward. The inward movement of the clamping driving sliders drives the coating extrusion piece to move inward. The inward movement of the coating extrusion piece realizes the extrusion of the wafer, ensures that the wafer is always in a coaxial position with the coating rotary table, avoids the deviation of the wafer, ensures the uniformity of the photoresist coating on the wafer, and improves the yield rate of wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments are briefly introduced below.

[0018] The drawings described below only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0019] In the attached figure: Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention.

[0020] Figure 2 It is a schematic structural diagram of an adsorption fan according to an embodiment of the present invention.

[0021] Figure 3 Schematic diagram of the adsorption support structure of an embodiment of the present invention.

[0022] Figure 4It is a schematic diagram of the cleaning scraper structure of an embodiment of the present invention.

[0023] Figure 5 It is a schematic structural diagram of a cleaning transmission rod according to an embodiment of the present invention.

[0024] Figure 6 2 is a schematic diagram of the cleaning connecting rod structure according to an embodiment of the present invention.

[0025] Figure 7 2 is a schematic structural diagram of an anti-overflow component according to an embodiment of the present invention.

[0026] Figure 8 2 is a schematic structural diagram of a clamping drive member according to an embodiment of the present invention.

[0027] Reference Signs List 1. Photoresist coating machine body; 101. Adsorption rotary joint; 102. Adsorption support; 103. Adsorption fan; 104. Cleaning moving parts; 105. Cleaning fixed parts; 106. Cleaning transmission rod; 107. Cleaning driving parts; 108. Cleaning reset spring; 109. Cleaning connecting parts; 110. Cleaning scraper; 111. Cleaning connecting rod; 2. Glue coating platform; 3. Coating rotary table; 4. Control box; 5. Coating drive motor; 6. Clamping limiter; 601. Anti-overflow part; 602. Anti-overflow hole; 603. Clamping connecting part; 604. Clamping drive part; 605. Coating extrusion part; 606. Coating extrusion spring; 607. Clamping drive rod; 608. Clamping drive protrusion; 609. Clamping reset spring; 7. Clamping drive slider; 8. Photoresist head. DETAILED DESCRIPTION Example 1

[0028] Please refer to Figures 1 to 6 As shown: The present invention provides a semiconductor photolithography device, comprising a photoresist coating machine body 1, a coating carrier 2, a coating rotary table 3, a control box 4, a coating drive motor 5, a clamping limiter 6, a clamping drive slider 7, a photoresist head 8 and a coating cleaning mechanism; the coating carrier 2 is fixedly connected to the inner side of the photoresist coating machine body 1; the coating rotary table 3 is rotatably connected to the upper middle position of the coating carrier 2, and a plurality of groups of opening structures are provided below the coating rotary table 3; the control box 4 is fixedly connected to the photoresist coating machine body 1, and ... the plurality of groups of opening structures are provided below the coating rotary table 3; the control box 4 is fixedly connected to the photoresist coating machine body 1, and the plurality of groups of opening structures are provided below the coating rotary table 3; the control box 4 is fixedly connected to the photoresist coating machine body 1, and the plurality of groups of opening structures are provided below the coating rotary table 3; the plurality of groups of opening structures are provided below the coating rotary table 3, and the plurality of groups of opening structures are provided below the coating rotary table 3; the plurality of groups of opening structures are provided below the coating rotary table 3, and the plurality of groups of opening structures are provided below the coating rotary table 3; the plurality of groups of opening structures are provided below the coating rotary table 3, and the plurality of groups of opening structures are provided below the coating rotary table 3; the plurality of groups of opening structures are provided above the coating rotary table 3, and the plurality of groups of opening structures are provided below the coating rotary table 3; the plurality of groups of opening structures are provided above the coating rotary table 3, and the plurality of groups of opening structures are Above the body 1; the coating drive motor 5 is fixedly connected to the inside of the photoresist coating body 1, and the coating drive motor 5 is transmission-connected to the coating rotary table 3; the clamping limiter 6 is fixedly connected to the inner side of the coating rotary table 3, and the clamping limiter 6 is provided with a slide groove structure; a total of four groups of clamping drive sliders 7 are provided, and the four groups of clamping drive sliders 7 are respectively slidably connected to the inner side of the slide groove of the clamping limiter 6; the photoresist head 8 is arranged on the inner side of the photoresist coating body 1; the coating cleaning mechanism is arranged on the inner side of the coating rotary table 3.

[0029] Among them, the coating and cleaning mechanism includes: an adsorption rotary joint 101, an adsorption support 102 and an adsorption fan 103; the adsorption rotary joint 101 is rotatably connected to the outer periphery of the rotating shaft of the coating rotary table 3; the adsorption support 102 is fixedly connected to the upper interior of the coating rotary table 3, and the adsorption support 102 is provided with multiple groups of circular hole structures, and the adsorption support 102 is connected to the interior of the adsorption rotary joint 101; the adsorption fan 103 is a negative pressure fan structure, and the adsorption fan 103 is fixedly connected to the lower interior of the photoresist coating body 1, and the air inlet of the adsorption fan 103 is connected to the adsorption rotary joint 101.

[0030] Among them, the coating and cleaning mechanism also includes: a cleaning movable part 104, a cleaning fixed part 105, a cleaning transmission rod 106 and a cleaning driving part 107; the cleaning movable part 104 is slidably connected to the lower part of the outer periphery of the rotating shaft of the coating rotary table 3; the cleaning fixed part 105 is fixedly connected to the upper part of the outer periphery of the rotating shaft of the coating rotary table 3; there are two groups of cleaning transmission rods 106, and the two groups of cleaning transmission rods 106 are composed of two groups of connecting rods hinged to each other, the upper ends of the two groups of cleaning transmission rods 106 are hinged to the cleaning fixed part 105, and the lower ends of the two groups of cleaning transmission rods 106 are hinged to the cleaning movable part 104; there are two groups of cleaning driving parts 107, and the two groups of cleaning driving parts 107 are fixedly connected to the outside of the cleaning transmission rod 106 by soft ropes.

[0031] The coating cleaning mechanism further includes: a cleaning reset spring 108 ; the cleaning reset spring 108 is fixedly connected above the cleaning movable member 104 , and the upper end of the cleaning reset spring 108 is fixedly connected to the cleaning fixed member 105 .

[0032] Among them, the coating cleaning mechanism also includes: a cleaning connecting piece 109, a cleaning scraper 110 and a cleaning connecting rod 111; the cleaning connecting piece 109 is rotatably connected to the bottom of the cleaning movable piece 104; the cleaning scraper 110 is a circular ring structure, and the cleaning scraper 110 is slidably connected to the inner side of the coating rotary table 3; there are two groups of cleaning connecting rods 111, and the two groups of cleaning connecting rods 111 are respectively fixedly connected to the outer periphery of the cleaning connecting piece 109, and the upper ends of the two groups of cleaning connecting rods 111 are fixedly connected to the cleaning scraper 110.

[0033] The specific usage and function of this embodiment: When the wafer needs to be coated with photoresist, the wafer is placed above the adsorption support 102, and the adsorption fan 103 is turned on. The adsorption fan 103 realizes negative pressure attraction and fixation of the wafer through the adsorption rotary joint 101 and the adsorption support 102, and the photoresist is applied to the top of the wafer. The coating drive motor 5 is turned on, and the coating drive motor 5 drives the coating rotary table 3 to rotate. The rotation of the coating rotary table 3 drives the wafer to rotate. The rotation of the wafer realizes the coating of the photoresist under the action of centrifugal force. At the same time, the rotation of the coating rotary table 3 drives the cleaning movable part 104 to rotate, and the rotation of the cleaning movable part 104 drives the cleaning transmission rod 106 to rotate, and the rotation of the cleaning transmission rod 106 drives the cleaning drive Part 107 rotates, and the cleaning driving part 107 rotates and drives the cleaning moving part 104 to move upward under the action of centrifugal force. The cleaning moving part 104 moves upward and drives the cleaning connecting part 109 to move upward. The cleaning connecting part 109 moves upward and drives the cleaning connecting rod 111 to move upward. The cleaning connecting rod 111 moves upward and drives the cleaning scraper 110 to move upward. The cleaning scraper 110 moves upward to the upper inner side of the coating rotary table 3. When the glue coating is stopped, under the action of the cleaning reset spring 108, the cleaning scraper 110 moves downward. The cleaning scraper 110 moves downward to clean the inner wall of the coating rotary table 3, ensuring the cleanliness of the inner wall of the coating rotary table 3, facilitating the next use of the coating rotary table 3, and avoiding contamination of the wafer. Example 2

[0034] like Figures 1 to 8 As shown: The present invention provides a semiconductor lithography device, which, based on the first embodiment, further includes a coating clamping mechanism, and the coating clamping mechanism is arranged on the inner side of the coating rotary table 3 .

[0035] Among them, the coating clamping mechanism includes: an anti-overflow part 601 and an anti-overflow hole 602; the anti-overflow part 601 is rotatably connected to the outer periphery of the rotating shaft of the coating rotary table 3, the anti-overflow part 601 is connected to the external fan through a hose, and the upper end of the anti-overflow part 601 is a slope structure; there are multiple groups of anti-overflow holes 602, and the multiple groups of anti-overflow holes 602 are respectively opened on the upper outside of the anti-overflow part 601.

[0036] Among them, the coating clamping mechanism also includes: a clamping connection 603, a clamping drive 604, a coating extrusion member 605 and a coating extrusion spring 606; the clamping connection 603 is fixedly connected to the top of the glue coating support platform 2, the clamping connection 603 is a concave structure, and the inner side of the clamping connection 603 is fixedly connected to the anti-overflow member 601; the clamping drive 604 is rotatably connected to the inner side of the clamping limit member 6, and a threaded groove structure is provided above the clamping drive 604, and four groups of clamping drive sliders 7 are all threadedly connected to the clamping drive 604; there are four groups of coating extrusion members 605, and the four groups of coating extrusion members 605 are respectively slidably connected to the upper end of the clamping drive slider 7; there are four groups of coating extrusion springs 606, and the four groups of coating extrusion springs 606 are respectively fixedly connected to the upper end of the clamping drive slider 7, and the outer sides of the four groups of coating extrusion springs 606 are respectively fixedly connected to the coating extrusion member 605.

[0037] Among them, the coating clamping mechanism also includes: a clamping drive rod 607, a clamping drive protrusion 608 and a clamping reset spring 609; the clamping drive rod 607 is fixedly connected to the outside of the clamping drive part 604; the clamping drive protrusion 608 is fixedly connected to the bottom of the clamping connection part 603; the clamping reset spring 609 is fixedly connected to the front end of the clamping drive rod 607, and the front end of the clamping reset spring 609 is fixedly connected to the clamping limit part 6.

[0038] The specific usage and function of this embodiment are as follows: when coating the wafer, the fan connected to the anti-overflow part 601 is turned on, and the anti-overflow part 601 blows air toward the edge of the wafer through the anti-overflow hole 602, thereby preventing the photoresist from flowing through the edge of the wafer to the back of the wafer, thereby ensuring the quality of the wafer coating. At the same time, as the coating rotary table 3 rotates, the coating rotary table 3 rotates and drives the clamping limiter 6 to rotate, and the clamping limiter 6 rotates and drives the clamping drive member 604 to rotate, and the clamping drive member 604 rotates and drives the clamping drive rod 607 to rotate, and the clamping drive rod 607 rotates and contacts the clamping drive protrusion 608. At this time, the clamping drive The rod 607 is squeezed to drive the clamping drive part 604 and the clamping limit part 6 to rotate relative to each other. At this time, the four groups of clamping drive sliders 7 move inward, and the clamping drive sliders 7 move inward to drive the coating extrusion part 605 to move inward. The coating extrusion part 605 moves inward to squeeze the wafer, ensuring that the wafer is always in a coaxial position with the coating rotary table 3, avoiding the deviation of the wafer, ensuring the uniformity of the photoresist coating on the wafer, and improving the yield rate of wafer processing. When the clamping drive rod 607 moves past the position of the clamping drive protrusion 608, the clamping drive slider 7 is reset under the action of the clamping reset spring 609.

[0039] In this article, there are several points to note: 1. The drawings of this embodiment only involve the structures related to this embodiment. Other structures can refer to the general design.

[0040] 2. In the absence of conflict, the features of this embodiment and the embodiments can be combined with each other to obtain new embodiments.

[0041] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A semiconductor lithography apparatus, characterized in that: The invention comprises a photoresist coating machine body (1), a coating support platform (2), a coating rotary platform (3), a control box (4), a coating drive motor (5), a clamping limiter (6), a clamping drive slider (7), a photoresist head (8), a coating cleaning mechanism and a coating clamping mechanism; the coating support platform (2) is fixedly connected to the inner side of the photoresist coating machine body (1); the coating rotary platform (3) is rotatably connected to the upper middle position of the coating support platform (2), and a plurality of groups of opening structures are provided below the coating rotary platform (3); the control box (4) is fixedly connected to the upper part of the photoresist coating machine body (1); the coating drive motor ( 5) is fixedly connected to the inside of the photoresist coating machine body (1), and the coating drive motor (5) is transmission-connected to the coating rotary table (3); the clamping limiter (6) is fixedly connected to the inner side of the coating rotary table (3), and the clamping limiter (6) is provided with a slide groove structure; the clamping drive sliders (7) are provided in four groups, and the four groups of clamping drive sliders (7) are respectively slidably connected to the inner side of the slide groove of the clamping limiter (6); the photoresist head (8) is provided on the inner side of the photoresist coating machine body (1); the coating cleaning mechanism is provided on the inner side of the coating rotary table (3); and the coating clamping mechanism is provided on the inner side of the coating rotary table (3).

2. The semiconductor lithography apparatus according to claim 1, wherein: The coating cleaning mechanism comprises: an adsorption rotary joint (101), an adsorption support (102) and an adsorption fan (103); the adsorption rotary joint (101) is rotatably connected to the outer periphery of the rotating shaft of the coating rotary table (3); the adsorption support (102) is fixedly connected to the upper interior of the coating rotary table (3), the adsorption support (102) is provided with multiple groups of circular hole structures, and the adsorption support (102) is communicated with the interior of the adsorption rotary joint (101); the adsorption fan (103) is a negative pressure fan structure, the adsorption fan (103) is fixedly connected to the lower interior of the photoresist coating machine body (1), and the air inlet of the adsorption fan (103) is communicated with the adsorption rotary joint (101).

3. The semiconductor lithography apparatus according to claim 2, wherein: The coating cleaning mechanism further comprises: a cleaning movable member (104), a cleaning fixed member (105), a cleaning transmission rod (106) and a cleaning driving member (107); the cleaning movable member (104) is slidably connected below the outer periphery of the rotating shaft of the coating rotary table (3); the cleaning fixed member (105) is fixedly connected above the outer periphery of the rotating shaft of the coating rotary table (3); two groups of cleaning transmission rods (106) are provided, and both groups of cleaning transmission rods (106) are composed of two groups of mutually hinged connecting rods, the upper ends of the two groups of cleaning transmission rods (106) are hinged to the cleaning fixed member (105), and the lower ends of the two groups of cleaning transmission rods (106) are hinged to the cleaning movable member (104); and two groups of cleaning driving members (107) are provided, and both groups of cleaning driving members (107) are fixedly connected to the outer side of the cleaning transmission rod (106) through soft ropes.

4. The semiconductor lithography apparatus according to claim 3, wherein: The coating cleaning mechanism further comprises: a cleaning reset spring (108); the cleaning reset spring (108) is fixedly connected above the cleaning movable member (104); and the upper end of the cleaning reset spring (108) is fixedly connected to the cleaning fixed member (105).

5. The semiconductor lithography apparatus according to claim 4, wherein: The coating cleaning mechanism further comprises: a cleaning connecting member (109), a cleaning scraper (110) and a cleaning connecting rod (111); the cleaning connecting member (109) is rotatably connected to the bottom of the cleaning movable member (104); the cleaning scraper (110) is a circular ring structure, and the cleaning scraper (110) is slidably connected to the inner side of the coating rotating table (3); two groups of cleaning connecting rods (111) are provided, and the two groups of cleaning connecting rods (111) are respectively fixedly connected to the outer periphery of the cleaning connecting member (109), and the upper ends of the two groups of cleaning connecting rods (111) are fixedly connected to the cleaning scraper (110).

6. The semiconductor lithography apparatus according to claim 1, wherein: The coating clamping mechanism comprises: an anti-overflow part (601) and an anti-overflow hole (602); the anti-overflow part (601) is rotatably connected to the outer periphery of the rotating shaft of the coating rotating table (3); the anti-overflow part (601) is externally connected to a fan through a hose; the upper end of the anti-overflow part (601) is an inclined surface structure; the anti-overflow hole (602) is provided in multiple groups, and the multiple groups of anti-overflow holes (602) are respectively opened on the upper outer side of the anti-overflow part (601).

7. The semiconductor lithography apparatus according to claim 6, wherein: The coating clamping mechanism further comprises: a clamping connection member (603), a clamping drive member (604), a coating extrusion member (605) and a coating extrusion spring (606); the clamping connection member (603) is fixedly connected to the top of the coating support platform (2), the clamping connection member (603) is a concave-shaped structure, and the inner side of the clamping connection member (603) is fixedly connected to the anti-overflow member (601); the clamping drive member (604) is rotatably connected to the inner side of the clamping limit member (6), and the upper side of the clamping drive member (604) is fixedly connected to the upper side of the coating support platform (2). A thread groove structure is provided, and four groups of clamping drive sliders (7) are all threadedly connected to the clamping drive member (604); four groups of coating extrusion members (605) are provided, and the four groups of coating extrusion members (605) are respectively slidably connected to the upper end of the clamping drive slider (7); four groups of coating extrusion springs (606) are provided, and the four groups of coating extrusion springs (606) are respectively fixedly connected to the upper end of the clamping drive slider (7), and the outer sides of the four groups of coating extrusion springs (606) are respectively fixedly connected to the coating extrusion members (605).

8. The semiconductor lithography apparatus according to claim 7, wherein: The coating clamping mechanism further comprises: a clamping drive rod (607), a clamping drive protrusion (608) and a clamping return spring (609); the clamping drive rod (607) is fixedly connected to the outside of the clamping drive member (604); the clamping drive protrusion (608) is fixedly connected to the bottom of the clamping connection member (603); the clamping return spring (609) is fixedly connected to the front end of the clamping drive rod (607), and the front end of the clamping return spring (609) is fixedly connected to the clamping limit member (6).

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