A PCB fine circuit processing flash etching device

Abstract

The application discloses a flash etching device for fine circuit processing of a PCB (Printed Circuit Board), and relates to the technical field of PCB processing.The device comprises a workbench, a mounting frame and a fixing frame are fixedly connected to the top of the workbench, the mounting frame is arranged on the outer side of the fixing frame, equidistantly rotating connections are arranged on the fixing frame, and a conveying roller is further arranged.The device further comprises a center adjusting mechanism and a dynamic spraying mechanism.The center adjusting mechanism is arranged to realize the axial reciprocating movement of the moving ring frame by means of the fixed sleeve, the moving ring frame and the push plate during the movement of the PCB from the left side of the fixing frame to the inside of the mounting frame, thereby driving the push plate to dynamically adjust the conveying center of the PCB placed on the conveying roller, so as to real-time correct the conveying center of the PCB, ensure that the conveying center is always in the middle, improve the uniformity and consistency of subsequent spraying, reduce the problem of uneven subsequent spraying caused by the deviation of the conveying center, thereby improving the spraying efficiency and product quality, and reducing the rate of defective products.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, specifically to a flash etching device for fine circuit processing of PCB boards. Background Technology

[0002] The flash etching process for PCBs is a process that uses photosensitive etchant and ultraviolet light exposure technology to cure the photosensitive etchant under ultraviolet light to form a light-shielding pattern. Then, the copper layer of the unetched parts is removed by chemical etching. In the existing flash etching process for fine circuit processing of PCBs, the spraying process is one of the key steps, used to clean or treat the PCB surface to ensure the accuracy and consistency of subsequent etching processes.

[0003] In actual production, PCB boards are often moved to the spray head by transport rollers for the spraying process. However, due to factors such as equipment wear, installation errors, or minor vibrations during transportation, the transport center of the PCB board is prone to deviating from the center position of the transport rollers. In the current technology, there is a lack of dynamic adjustment function for the transport center of the PCB board. This deviation will cause the flash etching liquid to not evenly cover the entire surface of the PCB board during the subsequent spraying process, resulting in local under-spraying or over-spraying. This seriously affects product quality and leads to inconsistent etching effects on the surface of the PCB board. Some areas will not be completely etched due to insufficient spraying, while other areas will be over-etched due to excessive spraying. This not only affects the precision and reliability of the circuit, but also causes the circuit function to fail.

[0004] Therefore, in view of this, the present invention proposes a flash etching device for fine circuit processing of PCB boards to make up for and improve the deficiencies of the prior art. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides a flash etching apparatus for fine circuit processing of PCB boards, thereby resolving the corresponding technical issues raised in the background section.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a flash etching device for fine circuit processing of PCB board, including a worktable, a mounting frame and a fixing frame fixedly connected to the top of the worktable, and the mounting frame is disposed outside the fixing frame, and transport rollers are rotatably connected at equal intervals on the fixing frame, and further including: a center adjustment mechanism and a dynamic spraying mechanism, wherein the center adjustment mechanism is disposed on the left side of the mounting frame, and the dynamic spraying mechanism is disposed inside the mounting frame;

[0007] The central adjustment mechanism includes a fixed sleeve, a movable ring frame, and a push plate. The fixed sleeve is symmetrically arranged on the left side of the mounting frame, and the movable ring frame is coaxially arranged on the outside of the fixed sleeve. The push plate is symmetrically arranged above the conveyor roller.

[0008] The dynamic spraying mechanism includes a rack, a gear, a diverter pipe, and spray heads. The rack is equidistantly slidably connected to the top of the mounting frame. The gear is meshed on the right side of the rack. The diverter pipe is equidistantly positioned above the fixed frame. The spray heads are equidistantly fixed and connected to the outer surface of the diverter pipe.

[0009] Preferably, the central adjustment mechanism further includes side plates symmetrically fixedly connected to the left side of the mounting frame, with a rotating shaft rotatably connected between the side plates. A drive motor is fixedly connected to one of the side plates, and the output end of the drive motor is fixedly connected to the rotating shaft. The fixing sleeve is symmetrically fixedly connected to the outer surface of the rotating shaft on the same axis.

[0010] Preferably, the outer surface of the fixed sleeve is provided with a continuous V-groove, and the outer surface of the movable ring frame is symmetrically fixedly connected with an extension plate. A sliding ball is fixedly connected to the inner wall of the end of the extension plate facing the fixed sleeve, and the sliding ball is slidably connected to the continuous V-groove.

[0011] Preferably, the push plate is fixedly connected to the outer surface of the movable ring frame, and the push plate is set vertically downward, and the push plate is used to push the PCB board.

[0012] Preferably, each of the side plates has a bent plate symmetrically fixedly connected to its opposing surfaces with the pivot axis as the axis of rotation. The opposing surfaces of the bent plates have a first sliding groove. The outer surface of the movable ring frame has a first slider symmetrically fixedly connected to it, and the first slider is slidably connected in the first sliding groove. A first return spring is fixedly connected between the first slider and the first sliding groove.

[0013] Preferably, the dynamic spraying mechanism further includes a linkage shaft symmetrically rotatably connected to the lower end of the inner wall of the rear side of the mounting frame, and a transmission component is connected between the linkage shaft and the rotating shaft. A first rotating plate is fixedly connected to the outer surface of the linkage shaft, a second rotating plate is rotatably connected to the end of the first rotating plate away from the linkage shaft, and a bottom block is rotatably connected to the end of the second rotating plate away from the first rotating plate.

[0014] Preferably, a connecting plate is fixedly connected between the tops of the base blocks, the top of the connecting plate is fixedly connected to the bottom of the gear, and a driven shaft is rotatably connected at equal intervals to the upper end of the rear inner wall of the mounting bracket, and the gear is coaxially fixedly connected to the outer surface of the driven shaft.

[0015] Preferably, the upper end of the inner wall of the rear side of the mounting bracket is provided with a second sliding groove at equal intervals, the rear side of the connecting plate is fixedly connected with a second slider at equal intervals, and the second slider is slidably connected in the second sliding groove. A second return spring is fixedly connected between the second slider and the second sliding groove.

[0016] Preferably, a central tube is fixedly connected to the upper end of the front inner wall of the mounting bracket, and a liquid guide tube is fixedly connected to the right side of the central tube. The liquid guide tube is used to introduce flash erosion liquid into the central tube.

[0017] Preferably, a sealing joint is fixedly connected to the outer surface of the central tube, the rear end of the diverter tube is fixedly connected to the driven shaft, and the front end of the diverter tube is rotatably connected to the sealing joint.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] (1) By setting the central adjustment mechanism, during the process of the PCB board moving from the left side of the fixed frame to the mounting frame, the design of the fixed sleeve, the moving ring frame and the push plate can realize the axial reciprocating movement of the moving ring frame, thereby driving the push plate to dynamically adjust the transportation center of the PCB board placed on the transport roller, so as to correct the transportation center of the PCB board in real time, ensuring that it is always centered, improving the uniformity and consistency of subsequent spraying, reducing the problem of uneven spraying caused by deviation of the transportation center, thereby improving spraying efficiency and product quality, reducing the defect rate, and through dynamic adjustment, the device can also adapt to PCB boards of different sizes and shapes without frequent machine stoppages for equipment adjustment, thus improving production efficiency.

[0020] (2) By setting the central adjustment mechanism and using the sliding fit design of the continuous V-groove and the slider, the rotational motion of the rotating shaft can be converted into the axial reciprocating motion of the moving ring frame, so that the slider can move along the predetermined path when sliding in the continuous V-groove, thereby ensuring that the motion trajectory of the moving ring frame is accurate and stable. There is no need for a complex mechanical transmission device, which simplifies the equipment structure. The shape and size of the continuous V-groove can accurately control the movement path of the slider, reduce the deviation in the movement process, improve the running accuracy of the equipment, ensure that the transport center of the PCB board can be accurately adjusted, and reduce the problem of transport center deviation caused by mechanical error.

[0021] The first slider and the first groove set between the movable ring frame and the side plate, and equipped with a first return spring, can not only guide the axial movement of the movable ring frame, but also buffer the impact force of the movable ring frame during the movement through the elastic action of the first return spring, so as to ensure that the movement of the movable ring frame is smooth and repeatable.

[0022] (3) By setting up a dynamic spraying mechanism, during the process of centering the PCB board transported on the left end of the fixed frame by the two push plates in the center adjustment mechanism, the design of the linkage shaft, driven shaft, rack and gear can synchronously drive the diversion pipe and the spray head to swing back and forth above the PCB board with the driven shaft as the axis, thereby increasing the coverage of the spray head and enabling the spray head to spray the PCB board more evenly, reducing defects caused by uneven spraying. Moreover, the design of the dynamic spraying mechanism can also reduce the direct contact between the spray head and the PCB board, reduce the mechanical wear caused by the spray force of the flash etching liquid, reduce the deposition of flash etching liquid inside the spray head, extend the service life of the spray head, reduce the maintenance frequency and cost of the equipment, and reduce the downtime caused by equipment failure.

[0023] The design of the linkage shaft, the first rotating plate, the second rotating plate, and the driven shaft ensures that the swing trajectory of the spray head is accurate and stable, reducing motion deviation caused by mechanical errors. Furthermore, the design of the first and second rotating plates can disperse mechanical stress, reduce wear on individual components, effectively buffer the impact force during the movement, and extend the service life of mechanical components. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the connection structure of the mounting bracket shown in this invention;

[0026] Figure 3 As shown in this invention Figure 2 Enlarged structural diagram at point A in the middle;

[0027] Figure 4 This is a schematic diagram of the shaft connection structure shown in the present invention;

[0028] Figure 5 This is a schematic diagram of the disassembled structure of the fixed sleeve and the movable ring frame shown in this invention;

[0029] Figure 6 As shown in this invention Figure 5 Enlarged structural diagram at point B;

[0030] Figure 7 This is a schematic diagram of the toothed rod connection structure shown in the present invention.

[0031] The numbers on the map are:

[0032] 1. Workbench; 2. Mounting frame; 3. Fixing frame; 4. Transport roller;

[0033] 5. Central adjustment mechanism; 501. Side plate; 502. Drive motor; 503. Rotating shaft; 504. Fixed sleeve; 505. Continuous V-groove; 506. Moving ring frame; 507. Extension plate; 508. Sliding ball; 509. First slider; 510. First return spring; 511. Push plate; 512. Bending plate; 513. First slide groove;

[0034] 6. Dynamic spraying mechanism; 601. Transmission component; 602. Linkage shaft; 603. First rotating plate; 604. Second rotating plate; 605. Base block; 606. Connecting plate; 607. Second slider; 608. Second return spring; 609. Gear rack; 610. Driven shaft; 611. Gear; 612. Diverter pipe; 613. Spray head; 614. Central pipe; 615. Sealing joint; 616. Second slide groove; 617. Liquid guide pipe. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Embodiment 1 of the present invention:

[0037] Please refer to Figures 1 to 7 As shown, a flash etching device for fine circuit processing of PCB board includes a worktable 1, a mounting frame 2 and a fixing frame 3 are fixedly connected to the top of the worktable 1, and the mounting frame 2 is located outside the fixing frame 3. Transport rollers 4 are rotatably connected to the fixing frame 3 at equal intervals. The device also includes a center adjustment mechanism 5 and a dynamic spraying mechanism 6, with the center adjustment mechanism 5 located on the left side of the mounting frame 2 and the dynamic spraying mechanism 6 located inside the mounting frame 2.

[0038] The central adjustment mechanism 5 includes a fixed sleeve 504, a movable ring frame 506, and a push plate 511. The fixed sleeve 504 is symmetrically arranged on the left side of the mounting frame 2, the movable ring frame 506 is coaxially arranged on the outside of the fixed sleeve 504, and the push plate 511 is symmetrically arranged above the transport roller 4.

[0039] The dynamic spraying mechanism 6 includes a rack 609, a gear 611, a diverter pipe 612, and a spray head 613. The rack 609 is equidistantly slidably connected to the top of the mounting frame 2. The gear 611 is meshed on the right side of the rack 609. The diverter pipe 612 is equidistantly arranged above the fixed frame 3. The spray head 613 is equidistantly fixed and connected to the outer surface of the diverter pipe 612.

[0040] The central adjustment mechanism 5 also includes side plates 501 symmetrically fixedly connected to the left side of the mounting frame 2. A rotating shaft 503 is rotatably connected between the side plates 501. A drive motor 502 is fixedly connected to one of the side plates 501. The output end of the drive motor 502 is fixedly connected to the rotating shaft 503. A fixing sleeve 504 is symmetrically fixedly connected to the outer surface of the rotating shaft 503 on the same axis.

[0041] The outer surface of the fixed sleeve 504 is provided with a continuous V-groove 505. The outer surface of the movable ring frame 506 is symmetrically fixedly connected with an extension plate 507. A slider 508 is fixedly connected to the inner wall of the end of the extension plate 507 facing the fixed sleeve 504, and the slider 508 is slidably connected to the continuous V-groove 505.

[0042] The push plate 511 is fixedly connected to the outer surface of the movable ring frame 506, and the push plate 511 is set vertically downward. The push plate 511 is used to push the PCB board.

[0043] The side plates 501 are symmetrically fixedly connected with bending plates 512 about the axis of rotation 503. The bending plates 512 are provided with a first sliding groove 513 on their opposite surfaces. The outer surface of the movable ring frame 506 is symmetrically fixedly connected with a first slider 509, and the first slider 509 is slidably connected in the first sliding groove 513. A first return spring 510 is fixedly connected between the first slider 509 and the first sliding groove 513.

[0044] The effects achieved by this embodiment are as follows: Compared with the prior art, by setting the central adjustment mechanism 5, during the process of the PCB board moving and transporting from the left side of the fixed frame 3 into the mounting frame 2, the design of the fixed sleeve 504, the moving ring frame 506 and the push plate 511 can realize the axial reciprocating movement of the moving ring frame 506, thereby driving the push plate 511 to dynamically adjust the transport center of the PCB board placed on the transport roller 4, thereby correcting the transport center of the PCB board in real time, ensuring that it is always centered, improving the uniformity and consistency of subsequent spraying, reducing the problem of uneven spraying caused by deviation of the transport center, thereby improving spraying efficiency and product quality, reducing the defect rate, and through dynamic adjustment, this device can also adapt to PCB boards of different sizes and shapes without frequent machine stops for equipment adjustment, thus improving production efficiency.

[0045] The sliding fit design of the continuous V-groove 505 and the slider 508 can convert the rotational motion of the rotating shaft 503 into the axial reciprocating motion of the moving ring frame 506. This allows the slider 508 to move along a predetermined path when sliding in the continuous V-groove 505, thereby ensuring that the motion trajectory of the moving ring frame 506 is accurate and stable. This eliminates the need for complex mechanical transmission devices, simplifying the equipment structure. Furthermore, the shape and size of the continuous V-groove 505 can precisely control the motion path of the slider 508, reducing deviations during the motion process, improving the operating accuracy of the equipment, and ensuring that the transport center of the PCB board can be accurately adjusted, reducing the problem of transport center deviation caused by mechanical errors.

[0046] The first slider 509 and the first groove 513 provided between the movable ring frame 506 and the side plate 501, and equipped with a first return spring 510, can not only guide the axial movement of the movable ring frame 506, but also buffer the impact force of the movable ring frame 506 during the movement through the elastic action of the first return spring 510, so as to ensure that the movement of the movable ring frame 506 is smooth and repeatable.

[0047] Embodiment 2 of the present invention:

[0048] Please refer to Figures 1 to 7 As shown, the dynamic spraying mechanism 6 also includes a linkage shaft 602 symmetrically rotatably connected to the lower end of the inner wall of the rear side of the mounting frame 2, and a transmission component 601 is connected between the linkage shaft 602 and the rotating shaft 503. A first rotating plate 603 is fixedly connected to the outer surface of the linkage shaft 602. A second rotating plate 604 is rotatably connected to the end of the first rotating plate 603 away from the linkage shaft 602. A bottom block 605 is rotatably connected to the end of the second rotating plate 604 away from the first rotating plate 603.

[0049] A connecting plate 606 is fixedly connected between the top of the bottom block 605. The top of the connecting plate 606 is fixedly connected to the bottom of the rack 609. A driven shaft 610 is rotatably connected at equal distances to the upper end of the inner wall of the rear side of the mounting bracket 2. The gear 611 is coaxially fixedly connected to the outer surface of the driven shaft 610.

[0050] The upper end of the inner wall of the rear side of the mounting bracket 2 is provided with a second sliding groove 616 at equal intervals. The rear side of the connecting plate 606 is fixedly connected with a second slider 607 at equal intervals, and the second slider 607 is slidably connected in the second sliding groove 616. A second return spring 608 is fixedly connected between the second slider 607 and the second sliding groove 616.

[0051] A central tube 614 is fixedly connected to the upper end of the inner wall of the front side of the mounting bracket 2. A liquid guide tube 617 is fixedly connected to the right side of the central tube 614. The liquid guide tube 617 is used to introduce flash erosion liquid into the central tube 614.

[0052] A sealing joint 615 is fixedly connected to the outer surface of the central tube 614. The rear end of the diversion tube 612 is fixedly connected to the driven shaft 610, and the front end of the diversion tube 612 is rotatably connected to the sealing joint 615.

[0053] The effects achieved by this embodiment are as follows: Compared with the prior art, by setting up the dynamic spray mechanism 6, during the process of centering the PCB board transported at the left end of the fixed frame 3 by using the two push plates 511 in the center adjustment mechanism 5, the design of the linkage shaft 602, driven shaft 610, rack 609 and gear 611 can synchronously drive the diversion pipe 612 to work with the spray head 613 to swing back and forth above the PCB board with the driven shaft 610 as the axis, thereby increasing the coverage of the spray head 613, enabling the spray head 613 to spray the PCB board more evenly, reducing defects caused by uneven spraying. Moreover, the design of the dynamic spray mechanism 6 can also reduce the direct contact between the spray head 613 and the PCB board, reduce mechanical wear caused by the spray force of the flash etching liquid, reduce the deposition of flash etching liquid inside the spray head 613, extend the service life of the spray head 613, reduce the maintenance frequency and cost of the equipment, and reduce downtime caused by equipment failure.

[0054] The design of the linkage shaft 602, the first rotating plate 603, the second rotating plate 604 and the driven shaft 610 can ensure that the swing trajectory of the spray head 613 is accurate and stable, reduce the motion deviation caused by mechanical errors, and the design of the first rotating plate 603 and the second rotating plate 604 can disperse mechanical stress, reduce the wear of individual components, effectively buffer the impact force during the movement, and extend the service life of mechanical components.

[0055] The complete usage steps and working principle of the above embodiments are as follows:

[0056] It should be noted in advance that, if Figure 1 As shown, when the equipment is running, the PCB board is transported from the left side of the fixed frame 3 by the transport roller 4 and first conveyed into the mounting frame 2. It is then sprayed by the spray structure inside the mounting frame 2 and then output from the right side of the fixed frame 3. It should also be noted that the above are all existing technologies and will not be elaborated on here.

[0057] The following is the working process of the central adjustment mechanism 5 adjusting and controlling the transport center of the PCB board above the transport roller 4:

[0058] During the process of moving and transporting the PCB board from the left side of the fixing frame 3 into the mounting frame 2, such as Figure 1 , Figure 2 , Figure 4 , Figure 5 as well as Figure 6As shown, since the mounting bracket 2 has symmetrically fixed side plates 501 on its left side, and a rotating shaft 503 is rotatably mounted between the side plates 501, a drive motor 502 is fixedly mounted on one of the side plates 501, and the output end of the drive motor 502 is fixedly connected to the rotating shaft 503. Therefore, the drive motor 502 can be turned on synchronously during equipment operation, driving the rotating shaft 503 to rotate between the two side plates 501. Furthermore, since the outer surface of the rotating shaft 503 is symmetrically fixed with fixed sleeves 504 coaxially, and the outer surface of the fixed sleeves 504 has continuous V-grooves 505, when the rotating shaft 503 rotates, the two fixed sleeves 504 mounted on its outer surface rotate synchronously around the rotating shaft 503. (Refer to...) Figure 5 A movable ring frame 506 is movably mounted on the outer surface of the fixed sleeve 504, and extension plates 507 are symmetrically fixed on the outer surface of the movable ring frame 506. Each extension plate 507 has a sliding ball 508 fixedly mounted on its inner surface facing the fixed sleeve 504, which is adapted to the continuous V-groove 505. The sliding ball 508 is slidably mounted within the continuous V-groove 505. Therefore, when the rotating shaft 503 rotates, causing the fixed sleeve 504 to rotate synchronously, the continuous change of the continuous V-groove 505, combined with the design of the sliding ball 508, allows the sliding ball 508 to follow the opening path of the continuous V-groove 505, driving the movable ring frame 506 to move axially back and forth synchronously on the outer surface of the fixed sleeve 504. Furthermore, because the push plate 511 is fixedly mounted on the outer surface of the movable ring frame 506 and is vertically downward, the continuous V-groove 505 drives the sliding ball 508, allowing the two push plates 511 to move synchronously under the connecting action of the movable ring frame 506. The PCB board is moved axially back and forth above the transport roller 4 (i.e., moving towards or away from each other) to adjust the transport center of the PCB board on the transport roller 4, so that the PCB board can be placed in the center on the transport roller 4. This is so that the subsequent dynamic spraying mechanism 6 can spray the PCB board. In the above process, through the design of the center adjustment mechanism 5, the axial reciprocating movement of the moving ring frame 506 can be realized, which in turn drives the push plate 511 to dynamically adjust the transport center of the PCB board placed on the transport roller 4. This corrects the transport center of the PCB board in real time, ensuring that it is always centered, improving the uniformity and consistency of subsequent spraying, reducing the problem of uneven spraying caused by deviation of the transport center, thereby improving spraying efficiency and product quality, reducing the defect rate, and through dynamic adjustment, the device can also adapt to PCB boards of different sizes and shapes without frequent machine stops for equipment adjustment, thus improving production efficiency.

[0059] The sliding fit design of the continuous V-groove 505 and the slider 508 can convert the rotational motion of the rotating shaft 503 into the axial reciprocating motion of the moving ring frame 506. This allows the slider 508 to move along a predetermined path when sliding in the continuous V-groove 505, thereby ensuring that the motion trajectory of the moving ring frame 506 is accurate and stable. This eliminates the need for complex mechanical transmission devices, simplifying the equipment structure. Furthermore, the shape and size of the continuous V-groove 505 can precisely control the motion path of the slider 508, reducing deviations during the motion process, improving the operating accuracy of the equipment, and ensuring that the transport center of the PCB board can be accurately adjusted, reducing the problem of transport center deviation caused by mechanical errors.

[0060] like Figure 4 , Figure 5 as well as Figure 6 As shown, symmetrical bending plates 512 are fixedly provided on the opposing surfaces of the side plates 501, and first sliding grooves 513 are opened on the opposing surfaces of the two bending plates 512 on the same side. First sliders 509 adapted to the first sliding grooves 513 are symmetrically fixedly provided on the outer surface of the movable ring frame 506, and the first sliders 509 are slidably disposed in the first sliding grooves 513. A first return spring 510 is fixedly provided between the first slider 509 and the groove wall of the first sliding groove 513. Therefore, while the fixed sleeve 504 rotates to drive the movable ring frame 506 to move axially back and forth, the first slider 509 will slide synchronously in the first sliding groove 513 to compress or release the first return spring 510, thereby cooperating with the axial movement of the movable ring frame 506 and avoiding the deviation of the axial movement direction of the movable ring frame 506, thereby improving the stability of the movable ring frame 506 and the pusher plate 511 in pushing the PCB board.

[0061] Please refer to the above work process. Figures 1 to 7 .

[0062] The following describes the working process of the dynamic spray mechanism 6 simultaneously swinging and spraying the PCB board below while controlling the PCB board transport center:

[0063] After the two push plates 511 in the central adjustment mechanism 5 center the PCB board transported on the left end of the fixed frame 3, the PCB board will be transported by the transport rollers 4 and gradually move into the mounting frame 2 for the spraying process. Figure 2 , Figure 3 as well as Figure 7As shown, since the lower end of the rear inner wall of the mounting bracket 2 is symmetrically equipped with a linkage shaft 602, and a transmission component 601 is connected between the outer surface of the linkage shaft 602 and the outer surface of the rotating shaft 503 (it should be noted that the transmission component 601 consists of multiple transmission wheels and a transmission belt connecting the multiple transmission wheels, and the number of transmission wheels is consistent with the total number of rotating shaft 503 and linkage shaft 602, that is, the outer surfaces of rotating shaft 503 and linkage shaft 602 are fixedly equipped with transmission wheels, and the transmission belt is connected between the outer surfaces of these transmission wheels), when the rotating shaft 503 rotates and drives the two push plates 511 to move towards each other to push the PCB board in the center, the two symmetrical linkage shafts 602 can be driven to rotate synchronously on the lower inner wall of the rear side of the mounting bracket 2 through the transmission action of the transmission component 601. Figure 3 and Figure 7 As shown, a first rotating plate 603 is rotatably mounted on the outer surface of the linkage shaft 602, and a second rotating plate 604 is rotatably mounted on the end of the first rotating plate 603 away from the linkage shaft 602. A bottom block 605 is rotatably mounted on the end of the second rotating plate 604 away from the first rotating plate 603. Therefore, when the linkage shaft 602 rotates on the inner wall of the mounting frame 2, it can synchronously drive the first rotating plate 603 to rotate around the linkage shaft 602 as the axis. Through the rotation of the first rotating plate 603, the second rotating plate 604 can continue to move. Since the bottom block 605 is fixedly mounted on the bottom of the connecting plate 606, and the connecting plate 606 is slidably mounted on the upper inner wall of the rear side of the mounting frame 2, the axial movement direction of the connecting plate 606 is limited. When the first rotating plate 603 rotates, through the linkage design of the second rotating plate 604, the bottom block 605 can move vertically in coordination with the connecting plate 606, thereby realizing the up-down reciprocating motion of the connecting plate 606.

[0064] The mounting bracket 2 has a second sliding groove 616 symmetrically opened on the upper inner wall of the rear side. The connecting plate 606 has a second slider 607 symmetrically fixed on the rear side. A second return spring 608 is fixed between the second slider 607 and the groove wall of the second sliding groove 616. The spring can limit the axial movement path of the connecting plate 606 while the second rotating plate 604 pushes the connecting plate 606 to move up and down. This makes the movement of the connecting plate 606 more stable and provides a reliable foundation for subsequent dynamic spraying.

[0065] refer to Figure 2 , Figure 3 as well as Figure 7As shown, a central tube 614 is fixedly installed on the inner wall of the upper front side of the mounting frame 2, and a liquid guide tube 617 is fixedly connected to the central tube 614. A flash etch liquid tank is provided in the workbench 1. The end of the liquid guide tube 617 away from the central tube 614 is fixedly connected to the flash etch liquid tank, and the position of the flash etch liquid tank corresponds to that of the mounting frame 2. The sprayed flash etch liquid eventually flows into the flash etch liquid tank under the influence of gravity. The flash etch liquid is repeatedly extracted and reused through the liquid guide tube 617. (It should be noted that a corresponding filter structure is provided between the liquid guide tube 617 and the flash etch liquid tank to prevent impurities from entering the interior of the central tube 614 and causing blockage of the spray head 613. The design between the liquid guide tube 617 and the flash etch liquid tank is existing technology and will not be elaborated on here.)

[0066] A driven shaft 610 is equidistantly rotatably mounted on the upper inner wall of the rear side of the mounting bracket 2. A rack 609 is equidistantly fixed on the top of the connecting plate 606, and the rack 609 is slidably connected to the top of the mounting bracket 2. When the second rotating plate 604 moves to drive the connecting plate 606 to move vertically back and forth, the rack 609 mounted on it can move synchronously and slide through the top of the mounting bracket 2. Because the rack 609 meshes with the gear 611 on its right side, and the gear 611 is coaxially fixed on the outer surface of the driven shaft 610, when the connecting plate 606 moves upward, the rack 609 moves through the teeth of the rack 609. The meshing mechanism drives the gear 611 to reciprocate. Because the outer surface of the central tube 614 is fixedly connected to a sealing joint 615, and the number and position of the sealing joints 615 correspond to the driven shaft 610, and the inner surface of the sealing joint 615 is provided with a shunt pipe 612 for sealing rotation, with the end of the shunt pipe 612 away from the sealing joint 615 fixedly connected to the driven shaft 610, during the process of the rack 609 driving the gear 611 to reciprocate and causing the driven shaft 610 to move synchronously, the fixed design of the driven shaft 610 and the shunt pipe 612 allows for simultaneous rotation of the driven shaft 610. At the same time, the diversion pipe 612 is driven to reciprocate and swing at the upper end of the mounting bracket 2, causing the spray head 613 connected to the diversion pipe 612 to reciprocate and swing synchronously, thereby increasing the spray range on the PCB board and improving the spray efficiency. In the above process, through the setting of the dynamic spray mechanism 6, when the PCB board transported on the left end of the fixed frame 3 is centered by the two push plates 511 in the center adjustment mechanism 5, the design of the linkage shaft 602, driven shaft 610, rack 609 and gear 611 can synchronously drive the diversion pipe 612 and the spray head 613 to swing synchronously. The spray head 613 reciprocates above the PCB board around the driven shaft 610, thereby increasing the coverage area of ​​the spray head 613 and enabling the spray head 613 to spray the PCB board more evenly, reducing defects caused by uneven spraying. In addition, the design of the dynamic spraying mechanism 6 can also reduce the direct contact between the spray head 613 and the PCB board, reduce mechanical wear caused by the spraying force of the flash etching liquid, reduce the deposition of flash etching liquid inside the spray head 613, extend the service life of the spray head 613, reduce the maintenance frequency and cost of the equipment, and reduce downtime caused by equipment failure.

[0067] Please refer to the above work process. Figures 1 to 7 .

[0068] The circuits and controls involved in this invention are all existing technologies and will not be described in detail here.

[0069] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flash etching device for fine circuit processing of PCB board, comprising a worktable (1), wherein a mounting frame (2) and a fixing frame (3) are fixedly connected to the top of the worktable (1), and the mounting frame (2) is disposed outside the fixing frame (3), and transport rollers (4) are rotatably connected at equal intervals on the fixing frame (3), characterized in that, Also include: center adjustment mechanism (5) and dynamic spray mechanism (6); The center adjustment mechanism (5) comprises a fixed sleeve (504), a moving ring holder (506) and a push plate (511), the fixed sleeve (504) is symmetrically arranged on the left side of the mounting frame (2), the moving ring holder (506) is coaxially arranged on the outside of the fixed sleeve (504), and the push plate (511) is symmetrically arranged above the conveying roller (4); The dynamic spray mechanism (6) comprises a rack (609), a gear (611), a shunt pipe (612) and a spray head (613), the rack (609) penetrates through the top of the mounting frame (2) at equal intervals in a sliding manner, the gear (611) is arranged on the right side of the rack (609) in a meshed manner, the shunt pipe (612) is arranged above the fixed frame (3) at equal intervals, and the spray head (613) is fixedly connected to the outer surface of the shunt pipe (612) at equal intervals. The center adjustment mechanism (5) further comprises side plates (501) which are symmetrically and fixedly connected to the left side of the mounting frame (2), a rotating shaft (503) is rotatably connected between the side plates (501), one of the side plates (501) is fixedly connected with a driving motor (502), and the output end of the driving motor (502) is fixedly connected with the rotating shaft (503). A continuous V-shaped groove (505) is formed in the outer surface of the fixed sleeve (504), extension plates (507) are fixedly connected to the outer surface of the moving ring holder (506) in a symmetrical manner, a sliding ball (508) is fixedly connected to the inner wall of one end of the extension plate (507) facing the fixed sleeve (504), and the sliding ball (508) is in sliding connection with the continuous V-shaped groove (505). The push plate (511) is fixedly connected to the outer surface of the moving ring holder (506), and the push plate (511) is arranged vertically downward, and the push plate (511) is used for pushing the PCB board.

2. The PCB fine circuit processing flash etching device according to claim 1, characterized in that, Bend plates (512) are fixedly connected to the facing surfaces of the side plates (501) in a symmetrical manner with the rotating shaft (503) as the axis, first sliding grooves (513) are formed in the facing surfaces of the bend plates (512), first sliding blocks (509) are fixedly connected to the outer surface of the moving ring holder (506) in a symmetrical manner, the first sliding blocks (509) are in sliding connection with the first sliding grooves (513), and first return springs (510) are fixedly connected between the first sliding blocks (509) and the first sliding grooves (513).

3. The PCB fine circuit processing flash etching device according to claim 1, characterized in that, The dynamic spray mechanism (6) further comprises a linkage shaft (602) which is symmetrically and rotatably connected to the lower end of the inner wall of the rear side of the mounting frame (2), a transmission member (601) is in transmission connection between the linkage shaft (602) and the rotating shaft (503), a first rotating plate (603) is fixedly connected to the outer surface of the linkage shaft (602), a second rotating plate (604) is rotatably connected to one end of the first rotating plate (603) away from the linkage shaft (602), and a bottom block (605) is rotatably connected to one end of the second rotating plate (604) away from the first rotating plate (603).

4. The PCB fine circuit processing flash etching device according to claim 3, characterized in that, The connecting plate (606) top is fixedly connected with the bottom of the gear rod (609), the driven shaft (610) is equidistantly and rotatably connected to the upper end of the rear inner wall of the mounting frame (2), and the gear (611) is coaxially and fixedly connected to the outer surface of the driven shaft (610).

5. The PCB fine circuit processing flash etching device according to claim 4, characterized in that, The second sliding groove (616) is equidistantly formed in the upper end of the rear inner wall of the mounting frame (2), the second sliding block (607) is equidistantly and fixedly connected to the rear side of the connecting plate (606), and the second sliding block (607) is slidingly connected in the second sliding groove (616).

6. The PCB fine circuit processing flash etching device according to claim 1, characterized in that, The center pipe (614) is fixedly connected to the upper end of the front inner wall of the mounting frame (2), the liquid guide pipe (617) is fixedly and communicatively connected to the right side of the center pipe (614), and the liquid guide pipe (617) is used for guiding the flash flood liquid into the center pipe (614).

7. The PCB fine circuit processing flash etching device according to claim 6, characterized in that, The outer surface of the center pipe (614) is fixedly and communicatively connected with the sealing joint (615), the rear end of the shunt pipe (612) is fixedly connected with the driven shaft (610), and the front end of the shunt pipe (612) is rotatably connected in the sealing joint (615).

Images