Chip ultrathin packaging structure and chip packaging method

Abstract

The invention provides a chip ultrathin packaging structure and a chip packaging method, and relates to the technical field of chip packaging, the packaging structure comprises a plastic packaging body, a packaging chip is arranged in the plastic packaging body, the packaging chip is arranged on a substrate, a heat conduction layer is arranged on the side, away from the substrate, of the packaging chip, and a heat conduction plate is arranged on the side, away from the packaging chip, of the heat conduction layer; one side, away from the heat-conducting layer, of the heat-conducting plate is provided with a plurality of heat-conducting strips, one end, away from the heat-conducting plate, of each heat-conducting strip is connected with the heat-dissipating plate, the heat-conducting strips are arranged along the length direction of the heat-dissipating plate, and one side, away from the heat-conducting strips, of the heat-dissipating plate is exposed out of the According to the packaging structure, the heat conduction strips are arranged in the length direction of the heat dissipation plate, so that the overall bending rigidity of the heat dissipation plate can be improved, the bending resistance of the packaging structure is enhanced, when the packaging structure is subjected to external force, bending deformation of the packaging structure can be reduced through the heat dissipation plate provided with the heat conduction strips, and the service life of the chip is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to an ultra-thin chip packaging structure and a chip packaging method. Background Art

[0002] With the rapid development of electronic technology, electronic products are gradually moving towards miniaturization and thinness, which puts higher demands on chip packaging technology.

[0003] A Chinese patent application with authorization announcement number CN217062075U discloses an ultra-thin chip packaging structure, belonging to the field of chip packaging technology. The structure comprises a base, a housing, a chip, and a plurality of pins. The housing is connected to the base, and a mounting cavity is formed between the housing and the base. The chip is mounted in the mounting cavity, and the pins are mounted between the base and the housing, with the pins extending outward from the mounting cavity. This ultra-thin chip packaging structure has a small size and good stability. The pins can quickly dissipate heat from the mounting cavity, thereby ensuring that the chip can operate in a more suitable environment and thus ensure that the chip can maintain stable operation for a long time.

[0004] The above-mentioned ultra-thin chip packaging structure can meet the needs of ultra-thin electronic products. However, as the thickness of the ultra-thin chip packaging structure decreases, the bending and impact resistance of the packaging structure will also decrease. When the packaging structure is subjected to external force, it is easy to be damaged due to bending and deformation, affecting the service life of the chip. Summary of the Invention

[0005] The present invention provides an ultra-thin chip packaging structure and a chip packaging method, which are used to solve the technical problem that the current ultra-thin chip packaging structure is easily damaged due to bending and deformation when subjected to external force.

[0006] To solve the above technical problems, the present invention discloses an ultra-thin chip packaging structure, comprising: a plastic packaging body, a packaging chip is arranged in the plastic packaging body, the packaging chip is arranged on a substrate, a heat-conducting layer is arranged on the side of the packaging chip away from the substrate, a heat-conducting plate is arranged on the side of the heat-conducting layer away from the packaging chip, a plurality of heat-conducting strips are arranged on the side of the heat-conducting plate away from the heat-conducting layer, one end of the heat-conducting strips away from the heat-conducting plate is connected to a heat dissipation plate, the heat-conducting strips are arranged along the length direction of the heat dissipation plate, and the side of the heat dissipation plate away from the heat-conducting strips is exposed to the plastic packaging body and forms a heat dissipation surface.

[0007] Preferably, the plurality of heat-conducting strips are arranged at equal intervals, and the length of the heat-conducting strips is equal to the length of the heat sink.

[0008] Preferably, a plurality of first heat conducting blocks are arranged between two adjacent front and rear heat conducting strips, and the front and rear sides of the first heat conducting blocks are respectively connected to the front and rear heat conducting strips.

[0009] Preferably, a second heat conducting block is arranged between two adjacent first heat conducting blocks on the left and right, and the front and rear sides of the second heat conducting block are respectively connected to the front and rear heat conducting strips.

[0010] Preferably, the upper end of the first heat conductive block is connected to the lower surface of the heat conductive plate, and a first gap is set between the lower end of the first heat conductive block and the upper surface of the heat dissipation plate, the lower end of the second heat conductive block is connected to the upper surface of the heat dissipation plate, and a second gap is set between the upper end of the second heat conductive block and the lower surface of the heat conductive plate.

[0011] Preferably, a plurality of through holes are provided near the upper end of the first heat conducting block, and both ends of the through holes pass through the left and right sides of the first heat conducting block.

[0012] The present invention also provides a chip packaging method for an ultra-thin chip packaging structure, comprising the following steps:

[0013] providing a substrate;

[0014] Flip-chip packaging of chips on substrates;

[0015] preparing a heat-conducting layer on the surface of the packaged chip;

[0016] A heat conducting plate is installed on the surface of the heat conducting layer, a plurality of heat conducting strips are arranged on the side of the heat conducting plate away from the heat conducting layer, and a heat dissipation plate is arranged on the side of the heat conducting strips away from the heat conducting plate;

[0017] A plastic sealing device is used to perform plastic sealing to obtain a plastic sealing body and complete the packaging.

[0018] Preferably, the plastic sealing device includes a mold body and a plastic sealing mechanism, the mold body includes an upper mold and a lower mold, the lower mold is arranged below the upper mold, and the plastic sealing mechanism is arranged on the upper mold.

[0019] Preferably, the plastic sealing mechanism includes an injection tube and a discharge tube, an injection hole is set on one side of the upper surface of the upper mold, and a discharge hole is set on the side of the upper surface of the upper mold away from the injection hole. The injection tube is slidably set in the injection hole, a first injection port is set at the lower end of the injection tube, a second injection port is set near the lower end side wall of the injection tube, and the discharge tube is set in the discharge hole.

[0020] Preferably, a heating tube is sleeved on the outside of the injection tube, the lower end of the heating tube is connected to the upper surface of the upper mold, an annular heating cavity is set in the heating tube, a fluid inlet and a fluid outlet are set on the side wall of the heating tube, and the fluid inlet and fluid outlet are respectively connected to the annular heating cavity.

[0021] The technical solution of the present invention has the following advantages: The present invention provides an ultra-thin chip packaging structure and a chip packaging method, which relate to the field of chip packaging technology. The packaging structure includes a plastic package body, a packaged chip is arranged in the plastic package body, and the packaged chip is arranged on a substrate. A heat-conducting layer is arranged on the side of the packaged chip away from the substrate, a heat-conducting plate is arranged on the side of the heat-conducting layer away from the packaged chip, and a plurality of heat-conducting strips are arranged on the side of the heat-conducting plate away from the heat-conducting layer. The ends of the heat-conducting strips away from the heat-conducting plate are connected to a heat sink, and the heat-conducting strips are arranged along the length of the heat sink. The side of the heat sink away from the heat-conducting strips is exposed to the plastic package body and forms a heat dissipation surface. In the present invention, by arranging a plurality of heat-conducting strips along the length of the heat sink, the overall bending stiffness of the heat sink can be improved, thereby enhancing the bending resistance of the packaging structure. When the packaging structure is subjected to external force, the heat sink provided with the heat-conducting strips can reduce the bending deformation of the packaging structure, thereby extending the service life of the chip.

[0022] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the devices particularly pointed out in the written description and the accompanying drawings.

[0023] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0025] Figure 1 This is a schematic diagram of the overall structure of an ultra-thin chip packaging structure of the present invention;

[0026] Figure 2 For the present invention Figure 1 A magnified view of the structure at center A;

[0027] Figure 3 A top view of the heat conducting strip of the present invention;

[0028] Figure 4 This is a schematic diagram of a plastic encapsulation device in a chip encapsulation method of the present invention;

[0029] Figure 5 For the present invention Figure 4 A magnified view of the structure at point B in the middle;

[0030] Figure 6 A top view of the sealing cover in the present invention;

[0031] Figure 7 Schematic diagram of the first sealing plate and the second sealing plate in the present invention;

[0032] Figure 8 Schematic diagram of the contact between the first sealing plate, the second sealing plate and the outer wall of the heat conducting plate in the present invention;

[0033] Figure 9 For the present invention Figure 8 Enlarged view of the structure at point C in the middle.

[0034] In the figure: 1. plastic package; 2. packaged chip; 3. substrate; 4. heat-conducting layer; 5. heat-conducting plate; 6. heat-conducting strip; 7. heat sink; 8. first heat-conducting block; 9. second heat-conducting block; 10. first gap; 11. second gap; 12. through hole; 13. upper mold; 14. lower mold; 15. injection pipe; 16. discharge pipe; 17. first injection port; 18. second injection port; 19. heating pipe; 20. annular heating chamber; 21. sealing cover; 22. moving cover; 23. first electric push rod; 24. sliding hole; 25. connecting block; 26. first sealing hole; 27. first sealing block; 28. first contact block; 29. ​​first sealing plate; 30. second sealing plate; 31. flow channel; 32. telescopic tube; 33. second electric push rod; 34. lower pressure plate. DETAILED DESCRIPTION

[0035] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0036] In addition, in the present invention, descriptions such as "first" and "second" are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but this must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] Example 1

[0038] The embodiment of the present invention provides a chip ultra-thin packaging structure, such as Figure 1-Figure 3As shown, it includes: a plastic packaging body 1, a packaged chip 2 is arranged in the plastic packaging body 1, the packaged chip 2 is arranged on a substrate 3, a heat-conducting layer 4 is arranged on the side of the packaged chip 2 away from the substrate 3, a heat-conducting plate 5 is arranged on the side of the heat-conducting layer 4 away from the packaged chip 2, and a plurality of heat-conducting strips 6 are arranged on the side of the heat-conducting plate 5 away from the heat-conducting layer 4. The end of the heat-conducting strip 6 away from the heat-conducting plate 5 is connected to the heat dissipation plate 7, the heat-conducting strip 6 is arranged along the length direction of the heat dissipation plate 7, and the side of the heat dissipation plate 7 away from the heat-conducting strip 6 is exposed to the plastic packaging body 1 and forms a heat dissipation surface.

[0039] The working principle and beneficial effects of the above technical solution are as follows: the packaged chip 2 can be mounted on the substrate 3 by a flip-chip process, and a heat-conducting layer 4 is provided on the side of the packaged chip 2 away from the substrate 3. The heat-conducting layer 4 can be made of heat-conducting silicone, and then a heat-conducting plate 5 is bonded through the heat-conducting layer 4. The heat generated by the packaged chip 2 during operation can be conducted to the heat-conducting plate 5 through the heat-conducting layer 4. By providing the heat-conducting layer 4, the gap between the heat-conducting plate 5 and the packaged chip 2 can be reduced, and the heat-conducting capacity of the heat-conducting plate 5 can be improved. A heat dissipation plate 7 is provided on the other side of the heat-conducting plate 5, and the heat dissipation plate 7 is connected to the heat-conducting plate 5 by a number of heat-conducting strips 6. The heat of the heat-conducting plate 5 can be transferred to the heat-conducting plate 7 through the heat-conducting strips 6, and heat dissipation is achieved through the exposed heat dissipation surface of the heat dissipation plate 7, thereby ensuring the heat dissipation performance of the chip ultra-thin packaging structure. Preferably, the heat-conducting plate 5, the heat-conducting strips 6, and the heat-conducting plate 7 can be manufactured by an integrated molding process. The heat conducting plate 5, heat conducting strips 6 and heat dissipation plate 7 are all made of heat conducting materials. A plastic package 1 is arranged on the outside of the substrate 3, the packaged chip 2, the heat conducting plate 5 and the heat dissipation plate 7. The plastic package 1 can be made of epoxy resin, so as to wrap the packaged chip 2 and extend the service life of the packaged chip 2. In the present invention, a plurality of heat conducting strips 6 are arranged between the heat dissipation plate 7 and the heat conducting plate 5. The heat conducting strips 6 are arranged along the length direction of the heat dissipation plate 7. The heat conducting strips 6 are perpendicular to the heat dissipation plate 7. The heat conducting strips 6 can improve the overall bending stiffness of the heat dissipation plate 7 and enhance the bending resistance of the packaging structure. When the packaging structure is subjected to an external force perpendicular to the length direction of the heat dissipation plate 7, the heat dissipation plate 7 with the heat conducting strips 6 can effectively resist deformation, reduce the bending deformation of the packaging structure, improve the stability of the packaging structure, avoid exposing the packaged chip 2 due to bending and breakage, and extend the service life of the packaged chip 2.

[0040] Example 2

[0041] On the basis of the above embodiment 1, Figure 3 As shown, a plurality of heat conducting strips 6 are arranged at equal intervals, and the length of the heat conducting strips 6 is equal to the length of the heat dissipation plate 7 .

[0042] The working principle and beneficial effects of the above technical solution are as follows: the evenly arranged thermal conductive strips 6 can effectively resist bending, thereby improving the rigidity and deformation resistance of the heat sink 7. Preferably, the length of the thermal conductive strips 6 is equal to the length of the heat sink 7, which can reduce the degree of bending at the edge of the heat sink 7 and ensure the overall bending resistance of the heat sink 7.

[0043] Example 3

[0044] On the basis of Example 1 or 2, as Figure 1-Figure 3 As shown, a plurality of first heat conducting blocks 8 are arranged between two adjacent heat conducting strips 6, and the front and rear sides of the first heat conducting blocks 8 are respectively connected to the heat conducting strips 6 on the front and rear sides;

[0045] A second heat conducting block 9 is provided between two adjacent first heat conducting blocks 8 on the left and right sides, and the front and rear sides of the second heat conducting block 9 are respectively connected to the front and rear heat conducting strips 6;

[0046] The upper end of the first heat conducting block 8 is connected to the lower surface of the heat conducting plate 5, and a first gap 10 is set between the lower end of the first heat conducting block 8 and the upper surface of the heat dissipation plate 7. The lower end of the second heat conducting block 9 is connected to the upper surface of the heat dissipation plate 7, and a second gap 11 is set between the upper end of the second heat conducting block 9 and the lower surface of the heat conducting plate 5.

[0047] A plurality of through holes 12 are provided near the upper end of the first heat conducting block 8 , and both ends of the through holes 12 pass through the left and right sides of the first heat conducting block 8 .

[0048] The working principle and beneficial effects of the above technical solution are as follows: a plurality of first heat-conducting blocks 8 are arranged at equal intervals between the two heat-conducting bars 6, and a second heat-conducting block 9 is arranged between the two first heat-conducting blocks 8. By arranging the first heat-conducting block 8 and the second heat-conducting block 9, not only the stability of the heat-conducting bar 6 can be improved and the heat-conducting bar 6 can be prevented from tilting, but also the thermal conductivity can be improved, more heat can be extracted from the packaged chip 2, and the overall heat dissipation performance of the package structure can be improved. At the same time, when the package structure is subjected to an external force perpendicular to the width direction of the heat dissipation plate 7, the heat-conducting bar 6 is connected by the first heat-conducting block 8 and the second heat-conducting block 9. The first heat-conducting block 8 and the second heat-conducting block 9 are respectively perpendicular to the heat-conducting bar 6, and the first heat-conducting block 8 and the second heat-conducting block 9 are perpendicular to the surface of the heat dissipation plate 7, which can improve the bending resistance of the heat dissipation plate 7, reduce the bending deformation of the package structure, further improve the stability of the package structure, and extend the service life of the packaged chip 2. A first gap 10 is set between the lower end of the first heat-conducting block 8 and the heat dissipation plate 7, and the second heat-conducting block 9 is perpendicular to the heat dissipation plate 7. A second gap 11 is set between the heat conducting plates 5 to form an S-shaped flow path. Therefore, when preparing the plastic package 1, the molten plastic package can flow along the length direction of the heat conducting strip 6. During the flow process, it flows through the first gap 10 to between the first heat conducting block 8 and the second heat conducting block 9. Then, after the molten plastic package fills the space between the first heat conducting block 8 and the second heat conducting block 9, it flows from the second gap 11 between the second heat conducting block 9 and the next first heat conducting block 8. The plastic package flows in an S shape between the heat conducting plate 5 and the heat dissipation plate 7, which can make the plastic package uniformly fill the space between the heat conducting plate 5 and the heat dissipation plate 7, reduce the unfilled area, and avoid the problem of local insufficient filling. During the flow of the molten plastic package, the gas between the heat dissipation plate 7 and the heat conducting plate 5 can gradually flow out along the flow direction through the curved flow path, which not only reduces the formation of internal pores, thereby improving the preparation quality of the plastic package 1, but also avoids a large amount of gas between the heat conducting plate 5 and the heat dissipation plate 7, thereby improving the overall heat dissipation performance of the packaging structure.Since the gas between the heat conducting plate 5 and the heat dissipation plate 7 is likely to concentrate and remain outside the first heat conducting block 8 near the upper end, if the gas is not discharged in time, pores will be formed in the plastic package 1. The existence of pores will reduce the impact resistance and bending resistance of the plastic package 1, thereby reducing the overall stability of the packaging structure. Therefore, a plurality of through holes 12 are provided near the upper end of the first heat conducting block 8. The through holes 12 are tapered in structure. The diameter of the inlet of the through hole 12 is larger than the diameter of the outlet of the through hole 12. The molten plastic package can drive the gas into the through hole 12 and flow through the through hole 12 into the space between the first heat conducting block 8 and the second heat conducting block 9. Then, as the first heat conducting block 8 and the second heat conducting block 9 are separated, the gas is discharged. The molten plastic encapsulation material flows between the heat blocks 9 and is ultimately discharged outside the mold body. This solution allows the gas between the heat sink 7 and the heat conducting plate 5 to be discharged, thereby reducing the formation of internal pores, improving the molding quality of the plastic encapsulation body 1, and significantly enhancing the bending resistance of the plastic encapsulation body 1. This in turn improves the overall structural strength and stability of the package structure, extending the service life of the packaged chip 2. By providing the first gap 10 and the second gap 11, the plastic encapsulation material can be completely filled between the heat conducting plate 5 and the heat sink 7, improving the reliability of the connection between the heat sink 7 and the plastic encapsulation body 1, preventing the heat sink 7 and the plastic encapsulation body 1 from separating, and extending the service life of the package structure.

[0049] Example 4

[0050] Based on any one of Embodiments 1-3, the present invention further provides a chip packaging method for an ultra-thin chip packaging structure, comprising the following steps:

[0051] S10: providing a substrate 3;

[0052] S20: flip-chip packaging chip 2 on substrate 3;

[0053] S30: preparing a heat-conducting layer 4 on the surface of the packaged chip 2;

[0054] S40: Install a heat conducting plate 5 on the surface of the heat conducting layer 4, arrange a plurality of heat conducting strips 6 on the side of the heat conducting plate 5 away from the heat conducting layer 4, and arrange a heat dissipation plate 7 on the side of the heat conducting strips 6 away from the heat conducting plate 5;

[0055] S50: Using a plastic sealing device to perform plastic sealing to obtain a plastic sealing body 1, and completing the packaging.

[0056] The working principle and beneficial effects of the above technical solution are as follows: a substrate 3 is provided, on which a plurality of conductive copper pillars are arranged, which can be made of metallic copper; then a chip 2 is flip-chip packaged on the substrate 3, and the packaged chip 2 is electrically connected to the substrate 3 through the conductive copper pillars; then conductive silicone is evenly applied to the surface of the packaged chip 2 to prepare a heat-conducting layer 4; then a heat-conducting plate 5 is installed on the surface of the heat-conducting layer 4, and a plurality of heat-conducting strips 6 are arranged on the side of the heat-conducting plate 5 away from the heat-conducting layer 4, and a heat dissipation plate 7 is arranged on the side of the heat-conducting strips 6 away from the heat-conducting plate 5; finally, a plastic sealing device is used for plastic sealing to obtain a plastic-sealed body 1, and the chip packaging is completed. In the above solution, the thermally conductive strips 6 can improve the overall bending stiffness of the heat dissipation plate 7 and enhance the bending resistance of the packaging structure. When the packaging structure is subjected to an external force perpendicular to the length direction of the heat dissipation plate 7, the heat dissipation plate 7 with the thermally conductive strips 6 can effectively resist deformation, reduce the bending deformation of the packaging structure, improve the stability of the packaging structure, avoid the exposure of the packaged chip 2 due to bending and breakage, and extend the service life of the packaged chip 2.

[0057] Example 5

[0058] On the basis of Example 4, Figure 4-Figure 9 As shown, the plastic sealing device includes a mold body and a plastic sealing mechanism. The mold body includes an upper mold 13 and a lower mold 14. The lower mold 14 is arranged below the upper mold 13, and the plastic sealing mechanism is arranged on the upper mold 13.

[0059] The plastic sealing mechanism includes an injection tube 15 and an exhaust tube 16. An injection hole is provided on one side of the upper surface of the upper mold 13, and an exhaust hole is provided on the side of the upper surface of the upper mold 13 away from the injection hole. The injection tube 15 is slidably provided in the injection hole. A first injection port 17 is provided at the lower end of the injection tube 15, a second injection port 18 is provided near the lower end side wall of the injection tube 15, and the exhaust tube 16 is provided in the exhaust hole.

[0060] The working principle and beneficial effects of the above technical solution are as follows: during plastic sealing, first open the upper mold 13, place the heat sink 7 down into the lower mold 14, and then cover the upper mold 13 on the lower mold 14. Next, connect one end of the injection pipe 15 to the output end of the plastic sealing material injection device, inject the molten plastic sealing material into the injection pipe 15 through the injection device, and then inject it into the mold cavity formed by the upper mold 13 and the lower mold 14 through the first injection port 17. The first injection port 17 is conical, and the molten plastic sealing material passing through the first injection port 17 flows vertically downward. A second injection port 18 is also provided on the side wall of the injection pipe 15, and the second injection port 18 is close to the upper end of the first injection port 17. At the end, the second injection port 18 is perpendicular to the first injection port 17. Since the first injection port 17 is tapered, part of the molten plastic encapsulation material can flow out through the second injection port 18, thereby promoting the horizontal flow of the molten plastic encapsulation material in the mold cavity, and promoting the molten plastic encapsulation material to flow toward the discharge pipe 16, which is conducive to the discharge of gas. Preferably, a vacuum pump is connected to the output end of the discharge pipe 16, and the gas in the mold cavity is extracted by the vacuum pump, which is conducive to the bursting of bubbles and discharge from the discharge pipe 16, further reducing the pores in the plastic encapsulation body 1, improving the bending resistance of the plastic encapsulation body 1, improving the overall structural strength and stability of the packaging structure, and extending the service life of the packaged chip 2.

[0061] Example 6

[0062] On the basis of Example 5, Figure 5 As shown, a heating tube 19 is provided on the outside of the injection tube 15, the lower end of the heating tube 19 is connected to the upper surface of the upper mold 13, an annular heating cavity 20 is provided in the heating tube 19, and a fluid inlet and a fluid outlet are provided on the side wall of the heating tube 19, and the fluid inlet and the fluid outlet are respectively connected to the annular heating cavity 20.

[0063] The working principle and beneficial effects of the above technical solution are as follows: a heating tube 19 is arranged outside the injection tube 15, and the external high-temperature fluid can enter the annular heating chamber 20 through the fluid inlet and then be discharged from the fluid outlet, so that the annular heating chamber 20 is maintained in a high-temperature state. The injection tube 15 is heated by the annular heating chamber 20, which can prevent the plastic encapsulation material from cooling too quickly in the injection tube 15, thereby improving the fluidity of the plastic encapsulation material, reducing the generation of pores in the plastic encapsulation body 1, and further improving the molding quality of the plastic encapsulation body 1.

[0064] Example 7

[0065] On the basis of Example 5 or 6, Figure 4-Figure 9As shown, a lower pressure port is provided at the center of the upper surface of the upper mold 13, a sealing cover 21 is provided on the upper mold 13, the lower end of the sealing cover 21 is communicated with the lower pressure port, a movable cover 22 is provided in the sealing cover 21, the lower end of the movable cover 22 is communicated with the lower pressure port, the outer wall of the movable cover 22 is slidably connected to the inner wall of the sealing cover 21 up and down, a first electric push rod 23 is provided on the top of the sealing cover 21, the output end of the first electric push rod 23 is connected to the upper surface of the movable cover 22, a sliding hole 24 is provided on the side of the sealing cover 21 close to the injection pipe 15, a connecting block 25 is slidably provided in the sliding hole 24, one end of the connecting block 25 is connected to the side wall of the movable cover 22, and the other end of the connecting block 25 is connected to the side wall of the injection pipe 15, first sealing holes 26 are symmetrically provided on the inner walls of the left and right sides of the movable cover 22, a first sealing block 27 is provided in the first sealing hole 26, the first sealing block 27 is slidably connected to the inner wall of the first sealing hole 26 left and right, and the first sealing block 27 is provided near one end of the sealing cover 21 A first contact block 28 is provided, a first sealing plate 29 is provided at one end of the first sealing block 27 away from the sealing cover 21, and the first sealing plate 29 extends to the outside of the first sealing hole 26 away from one end of the first sealing block 27, and second sealing holes are symmetrically provided on the inner walls of the front and rear sides of the movable cover 22, a second sealing block is provided in the second sealing hole, and the second sealing block is slidably connected to the inner wall of the second sealing hole front and back, a second contact block is provided at one end of the second sealing block close to the sealing cover 21, a second sealing plate 30 is provided at one end of the second sealing block away from the sealing cover 21, and the second sealing plate 30 extends to the outside of the second sealing hole away from one end of the second sealing block, and the lower surface of the second sealing plate 30 is sealed and slidably connected to the upper surface of the first sealing plate 29, a flow channel 31 is provided in the movable cover 22, and the flow channel 31 is respectively connected with the first sealing hole 26 and the second sealing hole close to the sealing cover 21, a telescopic tube 32 is provided on the movable cover 22, and one end of the telescopic tube 32 is connected with the flow channel 31.

[0066] The working principle and beneficial effects of the above technical solution are as follows: one end of the telescopic tube 32 is connected to the pump body, and an electromagnetic valve is provided on the telescopic tube 32. Gas can be transported to the flow channel 31 or gas can be extracted from the flow channel 31 through the pump body. An air pressure sensor is provided in the flow channel 31. The air pressure sensor is used to detect the gas pressure in the flow channel 31. When the plastic sealing material is injected, the first electric push rod 23 is used to push the movable cover 22 to slide downward in the sealing cover 21. When the lower surface of the first sealing plate 29 is flush with the lower surface of the substrate 3, the first electric push rod 23 stops pushing out, and the pump body is started. The gas enters the first sealing hole 26 and the second sealing hole through the flow channel 31. The gas entering the first sealing hole 26 can push the first sealing block 27 to slide outward in the first sealing hole 26. The first sealing block 27 drives the first sealing plate 29 to move toward the direction of the substrate 3. At the same time, the gas entering the second sealing hole can push the second sealing block to slide outward in the second sealing hole. The second sealing block drives the second sealing plate 30 to move toward the direction of the substrate 3. The first sealing plate 29 and the second sealing plate 30 gradually contact the outer wall of the substrate 3. When the gas pressure in the flow channel 31 detected by the air pressure sensor reaches the preset pressure range, the pump body stops working. At this time, under the push of the first sealing plate 29 and the second sealing plate 30, the substrate 3 is in the center position of the mold cavity, which improves the consistency of the package. Then, the first electric push rod 23 is started again. The first electric push rod 23 is pushed out to drive the movable cover 22 to slide downward. When the lower surface of the first sealing plate 29 is flush with the lower surface of the heat conducting plate 5, , the first electric push rod 23 stops working, and continues to start the pump body, so that the first sealing plate 29 and the second sealing plate 30 are pushed out, and the first sealing plate 29 and the second sealing plate 30 are respectively in contact with the outer wall of the heat conducting plate 5. When the gas pressure in the flow channel 31 detected by the air pressure sensor reaches the preset pressure range, the pump body stops working, the solenoid valve is closed, and the first sealing plate 29 and the second sealing plate 30 remain in contact with the outer wall of the heat conducting plate 5, and the lower surface of the second sealing plate 30 is in contact with the upper surface of the first sealing plate 29. The substrate 3, the chip, the heat conducting plate 5 and the mold cavity are isolated by the first sealing plate 29, the second sealing plate 30 and the movable cover 22. When the movable cover 22 slides downward, it can drive the injection pipe 15 to slide downward through the connecting block 25, so that the second injection pipe 15 is The discharge direction of the material port 18 is located between the heat conducting plate 5 and the heat dissipating plate 7. When the first sealing plate 29 and the second sealing plate 30 are in contact with the outer wall of the heat conducting plate 5, the molten plastic encapsulating material is injected into the mold cavity through the injection pipe 15. Under the isolation of the movable cover 22, the first sealing plate 29 and the second sealing plate 30, the molten plastic encapsulating material can flow along the heat conducting strip 6 and flow along the S-shaped path formed by the first heat conducting block 8 and the second heat conducting block 9. In addition, the molten plastic encapsulating material flowing out of the second material injection port 18 can promote the horizontal flow of the molten plastic encapsulating material in the mold cavity, so that the plastic encapsulating material is evenly filled between the heat conducting plate 5 and the heat dissipating plate 7, reducing the unfilled area, and through the curved flow path, the gas between the heat dissipating plate 7 and the heat conducting plate 5 is gradually discharged from the discharge pipe 16 along the flow direction.The formation of internal pores is reduced, the molding quality of the plastic sealing body 1 is improved, and the heat dissipation performance and anti-bending performance of the overall packaging structure are further improved. When the molten plastic sealing material is discharged from the discharge pipe 16, the injection of the molten plastic sealing material is stopped first, and then the first electric push rod 23 is started, so that the movable cover 22 is pushed downward by a preset distance, and the first sealing plate 29 slides downward along the heat conducting plate 5, but is not separated from the heat conducting plate 5. By pushing the plastic sealing material downward, the pores in the molten plastic sealing material are further eliminated. Then, the first electric push rod 23 is controlled to retract upward, and the gas in the flow channel 31 is extracted through the pump body, so that the first sealing plate 29 and the second sealing plate 30 slide into the movable cover 22. When the lower surface of the first sealing plate 29 is flush with the lower surface of the lower pressure plate 34, the gas is transported to the flow channel through the pump body. 31, the first sealing plate 29 and the second sealing plate 30 are in contact with the outer wall of the lower pressure plate 34. At this time, the pump body and the solenoid valve are closed, and the molten plastic encapsulating material continues to be injected through the injection pipe 15 until the molten plastic encapsulating material overflows from the discharge pipe 16. The plastic encapsulating material is then solidified and the excess plastic encapsulating material is removed to form the plastic encapsulating body 1. The molten plastic encapsulating material is injected step by step to ensure that the plastic encapsulating material between the heat conducting plate 5 and the heat dissipating plate 7 is more fully filled, reducing the air holes in the plastic encapsulating body 1. In addition, after the first injection, because the first sealing plate 29 and the second sealing plate 30 are at different horizontal planes, a protrusion is formed between the first sealing plate 29 and the second sealing plate 30. When the molten plastic encapsulating material is injected for the second time, this protrusion can strengthen the connection between the plastic encapsulating materials, thereby improving the molding quality of the plastic encapsulating body 1.

[0067] Example 8

[0068] On the basis of Example 7, Figure 4 As shown, a second electric push rod 33 is provided at the top center of the sealing cover 21 , and an output end of the second electric push rod 33 passes through the sealing cover 21 and the moving cover 22 in sequence and is provided with a lower pressing plate 34 .

[0069] The working principle and beneficial effects of the above technical solution are as follows: when the first sealing plate 29 and the second sealing plate 30 contact the outer wall of the substrate 3, the second electric push rod 33 is started, the second electric push rod 33 extends and drives the lower pressure plate 34 to move downward until the lower pressure plate 34 contacts the substrate 3, until the plastic package body 1 is prepared. The lower pressure plate 34 can press the substrate 3, improve the reliability of the connection between the substrate 3 and the chip, avoid the separation of the substrate 3 and the chip during the injection of the plastic package material, ensure the packaging quality, and extend the service life of the packaged chip 2.

[0070] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0071] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0072] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the description and implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A chip ultra-thin packaging structure, characterized in that: include: A plastic package body (1) is provided in the plastic package body (1), the package chip (2) is provided on a substrate (3), a heat conducting layer (4) is provided on the side of the package chip (2) away from the substrate (3), a heat conducting plate (5) is provided on the side of the heat conducting layer (4) away from the package chip (2), a plurality of heat conducting strips (6) are provided on the side of the heat conducting plate (5) away from the heat conducting layer (4), one end of the heat conducting strip (6) away from the heat conducting plate (5) is connected to a heat dissipation plate (7), the heat conducting strip (6) is provided along the length direction of the heat dissipation plate (7), and the side of the heat dissipation plate (7) away from the heat conducting strip (6) is exposed to the plastic package body (1) and forms a heat dissipation surface.

2. The ultra-thin chip packaging structure according to claim 1, characterized in that: A plurality of heat-conducting strips (6) are arranged at equal intervals, and the length of the heat-conducting strips (6) is equal to the length of the heat dissipation plate (7).

3. The ultra-thin chip packaging structure according to claim 1, characterized in that: A plurality of first heat conducting blocks (8) are arranged between two adjacent heat conducting strips (6) at the front and rear ends, and the front and rear ends of the first heat conducting blocks (8) are respectively connected to the heat conducting strips (6) at the front and rear ends.

4. The ultra-thin chip packaging structure according to claim 3, characterized in that: A second heat conducting block (9) is arranged between two adjacent first heat conducting blocks (8) on the left and right sides, and the front and rear sides of the second heat conducting block (9) are respectively connected to the heat conducting strips (6) on the front and rear sides.

5. The ultra-thin chip packaging structure according to claim 4, characterized in that: The upper end of the first heat conducting block (8) is connected to the lower surface of the heat conducting plate (5), and a first gap (10) is provided between the lower end of the first heat conducting block (8) and the upper surface of the heat dissipation plate (7); the lower end of the second heat conducting block (9) is connected to the upper surface of the heat dissipation plate (7), and a second gap (11) is provided between the upper end of the second heat conducting block (9) and the lower surface of the heat conducting plate (5).

6. The ultra-thin chip packaging structure according to claim 5, characterized in that: A plurality of through holes (12) are provided near the upper end of the first heat conducting block (8), and both ends of the through holes (12) pass through the left and right sides of the first heat conducting block (8).

7. A chip packaging method according to any one of claims 1 to 6, characterized in that: The following steps are involved: Providing a substrate (3); Flip-chip packaging of a chip (2) on a substrate (3); Preparing a heat-conducting layer (4) on the surface of the packaged chip (2); A heat conducting plate (5) is mounted on the surface of the heat conducting layer (4), a plurality of heat conducting strips (6) are arranged on the side of the heat conducting plate (5) away from the heat conducting layer (4), and a heat dissipation plate (7) is arranged on the side of the heat conducting strips (6) away from the heat conducting plate (5); A plastic sealing device is used to perform plastic sealing to obtain a plastic sealing body (1), thereby completing the packaging.

8. The chip packaging method according to claim 7, characterized in that: The plastic sealing device comprises a mold body and a plastic sealing mechanism. The mold body comprises an upper mold (13) and a lower mold (14). The lower mold (14) is arranged below the upper mold (13), and the plastic sealing mechanism is arranged on the upper mold (13).

9. The chip packaging method according to claim 8, characterized in that: The plastic sealing mechanism comprises an injection pipe (15) and a discharge pipe (16); an injection hole is provided on one side of the upper surface of the upper mold (13); a discharge hole is provided on the side of the upper surface of the upper mold (13) away from the injection hole; the injection pipe (15) is slidably provided in the injection hole; a first injection port (17) is provided at the lower end of the injection pipe (15); a second injection port (18) is provided near the side wall of the lower end of the injection pipe (15); and the discharge pipe (16) is provided in the discharge hole.

10. The chip packaging method according to claim 9, characterized in that: A heating tube (19) is sleeved on the outside of the injection tube (15), the lower end of the heating tube (19) is connected to the upper surface of the upper mold (13), an annular heating cavity (20) is provided in the heating tube (19), and a fluid inlet and a fluid outlet are provided on the side wall of the heating tube (19), and the fluid inlet and the fluid outlet are respectively connected to the annular heating cavity (20).

Images