Display panel and preparation method thereof

Abstract

The invention provides a display panel and a preparation method thereof. The display panel comprises a planarization layer; the anode layer is located on one side of the planarization layer and comprises a plurality of sub-pixel anodes; the barrier layer is located on one side, which is the same as the anode layer, of the planarization layer, the barrier layer surrounds each sub-pixel anode in the direction parallel to the display panel, and a gap is formed between the barrier layer and each sub-pixel anode; the pixel definition layer is located on the side, away from the planarization layer, of the barrier layer, and the hardness of the material of the barrier layer is larger than that of the planarization layer and that of the pixel definition layer. According to the display panel and the preparation method thereof, the hard barrier layer is arranged above the planarization layer, so that the thin film transistor is prevented from being crushed by foreign matters downwards, and the yield of the display panel is improved.

Description

Technical Field

[0001] The present invention relates to the field of display panel structures, and in particular to a display panel and a method for preparing the same. Background Art

[0002] As a new generation of display technology, OLED (Organic Light Emitting Diode) displays have the advantages of low power consumption, high color gamut, high brightness, high refresh rate, wide viewing angle, and high response speed. In particular, the high refresh rate makes OLED displays more suitable for display in mobile devices, and therefore they are increasingly widely used.

[0003] Currently, during the preparation of display panels, when the cover plate is pressed together, some foreign matter is usually pressed into the interior of the display panel. Since the pixel definition layer and the planarization layer are usually made of organic materials with a soft texture, the foreign matter will damage the thin-film transistors underneath, affecting the product yield.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0005] In view of this, the present invention provides a display panel and a method for manufacturing the same, wherein a hard barrier layer is provided above a planarization layer to prevent foreign matter from damaging the thin film transistors, thereby improving the yield of the display panel.

[0006] One aspect of the present invention provides a display panel, comprising:

[0007] planarization layer;

[0008] an anode layer, located on one side of the planarization layer, the anode layer including a plurality of sub-pixel anodes;

[0009] a barrier layer, located on the same side of the planarization layer as the anode layer, the barrier layer surrounding each of the sub-pixel anodes in a direction parallel to the display panel, and forming a gap between the barrier layer and each of the sub-pixel anodes; and

[0010] The pixel definition layer is located on a side of the barrier layer away from the planarization layer, wherein the hardness of the barrier layer material is greater than that of the planarization layer and the pixel definition layer.

[0011] In some embodiments, during the manufacturing process of the display panel, the gap is etched out of a film layer to form the anode layer and the barrier layer.

[0012] In some embodiments, the barrier layer and the anode layer are made of the same material, namely silver.

[0013] In some embodiments, the display panel further comprises:

[0014] A plurality of light-emitting sub-pixels are located on a side of the anode layer away from the planarization layer, and the silver barrier layer reflects light emitted by the light-emitting sub-pixels.

[0015] In some embodiments, the display panel further comprises:

[0016] a plurality of support columns located on a side of the pixel definition layer facing away from the barrier layer, wherein the projections of the support columns on the plane where the display panel is located are included in the projection of the barrier layer on the plane where the display panel is located;

[0017] The cover plate is located on a side of the support column away from the pixel definition layer.

[0018] In some embodiments, the width of the gap ranges from 1 to 10 micrometers; during the preparation of the display panel, the material of the pixel definition layer fills the gap.

[0019] In some embodiments, the barrier layer is not electrically connected to any other components of the display panel.

[0020] In some embodiments, the display panel further comprises:

[0021] A data transmission layer, located on a side of the planarization layer away from the anode layer;

[0022] The planarization layer includes a plurality of through holes, each of the through holes corresponds to a sub-pixel anode, and the sub-pixel anode is electrically connected to the data transmission layer through the through hole.

[0023] Another aspect of the present invention further provides a method for preparing a display panel, which is used to prepare the above-mentioned display panel, comprising the following steps:

[0024] preparing the planarization layer;

[0025] The anode layer is prepared on one side of the planarization layer, wherein the anode layer includes a plurality of sub-pixel anodes;

[0026] forming the barrier layer on one side of the planarization layer, wherein the barrier layer surrounds each of the sub-pixel anodes in a direction parallel to the display panel and forms a gap between the barrier layer and each of the sub-pixel anodes; and

[0027] The pixel definition layer is prepared on a side of the barrier layer facing away from the planarization layer, wherein the hardness of the barrier layer material is greater than that of the planarization layer and the pixel definition layer.

[0028] In some embodiments, the step of preparing the anode layer on one side of the planarization layer and the step of preparing the barrier layer on one side of the planarization layer comprises:

[0029] preparing a film layer on one side of the planarization layer;

[0030] The gap is etched from the membrane layer to form the anode layer and the barrier layer.

[0031] Compared with the prior art, the present invention has at least the following advantages:

[0032] The display panel and its preparation method of the present invention: (1) a hard barrier layer is provided above the planarization layer to prevent foreign matter from pressing down on the thin film transistor, thereby improving the yield of the display panel; (2) a gap is formed by etching the same film layer to directly prepare the anode layer and the barrier layer, thereby reducing the difficulty of preparing the display panel; (3) by using a silver material, the barrier layer can reflect the light emitted by the luminescent sub-pixel, thereby improving the light output rate of the display panel.

[0033] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings are incorporated into and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0035] Figure 1 A schematic diagram showing a display panel provided by the present invention;

[0036] Figure 2 A schematic structural diagram of an anode layer and a barrier layer of a display panel provided by the present invention is shown;

[0037] Figure 3 Show Figure 2 Schematic diagram of the AA' section of the display panel;

[0038] Figure 4 A flow chart showing a method for manufacturing a display panel provided by the present invention is shown.

[0039] Reference numerals:

[0040] 1 Planarization layer

[0041] 2 Anode layer

[0042] 21 Sub-pixel anode

[0043] 3 Barrier layer

[0044] 31 Gap

[0045] 4 pixel definition layers

[0046] 5 luminescent sub-pixels

[0047] 6 Support columns

[0048] 7 Cover

[0049] 8 Data Transmission Layer

[0050] 9 Display Panel DETAILED DESCRIPTION

[0051] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures represent identical or similar structures, and thus a repeated description thereof will be omitted.

[0052] The terms "first," "second," and similar terms used in the specific description do not denote any order, quantity, or importance, but are simply used to distinguish different components. Furthermore, in the description of the present invention, the terms "upper," "lower," and the like indicate orientations or positional relationships based on those shown in the accompanying drawings. These are intended solely for ease of description and do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0053] It should be noted that, in the absence of conflict, the embodiments of the present invention and features in different embodiments may be combined with each other.

[0054] The inventors of this case have conducted careful and in-depth research and have provided a solution to the problems existing in the prior art. The present invention provides a display panel and a method for manufacturing the same, wherein the display panel includes: a planarization layer; an anode layer, located on one side of the planarization layer, the anode layer including a plurality of sub-pixel anodes; a barrier layer, located on the same side of the planarization layer as the anode layer, the barrier layer surrounds each sub-pixel anode in a direction parallel to the display panel, and forms a gap between the barrier layer and each sub-pixel anode; and a pixel definition layer, located on the side of the barrier layer away from the planarization layer, wherein the hardness of the barrier layer material is greater than that of the planarization layer and the pixel definition layer. The display panel and the method for manufacturing the same of the present invention prevent foreign matter from damaging the thin film transistor by disposing a hard barrier layer above the planarization layer, thereby improving the yield of the display panel.

[0055] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings.

[0056] Figure 1 A schematic diagram showing a display panel provided by the present invention; Figure 2 A schematic structural diagram of an anode layer and a barrier layer of a display panel provided by the present invention is shown; Figure 3 Show Figure 2 Schematic diagram of the AA' section of the display panel.

[0057] like Figures 1 to 3 As shown, one aspect of this embodiment of the present invention provides a display panel 9, comprising:

[0058] planarization layer 1;

[0059] an anode layer 2 located on one side of the planarization layer 1, the anode layer 2 including a plurality of sub-pixel anodes 21;

[0060] a barrier layer 3 located on the same side of the planarization layer 1 as the anode layer 2 , the barrier layer 3 surrounding each sub-pixel anode 21 in a direction parallel to the display panel 9 , and forming a gap 31 between the barrier layer 3 and each sub-pixel anode 21 ; and

[0061] The pixel definition layer 4 is located on the side of the barrier layer 3 facing away from the planarization layer 1 , wherein the hardness of the barrier layer 3 material is greater than that of the planarization layer 1 and the pixel definition layer 4 .

[0062] The planarization layer 1 and pixel definition layer 4 are usually made of organic materials, which are soft and can cause foreign matter to damage the thin film transistors underneath. The hard barrier layer 3 can prevent foreign matter from damaging the thin film transistors, thereby improving the yield of the display panel.

[0063] In some embodiments, during the fabrication of the display panel 9, a gap 31 is etched from a film layer to form the anode layer 2 and the barrier layer 3, but the present invention is not limited thereto. By etching the same film layer to form the gap 31, the anode layer 2 and the barrier layer 3 can be directly fabricated, thereby reducing the difficulty of fabricating the display panel 9.

[0064] In some embodiments, the barrier layer 3 and the anode layer 2 are made of the same material, silver, but this is not limiting. In other embodiments, the barrier layer 3 may be made of a different material than the anode layer 2, as long as the hardness requirement is met to prevent foreign matter from damaging the thin film transistors and improve the yield of the display panel 9.

[0065] In some embodiments, the display panel 9 further includes: a plurality of light-emitting sub-pixels 5 located on the side of the anode layer 2 facing away from the planarization layer 1; and a silver barrier layer 3 that reflects light emitted by the light-emitting sub-pixels 5, but the present invention is not limited thereto. When the display panel 9 is displaying, the light emitted by the light-emitting sub-pixels 5 may leak into the pixel definition layer 4 or be reflected back by the upper structure. By using a silver material, the barrier layer 3 can reflect the light emitted by the light-emitting sub-pixels 5, thereby improving the light extraction efficiency of the display panel 9.

[0066] In some embodiments, the display panel 9 further includes: a plurality of support columns 6, located on the side of the pixel definition layer 4 facing away from the barrier layer 3, wherein the projection of the support columns 6 on the plane where the display panel 9 is located is included in the projection of the barrier layer 3 on the plane where the display panel 9 is located; and a cover plate 7, located on the side of the support columns 6 facing away from the pixel definition layer 4, but not limited thereto. During the preparation of the display panel 9, the cover plate 7 is placed on the support columns 6 and pressed downward. Since the planarization layer 1 and the pixel definition layer 4 are generally made of organic materials with a soft texture, foreign matter may damage the thin film transistors below. Adding a hard barrier layer 3 and pressing the support columns 6 on the barrier layer 3 can prevent the support columns 6 from damaging the thin film transistors downward, thereby improving the yield of the display panel.

[0067] In some embodiments, the width of gap 31 ranges from 1 to 10 microns. During the fabrication of display panel 9, the material of pixel definition layer 4 fills gap 31, but this is not limiting. The aforementioned width range of gap 31 ensures that there is no electrical connection between anode layer 2 and barrier layer 3, thereby preventing circuit malfunctions in display panel 9. Filling gap 31 with the material of pixel definition layer 4 can simplify the fabrication process of display panel 9.

[0068] In some embodiments, the barrier layer 3 is not electrically connected to any other components of the display panel 9 , thereby preventing circuit failure of the display panel 9 , but the present invention is not limited thereto.

[0069] In some embodiments, the display panel 9 further includes:

[0070] The data transmission layer 8 is located on the side of the planarization layer 1 facing away from the anode layer 2;

[0071] The planarization layer 1 includes a plurality of through holes, each of which corresponds to a sub-pixel anode 21 . The sub-pixel anode 21 is electrically connected to the data transmission layer 8 through the through hole, but the present invention is not limited thereto.

[0072] The data transmission layer 8 is used to provide light emitting data signals to the sub-pixel anode 21. The planarization layer 1 is used to planarize the underlying data transmission layer 8 and thin film transistor layer, etc., to facilitate the preparation of the anode layer 2.

[0073] The display panel 9 of the present invention (1) provides a hard barrier layer 3 above the planarization layer 1 to prevent foreign matter from pressing down on the thin film transistor, thereby improving the yield of the display panel 9; (2) forms a gap 31 by etching the same film layer to directly prepare the anode layer 2 and the barrier layer 3, thereby reducing the difficulty of preparing the display panel 9; (3) uses a silver material so that the barrier layer 3 can reflect the light emitted by the light-emitting sub-pixel 5, thereby improving the light output rate of the display panel 9.

[0074] Figure 4 A flow chart showing a method for manufacturing a display panel provided by the present invention is shown.

[0075] refer to Figure 4 Based on the same inventive concept, another aspect of this embodiment of the present invention further provides a method for manufacturing a display panel, which is used to manufacture the above-mentioned display panel, comprising the following steps:

[0076] preparing a planarization layer 1;

[0077] An anode layer 2 is formed on one side of the planarization layer 1, and the anode layer 2 includes a plurality of sub-pixel anodes 21;

[0078] A barrier layer 3 is formed on one side of the planarization layer 1 , the barrier layer 3 surrounds each sub-pixel anode 21 in a direction parallel to the display panel 9 , and a gap 31 is formed between the barrier layer 3 and each sub-pixel anode 21 ; and

[0079] A pixel definition layer 4 is prepared on the side of the barrier layer 3 facing away from the planarization layer 1 , wherein the hardness of the barrier layer 3 material is greater than that of the planarization layer 1 and the pixel definition layer 4 .

[0080] The planarization layer 1 and pixel definition layer 4 are usually made of organic materials, which are soft and can cause foreign matter to damage the thin film transistors underneath. The hard barrier layer 3 can prevent foreign matter from damaging the thin film transistors, thereby improving the yield of the display panel.

[0081] It is worth noting that S110 to S140 are merely step numbers, intended to facilitate subsequent reference and avoid duplication, and are not intended to limit the order in which the steps of this method are to be performed. In other embodiments, the above steps of this method may be written in an alternate order, and the method is not limited thereto. Subsequent step numbers in the present invention all have the same meaning, and any duplication will not be repeated.

[0082] In some embodiments, "forming an anode layer 2 on one side of the planarization layer 1 and forming a barrier layer 3 on one side of the planarization layer 1" may include, but is not limited to, forming a film layer on one side of the planarization layer 1; and etching a gap 31 in the film layer to form the anode layer 2 and the barrier layer 3. By etching the same film layer to form the gap 31, the anode layer 2 and the barrier layer 3 can be directly formed, thereby reducing the difficulty of manufacturing the display panel 9. The film layer may be made of silver, but is not limited to silver.

[0083] For other aspects of this embodiment, reference can be made to the embodiment of the display panel 9 described above, and the same technical effects can be achieved. The repeated parts will not be described in detail.

[0084] In summary, the display panel and its preparation method of the present invention: (1) a hard barrier layer is provided above the planarization layer to prevent foreign matter from pressing down on the thin film transistor, thereby improving the yield of the display panel; (2) a gap is formed by etching the same film layer to directly prepare the anode layer and the barrier layer, thereby reducing the difficulty of preparing the display panel; (3) by using silver material, the barrier layer can reflect the light emitted by the light-emitting sub-pixel, thereby improving the light output rate of the display panel.

[0085] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: include: planarization layer (1); an anode layer (2), located on one side of the planarization layer (1), the anode layer (2) comprising a plurality of sub-pixel anodes (21); a barrier layer (3) located on the same side of the planarization layer (1) as the anode layer (2), the barrier layer (3) surrounding each of the sub-pixel anodes (21) in a direction parallel to the display panel (9), and forming a gap (31) between the barrier layer (3) and each of the sub-pixel anodes (21); and A pixel definition layer (4) is located on a side of the barrier layer (3) facing away from the planarization layer (1), wherein the hardness of the barrier layer (3) material is greater than that of the planarization layer (1) and the pixel definition layer (4).

2. The display panel according to claim 1, wherein: During the preparation of the display panel (9), the gap (31) is etched from a film layer to form the anode layer (2) and the barrier layer (3).

3. The display panel according to claim 1, wherein: The barrier layer (3) and the anode layer (2) are made of the same material, which is silver.

4. The display panel according to claim 3, wherein: Also includes: A plurality of light-emitting sub-pixels (5) are located on a side of the anode layer (2) away from the planarization layer (1), and the silver barrier layer (3) reflects light emitted by the light-emitting sub-pixels (5).

5. The display panel according to claim 1, wherein: Also includes: a plurality of support columns (6) located on a side of the pixel definition layer (4) facing away from the barrier layer (3), wherein the projections of the support columns (6) on the plane where the display panel (9) is located are included in the projection of the barrier layer (3) on the plane where the display panel (9) is located; A cover plate (7) is located on a side of the support column (6) facing away from the pixel definition layer (4).

6. The display panel according to claim 1, wherein: The width of the gap (31) ranges from 1 to 10 micrometers; and during the preparation of the display panel (9), the material of the pixel definition layer (4) fills the gap (31).

7. The display panel according to claim 1, wherein: The barrier layer (3) is not electrically connected to any other components of the display panel (9).

8. The display panel according to claim 1, wherein: Also includes: a data transmission layer (8), located on a side of the planarization layer (1) facing away from the anode layer (2); The planarization layer (1) comprises a plurality of through holes, each of the through holes corresponds to a sub-pixel anode (21), and the sub-pixel anode (21) is electrically connected to the data transmission layer (8) through the through hole.

9. A method for preparing a display panel, for preparing the display panel according to any one of claims 1 to 8, characterized in that: The following steps are involved: preparing the planarization layer (1); The anode layer (2) is prepared on one side of the planarization layer (1), and the anode layer (2) includes a plurality of sub-pixel anodes (21); The barrier layer (3) is formed on one side of the planarization layer (1), and the barrier layer (3) surrounds each of the sub-pixel anodes (21) in a direction parallel to the display panel (9), and a gap (31) is formed between the barrier layer (3) and each of the sub-pixel anodes (21); and The pixel definition layer (4) is prepared on the side of the barrier layer (3) facing away from the planarization layer (1), wherein the hardness of the barrier layer (3) material is greater than that of the planarization layer (1) and the pixel definition layer (4).

10. The method for manufacturing a display panel according to claim 9, wherein: The step of preparing the anode layer (2) on one side of the planarization layer (1), and the step of preparing the barrier layer (3) on one side of the planarization layer (1), comprises: preparing a film layer on one side of the planarization layer (1); The gap (31) is etched into the film layer to form the anode layer (2) and the barrier layer (3).

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