Packaging base, composition board and electronic device

Abstract

The invention relates to the technical field of electronic packaging, and discloses a packaging base, a composition board and an electronic device.The packaging base comprises an insulating substrate, a metal layer, a plurality of external connecting terminals, a first wire, a second wire and a third wire; the insulating substrate comprises a base part and a frame part; the base part is provided with a first surface, the frame part is provided with a second surface, and the outer wall of the base part and the outer wall of the frame part extend in the first direction to form an outer side face; one end of the first wiring extends in the frame part and is connected with the metal layer; the second wiring is arranged in the frame part; the third wiring is arranged in the base part. The method has the advantages that electroplating wiring conduction connection in the packaging base is easy to achieve, the method is suitable for the situation that the packaging base is prepared through a single insulating film layer, the size of the packaging base can be further reduced, a through hole conductor does not need to be arranged on the frame part, the cracking risk of the frame part due to thermal stress is reduced, the electroplating wiring structure is simplified, and the production cost is reduced. And the uniformity of the plating layer on the packaging base is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, in particular to a packaging base, a combined board and an electronic device. Background Art

[0002] Package bases are commonly used to package electronic components such as quartz crystals and semiconductor chips. The resulting components (such as semiconductor devices, temperature-compensated oscillators (TCXOs), tuning fork resonators, thermistor resonators, automotive components, standard oscillators (OSCs), and voltage-compensated oscillators (VCXOs)) are widely used in a variety of electronic devices. A typical package base consists of an insulating substrate and a conductive pattern disposed on the insulating substrate. The insulating substrate includes a base insulator and a frame insulator (hereinafter referred to as the base and frame). The base and frame together form a cavity for placing the electronic component. Once the electronic component is placed in the cavity, a cover is sealed to the cavity opening by welding, thereby achieving the packaging of the electronic component.

[0003] In the prior art, the traditional electroplating wiring scheme requires printing electroplating wiring on multiple insulating film layers, and then stacking multiple insulators to prepare the required packaging base, and using through-hole conductors provided in the frame to achieve conductivity between the annular metal layer and other electroplated wiring in the base.

[0004] With the development of miniaturization of electronic devices, the package base also needs to develop towards miniaturization and thinning to meet application requirements. However, in the process of producing miniaturized and thin package bases, the mechanical strength of the insulator of the frame is reduced due to the reduction in the overall volume of the package base. The use of traditional electroplating wiring schemes can easily lead to thermal expansion differences between the through-hole conductors located in the frame and the insulator of the frame, which in turn causes thermal stress cracking of the frame. Secondly, traditional electroplating wiring requires that the package base be composed of multiple insulating film layers, which is not applicable to the case where the package base is prepared with a single insulating film layer, limiting the further reduction of the package base size. In addition, due to the complexity of the circuit, the traditional electroplating wiring scheme, if applied to a miniaturized and thin package base, is likely to cause the plating uniformity to deteriorate. Summary of the Invention

[0005] The present invention aims to provide a package base, a composite board, and an electronic device that facilitates conductive connection of electroplated wiring within the package base. This design is suitable for use with package bases fabricated from a single insulating film layer, further reducing the size of the package base. Furthermore, the design eliminates the need for through-hole conductors within the frame, reducing the risk of frame cracking due to thermal stress. Furthermore, the design simplifies the electroplated wiring structure, improves the uniformity of the plating layer on the package base, and facilitates miniaturization and thinning of the package base.

[0006] In order to achieve the above object, the present invention provides a package base, comprising an insulating substrate, a metal layer, a plurality of external connection terminals, a first wiring, a second wiring, and a third wiring;

[0007] The insulating substrate includes a base and a frame, wherein the frame is formed with a through groove in the first direction, and one end surface of the base is connected to the frame so that the side wall of the through groove and the one end surface of the base are surrounded to form a concave cavity; the base is provided with a first surface on a side away from the frame, and the frame is provided with a second surface on a side away from the base, and the outer wall of the base and the outer wall of the frame extend in the first direction to form an outer side surface;

[0008] The metal layer is disposed on the second surface and surrounds the cavity;

[0009] A plurality of external connection terminals are provided on the first surface;

[0010] One end of the first wiring extends within the frame portion and is connected to the metal layer, and the other end of the first wiring extends within the base portion and is connected to one of the external connection terminals through a through-hole conductor;

[0011] The second wiring is provided in the frame portion, one end of the second wiring is connected to the metal layer, and the other end of the second wiring extends to the outer side surface and is exposed to form a first exposed portion;

[0012] The third wiring is provided in the base portion, one end of the third wiring is connected to the external connection terminal, and the other end of the third wiring extends to the outer side surface and is exposed to form a second exposed portion.

[0013] Furthermore, one end of the outer side surface in the first direction is connected to the first surface via a dividing slope, and the other end of the outer side surface in the first direction is connected to the second surface via a dividing slope;

[0014] The first exposed portion is arranged away from the dividing inclined surface, and / or,

[0015] The second exposed portion is disposed away from the dividing inclined surface.

[0016] Furthermore, the insulating substrate has a first corner region, a third corner region, a second corner region and a fourth corner region that are diagonally arranged, and a side region is provided between adjacent corner regions;

[0017] The third wiring is provided in the edge region; or

[0018] The third wiring is provided in any one of the first corner region, the second corner region, the third corner region, and the fourth corner region.

[0019] Furthermore, one external connection terminal is connected to at least two third wirings, and the two third wirings are located in adjacent side regions.

[0020] Furthermore, the second wiring is provided on the first corner area and the third corner area, and the fourth wiring is provided on the second corner area and the fourth corner area;

[0021] The fourth wiring is located in the frame portion, one end of the fourth wiring extends to the outer side surface and is exposed to form a third exposed portion, and the fourth wiring is insulated from the metal layer.

[0022] Furthermore, the first wiring is provided on the first corner region, one end of the first wiring is located in the frame portion and extends to connect to the metal layer, and the other end of the first wiring is located in the base portion and connected to one of the external connection terminals through the through-hole conductor.

[0023] Furthermore, the first wiring is provided in both the first corner region and the third corner region; and one end of the first wiring located at the base is connected to one of the external terminals through the through-hole conductor.

[0024] Furthermore, it also includes a first electrode pad and a second electrode pad, the first electrode pad and the second electrode pad are arranged diagonally in the cavity, the first electrode pad through-hole conductor is connected to one of the external connection terminals located below the second corner area; the second electrode pad is connected to one of the external connection terminals located below the fourth corner area.

[0025] The present invention further provides a package base assembly board, which is formed by arranging the package bases described in any one of the above items, wherein the insulating substrate has a first corner region, a third corner region, a second corner region, and a fourth corner region arranged diagonally, and a side region is provided between adjacent corner regions;

[0026] A second wiring is provided in the side region, the second wiring is electrically connected between two adjacent package bases, and the third wiring is electrically connected between two adjacent package bases; or

[0027] The second wiring is respectively provided in the first corner region and the third corner region, the third wiring is provided in the side region, and the fourth wiring is provided in the second corner region. The fourth wiring is located in the frame portion, one end of the fourth wiring extends to the outer side surface to be exposed to form a third exposed portion, and the fourth wiring is insulated from the metal layer.

[0028] The second wirings of two diagonally adjacent package bases are electrically connected via the fourth wirings of the side-adjacent package bases, and the third wirings electrically connected to each other are provided between the two side-adjacent package bases.

[0029] The present invention further provides an electronic device, comprising any one of the above-mentioned packaging bases, an electronic component disposed in the cavity, and a cover for sealing the cavity.

[0030] Compared with the prior art, a package base, a composite board, and an electronic device according to an embodiment of the present invention have the following advantages: a first wiring, a second wiring, and a third wiring are provided, wherein one end of the first wiring extends within the frame and is connected to the metal layer, and the other end extends within the base and is connected to an external connection terminal through a through-hole conductor; a second wiring is provided within the frame, one end of the second wiring is connected to the metal layer, and the other end extends to the outer side surface to be exposed and form a first exposed portion; a third wiring is provided within the base, one end of the third wiring is connected to the external connection terminal, and the other end extends to the outer side surface to be exposed and form a second exposed portion, thereby achieving electroplated conduction between the conductive wirings within the package base and achieving electroplated conduction between two adjacent package bases. This solution simplifies the electroplated wiring structure, facilitates the manufacture of the package base composite board, is applicable to the case where the package base is prepared with a single insulating film layer, and can further reduce the size of the package base; at the same time, the electroplated wiring structure of this solution can improve the uniformity of the plating on the package base, which is conducive to the miniaturization and thinning of the package base. In addition, the present invention does not require a through-hole conductor to be provided in the frame, thereby reducing the risk of the frame cracking due to thermal stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a perspective view of a package base according to an embodiment of the present invention;

[0032] Figure 2 This is an appearance diagram of a package base according to an embodiment of the present invention;

[0033] Figure 3 Schematic diagram of the distribution of the conductive pattern of the package base according to an embodiment of the present invention;

[0034] Figure 4 is a top view of a package base according to an embodiment of the present invention;

[0035] Figure 5 is a perspective view of a package base according to an embodiment of the present invention from a top view;

[0036] Figure 6 yes Figure 5 Cross-sectional view at the middle BB;

[0037] Figure 7 yes Figure 5 Cross-sectional view at CC;

[0038] Figure 8 yes Figure 5 Cross-sectional view at DD in the middle;

[0039] Figure 9 It is a partial schematic diagram of the package base assembly board according to an embodiment of the present invention;

[0040] Figure 10 This is a schematic diagram of connecting conductive patterns of adjacent package bases in a package base assembly board according to an embodiment of the present invention;

[0041] Figure 11 is a perspective view of another structure of a package base according to an embodiment of the present invention;

[0042] Figure 12 yes Figure 11 Schematic diagram of the conductive pattern inside the package base;

[0043] Figure 13 This is a schematic diagram of another wiring structure connection between adjacent package bases in a package base assembly board according to an embodiment of the present invention;

[0044] Figure 14 yes Figure 9 A top perspective view of the mid-package base assembly board;

[0045] Figure 15 yes Figure 14 Cross-sectional view at EE;

[0046] Figure 16 yes Figure 14 Cross-sectional view at FF;

[0047] Figure 17 yes Figure 14 Cross-sectional view at GG in the middle;

[0048] Figure 18 yes Figure 13 A top perspective view of the mid-package base assembly board;

[0049] Figure 19 yes Figure 18 Cross-sectional view at HH in the middle;

[0050] Figure 20 yes Figure 18 Cross-sectional view at II;

[0051] Figure 21 yes Figure 18 Cross-sectional view at JJ in the middle.

[0052] In the figure, 1, insulating substrate; 11, base; 111, first surface; 12, frame; 121, second surface; 100, outer side surface; 101, cavity; 102, dividing slope; 2, metal layer; 3, external connection terminal; 4, first wiring; 5, through-hole conductor; 6, second wiring; 61, first exposed portion; 7, third wiring; 71, second exposed portion; 8, fourth wiring; 81, third exposed portion; 9, first electrode pad; 10, second electrode pad; a, first corner area; c, third corner area, b, second corner area; d, fourth corner area; e, side area; A1, first package base; A2, second package base; A3, third package base; A4, fourth package base; K, dividing groove; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0053] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0054] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "inside", "outside", etc. used in the present invention to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the devices and elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0055] In describing the present invention, it should be understood that the terms "first," "second," etc., are used to describe various types of information, but such information should not be limited to these terms. These terms are merely used to distinguish information of the same type from one another. For example, "first" information could also be referred to as "second" information, and similarly, "second" information could also be referred to as "first" information without departing from the scope of the present invention.

[0056] like Figures 1 to 21 As shown, a packaging base of a preferred embodiment of the present invention includes an insulating substrate 1, a metal layer 2, a plurality of external connection terminals 3, a first wiring 4, a second wiring 6 and a third wiring 7; wherein the insulating substrate 1 serves as a carrier for mounting other components. For the convenience of description, the height direction of the insulating substrate 1 is defined as the first direction X, the length direction is defined as the second direction Y, and the width direction is defined as the third direction Z.

[0057] See Figure 1 、 Figures 6 to 8The insulating substrate 1 includes a base 11 and a frame 12, wherein a first surface 111 is provided on a side of the base 11 away from the frame 12, and a second surface 121 is provided on a side of the frame 12 away from the base 11. The outer wall of the base 11 and the outer wall of the frame 12 extend in the first direction X to form an outer side surface 100. The frame 12 is formed with a through groove in the first direction X. One end face of the base 11 is connected to the frame 12 so that the side wall of the through groove and one end face of the base 11 are combined to form a cavity 101. Specifically, electronic components are installed in the cavity 101. After the electronic components are installed, a cover plate is sealed on the cavity 101 to achieve packaging. The metal layer 2 is provided on the second surface 121 and is arranged around the cavity 101. A plurality of external connection terminals 3 are provided on the first surface 111, which are used to be electrically connected to external electronic devices after being connected to the internal wiring structure for signal transmission.

[0058] In order to realize electroplated conductive connection between different conductive layers inside the package base, and at the same time, to form an electroplated conductive circuit between any two adjacent package bases in the package base assembly board, a first wiring 4, a second wiring 6 and a third wiring 7 are provided, wherein one end of the first wiring 4 extends within the frame 12 and is connected to the metal layer 2, and the other end of the first wiring 4 extends within the base 11 and is connected to an external connection terminal 3 through a through-hole conductor 5; the second wiring 6 is provided in the frame 12, one end of the second wiring 6 is connected to the metal layer 2, and the other end extends to the outer side surface 100 to be exposed and form a first exposed portion 61; the third wiring 7 is provided in the base 11, one end of the third wiring 7 is connected to the external connection terminal 3, and the other end extends to the outer side surface 100 to be exposed and form a second exposed portion 71. The first exposed portion 61 and the second exposed portion 71 can be used to provide circuit conduction between adjacent package bases. In the present invention, there is no need to provide through-hole conductors 5 in the frame portion 12. This prevents the frame portion 12 from being affected by the structure of the through-hole conductors 5, reduces the thermal expansion difference in the frame portion 12 area, and thus reduces the risk of cracking of the package base. At the same time, the wiring circuit of the package base is simplified, and the production of the package base assembly board is facilitated. It is applicable to the case where the package base is prepared with a single insulating film layer, which can further reduce the size of the package base. It also improves the uniformity of the coating on the package base, which is conducive to the miniaturization and thinning of the package base.

[0059] When the first wiring 4 and the second wiring 6 are not directly connected and are respectively connected to the metal layer 2, two connection points are generated between the metal layer 2 and the first wiring 4 and the second wiring 6 respectively. The increase in the number of connection points leads to uneven distribution of resistance of the electroplated wiring, which makes the thickness uniformity of the electroplated layer of the package base poor. At the same time, parasitic capacitance may also be generated between the second wiring 6 and the first wiring 4, resulting in signal interference in actual application of the package base. Therefore, in this embodiment, the end of the second wiring 6 connected to the metal layer 2 is connected to the first wiring 4, that is, the end of the second wiring 6 away from the first exposed portion 61 is directly connected to the first wiring 4, which reduces the number of connection points, improves the resistance uniformity of the electroplated wiring, and makes the overall symmetry of the electroplated wiring of the package base better, improves the uniformity of the current, and thus ensures the thickness uniformity of the electroplated layer of the package base; at the same time, it avoids the generation of parasitic capacitance between the first wiring 4 and the second wiring 6, and reduces signal interference in actual application of the package base.

[0060] Further, in this embodiment, see Figure 9 The dividing bevels 102 between adjacent package bases cooperate to form a dividing groove K. When the wiring structure is distributed on the package base assembly board, if part of the wiring structure is exposed outside the dividing groove K, adjacent package bases near the exposed portion may easily adhere to each other during electroplating of the assembly board. Therefore, in this embodiment, one end of the outer side surface 100 in the first direction X is connected to the first surface 111 via the dividing bevel 102, and the other end of the outer side surface 100 in the first direction X is connected to the second surface 121 via the dividing bevel 102. The first exposed portion 61 is positioned away from the dividing bevel 102, and / or the second exposed portion 71 is positioned away from the dividing bevel 102. That is, the first exposed portion 61 and the second exposed portion 71 are positioned so as not to be exposed outside the dividing bevel 102.

[0061] Furthermore, in order to facilitate the distribution of the wiring structure in the insulating substrate 1, refer to Figure 4The insulating substrate 1 is divided. Specifically, the insulating substrate 1 has a first corner region a and a third corner region c, as well as a second corner region b and a fourth corner region d, each of which is diagonally disposed. A side region e is disposed between adjacent corner regions. A third wiring 7 is disposed within the side region e. Alternatively, the third wiring 7 is disposed within any of the first corner region a, the second corner region b, the third corner region c, and the fourth corner region d. When the package base is prepared by a hot pressing process, the electroplated wiring (i.e., the wiring structure such as the first wiring 4, the second wiring 6, and the third wiring 7) and the cavity 101 within the package base are formed by sequentially printing a conductive coating and a ceramic slurry coating covering part or all of the conductive coating on the upper and lower surfaces of the base material of the insulating substrate 1. The base material and the coating printed thereon are then heated and pressed together in a mold. The base material and the coating printed thereon deform according to the structure of the mold and fill the mold cavity. The ceramic slurry layer protruding from the base material surface sinks to be flush with the base material surface due to pressure, thereby forming the cavity 101 and the conductive coating structure within the package base.

[0062] Since the third wiring 7 is formed by hot pressing a conductive coating printed on the lower surface of the substrate, and the lower surface of the substrate deforms less during the hot pressing process, to ensure good flatness of the first surface 111 of the insulating substrate 1 after hot pressing, the thickness of the ceramic slurry printed on the lower surface of the substrate needs to be reduced. This results in a smaller minimum distance between the second exposed portion 71 of the third wiring 7 and the first surface 111. When the third wiring 7 is located in a corner region, the corner region is subjected to pressure deformation twice during the formation of the dividing groove K in the package base assembly (i.e., pressure in the second direction Y and the third direction Z), resulting in a deeper dividing groove K. This increases the risk of electroplating adhesion caused by the third wiring 7 being exposed at the dividing groove K, and may even cause disconnection of the third wiring 7 between adjacent package bases. Therefore, the third wiring 7 is located in the edge region e. The edge region e is subjected to only one pressure deformation during the formation of the dividing groove K in the package base assembly, and the depth of the dividing groove K is moderate. This reduces the risk of electroplating adhesion caused by the third wiring 7 being exposed at the dividing groove K and prevents disconnection of the third wiring 7 between adjacent package bases.

[0063] Further, in this embodiment, see Figure 1 、 Figure 2 、 Figure 3 , one external connection terminal 3 is connected to at least two third wirings 7, and the two third wirings 7 are located in adjacent side regions e. That is, in this embodiment, a complete package base includes four external connection terminals 3, which are correspondingly formed with eight third wirings 7. The distribution of the third wirings 7 is as follows Figure 1 shown.

[0064] Furthermore, in this embodiment, a second wiring 6 is provided on the first corner area a and the third corner area c, and a fourth wiring 8 is provided on the second corner area b and the fourth corner area d; the fourth wiring 8 is located in the frame portion 12, and one end of the fourth wiring 8 extends to the outer side surface 100 to be exposed to form a third exposed portion 81, and the fourth wiring 8 is insulated from the metal layer 2.

[0065] Since in the process of forming the insulating substrate 1, the second surface 121 of the insulating substrate 1 needs to undergo a hot pressing process to form a cavity 101, so that the second surface 121 is highly deformed during the hot pressing process. Since in the packaging base assembly board, the corner area of ​​the insulating substrate 1 of one packaging base shares an angle with the corner areas of the other three adjacent insulating substrates 1, compared with the edge area e that only shares an edge with the insulating substrate 1, more fillers (insulators and coatings) are required to fill the corner area. Otherwise, the corner area of ​​the insulating substrate 1 after molding will be concave, resulting in poor flatness. Therefore, in the present invention, the second wiring 6 and the third wiring 7 are respectively arranged in the corner area, which can effectively increase the volume of the filler in the corner area, so that the corner area is fully filled during the hot pressing process, and the packaging base has better flatness.

[0066] Similarly, in some implementations, in order to fully fill the corner area, see Figures 1 to 10 A first wiring 4 is provided on the first corner area a, one end of the first wiring 4 is located at the frame portion 12 and extends to connect to the metal layer 2, and the other end of the first wiring 4 is located at the base 11 and connected to an external connection terminal 3 through a through-hole conductor 5.

[0067] In some other embodiments, in order to make the corner area fully filled, see Figure 11 、 Figure 12 、 Figure 13 A first wiring 4 is provided in both the first corner region a and the third corner region c; one end of the first wiring 4 located in the frame portion 12 is connected to an external terminal through a through-hole conductor 5 .

[0068] Furthermore, in this embodiment, in order to facilitate electrical connection with electronic components, refer to Figure 1 The package base also includes a first electrode pad 9 and a second electrode pad 10, wherein the first electrode pad 9 and the second electrode pad 10 are diagonally arranged in the cavity 101, and the through-hole conductor 5 of the first electrode pad 9 is connected to an external connection terminal 3 located below the second corner area b; the second electrode pad 10 is connected to an external connection terminal 3 located below the fourth corner area d.

[0069] The production of package bases is typically performed on a large insulating substrate 1, resulting in a package base assembly board composed of multiple package bases. Electroplating traces on the package base assembly board connect the conductive patterns on adjacent package bases, achieving electroplating of all package bases. After electroplating is complete, the assembly board can be separated into individual package bases using pre-set segmentation grooves K.

[0070] Therefore, the present invention also provides a packaging base combination board, which is composed of any of the above-mentioned packaging bases. Specifically, the insulating substrate 1 has a first corner area a, a third corner area c, and a second corner area b and a fourth corner area d arranged diagonally, and an edge area e is provided between adjacent corner areas; a second wiring 6 (not shown in the figure) is provided in the edge area e, and the second wiring 6 electrically connected to each other is provided between two adjacent packaging bases on the sides, and the third wiring 7 electrically connected to each other is provided between two adjacent packaging bases on the sides.

[0071] In some other embodiments, see Figures 9 to 21 The package base assembly board is composed of package bases arranged in the second direction Y and the third direction Z. In order to facilitate the description of the conductive relationship between adjacent package bases, a local structure in the package base assembly board is selected for description. Figures 9 to 21 The package base assembly board includes a first package base A1, a second package base A2, a third package base A3 and a fourth package base A4, wherein the first package base A1 and the second package base A2, the third package base A3 and the fourth package base A4 are adjacently arranged on the third direction Z; the first package base A1 and the fourth package base A4, the second package base A2 and the third package base A3 are adjacently arranged on the second direction Y, the first package base A1 and the third package base A3 are adjacently arranged at an angle, and the second package base A2 and the fourth package base A4 are adjacently arranged at an angle. It should be noted that Figure 9 、 Figure 10 It can be seen that edge-adjacent means that the two package bases are adjacent in the second direction Y or the third direction Z, and the dividing slopes 102 are oppositely arranged to form a dividing groove K. Diagonally adjacent means that the two package bases are adjacent and the diagonals are located on the same straight line.

[0072] In each package subassembly, second wiring 6 is provided in the first corner region a and the third corner region c, respectively. A third wiring 7 is provided in the side region e. A fourth wiring 8 is provided in the second corner region b. The fourth wiring 8 is located within the frame portion 12. One end of the fourth wiring 8 extends to the outer side surface 100, where it is exposed, forming a third exposed portion 81. The fourth wiring 8 is insulated from the metal layer 2. Furthermore, the second wiring 6 of diagonally adjacent package subassemblies is electrically connected via the fourth wiring 8 of the adjacent package subassembly on the opposite side. Specifically, the second wiring 6 in the first package subassembly A1 is electrically connected to the second wiring 6 in the third package subassembly A3 via the fourth wiring 8 in the fourth package subassembly A4.

[0073] There is a third wiring 7 electrically connected to each other between two adjacent package bases. Specifically, part of the third wiring 7 in the first package base A1 is connected to part of the third wiring 7 in the fourth package base A4; part of the third wiring 7 in the first package base A1 is connected to part of the third wiring 7 in the second package base A2, part of the third wiring 7 in the second package base A2 is connected to part of the third wiring 7 in the third package base A3, and part of the third wiring 7 in the third package base A3 is connected to part of the third wiring 7 in the fourth package base A4. That is, the third wiring 7 of one package base is respectively connected to the third wiring 7 of other package bases located on its peripheral side, thereby achieving internal wiring conduction of the package base assembly board.

[0074] The present invention provides an electronic device, comprising any one of the above-mentioned packaging bases, an electronic component disposed in the cavity 101 , and a cover for sealing the cavity 101 .

[0075] In summary, the embodiment of the present invention provides a package base, a composite board, and an electronic device, which are provided with a first wiring 4, a second wiring 6, and a third wiring 7, wherein one end of the first wiring 4 extends within the frame 12 and is connected to the metal layer 2, and the other end extends within the base 11 and is connected to an external connection terminal 3 through a through-hole conductor 5; the second wiring 6 is provided within the frame 12, one end of the second wiring 6 is connected to the metal layer 2, and the other end extends to the outer side surface 100 to be exposed and form a first exposed portion 61; the third wiring 7 is provided within the base 11, one end of the third wiring 7 is connected to the external connection terminal 3, and the second wiring 6 is provided to the outer side surface 100 to be exposed and form a first exposed portion 61; The first end is connected to the connecting terminal 3, and the other end extends to the outer side surface 100 to be exposed and form a second exposed portion 71, thereby achieving electroplated conduction between the conductive wiring inside the package base, and achieving electroplated wiring conduction connection between two adjacent package bases. This solution simplifies the electroplated wiring structure, facilitates the production of the package base assembly board, and is applicable to the case where a single insulating film layer is used to prepare the package base, which can further reduce the size of the package base. At the same time, the electroplated wiring structure of this solution can improve the uniformity of the plating on the package base, which is conducive to the miniaturization and thinning of the package base. In addition, the present invention does not require the provision of through-hole conductors 5 in the frame portion 12, reducing the risk of cracking of the frame portion 12 due to thermal stress.

[0076] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A packaging base, characterized in that: comprising an insulating substrate, a metal layer, a plurality of external connection terminals, a first wiring, a second wiring, and a third wiring; The insulating substrate includes a base and a frame, wherein the frame is formed with a through groove in the first direction, and one end surface of the base is connected to the frame so that the side wall of the through groove and the one end surface of the base are surrounded to form a concave cavity; the base is provided with a first surface on a side away from the frame, and the frame is provided with a second surface on a side away from the base, and the outer wall of the base and the outer wall of the frame extend in the first direction to form an outer side surface; The metal layer is disposed on the second surface and surrounds the cavity; A plurality of external connection terminals are provided on the first surface; One end of the first wiring extends within the frame portion and is connected to the metal layer, and the other end of the first wiring extends within the base portion and is connected to one of the external connection terminals through a through-hole conductor; The second wiring is provided in the frame portion, one end of the second wiring is connected to the metal layer, and the other end of the second wiring extends to the outer side surface and is exposed to form a first exposed portion; The third wiring is provided in the base portion, one end of the third wiring is connected to the external connection terminal, and the other end of the third wiring extends to the outer side surface and is exposed to form a second exposed portion.

2. The package base according to claim 1, wherein: One end of the outer side surface in the first direction is connected to the first surface via a dividing slope, and the other end of the outer side surface in the first direction is connected to the second surface via a dividing slope; The first exposed portion is arranged away from the dividing inclined surface, and / or, The second exposed portion is disposed away from the dividing inclined surface.

3. The package base according to claim 1, wherein: The insulating substrate has a first corner region, a third corner region, a second corner region and a fourth corner region that are diagonally arranged, and a side region is provided between adjacent corner regions; The third wiring is provided in the edge region; or The third wiring is provided in any one of the first corner region, the second corner region, the third corner region, and the fourth corner region.

4. The package base according to claim 3, wherein: One external connection terminal is connected to at least two third wirings, and the two third wirings are located in adjacent side regions.

5. The package base according to claim 3, wherein: The second wiring is provided on the first corner area and the third corner area, and the fourth wiring is provided on the second corner area and the fourth corner area; The fourth wiring is located in the frame portion, one end of the fourth wiring extends to the outer side surface and is exposed to form a third exposed portion, and the fourth wiring is insulated from the metal layer.

6. The package base according to claim 3, wherein: The first wiring is provided on the first corner region. One end of the first wiring is located in the frame portion and extends to connect to the metal layer. The other end of the first wiring is located in the base portion and connected to one of the external connection terminals through the through-hole conductor.

7. The package base according to claim 3, wherein: The first wiring is provided in the first corner region and the third corner region; and one end of the first wiring located at the base is connected to one of the external terminals via the through-hole conductor.

8. The package base according to claim 3, wherein: It also includes a first electrode pad and a second electrode pad, the first electrode pad and the second electrode pad are arranged diagonally in the cavity, the first electrode pad through-hole conductor is connected to one of the external connection terminals located below the second corner area; the second electrode pad is connected to one of the external connection terminals located below the fourth corner area.

9. A package base assembly board, formed by arranging the package bases according to any one of claims 1 to 8, characterized in that: The insulating substrate has a first corner region, a third corner region, a second corner region and a fourth corner region that are diagonally arranged, and a side region is provided between adjacent corner regions; A second wiring is provided in the edge region, the second wiring is electrically connected to each other between two adjacent edges of the package bases, and the third wiring is electrically connected to each other between two adjacent edges of the package bases; or The second wiring is respectively provided in the first corner region and the third corner region, the third wiring is provided in the side region, and the fourth wiring is provided in the second corner region. The fourth wiring is located in the frame portion, one end of the fourth wiring extends to the outer side surface to be exposed to form a third exposed portion, and the fourth wiring is insulated from the metal layer. The second wirings of two diagonally adjacent package bases are electrically connected via the fourth wirings of the side-adjacent package bases, and the third wirings electrically connected to each other are provided between the two side-adjacent package bases.

10. An electronic device comprising the package base according to any one of claims 1 to 8, characterized in that: The invention also includes an electronic component arranged in the cavity and a cover plate for sealing the cavity.

Images