Packaging equipment for electronic component manufacturing

Abstract

The invention relates to the technical field of electronic component packaging, in particular to packaging equipment for electronic component manufacturing, which comprises a processing table, a packaging mechanism is mounted on the right side of the top surface of the processing table, and a feeding mechanism is mounted on the left side of the top surface of the processing table; a moving structure is installed on the top face of the machining table and comprises a guide rail, the guide rail is fixedly installed on the top face of the machining table, a moving plate is slidably installed on the outer side of the top face of the guide rail, and a handle is fixedly connected to the front face of the moving plate. According to the packaging equipment, the turbine fan is arranged and can automatically rotate when an element is pulled out after packaging is finished, air can be accelerated to be blown to the surface of the element from the upper side and the lower side, solidification of colloid on the upper face and the lower face of the element can be accelerated, and meanwhile when the turbine fan rotates, the shell can be driven to integrally vibrate through cooperation of a clamping ball and a clamping groove; and the colloid can be compacted downwards, so that internal bubbles are extruded out, and the packaging effect of the element is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component packaging, in particular to packaging equipment for manufacturing electronic components. Background Art

[0002] Electronic component packaging refers to the installation of the pins of electronic components (such as chips, diodes, transistors, etc.) on a specific circuit board. In order to ensure the stability of the electronic components after installation, the pins where the electronic components are soldered to the circuit board are encapsulated with glue to protect the stability of the electronic components during subsequent use on the circuit board.

[0003] In this regard, China's patent application number: CN202410721156.2 discloses a packaging device for manufacturing electronic components, including a mounting table, the top of the mounting table is rotatably connected to a mounting shaft, the bottom end of the mounting shaft is fixedly connected to a drive motor fixedly connected to the mounting table through a coupling, the top of the mounting shaft is fixedly connected to a mounting disk, the top of the mounting disk is provided with a plurality of mounting slots, and a clamping mechanism is provided in the mounting slot. This packaging device for manufacturing electronic components, through the glue packaging mechanism, selects a suitable glue tube to glue and package the pins of the electronic components according to the size of the pins of the electronic components soldered on the circuit board, thereby realizing the glue packaging of electronic components with pins of different sizes, greatly improving the applicability of the packaging of the pins of electronic components on the circuit board, and also improving the packaging effect and packaging efficiency of the pins.

[0004] The device is equipped with a rotatable clamping plate to turn the clamped circuit board over, making it easier to encapsulate the other side of the circuit board. However, in actual packaging processing, the colloid mostly encapsulates the pins through its own fluidity. Bubbles are easily generated inside the colloid during packaging, which will affect the packaging effect, reduce product quality, and be detrimental to the company's economic benefits.

[0005] Therefore, in order to solve the above problems, a packaging device for manufacturing electronic components is proposed. Summary of the Invention

[0006] The purpose of the present invention is to provide a packaging device for manufacturing electronic components to solve the problem in the prior art proposed in the above background technology that most of the colloids are used to encapsulate the pins through their own fluidity, and bubbles are easily generated inside the colloid during packaging, which affects the packaging effect, causes the quality of the product to be reduced, and is not conducive to the economic benefits of the enterprise.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solution: a packaging device for manufacturing electronic components, comprising: a processing table, a packaging mechanism installed on the right side of the top surface of the processing table, and a loading mechanism installed on the left side of the top surface of the processing table; The top surface of the processing table is equipped with a movable structure, and the movable structure includes a guide rail, which is fixedly installed on the top surface of the processing table, and a movable plate is slidably installed on the outer side of the top surface of the guide rail, and a handle is fixedly connected to the front of the movable plate, and a fixed cylinder is installed in the middle of the top surface of the guide rail, and an air inlet is provided on the surface of the fixed cylinder, and a shell is installed on the top surface of the fixed cylinder, and an air inlet hole is provided on the inner wall of the shell, and a card slot is provided on the inner inner wall of the shell, and an air outlet is fixedly connected to the rear wall of the shell, and a turbine fan is movably installed on the inner side of the shell through a bearing, and a spring is fixedly connected to the inner wall of the turbine fan, and a card ball is fixedly connected to the end of the spring, and a bevel gear ring is fixedly installed on the bottom surface of the turbine fan; A positioning structure is installed on the inner side of the moving structure. The positioning structure includes a motor. The motor is fixedly installed on the inner wall of the shell. The output end of the motor is fixedly connected to a rotating frame. An electric push rod is fixedly installed on the inner side of the rotating frame.

[0008] Preferably, a driving structure is installed inside the movable structure, and the driving structure includes a first pulley, which is movably installed inside the fixed cylinder through a bearing, a transmission belt is provided on the outer side of the first pulley, and the end of the first pulley is fixedly connected to a bevel gear, and a second pulley is movably installed on the bottom surface of the movable plate through a bearing, and the end of the second pulley is fixedly connected to a transmission gear, and a rack plate is fixedly installed on the top surface of the processing table.

[0009] Preferably, the packaging mechanism is located on the rear side of the movable plate.

[0010] Preferably, the air inlet passes through the fixed cylinder, and the interior of the shell and the air outlet are communicated with each other.

[0011] Preferably, the clamping grooves are distributed in an annular shape on the inner surface of the housing, the clamping balls are clamped inside the clamping grooves, and the bevel gear ring is meshed with the bevel gear.

[0012] Preferably, the positioning structure is located on the inner side of the housing, and the rotating frame is flush with the air inlet.

[0013] Preferably, the transmission belt passes through the movable plate, and the bottom end of the transmission belt is sleeved on the outside of the second pulley, and the transmission gear is engaged with the rack plate.

[0014] Compared with the prior art, the beneficial effects of the present invention are: the packaging equipment of the present invention can automatically rotate when the component is pulled out after the packaging is completed by setting a turbo fan, which can accelerate the air to blow onto the surface of the component from the upper and lower sides, and accelerate the solidification of the colloid on the upper and lower sides of the component. At the same time, when the turbo fan rotates, it can drive the overall vibration of the shell through the cooperation of the card ball and the card slot, which can make the colloid tamp downward to squeeze out the bubbles inside, thereby ensuring the packaging effect of the component.

[0015] It is equipped with a moving structure, a driving structure and a positioning structure. When packaging, the component is placed inside the rotating frame, and the electric push rod is started. The two sets of electric push rods cooperate with each other to clamp and fix the component. When the handle is pushed, the moving plate can slide on the guide rail, and the moving plate moves backward to the lower side of the packaging mechanism, which is convenient for the packaging mechanism to process the component. After the packaging is completed, pull the handle and the movable plate can move forward on the guide rail, and when the movable plate moves, it will drive the transmission gear to move relative to the rack plate, and the transmission gear is engaged with the rack plate. When the movable plate moves, it will drive the transmission gear to rotate, and the transmission gear will drive the second pulley to rotate, and drive the first pulley and the bevel gear to rotate through the transmission belt, and the bevel gear is engaged with the bevel gear ring, so the rotation of the bevel gear will drive the turbine fan to rotate inside the shell through the bevel gear ring, and the turbine fan will rotate clockwise. When the turbine fan rotates, it can pump outside air from the upper side to the inside of the shell, and air can also enter the inside of the shell from the air inlet, so that the components inside the shell are affected by air from the upper and lower directions. Air blowing can accelerate the solidification of the colloid on the surface of the component, and then the air enters the inside of the shell through the air inlet and is finally discharged through the air outlet. When the turbine fan rotates, it drives the spring to drive the card ball to rotate in a circle. The card ball is stuck in the card slot. When the turbine fan rotates, it drives the spring to bend, so that the card ball can be pulled out of the card slot and fit the inner wall of the shell. When the card ball is realigned with the card slot, the card ball hits the inner wall of the card slot under the elastic action of the spring, causing the inner side of the shell to vibrate. The vibration effect is transmitted to the component through the positioning structure, which can cause the component to vibrate in the horizontal direction. The colloid is compacted downward under the action of the vibration, and the bubbles inside can be squeezed out, which can ensure the packaging effect of the component. After pulling out, the packaging result of the top surface of the component can be tested, and then the motor is controlled to start, and the motor drives the rotating frame to rotate, so that the component can be turned over to facilitate the packaging of the bottom surface of the component. It is easy to operate and has strong functionality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic front view of the structure of the present invention; Figure 2 It is a schematic diagram of the explosion of the structure of the present invention; Figure 3 It is a bottom view schematic diagram of the structure of the movable plate and the second pulley of the present invention; Figure 4 It is a schematic exploded view of the structure of the moving structure and the positioning structure of the present invention; Figure 5 Schematic diagram of a top cross-section of the structure of the casing and the turbofan of the present invention; Figure 6 Schematic diagram of the separation structure of the casing and the turbofan of the present invention; Figure 7Schematic diagram of the front cross-section of the structure of the turbine fan, bevel gear ring and bevel gear of the present invention; Figure 8 It is a front cross-sectional schematic diagram of the structure of the movable plate, fixed cylinder and shell of the present invention.

[0017] In the figure: 1. Processing table; 11. Packaging mechanism; 12. Loading mechanism; 2. Moving structure; 21. Guide rail; 22. Moving plate; 23. Handle; 24. Fixed cylinder; 25. Air inlet; 26. Housing; 27. Air inlet hole; 28. Slot; 29. ​​Air outlet; 210. Turbofan; 211. Spring; 212. Card ball; 213. Bevel gear ring; 3. Driving structure; 31. First pulley; 32. Transmission belt; 33. Bevel gear; 34. Second pulley; 35. Transmission gear; 36. Rack plate; 4. Positioning structure; 41. Motor; 42. Rotating frame; 43. Electric push rod. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figures 1-8 , an embodiment provided by the present invention: The processing table 1, packaging mechanism 11, loading mechanism 12, motor 41 and electric push rod 43 used in this application are products that can be directly purchased on the market. Their principles and connection methods are existing technologies well known to technicians in this field, so they will not be repeated here.

[0020] A packaging device for manufacturing electronic components, comprising: a processing table 1, a packaging mechanism 11 is installed on the right side of the top surface of the processing table 1, and a loading mechanism 12 is installed on the left side of the top surface of the processing table 1; The top surface of the processing table 1 is equipped with a movable structure 2, which includes a guide rail 21. The guide rail 21 is fixedly installed on the top surface of the processing table 1. A movable plate 22 is slidably installed on the outer side of the top surface of the guide rail 21. A handle 23 is fixedly connected to the front of the movable plate 22. A fixed cylinder 24 is installed in the middle of the top surface of the guide rail 21. An air inlet 25 is provided on the surface of the fixed cylinder 24. A shell 26 is installed on the top surface of the fixed cylinder 24. An air inlet hole 27 is provided on the inner wall of the shell 26. A card slot 28 is provided on the inner wall of the shell 26. An air outlet 29 is fixedly connected to the rear wall of the shell 26. The inner side of the shell 26 is movable by a bearing. A turbine fan 210 is dynamically installed. A spring 211 is fixedly connected to the inner wall of the turbine fan 210. A locking ball 212 is fixedly connected to the end of the spring 211. A bevel gear ring 213 is fixedly installed on the bottom surface of the turbine fan 210. The turbine fan 210 can automatically rotate when the component is pulled out after the encapsulation is completed, which can accelerate the air to blow onto the surface of the component from the top and bottom, and accelerate the curing of the colloid on the top and bottom surfaces of the component. At the same time, when the turbine fan 210 rotates, the locking ball 212 and the locking groove 28 cooperate to drive the entire housing 26 to vibrate, which can compact the colloid downward to squeeze out the bubbles inside and ensure the encapsulation effect of the component. A positioning structure 4 is installed on the inner side of the moving structure 2. The positioning structure 4 includes a motor 41. The motor 41 is fixedly installed on the inner wall of the shell 26. The output end of the motor 41 is fixedly connected to the rotating frame 42. The inner side of the rotating frame 42 is fixedly installed with an electric push rod 43. The positioning structure 4 can clamp the component and enable the component to be flipped up and down, which is convenient for packaging the upper and lower sides of the component.

[0021] Furthermore, a driving structure 3 is installed inside the movable structure 2, and the driving structure 3 includes a first pulley 31, which is movably installed inside the fixed cylinder 24 through a bearing, and a transmission belt 32 is provided on the outer side of the first pulley 31. The end of the first pulley 31 is fixedly connected to a bevel gear 33, and a second pulley 34 is movably installed on the bottom surface of the movable plate 22 through a bearing, and the end of the second pulley 34 is fixedly connected to a transmission gear 35. A rack plate 36 is fixedly installed on the top surface of the processing table 1. The driving structure 3 can drive the turbine fan 210 to rotate when the movable plate 22 moves, so as to facilitate the solidification of the colloid on the surface of the component, and at the same time, it can drive the card ball 212 to hit the inner wall of the card slot 28, so that the outer shell 26 vibrates, and the colloid is compacted downward to squeeze out the bubbles inside, thereby ensuring the packaging effect of the component and improving the functionality of the device.

[0022] Furthermore, the packaging mechanism 11 is located on the rear side of the movable plate 22. When the movable plate 22 moves backward, the component can be transported to the lower side of the packaging mechanism 11, so that the surface of the component can be glued and packaged by the packaging mechanism 11 to ensure the operating experience of the device.

[0023] Furthermore, the air inlet 25 passes through the fixed tube 24, and the interior of the outer shell 26 and the air outlet 29 are communicated. Through the air inlet 25, when the turbofan 210 rotates, the outside air can be blown from the bottom to the surface of the component, which is convenient for blowing and cleaning the uncoated side of the component, keeping the coated surface clean, and accelerating the solidification of the colloid on the component. The air in the outer shell 26 can be discharged through the air outlet 29.

[0024] Furthermore, the card slots 28 are distributed in a ring shape on the inner surface of the shell 26, the card ball 212 is stuck inside the card slots 28, the bevel gear ring 213 is engaged with the bevel gear 33, and the rotation of the bevel gear 33 can drive the turbine fan 210 to rotate through the bevel gear ring 213. The turbine fan 210 drives the card ball 212 to hit the card slots 28 in sequence along a circular trajectory, causing the shell 26 to vibrate in the circumferential direction, which can accelerate the discharge of bubbles in the colloid and improve the packaging effect of the components.

[0025] Furthermore, the positioning structure 4 is located on the inner side of the shell 26, and the rotating frame 42 is flush with the air inlet hole 27. When the shell 26 vibrates, the positioning structure 4 and the component inside can be driven to vibrate together, so as to shake out the bubbles in the colloid. The air from the outside can enter the shell 26 through the air inlet hole 27. Therefore, the wind speed near the air inlet hole 27 is relatively large, which can ensure the curing efficiency of the colloid on the component.

[0026] Furthermore, the transmission belt 32 passes through the movable plate 22, and the bottom end of the transmission belt 32 is sleeved on the outside of the second pulley 34, and the transmission gear 35 is engaged with the rack plate 36. When the movable plate 22 moves, it can drive the transmission gear 35 to move relative to the rack plate 36. The transmission gear 35 can rotate and drive the first pulley 31 to rotate through the transmission belt 32, thereby providing power for the rotation of the turbofan 210.

[0027] Working principle: When packaging, the component is placed inside the rotating frame 42, and the electric push rod 43 is started. The two sets of electric push rods 43 cooperate with each other to clamp and fix the component. The handle 23 is pushed, and the movable plate 22 can slide on the guide rail 21. The movable plate 22 moves backward to the lower side of the packaging mechanism 11, which facilitates the packaging process of the component through the packaging mechanism 11; After the packaging is completed, the handle 23 is pulled, and the movable plate 22 can move forward on the guide rail 21, and when the movable plate 22 moves, it will drive the transmission gear 35 to move relative to the rack plate 36, and the transmission gear 35 is meshed with the rack plate 36. When the movable plate 22 moves, it will drive the transmission gear 35 to rotate, and the transmission gear 35 will drive the second pulley 34 to rotate, and drive the first pulley 31 and the bevel gear 33 to rotate through the transmission belt 32, and the bevel gear 33 is meshed with the bevel gear ring 213, so the rotation of the bevel gear 33 drives the turbine fan 210 to rotate inside the shell 26 through the bevel gear ring 213, and the turbine fan 210 rotates clockwise. When the turbine fan 210 rotates, it can pump outside air from the upper side to the inside of the shell 26, and air can also enter the inside of the shell 26 from the air inlet 25, so that the components inside the shell 26 are affected by the upper and lower parts. The air blowing from the side can accelerate the solidification of the colloid on the surface of the component, and then the air enters the interior of the shell 26 through the air inlet 27 and is finally discharged through the air outlet 29. When the turbine fan 210 rotates, it drives the spring 211 to drive the card ball 212 to rotate in a circle. The card ball 212 is stuck in the card slot 28. When the turbine fan 210 rotates, it drives the spring 211 to bend, so that the card ball 212 can be pulled out of the card slot 28 and fit the inner wall of the shell 26. When the card ball 212 is realigned with the card slot 28, the card ball 212 hits the inner wall of the card slot 28 under the elastic action of the spring 211, causing the inner side of the shell 26 to vibrate. The vibration effect is transmitted to the component through the positioning structure 4, which can cause the component to vibrate in the horizontal direction. The colloid is compacted downward under the action of the vibration, and the bubbles inside can be squeezed out, which can ensure the packaging effect of the component. After pulling out, the packaging result of the top surface of the component can be tested, and then the motor 41 is controlled to start, and the motor 41 drives the rotating frame 42 to rotate, so that the component can be turned over to facilitate the packaging of the bottom surface of the component. The operation is convenient and the functionality is strong.

[0028] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any ordinary technician in this industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with this profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the scope of protection of the technical solution of the present invention.

Claims

1. A packaging device for manufacturing electronic components, comprising: A processing table (1), wherein a packaging mechanism (11) is installed on the right side of the top surface of the processing table (1), and a loading mechanism (12) is installed on the left side of the top surface of the processing table (1); Its characteristics are: A movable structure (2) is installed on the top surface of the processing table (1), and the movable structure (2) includes a guide rail (21), the guide rail (21) is fixedly installed on the top surface of the processing table (1), a movable plate (22) is slidably installed on the outer side of the top surface of the guide rail (21), a handle (23) is fixedly connected to the front of the movable plate (22), a fixed cylinder (24) is installed in the middle of the top surface of the guide rail (21), an air inlet (25) is opened on the surface of the fixed cylinder (24), and a shell (26) is installed on the top surface of the fixed cylinder (24). An air inlet (27) is provided on the inner wall of the housing (26), a slot (28) is provided on the inner inner wall of the housing (26), an air outlet (29) is fixedly connected to the rear wall of the housing (26), a turbine fan (210) is movably mounted on the inner side of the housing (26) via a bearing, a spring (211) is fixedly connected to the inner wall of the turbine fan (210), a ball (212) is fixedly connected to the end of the spring (211), and a bevel gear ring (213) is fixedly mounted on the bottom surface of the turbine fan (210); A positioning structure (4) is installed on the inner side of the moving structure (2), and the positioning structure (4) includes a motor (41). The motor (41) is fixedly installed on the inner wall of the housing (26). The output end of the motor (41) is fixedly connected to a rotating frame (42), and an electric push rod (43) is fixedly installed on the inner side of the rotating frame (42).

2. The packaging equipment for electronic component manufacturing according to claim 1, characterized in that: A driving structure (3) is installed inside the movable structure (2), and the driving structure (3) includes a first pulley (31), which is movably installed inside the fixed cylinder (24) through a bearing, and a transmission belt (32) is sleeved on the outer side of the first pulley (31), and the end of the first pulley (31) is fixedly connected to a bevel gear (33), and a second pulley (34) is movably installed on the bottom surface of the movable plate (22) through a bearing, and the end of the second pulley (34) is fixedly connected to a transmission gear (35), and a rack plate (36) is fixedly installed on the top surface of the processing table (1).

3. The packaging equipment for electronic component manufacturing according to claim 1, characterized in that: The packaging mechanism (11) is located on the rear side of the moving plate (22).

4. The packaging equipment for electronic component manufacturing according to claim 1, characterized in that: The air inlet (25) passes through the fixed cylinder (24), and the interior of the outer shell (26) and the air outlet (29) are in communication.

5. The packaging equipment for electronic component manufacturing according to claim 1, characterized in that: The clamping groove (28) is distributed in an annular shape on the inner surface of the housing (26), the clamping ball (212) is clamped inside the clamping groove (28), and the bevel gear ring (213) is meshed with the bevel gear (33).

6. The packaging equipment for electronic component manufacturing according to claim 1, characterized in that: The positioning structure (4) is located on the inner side of the outer shell (26), and the rotating frame (42) is flush with the air inlet hole (27).

7. The packaging equipment for electronic component manufacturing according to claim 2, characterized in that: The transmission belt (32) passes through the movable plate (22), and the bottom end of the transmission belt (32) is sleeved on the outside of the second pulley (34), and the transmission gear (35) is engaged with the rack plate (36).

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