Pressurizing device and method for integrated circuit board production

Abstract

The invention relates to the technical field of integrated circuit board pressing forming, in particular to a pressurizing device for integrated circuit board production and a method thereof.The pressurizing device comprises a pressurizing mechanism, the pressurizing mechanism comprises a pressurizing table, a supporting frame is fixedly connected to the back face of the pressurizing table, and a hydraulic rod is fixedly connected to the top of the supporting frame; the piston end of the hydraulic rod penetrates through the top of the pressurizing table and is fixedly connected with an electric heating pressure plate; the air blowing mechanism comprises an air blower, the front face of the air blower is fixedly connected with the back face of the supporting frame, an air suction hood is arranged at the top of the electric heating pressure plate, and the inner wall of the air suction hood is fixedly connected with the surface of the piston end of the hydraulic rod. The blowing mechanism is used for sucking and filtering harmful gas and blowing and cooling the integrated circuit board, and the placement mechanism is used for conveniently limiting stacking of the integrated circuit board and conveniently taking the integrated circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit board pressing and forming, and in particular to a pressurizing device and method for producing integrated circuit boards. Background Art

[0002] The production of integrated circuit boards uses a pressurized device for compression molding. Workers first stack the printed circuit boards and PP curing sheets in the groove from bottom to top, and ensure that the top layer is the printed circuit board. The heating block is pressed on the top surface of the top printed circuit board. After maintaining the pressure for a period of time, the heating rod is energized. The heat generated by the heating rod is transferred to the heating block, and the heating block then transfers the heat to the top printed circuit board. The top printed circuit board then transfers the heat to the PP curing sheet and printed circuit board below it. The PP curing sheet melts after being heated, and the melted PP curing sheet firmly connects the printed circuit boards on its upper and lower surfaces into one, thereby finally pressing and molding the finished integrated circuit board.

[0003] When the PP cured sheet is heated and melted to perform multi-layer bonding, a small amount of harmful gas will be produced. Although the toxicity is low, it will accumulate over a long period of time and cause harm to the user's body. At the same time, after the integrated circuit board is completed, it needs to wait for cooling before it can be removed to avoid affecting the adhesion effect of the integrated circuit board. At the same time, the completed integrated circuit board is usually in a groove, making it difficult to remove. Summary of the Invention

[0004] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract and title of this application to avoid obscuring the purpose of this section, the abstract and the title of the invention, and such simplifications or omissions should not be used to limit the scope of the present invention.

[0005] The present invention is proposed in view of the above-mentioned problems existing in the existing pressurizing device for producing integrated circuit boards.

[0006] Therefore, the object of the present invention is to provide a pressurizing device for producing integrated circuit boards, which has the following purposes: to extract toxic gases for filtration and to assist in cooling the workpiece, while making it easy to take it.

[0007] To solve the above technical problems, the present invention provides the following technical solutions: comprising: a pressurizing mechanism, which comprises a pressurizing platform, the back of the pressurizing platform is fixedly connected to a support frame, the top of the support frame is fixedly connected to a hydraulic rod, the piston end of the hydraulic rod passes through the top of the pressurizing platform and is fixedly connected to an electrically heated pressure plate; a blowing mechanism, which comprises a blower, the front of the blower is fixedly connected to the back of the support frame, the top of the electrically heated pressure plate is provided with an air suction hood, the inner wall of the air suction hood is fixedly connected to the surface of the piston end of the hydraulic rod, the air suction hood is connected to the air inlet end of the blower, an air outlet sleeve is provided on the rear side of the top of the pressurizing platform, an air guide box is fixedly connected to the right side of the top of the air suction hood, a filter plate is fixedly connected to the left side of the inside of the air guide box, the air outlet sleeve is connected to the air outlet end of the blower through the air guide box, and a self-switch component is provided on the right side of the air guide box; and a placing mechanism, which comprises a limiting component, a glue scraping component and an angle adjustment component.

[0008] As a preferred solution of the pressurizing device for integrated circuit board production described in the present invention, wherein: the self-switch assembly includes an air blowing hole, the air guide box is connected to the air outlet sleeve through the air blowing hole, the air blowing hole is opened on the right side of the air guide box, and a perforated plate is slidably connected to the right side of the bottom of the air guide box, and a sealing plate is fixedly connected to the top of the perforated plate, and the top of the sealing plate passes through the right side of the top of the air guide box and is slidably connected to the air guide box, an exhaust groove is opened on the right side of the air guide box, and a number of exhaust grooves are opened and distributed at equal distances, and a magnetic attraction is provided at the bottom of the perforated plate, and the bottom of the left side of the magnetic attraction is fixedly connected to the bottom of the right side of the pressurizing platform.

[0009] As a preferred solution of the pressurizing device for producing integrated circuit boards according to the present invention, the limiting assembly includes corner limiting members, four corner limiting members are provided and are distributed in a rectangular shape with equal distances, the bottom of the corner limiting member is fixedly connected to the top of the pressing platform, the top of the pressing platform is provided with a slot, and four slots are provided, the bottom of the pressing platform is provided with a movable plate, the top of the movable plate is fixedly connected to four side baffles, the four corners of the bottom of the movable plate are fixedly connected to a piston rod, the four corners of the bottom of the inner wall of the support frame are fixedly connected to a piston sleeve, the inner wall of the piston sleeve is slidably connected to the surface of the piston rod, the rear side of the inner wall of the support frame is provided with a movable groove, the inside of the movable groove is slidably connected to a transmission rod, the top of the front of the transmission rod is fixedly connected to the back of the suction hood, the bottom of the transmission rod is fixedly connected to a pressure plate, the bottom of the pressure plate is fixedly connected to an airbag, the bottom of the airbag is fixedly connected to the bottom of the inner wall of the movable groove, and the airbag is communicated with the piston sleeve.

[0010] As a preferred solution of the pressurizing device for integrated circuit board production described in the present invention, the glue scraping assembly includes an overflow groove, the overflow groove is opened on the outside of the side baffle, there are four groups of overflow grooves and two in each group, and the top of the inner wall of the overflow groove is fixedly connected to a scraping plate.

[0011] As a preferred solution of the pressurizing device for integrated circuit board production described in the present invention, the angle adjustment assembly includes a slider, the front side of the slider is movably connected to the back side of the air outlet sleeve, the front side of the transmission rod is provided with a guide groove, the inner wall of the guide groove is slidably connected to the surface of the slider, the bottom of the slider is fixedly connected to a first tension spring, and the other end of the first tension spring is fixedly connected to the bottom of the inner wall of the guide groove.

[0012] As a preferred solution of the pressurizing device for integrated circuit board production described in the present invention, the top of the sealing plate is fixedly connected to a limiting member, and both sides of the inner bottom of the perforated plate are fixedly connected to a second tension spring, and the other end of the second tension spring is fixedly connected to both sides of the bottom of the air guide box.

[0013] As a preferred solution of the pressurizing device for integrated circuit board production described in the present invention, the top of the outer side of the piston sleeve is connected to a pressure relief valve, the bottom of the piston rod is movably connected to a limit ring, and the surface of the limit ring is fixedly connected to the inner wall of the piston sleeve.

[0014] As a preferred solution of the pressurizing device for integrated circuit board production described in the present invention, limiting grooves are provided on both sides of the inner wall of the guide groove, the inner wall of the limiting groove is slidably connected to the limiting block, and the inner wall of the limiting block is fixedly connected to both sides of the slider.

[0015] The beneficial effects of the present invention are as follows: a pressurizing mechanism is used to heat and pressurize stacked integrated circuit boards; a blowing mechanism is used to absorb and filter harmful gases and blow air to dissipate heat on the integrated circuit boards; and a placement mechanism is used to conveniently limit the stacking of integrated circuit boards and facilitate their removal.

[0016] The present invention is proposed in view of the problems existing in the pressurizing method of the conventional pressurizing device for producing integrated circuit boards.

[0017] Therefore, the purpose of the present invention is to provide a pressurizing method for a pressurizing device used in the production of integrated circuit boards, the purpose of which is to absorb and filter harmful gases, blow air to dissipate heat on the integrated circuit boards, and facilitate the removal of integrated circuit boards.

[0018] In order to solve the above technical problems, the present invention provides the following technical solutions: comprising: Using a pressurizing mechanism to heat and pressurize the stacked integrated circuit boards; Use a blower mechanism to absorb and filter harmful gases, and blow air to dissipate heat on the integrated circuit board; The placement mechanism can be used to conveniently limit the stacking of integrated circuit boards and facilitate their removal.

[0019] As a preferred embodiment of the pressurizing method of the pressurizing device for producing integrated circuit boards of the present invention, the method further comprises: Using a pressurizing mechanism to heat and pressurize the stacked integrated circuit boards, so that the PP cured sheets between the integrated circuit boards are heated and melted and the multiple integrated circuit boards are bonded and pressed together; Use a blower mechanism to absorb and filter the harmful gases generated when the PP cured sheet is melted, and use the filtered air to blow heat to the processed integrated circuit board; The placement mechanism can be used to conveniently restrict the front, back, left, and right directions of multiple integrated circuit boards when they are stacked, and the placement mechanism can also be used to conveniently take out the integrated circuit boards after the integrated circuit boards are processed.

[0020] The beneficial effects of the present invention are as follows: a pressurizing mechanism is used to heat and pressurize the stacked integrated circuit boards, so that the PP cured sheets between the integrated circuit boards are heated and melted and the multiple integrated circuit boards are bonded and pressed together; a blower mechanism is used to absorb and filter the harmful gas generated when the PP cured sheets are melted, and the filtered air is used to blow and dissipate the heat of the processed integrated circuit boards; a placement mechanism can be used to conveniently restrict the front, back, left, and right sides of the multiple integrated circuit boards when they are stacked, and the placement mechanism can also be used to facilitate the removal of the integrated circuit boards after the processing of the integrated circuit boards is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort. Among them: Figure 1 This is a schematic diagram of the overall structure provided by the present invention.

[0022] Figure 2 This is a schematic cross-sectional structural diagram of the air guide box provided by the present invention.

[0023] Figure 3 This is a schematic diagram of the three-dimensional structure of the air outlet sleeve provided by the present invention.

[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of the support frame provided by the present invention.

[0025] Figure 5This is a schematic cross-sectional structural diagram of the piston sleeve provided by the present invention.

[0026] Figure 6 This is a schematic diagram of the three-dimensional structure of the pressurizing platform provided by the present invention.

[0027] Figure 7 This is a schematic diagram of the three-dimensional structure of the movable panel provided by the present invention.

[0028] Figure 8 This is a schematic diagram of the enlarged structure of point A in Figure 4 provided by the present invention. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0030] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0031] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0032] Furthermore, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, when describing the embodiments of the present invention, cross-sectional views illustrating device structures may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, the three-dimensional dimensions of length, width, and depth should be included.

[0033] Example 1 Reference Figures 1 to 8 , which is the first embodiment of the present invention, provides a pressurizing method for a pressurizing device used in the production of integrated circuit boards, which can extract and filter the harmful gases generated during processing and cool the processed integrated circuit boards through the exhaust wind.

[0034] The stacked integrated circuit boards are heated and pressurized using the pressurizing mechanism 100, so that the PP cured sheets between the integrated circuit boards are heated and melted, and the multiple integrated circuit boards are bonded and pressed together. The pressurizing mechanism 100 is then closed to stop pressurizing and heating, and the integrated circuit boards are allowed to cool down completely. During the process of applying pressure and heating the integrated circuit using the pressurizing mechanism 100, the blowing mechanism 200 absorbs and filters the harmful gases generated when the PP cured sheet is melted, thereby preventing the harmful gases from accumulating and being inhaled by the user. The filtered air is then blown to dissipate heat from the processed integrated circuit board, thereby improving the cooling effect on the integrated circuit board. The placement mechanism 300 can be used to conveniently restrict the front, back, left, and right positions of multiple integrated circuit boards when they are stacked, and can also be used to conveniently take the integrated circuit boards after the integrated circuit boards are processed. At the same time, when the placement mechanism 300 is used, the glue overflowed when the multiple integrated circuit boards are glued and pressed together can be scraped off, and the scraped glue residue can also be blown away by the cooling air generated by the blower mechanism 200.

[0035] Example 2 Reference Figures 1 to 4 8 is a second embodiment of the present invention, which provides a pressurizing mechanism 100 and a blowing mechanism 200 to achieve the treatment of harmful gases during heating and pressurizing and to perform auxiliary cooling after the processing is completed.

[0036] The pressurizing mechanism 100 includes a pressurizing platform 101, the back of the pressurizing platform 101 is fixedly connected to a support frame 102, the top of the support frame 102 is fixedly connected to a hydraulic rod 103, the piston end of the hydraulic rod 103 passes through the top of the pressurizing platform 101 and is fixedly connected to an electric heating pressure plate 104, and a blower mechanism 200 includes a blower 201, the front of the blower 201 is fixedly connected to the back of the support frame 102, and the top of the electric heating pressure plate 104 is provided with a An air suction hood 202 is provided, the inner wall of the air suction hood 202 is fixedly connected to the surface of the piston end of the hydraulic rod 103, the air suction hood 202 is connected to the air inlet end of the blower 201, and an air outlet sleeve 203 is provided on the rear side of the top of the pressurizing platform 101. An air guide box 204 is fixedly connected to the right side of the top of the air suction hood 202, and a filter plate 205 is fixedly connected to the left side of the inside of the air guide box 204. The air outlet sleeve 203 is connected to the air outlet end of the blower 201 through the air guide box 204.

[0037] The right side of the air guide box 204 is provided with a self-switch assembly 206, which includes an air blowing hole 206a. The air guide box 204 is connected to the air outlet sleeve 203 through the air blowing hole 206a. The air blowing hole 206a is provided on the right side of the air guide box 204. A perforated plate 206b is slidably connected to the right side of the bottom of the air guide box 204. A sealing plate 206c is fixedly connected to the top of the perforated plate 206b. The top of the sealing plate 206c passes through the right side of the top of the air guide box 204 and is slidably connected to the air guide box 204. An exhaust groove 206d is provided on the right side of the box 204. There are several exhaust grooves 206d and they are distributed at equal distances. A magnetic component 206e is provided at the bottom of the perforated plate 206b. The bottom of the left side of the magnetic component 206e is fixedly connected to the bottom of the right side of the pressurizing platform 101. The top of the sealing plate 206c is fixedly connected to the limiting component 206f. The two sides of the inner bottom of the perforated plate 206b are fixedly connected with a second tension spring 206g, and the other end of the second tension spring 206g is fixedly connected to the two sides of the bottom of the air guide box 204.

[0038] Specifically, an electric heating pressure plate 104 is used to press down and generate heat to bond the stacked integrated circuit boards together, and the blower 201 is turned on simultaneously so that the harmful gases generated when the PP cured sheet is heated and melted are sucked by the suction hood 202 above and filtered through the filter plate 205, so that the harmful substances are filtered on the filter plate 205 and harmless air is discharged. The discharged harmless air can be discharged through the air outlet sleeve 203 and blown to the surface of the processed integrated circuit board, thereby helping the integrated circuit board to cool down, so that the melted colloid between the integrated circuit boards can quickly solidify and adhere, thereby improving the processing efficiency of the integrated circuit boards.

[0039] Specifically, after the electric heating pressure plate 104 moves downward, the exhausted gas can only be exhausted through the exhaust groove 206d, preventing the exhaust sleeve 203 from continuously exhausting gas to cool the integrated circuit board during the heating and pressurizing process, thereby preventing the integrated circuit board from being heated and pressed.

[0040] Furthermore, when multiple integrated circuit boards need to be bonded and pressed, the user first stacks the multiple integrated circuit boards on the pressurizing table 101, and places a PP curing sheet between each integrated circuit board, then starts the hydraulic rod 103 to drive the electric heating pressure plate 104 to pressurize the stacked integrated circuit boards, and at the same time turns on the electric heating pressure plate 104 to generate heat, so that the PP curing sheet melts into a colloid, thereby bonding the stacked integrated circuit boards together. During the use of the electric heating pressure plate 104, the blower 201 can be turned on synchronously, so that the input end of the blower 201 generates suction, and the suction hood 202 will move along with the electric heating pressure plate 104. The synchronous up and down movement allows the harmful gases generated by the PP cured sheet when it is heated and melted to be sucked by the suction hood 202 covered above, and the blower 201 will discharge the sucked air into the air guide box 204 through the output end. At this time, the sucked harmful gases can be filtered by the filter plate 205 in the air guide box 204, so that the harmful substances are filtered on the filter plate 205 and harmless air is discharged. The discharged harmless air can be discharged through the air outlet sleeve 203 and blown to the surface of the integrated circuit board that has been processed, thereby helping to cool the integrated circuit board so that the melted colloid between the integrated circuit boards can quickly solidify and adhere, thereby improving the processing efficiency of the integrated circuit board.

[0041] Furthermore, when the electric heating pressure plate 104 moves downward, the air guide box 204 will be driven to move downward synchronously, so that the perforated plate 206b on the air guide box 204 is close to the magnetic attraction part 206e, and then the magnetic force of the magnetic attraction part 206e is used to adsorb the perforated plate 206b, so that the perforated plate 206b drives the sealing plate 206c to move downward, and then the sealing plate 206c can seal the blowing hole 206a, so that the gas that needs to be discharged in the air guide box 204 can only be discharged through the exhaust groove 206d, so as to avoid the integrated circuit board being heated and pressurized and pressed in the process of continuous exhaust of gas from the air outlet sleeve 203 to cool the integrated circuit board, thereby affecting the integrated circuit board. The circuit board is heated. When the electric heating pressure plate 104 moves upward after the processing is completed, the magnetic attraction part 206e will be separated from the perforated plate 206b, and the tension of the second tension spring 206g can be used to pull the perforated plate 206b upward to reset, so that the holes on the perforated plate 206b correspond to the blowing holes 206a. At the same time, the perforated plate 206b will seal the remaining exhaust grooves 206d, so that the air in the air guide box 204 can be blown to the surface of the integrated circuit board that needs to be cooled through the air outlet sleeve 203, thereby assisting the integrated circuit board to cool down. During the use of the sealing plate 206c, the limiter 206f can be used to prevent the sealing plate 206c from being separated from the air guide box 204.

[0042] Example 3 Reference Figures 1 to 8, which is the third embodiment of the present invention, provides a placement mechanism 300 to facilitate the removal of integrated circuit boards and assist in removing excess waste glue and adjusting the blowing angle.

[0043] The placing mechanism 300 includes a limiting component 301, a scraping component 302 and an angle adjustment component 303. The limiting component 301 includes a corner limiting member 301a. The corner limiting members 301a are provided with four and are distributed in a rectangular shape with equal distances. The bottom of the corner limiting member 301a is fixedly connected to the top of the pressurizing platform 101. The top of the pressurizing platform 101 is provided with a slot 301b. The slot 301b is provided with four. The bottom of the pressurizing platform 101 is provided with a movable plate 301c. The movable plate The top of 301c is fixedly connected with four side baffles 301d, the four corners of the bottom of the movable plate 301c are fixedly connected with the piston rod 301e, the four corners of the bottom of the inner wall of the support frame 102 are fixedly connected with the piston sleeve 301f, the inner wall of the piston sleeve 301f is slidably connected to the surface of the piston rod 301e, the rear side of the inner wall of the support frame 102 is provided with a movable groove 301g, the interior of the movable groove 301g is slidably connected with the transmission rod 301h, and the top of the front of the transmission rod 301h is connected to the suction hood 202 is fixedly connected to the back of the drive rod 301h, the bottom of the drive rod 301h is fixedly connected to the pressure plate 301i, the bottom of the pressure plate 301i is fixedly connected to the air bag 301j, the bottom of the air bag 301j is fixedly connected to the bottom of the inner wall of the movable groove 301g, the air bag 301j is connected to the piston sleeve 301f, the rubber scraping assembly 302 includes an overflow groove 302a, the overflow groove 302a is opened on the outside of the side baffle 301d, the overflow groove 302a is opened in four groups and each group has two overflow grooves. A shovel plate 302b is fixedly connected to the top of the inner wall of 302a, and the angle adjustment assembly 303 includes a slider 303a. The front of the slider 303a is movably connected to the back of the air outlet sleeve 203. A guide groove 303b is provided on the front of the transmission rod 301h. The inner wall of the guide groove 303b is slidably connected to the surface of the slider 303a. The bottom of the slider 303a is fixedly connected to a first tension spring 303c, and the other end of the first tension spring 303c is fixedly connected to the bottom of the inner wall of the guide groove 303b.

[0044] Specifically, when the user places multiple integrated circuit boards on the press table 101 for stacking, the stacked integrated circuit boards are limited in the front, back, left, and right directions by the corner limiter 301a, and the side baffles 301d are used in conjunction with the corner limiter 301a to cover the four sides of the integrated circuit, thereby limiting the movement of the integrated circuit boards and ensuring the stability of the integrated circuit boards during processing. After processing is completed, when the electric heating pressure plate 104 moves upward to reset, the side baffles 301d moves downward to reset. At this time, the left, right, front, and rear sides of the processed integrated circuit boards are exposed, making it easy to directly pick them up. When the side baffles 301d move downward to reset, the integrated circuit boards are exposed. When the pressure plate 301 is in the right position, the scraper plate 302b can scrape off the overflowed glue, thereby saving the subsequent treatment of the overflowed glue and further improving the overall processing efficiency. At the same time, the wind force used by the air outlet sleeve 203 to cool the integrated circuit board can also blow the remaining waste glue to the front, so that it no longer stays on the pressurizing platform 101. In the process of the transmission rod 301h moving upward, the air outlet sleeve 203 will be adjusted to move upward, and at the same time, the air outlet sleeve 203 will be in a downward tilted state, which increases the cooling contact area of ​​the air outlet sleeve 203 on the integrated circuit board, and can also blow off the waste glue still on the front of the integrated circuit board after the integrated circuit board is scraped.

[0045] Furthermore, when the user places multiple integrated circuit boards on the pressurizing table 101 for stacking, the integrated circuit boards can be placed on the inner side of the corner limiter 301a, so that the stacked integrated circuit boards can be limited in the front, back, left and right directions by the corner limiter 301a. Then, when the electric heating pressure plate 104 drives the suction hood 202 to move downward to heat and press the integrated circuit boards, the suction hood 202 will synchronously drive the transmission rod 301h to move downward, so that the transmission rod 301h moves downward along the inner wall of the movable groove 301g, and then the transmission rod 301h drives the pressure plate 301i to squeeze the airbag 301j, so that the squeezed gas in the airbag 301j is discharged into the piston sleeve 301f, and will press the piston in the piston sleeve 301f. The rod 301e generates a thrust, causing the piston rod 301e to move upward and push the movable plate 301c and the side baffle 301d to move upward, so that the side baffle 301d moves to the top of the press table 101 through the slot 301b, and cooperates with the corner limiter 301a to cover the four sides of the integrated circuit, thereby limiting the movement of the integrated circuit board and ensuring the stability of the integrated circuit board during processing. After the processing is completed, when the electric heating pressure plate 104 moves upward and resets, it will drive the transmission rod 301h to move upward through the suction hood 202, so that the transmission rod 301h moves upward along the inner wall of the movable groove 301g, and then the transmission rod 301h drives the pressure plate 301i to reset, so that the pressure plate 301i drives the top of the airbag 301j to move upward and reset, The airbag 301j is expanded, and then the air injected into the piston sleeve 301f is sucked back, so that the piston rod 301e in the piston sleeve 301f lacks the push of air pressure, which drives the movable plate 301c and the side baffle 301d to move downward and reset. At this time, the left and right sides, front and rear sides of the integrated circuit board that has been processed are exposed, so that it is convenient to take it directly. When the glue produced by the melted PP fixing sheet is squeezed and adhered between multiple integrated circuit boards, the excess glue will be discharged outward due to the squeezing. At this time, the overflow groove 302a opened on the outside of the side baffle 301d is used to guide the discharged glue. After the processing of the integrated circuit board is completed, when the side baffle 301d is driven to move downward and reset, the glue fixed on the upper inner wall of the overflow groove 302a is discharged. The shovel plate 302b can scrape off the overflowed glue, thereby saving the subsequent treatment of the overflowed glue and further improving the overall processing efficiency. When the transmission rod 301h moves downward, it will simultaneously drive the slider 303a and the air outlet sleeve 203 movably connected to the front of the slider 303a to move downward. When the bottom of the air outlet sleeve 203 contacts the back side of the top of the pressurizing platform 101, the slider 303a will stop moving. The sliding cooperation between the guide groove 303b and the slider 303a makes the transmission rod 301h continue to move downward. At this time, the air outlet sleeve 203 is in a state of being flat on the back side of the top of the pressurizing platform 101. At the same time, the tension of the first tension spring 303c can make the air outlet sleeve 203 more stable when it is flat on the pressurizing platform 101.During the upward movement of the transmission rod 301h, the air outlet sleeve 203 first performs air cooling. At this time, the wind force used by the air outlet sleeve 203 to cool the integrated circuit board can also blow away the remaining waste glue toward the front, so that it no longer stays on the pressurizing platform 101. During the upward movement of the transmission rod 301h, the tension of the first tension spring 303c is first retracted (during the retraction of the tension of the first tension spring 303c, the air outlet sleeve 203 is still in the air blowing state). After the tension of the first tension spring 303c is retracted, the transmission rod 301h will synchronously lift the slider 303a upward. Then the slider 303a will pull the back of the air outlet sleeve 203 upward, causing the air outlet sleeve 203 to move upward. At the same time, it will also cause the air outlet sleeve 203 to be in a downward tilted state, thereby increasing the cooling contact area of ​​the air outlet sleeve 203 for the integrated circuit board and being able to blow away the waste glue still on the front of the integrated circuit board after the integrated circuit board is scraped.

[0046] It should be noted that after the integrated circuit board is processed and the surface is scraped off and the residual waste glue remaining on the pressurizing platform 101 is in a semi-dry state and lacks stickiness, which facilitates subsequent blowing off.

[0047] The remaining structures are the same as those of Example 2.

[0048] Example 4 Reference Figures 1 to 8 , which is the fourth embodiment of the present invention. This embodiment is different from the third embodiment in that: this embodiment provides a pressurizing device and method for producing integrated circuit boards.

[0049] When multiple integrated circuit boards need to be bonded and pressed, the user first stacks the multiple integrated circuit boards on the pressurizing table 101 and places a PP curing sheet between each integrated circuit board. Then, the hydraulic rod 103 is activated to drive the electric heating pressure plate 104 to pressurize the stacked integrated circuit boards. At the same time, the electric heating pressure plate 104 is turned on to generate heat, causing the PP curing sheet to melt into a colloid, thereby bonding the stacked integrated circuit boards.

[0050] During the use of the electric heating pressure plate 104, the blower 201 can be turned on synchronously, so that the input end of the blower 201 generates suction, and the air suction hood 202 will move up and down synchronously with the electric heating pressure plate 104, so that the harmful gas generated by the PP cured sheet when it is heated and melted is sucked by the air suction hood 202 covered above, and the blower 201 will discharge the sucked air into the air guide box 204 through the output end. At this time, the sucked harmful gas can be filtered by the filter plate 205 in the air guide box 204, so that the harmful substances are filtered on the filter plate 205 and harmless air is discharged. The discharged harmless air can be discharged through the air outlet sleeve 203 and blown to the surface of the integrated circuit board that has been processed, so as to help the integrated circuit board cool down, so that the melted colloid between the integrated circuit boards can quickly solidify and adhere, thereby improving the processing efficiency of the integrated circuit board.

[0051] In the process of the electric heating pressure plate 104 moving downward, the air guide box 204 will be driven to move downward synchronously, so that the perforated plate 206b on the air guide box 204 is close to the magnetic attraction part 206e, and then the magnetic force of the magnetic attraction part 206e is used to adsorb the perforated plate 206b, so that the perforated plate 206b drives the sealing plate 206c to move downward, and then the sealing plate 206c can seal the blowing hole 206a, so that the gas that needs to be discharged in the air guide box 204 can only be discharged through the exhaust groove 206d, so as to avoid the integrated circuit board being heated and pressurized and pressed in the process of continuous exhaust of gas from the air outlet sleeve 203 to cool the integrated circuit board, thereby affecting the integrated circuit board The heating received, when the electric heating pressure plate 104 moves upward after the processing is completed, the magnetic attraction part 206e will be separated from the perforated plate 206b, and the tension of the second tension spring 206g can be used to pull the perforated plate 206b upward to reset, so that the holes on the perforated plate 206b correspond to the blowing holes 206a, and at the same time the perforated plate 206b will seal the remaining exhaust grooves 206d, so that the air in the air guide box 204 can be blown to the surface of the integrated circuit board that needs to be cooled through the air outlet sleeve 203, thereby assisting the integrated circuit board to cool down. During the use of the sealing plate 206c, the limiter 206f can be used to prevent the sealing plate 206c from being separated from the air guide box 204.

[0052] When the user places multiple integrated circuit boards on the press table 101 for stacking, the integrated circuit boards can be placed on the inner side of the corner limiter 301a, so that the stacked integrated circuit boards can be limited in the front, back, left and right directions by the corner limiter 301a. Then, when the electrically heated pressure plate 104 drives the suction hood 202 to move downward to heat and press the integrated circuit boards, the suction hood 202 will synchronously drive the transmission rod 301h to move downward, so that the transmission rod 301h moves downward along the inner wall of the movable groove 301g, and then the transmission rod 301h drives the pressure plate 301i to squeeze the air bag 301j, so that the squeezed gas in the air bag 301j is discharged into the piston sleeve 301f, and it will generate a thrust on the piston rod 301e in the piston sleeve 301f, so that the piston rod 301e moves upward and pushes the movable plate 301c and the side baffle 301d to move upward, so that the side baffle 301d passes through the slot 301 1a and 1b are moved to the top of the press table 101 and cooperate with the corner limiter 301a to cover the four sides of the integrated circuit, thereby limiting the movement of the integrated circuit board and ensuring the stability of the integrated circuit board during processing. After the processing is completed, when the electric heating pressure plate 104 moves upward and resets, it will drive the transmission rod 301h to move upward through the suction hood 202, so that the transmission rod 301h moves upward along the inner wall of the movable groove 301g, and then the transmission rod 301h drives the pressure plate 301i to reset, so that the pressure plate 301i drives the top of the airbag 301j to move upward and reset, and the two people make the airbag 301j expand, and then the air injected into the piston sleeve 301f is drawn back, so that the piston rod 301e in the piston sleeve 301f lacks the push of air pressure, and then drives the movable plate 301c and the side baffle 301d to move downward and reset. At this time, the left and right sides, front and rear sides of the integrated circuit board that has been processed are exposed, making it easy to take it directly.

[0053] During the process of using the airbag 301j to inject air into the piston sleeve 301f, if too much gas is injected and the side baffle 301d is moved upward to the specified position in advance, the air pressure in the piston sleeve 301f will increase suddenly. At this time, the pressure relief valve 301k will automatically open to discharge the excess air pressure. When the normal air pressure is reached, the pressure relief valve 301k will close. At the same time, the limiting ring 301l can limit the maximum downward movement distance of the piston rod 301e to prevent the bottom of the piston rod 301e from touching the bottom, causing the air discharged into the piston sleeve 301f by the airbag 301j to be unable to lift the piston rod 301e upward, thereby improving the stability of use.

[0054] When the glue generated by the melted PP fixing sheet is squeezed and adhered between multiple integrated circuit boards, the excess glue will be discharged outward due to the squeezing. At this time, the discharged glue is guided and discharged through the overflow groove 302a opened on the outer side of the side baffle 301d. After the processing of the integrated circuit boards is completed, when the side baffle 301d is driven to move downward and reset, the scraper plate 302b fixed on the upper inner wall of the overflow groove 302a can scrape off the overflowed glue, thereby saving the subsequent processing of the overflowed glue and further improving the overall processing efficiency.

[0055] When the transmission rod 301h moves downward, the slider 303a and the air outlet sleeve 203 movably connected to the front of the slider 303a will be driven to move downward. When the bottom of the air outlet sleeve 203 contacts the rear side of the top of the pressurizing platform 101, the slider 303a will stop moving. The guide groove 303b and the sliding cooperation of the slider 303a will make the transmission rod 301h continue to move downward. At this time, the air outlet sleeve 203 is in a state of being flat on the rear side of the top of the pressurizing platform 101. At the same time, the tension of the first tension spring 303c can make the air outlet sleeve 203 more stable when it is flat on the pressurizing platform 101. When the transmission rod 301h moves upward, the air outlet sleeve 203 is first cooled by air blowing. At this time, the integrated circuit board is cooled by the air outlet sleeve 203. The wind force can also blow the remaining waste glue to the front, so that it no longer stays on the pressurizing platform 101. During the upward movement of the transmission rod 301h, the tension of the first tension spring 303c is first retracted (during the period when the tension of the first tension spring 303c is retracted, the air outlet sleeve 203 is still in a blowing state). After the tension of the first tension spring 303c is retracted, the transmission rod 301h will synchronously lift the slider 303a upward, and then the slider 303a will pull the back of the air outlet sleeve 203 upward, so that the air outlet sleeve 203 moves upward, and at the same time, the air outlet sleeve 203 is in a downward tilted state, thereby increasing the cooling contact area of ​​the air outlet sleeve 203 on the integrated circuit board, and can also blow away the waste glue still on the front of the integrated circuit board after the integrated circuit board is scraped with glue.

[0056] Furthermore, during the sliding cooperation between the guide groove 303b and the slider 303a, the sliding connection between the limiting block 303e and the limiting groove 303d can prevent the slider 303a from being separated from the guide groove 303b.

[0057] In summary, the pressurizing mechanism 100 is used to heat and pressurize the stacked integrated circuit boards, thereby completing the bonding and pressing between multiple integrated circuit boards. At the same time, the blowing mechanism 200 can absorb and filter the harmful gases generated during heating, and use the filtered air to dissipate the heat of the processed integrated circuit boards. Then, the placing mechanism 300 can facilitate the removal of the processed integrated circuit boards.

[0058] It is important to note that the configuration and arrangement of the present application, as illustrated in various exemplary embodiments, are illustrative only. Although only a few embodiments are described in detail in this disclosure, those reading this disclosure will readily appreciate that numerous modifications are possible without materially departing from the novel aspects and advantages of the subject matter described herein. For example, variations in the size, dimensions, structure, shape, and proportions of various components, as well as parameter values ​​such as temperature, pressure, mounting arrangements, use of materials, color, and orientation are possible. For example, components shown as integrally formed may be constructed from multiple parts or components, the positions of components may be inverted or otherwise altered, and the nature, number, or position of discrete components may be modified or changed. Therefore, all such modifications are intended to be encompassed within the scope of this invention. The order or sequence of any process or method steps may be altered or reordered according to alternative embodiments. In the claims, any "means-plus-function" clause is intended to cover structures that perform the functions described herein, and not only structural equivalence but also equivalent structures. Other substitutions, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of this invention. Therefore, the present invention is not limited to the specific embodiments, but extends to a variety of modifications that still fall within the scope of the appended claims. In addition, in order to provide a concise description of the exemplary embodiments, not all features of the actual embodiment may be described, that is, those features that are not relevant to the best mode presently contemplated for carrying out the invention, or those features that are not relevant to implementing the invention.

[0059] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A pressurizing device for producing integrated circuit boards, characterized in that: include, A pressurizing mechanism (100) comprises a pressurizing platform (101), the back of the pressurizing platform (101) being fixedly connected to a support frame (102), the top of the support frame (102) being fixedly connected to a hydraulic rod (103), the piston end of the hydraulic rod (103) passing through the top of the pressurizing platform (101) being fixedly connected to an electric heating pressure plate (104); A blower mechanism (200) comprising a blower (201), wherein the front of the blower (201) is fixedly connected to the back of the support frame (102), an air suction hood (202) is provided on the top of the electric heating pressure plate (104), the inner wall of the air suction hood (202) is fixedly connected to the surface of the piston end of the hydraulic rod (103), the air suction hood (202) is communicated with the air inlet end of the blower (201), an air outlet sleeve (203) is provided on the rear side of the top of the pressurizing platform (101), an air guide box (204) is fixedly connected to the right side of the top of the air suction hood (202), a filter plate (205) is fixedly connected to the left side of the inside of the air guide box (204), the air outlet sleeve (203) is communicated with the air outlet end of the blower (201) through the air guide box (204), and a self-switch assembly (206) is provided on the right side of the air guide box (204); and, The placement mechanism (300) comprises a limiting component (301), a glue scraping component (302) and an angle adjustment component (303).

2. The pressurizing device for producing integrated circuit boards according to claim 1, characterized in that: The self-switch assembly (206) includes an air blowing hole (206a), the air guide box (204) is connected to the air outlet sleeve (203) through the air blowing hole (206a), the air blowing hole (206a) is opened on the right side of the air guide box (204), a perforated plate (206b) is slidably connected to the right side of the bottom of the air guide box (204), and a sealing plate (206c) is fixedly connected to the top of the perforated plate (206b), and the sealing plate (206c) is fixedly connected to the top of the sealing plate (206c). 6c) is penetrated to the right side of the top of the air guide box (204) and is slidably connected to the air guide box (204), an exhaust groove (206d) is provided on the right side of the air guide box (204), and a plurality of exhaust grooves (206d) are provided and are distributed at equal distances, and a magnetic attraction part (206e) is provided at the bottom of the perforated plate (206b), and the bottom of the left side of the magnetic attraction part (206e) is fixedly connected to the bottom of the right side of the pressurizing platform (101).

3. The pressurizing device for producing integrated circuit boards according to claim 1, wherein: The limiting assembly (301) includes a corner limiting member (301a), four of which are arranged in a rectangular shape and are equidistantly distributed. The bottom of the corner limiting member (301a) is fixedly connected to the top of the pressurizing platform (101). The top of the pressurizing platform (101) is provided with a slot (301b), and four of the slots (301b) are provided. The bottom of the pressurizing platform (101) is provided with a movable plate (301c), and the top of the movable plate (301c) is fixedly connected to four side baffles (301d). The four corners of the bottom of the movable plate (301c) are fixedly connected to a piston rod (301e), and the four corners of the bottom of the inner wall of the support frame (102) are fixedly connected to a piston sleeve (301e). 01f), the inner wall of the piston sleeve (301f) is slidably connected to the surface of the piston rod (301e), a movable groove (301g) is provided on the rear side of the inner wall of the support frame (102), a transmission rod (301h) is slidably connected inside the movable groove (301g), the top of the front of the transmission rod (301h) is fixedly connected to the back of the suction hood (202), the bottom of the transmission rod (301h) is fixedly connected to a pressure plate (301i), the bottom of the pressure plate (301i) is fixedly connected to an airbag (301j), the bottom of the airbag (301j) is fixedly connected to the bottom of the inner wall of the movable groove (301g), and the airbag (301j) is communicated with the piston sleeve (301f).

4. The pressurizing device for producing integrated circuit boards according to claim 3, wherein: The rubber scraping assembly (302) comprises an overflow groove (302a), the overflow groove (302a) being provided on the outside of the side baffle (301d), the overflow groove (302a) being provided in four groups with two overflow grooves in each group, and a scraping plate (302b) being fixedly connected to the top of the inner wall of the overflow groove (302a).

5. The pressurizing device for producing integrated circuit boards according to claim 3, characterized in that: The angle adjustment assembly (303) comprises a slider (303a), the front of the slider (303a) being movably connected to the back of the air outlet sleeve (203), a guide groove (303b) being provided on the front of the transmission rod (301h), the inner wall of the guide groove (303b) being slidably connected to the surface of the slider (303a), a first tension spring (303c) being fixedly connected to the bottom of the inner wall of the guide groove (303b), and the other end of the first tension spring (303c) being fixedly connected to the bottom of the inner wall of the guide groove (303b).

6. The pressurizing device for producing integrated circuit boards according to claim 2, wherein: The top of the sealing plate (206c) is fixedly connected to a limiting member (206f), and both sides of the inner bottom of the perforated plate (206b) are fixedly connected to a second tension spring (206g), and the other end of the second tension spring (206g) is fixedly connected to both sides of the bottom of the air guide box (204).

7. The pressurizing device for producing integrated circuit boards according to claim 3 or 4, characterized in that: The top of the outer side of the piston sleeve (301f) is connected to a pressure relief valve (301k), and the bottom of the piston rod (301e) is movably connected to a limit ring (301l), and the surface of the limit ring (301l) is fixedly connected to the inner wall of the piston sleeve (301f).

8. The pressurizing device for producing integrated circuit boards according to claim 5, characterized in that: Limiting grooves (303d) are provided on both sides of the inner wall of the guide groove (303b), the inner wall of the limiting groove (303d) is slidably connected to a limiting block (303e), and the inner wall of the limiting block (303e) is fixedly connected to both sides of the sliding block (303a).

9. A pressurizing method for a pressurizing device for producing integrated circuit boards, characterized in that: The pressurizing device for producing an integrated circuit board according to any one of claims 1 to 8 further comprises: Using a pressurizing mechanism (100) to heat and pressurize the stacked integrated circuit boards; A blower mechanism (200) is used to absorb and filter harmful gases, and to blow air to dissipate heat on the integrated circuit board; The placement mechanism (300) can be used to conveniently limit the stacking of integrated circuit boards and facilitate their removal.

10. The pressurizing method of the pressurizing device for producing integrated circuit boards according to claim 9, characterized in that: include, Using a pressurizing mechanism (100) to heat and pressurize the stacked integrated circuit boards, so that the PP cured sheets between the integrated circuit boards are heated and melted, and the multiple integrated circuit boards are bonded and pressed together; The harmful gas generated when the PP solidified sheet is melted is sucked and filtered by a blower mechanism (200), and the filtered air is used to blow heat to the processed integrated circuit board; The placement mechanism (300) can be used to conveniently restrict the front, back, left, and right directions of multiple integrated circuit boards when they are stacked, and the placement mechanism (300) can also be used to conveniently take the integrated circuit boards after processing of the integrated circuit boards is completed.

Images