Pickling board grinding equipment for circuit board

Abstract

The invention discloses acid pickling and board grinding equipment for a circuit board, and belongs to the technical field of circuit boards, and the acid pickling and board grinding equipment comprises a bottom plate, a board grinding assembly mounted above the bottom plate, and a spray-washing assembly mounted on the side surface of the bottom plate, and a first guide rail and a first displacement driving device are fixed on the upper side of the bottom plate; a plurality of first sliding blocks are installed on the first guide rail in the length direction of the first guide rail in a sliding mode, the first sliding block closest to the first displacement driving device is connected with the output end of the first displacement driving device, and the first sliding block farthest from the first displacement driving device is fixedly connected with the bottom plate. A rotating pin is fixed to each first sliding block, a first connecting rod and a second connecting rod are hinged to each rotating pin at the same time, the first connecting rods and the second connecting rods are installed on the rotating pins in an X shape, and the adjacent first connecting rods and second connecting rods are hinged end to end. According to the invention, a plurality of circuit boards can be subjected to acid pickling and board grinding at the same time, and the processing efficiency of the circuit boards can be improved while the surface quality of the circuit boards is ensured.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit boards, and in particular relates to a pickling and grinding device for circuit boards. Background Art

[0002] Circuit boards, also known as printed circuit boards (PCBs), miniaturize and visualize circuitry, playing a vital role in the mass production of fixed circuits and optimizing the layout of electrical appliances. PCBs are typically manufactured through a process involving electroplating, etching, and other steps after circuit diagram design. After plating, PCBs typically require pickling to remove surface residue and protect them. Grinding also removes oil, impurities, and burrs, ensuring a clean and smooth surface and ensuring smooth processing in subsequent processes. However, existing equipment typically only processes single PCBs, resulting in low processing efficiency. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a pickling and grinding equipment for circuit boards, which can simultaneously perform pickling and grinding treatments on multiple circuit boards, while ensuring the surface quality of the circuit boards and improving the processing efficiency of the circuit boards.

[0004] In order to achieve the above object, the present invention provides the following technical solutions: The cam is connected to the control stand by an upper handle which is fixed on the control stand, and the cam is connected to the control stand by an upper handle which is fixed on the control stand, so that the control stand can be driven by the upper handle to change the direction of the rotation of the control stand.

[0005] Furthermore, a top plate is arranged parallel to and spaced apart on the upper side of the bottom plate, and the bottom plate and the top plate are connected by a column. A second guide rail is fixed to the lower side of the top plate, and a plurality of second sliders are slidably installed on the second guide rail along its length direction. The second sliders correspond to the first sliders one by one, the upper end of the vertical screw is rotatably connected to the second slider, and the upper end of the vertical guide rod is fixedly connected to the second slider.

[0006] Furthermore, a longitudinal screw and a longitudinal guide rod are installed at parallel intervals on the lower side of the top plate, the longitudinal screw is connected to the second motor, and the longitudinal screw is also threadedly connected to the longitudinal moving block, and the longitudinal moving block is provided with a guide hole that slides with the longitudinal guide rod; a transverse screw and a transverse guide rod are installed at parallel intervals on the lower side of the longitudinal moving block, the transverse screw is connected to the third motor, and the transverse screw is also threadedly connected to the transverse moving block, and the transverse moving block is provided with a guide hole that slides with the transverse guide rod; the transverse moving block is also connected to the grinding plate assembly.

[0007] Furthermore, the grinding plate assembly includes a servo, a vertical telescopic device, a fourth motor, a telescopic airbag, and a grinding disc. The servo is fixed on the lower side of the transverse moving block. The output end of the servo is connected to the vertical telescopic device. The output end of the vertical telescopic device is connected to the fourth motor. The output end of the fourth motor is connected to the grinding disc through the telescopic airbag. The telescopic airbag is also connected to an air pump through an air pipe.

[0008] Furthermore, a receiving groove is provided in the center of the grinding disc, a coil spring is installed in the receiving groove, the outer end of the coil spring is fixedly connected to the grinding disc, the inner end of the coil spring is fixedly connected to a longitudinal telescopic device, the output end of the longitudinal telescopic device is connected to the grinding head, a grinding block is provided at the opening of the receiving groove, and a center hole for the grinding head to pass through is provided in the center of the grinding block.

[0009] Furthermore, a support block is slidably provided on the outer side of the vertical guide rod, and a through hole is opened on the support block for the vertical screw to pass through. The lower side of the support block also forms an installation position for the circuit board, and an elastic support device is connected between the second slider and the support block.

[0010] Furthermore, a notch is formed on the side of the installation position, and the circuit board can be loaded and unloaded from the notch along the horizontal direction.

[0011] Furthermore, the spray assembly includes a second displacement drive device, a third guide rail, a third slider, a spray pipe, a hose and a pickling box. The third guide rail is installed parallel to one side of the first guide rail. The third slider slides with the third guide rail. The spray pipe is fixed to the third slider. The spray pipe is also connected to the pickling box through a hose. A water pump is installed on the hose. A spray hole is opened on the spray pipe. The second displacement drive device can drive the third slider to slide along the third guide rail.

[0012] The beneficial effects of the present invention are: The present invention discloses a pickling and grinding device for circuit boards. By arranging multiple first sliders on a base plate, a vertical movable block on the first slider is formed with an installation position for installing the circuit boards. Multiple circuit boards can be installed at intervals, thereby realizing simultaneous pickling and grinding of multiple circuit boards. While ensuring the surface quality of the circuit boards, the processing efficiency of the circuit boards is greatly improved.

[0013] By activating the first displacement drive, multiple circuit boards can be brought together and apart. When brought together, multiple boards can be placed and retrieved simultaneously, facilitating subsequent processes. When separated, pickling and grinding operations can be performed thoroughly, and the grinding tool will not interfere with the boards during operation, ensuring ease of use.

[0014] Other advantages, objectives and features of the present invention will be described in the following description and will be apparent to those skilled in the art to some extent, or those skilled in the art can be taught from the practice of the present invention. The objectives and other advantages of the present invention can be achieved through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to make the purpose, technical solutions and beneficial effects of the present invention more clear, the present invention provides the following drawings for illustration: Figure 1 The structure of the device of the present invention is shown in FIG. Figure 1 ; Figure 2 The structure of the device of the present invention is shown in FIG. Figure 2 ; Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 is a structural schematic diagram of the second slider; Figure 5 Schematic diagram of the structure of the coil spring; Figure 6 Schematic diagram of the structure of the grinding plate assembly; Figure 7 is a cross-sectional view of a grinding plate assembly; Figure 8 Schematic diagram of the structure of the first connecting rod and the second connecting rod.

[0016] The numbers in the accompanying drawings are as follows: bottom plate 1, grinding plate assembly 2, spray assembly 3, first guide rail 4, first displacement drive device 5, first slider 6, rotating pin 7, first connecting rod 8, second connecting rod 9, vertical screw 10, vertical guide rod 11, first motor 12, vertical moving block 13, top plate 14, column 15, second guide rail 16, second slider 17, longitudinal screw 18, longitudinal guide rod 19, second motor 20, longitudinal moving block 21, transverse screw 22, transverse guide rod 23, third motor 24, lateral movement block 25, servo 26, vertical telescopic device 27, fourth motor 28, telescopic airbag 29, grinding disc 30, air pipe 31, accommodating groove 32, coil spring 33, longitudinal telescopic device 34, grinding head 35, grinding block 36, center hole 37, support block 38, elastic support device 39, notch 40, second displacement drive device 41, third guide rail 42, third slider 43, spray pipe 44, hose 45, spray hole 46. DETAILED DESCRIPTION

[0017] like Figures 1 to 8 As shown, the present invention discloses a pickling and grinding device for circuit boards, comprising a base plate 1, a grinding plate assembly 2 mounted above the base plate 1, and a spray assembly 3 mounted on the side of the base plate 1. The base plate 1 primarily supports the entire device. To facilitate the collection of pickling liquid from the circuit boards, the base plate 1 can also be installed in a pickling tank, which also facilitates the collection of grinding debris from the grinding plates. In some other embodiments, the grinding plate assembly 2 and the spray assembly 3 utilize existing equipment, and the spray assembly 3 can be configured to move around the base plate 1 to clean the circuit boards.

[0018] In this embodiment of the present invention, a first guide rail 4 and a first displacement drive device 5 are fixed to the upper side of the base plate 1. The longitudinal direction of the base plate 1 is defined as the longitudinal direction, the width direction as the transverse direction, and the direction perpendicular to the base plate 1 as the vertical direction. The first guide rail 4 extends longitudinally, and a plurality of first sliders 6 are slidably mounted on the first guide rail 4 along its length. The first displacement drive device 5 is a hydraulic cylinder mounted at one end of the base plate 1.

[0019] Among them, the first slider 6 closest to the first displacement drive device 5 is connected to the output end of the first displacement drive device 5, so that the first displacement drive device 5 can drive the first slider 6 to slide longitudinally, and the first slider 6 farthest from the first displacement drive device 5 is fixedly connected to the base plate 1; the distance between the first slider 6 farthest from the first displacement drive device 5 and the first slider 6 closest to it should be long enough so that multiple first sliders 6 can have a certain displacement space.

[0020] A rotating pin 7 is fixed on each first slider 6. The rotating pin 7 is located at the center of the first slider 6 and is perpendicular to the upper surface of the first slider 6. The first connecting rod 8 and the second connecting rod 9 are hinged on the rotating pin 7 at the same time. The planes where the first connecting rod 8 and the second connecting rod 9 are located are parallel to the upper surface of the first slider 6. The first connecting rod 8 and the second connecting rod 9 are installed on the rotating pin 7 in an X shape, and the adjacent first connecting rods 8 and second connecting rods 9 are hinged end to end; that is, the head end of the first connecting rod 8 is hinged to the tail end of one second connecting rod 9, and the tail end of the second connecting rod 9 is hinged to the head end of another second connecting rod 9, until all the first connecting rods 8 and the second connecting rod 9 are connected in a fork-shaped manner. The specific structure is shown in the figure.

[0021] A vertical screw 10 and a vertical guide rod 11 are installed in parallel and at intervals on the first slider 6. The vertical screw 10 is rotatably connected to the first slider 6. A first motor 12 for controlling the rotation of the vertical screw 10 is installed on the first slider 6. A vertical moving block 13 is also threadedly connected to the vertical screw 10. A guide hole is provided on the vertical moving block 13 for slidingly cooperating with the vertical guide rod 11. A mounting position for installing a circuit board is formed on the vertical moving block 13.

[0022] The working principle and process of the device of the present invention are as follows: before operation, each first slider 6 has the shortest distance between them, thereby occupying the smallest space, and the staff or the operating robot arm installs the circuit board on the corresponding installation position, and the two adjacent circuit boards are arranged in parallel and spaced apart. Start the first displacement drive device 5, drive the first slider 6 connected to it away from the fixed first slider 6, and the two adjacent first sliders 6 are arranged in space, and the space between them can be used by the grinding plate assembly 2 to perform grinding plate processing operations. The grinding plate tool will not interfere with the circuit board during operation and can be used conveniently. The equipment of the present invention realizes the simultaneous pickling and grinding plate processing of multiple circuit boards, which greatly improves the processing efficiency of the circuit boards while ensuring the surface quality of the circuit boards.

[0023] In this embodiment, a top plate 14 is arranged parallel to and spaced apart on the upper side of the bottom plate 1. The bottom plate 1 and the top plate 14 are connected by a column 15. A second guide rail 16 is fixed to the lower side of the top plate 14. A plurality of second sliders 17 are slidably installed on the second guide rail 16 along its length direction. The second sliders 17 correspond one-to-one to the first slider 6. The upper end of the vertical screw 10 is rotatably connected to the second slider 17, and the upper end of the vertical guide rod 11 is fixedly connected to the second slider 17. The sliding connection method of the second slider 17 is exactly the same as that of the first slider 6. The driving force of its sliding is transmitted through the vertical guide rod 11, and it can follow the displacement of the first slider 6. By providing the second slider 17, support can be provided for the upper ends of the vertical screw 10 and the vertical guide rod 11, making their movement more stable.

[0024] In this embodiment, a longitudinal screw 18 and a longitudinal guide rod 19 are installed in parallel and spaced relation to the lower side of the top plate 14. Both longitudinal screw 18 and longitudinal guide rod 19 are arranged in the longitudinal direction. The longitudinal screw 18 is connected to a second motor 20 and is also threadedly connected to a longitudinal movement block 21. The longitudinal movement block 21 has a guide hole that slides with the longitudinal guide rod 19. A transverse screw 22 and a transverse guide rod 23 are installed in parallel and spaced relation to the lower side of the longitudinal movement block 21. The transverse screw 22 is connected to a third motor 24 and is also threadedly connected to a transverse movement block 25. The transverse movement block 25 has a guide hole that slides with the transverse guide rod 23. The transverse movement block 25 is also connected to the grinding plate assembly 2. By providing the longitudinal movement block 21 and the transverse movement block 25, the grinding plate assembly 2 can be driven to move along a plane, accommodating grinding plate operation at different positions on the plane.

[0025] In this embodiment, the grinding plate assembly 2 includes a steering gear 26, a vertical telescopic device 27, a fourth motor 28, a telescopic airbag 29, and a grinding disc 30. The steering gear 26 is fixed to the lower side of the transverse moving block 25. The output end of the steering gear 26 is connected to the vertical telescopic device 27. The steering gear 26 can drive the vertical telescopic device 27 to rotate about its central axis, thereby changing the grinding direction of the grinding disc 30. The vertical telescopic device 27 can drive the fourth motor 28 to move up and down, thereby changing the vertical grinding position.

[0026] The output of vertical telescopic device 27 is connected to fourth motor 28, which in turn is connected to grinding disc 30 via telescopic airbag 29. Telescopic airbag 29 is also connected to an air pump via air pipe 31. The provision of telescopic airbag 29 allows grinding disc 30 to adapt to grinding different bump heights on the circuit board, minimizing damage to the circuit board itself.

[0027] In this embodiment, a receiving slot 32 is defined at the center of the grinding disc 30. A coil spring 33 is mounted within the receiving slot 32. The outer end of the coil spring 33 is fixedly connected to the grinding disc 30, while the inner end of the coil spring 33 is fixedly connected to a longitudinal expansion mechanism 34. The output end of the longitudinal expansion mechanism 34 is connected to a grinding head 35. A grinding block 36 is positioned at the opening of the receiving slot 32. A central hole 37 is defined in the center of the grinding block 36 for the grinding head 35 to pass through. The diameter of the central hole 37 is larger than that of the grinding head 35. Normal grinding is achieved by contact between the outer end surface of the grinding block 36 and the circuit board. Simultaneously, the grinding head 35 can be extended outward by the longitudinal expansion mechanism 34, thereby grinding holes in the circuit board.

[0028] The grinding head 35 is eccentrically arranged in the receiving groove 32. By setting the coil spring 33, when the grinding disc 30 rotates under the action of the fourth motor 28, the grinding head 35 moves radially outward under the action of centrifugal force, so that the grinding head 35 can be close to the inner wall of the hole to perform the grinding operation, and the processing effect is better.

[0029] In this embodiment, a support block 38 is slidably provided on the outer side of the vertical guide rod 11. The support block 38 has a through hole for the vertical screw 10 to pass through. The underside of the support block 38 also forms a mounting position for the circuit board. An elastic support device 39 is connected between the second slider 17 and the support block 38. The elastic support device 39 utilizes a support spring to press the support block 38 downward against the circuit board. The cooperation between the vertical movable block 13 and the support block 38 positions and supports both sides of the circuit board, preventing the grinding disc 30 from causing deflection of the circuit board during machining and ensuring the quality of the ground board. A notch 40 is formed on the side of the mounting position, allowing the circuit board to be loaded and unloaded laterally through the notch 40.

[0030] In this embodiment, the spray assembly 3 includes a second displacement drive device 41, a third guide rail 42, a third slider 43, a spray pipe 44, a hose 45, and a pickling tank. The third guide rail 42 is mounted parallel to one side of the first guide rail 4. The third slider 43 slides in engagement with the third guide rail 42. The spray pipe 44 is fixed to the third slider 43 and connected to the pickling tank via a hose 45. The hose 45 is equipped with a water pump. The spray pipe 44 is provided with a spray hole 46. The second displacement drive device 41 is capable of driving the third slider 43 to slide along the third guide rail 42. In some other embodiments, the third guide rail 42 is an annular guide rail, which allows for more thorough pickling of the circuit board.

[0031] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. A pickling and grinding equipment for circuit boards, characterized by: The cam is connected to the control stand by an upper handle which is fixed on the control stand, and the cam is connected to the control stand by an upper handle which is fixed on the control stand, so that the cam can be turned away from the control stand, thereby preventing the cam from sliding off the control stand and causing the cam to slide in the control stand.

2. The pickling and grinding equipment for circuit boards according to claim 1, characterized in that: A top plate is arranged parallel to and spaced apart on the upper side of the bottom plate. The bottom plate and the top plate are connected by a column. A second guide rail is fixed to the lower side of the top plate. A plurality of second sliders are slidably installed on the second guide rail along its length direction. The second sliders correspond to the first sliders one by one. The upper end of the vertical screw is rotatably connected to the second slider, and the upper end of the vertical guide rod is fixedly connected to the second slider.

3. The pickling and grinding equipment for circuit boards according to claim 2, characterized in that: A longitudinal screw and a longitudinal guide rod are installed at parallel intervals on the lower side of the top plate. The longitudinal screw is connected to the second motor and is also threadedly connected to the longitudinal moving block. The longitudinal moving block is provided with a guide hole that slides with the longitudinal guide rod; a transverse screw and a transverse guide rod are installed at parallel intervals on the lower side of the longitudinal moving block. The transverse screw is connected to the third motor and is also threadedly connected to the transverse moving block. The transverse moving block is provided with a guide hole that slides with the transverse guide rod; the transverse moving block is also connected to the grinding plate assembly.

4. The pickling and grinding equipment for circuit boards according to claim 3, characterized in that: The grinding plate assembly includes a servo, a vertical telescopic device, a fourth motor, a telescopic airbag, and a grinding disc. The servo is fixed on the lower side of the transverse moving block. The output end of the servo is connected to the vertical telescopic device. The output end of the vertical telescopic device is connected to the fourth motor. The output end of the fourth motor is connected to the grinding disc through the telescopic airbag. The telescopic airbag is also connected to an air pump through an air pipe.

5. The pickling and grinding equipment for circuit boards according to claim 4, characterized in that: A receiving groove is provided in the center of the grinding disc, a coil spring is installed in the receiving groove, the outer end of the coil spring is fixedly connected to the grinding disc, the inner end of the coil spring is fixedly connected to a longitudinal telescopic device, the output end of the longitudinal telescopic device is connected to the grinding head, a grinding block is provided at the opening of the receiving groove, and a center hole for the grinding head to pass through is provided in the center of the grinding block.

6. The pickling and grinding equipment for circuit boards according to claim 2, characterized in that: A support block is slidably provided on the outer side of the vertical guide rod, and a through hole is provided on the support block for the vertical screw to pass through. The lower side of the support block also forms an installation position for the circuit board, and an elastic support device is connected between the second slider and the support block.

7. The pickling and grinding equipment for circuit boards according to claim 6, characterized in that: A notch is formed on the side of the installation position, and the circuit board can be loaded and unloaded from the notch along the horizontal direction.

8. The pickling and grinding equipment for circuit boards according to any one of claims 1 to 7, characterized in that: The spray assembly includes a second displacement drive device, a third guide rail, a third slider, a spray pipe, a hose and a pickling box. The third guide rail is installed parallel to one side of the first guide rail. The third slider slides with the third guide rail. The spray pipe is fixed to the third slider. The spray pipe is also connected to the pickling box through a hose. A water pump is installed on the hose. A spray hole is opened on the spray pipe. The second displacement drive device can drive the third slider to slide along the third guide rail.

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