Control parameter setting method, detection system and control method thereof, and storage medium

Abstract

The embodiment of the invention provides a control parameter setting method, a detection system and a control method thereof, and a storage medium, and the method comprises the steps: obtaining an initial control parameter of a multi-axis motion machine after a to-be-detected piece is detected to be fixed on an objective table, completing at least one movement process based on the parameter, calculating a static jitter error and a dynamic following error in the movement process, and setting the to-be-detected piece. And the control parameters are adjusted through iteration until the error meets a preset performance standard, and an optimal control parameter configuration file is generated. When detection is carried out through a detection system, after specification parameters and a target scanning track of a to-be-detected piece are obtained, an optimal control parameter configuration file which is generated through parameter setting and accurately matched with the specification parameters is called, and dynamic parameter adaptation of a multi-axis motion machine table is achieved; it is ensured that the machine can still drive the target scanning track with the optimal control strategy under the complex working condition, the compatibility, the detection precision and the stability of a detection system are remarkably improved, and meanwhile the field debugging complexity and the time cost are reduced through the pre-stored configuration file.

Description

Technical Field

[0001] The present application relates to the field of semiconductor detection technology, and in particular to a control parameter setting method, a detection system and its control method, and a storage medium. Background Art

[0002] Semiconductor testing is an indispensable link in the semiconductor industry chain, running through the entire process of design, manufacturing, packaging and testing. Wafer inspection is the core cornerstone of quality control in semiconductor testing. Its significance lies in the early identification of physical defects (such as particles and scratches) and electrical anomalies (such as leakage and parameter drift) in wafer manufacturing through high-precision technologies (such as optical, electron beam, and electrical testing). This ensures that each chip meets the design specifications before packaging, thereby avoiding ineffective investment in subsequent processes, improving overall yield, and providing data feedback for process optimization. It is a key link in supporting the reliability of advanced processes, ensuring the stability of the industry chain, and ensuring the performance of end products.

[0003] Currently, the most common wafer inspection systems include four-axis precision motion stages. This system controls the relative motion of the stage and the optical inspection lens to inspect the wafer surface. The precision of the motion stage's control over each axis directly impacts the inspection results. For example, the accuracy of control over the vertical Z-axis determines the focus accuracy of optical inspection.

[0004] In the face of wafers of different specifications, in order to adapt to the diverse needs of different application scenarios, the control parameters of the motion machine need to be adjusted to improve the system performance such as the control accuracy, flexibility, and stability of the motion machine, and ensure that the motion machine operates at the optimal parameters under various inspection conditions, reducing debugging time and improving inspection efficiency.

[0005] The parameter tuning of existing motion machines is usually based on empirical data, and then based on the PID control algorithm. During the detection process, the motion machine adjusts and optimizes the kinematic control parameters according to the real-time position and target position. This process limits the dynamic performance of the motion machine, increases the accuracy deviation, and also prolongs the detection cycle. Summary of the Invention

[0006] The present application provides a control parameter setting method, a detection system and its control method, and a storage medium, which can solve the technical problems that the control parameters of the motion machine in the current semiconductor detection system are optimized and set during the detection process, resulting in a long setting cycle and large accuracy deviation.

[0007] In a first aspect, embodiments of the present application provide a control parameter tuning method, which is applied to a detection system. The detection system includes a multi-axis motion machine and a stage, wherein the stage is disposed on the multi-axis motion machine and is used to carry and fix a test object. The tuning method includes:

[0008] After detecting that the workpiece to be tested is fixed on the stage, obtaining initial control parameters of the multi-axis motion machine; the initial control parameters include at least one of position loop parameters, speed loop parameters, and current loop parameters;

[0009] Controlling the multi-axis motion machine to complete at least one movement process based on the initial control parameters;

[0010] Calculate static jitter error and dynamic following error during motion;

[0011] The initial control parameters are adjusted until the calculated static jitter error and dynamic following error meet preset performance standards.

[0012] In some embodiments, obtaining initial control parameters of the multi-axis motion machine includes:

[0013] Obtaining a Bode diagram of the multi-axis motion machine;

[0014] Initial control parameters of the multi-axis motion machine are determined according to the Bode diagram of the multi-axis motion machine.

[0015] In some embodiments, controlling the multi-axis motion machine to complete at least one movement process based on the initial control parameters includes:

[0016] The multi-axis motion machine is controlled to complete at least one single-axis movement process based on the initial control parameters; the single-axis movement process includes reciprocating motion in the Z-axis direction, reciprocating motion in the X-axis direction, reciprocating motion in the Y-axis direction, and reciprocating motion in the T-axis direction.

[0017] In some embodiments, calculating the static jitter error and the dynamic following error during the motion process includes:

[0018] Get the actual positions of at least two locations in the selected direction;

[0019] Calculating a static jitter error corresponding to a selected direction based on a deviation between the actual position and the corresponding set position;

[0020] Obtain at least one actual motion trajectory during single-axis movement in a selected direction;

[0021] The dynamic following error corresponding to the selected direction is calculated based on the deviation value between the actual motion trajectory and the corresponding set motion trajectory.

[0022] In some embodiments, the preset performance standard is: based on the calculated results of the static jitter error and the dynamic following error and their respective weights, the calculated performance index characterizing the motion performance of the multi-axis motion machine reaches a preset threshold.

[0023] In some embodiments, the control parameter setting method further includes:

[0024] Generating an optimal control parameter configuration file corresponding to different specification parameters according to the specification parameters of the test piece; the specification parameters include weight;

[0025] The optimal control parameter configuration file includes a configuration file composed of multi-axis optimal control parameters and / or a configuration file composed of a combination of multiple single-axis optimal control parameters.

[0026] In some embodiments, the control parameter setting method further includes:

[0027] In response to the storage instruction, saving the optimal control parameter configuration files corresponding to different specification parameters to a designated location;

[0028] The designated location includes a designated location of local storage, a designated location of a host computer, and / or a designated location of an Internet platform.

[0029] In a second aspect, an embodiment of the present application provides a control method for a detection system, wherein the detection system includes a multi-axis motion machine and a stage, wherein the stage is disposed on the multi-axis motion machine and is used to carry and fix a workpiece to be tested; the control method includes:

[0030] After detecting that the object to be tested is fixed on the stage, obtaining target working condition information; the target working condition information at least includes specification parameters of the object to be tested and a target scanning trajectory;

[0031] Recalling a pre-stored optimal control parameter configuration file corresponding to the specification parameters of the device under test; wherein the optimal control parameter configuration file is obtained using the control parameter setting method according to any one of claims 1 to 7;

[0032] Based on the optimal control parameters of the called optimal control parameter configuration file, the multi-axis motion machine is controlled to move along the target scanning trajectory to detect the workpiece to be tested.

[0033] In some embodiments, the target operating condition information further includes a target detection item;

[0034] The calling of a pre-stored optimal control parameter configuration file corresponding to the specification parameters of the device under test includes:

[0035] Determining, according to the target detection item, a specific axis corresponding to the target detection item;

[0036] The optimal control parameter configuration parameters for the specific axis are called.

[0037] In some embodiments, calling a pre-stored optimal control parameter configuration file corresponding to the specification parameters of the device under test includes:

[0038] In response to the calling instruction, obtaining the optimal control parameter configuration file from a specified location;

[0039] The designated location includes a designated location of local storage, a designated location of a host computer, and / or a designated location of an Internet platform.

[0040] In a third aspect, an embodiment of the present application provides a detection system, comprising:

[0041] The stage is used to carry and fix the test piece;

[0042] The detection device includes an optical component, an objective lens, and a detection component; the optical component is used to perform optical imaging of the object to be tested on the stage through the objective lens, and transmit the optical signal obtained by imaging to the detection component, and the detection component is used to convert the optical signal into an electrical signal, thereby obtaining a detection image of the object to be tested;

[0043] A multi-axis motion machine comprises a driver and a controller; the controller is used to execute the method as described in any embodiment of the first aspect and / or the second aspect, driving the driver to make the stage move relative to the objective lens.

[0044] In some embodiments, the detection device further includes a filter component; the filter component is configured to perform filtering processing on the optical signal generated by the optical component.

[0045] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, characterized in that the computer-readable storage medium stores computer execution instructions, which, when executed by a processor, are used to implement the steps of the control parameter adjustment method as described in any embodiment of the first aspect, and / or the steps of the detection system control method as described in any embodiment of the second aspect.

[0046] The embodiments of the present application provide a method for adjusting control parameters and a method for controlling multiple motion machines for semiconductor inspection systems. After detecting that a workpiece to be tested is fixed to a stage, the method obtains initial control parameters for the multi-axis motion machine and completes at least one movement process based on these parameters, thereby calculating static jitter error and dynamic following error. The method then iteratively adjusts the control parameters until the errors meet preset performance standards, thereby achieving a precise parameter adjustment process for the multi-axis motion machine. When the workpiece to be tested is inspected by the inspection system, after obtaining the specifications and target scanning trajectory of the workpiece, the optimal control parameter configuration file generated through parameter adjustment, which accurately matches the specifications, is called to achieve dynamic parameter adaptation of the multi-axis motion machine, thereby ensuring that the machine can still drive the target scanning trajectory with the optimal control strategy under complex working conditions. This significantly improves the compatibility, inspection accuracy, and stability of the inspection system. Pre-stored configuration files reduce the complexity and time cost of on-site debugging, providing a reusable standardized technical solution for high-precision and high-efficiency inspection in the semiconductor, precision manufacturing, and other fields.

[0047] In addition, the present application also provides a computer-readable storage medium having the same beneficial effects as the above-mentioned control parameter setting method and / or detection system control method. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0049] Figure 1 A schematic diagram of the structure of a detection system provided in one embodiment of the present application;

[0050] Figure 2 A flow chart of a control parameter setting method provided in one embodiment of the present application;

[0051] Figure 3 A flowchart of calculating static jitter error and dynamic following error provided by one embodiment of the present application;

[0052] Figure 4 This is a dynamic following error analysis diagram obtained by controlling the Z-axis sinusoidal motion provided by an embodiment of the present application;

[0053] Figure 5 A flow chart of a control parameter setting method provided in another embodiment of the present application;

[0054] Figure 6 A flow chart of a control method for a detection system provided in one embodiment of the present application;

[0055] Figure 7A schematic structural diagram of a detection system provided in another embodiment of the present application.

[0056] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0057] The present application is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0058] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. Furthermore, the steps or actions in the method description may be reordered or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various sequences in the specification and drawings are provided solely for the purpose of clearly describing a particular embodiment and are not intended to be mandatory, unless otherwise specified.

[0059] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally a class, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated before and after are in an "or" relationship. The "connection" and "connection" mentioned in this application, unless otherwise specified, include direct and indirect connections (connections).

[0060] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0061] Figure 1 This is a schematic diagram of the structure of a detection system provided by an embodiment of the present application. Figure 1 As shown, the inspection system 100 provided in this embodiment is used for semiconductor inspection. The inspection system 100 at least includes a stage 110 , an inspection device 120 and a multi-axis motion machine 130 .

[0062] In this embodiment, the stage 110 is used to carry the test piece when it is being tested, thereby providing a process platform for optical inspection of the test piece. In some embodiments, there may be multiple stages 110 to achieve simultaneous inspection or sequential inspection of multiple test pieces. A fixing member is provided on the stage 110 for fixing the test piece on the stage 110 to prevent the test piece from sliding relative to the stage 110 during inspection or processing, thereby affecting the inspection result or processing result. In some embodiments, the fixing object on the stage 110 may be a suction cup, a magnet or other elements with a fixing function, which are not limited here.

[0063] In this embodiment, the inspection device 120 is used to perform at least one inspection item on the DUT. Semiconductor inspection includes wafer stage inspection, pre-packaging and in-process testing, packaging stage inspection, and finished product testing. Semiconductor inspection is a multi-level, multi-dimensional system that covers the entire life cycle from design to final product to ensure the quality and reliability of semiconductors. Among them, wafer inspection includes process control inspection, such as film thickness measurement, critical dimension measurement, overlay accuracy inspection, and surface morphology inspection, as well as defect detection, such as surface defect detection and internal defect detection.

[0064] In some embodiments, the detection device 120 includes an optical component, an objective lens, and a detection component. The optical component is used to perform optical imaging of the object under test on the stage through the objective lens and transmit the optical signal obtained by the imaging to the detection component, which is used to convert the optical signal into an electrical signal to obtain a detection image of the object under test.

[0065] The multi-axis motion machine 130 includes at least a track and a drive controller. The drive controller is used at least to plan the detection trajectory and generate multi-axis control instructions according to the upcoming detection project to control the relative displacement of the workpiece 110 or the detection device 120 installed on the track along the detection trajectory, so that the detection device 120 can complete multi-directional and multi-posture detection of the test piece.

[0066] To handle different types of semiconductor inspections and test items, such as internal and surface defect inspections for wafers of varying specifications, the multi-axis motion machine 130 requires configuration of different operating and control parameters. Furthermore, the control accuracy of each axis directly impacts the inspection results. For example, the control accuracy of the vertical Z-axis determines the focusing accuracy of optical inspections. To meet the diverse needs of different application scenarios, the control parameters of the multi-axis motion machine 130 must be adjusted to improve system performance, including control accuracy, flexibility, and stability. This ensures that the multi-axis motion machine 130 operates at optimal parameters under various inspection conditions, reducing debugging time and improving inspection efficiency.

[0067] However, existing multi-axis motion machine 130 parameter tuning largely relies on empirical data, including historical debugging records, manufacturer recommendations, or engineers' personal experience. This empirical data is typically based on a single or specific operating condition. However, in practice, when faced with more complex operating conditions, the results of parameter tuning based on empirical data often lead to adjustments and optimization of kinematic control parameters based on the real-time and target positions during testing. This process limits the dynamic performance of the multi-axis motion machine 130, increases accuracy deviations, and prolongs the testing cycle.

[0068] Therefore, it is very necessary to collect and integrate parameter data and working condition data of various types and working conditions, and adjust and debug the optimal control parameters of the multi-axis motion machine 130 under different working conditions, so that when facing the same working conditions, the optimal control parameters can be directly called to reduce the time for on-site adjustment and optimization.

[0069] The following is further explained with reference to the accompanying drawings.

[0070] Figure 2 This is a flow chart of a control parameter tuning method provided in one embodiment of the present application. The control parameter tuning method provided in this embodiment is applied to the detection system 100 of any of the above embodiments. The specific execution can be in the controller or processor of the detection system 100, or in the controller or processor of the multi-axis motion machine 130. The tuning method specifically includes the following steps:

[0071] Step S210 : After detecting that the workpiece to be tested is fixed on the stage, initial control parameters of the multi-axis motion machine are obtained.

[0072] In this embodiment, before adjusting the control parameters of the multi-axis motion machine 130, it is necessary to ensure that the connection between the multi-axis motion machine 130 and the stage 110 or the detection device 120 is correct, without looseness or poor contact, so as to avoid deviations in the subsequent parameter adjustment process. Before parameter adjustment, ensure that the test piece is fixed on the stage 110. The purpose is to adjust the optimal control parameters of the test piece that are adapted to the specification parameters. After detecting that the test piece is fixed on the stage 110, the initial control parameters of the multi-axis motion machine 130 are obtained. Obtaining the initial control parameters can fully understand the current settings and performance status of the multi-axis motion machine 130, providing a basis for subsequent adjustment work. Analyzing the initial parameters helps determine the direction and focus of the adjustment, such as the specific performance indicators that are expected to be achieved through parameter adjustment, such as improving position accuracy, reducing speed fluctuations, and enhancing system stability. Furthermore, the range and focus of the tuning parameters are determined based on the working conditions and load characteristics of the multi-axis motion machine 130 in actual applications, so as to formulate a more targeted tuning strategy, reduce the number of trial and error, and improve tuning efficiency.

[0073] The parameter configuration of the multi-axis motion machine 130 generally involves two levels: kinematic model parameters and control loop parameters. Kinematic model parameters are primarily used to describe the geometric relationships and kinematic models of the mechanical structure, directly affecting trajectory planning and motion control accuracy. These parameters include DH parameters (link length, link offset, joint torsion angle, and joint rotation angle), tool coordinate system, base coordinate system, joint zero offset, and kinematic constraints. Control loop parameters are primarily used to adjust the dynamic response of the motor driver to ensure motion smoothness and accuracy. These parameters include position loop parameters, velocity loop parameters, and current loop parameters.

[0074] Position loop parameters are the outermost regulatory element of the multi-axis motion machine 130 control system. Their primary function is to ensure that the end effector accurately tracks the command position while balancing dynamic response speed with system stability. These parameters include proportional gain, which determines positioning stiffness; differential gain, which suppresses overshoot and improves damping; feedforward gain, which compensates for gravity or friction; and jerk limit, which smooths trajectory transitions.

[0075] The speed loop parameters are the intermediate control loop, controlling the motor speed by adjusting the current loop command. These parameters include the proportional gain, which determines the bandwidth of the speed response; the integral gain, which eliminates steady-state speed errors; the speed feedforward, which compensates for lag caused by inertia; and the low-pass filter parameter value, which suppresses mechanical resonance.

[0076] The current loop parameters are the innermost control loop, directly regulating the motor winding current to control electromagnetic torque. These include proportional gain, which adjusts current response speed; integral gain, which eliminates steady-state errors; current limiting, which prevents motor overcurrent; and filter cutoff frequency, which suppresses high-frequency noise.

[0077] It should be noted that when adjusting the control parameters of the multi-axis motion machine 130, the parameter range and focus that need to be adjusted are different according to different usage scenarios and the specifications and characteristics of the test piece. When specifying the tuning strategy, the number and target of the parameters can be selectively adjusted according to actual needs.

[0078] In some embodiments, a Bode plot analysis method is used to obtain the initial control parameters of the multi-axis motion machine 130. The Bode plot is an important tool for analyzing the frequency response of a control system. By using the amplitude-frequency and phase-frequency characteristic curves, the stability, bandwidth, and anti-interference capability of the system can be intuitively evaluated. Specifically, the Bode plot of the multi-axis motion machine 130 is first obtained, and then the Bode plot is analyzed to determine the initial control parameters of the multi-axis motion machine 130.

[0079] Bode plot analysis visually displays the system's frequency response characteristics through amplitude-frequency and phase-frequency curves. The process of extracting initial control parameters from a Bode plot involves first analyzing the system's frequency response characteristics based on the open-loop Bode plot to determine key performance indicators (such as crossover frequency, phase margin, and resonant frequency). Controller parameters are then designed step by step according to the control loop hierarchy (current loop, velocity loop, and position loop). The current loop determines the proportional and integral gains and sets a low-pass filter based on the mechanical resonant frequency and inductance characteristics. The velocity loop designs the proportional, integral gain, and feedforward coefficient based on the load inertia and current loop bandwidth. The position loop calculates the proportional, differential gain, and feedforward parameters based on the transmission stiffness and velocity loop bandwidth. Furthermore, by adjusting the parameters of each loop, the closed-loop Bode plot's phase margin and gain margin meet stability requirements. Ultimately, initial control parameters that balance dynamic performance and stability are obtained.

[0080] In some embodiments, during the process of extracting initial control parameters through the Bode diagram, the gain margin of the multi-axis motion machine 130 system is required to be greater than 6 dB and the phase margin is required to be greater than 35°.

[0081] Step S220 : controlling the multi-axis motion machine to complete at least one movement process based on the initial control parameters.

[0082] In this embodiment, after obtaining the initial control parameters of the multi-axis motion machine 130, the multi-axis motion machine 130 is controlled to complete at least one movement process according to at least one motion trajectory set by the operator. The set motion trajectory can be a simple reciprocating motion or a motion trajectory under a working condition of simulated detection.

[0083] In some embodiments, controlling the multi-axis motion machine 130 to complete at least one movement process based on the initial control parameters specifically involves controlling the multi-axis motion machine 130 to complete at least one single-axis movement process based on the initial control parameters. The single-axis movement process includes reciprocating motion in the Z-axis direction, reciprocating motion in the X-axis direction, reciprocating motion in the Y-axis direction, and reciprocating motion in the T-axis direction.

[0084] It is understandable that the advantage of determining the optimal parameters of the multi-axis motion machine 130 through single-axis reciprocating motion is that it simplifies the debugging process by isolating the coupling interference between axes, independently analyzes the dynamic characteristics of each axis to quickly locate performance differences, and significantly reduces the complexity and risk of multi-axis collaborative debugging. At the same time, it improves the adaptability of parameters to mechanical changes and fault diagnosis capabilities, provides a reliable foundation for subsequent multi-axis linkage optimization, and ultimately achieves efficient, safe and robust parameter adjustment.

[0085] Step S230: Calculate the static jitter error and dynamic following error during the motion process.

[0086] In this embodiment, the static jitter error (such as peak-to-peak value, RMS) and the dynamic following error (such as maximum absolute error, RMSE) can be used to evaluate the performance of the multi-axis motion table and guide parameter optimization. The static jitter error specifically refers to the periodic or random position deviation of the machine near the target position due to mechanical vibration, noise or unreasonable control parameters. For example, the jitter amplitude of the static jitter of the Z axis can reflect the mechanical rigidity of the z axis to a certain extent, and the jitter frequency reflects the mechanical resonance frequency and environmental interference. The dynamic following error specifically refers to the deviation between the actual trajectory and the target trajectory of the machine during movement due to system response delay, inertia or interference. For example, the dynamic following error of the Z axis can reflect the dynamic response capability and control stability of the z axis.

[0087] By quantifying static jitter errors, stability problems caused by mechanical vibration, noise interference or unreasonable control parameters when the machine is in a stationary state can be accurately identified, while dynamic following errors directly reflect the accuracy and responsiveness of trajectory tracking during motion. The joint analysis of the two types of errors can locate performance bottlenecks (such as excessive single-axis jitter or multi-axis linkage trajectory deviation) and provide a clear direction for parameter adjustment - static errors guide filter design, damping optimization and mechanical stiffness improvement, and dynamic errors drive control gain (such as proportion, feedforward coefficient) and bandwidth adjustment, ultimately achieving stable operation and trajectory consistency of the machine in high-speed, high-precision scenarios. This is the core link in improving the reliability and processing quality of multi-axis motion systems.

[0088] Figure 3 This is a flow chart for calculating static jitter error and dynamic following error provided by an embodiment of the present application. Figure 3 As shown, step S230, calculating the static jitter error and the dynamic following error during the motion process, specifically includes the following steps:

[0089] Step 2301: Obtain the actual positions of at least two positions in a selected direction.

[0090] Step 2302: Calculate the static jitter error corresponding to the selected direction based on the deviation between the actual position and the corresponding set position.

[0091] In this embodiment, when calculating the static jitter error, the multi-axis motion machine 130 is first controlled to perform reciprocating motion in the selected single-axis direction, and the actual position corresponding to at least two set positions in the direction is recorded and obtained, and the deviation value between the actual position and the corresponding set position is calculated as the static jitter error corresponding to the selected direction. It should be noted that during the data collection process, it is necessary to ensure that the multi-axis motion machine 130 stays at the set position for a period of time after moving to the set position, such as 3 to 5 seconds after the movement is completed, and then the position coordinates after the movement are collected. In general, sampling data of at least 5 to 10 positions are collected to cover different working conditions. For example, for the sampling of static jitter error data on the Z axis, the machine needs to be controlled to be stationary at different vertical heights, and coordinate data of 5 to 10 positions are collected.

[0092] In some embodiments, the static jitter error may be the average value of the deviation between the actual position and the set position, or may be a static jitter error indicator that can characterize the deviation between the actual position and the set position, such as the root mean square error reflecting the error fluctuation level, or the standard deviation reflecting the degree of error dispersion.

[0093] Step 2303: Obtain at least one actual motion trajectory during the single-axis movement in the selected direction.

[0094] Step 2304: Calculate the dynamic following error corresponding to the selected direction based on the deviation between the actual motion trajectory and the corresponding set motion trajectory.

[0095] In this embodiment, when calculating the dynamic following error, the multi-axis motion machine 130 is first controlled to perform reciprocating motion in the selected single-axis direction, and the actual motion trajectory corresponding to at least one set motion trajectory in the selected direction is recorded and obtained. The actual motion trajectory and its corresponding set motion trajectory are compared, and the deviation value between the two is calculated as the dynamic following error corresponding to the selected direction. Among them, the set motion trajectory is generated by an algorithm preset by the controller, and the actual motion trajectory is collected in real time by an encoder or a laser interferometer. It should be noted that during the data acquisition process, it is necessary to ensure that the timestamps of the set trajectory and the actual trajectory are aligned, and the motion trajectory set during the acquisition process is preferably able to cover a complete motion cycle. For example, for the dynamic following error on the Z axis, the Z axis can be controlled to perform sinusoidal motion according to the set frequency and amplitude, and the motion trajectory analysis can be performed to calculate the dynamic following error, such as Figure 4 As shown. ( Figure 4 Dynamic following error analysis diagram obtained by controlling Z-axis sinusoidal motion according to one embodiment of the present application)

[0096] In some embodiments, the dynamic following error can be the average value of the deviation between the actual motion trajectory and the set motion trajectory, or it can be a dynamic following error indicator that can characterize the deviation between the actual motion trajectory and the set motion trajectory, such as: the root mean square error reflecting the overall accuracy of trajectory tracking, the maximum absolute error reflecting the tracking capability in the worst case, or the integral error reflecting the cumulative effect of the error.

[0097] Step S240: Adjust the initial control parameters until the calculated static jitter error and dynamic following error meet the preset performance standards.

[0098] In this embodiment, after calculating and obtaining the static jitter error and dynamic following error corresponding to the single-axis motion of the multi-axis motion machine 130, it is first determined whether the static jitter error and the dynamic following error meet the preset performance standards. If they meet the preset performance standards, it is considered that the current control parameters meet the expected performance requirements and can be used as the optimal control parameters of the corresponding axis. Otherwise, it is considered that the current control parameters do not meet the expected performance requirements and further parameter adjustment is required.

[0099] It is understood that, under normal circumstances, the static jitter error and dynamic following error calculated based on the initial control parameters for the movement of the multi-axis motion machine 130 may not meet the preset performance standards. In this case, the initial control parameters can be adjusted, and steps S220-S230 can be repeated until the final calculated static jitter error and dynamic following error meet the preset performance standards. For example, when significant static jitter is present, the proportional gain can be appropriately reduced.

[0100] In some embodiments, the preset performance standard is that the static jitter error and the dynamic following error are respectively less than corresponding preset error thresholds;

[0101] And / or, the preset performance standard is: a comprehensive error calculated based on the calculated results of the static jitter error and the dynamic following error and their respective weights is less than a preset error threshold.

[0102] It is understood that static jitter error and dynamic following error are two different error results, and there is no direct correlation between the two. In this case, the preset performance standard can be a comprehensive error calculated based on the calculated results of the static jitter error and dynamic following error and their respective weights. This comprehensive error value can represent the performance index of the motion performance of the multi-axis motion machine 130. That is, assuming that the calculated result of the static jitter error is M and the calculated result of the dynamic following error is N, when representing the performance index of the motion performance of the multi-axis motion machine 130, the weight of the static jitter error is a, and the weight of the dynamic following error is b. Then, the comprehensive error corresponding to the control parameters of the current axis is a*M+b*N. Let the preset comprehensive error threshold be Q. If a*M+b*N<Q, it is considered that the static jitter error and dynamic following error corresponding to the control parameters of the current axis meet the preset performance standard.

[0103] In summary, the control parameter adjustment method for various motion machines applied to semiconductor inspection systems provided by any of the above embodiments obtains the initial control parameters of the multi-axis motion machine after detecting that the workpiece to be tested is fixed on the stage, and completes at least one movement process based on the parameters, thereby calculating the static jitter error and dynamic following error, and then iteratively adjusting the control parameters until the error meets the preset performance standard, thereby achieving precise parameter adjustment of the multi-axis motion machine. This method significantly improves the motion accuracy and stability of the machine under static and dynamic working conditions, ensures the positioning accuracy and trajectory tracking capability of the workpiece to be tested during processing or inspection; achieves traceability and repeatability of parameter optimization by quantifying error indicators, avoids the subjectivity of manual debugging; shortens the machine debugging cycle, reduces the scrap rate and equipment loss caused by parameter mismatch; and ultimately ensures the reliable operation of the multi-axis motion system under complex working conditions, providing core technical support for scenarios such as high-precision manufacturing, precision assembly and automated inspection.

[0104] Figure 5 This is a flow chart of a control parameter setting method provided by another embodiment of the present application. Figure 5 As shown, the control parameter method provided in this embodiment specifically includes the following steps:

[0105] Step S510: After detecting that the workpiece to be tested is fixed on the stage, initial control parameters of the multi-axis motion machine are obtained.

[0106] Step S520: Control the multi-axis motion machine to complete at least one movement process based on the initial control parameters.

[0107] Step S530: Calculate the static jitter error and dynamic following error during the motion process.

[0108] Step S540: Adjust the initial control parameters until the calculated static jitter error and dynamic following error meet the preset performance standards.

[0109] It should be noted that the implementation process of steps S510 to S540 is the same as that of steps S210 to S240 in any of the above embodiments, and has the same technical effect. To avoid repetition, they will not be described here.

[0110] Step S550: Generate optimal control parameter configuration files corresponding to different specification parameters according to the specification parameters of the device under test.

[0111] In this embodiment, after detecting that the workpiece to be tested is fixed to the worktable 110, the initial control parameters of the multi-axis motion machine 130 are obtained, and at least one movement process is completed based on the parameters. The static jitter error and dynamic following error are then calculated. The control parameters are then iteratively adjusted until the error meets the preset performance standard. After the control parameters of the multi-axis motion machine 130 are calibrated, optimal control parameter configuration files corresponding to different specification parameters are generated based on the specification parameters of the workpiece to be tested.

[0112] In some embodiments, the specification parameters of the part to be tested include at least the weight of the part to be tested. For example, in wafer testing, for the testing of wafers of different weights, the machine control parameters need to be dynamically adjusted according to the wafer mass, mechanical properties and testing process requirements to ensure detection accuracy, equipment stability and wafer safety. Specifically, the weight of the wafer directly affects the inertial force during movement. Heavy wafers need to reduce acceleration to avoid slipping or breaking, and the braking time of heavy wafers is longer, so the motion trajectory needs to be planned in advance. The mass of the wafer can also change the natural frequency of the system. Heavy wafers reduce the natural frequency of the system and are prone to resonance. Heavy wafers may produce greater jitter when stationary due to the flexibility of the mechanical structure. The trajectory tracking error increases during high-speed movement, so dynamic adjustment is required. Therefore, the trajectory and performance standards set during the control parameter setting process for parts to be tested with different specifications are different. After completing the parameter setting for parts to be tested with different specifications, it is very necessary to generate optimal control parameter configuration files corresponding to different specifications.

[0113] In some embodiments, the generated optimal control parameter configuration file can be a configuration file composed of multi-axis optimal control parameters, that is, the configuration file is a file formed by the control parameters of multiple single axes obtained through the above steps. After the working conditions are clarified during the detection process, it can be directly called to control the movement of the multi-axis motion machine 130 and assist the detection device 120 to complete the detection of the test piece.

[0114] The generated optimal control parameter configuration file can also be a plurality of configuration files composed of a combination of single-axis optimal control parameters, that is, the configuration file is a packaged file formed by multiple files containing the control parameters of multiple single axes obtained through the above steps. After the working conditions are clarified during the detection process, it can be selectively called to control the movement of the multi-axis motion machine 130 and assist the detection device 120 to complete the detection of the workpiece to be tested.

[0115] In some embodiments, based on any of the above embodiments, the control parameter setting method further includes:

[0116] Step S560: In response to the storage instruction, save the optimal control parameter configuration files corresponding to different specification parameters to a designated location; wherein the designated location includes a designated location of local storage, a designated location of the host computer and / or a designated location of the Internet platform.

[0117] In this embodiment, after detecting that the DUT is fixed to the stage 110, the initial control parameters of the multi-axis motion machine 130 are obtained. Based on these parameters, at least one movement process is performed to calculate the static jitter error and dynamic following error. The control parameters are then iteratively adjusted until the errors meet preset performance standards. After the control parameters of the multi-axis motion machine 130 are tuned, optimal control parameter configuration files corresponding to different DUT specifications are generated based on the DUT specifications. To facilitate subsequent testing of different DUTs by the inspection system 100, the multi-axis motion machine 130 can quickly retrieve the corresponding optimal control parameter configuration files. The generated optimal control parameter configuration files for different DUT specifications can be saved to a designated location in response to an externally input storage instruction.

[0118] In some embodiments, the storage process may be offline storage and online storage, that is, the corresponding designated location may be one or more of a designated location of local storage, a designated location of a host computer, and a designated location of an Internet platform.

[0119] After the control parameters of the multi-axis motion machine 130 of the detection system 100 are adjusted and the optimal control parameter configuration files corresponding to different specification parameters are obtained, in the subsequent detection control process of the detection system 100, the adjusted optimal control parameter configuration files can be directly retrieved online or offline, which can greatly shorten the time for debugging the multi-axis motion machine 130 before detection.

[0120] Therefore, an embodiment of the present application further provides a control method for the detection system 100, which is described in detail below.

[0121] Figure 6 This is a flow chart of a control method for a detection system provided by an embodiment of the present application. Figure 6 As shown, the detection method provided in this embodiment is applied to the detection system 100 of any of the above embodiments, and can be specifically executed in the controller or processor of the detection system 100. The control method specifically includes the following steps:

[0122] Step S610: After detecting that the workpiece to be tested is fixed on the stage, target working condition information is obtained; wherein the target working condition information at least includes specification parameters of the workpiece to be tested and a target scanning trajectory.

[0123] Step S620: call a pre-stored optimal control parameter configuration file corresponding to the specification parameters of the device under test; wherein the optimal control parameter configuration file corresponding to the specification parameters of the device under test is obtained by the control parameter setting method described in any of the above embodiments.

[0124] Step S630 : Based on the optimal control parameters of the called optimal control parameter configuration file, control the multi-axis motion machine to move along the target scanning trajectory to inspect the workpiece.

[0125] In this embodiment, before inspecting the piece to be tested, it is first detected whether the piece to be tested is fixedly placed on the stage 110 of the inspection system 100. After determining that the piece to be tested is correctly fixed on the stage 110, the target working condition information is obtained, wherein the target information at least includes the specification parameters and the target scanning trajectory of the piece to be tested. After the specification parameters of the piece to be tested are clarified, the optimal control parameter configuration file corresponding to the specification parameters of the piece to be tested that has been pre-stored can be called, and the optimal control parameter configuration file corresponding to the specification parameters of the piece to be tested can be parsed at the same time to obtain the optimal control parameters carried in the called optimal control parameter configuration file. Based on the optimal control parameters, the multi-axis motion machine 130 is controlled to move along the target scanning trajectory to inspect the piece to be tested, and the final inspection result is obtained.

[0126] Among them, the optimal control parameter configuration file corresponding to the specification parameters of the device under test is obtained by the control parameter adjustment method described in any of the above embodiments. The acquisition process is the same as the process implemented in any of the above embodiments. To avoid repetition, it will not be repeated here.

[0127] In some embodiments, after confirming that the DUT is correctly secured on stage 110, the acquired target operating condition information also includes target detection items. Step S620, when invoking a pre-stored optimal control parameter configuration file corresponding to the DUT's specification parameters, specifically involves determining, based on the target detection items, the specific axis corresponding to the target detection items, and then selecting and invoking the optimal control parameter configuration parameters for the specific axis.

[0128] It is understandable that for some specific inspection items, more attention is paid to the specific defects or deficiencies of the workpiece to be tested. During the inspection process, it is only necessary to control the multi-axis motion machine 130 to perform reciprocating motion in a certain direction, or during the inspection process, it is only necessary to accurately control the movement in one direction, and basic parameters can be used in other directions. In such cases, according to the target inspection item, the specific axis that the target inspection item pays more attention to can be determined, and the optimal control parameter configuration file corresponding to the specific axis can be called from the pre-stored optimal control parameter configuration file to obtain the optimal control parameters of the specific axis, or the optimal control parameters corresponding to the specific axis can be called from the pre-stored optimal control parameter configuration file.

[0129] In some embodiments, when calling a pre-stored optimal control parameter configuration file corresponding to the specification parameters of the device to be tested, the optimal control parameter configuration file is obtained from a specified location in response to the calling instruction; wherein the specified location includes a specified location of local storage, a specified location of the host computer and / or a specified location of the Internet platform.

[0130] It can be understood that after the control parameters of the multi-axis motion machine 130 are adjusted for the test pieces with different specifications and parameters, the generated optimal control parameter configuration file may be stored in a specified offline location or in a specified online location. At this time, in response to the call instruction input from the external input, the optimal control parameter configuration file is obtained from the specified location, that is, it can be obtained from the specified location of local storage, the specified location of the host computer, or from the specified location of the Internet platform when connected to the Internet. Different calling methods are suitable for different detection systems 100, which can reduce the pressure on the data storage of the detection equipment.

[0131] The control method of the detection system provided in this embodiment automatically obtains the specification parameters and target scanning trajectory of the workpiece to be tested after the detection system is started, and calls a pre-stored optimal control parameter configuration file that accurately matches the specification parameters to achieve dynamic parameter adaptation of the multi-axis motion machine, thereby ensuring that the machine can still drive the target scanning trajectory with the optimal control strategy under complex working conditions, significantly improving the compatibility (adaptation to workpieces of different specifications), detection accuracy (reducing errors caused by parameter mismatch) and stability (avoiding detection failures caused by vibration, inertia, etc.) of the detection system. At the same time, the pre-stored configuration file reduces the complexity and time cost of on-site debugging, providing a reusable standardized technical solution for high-precision and high-efficiency detection in fields such as semiconductors and precision manufacturing.

[0132] Figure 7 This is a schematic diagram of the structure of a detection system provided in another embodiment of the present application. Figure 7 As shown, the detection system 700 provided in this embodiment at least includes a stage 710 , a detection device 720 and a multi-axis motion machine 730 .

[0133] In this embodiment, the stage 710 is used to carry the workpiece to be tested during testing, thereby providing a process platform for optical testing of the workpiece to be tested.

[0134] The detection device 720 is used to perform at least one detection item on the part to be tested, and includes an optical component, an objective lens, and a detection component. The optical component is used to perform optical imaging of the part to be tested on the stage 710 through the objective lens, and transmit the optical signal obtained by imaging to the detection component. The detection component is used to convert the optical signal into an electrical signal, thereby obtaining a detection image of the part to be tested.

[0135] In some embodiments, the detection device 720 further includes a filter component, which is used to filter the optical signal generated by the optical component.

[0136] The multi-axis motion machine 730 includes a driver 7301 and a controller 7302, wherein the controller 7302 is used to execute the steps of the control parameter adjustment method and / or the detection control method as described in any of the above embodiments, so as to realize the relative movement of the object stage 710 relative to the objective lens by driving the driver 7301, so that the optical component can perform optical imaging of the object to be tested on the object stage 710 through the objective lens.

[0137] It should be noted that when the controller executes the steps of the control parameter adjustment method and / or the detection control method as described in any of the above embodiments, its implementation process is the same as the process described in any of the above embodiments and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0138] An embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, it implements the above-mentioned control parameter setting and / or each process of any embodiment of the control method of the detection system, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0139] Among them, the processor can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, etc., to execute relevant programs to implement the technical solution provided by this embodiment.

[0140] Those skilled in the art will appreciate that all or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer program. When all or part of the functions in the above embodiments are implemented by computer program, the program can be stored in a computer-readable storage medium, and the storage medium can include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to implement the above functions. For example, the program is stored in the memory of the device, and when the program in the memory is executed by the processor, all or part of the above functions can be implemented. In addition, when all or part of the functions in the above embodiments are implemented by computer program, the program can also be stored in a storage medium such as a server, another computer, disk, optical disk, flash disk or mobile hard disk, and saved in the memory of the local device by downloading or copying, or the system of the local device is updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments can be implemented.

[0141] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can make several simple deductions, modifications or replacements based on the ideas of the present application without departing from the scope of protection of the purpose of the present application and the claims. All of these are within the protection of the present application.

Claims

1. A control parameter setting method, characterized in that: Applied to a detection system, the detection system includes a multi-axis motion machine and a stage, the stage is arranged on the multi-axis motion machine, and the stage is used to carry and fix the test piece; the adjustment method includes: After detecting that the workpiece to be tested is fixed on the stage, obtaining initial control parameters of the multi-axis motion machine; the initial control parameters include at least one of position loop parameters, speed loop parameters, and current loop parameters; Controlling the multi-axis motion machine to complete at least one movement process based on the initial control parameters; Calculate static jitter error and dynamic following error during motion; The initial control parameters are adjusted until the calculated static jitter error and dynamic following error meet preset performance standards.

2. The control parameter setting method according to claim 1, characterized in that: The obtaining of initial control parameters of the multi-axis motion machine includes: Obtaining a Bode diagram of the multi-axis motion machine; Initial control parameters of the multi-axis motion machine are determined according to the Bode diagram of the multi-axis motion machine.

3. The control parameter setting method according to claim 1, characterized in that: The controlling the multi-axis motion machine to complete at least one movement process based on the initial control parameters includes: The multi-axis motion machine is controlled to complete at least one single-axis movement process based on the initial control parameters; the single-axis movement process includes reciprocating motion in the Z-axis direction, reciprocating motion in the X-axis direction, reciprocating motion in the Y-axis direction, and reciprocating motion in the T-axis direction.

4. The control parameter setting method according to claim 3, characterized in that: The calculation of the static jitter error and the dynamic following error during the motion process includes: Get the actual positions of at least two locations in the selected direction; Calculating a static jitter error corresponding to a selected direction based on a deviation between the actual position and the corresponding set position; Obtain at least one actual motion trajectory during single-axis movement in a selected direction; The dynamic following error corresponding to the selected direction is calculated based on the deviation value between the actual motion trajectory and the corresponding set motion trajectory.

5. The control parameter setting method according to claim 4, characterized in that: The preset performance standard is: based on the calculated results of the static jitter error and the dynamic following error and their respective weights, the calculated performance index characterizing the motion performance of the multi-axis motion machine reaches a preset threshold.

6. The control parameter setting method according to any one of claims 2 to 5, characterized in that: Also includes: Generating optimal control parameter configuration files corresponding to different specification parameters according to the specification parameters of the test piece; The specifications include weight; The optimal control parameter configuration file includes a configuration file composed of multi-axis optimal control parameters and / or a configuration file composed of a combination of multiple single-axis optimal control parameters.

7. The control parameter setting method according to claim 6, characterized in that: Also includes: In response to the storage instruction, saving the optimal control parameter configuration files corresponding to different specification parameters to a designated location; The designated location includes a designated location of local storage, a designated location of a host computer, and / or a designated location of an Internet platform.

8. A control method for a detection system, characterized in that: The detection system includes a multi-axis motion machine and a stage, wherein the stage is arranged on the multi-axis motion machine and is used to carry and fix the workpiece to be tested; the control method includes: After detecting that the object to be tested is fixed on the stage, obtaining target working condition information; the target working condition information at least includes specification parameters of the object to be tested and a target scanning trajectory; Recalling a pre-stored optimal control parameter configuration file corresponding to the specification parameters of the device under test; wherein the optimal control parameter configuration file is obtained using the control parameter setting method according to any one of claims 1 to 7; Based on the optimal control parameters of the called optimal control parameter configuration file, the multi-axis motion machine is controlled to move along the target scanning trajectory to detect the workpiece to be tested.

9. The control method of the detection system according to claim 8, characterized in that: The target operating condition information also includes target detection items; The calling of a pre-stored optimal control parameter configuration file corresponding to the specification parameters of the device under test includes: Determining, according to the target detection item, a specific axis corresponding to the target detection item; The optimal control parameter configuration parameters for the specific axis are called.

10. The control method of the detection system according to claim 8, characterized in that: The calling of a pre-stored optimal control parameter configuration file corresponding to the specification parameters of the device under test includes: In response to the calling instruction, obtaining the optimal control parameter configuration file from a specified location; The designated location includes a designated location of local storage, a designated location of a host computer, and / or a designated location of an Internet platform.

11. A detection system, characterized in that: include: The stage is used to carry and fix the test piece; A detection device, comprising an optical component, an objective lens and a detection component; The optical component is used to perform optical imaging of the object to be tested on the stage through the objective lens, and transmit the optical signal obtained by imaging to the detection component, and the detection component is used to convert the optical signal into an electrical signal, so as to obtain a detection image of the object to be tested; Multi-axis motion machines, including drives and controllers; The controller is used to execute the method according to any one of claims 1 to 10, and drive the driver to make the stage move relative to the objective lens.

12. The detection system according to claim 11, characterized in that: The detection device also includes a filter component; The filter component is used to perform filtering processing on the optical signal generated by the optical component.

13. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the steps of the control parameter adjustment method as described in any one of claims 1 to 7, and / or the steps of the detection system control method as described in any one of claims 8 to 10.

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