Electronic component

Abstract

An electronic component (100) is provided with: a base section (10) having a housing section (16) for housing an electronic component; and a terminal (30). A part of the terminal (30) is embedded in the base part (10), and one end of the terminal (30) protrudes from the base part (10) toward the outside of the base part (10). The base part (10) is provided with a covering part (11). The covering part (11) extends from the outer surface of the base part (10) and covers at least a part of the periphery of the base end of the one end part of the terminal (30).

Description

Technical Field

[0001] The present invention relates to electronic components. Background Art

[0002] There is an electronic component that includes a base portion for accommodating an electronic element such as a coil, wherein a portion of a terminal is embedded in the base portion and another portion of the terminal protrudes from the base portion.

[0003] Regarding this technology, the following Patent Document 1 describes a vehicle glass module (1) in which a terminal (glass-side conductor (7) of Patent Document 1) extends from the side surface of the end portion in the longitudinal direction of a base portion (main body (10) of Patent Document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2020-047473 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] When external force is applied to an electronic component mounted on a substrate, stress is concentrated on a portion of the base portion surrounding the base end of the protruding terminal. For example, stress may be concentrated on the corner of the opening end of the recessed portion of the base portion formed to embed the terminal.

[0009] This stress concentration may cause problems such as damage to the base portion or deformation of the terminal.

[0010] The present invention has been made in view of the above-mentioned problems, and provides an electronic component capable of preventing a base portion from being damaged or suppressing deformation of a terminal when an external force is applied to the electronic component.

[0011] Means for solving problems

[0012] The electronic component of the present invention comprises: a base portion having a storage portion for storing electronic elements; and a terminal, a portion of which is embedded in the base portion, and one end of the terminal protrudes from the base portion toward the outside of the base portion, characterized in that the base portion has a covering portion that extends from the outer surface of the base portion and covers at least a portion of the periphery of the base end of the one end portion.

[0013] Because the base end of one end of the protruding terminal is covered by the covering portion extending from the base portion, the stress on the base portion when external force is applied to the electronic component is dispersed over the area from the base end to the front end of the covering portion. This prevents the base portion from being damaged or the terminal from being deformed when external force is applied to the electronic component.

[0014] Effects of the Invention

[0015] According to the electronic component of the present invention, it is possible to prevent the base portion from being damaged or suppress deformation of the terminal when an external force is applied to the electronic component.

[0016] The above-mentioned objects and other objects, features and advantages will become more apparent from the preferred embodiments described below and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a perspective view showing an example of the electronic component according to the first embodiment of the present invention. The outer shape of the storage portion is shown by the dotted line.

[0018] Figure 2 1 is a perspective view of the electronic component according to the first embodiment. The case and base are omitted from the illustration, and the base is shown with only the outline indicated by a dotted line.

[0019] Figure 3 This is a side view of the electronic component according to Embodiment 1. The outer shape of the terminal embedded in the base portion, the shape of the plug connection portion, the shape of the pins, and the outer shape of the storage portion are shown by dotted lines.

[0020] Figure 4 It is a front view of the electronic component according to the first embodiment.

[0021] Figure 5 This is a rear view of the electronic component according to the first embodiment.

[0022] Figure 6 It is a plan view of the electronic component according to the first embodiment.

[0023] Figure 7 It is a bottom view of the electronic component according to the first embodiment.

[0024] Figure 8 (a) is Figure 4 An enlarged view of the covering portion and its vicinity in FIG. The mounting portion and rising portion, which are part of the terminal, are omitted from the illustration. Figure 8 (b) is Figure 3 An enlarged view of the terminal and its vicinity.

[0025] Figure 9 (a) is a side view showing an example of an electronic component according to a second embodiment of the present invention. Figure 9 (b) is a front view of the electronic component, wherein the mounting portion and the rising portion, which are part of the terminal, are omitted.

[0026] Figure 10 (a) is a side view showing another example of the electronic component according to the second embodiment of the present invention. Figure 10(b) is a front view of the electronic component, wherein the mounting portion and the rising portion, which are part of the terminal, are omitted.

[0027] Figure 11 (a) is a diagram illustrating the results of calculation of stress applied to a control electronic component. Figure 11 (b) is a diagram illustrating the results of calculating the stress applied to the electronic components. Figure 11 (a) and Figure 11 The terminal illustration is omitted in (b). DETAILED DESCRIPTION

[0028] The various components of the electronic component of the present invention do not need to exist independently. It is allowed that multiple components are formed into one component, one component is formed by multiple components, one component is part of other components, and part of one component overlaps with part of other components.

[0029] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, corresponding components are denoted by common reference numerals, and duplicate descriptions are omitted as appropriate.

[0030] In addition, in this embodiment, the directions of front, back, left, right, up and down are specified as shown in the figure for description. However, this is specified for the purpose of simply explaining the relative relationship of the components, and does not limit the directions during manufacture and use of the product of the present invention. Here, the up and down direction refers to an exemplary direction of the direction of gravity when the electronic component is mounted on a substrate, and does not necessarily refer to the direction of gravity when the electronic component is mounted on a vehicle, etc. That is, the direction of gravity of the electronic component when it is mounted on a vehicle, etc. is not limited to the up and down direction, and may have a left and right component or a front and back component. Furthermore, the electronic component may also be mounted with a direction other than the up and down direction as the direction of gravity.

[0031] The front-to-back direction coincides with the long side direction of the base, the left-to-right direction coincides with the short side direction or width direction of the base, and the up-down direction coincides with the height direction of the base. Furthermore, the direction from the outer edge of the base toward the center is referred to as an inward direction, inner side, or inner direction, and the direction from the center of the base toward the outer edge is referred to as an outward direction, outer side, or outer direction.

[0032] Furthermore, the plane referred to in the present invention refers to a shape formed in a physical sense with the plane as a target, and need not necessarily be a geometrically perfect plane.

[0033] <First embodiment>

[0034] (Electronic components)

[0035] Figure 1It is a perspective view showing an example of the electronic component 100 according to the first embodiment of the present invention.

[0036] First, the outline of the electronic component 100 according to this embodiment will be described.

[0037] The electronic component 100 includes a base portion 10 and a terminal 30. The base portion 10 includes a housing portion 16 for housing an electronic component. A portion of the terminal 30 (an embedded portion 38 described later) is embedded in the base portion 10, and one end portion of the terminal 30 (an exposed end portion 30c described later (see FIG. 1 )) is embedded in the base portion 10. Figure 2 )) protrudes from the base portion 10 toward the outside of the base portion 10. The base portion 10 has a covering portion 11 that extends from the outer surface of the base portion 10 and covers at least a portion around the base end of one end portion (exposed end portion 30c).

[0038] When the base end of one end of the protruding terminal 30 is covered by the covering portion 11 extending from the base portion 10, the stress applied to the base portion 10 when an external force is applied to the electronic component 100 is dispersed over the range from the base end to the front end of the covering portion 11. In particular, this stress is dispersed across the front end and base end of the covering portion 11 (the boundary between the covering portion 11 and the main body portion 12 of the base portion 10, described later). This prevents damage to the base portion 10 and suppresses deformation of the terminal 30 even when an external force is applied to the electronic component 100.

[0039] Next, the electronic component 100 of this embodiment will be described in detail.

[0040] The electronic component 100 is a component that constitutes a part of an electronic circuit. In this embodiment, electronic elements are contained in the storage section 16 described later, but it is not limited to this. The electronic component 100 may also be provided as an electronic element storage housing without containing electronic elements in the storage section 16. For example, electronic elements are elements that constitute an electronic circuit. Electronic elements may also include coils. The electronic component 100 containing electronic elements can function as a coil component of an inductor, transformer, antenna, etc. The electronic component 100 of this embodiment is an electronic component 100 for vehicle installation. As examples of places where the electronic component 100 is installed, there can be cited the vehicle body such as a wall, window glass, ceiling, floor, or under-floor portion of the vehicle, or a portion of the console box or trunk, or the interior of equipment arranged in these places. The electronic component 100 can be installed at a desired position of the vehicle in any direction.

[0041] The base portion 10 is a pedestal portion that embeds and holds the terminal 30, described later. The base portion 10 is formed from an insulating material such as a resin. Polyphenylene sulfide (PPS) is exemplified as the resin. The base portion 10 is formed by injection molding. More specifically, the base portion 10 is formed by allowing a liquid insulating material to flow into a mold having a bent terminal 30 disposed therein and solidifying the mold. The following describes a case where the base portion 10 is formed using a resin as the insulating material.

[0042] In the present embodiment, the shape of the base portion 10 is a roughly rectangular parallelepiped that is long in the front-to-back direction. The shape of the base portion 10 is not limited thereto, and may be any shape such as a polygonal prism or a cylinder. The base portion 10 is formed by a side surface 10a facing the side of the base portion 10 (from the center of the base portion 10 toward any direction in the front-to-back direction or the left-to-right direction), an upper surface 10b facing upward (the upper surface of the shell portion 13 described later), and a bottom surface 10c facing downward (the bottom surface of the bottom portion 17 described later). The side surface 10a of the base portion 10 refers to a surface formed by connecting the side surface of the shell portion 13 described later and the side surface of the bottom portion 17. The outer surface of the base portion 10 refers to the outer surface of the main body portion 12 described later, including the side surface 10a, the upper surface 10b, and the bottom surface 10c of the base portion 10. The surface of the covering portion 11 described later is not included in the outer surface of the base portion 10. The outer surface of the main body portion 12 is also imaginarily arranged at the base end of the covering portion 11 described later. That is, the boundary surface between the covering portion 11 and the main body portion 12 is included in the outer surface of the main body portion 12 .

[0043] In this embodiment, the base 10 includes an upper housing 13 and a lower bottom 17. The housing 13 and the bottom 17 are bonded together using an adhesive such as epoxy resin. The base 10 may be composed of two or more components, or may be integrally formed from a single component, as in this embodiment.

[0044] The base portion 10 (housing portion 13) includes a storage portion 16. The storage portion 16 is a portion for storing electronic components (not shown), and may be a hollow space or a solid portion made of insulating material. Figure 3As shown, a portion of the pin 15 described later and a portion of the terminal 30 (the first terminal 30a and the second terminal 30b) are inserted into the interior of the storage portion 16 and connected to the electronic component inside the storage portion 16. That is, the pin 15 described later and the terminal 30 are electrically connected via the electronic component inside the storage portion 16. In this embodiment, the storage portion 16 is arranged behind the base portion 10, and the interior of the storage portion 16 and the exterior of the storage portion 16 are formed integrally. That is, in this embodiment, the electronic component is buried in the housing portion 13 described later that includes the storage portion 16. Alternatively, a space such as a recess for accommodating the electronic component may be provided inside the electronic component 100 as the storage portion 16, and the electronic component may be arranged in this space. Alternatively, the electronic component may be covered with a cover or the like, or the electronic component may be engaged or bonded to the base portion 10, thereby holding the electronic component in the electronic component 100 that serves as a housing for the electronic component.

[0045] The base portion 10 (housing portion 13) is provided with a plug connection portion 13a. The plug connection portion 13a is a portion for fixing a plug (not shown) connected to an external circuit to the electronic component 100. In this embodiment, the plug connection portion 13a is formed as a bottomed recessed portion (also referred to as a plug insertion hole 13a) that is open at the front and extends in the front-to-back direction. Figure 3 and Figure 4 As shown, a plug-engaging protrusion 13b is provided on the peripheral wall defining the plug insertion hole 13a. The outer surface of the plug-engaging protrusion 13b includes an insertion surface 13b1 facing forward (toward the opening of the plug insertion hole 13a) and an engaging surface 13b2 facing rearward (toward the bottom of the plug insertion hole 13a). Engaging surface 13b2 faces the inner side of the through-hole 14, which will be described later. Furthermore, engaging surface 13b2 is smoothly connected to a portion of the peripheral wall defining the through-hole 14 without any steps.

[0046] like Figure 3 As shown in FIG. 1 , in this embodiment, the plug engagement protrusion 13 b extends in the front-rear direction, but is divided into a front portion and a rear portion by the through hole 14. Figure 4 As shown, in this embodiment, the plug engagement projection 13b is formed at the center in the left-right direction on the upper side of the peripheral wall of the plug insertion hole 13a.

[0047] In this embodiment, the plug is inserted and fixed to Figure 3The plug connection portion 13a is shown. More specifically, the plug is inserted into the plug insertion hole 13a along a plug engagement protrusion 13b, which has a shape corresponding to the plug's outer shape. When the plug is inserted to a predetermined depth into the plug insertion hole 13a, a protrusion provided on the outer periphery of the plug engages with the plug engagement protrusion 13b. When the plug is inserted, the outer surface of the protrusion provided on the plug and the engagement surface 13b2 of the plug engagement protrusion 13b face each other and come into pressure contact or abutment, preventing the plug from falling out of the plug insertion hole 13a.

[0048] In this embodiment, the inclination of the insertion surface 13b1 relative to the horizontal plane (a plane parallel to the front-back direction and the left-right direction) is smaller than the inclination of the engagement surface 13b2. This makes it easier to insert the plug into the plug insertion hole 13a and prevents the plug from falling out of the plug insertion hole 13a.

[0049] In this embodiment, a through hole 14 is provided on the peripheral wall defining the plug insertion hole 13a, and the interior of the plug insertion hole 13a communicates with the exterior of the plug insertion hole 13a via the through hole 14. The engagement of the plug with the plug engagement protrusion 13b can be visually confirmed through the through hole 14.

[0050] The plug fixed to the plug connection portion 13a is electrically connected to pins 15 protruding from the bottom of the plug insertion hole 13a toward the inside of the plug insertion hole 13a. The pins 15 are formed of a conductive material, and the plug and the electronic component are electrically connected via the pins 15.

[0051] Terminal 30 is a component formed of a conductive material. Examples of the conductive material include metals such as copper. Electronic component 100 is mounted on a substrate (not shown) by bonding it to the terminal 30. The substrate may be a circuit substrate mounted on glass such as a vehicle window pane, or may be a circuit substrate mounted inside a component or device.

[0052] The terminal 30 of this embodiment is formed by bending a plate-like component having a rectangular cross-section, as described later, but is not limited thereto. For example, the cross-section of the terminal 30 may also be circular or elliptical. In this embodiment, the electronic component 100 includes a pair of first terminals 30a and second terminals 30b separated in the front-to-back direction as the terminals 30. As described later, the shapes of the rising portions 36 of the first terminals 30a and the second terminals 30b are different. The base portion 10 may also include a plurality of terminals 30, three or more.

[0053] The terminal 30 includes an embedded portion 38 embedded in the base portion 10 (particularly the body portion 12 described later), a protruding portion 32 extending from the embedded portion 38 and protruding from the outer surface, a rising portion 36, and a mounting portion 34. The protruding portion 32, the rising portion 36, and the mounting portion 34 are sometimes collectively referred to as an exposed end portion 30c.

[0054] The embedded portion 38 is at least a portion of the portion of the terminal 30 that is embedded in the base portion 10 at the other end portion opposite to the end on which the mounting portion 34 is arranged, and is a portion that is arranged at a position closest to the mounting portion 34. In the present embodiment, the other end portion opposite to the mounting portion 34 (the embedded end portion 30d) is embedded in the base portion 10 over the entire range from the embedded portion 38 to the other end (the end opposite to the mounting portion 34). Alternatively, a portion of the embedded end portion 30d may be exposed from the base portion 10. The dimensions of the embedded portion 38 in the left-right direction and the up-down direction are equal to the dimensions of the protrusion 32 described later in the left-right direction or the up-down direction. In other words, the shape and dimensions of the cross section of the embedded portion 38 are the same as the shape and dimensions of the cross section of the protrusion 32.

[0055] The exposed end portion 30c has a protrusion 32. The protrusion 32 is a part of the exposed end portion 30c, located on the base end side (the other end side) of the exposed end portion 30c and extending along the protruding direction of the exposed end portion 30c. Here, the protruding direction of the exposed end portion 30c refers to the direction in which a part of the base end of the exposed end portion 30c protrudes from the inside of the base portion 10 to the outside of the base portion 10. That is, in the present embodiment, the protruding direction of the exposed end portion of the first terminal 30a is the forward direction, and the protruding direction of the exposed end portion 30c in the second terminal 30b is the backward direction. In the present embodiment, the protruding direction of the exposed end portion 30c is a direction parallel to the front-to-back direction, but is not limited to this. The protruding direction of the exposed end portion 30c may also be a direction that includes a front-to-back direction or a left-to-right direction component and is not parallel to the front-to-back direction or the left-to-right direction.

[0056] Here, the base end of the exposed end portion 30c refers to the side closer to the outer surface of the base portion 10, which is the root side of the protruding exposed end portion 30c. The leading end of the exposed end portion 30c refers to the end of the exposed end portion 30c opposite to the base end, which is the end farther from the base portion 10 along the outer surface of the exposed end portion 30c.

[0057] Furthermore, in this embodiment, the length of the protrusion 32 in the protruding direction of the protrusion 32 is shorter than the height of the protrusion 32. Here, the height of the protrusion 32 refers to the height of the lower surface of the protrusion 32 relative to the lower surface of the mounting portion 34. Furthermore, in the first terminal 30a, the length of the protrusion 32 is shorter than the length of the rising portion 36. Here, the length of the protrusion 32 or rising portion 36 refers to the length of the substantially linear portion of the protrusion 32 or rising portion 36. Specifically, the length of the protrusion 32 is the distance from the outer surface of the base portion 10 to the boundary surface between the protrusion 32 and the bent portion at the boundary between the protrusion 32 and the rising portion 36. The length of the rising portion 36 is the distance from the boundary surface between the rising portion 36 and the bent portion at the boundary between the protrusion 32 and the rising portion 36 to the boundary surface between the rising portion 36 and the bent portion at the boundary between the mounting portion 34 and the rising portion 36. By making the length of the protrusion 32 smaller than the height of the protrusion 32 , the proportion of the portion of the terminal 30 buried in the base portion 10 (buried end portion 30 d ) can be increased, and deformation of the terminal 30 can be suppressed.

[0058] Alternatively, the length of the protrusion 32 may be greater than the height of the protrusion 32. By ensuring a large length of the protrusion 32, the protrusion 32 deflects appropriately when an external force is applied to the electronic component 100, thereby suppressing deformation of the terminal 30 or the base 10.

[0059] Alternatively, the terminal 30 may protrude from the bottom surface of the base portion 10. In this case, the protruding direction of the terminal 30 may be downward. Here, downward refers to a direction having an up-down component, including a direction parallel to the up-down direction, but not limited to a direction parallel to the up-down direction.

[0060] The rising portion 36 is a portion formed integrally and continuously with the protrusion 32 and extends in a direction having a vertical component. In this embodiment, the rising portion 36 extends in a direction parallel to the vertical direction, but is not limited thereto. The rising portion 36 may be inclined relative to the vertical direction such that the upper end is located inwardly of the base portion 10 and the lower end is located outwardly of the base portion 10, or may be inclined relative to the vertical direction such that the upper end is located outwardly of the base portion 10 and the lower end is located inwardly of the base portion 10.

[0061] The terminal 30 is bent between the rising portion 36 and the protruding portion 32. In this embodiment, the angle formed by a portion of the terminal 30 from the rising portion 36 to the protruding portion 32 is 90 degrees, but the angle may be larger or smaller than 90 degrees.

[0062] like Figure 3As shown, the rising portion 36 of the second terminal 30b includes a first rising portion 36a and a second rising portion 36b extending in the vertical direction, respectively. The boundary between the first rising portion 36a and the second rising portion 36b is bent so as to bulge upward. The vertical dimension of the first rising portion 36a is larger than the vertical dimension of the second rising portion 36b. The first rising portion 36a and the second rising portion 36b are spaced apart from each other.

[0063] The mounting portion 34 is the portion where the circuit on the substrate connects to the terminal 30 when the electronic component 100 is mounted on a substrate (not shown). In this embodiment, the electronic component 100 is surface-mounted relative to the substrate, so the mounting portion 34 has a lower surface (mounting surface) facing downward. Alternatively, the mounting portion 34 may be pin-shaped, and the terminal 30 may be a pin terminal. The mounting portion 34 and the substrate are joined by welding, etc., as described later.

[0064] like Figure 6 or Figure 7 As shown, the width dimension (the dimension in the left-right direction) of the mounting portion 34 of this embodiment is greater than the width dimension of the upright portion 36 or the width dimension of the protrusion 32. The outer shape of the mounting portion 34, when viewed in the height direction, is a horizontally elongated rectangle. Furthermore, the mounting portion 34 has a recessed portion 34c recessed in a predetermined direction in a portion adjacent to the upright portion 36 (a portion of the portion on the base end side of the mounting portion 34 at the center in the left-right direction). Specifically, the recessed portion 34c is recessed in the direction of the bend (laterally and outwardly in the front-back direction) of the bend at the boundary between the mounting portion 34 and the upright portion 36.

[0065] In this embodiment, a convex portion 34a is provided on the lower surface of the mounting portion 34 so as to protrude downward from the lower surface of the mounting portion 34. Figure 4 and Figure 5 As shown, two protrusions 34a are provided in the left-right direction in one mounting portion 34. The protrusion length of the protrusion 34a (the height dimension from the lower end of the protrusion 34a with respect to the lower surface of the mounting portion 34) is smaller than the thickness of the protrusion 34a (the height dimension).

[0066] And, as Figure 1 and Figure 6As shown, the upper surface of the mounting portion 34 is provided with a recessed portion 34b that is recessed downward relative to the upper surface of the mounting portion 34. Two recessed portions 34b are provided in one mounting portion 34, separated in the left-right direction. The depth of the recessed portion 34b (the height dimension from the upper surface of the mounting portion 34 to the bottom surface of the recessed portion 34b) is less than the thickness of the mounting portion 34. Furthermore, in this embodiment, when viewed from the height, the protrusion 34a and the recessed portion 34b partially or entirely overlap. Specifically, when viewed from the height, the center of the protrusion 34a coincides with the center of the recessed portion 34b.

[0067] When the mounting portion 34 is joined to the substrate by soldering, the joining can be performed, for example, as follows. The front end (lower end) or front end surface (lower surface) of the protrusion 34a is in direct point contact or surface contact with the substrate, and the lower surface of the mounting portion 34 (the other surface area other than the portion where the protrusion 34a is provided) is indirectly joined to the substrate via solder. Furthermore, the solder may cover the upper surface of the mounting portion 34. In this case, by arranging the solder in the recess 34b on the upper surface of the mounting portion 34, the solder and the mounting portion 34 are more firmly joined.

[0068] In this embodiment, the mounting portion 34 and the rising portion 36 are continuously formed integrally, and the terminal 30 is bent between the mounting portion 34 and the rising portion 36. The angle formed by a portion of the terminal 30 from the mounting portion 34 to the rising portion 36 is equal to 90 degrees, or greater than 90 degrees, or less than 90 degrees.

[0069] like Figure 3 As shown, the embedded end portion 30d is substantially entirely embedded in the bottom portion 17, with a portion embedded in the housing portion 13. The embedded end portion 30d of this embodiment extends below the housing portion 16, and one end portion of the embedded end portion 30d (the end portion opposite the mounting portion 34) is disposed within the housing portion 16.

[0070] like Figure 2As shown, the embedded end portion 30d of the first terminal 30a branches into two branches at a position closer to one end side than the embedded portion 38 (the opposite side of the side connected to the mounting portion 34), and then the two branches are closed and become one at a position closer to one end side than the two branches. That is, a part of the embedded end portion 30d (the annular portion 30d) is annular. The left-right dimension of the annular portion 30d1 is larger than the left-right dimension of the embedded portion 38. The left-right dimension of a part (the narrow width portion 30d2) closer to one end side than the annular portion 30d1 is smaller than the left-right dimension of the annular portion 30d1. The narrow width portion 30d2 protrudes upward in the middle, and a part of the narrow width portion 30d2 is arranged inside the storage portion 16. Furthermore, the embedded portion 38 , the annular portion 30 d 1 , and a portion of the narrow portion 30 d 2 are formed as a continuous plate member, and their upper and lower surfaces are arranged on the same plane.

[0071] The embedded end portion 30d of the second terminal 30b includes a portion (wide portion 30d3) located on the opposite side of the mounting portion 34 across the embedded portion 38, and a folded portion 30d4 that continues from the wide portion 30d3 and serves as one end of the embedded end portion 30d. In other words, the folded portion 30d and the embedded portion 38 branch off from the wide portion 30d. The second terminal 30b protrudes upward at the boundary between the folded portion 30d4 and the wide portion 30d3, and the folded portion 30d4 is located within the housing portion 16.

[0072] The covering portion 11 is a portion of the base portion 10 that extends from the outer surface of the base portion 10 (main body portion 12) and covers a portion or all of the outer surface of the exposed end portion 30c. Figure 3 As shown, the portion of the base portion 10 other than the covering portion 11 is referred to as the main body 12. In the present embodiment, the main body 12 is seamlessly integrated with the covering portion 11. Here, more specifically, the outer surface of the base portion 10 extending from the covering portion 11 is the outer surface of the base portion 10 from which the terminal 30 protrudes. That is, preferably, the outer surface of the base portion 10 extending from the covering portion 11 is the side surface 10a or the bottom surface 10c of the base portion 10. In the present embodiment, the covering portion 11 extends from the surface facing forward or backward, which is the side surface 10a of the base portion 10.

[0073] The covering portion 11 covers at least a portion of the periphery of the base end of the exposed end portion 30c, meaning that the covering portion 11 covers at least a portion of the radial direction of the portion of the exposed end portion 30c on the base end side of the exposed end portion 30c. Here, the radial direction of the exposed end portion 30c (terminal 30) refers to the direction from the center of the cross-section of the exposed end portion 30c (terminal 30) (a cross-section taken perpendicular to the direction of extension of the exposed end portion 30c) toward the periphery of the cross-section. The cross-sectional shape of the terminal 30 is not circular or polygonal; the term "radial direction of the exposed end portion 30c" is used for the above-mentioned purpose. In other words, the covering portion 11 can completely cover the exposed end portion 30c in the radial direction, encircling a portion of the base end side of the exposed end portion 30c. Alternatively, as in the second embodiment described below, the covering portion 11 can cover only a portion of the radial direction of the portion of the exposed end portion 30c on the base end side of the exposed end portion 30c. That is, the covering portion 11 can cover only the upper side, only the lower side, or only the side of the portion of the base end side of the exposed end portion 30c.

[0074] Specifically, the portion of the proximal side of the exposed end portion 30c is a portion or all of the protrusion 32. In this embodiment, as described later, the covering portion 11 covers only a portion of the proximal side of the protrusion 32. Alternatively, the covering portion 11 may also cover a portion or all of the bent portion between the protrusion 32 and the rising portion 36, or a portion or all of the rising portion 36. However, as described later, it is preferred that the bent portion or the rising portion 36 be exposed from the covering portion 11.

[0075] like Figure 4 or Figure 5 As shown, the area of ​​the covering portion 11 when viewed in the protruding direction of the protrusion 32 is preferably smaller than the area of ​​the base portion 10 (main portion 12) when viewed in this direction. More preferably, the width dimension (left-right dimension) of the covering portion 11 when viewed in the protruding direction of the protrusion 32 is smaller than the width dimension of the base portion 10 (main portion 12) when viewed in this direction. Furthermore, the thickness dimension (height dimension) of the covering portion 11 when viewed in the protruding direction of the protrusion 32 is preferably smaller than the thickness dimension of the base portion 10 (main portion 12) when viewed in this direction.

[0076] And, as Figure 3 and Figure 6 As shown, the covering portion 11 and the protrusion 32 overlap each other in the overlapping region in a direction perpendicular to the protruding direction of the protrusion 32 (left-right or up-down, or both). Preferably, the covering portion 11 is in close contact with the protrusion 32 throughout the entire overlapping region. Here, "close contact between the covering portion 11 and the protrusion 32 throughout the entire overlapping region" includes a situation where the covering portion 11 and the protrusion 32 are separated in a very small portion due to an unexpected gap or the like.

[0077] like Figure 8 As shown in (a), the shape of the cross section of the protrusion 32 is thin and flat in the short side direction. The protrusion 32 has a first main surface facing the short side direction of the cross section of the protrusion 32 and a second main surface opposite to the first main surface. The first main surface and the second main surface are covered by the covering portion 11. Hereinafter, the short side direction of the cross section of the protrusion 32 is sometimes referred to as the short side direction of the protrusion 32. In addition, the long side direction of the cross section of the protrusion 32 is sometimes referred to as the long side direction of the protrusion 32. By covering the first main surface and the second main surface with the covering portion 11, the stress applied to the base portion 10 can be alleviated when an external force in the short side direction of the protrusion 32 is applied to the electronic component 100.

[0078] Here, the cross section of the protrusion 32 refers to the cross section when observed along the protruding direction of the protrusion 32. In the present embodiment, the shape of the cross section of the protrusion 32 is a rectangle that is horizontally long in the left-right direction, but is not limited to this, and may also be a polygon or ellipse that is flat in the short side direction. In the case where the cross-sectional shape of the protrusion 32 is a polygon, the two faces face one side and the other side of the short side direction. Here, the face facing the prescribed direction means that the normal vector of the face has a prescribed directional component, including the case where the normal vector of the face is parallel to the prescribed direction, but is not limited to this. In the case of an ellipse, the first principal surface or the second principal surface refers to a surface area (a portion of the peripheral surface) that can be visually confirmed from the short side direction of the protrusion 32.

[0079] In the present embodiment, the short side direction of the protrusion 32 is the up-down direction. The first principal surface may be a surface facing upward or downward. Similarly, the second principal surface may be a surface facing downward or upward. In the present embodiment, the protrusion 32 has an upper principal surface 32c facing upward, a lower principal surface 32d facing downward, and a side end surface 32e facing the long side direction (left-right direction) described later. The area of ​​the upper principal surface 32c and the lower principal surface 32d is larger than the area of ​​each side end surface 32e. In the present embodiment, the first principal surface is described as the upper principal surface 32c and the second principal surface is described as the lower principal surface 32d.

[0080] Alternatively, the short side of the protrusion 32 may be oriented in the horizontal direction. That is, the cross-sectional shape of the protrusion 32 may be a vertically elongated rectangle. In this case, the covering portion 11 covers the outer surfaces of the protrusion 32, which are the first and second principal surfaces, that face the horizontal direction.

[0081] The protrusion 32 has a pair of side end surfaces 32e, 32e facing the longitudinal direction of the cross section of the protrusion 32. The pair of side end surfaces 32e, 32e are respectively covered by the covering portion 11. This can alleviate the stress applied to the base portion 10 when an external force in the longitudinal direction is applied to the electronic component 100.

[0082] In this embodiment, the covering portion 11 not only covers the upper principal surface 32c and the lower principal surface 32d, but also covers a pair of side end surfaces 32e, 32e. The covering portion 11 of this embodiment includes a first covering portion 11a covering the upper principal surface 32c, a second covering portion 11b covering the lower principal surface 32d, and a third covering portion 11c covering the side end surfaces 32e. Hereinafter, the first covering portion 11a, the second covering portion 11b, and the third covering portion 11c will sometimes be referred to simply as the covering portion 11. The first covering portion 11a, the second covering portion 11b, and the third covering portion 11c are formed integrally. In other words, the entire radial direction of the protrusion 32 is covered by the circumferentially continuous covering portion 11, with no gaps separating the covering portion 11 from the protrusion 32. As a result, when an external force is applied to the electronic component 100, causing the protrusion 32 to displace, the covering portion 11 can easily follow the protrusion 32. Alternatively, gaps may be provided between the first, second, and third covering portions 11a, 11b, and 11c, spaced apart from each other in the circumferential direction of the protrusion 32. This allows the first, second, and third covering portions 11a, 11b, and 11c to independently follow the displacement of the protrusion 32.

[0083] Alternatively, the entire upper main surface 32c and the lower main surface 32d may be exposed from the covering portion 11, with only the pair of side end surfaces 32e, 32e being covered by the covering portion 11. When the short side direction of the protruding portion 32 is in the vertical direction as in the present embodiment, only the surface of the outer surface of the protruding portion 32 facing the horizontal direction may be covered by the covering portion 11. When the short side direction of the protruding portion 32 is in the horizontal direction, only the surface of the outer surface of the protruding portion 32 facing the vertical direction may be covered by the covering portion 11.

[0084] like Figure 8As shown in (b), the outer surface of the protrusion 32 includes a covered region 32a, a portion of which is covered by the covering portion 11 at the base end, and a flat exposed region 32b, which is located adjacent to the covered region 32a and closer to the front end than the covered region 32a. Thus, when the base 10 is formed by injection molding, the surface of the injection molding mold follows the flat surface of the exposed region 32b of the protrusion 32, effectively preventing resin from leaking from the interior of the injection molding mold. Furthermore, since a portion of the front end of the protrusion 32 is exposed from the covering portion 11, the portion of the terminal extending from the protrusion 32 to the rising portion 36 is easily deformed by external forces applied to the electronic component 100, thereby alleviating stress applied to the base 10.

[0085] The covered area 32a or exposed area 32b refers to a portion or the entire area of ​​the outer surface of the protrusion 32. Here, the protrusion 32 does not include the bent portion at the boundary between the protrusion 32 and the rising portion 36. Therefore, when the cross-sectional shape of the protrusion 32 is a polygon such as a rectangle, the outer surface of the protrusion 32 is flat.

[0086] The exposed area 32b refers to a portion of the surface area that is continuous with the covered area 32a and is located closer to the distal end of the covered area 32a. Specifically, when viewed from the protruding direction of the protruding portion 32, the exposed area 32b overlaps with the covered area 32a. In the case where the upper main surface 32c is covered by the covering portion 11, as in the second embodiment described below, and the entire side end surface 32e, including the base end, is exposed from the covering portion 11, the exposed area 32b is a portion of the surface area on the distal end side of the upper main surface 32c and does not include the surface area on the base end side of the side end surface 32e.

[0087] The exposed area 32b being flat means that the exposed area 32b is substantially flat, but does not necessarily need to be completely flat. A portion of the exposed area 32b may be slightly curved. The exposed area 32b being flat means that part or all of the exposed area 32b is flat. It is particularly preferred that the exposed areas 32b on the first principal surface (upper principal surface 32c) and the second principal surface (lower principal surface 32d) are flat. It is further preferred that the exposed areas 32b on the side end surface 32e are also flat.

[0088] Furthermore, it is preferable that the dimension L1 (also referred to as the covering length) of the covered region 32a in the protruding direction of the protruding portion 32 is greater than the dimension L2 of the exposed region 32b in the protruding direction of the protruding portion 32. Thus, when external force is applied to the electronic component 100, the stress applied from the protruding portion 32 to the base portion 10 can be sufficiently alleviated. Furthermore, by sufficiently shortening the overall length of the protruding portion 32, the dimension of the exposed end portion 30c in the protruding direction of the protruding portion 32 can be kept small.

[0089] Furthermore, the covering length of the covering region 32a of the first principal surface (upper principal surface 32c) can be equal to, or greater or less than, the covering length of the covering region of the second principal surface (lower principal surface 32d). When the covering length of the covering region 32a of the upper principal surface 32c is greater than the covering length of the covering region 32a of the lower principal surface 32d, the covering portion 11 (second covering portion 11b) covering the lower principal surface 32d is less likely to obstruct the displacement of the bent portion at the boundary between the protrusion 32 and the rising portion 36, thereby facilitating deformation of the bent portion. Furthermore, the injection molding mold covering the lower side of the electronic component 100 during injection molding easily covers the periphery of the protrusion 32, resulting in a shape that is highly adaptable to manufacturing. On the other hand, when the covering length of the covering region 32a on the lower main surface 32d is greater than the covering length of the covering region 32a on the upper main surface 32c, the tip of the second covering portion 11b is positioned near the bent portion at the boundary between the protrusion 32 and the rising portion 36. Therefore, when external force is applied to the electronic component 100, stress concentrates on this tip, accelerating displacement at the bent portion at the boundary between the protrusion 32 and the rising portion 36, and preventing deformation of linear portions such as the protrusion 32. Furthermore, when the covering length of the covering region 32a on the upper main surface 32c is equal to the covering length of the covering region 32a on the lower main surface 32d, the exposed region 32b of the upper main surface 32c overlaps with the exposed region 32b of the lower main surface 32d when viewed along the short side of the protrusion 32. With this structure, the protrusion 32 can be evenly gripped from the top and bottom by the mold covering the upper side and the mold covering the lower side of the electronic component 100 used in injection molding, thereby facilitating manufacturing.

[0090] When the covering length of a portion of the covering portion 11 covering a radial part of the protrusion 32 is different from the covering length of another portion of the covering portion 11 covering another radial part, the front ends of the covering portions 11 with different covering lengths can be smoothly connected to each other or can be discontinuously connected in a manner having steps in the protruding direction of the protrusion 32.

[0091] Furthermore, the covering length of the covering region 32a of the first main surface (upper main surface 32c) or the second main surface (lower main surface 32d) may be equal to, larger than, or smaller than the covering length of the covering region 32a of the side end surface 32e.

[0092] Instead of the present embodiment, the entire outer surface of the protruding portion 32 including the tip may be covered by the covering portion 11 , and the entire outer surface may serve as the covering region 32 a .

[0093] In this embodiment, if Figure 6 and Figure 8As shown in (b), at least a portion of the covering portion 11 becomes thinner from the base end toward the front end. If the covering portion 11 becomes thinner from the base end toward the front end, the rigidity of the covering portion 11 gradually decreases or decreases in multiple stages from the base end toward the front end, while the flexibility of the covering portion 11 gradually increases or increases in multiple stages from the base end toward the front end. As a result, when an external force is applied to the electronic component 100, the stress applied to the covering portion 11 is dispersed over the entire range from the front end to the base end of the covering portion 11, or is dispersed to multiple locations.

[0094] Regarding at least a portion of the covering portion 11, at least a portion in the radial direction of the covering portion 11 disposed around the protrusion 32 may be thinner from the base end toward the distal end. In other words, a portion in the radial direction of the covering portion 11 disposed around the protrusion 32 may be thinner from the base end toward the distal end, while another portion may have the same thickness from the base end toward the distal end.

[0095] Here, the thinning of the covering portion 11 from the base end toward the tip means that the thickness of the covering portion 11 decreases in multiple stages or continuously from the base end toward the tip end of the covering portion 11. That is, the outer surface of the covering portion 11 can be inclined relative to the protruding direction of the protrusion 32, as in the present embodiment, or it can be a stepped surface. Furthermore, the inclined surface of the outer surface of the covering portion 11 can be flat, or it can be a dome-shaped curved surface when viewed from the left and right or from the top and bottom, or it can be a curved surface that is concave toward the protrusion 32.

[0096] like Figure 8 As shown in (a), the thickness of the covering portion 11 here refers to the thickness in the direction connecting the center of the terminal and the outer edge of the covering portion 11 when viewed from the protruding direction of the protrusion 32, or the distance between the inner edge of the covering portion 11 on the terminal 30 side and the outer edge on the opposite side of the terminal 30 side. For example, the thickness (maximum thickness) of the base end side of the covering portion 11 (the first covering portion 11a, the second covering portion 11b, or the third covering portion 11c) of this embodiment refers to Figure 8 Dimensions L3, L4 or L5 as shown in (a).

[0097] Instead of the present embodiment, a part or the entirety of the covering portion 11 may have the same thickness from the base end toward the tip, or the thickness may increase from the base end toward the tip.

[0098] In this embodiment, if Figure 6 、 Figure 8 (a) and Figure 8As shown in (b), the covering portion 11 covering the first principal surface (upper principal surface 32c), the second principal surface (lower principal surface 32d), and the pair of side end surfaces 32e, 32e, respectively, becomes thinner from the base end toward the tip. That is, the first covering portion 11a, the second covering portion 11b, and the third covering portion 11c become thinner from the base end toward the tip. When the upper principal surface 32c, the lower principal surface 32d, and the side end surfaces 32e are covered by the covering portion 11 as in this embodiment, the thickness of the covering portion 11 specifically refers to the thickness of the portion that overlaps with the protrusion 32 in the short-side or long-side directions of the protrusion 32.

[0099] like Figure 8 As shown in (b), the thickness of the covering portion 11 at the base end of the covering portion 11 is equal to or greater than the dimension of the covering portion 11 in the direction of projection 32. This reduces the dimension of the projection 32 in the direction of projection 32, and substantially reduces the rigidity of the covering portion 11 from the base end to the tip. Furthermore, since the covering portion 11 has a sufficiently large thickness at the base end, the change in rigidity of the base portion 10 at the boundary between the covering portion 11 and the main body portion 12 can be reduced, thereby relieving the stress concentrated at this boundary.

[0100] Alternatively, the thickness of the covering portion 11 may be equal to or greater than the dimension of the covering portion 11 in the protruding direction of the protruding portion 32 in only a portion of the covering portion 11 as viewed in the radial direction of the protruding portion 32, while the thickness of the covering portion 11 may be less than the dimension of the covering portion 11 in the protruding direction in another portion. Alternatively, as in the present embodiment, the thickness of the covering portion 11 may be equal to or greater than the dimension of the covering portion 11 in the protruding direction of the protruding portion 32 in the entire covering portion 11 as viewed in the radial direction of the protruding portion 32.

[0101] When the coating 11 continuously becomes thinner from the base end to the tip end, the surface of the coating 11 forms an inclined surface inclined relative to the protruding direction of the protruding portion 32. The inclination of the inclined surface relative to the protruding direction (hereinafter also referred to as the inclination angle) is equal to or greater than 45 degrees.

[0102] Alternatively, the thickness of the covering portion 11 at the base end of the covering portion 11 may be smaller than the dimension of the covering portion 11 in the protruding direction. In this case, the angle of inclination of the inclined surface of the covering portion 11 is less than 45 degrees. This configuration allows the rigidity of the covering portion 11 to change more gradually from the base end to the tip end. When external force is applied to the electronic component 100, the covering portion 11 and the protruding portion 32 covered by the covering portion 11 are subjected to stress and deform more gently.

[0103] like Figure 8As shown in (a), at the base end of the covering portion 11, the thickness (dimension L3) of the portion of the covering portion 11 (first covering portion 11a) covering the first principal surface is equal to or greater than the thickness (dimension L5) of the other portion of the covering portion 11 (third covering portion 11c) covering the side end surface 32e. The surface of the protrusion 32 facing the short side, i.e., the principal surface, has a larger area than the side end surface 32e. Therefore, when external force is applied to the electronic component 100, the stress applied to the entire first covering portion 11a is greater than the stress applied to the entire third covering portion 11c. By having the thickness of the first covering portion 11a be greater than the thickness of the third covering portion 11c, the stress applied to the covering portion 11 covering the first principal surface can be more effectively mitigated.

[0104] Here, of the two principal surfaces (upper principal surface 32c and lower principal surface 32d) of the protrusion 32 facing the short side, the surface expected to be subjected to a stronger stress can be designated as the first principal surface. That is, the first principal surface can be either the upper principal surface 32c or the lower principal surface 32d. Furthermore, the thickness (dimension L4) of the covering portion 11 (second covering portion 11b) covering a portion of the second principal surface can be equal to, or greater or less than, the thickness (dimension L5) of the third covering portion 11c.

[0105] Alternatively, the thickness of the portion of covering portion 11 covering the first main surface may be smaller than the thickness of the other portion of covering portion 11 covering the side end surface 32e. In this case, the stress applied to the third covering portion 11c can be more effectively mitigated. This configuration is useful when, for example, external force is expected to be applied to the electronic component 100 along the longitudinal direction of the protrusion 32.

[0106] At the base end of covering portion 11, the thickness of the portion of covering portion 11 covering the first principal surface (first covering portion 11a) is equal to or greater than the thickness of the portion of covering portion 11 covering the second principal surface (second covering portion 11b). This allows first covering portion 11a and second covering portion 11b to have sufficient thickness in response to stress applied to them when external force is applied to electronic component 100.

[0107] Here, the first principal surface can be the principal surface covered by the portion of covering portion 11 where stress is more concentrated, within each covering portion 11 (first covering portion 11a or second covering portion 11b) covering the principal surface of protrusion 32 facing the short side. For example, if external force is applied to electronic component 100, and stress is most concentrated on a portion of first covering portion 11a, upper principal surface 32c can be the first principal surface, while if stress is most concentrated on a portion of second covering portion 11b, lower principal surface 32d can be the first principal surface. In this way, covering portion 11 covering the first principal surface can fully withstand the stress applied to covering portion 11 by terminal 30.

[0108] Alternatively, the second main surface may be formed as a main surface covered by a portion of the covering portion 11 where stress is more concentrated. In this way, since the protrusion 32 (terminal 30) is in close contact with the thick-walled covering portion 11 covering the first main surface, when the protrusion 32 is about to apply stress to the thin-walled covering portion 11 covering the first main surface, the stress applied from the protrusion 32 to the thin-walled covering portion 11 can be reduced by the rigidity of the thick-walled covering portion 11.

[0109] When the first and second covering portions 11a and 11b are continuously thinned from the base end to the front end, the inclination angle of the flat slope of the first covering portion 11a may be equal to or greater than the inclination angle of the slope of the second covering portion 11b.

[0110] like Figure 8 As shown in (a), at the base end of the covering portion 11, the thickness of the portion of the covering portion 11 (the first covering portion 11a and the second covering portion 11b) covering the first and second principal surfaces is equal to or greater than the dimension of the protrusion 32 in the short-side direction of the protrusion 32 (the thickness of the protrusion 32). Thus, when external force is applied to the electronic component 100, the first covering portion 11a and the second covering portion 11b can adequately support the protrusion 32.

[0111] Furthermore, the thickness of the portion of the covering portion 11 covering the first and second principal surfaces is preferably equal to or smaller than the longitudinal dimension of the protrusion 32 (the width of the protrusion 32). This is to impart sufficient flexibility to the covering portion 11 to allow it to follow the protrusion 32 as it is displaced or deformed by external forces.

[0112] Alternatively, as an alternative to this embodiment, the dimension of protrusion 32 in the short-side direction of protrusion 32 may be greater than the thickness of the portion of covering portion 11 covering the first and second principal surfaces at the base end of covering portion 11. By making the dimension of protrusion 32 in the short-side direction sufficiently large, protrusion 32 has increased rigidity, thereby making it less likely to deform. Therefore, when external force is applied to electronic component 100, the stress applied from protrusion 32 to covering portion 11 in close contact with protrusion 32 is evenly applied from the base end to the tip of protrusion 32.

[0113] like Figure 4 As shown, when viewed from the protruding direction of the protrusion 32, the periphery of the covering portion 11 is surrounded by the outer surface of the base portion 10. In other words, when viewed from the protruding direction, the outer edge of the covering portion 11 is arranged at a position closer to the inside than the outer edge of the base portion 10. That is, when viewed from the protruding direction of the protrusion 32, the outer edge of the covering portion 11 is separated from the outer edge of the base portion 10. Moreover, the thickness of the covering portion 11 is sufficiently smaller than the distance from the center of the protrusion 32 to the outer edge of the base portion 10 when viewed from the protruding direction of the protrusion 32. For example, the first covering portion 11a (refer to Figure 8 (a)) or the second covering portion 11b (refer to Figure 8 The thickness of (a) is smaller than the distance from the center of the protrusion 32 to the upper surface 10b of the base portion 10 when viewed from the protruding direction of the protrusion 32. Figure 8 The thickness of (a)) is smaller than the distance from the center of the protrusion 32 to the side surface 10 a of the base portion 10 when viewed from the protruding direction of the protrusion 32 .

[0114] When viewed from the protruding direction of the protrusion 32, the outer surface of the base 10 surrounds the covering portion 11. The covering portion 11 extends from a portion of the outer surface of the base 10, and the thickness of the covering portion 11 is sufficiently small relative to the size of the base 10. This allows the covering portion 11 to have sufficient flexibility to follow the deformation of the protrusion 32 when the electronic component 100 is subjected to external force.

[0115] Here, use Figure 11 (a) and Figure 11 (b) of the present embodiment describes the following situation regarding the electronic component 100: when an external force is applied to the electronic component 100, the stress applied to the base portion 10 around the terminal 30 (especially the embedded end portion 30d including the embedded portion 38) is relieved. Figure 11 (a) and Figure 11 (b) of FIG. 3 shows the vicinity of the protruding portion of the terminal 30 embedded in the frame. The light and dark colors in the frame indicate the magnitude of the stress applied to the portion.

[0116] A three-dimensional shape model simulating the electronic component 100 of the present embodiment was created, and the stress applied to the base portion 10 was calculated for the three-dimensional model using the finite element method. In addition, in order to compare the stress applied to the base portion 10 of the electronic component 100, a three-dimensional shape model simulating an electronic component (referred to as a control electronic component) including a base portion 10 without a covering portion 11 and having only a main body portion 12 was created, and the stress was calculated. The three-dimensional shape model simulating the electronic component 100 and the three-dimensional shape model simulating the control electronic component have the same shape except for the presence or absence of the covering portion 11. Regarding the various components constituting the electronic component 100 and the control electronic component, the density or Young's modulus of the solder and glass plate described later, and other material constants, relevant values ​​regarding the above material types were input. The elements of the electronic component 100 and the control electronic component were divided into tetrahedral elements and the three-dimensional shape models were created. The electronic component 100 and the control electronic component were fixed to the substrate (glass plate such as lime glass) by welding as described above. That is, electronic component 100 or a reference electronic component shares nodes with the solder, the solder shares nodes with the substrate, and the electronic component 100 or a reference electronic component shares nodes with the substrate. The main surface of the glass plate serving as the substrate is a quadrilateral. Furthermore, the side surfaces (side end surfaces) surrounding the glass plate are fixed.

[0117] Assuming that the electronic component 100 is pulled upward from the substrate, the stress applied to the base portion 10 when an external force is applied from the bottom to the top of the electronic component 100 is calculated by computer simulation. Specifically, the stress on the plug engagement protrusion 13b of the base portion 10 (see Figure 3 ) is applied with a force of 100 N. The force of 100 N is distributed and applied to the insertion surface 13b1 of the plug engagement protrusion 13b (see Figure 3 ) and the lower surface (disposed downwardly between the insertion surface 13b1 and the engagement surface 13b2 (refer to Figure 3 ) between the surfaces).

[0118] like Figure 11 As shown in (a), in the control electronic component, stress is concentrated near the corners of the rectangular opening portion (terminal insertion portion 18) of the recess formed by embedding the terminal 30 (embedded portion 38) in the main body 12. Specifically, the maximum stress applied to this portion is about 148 MPa. In addition, the stress applied to this portion is the maximum value of the stress applied to the electronic component 100. On the other hand, in the electronic component 100, the stress is dispersed throughout the entire covering portion 11. Specifically, a hole (terminal insertion portion 18) is formed inside the covering portion 11, which is rectangular in shape when viewed from the protruding direction of the protrusion 32 due to the passage of the terminal 30 (protrusion 32). As shown Figure 11As shown in (b), the stress applied near the corners of the hole is smaller than the stress applied near the corners of the recessed portion of the main body portion 12 of the control electronic component. Specifically, the maximum stress applied to this portion is 73 MPa. Furthermore, the stress applied near the corners of the hole is the maximum value of the stress applied to the electronic component 100. That is, in the electronic component 100, the maximum value of the stress applied to the base portion 10 is reduced by approximately 51% compared to the control electronic component. Furthermore, in the electronic component 100, when viewed from the protruding direction of the protrusion 32, stress is also applied near the edges (especially the edges arranged above and the edges arranged on the sides) constituting the hole. That is, it was confirmed that: in the electronic component 100, stress is applied to the first covering portion 11a (refer to Figure 8 (a)) and the third covering portion 11c (refer to Figure 8 (a)).

[0119] <Second embodiment>

[0120] Figure 9 (a) and Figure 10 (a) is a side view showing an example of the electronic component 100 according to this embodiment. Figure 9 (b) and Figure 10 (b) is a front view of the electronic component 100 .

[0121] First, the outline of the electronic component 100 according to this embodiment will be described.

[0122] As described above, the electronic component 100 of this embodiment includes: a base portion 10 having a storage portion 16 for storing an electronic component; and a terminal 30, a portion of which (an embedded portion 38 described later) is embedded in the base portion 10, and one end portion of the terminal 30 (an exposed end portion 30c described later) protrudes from the base portion 10 toward the outside of the base portion 10. The base portion 10 includes a covering portion 11, which extends from the outer surface of the base portion 10 and covers at least a portion of the periphery of the base end of the one end portion (the exposed end portion 30c).

[0123] Next, the electronic component 100 of this embodiment will be described in detail.

[0124] In the electronic component 100 of this embodiment, a portion of the base end of one end portion (the exposed end portion 30c) is covered by the covering portion 11, while another portion of the base end of the exposed end portion 30c is exposed from the covering portion 11. This is different from the first embodiment described above. For example, it is possible to predict the direction in which external force is likely to be applied to the electronic component 100, and the covering portion 11 is arranged in a portion where stress is concentrated in the radial direction of the protrusion 32, while the covering portion 11 is not arranged in the other portion (exposed from the covering portion 11). For example, in the case where it is expected that an external force from the bottom up is applied to the electronic component 100, the covering portion 11 can be arranged only on the upper side of the protrusion 32 as described later. In this way, when an external force is applied to the electronic component 100, the terminal 30 is pressed against the base portion 10 including the covering portion 11. Therefore, although stress is applied to the base portion 10, the stress is dispersedly applied to the covering portion 11 by providing the covering portion 11, thereby avoiding stress concentration on a portion of the base portion 10.

[0125] Furthermore, the covering portion 11 may not be disposed in a portion of the protrusion 32 where stress is concentrated in the radial direction (so that portion is exposed), but may be disposed in another portion opposite to the portion across the protrusion 32. For example, if an external force is expected to be applied to the electronic component 100 from below, the covering portion 11 may be disposed only on the lower side of the protrusion 32, as described below. In this manner, the covering portion 11, which is in close contact with the protrusion 32, can suppress displacement or deformation of the protrusion 32 due to the external force.

[0126] Furthermore, by disposing the covering portion 11 only around the necessary portion of the base end of the protrusion 32, the amount of resin used in manufacturing can be reduced. Furthermore, by not covering the entire perimeter of the base end of the protrusion 32 with the covering portion 11, deformation of the protrusion 32 can be prevented from being hindered by the covering portion 11. Therefore, when external forces are applied to the electronic component 100, the protrusion 32 can deform appropriately, dispersing the stress.

[0127] like Figure 9 (a) and Figure 9 As shown in (b), an example of this embodiment is as follows: only the base end of the first main surface (upper main surface 32c) is covered by the covering portion 11 (first covering portion 11a), and the second main surface (lower main surface 32d) and a pair of side end surfaces 32e, 32e are exposed as a whole from the covering portion 11.

[0128] like Figure 10 (a) and Figure 10 As shown in (b), an example of this embodiment is as follows: only the base end of the second main surface (lower main surface 32d) is covered by the covering portion 11 (second covering portion 11b), and the first main surface (upper main surface 32c) and the pair of side end surfaces 32e, 32e are exposed from the covering portion 11. Figure 9 (b) and Figure 10 As shown in (b), the side end surface 32e of the protrusion 32 and the side end surface of the covering portion 11 are arranged on the same plane. Alternatively, the side end surface of the covering portion 11 may be arranged outward in the left-right direction relative to the side end surface 32e of the protrusion 32, or inward in the left-right direction relative to the side end surface 32e of the protrusion 32.

[0129] Can also replace Figure 9 (a) to Figure 10 In the example shown in (b), the base ends of one or both of the pair of side end surfaces 32e, 32e of the protruding portion 32 are covered by the covering portion 11, and the entirety of the other surface (the first principal surface or the second principal surface) is exposed from the covering portion 11. Alternatively, the base ends of the first principal surface, the second principal surface, or a portion of the pair of side end surfaces 32e, 32e may be covered by the covering portion 11, and the base ends of the remaining surfaces may be exposed from the covering portion 11.

[0130] Furthermore, the electronic component 100 of this embodiment has the following features similarly to the electronic component 100 of the first embodiment.

[0131] The outer surface of the protrusion 32 includes a covered region 32a in which a portion of the proximal end is covered by the covering portion 11 and a flat exposed region 32b connected to the covered region 32a and arranged closer to the distal end than the covered region 32a.

[0132] At least a portion of the covering portion 11 becomes thinner from the base end toward the front end.

[0133] The thickness of the covering portion 11 at the base end of the covering portion 11 is equal to or greater than the dimension of the covering portion 11 in the protruding direction.

[0134] The present invention is not limited to the above-described embodiment, and various modifications and improvements can be included as long as the object of the present invention can be achieved.

[0135] The following modifications can be combined as appropriate.

[0136] The electronic component 100 of the first embodiment or the second embodiment is used by being connected to a plug for connecting to an external system, but the present invention is not limited thereto. The electronic component may be connected only to the terminal 30 .

[0137] The above-mentioned embodiment includes the following technical ideas.

[0138] (1) An electronic component comprising: a base portion having a storage portion for storing an electronic element; and a terminal, a portion of which is embedded in the base portion, and one end portion of which protrudes from the base portion toward the outside of the base portion, wherein the base portion has a covering portion extending from the outer surface of the base portion and covering at least a portion of the periphery of the base end of the one end portion.

[0139] (2) The electronic component according to (1), wherein a portion around the base end of the one end portion is covered by the covering portion, and another portion around the base end of the one end portion is exposed from the covering portion.

[0140] (3) An electronic component according to (1), wherein the one end portion has a protrusion located on the base end side of the one end portion and extending along the protruding direction of the one end portion, the cross-section of the protrusion is thin and flat in the short side direction, the protrusion has a first main surface facing the short side direction of the cross-section of the protrusion and a second main surface opposite to the first main surface, and the first main surface and the second main surface are covered by the covering portion.

[0141] (4) The electronic component according to (3), wherein the protrusion has a pair of side end surfaces facing the longitudinal direction of the cross section of the protrusion, and the pair of side end surfaces are respectively covered by the covering portion.

[0142] (5) An electronic component according to (4), wherein the outer surface of the protrusion includes a covered area in which a portion of the base end side is covered by the covering portion and a flat exposed area connected to the covering area and arranged at a position closer to the front end side than the covering area.

[0143] (6) The electronic component according to any one of (3) to (5), wherein at least a portion of the covering portion becomes thinner from the base end toward the front end.

[0144] (7) The electronic component according to (4) or (5), wherein the covering portion covering the first main surface, the second main surface, and the pair of side end surfaces becomes thinner from the base end toward the front end.

[0145] (8) The electronic component according to (6) or (7), wherein a thickness of the covering portion at a base end of the covering portion is equal to or larger than a dimension of the covering portion in the protruding direction.

[0146] (9) An electronic component according to any one of (6) to (8) of cited (4), wherein at the base end of the covering portion, the thickness of a portion of the covering portion covering the first main surface is equal to or greater than the thickness of another portion of the covering portion covering the side end surface.

[0147] (10) The electronic component according to any one of (6) to (9), wherein, at the base end of the covering portion, the thickness of the covering portion covering the first main surface is equal to or greater than the thickness of the covering portion covering the second main surface.

[0148] (11) An electronic component according to any one of (6) to (10), wherein at the base end of the covering portion, the thickness of a portion of the covering portion covering the first main surface and the second main surface is equal to or greater than the dimension of the protrusion in the short side direction of the protrusion.

[0149] (12) The electronic component according to any one of (7) to (11), wherein the periphery of the covering portion is surrounded by the outer surface of the base portion when viewed from the protruding direction.

[0150] Description of labels

[0151] 100: electronic component; 10: base; 10a: side; 10b: top; 10c: bottom; 11: cover; 11a: first cover; 11b: second cover; 11c: third cover; 12: main body; 13: housing; 13a: plug connection, plug insertion hole; 13b: plug engagement projection; 13b1: insertion surface; 13b2: engagement surface; 14: through hole; 15: pin; 16: storage; 17: bottom; 18: terminal insertion portion; 30: terminal; 30a: First terminal; 30b: second terminal; 30c: exposed end; 30d: buried end; 30d1: annular portion; 30d2: narrow portion; 30d3: wide portion; 30d4: folded portion; 32: protrusion; 32a: covered area; 32b: exposed area; 32c: upper main surface; 32d: lower main surface; 32e: side end surface; 34: mounting portion; 34a: convex portion; 34b: concave portion; 34c: recessed portion; 36: rising portion; 36a: first rising portion; 36b: second rising portion; 38: buried portion.

Claims

1. An electronic component comprising: a base portion having a storage portion for storing electronic components; and a terminal, a portion of which is embedded in the base portion, and one end portion of which protrudes from the base portion toward the outside of the base portion; in, The base portion includes a covering portion extending from an outer surface of the base portion and covering at least a portion around a base end of the one end portion.

2. The electronic component according to claim 1, wherein A portion of the periphery of the base end of the one end portion is covered by the covering portion, Another portion of the one end portion around the base end is exposed from the covering portion.

3. The electronic component according to claim 1, wherein The one end portion has a protruding portion, the protruding portion being located on the base end side of the one end portion and extending in a protruding direction of the one end portion, The cross-section of the protrusion is thin and flat in the short side direction. The protrusion has a first main surface facing the short side direction of the cross section of the protrusion and a second main surface facing the first main surface. The first main surface and the second main surface are covered by the covering portion.

4. The electronic component according to claim 3, wherein The protrusion has a pair of side end surfaces facing the longitudinal direction of the cross section of the protrusion. The pair of side end surfaces are respectively covered by the covering portion.

5. The electronic component according to claim 4, wherein The outer surface of the protruding portion includes a covered region in which a portion of a base end side is covered by the covering portion, and a flat exposed region connected to the covered region and arranged closer to the distal end side than the covered region.

6. The electronic component according to any one of claims 3 to 5, wherein At least a portion of the covering portion becomes thinner from the base end toward the front end.

7. The electronic component according to claim 4 or 5, wherein The covering portion covering the first main surface, the second main surface, and the pair of side end surfaces is thinner from the base end toward the front end.

8. The electronic component according to claim 6 or 7, wherein The thickness of the covering portion at the base end of the covering portion is equal to or greater than the dimension of the covering portion in the protruding direction.

9. The electronic component according to any one of claims 6 to 8 as dependent on claim 4, wherein: At the base end of the covering portion, a thickness of a portion of the covering portion covering the first main surface is equal to or greater than a thickness of another portion of the covering portion covering the side end surface.

10. The electronic component according to any one of claims 6 to 9, wherein At a base end of the covering portion, a thickness of the covering portion covering a portion of the first main surface is equal to or greater than a thickness of the covering portion covering a portion of the second main surface.

11. The electronic component according to any one of claims 6 to 10, wherein At a base end of the covering portion, a thickness of a portion of the covering portion covering the first main surface and the second main surface is equal to or greater than a dimension of the protruding portion in a short-side direction of the protruding portion.

12. The electronic component according to any one of claims 7 to 11, wherein When viewed from the protruding direction, the covering portion is surrounded by the outer surface of the base portion.

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