Wafer six-surface detection equipment

Abstract

The invention provides wafer six-surface detection equipment, and relates to the technical field of wafer detection, the wafer six-surface detection equipment comprises an equipment detection platform and a numerical control gantry truss, one side of the top end of the equipment detection platform is provided with a feeding module used for bearing a to-be-detected sample and a qualified discharging module used for bearing the detected sample, a feeding transfer deviation rectifying module is arranged between the feeding module and the qualified discharging module, a six-face detection module used for detecting samples and an NG discharging module used for separating unqualified samples are installed on the other side of the top end of the equipment detection platform, and a discharging transfer deviation rectifying module is arranged between the qualified discharging module and the NG discharging module. After the wafers are corrected through the feeding transfer correction module, the wafers are placed on the detection station to be subjected to six-face detection, after detection is completed, the wafers are corrected again through the discharging transfer correction module, the qualified wafers are orderly placed in a carrier through the qualified discharging module, and the unqualified wafers are subjected to NG discharging treatment through the NG discharging module.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a wafer six-side detection device. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. Silicon ingots are ground, polished, and sliced ​​into silicon wafers, or wafers. As the fundamental raw material for the integrated circuit (IC) and chip industries, wafer quality directly impacts the performance of subsequent ICs and chips. During the wafer production process, each step can introduce defects, which can lead to chip performance degradation or failure. Therefore, wafer inspection is a critical step in ensuring chip manufacturing quality and improving production yield.

[0003] Deficiencies in existing technologies: Existing wafer AOI inspection equipment usually inspects the entire wafer. During inspection, only one side of the wafer can be inspected, and all sides of the die cannot be effectively inspected at the same time. At the same time, the position of the wafer to be inspected cannot be adjusted and corrected during the inspection process, which easily affects the accuracy of the wafer inspection position and results. When the front-end cutting process needs to be improved, or when there are higher appearance control standards for the sides of the die, ordinary wafer AOI inspection equipment cannot meet its inspection needs, which greatly reduces the inspection efficiency of the equipment. Summary of the Invention

[0004] The problem to be solved by the present invention is that the existing detection equipment cannot effectively detect all sides of the grain at the same time, and the position of the wafer to be detected cannot be adjusted and corrected during the detection process, which easily affects the accuracy of the wafer detection position and results, and cannot meet the demand for higher appearance control standards for the sides of the grain.

[0005] In order to solve the above technical problems, the present invention provides a six-sided inspection device for wafers, comprising an equipment inspection platform and a CNC gantry truss arranged at the top thereof, wherein a loading module for carrying samples to be inspected and a qualified unloading module for carrying inspected samples are provided on one side of the top of the equipment inspection platform, a loading transfer and correction module is provided between the loading module and the qualified unloading module, a six-sided inspection module for inspecting samples and an NG unloading module for separating unqualified samples are installed on the other side of the top of the equipment inspection platform, and a unloading transfer and correction module is provided between the qualified unloading module and the NG unloading module; The feeding transfer and correction module includes an adjustment frame located at the top of the equipment detection platform, a movable base is provided at the top of the adjustment frame, a correction platform is provided at the top of the movable base, and a first adsorption platform is fixedly connected to the top of the correction platform; The six-sided detection module includes a turntable arranged on the top of the equipment detection platform, and a plurality of detection stations are provided on the turntable. Each of the detection stations is provided with a second adsorption platform, and six wafer detection devices are installed on the outer side of the turntable.

[0006] Preferably, a material picking assembly is installed on one side of the bottom end of the CNC gantry truss, and the position of the material picking assembly corresponds to the position of the deflection correction platform, and the position of the deflection correction platform corresponds to the position of the detection station.

[0007] Preferably, the inner cavity of the movable base is provided with a first driving device, the output end of the first driving device is fixedly connected to the bottom end of the correction platform, one end of the movable base is provided with a fastener, and the movable base is movably connected to the adjustment frame.

[0008] Preferably, the material picking assembly includes a linear guide rail fixedly mounted on the bottom end of the CNC gantry truss, and a material picking device is mounted on the linear guide rail, and the position of the material picking device corresponds to the correction platform and the detection station.

[0009] Preferably, an equipment frame is installed in the middle of the CNC gantry truss, and a second driving device for driving the turntable to rotate is installed on the equipment frame. The output end of the second driving device is fixedly connected to the central axis of the turntable. Several of the inspection stations are arranged in a circular array, and six of the wafer inspection devices are arranged in a circular array at the top of the equipment inspection platform. The position of the wafer inspection device corresponds to the position of the inspection station.

[0010] Preferably, a loading robot and a first unloading robot are installed at one end of the CNC gantry truss, the loading robot is located between the loading module and the loading transfer correction module, the qualified unloading module is installed with a carrier for storing qualified wafers, and the loading transfer correction module and the unloading transfer correction module have the same structure.

[0011] Preferably, a second blanking robot is installed at the other end of the CNC gantry truss. The structure of the second blanking robot is the same as that of the first blanking robot. The second blanking robot is located between the NG blanking module and the inspection station.

[0012] Preferably, the top of the CNC gantry truss is provided with an air circuit system for driving a device to realize corresponding actions, the top of the equipment detection platform is provided with an equipment housing, and the equipment housing is provided with an operation panel.

[0013] Technical effects and advantages of the present invention: 1. The present invention inspects wafers using a six-side inspection module. Before inspection, the loading module moves the wafer sample to be inspected to the loading and deflection correction module for correction. After correction, the wafer sample to be inspected is moved to the inspection station by the picker assembly. A second adsorption platform adsorbs the wafer sample to the inspection station. During the inspection process, a second drive device is activated to rotate a turntable. Six inspection devices are arranged in a circular array around the turntable. As the turntable rotates, the wafer sample to be inspected at the inspection station passes through the six wafer inspection devices in sequence. The six wafer inspection devices sequentially inspect the six sides of the wafer sample, thus enabling the device to inspect the side surfaces of the wafer sample, meeting the demand for high-level visual control of the wafer side surfaces, and effectively improving the device's inspection efficiency and the accuracy of the test results.

[0014] 2. The present invention utilizes a loading and transfer deflection correction module to correct wafer samples to be inspected. Wafer samples to be inspected are placed on a deflection correction table by a loading robot. When the loading module loads the wafer samples, the wafer samples are first placed on the deflection correction table. A first suction table secures the wafer samples to the deflection correction table by suction. A first drive device is then activated to rotate the deflection correction table, correcting the position of the wafer samples. The deflection correction table can also be adjusted on the adjustment frame to accommodate different sample sizes. After position adjustment, fasteners are used to secure the movable base, ensuring that wafer samples of varying sizes can be accurately placed on the deflection correction table for correction.

[0015] 3. This invention incorporates a mid-unloading transfer and deflection correction module between the qualified unloading module and the failed unloading module. After inspection, the mid-unloading transfer and deflection correction module accurately corrects the position and angle of the inspected wafers. Following this correction, the retrieving arm of the first unloading robot moves the qualified wafers to the qualified unloading module. The qualified unloading module is equipped with a wafer storage carrier, allowing qualified wafers to be placed in an orderly manner. This effectively improves the device's wafer inspection efficiency. The failed wafers are then processed by the failed unloading module, avoiding delays and errors associated with manual sorting. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The overall structure of the present invention is shown in FIG. Figure 1 .

[0017] Figure 2 It is a schematic structural diagram of the overall invention from another perspective.

[0018] Figure 3 For the present invention Figure 1 A magnified schematic diagram of the structure in the middle.

[0019] Figure 4 It is a schematic diagram of the structure of the six-side detection module of the present invention.

[0020] Figure 5 The overall structure of the present invention is shown in FIG. Figure 2 .

[0021] Figure 6 It is a schematic diagram of the overall cross-sectional structure of the present invention.

[0022] Figure 7 It is a schematic diagram of the overall external structure of the present invention.

[0023] The accompanying drawings are marked as follows: 1. Equipment detection platform; 2. CNC gantry truss; 3. Loading module; 4. Qualified unloading module; 5. Loading transfer correction module; 51. Adjustment frame; 52. Movable base; 53. Correction platform; 54. First adsorption platform; 55. First drive device; 56. Fastener; 6. Six-sided detection module; 61. Turntable; 62. Inspection station; 63. Second adsorption platform; 64. Wafer detection device; 65. Picking assembly; 651. Linear guide rail; 652. Picking equipment; 66. Equipment frame; 67. Second drive device; 7. NG unloading module; 8. Unloading transfer correction module; 9. Loading robot; 10. First unloading robot; 11. Carrier; 12. Second unloading robot; 13. Air system; 14. Equipment housing; 15. Operation panel. DETAILED DESCRIPTION

[0024] The present invention provides a wafer six-side detection device, such as Figure 1 - Figure 7 As shown, it includes an equipment detection platform 1 and a CNC gantry truss 2 arranged at the top thereof, a loading module 3 for carrying samples to be detected and a qualified unloading module 4 for carrying samples after detection are arranged on one side of the top of the equipment detection platform 1, a loading transfer and correction module 5 is arranged between the loading module 3 and the qualified unloading module 4, a six-sided detection module 6 for detecting samples and an NG unloading module 7 for separating unqualified samples are installed on the other side of the top of the equipment detection platform 1, and a unloading transfer and correction module 8 is arranged between the qualified unloading module 4 and the NG unloading module 7.

[0025] Further, such as Figure 1 and Figure 3 As shown, the loading and transfer correction module 5 includes an adjustment frame 51 located at the top of the equipment detection platform 1, a movable base 52 is provided at the top of the adjustment frame 51, a correction platform 53 is provided at the top of the movable base 52, and a first adsorption platform 54 is fixedly connected to the top of the correction platform 53, and the wafer sample is adsorbed on the correction platform 53 through the first adsorption platform 54.

[0026] Further, such as Figure 2 and Figure 4As shown, the six-sided detection module 6 includes a turntable 61 arranged at the top of the equipment detection platform 1, and a number of detection stations 62 are provided on the turntable 61. Each detection station 62 is provided with a second adsorption platform 63, and six wafer detection devices 64 are installed on the outside of the turntable 61. After the corrected wafer sample to be detected is adsorbed on the detection station 62 by the second adsorption platform 63, the wafer sample is inspected by the wafer detection device 64.

[0027] Further, such as Figure 5 and Figure 6 As shown, a material picking component 65 is installed on one side of the bottom end of the CNC gantry truss 2. The position of the material picking component 65 corresponds to the position of the correction platform 53, and the position of the correction platform 53 corresponds to the position of the detection station 62. The wafer sample is first corrected in position by the loading and transfer correction module 5, and then moved to the detection station 62 to prevent the loading module 3 from shifting the position when moving the wafer sample to the detection station 62, thereby affecting the accuracy of the detection position.

[0028] Further, such as Figure 3 and Figure 6 As shown, the inner cavity of the movable base 52 is provided with a first driving device 55, and the output end of the first driving device 55 is fixedly connected to the bottom end of the correcting platform 53. One end of the movable base 52 is provided with a fastener 56. The movable base 52 is movably connected to the adjustment frame 51. When the sample of the wafer to be tested is loaded through the loading module 3, the wafer sample is first adsorbed on the correcting platform 53 through the first adsorption platform 54, and then the first driving device 55 is started to drive the correcting platform 53 to rotate, and the position of the wafer sample is corrected to ensure the accuracy of the detection position. At the same time, due to the different specifications and sizes of different wafer samples, the position placed on the loading module 3 may be different. Therefore, the position of the correcting platform 53 on the adjustment frame 51 can be adjusted according to the specifications and sizes of different wafer samples. After the position adjustment is completed, the position of the movable base 52 is fixed by the fastener 56 to ensure that wafer samples of different specifications and sizes can be accurately moved from the loading module 3 to the correcting platform 53 for correction.

[0029] Further, such as Figure 6As shown, the material picking component 65 includes a linear guide 651 fixedly installed at the bottom end of the CNC gantry truss 2, and a material picking device 652 is installed on the linear guide 651. The material picking device 652 corresponds to the position of the correction platform 53 and the detection station 62. The material picking device 652 adopts the vacuum adsorption material picking arm in the existing technology. Among them, the existing technology of the vacuum adsorption material picking arm is relatively mature and will not be described in detail here. Its working principle is to form a negative pressure in the inner cavity of the suction cup through the built-in vacuum air path design, so as to adsorb the wafer sample and complete the material picking operation. The linear guide 651 includes a servo motor, a lead screw and a slider and other structures, which belong to the existing technology. The lead screw is driven by the servo motor to drive the slider to realize linear movement, so that the linear guide 651 drives the material picking device 652 to realize linear movement in the direction of the detection station 62, driving the corrected wafer sample to be accurately placed on the second adsorption platform 63, and the wafer sample is fixed on the detection station 62 for detection through the second adsorption platform 63.

[0030] Further, such as Figure 2 and Figure 5 As shown, an equipment frame 66 is installed in the middle of the CNC gantry truss 2, and a second driving device 67 for driving the turntable 61 to rotate is installed on the equipment frame 66. The output end of the second driving device 67 is fixedly connected to the central axis of the turntable 61, and a number of inspection stations 62 are arranged in a circular array. Six wafer inspection devices 64 are arranged in a circular array at the top of the equipment inspection platform 1 and surround the turntable 61. The position of the wafer inspection device 64 corresponds to the position of the inspection station 62. During inspection, the second driving device 67 is started to drive the turntable 61 to rotate, so that the turntable 61 drives the wafer sample to be inspected on the inspection station 62 to pass through the six wafer inspection devices 64 in turn. The six wafer inspection devices 64 simultaneously inspect six surfaces of the wafer sample to be inspected. After the inspection is completed, the inspection result is output by the wafer inspection device 64, so that the device can inspect the side of the wafer at the same time, meet the demand for high appearance control of the side of the wafer, and effectively improve the working efficiency and result accuracy of the device inspection.

[0031] Further, such as Figure 1 and Figure 6As shown, a loading robot 9 and a first unloading robot 10 are installed at one end of the CNC gantry truss 2. The loading robot 9 and the first unloading robot 10 both adopt single-arm robotic arms. Among them, the existing technology of single-arm robotic arms is relatively mature and will not be described in detail here. They are usually composed of a driving motor, a reducer, a main arm and an end effector. The end effector adopts a vacuum suction cup, which realizes non-destructive transportation of the wafer through the vacuum suction cup, and accurately places the wafer on the correction table 53 and the inspection station 62. The loading robot 9 is located between the loading module 3 and the loading transfer correction module 5. A carrier 11 for storing qualified wafers is installed on the qualified unloading module 4. The loading transfer correction module 5 and the unloading transfer correction module 8 have the same structure. The wafer sample to be tested placed on the loading module 3 is moved to the correction table 53 for correction operation through the material-picking robotic arm in the loading robot 9. After the correction operation is completed, the wafer is corrected by the material-picking equipment 652 Transfer and move the wafer sample to be tested on the correction table 53 to the top of the second adsorption table 63, so that the position of each wafer sample can be kept consistent, avoiding position deviation during the loading process, affecting the accuracy of the detection and the accuracy of the detection results. After the detection is completed, the detection result data is processed internally by the equipment, and the qualified wafers are sucked by the wafer sample by the first unloading robot 10 through the material picking robot arm and moved to the unloading transfer correction module 8. The unloading transfer correction module 8 accurately corrects the position and angle of the wafer after detection. After the correction is completed, the qualified wafer is moved to the carrier 11 on the qualified unloading module 4 through the material picking robot arm in the first unloading robot 10. The carrier 11 can be a waffle box, a crystal expansion ring or an iron ring, so that the qualified wafers can be placed in the carrier 11 accurately and orderly, which is beneficial to the subsequent operation of the wafer and effectively improves the working efficiency of the device for wafer detection.

[0032] Further, such as Figure 1 and Figure 2 As shown, a second unloading robot 12 is installed at the other end of the CNC gantry truss 2. The structure of the second unloading robot 12 is the same as that of the first unloading robot 10. The second unloading robot 12 is located between the NG unloading module 7 and the inspection station 62. It detects unqualified wafers and uses the material-picking robot arm in the second unloading robot 12 to suck them up and move them to the NG unloading module 7. The NG unloading module 7 includes automated components such as robot arms, cylinders or belts, which can quickly identify and separate unqualified products from qualified products. The unqualified wafers are subjected to NG unloading processing through the NG unloading module 7 to avoid delays and errors in manual sorting.

[0033] Further, such as Figure 2 and Figure 7As shown, the top of the CNC gantry truss 2 is provided with an air circuit system 13 for driving the device to realize the corresponding action, and the top of the equipment detection platform 1 is provided with an equipment housing 14, and the equipment housing 14 is provided with an operation panel 15. Among them, the existing technology of the air circuit system 13 is relatively mature and will not be described in detail here. The corresponding function is achieved by controlling the flow and pressure of the gas. The air source provides compressed air, which is transported to the control element and the actuator through the air circuit pipeline. The control element controls the flow and pressure of the gas according to the preset logic or signal, and then drives the actuator to complete the corresponding action.

[0034] The working principle of the present invention is as follows: first, the wafer sample to be tested is placed on the loading module 3, and the device is operated by using the operation panel 15. The gas system 13 in the device controls the equipment in the device to realize the corresponding action, and the corresponding function is realized by controlling the flow and pressure of the gas. The gas source provides compressed air, which is transported to the control element and the execution element through the gas pipeline. The control element controls the flow and pressure of the gas according to the preset logic or signal, and then drives the execution element to complete the corresponding action. According to the operation, the loading robot 9 is first started. The end effector of the material-picking robot arm in the loading robot 9 adopts a vacuum suction cup, which adsorbs the wafer sample through the vacuum suction cup to realize non-destructive transportation of the wafer, and accurately places the wafer on the correction table 53, and then starts the first The driving device 55 drives the deflection correction table 53 to rotate through the first driving device 55, and corrects the position of the wafer sample to ensure the accuracy of the detection position. Since the specifications and sizes of different wafer samples are different, the positions where they are placed on the loading module 3 may be different. The position of the deflection correction table 53 on the adjustment frame 51 can be adjusted according to the specifications and sizes of different samples. After the position adjustment is completed, the position of the movable base 52 is fixed by the fastener 56 to ensure that wafer samples of different specifications and sizes can be accurately placed on the deflection correction table 53 for correction. After the correction is completed, the vacuum air path design built into the material taking device 652 is used to form a negative pressure in the inner cavity of the suction cup to adsorb the wafer sample and complete the material taking operation. After the material taking is completed, the linear guide is started The rail 651 drives the material-retrieving device 652 to move linearly in the direction of the inspection station 62, so that the corrected wafer sample adsorbed on the material-retrieving device 652 moves to the second adsorption platform 63, and is fixed on the inspection station 62 through the second adsorption platform 63. Then, the second driving device 67 is started to drive the turntable 61 to rotate, so that the turntable 61 drives the wafer sample to be inspected fixed on the inspection station 62 to pass through the six wafer inspection devices 64 in sequence. The six wafer inspection devices 64 simultaneously inspect six sides of the wafer sample to be inspected. After the inspection is completed, the inspection results are output by the wafer inspection device 64, which enables the device to inspect the sides of the wafer at the same time, effectively improving the working efficiency of the wafer inspection. After the inspection is completed, the data processing equipment inside the equipment processes the data. The inspection result data is processed, and the qualified wafers are grabbed by the picking robot arm in the first unloading robot 10 and moved to the unloading transfer correction module 8. The operation process of the unloading transfer correction module 8 is consistent with the operation process of the loading transfer correction module 5. Therefore, the unloading transfer correction module 8 is used to accurately correct the position and angle of the wafer after inspection. After the correction is completed, the qualified wafers are moved to the qualified unloading module 4 by the picking robot arm in the first unloading robot 10. A carrier 11 for storing wafers is placed on the qualified unloading module 4, so that the qualified wafers can be placed in the carrier 11 in an orderly manner, which is beneficial to the subsequent operation of the wafers. Unqualified wafers are detected and grabbed by the picking robot arm in the second unloading robot 12 and moved to the NG unloading module 7.The NG unloading module 7 quickly identifies and separates defective products from qualified products, and performs NG unloading on defective wafers, thus avoiding delays and errors caused by manual sorting.

[0035] It will be understood that the present invention is described by way of some embodiments, and it will be appreciated by those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be protected by the present invention.

Claims

1. A wafer six-side inspection device, comprising an equipment inspection platform (1) and a CNC gantry truss (2) arranged on the top thereof, characterized in that: A loading module (3) for carrying samples to be tested and a qualified unloading module (4) for carrying tested samples are provided on one side of the top of the equipment detection platform (1); a loading transfer and deviation correction module (5) is provided between the loading module (3) and the qualified unloading module (4); a six-sided detection module (6) for testing samples and an NG unloading module (7) for separating unqualified samples are installed on the other side of the top of the equipment detection platform (1); a unloading transfer and deviation correction module (8) is provided between the qualified unloading module (4) and the NG unloading module (7); The feeding transfer and correction module (5) comprises an adjustment frame (51) arranged at the top of the equipment detection platform (1), a movable base (52) is arranged at the top of the adjustment frame (51), a correction platform (53) is arranged at the top of the movable base (52), and a first adsorption platform (54) is fixedly connected to the top of the correction platform (53); The six-side detection module (6) includes a turntable (61) arranged on the top of the equipment detection platform (1), a plurality of detection stations (62) are arranged on the turntable (61), each of the detection stations (62) is provided with a second adsorption platform (63), and six wafer detection devices (64) are installed on the outer side of the turntable (61); A second blanking robot (12) is installed at the other end of the CNC gantry truss (2). The structure of the second blanking robot (12) is the same as that of the first blanking robot (10). The second blanking robot (12) is located between the NG blanking module (7) and the inspection station (62).

2. The wafer six-side inspection device according to claim 1, characterized in that: A material taking assembly (65) is installed on one side of the bottom end of the numerically controlled gantry truss (2), and the position of the material taking assembly (65) corresponds to the position of the deflection correction platform (53), and the position of the deflection correction platform (53) corresponds to the position of the detection station (62).

3. The wafer six-side inspection device according to claim 1, characterized in that: The inner cavity of the movable base (52) is provided with a first driving device (55), the output end of the first driving device (55) is fixedly connected to the bottom end of the correction platform (53), one end of the movable base (52) is provided with a fastener (56), and the movable base (52) is movably connected to the adjustment frame (51).

4. The wafer six-side inspection device according to claim 2, characterized in that: The material picking assembly (65) includes a linear guide rail (651) fixedly mounted on the bottom end of the CNC gantry truss (2), and a material picking device (652) is mounted on the linear guide rail (651). The material picking device (652) corresponds to the position of the correction platform (53) and the detection station (62).

5. The wafer six-side inspection device according to claim 1, characterized in that: An equipment rack (66) is installed in the middle of the CNC gantry truss (2), and a second driving device (67) for driving the turntable (61) to rotate is installed on the equipment rack (66). The output end of the second driving device (67) is fixedly connected to the central axis of the turntable (61). Several detection stations (62) are arranged in a circular array, and six wafer detection devices (64) are arranged in a circular array on the top of the equipment detection platform (1). The position of the wafer detection device (64) corresponds to the position of the detection station (62).

6. The wafer six-side inspection device according to claim 1, characterized in that: A loading robot (9) and a first unloading robot (10) are installed at one end of the CNC gantry truss (2); the loading robot (9) is located between the loading module (3) and the loading transfer and correction module (5); a carrier (11) for storing qualified wafers is installed on the qualified unloading module (4); the loading transfer and correction module (5) and the unloading transfer and correction module (8) have the same structure.

7. The wafer six-side inspection device according to claim 1, characterized in that: The top of the numerically controlled gantry truss (2) is provided with an air circuit system (13) for driving a device to realize corresponding actions, and the top of the equipment detection platform (1) is provided with an equipment housing (14), and an operation panel (15) is provided on the equipment housing (14).

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